Light-emitting device and manufacturing method for light-emitting device

Abstract

To achieve a light-emitting device in a stable bonding state.SOLUTION: A light-emitting device includes a substrate having a first surface and a second surface that is above the first surface and surrounds the first surface in a top view, one or more light-emitting elements disposed on the first surface, an optical member bonded to the substrate and disposed in a position where a portion of the optical member overlaps the first surface in a top view, a first adhesive portion with a first adhesive cured that is interposed between the second surface and the optical member and is provided in first and second regions of the second surface, respectively, to fix the optical member to the substrate, and a second adhesive portion with a second adhesive different from the first adhesive cured that sandwiches the first adhesive portion provided in the first region, and is provided at two locations on the second surface without contacting the first adhesive portion, and further that sandwiches the first adhesive portion provided in the second region, and is provided at two locations on the second surface without contacting the first adhesive portion.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a light emitting device and a method for manufacturing a light emitting device. [Background technology]

[0002] Patent Document 1 discloses a method for manufacturing a light-emitting device comprising: After adjustment, the plates are joined with an ultraviolet-curing resin adhesive. According to 1, the position can be adjusted and fixed, so mounting can be performed with high precision.

[0003] Furthermore, light emitting devices having light emitting elements such as semiconductor laser elements are widely used in projectors and car headlights. It is used by incorporating it into various products such as dryite. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication 2017-201684 Summary of the Invention [Problem to be solved by the invention]

[0005] To realize a light emitting device with stable adhesion. [Means for solving the problem]

[0006] The light emitting device disclosed in the embodiment has a first surface and a front surface which is located above the first surface and is in a top view. a substrate having a second surface surrounding the first surface; and one or more a light emitting element bonded to the base and disposed at a position where a part of the light emitting element overlaps with the first surface when viewed from above; an optical member, and a first region and a second region of the second surface interposed between the second surface and the optical member; a first adhesive that is hardened and that fixes the optical member to the base; The first adhesive portion is sandwiched between the first adhesive portion and the first adhesive portion provided in the first region. The first electrode is provided at two locations on the second surface without contacting with the first electrode, and is provided in the second region. two front adhesive portions provided on the second surface, the front adhesive portions being sandwiched between the first adhesive portions and not in contact with the first adhesive portions; a second adhesive portion formed by hardening a second adhesive different from the first adhesive, A virtual first line segment connecting points on the first adhesive portion provided in the first region and the second region is Two front ends passing through the first surface and sandwiching the first adhesive portion provided in the first region in a top view A virtual second line segment connecting points on the second adhesive portion does not pass through the first surface, and when viewed from above, A virtual third line connecting points on two of the second adhesive portions sandwiching the first adhesive portion provided in the region The line segment does not pass through the first surface, and in a top view, the first adhesive portion provided in the first region The width in the direction parallel to the second line segment is the width of the first adhesive portion provided in the first region between two front adhesive portions. the width of the second adhesive portion in a direction parallel to the second line segment, The width of the first adhesive portion provided in the second region in a direction parallel to the third line segment is The width of the two second adhesive portions sandwiching the first adhesive portion in a direction parallel to the third line segment is greater than either

[0007] The manufacturing method disclosed in the embodiment includes: and a second surface surrounding the first surface of the substrate. providing a first adhesive in the first region and the second region on the second surface, respectively; The first adhesive provided in the first region does not contact the first adhesive provided in the first region. A second adhesive different from the first adhesive is provided at least in two places so as to sandwich the adhesive, The adhesive layer is not in contact with the first adhesive layer provided in the second region and is provided in the second region. providing the second adhesive at at least two locations so as to sandwich the first adhesive; curing the first adhesive while in contact with the first adhesive and the second adhesive; 1. A step of forming a first adhesive portion by hardening an adhesive, and in a state where the first adhesive portion is formed, curing the second adhesive to form a second adhesive portion in which the second adhesive is cured; The light emitting device manufactured by this manufacturing method has the first adhesive portion and the second adhesive portion. When viewed from above, points on the first adhesive portion provided in each of the first region and the second region are connected. A virtual first line segment passes through the first surface, and the first region is provided in the first region in a top view. A virtual second line segment connecting two points on the second adhesive portion that sandwich the adhesive portion does not pass through the first surface. When viewed from above, two of the second adhesive portions sandwiching the first adhesive portion provided in the second region are A virtual third line segment connecting the points does not pass through the first surface and is provided in the first region when viewed from above. The width of the first adhesive portion in a direction parallel to the second line segment is The width of the second adhesive portion is larger than the width of the second adhesive portion in the direction parallel to the second line segment. In the top view, the first adhesive portion provided in the second region is The width of the third adhesive portion between the two second adhesive portions sandwiching the first adhesive portion provided in the second region is The width of the line segment must be greater than either of the widths in the directions parallel to the line segment. Effect of the Invention

[0008] According to the present invention, a light emitting device with a stable adhesive state can be realized. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view of a light emitting device according to an embodiment. [Diagram 2] FIG. 2 is a top view of the light emitting device according to the embodiment. [Diagram 3] FIG. 3 is a cross-sectional view of the light emitting device taken along line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view of the light emitting device taken along line IV-IV in FIG. [Figure 5A] FIG. 5A is a schematic diagram for explaining a method for manufacturing a light emitting device according to an embodiment. [Figure 5B] FIG. 5B is another schematic view for explaining the method for manufacturing the light emitting device according to the embodiment. [Figure 5C] FIG. 5C is another schematic view for explaining the method for manufacturing the light emitting device according to the embodiment. [Figure 5D] FIG. 5D is another schematic view for explaining the method for manufacturing the light emitting device according to the embodiment. [Figure 6] FIG. 6 is a graph showing the results of an experiment measuring the light resistance of an adhesive. [Figure 7] FIG. 7 is a graph showing the measurement results of the light resistance of the adhesive. [Figure 8] FIG. 8 is a graph showing the measurement results of the light resistance of the adhesive. [Figure 9] FIG. 9 is a graph showing the measurement results of the light resistance of the adhesive. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In this specification or claims, polygons such as triangles and quadrilaterals are referred to as polygons. Polygons and shapes that have been processed with rounded corners, chamfers, corner removal, rounding, etc. are also included. In addition, the shape where processing is applied not only to the corners (edges) but also to the middle part of the edge is also called In other words, the polygon is left as the base, but partial processing is performed. The shapes shown are within the interpretation of "polygon" as used herein and in the claims. It shall be so.

[0011] This also applies to words that represent specific shapes, such as trapezoids, circles, and irregular shapes, not just polygons. The same is true for each edge that forms the shape. Even if the corners or middle parts are processed, the interpretation of the “side” includes the processed parts. In addition, "polygons" and "edges" that are not partially processed are distinguished from processed shapes. In such cases, the word "strict" shall be added, for example, "strict rectangle."

[0012] In addition, in the present specification or claims, the terms "up and down," "left and right," "front and back," "front and back," "front and back," and "back" are used interchangeably. These descriptions merely describe the relationship of relative position, orientation, direction, etc., and do not necessarily represent the relationship when used. The assignment does not have to match the assignment.

[0013] In addition, directions such as the X direction, the Y direction, and the Z direction are indicated by arrows in the drawings. The direction of the arrows is consistent across multiple figures relating to the same embodiment.

[0014] In addition, in this specification, when describing components, for example, the terms "member" and "part" are used. The term "material" refers to an object that is handled as a single unit. The object handled by the body can also be considered an object that is treated as a part in the manufacturing process. On the other hand, "part" refers to an object that does not have to be treated as a single unit. For example, The word "bu" is used when referring to a part of a component.

[0015] In addition, the above distinction between "components" and "parts" is based on the interpretation of the doctrine of equivalents, In other words, the term "member" in the claims does not indicate the intention to limit the scope of the invention to "members". The presence of a listed component does not, by itself, constitute a physical representation of that component. The applicant does not recognize that treating the device alone is essential to the application of the present invention. .

[0016] In addition, in the present specification or claims, a certain component may be a plurality of components, each of which may be When expressing something differently, the components are differentiated by adding "first" or "second" to the beginning of the component. In addition, there may be cases where the subject matter distinguished between the present specification and the claims differs. Therefore, the claims may include elements having the same appendix as those in this specification. Even if the subject matter specified by this element is the same between the present specification and the claims, It is possible that this will not be the case.

[0017] For example, in this specification, configurations that are distinguished by being labeled "first," "second," and "third" The elements are referred to as "first" and "third" in the present specification. When describing a range, the claims may be written as "first" and "second" for ease of reading. In this case, the elements are distinguished by adding "first" to the claims. Each of the components marked with "first" and "second" will be referred to herein as a "first" and a "third" Note that this rule is not limited to the application of components. It can also be applied rationally and flexibly to other subjects.

[0018] Hereinafter, an embodiment of the present invention will be described. Furthermore, with reference to the drawings, A specific embodiment for carrying out the present invention will be described. The embodiment for carrying out the present invention is as follows. However, the present invention is not limited to this specific form. That is, the illustrated embodiment is merely an example of the manner in which the present invention may be practiced. The sizes and positional relationships of the components shown in each drawing are for ease of understanding. Some figures may be exaggerated for illustrative purposes.

[0019] <Embodiment> A light emitting device 1 according to an embodiment will be described. FIGS. 1 to 9 show an exemplary embodiment of the light emitting device 1. 1 is a perspective view of the light emitting device 1. FIG. Note that the portion of the inner edge of the second upper surface 10B of the base 10 that overlaps with the optical member 70 is 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view taken along line III-III in FIG. 5A to 5D are cross-sectional views taken along line IV-IV of FIG. 6 to 9 are schematic diagrams showing the manufacturing process for explaining the adhesive against light. 1 is a graph showing the results of an experiment measuring resistance.

[0020] The light emitting device 1 includes a plurality of components. The components of the light emitting device 1 include a base 10, one or more light emitting devices 20, one or more submounts 30, one or more The reflecting member 40, the multiple wirings 60, the optical member 70, the first adhesive portion 80A, and the second adhesive portion 8 0B, is included.

[0021] The light emitting device 1 may include other components. For example, the light emitting device 1 may include: The light emitting device 1 may include a light emitting element other than the light emitting element 20. Some of the components may not be included.

[0022] In the following, first, each component of the light emitting device 1 will be described, and then the light emitting device 1 will be described. He explains.

[0023] (Base 10) The base 10 has a first upper surface 10A and a second upper surface 10B located above the first upper surface 10A. The second upper surface 10B surrounds the first upper surface 10A in a top view. The second upper surface 10B may be formed with a third upper surface 10C located between the upper surface 10A and the second upper surface 10B. The upper surface 10B surrounds the third upper surface 10C in a top view. The base 10 may have a lower surface, a plurality of outer surfaces, and having a plurality of inner surfaces.

[0024] The base 10 is formed to have a surface shape that forms a concave shape. The first upper surface 10A has a concave recess. The surface is one of a plurality of surfaces that define the recess. When viewed from above, the outer edge of the defined recess is rectangular. In the top view, the second top surface 10B is located outside the outer edge of the recess. The surfaces define a frame-shaped region (hereinafter, referred to as the frame-shaped region) that surrounds the first upper surface 10A in a top view. The second upper surface 10B can be a frame-shaped region.

[0025] When viewed from above, the outer edge shape of the second upper surface 10B is rectangular. The first and second sides are opposite each other, and the third side is opposite each other. The rectangle of the second upper surface 10B is formed by the long side, the third side, and the fourth side. In this case, the first and second sides are the long sides, and the third and fourth sides are the short sides. The frame-shaped region can be a region including the first side to the fourth side.

[0026] In addition, since the second upper surface 10B has an area, the rectangular frame shape is not a line shape but a band shape (having a width). Therefore, the first to fourth sides are not lines but have areas and are characterized by their shape. Each side may be substantially specified.

[0027] As an example, a straight line connecting a corner of the inner edge of the frame-shaped second upper surface 10B and a corner of the outer edge closest to this corner is Lines can be found at all corners and these lines can be used to identify the boundaries of each side. Alternatively, the area from the outer edge of the second upper surface 10B to a predetermined width is defined as a frame-shaped area, and the outer edges of each side are You can also specify the side by the area from the edge to a certain width. In this case, A part of the area of ​​the corner portion is shared between the shared sides. The length is equal to or more than 1 / 15 and equal to or less than 1 / 5 of the length of the outer shape of the second upper surface 10B in the direction perpendicular to the outer edge of the The width of the frame of the frame-shaped region can be expressed as the outer shape of the frame-shaped region in the direction perpendicular to the outer edge of the side. The length may be between one-fifteenth and one-fifth of the length of the

[0028] The base 10 can be configured to include a base portion 11 and a side portion 12. It may further include a lid portion 13. The base portion 11 has a first upper surface 10A. The side portion 12 is connected to the base portion 11 and surrounds the first upper surface 10A in a top view. A lid portion 13 is connected to the side portion 12.

[0029] The base 11, the side portion 12, and the cover portion 13 are each made of different materials, and are joined together by a The base 11 and the side portions 12 may be made of the same material. Alternatively, the side portion 12 and the cover portion 13 may be integrally formed of the same material. You may do so.

[0030] The base 11 has a convex shape. The upper surface of the protruding portion is the first upper surface 10A. The upper surface of the portion that is not covered can be the fourth upper surface 10D. The base 11 surrounds the first upper surface 10A. The base 11 may be formed mainly of a metal such as copper. do.

[0031] Here, the main material is the material that occupies the largest proportion by mass or volume in the target structure. In addition, when the target structure is formed from one material, In other words, when a material is the main material, it is the material that occupies the largest part of the This includes the possibility that the percentage of

[0032] The side portion 12 may be provided to connect to the fourth top surface 10D. The side wall portions corresponding to the two opposite sides of the rectangle are formed in a rectangular frame shape. The lead pins are provided so as to penetrate the side walls. The lead pins can be used as wiring. The side portion 12 is made of an alloy containing iron. An insulating material is provided between each lead pin and side portion 12, and side portion 12 and the lead pin are not electrically connected.

[0033] The lid portion 13 can be configured to include a frame member 13A and a light-transmitting member 13B. The lid portion 13 can be formed to have a second upper surface 10B. The lid portion 13 has a frame-shaped region. possible.

[0034] The frame member 13A may have a second upper surface 10B. The frame member 13A may form a frame-shaped region. The frame member 13A is joined to the side portion 12, and the light-transmitting member 13B is joined to the frame member 13A. The member 13A can be formed using a metal such as an alloy of iron and nickel as the main material. The frame member 13A may be made up of a plurality of parts. It can be formed using lath or the like as the main material.

[0035] For example, the base 11 and the side 12 may be made of aluminum nitride, silicon nitride, or oxide. It may be made of ceramics using aluminum, silicon carbide, or the like as the main material. For example, the lid portion 13 may be formed using sapphire or the like as a main material.

[0036] The base body 10 has a base portion 11, a side portion 12, and a lid portion 13, which define a closed space inside the base body 10. This closed space is an enclosed space in which the entry and exit of the substrate is substantially restricted. The enclosed space can be in an airtight state under a specific atmosphere. The inside of the sealed space may be substantially a vacuum state.

[0037] (Light emitting element 20) The light emitting element 20 emits light. The light emitting element 20 has an upper surface, a lower surface, and one or more The light emitting element has side surfaces, one or more of which serve as a light emitting surface from which light is emitted. 20 emits light from one or more emission points on the light emission surface. These points are called light emission points. A specific example of the light emitting element 20 is a semiconductor laser element.

[0038] The light emitting element 20 may be, for example, a light emitting element that emits blue light, a light emitting element that emits green light, or the like. Alternatively, a light emitting element that emits red light may be used. Alternatively, light emitting elements that emit light of other colors may be used.

[0039] Here, blue light is light whose emission peak wavelength is within the range of 420 nm to 494 nm. Green light has a peak emission wavelength in the range of 495nm to 570nm. Red light is defined as light whose peak emission wavelength is between 605nm and 750nm. This refers to light that is within the range of

[0040] Here, the semiconductor laser element will be described. The semiconductor laser element has, when viewed from above, The semiconductor laser element has a rectangular shape with one side facing the other as a long side and the other side facing the other as a short side. From the top surface, multiple semiconductor layers including an active layer are stacked. A side surface including one of the sides serves as an output end surface from which light is output. The light emitting end surface of the semiconductor laser element 20 can be regarded as a light emitting surface of the light emitting element 20. The area is larger than that of the output end face.

[0041] The light (laser light) emitted from the semiconductor laser element has a spreading effect. The light emitted from the semiconductor laser element is divergent light. The far-field pattern (hereafter referred to as "F") is an elliptical shape on a plane parallel to the emission end face of the laser element. The FFP is the shape of the emitted light at a position away from the output facet. These are the shape and light intensity distribution.

[0042] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light intensity distribution of the FFP, The light with the peak intensity is called the light traveling along the optical axis or the light passing through the optical axis. In the light intensity distribution of FFP, the peak intensity is 1 / e 2Light having an intensity of at least This will be called the main light.

[0043] The shape of the FFP of the light emitted from the semiconductor laser element is such that the lamination direction is perpendicular to the lamination direction. The lamination direction is the direction in which the active layer of the semiconductor laser element is stacked. The direction perpendicular to the stacking direction is the direction in which the semiconductor layers are stacked. The direction of the major axis of the elliptical shape of the FFP is the direction of the semiconductor laser element. The fast axis direction and the short axis direction of the molecule can also be called the slow axis direction of the semiconductor laser element.

[0044] The light emitted from the semiconductor laser element is divergent light. Here, the light intensity distribution of the FFP is Based on 1 / e of peak light intensity 2 The angle at which the light of a given optical intensity spreads is called the light spreading angle of a semiconductor laser element. The light divergence angle is 1 / e of the peak light intensity. 2 In addition to the light intensity, e.g. In the description of this specification, the term "light" is used simply to refer to the light intensity at half the light intensity at the center of the optical axis. The "divergence angle of the peak light intensity" refers to 1 / e 2 It refers to the spread angle of light at a given light intensity. Note that the spread angle in the fast axis direction is larger than the spread angle in the slow axis direction. can.

[0045] A semiconductor laser element that emits blue light or a semiconductor laser element that emits green light Examples of the nitride semiconductor include semiconductor laser devices. , GaN, InGaN, and AlGaN can be used. Laser elements include InAlGaP, GaInP, GaAs, and AlGaAs semiconductors. Examples include those containing a conductor.

[0046] (Submount 30) The submount 30 has a bottom surface, a top surface, and one or more side surfaces. The submount 30 has the smallest width in the vertical direction. The submount 30 is configured in a rectangular parallelepiped shape. The shape is not limited to a rectangular parallelepiped. The submount 30 may be made of, for example, aluminum nitride. It can be formed using silicon nitride or silicon carbide as the main material.

[0047] (Reflective member 40) The reflecting member 40 has a light reflecting surface that reflects light. The reflecting member 40 has a lower surface and an upper surface. The light reflecting surface is inclined with respect to the lower surface of the reflecting member 40. The light reflecting surface is flat and is not perpendicular or parallel to the bottom surface of the reflecting member 40. The light reflecting surface does not have to be flat. The angle of inclination does not have to be 45 degrees.

[0048] The reflecting member 40 can be formed by using glass, metal, or the like as a main material. Heat-resistant materials are recommended, such as quartz, glass such as BK7 (borosilicate glass), or aluminum. The reflecting member 40 is made of a metal such as silicon. If the main material is a reflective material, a light reflecting surface can be formed from the main material. When forming a light reflecting surface separately from the main material, for example, a metal film such as Ag or Al or T Forming dielectric multilayer films such as a2O5 / SiO2, TiO2 / SiO2, and Nb2O5 / SiO2 By forming a film, a light reflecting surface can be formed.

[0049] The reflectance of the light reflecting surface is 90% or more for the peak wavelength of the light irradiated onto the reflecting surface. The reflectance may be 95% or more. The reflectance here is 100% or less. Or less than 100%.

[0050] (Wiring 60) The wiring 60 is made of a conductor having a linear shape with both ends being joined. When the wiring 60 is connected to the wiring 60, both ends of the linear portion of the wiring 60 are connected to other components. The wiring 60 is used for electrical connection between the two components. Examples of metals that can be used include gold, aluminum, silver, and copper. include.

[0051] (Optical member 70) The optical member 70 has an upper surface, a lower surface, and a side surface. The optical member 70 has a lens surface. The optical member 70 has an optical characteristic area. This is an area where the optical characteristics change depending on the angle or position of incidence of light entering the area. For example, the optical properties of a lens surface change depending on the deviation from the optical axis or focus of the lens. For example, if the A-plane of sapphire is the incident plane of light, the incident The polarization characteristics change as the polarization direction of the incoming light rotates, so this can be considered an optical characteristic region.

[0052] The upper surface of the optical member 70 is flat, and one or more lens surfaces are provided on the upper surface side. One or more of the lens surfaces may be curved as opposed to planar. In this embodiment, the "top surface" of the optical member 70 does not refer to the lens surface. The optical members 70 are arranged in N rows and M columns (N is 1 or more, and M is a natural number of 2 or more). The lens surface may be provided on the lower surface side. The upper and lower surfaces are flat. The lens surfaces intersect with the upper surface. When viewed from above, the optical member 70 has a rectangular outer shape. The underside of 70 is rectangular.

[0053] Here, in the optical member 70, a portion overlapping with a plurality of lens surfaces in a top view is defined as a lens portion. In the optical member 70, the portion overlapping with the upper surface when viewed from above is called a non-lens portion. When the lens surface is divided into two parts by a virtual plane including the upper surface, the lens surface side is the lens-shaped part, and the lower surface side is the flat plate-shaped part. The lower surface of the lens portion is a part of the lower surface of the optical member 70.

[0054] The optical member 70 is formed so that the outer edge is octagonal in top view. The optical member 70 is made of a light-transmitting material such as glass or synthetic quartz. The insulating film can be formed by using a conductive material as the main material.

[0055] (Adhesive part 80) The adhesive portion 80 is formed by curing the adhesive. The adhesive portion 80 is formed by using different adhesives. The adhesive portion 80 is divided into a first adhesive portion 80A, By adding “first” and “second” to the adhesive portion 80B, the adhesive type can be specified. Similarly, different types of adhesives will be referred to as the first adhesive 81, The adhesives are referred to as second adhesives 82 and the like.

[0056] The second adhesive 82 is made of an adhesive having better resistance to light than the first adhesive 81. Here, "having excellent resistance to light" means that the light emitting device 1 is attached using an adhesive. This means that the adhesive has excellent resistance after it is manufactured. For example, the second adhesive 82 has a resistance to visible light (400 nm). 4. An adhesive having better resistance to ultraviolet rays (wavelength range of 760 nm or more and 760 nm or less) than the first adhesive 81 For example, the second adhesive 82 has a resistance to blue light that is higher than that of the first adhesive. An adhesive superior to 81 is used.

[0057] For example, a predetermined value of energy density [W / mm 2 ] light continues to be emitted. When exposed to light of the same energy density, the first If the adhesive portion 80A loses its adhesive strength in a shorter time than the second adhesive portion 80B, the second adhesive portion 80B is It can be said that the adhesive 82 has better resistance to light than the first adhesive 81.

[0058] For example, an ultraviolet curing resin adhesive is used as the first adhesive 81, and a thermal A curable resin adhesive can be used. However, the adhesive to be used is not limited to this. The combination of 81 and the second adhesive 82 is not limited to this. Adhesives made of silicone resins or acrylate resins can be used. An adhesive such as an epoxy resin or a silicone resin can be used.

[0059] Next, the light emitting device 1 will be described while explaining the manufacturing method.

[0060] (Light emitting device 1) The light emitting device 1 is manufactured by a process of disposing the light emitting element 20 on the base 10 and providing an adhesive to the base 10. and a step of fixing the optical member 70 to the base 10 with an adhesive. It can be manufactured by

[0061] The method for manufacturing the light emitting device 1 may include a step of preparing a base 10 (see FIG. 5A). When the container 10 has a lid 13, at least the lid 13 is connected to the base 11 via the side 12. The base 10 is prepared in an uncoated state. The base 10 is made up of a base portion 11, a side portion 12, and a lid portion. 13 may be provided as an independent member, or two members may be provided in a connected state. Good too.

[0062] The method for manufacturing the light emitting device 1 includes a step of arranging the light emitting element 20 on the base 10 (see FIG. 5B). One or more light emitting elements 20 are disposed on the first upper surface 10A of the base 10. The light emitting elements 20 are arranged in N rows and M columns (N is a natural number of 1 or more and M is a natural number of 2 or more). In the illustrated light emitting device 1, the row direction and the X direction are parallel, and the column direction and the Y direction are parallel. are parallel.

[0063] Light traveling in a direction parallel to the Y direction is emitted from one or more light emitting elements 20. The light emitted from the light emitting element 20 may include light traveling in a direction not parallel to the Y direction. When the light from the light emitting element 20 is a laser beam, the optical axis of the laser beam is parallel to the Y direction. Therefore, the light emitting element 20 can be disposed so that the slow axis direction of the laser light is parallel to the X direction. In addition, the light emitting element 20 is arranged so as to emit light traveling in a direction parallel to the Z direction. A child 20 may be placed.

[0064] In the step of arranging the light emitting element 20, not only the light emitting element 20 but also other components may be arranged. Other components include a submount 30, a reflecting member 40, and wiring 60. Before or after the light emitting element 20 is disposed, one or more of these may be The components to be arranged before the light emitting element 20 is arranged and the components to be arranged before the light emitting element 20 is arranged are arranged. A plurality of components may be placed, including a component placed after the element 20 is placed. .

[0065] The submount 30 can be provided in a one-to-one correspondence with the light emitting element 20. One light emitting element 20 is bonded to the submount 30, and the submount 30 is directly bonded to the base 10. A plurality of light emitting elements 20 may be bonded to one submount 30.

[0066] The reflecting members 40 can be provided in a one-to-one correspondence with the light emitting elements 20. Thus, the light emitted from one light-emitting element 20 is reflected. The light reflecting surface of the reflecting member 40 reflects at least a major portion of the light emitted from the reflecting member 40. The light reflected by the reflecting member 40 includes light traveling in a direction parallel to the Z direction. In addition, the light emitted from the plurality of light emitting elements 20 is reflected by one reflecting member 40. This may be allowed.

[0067] A plurality of wirings 60 are arranged to electrically connect the light emitting elements 20. Thus, one or more light emitting elements 20 are electrically connected to the base 10. A current path is formed through which a current flows to the light emitting element 20 through the lead pin of the body 10. The plurality of light emitting elements 20 may be electrically connected in series by wiring 60. However, the form of electrical connection does not have to be limited to such a series connection.

[0068] In the case where the base 10 has a lid portion 13, the light emitting element 20 is disposed on the first upper surface 10A, and then the lid The cover 13 closes the space in which the light emitting element 20 is disposed (see FIG. 5C). The frame member 13A of the base 10 is connected to the side portion 12 of the base 10 and joined. In the case where the base body 10 has a lid portion 13, the lid portion 1 can be connected and bonded in this manner. The work of mounting the light emitting element 20 on the base 10 is also included in the process of disposing the light emitting element 20 on the base 10. When arranging the components in a closed space, the light emitting element 20 and the After the other components are arranged, the device is covered with the lid 13.

[0069] In a state in which the light emitting element 20 is disposed on the base, the base 10 is Two sides are arranged parallel to the Y direction, and the third and fourth sides are arranged parallel to the X direction. Each of the elements 20 emits light in a direction toward the third side in top view.

[0070] When a plurality of light emitting elements 20 are arranged in N rows and M columns, the light emitting device 1 has a maximum number of rows or columns of In order to arrange four or more light emitting elements 20 side by side, It is preferable that 10A has a width of 8.0 mm or more in the direction in which the four or more light emitting elements 20 are arranged. For example, The width is kept at 8.0 mm or more and 19.0 mm or less, and 4 to 10 mm or less are provided on the first upper surface 10A. The lower light emitting element 20 can be arranged in a line. When the light emitting elements 20 and the reflective member 40 are arranged side by side, the first upper surface 10A is provided with four or more light emitting elements. It is preferable that the width of the light emitting element 20 is 12.0 mm or more in the direction in which the light emitting elements 20 are arranged. The width of the first upper surface 10A in the vertical direction can be 8.0 mm or more and 20.0 mm or less.

[0071] The method for manufacturing the light emitting device 1 includes a step of providing an adhesive on the base 10. Instead of providing the light emitting element 10, the light emitting element 1 may be provided on the optical member 70. The outer edge of the joining surface of the substrate 10 that is in contact with the adhesive is closer to the optical axis. The adhesive is larger than the outer edge of the optical member 70. Easy to do.

[0072] A first adhesive 81 and a second adhesive 82 are provided on the second upper surface 10B of the base 10. The adhesive 81 is provided at a plurality of locations on the second upper surface 10B. The first region and the second region of the frame region are provided with one each. In this state, the first adhesive 81 is cured and the first adhesive portion 8 is formed. That is, the first adhesive portion 80A is provided at a plurality of positions in the frame-shaped region. At least one of the first and second regions of the frame region is provided.

[0073] In this way, if the state is maintained, the "first adhesive 81" is replaced with the "first adhesive portion 80A". The same can be said for the adhesive 80 and the first adhesive 81. The same results can be obtained by replacing the "first adhesive portion 80A" and the "second adhesive 82" with the "second adhesive portion 80B". When it can be said that the above is the case, the expression "the state is maintained" is used.

[0074] The second adhesive 82 does not come into contact with the first adhesive 81 provided in the first region, and The first region is provided in at least two places so as to sandwich the first adhesive 81 provided in the first region. The first region is sandwiched between the second adhesive 82 provided at these two locations. The second adhesive 82 is provided on the outer side of the adhesive 8. Note that this state is the state where the adhesive hardens and the adhesive portion 8 becomes solid. It will be maintained even if it becomes 0.

[0075] The second adhesive 82 does not come into contact with the first adhesive 81 provided in the second region, and The second region is provided in at least two places so as to sandwich the first adhesive 81 provided in the second region. The second adhesive 82 is sandwiched between the two portions. In other words, when viewed from above, the second region The second adhesive 82 is provided on the outer side of the adhesive 8. Note that this state will continue until the adhesive hardens and the adhesive portion 8 becomes solid. It will be maintained even if it becomes 0.

[0076] When viewed from above, a virtual line connecting points on the first adhesive 81 provided in each of the first and second regions is The imaginary line segment (first line segment L1) passes through the first upper surface 10A. A virtual line segment (second line segment L2) connecting two points on the second adhesive 82 that sandwich the first adhesive 81 is ) does not pass through the first surface. When viewed from above, the first adhesive 81 provided in the second region is sandwiched between two first adhesives 82 and 83. The imaginary line segment (third line segment L3) connecting the points on the second adhesive 82 does not pass through the first surface. The adhesive 81 and the second adhesive 82 are provided so as to satisfy this positional relationship. This state is maintained even after the adhesive hardens to form adhesive portion 80.

[0077] When viewed from above, the width of the first adhesive 81 provided in the first region in a direction parallel to the second line segment is The direction parallel to the second line segment of the two second adhesives 82 sandwiching the first adhesive 81 provided in the region The width of the third line of the first adhesive 81 provided in the second region is larger than the width of the third line of the first adhesive 81 in the top view. The width in the direction parallel to the width of the first adhesive 81 provided in the second region is the width of the first adhesive 81 provided in the second region. The width of the first section is larger than the width of the second section in the direction parallel to the third line segment. The adhesive 81 and the second adhesive 82 provided at two locations on either side of the adhesive 81 are stable. In this state, the adhesive hardens to form an adhesive portion 80. is also maintained.

[0078] The width of the first adhesive 81 provided in the first region in a direction parallel to the second line segment is The range is from 0.9 to 1.1 times the width of the first adhesive 81 in the direction parallel to the third line segment. It is preferable that the adhesive 81 provided in the first region is within the range of 0.1 mm. The difference between the adhesive strength of the first adhesive 81 provided in the second region and the adhesive strength of the first adhesive 81 provided in the second region can be reduced, and the adhesive strength balance can be improved. This condition is maintained even after the adhesive hardens to form the adhesive portion 80. It is preferable that

[0079] Two second adhesives 82, when viewed from above, a line segment connecting the two second adhesives 82 is Two second adhesives 82 intersecting the first line segment on the first upper surface 10A are applied onto the second upper surface 10B. The area of ​​one of the two is preferably within a range of 0.9 to 1.1 times that of the other. This allows for well-balanced adhesion.

[0080] The first adhesive 81 is provided at one location on each of the first side and the second side. The agent 81 may be provided at a plurality of locations on the first side or the second side, or may be provided at a plurality of locations on the third side or the fourth side. The first region may be included in the region that forms the first side of the frame region. The second area is included in the areas that form the two sides.

[0081] In the top view, a virtual line passing through the midpoint of the first side and perpendicular to the first side is a first tangent line provided in the first region. The adhesive 81 and the first adhesive 81 provided in the second region are passed through. This is maintained even after the adhesive hardens to form the adhesive joint 80.

[0082] When viewed from above, the direction perpendicular to the first side is the row direction, and the direction parallel to the first side is the column direction. The light emitting elements 20 may be arranged in a matrix of at least two rows and at least two columns. The matrix arrangement above with two or more rows and columns is referred to as the first matrix arrangement.

[0083] In the first matrix arrangement, a plurality of light-emitting elements are arranged in one of the rows at both ends when viewed from above. A virtual straight line (hereinafter referred to as a first virtual line) passing through the element 20 and a virtual line (hereinafter referred to as a second virtual line) arranged in the other row A virtual line (hereinafter, referred to as a second virtual line) passing through the plurality of light emitting elements 20. In this state, the first adhesive 81 is applied. Note that, in this state, the adhesive has hardened to become the adhesive portion 80. This will be maintained even if

[0084] In the first matrix arrangement, when viewed from above, A virtual straight line (hereinafter referred to as a third virtual line) passing through a number of light-emitting elements and a virtual line (hereinafter referred to as a third virtual line) passing through the third side Between the imaginary straight line, one of two second adhesives 82 is provided, sandwiching the first adhesive 81. The first adhesive 81 is applied between the third virtual line and a virtual straight line passing through the inner edge of the third side. One of the two sandwiching second adhesives 82 is provided. Note that this state is when the adhesive has hardened. This is maintained even when the adhesive portion 80 is formed.

[0085] In the first matrix arrangement, when viewed from above, the multiplexer arranged in the row adjacent to the other row of the two end rows A virtual straight line (hereinafter referred to as a fourth virtual line) passing through the fourth light-emitting element and a virtual Between the imaginary straight line, the other of the two second adhesives 82 sandwiching the first adhesive 81 is provided. The first adhesive 81 is applied between the fourth virtual line and a virtual straight line passing through the inner edge of the fourth side. The other of the two sandwiching second adhesives 82 is applied. Note that this state is when the adhesive has hardened. This is maintained even when the adhesive portion 80 is formed.

[0086] When viewed from above, a virtual line passing through the inner edge of the third side and perpendicular to the first side, and a virtual line passing through the inner edge of the fourth side A first adhesive 81 and a second adhesive 82 are applied to a part of the frame-shaped region between a virtual line perpendicular to the first side and the first side. A second adhesive 82 is provided. A first adhesive 81 and a second adhesive 82 are provided in the area other than the frame area. The second adhesive 82 is not provided. In this state, the adhesive is cured to form the adhesive portion 80. This will be maintained even if

[0087] The method for manufacturing the light emitting device 1 includes a step of fixing the optical member 70 to the base 10 with an adhesive. This process includes a process of hardening the first adhesive 81 and a process of applying a second adhesive 82 after the first adhesive 81 has hardened. and curing the adhesive 82.

[0088] In the step of curing the first adhesive 81, the optical member 70 is adhered to the first adhesive 81 and the second adhesive 8 2, the first adhesive 81 is cured. The first adhesive portion 80A is formed by bonding the base 10 and the optical member 10 together via the first adhesive portion 80A. At this time, the first adhesive 81 is solidified, and the second adhesive 82 is solidified. In this state, the optical member 70 is fixed to the base 10. .

[0089] In the step of curing the second adhesive 82, the second adhesive 82 in contact with the optical member 70 is In this manner, the second adhesive 82 is cured to form the second adhesive portion 80B. The substrate 10 and the optical member 70 are bonded to each other via the second adhesive portion 80B. It is fixed to the base 10 via the first adhesive part 80A and the second adhesive part 80B.

[0090] In the manufacture of the light emitting device 1, the application amount [g] of the first adhesive 81 is The amount of the first adhesive 81 and the second adhesive 82 is larger than that of the first adhesive 81 and the second adhesive 82. The total amount of adhesive 81 applied [g] is greater than the total amount of adhesive 82 applied. This can improve the stability of the bond achieved by hardening the first adhesive 81.

[0091] The amount of the first adhesive 81 applied is preferably 30 mg or more and 70 mg or less. If the amount of the adhesive 81 applied is too small, the optical member 70 may not be stably attached to the substrate 10 by the first adhesive 81 alone. If the amount of the first adhesive 81 applied is too large, it will come into contact with the second adhesive 82 and become difficult to fix. The second upper surface 1 is adhered to the first adhesive 81 and the second adhesive 82 in a state where neither the first adhesive 81 nor the second adhesive 82 is cured. Since the first adhesive 81 and the second adhesive 82 are provided at 0B, it is preferable that the first adhesive 81 and the second adhesive 82 do not come into contact with each other.

[0092] The amount of the second adhesive 82 applied is preferably 20 mg or more and 35 mg or less. As with the adhesive 81, it is possible to stabilize the bond and reduce the risk of contact with the first adhesive 81. .

[0093] The optical member 70 has an octagonal outer edge when viewed from above, and one side of the octagon is located on the first side. The other side of the octagon can be positioned on the second side. The first adhesive portion 80A provided in the first region is sandwiched between both ends of one side of the octagon located above. Two second adhesive portions 80B are provided, each of which is located on the second side and is provided at both ends of one side of the octagon. Two second adhesive portions 80B are provided to sandwich the first adhesive portion 80A provided in the second region. By forming the second adhesive portion 80B at both ends of the side of the optical member 70, the optical member 70 is balanced. It can be well adhered.

[0094] The optical member 70 is fixed to the base 10 by applying an adhesive to the upper surface of the base 10. For example, the optical member 70 may be fixed to the side portion 12 of the base 10. In this case, the inner surface of the side portion 12 is used for joining with the optical member 70. If the adhesive has a certain degree of viscosity, the adhesive can be applied to the outer surface of the optical member 70 and the base 1. The optical member 70 can be fixed to the base 10 by interposing an adhesive between the inner surfaces of the optical member 70 and the base 10. In this case, a first region and a second region are provided on each of the opposing inner surfaces of the base body 10. Therefore, the light emitting device 1 according to the embodiment is not limited to the illustrated form. A first adhesive portion 80A and a second adhesive portion 80B are provided on a surface on which the first region is provided and a surface on which the second region is provided. 80B. The surface on which the first region is provided and the surface on which the second region is provided may be formed as follows. The faces can be made up of separate faces or one connected face. In any case, it can be said to be a surface located above the first upper surface 10A.

[0095] The light emitted from one or more light emitting elements 20 passes through the optical characteristic area of ​​the optical member 70. In the illustrated light emitting device 1, the light emitted from the light emitting element 20 is reflected by the reflecting member 40. The light is reflected by the lens surface of the optical member 70 and passes through the lens surface of the optical member 70. The light emitted from the light emitting element 20 passes through a plurality of lens surfaces arranged in a matrix of N rows and M columns. A major portion of the light from one light emitting element 20 passes through one lens surface.

[0096] The light passing through the optical member 70 is collimated and emitted from the optical member 70. The device 1 emits one or more collimated beams of light. By precisely directing light into the optical characteristic area, it is possible to perform the intended optical control. In the illustrated example of the light emitting device 1, the adhesive portion 80 is disposed on the rear surface of the optical member 70 when viewed from above. The optical characteristic area is provided in an area that does not overlap with the lens surface. This enables optical design that does not cause the adhesive portion 80 to interfere with the optical path.

[0097] Here, experimental results regarding the light resistance of the first adhesive 81 and the second adhesive 82 will be shown. FIG. 6 shows an optical member placed on a metal plate, and the optical member is bonded to a first adhesive 81 and a second adhesive 82. In the state where the first adhesive portion and the second adhesive portion are formed by bonding the first adhesive portion and the second adhesive portion, a laser beam is irradiated from above. When the light is emitted, passes through the optical components, and is irradiated onto the adhesive, the time it takes for each adhesive part to burn The time it takes for the adhesive to adhere to the adhesive is measured. / mm 2 The correlation between [time to burn] and [hours] is shown in the graph.

[0098] In this experiment, a thermocouple was placed near the adhesive joint, and the temperature change of the thermocouple was measured. In addition, the temperature was adjusted assuming the conditions when the light emitting device 1 is actually operated. The temperature of the thermocouple starts to rise sharply from a stable state at some point, by 2 to 3 degrees or so. The temperature rose above 100°C. When the adhesive was inspected, it was found to have turned black. .

[0099] Here, the measurement results for the plot P shown in FIG. 6 are shown in FIG. 7 to FIG. 9. Before starting the measurement, the temperature around the adhesive joint was adjusted to 75 degrees. After confirming that the temperature of the thermocouple had stabilized at around 75 degrees, the laser light was irradiated. As shown in the figure, the laser light irradiation started 30 to 40 seconds after the start of the measurement, This caused the temperature of the thermocouple to rise to around 82 degrees.

[0100] The temperature rise caused by laser irradiation slows down at around 82 degrees and stabilizes at a roughly constant temperature. As shown in Figure 7, the temperature gradually increased over a long period of time. When the temperature exceeded 1000 s, it began to rise rapidly from a stable state. At this time, it was confirmed that the adhesive joint had turned black.

[0101] From these results, it is assumed that the adhesive part was burned due to the temperature rise caused by the light irradiation. Therefore, the point at which the temperature of the thermocouple suddenly starts to rise from a stable state was defined as the point at which the bonded part was burned. The time it takes for the adhesive to burn is estimated as the time when the adhesive begins to burn. The results of six experiments are presented.

[0102] As can be seen from the results in FIG. 6, when the first adhesive 81 is used, the 2 ] The first adhesive part was burned within 100 hours of exposure to high energy density light. However, depending on the product in which the light-emitting device is installed, a light-emitting device with better light resistance may be used. There may be things you are asked to do.

[0103] In addition, the second adhesive 82 has better resistance to light than the first adhesive 81. Therefore, even if the first adhesive part is burned and loses its adhesive strength, In the optical device 1, the optical member 70 is maintained in a fixed state. Therefore, the light emitting device 1 can be provided with a stable adhesion even after the attachment.

[0104] The first adhesive 81 and the second adhesive 82 are not limited to those used in the experiment, and may be any suitable adhesive. The first adhesive 81 and the second adhesive 82 used in the light emitting device 1 are Based on the experimental results, the following combinations are considered:

[0105] For example, when exposed to light of a certain energy density, the adhesive will burn within 10 hours. The combination of the first adhesive 81, which has a high adhesion, and the second adhesive 82, which does not burn in 100 hours, is In the experiment shown in Figure 6, the 2 ] energy density light irradiation In contrast, the bonded portion using the first adhesive 81 was burned in 3 hours, while the bonded portion using the second adhesive 82 was burned in 3 hours. The resulting bond did not burn even after 250 hours.

[0106] For example, the adhesive joint will not burn within one hour when exposed to light of a certain energy density. The combination of the first adhesive 81, which is a material that can be used for a long time, and the second adhesive 82, which is a material that does not burn in 10 hours, is given. In the experiment shown in Figure 6, the 2 ] for light irradiation with an energy density of The bonded portion using the first adhesive 81 was burned in 50 minutes, while the bonded portion using the second adhesive 82 was burned in 50 minutes. The part did not burn even after 11 hours.

[0107] For example, the adhesive joint will burn within 30 minutes when exposed to light of a certain energy density. The combination of the first adhesive 81, which is a material that can be used for a long time, and the second adhesive 82, which is a material that does not burn in 5 hours, is given as an example. In the experiment shown in Figure 6, the 2 ] for light irradiation with an energy density of The bonded portion using the first adhesive 81 was burned in 15 minutes, while the bonded portion using the second adhesive 82 was burned in 15 minutes. It didn't burn even after 5 hours.

[0108] The second adhesive 82 has a resistance of at least 5.0 [W / mm 2 ] or less energy density The adhesive 81 has better resistance to light than the first adhesive 81 with respect to irradiation of light in the range. Although it depends on the environment in which the light emitting device 1 is installed, it is preferable that the light emitting device 1 has a light emission efficiency of at least 1.0 [W / mm 2 ]Less energy The adhesive 81 has better resistance to light than the first adhesive 81 when exposed to light in a range of energy densities. It may be a second adhesive 82 that is provided in the first adhesive layer 82 .

[0109] In the light emitting device 1, the second adhesive portion 80B is provided so as to sandwich the first adhesive portion 80A. As a result, even if the adhesive force of the first adhesive portion 80A is lost, the positional displacement of the optical member 70 is suppressed. The second adhesive portion 80B is disposed approximately symmetrically from the first adhesive portion 80A. In this way, the balance is maintained even if the first adhesive portion 80A has no adhesive force. For example, The second adhesive portion 80B that bonds the optical member 70 and the base body 10 is subjected to a load due to a temperature change in the operating environment. Even if a load is applied, one of the two second adhesive portions 80B will not be subjected to an excessively large load compared to the other. If the difference in load is large, a difference in adhesive strength occurs between the two second adhesive portions 80B. As described above, the optical member 70 may be rotated out of alignment. By bonding the optical member 70 with an adhesive, the optical characteristic area is effectively affected. This makes it possible to prevent misalignment, thereby realizing a light emitting device 1 with a stable adhesive state.

[0110] The embodiment of the present invention has been described above. The present invention is not strictly limited to a light emitting device. This is not something that can be realized without being limited to the external shape and structure of the light emitting device. For example, the invention may be applied without necessarily having a sufficient number of constituent elements. Some of the components of the light emitting device disclosed in the embodiment are not described in the scope of the claims. In such cases, some of the components may be replaced, omitted, modified in shape, or changed in material. The freedom of design by the manufacturer is allowed, and the invention described in the claims is applied. This specifies that: [Industrial Applicability]

[0111] The light emitting device described in the embodiment is applicable to a projector, an in-vehicle headlight, a head-mounted display, It can be used for sprays, lighting, displays, etc. [Explanation of symbols]

[0112] 1 Light emitting device 10 Base 10A 1st top surface 10B 2nd top surface 10C 3rd top surface 10D 4th top surface 11 Base 12 Side 13 Lid 13A Frame member 13B Translucent material 20 Semiconductor laser element 30 Submount 40 Reflective material 60 Wiring 70 Optical Components 80 Adhesive part 80A 1st adhesive part 80B 2nd adhesive part 81 First Adhesive 82 Second Adhesive

Claims

[Claim 1] A first surface and a second surface that is located above the first surface and surrounds the first surface in a top view. A substrate; one or more light emitting elements disposed on the first surface; an optical member bonded to the base and disposed at a position where a portion of the optical member overlaps with the first surface in a top view; 、 A second surface is provided between the second surface and the optical member, and the second surface is provided in a first region and a second region. a first adhesive portion formed by hardening a first adhesive, the first adhesive being provided on the first adhesive portion and fixing the optical member to the base; 、 The first adhesive portion provided in the first region is sandwiched between the first adhesive portion and the second adhesive portion. The first adhesive portion is provided in two places on the second surface, and is further provided in the second region. The first adhesive portion is provided at two locations on the second surface without contacting the first adhesive portion. a second adhesive portion in which a second adhesive different from the adhesive is cured; Equipped with When viewed from above, points on the first adhesive portions provided in the first region and points on the second adhesive portions provided in the second region are connected to each other. a virtual first line segment passing through the first surface, When viewed from above, two of the second adhesive portions sandwiching the first adhesive portion provided in the first region are a second imaginary line segment connecting the points does not pass through the first surface; When viewed from above, two of the second adhesive portions sandwiching the first adhesive portion provided in the second region are An imaginary third line segment connecting the points does not pass through the first surface, a width of the first adhesive portion provided in the first region in a direction parallel to the second line segment when viewed from above; The second line of the two second adhesive portions sandwiching the first adhesive portion provided in the first region greater than either of the widths parallel to the a width of the first adhesive portion provided in the second region in a direction parallel to the third line segment when viewed from above; The third line is formed between two of the second adhesive portions sandwiching the first adhesive portion provided in the second region. A light-emitting device that is larger than either of its widths in the directions parallel to the minus.

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