Calculator, test item presentation method and program

Abstract

To facilitate an EMC test with respect to multiple products.SOLUTION: There is provided a calculator comprising one or more processors and one or more memory resources. The one or more processors execute: a step for executing in simulation, an EMC test to a first product; a step for executing in simulation, the EMC test to a second product; and a step for presenting any of the first product and the second product, as a representative product for which the EMC test is executed, when a simulation result of the EMC test to the first product and the simulation result of the EMC test to the second product are in a tolerance limit.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a computer, a test item presentation method, and a test item presentation program. [Background technology]

[0002] As a test for a product, there is an EMC (Electromagnetic Compatibility) test for determining whether the product meets the EMC standard (Patent Document 1). The EMC standard is a standard for regulating the effect of electromagnetic waves emitted from a product on other devices and for regulating the performance degradation and malfunction of a product caused by electromagnetic waves emitted from other devices. There are cases where there are multiple products with different specifications, such as elevators and chemical analysis equipment. In this case, by performing an EMC test on each of the multiple products, it is possible to reliably determine whether each product meets the EMC standard.

[0003] However, performing EMC testing on all of a large number of products would result in increased testing costs and longer testing times.To avoid this, it is conceivable that the user may perform EMC testing on a representative product selected from multiple products, and omit EMC testing on the other products. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-186683 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the user selects a representative product, doubts remain about the validity of the selection method and the legitimacy of not conducting EMC testing on products other than the representative product.

[0006] The present invention has been made in view of the above circumstances, and has an object to simplify EMC testing for multiple products. [Means for solving the problem]

[0007] In order to solve the above problem, a computer according to one embodiment of the present invention is a computer having one or more processors and one or more memory resources, wherein the one or more processors execute the steps of: performing an EMC test on a first product by simulation; performing the EMC test on a second product by simulation; and, if a simulation result of the EMC test on the first product and a simulation result of the EMC test on the second product fall within an acceptable range, presenting either the first product or the second product as a representative product for the EMC test. Effect of the Invention

[0008] According to the present invention, EMC testing for multiple products can be simplified.

[0009] Problems, configurations and effects other than those described above will become apparent from the following description of the embodiments. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a configuration diagram of an example of a computer according to this embodiment. [Diagram 2] FIG. 2 is a schematic diagram showing an example of a data structure of the product-specific information according to the present embodiment. [Diagram 3] FIG. 3 is a schematic diagram showing an example of a data structure of the propagation path information according to the present embodiment. [Figure 4] FIG. 4 is a schematic diagram showing an example of a data structure of actual measurement and analysis information according to this embodiment. [Diagram 5] FIG. 5 is a schematic diagram showing an example of a data structure of test information according to the present embodiment. [Figure 6] FIG. 6 is an example of a functional block diagram of a computer according to this embodiment. [Figure 7] FIG. 7 is a schematic diagram showing an example of a method for generating a connection model according to the present embodiment. [Figure 8] FIG. 8 is a schematic diagram showing an example of a propagation path according to the present embodiment. [Figure 9] FIG. 9 is a schematic diagram showing an example of a propagation path for each of r products in this embodiment. [Figure 10] FIG. 10 is a schematic diagram showing an example of a comparison result of noise levels in this embodiment. [Figure 11] FIG. 11 is a schematic diagram showing an example in which, in an EMC test item in which noise is applied to “application point-p”, the simulation results for all r products are determined to be outside the allowable range. [Figure 12] FIG. 12 is a schematic diagram of an example of test specifications created by the test specification creating unit according to this embodiment. [Figure 13] FIG. 13 is a flowchart showing an example of processing performed by a computer according to this embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In all the drawings for describing the embodiment, the same members are generally given the same reference numerals, and the repeated description thereof will be omitted as appropriate. In the following embodiment, the components (including element steps, etc.) are not necessarily essential, unless otherwise specified or considered to be obviously essential in principle. In addition, when "consisting of A", "consisting of A", "having A", or "including A" is used, it is understood that other elements are not excluded, except when it is specifically specified that only the element is included. Similarly, in the following embodiment, when referring to the shape, positional relationship, etc. of the components, etc., it includes those that are substantially similar to or similar to the shape, etc., except when it is specifically specified or considered to be obviously not essential in principle.

[0012] <Present embodiment> FIG. 1 is a configuration diagram of an example of a computer according to the present embodiment. In the computer 100, a processor reads a test item presentation program stored in a memory resource to perform various processes such as data generation, transmission, and reception, and the processor executes processes according to the test item presentation program. The computer 100 is, for example, a personal computer, a tablet terminal (computer), a smartphone, a server computer, a blade server, a cloud server, or the like, and is a system including at least one of these computers. That is, the computer 100 also includes a system including, for example, a cloud server and a display computer (for example, a tablet terminal or a smartphone). In addition, a controller that controls or manages some device including a processor and memory resources is also an example of the computer 100.

[0013] 1, the computer 100 has one or more processors 101, one or more UI devices 102, one or more NI (Network Interface) devices 103, and one or more memory resources 104. The computer 100 may include other components. The processor 101, the UI (User Interface) device 102, the NI device 103, and the memory resource 104 are connected to each other via a bus 113.

[0014] The processor 101 is an arithmetic device that reads various programs stored in the memory resource 104 and executes processing corresponding to each program. Examples of the processor 101 include a microprocessor, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an FPGA (Field Programmable Gate Array), a quantum processor, or other semiconductor devices capable of performing calculations.

[0015] The UI device 102 is an input device that inputs instructions from a user (which may be an operator) to the computer 100, and an output device that outputs information generated by the computer 100. Examples of the input device include a keyboard, a touch panel, a pointing device such as a mouse, and a voice input device such as a microphone. Examples of the output device include a display, a printer, and a voice synthesizer. Unless otherwise specified below, input and output of information between the computer 100 and the user is performed via the UI device 102. The UI device 102 may be only an input device or only an output device.

[0016] The NI device 103 is a communication device that performs information communication with an external device. The NI device 103 performs information communication with the external device via a predetermined communication network such as the Internet or a LAN (Local Area Network). Note that, unless otherwise specified below, information communication between the computer 100 (or the processor 101) and the external device is performed via the NI device 103.

[0017] The memory resource 104 is a storage device that stores the test item presentation program 105, the design information 106, the product-specific information 107, the propagation path information 108, the actual measurement and analysis information 109, and the test information 110, and is an example of a non-volatile memory and / or a volatile memory. Examples of the volatile memory are a RAM (Random Access Memory) and a ROM (Read Only Memory). Examples of the non-volatile memory may be a rewritable storage medium such as a flash memory, a hard disk, or an SSD (Solid State Drive), or may be a USB (Universal Serial Bus) memory, a memory card, or a hard disk. In addition, RAMs such as MRAM (Magnetoresistive RAM), PRAM (Phase change RAM), and ReRAM (Resistive RAM) may be regarded as non-volatile memories. The processor 101 may perform a service of distributing the test item presentation program 105 stored in the memory resource 104 to other computers.

[0018] The computer 100 executes the test item presentation program 105 to present a representative product to be tested as a representative test item of the EMC test, as described later. When presenting the representative product, the processor 101 refers to the design information 106, the product-specific information 107, the propagation path information 108, the actual measurement and analysis information 109, and the test information 110. These pieces of information 106 to 110 may be outside the computer 100 as long as they can be accessed by the processor 101. For example, each piece of information 106 to 110 may be stored in a cloud storage that can be accessed by the processor 101 via a communication network such as the Internet or a LAN. Furthermore, each piece of information 106 to 110 may be a data structure such as a file or a database as long as it can store data. Details of each piece of information 106 to 110 will be described below.

[0019] The design information 106 is information that associates a product with components included in the product, and is generated in advance by a user and stored in the memory resource 104. The components are not limited to electronic components such as filters. Parts such as a case that are electromagnetically coupled to electronic components are also an example of a component. For example, the user generates the design information 106 based on a product circuit diagram, model information created by MBSE (Model-Based System Engineering), and CAD (Computer Aided Design) information. In addition to simply associating a product with a component, components that are mechanically connected may be associated with each other and stored in the design information 106.

[0020] Fig. 2 is a schematic diagram showing an example of the data structure of the product-specific information 107. The product-specific information 107 is information showing the specifications for each product. Fig. 2 shows an example in which each of r products "Product-1", "Product-2", ... "Product r" is an elevator car. In this case, the specifications are "load capacity", "speed", "longest hoistway length", "power receiving system", "main circuit line filter", "main circuit smoothing capacitor", "main circuit IPM (Intelligent Power Module)", and "AC 100V line filter".

[0021] 3 is a schematic diagram showing an example of the data structure of the propagation path information 108. The propagation path information 108 is information that associates an "application point," a "propagation path," and an "influence point."

[0022] An "application point" is a component to which noise is applied during EMC testing. A "propagation path" is a path along which the noise applied to the "application point" propagates. An "affected point" is a component that experiences a malfunction due to noise propagating along the "propagation path."

[0023] The arrow "→" in the "propagation path" indicates that the components at the base and tip of the arrow are mechanically connected to each other, and the symbol "||" indicates that the components on the left and right of the arrow are electromagnetically connected to each other by inductive coupling or electric field coupling.

[0024] The user generates propagation path information 108 by analyzing problems that have occurred in the past with a number of products, and stores this information in advance in the memory resource 104 .

[0025] FIG. 4 is a schematic diagram showing an example of a data structure of the actual measurement and analysis information 109. The actual measurement and analysis information 109 is information that associates the "components" included in each of a plurality of products with the "electrical characteristics" of the "components." When the "component" is an EMI (Electro Magnetic Interference) filter as in the example of FIG. 4, the amount of signal loss (S21) for each frequency is stored as the "electrical characteristic" in the propagation path information 108. When the "component" is a resistor, the "electrical characteristic" is a resistance value, and when the "component" is a capacitor, the "electrical characteristic" is a capacitance value. The user actually measures the electrical characteristics of each component in advance, associates the actual measurement value with the component, and stores the measured value in the actual measurement and analysis information 109.

[0026] 5 is a schematic diagram showing an example of the data structure of the test information 110. The test information 110 is information that associates a "test item," a "test overview," and an "application point."

[0027] The "test item" is an item of the EMC test that is scheduled to be performed on the product. The "test overview" is an overview of the test in the "test item". The "application point" is a component to which noise is to be applied in the "test item". The test information 110 is created in advance by the user and stored in the memory resource 104.

[0028] Fig. 6 is an example of a functional block diagram of the computer 100. As shown in Fig. 6, the computer 100 includes a connection model generating unit 121, a propagation path identifying unit 122, a noise level calculating unit 123, an inter-product comparing unit 124, a test specification creating unit 125, and a presenting unit 126. Each of these units is realized by executing a test item presenting program 105 in cooperation with the processor 101 and the memory resource 104.

[0029] The connection model generation unit 121 generates a connection model indicating electromagnetic connection relationships between components for each product.

[0030] Fig. 7 is a schematic diagram showing an example of a method for generating a connection model. As shown in Fig. 7, the connection model generation unit 121 identifies all components included in a product based on the design information 106, and generates a fully connected graph connecting these components as a connection model 111. Each node N in the connection model 111 indicates a component included in a product. Each node N is connected to all other nodes N. In addition, the edges connecting the nodes N indicate electromagnetic paths between the components corresponding to each node N.

[0031] 6 again, the propagation path identifying unit 122 extracts all paths that include, as an "application point", an "application point" of a test item included in the test information 110, from among paths configured with an "application point", a "propagation path", and an "influence point" in the propagation path information 108. Then, the propagation path identifying unit 122 identifies paths similar to the extracted paths from the connection model 111 as propagation paths through which noise propagates.

[0032] 8 is a schematic diagram showing an example of the propagation path 112 identified by the propagation path identifying unit 122. For example, the propagation path identifying unit 122 identifies a graph that matches a path extracted from the propagation path information 108 as described above, among the subgraphs of the connection model 111 (FIG. 7) of a certain product, as a propagation path 112 similar to the path. This makes it possible to limit the path when simulating an EMC test to the propagation path 112, eliminating the need to simulate all the paths in the connection model 111, thereby reducing the simulation cost.

[0033] Here, if a maximum of p application points can be extracted from the test information 110, and a maximum of q influence points are associated with each application point on the propagation path information 108, a maximum of p×q propagation paths 112 can be identified.

[0034] 9 is a schematic diagram showing an example of the propagation paths 112 for each of r products. When the number of products is r as in this example, the propagation path identification unit 122 identifies p×q×r propagation paths 112. One propagation path 112 corresponding to a certain product is an example of a first propagation path, and one propagation path 112 corresponding to another product is an example of a second propagation path. In addition, the solid lines in the propagation paths 112 are paths connecting components that are shown to be mechanically connected in the design information 106. In addition, the dashed lines in the propagation paths 112 are paths connecting components that are not shown to be mechanically connected in the design information 106 but are shown to be electromagnetically connected in the "propagation path" of the propagation path information 108.

[0035] Furthermore, based on the propagation path information 108, the propagation path identifying unit 122 also identifies a component corresponding to the "application point" and a component corresponding to the "influence point" in the propagation path information 108, for each of the p×q propagation paths 112 of each product. The component corresponding to the "application point" is an example of a first component, and the component corresponding to the "influence point" is an example of a second component. Furthermore, based on the test information 110, the propagation path identifying unit 122 also identifies a "test item" of the EMC test that applies noise to the "application point".

[0036] Referring again to Fig. 6, when the EMC test is executed by simulation, the noise level calculation unit 123 applies noise defined in the test item of the EMC test to an "application point" in the propagation path 112, and calculates the noise level at an "influence point" in the propagation path 112. Since the "application point" and the "influence point" are specified by the propagation path specification unit 122 as described above, the noise level calculation unit 123 can specify the "application point" and the "influence point" based on the above. In addition, since the test item of the EMC test for applying noise to the "application point" is also specified by the propagation path specification unit 122 as described above, the noise level calculation unit 123 can specify the noise defined in the test item based on the above.

[0037] As shown in Fig. 9, there are multiple paths from an "application point" to an "influence point". The noise level calculation unit 123 calculates the noise level for each of these paths and adds up the noise levels at the "influence point". The noise level calculation unit 123 also identifies the electrical characteristics of components present on each path based on the actual measurement and analysis information 109, and calculates the noise level by an electromagnetic field simulation using the electrical characteristics. Then, the noise level calculation unit 123 calculates the noise level at the "influence point" for each of the p x q x r propagation paths 112.

[0038] The noise level calculation unit 123 may set simulation conditions for the electromagnetic field simulation based on the product-specific information 107. For example, since the "longest elevator length" in the product-specific information 107 affects the noise level at the "influence point", the noise level calculation unit 123 may include the "longest elevator length" in the simulation conditions.

[0039] By calculating the noise level at the "influence point" when noise is applied to the "application point" in this way, it is possible to estimate the noise level at the "influence point" in EMC testing using an actual device.

[0040] In particular, since the "application point" is a component to which noise is specified as a test item of the EMC test, by applying noise to the "application point", it is possible to simulate the EMC test related to that test item.

[0041] As described above, the "influence point" is a component where a malfunction occurs due to noise propagating through the propagation path 112. Therefore, by calculating the noise level at the "influence point", it is possible to simulate an EMC test with an emphasis on components that are prone to malfunction.

[0042] The inter-product comparison unit 124 compares the noise levels calculated by the noise level calculation unit 123 between products.

[0043] Fig. 10 is a schematic diagram showing an example of a comparison result of noise levels. Fig. 10 shows the difference in noise levels for r products at q influence points, "influence point-1" to "influence point-q", when noise is applied to one "application point-1". In this example, the noise level calculation unit 123 performs a simulation using noise of multiple frequencies and calculates the noise level for each frequency.

[0044] The inter-product comparison unit 124 refers to the tolerance range preset by the user and judges whether the difference in noise level between r products at all frequencies and all q affected points falls within the tolerance range. For EMC test items where the difference in noise level between products is small, individual product differences are unlikely to appear in the test results. Therefore, by judging whether the difference in noise level between products falls within the tolerance range, it is possible to judge whether one product arbitrarily selected from multiple products can substitute for the test item of the EMC test.

[0045] 10 shows an example in which the difference in noise level at all frequencies falls within the allowable range at all q affected points. In this case, the product comparison unit 124 determines that the simulation results for all r products fall within the allowable range in the EMC test item in which noise is applied to "application point-1".

[0046] On the other hand, if the difference in noise levels among the r products at any of the q affected points at any of the multiple frequencies does not fall within the acceptable range, the product comparison unit 124 determines that the simulation results for all of the r products do not fall within the acceptable range in the EMC test item in which noise is applied to “application point-1”.

[0047] Fig. 11 is a schematic diagram showing an example in which the simulation results for all r products are determined to be outside the allowable range in an EMC test item in which noise is applied to "application point-p". In this example, the difference between the noise level of "product-r" and the noise levels of the remaining r-1 products is outside the allowable range at all frequencies and all q affected points.

[0048] The user may divide the frequencies into multiple groups and set a different tolerance range for each group. In this case, when the difference in noise level between the r products falls within the tolerance range in all groups and all q influence points, the inter-product comparison unit 124 determines that the simulation results for all r products fall within the tolerance range. When the difference in noise level between the r products does not fall within the tolerance range in any of the multiple groups at any of the q influence points, the inter-product comparison unit 124 determines that the simulation results for all r products do not fall within the tolerance range.

[0049] 6 again, the test specification creating section 125 creates test specifications for the EMC test based on the judgment result of the product comparison section 124 and the test information 110.

[0050] For example, when it is determined that the simulation results for all r products in a certain "test item" in the test information 110 are within an acceptable range, the test specification creation unit 125 creates a test specification in which one of the r products is a representative product for performing that test item.

[0051] Fig. 12 is a schematic diagram of an example of test specifications 118 created by test specification creation unit 125. In the example of Fig. 12, it is assumed that the number r of products is six. Furthermore, one of the test items, "high-speed burst noise test", is subdivided into multiple subitems "AC200V (to earth)", "AC200V (phase-to-phase)", "AC100V (to earth)", ... for each application point. The same is true for "impulse noise test".

[0052] When an EMC test related to a subitem of a test item can be substituted with a representative product, the test specification creation unit 125 generates a message "Replaceable with Representative Product" indicating that substitution is possible. In this example, it is assumed that the simulation results for all six products in the subitem "AC200V (to ground)" of the "High-speed burst noise test" are within the allowable range. In this case, the test specification creation unit 125 generates the message "Replaceable with Representative Product" in association with the subitem.

[0053] On the other hand, for the subitem "AC200V (phase-to-phase)" of the "fast burst noise test", the simulation results for "Group A" consisting of five products, "Product-1" to "Product-5", are within the allowable range. However, for "Group B" consisting of "Product-6", the difference in noise level with each product in "Group A" is not within the allowable range. In this case, for the subitem "AC200V (phase-to-phase)" of the "fast burst noise test", the test specification creation unit 125 creates a specification for the subitem "AC200V (phase-to-phase)" of the "fast burst noise test", specifying any one selected from "Product-1" to "Product-5" belonging to "Group A" and "Product-6" belonging to "Group B" as the products to be subjected to the EMC test related to that subitem.

[0054] Also, in the example of Figure 12, in the subitem "AC 200V (phase-to-phase)" of "Impulse Noise Test," the simulation results for "Product-1" to "Product-3" belonging to "Group C" are within the allowable range. Similarly, the simulation results for "Product-4" to "Product-5" belonging to "Group D" are also within the allowable range. However, the simulation results for "Group C" and "Group D" are not within the allowable range.

[0055] In this case, the test specification creation unit 125 may create a specification for performing EMC tests related to all subitems of "high-speed burst test" and "impulse noise test" only on "Product-2" and "Product-6". Since "Product-2" belongs to both "Group A" and "Group C", it can be a representative model for performing EMC tests related to the subitem "AC200V (phase-to-phase)" of the "high-speed burst noise test" and the subitem "AC200V (phase-to-phase)" of the "impulse noise test". For the same reason, "Product-6" can also be a representative model for performing these EMC tests. Therefore, it is sufficient to perform tests on only "Product-2" and "Product-6" for all subitems of "high-speed burst noise test" and "impulse noise test".

[0056] 6 again, the presentation unit 126 presents the test specifications 118 created by the test specification creation unit 125. For example, the presentation unit 126 presents any one selected from "Product-1" to "Product-6" as a representative product for performing an EMC test related to a subitem of a test item associated with the message "Replaceable with representative product" in the test specifications 118.

[0057] On the other hand, for the subitem "AC200V (phase-to-phase)" of "High-speed burst noise test," any one (first product) selected from "Product-1" to "Product-5" belonging to "Group A" and "Product-6" (second product) belonging to "Group B" are presented as products for which EMC testing related to the subitem will be performed. This allows the user to understand that the representative product cannot be substituted for EMC testing for the subitem.

[0058] Furthermore, the presentation unit 126 may present "Product-2" and "Product-6" as described above as products for which EMC tests related to all of the sub-items of "High-speed burst test" and "Impulse noise test" are performed.

[0059] There is no particular limitation on the method of presentation by the presentation unit 126. The presentation unit 126 may present the test specifications 118 to the user via the UI device 102, or may present the test specifications 118 by printing them on paper using a printer (not shown).

[0060] Next, a test item presenting method according to this embodiment will be described.

[0061] FIG. 13 is a flowchart showing an example of processing performed by the computer 100 according to this embodiment.

[0062] First, the connection model generation unit 121 generates a connection model 111 for each product (step S11). For example, when the number of products is r, the connection model generation unit 121 identifies r connection models 111.

[0063] Next, the propagation path identifying unit 122 extracts all paths that include the application points of the test items included in the test information 110 as "application points" from among paths composed of "application points," "propagation paths," and "influence points" in the propagation path information 108, and identifies paths similar to the extracted paths as propagation paths 112 from the connection model 111 (step S12). In this example, a maximum of p×q propagation paths 112 are identified for one product as described above.

[0064] Next, the noise level calculation unit 123 applies noise defined in the test items of the EMC test to the "application point" in the propagation path 112 by executing a simulation of the EMC test, and calculates the noise level at the "influence point" in the propagation path 112 (step S13). As described above, when the number of products is r and one product has p×q propagation paths, the noise level calculation unit 123 calculates the noise level at the "influence point" for each of the p×q×r propagation paths 112.

[0065] Next, the inter-product comparison unit 124 compares the noise levels calculated by the noise level calculation unit 123 between the products (step S14). Then, based on the comparison result, the inter-product comparison unit 124 determines whether or not the simulation results for all r products are within the allowable range for each test item in which noise is applied to p application points.

[0066] Next, the test specification creating section 125 creates the test specification 118 (FIG. 12) for the EMC test based on the judgment result of the product comparison section 124 and the test information 110 (step S15).

[0067] Then, the presentation unit 126 presents the test specifications 118 (step S16). With the above, the basic processing performed by the computer 100 is completed.

[0068] 12, according to the present embodiment, the presenting unit 126 presents any one selected from a plurality of products as a representative product for performing EMC testing related to a subitem of a test item associated with the message "replaceable with representative product" in the test specifications 118. This eliminates the need to perform EMC testing related to the subitem on all products, and simplifies EMC testing on a plurality of products.

[0069] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0070] The present invention is not limited to the above-described embodiments, and various modifications are included. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to those including all of the components described. It is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. It is possible to add, delete, or replace a part of the configuration of each embodiment with another configuration.

[0071] The above-mentioned configurations, functions, processing units, processing means, etc. may be realized in hardware by designing some or all of them in an integrated circuit such as an FPGA. The above-mentioned configurations, functions, etc. may be realized in software by a processor interpreting and executing a program that realizes each function. Information such as a program, a judgment table, and a file that realizes each function can be placed in a memory, a storage device such as an HDD or SSD, or a recording medium such as an IC (Integrated Circuit) card, an SD (Secure Digital) card, or a DVD (Digital Versatile Disc). The control lines and information lines are those that are considered necessary for explanation, and do not necessarily show all control lines and information lines in the product. In reality, it may be considered that almost all configurations are connected to each other.

[0072] The computer 100 may be realized by a user (operator) performing some or all of the functions and processes realized by the test item presentation program 105.

[0073] There are cases where the computer 100 does not have the UI device 102, and instead leaves some of the output processing to the user and the input processing from the user to a processor system (called an external processor system) such as a smartphone or tablet terminal outside the system. In such cases, the computer 100 (or the processor 101, the test item presentation program 105) may perform the following in order to execute the processing as described above and other parts of the program.

[0074] *As an alternative to the output to the user using the UI device 102 described above, data required for output to the user is transmitted to an external processor system via the NI device 103. Examples of the data in question include the data to be output itself, and data for generating output data in another processor system, but it may also be a program describing the process of performing user output in the external processor system, or Web data.

[0075] *Instead of receiving an input or operation from a user using the UI device 102 described above, data indicating a user input or operation is received from an external processor system via the NI device 103. From another perspective, the meaning of outputting data to a user may include not only the computer 100 itself outputting the data, but also having another entity other than the computer 100 output the data (using the computer 100 to do so). Furthermore, the meaning of receiving an input or operation from a user may include not only direct output or reception to the user by the UI device 102 of the computer 100, but also indirect reception by the computer 100. [Explanation of symbols]

[0076] 100...computer, 101...processor, 102...UI device, 103...NI device, 104...memory resource, 105...test item presentation program, 106...design information, 107...product-specific information, 108...propagation path information, 109...actual measurement / analysis information, 110...test information, 111...connection model, 112...propagation path, 113...bus, 118...test specification, 121...connection model generation unit, 122...propagation path identification unit, 123...noise level calculation unit, 124...product comparison unit, 125...test specification creation unit, 126...presentation unit.

Claims

1. A computer having one or more processors and one or more memory resources, The one or more processors: performing an EMC test on the first product by simulation; performing the EMC test on a second product by simulation; presenting either the first product or the second product as a representative product to be subjected to the EMC test when a simulation result of the EMC test on the first product and a simulation result of the EMC test on the second product are within an allowable range; A computer that runs

2. 2. The computer of claim 1, The simulation is a simulation for calculating a noise level, the tolerance is a tolerance for a difference between the noise level of the first product and the noise level of the second product; calculator.

3. 3. The computer of claim 2, The one or more processors: Identifying a first propagation path along which noise propagates through a plurality of components constituting the first product; and identifying a second propagation path along which noise propagates through a plurality of components constituting the second product; In the step of performing the EMC test on the first product by the simulation, noise is applied to a first component among the plurality of components included in the first propagation path, and the noise level in a second component is calculated; In the step of performing the EMC test on the second product by the simulation, noise is applied to a first component among the plurality of components included in the second propagation path, and the noise level in a second component is calculated. calculator.

4. 4. The computer of claim 3, The first component is a component to which noise is to be applied in the EMC test. calculator.

5. 4. The computer of claim 3, The one or more processors: in the step of identifying the first propagation path, a path similar to the propagation path is identified as the first propagation path among paths connecting the components constituting the first product based on propagation path information indicating a propagation path passing through each of the components electromagnetically connected to each other; In the step of identifying the second propagation path, a path similar to the propagation path is identified as the second propagation path among paths connecting the components constituting the second product based on the propagation path information. calculator.

6. 6. The computer of claim 5, In the propagation path information, a component in which a malfunction occurs is associated with the propagation path; The second component is a component in which the failure occurs. calculator.

7. 2. The computer of claim 1, presenting both the first product and the second product as products to be subjected to the EMC test when a simulation result of the EMC test for the first product and a simulation result of the EMC test for the second product are not within an allowable range; The computer further executes the above.

8. A test item presentation method executed by a computer having one or more processors and one or more memory resources, comprising: performing an EMC test on the first product by simulation; performing the EMC test on a second product by simulation; presenting either the first product or the second product as a representative product to be subjected to the EMC test when a simulation result of the EMC test on the first product and a simulation result of the EMC test on the second product are within an allowable range; A test item presentation method including:

9. The test item presentation method according to claim 8, The simulation is a simulation for calculating a noise level, the tolerance is a tolerance for a difference between the noise level of the first product and the noise level of the second product; How test items are presented.

10. The test item presentation method according to claim 9, Identifying a first propagation path along which noise propagates through a plurality of components constituting the first product; and identifying a second propagation path along which noise propagates through a plurality of components constituting the second product, In the step of performing the EMC test on the first product by the simulation, noise is applied to a first component among the plurality of components included in the first propagation path, and the noise level in a second component is calculated; In the step of performing the EMC test on the second product by the simulation, noise is applied to a first component among the plurality of components included in the second propagation path, and the noise level in a second component is calculated. How test items are presented.

11. The test item presentation method according to claim 10, The first component is a component to which noise is to be applied in the EMC test. How test items are presented.

12. The test item presentation method according to claim 10, in the step of identifying the first propagation path, a path similar to the propagation path is identified as the first propagation path among paths connecting the components constituting the first product based on propagation path information indicating a propagation path passing through each of the components electromagnetically connected to each other; In the step of identifying the second propagation path, a path similar to the propagation path is identified as the second propagation path among paths connecting the components constituting the second product based on the propagation path information. How test items are presented.

13. The test item presentation method according to claim 12, In the propagation path information, a component in which a malfunction occurs is associated with the propagation path; The second component is a component in which the failure occurs. How test items are presented.

14. The test item presentation method according to claim 8, presenting both the first product and the second product as products to be subjected to the EMC test when a simulation result of the EMC test for the first product and a simulation result of the EMC test for the second product are not within an allowable range; The test item presentation method further comprises:

15. A program for causing a computer to execute the test item presenting method according to any one of claims 8 to 14.

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