Cooling control method

Abstract

To provide a cooling control method that can provide sufficient cooling with one fan for multiple heat sources.SOLUTION: A cooling control method uses a sensor provided for each of multiple heat sources to measure the temperature of each heat source, a fan that blows cooling air to each heat source, a wind deflector that can control the amount of cooling air blown to each heat source by controlling the angle of the panel surface, and a control unit that controls the angle of the wind deflector's panel surface. The control unit aggregates the temperature information measured by each sensor and controls the angle of the wind deflector's panel surface on the basis of the temperature information.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a cooling control method for controlling cooling of each of a plurality of heat sources in a computer device (electronic computer) or the like. [Background technology]

[0002] Computer equipment (electronic calculators) are becoming more densely packed with the electronic components that make up the device, which is increasing the amount of heat generated by the electronic components. However, because the increased density reduces the heat dissipation area and heat dissipation paths, there is a need to sufficiently cool the heat-generating electronic components.

[0003] In conventional computers (electronic calculators), cooling is achieved by controlling the rotation speed of a variable speed fan according to the temperature (load) of the CPU. In practice, a cooling control IC receives information from the CPU's temperature sensor, and the cooling control IC controls the rotation speed of the fan by sending a pulse signal with a duty ratio according to the temperature read by the variable speed fan.

[0004] Another known example is Patent Document 1, which describes a cooling method in which cooling of multiple heat sources is controlled simply by controlling the direction of the fans. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2014-216035 A Summary of the Invention [Problem to be solved by the invention]

[0006] In the above-mentioned conventional technology, no structure such as an air deflector for directing cooling air to the heat source is provided. As in the conventional technology described above, if there is no wind directing structure such as a wind deflector, or if a wind deflector is provided but is fixed, when the heat sources become hot, a single fan cannot adequately cool multiple heat sources. Furthermore, the space inside the device is limited, making it difficult to increase the number of fans in response to the number of heat sources.

[0007] In order to solve the above-mentioned problems, an object of the present invention is to provide a cooling control method capable of sufficiently cooling a plurality of heat sources with one fan.

[0008] The above and other objects of the present invention and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0009] The cooling control method of the present invention is a cooling control method for controlling cooling of each of a plurality of heat sources. The cooling control method of the present invention uses a sensor provided for each heat source to measure the temperature of each heat source, a fan to blow cooling air to each heat source, a wind deflector that can control the amount of cooling air blown to each heat source by controlling the angle of the panel surface, and a control unit that controls the angle of the panel surface of the wind deflector. Furthermore, in the cooling control method of the present invention, the control unit consolidates information on the temperatures measured by the sensors, and controls the angle of the plate surface of the airflow direction plate based on the temperature information. Effect of the Invention

[0010] According to the above-described cooling control method of the present invention, even when the heat sources reach high temperatures, a single fan can sufficiently cool a plurality of heat sources in real time. Therefore, the lifespan of parts can be extended and the risk of product failure can be reduced.

[0011] Problems, configurations and effects other than those described above will become apparent from the following description of the embodiments. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic configuration diagram of a computer device according to a first embodiment. [Diagram 2] FIG. 2 is a block diagram for explaining control by a cooling function IC in FIG. [Diagram 3] FIG. 2 is an enlarged view of a main part of the computer device of FIG. [Figure 4] 4 is a flowchart showing one embodiment of a specific procedure of a cooling control method in the first embodiment. [Diagram 5] 5 is an example of a data table for determining the angle of the air deflector, the number of revolutions of the fan, and the temperature of the Peltier element, which are used in step S3 of FIG. [Figure 6] FIG. 2 is a diagram showing a first example of the position of the plate surface of the airflow direction plate. [Figure 7] FIG. 11 is a diagram showing a second example of the position of the plate surface of the airflow direction plate. [Figure 8] FIG. 11 is a diagram showing a third example of the position of the panel surface of the airflow direction panel. [Figure 9] FIG. 11 is a schematic configuration diagram of a computer device according to a second embodiment. [Figure 10] FIG. 1 is a schematic diagram illustrating an example of a conventional technique. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, the embodiments and examples of the present invention will be described with reference to text and drawings. However, the structures, materials, and other specific configurations shown in the present invention are not limited to the embodiments and examples described here, and can be appropriately combined or improved without changing the gist of the invention. Elements that are not directly related to the present invention are not shown.

[0014] First, prior to describing the embodiment and examples of the present invention, an example of the conventional technology corresponding to the cooling control method of the present invention will be described with reference to Fig. 10. Fig. 10 is a schematic diagram for explaining an example of the conventional technology.

[0015] In the conventional technology shown in FIG. 10, device 100 is configured with fan 101 that blows air 103 to cool a heat source (not shown), and air deflector 102 that is positioned in front of fan 101 to control the direction of air 103. The position and direction of the airflow direction plate 102 are fixed, and the airflow direction plate 102 causes the cooling air 103 sent from the fan 101 to flow in a predetermined direction. In a conventional fixed air deflector such as the air deflector 102 shown in FIG. 10, the cooling air 103 flows only in a predetermined direction, so when the heat sources become hot, a single fan cannot adequately cool multiple heat sources.

[0016] The inventors of the present invention have considered measures to solve such problems, and as a result of their investigations, have discovered that a wind direction plate capable of controlling the angle of its plate surface can be provided, and that this wind direction plate can be used to control the amount of cooling air from the fan toward each heat source.

[0017] The cooling control method of the present invention is a cooling control method for controlling cooling of each of a plurality of heat sources, and uses a sensor provided for each heat source for measuring the temperature of each heat source, a fan for blowing cooling air to each heat source, a wind deflector that can control the amount of cooling air blown to each heat source by controlling the angle of the panel surface, and a control unit that controls the angle of the panel surface of the wind deflector. The control unit then aggregates the temperature information measured by each sensor, and controls the angle of the vane's surface based on the temperature information.

[0018] In the above cooling control method, the airflow direction plate is configured to be able to control the amount of cooling air from the fan to each heat source by controlling the angle of its plate surface. The airflow direction plate is preferably configured so that its plate surface can be rotated around a central axis. A configuration can be adopted in which the angle of the plate surface can be changed arbitrarily using a mechanism such as a motor, or a configuration in which the angle of the plate surface can be changed in stages using a mechanism such as a stepping motor.

[0019] According to the cooling control method of the present invention, a sensor, a fan, a wind deflector that can control the volume of cooling air from the fan by controlling the angle of the panel surface, and a control unit that controls the angle of the wind deflector's panel surface, the control unit controls the angle of the wind deflector's panel surface based on temperature information measured by the sensor. This means that by controlling the angle of the air deflector's panel surface, the amount of cooling air blown to each heat source can be controlled, so that a single fan can provide sufficient cooling to multiple heat sources in real time, even if the heat sources become too hot. Therefore, the lifespan of parts can be extended and the risk of product failure can be reduced.

[0020] In the above cooling control method, a Peltier element may be disposed between the fan and the airflow direction plate, and the cooling air from the fan may be cooled by the Peltier element. In this configuration, the cooling air can be further cooled by the Peltier element, so that the cooling effect can be improved.

[0021] In the above cooling control method, a Peltier element may be disposed on the plate surface of the airflow direction plate, and the cooling air from the fan may be cooled by the Peltier element. In this configuration, the cooling air can be further cooled by the Peltier element, so that the cooling effect can be improved.

[0022] In these configurations, the control unit can also be configured to control the cooling by the Peltier element based on the temperature information. With this configuration, in addition to controlling the volume of cooling airflow to each heat source, the temperature of the cooling airflow can also be controlled.

[0023] In the above cooling control method, the control unit may also control the rotation speed of the fan based on the temperature information. With this configuration, the overall volume of the cooling air can be controlled by controlling the rotation speed of the fan.

[0024] In the above cooling control method, a Peltier element can be placed between the fan and the air deflector or on the surface of the air deflector, and the control unit can be configured to control the angle of the air deflector surface, the current flowing through the Peltier element, and the rotation speed of the fan based on temperature information. With this configuration, the cooling by the Peltier element can be controlled by controlling the current flowing through the Peltier element, and in addition to the amount of cooling air to each heat source, the temperature of the cooling air and the overall amount of cooling air can also be controlled.

[0025] In this configuration, the control unit can be further configured to control the angle of the air deflector's plate surface, the current flowing through the Peltier element, and the rotation speed of the fan based on a table of combinations of values ​​of temperature information from each sensor, the angle of the air deflector's plate surface, the current flowing through the Peltier element, and the rotation speed of the fan, which has been created in advance. With this configuration, control is performed based on a pre-created table of value combinations, making it easy to control three elements: the angle of the air deflector's surface, the current flowing through the Peltier element, and the fan's rotation speed.

[0026] A specific example of the cooling control method will now be described.

[0027] Example 1 The cooling control method of the first embodiment will be described with reference to FIGS.

[0028] FIG. 1 is a schematic diagram of a computer device 10 according to a first embodiment. In the first embodiment, a computer device 10 shown in FIG. 1 is configured to implement a cooling control method of the present invention.

[0029] As shown in FIG. 1, a computer device 10 includes a CPU 1, an HDD 2, a fan 5 for blowing cooling air, a wind deflector 6, a cooling IC 7, and a Peltier element 8. Furthermore, a first sensor 3 and a second sensor 4 are provided for measuring the temperatures of the two heat sources (CPU 1 and HDD 2), respectively.

[0030] The airflow direction vane 6 is disposed in front of the fan 5 and guides the cooling air from the fan 5 . The airflow direction plate 6 has one end 6A fixed, and the plate surface can be rotated around the fixed end 6A as a rotation axis, and the angle of the plate surface (such as the angle as seen from the fan 5) can be changed by rotating the plate surface. A mechanism (not shown) is provided to rotate the plate surface of the wind direction vane 6. The plate surface of the wind direction vane 6 can be rotated by using a motor or the like connected to the rotation shaft (one end 6A) of the wind direction vane 6. It is possible to configure the angle of the plate surface of the wind direction vane 6 to be changed arbitrarily by a mechanism such as a motor, or to configure the angle of the plate surface of the wind direction vane 6 to be changed in stages by using a mechanism such as a stepping motor. A configuration using a stepping motor as a mechanism limits the angle of the plate surface of the wind direction vane 6 to a few angles and cannot change the angle arbitrarily, but has the advantage that the motor can be easily controlled and stopped stably.

[0031] The Peltier element 8 is provided between the fan 5 and the air deflector 6 . By passing a current through the Peltier element 8, the Peltier element 8 can change (cool or heat) the temperature around the Peltier element 8. In this embodiment, cooling is performed by passing a current through the Peltier element 8 to lower the temperature of the cooling air from the fan 5.

[0032] The cooling function IC7 corresponds to the control unit in the cooling control method of the present invention, and based on information such as temperature obtained from the first sensor 3 or the second sensor 4, moves the surface of the air deflector 6, which is located in the direction of the flow of outside air taken in from the fan 5, to control the angle of the surface. This allows the air flow to be changed, allowing cooling to be focused on the heat source that is to be cooled. The cooling function IC 7 is also configured to control the rotation speed of the fan 5 and the current flowing through the Peltier element 8.

[0033] FIG. 2 is a block diagram for explaining the control by the cooling function IC 7. As shown in FIG. 2, the sensors measuring the temperature of each heat source (first sensor 3 and second sensor 4) send temperature information to the cooling function IC 7, which aggregates the temperature information and, based on that information, controls 11 the Peltier element, 12 the angle of the air deflector, and 13 the fan speed. The control 11 of the Peltier element is actually a control of the amount of current flowing through the Peltier element 8 .

[0034] Fig. 3 is an enlarged view of the main parts of the computer device 10 in Fig. 1. Fig. 3 shows the fan 5, the Peltier element 8 arranged in front of the fan 5, and the air deflector 6 of the computer device 10 in Fig. 1. Note that although the CPU 1 and HDD 2 are actually outside the scope of Fig. 3, the characters "CPU" and "HDD" are written in Fig. 3 so that their positional relationship with the air deflector 6 can be understood.

[0035] With reference to FIG. 3, control of the angle of the plate surface of the airflow direction plate 6 will be described. As shown by the arrow in Figure 3, by changing the angle of the plate surface of the air deflector 6 located in front of the fan 5, the flow of the cooling air sent from the fan 5 can be changed, and cooling can be directed to the intended heat source, as will be described in detail later.

[0036] FIG. 4 is a flowchart showing one embodiment of a specific procedure of the cooling control method in the first embodiment. In this embodiment, in the configuration shown in the block diagram of FIG. 2, cooling control is performed according to the flow chart shown in FIG. 4, as will be described below. First, in step S1, the first sensor 3 and the second sensor 4, which monitor their respective heat sources, measure temperatures. Next, in step S2, the cooling function IC 7 counts up the temperatures of the two sensors 3, 4. Next, in step S3, the cooling function IC 7 checks the temperatures collected from the sensors 3 and 4 against a data table created in advance, and controls the fan 5, the air deflector 6, and the Peltier element 8 based on the data table. Specifically, it controls the rotation speed of the fan 5, the angle of the plate surface of the air deflector 6, and the current flowing through the Peltier element 8. By changing the amount of current flowing through the Peltier element 8, the temperature of the surface of the Peltier element 8 and the surroundings of the Peltier element 8 can be changed.

[0037] Temperature information is constantly acquired by the sensors 3 and 4, and the rotation speed of the fan 5, the angle of the plate surface of the air deflector 6, and the temperature of the Peltier element 8 are controlled in real time.

[0038] FIG. 5 is an example of a data table for determining the angle of the air deflector, the number of revolutions of the fan, and the temperature of the Peltier element, which are used in step S3 of FIG. In the data table shown in Figure 5, the rotation speed of fan 5, the angle (of the plate surface) of vane 6, and the current to be passed through Peltier element 8 are specified for a combination of temperature IC1 of CPU 1 measured by the first sensor 3 and temperature IC2 of HDD 2 measured by the second sensor 4. In FIG. 5, among the many combinations of temperatures IC1 and IC2, only three combinations are shown.

[0039] Then, the fan 5, the air deflector 6, and the Peltier element 8 are operated based on a data table corresponding to the temperature of each heat source to be cooled, such as the data table shown in FIG. For example, as shown in FIG. 5, when temperatures IC1 and IC2 are both 5°C, the rotation speed of fan 5 is controlled to 100 revolutions / m (100 revolutions per minute), the angle of the plate surface of air deflector 6 is controlled to 50 degrees, and the current of Peltier element 8 is controlled to 0 A (off state). When the temperatures of CPU 1 and HDD 2 rise and temperature IC1 reaches 24°C and temperature IC2 reaches 55°C, the rotation speed of fan 5 is controlled to 1500 rpm, the angle of the plate surface of air deflector 6 is controlled to 80 degrees, and the current of Peltier element 8 is controlled to 0A (off state). Furthermore, when the temperature of the CPU 1 and the HDD 2 rises and the temperature of the temperature IC 1 reaches 40°C and the temperature of the temperature IC 2 reaches 80°C, the rotation speed of the fan 5 is controlled to 2000 revolutions / min, the angle of the plate surface of the wind direction plate 6 is 50 degrees, and the current of the Peltier element 8 is 100 mA (on state).

[0040] In FIG. 5, the case where both the temperature IC 1 and the temperature IC 2 rise and IC 1 < IC 2 is extracted and illustrated. However, the cases where IC 1 > IC 2 or only one of the temperatures rises are also defined in the data table and controlled based on the data table.

[0041] Next, with reference to the examples of the position of the plate surface of the wind direction plate 6 shown in FIGS. 6 to 8, the details of the control of the position of the plate surface of the wind direction plate 6 shown in FIG. 3 will be described. In FIGS. 6 to 8, only the fan 5, the wind direction plate 6, and the cooling wind 9 are illustrated, and the illustration of the Peltier element 8 in FIG. 1 and the like is omitted. Also, for clarity of the positional relationship, the characters "CPU" and "HDD" are attached as in FIG. 3.

[0042] FIG. 6 is a diagram showing a first example of the position of the plate surface of the wind direction plate 6. The first example shown in FIG. 6 is the case where the CPU is at a high temperature and the HDD is at a low temperature. In this case, since it is necessary to cool the CPU preferentially, as shown in FIG. 6, the plate surface of the wind direction plate 6 is made parallel to the wind 9, that is, the angle of the plate surface of the wind direction plate 6 is set to 0 degrees. The state of FIG. 6 is the same as the state shown by the solid line in FIG. 3. In this case, as shown in FIG. 6, the wind 9 from the fan 5 travels straight and heads towards the CPU. Thereby, the flow of the wind 9 to the HDD side can be prevented, and the wind can be preferentially blown to the front CPU for cooling.

[0043] FIG. 7 is a diagram showing a second example of the position of the plate surface of the wind direction plate 6. The second example shown in Fig. 7 is when both the CPU and HDD are at high temperatures. In this case, since it is necessary to cool both, the angle of the plate surface of the air deflector 6 is changed from the state shown in Fig. 6, as shown in Fig. 7. For example, the angle of the plate surface of the air deflector 6 is set to 30 degrees. This state in Fig. 7 is similar to the state shown by the two-dot chain line in Fig. 3, where the inclination of the plate surface is smaller. In this case, as shown in FIG. 7, wind 9A to the right of the surface of the air deflector 6 changes direction when it hits the surface and heads toward the HDD, while wind 9B passing to the left of the surface of the air deflector 6 continues straight ahead toward the CPU. This allows air to be blown to both the CPU and the HDD, and one fan 5 can cool two heat sources (CPU 1, HDD 2).

[0044] FIG. 8 is a diagram showing a third example of the position of the plate surface of the airflow direction plate 6. In FIG. The third example shown in FIG. 8 is a case where the CPU is at a low temperature and the HDD is at a high temperature. In this case, since it is necessary to focus on cooling the HDD, the angle of the plate surface of the air deflector 6 is made wider than the state shown in FIG. 7, as shown in FIG. 8. For example, the angle of the plate surface of the air deflector 6 is set to 60 degrees. This state in FIG. 8 is similar to the state shown by the two-dot chain line in FIG. 3, where the plate surface is inclined more. In this case, as shown in FIG. 8, the air 9 from the fan 5 hits the plate surface of the airflow direction plate 6, changes direction, and heads toward the HDD. This allows the flow of air 9 to be redirected toward the HDD, enabling cooling of the HDD to be focused.

[0045] According to this embodiment, a first sensor 3, a second sensor 4, a fan 5, a wind deflector 6 that can control the amount of cooling air from the fan 5 by controlling the angle of the panel surface, and a cooling function IC 7 that controls the angle of the panel surface of the wind deflector 6 are used. Then, the cooling function IC 7 controls the angle of the plate surface of the airflow direction plate 6 based on the information of the temperature measured by the sensors 3 and 4. This allows the amount of cooling air 9 blown to each of the CPU 1 and HDD 2 to be controlled by controlling the angle of the surface of the air deflector 6, so that even if the CPU 1 or HDD 2 becomes hot, a single fan 5 can provide sufficient cooling to the CPU 1 and HDD 2 in real time. Therefore, the lifespan of the CPU 1, HDD 2, and their peripheral components (electronic components and other components) can be extended, and the risk of failure of the computer device 10 can be reduced.

[0046] Furthermore, according to this embodiment, since the Peltier element 8 is provided in front of the fan 5, the cooling air from the fan 5 can be further cooled by the Peltier element 8.

[0047] Here, in a configuration in which the fan 5 takes in air outside the device and blows it out, if a Peltier element is not provided, the temperature of the cooling air from the fan 5 will depend on the outside air temperature. In contrast, in this embodiment, by providing a Peltier element 8 in front of the fan 5, the temperature of the air being blown can be changed independently of the outside air temperature, even when the fan 5 is configured to take in air from outside the device and blow it out.

[0048] Furthermore, according to this embodiment, the cooling function IC 7 controls the angle of the plate surface of the airflow direction vane 6, the current flowing through the Peltier element 8, and the rotation speed of the fan 5 based on the temperature information measured by the sensors 3 and 4. This makes it possible to control the temperature of the cooling air 9 and the overall air volume of the cooling air 9 in addition to the volume of air blown by the cooling air 9 toward each of the CPU 1 and the HDD 2 .

[0049] Furthermore, according to this embodiment, the cooling function IC 7 controls the angle of the plate surface of the air deflector 6, the current flowing to the Peltier element 8, and the rotation speed of the fan 5 based on a data table of combinations of values ​​of the temperature information of the sensors 3 and 4, the angle of the plate surface of the air deflector 6, the current flowing to the Peltier element 8, and the rotation speed of the fan 5, which have been created in advance. This allows control to be performed based on a pre-created table of value combinations, making it easy to control the three elements of the angle of the plate surface of the air deflector 6, the current flowing through the Peltier element 8, and the rotation speed of the fan 5.

[0050] Example 2 Next, a cooling control method according to the second embodiment will be described with reference to FIG.

[0051] FIG. 9 is a schematic diagram of a computer device 20 according to the second embodiment. In the computer device 10 shown in FIG. 1, the Peltier element 8 is disposed between the fan 5 and the air deflector 6. In contrast, in a computer device 20 shown in FIG. 9, a Peltier element 8 is provided on the surface of a wind direction plate 6 on the HDD 2 side. Other configurations are similar to those of the computer device 10 of the first embodiment shown in FIG. 1, so the same reference numerals are used and duplicated explanations are omitted.

[0052] In this embodiment, it is possible to obtain the effects obtained in the embodiment 1. That is, a single fan 5 can provide sufficient cooling for the CPU 1 and the HDD 2 in real time. Therefore, the lifespan of the CPU 1, HDD 2, and their peripheral components (electronic components and other components) can be extended, and the risk of failure of the computer device 10 can be reduced. In addition, the cooling air from the fan 5 can be further cooled by the Peltier element 8, and the temperature of the air to be blown can be changed independently of the outside air temperature. In addition to the amount of airflow of the cooling air 9 toward each of the CPU 1 and the HDD 2, the temperature of the cooling air 9 and the total amount of airflow of the cooling air 9 can also be controlled. And, because control is performed based on a data table, the three elements of the angle of the plate surface of the airflow direction plate 6, the current flowing through the Peltier element 8, and the rotation speed of the fan 5 can be easily controlled.

[0053] Furthermore, in this embodiment, by providing a Peltier element 8 on the surface of the airflow direction plate 6 facing the HDD 2, the cooling air directed toward the HDD 2 can be cooled by the Peltier element 8, thereby making it possible to cool the HDD 2 more efficiently.

[0054] (Modification) In the above-described embodiment, the cooling function IC 7 serving as the control unit controls three elements: the angle of the plate surface of the airflow direction plate 6, the rotation speed of the fan 5, and the current flowing through the Peltier element 8. In the present invention, it is possible to adopt a configuration in which two elements including control of the angle of the plate surface of the airflow direction vane are controlled, or a configuration in which only the angle of the plate surface of the airflow direction vane is controlled. Even in these configurations, the angle of the airflow direction plate is controlled, and therefore the amount of cooling airflow to each heat source can be controlled by controlling the angle of the airflow direction plate.

[0055] In the above-described embodiment, the angle of the plate surface of the airflow direction plate 6, the current flowing through the Peltier element 8, and the rotation speed of the fan 5 are controlled based on a data table. The present invention also includes cases where cooling control is performed without using a data table. For example, it is possible to control each element, such as the angle of the wind direction vane, individually (separately for each element), based on the temperature measured by the sensor, using conditions based on mathematical expressions or temperature values. When a data table is used as in the above embodiment, control of multiple elements can be easily performed.

[0056] In the computer device 20 of the second embodiment shown in FIG. 9, the Peltier element 8 is provided on the surface of the airflow direction plate 6 on the HDD 2 side. Alternatively, a configuration in which the Peltier element 8 is provided on the CPU 1 side of the plate surface of the airflow direction plate 6, or a configuration in which the Peltier element 8 is provided on both sides of the plate surface of the airflow direction plate 6, may be adopted. In any of these three configurations, including the configuration of Example 2, the cooling wind passing through the surface on which the Peltier element 8 is provided can be cooled by the Peltier element 8.

[0057] In each of the above-described embodiments, the computer devices 10 and 20 are provided with one fan 5, and the one fan 5 cools two heat sources (the CPU 1 and the HDD 2). In the present invention, it is also possible to adopt a configuration in which three or more heat sources are cooled by one fan, and two or more air deflectors may be provided in order to cool three or more heat sources. Furthermore, a plurality of fans may be provided to cool three or more heat sources, but in order to obtain the advantages of the present invention, the number of fans is set to be less than the number of heat sources to be cooled.

[0058] The present invention is not limited to the above-described embodiments and examples, and includes various modified examples. For example, the above-described embodiments and examples have been described in detail to easily explain the present invention, and the present invention is not necessarily limited to those having all of the configurations described. [Explanation of symbols]

[0059] 1 CPU, 2 HDD, 3 first sensor, 4 second sensor, 5 fan, 6 air deflector, 7 cooling function IC, 8 Peltier element, 10, 20 computer device

Claims

1. A cooling control method for controlling cooling of each of a plurality of heat sources, comprising: a sensor provided for each of the heat sources, the sensor measuring the temperature of each of the heat sources; a fan for blowing cooling air to each of the heat sources; a wind deflector capable of controlling the amount of cooling air blown to each of the heat sources by controlling the angle of the plate surface; and a control unit for controlling the angle of the plate surface of the wind deflector, The control unit aggregates information on the temperatures measured by the sensors, and controls an angle of the plate surface of the wind direction plate based on the information on the temperatures. Cooling control method.

2. The cooling control method according to claim 1 , further comprising the step of: disposing a Peltier element between the fan and the airflow direction plate; and cooling the cooling air from the fan by the Peltier element.

3. The cooling control method according to claim 1 , further comprising the step of: disposing a Peltier element on a plate surface of the airflow direction plate; and cooling the cooling air from the fan by the Peltier element.

4. The cooling control method according to claim 2 , wherein the control unit also controls the cooling of the cooling air by the Peltier element based on the temperature information.

5. The cooling control method according to claim 3 , wherein the control unit also controls the cooling of the cooling air by the Peltier element based on the information on the temperature.

6. The cooling control method according to claim 1 , wherein the control unit also controls a rotation speed of the fan based on the temperature information.

7. A Peltier element is disposed between the fan and the wind direction plate or on the plate surface of the wind direction plate, The cooling control method according to claim 1 , wherein the control unit controls an angle of the plate surface of the airflow direction plate, a current flowing through the Peltier element, and a rotation speed of the fan, based on the temperature information.

8. The cooling control method according to claim 7, wherein the control unit controls the angle of the plate surface of the air deflector, the current flowing through the Peltier element, and the rotation speed of the fan based on a table of combinations of values ​​of the temperature information of each of the sensors, the angle of the plate surface of the air deflector, the current flowing through the Peltier element, and the rotation speed of the fan, which is created in advance.

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