Cleaning nozzle, cleaning device, and manufacturing method of semiconductor element

Abstract

To provide a cleaning nozzle in which a dispersion amount of an ejected gas is less than the prior arts.SOLUTION: A cleaning nozzle comprises: a mixed phase fluid nozzle which ejects a mixed phase fluid containing a gas containing water molecules and a liquid containing water molecules from a mixed phase fluid nozzle ejection port; and an outer peripheral nozzle which includes an outer peripheral nozzle ejection port enclosing the mixed phase fluid nozzle ejection port and ejects the liquid. Therefore, a cleaning nozzle in which a dispersion amount of an ejected gas is less than the prior arts can be obtained. A manufacturing method of a semiconductor element includes: a loading step of loading a semiconductor substrate on a stage; and a cleaning step of cleaning a ground surface of the semiconductor substrate with the cleaning nozzle. Therefore, the semiconductor element can be obtained while making the dispersion amount of the ejected gas less than the prior arts.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a cleaning nozzle that ejects a gas containing water molecules and a method for manufacturing a semiconductor device. [Background technology]

[0002] In the prior art, an object cleaning system is disclosed in which a multiphase fluid of water vapor and water is sprayed onto the surface of the object (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-141251 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the conventional technology has a problem in that the gas containing water molecules ejected from the cleaning nozzle scatters after cleaning the object to be cleaned.

[0005] The present disclosure has been made to solve the problems described above, and aims to provide a cleaning nozzle and cleaning apparatus that cause less scattering of gas containing water molecules than conventional methods, and a method for manufacturing semiconductor devices using the cleaning apparatus. [Means for solving the problem]

[0006] A cleaning nozzle according to the present disclosure comprises a multiphase fluid nozzle that ejects a multiphase fluid containing a gas containing water molecules and a liquid containing water molecules from a multiphase fluid nozzle ejection outlet, and an outer peripheral nozzle that has an outer peripheral nozzle ejection outlet surrounding the multiphase fluid nozzle ejection outlet and ejects the liquid.

[0007] Furthermore, a cleaning nozzle according to the present disclosure comprises: a multiphase fluid nozzle that ejects a multiphase fluid containing a gas containing water molecules and a liquid containing water molecules from a multiphase fluid nozzle outlet; a wall portion provided to surround the multiphase fluid nozzle; a connection portion that connects the end of the wall portion opposite the injection direction of the multiphase fluid to the multiphase fluid nozzle; and an outer peripheral nozzle outlet provided in the wall portion and at the end of the wall portion on the side in the injection direction of the multiphase fluid, and ejects liquid.

[0008] Furthermore, a cleaning nozzle according to the present disclosure includes a multiphase fluid nozzle that ejects a multiphase fluid containing a gas containing water molecules and a liquid containing water molecules from a multiphase fluid nozzle outlet, a wall portion arranged to surround the multiphase fluid nozzle, a connection portion that connects the end of the wall portion opposite the injection direction of the multiphase fluid to the multiphase fluid nozzle and has a connection portion facing surface that is on the side of the injection direction of the multiphase fluid, and an outer periphery nozzle that is arranged on the connection portion and has an outer periphery nozzle outlet on the connection portion facing surface, and ejects liquid.

[0009] A cleaning device according to the present disclosure includes the above cleaning nozzle, and a stage disposed opposite the cleaning nozzle and having a mounting surface on which an object to be cleaned is mounted.

[0010] The method for manufacturing a semiconductor element according to the present disclosure includes a mounting step of mounting a semiconductor substrate on a stage, and a cleaning step of cleaning the ground surface of the semiconductor substrate with the cleaning nozzle. Effect of the Invention

[0011] According to the cleaning nozzle of the present disclosure, it is possible to obtain a cleaning nozzle in which the amount of gas containing water molecules ejected from the cleaning nozzle that scatters after cleaning an object to be cleaned is less than that of the conventional cleaning nozzle. Also, according to the manufacturing method of a semiconductor element of the present disclosure, it is possible to obtain a semiconductor element while reducing the amount of gas containing water molecules that scatters after being ejected from the cleaning nozzle. [Brief description of the drawings]

[0012] [Figure 1]1 is a cross-sectional view of a cleaning device according to a first embodiment of the present disclosure. [Diagram 2] 1 is a cross-sectional view of a cleaning nozzle according to a first embodiment of the present disclosure. [Diagram 3] FIG. 11 is a cross-sectional view of a cleaning nozzle according to a second embodiment of the present disclosure. [Figure 4] FIG. 11 is a cross-sectional view of a cleaning nozzle according to a third embodiment of the present disclosure. [Diagram 5] FIG. 11 is a cross-sectional view of a cleaning nozzle according to a fourth embodiment of the present disclosure. [Figure 6] FIG. 11 is a cross-sectional view of a cleaning nozzle according to a fifth embodiment of the present disclosure. [Figure 7] FIG. 13 is a cross-sectional view of a cleaning nozzle according to a sixth embodiment of the present disclosure. [Figure 8] FIG. 13 is a plan view of a cleaning nozzle according to a seventh embodiment of the present disclosure. [Figure 9] FIG. 13 is a plan view of a cleaning nozzle according to an eighth embodiment of the present disclosure. [Figure 10] FIG. 13 is a plan view of a cleaning nozzle according to a ninth embodiment of the present disclosure. [Figure 11] FIG. 23 is a plan view of a cleaning nozzle according to a tenth embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, the embodiments of the present disclosure will be described with reference to the accompanying drawings. Note that the drawings are schematic, and the interrelationships of sizes and positions shown in different drawings are not necessarily limited to those described and may be changed as appropriate. In addition, in the following description, similar components are illustrated with the same reference numerals, and their names and functions are the same or similar. Therefore, detailed description thereof may be omitted.

[0014] Embodiment 1 The cleaning nozzle 201 in the first embodiment will be described with reference to Figures 1 and 2. Figure 1 is a cross-sectional view of the cleaning device 101 according to the first embodiment.

[0015] The cleaning apparatus 101 according to this embodiment includes a cleaning nozzle 201. The cleaning apparatus 101 cleans the object 304. That is, the cleaning apparatus 101 removes foreign matter from the object 304. The cleaning apparatus 101 may further include a stage 301 and an exhaust horn 302.

[0016] The stage 301 includes a mounting surface 303. An object to be cleaned 304 is mounted on the mounting surface 303. The mounting surface 303 is provided facing the cleaning nozzle 201. The object to be cleaned 304 is mounted on the mounting surface 303 of the stage 301, and is cleaned by the cleaning nozzle 201. Note that mounting the object to be cleaned 304 on the mounting surface 303 simply includes placing the object to be cleaned 304 on the mounting surface 303.

[0017] The stage 301 rotates, for example, around a stage axis 305. The object to be cleaned 304 is, for example, a semiconductor wafer, but may be another substrate or the like.

[0018] Exhaust horn 302 is provided so as to surround object to be cleaned 304. Exhaust horn 302 sucks in gas and liquid ejected from cleaning nozzle 201 through suction port 306. Most of the gas and liquid sucked in by exhaust horn 302 was ejected from cleaning nozzle 201 and bounced off object to be cleaned 304 or stage 301. Exhaust horn 302 discharges the sucked gas or liquid through exhaust port 307. The gas and liquid used in multiphase fluid nozzle 1 contain water molecules.

[0019] In addition, the exhaust horn 302 may suck in only either gas or liquid from the side of the object to be cleaned 304 and exhaust it from the opposite side to the object to be cleaned 304, or it may suck in and exhaust both gas and liquid.

[0020] The exhaust horn 302 may surround the object to be cleaned 304 in a ring shape, continuously and without interruption, all around the object to be cleaned in a direction perpendicular to the stage axis 305, or may be provided at only a portion of the position that surrounds the object to be cleaned 304 in a ring shape, in a direction perpendicular to the stage axis 305, as shown in FIG. 1.

[0021] Note that arrow A shows an example of the gas path, arrow B shows the liquid path, and arrow C shows an example of the multiphase fluid path. Also, arrow C indicates the injection direction of the multiphase fluid. A multiphase fluid refers to a fluid in which particles of different phases are dispersed. Although a case where the multiphase fluid contains gas and liquid will be described, the multiphase fluid may contain other substances besides gas and liquid. Note that the gas passing through the gas path shown by arrow A contains water molecules.

[0022] The cleaning nozzle 201 according to this embodiment includes a multiphase fluid nozzle 1 and a peripheral nozzle 2. The cleaning nozzle 201 cleans the object 304 to be cleaned. In other words, the cleaning nozzle 201 removes foreign matter from the object 304 to be cleaned.

[0023] The multiphase fluid nozzle 1 includes a gas inlet 3, a gas flow path 4, a liquid inlet 5, a liquid flow path 6, a gas-liquid mixing section 7, a multiphase fluid flow path 8, and a multiphase fluid nozzle outlet 9. A multiphase fluid is ejected from the multiphase fluid nozzle outlet 9. That is, gas and liquid containing water molecules are mixed in the gas-liquid mixing section 7 to become a multiphase fluid, which is ejected from the multiphase fluid nozzle outlet 9.

[0024] The gas flow path 4, the gas liquid mixer 7, and the multiphase fluid flow path 8, which are the flow paths through which the gas flowing in from the gas inlet 3 passes before being ejected from the multiphase fluid nozzle ejection outlet 9, are smoothly connected.

[0025] A main flow path is made up of the gas flow path 4, the gas-liquid mixer 7, and the multiphase fluid flow path 8. It is desirable for the main flow path to be provided straight.

[0026] By providing the main flow path, which is the flow path through which gas passes, in a straight line, the ability of the cleaning nozzle 201 to remove foreign matter from the object to be cleaned 304 can be improved compared to when the main flow path is not provided in a straight line.

[0027] The liquid flow path 6 is connected to the main flow path at the gas-liquid mixing section 7. The liquid flow path 6 is connected to the main flow path at an angle. That is, the liquid flow path 6 is connected to the main flow path at an acute angle. It is desirable that the angle between the direction from the liquid inlet 5 to the multiphase fluid nozzle outlet 9 and the direction from the gas inlet 3 to the multiphase fluid nozzle outlet 9 is 90 degrees or less.

[0028] The outer circumferential nozzle 2 includes an outer circumferential nozzle inlet 11 , an outer circumferential nozzle inner flow passage 12 , and an outer circumferential nozzle outlet 13 .

[0029] The outer peripheral nozzle inlet 11 is provided, for example, on the side of the outer peripheral nozzle 2 opposite the stage 301 in a direction parallel to the injection direction of the multiphase fluid. The outer peripheral nozzle internal flow path 12 includes, for example, a straight portion 14 and an annular portion 15. The straight portion 14 and the annular portion 15 are connected and provided continuously. That is, the fluid flowing through the straight portion 14 flows into the annular portion 15.

[0030] As shown in Fig. 1, the peripheral nozzle 2 surrounds the multiphase fluid nozzle 1 in a direction perpendicular to the main flow path. That is, the peripheral nozzle 2 surrounds the multiphase fluid nozzle 1 in a direction perpendicular to the injection direction of the multiphase fluid. For example, the peripheral nozzle 2 covers the multiphase fluid nozzle 1 in an annular shape in a plan view. Annular shape includes a circular ring shape or a polygonal ring shape. Note that the peripheral nozzle 2 surrounding the multiphase fluid nozzle 1 does not necessarily mean that the peripheral nozzle 2 covers the multiphase fluid nozzle 1 continuously over the entire circumference, and may be partially interrupted.

[0031] 1, the peripheral nozzle outlet 13 surrounds the multiphase fluid nozzle outlet 9 in a direction perpendicular to the main flow path. That is, the peripheral nozzle outlet 13 surrounds the multiphase fluid nozzle outlet 9 in a direction perpendicular to the injection direction of the multiphase fluid. For example, the peripheral nozzle outlet 13 covers the multiphase fluid nozzle outlet 9 in an annular shape in a plan view. The plan view is a direction seen perpendicularly from a plane in which the peripheral nozzle outlet 13 and the multiphase fluid nozzle outlet 9 exist. The annular shape includes a circular ring shape or a polygonal ring shape. The peripheral nozzle outlet 13 surrounding the multiphase fluid nozzle outlet 9 does not necessarily have to cover the multiphase fluid nozzle outlet 9 continuously all around, and may be partially interrupted.

[0032] The multiphase fluid nozzle 1 can move to a position facing the mounting surface 303 via the object to be cleaned 304, and clean the object to be cleaned 304. The distance between the multiphase fluid nozzle outlet 9 and the object to be cleaned 304 is desirably, for example, about 3 mm to 7 mm. By setting the distance between the multiphase fluid nozzle outlet 9 and the object to be cleaned 304 to about 3 mm to 7 mm, the ability of the multiphase fluid nozzle 1 to remove foreign matter from the object to be cleaned 304 can be improved.

[0033] The flow of gas and liquid will be explained with reference to FIG.

[0034] Gas flows in from the gas inlet 3 of the multiphase fluid nozzle 1. The gas flowing in from the gas inlet 3 passes through the gas flow path 4. The gas that has passed through the gas flow path 4 reaches the gas-liquid mixing section 7. The gas that has reached the gas-liquid mixing section 7 mixes with the liquid that has reached the gas-liquid mixing section 7 to become a multiphase fluid. The multiphase fluid passes through the multiphase fluid flow path 8. The multiphase fluid that has passed through the multiphase fluid flow path 8 reaches the multiphase fluid nozzle outlet 9 and is ejected from the multiphase fluid nozzle 1 through the multiphase fluid nozzle outlet 9.

[0035] Liquid flows in from the liquid inlet 5 of the multiphase fluid nozzle 1. The liquid that flows in from the liquid inlet 5 passes through the liquid flow path 6. The liquid that passes through the liquid flow path 6 reaches the gas-liquid mixing section 7. The liquid that reaches the gas-liquid mixing section 7 mixes with the gas that reaches the gas-liquid mixing section 7 to become a multiphase fluid. The multiphase fluid passes through the multiphase fluid flow path 8. The multiphase fluid that passes through the multiphase fluid flow path 8 reaches the multiphase fluid nozzle outlet 9 and is ejected from the multiphase fluid nozzle 1 through the multiphase fluid nozzle outlet 9.

[0036] The multiphase fluid ejected from the multiphase fluid nozzle ejection port 9 reaches the object to be cleaned 304 and removes foreign matter from the object to be cleaned 304 .

[0037] It is preferable that the multiphase fluid ejected from the multiphase fluid nozzle ejection port 9 is ejected perpendicularly to the object to be cleaned 304 and the stage 301. By ejecting the multiphase fluid perpendicularly to the object to be cleaned 304 and the stage 301, the ability of the cleaning nozzle 201 to remove foreign matter from the object to be cleaned 304 can be improved.

[0038] It is desirable that the gas and the liquid used in the multiphase fluid nozzle 1 have the same pressure when they are mixed in the gas-liquid mixing section 7. The pressure of the gas used in the multiphase fluid nozzle 1 is desirably about 0.1 MPa to 0.3 MPa, for example.

[0039] Moreover, the flow rate of the liquid used in the multiphase fluid nozzle 1 is desirably, for example, about 100 cc / min to 500 cc / min.

[0040] By adjusting the pressure of the gas used in the multiphase fluid nozzle 1 and the flow rate of the liquid used in the multiphase fluid nozzle 1, the ability of the multiphase fluid nozzle 1 to remove foreign matter from the object to be cleaned 304 can be improved.

[0041] The pressure of the gas used in the multiphase fluid nozzle 1 and the flow rate of the liquid used in the multiphase fluid nozzle 1 can be changed to appropriate values ​​as appropriate. The pressure of the gas used in the multiphase fluid nozzle 1 and the flow rate of the liquid used in the multiphase fluid nozzle 1 can also be changed depending on the distance between the multiphase fluid nozzle outlet 9 and the object to be cleaned 304, the shape of the multiphase fluid nozzle outlet 9, or the shape of the outer peripheral nozzle 2. By appropriately changing the pressure of the gas used in the multiphase fluid nozzle 1, the flow rate of the liquid used in the multiphase fluid nozzle 1, the distance between the multiphase fluid nozzle outlet 9 and the object to be cleaned 304, the shape of the multiphase fluid nozzle outlet 9, or the shape of the outer peripheral nozzle 2, etc., the ability of the cleaning nozzle 201 to remove foreign matter from the object to be cleaned 304 can be improved.

[0042] The gas and liquid used in the multiphase fluid nozzle 1 contain water molecules. By containing water molecules in the gas and liquid used in the multiphase fluid nozzle 1, the ability of the multiphase fluid nozzle 1 to remove foreign matter from the object to be cleaned 304 can be improved compared to when the gas and liquid do not contain water molecules.

[0043] The gas used in the multiphase fluid nozzle 1 may be steam. The liquid used in the multiphase fluid nozzle 1 may be pure water. The multiphase fluid nozzle 1 is sometimes called a steam two-fluid nozzle. The gas used in the multiphase fluid nozzle 1 may be at a higher temperature than the liquid flowing in from the liquid inlet 5. For example, the gas flowing in from the gas inlet 3 is at about 100°C, and the multiphase fluid ejected from the multiphase fluid nozzle ejection outlet 9 is at about 90°C.

[0044] Liquid flows in from the peripheral nozzle inlet 11 of the peripheral nozzle 2. The liquid that flows in from the peripheral nozzle inlet 11 passes through the peripheral nozzle internal flow path 12. The liquid that passes through the peripheral nozzle internal flow path 12 is ejected to the outside of the peripheral nozzle 2 from the peripheral nozzle outlet 13. The peripheral nozzle outlet 13 is formed so as to surround the multiphase fluid nozzle outlet 9, so that the liquid ejected from the peripheral nozzle outlet 13 is ejected so as to surround the multiphase fluid ejected from the multiphase fluid nozzle outlet 9. In addition, the liquid ejected from the peripheral nozzle outlet 13 is ejected toward the object to be cleaned 304 and in parallel to the ejection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9.

[0045] Because the liquid ejected from the peripheral nozzle outlet 13 has a lower temperature than the multiphase fluid ejected from the multiphase fluid nozzle outlet 9, the liquid ejected from the peripheral nozzle outlet 13 cools the multiphase fluid ejected from the multiphase fluid nozzle outlet 9. The liquid ejected from the peripheral nozzle outlet 13 cools the multiphase fluid ejected from the multiphase fluid nozzle outlet 9, and liquefies a portion of the gas contained in the multiphase fluid ejected from the multiphase fluid nozzle outlet 9. In particular, the liquid ejected from the peripheral nozzle outlet 13 condenses water molecules contained in the gas of the multiphase fluid ejected from the multiphase fluid nozzle outlet 9, thereby turning a portion of the multiphase fluid into water.

[0046] That is, the outer peripheral nozzle 2 can function as a cooling nozzle that cools the multiphase fluid injected from the multiphase fluid nozzle injection port 9.

[0047] The gas contained in the multiphase fluid is cooled and turned into liquid, and most of the liquid ejected from the peripheral nozzle ejection port 13 falls in the direction of gravity after cleaning the cleaning target 304. The gas contained in the multiphase fluid is cooled and turned into liquid, and some of the liquid ejected from the peripheral nozzle ejection port 13 scatters and is sucked into the exhaust horn 302 from the suction port 306. The liquid sucked into the exhaust horn 302 is discharged from the exhaust port 307 of the exhaust horn 302.

[0048] Gas contained in the multiphase fluid that does not become liquid disperses as gas. The dispersed gas is sucked into exhaust horn 302 from suction port 306. The gas sucked into exhaust horn 302 is exhausted from exhaust port 307 of exhaust horn 302.

[0049] By cooling the gas contained in the multiphase fluid to become a liquid, it is possible to suppress the scattering of the gas compared to when the gas is not cooled. In other words, the amount of gas scattering can be reduced compared to the conventional method.

[0050] Since the amount of gas scattering can be reduced compared to the conventional method, exhaust horn 302 that sucks in gas or liquid can be made smaller. That is, even if exhaust horn 302 does not surround object to be cleaned 304 continuously over the entire circumference in a ring shape without any gaps in the direction perpendicular to stage axis 305, exhaust horn 302 can sufficiently suck in gas and liquid. Note that the gas sucked in by exhaust horn 302 contains water molecules.

[0051] Even if the exhaust horn 302 does not continuously surround the object to be cleaned 304 all around, the exhaust horn 302 can sufficiently suck in gas and liquid, thereby reducing the manufacturing and maintenance costs of the exhaust horn 302.

[0052] Furthermore, because the amount of gas scattering can be reduced compared to the conventional method, even when exhaust horn 302 with a smaller suction force than the conventional method is used, exhaust horn 302 can sufficiently suck in gas and liquid.

[0053] The exhaust horn 302 sufficiently sucks in the gas, thereby reducing the possibility of the cleaning device 101 rusting. In addition, the exhaust horn 302 sufficiently sucks in the gas and liquid remaining after cleaning the cleaning target 304, thereby reducing the risk of disturbing the environment of the room, such as a clean room, in which the cleaning device 101 is placed. In addition, the exhaust horn 302 sufficiently sucks in the gas and liquid, thereby preventing the visibility of the room, such as a clean room, in which the cleaning device 101 is placed from becoming poor.

[0054] The liquid ejected from the outer peripheral nozzle ejection port 13 may be ejected onto the object to be cleaned 304, or may be ejected to a location where there is no object to be cleaned 304. The liquid ejected from the outer peripheral nozzle ejection port 13 may be ejected onto the stage 301, or may be ejected to a location where there is no stage 301.

[0055] The liquid used in the peripheral nozzle 2 may be pure water. The liquid used in the multiphase fluid nozzle 1 and the liquid used in the peripheral nozzle 2 may be the same or different. The liquid used in the peripheral nozzle 2 is, for example, at room temperature.

[0056] The inner diameter of the outer peripheral nozzle inner flow path 12 may be formed to gradually narrow as it approaches the outer peripheral nozzle outlet 13. Also, the outer peripheral nozzle inner flow path 12 may be provided in a spiral shape, and the liquid ejected from the outer peripheral nozzle outlet 13 may be ejected in a direction other than perpendicular to the mounting surface 303.

[0057] Fig. 2 is a cross-sectional view of cleaning nozzle 201 according to embodiment 1. As shown in Fig. 2, multiphase fluid nozzle outlet 9 and peripheral nozzle outlet 13 are provided on the same plane perpendicular to the injection direction of the multiphase fluid. In other words, multiphase fluid nozzle outlet 9 and peripheral nozzle outlet 13 are provided on the same plane parallel to mounting surface 303 of stage 301.

[0058] By arranging the multiphase fluid nozzle outlet 9 and the outer peripheral nozzle outlet 13 on the same plane perpendicular to the injection direction of the multiphase fluid, the cleaning nozzle 201 is easier to manufacture than when the multiphase fluid nozzle outlet 9 and the outer peripheral nozzle outlet 13 are not arranged on the same plane perpendicular to the injection direction of the multiphase fluid.

[0059] In addition, being provided on the same plane also includes being provided slightly shifted in the injection direction of the multiphase fluid, as long as the cleaning effect is equivalent.

[0060] Furthermore, it is desirable that the plane on which the multiphase fluid nozzle outlet 9 and the peripheral nozzle outlet 13 are provided is horizontal. In other words, it is desirable that the plane on which the multiphase fluid nozzle outlet 9 and the peripheral nozzle outlet 13 are provided is perpendicular to the direction of gravity.

[0061] The multiphase fluid nozzle 1 includes a multiphase fluid nozzle facing surface 16 which corresponds to the bottom surface of the multiphase fluid nozzle 1 and is a surface facing the mounting surface 303 of the stage 301 and the object to be cleaned 304. In addition, the outer periphery nozzle 2 includes a outer periphery nozzle facing surface 17 which corresponds to the bottom surface of the outer periphery nozzle 2 and is a surface facing the mounting surface 303 of the stage 301 and the object to be cleaned 304.

[0062] In this embodiment, the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17 are provided on the same plane. However, the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17 do not have to be provided on the same plane, and for example, the multiphase fluid nozzle facing surface 16 or the outer peripheral nozzle facing surface 17 may include a step.

[0063] The multiphase fluid nozzle 1 and the outer peripheral nozzle 2 may be provided separately or integrally. When the multiphase fluid nozzle 1 and the outer peripheral nozzle 2 are provided separately, the multiphase fluid nozzle 1 and the outer peripheral nozzle 2 are fixed together with, for example, a hexagonal bolt.

[0064] The outer peripheral nozzle 2 desirably has a dimension in the injection direction of the multiphase fluid of, for example, about 25 mm to 40 mm. More desirably, the dimension in the injection direction of the multiphase fluid is about 33 mm. The outer peripheral nozzle 2 desirably has a dimension in a direction perpendicular to the injection direction of the multiphase fluid of, for example, about 45 mm to 65 mm. More desirably, the dimension in the direction perpendicular to the injection direction of the multiphase fluid is about 56 mm. By adjusting the dimensions of the outer peripheral nozzle 2, the amount of gas scattering can be reduced.

[0065] The cleaning nozzle 201 may further include another nozzle in addition to the multiphase fluid nozzle 1 and the peripheral nozzle 2. For example, a nozzle further surrounding the peripheral nozzle 2 may be provided.

[0066] Moreover, it is preferable that the cleaning nozzle 201 is made of titanium. By making the cleaning nozzle 201 of titanium, it is possible to prevent contamination of the cleaning target 304. However, the cleaning nozzle 201 may be made of a material other than titanium.

[0067] Embodiment 2 The cleaning nozzle 202 in the second embodiment will be described with reference to Fig. 3. Description of the same configuration as in the first embodiment will be omitted. In Fig. 3, the same reference numerals as in Figs. 1 and 2 indicate the same or corresponding parts.

[0068] Fig. 3 is a cross-sectional view of a cleaning nozzle 202 according to embodiment 2. As shown in Fig. 3, the cleaning nozzle 202 according to this embodiment differs from the cleaning nozzle 201 of embodiment 1 in the positional relationship between the multiphase fluid nozzle 1 and the outer peripheral nozzle 2. The following description will focus on the differences from the cleaning nozzle 201 of embodiment 1.

[0069] 3, the peripheral nozzle outlet 13 is provided in the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9. In other words, the distance between the peripheral nozzle outlet 13 and the mounting surface 303 is smaller than the distance between the multiphase fluid nozzle outlet 9 and the mounting surface 303.

[0070] By arranging the outer peripheral nozzle outlet 13 in the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9, the cleaning ability of the cleaning nozzle 202 and the efficiency of converting the gas contained in the multiphase fluid injected from the multiphase fluid nozzle outlet 9 into liquid can be improved compared to when the multiphase fluid nozzle outlet 9 and the outer peripheral nozzle outlet 13 are arranged on the same plane perpendicular to the injection direction of the multiphase fluid.

[0071] Furthermore, in this embodiment, the outer peripheral nozzle facing surface 17 is provided in the injection direction of the multiphase fluid from the multiphase fluid nozzle facing surface 16. In other words, the distance between the outer peripheral nozzle facing surface 17 and the mounting surface 303 is smaller than the distance between the multiphase fluid nozzle facing surface 16 and the mounting surface 303.

[0072] The distance between the outer peripheral nozzle facing surface 17 and the mounting surface 303 does not have to be smaller than the distance between all points included in the multiphase fluid nozzle facing surface 16 and the mounting surface 303. For example, the multiphase fluid nozzle facing surface 16 or the outer peripheral nozzle facing surface 17 may include a step, and for example, a part of the multiphase fluid nozzle facing surface 16 and a part of the outer peripheral nozzle facing surface 17 may be on the same plane. Also, a part of the multiphase fluid nozzle facing surface 16 may be located closer to the mounting surface 303 than a part of the outer peripheral nozzle facing surface 17.

[0073] The multiphase fluid nozzle 1 and the outer peripheral nozzle 2 may be provided separately or integrally. When the multiphase fluid nozzle 1 and the outer peripheral nozzle 2 are provided separately, the multiphase fluid nozzle 1 and the outer peripheral nozzle 2 are fixed together with, for example, a hexagonal bolt.

[0074] 3 shows a case where the peripheral nozzle outlet 13 is provided in the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9, but the peripheral nozzle outlet 13 may be provided in the opposite direction to the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9. In other words, the multiphase fluid nozzle outlet 9 may be provided at a position closer to the object to be cleaned 304 than the peripheral nozzle outlet 13.

[0075] Alternatively, the multiphase fluid nozzle 1 and the outer peripheral nozzle 2 may be provided as separate bodies, with the outer peripheral nozzle 2 provided so as to be movable in a direction parallel to the injection direction of the multiphase fluid. That is, the outer peripheral nozzle 2 may be provided so as to be able to adjust the distance between the outer peripheral nozzle 2 and the mounting surface 303. By providing the outer peripheral nozzle 2 so as to be able to move in a direction parallel to the injection direction of the multiphase fluid, the distance between the outer peripheral nozzle injection port 13 and the mounting surface 303 can be set independently of the distance between the multiphase fluid nozzle injection port 9 and the mounting surface 303.

[0076] Because the peripheral nozzle 2 is provided so as to be movable in a direction parallel to the injection direction of the multiphase fluid, the distance between the peripheral nozzle outlet 13 and the mounting surface 303 and the object to be cleaned 304 can be changed according to the amount of gas and liquid flowing into the multiphase fluid nozzle 1 and the peripheral nozzle 2. Because the distance between the peripheral nozzle outlet 13 and the mounting surface 303 and the object to be cleaned 304 can be changed according to the amount of gas and liquid flowing into the multiphase fluid nozzle 1 and the peripheral nozzle 2, the cleaning ability of the cleaning nozzle 202 and the efficiency of converting the gas contained in the multiphase fluid injected from the multiphase fluid nozzle outlet 9 into liquid can be improved.

[0077] Embodiment 3 A cleaning nozzle 203 in the third embodiment will be described with reference to Fig. 4. Descriptions of the same configuration as in the first embodiment will be omitted. In Fig. 4, the same reference numerals as in Figs. 1 to 3 indicate the same or corresponding parts.

[0078] Fig. 4 is a cross-sectional view of a cleaning nozzle 203 according to embodiment 3. As shown in Fig. 4, the cleaning nozzle 203 according to this embodiment has a different shape of the outer circumferential nozzle 18 from the shape of the outer circumferential nozzle 2 of embodiment 1. The following mainly describes the differences from the cleaning nozzle 201 of embodiment 1.

[0079] The cleaning nozzle 203 of this embodiment includes a connection part 19. The connection part 19 connects the multiphase fluid nozzle 1 and the outer peripheral nozzle 18. As shown in FIG. 4 , the connection part 19 is provided integrally with the outer peripheral nozzle 18, and connects the multiphase fluid nozzle 1 and the outer peripheral nozzle 18.

[0080] The connecting part 19 may be provided as a separate body from the outer peripheral nozzle 18, or the connecting part 19 that is separate from the outer peripheral nozzle 18 may connect the multiphase fluid nozzle 1 and the outer peripheral nozzle 18. The connecting part 19 may also be provided integrally with the multiphase fluid nozzle 1.

[0081] The connection part 19 includes a connection part facing surface 20 on the side of the injection direction of the multiphase fluid. That is, the connection part 19 includes a connection part facing surface 20 on the side of the mounting surface 303 and the object to be cleaned 304, which faces the mounting surface 303 and the object to be cleaned 304. The connection part facing surface 20 is, for example, a surface parallel to the mounting surface 303 and the object to be cleaned 304.

[0082] The connection part facing surface 20 is provided in the opposite direction to the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9. That is, the distance between the connection part facing surface 20 and the mounting surface 303 and the object to be cleaned 304 is greater than the distance between the multiphase fluid nozzle outlet 9 and the mounting surface 303 and the object to be cleaned 304. Furthermore, in this embodiment, the distance between the connection part facing surface 20 and the mounting surface 303 and the object to be cleaned 304 is greater than the distance between the outer circumferential nozzle outlet 13 and the mounting surface 303 and the object to be cleaned 304.

[0083] The outer peripheral nozzle 18 includes a wall portion 21. The wall portion 21 is provided extending from the connection portion opposing surface 20 in the injection direction of the multiphase fluid. The wall portion 21 is provided so as to surround the multiphase fluid nozzle outlet 9. The wall portion 21 is further provided so as to surround the outer peripheral nozzle outlet 13. In this embodiment, the outer peripheral nozzle internal flow path 12 is provided so as to follow the wall portion 21.

[0084] The wall portion 21 has an end portion on the opposite side to the injection direction of the multiphase fluid. The connection portion 19 connects the end portion of the wall portion 21 on the opposite side to the injection direction of the multiphase fluid to the multiphase fluid nozzle 1. The wall portion 21 also has an end portion on the side of the injection direction of the multiphase fluid.

[0085] Since the outer peripheral nozzle 18 includes the wall portion 21, there is an area 26 surrounded by the connection portion facing surface 20 and the wall portion 21, as shown in Fig. 4. In other words, the outer peripheral nozzle 18 has a concave shape on the side opposite to the injection direction of the multiphase fluid. Gas and the like can accumulate in the area 26 surrounded by the connection portion facing surface 20 and the wall portion 21. By accumulating the gas in the area 26, the amount of gas scattering can be reduced.

[0086] The existence of area 26 surrounded by the connection portion opposing surface 20 and wall portion 21 allows gas to accumulate in area 26, making it easier for the gas contained in the multiphase fluid ejected from the multiphase fluid nozzle ejection outlet 9 to mix with the liquid ejected from the outer peripheral nozzle ejection outlet 13 compared to when area 26 surrounded by the connection portion opposing surface 20 and wall portion 21 does not exist, thereby increasing the efficiency of converting the gas contained in the multiphase fluid ejected from the multiphase fluid nozzle ejection outlet 9 into liquid.

[0087] 4, in the cleaning nozzle 203, the multiphase fluid nozzle outlet 9 and the outer peripheral nozzle outlet 13 are provided on the same plane perpendicular to the injection direction of the multiphase fluid, similar to the cleaning nozzle 201 of embodiment 1. In other words, the multiphase fluid nozzle outlet 9 and the outer peripheral nozzle outlet 13 are provided on the same plane parallel to the mounting surface 303 of the stage 301.

[0088] By arranging the multiphase fluid nozzle outlet 9 and the outer peripheral nozzle outlet 13 on the same plane perpendicular to the injection direction of the multiphase fluid, the cleaning nozzle 201 is easier to manufacture than when the multiphase fluid nozzle outlet 9 and the outer peripheral nozzle outlet 13 are not arranged on the same plane perpendicular to the injection direction of the multiphase fluid.

[0089] Furthermore, it is desirable that the plane on which the multiphase fluid nozzle outlet 9 and the peripheral nozzle outlet 13 are provided is horizontal. In other words, it is desirable that the plane on which the multiphase fluid nozzle outlet 9 and the peripheral nozzle outlet 13 are provided is perpendicular to the direction of gravity.

[0090] In this embodiment, the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17 are provided on the same plane, and the connection portion facing surface 20 is provided at a position farther from the mounting surface 303 and the object to be cleaned 304 than the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17.

[0091] It is not necessary that the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17 are provided on the same plane. Also, the connection portion facing surface 20 may include, for example, a step.

[0092] Embodiment 4 A cleaning nozzle 204 in the fourth embodiment will be described with reference to Fig. 5. Description of the same configuration as in the third embodiment will be omitted. In Fig. 5, the same reference numerals as in Figs. 1 to 4 denote the same or corresponding parts.

[0093] Fig. 5 is a cross-sectional view of a cleaning nozzle 204 according to embodiment 4. As shown in Fig. 5, the cleaning nozzle 204 according to this embodiment differs from the cleaning nozzle 203 of embodiment 3 in the positional relationship between the multiphase fluid nozzle 1 and the outer peripheral nozzle 18. The following description will focus on the differences from the cleaning nozzle 203 of embodiment 3.

[0094] 5, the peripheral nozzle outlet 13 is provided in the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9. In other words, the distance between the peripheral nozzle outlet 13 and the mounting surface 303 is smaller than the distance between the multiphase fluid nozzle outlet 9 and the mounting surface 303.

[0095] By arranging the outer peripheral nozzle outlet 13 in the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9, the cleaning ability of the cleaning nozzle 204 and the efficiency of converting the gas contained in the multiphase fluid injected from the multiphase fluid nozzle outlet 9 into liquid can be improved compared to when the multiphase fluid nozzle outlet 9 and the outer peripheral nozzle outlet 13 are arranged on the same plane perpendicular to the injection direction of the multiphase fluid.

[0096] Furthermore, in this embodiment, the outer peripheral nozzle facing surface 17 is provided in the injection direction of the multiphase fluid from the multiphase fluid nozzle facing surface 16. In other words, the distance between the outer peripheral nozzle facing surface 17 and the mounting surface 303 is smaller than the distance between the multiphase fluid nozzle facing surface 16 and the mounting surface 303.

[0097] The connection portion facing surface 20 is provided at a position farther from the mounting surface 303 and the cleaning target 304 than the multiphase fluid nozzle facing surface 16 and the outer circumferential nozzle facing surface 17. The connection portion facing surface 20 may include, for example, a step.

[0098] The multiphase fluid nozzle 1 and the outer peripheral nozzle 18 may be provided separately or integrally. When the multiphase fluid nozzle 1 and the outer peripheral nozzle 18 are provided separately, the multiphase fluid nozzle 1 and the outer peripheral nozzle 18 are fixed together with, for example, a hexagonal bolt.

[0099] Alternatively, the multiphase fluid nozzle 1 and the outer peripheral nozzle 18 may be provided as separate bodies, with the outer peripheral nozzle 18 provided so as to be movable in a direction parallel to the injection direction of the multiphase fluid. That is, the outer peripheral nozzle 18 may be provided so as to adjust the distance between the outer peripheral nozzle 18 and the mounting surface 303. By providing the outer peripheral nozzle 18 so as to be movable in a direction parallel to the injection direction of the multiphase fluid, the distance between the outer peripheral nozzle injection port 13 and the mounting surface 303 can be set independently of the distance between the multiphase fluid nozzle injection port 9 and the mounting surface 303.

[0100] Because the peripheral nozzle 18 is provided so as to be movable in a direction parallel to the injection direction of the multiphase fluid, the distance between the peripheral nozzle outlet 13 and the mounting surface 303 and the object to be cleaned 304 can be changed according to the amount of gas and liquid flowing into the multiphase fluid nozzle 1 and the peripheral nozzle 18. Because the distance between the peripheral nozzle outlet 13 and the mounting surface 303 and the object to be cleaned 304 can be changed according to the amount of gas and liquid flowing into the multiphase fluid nozzle 1 and the peripheral nozzle 18, the cleaning performance of the cleaning nozzle 204 and the efficiency of converting the gas contained in the multiphase fluid injected from the multiphase fluid nozzle outlet 9 into liquid can be improved.

[0101] Embodiment 5. A cleaning nozzle 205 in the fifth embodiment will be described with reference to Fig. 6. Descriptions of the same configuration as in the third embodiment will be omitted. In Fig. 6, the same reference numerals as in Figs. 1 to 5 indicate the same or corresponding parts.

[0102] Fig. 6 is a cross-sectional view of a cleaning nozzle 205 according to embodiment 5. As shown in Fig. 6, the cleaning nozzle 205 according to this embodiment has a different shape of the outer circumferential nozzle 22 from the shape of the outer circumferential nozzle 18 of embodiment 3. The following description will focus on the differences from the cleaning nozzle 203 of embodiment 3.

[0103] The cleaning nozzle 205 of this embodiment includes a connection part 23. The connection part 23 connects the multiphase fluid nozzle 1 and the outer peripheral nozzle 22. As shown in FIG. 6, the connection part 23 is provided integrally with the outer peripheral nozzle 22, and connects the multiphase fluid nozzle 1 and the outer peripheral nozzle 22.

[0104] The connection part 23 includes a connection part facing surface 25 on the side of the injection direction of the multiphase fluid. That is, the connection part 23 includes a connection part facing surface 25 that faces the mounting surface 303 and the object to be cleaned 304 on the side of the mounting surface 303 and the object to be cleaned 304. The connection part facing surface 25 is, for example, a surface parallel to the mounting surface 303 and the object to be cleaned 304.

[0105] The connection part facing surface 25 is provided in the opposite direction to the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9. In other words, the distance between the connection part facing surface 25 and the mounting surface 303 and the object to be cleaned 304 is greater than the distance between the multiphase fluid nozzle outlet 9 and the mounting surface 303 and the object to be cleaned 304.

[0106] The outer peripheral nozzle 22 includes a wall portion 24. The wall portion 24 is provided to extend in the injection direction of the multiphase fluid from the connection portion opposing surface 20. The wall portion 24 is provided so as to surround the multiphase fluid nozzle outlet 9. Furthermore, the wall portion 24 is provided so as to surround the outer peripheral nozzle outlet 13.

[0107] The wall portion 24 has an end portion on the opposite side to the injection direction of the multiphase fluid. The connection portion 23 connects the end portion of the wall portion 24 on the opposite side to the injection direction of the multiphase fluid to the multiphase fluid nozzle 1. The wall portion 24 also has an end portion on the side of the injection direction of the multiphase fluid.

[0108] 6, there is an area 26 surrounded by the connection portion facing surface 25 and the wall portion 24. In other words, the outer peripheral nozzle 22 has a cup-like shape. Gas and the like can accumulate in the area 26 surrounded by the connection portion facing surface 25 and the wall portion 24. By accumulating the gas in the area 26, the amount of gas scattering can be reduced.

[0109] The existence of area 26 surrounded by the connection portion opposing surface 25 and wall portion 24 allows gas to accumulate in area 26, making it easier for the gas contained in the multiphase fluid ejected from the multiphase fluid nozzle ejection outlet 9 to mix with the liquid ejected from the outer peripheral nozzle ejection outlet 13 compared to when area 26 surrounded by the connection portion opposing surface 25 and wall portion 24 does not exist, thereby increasing the efficiency of converting the gas contained in the multiphase fluid ejected from the multiphase fluid nozzle ejection outlet 9 into liquid.

[0110] The connection part 23 according to this embodiment has the outer peripheral nozzle outlet 13 on the connection part facing surface 25. That is, the outer peripheral nozzle outlet 13 is provided on the connection part facing surface 25. That is, the multiphase fluid injected from the outer peripheral nozzle outlet 13 is injected into a region 26 surrounded by the connection part facing surface 25 and the wall part 24.

[0111] By ejecting the liquid ejected from the outer peripheral nozzle ejection outlet 13 into the area 26 surrounded by the connection portion opposing surface 25 and the wall portion 24, the gas accumulating in the area 26 surrounded by the connection portion opposing surface 25 and the wall portion 24 and the liquid ejected from the outer peripheral nozzle ejection outlet 13 are more easily mixed, thereby increasing the efficiency of converting the gas contained in the multiphase fluid ejected from the multiphase fluid nozzle ejection outlet 9 into liquid.

[0112] The connection part facing surface 25 is provided in the opposite direction to the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9, and therefore the outer circumferential nozzle outlet 13 provided on the connection part facing surface 25 is provided in the opposite direction to the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet 9. In other words, the distance between the outer circumferential nozzle outlet 13 and the mounting surface 303 and the object to be cleaned 304 is greater than the distance between the multiphase fluid nozzle outlet 9 and the mounting surface 303 and the object to be cleaned 304.

[0113] In this embodiment, the outer peripheral nozzle inlet 11 and the outer peripheral nozzle internal flow passage 12 are provided in the connection portion 23. The outer peripheral nozzle inlet 11 and the outer peripheral nozzle internal flow passage 12 may be provided in the wall portion 24.

[0114] In this embodiment, the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17 are provided on the same plane, and the connection portion facing surface 25 is provided at a position farther from the mounting surface 303 and the object to be cleaned 304 than the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17.

[0115] It is not necessary that the multiphase fluid nozzle facing surface 16 and the outer peripheral nozzle facing surface 17 are provided on the same plane. Also, the connection portion facing surface 25 may include, for example, a step.

[0116] The connecting portion 23 may be provided as a separate body from the wall portion 24 of the outer peripheral nozzle 22. The connecting portion 23 may be provided integrally with the multiphase fluid nozzle 1.

[0117] Embodiment 6 A cleaning nozzle 206 in the sixth embodiment will be described with reference to Fig. 7. Descriptions of the same configuration as in the fifth embodiment will be omitted. In Fig. 7, the same reference numerals as in Figs. 1 to 6 indicate the same or corresponding parts.

[0118] Fig. 7 is a cross-sectional view of a cleaning nozzle 206 according to embodiment 6. As shown in Fig. 7, the cleaning nozzle 206 according to this embodiment differs from the cleaning nozzle 205 of embodiment 5 in the positional relationship between the multiphase fluid nozzle 1 and the outer peripheral nozzle 22. The following description will focus on the differences from the cleaning nozzle 205 of embodiment 5.

[0119] In this embodiment, the outer peripheral nozzle facing surface 17 is provided in the injection direction of the multiphase fluid from the multiphase fluid nozzle facing surface 16. In other words, the distance between the outer peripheral nozzle facing surface 17 and the mounting surface 303 is smaller than the distance between the multiphase fluid nozzle facing surface 16 and the mounting surface 303.

[0120] The connection portion facing surface 25 is provided at a position farther from the mounting surface 303 and the object to be cleaned 304 than the multiphase fluid nozzle facing surface 16 and the outer circumferential nozzle facing surface 17. The connection portion facing surface 25 may include, for example, a step.

[0121] The multiphase fluid nozzle 1 and the outer peripheral nozzle 22 may be provided separately or integrally. When the multiphase fluid nozzle 1 and the outer peripheral nozzle 22 are provided separately, the multiphase fluid nozzle 1 and the outer peripheral nozzle 22 are fixed together with, for example, a hexagonal bolt.

[0122] Alternatively, the multiphase fluid nozzle 1 and the outer peripheral nozzle 22 may be provided as separate bodies, with the outer peripheral nozzle 22 provided so as to be movable in a direction parallel to the injection direction of the multiphase fluid. By providing the outer peripheral nozzle 22 so as to be movable in a direction parallel to the injection direction of the multiphase fluid, the distance between the outer peripheral nozzle outlet 13 and the mounting surface 303 can be set independently of the distance between the multiphase fluid nozzle outlet 9 and the mounting surface 303.

[0123] Because the peripheral nozzle 22 is provided so as to be movable in a direction parallel to the injection direction of the multiphase fluid, the distance between the peripheral nozzle outlet 13 and the mounting surface 303 and the object to be cleaned 304 can be changed according to the amount of gas and liquid flowing into the multiphase fluid nozzle 1 and the peripheral nozzle 22. Because the distance between the peripheral nozzle outlet 13 and the mounting surface 303 and the object to be cleaned 304 can be changed according to the amount of gas and liquid flowing into the multiphase fluid nozzle 1 and the peripheral nozzle 22, the cleaning performance of the cleaning nozzle 206 and the efficiency of converting the gas contained in the multiphase fluid injected from the multiphase fluid nozzle outlet 9 into liquid can be improved.

[0124] Embodiment 7 A cleaning nozzle 207 in the seventh embodiment will be described with reference to Fig. 8. Descriptions of configurations similar to those in the first embodiment will be omitted. In Fig. 8, the same reference numerals as those in Figs. 1 to 7 denote the same or corresponding parts.

[0125] Fig. 8 is a plan view of the cleaning nozzle 207 according to the seventh embodiment. Fig. 8 is a view of the cleaning nozzle 207 as viewed from the stage 301 side. As shown in Fig. 8, the cleaning nozzle 207 includes a multiphase fluid nozzle 31 and a peripheral nozzle 32.

[0126] The multiphase fluid nozzle 31 includes a multiphase fluid nozzle outlet 33. For example, one multiphase fluid nozzle outlet 33 is provided in the multiphase fluid nozzle 31. Note that two or more multiphase fluid nozzle outlets 33 may be provided.

[0127] The multiphase fluid nozzle outlet 33 may have a shape that combines straight lines and arcs, for example, as shown in Fig. 8. The multiphase fluid nozzle outlet 33 may also be circular or elliptical, or may have a shape that combines only straight lines, or may have a shape that combines only arcs. The size of the multiphase fluid nozzle outlet 33 can be changed as appropriate. The size of the multiphase fluid nozzle outlet 33 may be, for example, a rectangle of 2 mm x 7 mm. By changing the size of the multiphase fluid nozzle outlet 33 as appropriate, the ability of the cleaning nozzle 207 to remove foreign matter from the cleaning target 304 can be improved.

[0128] The peripheral nozzle 32 includes a peripheral nozzle outlet 34. For example, a plurality of peripheral nozzle outlets 34 are provided in the peripheral nozzle 32. As shown in Fig. 8, for example, 16 peripheral nozzle outlets 34 are provided in the peripheral nozzle 32. The multiple peripheral nozzle outlets 34 are arranged, for example, in an annular arrangement at intervals so as to surround the multiphase fluid nozzle 31 in the direction in which the multiphase fluid is ejected.

[0129] The outer peripheral nozzle outlet 34 may be provided in the wall portion 21, or may be provided in the connection portion facing surface 25. Moreover, the outer peripheral nozzle outlet 34 may be provided in both the wall portion 21 and the connection portion facing surface 25.

[0130] The outer peripheral nozzle outlet 34 may have a shape that combines straight lines and arcs, for example, as shown in Fig. 8. The outer peripheral nozzle outlet 34 may also have a circular or elliptical shape, a shape that combines only straight lines, or a shape that combines only arcs.

[0131] Embodiment 8 A cleaning nozzle 208 in the eighth embodiment will be described with reference to Fig. 9. Descriptions of configurations similar to those in the first embodiment will be omitted. In Fig. 9, the same reference numerals as those in Figs. 1 to 8 indicate the same or corresponding parts.

[0132] Fig. 9 is a plan view of the cleaning nozzle 208 according to the eighth embodiment. Fig. 9 is a view of the cleaning nozzle 208 as viewed from the stage 301 side. As shown in Fig. 9, the cleaning nozzle 208 includes a multiphase fluid nozzle 35 and a peripheral nozzle 36.

[0133] The multiphase fluid nozzle 35 includes a multiphase fluid nozzle outlet 37. For example, one multiphase fluid nozzle outlet 37 is provided in the multiphase fluid nozzle 35. Note that two or more multiphase fluid nozzle outlets 37 may be provided.

[0134] The multiphase fluid nozzle outlet 37 may have a shape that combines straight lines and arcs, for example, as shown in Fig. 9. Furthermore, the multiphase fluid nozzle outlet 37 may be circular or elliptical, or may have a shape that combines only straight lines, or may have a shape that combines only arcs.

[0135] The outer circumferential nozzle 36 includes an outer circumferential nozzle outlet 38. For example, a plurality of the outer circumferential nozzle outlets 38 are provided in the outer circumferential nozzle 36. As shown in Fig. 9, for example, 32 outer circumferential nozzle outlets 38 are provided in the outer circumferential nozzle 36. The multiple outer circumferential nozzle outlets 38 are formed in annular shapes, for example, 16 outlets per annular shape, and are arranged concentrically so as to surround the multiphase fluid nozzle 31.

[0136] The outer circumferential nozzle ejection outlet 38 may be provided in the wall portion 21, or may be provided in the connection portion facing surface 25. Furthermore, the outer circumferential nozzle ejection outlet 38 may be provided in both the wall portion 21 and the connection portion facing surface 25. When the outer circumferential nozzle ejection outlet 38 is formed in an annular shape and there are two rings, one of them may be provided in the wall portion 21 and the other may be provided in the connection portion facing surface 25. Furthermore, the number of rings formed by the outer circumferential nozzle ejection outlet 38 may be three or more.

[0137] The outer peripheral nozzle outlet 38 may have a shape that combines straight lines and arcs, for example, as shown in Fig. 9. The outer peripheral nozzle outlet 38 may also have a circular or elliptical shape, a shape that combines only straight lines, or a shape that combines only arcs.

[0138] Embodiment 9 A cleaning nozzle 209 in the ninth embodiment will be described with reference to Fig. 10. Descriptions of configurations similar to those in the first embodiment will be omitted. In Fig. 10, the same reference numerals as those in Figs. 1 to 9 denote the same or corresponding parts.

[0139] Fig. 10 is a plan view of the cleaning nozzle 209 according to the 9th embodiment. Fig. 10 is a view of the cleaning nozzle 209 as viewed from the stage 301 side. As shown in Fig. 10, the cleaning nozzle 209 includes a multiphase fluid nozzle 39 and a peripheral nozzle 40.

[0140] The multiphase fluid nozzle 39 includes a multiphase fluid nozzle outlet 41. For example, one multiphase fluid nozzle outlet 41 is provided in the multiphase fluid nozzle 39. Note that two or more multiphase fluid nozzle outlets 41 may be provided.

[0141] The multiphase fluid nozzle outlet 41 may be, for example, circular, as shown in Fig. 10. Furthermore, the multiphase fluid nozzle outlet 41 may be circular or elliptical, or may have a shape formed by combining only straight lines, a shape formed by combining only arcs, or a shape formed by combining straight lines and arcs.

[0142] The peripheral nozzle 40 includes a peripheral nozzle outlet 42. For example, a plurality of the peripheral nozzle outlets 42 are provided in the peripheral nozzle 40. As shown in Fig. 10, for example, 16 peripheral nozzle outlets 42 are provided in the peripheral nozzle 40. The multiple peripheral nozzle outlets 42 are arranged, for example, in an annular shape so as to surround the multiphase fluid nozzle 39.

[0143] The outer peripheral nozzle outlet 42 may be provided in the wall portion 21, or may be provided in the connection portion facing surface 25. Moreover, the outer peripheral nozzle outlet 42 may be provided in both the wall portion 21 and the connection portion facing surface 25.

[0144] The outer peripheral nozzle outlet 42 may have a shape that combines straight lines and arcs, for example, as shown in Fig. 10. The outer peripheral nozzle outlet 42 may also have a circular or elliptical shape, a shape that combines only straight lines, a shape that combines only arcs, or a shape that combines straight lines and arcs.

[0145] Embodiment 10 A cleaning nozzle 210 in the tenth embodiment will be described with reference to Fig. 11. Description of the same configuration as in the first embodiment will be omitted. In Fig. 11, the same reference numerals as in Figs. 1 to 10 indicate the same or corresponding parts.

[0146] Fig. 11 is a plan view of the cleaning nozzle 210 according to the embodiment 10. Fig. 11 is a view of the cleaning nozzle 210 as viewed from the stage 301 side. As shown in Fig. 11, the cleaning nozzle 210 includes a multiphase fluid nozzle 43 and a peripheral nozzle 44.

[0147] The multiphase fluid nozzle 43 includes a multiphase fluid nozzle outlet 45. For example, one multiphase fluid nozzle outlet 45 is provided in the multiphase fluid nozzle 43. Note that two or more multiphase fluid nozzle outlets 45 may be provided.

[0148] The multiphase fluid nozzle outlet 45 may be, for example, circular, as shown in Fig. 11. Furthermore, the multiphase fluid nozzle outlet 45 may be circular or elliptical, or may have a shape formed by combining only straight lines, a shape formed by combining only circular arcs, or a shape formed by combining straight lines and circular arcs.

[0149] The outer circumferential nozzle 44 includes an outer circumferential nozzle outlet 46. For example, one outer circumferential nozzle outlet 46 is provided in the outer circumferential nozzle 44. As shown in Fig. 10, for example, one outer circumferential nozzle outlet 46 is provided in a ring shape such that a plurality of outer circumferential nozzle outlets 46 are continuously provided so as to surround the multiphase fluid nozzle 39. Note that two or more outer circumferential nozzle outlets 46 may be provided.

[0150] The outer peripheral nozzle outlet 46 may be provided in the wall portion 21, or may be provided in the connection portion facing surface 25. In addition, when two or more outer peripheral nozzle outlets 46 are provided, they may be provided in both the wall portion 21 and the connection portion facing surface 25.

[0151] The outer peripheral nozzle outlet 46 may have a shape made up of a combination of circles, as shown in Fig. 11. The outer peripheral nozzle outlet 46 may also have a shape made up of a combination of straight lines only, a combination of arcs only, or a combination of straight lines and arcs.

[0152] Embodiment 11 A method for manufacturing a semiconductor device according to the eleventh embodiment will be described below. Descriptions of the same configuration as in the first embodiment will be omitted.

[0153] The method for manufacturing a semiconductor device in this embodiment includes a mounting step 1001 in which a semiconductor substrate is mounted on a stage, a grinding step 1002 in which the semiconductor substrate mounted on the stage in the mounting step 1001 is ground to reduce its thickness, and a cleaning step 1003 in which the ground surface of the semiconductor substrate ground in the grinding step 1002 is cleaned with a cleaning nozzle 201. The mounting step 1001, the grinding step 1002, and the cleaning step 1003 are performed in this order. That is, the grinding step 1002 is performed between the mounting step 1001 and the cleaning step 1003.

[0154] In the grinding process 1002, the semiconductor substrate is ground to reduce its thickness. That is, the semiconductor substrate is ground to reduce its thickness. The cleaning nozzle used in the cleaning process 1003 may be any of the cleaning nozzles 201 to 210 according to the first to tenth embodiments. In the cleaning process 1003, cleaning refers to removing foreign matter from the object to be cleaned 304, for example. The cleaning process 1003 is sometimes called a foreign matter removal process.

[0155] By including the cleaning step 1003 in the semiconductor element manufacturing method, it is possible to obtain a semiconductor element while reducing the amount of scattering of the injected gas compared to the conventional method. Also, by including the cleaning step 1003 in the semiconductor element manufacturing method, it is possible to increase the efficiency of removing debris generated by grinding.

[0156] In addition, in each of the above embodiments described in this specification, the material, material, size, shape, relative positional relationship, or implementation conditions of each component may be described, but these are examples in all aspects and are not limited to the embodiments described. Therefore, countless modified examples not exemplified are expected within the scope of each embodiment. For example, this includes cases where any component is modified, added, or omitted, and further cases where at least one component in at least one embodiment is extracted and combined with a component of another embodiment.

[0157] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0158] Various aspects of the present disclosure are summarized below as appendices.

[0159] (Appendix 1) a multiphase fluid nozzle that ejects a multiphase fluid including a gas containing water molecules and a liquid containing water molecules from a multiphase fluid nozzle ejection port; and a peripheral nozzle having a peripheral nozzle outlet surrounding the multiphase fluid nozzle outlet and injecting a liquid. Cleaning nozzle. (Appendix 2) a multiphase fluid nozzle that ejects a multiphase fluid including a gas containing water molecules and a liquid containing water molecules from a multiphase fluid nozzle ejection port; an outer circumferential nozzle for injecting a liquid, the outer circumferential nozzle having a wall portion provided so as to surround the multiphase fluid nozzle, a connection portion for connecting an end portion of the wall portion opposite to the injection direction of the multiphase fluid and the multiphase fluid nozzle, and an outer circumferential nozzle outlet provided on the wall portion and at an end portion of the wall portion on the injection direction side of the multiphase fluid; A cleaning nozzle equipped with (Appendix 3) a multiphase fluid nozzle that ejects a multiphase fluid including a gas containing water molecules and a liquid containing water molecules from a multiphase fluid nozzle ejection port; a wall section provided so as to surround the multiphase fluid nozzle, a connection section that connects an end of the wall section on the opposite side to the injection direction of the multiphase fluid to the multiphase fluid nozzle and has a connection section facing surface that is on the side of the injection direction of the multiphase fluid, and a peripheral nozzle that is provided on the connection section and has an peripheral nozzle injection port on the connection section facing surface, and that ejects liquid; A cleaning nozzle equipped with (Appendix 4) The multiphase fluid nozzle outlet and the outer peripheral nozzle outlet are provided on the same plane perpendicular to the injection direction of the multiphase fluid. 4. A cleaning nozzle according to any one of claims 1 to 3. (Appendix 5) The outer peripheral nozzle outlet is provided in the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet. 4. A cleaning nozzle according to any one of claims 1 to 3. (Appendix 6) The multiphase fluid nozzle and the outer peripheral nozzle are provided separately, The peripheral nozzle is movable in a direction parallel to the injection direction of the multiphase fluid. 4. A cleaning nozzle according to any one of claims 1 to 3. (Appendix 7) The outer peripheral nozzle outlet is provided in a plurality of locations so as to surround the multiphase fluid nozzle outlet. 7. A cleaning nozzle according to any one of claims 1 to 6. (Appendix 8) The outer peripheral nozzle outlet is provided in an annular shape so as to surround the multiphase fluid nozzle outlet. 7. A cleaning nozzle according to any one of claims 1 to 6. (Appendix 9) A cleaning nozzle according to any one of claims 1 to 8, a stage provided opposite the cleaning nozzle and having a mounting surface on which an object to be cleaned is mounted; A cleaning device comprising: (Appendix 10) a mounting step of mounting the semiconductor substrate on a stage; A cleaning step of cleaning the ground surface of the semiconductor substrate with the cleaning nozzle according to any one of claims 1 to 9. A method for manufacturing a semiconductor device. (Appendix 11) a grinding step of grinding the semiconductor substrate mounted on the stage to reduce a thickness of the semiconductor substrate between the mounting step and the cleaning step, A method for manufacturing a semiconductor device according to claim 10. [Explanation of symbols]

[0160] 1, 31, 35, 39, 43 Multiphase fluid nozzle, 2, 18, 22, 32, 36, 40, 44 Outer peripheral nozzle, 9, 33, 37, 41, 45 Multiphase fluid nozzle outlet, 13, 34, 38, 42, 46 Outer peripheral nozzle outlet, 19, 23 Connection part, 20, 25 Connection part facing surface, 21, 24 Wall part, 101 Cleaning device, 201, 202, 203, 204, 205, 206, 207, 208, 209, 210 Cleaning nozzle, 301 Stage, 302 Exhaust horn, 303 Mounting surface, 304 Cleaning object

Claims

1. a multiphase fluid nozzle that ejects a multiphase fluid including a gas containing water molecules and a liquid containing water molecules from a multiphase fluid nozzle ejection port; An outer circumferential nozzle having an outer circumferential nozzle outlet surrounding the multiphase fluid nozzle outlet and injecting a liquid. Cleaning nozzle.

2. a multiphase fluid nozzle that ejects a multiphase fluid including a gas containing water molecules and a liquid containing water molecules from a multiphase fluid nozzle ejection port; an outer circumferential nozzle for injecting a liquid, the outer circumferential nozzle having a wall portion provided so as to surround the multiphase fluid nozzle, a connection portion for connecting an end portion of the wall portion opposite to the injection direction of the multiphase fluid and the multiphase fluid nozzle, and an outer circumferential nozzle outlet provided on the wall portion and at an end portion of the wall portion on the injection direction side of the multiphase fluid; A cleaning nozzle equipped with

3. a multiphase fluid nozzle that ejects a multiphase fluid including a gas containing water molecules and a liquid containing water molecules from a multiphase fluid nozzle ejection port; a wall section provided so as to surround the multiphase fluid nozzle, a connection section that connects an end of the wall section on the opposite side to the injection direction of the multiphase fluid to the multiphase fluid nozzle and has a connection section facing surface that is on the side of the injection direction of the multiphase fluid, and a peripheral nozzle that is provided on the connection section and has an peripheral nozzle injection port on the connection section facing surface, and that ejects liquid; A cleaning nozzle equipped with

4. The multiphase fluid nozzle outlet and the peripheral nozzle outlet are provided on the same plane perpendicular to the injection direction of the multiphase fluid. The cleaning nozzle according to claim 1 .

5. The outer peripheral nozzle outlet is provided in the injection direction of the multiphase fluid from the multiphase fluid nozzle outlet. The cleaning nozzle according to claim 1 .

6. The multiphase fluid nozzle and the outer peripheral nozzle are provided separately, The peripheral nozzle is movable in a direction parallel to the injection direction of the multiphase fluid. The cleaning nozzle according to claim 1 .

7. The outer peripheral nozzle outlet is provided in a plurality of locations so as to surround the multiphase fluid nozzle outlet. The cleaning nozzle according to claim 1 .

8. The outer peripheral nozzle outlet is provided in an annular shape so as to surround the multiphase fluid nozzle outlet. The cleaning nozzle according to claim 1 .

9. A cleaning nozzle according to any one of claims 1 to 3; a stage provided opposite the cleaning nozzle and having a mounting surface on which an object to be cleaned is mounted; A cleaning device comprising:

10. a mounting step of mounting the semiconductor substrate on a stage; A cleaning step of cleaning the ground surface of the semiconductor substrate with the cleaning nozzle according to any one of claims 1 to 3. A method for manufacturing a semiconductor device.

11. a grinding step of grinding the semiconductor substrate mounted on the stage to reduce a thickness of the semiconductor substrate between the mounting step and the cleaning step, The method for manufacturing a semiconductor device according to claim 10 .

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