Component mounting device, component mounting method, and component mounting system

Abstract

To correct a mounting position of a component in mounting of the component by two mounting heads with high accuracy.SOLUTION: A component mounting device comprises: a first imaging camera and a second imaging camera that image a first feature part provided to a first substrate or a second feature part provided to a second substrate; a calculation part that calculates a correspondence relation of a first mounting head and a second mounting head on the basis of a first imaging image of the first feature part imaged by the first imaging camera and a second imaging image of the first feature part imaged by the second imaging camera; and a control part that causes, in the case where a first substrate is transported, the component to be mounted on the first substrate on the basis of the position of the first feature part, and in the case where and a second substrate is transported, causes the component to be mounted on a second substrate on the basis of the correspondence relation and a position of the second feature part reflected to a third imaging image obtained by imaging the second feature part by any one of the first imaging camera and the second imaging camera.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus, a component mounting method, and a component mounting system. [Background technology]

[0002] Patent Document 1 discloses a multi-gantry surface mounting device that includes multiple mounting heads each equipped with a camera, and mounts electronic components on a printed circuit board on which a reference mark is printed by each of the multiple mounting heads. The multi-gantry surface mounting device uses one camera to recognize the reference mark among multiple common recognition marks and reference marks provided at a height position approximately equal to the height position of the printed circuit board held when mounting electronic components, and corrects the mounting positions of electronic components on the printed circuit board for all of the multiple mounting heads without recognizing the reference marks with other cameras. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-38194 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in Patent Document 1, the reference mark is not recognized by each of the two cameras, so there is a possibility that misalignment of the mounted electronic components may occur due to individual differences in the board itself, misalignment of the board when it is brought into the multi-gantry surface mounting device, etc.

[0005] The present disclosure has been devised in consideration of the above-mentioned conventional circumstances, and aims to provide a component mounting device, a component mounting method, and a component mounting system that can correct the mounting position of a component with greater precision when mounting components using two mounting heads. [Means for solving the problem]

[0006] The present disclosure relates to a component mounting device that mounts components on a first board and a second board, the component mounting device including a base, a board transport section provided on the base and configured to transport the first board or the second board, a first mounting head that mounts the components on the first board or the second board transported by the board transport section, a second mounting head that mounts the components on the first board or the second board transported by the board transport section, a first mounting head moving mechanism that moves the first mounting head, a second mounting head moving mechanism that moves the second mounting head, a first imaging camera that is provided on the first mounting head and captures an image of a first characteristic portion provided on the first board or a second characteristic portion provided on the second board, a second imaging camera that is provided on the second mounting head and captures an image of the first characteristic portion provided on the first board or the second characteristic portion provided on the second board, and a first captured image of the first characteristic portion captured by the first imaging camera and a second captured image of the second characteristic portion captured by the second imaging camera. a calculation unit that calculates a correspondence relationship between the first mounting head and the second mounting head based on a second captured image of the first feature portion captured by a camera; a storage unit that stores the correspondence relationship; and a control unit that drives the first mounting head moving mechanism and the second mounting head moving mechanism to cause the first mounting head and the second mounting head to mount the component on the first board or the second board, wherein when the first board is transported by the board transport unit, the control unit mounts the component on the first board based on positions of the first feature portion that appear in each of the first and second captured images, and when the second board is transported by the board transport unit, the control unit mounts the component on the second board based on the correspondence relationship and the position of the second feature portion that appears in a third captured image in which the second feature portion is captured by either the first or second imaging camera.

[0007] The present disclosure also relates to a component mounting method performed by a component mounting device that mounts components on a first board or a second board by a first mounting head moved by a first mounting head moving mechanism and a second mounting head moved by a second mounting head moving mechanism, the method including a board transport step of transporting the first board provided on a base and having a first characteristic portion or the second board provided on a second characteristic portion, a first imaging step of capturing an image of the first characteristic portion provided on the first board by a first imaging camera of the first mounting head and a second imaging camera of the second mounting head, and and a component mounting process of mounting components onto the first board or the second board by the first mounting head and the second mounting head, wherein the component mounting process, when the first board is transported, mounts the component on the first board based on positions of the first characteristic part that appear in each of the first and second captured images captured by the first imaging process, and, when the second board is transported, mounts the component on the second board based on the correspondence and the position of the second characteristic part that appears in a third captured image in which the second characteristic part is captured by either the first or second imaging camera.

[0008] The present disclosure also relates to a component mounting system including a component supplying device and a component mounting device that mounts components supplied by the component supplying device onto a first board and a second board, the component mounting device including a base, a board transport section provided on the base and configured to transport the first board or the second board, a first mounting head that mounts the components supplied from the component supplying device onto the first board or the second board transported by the board transport section, a second mounting head that mounts the components supplied from the component supplying device onto the first board or the second board transported by the board transport section, a first mounting head moving mechanism that moves the first mounting head, a second mounting head moving mechanism that moves the second mounting head, a first imaging camera that is provided on the first mounting head and that captures an image of a first characteristic portion provided on the first board or a second characteristic portion provided on the second board, and a second imaging camera that is provided on the second mounting head and that captures an image of the first characteristic portion provided on the first board or the second characteristic portion provided on the second board. a calculation unit that calculates a correspondence relationship between the first mounting head and the second mounting head based on a first captured image of the first feature portion captured by the first imaging camera and a second captured image of the first feature portion captured by the second imaging camera; a storage unit that stores the correspondence relationship; and a control unit that drives the first mounting head moving mechanism and the second mounting head moving mechanism to cause the first mounting head and the second mounting head to mount the components on the first board or the second board, wherein, when the first board is transported by the board transport unit, the control unit places the components on the first board based on positions of the first feature portion captured in each of the first and second captured images, and when the second board is transported by the board transport unit, the control unit places the components on the second board based on the correspondence relationship and the position of the second feature portion captured in a third captured image in which the second feature portion is captured by either the first or the second imaging camera. Effect of the Invention

[0009] According to the present disclosure, when components are placed using two placement heads, the placement positions of the components can be corrected with higher accuracy. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a top view of a production system according to an embodiment. [Diagram 2] FIG. 2 is a top view of a main part of a component mounting device according to an embodiment. [Diagram 3] FIG. 2 is a block diagram showing an example of the internal configuration of a component mounting device according to an embodiment. [Figure 4] 1 is a flowchart showing an example of an operation procedure of a component mounting device according to an embodiment. [Diagram 5] FIG. 13 is a diagram for explaining an example of correction of component mounting positions when recognition of board marks by one of the imaging cameras is omitted; [Figure 6] FIG. 13 is a diagram for explaining an example of the recognition timing of a fixed mark and a board mark by a first imaging camera and a second imaging camera; [Figure 7] FIG. 13 is a block diagram showing an example of the internal configuration of a component mounting system according to a modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, with reference to the drawings as appropriate, a detailed description will be given of an embodiment that specifically discloses a component mounting device, a component mounting method, and a component mounting system according to the present disclosure. However, more detailed description than necessary may be omitted. For example, detailed description of already well-known matters and duplicated description of substantially the same configuration may be omitted. This is to avoid the following description becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the attached drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0012] For example, the term "unit" or "device" in the embodiments is not limited to a physical configuration that is mechanically realized by hardware, but also includes a configuration whose functions are realized by software such as a program. Also, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

[0013] In the following description, the conveying direction of the board KB in the component mounting device 1B is defined as the X direction, and the direction perpendicular to the X direction and extending in the depth direction (front-rear direction) as seen from the operator OP is defined as the Y direction. The XY plane is a horizontal plane along the surface of the board KB.

[0014] The production system 100 will be described with reference to Fig. 1. Fig. 1 is a top view of the production system 100 according to the embodiment.

[0015] The production system 100 includes a higher-level device P1, a solder printer 1A, a component mounting device 1B, and an inspection device 1C. Note that the production system 100 shown in FIG. 1 is merely an example and is not limited thereto. For example, the production system 100 may be configured to include a plurality of component mounting devices 1B.

[0016] The higher-level device P1 is, for example, a personal computer (PC) or the like, and controls the solder printer 1A, the component mounting device 1B, and the inspection device 1C, and manages the production of the board KB on which the components BH are mounted. The higher-level device P1 can accept operations by an operator OP, and executes control of the solder printer 1A, the component mounting device 1B, and the inspection device 1C based on the operation of the operator OP.

[0017] When the board KB is carried in, the solder printer 1A prints solder on the board KB that has been carried in. The solder printer 1A carries the board KB after solder printing out to the component mounting device 1B.

[0018] The component mounting apparatus 1B mounts at least one component BH on the surface of the board KB carried in from the solder printer 1A. The component mounting apparatus 1B carries the board KB after the components have been mounted thereon to an inspection apparatus 1C.

[0019] The inspection device 1C inspects the components BH mounted on the board KB carried in from the component mounting device 1B. The inspection device 1C carries out the inspected board KB to a removal position (not shown) for the board KB.

[0020] Next, the configuration of the main part of the component mounting device 1B will be described with reference to Fig. 2 and Fig. 3. Fig. 2 is a top view of the main part of the component mounting device 1B in the embodiment. Fig. 3 is a block diagram showing an example of the internal configuration of the component mounting device 1B in the embodiment. Note that the component mounting device 1B shown in Figs. 2 and 3 is an example and is not limited thereto.

[0021] The component mounting apparatus 1B includes a base TB, a communication unit 20, a control unit 21, a memory unit 22, a board transport unit 23, a first mounting head 24, a second mounting head 25, a first mounting head moving mechanism 26, a second mounting head moving mechanism 27, a first imaging camera 28A, a second imaging camera 28B, and a component supply unit 29.

[0022] The communication unit 20 is connected to the higher-level device P1 so as to be able to transmit and receive data therebetween. The communication unit 20 outputs various data transmitted from the higher-level device P1 to the control unit 21. The communication unit 20 also transmits various data transmitted from the control unit 21 to the higher-level device P1.

[0023] The control unit 21 is configured using, for example, a Central Processing Unit (CPU) or a Field Programmable Gate Array (FPGA), and performs various processes and controls in cooperation with the storage unit 22. Specifically, the control unit 21 refers to the programs and data stored in the storage unit 22 and executes the programs to realize the functions of each unit. The units referred to here are, for example, a calculation unit 21A, an update unit 21B, and the like.

[0024] The calculation unit 21A recognizes the positions of the fixed marks MK11-MK16 appearing in the captured image captured by the first imaging camera 28A and the captured image captured by the second imaging camera 28B. The calculation unit 21A stores the recognized positions of the fixed marks MK11-MK16 (hereinafter referred to as “recognized positions”) in the storage unit 22.

[0025] The calculation unit 21A corrects the imaging positions of the board marks MK21-MK22 imaged by the first imaging camera 28A and the second imaging camera 28B, respectively, based on the recognized positions of the fixed marks MK11-MK16 and the positions of the board marks MK21-MK22 stored in the production program 22A.

[0026] Furthermore, calculation unit 21A calculates a positional relation equation indicating the relative position between first mounting head 24 and second mounting head 25 based on the calculated positions of first mounting head 24 and second mounting head 25 relative to board KB. Calculation unit 21A stores in memory unit 22 the calculated positional relation equation between first mounting head 24 and second mounting head 25 in association with the number of boards KB currently being produced.

[0027] Update unit 21B stores the positional relation equation calculated by calculation unit 21A in storage unit 22. When update unit 21B determines that the positional relation equation has already been stored in storage unit 22, update unit 21B executes an update process of overwriting the stored positional relation equation with the newly calculated positional relation equation.

[0028] The storage unit 22 has, for example, a random access memory (RAM) as a work memory used when executing each process of the control unit 21, and a read only memory (ROM) that stores programs and data that define the operation of the control unit 21. The RAM temporarily stores data or information generated or acquired by the control unit 21. The ROM stores programs that define the operation of the control unit 21. The storage unit 22 includes a production program 22A, a positional relation equation 22B, and data 22C related to imaging timing.

[0029] The production program 22A is a program for producing at least one type of board KB. The control unit 21 places components BH on the board KB by referencing the production program 22A corresponding to the board KB to be produced.

[0030] The positional relational expression 22B is a relational expression that indicates the relative position between the first mounting head 24 and the second mounting head 25 calculated by the calculation unit 21A.

[0031] The data 22C relating to the imaging timing stores information such as the number of substrates KB produced, information relating to the first substrate, information relating to the second substrate, and a threshold value.

[0032] The first substrate here is the substrate KB for which the images of the fixing marks MK11-MK16 and the substrate marks are captured. When the control unit 21 determines that the loaded substrate KB is the first substrate based on the data related to the imaging timing stored in the storage unit 22, it recalculates the positional relation equation and determines whether or not it is necessary to update the positional relation equation.

[0033] The information on the first board includes information on the board KB set as the first board. The information on the first board is, for example, information on the number of boards KB produced (1st, 9th, 24th, etc.) or information on the production time of the board KB (1 minute, 3 minutes, 5 minutes, etc.).

[0034] The second board here is the board KB on which the board marks MK21-MK22 are imaged. When the control unit 21 determines that the carried-in board KB is not the first board based on the data related to the imaging timing stored in the storage unit 22, it performs an imaging process of the board marks MK21-MK22 by either the first imaging camera 28A or the second imaging camera 28B, and a correction (calculation) process of the mounting position of the component BH by the other of the first imaging camera 28A or the second imaging camera 28B based on the positional relation equation and the recognized positions of the board marks MK21-MK22.

[0035] The information on the second board includes information on the board KB set as the second board. The information on the second board is, for example, information on the number of boards KB produced, such as the 2nd to 8th boards, the 10th to 23rd boards, or the production time of the board KB. Note that the information on the second board may be defined as a board KB other than the first board specified by the information on the first board, and may be omitted.

[0036] In addition, the threshold value here is a value for determining whether or not the positional relation equation 22B already stored in the memory unit 22 can be continuously used, based on the amount of displacement of the recognition positions of the fixed marks MK11 to MK16 recognized on each of the Nth (N: integer greater than or equal to 1) first substrate and the (N+1)th first substrate.

[0037] When control unit 21 determines that the calculated displacement amount of the recognized positions is equal to or greater than the threshold, it determines that the stored positional relation equation is unusable, recalculates the positional relation equation based on the recognized positions of fixing marks MK11-MK16, and executes updating of the positional relation equation. When control unit 21 determines that the calculated displacement amount of the recognized positions is not equal to or greater than the threshold, it determines that the stored positional relation equation is usable, and executes mounting of components BH using the stored positional relation equation until the next first board is produced.

[0038] The board transport unit 23 is controlled by the control unit 21 to transport the board KB carried out from the solder printer 1A to a predetermined component mounting position. In addition, the board transport unit 23 is controlled by the control unit 21 to transport the board KB on which the components BH are mounted from the predetermined component mounting position to the inspection device 1C.

[0039] The first mounting head 24 is disposed above the base TB, and is driven in the X or Y direction by a first mounting head moving mechanism 26 to mount components BH supplied by a component supply unit 29 onto the board KB.

[0040] The second mounting head 25 is disposed above the base TB, and is driven in the X or Y direction by a second mounting head moving mechanism 27 to mount components BH supplied by a component supply unit 29 onto the board KB.

[0041] The first mounting head moving mechanism 26 is composed of an X-axis table mechanism 26A and a Y-axis table mechanism 26B that is approximately perpendicular to the X-axis table mechanism 26A, and is configured to be able to move the first mounting head 24 between the component supply unit 29 and an arbitrary component mounting position on the board KB. Specifically, the first mounting head 24 can be moved linearly in the X and Y directions by the X-axis table mechanism 26A and the Y-axis table mechanism 26B that are arranged orthogonal to each other on an XY plane that is approximately parallel to the surface of the board KB.

[0042] The second mounting head moving mechanism 27 is composed of an X-axis table mechanism 27A and a Y-axis table mechanism 27B that is approximately perpendicular to the X-axis table mechanism 27A, and is configured to be able to move the second mounting head 25 between the component supply unit 29 and an arbitrary component mounting position on the board KB. Specifically, the second mounting head 25 is able to move linearly in the X and Y directions by the X-axis table mechanism 27A and the Y-axis table mechanism 27B that are arranged orthogonal to each other on an XY plane that is approximately parallel to the surface of the board KB.

[0043] The first imaging camera 28A is configured integrally with the first mounting head 24, and is moved in the X direction or Y direction by the first mounting head moving mechanism 26. The first imaging camera 28A is controlled by the control unit 21 to capture images of the fixing marks MK11 to MK16, the board marks MK21, MK22, the component BH to be mounted, and the mounting position of the component BH on the board KB. The first imaging camera 28A outputs the captured images to the control unit 21.

[0044] The second imaging camera 28B is configured integrally with the second mounting head 25, and is moved in the X direction or Y direction by the second mounting head moving mechanism 27. The second imaging camera 28B is controlled by the control unit 21 to capture images of the fixing marks MK11-MK16, the board marks MK21, MK22, the component BH to be mounted, and the mounting position of the component BH on the board KB. The second imaging camera 28B outputs the captured images to the control unit 21.

[0045] Component supply unit 29 supplies at least one component BH to be mounted on board KB. Component supply unit 29 shown in Fig. 2 is provided with a plurality of tape feeders 29A, and a carrier tape containing components BH is mounted on each of tape feeders 29A to supply components BH to a predetermined component removal position.

[0046] Note that the component supply unit 29 may supply the components BH using a tray feeder. Also, the component supply unit 29 shown in Fig. 2 is provided only below the board transport unit 23 and below the second mounting head moving mechanism 27 in the drawing, but this is not limiting. For example, a plurality of component supply units 29 may be provided above and below the board transport unit 23 in the drawing, corresponding to the first mounting head moving mechanism 26 and the second mounting head moving mechanism 27, respectively.

[0047] Each of the multiple fixed marks MK11-MK16 is provided on a base TB on which the substrate transport unit 23 is provided. Note that, in the example shown in Fig. 2, three fixed marks MK11-MK13 are provided on the upper side of the substrate transport unit 23 in the plane of the drawing, and three fixed marks MK14-MK16 are provided on the lower side of the substrate transport unit 23 in the plane of the drawing, but it goes without saying that the number and arrangement of the fixed marks MK11-MK16 are not limited to this.

[0048] Each of the multiple board marks MK21-MK22 is provided on the board KB. It goes without saying that the number and arrangement of the board marks MK21-MK22 are not limited to the example shown in FIG.

[0049] Next, an example of the operation procedure of the component mounting device 1B will be described with reference to Fig. 4 and Fig. 5. Fig. 4 is a flow chart showing an example of the operation procedure of the component mounting device 1B in the embodiment. The imaging processes of the first imaging camera 28A and the second imaging camera 28B will be described. Fig. 5 is a diagram for explaining an example of correction of the component mounting position when recognition of the board mark by one of the imaging cameras is omitted. Note that the examples shown in Figs. 4 and 5 are merely examples, and the present invention is not limited to these.

[0050] Based on a control command transmitted from the higher-level device P1 instructing the start of production of the board KB, the control unit 21 refers to the production program 22A for the board KB stored in the storage unit 22, and starts the production of the board KB.

[0051] The control unit 21 drives the board transport unit 23 to transport the board KB, which is the first board, carried out from the solder printer 1A, to a predetermined board transport position (St11).

[0052] After carrying in the substrate KB, the control unit 21 uses the first imaging camera 28A and the second imaging camera 28B to capture images of the multiple fixing marks MK11-MK16 provided on the base TB. The control unit 21 recognizes (detects) the fixing marks MK11-MK16 from the image captured by the first imaging camera 28A and the fixing marks MK11-MK16 from the image captured by the second imaging camera 28B (St12). The control unit 21 calculates the recognized positions of the fixing marks MK11-MK16 captured by the first imaging camera 28A and the fixed marks MK11-MK16 captured by the second imaging camera 28B, and stores them in the storage unit 22 (St12).

[0053] The control unit 21 determines whether the first board currently being produced is the first board (St13).

[0054] When the control unit 21 determines in the processing of step St13 that the first board currently being produced is the first first board (St13, YES), it corrects the imaging positions of each of the board marks MK21-MK22 imaged by the first imaging camera 28A and the second imaging camera 28B, based on the recognized positions of each of the recognized fixing marks MK11-MK16 and the positions of the board marks MK21-MK22 stored in the production program 22A.

[0055] The control unit 21 moves the first mounting head 24 or the second mounting head 25 to the imaging positions of the corrected board marks MK21-MK22, and causes the first imaging camera 28A or the second imaging camera 28B to capture images of the board marks MK21-MK22 (St14). The control unit 21 recognizes (detects) the board marks MK21-MK22 from the image captured by the first imaging camera 28A, and the board marks MK21-MK22 from the image captured by the second imaging camera 28B (St14).

[0056] The control unit 21 calculates the recognition positions of the board marks MK21-MK22 imaged by the first imaging camera 28A and the recognition positions of the board marks MK21-MK22 imaged by the second imaging camera 28B (St15). The control unit 21 calculates a positional relation equation indicating the relative position between the first placing head 24 and the second placing head 25 based on the calculated recognition positions of the board marks MK21-MK22. The control unit 21 stores the calculated positional relation equation in the memory unit 22, and further stores the recognition positions of the fixed marks MK11-MK16 imaged by the first imaging camera 28A and the recognition positions of the fixed marks MK11-MK16 imaged by the second imaging camera 28B in the memory unit 22 (St15).

[0057] The control unit 21 uses the first mounting head 24 and the second mounting head 25 to mount components BH on the board KB, which is the first board (St19).

[0058] Here, the positional relation equation will be described. Note that the positional relation equation described below is calculated based on the respective recognition positions of the board marks MK21-MK22 captured on the first board, as an example. Also, the positional relation equation described below is for an example in which the first imaging camera 28A captures the board marks MK21-MK22, and the second imaging camera 28B omits capturing the board marks MK21-MK22.

[0059] <Positional relationship formula> RxaM = FxaM + (Rxa0 - Fxa0) RyaM = FyaM + (Rya0 - Fya0) RxbM = FxbM + (Rxb0 - Fxb0) RybM = FybM + (Ryb0 - Fyb0)

[0060] Coordinates (Fxa0, Fya0) are position information (coordinates) of board mark MK21 recognized on the first board based on the captured image captured by the first imaging camera 28A. Coordinates (Fxb0, Fyb0) are position information (coordinates) of board mark MK22 recognized on the first board based on the captured image captured by the first imaging camera 28A.

[0061] Coordinates (Rxa0, Rya0) are position information (coordinates) of board mark MK21 recognized on the first board based on the captured image captured by the second imaging camera 28B. Coordinates (Rxb0, Ryb0) are position information (coordinates) of board mark MK22 recognized on the first board based on the captured image captured by the second imaging camera 28B.

[0062] The coordinates (FxaM, FyaM) are position information (coordinates) of the board mark MK21 recognized on the basis of the image captured by the first imaging camera 28A on the Mth board KB (M: an integer of 2 or more) out of the number of boards KB produced. The coordinates (FxbM, FybM) are position information (coordinates) of the board mark MK22 recognized on the basis of the image captured by the first imaging camera 28A on the Mth board KB.

[0063] The coordinates (RxaM, RyaM) are calculated based on position information (coordinates) of the board mark MK21 recognized based on the image captured by the first imaging camera 28A. The coordinates (RxaM, RyaM) are calculated as position information (coordinates) of the board mark MK21 recognized based on the image captured by the first imaging camera 28A for the Mth board KB out of the production number of boards KB.

[0064] The coordinates (RxbM, RybM) are calculated based on position information (coordinates) of the board mark MK22 recognized based on the image captured by the first imaging camera 28A. The coordinates (RxbM, RybM) are calculated as position information (coordinates) of the board mark MK22 recognized based on the image captured by the first imaging camera 28A for the Mth board KB out of the production number of boards KB.

[0065] On the other hand, if the control unit 21 determines in the processing of step St13 that the first substrate currently being produced is not the first first substrate (St13, NO), it calculates the amount of displacement between the recognition positions of the fixed marks MK11-MK16 recognized by each of the first imaging camera 28A and the second imaging camera 28B on the current first substrate and the recognition positions of the fixed marks MK11-MK16 recognized by each of the first imaging camera 28A and the second imaging camera 28B stored in the memory unit 22 (St16).

[0066] The control unit 21 determines whether the amount of displacement of the recognition positions of the fixed marks MK11-MK16 captured by either one of the first and second imaging cameras 28A and 28B and calculated is greater than or equal to a threshold value (St17).

[0067] When the control unit 21 determines in the process of step St17 that the calculated displacement amount of the recognition position of any one of the fixed marks MK11-MK16 is equal to or greater than the threshold value (St17, YES), the control unit 21 proceeds to the process of step St14, and recalculates the positional relational equation based on the re-recognized recognition positions of the board marks MK21-MK22 (St14).The control unit 21 updates the positional relational equation already stored in the memory unit 22 to the recalculated positional relational equation (St15).

[0068] On the other hand, if the control unit 21 determines in the processing of step St17 that the calculated displacement amount of the recognition position of any one of the fixed marks MK11-MK16 is not equal to or greater than the threshold (i.e., none of the calculated displacement amounts of the recognition positions of the fixed marks MK11-MK16 are equal to or greater than the threshold) (St17, NO), the control unit 21 corrects the imaging positions of each of the board marks MK21-MK22 based on the recognition positions of the fixed marks MK11-MK16. The control unit 21 captures an image of each of the multiple board marks MK21-MK22 by the first imaging camera 28A or the second imaging camera 28B (St18).

[0069] The control unit 21 calculates (St18) the positions of the board marks MK21-MK22 imaged by one of the imaging cameras (i.e., the first imaging camera 28A or the second imaging camera 28B) based on the recognized positions of the board marks MK21-MK22 imaged by the other imaging camera (i.e., the first imaging camera 28A or the second imaging camera 28B) and the positional relation equation stored in the storage unit 22. The control unit 21 calculates (St18) the placement positions of the components BH to be placed by the other placement head (i.e., the first placement head 24 or the second placement head 25) provided with the other imaging camera based on the calculated positions of the board marks MK21-MK22.

[0070] Control unit 21 drives one of the mounting head movement mechanisms and one of the mounting heads to transport component BH to the calculated mounting position and place component BH on board KB, the first board (St19). Control unit 21 drives the other of the mounting head movement mechanisms and the other of the mounting heads to transport component BH to the calculated mounting position and place component BH on board KB, the first board (St19).

[0071] When control unit 21 determines that mounting of components BH is completed, it drives board transport unit 23 to carry out board KB, which is the first board, from component mounting device 1B to inspection device 1C (St20).

[0072] The control unit 21 drives the board transport unit 23 to transport the board KB, which is the second board carried out from the solder printer 1A, to a predetermined board transport position (St21).

[0073] The control unit 21 captures an image of each of the multiple board marks MK21-MK22 provided on the board KB, which is the second board, with either the first imaging camera 28A or the second imaging camera 28B (St22). The control unit 21 recognizes (detects) each of the board marks MK21-MK22 from the captured image captured by either the first imaging camera 28A or the second imaging camera 28B (St22).

[0074] Based on the recognized positions of the board marks MK21 to MK22, the control unit 21 calculates the placement position of the component BH to be placed by one of the placement heads (i.e., the first placement head 24 or the second placement head 25) equipped with one of the imaging cameras (St23).

[0075] The control unit 21 calculates (St23) the recognition positions of the board marks MK21-MK22 by the other imaging camera (i.e., the first imaging camera 28A or the second imaging camera 28B) based on the recognition positions of the board marks MK21-MK22 imaged by one imaging camera (i.e., the first imaging camera 28A or the second imaging camera 28B) and the positional relation equation stored in the storage unit 22. The control unit 21 calculates (St23) the placement positions of the components BH to be placed by the other placement head (i.e., the first placement head 24 or the second placement head 25) provided with the other imaging camera based on the calculated positions of the board marks MK21-MK22.

[0076] Control unit 21 drives one of the mounting head movement mechanisms and one of the mounting heads to transport component BH to the calculated mounting position and place component BH on board KB, the second board (St24). Control unit 21 drives the other of the mounting head movement mechanisms and the other of the mounting heads to transport component BH to the calculated mounting position and place component BH on board KB, the second board (St24).

[0077] When the control unit 21 determines that the mounting of the components BH is completed, it drives the board transport unit 23 to carry out the second board, that is, the board KB, from the component mounting device 1B to the inspection device 1C (St25).

[0078] The control unit 21 determines whether the next board KB to be carried into the component mounting device 1B is the first board (St26). Specifically, the control unit 21 determines whether the next (M+1)-th board KB to be carried in is the board set as the first board. When the first board is set based on the elapsed time, the control unit 21 starts measuring the elapsed time from the timing when the production of the board KB starts, and determines whether it is the timing to carry in the first board based on the current elapsed time.

[0079] When the control unit 21 determines in the process of step St26 that the board KB to be next carried into the component mounting apparatus 1B is the first board (St26, YES), the process returns to the process of step St11.

[0080] On the other hand, when the control unit 21 determines in the process of step St26 that the board KB to be next carried into the component mounting apparatus 1B is not the first board (St26, NO), the process returns to the process of step St21.

[0081] As described above, component mounting apparatus 1B according to the embodiment calculates the positional relation equation during production of board KB, which is the first board, and thereby omits the imaging and recognition of board marks MK21-MK22 by either the other imaging camera (specifically, first imaging camera 28A or second imaging camera 28B) during production of board KB, which is the second board, and can perform mounting of components BH by each of first mounting head 24 and second mounting head 25. This allows component mounting apparatus 1B to shorten the processing time required for imaging board marks MK21-MK22 by the two imaging cameras and for calculating the recognition positions based on the images captured by the two imaging cameras, and can improve the production efficiency of board KB.

[0082] Furthermore, when the component mounting device 1B determines that the displacement amount of the recognition positions of the fixed marks MK11 to MK16 is greater than or equal to a threshold value, that is, that the positional deviation amount of each of the first mounting head 24 and the second mounting head 25 is greater than or equal to a threshold value, the positional relationship equation is re-calculated to more effectively suppress an increase in the positional deviation amount of the mounting position of the component BH, thereby achieving more accurate mounting of the component BH.

[0083] Next, the imaging process of each of the first imaging camera 28A and the second imaging camera 28B will be described with reference to Fig. 6. Fig. 6 is a diagram for explaining an example of the recognition timing of the fixed marks MK11-MK16 and the board marks MK21-MK22 by the first imaging camera 28A and the second imaging camera 28B. Note that the example shown in Fig. 6 is just an example, and is not limited to this.

[0084] An example will be described in which component mounting apparatus 1B produces 30 boards KB. The first, ninth, and twenty-fourth boards KB produced among the 30 boards KB, that is, the boards KB carried into component mounting apparatus 1B, are set as first boards. The second to eighth, tenth to twenty-third, and twenty-fifth to thirty boards produced among the 30 boards KB, that is, the boards KB carried into component mounting apparatus 1B, are set as second boards. The information on the boards KB set as the first boards and the information on the boards KB set as the second boards are stored in data 22C relating to the imaging timing of storage unit 22.

[0085] <Image capture process during production of the first board> The control unit 21 counts the number of boards KB carried in (production number). When the control unit 21 determines that the counted production number is the first board, it determines that the carried-in board KB is the first board for which imaging of the fixing marks MK11 to MK16 is required. The control unit 21 drives each of the first mounting head 24 and the second mounting head 25 to capture images of the fixing marks MK11 to MK16 by the first imaging camera 28A and the second imaging camera 28B, respectively.

[0086] The control unit 21 recognizes (detects) the fixed marks MK11 to MK16 from the captured images of the fixed marks MK11 to MK16 captured by the first imaging camera 28A and the second imaging camera 28B, respectively. The control unit 21 calculates the recognized positions of the fixed marks MK11 to MK16 recognized from the image captured by the first imaging camera 28A and the recognized positions of the fixed marks MK11 to MK16 recognized from the image captured by the second imaging camera 28B. The control unit 21 performs coordinate correction of the first placing head 24 and the first imaging camera 28A based on the recognition results of the fixed marks MK11 to MK16 by the first imaging camera 28A. The control unit 21 also performs coordinate correction of the second placing head 25 and the second imaging camera 28B based on the recognition results of the fixed marks MK11 to MK16 by the first imaging camera 28A, respectively.

[0087] Furthermore, the control unit 21 executes imaging of each of the board marks MK21-MK22 by the coordinate-corrected first imaging camera 28A and the coordinate-corrected second imaging camera 28B. The control unit 21 recognizes (detects) the board marks MK21-MK22 from the captured images captured by each of the first imaging camera 28A and the second imaging camera 28B. The control unit 21 calculates a positional relation equation between the first placing head 24 and the second placing head 25 based on the recognized positions of each of the board marks MK21-MK22 recognized from the captured image captured by the first imaging camera 28A and the recognized positions of each of the board marks MK21-MK22 recognized from the captured image captured by the second imaging camera 28B.

[0088] The control unit 21 stores in the memory unit 22 the calculated positional relationship equation between the first mounting head 24 and the second mounting head 25 and the recognized positions of the fixed marks MK11 to MK16 recognized by each of the first imaging camera 28A and the second imaging camera 28B on the first first substrate.

[0089] Furthermore, the control unit 21 corrects the mounting position of each component BH to be placed on the board KB based on the recognized positions of the fixing marks MK11-MK16 and the recognized positions of the board marks MK21-MK22 recognized by the first imaging camera 28A and the second imaging camera 28B, respectively, the calculated positional relational expression, and the mounting positions of each component BH included in the production program 22A, and places the component BH in the corrected mounting position. Note that, if there are no fixing marks MK11-MK16, it is also possible to correct the mounting position of each component BH to be placed on the board KB based on the recognized positions of the board marks MK21-MK22, the calculated positional relational expression, and the mounting positions of each component BH included in the production program 22A, and place the component BH in the corrected mounting position.

[0090] <Imaging process during second board production> The control unit 21 counts the number of boards KB carried in (the number of boards produced). Based on the counted number of boards produced, the control unit 21 determines that the carried-in board KB is the second board. The control unit 21 drives the first mounting head 24 to capture images of the board marks MK21-MK22 by the first imaging camera 28A.

[0091] The control unit 21 recognizes (detects) the board marks MK21-MK22 from the captured image captured by the first imaging camera 28A. The control unit 21 corrects the position of the component BH to the mounting position corresponding to the current board KB based on the recognized positions of the fixing marks MK11-MK16 recognized from the captured image captured during the production of the first board, the recognized positions of each of the board marks MK21-MK22 recognized from the captured image captured by the first imaging camera 28A, and the mounting positions of each component BH included in the production program 22A. The control unit 21 drives the first mounting head 24 to mount the component BH at the mounting position of the component BH after the position correction. In addition, when there are no fixed marks MK11 to MK16, the control unit 21 may correct the mounting position of each component BH to be mounted on the board KB based on the recognized positions of the board marks MK21 to MK22, the calculated positional relation equation, and the mounting position of each component BH included in the production program 22A, and drive the first mounting head 24 to mount the component BH at the corrected mounting position.

[0092] Furthermore, the control unit 21 corrects the placement position of each component BH to be placed on the current board KB based on the recognized positions of the fixing marks MK11 to MK16 recognized based on the captured image captured during the production of the first board, the recognized positions of each board mark MK21 to MK22 recognized from the captured image captured by the first imaging camera 28A, the positional relational expression stored in the storage unit 22, and the placement position of each component BH included in the production program 22A. The control unit 21 drives the second placement head 25 to place the component BH at the placement position of the component BH after the position correction. Note that, when there are no fixing marks MK11 to MK16, the control unit 21 may correct the placement position of each component BH to be placed on the board KB based on the recognized positions of the board marks MK21 to MK22, the calculated positional relational expression, and the placement position of each component BH included in the production program 22A, and drive the second placement head 25 to place the component BH at the corrected placement position.

[0093] <Image capture process during production of the first board after the second board> The control unit 21 counts the number of boards KB carried in (production number). When the control unit 21 determines based on the counted production number that the carried-in board KB is the second or subsequent first board, it drives the first mounting head 24 and the second mounting head 25 to capture images of the fixing marks MK11 to MK16 by the first imaging camera 28A and the second imaging camera 28B, respectively.

[0094] The control unit 21 recognizes (detects) the fixed marks MK11 to MK16 from the captured images of the fixed marks MK11 to MK16 captured by the first imaging camera 28A and the second imaging camera 28B. The control unit 21 calculates the recognized positions of the fixed marks MK11 to MK16 recognized from the captured image captured by the first imaging camera 28A and the recognized positions of the fixed marks MK11 to MK16 recognized from the captured image captured by the second imaging camera 28B.

[0095] The control unit 21 calculates the amount of displacement between the calculated recognition positions of each of the fixed marks MK11-MK16 and the recognition positions of each of the fixed marks MK11-MK16 stored in the storage unit 22. When the control unit 21 determines that the amount of displacement calculated based on the recognition positions of each of the fixed marks MK11-MK16 recognized from an image captured by at least one of the first imaging camera 28A and the second imaging camera 28B is equal to or greater than a threshold, it updates the recognition positions of the fixed marks MK11-MK16 stored in the storage unit 22 to the recognition positions of the fixed marks MK11-MK16 recognized on the current board KB (first board).

[0096] When the control unit 21 determines that the calculated displacement amount is not equal to or greater than the threshold value, it skips the calculation process of the positional relation equation, and drives the first placement head 24 to capture images of the board marks MK21-MK22 by the first imaging camera 28A. The control unit 21 recognizes (detects) the board marks MK21-MK22 from the captured images captured by the first imaging camera 28A. The control unit 21 corrects the position of the component BH to the mounting position corresponding to the current board KB based on the respective recognized positions of the board marks MK21-MK22 recognized from the captured images captured by the first imaging camera 28A and the mounting positions of each component BH included in the production program 22A. The control unit 21 drives the first placement head 24 to mount the component BH at the mounting position of the component BH after the position correction.

[0097] Furthermore, the control unit 21 corrects the placement position of each component BH to be placed on the current board KB based on the respective recognized positions of the board marks MK21-MK22 recognized from the captured image captured by the first imaging camera 28A, the positional relation equation stored in the memory unit 22, and the placement position of each component BH included in the production program 22A. The control unit 21 drives the second placement head 25 to place the component BH at the placement position of the component BH after the position correction.

[0098] On the other hand, when the control unit 21 determines that the calculated displacement amount is equal to or greater than the threshold value, it causes the first imaging camera 28A and the second imaging camera 28B to capture images of each of the board marks MK21-MK22. The control unit 21 recognizes (detects) the board marks MK21-MK22 from the captured images captured by the first imaging camera 28A and the second imaging camera 28B. The control unit 21 calculates a positional relation equation between the first placing head 24 and the second placing head 25 based on the recognized positions of each of the board marks MK21-MK22 recognized from the captured image captured by the first imaging camera 28A and the recognized positions of each of the board marks MK21-MK22 recognized from the captured image captured by the second imaging camera 28B.

[0099] The control unit 21 stores (updates) in the storage unit 22 the calculated positional relation equation and the recognized positions of the fixed marks MK11 to MK16 recognized by the first imaging camera 28A and the second imaging camera 28B on the first first substrate.

[0100] Furthermore, the control unit 21 corrects the mounting position of each component BH to be mounted by the second mounting head 25 based on the recognized positions of the board marks MK21-MK22 recognized by the first imaging camera 28A and the second imaging camera 28B, the calculated positional relation equation, and the mounting position of each component BH included in the production program 22A. The control unit 21 drives each of the first mounting head 24 and the second mounting head 25 to mount the component BH at the corrected mounting position.

[0101] In the example shown in Fig. 6, the first imaging camera 28A captures images of the board marks MK21 to MK22 of all boards KB, but the present invention is not limited to this. In addition, in the example shown in Fig. 6, the first board and the second board are each designated by the number of boards KB carried in (the number of boards KB produced), but the present invention is not limited to this. For example, the first board may be set based on the elapsed time from the start of production of the boards KB (for example, 0 seconds, 60 seconds, 85 seconds, etc.).

[0102] 6 shows an example in which component mounting apparatus 1B captures images of board marks MK21-MK22 with first imaging camera 28A and second imaging camera 28B, respectively, for first boards other than the first first board, i.e., the 9th and 24th boards, but is not limited to this. When component mounting apparatus 1B determines that the displacement amount of the recognition positions of fixing marks MK11-MK16 is not equal to or greater than a threshold value in the production of the 9th and 24th first boards, it may capture images of board marks MK21-MK22 with either first imaging camera 28A or second imaging camera 28B, and omit capturing images of board marks MK21-MK22 with the other imaging camera.

[0103] This allows component mounting apparatus 1B to reduce the time it takes to move the imaging camera for imaging and the time it takes to process the captured images, thereby improving the production efficiency of boards KB produced by component mounting apparatus 1B.

[0104] (Modification of the embodiment) The component mounting device 1B according to the embodiment has a configuration including a component supply unit 29. A component mounting system 1BA according to a modified example of the embodiment will be described with reference to an example in which the component supply unit 29 is configured separately from the component mounting device 1B and is realized as a component supply device 1B2 capable of supplying components BH to the component mounting device 1B.

[0105] 7 is a block diagram showing an example of the internal configuration of a component mounting system 1BA according to a modified example of the embodiment. Note that the component mounting system 1BA has substantially the same configuration as the component mounting device 1B and can achieve substantially the same functions, so the same components are given the same reference numerals and descriptions thereof are omitted.

[0106] The component mounting system 1BA includes a component mounting device 1B1 and a component supplying device 1B2, and can realize the same functions as the component mounting device 1B. The component mounting device 1B1 has a configuration in which the component supplying unit 29 is omitted from the component mounting device 1B according to the embodiment, and can realize the same functions as the component supplying unit 29 according to the embodiment, and is connected to the component mounting device 1B1 or the higher-level device P1 so as to be able to communicate data with each other, and supplies at least one component to be mounted on the board KB to the component mounting device 1B1.

[0107] As described above, component mounting apparatuses 1B and 1B1 in the embodiment and the modified example of the embodiment mount components BH on the first board and the second board. Component mounting apparatuses 1B and 1B1 include a base TB, a board transport section 23 provided on base TB and transporting the first board or the second board, a first mounting head 24 that mounts components BH on the first board or the second board transported by the board transport section 23, a second mounting head 25 that mounts components BH on the first board or the second board transported by the board transport section 23, a first mounting head moving mechanism 26 that moves the first mounting head 24, a second mounting head moving mechanism 27 that moves the second mounting head 25, a first imaging camera 28A provided on the first mounting head 24 and capturing an image of board marks MK21-MK22 (an example of a first characteristic portion) provided on the first board or board marks MK21-MK22 (an example of a second characteristic portion) provided on the second board, and a second mounting head 25 that moves the first mounting head 24. 5, and includes a second imaging camera 28B that images the board marks MK21-MK22 provided on the first board or the board marks MK21-MK22 provided on the second board, a calculation unit 21A that calculates a positional relation equation (an example of a correspondence relationship) between the first mounting head 24 and the second mounting head 25 based on a first captured image of the board marks MK21-MK22 captured by the first imaging camera 28A and a second captured image of the board marks MK21-MK22 captured by the second imaging camera 28B, a memory unit 22 that stores the positional relation equation, and a control unit 21 that drives the first mounting head moving mechanism 26 and the second mounting head moving mechanism 27 to cause the first mounting head 24 and the second mounting head 25 to mount components BH on the first board or the second board. When a first board is transported by the board transport section 23, the control section 21 places a component BH on the first board based on the positions of the board marks MK21-MK22 that appear in each of the first and second captured images, and when a second board is transported by the board transport section 23, the control section 21 places a component BH on the second board based on the positional relationship equation and the positions of the board marks MK21-MK22 that appear in the third captured image in which the board marks MK21-MK22 are captured by either the first imaging camera 28A or the second imaging camera 28B.

[0108] As a result, component mounting apparatuses 1B, 1B1 in the embodiment and the modified example of the embodiment calculate the positional relation equation during production of board KB, which is the first board, and can omit imaging and recognition of board marks MK21-MK22 by either the other imaging camera (specifically, first imaging camera 28A or second imaging camera 28B) in production of board KB, which is the second board, and can perform mounting of components BH by each of first mounting head 24 and second mounting head 25. Therefore, component mounting apparatuses 1B, 1B1 can shorten the processing time required for imaging board marks MK21-MK22 by two imaging cameras, calculating the recognition positions based on the images captured by the two imaging cameras, and the movement time of the two imaging cameras for imaging, and can achieve more accurate mounting of components BH and improved production efficiency of board KB.

[0109] Furthermore, the board transport unit 23 of the component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment transports the first board and the multiple second boards alternately. The storage unit 22 stores the transport timing of the first board. As a result, in the production of the board KB, which is the second board having a larger number than the first boards, the component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment can omit the imaging and recognition of the board marks MK21-MK22 by the other imaging camera (specifically, the first imaging camera 28A or the second imaging camera 28B) and perform mounting of the components BH by each of the first mounting head 24 and the second mounting head 25, thereby improving the production efficiency of the board KB.

[0110] Furthermore, when it is determined that it is time to transport the first board, calculation unit 21A of component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment recalculates the positional relation equation between first mounting head 24 and second mounting head 25 based on the first captured image and the second captured image, and updates the positional relation equation stored in storage unit 22 to the recalculated positional relation equation. In this way, component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment periodically recalculates the positional relation equation, thereby more effectively suppressing an increase in the amount of positional deviation of the mounting position of component BH, and achieving more accurate mounting of component BH.

[0111] Furthermore, the base TB of the component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment has fixing marks MK11-MK16 (an example of a reference portion) that are imaged by the first imaging camera 28A and the second imaging camera 28B. The control unit 21 causes the first imaging camera 28A and the second imaging camera 28B to image the fixing marks MK11-MK16, respectively, and causes the first imaging camera 28A and the second imaging camera 28B to image the board marks MK21-MK22 based on the positions of the fixing marks MK11-MK16 that appear in the image of the fixing marks MK11-MK16 that is imaged by the first imaging camera 28A (an example of a first reference image) and the positions of the fixing marks MK11-MK16 that appear in the image of the fixing marks MK11-MK16 that is imaged by the second imaging camera 28B (an example of a second reference image). As a result, the component mounting apparatuses 1B, 1B1 in the embodiment and the modified examples of the embodiment can more efficiently capture images of the board marks MK21-MK22 by the first imaging camera 28A and the second imaging camera 28B, respectively, based on the position information of the board marks MK21-MK22 on the board KB recorded in the production program 22A and the recognized positions of the fixing marks MK11-MK16.

[0112] Further, the storage unit 22 of the component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment stores the positions of the fixed marks MK11 to MK16 in the captured images captured by the first imaging camera 28A and the second imaging camera 28B. When the calculation unit 21A determines that it is the timing to transport the first board, it causes the first imaging camera 28A and the second imaging camera 28B to capture the fixed marks MK11 to MK16 again, calculates the positions of the fixed marks MK11 to MK16 in the captured images captured again, and calculates the positional relation equation again based on the displacement between the captured images stored in the storage unit 22 and the positions of the fixed marks MK11 to MK16 in the captured images, and the recalculated captured images and the positions of the fixed marks MK11 to MK16 in the captured images. As a result, the component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment can more effectively suppress an increase in the amount of positional deviation of the mounting position of the component BH, thereby realizing more accurate mounting of the component BH.

[0113] Furthermore, when the calculation unit 21A of the component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment determines that the displacement amount is equal to or greater than the threshold value, the calculation unit 21A recalculates the positional relation equation between the first mounting head 24 and the second mounting head 25 based on the first captured image and the second captured image, and updates the positional relation equation stored in the storage unit 22 to the recalculated positional relation equation. This allows the component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment to calculate the positional deviation amount of the first mounting head 24 and the second mounting head 25 based on the displacement amount of the recognition positions of the fixing marks MK11 to MK16. Therefore, when the component mounting apparatus 1B, 1B1 determines that the positional deviation amount of the first mounting head 24 and the second mounting head 25 based on the displacement amount is equal to or greater than the threshold value, the calculation unit 21A recalculates the positional relation equation, thereby more effectively suppressing an increase in the positional deviation amount of the mounting position of the component BH, thereby realizing more accurate mounting of the component BH.

[0114] Furthermore, when the calculation unit 21A of the component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment determines that the displacement amount is not equal to or greater than the threshold, it omits updating of the positional relation equation stored in the storage unit 22. This allows the component mounting apparatus 1B, 1B1 in the embodiment and the modified example of the embodiment to calculate the positional deviation amount of the first mounting head 24 and the second mounting head 25 based on the displacement amount of the recognition positions of the fixing marks MK11 to MK16. Therefore, when the component mounting apparatus 1B, 1B1 determines that the positional deviation amount of the first mounting head 24 and the second mounting head 25 based on the displacement amount is not equal to or greater than the threshold, it omits the calculation process and update process of the positional relation equation, thereby reducing the movement time of the two imaging cameras for imaging and the processes required for the calculation process and update process of the positional relation equation, thereby improving the production efficiency of the board KB.

[0115] Although various embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, corrections, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also belong to the technical scope of the present disclosure. In addition, the components in the various embodiments described above may be arbitrarily combined within the scope of the invention. [Industrial Applicability]

[0116] INDUSTRIAL APPLICABILITY The present disclosure is useful as a component mounting device, a component mounting method, and a component mounting system that can correct the mounting position of a component with higher accuracy when mounting components using two mounting heads. [Explanation of symbols]

[0117] 1B,1B1 Component placement device 1B2 Parts supply device 1BA Component Placement System 20 Communications Department 21 Control section 21A Calculation section 21B Update section 22 Memory section 22A Production Program 22B Positional relationship formula 22C Imaging timing data 23 Substrate transport section 24 First placement head 25 Second mounting head 26 First mounting head moving mechanism 26A, 27A X-axis table mechanism 26B, 27B Y-axis table mechanism 27 Second mounting head movement mechanism 28A First Imaging Camera 28B Second Imaging Camera 29 Parts Supply Department 100 Production System BH Parts KB board MK11,MK12,MK13,MK14,MK15,MK16 Fixed Mark MK21,MK22 board mark P1 Upper device TB base

Claims

1. A component mounting device that mounts components on a first board and a second board, The base and a substrate transport unit provided on the base and configured to transport the first substrate or the second substrate; a first mounting head that mounts the components onto the first board or the second board transported by the board transport unit; a second mounting head that mounts the components onto the first board or the second board transported by the board transport unit; a first mounting head moving mechanism that moves the first mounting head; a second mounting head moving mechanism that moves the second mounting head; a first imaging camera provided on the first mounting head for capturing an image of a first characteristic portion provided on the first substrate or a second characteristic portion provided on the second substrate; a second imaging camera provided on the second mounting head for capturing an image of a first characteristic portion provided on the first substrate or a second characteristic portion provided on the second substrate; a calculation unit that calculates a correspondence relationship between the first mounting head and the second mounting head based on a first captured image of the first characteristic portion captured by the first imaging camera and a second captured image of the first characteristic portion captured by the second imaging camera; A storage unit that stores the correspondence relationship; a control unit that drives the first mounting head moving mechanism and the second mounting head moving mechanism to place the components on the first board or the second board by the first mounting head and the second mounting head, The control unit is When the first board is transported by the board transport unit, the component is mounted on the first board based on positions of the first feature portion captured in each of the first captured image and the second captured image; when the second board is transported by the board transport unit, the component is mounted on the second board based on the correspondence relationship and a position of the second characteristic part captured in a third captured image in which the second characteristic part is captured by either the first imaging camera or the second imaging camera. Parts mounting device.

2. the substrate transport unit transports the first substrate and the plurality of second substrates alternately; The storage unit stores a transport timing of the first substrate.

2. The component mounting apparatus according to claim 1.

3. When it is determined that it is time to transport the first board, the calculation unit recalculates the correspondence relationship between the first mounting head and the second mounting head based on the first captured image and the second captured image, and updates the correspondence relationship stored in the storage unit to the recalculated correspondence relationship.

3. The component mounting apparatus according to claim 2.

4. the base has a reference portion imaged by the first imaging camera and the second imaging camera, the control unit causes each of the first imaging camera and the second imaging camera to capture an image of the reference part, and causes the first imaging camera and the second imaging camera to capture an image of the first characteristic part based on a position of the reference part captured in a first reference image of the reference part captured by the first imaging camera and a position of the reference part captured in a second reference image of the reference part captured by the second imaging camera.

2. The component mounting apparatus according to claim 1.

5. the storage unit stores a position of the reference portion in the first reference image and a position of the reference portion in the second reference image; When it is determined that it is time to transport the first substrate, the calculation unit causes the first imaging camera and the second imaging camera to image the reference part again, recalculates a position of the reference part appearing in the re-imaged first reference image and a position of the reference part appearing in the re-imaged second reference image, and recalculates the correspondence relationship based on an amount of displacement between the position of the reference part appearing in each of the first reference image and the second reference image stored in the storage unit and the recalculated position of the reference part appearing in each of the first reference image and the second reference image.

5. The component mounting apparatus according to claim 4.

6. When the calculation unit determines that the amount of displacement is equal to or greater than a threshold value, the calculation unit recalculates the correspondence relationship between the first mounting head and the second mounting head based on the first captured image and the second captured image, and updates the correspondence relationship stored in the storage unit to the recalculated correspondence relationship.

6. The component mounting apparatus according to claim 5.

7. When the calculation unit determines that the amount of displacement is not equal to or greater than the threshold, the calculation unit omits updating of the correspondence relationship stored in the storage unit.

7. The component mounting apparatus according to claim 6.

8. A component mounting method performed by a component mounting device, which mounts components on a first board or a second board using a first mounting head moved by a first mounting head moving mechanism and a second mounting head moved by a second mounting head moving mechanism, comprising: a substrate transport step of transporting the first substrate provided on a base and having a first characteristic portion or the second substrate provided on a base; a first imaging step of imaging the first feature portion provided on the first substrate by a first imaging camera included in the first mounting head and a second imaging camera included in the second mounting head; a calculation step of calculating and storing a correspondence relationship between the first mounting head and the second mounting head based on a first captured image of the first characteristic portion captured by the first imaging camera and a second captured image of the first characteristic portion captured by the second imaging camera; a component mounting process of mounting components on the first board or the second board by the first mounting head and the second mounting head, The component mounting step includes: When the first board is transported, the component is mounted on the first board based on positions of the first characteristic portion captured in each of the first captured image and the second captured image captured in the first imaging step; when the second board is transported, the component is mounted on the second board based on the correspondence relationship and a position of the second characteristic part captured in a third captured image in which the second characteristic part is captured by either the first imaging camera or the second imaging camera. How to install parts.

9. the substrate transport step transports the first substrate and the plurality of second substrates alternately based on a transport timing of the first substrate stored in advance; 9. The component mounting method according to claim 8.

10. when it is determined in the calculation step that it is time to transport the first substrate, the correspondence relationship between the first mounting head and the second mounting head is recalculated based on the first captured image of the first feature portion and the second captured image of the first feature portion, and the stored correspondence relationship is updated to the recalculated correspondence relationship.

10. The component mounting method according to claim 9.

11. a second imaging step of imaging a reference portion provided on the base by the first imaging camera and the second imaging camera, The first imaging step images the first characteristic part based on a position of the reference part captured in a first reference image of the reference part captured by the first imaging camera in the second imaging step and a position of the reference part captured in a second reference image of the reference part captured by the second imaging camera.

9. The component mounting method according to claim 8.

12. a storage step of storing a position of the reference portion captured in the first reference image obtained by the second imaging step and a position of the reference portion captured in the second reference image, the second imaging step is performed again when a new first substrate is transported in the substrate transport step; In the calculation step, a position of the reference part in the first reference image captured again in the second imaging step and a position of the reference part in the second reference image captured again are calculated again, and the correspondence relationship is calculated again based on an amount of displacement between the positions of the reference part in each of the first reference image and the second reference image stored in the storage step and the positions of the reference part in each of the first reference image and the second reference image that have been recalculated. The component mounting method according to claim 11.

13. When it is determined in the calculation step that the amount of displacement is equal to or greater than a threshold value, the correspondence relationship between the first mounting head and the second mounting head is calculated again based on the first captured image and the second captured image, When the correspondence relationship is recalculated in the calculation step, the storage step updates the stored correspondence relationship to the recalculated correspondence relationship. The component mounting method according to claim 12.

14. When it is determined in the calculation step that the amount of displacement is not equal to or greater than the threshold, updating of the stored correspondence relationship is omitted. The component mounting method according to claim 13.

15. A parts supply device; a component mounting device that mounts the components supplied by the component supply device onto a first board and a second board, The component mounting device includes: The base and a substrate transport unit provided on the base and configured to transport the first substrate or the second substrate; a first mounting head that mounts the components supplied from the component supply device onto the first board or the second board transported by the board transport unit; a second mounting head that mounts the components supplied from the component supply device onto the first board or the second board transported by the board transport unit; a first mounting head moving mechanism that moves the first mounting head; a second mounting head moving mechanism that moves the second mounting head; a first imaging camera provided on the first mounting head for capturing an image of a first characteristic portion provided on the first substrate or a second characteristic portion provided on the second substrate; a second imaging camera provided on the second mounting head for capturing an image of a first characteristic portion provided on the first substrate or a second characteristic portion provided on the second substrate; a calculation unit that calculates a correspondence relationship between the first mounting head and the second mounting head based on a first captured image of the first characteristic portion captured by the first imaging camera and a second captured image of the first characteristic portion captured by the second imaging camera; A storage unit that stores the correspondence relationship; a control unit that drives the first mounting head moving mechanism and the second mounting head moving mechanism to place the components on the first board or the second board by the first mounting head and the second mounting head, The control unit is When the first board is transported by the board transport unit, the component is mounted on the first board based on positions of the first characteristic portion captured in each of the first captured image and the second captured image; when the second board is transported by the board transport unit, the component is mounted on the second board based on the correspondence relationship and a position of the second characteristic part captured in a third captured image in which the second characteristic part is captured by either the first imaging camera or the second imaging camera. Parts mounting system.

16. the substrate transport unit transports the first substrate and the plurality of second substrates alternately; The storage unit stores a transport timing of the first substrate. The component mounting system according to claim 15.

17. When it is determined that it is time to transport the first board, the calculation unit recalculates the correspondence relationship between the first mounting head and the second mounting head based on the first captured image and the second captured image, and updates the correspondence relationship stored in the storage unit to the recalculated correspondence relationship.

17. The component mounting system of claim 16.

18. the base has a reference portion imaged by the first imaging camera and the second imaging camera, the control unit causes each of the first imaging camera and the second imaging camera to capture an image of the reference part, and causes the first imaging camera and the second imaging camera to capture an image of the first characteristic part based on a position of the reference part captured in a first reference image of the reference part captured by the first imaging camera and a position of the reference part captured in a second reference image of the reference part captured by the second imaging camera. The component mounting system according to claim 15.

19. the storage unit stores a position of the reference portion in the first reference image and a position of the reference portion in the second reference image; When it is determined that it is time to transport the first substrate, the calculation unit causes the first imaging camera and the second imaging camera to image the reference part again, recalculates a position of the reference part appearing in the re-imaged first reference image and a position of the reference part appearing in the re-imaged second reference image, and recalculates the correspondence relationship based on an amount of displacement between the position of the reference part appearing in each of the first reference image and the second reference image stored in the storage unit and the recalculated position of the reference part appearing in each of the first reference image and the second reference image.

20. The component mounting system of claim 18.

20. When the calculation unit determines that the amount of displacement is equal to or greater than a threshold value, the calculation unit recalculates the correspondence relationship between the first mounting head and the second mounting head based on the first captured image and the second captured image, and updates the correspondence relationship stored in the storage unit to the recalculated correspondence relationship.

20. The component mounting system of claim 19.

21. When the calculation unit determines that the amount of displacement is not equal to or greater than the threshold, the calculation unit omits updating of the correspondence relationship stored in the storage unit.

21. The component mounting system of claim 20.

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