Laminated coil part

Abstract

To provide a laminated coil part capable of inhibiting generation of though hole breaking.SOLUTION: In a laminated coil part 1, a first conductive pattern 12 and a second conductive pattern 16 each has a parallel parts P1 where the conductive patterns overlap with each other in a lamination direction, and a non-parallel part P2 where the conductive patterns do not overlap with each other. the parallel parts P1, P1 of a set of the first conductive pattern 12 and the second conductive pattern 16 are connected to each other via a first through hole T1, and the non-parallel parts P2, P2 of a set of the first conductive pattern 12 and the second conductive pattern 16 adjacent to each other in the lamination direction are connected to each other via a second through hole T2.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a laminated coil component. [Background technology]

[0002] An example of a conventional laminated coil component is the laminated inductor described in Patent Document 1. This conventional laminated inductor includes a laminate made of multiple insulator layers, an external electrode formed on the outside of the laminate, and a coil conductor formed in a spiral shape inside the laminate. The conductor patterns constituting the coil body are of only two types: a C-shaped pattern and an I-shaped pattern, with the number of C-shaped patterns being greater than the number of I-shaped patterns. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-162101 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the conventional multilayer inductor described above, layers having the same conductor pattern are stacked in the stacking direction. Therefore, through holes connecting the conductor patterns of adjacent layers in the stacking direction are also continuous in the stacking direction at the same position, which causes a problem of increasing the conductor volume at the same position. Since stress is easily applied at the position where the conductor volume is increased, it is considered that the through hole is easily broken when thermal expansion or thermal contraction occurs.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a laminated coil component that can suppress the occurrence of breakage of through holes. [Means for solving the problem]

[0006] A laminated coil component according to one aspect of the present disclosure is a laminated coil component including a coil portion inside an insulating base body having a laminated structure, the coil portion having a plurality of sets including a first conductor pattern layer having a first conductor pattern and a second conductor pattern layer having a second conductor pattern, each of the first conductor pattern and the second conductor pattern having a parallel portion overlapping each other in the stacking direction, a non-parallel portion not overlapping each other in the stacking direction, and a pad portion used for connecting between the conductor patterns, and in one set, the parallel portion of the first conductor pattern and the parallel portion of the second conductor pattern The first pads provided on the first and second portions are connected to each other via a first through hole, the second pads provided on the non-parallel portions of the first conductor patterns of one set are connected to the third pads provided on the non-parallel portions of the second conductor patterns of a set located on one side of the first set in the stacking direction via a second through hole, and the third pads provided on the non-parallel portions of the second conductor patterns of one set are connected to the second pads provided on the non-parallel portions of the first conductor patterns of a set located on the other side of the first set in the stacking direction via a second through hole.

[0007] In this laminated coil component, a first through hole connecting the first and second conductor patterns of one set connects the first pads provided in the parallel portions, and a second through hole connecting the first and second conductor patterns of one set and a set adjacent to the first set connects the second and third pads provided in the non-parallel portions. This allows the positions of the first and second through holes to be dispersed when viewed from the stacking direction. Dispersing the positions of the through holes makes it possible to avoid an increase in the conductor volume at the same position. Therefore, even if thermal expansion or thermal contraction occurs, the occurrence of breakage of the through holes can be suppressed.

[0008] In one set, the second pad portion and the third pad portion may overlap each other in the stacking direction, whereby the distributed relationship between the positions of the first through holes and the positions of the second through holes is maintained while the symmetry of the first conductor pattern and the second conductor pattern is enhanced, thereby simplifying the pattern.

[0009] In one set, a gap may be present between the second pad portion and the third pad portion, in which case the gap can make the electrical resistivity between the second pad portion and the third pad portion higher than that of the base material, thereby improving the voltage resistance of the laminated coil component.

[0010] In one set, a recess may be provided on at least one of a surface of the second pad portion facing the third pad portion and a surface of the third pad portion facing the second pad portion, in which case the recess can ensure a sufficient interlayer space between the second pad portion and the third pad portion, thereby improving the withstand voltage of the laminated coil component.

[0011] The distance in the stacking direction between the first conductor pattern and the second conductor pattern in one set may be smaller than the distance in the stacking direction between the first conductor pattern of one set and the second conductor pattern of the set located on one side of the set in the stacking direction, and the distance in the stacking direction between the second conductor pattern of one set and the first conductor pattern of the set located on the other side of the set in the stacking direction. In this case, a sufficient space can be secured between the layers of adjacent sets in the stacking direction, and the withstand voltage of the laminated coil component can be improved.

[0012] The element body may be constructed by laminating magnetic layers containing a plurality of metal magnetic particles, and the number of metal magnetic particles between the second pad portion and the third pad portion in one set may be greater than the number of metal magnetic particles located between the first conductor pattern and the second conductor pattern in one set. By relatively increasing the number of metal magnetic particles between the second pad portion and the third pad portion, the voltage resistance of the laminated coil component can be improved. Effect of the Invention

[0013] According to the present disclosure, the occurrence of disconnection of through holes can be suppressed. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view showing an embodiment of a laminated coil component. [Diagram 2] FIG. 2 is a diagram showing a layer structure of a laminated coil component. [Diagram 3] 4 is a diagram showing a connection relationship between a first conductor pattern layer and a second conductor pattern layer. FIG. [Figure 4] FIG. 2 is a cross-sectional view of a main portion of a laminated coil component. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, preferred embodiments of a laminated coil component according to one aspect of the present disclosure will be described in detail with reference to the drawings.

[0016] Fig. 1 is a perspective view showing one embodiment of a laminated coil component. As shown in Fig. 1, the laminated coil component 1 includes a rectangular parallelepiped element body 2 and a pair of terminal electrodes 3, 3. The pair of terminal electrodes 3, 3 are arranged at both ends of the element body 2, respectively, and are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. The laminated coil component 1 can be applied to, for example, a bead inductor or a power inductor.

[0017] The element body 2 having a rectangular parallelepiped shape has a pair of end faces 2a, 2b facing each other, a pair of main faces 2c, 2d facing each other, and a pair of side faces 2e, 2f facing each other. In the following description, the facing direction of the pair of end faces 2a, 2b is referred to as a first direction D1, and the facing direction of the pair of main faces 2c, 2d is referred to as a second direction D2. The facing direction of the pair of side faces 2e, 2f is referred to as a third direction D3. The first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other. In this embodiment, the pair of end faces 2a, 2b are square-shaped, and the pair of main faces 2c, 2d and the pair of side faces 2e, 2f are rectangular-shaped. The main face 2c (the bottom face in FIG. 1) can be a mounting surface. The mounting surface is a surface that faces another electronic device (such as a circuit board or electronic component) when the laminated coil component 1 is mounted on the other electronic device.

[0018] The element body 2 is constructed by stacking a plurality of magnetic layers 11 (see FIG. 2). The magnetic layers 11 are stacked in the opposing direction of the main surfaces 2c, 2d. That is, the stacking direction of the magnetic layers 11 coincides with the second direction D2 (hereinafter, the opposing direction of the main surfaces 2c, 2d may also be referred to as the "stacking direction"). Each magnetic layer 11 has a substantially rectangular shape. In the actual element body 2, the magnetic layers 11 are integrated to the extent that the boundaries between the layers are not visible.

[0019] The element body 2 includes a plurality of metal magnetic particles (not shown). The metal magnetic particles are composed of, for example, a soft magnetic alloy. The soft magnetic alloy is, for example, an Fe-Si based alloy. When the soft magnetic alloy is an Fe-Si based alloy, the soft magnetic alloy may include P. The soft magnetic alloy may be, for example, an Fe-Ni-Si-M based alloy. "M" includes one or more elements selected from Co, Cr, Mn, P, Ti, Zr, Hf, Nb, Ta, Mo, Mg, Ca, Sr, Ba, Zn, B, Al, and rare earth elements.

[0020] In the element body 2, the metal magnetic particles are bonded to each other. The bonding between the metal magnetic particles is realized, for example, by bonding between oxide films formed on the surfaces of the metal magnetic particles. The element body 2 also includes a portion filled with resin. The resin is present at least partially between the plurality of metal magnetic particles. The resin is a resin having electrical insulating properties. Examples of the resin that can be used include silicone resin, phenol resin, acrylic resin, and epoxy resin. There may be void portions between the plurality of metal magnetic particles that are not filled with resin.

[0021] The pair of terminal electrodes 3, 3 each have a flat rectangular parallelepiped shape and are arranged to cover the end faces 2a, 2b of the element body 2, respectively. The terminal electrode 3 is configured to contain a conductive material. The conductive material is, for example, Ag or Pd. The terminal electrode 3 is, for example, a fired electrode, and is configured as a sintered body of a conductive paste. The conductive paste contains a conductive metal powder and glass frit. The conductive metal powder is, for example, Ag powder or Pd powder. A plating layer may be formed on the surface of the terminal electrode 3. The plating layer is formed by, for example, electroplating. The electroplating is, for example, Ni electroplating or Sn electroplating.

[0022] Fig. 2 is a diagram showing the layer structure of a laminated coil component. As shown in the figure, a coil portion C is provided inside an element body 2. The multiple layers forming the coil portion C include a cover layer Lc, a first conductor pattern layer L1, a second conductor pattern layer L2, a connecting conductor layer L3, and an extraction conductor layer L4. The cover layer Lc is a layer composed only of a magnetic layer containing metal magnetic particles. A plurality of cover layers Lc are arranged on each of the main surface 2c side and the main surface 2d side of the element body 2.

[0023] Each layer except the cover layer Lc has a conductor portion formed in a predetermined pattern. The conductor portion is made of, for example, a metal material. The material of the metal material is not particularly limited, but for example, Ag, Cu, Au, Al, Pd, Pd / Ag alloy, etc. can be used. The metal material may contain a Ti compound, a Zr compound, a Si compound, etc. The conductor portion can be formed by, for example, a printing method or a thin film growth method.

[0024] The first conductor pattern layer L1 and the second conductor pattern layer L2 are layers that form the main portion (winding portion) of the coil portion C. In this embodiment, one first conductor pattern layer L1, one second conductor pattern layer L2, and one connecting conductor layer L3 are laminated in this order to form one set. Inside the element body 2, multiple sets are provided in the laminated structure according to the number of windings required in the coil portion C.

[0025] The first conductor pattern layer L1 has a first conductor pattern 12. The first conductor pattern 12 has a generally rectangular ring shape. The first conductor pattern 12 has a first portion 12a extending in the third direction D3 on the end face 2a side, a second portion 12b extending in the first direction D1 on the side face 2e side, and a third portion 12c extending in the third direction D3 on the end face 2b side. The first conductor pattern 12 also has a fourth portion 12d extending in the first direction D1 on the side face 2f side.

[0026] In the first conductor pattern 12, one end of the fourth portion 12d is connected to the end of the third portion 12c on the side surface 2f side, and the other end of the fourth portion 12d is located at the center of the first conductor pattern layer L1 in the first direction D1. A first pad portion 13 is provided at the end of the first portion 12a on the side surface 2f side and at the connection portion between the third portion 12c and the fourth portion 12d. A second pad portion 14 is provided at the other end of the fourth portion 12d.

[0027] The second conductor pattern layer L2 has a second conductor pattern 16. The second conductor pattern 16 has a generally rectangular ring shape. The second conductor pattern 16 has a first portion 16a extending in the third direction D3 on the end face 2a side, a second portion 16b extending in the first direction D1 on the side face 2e side, and a third portion 16c extending in the third direction D3 on the end face 2b side. The second conductor pattern 16 also has a fourth portion 16d extending in the first direction D1 on the side face 2f side.

[0028] In the second conductor pattern 16, one end of the fourth portion 16d is connected to the end of the first portion 16a on the side surface 2f side, and the other end of the fourth portion 16d is located at the center of the first conductor pattern layer L1 in the first direction D1. A first pad portion 13 is provided at the connection portion between the first portion 16a and the fourth portion 16d and at the end of the third portion 16c on the side surface 2f side. A third pad portion 17 is provided at the other end of the fourth portion 16d.

[0029] In this embodiment, as described above, the other end of the fourth portion 12d in the first conductor pattern 12 where the second pad portion 14 is provided and the other end of the fourth portion 16d in the second conductor pattern 16 where the third pad portion 17 is provided are both located at the center in the first direction D1. Therefore, the second pad portion 14 and the third pad portion 17 are overlapped with each other in the stacking direction.

[0030] The connecting conductor layer L3 functions as a layer that secures interlayer space between the first conductor pattern layer L1 and the second conductor pattern layer L2 of a pair adjacent to each other in the stacking direction. The connecting conductor layer L3 has only a pad portion 18 as a conductor portion. The pad portion 18 is disposed in correspondence with the second pad portion 14 of the first conductor pattern 12 and the third pad portion 17 of the second conductor pattern 16. That is, the pad portion 18, the second pad portion 14, and the third pad portion 17 are overlapped with each other in the stacking direction.

[0031] The lead conductor layer L4 is a layer that connects the coil portion C to the terminal electrodes 3, 3. In this embodiment, the lead conductor layer L4 has a lead conductor layer L4A arranged on the main surface 2c side and a lead conductor layer L4B arranged on the main surface 2d side. The lead conductor layer L4A is arranged on the lower layer side (main surface 2c side) of the connection conductor layer L3 of the set located closest to the main surface 2c side. The lead conductor layer L4A has a pad portion 19 arranged to overlap the pad portion 18 of the connection conductor layer L3 in the stacking direction, and a lead conductor 20A extending from the pad portion 19 toward the edge of the end surface 2b side. The pad portion 19 is electrically connected to the pad portion 18 of the connection conductor layer L3 via a through hole (not shown). The lead conductor 20A is connected to the terminal electrode 3 covering the end surface 2b at the end surface 2b.

[0032] On the principal surface 2d side, a connection conductor layer L3 is disposed on the upper layer side (principal surface 2d side) of the first conductor pattern layer L1 of the set located closest to the principal surface 2d side. The lead-out conductor layer L4B has a pad portion 19 disposed so as to overlap the pad portion 18 of the connection conductor layer L3 in the stacking direction, and a lead-out conductor 20B extending from the pad portion 19 toward the edge on the end surface 2a side. The pad portion 19 is electrically connected to the pad portion 18 of the connection conductor layer L3 via a through hole (not shown). The lead-out conductor 20B is connected at the end surface 2a to the terminal electrode 3 covering the end surface 2a.

[0033] Next, the connection relationship between the first conductor pattern layer L1 and the second conductor pattern layer L2 will be described in more detail. Fig. 3 is a diagram showing the connection relationship between the first conductor pattern layer L1 and the second conductor pattern layer L2. As shown in the figure, when connecting the first conductor pattern layer L1 and the second conductor pattern layer L2, each of the first conductor pattern 12 and the second conductor pattern 16 has a parallel portion P1 that overlaps with each other in the stacking direction and a non-parallel portion P2 that does not overlap with each other in the stacking direction.

[0034] In this embodiment, the first portions 12a, 16a, the second portions 12b, 16b, and the third portions 12c, 16c of the first conductor pattern 12 and the second conductor pattern 16 are parallel portions P1, and the fourth portions 12d, 16d are non-parallel portions P2. In one set, the first pads 13, 13 provided in the parallel portions P1 of the first conductor pattern 12 and the parallel portions P1 of the second conductor pattern 16 are connected to each other via the first through holes T1. On the other hand, in one set, the second pads 14 provided in the non-parallel portions P2 of the first conductor pattern 12 and the third pads 17 provided in the non-parallel portions P2 of the second conductor pattern 16 are not connected to each other.

[0035] The second pad portion 14 and the third pad portion 17 are used for connection between one set and a set adjacent to the one set in the stacking direction. In the example of FIG. 3, the second pad portion 14 provided on the non-parallel portion P2 of the first conductor pattern 12 of the one set and the third pad portion 17 provided on the non-parallel portion P2 of the second conductor pattern 16 of the set located on one side of the one set in the stacking direction are connected to each other via the pad portion 18 of the connection conductor layer L3 and the second through hole T2. Also, the third pad portion 17 provided on the non-parallel portion P2 of the second conductor pattern 16 of the one set and the second pad portion 14 provided on the non-parallel portion P2 of the first conductor pattern 12 of the set located on the other side of the one set in the stacking direction are connected to each other via the pad portion 18 of the connection conductor layer L3 and the second through hole T2.

[0036] FIG. 4 is a cross-sectional view of a main part of the laminated coil component. This figure shows a cross section of the element body 2 cut in the lamination direction at the position of the dashed line K shown in FIG. 3. As described above, the second pad portion 14 and the third pad portion 17 in one set are not connected, but as shown in FIG. 4, a gap G exists between the layers of the second pad portion 14 and the third pad portion 17 in one set. The gap G can be formed, for example, by the difference in thermal contraction rate between the element body 2 and the conductor portion constituting the coil portion C. The gap G may be formed by sandwiching a gap-forming member between the layers of the second pad portion 14 and the third pad portion 17 when the element body 2 is formed. In addition, when the element body 2 includes a portion filled with a plurality of metal magnetic particles and resin as in this embodiment, a part of the resin may enter the gap G.

[0037] In addition, in this embodiment, in one set, a recess 21 is provided on at least one of the surface of the second pad portion 14 facing the third pad portion 17 and the surface of the third pad portion 17 facing the second pad portion 14. In this embodiment, recesses 21 are provided on both of these surfaces. Due to these recesses 21, 21, the distance L1 in the stacking direction between the second pad portion 14 and the third pad portion 17 in one set is larger than the distance L2 in the stacking direction between the first conductor pattern 12 and the second conductor pattern 16 in one set.

[0038] The recess 21 can be formed, for example, by printing a magnetic material in the same shape as the second pad portion 14 at the position of the second pad portion 14 before forming the first conductor pattern 12 by printing or the like on the magnetic layer 11. The recess 21 can also be formed in the third pad portion 17 by disposing a magnetic material between the second pad portion 14 and the third pad portion 17 and allowing the magnetic material to penetrate into the third pad portion 17 side in the process of laminating and pressing the magnetic layer 11.

[0039] In this embodiment, the distance L2 in the stacking direction between the first conductor pattern 12 and the second conductor pattern 16 in one set is smaller than the distance L3 in the stacking direction between the first conductor pattern 12 of one set and the second conductor pattern 16 of the set located on one side of the set in the stacking direction, and the distance L4 in the stacking direction between the second conductor pattern 16 of one set and the first conductor pattern 12 of the set located on the other side of the set in the stacking direction. In the example of FIG. 4, the distance L3 and the distance L4 are equal, and L2 <L3=L4となっている。

[0040] In addition, in this embodiment, the number of metal magnetic particles between the second pad portion 14 and the third pad portion 17 in one set is greater than the number of metal magnetic particles located between the first conductor pattern 12 and the second conductor pattern 16 in one set (between the parallel portions P1, P1). That is, in this embodiment, the number of metal magnetic particles aligned in the stacking direction at the above-mentioned interval L1 is greater than the number of metal magnetic particles aligned in the stacking direction at the above-mentioned interval L2. The numbers of metal magnetic particles may be compared by comparing the average values ​​at multiple positions.

[0041] As described above, in the laminated coil component 1, the first through hole T1 connecting the first and second conductor patterns 12 and 16 of one set connects the first pads 13, 13 provided in the parallel portion P1, and the second through hole T2 connecting the first and second conductor patterns 12 and 16 of one set and a set adjacent to the first set connects the second and third pads 14, 17 provided in the non-parallel portion P2. As a result, in the laminated coil component 1, the positions of the first through hole T1 and the second through hole T2 can be dispersed when viewed from the stacking direction. Dispersing the positions of the first through hole T1 and the second through hole T2 can prevent the conductor volume from increasing at the same position. Therefore, even if thermal expansion or thermal contraction occurs, the occurrence of disconnection of the through holes T1 and T2 can be suppressed.

[0042] In the laminated coil component 1, the second pad portion 14 and the third pad portion 17 in one set overlap each other in the lamination direction. In this case, the distributed relationship between the positions of the first through holes T1 and the positions of the second through holes T2 is maintained, while the symmetry of the first conductor pattern 12 and the second conductor pattern 16 is enhanced, and the pattern is simplified.

[0043] In the laminated coil component 1, a gap G exists between the second pad portion 14 and the third pad portion 17 in one set. This gap G can make the interlayer electrical resistivity between the second pad portion 14 and the third pad portion 17 higher than that of the base material, thereby improving the withstand voltage of the laminated coil component 1. Also, in the laminated coil component 1, in one set, recesses 21 are provided on both the surface of the second pad portion 14 facing the third pad portion 17 and the surface of the third pad portion 17 facing the second pad portion 14. These recesses 21 can ensure a sufficient interlayer space between the second pad portion 14 and the third pad portion 17, thereby improving the withstand voltage of the laminated coil component 1.

[0044] In the laminated coil component 1, the distance L2 in the stacking direction between the first conductor pattern 12 and the second conductor pattern 16 in one set is smaller than the distance L3 in the stacking direction between the first conductor pattern 12 of one set and the second conductor pattern 16 of the set located on one side of the set in the stacking direction, and the distance L4 in the stacking direction between the second conductor pattern 16 of the one set and the first conductor pattern 12 of the set located on the other side of the set in the stacking direction. This makes it possible to ensure a sufficient space between the layers of adjacent sets in the stacking direction, thereby improving the withstand voltage of the laminated coil component 1.

[0045] In the laminated coil component 1, the element body 2 is formed by stacking magnetic layers 11 containing a plurality of metal magnetic particles. The number of metal magnetic particles between the second pad portion 14 and the third pad portion 17 in one set is greater than the number of metal magnetic particles located between the first conductor pattern 12 and the second conductor pattern 16 in one set. By relatively increasing the number of metal magnetic particles between the second pad portion 14 and the third pad portion 17, the withstand voltage of the laminated coil component 1 can be improved.

[0046] The present disclosure is not limited to the above embodiment. For example, in the above embodiment, the recess 21 is provided on both the surface of the second pad portion 14 facing the third pad portion 17 and the surface of the third pad portion 17 facing the second pad portion 14, but the recess 21 may be provided on only one of these surfaces, or may not be provided on either surface. The gap G between the layers of the second pad portion 14 and the third pad portion 17 may not necessarily be provided.

[0047] The element body 2 does not necessarily need to be configured to include metal magnetic particles, and may be configured of ferrite (e.g., Ni-Cu-Zn ferrite, Ni-Cu-Zn-Mg ferrite, Cu-Zn ferrite), a dielectric material, etc. In the above embodiment, one first conductor pattern layer L1, one second conductor pattern layer L2, and one connecting conductor layer L3 form one set, but the connecting conductor layer L3 may be omitted, and one set may be formed of one first conductor pattern layer L1 and one second conductor pattern layer L2. [Explanation of symbols]

[0048] 1...laminated coil component, 2...element body, 12...first conductor pattern, 13...first pad portion, 14...second pad portion, 17...third pad portion, 16...second conductor pattern, 21...recess, C...coil portion, L1...first conductor pattern layer, L2...second conductor pattern layer, P1...parallel portion, P2...non-parallel portion, T1...first through hole, T2...second through hole, G...gap.

Claims

1. A laminated coil component including a coil portion inside an insulating element body having a laminated structure, the coil portion has a plurality of sets including a first conductor pattern layer having a first conductor pattern and a second conductor pattern layer having a second conductor pattern; each of the first conductor pattern and the second conductor pattern has a parallel portion that overlaps with each other in a stacking direction, a non-parallel portion that does not overlap with each other in the stacking direction, and a pad portion used for connection between the conductor patterns; In one set, first pad portions provided on the parallel portion of the first conductor pattern and the parallel portion of the second conductor pattern are connected to each other via a first through hole, a second pad portion provided in the non-parallel portion of the first conductor pattern of the one set and a third pad portion provided in the non-parallel portion of the second conductor pattern of a set located on one side of the one set in the stacking direction are connected via a second through hole; a laminated coil component in which the third pad portion provided in the non-parallel portion of the second conductor pattern of the one set and the second pad portion provided in the non-parallel portion of the first conductor pattern of a set located on the other side of the one set in the stacking direction are connected via the second through hole.

2. 2. The laminated coil component according to claim 1, wherein in each set, the second pad portion and the third pad portion overlap each other in the lamination direction.

3. 3. The laminated coil component according to claim 1, wherein in the one set, a recess is provided on at least one of a surface of the second pad portion facing the third pad portion and a surface of the third pad portion facing the second pad portion.

4. the element body is formed by stacking magnetic layers each including a plurality of metal magnetic particles; 4. The laminated coil component according to claim 1, wherein the number of the metal magnetic particles between the second pad portion and the third pad portion in the one set is greater than the number of the metal magnetic particles located between the first conductor pattern and the second conductor pattern in the one set.

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