Electronic device and power converter

Abstract

To provide an electronic device that may use a heat-generating components of different sizes capable of sharing a support plate with electronic devices that can use heat-generating components of different sizes.SOLUTION: A connection hole 41g is connected to an upper flow channel 41b at a position closer to the upstream end than the downstream end of the upper flow channel 41b in the first direction. In a lower flow channel 41e, the connection hole 41g is the upstream end in the second direction. The center plate 41 is erected from the bottom surface of the upper flow channel 41b and has a guide wall 50 that guides the refrigerant X from the inlet opening of the connection hole 41g toward the downstream end of the upper flow channel 41b.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to electronic devices and power conversion devices. [Background technology]

[0002] For example, Patent Document 1 discloses a power conversion device including a DC-DC converter, a reactor, a power module, etc. The power conversion device disclosed in Patent Document 1 includes a housing that houses the DC-DC converter, the reactor, the power module, etc. In addition, the power conversion device disclosed in Patent Document 1 has a flow path therein that guides a coolant. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-108182 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, the power converter disclosed in Patent Document 1 has heat generating components disposed above and below the housing. In the case of an electronic device such as this power converter, an internal flow path for guiding a refrigerant is formed, for example, so as to be folded up and down inside the electronic device. In other words, the internal flow path is formed in a shape in which an upper flow path for guiding a refrigerant from one side to the other side and a lower flow path for guiding a refrigerant from the other side to the one side are connected at their ends. For example, in such a case, each of the upper flow path and the lower flow path is formed by arranging a support plate for supporting the heat generating components and the heat generating components opposite each other with a gap therebetween.

[0005] However, if the heat generating components attached to the support plate are different in size, it may not be possible to form the upper flow path or the lower flow path. For example, when a lower flow path is formed by attaching a relatively large heat generating component to the support plate, if a relatively small heat generating component is attached to the same support plate, a gap is created through which the refrigerant can flow out, making it impossible to form a sealed lower flow path. For this reason, the same support plate cannot be used for electronic devices that use heat generating components of different sizes, and the support plate cannot be shared by different types of electronic devices.

[0006] The present invention has been made in consideration of the above-mentioned problems, and has an object to make it possible to share a support plate between electronic devices that may use heat-generating components of different sizes. [Means for solving the problem]

[0007] The present invention employs the following configuration as a means for solving the above problems.

[0008] A first aspect of the present invention is a heat generating device comprising a first heat generating component, a second heat generating component separate from the first heat generating component, and a support plate having a first surface to which the first heat generating component is attached and a second surface located on the back side of the first surface to which the second heat generating component is attached, the support plate having a first flow path groove provided on the first surface and guiding a refrigerant mainly along a first direction along the first surface, a second flow path groove provided on the second surface and guiding the refrigerant mainly along a second direction opposite to the first direction, The support plate has a connection hole formed through the plate and guiding the refrigerant from the first flow path groove to the second flow path groove, the connection hole is connected to the first flow path groove at a position closer to an upstream end than a downstream end of the first flow path groove in the first direction, and the second flow path groove has an upstream end in the second direction at a connection portion with the connection hole, and the support plate has a guide wall erected from a bottom surface of the first flow path groove and guiding the refrigerant from an inlet opening of the connection hole toward the downstream end of the first flow path groove.

[0009] A second aspect of the present invention includes the electronic device according to the first aspect of the present invention, and employs a configuration including a power conversion circuit formed by the first heat generating component and the second heat generating component. Effect of the Invention

[0010] According to the present invention, the guide wall provided on the support plate guides the refrigerant from the inlet opening of the connection hole toward the downstream end of the first flow groove. Therefore, the first heat-generating component attached to the first surface efficiently exchanges heat with the refrigerant up to the end. Therefore, even if the connection position of the connection hole to the first flow groove is close to the upstream end, it is possible to suppress a decrease in the heat exchange efficiency between the first heat-generating component and the refrigerant. In addition, the second flow groove provided on the second surface of the support plate is shorter than the first flow groove. Therefore, it is possible to attach, for example, a second heat-generating component smaller than the first heat-generating component to the second surface, not limited to a second heat-generating component having the same size as the first heat-generating component. Therefore, the present invention allows a support plate to be shared between electronic devices that may use heat-generating components of different sizes and electronic devices that use heat-generating components of different sizes. [Brief description of the drawings]

[0011] [Figure 1] 1 is a schematic configuration diagram of a vehicle equipped with a power conversion device according to an embodiment of the present invention. [Diagram 2] 1 is a circuit diagram showing a schematic electrical configuration of a step-up / step-down converter and an inverter included in a power conversion device according to an embodiment of the present invention. [Diagram 3] 1 is an exploded perspective view showing a schematic structural configuration of a power conversion device according to an embodiment of the present invention; [Figure 4] FIG. 2 is a top view of a center plate provided in the power conversion device according to one embodiment of the present invention. [Diagram 5] 4 is a bottom view of a center plate provided in the power conversion device according to one embodiment of the present invention. FIG. [Figure 6]2 is a schematic cross-sectional view including a center plate provided in a power conversion device according to an embodiment of the present invention. FIG. [Figure 7] FIG. 5 is an enlarged view of FIG. 4 including a guide wall. [Figure 8] 4 is a bottom view showing a base plate provided in the power conversion device according to one embodiment of the present invention. FIG. [Figure 9] 4 is a bottom view showing a part of a base plate provided in the power conversion device according to one embodiment of the present invention. FIG. [Figure 10] 4 is a cross-sectional view including a guide wall and a rib provided in a power conversion device according to one embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic device and a power conversion device according to the present invention will now be described with reference to the drawings.

[0013] Fig. 1 is a schematic configuration diagram of a vehicle 100 equipped with a power conversion device 1 of the present embodiment. The vehicle 100 is, for example, an electric vehicle or a hybrid vehicle. As shown in Fig. 1, the vehicle 100 includes, for example, a high-voltage battery HB, a low-voltage battery LB, a motor M, and the power conversion device 1 of the present embodiment.

[0014] The high-voltage battery HB is a secondary battery such as a lithium-ion battery, and outputs a relatively high-voltage DC power of, for example, several hundred volts. This high-voltage battery HB is a battery that outputs driving power supplied to the motor M, and is a so-called driving battery. The low-voltage battery LB is a secondary battery such as a lead-acid battery, and outputs a relatively low-voltage DC power of, for example, about 12 V. This low-voltage battery LB is a battery that outputs auxiliary power to be supplied to auxiliary devices (not shown), and is a so-called auxiliary device battery.

[0015] The motor M generates rotational power by receiving driving power from a high-voltage battery HB via the power conversion device 1. The rotational power generated by the motor M is transmitted to the driving wheels of the vehicle 100 via a transmission mechanism (not shown).

[0016] The power conversion device 1 of this embodiment is a device that performs power conversion. For example, the power conversion device 1 converts DC power to AC power, AC power to DC power, and voltage. Specifically, the power conversion device 1 of this embodiment boosts the drive power output from the high-voltage battery HB and converts it to AC to supply it to the motor M. The power conversion device 1 of this embodiment also converts the regenerative power output from the motor M to DC, reduces the voltage, and supplies it to the high-voltage battery HB. Furthermore, the power conversion device 1 of this embodiment reduces the voltage of the drive power output from the high-voltage battery HB to generate power for auxiliary devices, and supplies it to the low-voltage battery LB.

[0017] As shown in FIG. 1, the power conversion device 1 of this embodiment includes a step-up / step-down converter 2, an inverter 3, and a DC-DC converter 4. The step-up / step-down converter 2, the inverter 3, and the DC-DC converter 4 are power conversion circuits that perform power conversion. The step-up / step-down converter 2 steps up or steps down the power. For example, the step-up / step-down converter 2 steps up the drive power supplied from the high-voltage battery HB and outputs it to the inverter 3. The step-up / step-down converter 2 also steps down the regenerative power supplied from the inverter 3 and outputs it to the high-voltage battery HB.

[0018] The inverter 3 converts DC power to AC power, or converts AC power to DC power. For example, the inverter 3 converts the DC driving power supplied from the step-up / step-down converter 2 into three-phase AC power and outputs it to the motor M. The inverter 3 also converts the AC regenerative power supplied from the motor M into DC power and outputs it to the high-voltage battery HB.

[0019] The DCDC converter 4 steps down the driving power output from the high-voltage battery HB and converts it into power for auxiliary devices. The DCDC converter 4 converts the DC driving power into DC power for auxiliary devices.

[0020] Fig. 2 is a circuit diagram showing a schematic electrical configuration of the step-up / step-down converter 2 and the inverter 3. As shown in Fig. 2, the power conversion device 1 of this embodiment includes the step-up / step-down converter 2 and the inverter 3 connected to each other.

[0021] The step-up / step-down converter 2 includes two power devices D, a capacitor C, and a reactor L. The inverter 3 includes three power devices D. Each power device D includes a power transistor. These power transistors include semiconductor elements and are mounted on an insulating circuit board. In this embodiment, one power device D includes two power transistors. However, a power device including a single power transistor may be included. In this case, four power devices are provided in the step-up / step-down converter 2, and six power devices are provided in the inverter 3. For example, each power transistor includes a plurality of semiconductor elements formed of, for example, SiC (silicon carbide). The power transistor may include a semiconductor element formed of other materials such as Si (silicon) and GaN (gallium nitride).

[0022] 3 is an exploded perspective view showing a schematic structural configuration of the power conversion device 1 of this embodiment. As shown in FIG. 3, the power conversion device 1 of this embodiment includes an intelligent power module 10, a heat sink 11, a capacitor unit 12, a base plate 13, a reactor unit 14, a DC-DC converter unit 15, and a main body case 16.

[0023] In the following description, for convenience of explanation, the direction in which the base plate 13 is located relative to a center plate 41 (described later) of the main body case 16 is defined as an upper direction, and the direction in which the heat sink 11 is located relative to a center plate 41 (described later) of the main body case 16 is defined as a lower direction. However, the installation posture of the power conversion device 1 is not particularly limited.

[0024] The intelligent power module 10 includes a power module 20, a gate driver board 21, an ECU board 22, etc. The power module 20 includes a plurality of power devices D having semiconductor elements, a resin power module case that houses these power devices D, etc.

[0025] The gate driver board 21 is a board on which a gate driver that generates drive signals for the step-up / step-down converter 2 and the inverter 3 formed by the power devices D is provided. Such a gate driver board 21 is stacked on the power module 20. The ECU board 22 is a board on which an ECU (Electronic Control Unit) that controls the gate driver board 21 is provided. This ECU board 22 is stacked on the gate driver board 21.

[0026] Such an intelligent power module 10 includes a power device D that forms the step-up / step-down converter 2 and the inverter 3. That is, the intelligent power module 10 forms at least a part of the step-up / step-down converter 2 and the inverter 3.

[0027] The heat sink 11 absorbs heat from the intelligent power module 10 and dissipates the heat to the refrigerant X flowing through internal flow paths (first flow path R1 and second flow path R2) described below. In this embodiment, the heat sink 11 is attached from below to a center plate 41 described below of the main body case 16. In addition, the intelligent power module 10 is attached to the heat sink 11 so that the power module 20 abuts against the heat sink 11 from below.

[0028] The intelligent power module 10 and the heat sink 11 form a lower heat generating component 30 (second heat generating component). That is, the lower heat generating component 30 includes a power module 20 having a power device D. The lower heat generating component 30 also includes a heat sink 11 on which the power module 20 is mounted. The lower heat generating component 30 is a heat generating component located below the center plate 41, and generates heat when electricity is applied. The lower heat generating component 30 is cooled by a refrigerant X, which will be described later.

[0029] The capacitor unit 12 is connected to the intelligent power module 10, and is disposed to the side of the power module 20. The capacitor unit 12 is a unit including a capacitor C that the step-up / step-down converter 2 has.

[0030] The base plate 13 is a substrate on which the reactor unit 14 and the DCDC converter unit 15 are provided. In this embodiment, the base plate 13 is attached from above to a center plate 41 (described later) of the main body case 16. The reactor unit 14 and the DCDC converter unit 15 are attached to the base plate 13 so as to abut against the base plate 13 from above.

[0031] The reactor unit 14 is fixed to the base plate 13. The reactor unit 14 is connected to the intelligent power module 10 via a bus bar (not shown), and is disposed above the center plate 41 in this embodiment. The reactor unit 14 is a unit including a reactor L provided in the step-up / step-down converter 2.

[0032] The DCDC converter unit 15 is fixed to the same base plate 13 as the reactor unit 14. This DCDC converter unit 15 is connected to the intelligent power module 10 via a bus bar (not shown), and in this embodiment, is disposed above the center plate 41. The DCDC converter unit 15 is a unit that forms the DCDC converter 4 shown in FIG.

[0033] The base plate 13, the reactor unit 14, and the DCDC converter unit 15 form an upper heat generating component 31 (first heat generating component). That is, the upper heat generating component 31 includes the reactor unit 14 and the DCDC converter unit 15. The upper heat generating component 31 also includes the base plate 13 on which the reactor unit 14 and the DCDC converter unit 15 are mounted. The upper heat generating component 31 is a heat generating component located above the central plate 41, and generates heat when electricity is applied. The upper heat generating component 31 is cooled by a refrigerant X, which will be described later.

[0034] The main body case 16 is a case that houses the intelligent power module 10, the heat sink 11, the capacitor unit 12, the base plate 13, the reactor unit 14, and the DCDC converter unit 15. This main body case 16 includes an upper cover 40, a center plate 41, and a lower cover 42. The upper cover 40, the center plate 41, and the lower cover 42 are formed so as to be separable in the vertical direction.

[0035] The upper cover 40 covers from above the upper heat-generating component 31 fixed from above to the central plate 41. In other words, the upper cover 40 covers from above the base plate 13, the reactor unit 14, and the DC-DC converter unit 15 included in the upper heat-generating component 31. Such an upper cover 40 is fastened to the central plate 41 via bolts or the like (not shown).

[0036] The central plate 41 is a support plate located between the upper cover 40 and the lower cover 42. The lower heat-generating component 30 is attached to the central plate 41 from below, and the upper heat-generating component 31 is attached to the central plate 41 from above, and the central plate 41 supports the lower heat-generating component 30 and the upper heat-generating component 31.

[0037] The lower cover 42 covers, from below, the lower heat generating component 30 fixed to the central plate 41 from below. In other words, the lower cover 42 covers, from below, the power module 20 and the heat sink 11 included in the lower heat generating component 30. Such a lower cover 42 is fastened to the central plate 41 via bolts or the like (not shown).

[0038] Fig. 4 is a top view of the central plate 41. Fig. 5 is a bottom view of the central plate 41. Fig. 6 is a schematic cross-sectional view including the central plate 41. An upper surface 41a (first surface) of the central plate 41 is a surface to which the upper heat-generating component 31 is attached. As shown in Fig. 4, the central plate 41 has an upper flow passage groove 41b provided in the upper surface 41a. The upper flow passage groove 41b is a groove portion for guiding the refrigerant X.

[0039] As shown in FIG. 6, the upper flow passage groove 41b is a groove portion whose longitudinal direction is along the arrangement direction of the DCDC converter unit 15 and the reactor unit 14. The center plate 41 has a supply port 41c at an end of the upper flow passage groove 41b on the DCDC converter unit 15 side in the longitudinal direction. The supply port 41c is formed to penetrate the center plate 41 in the horizontal direction, and is a through hole through which the refrigerant X that flows into the upper flow passage groove 41b from the outside passes. The upper flow passage groove 41b mainly guides the refrigerant X in a direction along the longitudinal direction from the supply port 41c. That is, the upper flow passage groove 41b guides the refrigerant X from the supply port 41c in a direction along the upper surface 41a of the center plate 41. In the following description, the flow direction of the refrigerant X in the upper flow passage groove 41b is referred to as a first direction. That is, the upper flow passage groove 41b mainly guides the refrigerant X in the first direction.

[0040] Note that guiding the refrigerant X mainly in the first direction does not mean that the refrigerant X is guided in the first direction at all portions of the upper flow passage groove 41b. In other words, guiding the refrigerant X mainly in the first direction does not exclude the case where the refrigerant X locally flows in a direction different from the first direction at a portion of the upper flow passage groove 41b.

[0041] As shown in FIG. 4, the upper flow passage groove 41b has an upstream portion 41b1 and a downstream portion 41b2. The end portion to which the supply port 41c is connected is the upstream end of the upper flow passage groove 41b, and the end portion located on the opposite side of the supply port 41c in the first direction is the downstream end of the upper flow passage groove 41b. The upstream portion 41b1 is located upstream of the downstream portion 41b2. The upstream portion 41b1 has substantially the same flow passage width as the DCDC converter unit 15. In this embodiment, when viewed from above, the DCDC converter unit 15 has a larger dimension in the width direction (direction perpendicular to the first direction) than the reactor unit 14. Therefore, the width direction dimension of the upstream portion 41b1 is larger than the width direction dimension of the downstream portion 41b2.

[0042] The downstream portion 41b2 is located downstream of the upstream portion 41b1. The downstream portion 41b2 has substantially the same flow path width as the reactor unit 14. The width dimension of the downstream portion 41b2 is larger than the width dimension of the upstream portion 41b1.

[0043] 6, the base plate 13 of the upper heat generating component 31 is disposed so as to close the upper flow passage groove 41b from above. A first flow passage R1 is formed between the base plate 13 and the central plate 41. This first flow passage R1 includes the upper flow passage groove 41b. In other words, the base plate 13 is fixed to the central plate 41 to form the first flow passage R1 including the upper flow passage groove 41b.

[0044] The lower surface 41d (second surface) of the central plate 41 is a surface to which the lower heat-generating component 30 is attached. As shown in Fig. 5, the central plate 41 has a lower flow passage groove 41e provided in the lower surface 41d. The lower flow passage groove 41e is a groove portion for guiding the refrigerant X.

[0045] 5, like the upper flow passage groove 41b, the lower flow passage groove 41e is a groove portion whose longitudinal direction is along the arrangement direction of the DCDC converter unit 15 and the reactor unit 14. The center plate 41 has an outlet 41f at an end of the lower flow passage groove 41e on the DCDC converter unit 15 side in the longitudinal direction. The outlet 41f is formed to penetrate the center plate 41 in the horizontal direction, and is a through hole through which the refrigerant X passes when it is discharged from the lower flow passage groove 41e to the outside.

[0046] The lower flow passage groove 41e mainly guides the refrigerant X in a direction along the longitudinal direction toward the exhaust port 41f. That is, the lower flow passage groove 41e guides the refrigerant X in a direction along the upper surface 41a of the center plate 41 toward the exhaust port 41f. In the following description, the flow direction of the refrigerant X in the lower flow passage groove 41e is referred to as a second direction. That is, the lower flow passage groove 41e mainly guides the refrigerant X in the second direction.

[0047] Note that guiding the refrigerant X mainly in the second direction does not mean that the refrigerant X is guided in the second direction at all portions of the lower flow passage groove 41e. In other words, guiding the refrigerant X mainly in the second direction does not exclude the case where the refrigerant X locally flows in a direction different from the second direction at a portion of the lower flow passage groove 41e.

[0048] 6, the lower flow passage groove 41e is located below the upper flow passage groove 41b. A first direction in which the refrigerant X mainly flows in the upper flow passage groove 41b is opposite to a second direction in which the refrigerant X mainly flows in the lower flow passage groove 41e. That is, the refrigerant X flows in opposite directions in the upper flow passage groove 41b and the lower flow passage groove 41e.

[0049] 6, the heat sink 11 of the lower heat generating component 30 is disposed so as to close the lower flow passage groove 41e from below. A second flow passage R2 is formed between the heat sink 11 and the central plate 41. This second flow passage R2 includes the lower flow passage groove 41e. In other words, the heat sink 11 is fixed to the central plate 41 to form the second flow passage R2 including the lower flow passage groove 41e.

[0050] As shown in FIG. 6, the center plate 41 has a connection hole 41g. The connection hole 41g is provided to penetrate the center plate 41 and guides the refrigerant X from the upper flow passage groove 41b to the lower flow passage groove 41e. The connection hole 41g is provided to penetrate the center plate 41 in the up-down direction. As shown in FIG. 6, the connection hole 41g is connected to the upper flow passage groove 41b at a position closer to the upstream end than to the downstream end of the upper flow passage groove 41b in the first direction. The position at which the connection hole 41g is connected in the upper flow passage groove 41b is disposed on the downstream end side than the center position of the upper flow passage groove 41b in the first direction. In this embodiment, the connection hole 41g is connected to the downstream part 41b2 of the upper flow passage groove 41b.

[0051] Also, the lower flow passage groove 41e has an upstream end in the second direction at a connection portion with the connection hole 41g. The supply port 41c connected to the upper flow passage groove 41b and the discharge port 41f connected to the lower flow passage groove 41e are arranged at positions overlapping each other when viewed from the top-bottom direction. Therefore, the upstream end of the upper flow passage groove 41b and the downstream end of the lower flow passage groove 41e are arranged at the same position when viewed from the top-bottom direction. On the other hand, the upstream end of the lower flow passage groove 41e is located downstream of the upstream end of the upper flow passage groove 41b when viewed from the top-bottom direction. That is, in this embodiment, the length dimension of the lower flow passage groove 41e in the second direction is smaller than the length dimension of the upper flow passage groove 41b in the first direction.

[0052] Further, when viewed from the top-bottom direction, a portion of the lower surface 41d downstream in the first direction from the upstream end of the lower flow passage groove 41e (a portion overlapping with the downstream end of the upper flow passage groove 41b when viewed from the top-bottom direction) is a base portion 41h against which the heat sink 11 can abut. When a large lower heat generating component 30 is attached to the lower surface 41d of the center plate 41, an end portion of the lower heat generating component 30 abuts against the base portion 41h. In addition to the lower heat generating component 30, a discharge resistor, a filter member for noise removal, and a bus bar may be abutted against the base portion 41h. In such a case, the discharge resistor, the filter member, and the bus bar can be cooled.

[0053] The central plate 41 also includes an opposing wall portion 41i protruding from the base portion 41h toward the downstream side in the second direction. The opposing wall portion 41i is disposed so as to cover the connection hole 41g from below. That is, the opposing wall portion 41i is disposed facing the bottom surface of the lower flow channel 41e with a gap therebetween, and is provided so as to cover the outlet opening of the connection hole 41g. Even when a small lower heat generating component 30 is attached to the lower surface 41d of the central plate 41, the end of the lower heat generating component 30 can abut against such opposing wall portion 41i. Note that the opposing wall portion 41i may not be provided, and the heat sink 11 may be provided so as to cover the outlet opening of the connection hole 41g from below.

[0054] 4, the center plate 41 has a guide wall 50. The guide wall 50 stands upright on the bottom surface of the upper flow passage groove 41b. The height dimension of the guide wall 50 is smaller than the depth dimension of the upper flow passage groove 41b. The upper end of the guide wall 50 is separated from the base plate 13. The guide wall 50 guides the refrigerant X from the position where the inlet opening of the connection hole 41g is provided toward the downstream end of the upper flow passage groove 41b.

[0055] Fig. 7 is an enlarged view of Fig. 4 including the guide wall 50. As shown in this figure, the guide wall 50 is formed in a U-shape having an arc-shaped portion 51, a first linear portion 52, and a second linear portion 53 when viewed in the normal direction (i.e., the up-down direction) of the bottom surface of the upper flow channel 41b.

[0056] The arc-shaped portion 51 is a portion formed in a semicircular arc shape when viewed from the top-bottom direction. The arc-shaped portion 51 is disposed on the upstream side of the connection hole 41g in the first direction. The arc-shaped portion 51 is curved such that the center portion bulges toward the downstream side in the first direction in a direction perpendicular to the first direction. Such an arc-shaped portion 51 functions as a dam that prevents the refrigerant X flowing from the upstream to the downstream in the first direction from flowing directly into the connection hole 41g.

[0057] The first linear portion 52 is a portion formed so as to extend linearly from one end of the arc-shaped portion 51 toward the downstream end of the upper flow channel 41b. The second linear portion 53 is a portion formed so as to extend linearly from the other end of the arc-shaped portion 51 toward the downstream end of the upper flow channel 41b. The first linear portion 52 and the second linear portion 53 are arranged so as to be parallel to each other when viewed in the up-down direction.

[0058] The first linear portion 52 and the second linear portion 53 guide the refrigerant X, whose flow direction has been changed by the arc-shaped portion 51, toward the downstream end of the upper flow channel 41b. A gap S is provided between the downstream end of the first linear portion 52 and the downstream end of the second linear portion 53 and the inner wall surface of the upper flow channel 41b. The refrigerant X guided to the first linear portion 52 and the second linear portion 53 flows into the gap S between the first linear portion 52 and the second linear portion 53. The refrigerant X that flows into the gap S between the first linear portion 52 and the second linear portion 53 flows in the direction opposite to the first direction and into the connection hole 41g.

[0059] 7, the distance from the first linear portion 52 to the inner wall surface of the upper flow passage groove 41b facing the first linear portion 52 is referred to as the separation dimension Da, and the distance from the second linear portion 53 to the inner wall surface of the upper flow passage groove 41b facing the second linear portion 53 is referred to as the separation dimension Db. A line located midway between the first linear portion 52 and the second linear portion is referred to as the center line La. The distance from the first linear portion 52 to the center line La is referred to as the dimension D1, and the distance from the second linear portion 53 to the center line La is referred to as the dimension D2.

[0060] For example, the guide wall 50 may be formed such that the separation dimension Da is equal to the dimension D1, and the separation dimension Db is equal to the dimension D2. In such a case, the flow path cross-sectional area between the first linear portion 52 and the inner wall surface of the upper flow path groove 41b is equal to the flow path cross-sectional area between the first linear portion 52 and the center line La. This makes the flow velocity of the refrigerant X flowing between the first linear portion 52 and the inner wall surface of the upper flow path groove 41b and the flow velocity of the refrigerant X flowing between the first linear portion 52 and the center line La substantially the same, thereby suppressing an increase in pressure loss in the first flow path R1.

[0061] In this case, the flow path cross-sectional area between the second straight-line portion 53 and the inner wall surface of the upper flow path groove 41b becomes equal to the flow path cross-sectional area between the second straight-line portion 53 and the center line La. This makes the flow velocity of the refrigerant X flowing between the second straight-line portion 53 and the inner wall surface of the upper flow path groove 41b and the flow velocity of the refrigerant X flowing between the second straight-line portion 53 and the center line La approximately equal, thereby suppressing an increase in pressure loss in the first flow path R1.

[0062] It is not necessary that the separation dimension Da is equal to the dimension D1, and that the separation dimension Db is equal to the dimension D2. For example, by forming the guide wall 50 so that the sum of the separation dimension Da and the separation dimension Db is equal to the sum of the dimension D1 and the dimension D2 (the separation dimension from the first linear portion 52 to the second linear portion 53), an increase in pressure loss in the first flow path R1 can be similarly suppressed.

[0063] Moreover, the dimension of the gap S is smaller than the separation dimension Da and the separation dimension Db. This increases the flow speed of the refrigerant X passing through the gap S, and reduces the pressure in the gap S. This makes it easier for the refrigerant X flowing between the first linear portion 52 and the inner wall surface of the upper flow passage groove 41b to flow toward the gap S. Furthermore, it makes it easier for the refrigerant X flowing between the second linear portion 53 and the inner wall surface of the upper flow passage groove 41b to flow toward the gap S. This makes it possible to prevent the refrigerant X from flowing over the upper end of the guide wall 50.

[0064] Fig. 8 is a bottom view showing the base plate 13. Fig. 9 is a bottom view showing a part of the base plate 13. As shown in these figures, the base plate 13 has a plurality of ribs 13a. These ribs 13a are provided so as to protrude downward from the base of the base plate 13. Furthermore, these ribs 13a are provided at positions overlapping with the downstream portions 41b2 of the upper flow passage grooves 41b when viewed from the top-bottom direction.

[0065] The rib 13a includes a U-shaped rib 13b that is U-shaped when viewed from the top-bottom direction, and a linear rib 13c that is linear when viewed from the top-bottom direction. The U-shaped rib 13b is disposed on the outside of the guide wall 50 so as to follow the guide wall 50 when viewed from the top-bottom direction. The linear rib 13c is formed so as to be parallel to the first linear portion 52 and the second linear portion 53 of the guide wall 50 when viewed from the top-bottom direction. The linear rib 13c is provided between the first linear portion 52 and the second linear portion 53, between the first linear portion 52 and the inner wall surface of the upper flow channel 41b, and between the second linear portion 53 and the inner wall surface of the upper flow channel 41b.

[0066] 10 is a cross-sectional view including a guide wall 50 and a rib 13a. As shown in this figure, the guide wall 50 is disposed between a plurality of ribs 13a. These guide walls 50 and the ribs 13a form a labyrinth structure 60 that suppresses the refrigerant X from flowing in a direction perpendicular to the first direction (the left-right direction in FIG. 10). Such a labyrinth structure 60 can suppress the refrigerant X from flowing over the upper end of the guide wall 50.

[0067] As described above, in this embodiment, the upper heat generating component 31 has the rib 13 a that is adjacent to the guide wall 50 with a gap therebetween and forms the labyrinth structure 60 together with the guide wall 50 .

[0068] The power conversion device 1 of this embodiment is connected to a supply pipe 200 (see FIG. 3) that guides the refrigerant X to be supplied to the power conversion device 1 of this embodiment, and a discharge pipe 300 (see FIG. 3) that guides the refrigerant X discharged from the power conversion device 1 of this embodiment.

[0069] The supply pipe 200 and the discharge pipe 300 are connected to a central plate 41 of the main body case 16. The supply pipe 200 is connected to a supply port 41c provided in the central plate 41. Moreover, the discharge pipe 300 is connected to a discharge port 41f provided in the central plate 41. The refrigerant X is supplied to the inside of the central plate 41 from the supply pipe 200 via the supply port 41c. Moreover, the central plate 41 discharges the refrigerant X inside to the discharge pipe 300 via the discharge port 41f.

[0070] In the power conversion device 1 of the present embodiment as described above, when performing power conversion, the lower heat generating component 30 and the upper heat generating component 31 generate heat. The power module 20 included in the lower heat generating component 30 and the reactor unit 14 and the DCDC converter unit 15 included in the upper heat generating component 31 generate a large amount of heat. The heat of the lower heat generating component 30 and the upper heat generating component 31 is absorbed by the refrigerant X. As a result, the lower heat generating component 30 and the upper heat generating component 31 are cooled.

[0071] The coolant X is supplied to the inside of the central plate 41 from a supply port 41c provided in the central plate 41. The coolant X supplied to the inside of the central plate 41 flows mainly in a first direction through the first flow path R1. At this time, the coolant X exchanges heat with the upper heat-generating component 31, thereby cooling the upper heat-generating component 31. Meanwhile, the coolant X increases in temperature due to the heat exchange between the coolant X and the upper heat-generating component 31.

[0072] The refrigerant X flowing through the first flow passage R1 flows through the upstream portion 41b1 and then the downstream portion 41b2 of the upper flow passage groove 41b. The refrigerant X flowing through the downstream portion 41b2 is guided toward the downstream end of the upper flow passage groove 41b by a guide wall 50 provided in the upper flow passage groove 41b. The refrigerant X that has flowed from the upstream portion 41b1 to the downstream portion 41b2 in this manner is prevented by the guide wall 50 from flowing into the connection hole 41g until it reaches the downstream end of the upper flow passage groove 41b.

[0073] Furthermore, the center plate 41 has a labyrinth structure 60 provided in the downstream portion 41b2. The labyrinth structure 60 prevents the refrigerant X flowing through the downstream portion 41b2 from flowing in a direction perpendicular to the first direction. Therefore, the labyrinth structure 60 prevents the refrigerant X that has flowed from the upstream portion 41b1 into the downstream portion 41b2 from flowing over the guide wall 50 and into the connecting hole 41g before reaching the downstream end of the upper flow passage groove 41b.

[0074] The refrigerant X that has reached the downstream end of the upper flow passage groove 41b has its flow direction changed at the downstream end of the upper flow passage groove 41b, and flows into between the first straight-line portion 52 and the second straight-line portion 53 of the guide wall 50. The refrigerant X flowing between the first straight-line portion 52 and the second straight-line portion 53 of the guide wall 50 flows into the connection hole 41g, and is supplied to the lower flow passage groove 41e (i.e., the second flow passage R2).

[0075] The connection hole 41g is connected to the upstream end of the lower passage groove 41e. The coolant X supplied from the connection hole 41g to the lower passage groove 41e flows mainly in the second direction from the upstream end to the downstream end of the lower passage groove 41e. At this time, the coolant X exchanges heat with the lower heat generating component 30, thereby cooling the lower heat generating component 30. Meanwhile, the coolant X further increases in temperature due to the heat exchange between the coolant X and the lower heat generating component 30.

[0076] The coolant X that has reached the downstream end of the lower flow passage groove 41e is discharged to the outside of the central plate 41 from an outlet 41f provided in the central plate 41. In this manner, as the coolant X flows through the internal flow passages (the first flow passage R1 and the second flow passage R2) of the central plate 41, heat from the lower heat generating component 30 and the upper heat generating component 31 is discharged to the outside of the power conversion device 1, and the lower heat generating component 30 and the upper heat generating component 31 are cooled.

[0077] The power conversion device 1 of the present embodiment as described above includes the upper heat generating component 31, the lower heat generating component 30, and the central plate 41. The lower heat generating component 30 is a heat generating component separate from the upper heat generating component 31. The central plate 41 has an upper surface 41a to which the upper heat generating component 31 is attached, and a lower surface 41d to which the lower heat generating component 30 is attached. The lower surface 41d is located on the reverse side of the upper surface 41a.

[0078] The central plate 41 also has an upper flow passage groove 41b, a lower flow passage groove 41e, and a connection hole 41g. The upper flow passage groove 41b is provided on the upper surface 41a and guides the refrigerant X mainly along a first direction along the upper surface 41a. The lower flow passage groove 41e is provided on the lower surface 41d and guides the refrigerant X mainly along a second direction opposite to the first direction. The connection hole 41g is provided penetrating the central plate 41 and guides the refrigerant X from the upper flow passage groove 41b to the lower flow passage groove 41e.

[0079] Furthermore, the connection hole 41g is connected to the upper flow passage groove 41b at a position closer to the upstream end than to the downstream end of the upper flow passage groove 41b in the first direction. The lower flow passage groove 41e has an upstream end in the second direction at a connection portion with the connection hole 41g. The center plate 41 has a guide wall 50. The guide wall 50 stands from the bottom surface of the upper flow passage groove 41b and guides the refrigerant X from the inlet opening of the connection hole 41g toward the downstream end of the upper flow passage groove 41b.

[0080] In the power converter 1 of the present embodiment, the guide wall 50 provided on the central plate 41 guides the coolant X from the inlet opening of the connection hole 41g toward the downstream end of the upper flow passage groove 41b. Therefore, the upper heat generating component 31 attached to the upper surface 41a efficiently exchanges heat with the coolant X up to the end. Therefore, even if the connection position of the connection hole 41g to the upper flow passage groove 41b is close to the upstream end, it is possible to suppress a decrease in the heat exchange efficiency between the upper heat generating component 31 and the coolant X. In addition, the lower flow passage groove 41e provided on the lower surface 41d of the central plate 41 is shorter than the upper flow passage groove 41b. Therefore, it is possible to attach a lower heat generating component 30 smaller than the upper heat generating component 31 to the lower surface 41d, for example, without being limited to a lower heat generating component 30 having the same size as the upper heat generating component 31. That is, the power converter 1 can attach a small lower heat generating component 30 as shown by the solid line in FIG. 6 to the lower surface 41d of the central plate 41, or a large lower heat generating component as shown by the virtual line in FIG. 6. Therefore, the power converter 1 of this embodiment can share the center plate 41 even when heat-generating components of different sizes are used.

[0081] For example, the power conversion device 1 of this embodiment can share the central plate 41 while suppressing changes in the cooling performance for the upper heat-generating component 31, whether a small power module 20 with a small output (i.e., a small lower heat-generating component 30) is installed or a large power module 20 with a large output (i.e., a large lower heat-generating component 30) is installed. In other words, the power conversion device 1 of this embodiment has excellent output expandability and can maintain the cooling performance for the upper heat-generating component 31 even when the output is changed.

[0082] In the power converter 1 of this embodiment, the guide wall 50 is formed in a U-shape when viewed from the normal direction (up-down direction) of the bottom surface of the upper flow passage groove 41b. The guide wall 50 has an arc-shaped portion 51, a first linear portion 52, and a second linear portion 53. The arc-shaped portion 51 is formed in an arc shape surrounding the inlet opening of the connection hole 41g from the upstream side of the upper flow passage groove 41b. The first linear portion 52 extends linearly from one end of the arc-shaped portion 51 toward the downstream end of the upper flow passage groove 41b. The second linear portion 53 extends linearly from the other end of the arc-shaped portion 51 toward the downstream end of the upper flow passage groove 41b.

[0083] In the power converter 1 of this embodiment, the guide wall 50 is formed in a U-shape, and therefore collision between the refrigerant X heading toward the downstream end of the upper flow passage groove 41b and the refrigerant X heading from the downstream end of the upper flow passage groove 41b toward the connection hole 41g can be suppressed. Therefore, the power converter 1 of this embodiment can suppress an increase in pressure loss in the first flow passage R1 (i.e., the upper flow passage groove 41b).

[0084] In the power conversion device 1 of this embodiment, the sum of the clearance dimension Da from the first straight portion 52 to the side wall surface of the upper flow path groove 41b and the clearance dimension Db from the second straight portion 53 to the side wall surface of the upper flow path groove 41b may be equal to the clearance dimension from the first straight portion 52 to the second straight portion 53.

[0085] In the power converter 1 of this embodiment, the flow speed of the refrigerant X flowing between the first linear portion 52 and the inner wall surface of the upper flow passage groove 41b is substantially the same as the flow speed of the refrigerant X flowing between the first linear portion 52 and the center line La. Therefore, the power converter 1 of this embodiment can suppress an increase in pressure loss in the first flow passage R1.

[0086] In the power converter 1 of the present embodiment, the upper heat generating component 31 has a rib 13a that is adjacent to the guide wall 50 with a gap therebetween and forms a labyrinth structure 60 together with the guide wall 50.

[0087] Such power converter 1 of the present embodiment prevents the refrigerant X from flowing in a direction perpendicular to the first direction (the left-right direction in FIG. 10) by the labyrinth structure 60. Therefore, the power converter 1 of the present embodiment can prevent the refrigerant X from flowing over the upper end of the guide wall 50.

[0088] Furthermore, in the power converter 1 of this embodiment, the central plate 41 includes an opposing wall portion 41i. The opposing wall portion 41i is disposed opposite to the bottom surface of the lower flow passage groove 41e with a gap therebetween, and covers the outlet opening of the connection hole 41g.

[0089] In the power converter 1 of this embodiment, the opposing wall portion 41i allows the small lower heat generating component 30 to be easily attached. That is, the power converter 1 of this embodiment allows the smaller lower heat generating component 30 to be easily attached compared to a case where the opposing wall portion 41i is not provided.

[0090] The power conversion device 1 of this embodiment also includes a power conversion circuit (the step-up / step-down converter 2, the inverter 3, and the DC-DC converter 4) formed by the upper heat-generating component 31 and the lower heat-generating component 30. Such a power conversion device 1 of this embodiment can be used as a power conversion device mounted on an electric vehicle or the like.

[0091] Moreover, in the power conversion device 1 of the present embodiment, the upper heat-generating component 31 includes a DCDC converter unit 15, a reactor unit 14, and a base plate 13. The DCDC converter unit 15 and the reactor unit 14 are mounted on the base plate 13. The base plate 13 is fixed to the center plate 41 to form a first flow passage R1 including an upper flow passage groove 41b between the base plate 13 and the center plate 41.

[0092] In the power converter 1 of this embodiment, the base plate 13 of the upper heat-generating component 31 is in direct contact with the refrigerant X. Therefore, in the power converter 1 of this embodiment, the upper heat-generating component 31 can be directly cooled by the refrigerant X, and the upper heat-generating component 31 can be efficiently cooled.

[0093] Moreover, in the power converter 1 of the present embodiment, the lower heat generating component 30 includes a power module 20 and a heat sink 11. The power module 20 has a plurality of power devices D. The power module 20 is mounted on the heat sink 11. The heat sink 11 is fixed to the central plate 41 to form a second flow passage R2 including a lower flow passage groove 41e between the heat sink 11 and the central plate 41.

[0094] In the power converter 1 of this embodiment, the heat sink 11 of the lower heat generating component 30 is in direct contact with the refrigerant X. Therefore, in the power converter 1 of this embodiment, the lower heat generating component 30 can be directly cooled by the refrigerant X, and the lower heat generating component 30 can be efficiently cooled.

[0095] Although the preferred embodiment of the present invention has been described above with reference to the attached drawings, it goes without saying that the present invention is not limited to the above embodiment. The shapes and combinations of the components shown in the above embodiment are merely examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention.

[0096] For example, in the above embodiment, the first flow path R1 is located at the top and the second flow path R2 is located at the bottom. However, the present invention is not limited to this. The present invention may be configured such that the first flow path R1 is located at the bottom and the second flow path R2 is located at the top.

[0097] In the above embodiment, the configuration has been described in which the lower heat generating component 30 includes the power module 20, and the upper heat generating component 31 includes the reactor unit 14 and the DC-DC converter unit 15. However, the present invention is not limited to this. For example, the present invention can also employ a configuration in which the upper heat generating component 31 includes the power module 20, and the lower heat generating component 30 includes the reactor unit 14 and the DC-DC converter unit 15.

[0098] In the above embodiment, the power conversion device is described as having the step-up / step-down converter 2 and the DCDC converter 4. However, the present invention is not limited to this, and can be applied to a power conversion device that does not have the step-up / step-down converter 2 and the DCDC converter 4. In such a case, for example, it is also possible to adopt a configuration in which the upper heat generating component 31 has a smoothing capacitor and the lower heat generating component 30 has a power module.

[0099] In the above embodiment, the power module 20 includes the power device D that forms the step-up / step-down converter 2. However, the present invention is not limited to this. For example, the power device D that forms the step-up / step-down converter 2 may be a separate unit and included in the upper heat-generating component 31. In such a case, the unit including the power device D that forms the step-up / step-down converter 2 is mounted on the base plate 13.

[0100] In the above embodiment, a configuration including the main body case 16 has been described. However, the present invention is not limited to this. For example, the present invention may also adopt a configuration including a support plate instead of the center plate 41 without including the main body case 16. In such a case, the power conversion device can be arranged so as to be housed in the case of another device.

[0101] In the above embodiment, the present invention is applied to a power conversion device. However, the present invention is not limited to this. The present invention is applicable to any electronic device in which heat-generating components are attached to both sides of a support plate.

[0102] The above embodiment can also be described as, for example, the following supplementary notes.

[0103] (Appendix 1) A first heat generating component; A second heat generating component separate from the first heat generating component; a support plate having a first surface to which the first heat generating component is attached and a second surface located on the rear side of the first surface and to which the second heat generating component is attached; Equipped with The support plate is a first flow path groove provided on the first surface and configured to guide a refrigerant mainly along a first direction along the first surface; a second flow passage groove provided on the second surface and configured to guide the refrigerant mainly along a second direction opposite to the first direction; a connection hole provided through the support plate and configured to guide the refrigerant from the first flow passage groove to the second flow passage groove; having the connection hole is connected to the first flow passage groove at a position closer to an upstream end of the first flow passage groove than to a downstream end of the first flow passage groove in the first direction, a connecting portion of the second flow channel with the connecting hole is an upstream end in the second direction, The support plate has a guide wall that is erected from a bottom surface of the first flow passage groove and guides the refrigerant from the inlet opening of the connection hole toward the downstream end of the first flow passage groove. 1. An electronic device comprising:

[0104] (Appendix 2) When viewed from a normal direction of a bottom surface of the first flow channel, The guide wall is an arc-shaped portion that surrounds the inlet opening of the connection hole from the upstream side of the first flow path groove; a first linear portion extending linearly from one end of the arc portion toward the downstream end of the first flow channel; a second linear portion extending linearly from the other end of the arc portion toward the downstream end of the first flow channel; The U-shape is formed having 2. The electronic device according to claim 1.

[0105] (Appendix 3) The electronic device described in Appendix 2, characterized in that a sum of a distance from the first linear portion to a side wall surface of the first flow groove and a distance from the second linear portion to a side wall surface of the first flow groove is equal to a distance from the first linear portion to the second linear portion.

[0106] (Appendix 4) The electronic device according to any one of claims 1 to 3, wherein the first heat generating component has a labyrinth structure forming wall that is adjacent to the guide wall with a gap therebetween and forms a labyrinth structure together with the guide wall.

[0107] (Appendix 5) The electronic device according to any one of claims 1 to 4, wherein the support plate is disposed opposite the bottom surface of the second flow channel with a gap therebetween and includes an opposing wall portion covering the outlet opening of the connection hole.

[0108] (Appendix 6) The electronic device includes the electronic device according to any one of claims 1 to 5, a power conversion circuit formed by the first heat generating component and the second heat generating component A power conversion device comprising:

[0109] (Appendix 7) The first heat generating component is A DC-DC converter unit, A reactor unit; a base plate on which the DC-DC converter unit and the reactor unit are mounted and which is fixed to the support plate to form a first flow passage including the first flow passage groove between the support plate and the base plate; 7. The power conversion device according to claim 6, comprising:

[0110] (Appendix 8) The second heat generating component is a power module having a plurality of power devices; a heat sink on which the power module is mounted and which is fixed to the support plate to form a second flow passage including the second flow passage groove between the support plate and the heat sink; 8. The power conversion device according to claim 6 or 7, comprising:

[0111] (Appendix 9) the first heat generating component includes a smoothing capacitor; The second heat generating component includes a power module having a plurality of power devices. 7. The power conversion device according to claim 6. [Explanation of symbols]

[0112] 1...power conversion device (electronic device), 2...step-up / down converter, 3...inverter, 4...dCDC converter, 10...intelligent power module, 11...heat sink, 12...capacitor unit, 13...base plate, 13a...rib (labyrinth structure forming wall), 13b...U-shaped rib, 13c...straight-line rib, 14...reactor unit, 15...dCDC converter unit, 16...main body case, 20...power module, 30...lower heat generating component (second heat generating component), 31...upper heat generating component (first heat generating component), 41...center plate (support plate) rate), 41a...upper surface (first surface), 41b...upper flow groove (first flow groove), 41b1...upstream portion, 41b2...downstream portion, 41c...supply port, 41d...lower surface (second surface), 41e...lower flow groove (second heat generating component), 41f...discharge port, 41g...connection hole, 41h...base portion, 41i...opposing wall portion, 50...guide wall, 51...circular arc portion, 52...first linear portion, 53...second linear portion, 60...labyrinth structure, 100...vehicle, C...condenser, D...power device, L...reactor, M...motor, R1...first flow path, R2...second flow path, S...gap, X...refrigerant

Claims

1. A first heat generating component; A second heat generating component separate from the first heat generating component; a support plate having a first surface to which the first heat generating component is attached and a second surface located on the rear side of the first surface and to which the second heat generating component is attached; Equipped with The support plate is a first flow passage groove provided on the first surface and configured to guide a refrigerant mainly along a first direction along the first surface; a second flow passage groove provided on the second surface and configured to guide the refrigerant mainly along a second direction opposite to the first direction; a connection hole provided through the support plate and configured to guide the refrigerant from the first flow passage groove to the second flow passage groove; having the connection hole is connected to the first flow passage groove at a position closer to an upstream end of the first flow passage groove than to a downstream end of the first flow passage groove in the first direction, a connecting portion of the second flow channel with the connecting hole is an upstream end in the second direction, The support plate has a guide wall that is erected from a bottom surface of the first flow passage groove and guides the refrigerant from the inlet opening of the connection hole toward the downstream end of the first flow passage groove.

1. An electronic device comprising:

2. When viewed from a normal direction of a bottom surface of the first flow channel, The guide wall is an arc-shaped portion that surrounds the inlet opening of the connection hole from an upstream side of the first flow channel; a first linear portion extending linearly from one end of the arc portion toward the downstream end of the first flow channel; a second linear portion extending linearly from the other end of the arc portion toward the downstream end of the first flow channel; The U-shape is formed having 2. The electronic device according to claim 1.

3. 3. The electronic device according to claim 2, wherein a sum of a distance from the first linear portion to a side wall surface of the first flow groove and a distance from the second linear portion to a side wall surface of the first flow groove is equal to a distance from the first linear portion to the second linear portion.

4. 4. The electronic device according to claim 1, wherein the first heat generating component has a labyrinth structure forming wall that is adjacent to the guide wall with a gap therebetween and forms a labyrinth structure together with the guide wall.

5. The electronic device according to any one of claims 1 to 3, characterized in that the support plate is arranged opposite a bottom surface of the second flow channel with a gap therebetween and has an opposing wall portion covering an outlet opening of the connection hole.

6. The electronic device according to any one of claims 1 to 3, a power conversion circuit formed by the first heat generating component and the second heat generating component A power conversion device comprising:

7. The first heat generating component is A DC-DC converter unit; A reactor unit; a base plate on which the DCDC converter unit and the reactor unit are mounted and which is fixed to the support plate to form a first flow passage including the first flow passage groove between the support plate and the base plate; 7. The power conversion device according to claim 6, further comprising:

8. The second heat generating component is a power module having a plurality of power devices; a heat sink on which the power module is mounted and which is fixed to the support plate to form a second flow passage including the second flow passage groove between the support plate and the heat sink; 7. The power conversion device according to claim 6, further comprising:

9. the first heat generating component includes a smoothing capacitor; The second heat generating component includes a power module having a plurality of power devices.

7. The power conversion device according to claim 6.

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