Testing device

Abstract

To provide a testing device capable of executing multiple kinds of tests.SOLUTION: A testing device 1 includes: a supporting rack 210 for supporting the back of a chip; a pressing unit 220 for pressing a chip supported by the supporting rack 210; and a load measuring instrument 223 for measuring a load when the pressing unit 220 presses a chip. The pressing unit 220 includes a first test penetrator 227 for performing a three-point bending test by pressing a chip supported by the supporting rack 210, and a second test penetrator 228 for performing a four-point bending test by pressing a chip supported by the supporting rack 210, and the first test penetrator 227 and the second test penetrator 228 are configured selectively when pressing a chip supported by the supporting rack 210 by the pressing unit.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a testing device for measuring the strength of a test piece. [Background technology]

[0002] A three-point bending test is widely used to measure the strength of a test piece, and a test device for measuring the strength of a test piece by the three-point bending test has been disclosed (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-94832 A Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, the four-point bending test is also widely used to measure the strength of test pieces, and there is a strong demand for testing equipment that can perform multiple types of tests.

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a test apparatus capable of performing a plurality of types of tests. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the testing apparatus of the present invention is a testing apparatus comprising a support stand that supports the underside of a test piece, a pressing unit that presses the test piece supported by the support stand, and a load measuring instrument that measures the load when the pressing unit presses the test piece, wherein the pressing unit has a first test indenter that presses the test piece supported by the support stand to perform a first test, and a second test indenter that presses the test piece supported by the support stand to perform a second test different from the first test, and is configured so that the first test indenter and the second test indenter can be freely selected when the pressing unit presses the test piece supported by the support stand.

[0007] In the above-mentioned testing apparatus, the support table may be arranged with a predetermined distance between them and have a pair of support portions each extending in a first direction and supporting the lower surface of the test piece, the first test indenter may include a first end portion extending in the first direction that abuts against and presses the upper surface of the test piece supported by the support portions, and the second test indenter may include a second end portion extending in the first direction that abuts against and presses the upper surface of the test piece supported by the support portions, and a third end portion adjacent to the second end.

[0008] In the testing apparatus, the first test indenter and the second test indenter may be arranged side by side in the first direction.

[0009] In the above-mentioned testing apparatus, the support table includes a first test area in which a test piece to be pressed by the first test indenter is placed, and a second test area adjacent to the first test area in the first direction in which a test piece to be pressed by the second test indenter is placed, and the first test area may face the first test indenter and the second test area may face the second test indenter.

[0010] The testing device may further include a transport unit having a holding surface for holding the test piece and placing the held test piece on the support table, the transport unit transporting the test piece for the first test to the first test area and transporting the test piece for the second test to the second test area. Effect of the Invention

[0011] The present invention has the advantage that a plurality of types of tests can be performed. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing a part of a configuration example of a test apparatus according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view of a main part of the test apparatus shown in FIG. [Diagram 3] FIG. 3 is a perspective view of a wafer divided into chips to be measured by the test apparatus shown in FIG. [Figure 4] FIG. 4 is a perspective view showing a strength measuring mechanism of the testing apparatus shown in FIG. [Diagram 5] FIG. 5 is a side view of the support base and indenter of the strength measuring mechanism shown in FIG. 4, as viewed from the X-axis direction which is a second direction perpendicular to the first direction. [Figure 6] FIG. 6 is a front view showing the tip of the first test indenter of the strength measuring mechanism shown in FIG. [Figure 7] FIG. 7 is a front view showing the tip of the second test indenter of the strength measuring mechanism shown in FIG. [Figure 8] FIG. 8 is a cross-sectional view showing a state in which the testing apparatus shown in FIG. 1 has placed a chip on the first testing area of ​​the support stand. [Figure 9] FIG. 9 is a cross-sectional view showing a state in which the testing apparatus shown in FIG. 1 has placed a chip on the second testing area of ​​the support stand. [Figure 10] FIG. 10 is a cross-sectional view showing a broken state of the chip shown in FIG. [Figure 11] FIG. 11 is a cross-sectional view showing a broken state of the chip shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0014] [Embodiment 1] A test apparatus according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a part of a configuration example of the test apparatus according to the first embodiment. Fig. 2 is a perspective view of a main part of the test apparatus shown in Fig. 1. Fig. 3 is a perspective view of a wafer divided into chips to be measured by the test apparatus shown in Fig. 1.

[0015] The test apparatus 1 shown in Figures 1 and 2 according to the first embodiment is a chip destruction apparatus that destroys chips 14, which are test pieces individually separated from a wafer 10 shown in Figure 3, and measures the strength of the chips 14.

[0016] (Wafer) In the first embodiment, the wafer 10 is a disk-shaped semiconductor wafer or an optical device wafer, etc., with silicon, sapphire, gallium, etc., as the substrate 11. The wafer 10 has devices 13 formed in areas partitioned in a lattice pattern by a plurality of division lines 12 formed in a lattice pattern on the front surface 11-1 of the substrate 11. In the first embodiment, the wafer 10 has an adhesive tape 15, which is a support member having an annular frame 16 attached to its outer periphery, attached to the back surface 11-2, and is supported by the annular frame 16 to form a wafer unit 17. That is, in the first embodiment, the wafer 10 is supported by the adhesive tape 15. The wafer 10 is also divided into individual chips 14 along the division lines 12. The chips 14 include a part of the substrate 11 and the devices 13.

[0017] In the first embodiment, the wafer 10 has the devices 13 formed on the surface 11-1 of the substrate 11. However, in the present invention, when the test apparatus 1 is used to evaluate the validity of the processing conditions of the so-called post-processing in which the wafer 10 is divided into individual chips 14, the devices 13 do not have to be formed on the surface 11-1.

[0018] (Test Equipment) As shown in FIG. 1, the testing apparatus 1 comprises a cassette mounting stage 3 arranged on an apparatus main body 2 on which a cassette 4 containing a plurality of wafer units 17 is mounted, a transfer unit 5 for transferring the wafer units 17 into and out of the cassette 4, a pair of temporary placement rails 6 on which the wafer units 17 removed from the cassette 4 or the wafer units 17 before being loaded into the cassette 4 are temporarily placed, a frame fixing unit 7, and a control unit 400.

[0019] The cassette 4 is a storage container that stores a plurality of wafer units 17 at intervals in the Z-axis direction parallel to the vertical direction, and is provided with an opening 8 for inserting and removing the wafers 10. The cassette mounting table 3 has the cassette 4 mounted on its upper surface, and raises and lowers the cassette 4 in the Z-axis direction parallel to the vertical direction.

[0020] The pair of temporary placement rails 6 are provided on both ends of the width direction of the opening 8 of the cassette 4 placed on the cassette placement table 3 on the apparatus main body 2, and extend linearly in the Y-axis direction which is a first direction parallel to the horizontal direction. The pair of temporary placement rails 6 are arranged parallel to each other and spaced apart from each other along the X-axis direction which is a second direction perpendicular to the Y-axis direction and parallel to the horizontal direction. The pair of temporary placement rails 6 temporarily place the annular frame 16 of the wafer unit 17.

[0021] The frame fixing unit 7 includes an annular frame support member 18, an annular frame pressing member 19 disposed above and fixed to the frame support member 18, and a lifting mechanism (not shown) for lifting and lowering the frame support member 18. Before being lifted, the upper surface of the frame support member 18 is located on the same plane as the upper surface of the temporary placement rail 6, and the annular frame 16 of the wafer unit 17 is placed on the frame support member 18. When the annular frame 16 of the wafer unit 17 is placed on the upper surface of the frame support member 18, the lifting mechanism of the frame fixing unit 7 lifts the frame support member 18, sandwiching the annular frame 16 between the frame pressing member 19 and the frame support member 18, thereby fixing the wafer unit 17.

[0022] The carry-in / out unit 5 is provided so as to be movable in the Y-axis direction by a moving mechanism (not shown). The carry-in / out unit 5 carries the wafer unit 17 out of the cassette 4, temporarily places it on the temporary placement rails 6, and then carries the wafer unit 17 out to the upper surface of the frame support member 18 to which the frame fixing unit 7 has been lowered, and places it on the upper surface of the frame support member 18. The carry-in / out unit 5 also carries the wafer unit 17 on the upper surface of the frame support member 18 to which the frame fixing unit 7 has been lowered, into the cassette 4 via the temporary placement rails 6.

[0023] As shown in FIG. 2, the test apparatus 1 also includes a moving mechanism 30 that moves the frame fixing unit 7 in the Y-axis direction and the X-axis direction, a push-up mechanism 50, an imaging camera 60, a transport unit 20, a chip observation mechanism 100, and a strength measurement mechanism 200.

[0024] The moving mechanism 30 includes an X-axis moving mechanism 32 that is provided on the device body 2 and moves the moving table 40 in the X-axis direction, and a Y-axis moving mechanism 42 that is provided on the moving table 40 moved in the X-axis direction by the X-axis moving mechanism 32 and moves the frame fixing unit 7 in the Y-axis direction. The X-axis moving mechanism 32 moves the moving table 40, i.e., the frame fixing unit 7, in the X-axis direction between a position aligned with the pair of temporary placement rails 6 in the Y-axis direction and a position separated from the pair of temporary placement rails 6. Each of the moving mechanisms 32, 42 includes well-known ball screws 36, 46 that are provided rotatably about their axes, well-known motors 38, 48 that rotate the ball screws 36, 46 about their axes, and well-known guide rails 34, 44 that support the moving table 40 or the frame fixing unit 7 movably in the X-axis or Y-axis direction.

[0025] (Push-up mechanism) The push-up mechanism 50 is disposed below the frame fixing unit 7 which is positioned by the X-axis moving mechanism 32 at a position away from the pair of temporary placement rails 6. The push-up mechanism 50 is provided in the recess 9 of the device body 2, and pushes up any one of the chips 14 via the adhesive tape 15 of the wafer unit 17 which is fixed by the frame fixing unit 7 which is positioned by the X-axis moving mechanism 32 at a position away from the pair of temporary placement rails 6.

[0026] The push-up mechanism 50 is connected as a whole to a lifting mechanism (not shown) composed of a motor or the like, and moves up and down along the Z-axis direction. The push-up mechanism 50 has a tape holding part 51 formed in a hollow cylinder shape, and a push-up part 52 in the shape of a rectangular prism arranged inside the tape holding part 51. The upper surface of the tape holding part 51 is formed flat and parallel to the horizontal direction, and has a plurality of suction grooves formed concentrically along the circumferential direction of the tape holding part 51. Each of the suction grooves is connected to a suction source composed of an ejector or the like via a suction passage and an opening / closing valve formed inside the push-up mechanism 50.

[0027] The push-up part 52 is formed in a quadrangle whose upper surface has a planar shape smaller than the planar shape of the chip 14. The push-up part 52 is connected to a lifting unit constituted by a motor or the like, and can be raised and lowered along the Z-axis direction relative to the tape holding part 51.

[0028] With the wafer unit 17 including the annular frame 16 held by the frame fixing unit 7 positioned above, the push-up mechanism 50 sucks the suction grooves on the upper surface of the tape holding part 51 with a suction source, and sucks and holds the adhesive tape 15 around the chip 14 to be picked up on the upper surface of the tape holding part 51. The push-up mechanism 50 sucks and holds the adhesive tape 15 around the chip 14 to be picked up on the upper surface of the tape holding part 51, and the push-up part 52 is raised, pushing up the chip 14 above the adhesive tape 15 and peeling off the outer periphery of the chip 14 from the adhesive tape 15. The dimensions of the push-up mechanism 50 are appropriately adjusted according to the size of the chip 14.

[0029] The imaging camera 60 is disposed at a position where it can capture an image of the entire wafer 10 of the wafer unit 17 fixed by the frame fixing unit 7 on the recess 9. The imaging camera 60 is equipped with an imaging element that captures an image of the entire wafer 10 fixed by the frame fixing unit 7. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging camera 60 captures an image of the entire wafer 10 of the wafer unit 17 fixed by the frame fixing unit 7, obtains an image for aligning a predetermined chip 14 of the wafer 10 with the push-up mechanism 50, and outputs the obtained image to the control unit 400.

[0030] (Transport unit) The transport unit 20 has a pick-up mechanism 70 and a collet moving mechanism 80 which is a collet moving means.

[0031] The pick-up mechanism 70 picks up a predetermined chip 14 that has been pushed up by the push-up mechanism 50 from the wafer 10 that is divided into a plurality of chips 14 and supported by the adhesive tape 15. As shown in Fig. 2, the pick-up mechanism 70 includes a moving base 72 that is moved in the Y-axis direction and the Z-axis direction by the collet moving mechanism 80, an arm 74 that extends in the X-axis direction from the moving base 72 in a direction away from the collet moving mechanism 80, and a collet 76 that is provided at the tip of the arm 74 and holds the chip 14.

[0032] Collet 76 is attached to the lower end of the tip of arm 74. A lower surface 77 of collet 76 is connected to a suction source such as an ejector, and is sucked by the suction source to form a holding surface that sucks and holds chips 14. That is, transport unit 20 has lower surface 77 which is a holding surface that holds chips 14. Pick-up mechanism 70 sucks and holds chips 14 pushed up by push-up mechanism 50 on lower surface 77 of collet 76, and is raised by collet movement mechanism 80 to pick up a specified chip 14 from adhesive tape 15.

[0033] Furthermore, in the first embodiment, the testing device 1 may include a load cell as a measuring means for measuring the load applied to the chip 14 when it is picked up from the adhesive tape 15 on the upper surface side of the push-up mechanism 50. The load cell outputs the measurement result to the control unit 400. Note that in the present invention, the load cell as a measuring means may be provided on the lower surface 77 side of the collet 76 of the pick-up mechanism 70.

[0034] The collet moving mechanism 80 moves the collet 76 between a pick-up position where the chip 14 is picked up from the adhesive tape 15 and a placement position where the chip 14 is placed on a support base 210 (described later) of the strength measuring mechanism 200. The collet moving mechanism 80 includes a second Y-axis moving mechanism 82 that is provided on the device main body 2 and moves the moving table 90 in the Y-axis direction, and a Z-axis moving mechanism 92 that is provided on the moving table 90 moved in the Y-axis direction by the second Y-axis moving mechanism 82 and moves the moving base 72, i.e., the pick-up mechanism 70, in the Z-axis direction.

[0035] The second Y-axis moving mechanism 82 moves the moving table 90, i.e., the pickup mechanism 70, along the Y-axis from a pickup position where the upper surface of the thrust-up mechanism 50 and the lower surface 77 of the collet 76 face each other in the Z-axis direction toward the strength measuring mechanism 200. Each of the moving mechanisms 82, 92 includes well-known ball screws 86, 96 provided rotatably about their axes, well-known motors 88, 98 for rotating the ball screws 86, 96 about their axes, and well-known guide rails 84, 94 that support the moving table 90 or the pickup mechanism 70 movably in the Y-axis or Z-axis direction.

[0036] The chip observation mechanism 100 captures and observes the front surface 11-1, rear surface 11-2, and side surface of the chip 14. As shown in Fig. 1 and Fig. 2, the chip observation mechanism 100 includes a lower imaging unit 102 arranged adjacent to the push-up mechanism 50 on the device body 2 in the Y-axis direction, a lateral imaging unit 112, and a chip inversion mechanism 150 that inverts the chip 14 upside down.

[0037] The lower imaging unit 102 includes a lower imaging camera 103 that captures an image of the chip 14 held by the collet 76 of the pickup mechanism 70 from below. The lower imaging camera 103 is disposed at a position overlapping with the movement path of the collet 76. In the lower imaging unit 102, the lower imaging camera 103 captures an image of the chip 14 from below, and outputs the captured image to the control unit 400.

[0038] The lateral imaging unit 112 captures an image of the chip 14 from the side, i.e., the side surface of the chip 14. The lateral imaging unit 112 is disposed adjacent to the lower imaging unit 102 in the Y-axis direction, and in the first embodiment, is disposed on the side farther from the push-up mechanism 50 than the lower imaging unit 102.

[0039] The side imaging unit 112 includes a columnar chip support 114 that supports the chip 14 , and a side imaging camera 113 that images the side of the chip 14 .

[0040] The chip support stand 114 extends upward from the apparatus body 2, and is disposed at a position aligned with the lower imaging camera 103 in the Y-axis direction (i.e., at a position overlapping with the movement path of the collet 76). The chip support stand 114 has an upper surface formed flat and parallel to the horizontal direction, and supports the chip 14 transported by the collet 76 of the pickup mechanism 70 on the upper surface. The chip support stand 114 is also connected to a rotational drive source (not shown), and is rotated by the rotational drive source about an axis parallel to the Z-axis direction.

[0041] The side imaging camera 113 is disposed at a position where it can capture an image of the side of the chip 14 arranged on the upper surface of the chip support stand 114. The side imaging camera 113 is equipped with an imaging element that captures an image of the side of the chip 14. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The side imaging camera 113 captures an image of the side of the chip 14 arranged on the upper surface of the chip support stand 114, and outputs the captured image to the control unit 400.

[0042] In addition, since the test device 1 has the chip support table 114 at a position overlapping with the moving path of the collet 76, the chip 14 can be placed on the upper surface of the chip support table 114 by the collet 76.

[0043] The lateral imaging unit 112 images one side of the chip 14 supported by the chip support base 114 using the side imaging camera 113. Thereafter, the chip support base 114 is rotated by a predetermined angle, and the other side of the chip 14 is imaged by the side imaging camera 113. In this manner, the lateral imaging unit 112 images all the side surfaces of the chip 14 (for example, the four side surfaces of the chip 14) using the side imaging camera 113, obtains an image including the thickness of the chip 14 and the size of chipping formed in the chip 14, and outputs the obtained image to the control unit 400. In addition, the lateral imaging unit 112 can adjust the horizontal orientation (angle) of the chip 14 when the chip 14 is placed in the strength measurement mechanism 200 by controlling the rotation angle of the chip support base 114.

[0044] By using the above-mentioned lower imaging unit 102 and lateral imaging unit 112, the chip observation mechanism 100 images the front surface 11-1, rear surface 11-2 and side surface of the chip 14 picked up by the collet 76. In the present invention, the side surface imaging camera 113 that images the side surface of the chip 14 may be provided at a position where it can image the side surface of the chip 14 in a state where it is held by the collet 76. In this case, the side surface of the chip 14 can be observed without supporting the chip 14 on the chip support base 114, so that the rear surface 11-2, etc. of the chip 14 can be prevented from being damaged by placing the chip 14 on the chip support base 114.

[0045] The chip inversion mechanism 150 is disposed above the chip support stage 114 of the lateral imaging unit 112. The chip inversion mechanism 150 is configured to be able to rotate a base portion 151 by 180° around an axis parallel to the X-axis direction while holding the chip 14 at its tip portion.

[0046] When tip inversion mechanism 150 inverts tip 14 upside down, it rotates base portion 151 180° from the position shown by the solid lines in Figures 1 and 2 with respect to the upper surface of tip support base 114 supporting tip 14, to position it at the position shown by the dotted lines in Figures 1 and 2. Tip inversion mechanism 150 suction-holds tip 14 at its tip, and rotates base portion 151 180° to invert tip 14 upside down.

[0047] The chip 14 inverted by the chip inverting mechanism 150 is sucked and held by the collet 76 of the pickup mechanism 70, and after the suction and holding of the tip of the chip inverting mechanism 150 stops, the collet 76 is moved to the collet moving mechanism 80 and transported to the lower imaging unit 102 or the strength measuring mechanism 200. In this way, the chip inverting mechanism 150 inverts the chip 14 upside down.

[0048] (Strength measurement mechanism) Fig. 4 is a perspective view showing a strength measurement mechanism of the testing apparatus shown in Fig. 1. Fig. 5 is a side view of the support base and indenter of the strength measurement mechanism shown in Fig. 4, as viewed from the X-axis direction, which is a second direction perpendicular to the first direction. Fig. 6 is a front view showing the tip of a first test indenter of the strength measurement mechanism shown in Fig. 4. Fig. 7 is a front view showing the tip of a second test indenter of the strength measurement mechanism shown in Fig. 4.

[0049] The strength measuring mechanism 200 is a measuring means that measures the strength of the chip 14 picked up by the pickup mechanism 70. The strength measuring mechanism 200 is disposed next to the chip observation mechanism 100 in the Y-axis direction, and in the first embodiment, is disposed on the side farther from the push-up mechanism 50 than the chip observation mechanism 100. In the first embodiment, the strength measuring mechanism 200 is disposed at a position overlapping with the movement path of the collet 76.

[0050] As shown in Fig. 4, the strength measurement mechanism 200 includes a lower container 201 (shown in Figs. 1 and 2), a support stand 210, and a pressing unit 220. The lower container 201 is disposed on the device body 2, and is formed in a box shape with an opening 202 formed on the upper side.

[0051] The support base 210 supports the chip 14 that has been picked up by the collet 76 of the pickup mechanism 70 and whose front surface 11-1, back surface 11-2, and side surfaces have been imaged by the chip observation mechanism 100. The support base 210 is housed in the lower container 201 and is disposed at a position overlapping with the movement path of the collet 76. For this reason, the collet movement mechanism 80 moves the collet 76 from a position facing the push-up mechanism 50 in the Z-axis direction to a position facing the support base 210 in the Z-axis direction.

[0052] 4, the support base 210 includes a pair of long support parts 205 that support the chip 14, and a support base moving mechanism 219 that changes the positions of the long support parts 205 in the X-axis direction and the distance between the pair of long support parts 205. The pair of long support parts 205 are disposed at a predetermined distance from each other in the X-axis direction. Each of the long support parts 205 includes a support member 211 and a contact member 214.

[0053] The support member 211 is formed in a rectangular parallelepiped shape. The support members 211 of the pair of long support parts 205 are arranged at an interval from each other in the X-axis direction, and a predetermined interval is provided between them. The pair of support members 211 are arranged such that the longitudinal direction of the upper surface is along the Y-axis direction. The pair of support members 211 have the chip 14, the strength of which is to be measured, arranged on the upper surface side by a collet 76 or the like. For this purpose, the transport unit 20 places the chip 14 picked up from the wafer unit 17 on the support base 210. In the first embodiment, the support member 211, i.e., the support base 210, is placed on the back surface 11-2 side, which is the lower surface of the chip 14, and supports the back surface 11-2.

[0054] The support members 211 each have a columnar (rod-shaped) support protrusion 213 (corresponding to a support portion) formed on adjacent edges of the upper surface thereof, protruding upward, and the upper surface other than the aforementioned edges is covered with a contact member 214. That is, the support base 210 has a pair of support protrusions 213. The support protrusions 213 are made of a metal such as stainless steel, are arranged at a predetermined interval, and each extend parallel to the Y-axis direction to support the back surface 11-2 side of the chip 14. In addition, in the first embodiment, the cross-sectional shape of the upper surface of the support protrusions 213 is formed into an upwardly convex curved surface.

[0055] Contact member 214 is made of a material (such as sponge rubber) that is softer than support protrusion 213, and is formed into a plate shape with a constant thickness. Contact member 214 is formed into a rectangular shape in plan view, and its thickness in an undeformed state is greater than the amount of protrusion from the upper surface of support protrusion 213.

[0056] The contact member 214 supports the chip 14 with the back surface 11-2 of the chip 14 overlapped on the upper surface. Therefore, the upper surface of the contact member 214 supports the back surface 11-2 of the chip 14. In the first embodiment, the upper surface of the contact member 214 in an undeformed state is disposed about 1 mm above the upper end of the support protrusion 213. Therefore, the back surface 11-2 of the chip 14 disposed on the support member 211 contacts the upper surface of the contact member 214 with a gap between it and the support protrusion 213. Also, when the indenters 227 and 228 press the chip 14 on the upper end 213-1 of the support protrusion 213, the contact member 214 deforms and contacts the back surface 11-2 of the chip 14 to support the back surface 11-2.

[0057] The support table moving mechanism 219 moves each support member 211 in the X-axis direction, and includes a ball screw 216 rotatably mounted on a fixed plate 215 fixed to the device body 2, a motor 217 that rotates the ball screw 216, and a guide rail 218 that supports each support member 211 so that it can move freely in the X-axis direction.

[0058] The pressing unit 220 presses the chip 14 supported by the support base 210, measures the load applied to the pressing unit 220 when pressing the chip 14, and presses and destroys the chip 14 supported by the support base 210. The pressing unit 220 is provided above the lower container 201.

[0059] As shown in FIG. 4, the pressing unit 220 includes a moving mechanism 230 which is a moving means, a moving base 221, a first test indenter 227, and a second test indenter 228.

[0060] The moving mechanism 230 moves the indenters 227, 228 in the Z-axis direction relatively to the tip 14 supported by the pair of long support parts 205. The moving mechanism 230 includes a support plate 231 extending upward from the device body 2 and fixed to the device body 2, a ball screw 232 supported by the support plate 231 so as to be rotatable about its axis, a motor 233 that rotates the ball screw 232 about its axis, and a guide rail 234 that supports the moving base 221 so as to be movably in the Z-axis direction.

[0061] The longitudinal direction of the support plate 231, the ball screw 232, and the guide rail 234 is parallel to the Z-axis direction. The ball screw 232 is screwed into a screw hole provided in the moving base 221. The guide rail 234 is attached to the support plate 231. The moving mechanism 230 moves the indenter 227 in the Z-axis direction via the moving base 221 by the motor 233 rotating the ball screw 232 about its axis.

[0062] The movable base 221 is formed in a rectangular parallelepiped shape, and a cylindrical first support member 222 extending downward is connected to the lower surface side, and a load measuring device 223, which is a load measuring means consisting of a load cell or the like, is fixed to the lower end side of the first support member 222. The load measuring device 223 measures the load with which the indenters 227, 228 press the chip 14 supported by the pair of long support parts 205, and outputs the measurement result to the control unit 400. In other words, the pressing unit 220 includes the load measuring device 223 that measures the load when the indenters 227, 228 press the chip 14 supported by the pair of long support parts 205.

[0063] A clamping member 225 is attached to the lower side of the load measuring device 223 via a cylindrical second support member 224. The clamping member 225 is formed in a substantially gate-like shape when viewed from the front, and indenters 227, 228 that press the chip 14 supported by a pair of long support parts 205 are fixed between a pair of clamping surfaces 226 facing each other.

[0064] The first test indenter 227 presses the chip 14 supported by the support base 210 to perform a three-point bending test, which is a first test. The second test indenter 228 presses the chip 14 supported by the support base 210 to perform a four-point bending test, which is a second test different from the first test. The indenters 227, 228 are disposed above the long support portion 205 and above between the pair of long support portions 205, extend in the Y-axis direction parallel to the support protrusions 213 of the long support portion 205, and are arranged side by side in the Y-axis direction as shown in FIGS. 4 and 5.

[0065] The first test indenter 227 is formed as an integral plate shape tapered downward, and includes a first end 227-1 formed as a downwardly convex curved surface at the lower end as shown in FIG. 6. The first end 227-1 extends in the Y-axis direction. The second test indenter 228 is formed as an integral plate shape tapered downward, and includes a second end 228-2 and a third end 228-3 formed as a downwardly convex curved surface at the lower end as shown in FIG. 7. The second end 228-2 and the third end 228-3 are adjacent to each other in the X-axis direction, extend in the Y-axis direction, and are formed in the same shape with their lower ends located on the same plane.

[0066] The first end 227-1, the second end 228-2, and the third end 228-3 come into contact with and press against the surface 11-1, which is the upper surface of the chip 14 supported by the support protrusion 213 of the support base 210. The indenters 227 and 228 have their upper ends supported by the clamping member 225 parallel to the Y-axis direction, and the ends 227-1, 228-2, and 228-3 are disposed above and between the pair of long support parts 205. In the first embodiment, the first test indenter 227 is disposed closer to the chip observation mechanism 100 than the second test indenter 228, that is, upstream of the transport path of the chip 14 of the transport unit 20.

[0067] 4 and 5, the support table 210 on which the chip 14 is placed includes a first test area 210-1 on which the chip 14 to be pressed by the first test indenter 227 is placed, and a second test area 210-2 adjacent to the first test area 210-1 in the Y-axis direction and on which the chip 14 to be pressed by the second test indenter 228 is placed. The first test area 210-1 faces the first test indenter 227 along the Z-axis direction, and the second test area 210-2 faces the second test indenter 228 along the Z-axis direction.

[0068] Thus, in the first embodiment, the first test area 210-1 and the second test area 210-2 on the support base 210 are arranged side by side in the Y-axis direction. Also, in the first embodiment, the total length of the support base 210 in the Y-axis direction is equal to the total length of the indenters 227, 228 in the Y-axis direction, the total length of the first test area 210-1 in the Y-axis direction is approximately equal to the total length of the first end 227-1 of the first test indenter 227 in the Y-axis direction, and the total length of the second test area 210-2 in the Y-axis direction is approximately equal to the total length of the second end 228-2 and the third end 228-3 of the second test indenter 228 in the Y-axis direction.

[0069] When measuring the flexural strength of the chip 14, the strength measuring mechanism 200 adjusts the positions of the pair of support members 211 in the X-axis direction by the support table moving mechanism 219 while positioning the moving base 221 and the indenters 227, 228, etc., upward by the moving mechanism 230, and adjusts the distance between the pair of support members 211 to a distance according to the dimensions of the chip 14, etc. In the strength measuring mechanism 200, the chip 14 is placed on the pair of support members 211 by the collet 76, etc. At this time, both end portions of the chip 14 are supported by the support members 211, and the central portion overlaps between the long support portions 205.

[0070] If the back surface 11-2 side of the chip 14 comes into contact with the support protrusions 213 when the chip 14 is placed on the pair of support members 211, the back surface 11-2 side of the chip 14 may be damaged by the impact during placement. In this case, the flexural strength of the chip 14 changes, and it may become difficult to measure the flexural strength of multiple chips 14 under the same conditions.

[0071] For this reason, in the first embodiment, the strength measurement mechanism 200 provides the contact member 214 made of a flexible material on the upper surface side of the support member 211, and the upper surface of the contact member 214 is positioned above the upper end of the support protrusion 213. In the first embodiment, when the strength measurement mechanism 200 places the chip 14 on the pair of support members 211, the chip 14 comes into contact with the upper surface of the contact member 214 without coming into contact with the support protrusion 213, and is supported by the upper surface. As a result, the strength measurement mechanism 200 can prevent the back surface 11-2 side of the chip 14 from coming into contact with the support protrusion 213 and being damaged when the chip 14 is placed, and can suppress changes in the flexural strength of the chip 14.

[0072] The strength measuring mechanism 200 lowers the moving base 221, the indenters 227, 228, the upper container 240, etc. by the moving mechanism 30, presses the chip 14 with the indenters 227, 228, measures the load (force in the Z-axis direction) applied to the indenters 227, 228 by the pressing of the chip 14 with the load measuring device 223, and destroys the chip 14 with the indenters 227, 228 while appropriately outputting the measurement result to the control unit 400. The strength measuring mechanism 200 performs a three-point bending test using the pair of support protrusions 213 of the chip 14 and the first end 227-1 of the first test indenter 227, measures the load during this three-point bending test, and outputs the measurement result to the control unit 400. In addition, the strength measuring mechanism 200 performs a four-point bending test using a pair of support protrusions 213 of the chip 14 and the second end 228-2 and the third end 228-3 of the second test indenter 228, measures the load during this four-point bending test, and outputs the measurement results to the control unit 400.

[0073] When performing a three-point bending test on the chip 14, the strength measurement mechanism 200 supports the chip 14 on the first test area 210-1 of the support base 210, and presses the supported chip 14 with the first end 227-1 of the first test indenter 227 to destroy it. When performing a four-point bending test on the chip 14, the strength measurement mechanism 200 supports the chip 14 on the second test area 210-2 of the support base 210, and presses the supported chip 14 with the second end 228-2 and the second end 228-2 of the second test indenter 228 to destroy it.

[0074] (Control Unit) The control unit 400 controls each of the above-mentioned units of the test apparatus 1, and causes the test apparatus 1 to perform a measurement operation for each chip 14. The control unit 400 is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. The arithmetic processing device of the control unit 400 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the test apparatus 1 to each of the above-mentioned units of the test apparatus 1 via the input / output interface device.

[0075] The control unit 400 is connected to a display unit 300 which is a display means having a display screen 301 for displaying the state of the measurement operation, images, etc., and a touch panel 302 which is connected to the control unit 400 and is an input means used when an operator inputs information, etc., to the control unit 400 of the test device 1. The display unit 300 is composed of a liquid crystal display device, etc. The touch panel 302 is overlaid on the display screen 301 of the display unit 300.

[0076] Next, a measurement operation for breaking chip 14 of the test apparatus 1 configured as described above and measuring the load will be described. FIG. 8 is a cross-sectional view showing a state in which the test apparatus shown in FIG. 1 places a chip on a first test area of ​​the support stand. FIG. 9 is a cross-sectional view showing a state in which the test apparatus shown in FIG. 1 places a chip on a second test area of ​​the support stand. FIG. 10 is a cross-sectional view showing a state in which the chip shown in FIG. 8 is broken. FIG. 11 is a cross-sectional view showing a state in which the chip shown in FIG. 9 is broken.

[0077] In the testing apparatus 1, a cassette 4 containing a plurality of wafer units 17 is placed on the cassette mounting table 3 by an operator or the like, and the touch panel 302 or the like is operated to input measurement conditions into the control unit 400. The measurement conditions include information that corresponds one-to-one with the position of each chip 14 in each wafer unit 17 and whether the test performed on each chip 14 is a three-point bending test or a four-point bending test.

[0078] In the testing apparatus 1, when the control unit 400 receives an instruction from the operator to start measurement, the control unit 400 controls the carry-in / out unit 5 to carry out the wafer unit 17 including the unmeasured wafer 10 from the cassette 4 and temporarily place it on the pair of temporary placement rails 6, and controls the carry-in / out unit 5 to place the annular frame 16 of the wafer unit 17 temporarily placed on the temporary placement rails 6 on the lowered frame support member 18 of the frame fixing unit 7. The control unit 400 controls the frame fixing unit 7 to raise the frame support member 18 and fix the wafer unit 17 with the frame fixing unit 7, and then controls the moving mechanism 30 to position the wafer unit 17 fixed by the frame fixing unit 7 on the push-up mechanism 50.

[0079] In the test device 1, the control unit 400 causes the imaging camera 60 to capture an image of the wafer 10 of the wafer unit 17 fixed to the frame fixing unit 7, and aligns the predetermined chip 14 of the wafer 10 with the push-up mechanism 50. In the test device 1, the control unit 400 controls the push-up mechanism 50 to raise the push-up part 52 to push up the predetermined chip 14, and controls the pickup mechanism 70 and the like to suck and hold the predetermined chip 14 in the collet 76. In the test device 1, the control unit 400 controls the chip observation mechanism 100 to capture images of the front surface 11-1, back surface 11-2, and side surface determined by the measurement conditions, obtains these images, stores them in a storage device, and then places the back surface 11-2 of the chip 14 on a pair of long support parts 205 of the strength measurement mechanism 200.

[0080] At this time, when the chip 14 that the control unit 400 has sucked and held on the collet 76 with reference to the measurement conditions is a chip to be subjected to a three-point bending test, the test apparatus 1 transports the chip 14 to a first test area 210-1 on the support table 210 as shown in Fig. 8. When the chip 14 that the control unit 400 has sucked and held on the collet 76 with reference to the measurement conditions is a chip to be subjected to a four-point bending test, the test apparatus 1 transports the chip 14 to a second test area 210-2 on the support table 210 as shown in Fig. 9. In this way, the transport unit 20 transports the chip 14 to be subjected to the three-point bending test to the first test area 210-1, and transports the chip 14 to be subjected to the four-point bending test to the second test area 210-2.

[0081] In the first embodiment, the control unit 400 of the testing device 1 controls the strength measuring mechanism 200 to lower the indenters 227, 228, etc. by the moving mechanism 230, and brings the ends 227-1, 228-2, 228-3 of the indenters 227, 228 into contact with the surface 11-1 side of the chip 14, and presses the chip 14 with the indenters 227, 228. In addition, the load (force in the Z-axis direction) applied to the indenters 227, 228 by the pressing of the chip 14 is measured by the load measuring device 223, and the measurement result is output to the control unit 400 as appropriate.

[0082] In the test device 1, the control unit 400 controls the strength measuring mechanism 200 to further lower the indenters 227, 228, etc., and the indenters 227, 228 press the chip 14 further, deforming the contact member 214 supporting the chip 14 and bending the chip 14. As a result, the back surface 11-2 side of the chip 14 comes into contact with the support protrusions 213 of the support member 211, the chip 14 is supported by the pair of support protrusions 213, and the load on the indenter 227 pressing the chip 14 increases. At this time, depending on the flexibility of the contact member 214, there may be cases where only the contact member 214 is deformed and the chip 14 is not bent.

[0083] In the test device 1, the control unit 400 controls the strength measurement mechanism 200 to further lower the indenters 227, 228, and causes the pressing force applied to the tip 14 by the indenters 227, 228 to exceed a predetermined value, thereby destroying the tip 14, as shown in Figs. 10 and 11. When the tip 14 is destroyed, the load measured by the load measuring instrument 223 becomes zero from the maximum value. Therefore, the strength measurement mechanism 200 can detect the timing when the tip 14 is destroyed from the change in the value of the load measured by the load measuring instrument 223. In addition, the maximum value of the load measured by the load measuring instrument 223 corresponds to the strength of the tip 14. When the control unit 400 detects the timing when the tip 14 is destroyed, the test device 1 controls the strength measurement mechanism 200 to raise the indenters 227, 228 by the moving mechanism 230.

[0084] When performing a three-point bending test on the chip 14, the test apparatus 1 presses the chip 14 placed on the first test area 210-1 of the support base 210 with the first end 227-1 of the first test indenter 227 to break the chip 14, as shown in Fig. 10. When performing a four-point bending test on the chip 14, the test apparatus 1 presses the chip 14 placed on the second test area 210-2 of the support base 210 with the second end 228-2 and the third end 228-3 of the second test indenter 228 to break the chip 14, as shown in Fig. 11.

[0085] In this way, when the pressing unit 220 presses the chip 14 supported by the support stand 210, the testing apparatus 1 presses and breaks the chip with the first test indenter 227 when a three-point bending test is performed, and presses and breaks the chip with the second test indenter 228 when a four-point bending test is performed, so that the first test indenter 227 and the second test indenter 228 can be freely selected. After the testing apparatus 1 presses and breaks the chip 14 determined by the measurement conditions with the indenters 227, 228 in order and measures the load, it stores the wafer unit 17 in the cassette 4 and ends the measurement operation.

[0086] As described above, the testing apparatus 1 of embodiment 1 has a first test indenter 227 for performing a three-point bending test, which is a first test, on the chip 14, and a second test indenter 228 for performing a four-point bending test, which is a second test different from the first test, and is configured so that the first test indenter 227 and the second test indenter 228 can be freely selected when pressing the chip 14 supported by the support stand 210 with the pressing unit 220.

[0087] As a result, the test device 1 according to the first embodiment has the advantage of being able to carry out a plurality of types of tests.

[0088] Furthermore, in the testing apparatus 1, the indenters 227, 228, particularly the second test indenter 228, are formed integrally into a plate shape, so that the second end 228-2 and the third end 228-3 are integrated, making it easy to check and adjust, particularly when performing the second test, the four-point bending test.

[0089] The present invention is not limited to the above-mentioned embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the present invention, a moving mechanism for relatively moving the support base 210 and the pressing unit 220 in the Y-axis direction, which is the first direction, may be provided, and the chip 14 placed on the support base 210 may be pressed and broken by either the indenter 227 or 228 under measurement conditions, to perform either a three-point bending test or a four-point bending test. [Explanation of symbols]

[0090] 1 Test equipment 11-1 Surface (Top surface) 11-2 Back side (bottom side) 14 Chip (test piece) 20 Transport unit 210 Support stand 210-1 First Test Area 210-2 Second Test Area 213 Support protrusion (support part) 220 Pressing unit 223 Load Measuring Instrument 227 First test indenter 227-1 First end 228 Second test indenter 228-2 Second end 228-3 Third end Y 1st direction

Claims

1. A test apparatus comprising: a support table for supporting a lower surface of a test piece; a pressing unit for pressing the test piece supported by the support table; and a load measuring device for measuring a load applied when the pressing unit presses the test piece, the pressing unit has a first test indenter that presses the test piece supported by the support base to perform a first test, and a second test indenter that presses the test piece supported by the support base to perform a second test different from the first test, The testing device is configured so that the first test indenter and the second test indenter can be freely selected when the pressing unit presses the test piece supported by the support base.

2. The support base has a pair of support portions disposed at a predetermined interval and extending in a first direction to support a lower surface of the test piece, the first test indenter includes a first end portion extending in the first direction and adapted to abut and press against an upper surface of the test piece supported by the support portion; 2. The testing apparatus of claim 1, wherein the second test indenter includes a second end extending in the first direction that abuts against and presses against an upper surface of the test piece supported by the support portion, and a third end adjacent to the second end.

3. The testing apparatus according to claim 2 , wherein the first test indenter and the second test indenter are arranged side by side in the first direction.

4. the support base includes a first test area on which a test piece to be pressed by the first test indenter is placed, and a second test area adjacent to the first test area in the first direction and on which a test piece to be pressed by the second test indenter is placed, 4. The testing apparatus of claim 3, wherein the first test area faces the first test indenter and the second test area faces the second test indenter.

5. a transport unit having a holding surface for holding the test piece and for placing the held test piece on the support table; 5. The testing apparatus according to claim 4, wherein the transport unit transports the test piece for performing the first test to the first test area and transports the test piece for performing the second test to the second test area.

Images