Component inspection device

Abstract

To measure a weight applied to an electron component with high accuracy by reducing a disturbance value which has to be measured as an additional real weight value caused by device oscillation or the like.SOLUTION: A component inspection device is a device that inspects an electron component while transporting it and houses the electron component into a housing member after classification into a fair quality and a defective quality. The component inspection device comprises: a sheet holding part that holds a sheet which has a front surface and a back surface and to which the electron component is adhered onto the front surface; a component holding part that is opposite to the front surface of the sheet held by the sheet holding part and holds the electron component; a push-up member that is opposite to a push-up position of the back surface of the sheet held by the sheet holding part; a driving part that moves the push-up member along a predetermined direction so as to go toward the component holding part; a stage that sucks a region of a circumference of the push-up position on the back surface of the sheet held by the sheet holding part; a weight inspection part that inspects a weight applied to the push-up member; and a position inspection part that inspects a position of the push-up member in the predetermined direction.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a component inspection apparatus. [Background technology]

[0002] Patent Document 1 discloses an electronic component delivery device that adsorbs electronic components attached to a wafer sheet onto a collet. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-41007 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a component inspection device that, when measuring the load applied to an electronic component using a load sensor, can measure the load applied to an electronic component with high accuracy by reducing disturbance values ​​that are measured as values ​​other than the true load value due to device vibration, etc. [Means for solving the problem]

[0005] A component inspection device according to one aspect of the present disclosure is a device that inspects electronic components while transporting them, classifies them into good products and bad products, and stores the electronic components in a storage member. The component inspection device includes a sheet holding unit that holds a sheet having a front surface and a back surface and having electronic components affixed to the front surface, a component holding unit that faces the front surface of the sheet held in the sheet holding unit and holds the electronic components, a push-up member that faces a push-up position on the back surface of the sheet held in the sheet holding unit, a drive unit that moves the push-up member along a predetermined direction toward the component holding unit, a stage that adsorbs an area around the push-up position on the back surface of the sheet held in the sheet holding unit, a load detection unit that detects a load applied to the push-up member, and a position detection unit that detects the position of the push-up member in the predetermined direction. Effect of the Invention

[0006] According to the present disclosure, when the load applied to an electronic component is measured using a load sensor, a component inspection device is provided that can measure the load applied to the electronic component with high accuracy by reducing disturbance values ​​that are measured as values ​​other than the true load value due to device vibration, etc. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a side view that illustrates a schematic diagram of an example of a part inspection device. [Diagram 2] FIG. 2 is a block diagram illustrating an example of a functional configuration of the controller. [Diagram 3] FIG. 3 is a block diagram illustrating an example of a hardware configuration of the controller. [Figure 4] FIG. 4 is a flowchart showing an example of a series of processes executed by the controller. [Diagram 5] 5(a) and 5(b) are schematic diagrams showing an example of the operation during thrusting. [Figure 6] 6(a) and 6(b) are schematic diagrams showing an example of the operation during thrusting. [Figure 7] FIG. 7 is a schematic diagram showing an example of an operation during thrusting. [Figure 8] FIG. 8 is a flowchart showing an example of a series of processes executed by the controller. [Figure 9] FIG. 9 is a flowchart showing an example of a series of processes executed by the controller. [Figure 10] 10(a) and 10(b) are schematic diagrams showing an example of the operation during thrusting. [Figure 11] FIG. 11 is a graph showing an example of the detected values ​​of the position and the load. [Figure 12] 12(a), 12(b), and 12(c) are schematic diagrams showing an example of the operation during thrusting. [Figure 13]FIG. 13 is a flowchart showing an example of a series of processes executed by the controller. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment will be described with reference to the drawings. In the description, the same elements or elements having the same functions are designated by the same reference numerals, and duplicated description will be omitted.

[0009] [Parts inspection equipment] FIG. 1 is a side view that typically illustrates a component inspection apparatus according to an embodiment. The component inspection apparatus 1 illustrated in FIG. 1 is a die sorter that inspects electronic components W while conveying them, classifies them into non-defective and defective components, and then accommodates the electronic components W in a housing member. The component inspection apparatus 1 may accommodate electronic components W that have been determined to be non-defective through inspection in the housing member. The component inspection apparatus 1 may accommodate electronic components W in the housing member in a state in which they can be removed. For example, after being accommodated in the housing member by the component inspection apparatus 1, the electronic components W are removed from the housing member and processed in an apparatus other than the component inspection apparatus 1.

[0010] The inspection performed by the component inspection apparatus 1 includes, for example, an appearance inspection or an electrical property inspection. In addition to inspecting the electronic components W, the component inspection apparatus 1 may also perform marking. The container that contains the electronic components W after inspection by the component inspection apparatus 1 is, for example, a carrier tape, a tray, or a wafer sheet. The electronic components W to be inspected by the component inspection apparatus 1 may be components that are formed in a front-end process of semiconductor manufacturing and then separated into individual components by dicing or the like. Compared to a mounter or bonder that mounts electronic components on a printed circuit board, the component inspection apparatus 1, which is a die sorter, operates at a high speed. In other words, compared to a mounter or bonder, the number of components processed per unit time in the component inspection apparatus 1 is greater.

[0011] The component inspection apparatus 1 includes, for example, an inspection unit 10, a supply unit 20, and a controller 100. The inspection unit 10 may have a function of transporting electronic components W, a function of inspecting the electronic components W, and a function of storing electronic components W determined to be non-defective based on the inspection results of the electronic components W in a storage member.

[0012] The inspection unit 10 receives electronic components W from the supply unit 20 and transports the electronic components W along a circular orbit around a predetermined central axis. The inspection unit 10 transports a plurality of electronic components W along the circular orbit. The central axis of the circular orbit may be a vertical axis. In FIG. 1, the Z-axis direction corresponds to the vertical direction. The electronic components W to be transported include main surfaces Wa and Wb that face opposite to each other.

[0013] The inspection unit 10 has a support section 12 and a plurality of component holding sections 14. In FIG. 1, one component holding section 14 is shown. The support section 12 supports the plurality of component holding sections 14 so that they are positioned on the circular orbit, and is rotated by a drive section around a vertical axis. Each of the plurality of component holding sections 14 holds an electronic component W. The support section 12 may rotate intermittently so as to repeatedly rotate and stop. The support section 12 rotates intermittently so that each of the plurality of component holding sections 14 stops at a predetermined stop position on the circular orbit. As a result, the electronic components W held by each of the plurality of component holding sections 14 are transported while repeatedly moving and stopping.

[0014] Each of the multiple component holders 14 stops in turn at one of the stopping positions on the circular orbit. Each time one of the component holders 14 is positioned at a predetermined stopping position on the circular orbit, that component holder 14 receives an electronic component W from the supply unit 20. Hereinafter, the stopping position at which the inspection unit 10 receives the electronic component W from the supply unit 20 is referred to as the "supply position." The inspection unit 10 may inspect the electronic component W at a stopping position located downstream of the supply position on the circular orbit. The inspection unit 10 may store the electronic component W determined (classified) as a non-defective product by inspection in a storage member at a stopping position located downstream of the stopping position at which the inspection of the electronic component W is performed on the circular orbit.

[0015] (Supply unit) The supply unit 20 is a unit that sequentially (at different timings) supplies each of the multiple electronic components W to the inspection unit 10. The supply unit 20 is disposed, for example, below the support unit 12. The supply unit 20 may include a pickup unit 30 and a component supply unit 50.

[0016] The pickup unit 30 is a so-called rotary pickup. The pickup unit 30 is configured to transport the electronic component W along a circular orbit (hereinafter referred to as "circular orbit CR2") different from the above-mentioned circular orbit along which the electronic component W is transported by the inspection unit 10, and to deliver the electronic component W to the component holder 14 of the inspection unit 10. The pickup unit 30 has, for example, a support unit 32, a plurality of component holders 34, a rotation drive unit 36, and a rotation position detection unit 38.

[0017] The support portion 32 supports the component holders 34 so as to be positioned on the circular orbit CR2. The component holders 34 supported by the support portion 32 are positioned on the circular orbit CR2. The support portion 32 is provided rotatably around a central axis Ax2 of the circular orbit CR2. The central axis Ax2 of the circular orbit CR2 may be a horizontal axis. In the example shown in FIG. 1, the central axis Ax2 of the circular orbit CR2 extends in a direction perpendicular to the paper surface. The component holders 34 may be fixed (attached) to the support portion 32 so as to be arranged at equal intervals along a circumference around the central axis Ax2.

[0018] Each of the multiple component holding units 34 holds an electronic component W. Each of the multiple component holding units 34 receives an electronic component W from the component supply unit 50 and holds the received electronic component W. The component holding units 34 may hold the electronic component W in any manner. Specific examples of the manner of holding the electronic component W include vacuum suction, electrostatic suction, and gripping. The component holding units 34 hold the electronic component W in a state facing the electronic component W along the radial direction of the circular orbit CR2. The component holding units 34 may hold one of the main surfaces Wa and Wb by suction, with one of the main surfaces Wa and Wb facing outward from the circular orbit CR2.

[0019] The component holding unit 34 has, for example, a suction unit 42, a holder 44, and a spring 46. The suction unit 42 (component holding unit) holds the electronic component W by suctioning either the main surface Wa or the main surface Wb of the electronic component W. The suction unit 42 is, for example, a suction rod formed to extend along the radial direction of the circular orbit CR2, and suctions the main surface Wa of the electronic component W at an end portion facing outward from the circular orbit CR2. When the suction unit 42 holds the main surface Wa by suction, the main surface Wa of the electronic component W faces the inside of the circular orbit CR2 (the central axis Ax2), and the main surface Wb of the electronic component W faces outward from the circular orbit CR2.

[0020] The holder 44 is fixed to the outer periphery of the support part 32 and holds the adsorption part 42 movably along the radial direction of the circular orbit CR2. The spring 46 is configured to resist the movement of the adsorption part 42 along the radial direction. The spring 46 may be a coil spring. When a force toward the inside of the circular orbit CR2 is applied to the adsorption part 42, the spring 46 applies a reaction force toward the outside of the circular orbit CR2 to the adsorption part 42.

[0021] The supply unit 20 may have a suction section 48 that generates a suction force for suctioning the electronic component W. The suction section 48 includes, for example, a suction path that connects a space formed inside the suction section 42 to a suction pump (vacuum pump). The suction section 48 switches the suction state of the suction section 42 between an on state and an off state by an opening / closing member such as an electromagnetic valve. The open / close state of the opening / closing member of the suction section 48 is switched according to an operation command from the controller 100. The supply unit 20 may have a plurality of suction sections 48 corresponding to the plurality of suction sections 42, respectively. In FIG. 1, one suction section 48 is shown, and the other suction sections 48 are omitted.

[0022] The rotation drive unit 36 ​​rotates the support unit 32 around the central axis Ax2 (central axis) of the circular orbit CR2 so as to move the multiple component holders 34 along the circular orbit CR2. The rotation drive unit 36 ​​includes a power source such as an electric motor. The rotation drive unit 36 ​​may include a servo motor, a direct drive motor (DD motor), or an induction motor. The rotation of the support unit 32 by the rotation drive unit 36 ​​moves the multiple component holders 34 (the multiple suction units 42) along the circular orbit CR2. As a result, the electronic components W held by the component holders 34 (suction units 42) are transported along the circular orbit CR2.

[0023] The rotation drive unit 36 ​​is controlled to repeatedly rotate and stop the support unit 32 at an angular pitch (angular pitch around the central axis Ax2) between adjacent component holders 34 on the circular orbit CR2. Hereinafter, the multiple positions at which the multiple component holders 34 (more specifically, the multiple suction units 42) are located when the rotation drive unit 36 ​​stops the support unit 32 are referred to as "multiple stop positions."

[0024] Of the multiple stopping positions, the component holder 34 (suction unit 42) arranged at the stopping position closest to the component supply unit 50 receives the electronic component W from the component supply unit 50. Here, an area including the stopping position closest to the component supply unit 50 and for the component holder 34 arranged at that stopping position to receive the electronic component W is defined as a "transfer area TA" (see FIG. 5(a)). The circular orbit CR2 is set to pass through the transfer area TA.

[0025] Each of the multiple component holding units 34 receives an electronic component W in the transfer area TA (receives the electronic component W in sequence at different times). Each of the multiple suction units 42 is arranged in sequence in the transfer area TA. Each time any of the suction units 42 is arranged in the transfer area TA, that suction unit 42 receives an electronic component W. The component holding unit 34 (suction unit 42) arranged at the stopping position closest to the support unit 12 among the multiple stopping positions passes the electronic component W to the component holding unit 14 of the inspection unit 10.

[0026] The rotational position detection unit 38 is a sensor that detects the rotational position of the support part 32 in the circumferential direction around the central axis Ax2 of the circular orbit CR2 (hereinafter simply referred to as the "circumferential direction"). The rotational position detection unit 38 detects, for example, information that indicates the position of a reference position of the support part 32 in the circumferential direction as the rotational position. The rotational position detection unit 38 may be provided inside the rotation drive unit 36 ​​that rotates the support part 32. The rotational position detection unit 38 may be any sensor that is capable of detecting the rotational position, and is, for example, a rotary encoder. The rotational position detection unit 38 may be a slit sensor.

[0027] The rotational position detection unit 38 may be provided to detect the rotation angle of a shaft member arranged along the central axis Ax2 of the support unit 32 (pickup unit 30) instead of inside the rotation drive unit 36. The rotational position detection unit 38 may be provided directly on the shaft member, or may be provided at a position away from the shaft member (central axis Ax2). For example, the rotational position detection unit 38 may be provided on a transmission member connected to the shaft member and including a belt and a pulley.

[0028] The component supply unit 50 sequentially (at different times) supplies the multiple electronic components W attached to the wafer sheet WS to the pick-up unit 30. The component supply unit 50 may be arranged to be aligned in one horizontal direction with the pick-up unit 30. A semiconductor wafer cut into multiple electronic components W by dicing is attached to one surface of the wafer sheet WS. Hereinafter, the surface of the wafer sheet WS to which the multiple electronic components W are attached is referred to as the "front surface WSa," and the surface of the wafer sheet WS opposite to the front surface WSa is referred to as the "back surface WSb." In other words, the wafer sheet WS has a front surface WSa and a back surface WSb, and one or more electronic components W are attached to the front surface WSa.

[0029] A main surface Wb of each of a plurality of electronic components W may be attached to the front surface WSa of the wafer sheet WS (see the enlarged view of FIG. 1). When viewing the front surface WSa of the wafer sheet WS, the plurality of electronic components W may be arranged in a matrix so as to be aligned vertically and horizontally. On the front surface WSa of the wafer sheet WS, the gap between adjacent electronic components W may be several tens of μm to several hundreds of μm. The component supply unit 50 includes, for example, a sheet holding unit 52, a sheet driving unit 56, a push-up member 60, a push-up driving unit 70, a stage 80, and a push-up driving unit 90.

[0030] The sheet holding unit 52 is configured to hold a wafer sheet WS (sheet). The sheet holding unit 52 holds the wafer sheet WS such that the surface WSa to which the multiple electronic components W are affixed faces the pickup unit 30. The sheet holding unit 52 holds the wafer sheet WS such that the main surface Wa of the electronic component W to be supplied among the multiple electronic components W faces the suction surface of the suction unit 42 of the component holding unit 34 arranged in the transfer area TA. The component holding unit 34 (suction unit 42) stopped at a stop position included in the transfer area TA faces the surface WSa of the wafer sheet WS held by the sheet holding unit 52.

[0031] The sheet holding unit 52 may hold the wafer sheet WS in a vertical state. The sheet holding unit 52 may hold the wafer sheet WS so that the plurality of electronic components W are two-dimensionally arranged in the vertical and horizontal directions. In the example shown in FIG. 1, the suction surface of the suction unit 42 in the transfer area TA and the main surface Wa of the electronic component W to be supplied face each other along the X-axis direction. The peripheral portion of the wafer sheet WS may be held by a ring holder 54. The ring holder 54 may hold the wafer sheet WS in a stretched (expanded) state so as to widen the intervals between the plurality of electronic components W. The sheet holding unit 52 may hold the wafer sheet WS via the ring holder 54.

[0032] The sheet driving unit 56 moves the sheet holding unit 52 in a direction along the surface WSa of the wafer sheet WS. As the sheet driving unit 56 moves the sheet holding unit 52, the position of the wafer sheet WS held by the sheet holding unit 52 changes. As the position of the wafer sheet WS changes, the positions of the electronic components W on the wafer sheet WS relative to the pickup unit 30 (transfer area TA) change. The sheet driving unit 56 moves the sheet holding unit 52 in each of the two directions in which the multiple electronic components W on the wafer sheet WS are arranged.

[0033] The sheet driving unit 56 includes, for example, a driving unit that moves the sheet holding unit 52 in a direction parallel to the central axis Ax2, and a driving unit that moves the sheet holding unit 52 in the Z-axis direction (vertical). By the movement of the wafer sheet WS by the sheet driving unit 56, one of the multiple electronic components W on the wafer sheet WS is arranged as the electronic component W to be supplied at a position facing the suction unit 42 located in the transfer area TA along the X-axis direction. Hereinafter, the position where the electronic component W to be supplied is arranged and facing the suction unit 42 located in the transfer area TA along the X-axis direction is defined as a "supply position P1."

[0034] The supply position P1 is set, for example, at the intersection of a virtual line passing through the central axis Ax2 and the center of the transfer area TA on a plane including the circular orbit CR2, and the surface WSa of the wafer sheet WS held by the sheet holding unit 52. The supply position P1 does not change even if the wafer sheet WS moves. The sheet driving unit 56 moves the sheet holding unit 52 so that each of the multiple electronic components W on the wafer sheet WS is sequentially placed at the above-mentioned supply position P1. The sheet driving unit 56 may move the sheet holding unit 52 by the distance (pitch) between the centers of adjacent electronic components W when sequentially placing each of the multiple electronic components W arranged in a row on the wafer sheet WS at the supply position P1.

[0035] The push-up member 60 faces a push-up position P2 on the back surface WSb of the wafer sheet WS held by the sheet holding section 52. The push-up position P2 is a position on the back surface WSb of the wafer sheet WS that corresponds to the supply position P1 (the electronic component W to be supplied) when a certain electronic component W is placed at the supply position P1. The push-up position P2 corresponds to a portion of the back surface WSb of the wafer sheet WS that overlaps with the supply position P1 (e.g., the center of the electronic component W to be supplied) when a certain electronic component W is placed at the supply position P1, as viewed from a direction perpendicular to the wafer sheet WS. When the wafer sheet WS moves, the push-up position P2 changes on the back surface WSb of the wafer sheet WS.

[0036] The push-up member 60 is formed to extend along the X-axis direction in which the delivery area TA and the supply position P1 are aligned. The push-up member 60 may be a pin member (needle-shaped member). The push-up member 60 may be composed of one or more needles. The tip of the push-up member 60 is formed so as to be able to push the push-up position P2 of the back surface WSb of the wafer sheet WS toward the suction portion 42 located in the delivery area TA. When the push-up member 60 pushes out the wafer sheet WS, the area where the tip of the push-up member 60 contacts the wafer sheet WS may be smaller than the area of ​​the main surface Wb. The push-up member 60 may be held by a holder member. The push-up member 60, the wafer sheet WS, the electronic component W to be supplied, and the suction portion 42 located in the delivery area TA are arranged in this order along the X-axis direction.

[0037] The push-up drive unit 70 (drive unit) moves the push-up member 60 along a predetermined direction toward the component holding unit 34. The push-up drive unit 70 moves the push-up member 60 toward the suction unit 42 arranged in the transfer area TA, and moves the push-up member 60 away from the suction unit 42 arranged in the transfer area TA. In this disclosure, movement toward the transfer area TA (the suction unit 42 arranged in the transfer area TA) is referred to as "advancement," and movement away from the transfer area TA (the suction unit 42 arranged in the transfer area TA) is referred to as "retraction." Furthermore, advancement and retreat may be collectively referred to as "advancement and retreat."

[0038] The push-up drive unit 70 is a drive unit that advances or retreats the push-up member 60 along the X-axis direction (a predetermined direction). The push-up drive unit 70 advances the push-up member 60, so that the push-up member 60 can advance the push-up position P2 on the back surface WSb of the wafer sheet WS toward the suction unit 42. The push-up drive unit 70 includes, for example, a motor 72 and an advancing / retreating rod 74. The motor 72 generates a driving force for driving the push-up member 60 and transmits the driving force to the advancing / retreating rod 74. The advancing / retreating rod 74 is connected to, for example, a holder member that holds the push-up member 60. The advancing / retreating rod 74 advances and retreats along the X-axis direction due to the driving force of the motor 72, so that the push-up member 60 advances and retreats along the X-axis direction.

[0039] The stage 80 is configured to adsorb an area around the push-up position P2 on the back surface WSb of the wafer sheet WS held by the sheet holding section 52. The area adsorbed by the stage 80 is an area corresponding to the electronic component W to be supplied that is arranged at the supply position P1 and at least a portion of each of the one or more electronic components W located around the electronic component W to be supplied. The one or more electronic components W located around the electronic component W to be supplied include electronic components W adjacent to the electronic component W to be supplied in the vertical direction, horizontal direction, or diagonal direction.

[0040] The stage 80 may be formed in a tubular shape (for example, a cylindrical shape) so as to extend parallel to the advancing and retreating direction of the push-up member 60. The stage 80 may be provided so as to be movable along the advancing and retreating direction of the push-up member 60. In this case, the stage 80 is formed so as to be able to adsorb the area around the push-up position P2 on the back surface WSb of the wafer sheet WS and to protrude the area toward the adsorption section 42 located in the transfer area TA. The stage 80 includes, for example, a main body 82 and a cover member 84. The main body 82 is a tubular member having a space therein, and one end portion close to the wafer sheet WS in the advancing and retreating direction is open. The cover member 84 is provided at the open end portion of the main body 82 and forms an internal space of the stage 80 together with the main body 82. The push-up member 60 is accommodated in the internal space of the stage 80.

[0041] The cover member 84 includes a tip surface capable of surface contact with the back surface WSb of the wafer sheet WS. As viewed from the X-axis direction, the size of the cover member 84 is larger than the size of one electronic component W. The cover member 84 is provided with a plurality of suction holes 86 for applying a suction force to the back surface WSb of the wafer sheet WS. Each of the plurality of suction holes 86 is formed so as to penetrate the cover member 84 along the X-axis direction. As viewed from the X-axis direction, one suction hole 86 is provided at a position corresponding to the push-up member 60, and the suction hole 86 has a size that allows the push-up member 60 to pass through. At least a part of the other suction holes 86 located around the suction hole 86 through which the push-up member 60 passes is formed at a position overlapping with the electronic component W located around the electronic component W to be supplied as viewed from the X-axis direction.

[0042] The component supply unit 50 has a suction unit 88. The suction unit 88 sucks gas inside the stage 80 so as to create a negative pressure in the internal space of the stage 80. The suction unit 88 includes, for example, a flow path connecting the internal space of the stage 80 to a suction pump (vacuum pump) and an opening / closing member such as an electromagnetic valve that opens and closes the flow path. The suction unit 88 switches the suction state of the stage 80 between an on state and an off state using, for example, an opening / closing member such as an electromagnetic valve. The opening / closing state of the opening / closing member of the suction unit 88 is switched in response to an operation command from the controller 100.

[0043] The stage 80 may be held by a holder member 89. The holder member 89 and the advancing / retracting rod 74 of the push-up drive unit 70 are configured so as not to interfere with each other. Even if the advancing / retracting rod 74 advances and retreats when the push-up member 60 is driven, the holder member 89 does not move.

[0044] The push-up driving unit 90 (second driving unit) moves the stage 80 along the above-mentioned predetermined direction (the direction in which the push-up driving unit 70 moves the push-up member 60) so as to move toward the component holding unit 34. The push-up driving unit 90 advances the stage 80 toward the suction unit 42 arranged in the transfer area TA, and moves the push-up member 60 backward so as to move away from the suction unit 42 arranged in the transfer area TA. The push-up driving unit 90 is a driving unit that moves the stage 80 forward and backward along the X-axis direction. Even if the stage 80 is driven by the push-up driving unit 90, the push-up member 60 does not move. As described above, the push-up driving unit 90 moves the stage 80 independently of the driving by the push-up driving unit 70 (driving the push-up member 60).

[0045] The push-up drive unit 90 advances the stage 80, thereby making it possible to protrude the area of ​​the back surface WSb of the wafer sheet WS with which the cover member 84 (the tip surface of the cover member 84) makes surface contact toward the suction unit 42. The push-up drive unit 90 includes, for example, a motor 92 and an advancing / retracting rod 94. The motor 92 generates a driving force for driving the stage 80 and transmits the driving force to the advancing / retracting rod 94. The advancing / retracting rod 94 is connected, for example, to a holder member 89 that holds the stage 80. The advancing / retracting rod 94 advances and retreats along the X-axis direction due to the driving force of the motor 92, whereby the stage 80 advances and retreats along the X-axis direction.

[0046] (Load detection section) The component inspection device 1 includes a load detection unit 22. The load detection unit 22 is a sensor that detects a load applied to the push-up member 60. The load detection unit 22 can detect the load applied to the push-up member 60 when the push-up member 60 contacts the rear surface WSb of the wafer sheet WS and protrudes the push-up position P2 toward the suction unit 42. The load detection unit 22 may be provided in the push-up drive unit 70 (advance / retract rod 74). The load detection unit 22 may detect the load by any method. The load detection unit 22 may be a mechanical sensor that detects a change in electrical resistance value, such as a strain gauge, or may be a load cell.

[0047] When the push-up member 60 pushes up the push-up position P2 and the electronic component W to be supplied is in contact with the suction portion 42, the push-up member 60 is subjected to a reaction force from the wafer sheet WS and a reaction force that the electronic component W receives from the suction portion 42. The load applied to the electronic component W when pushed up by the push-up member 60 is reflected in the detection value by the load detection portion 22. The load detection portion 22 may repeatedly detect the load acting on the push-up member 60 at a predetermined sampling period. The load detection portion 22 outputs information indicating the load applied to the push-up member 60 to the controller 100.

[0048] (Advance / retreat position detection section) The part inspection device 1 includes an advance / retract position detection unit 26 (position detection unit). The advance / retract position detection unit 26 is a sensor that detects the position of the push-up member 60 in the above-mentioned predetermined direction. The advance / retract position detection unit 26 may detect the position in the X-axis direction (predetermined direction) of any part of the push-up member 60 and a part that is connected to the push-up member 60 and driven together. The advance / retract position detection unit 26 detects, for example, the position in the X-axis direction of the tip of the push-up member 60. Even if the position of a part other than the tip of the push-up member 60 is detected, the position of the tip of the push-up member 60 in the X-axis direction can be obtained from the positional relationship between that part and the tip of the push-up member 60.

[0049] The advance / retract position detection unit 26 may use any method to detect the position of the thrust-up member 60. The advance / retract position detection unit 26 is, for example, an encoder installed in the motor 72 (for example, a servo motor) of the thrust-up drive unit 70. The advance / retract position detection unit 26 may be a linear encoder installed at any location of the thrust-up drive unit 70 instead of in the motor 72.

[0050] The advance / retract position detection unit 26 detects the position of the push-up member 60 in the X-axis direction at least during the period in which the push-up member 60 is driven by the push-up driving unit 70. The advance / retract position detection unit 26 may repeat detection of the position of the push-up member 60 in the X-axis direction at a predetermined sampling period. The advance / retract position detection unit 26 outputs information indicating the position of the push-up member 60 in the X-axis direction to the controller 100.

[0051] The component inspection apparatus 1 may include an advance / retract position detection unit 28 (second position detection unit). The advance / retract position detection unit 28 is a sensor that detects the position of the stage 80 in the above-mentioned predetermined direction. The advance / retract position detection unit 28 may detect the position in the X-axis direction (predetermined direction) of any part of the stage 80 and a part that is connected to the stage 80 and driven together. The advance / retract position detection unit 28 detects, for example, the position in the X-axis direction of the tip of the stage 80. The tip of the stage 80 corresponds to the surface of the cover member 84 that contacts the wafer sheet WS. Even if the position of a part other than the tip of the stage 80 is detected, the position in the X-axis direction of the tip of the stage 80 can be obtained from the positional relationship between that part and the tip of the stage 80.

[0052] The advance / retract position detection unit 28 may use any method to detect the position of the stage 80. The advance / retract position detection unit 28 is, for example, an encoder installed in the motor 92 (for example, a servo motor) of the thrust-up drive unit 90. The advance / retract position detection unit 28 may be a linear encoder installed at any location of the thrust-up drive unit 90 instead of in the motor 92.

[0053] The advance / retract position detection unit 28 detects the position of the stage 80 in the X-axis direction at least during the period in which the stage 80 is driven by the thrust-up driving unit 90. The advance / retract position detection unit 28 may repeat detection of the position of the stage 80 in the X-axis direction at a predetermined sampling period. The advance / retract position detection unit 28 outputs information indicating the position of the stage 80 in the X-axis direction to the controller 100.

[0054] The detection results of the advance / retract position detection unit 26 and the advance / retract position detection unit 28 are transmitted to the controller 100, thereby enabling the controller 100 to grasp the positional relationship between the push-up member 60 and the stage 80. Although details will be described later, the controller 100 detects an abnormality in the load applied to the electronic component W to be supplied, based on the detection results of the load detection unit 22, the advance / retract position detection unit 26, and the advance / retract position detection unit 28.

[0055] (controller) The controller 100 is composed of one or more control computers. The controller 100 controls the inspection unit 10, the supply unit 20, the load detection unit 22, the advance / retract position detection unit 26, and the advance / retract position detection unit 28 according to a predetermined control procedure so that predetermined processes are performed on the multiple electronic components W in order.

[0056] 2, the controller 100 has, as its functional configuration (hereinafter referred to as "functional modules"), a transport control unit 102, a holding control unit 104, a sheet position control unit 106, a first thrust-up control unit 108, a second thrust-up control unit 110, a load data acquisition unit 112, a threshold setting unit 114, and an abnormality detection unit 116. The processes executed by these functional modules correspond to the processes executed by the controller 100.

[0057] The conveyance control unit 102 causes the rotation drive unit 36 ​​to intermittently rotate the support unit 32 so that the multiple suction units 42 are sequentially positioned at multiple stop positions on the circular orbit CR2. As a result, the support unit 32 rotates around the central axis Ax2 so as to repeatedly rotate and stop. The conveyance control unit 102 causes the rotation drive unit 36 ​​to intermittently rotate the support unit 32 at the same angle pitch as the angle pitch between the adjacent suction units 42 on the circular orbit CR2. As a result, any one of the suction units 42 is sequentially positioned in the transfer area TA. The conveyance control unit 102 may control the rotation drive unit 36 ​​based on the detection result of the rotation position of the support unit 12 obtained from the rotation position detection unit 38.

[0058] The holding control unit 104 controls the suction unit 48 so that the suction unit 42 holds the electronic component W to be held. For example, after a suction unit 42 not holding an electronic component W is placed in the transfer area TA, when the suction unit 42 receives the electronic component W to be supplied from the wafer sheet WS, the holding control unit 104 switches the suction state of the suction unit 42 to an ON state by the corresponding suction unit 48. The holding control unit 104 may identify an individual suction unit 42 placed in the transfer area TA based on a detection result of the rotational position of the support unit 12 obtained from the rotational position detection unit 38. Then, the holding control unit 104 may control the suction unit 48 corresponding to the identified suction unit 42.

[0059] The sheet position control unit 106 controls the sheet driving unit 56 so that one electronic component W on the wafer sheet WS is placed at the supply position P1 every time any of the suction units 42 is placed in the transfer area TA. The sheet position control unit 106 performs the following control, for example, while a plurality of electronic components W arranged in a line on the wafer sheet WS are sequentially supplied to the pickup unit 30. After one electronic component W is supplied to the pickup unit 30, the sheet position control unit 106 may move the sheet holding unit 52 by the distance (pitch) between the centers of adjacent electronic components W so that the next electronic component W to be supplied is placed at the supply position P1.

[0060] The first thrust control unit 108 controls the thrust drive unit 70 to advance and retreat the thrust member 60 along the X-axis direction, so that the thrust member 60 moves toward the suction unit 42 arranged in the transfer area TA. The first thrust control unit 108 controls the thrust drive unit 70 to advance the thrust member 60 from the origin position until the thrust member 60 reaches a predetermined displacement amount. The first thrust control unit 108 controls the thrust drive unit 70 to retreat from the advanced position where the predetermined displacement amount is reached to the origin position.

[0061] When the push-up member 60 is disposed in the forward position, the push-up member 60 is capable of pushing up the push-up position P2 on the back surface WSb of the wafer sheet WS toward the suction portion 42. When the push-up member 60 is disposed in the origin position, the push-up member 60 is not capable of pushing up the push-up position P2 on the back surface WSb of the wafer sheet WS. The origin position of the push-up member 60 may be set so that the tip of the push-up member 60 is spaced from the wafer sheet WS in a state in which the push-up member 60 is held by the sheet holding portion 52 and is not pushed up by any member.

[0062] The second thrust control unit 110 controls the thrust drive unit 90 to advance and retreat the stage 80 along the X-axis direction, so that the stage 80 faces the suction unit 42 arranged in the transfer area TA. The second thrust control unit 110 controls the thrust drive unit 90 to advance the stage 80 from the origin position until the stage 80 reaches a predetermined displacement amount. The second thrust control unit 110 controls the thrust drive unit 90 to retreat from the forward position where the predetermined displacement amount is reached to the origin position. The second thrust control unit 110 may control the suction unit 88 so that the stage 80 is in a state in which it can suction a part of the back surface WSb of the wafer sheet WS during the thrust operation by the stage 80.

[0063] When the stage 80 is disposed in the forward position, the stage 80 is capable of pushing up the area around the push-up position P2 on the back surface WSb of the wafer sheet WS toward the suction portion 42. When the stage 80 is disposed in the origin position, the stage 80 is not capable of pushing up the area around the push-up position P2 on the back surface WSb of the wafer sheet WS. The origin position of the stage 80 may be set so that the tip of the stage 80 (the tip surface that comes into surface contact with the cover member 84) does not come into contact with the wafer sheet WS that is held by the sheet holding portion 52 and is not pushed up by any member.

[0064] The load data acquiring unit 112 acquires information indicating the load acting on the push-up member 60 from the load detecting unit 22 at least during the period when the push-up member 60 is performing the push-up operation. The load data acquiring unit 112 may continue to acquire the information indicating the load from the load detecting unit 22 while the part inspection apparatus 1 is operating.

[0065] The threshold setting unit 114 sets (changes) a threshold for detecting an abnormality in the load applied to the electronic component W depending on the individual suction unit 42 arranged in the delivery area TA. There are also individual differences in the springs 46 that apply a reaction force to the suction units 42. Therefore, when the electronic component W to be supplied is sandwiched between the suction unit 42 and the push-up member 60 and the push-up member 60 further presses the electronic component W, the reaction force that the suction unit 42 receives from the springs 46 may vary depending on the individual suction unit 42 and springs 46.

[0066] From the viewpoint of the individual differences, when detecting an abnormality in load by comparing the load applied to the electronic component W to be supplied with the threshold value, if the judgment is performed using the same threshold value, even if the load value is an acceptable load value, it may be judged as an abnormality, and even if the load value is an unacceptable load value, it may be judged as not an abnormality. The above possibility increases when load management is performed using a small value. The threshold value setting unit 114 may identify an individual suction unit 42 arranged in the transfer area TA based on the detection result of the rotational position of the support unit 12 obtained from the rotational position detection unit 38. Then, the threshold value setting unit 114 may set a threshold value corresponding to the identified suction unit 42. The controller 100 may store in advance threshold values ​​set for each of the multiple suction units 42.

[0067] Furthermore, as an individual difference in the suction portions 42 (component holding portions 34), there is also an individual difference in the length of the suction portions 42. If the length of the suction portions 42 differs between individuals, the timing at which the electronic component W begins to be sandwiched between the push-up member 60 and the suction portion 42 when the push-up member 60 protrudes differs. The controller 100 may store in advance information indicating the length of the suction portion 42 (for example, a correction value from a reference) for each of the multiple suction portions 42.

[0068] The abnormality detection unit 116 detects an abnormality in the load applied to the electronic component W to be supplied. For example, the abnormality detection unit 116 acquires the position (relative position) of the push-up member 60 with respect to the stage 80 based on the detection result by the advance / retract position detection unit 26. The abnormality detection unit 116 may acquire the position of the push-up member 60 with respect to the stage 80 by calculating the position based on the detection result by the advance / retract position detection unit 26 and the detection result by the advance / retract position detection unit 28. The abnormality detection unit 116 may determine the presence or absence of an abnormality in the load applied to the electronic component W based on information indicating the load acting on the push-up member 60 and the acquired result of the position of the push-up member 60 with respect to the stage 80.

[0069] The abnormality detection unit 116 may compare the detection result of the load detection unit 22 with a threshold value (for example, a threshold value set by the threshold value setting unit 114) while evaluating a period during which the tip of the push-up member 60 protrudes from the tip of the stage 80 based on the acquired result of the position of the push-up member 60 relative to the stage 80 and excluding periods other than the period. The abnormality detection unit 116 may determine that the load applied to the electronic component W is abnormal when the load acting on the push-up member 60 exceeds the threshold value during the evaluation period during which the tip of the push-up member 60 protrudes from the tip of the stage 80. The abnormality detection unit 116 may set the start point of the evaluation period to the time point at which the clamping of the electronic component W starts, which is specified based on the information (for example, the above-mentioned correction value) indicating the length stored for each individual suction unit 42 and the acquired result of the position of the push-up member 60 relative to the stage 80.

[0070] When an abnormality is detected by the abnormality detection unit 116, the controller 100 may perform a process to remove the electronic component W that was supplied when the abnormality was detected. In addition to or instead of determining an abnormality based on the detection value by the load detection unit 22, the controller 100 may record the detection value detected by the load detection unit 22 while the component inspection apparatus 1 is operating.

[0071] 3, the controller 100 includes a circuit 150. The circuit 150 includes one or more processors 152, a memory 154, a storage 156, an input / output port 158, and a timer 159. The storage 156 includes a computer-readable storage medium, such as a non-volatile semiconductor memory. The storage 156 stores a program for causing the controller 100 to control the inspection unit 10, the supply unit 20, the load detection unit 22, the advance / retract position detection unit 26, and the advance / retract position detection unit 28 in a preset control procedure. For example, the storage 156 stores a program for configuring each of the above-mentioned functional modules.

[0072] The memory 154 temporarily stores the programs loaded from the storage medium of the storage 156 and the results of calculations by the processor 152. The processor 152 executes the above programs in cooperation with the memory 154 to configure each functional module of the controller 100. The input / output port 158 ​​inputs and outputs electrical signals between the rotation drive unit 36, the seat drive unit 56, the push-up drive unit 70, the push-up drive unit 90, the load detection unit 22, the suction unit 48, the advance / retract position detection unit 26, and the advance / retract position detection unit 28, etc., in accordance with instructions from the processor 152. The timer 159 measures the elapsed time by, for example, counting reference pulses at a constant period. Note that the circuit 150 is not necessarily limited to one that configures each function by a program. For example, the circuit 150 may configure at least a part of the functions by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) that integrates the dedicated logic circuit.

[0073] [Control method] Next, as an example of a control method, a series of processes executed by the controller 100 will be described. Fig. 4 is a flowchart showing a series of processes executed by the controller 100 when one electronic component W is supplied from the component supply unit 50 to the pickup unit 30. While this series of processes is being executed, the load data acquisition unit 112 continues to acquire the load value from the load detection unit 22, and the controller 100 continues to acquire the position detection results from the advance / retract position detection unit 26 and the advance / retract position detection unit 28.

[0074] The controller 100 executes step S11 in a state before the electronic component W to be supplied is placed at the supply position P1. In step S11, for example, the sheet position control unit 106 controls the sheet drive unit 56 so that one electronic component W to be supplied is placed at the supply position P1. In conjunction with the execution of step S11, the transport control unit 102 controls the rotation drive unit 36 ​​so that one suction unit 42 to receive the electronic component W to be supplied is placed in the transfer area TA. The holding control unit 104 may control the suction unit 48 so that the suction unit 42 is ready to suck the electronic component W after the suction unit 42 is placed in the transfer area TA.

[0075] FIG. 5(a) shows a schematic view of the state after step S11 is performed. When step S11 is performed, the push-up member 60 and the stage 80 are each disposed at the origin position. The tip of the push-up member 60 disposed at the origin position does not protrude beyond the tip surface (surface that contacts the wafer sheet WS) of the cover member 84 of the stage 80 disposed at the origin position. The tip of the push-up member 60 and its vicinity may be located within the suction hole 86 formed in the cover member 84 of the stage 80. When the push-up member 60 and the stage 80 are each disposed at the origin position, no part (area) of the wafer sheet WS is pushed up, and the position in the X-axis direction where the entire wafer sheet WS is located at this time is indicated by "xs".

[0076] Next, the controller 100 executes step S12. In step S12, for example, the first thrust control unit 108 controls the thrust drive unit 70 to start the advancement of the thrust member 60. Also, the second thrust control unit 110 controls the thrust drive unit 90 to start the advancement of the stage 80. The second thrust control unit 110 may control the suction unit 88 to cause the stage 80 to suck the area around the thrust position P2 of the wafer sheet WS, and then cause the thrust drive unit 90 to start the advancement of the stage 80.

[0077] The first push-up control unit 108 and the second push-up control unit 110 respectively control the push-up drive unit 70 and the push-up drive unit 90 so as to maintain a state in which the tip of the push-up member 60 does not protrude beyond the tip surface of the cover member 84 of the stage 80. By executing step S12, the push-up member 60 and the stage 80 each start to move toward the suction unit 42 arranged in the transfer area TA. After executing step S12, the stage 80 advances so as to protrude the area toward the suction unit 42 while sucking the area around the push-up position P2 of the wafer sheet WS.

[0078] Next, the controller 100 executes steps S13 and S14. In step S13, for example, the second thrust control unit 110 waits until the stage 80 advances by the set value of the displacement amount. In step S14, for example, the second thrust control unit 110 controls the thrust driving unit 90 to stop the stage 80. By executing steps S13 and S14, the stage 80 advances by the set value of the displacement amount. The set value of the displacement amount for the stage 80 is set to a value at which the electronic component W to be supplied does not come into contact with the suction unit 42 arranged in the transfer area TA. That is, in a state after the stage 80 has been advanced by the set value of the displacement amount, the electronic component W to be supplied does not come into contact with the suction unit 42 arranged in the transfer area TA.

[0079] FIG. 5(b) shows a state in which the wafer sheet WS is pushed up by the advancement of the stage 80, and the stage 80 is stopped before the electronic component W to be supplied comes into contact with the suction portion 42. While steps S12 to S14 are being performed, the tip of the push-up member 60 is not in contact with the push-up position P2 on the back surface WSb of the wafer sheet WS. Furthermore, since the electronic component W to be supplied is not in contact with the suction portion 42, no load is applied to the electronic component W due to the push-up of the wafer sheet WS unless an abnormality occurs. Even when step S14 is performed, the advancement of the push-up member 60 continues. As the stage 80 stops and the advancement of the push-up member 60 continues, the tip of the push-up member 60 protrudes beyond the tip surface of the stage 80, and the tip of the push-up member 60 comes into contact with the push-up position P2 on the back surface WSb of the wafer sheet WS.

[0080] Next, the controller 100 executes steps S15 and S16. In step S15, for example, the first thrust control unit 108 waits until the thrust member 60 advances by the set value of the displacement amount. In step S16, for example, the first thrust control unit 108 controls the thrust driving unit 70 to stop the thrust member 60. By executing steps S12 to S16, the thrust member 60 advances by the set value of the displacement amount.

[0081] 6(a) shows a state where the stage 80 is stopped while the push-up member 60 continues to advance. The push-up member 60 protrudes from the tip surface of the stopped stage 80, and the electronic component W to be supplied comes into contact with the suction unit 42 arranged in the transfer area TA. The set value of the displacement amount of the push-up member 60 is set to a value at which the tip of the push-up member 60 comes into contact with the push-up position P2 and the electronic component W to be supplied receives a force (contact force) from both the suction unit 42 and the push-up member 60. The set value of the displacement amount of the push-up member 60 may be set so that an excessive load is not applied to the electronic component W to be supplied and a load is applied to the extent that no trouble occurs during the transfer of the electronic component W to be supplied.

[0082] In step S16, for example, the first push-up control unit 108 controls the push-up driving unit 90 so that the stage 80 starts to move backward in synchronization with the stop of the push-up member 60. When the push-up member 60 comes into contact with the push-up position P2, the detection value of the load detection unit 22 reflects the reaction force acting from the suction unit 42 to the electronic component W to be supplied, which is caused by the push-up of the push-up member 60. In addition, when the push-up member 60 continues to move forward after coming into contact with the push-up position P2, the detection value of the load detection unit 22 also reflects the reaction force that the suction unit 42 arranged in the transfer area TA receives from the spring 46.

[0083] When the push-up member 60 stops and pushes up the push-up position P2 of the wafer sheet WS toward the suction portion 42, the stage 80, which is sucking the periphery of the push-up position P2, retreats, causing a part of the electronic component W to be supplied to start peeling off from the wafer sheet WS. When the push-up position P2 is set to be located approximately at the center of the electronic component W to be supplied, for example, the electronic component W starts to peel off from the peripheral region of the main surface Wb (it is released from the state of being attached to the wafer sheet WS). Fig. 6(b) illustrates an example of a part of the electronic component W to be supplied peeling off from the wafer sheet WS.

[0084] Next, the controller 100 executes step S17. In step S17, for example, the controller 100 waits until a predetermined waiting time has elapsed since execution of step S16. The waiting time is set in advance by an operator or the like, and is set, for example, to a time during which the retreating stage 80 does not reach the origin position. Note that in FIG. 6(b), in order to clearly show the state in which the wafer sheet WS is peeled off, a state in which the push-up member 60 stops in a pushing-up state and the stage 80 retreats to the origin position is illustrated.

[0085] Next, the controller 100 executes step S18. In step S18, for example, the first push-up control unit 108 controls the push-up drive unit 70 so that the push-up member 60 starts to retreat. At the start of execution of step S18, the stage 80 is retreating. By executing step S18, a part of the wafer sheet WS that was pushed up toward the suction unit 42 from the position xs starts to return to the position xs. Since the suction unit 42 is adsorbing the electronic component W to be supplied, the entire main surface Wb of the electronic component W is peeled off from the front surface WSa of the wafer sheet WS. Since the retreat of the stage 80 is started and continued before the execution of step S18, a part of the area of ​​the main surface Wa of the electronic component W to be supplied has already been peeled off from the front surface WSa of the wafer sheet WS, so that the entire main surface Wb of the electronic component W is easily peeled off from the front surface WSa of the wafer sheet WS.

[0086] Next, the controller 100 executes step S19. In step S19, for example, the first push-up control unit 108 waits until the push-up member 60 retreats to the origin position. When the push-up member 60 reaches the origin position, the first push-up control unit 108 controls the push-up drive unit 70 to stop the push-up member 60. During the wait in step S19, the stage 80 reaches the origin position first, and the second push-up control unit 110 controls the push-up drive unit 90 to stop the stage 80. By executing step S19, as shown in FIG. 7, the push-up member 60 (the stage 80 and the push-up member 60) moves to the origin position, the wafer sheet WS is not pushed up, and the electronic component W is delivered to the suction unit 42.

[0087] Next, the controller 100 executes step S20. In step S20, for example, the abnormality detection unit 116 judges whether or not the detection value of the load detection unit 22 has exceeded a threshold value. The abnormality detection unit 116 may calculate (obtain) the relative position of the push-up member 60 with respect to the stage 80 from the detection results of the advance / retract position detection unit 26 and the advance / retract position detection unit 28, and specify a target period during which the tip of the push-up member 60 protrudes beyond the tip of the stage 80, among the periods during which a series of processes of steps S11 to S19 have been executed. The abnormality detection unit 116 may judge whether or not the detection value of the load detection unit 22 has exceeded a threshold value during the target period, without considering the detection value of the load detection unit 22 during periods other than the target period. At this time, the threshold value used for the judgment may be set by the threshold setting unit 114 according to the suction unit 42 specified based on the detection result by the rotational position detection unit 38.

[0088] This completes the series of processes executed when one electronic component W is supplied to the pick-up unit 30. After completing this series of processes, the controller 100 may continue the series of processes in steps S11 to S20 with another electronic component W, which is a different individual, as the supply target. The controller 100 may control the pick-up unit 30 and the inspection unit 10 so that the electronic component W supplied to the pick-up unit 30 is supplied from the pick-up unit 30 to the inspection unit 10. The controller 100 may control the inspection unit 10 so as to transport, inspect, and accommodate the electronic component W supplied to the inspection unit 10 in a housing member. When executing these processes, the controller 100 may determine whether the electronic component W is a non-defective or not according to the inspection result, and then accommodate the electronic component W determined to be a non-defective by the inspection unit 10 in the housing member, and eject or accommodate the electronic component W determined to be a non-defective in a member other than the housing member.

[0089] [Variations] The above-described series of processes shown in FIG. 4 is an example and can be modified as appropriate. In the above-described series of processes, the controller 100 may execute one step and the next step in parallel, or may execute each step in an order different from the above-described example. The controller 100 may execute a process with content different from the above-described example in any step. In steps S17 and S18, the controller 100 may control the push-up driving unit 70 to start the retraction of the push-up member 60 after the retraction of the stage 80 is completed.

[0090] The controller 100 may execute a series of processes shown in Figures 8 and 9. In this series of processes, the controller 100 first executes steps S31 and S32, similar to steps S11 and S12 shown in Figure 4 (see Figure 8).

[0091] Next, the controller 100 executes steps S33 and S34. In step S33, for example, the second thrust control unit 110 waits until the thrust member 60 and the stage 80 advance by a first set amount from the origin position. The first set amount is preset to a value at which the electronic components W to be supplied do not come into contact with the suction unit 42 even if the stage 80 thrusts up the wafer sheet WS. In step S34, for example, the first thrust control unit 108 controls the thrust drive unit 70 to stop the thrust member 60, and the second thrust control unit 110 controls the thrust drive unit 90 to stop the stage 80.

[0092] Next, the controller 100 executes step S35. In step S35, for example, the controller 100 waits until a predetermined set time has elapsed from the completion of step S34. This set time is, for example, previously determined by an operator. When the thrust-up driving unit 70 starts to operate when the thrust-up member 60 starts to advance, a disturbance component may occur in the detection value of the load detection unit 22 due to the influence of various members included in the thrust-up driving unit 70. The set time is set to a degree that can reduce the disturbance component caused by the start of the operation of the thrust-up driving unit 70. In one example, the set time is several milliseconds to several tens of milliseconds.

[0093] Next, the controller 100 executes steps S36 and S37. In step S36, for example, the first thrust control unit 108 controls the thrust drive unit 70 to resume the advance of the thrust member 60, and the second thrust control unit 110 controls the thrust drive unit 90 to resume the advance of the stage 80. In step S37, for example, the second thrust control unit 110 waits until the stage 80 advances by a second set amount from the origin position. Alternatively, the first thrust control unit 108 may wait until the thrust member 60 advances by an amount corresponding to the second set amount. The second set amount is set to a value at which the electronic component W to be supplied contacts the suction unit 42. FIG. 10(a) shows a state in which the electronic component W to be supplied contacts the suction unit 42 arranged in the transfer area TA due to the thrust by the stage 80.

[0094] Next, the controller 100 executes steps S38 and S39. In step S38, for example, the first thrust control unit 108 controls the thrust driving unit 70 to stop the thrust member 60, and the second thrust control unit 110 controls the thrust driving unit 90 to stop the stage 80. In step S39, for example, the controller 100 waits until a predetermined set time has elapsed from the completion of step S38. This set time is, for example, predetermined by an operator, and is, for example, several milliseconds to several tens of milliseconds.

[0095] Next, the controller 100 executes step S40. In step S40, for example, the first thrust control unit 108 controls the thrust driving unit 70 so as to resume the forward movement of the thrust member 60. At the time of execution of step S40, the state in which the stage 80 is stopped continues.

[0096] Next, as shown in FIG. 9, the controller 100 executes steps S41 and S42. In step S41, for example, the first thrust control unit 108 waits until the thrust member 60 advances from the origin position by a third set amount. The third set amount is set, for example, so that the thrust member 60 contacts the rear surface WSb (thrust position P2) of the wafer sheet WS when the thrust member 60 moves by that set amount. In step S42, for example, the first thrust control unit 108 controls the thrust drive unit 70 to stop the thrust member 60. At the time of execution of step S42, the state in which the stage 80 is stopped continues.

[0097] Next, the controller 100 executes steps S43 and S44. In step S43, for example, the controller 100 waits until a predetermined set time has elapsed since the completion of step S42. This set time is, for example, predetermined by an operator, and is, for example, several milliseconds to several tens of milliseconds. In step S44, for example, the second thrust control unit 110 controls the thrust driving unit 90 so as to start the retreat of the stage 80. At the time of execution of step S44, the state in which the thrust member 60 is stopped continues. With the start of the retreat of the stage 80, the thrust member 60 transitions to a state in which it protrudes from the stage 80, as shown in FIG. 10(b).

[0098] Next, the controller 100 executes step S45. In step S45, for example, the controller 100 waits until a predetermined set time has elapsed since the completion of step S44. This set time is, for example, predetermined by an operator, and is, for example, several milliseconds to several tens of milliseconds. During this time, the push-up member 60 stops and the stage 80 retreats, so that a part (for example, a peripheral region) of the main surface Wb of the electronic component W is peeled off from the wafer sheet WS.

[0099] Next, the controller 100 executes step S46. In step S46, for example, the first thrust control unit 108 controls the thrust drive unit 70 to start the retreat of the thrust member 60. At the time of execution of step S46, the retreat of the stage 80 continues. Then, when the stage 80 reaches the origin position, the controller 100 executes step S47. In step S47, for example, the second thrust control unit 110 controls the thrust drive unit 90 to stop the stage 80. After that, when the thrust member 60 reaches the origin position, the controller 100 executes step S48. In step S48, for example, the first thrust control unit 108 controls the thrust drive unit 70 to stop the thrust member 60.

[0100] Next, the controller 100 executes step S49. In step S49, for example, the abnormality detection unit 116 determines whether or not the detection value detected by the load detection unit 22 exceeds a threshold value during the target period. For example, based on the detection results of the advance / retract position detection unit 26 and the advance / retract position detection unit 28, the abnormality detection unit 116 sets the target period to a period during which the push-up member 60 protrudes from the stage 80 and the electronic component W is sandwiched between the push-up member 60 and the suction unit 42.

[0101] Fig. 11 shows a schematic example of the detection results of the advance / retract positions and load values ​​of each member while the series of processes shown in Fig. 8 and Fig. 9 are being performed by the controller 100. The upper half of Fig. 11 shows a graph representing the time change in the detection results (encoder values) of the positions of the push-up member 60 and the stage 80 in the X-axis direction. The lower half of Fig. 11 shows a graph representing the time change in the detection results (detection values ​​by the load detection unit 22) of the load acting on the push-up member 60.

[0102] In the portion indicated by "a" in the graph showing the position detection results, the push-up member 60 and the stage 80 are both advancing. In the portion indicated by "b" in the graph, the push-up member 60 and the stage 80 are temporarily stopped before the electronic component W to be supplied comes into contact with the suction portion 42. As the push-up member 60 and the stage 80 temporarily stop, vibrations and the like caused by contact between the mechanical components within these members are stabilized. In the portion indicated by "c" in the graph, the electronic component W to be supplied comes into contact with the suction portion 42, and the advancement of the stage 80 stops. As the advancement of the push-up member 60 continues, the positions of the tip of the push-up member 60 and the tip of the stage 80 in the X-axis direction approximately coincide with each other, and the push-up member 60 stops.

[0103] In the portion indicated by "d" in the graph showing the position detection results, as the stage 80 starts to move backward, the tip of the push-up member 60 protrudes from the upper surface of the stage 80, and the push-up member 60 comes into contact with the wafer sheet WS and pushes it up. As a result, the electronic component W (more specifically, the electronic component W and the wafer sheet WS) becomes sandwiched between the push-up member 60 and the suction portion 42. In the portion indicated by "e" in the graph, the push-up member 60 and the stage 80 are both moving backward.

[0104] In the portion indicated by "A" on the graph showing the change in load value over time, a vibration-like change in load value is observed due to the effect of contact between mechanical parts in the thrust drive unit 70 when the thrust member 60 starts to operate. A vibration-like change in load value can also be observed in the time period prior to the portion indicated by "A". In the portion indicated by "C" on the graph, the effect of vibration of the thrust member 60 or mechanical parts in the thrust drive unit 70 when the thrust member 60 is stopped is observed.

[0105] In the graph shown in FIG. 11, a period (target period) that is the target for determining whether or not there is an abnormality in the load applied to the electronic component W is indicated by "Te". The start time of the target period Te is set, for example, at the time when the position of the tip of the push-up member 60 protrudes beyond the tip of the stage 80 as the stage 80 starts to move backward (the time when the protruding state starts). The end time of the target period Te is set, for example, at the time when the tip of the push-up member 60 reaches a position where the electronic component W is pushed up by the push-up member 60 after the push-up member 60 starts to move backward and the push-up member 60 is assumed to be maintained in contact with the wafer sheet WS. The end time of the target period Te may be set at a time when a predetermined time has elapsed from the time when the push-up member 60 starts to move backward. In either case, the target period Te is set after the position of the tip of the push-up member 60 protrudes beyond the tip of the stage 80.

[0106] In the graph of the load value, "Fth" represents a threshold value used to determine whether or not there is an abnormality. The threshold value Fth may be set for each individual suction unit 42 by the threshold value setting unit 114. The abnormality detection unit 116 may determine whether or not the detection value by the load detection unit 22 exceeds the threshold value Fth during the target period Te. When the detection value by the load detection unit 22 exceeds the threshold value Fth during the target period Te, the abnormality detection unit 116 may determine that the load acting on the electronic component W to be supplied is abnormal, and when the detection value by the load detection unit 22 does not exceed the threshold value Fth, the abnormality detection unit 116 may determine that the load acting on the electronic component W to be supplied is not abnormal. In this case, even if the detection value by the load detection unit 22 exceeds the threshold value Fth during a period other than the target period Te, the abnormality detection unit 116 determines whether or not there is an abnormality using the detection value of the load only during the target period Te. In the example shown in FIG. 11, since the load value does not exceed the threshold value Fth in the portion indicated by "B", it is determined that there is no abnormality.

[0107] The controller 100 may omit steps S33 to S36 in the series of processes shown in Fig. 8 and Fig. 9. In other words, the controller 100 does not need to execute control to temporarily stop the push-up member 60 and the stage 80 in the middle of their advancement before the electronic component W to be supplied comes into contact with the suction portion 42.

[0108] The component inspection device 1 may include a load detection unit 24 in addition to the load detection unit 22 (see FIG. 10(a) or FIG. 10(b)). The load detection unit 24 (second load detection unit) is a sensor that detects a load applied to the stage 80. The load detection unit 24 can detect a load applied to the stage 80 when the stage 80 advances and protrudes the area around the push-up position P2 of the back surface WSb of the wafer sheet WS toward the suction unit 42. The load detection unit 24 may be provided in the push-up drive unit 90 (advance and retreat rod 94). The load detection unit 24 may be a sensor that detects a load by any method. The load detection unit 24 may be a mechanical sensor that detects a change in an electrical resistance value such as a strain gauge, or may be a load cell. The load detection unit 24 may repeat detection of a load acting on the stage 80 at a predetermined sampling period. The load detection unit 24 outputs information indicating the load applied to the stage 80 to the controller 100.

[0109] The load data acquisition unit 112 continues to acquire load values ​​from the load detection unit 24 in addition to the load detection unit 22. The load data acquisition unit 112 acquires information indicating the load acting on the stage 80 from the load detection unit 24 at least during the period when the stage 80 is performing the push-up operation. The load data acquisition unit 112 may continue to acquire information indicating the load from the load detection unit 24 while the part inspection apparatus 1 is operating.

[0110] In the component inspection device 1 equipped with the load detection unit 24, the controller 100 may execute the series of processes of steps S11 to S20 described above, or may execute the series of processes of steps S31 to S39 described above. The abnormality detection unit 116 may detect an abnormality acting on the electronic component W based on information indicating the load acting on the stage 80. In the series of processes described above, before the stage 80 pushes up the wafer sheet WS and the electronic component W to be supplied contacts the suction unit 42, the load acting on the electronic component W is not reflected in the detection value of the load detection unit 24, but the reaction force acting from the wafer sheet WS to the stage 80 is reflected in the detection value. However, if the electronic component W to be supplied contacts the suction unit 42 while the stage 80 is pushing up the wafer sheet WS for some reason, the load associated with the contact (abnormal contact) may be reflected in the detection value of the load detection unit 24.

[0111] The abnormality detection unit 116 may determine that the load applied to the electronic component W is abnormal (that the electronic component W has made abnormal contact) when the load acting on the stage 80 exceeds a predetermined threshold. The abnormality detection unit 116 may determine that there is a possibility that an abnormal load has acted on the electronic component W when the detection value of the load detection unit 22 exceeds the threshold Fth or when the detection value of the load detection unit 24 exceeds a predetermined threshold during the target period Te. Different thresholds may be used for the abnormality determination based on the detection value of the load detection unit 22 and the abnormality determination based on the detection value of the load detection unit 24.

[0112] When the load detection unit 24 is provided and the series of processes shown in Fig. 8 and Fig. 9 are executed, the controller 100 may determine the presence or absence of an abnormality using the detection value of the load detection unit 24 obtained after execution of step S36. In this case, the determination can be made by reducing the influence of disturbance components reflected in the detection value of the load detection unit 24 when the thrust drive unit 90 starts operating. Therefore, it is possible to improve the accuracy of determining the presence or absence of an abnormality. Examples of causes of disturbance components that may be included in the detection value of the load detection unit 24 include contact between members included in the thrust drive unit 90, sliding resistance of movable parts included in the thrust drive unit 90, and vibration of springs and the like included in the thrust drive unit 90.

[0113] In the above example, the stage 80 is provided to be movable in the X-axis direction, but the stage 80 may be fixed at a predetermined position. For example, as shown in FIG. 12(a), the component supply unit 50 may have a sheet holding unit 52, a sheet driving unit 56, a push-up member 60, a push-up driving unit 70, and a stage 80, and may not have a push-up driving unit 90. FIG. 13 shows an example of a series of processes executed by the controller 100 when the stage 80 is not provided to be movable. In this series of processes, the controller 100 first executes step S51, similar to step S11 shown in FIG. 4.

[0114] Next, the controller 100 executes step S52. In step S52, for example, the first push-up control unit 108 controls the push-up drive unit 70 to start the advancement of the push-up member 60. When starting the advancement of the push-up member 60, the controller 100 may control the suction unit 88 to start a state in which the stage 80 sucks the surrounding area of ​​the push-up position P2 of the wafer sheet WS. After execution of step S52, the state in which the stage 80 sucks the surrounding area is continued.

[0115] Next, the controller 100 executes steps S53 and S54. In step S53, for example, the first thrust control unit 108 waits until the thrust member 60 advances by the set value of the displacement amount. In step S54, for example, the first thrust control unit 108 controls the thrust drive unit 70 to stop the thrust member 60. By executing steps S52 to S54, the thrust member 60 advances by the set value of the displacement amount. FIG. 12(b) illustrates a state in which the thrust member 60 advances by the set value.

[0116] Since the stage 80 is fixed, the tip of the push-up member 60 protrudes beyond the tip of the stage 80 while the push-up member 60 continues to advance, and the tip of the push-up member 60 comes into contact with the push-up position P2. Even after the tip of the push-up member 60 comes into contact with the push-up position P2, the push-up member 60 continues to advance, and the push-up position P2 is pushed out toward the suction unit 42 arranged in the transfer area TA. At this time, since the suction by the stage 80 continues, a part of the electronic component W to be supplied (for example, the peripheral area of ​​the main surface Wb) is peeled off from the wafer sheet WS. The set value of the displacement amount of the push-up member 60 is set to a value at which the tip of the push-up member 60 comes into contact with the push-up position P2 and the electronic component W to be supplied receives a force (contact force) from both the suction unit 42 and the push-up member 60. In addition, the set value of the displacement amount of the push-up member 60 may be set so that an excessive load is not applied to the electronic component W to be supplied, and a load is applied that does not cause any trouble during the transfer of the electronic component W to be supplied.

[0117] Next, the controller 100 executes steps S55 and S56. In step S55, for example, the controller 100 waits until a predetermined waiting time has elapsed after execution of step S54. The waiting time is set in advance by an operator or the like. In step S56, for example, the first push-up control unit 108 controls the push-up driving unit 70 so that the push-up member 60 starts to retreat. By executing step S56, a part of the wafer sheet WS that has been pushed up toward the suction unit 42 from the position xs starts to return to the position xs. Since the suction unit 42 is suctioning the electronic component W to be supplied, the entire main surface Wb of the electronic component W is peeled off from the front surface WSa of the wafer sheet WS. Before executing step S56, a part of the main surface Wa of the electronic component W to be supplied has already been peeled off from the front surface WSa of the wafer sheet WS, so that the entire main surface Wb of the electronic component W is easily peeled off from the front surface WSa of the wafer sheet WS.

[0118] Next, the controller 100 executes steps S57 and S58. In step S57, for example, the first push-up control unit 108 waits until the push-up member 60 retreats to the origin position. In step S58, for example, the first push-up control unit 108 controls the push-up driving unit 70 to stop the push-up member 60. By executing steps S57 and S58, as shown in FIG. 12(c), the push-up member 60 moves to the origin position, the wafer sheet WS is no longer pushed up, and the electronic component W is delivered to the suction unit 42.

[0119] Next, the controller 100 executes step S59. In step S59, for example, the abnormality detection unit 116 judges whether or not the load applied to the electronic component W to be supplied is abnormal. In one example, the abnormality detection unit 116 acquires the position of the push-up member 60 relative to the stage 80 by acquiring the detection result by the advance / retract position detection unit 26. In this case, the abnormality detection unit 116 may calculate the relative position of the push-up member 60 relative to the stage 80, or may acquire the detection result by the advance / retract position detection unit 26 as the above-mentioned relative position since the stage 80 is fixed. Then, the abnormality detection unit 116 may specify a target period during which the tip of the push-up member 60 protrudes beyond the tip of the stage 80 from the acquisition result of the relative position of the push-up member 60 relative to the stage 80, among the periods during which the series of processes of steps S51 to S58 are executed. The abnormality detection unit 116 may judge whether or not the detection value of the load detection unit 22 exceeds the threshold value during the target period, without considering the detection value of the load detection unit 22 during periods other than the target period. At this time, the threshold value used for the determination may be set by the threshold value setting unit 114 in accordance with the adhesion portion 42 identified based on the detection result by the rotational position detection unit 38.

[0120] The component inspection apparatus 1 may be provided with a pickup unit having one component holding unit instead of the pickup unit 30 (rotary pickup) configured to receive electronic components W from the supply unit 20 and deliver them to the component holding unit 14 of the inspection unit 10. In the various examples described above, at least a portion of the matters described in one example may be applied to other examples.

[0121] [Summary of this disclosure] [1] A component inspection apparatus 1 which inspects electronic components W while transporting them, classifies them into non-defective components and defective components, and then stores the electronic components W in a storage member, the component inspection apparatus 1 comprising: a sheet holding unit 52 which holds a wafer sheet WS having a front surface WSa and a back surface WSb and on which an electronic component W is affixed; a component holding unit 34 (suction unit 42) which faces the front surface WSa of the wafer sheet WS held by the sheet holding unit 52 and holds the electronic component W; a push-up member 60 which faces a push-up position P2 on the back surface WSb of the wafer sheet WS held by the sheet holding unit 52; a push-up drive unit 70 which moves the push-up member 60 along a predetermined direction toward the component holding unit 34 (suction unit 42); a stage 80 which adsorbs an area around the push-up position P2 on the back surface WSb of the wafer sheet WS held by the sheet holding unit 52; a load detection unit 22 which detects a load applied to the push-up member 60; and an advance / retreat position detection unit 26 which detects the position of the push-up member 60 in the X-axis direction. In this component inspection device 1, since the load detection unit 22 (load sensor) is provided, it is possible to detect an abnormality in the load applied to the electronic component W by the push-up of the push-up member 60. Meanwhile, as described above, since the component inspection device 1 operates at high speed, the push-up member 60 is driven by the push-up drive unit 70 so as to repeatedly advance and retreat in a short cycle. As a result, even during a time period when the tip of the push-up member 60 does not protrude beyond the stage 80 and the push-up member 60 is not in contact with the wafer sheet WS, a disturbance may occur in the detection value of the load detection unit 22 due to various vibrations and the like generated in the push-up drive unit 70 for driving the push-up member 60. Therefore, it has been found that if the presence or absence of an abnormality is simply determined using the detection value by the load detection unit 22, an erroneous determination may occur due to the disturbance. In contrast, in the component inspection device 1, the detection result of the advance / retract position detection unit 26 can identify the state in which the tip of the push-up member 60 protrudes beyond the stage 80 and is in contact with the wafer sheet WS, and the load abnormality can be determined using the detection value by the load detection unit 22, focusing on the time period in which the electronic component W is sandwiched between the push-up member 60 and the component holding unit 34 (suction unit 42). As a result, even if the push-up member 60 operates periodically at high speed, erroneous determination due to the disturbance can be avoided and abnormality can be detected with high accuracy. Therefore, in the component inspection device 1, when the load applied to the electronic component is measured by the load sensor, it is possible to reduce the disturbance value that is measured as a value other than the true load value due to device vibration, etc., and to measure the load applied to the electronic component with high accuracy.

[0122] [2] The component inspection device 1 described in [1] above, further comprising: a plurality of component holding parts 34 (plurality of suction parts 42) including a component holding part 34 (suction part 42), a support part 12 supporting the plurality of component holding parts 34 (plurality of suction parts 42) so as to be positioned on a circular orbit CR2 passing through a transfer area TA for receiving electronic components W from a wafer sheet WS, a rotation drive part 36 rotating the support part 32 so as to move the plurality of component holding parts 34 (plurality of suction parts 42) along the circular orbit CR2, and a rotational position detection part 38 detecting the rotational position of the support part 32 in the circumferential direction about the central axis (central axis line Ax2) of the circular orbit CR2, wherein each of the plurality of component holding parts 34 (plurality of suction parts 42) is configured to receive electronic components W from the wafer sheet WS in the transfer area TA. In this case, it is possible to detect an abnormality with higher accuracy. It is more advantageous to adopt the above configuration when it is necessary to more strictly manage the load applied to the electronic component W. For example, as described above, a difference may occur in the reaction force acting from the spring 46 to the suction part 42 between the suction part 42 and the spring 46 (component holding part 34) while the electronic component W is sandwiched between the push-up member 60 and the suction part 42. The reaction force acting from the spring 46 to the suction part 42 is reflected in the detection value by the load detection part 22. In the component inspection device 1, it is possible to identify which suction part 42 is located in the transfer area TA based on the detection result by the rotation position detection part 38. Therefore, it is possible to reduce the possibility of erroneous identification by determining an abnormality using the detection value by the load detection part 22 under conditions according to the identified suction part 42. In addition to or instead of the individual difference in the reaction force acting on the suction portion 42, as described above, the length of each suction portion 42 is different, and the timing at which the state in which the electronic component W is sandwiched between the push-up member 60 and the suction portion 42 starts (hereinafter referred to as the "start timing") is different. By identifying which suction portion 42 is arranged in the transfer area TA, the start timing can be determined for each suction portion 42 even if there are individual differences, based on the information indicating the length corresponding to that suction portion 42 and the detection result of the advance / retract position detection portion 26. Then, by determining an abnormality using the detection value of the load detection portion 22 obtained after the start timing, it is possible to perform the determination with high accuracy without being affected by disturbances.

[0123] [3] The stage 80 is arranged to be movable in the X-axis direction, and the component inspection apparatus 1 further includes a push-up drive unit 90 that moves the stage 80 along the X-axis direction toward the component holding unit 34 (suction unit 42), and an advance / retreat position detection unit 28 that detects the position of the stage 80 in the X-axis direction, as described in [1] or [2] above. In the above configuration, since the advance / retract position detector 28 for detecting the position of the stage 80 is provided, even if the stage 80 is movable, it is possible to identify the state in which the push-up member 60 protrudes beyond the stage 80 and is in contact with the wafer sheet WS. As a result, it is possible to move the stage 80 to more reliably perform the delivery operation of the electronic component W, while detecting the load applied to the electronic component with high accuracy.

[0124] [4] The component inspection apparatus 1 according to any one of the above [1] to [3], further comprising a load detection unit 24 for detecting a load applied to the stage 80. In this case, when the electronic component W comes into contact with the component holding portion 34 (suction portion 42) while the stage 80 is pushing up the wafer sheet WS, the load applied to the electronic component W is reflected in the detection value by the load detection portion 24. This makes it possible to manage the load applied to the electronic component W not only during the period when the push-up member 60 is pushing up the wafer sheet WS, but also during the period when the stage 80 is pushing up the wafer sheet WS. This is therefore useful for improving the reliability of the electronic component W.

[0125] From the viewpoint of being able to manage the load applied to the electronic component W even during the period when the stage 80 is pushing up the wafer sheet WS, the component inspection device according to the present disclosure may be configured as follows. [4A] A component inspection device which inspects electronic components W while transporting them, classifies them into non-defective and defective components, and then stores the electronic components W in a storage member, the component inspection device including: a sheet holding unit 52 which holds a wafer sheet WS having a front surface WSa and a back surface WSb, and on which an electronic component W is affixed to the front surface WSa; a component holding unit 34 (suction unit 42) which faces the front surface WSa of the wafer sheet WS held by the sheet holding unit 52 and holds the electronic component W; and a component holding unit 34 which faces a push-up position P2 of the back surface WSb of the wafer sheet WS held by the sheet holding unit 52. A component inspection device comprising a push-up member 60, a push-up drive unit 70 which moves the push-up member 60 toward the component holding unit 34 (suction unit 42), a stage 80 which adsorbs the area around the push-up position P2 on the back surface WSb of a wafer sheet WS held by the sheet holding unit 52, a push-up drive unit 90 which moves the stage 80 toward the component holding unit 34 (suction unit 42), a load detection unit 22 which detects the load applied to the push-up member 60, and a load detection unit 24 which detects the load applied to the stage 80.

[0126] [5] The component inspection device 1 according to any one of claims [1] to [4], further comprising a controller 100 that acquires the position of the push-up member 60 relative to the stage 80 based on the detection result by the advance / retract position detection unit 26. In this case, the state in which the tip of the push-up member 60 protrudes beyond the stage 80 can be identified from the position acquisition result. Therefore, it is possible for the controller 100 to determine whether or not there is an abnormality in the load applied to the electronic component W, excluding the period in which the tip of the push-up member 60 is not in contact with the wafer sheet WS. [Explanation of symbols]

[0127] 1...component inspection device, W...electronic component, 10...inspection unit, 20...supply unit, 30...pickup section, 34...component holding section, 42...suction section, TA...delivery area, CR2...circular orbit, 50...component supply section, 52...sheet holding section, WS...wafer sheet, WSa...front surface, WSb...back surface, 60...push-up member, 70...push-up drive section, 80...stage, 90...push-up drive section, P2...push-up position, 22, 24...load detection section, 26, 28...advance / retreat position detection section, 100...controller.

Claims

1. 1. A component inspection device that inspects electronic components while conveying them, classifies them into non-defective and defective components, and accommodates the electronic components in an accommodation member, a sheet holding section having a front surface and a back surface, the sheet holding section holding a sheet having the electronic components attached to the front surface; a component holding portion that faces the front surface of the sheet held by the sheet holding portion and holds the electronic component; a push-up member that faces a push-up position on the back surface of the sheet held by the sheet holding portion; a drive unit configured to move the push-up member along a predetermined direction toward the component holder; a stage that adsorbs an area around the push-up position on the rear surface of the sheet held by the sheet holding portion; A load detection unit that detects a load applied to the push-up member; a position detection unit that detects the position of the push-up member in the predetermined direction.

2. A plurality of component holders including the component holder; a support portion supporting the plurality of component holders so as to be positioned on a circular orbit passing through a transfer area for receiving the electronic components from the sheet; a rotation drive unit that rotates the support unit so as to move the component holders along the circular orbit; a rotational position detection unit that detects a rotational position of the support unit in a circumferential direction around the central axis of the circular orbit, The component inspection device according to claim 1 , wherein each of the plurality of component holders is configured to receive the electronic component from the sheet in the delivery area.

3. the stage is provided so as to be movable in the predetermined direction, The part inspection device includes: a second driving unit that moves the stage along the predetermined direction toward the component holder; The component inspection device according to claim 1 , further comprising: a second position detector that detects a position of the stage in the predetermined direction.

4. The component inspection device according to claim 3 , further comprising a second load detection unit that detects a load applied to the stage.

5. 5. The component inspection device according to claim 1, further comprising a controller that acquires a position of the push-up member relative to the stage based on a detection result by the position detection unit.

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