Printed circuit board and manufacturing method of the same

Abstract

To provide a printed circuit board which contains a glass layer, and can improve reliability while reducing a possibility of damages at a singulation, and provide a manufacturing method of the printed circuit board.SOLUTION: A present disclosure regards to a printed circuit board and a manufacturing method of the same. The printed circuit board contains: a first side surface and a second side surface that are opposite to each other in a first direction; a third side surface and a fourth side surface that are opposite to each other in a second direction that is vertical to the first direction; a first corner part that couples the first side surface and the third side surface; a second corner part that couples the first side surface and the fourth side surface; a glass layer that includes a third corner part coupling the second side surface and the third side surface and a fourth corner part coupling the second side surface and the fourth side surface; a first insulation layer that is arranged onto the glass layer, and covers at least one part of at least one side surface of the first to fourth side surfaces; and a second insulation layer that is arranged onto the first insulation layer, and covers at least one corner part of the first to fourth corner parts.SELECTED DRAWING: Figure 3b

Description

[Technical field]

[0001] The present disclosure relates to printed circuit boards and methods for manufacturing printed circuit boards. [Background technology]

[0002] Recently, with the development of artificial intelligence (AI) technology, multi-chip packages containing memory chips such as HBM (High Bandwidth Memory) and processor chips such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), and FPGA (Field Programmable Gate Array) are being used to process data that has increased exponentially. Therefore, attempts to use glass materials have been ongoing. However, when using glass materials, there is a high possibility of defects due to breakage such as cracking, and finished products containing glass materials are particularly vulnerable to impacts during the singulation stage. Summary of the Invention [Problem to be solved by the invention]

[0003] One of several objects of the present disclosure is to provide a printed circuit board that includes a glass layer and a method for making the printed circuit board.

[0004] Another of several objects of the present disclosure is to provide a printed circuit board and a method for manufacturing the printed circuit board that is less likely to break during singulation.

[0005] Another of several objectives of the present disclosure is to provide a printed circuit board and a method for manufacturing a printed circuit board that can improve reliability. [Means for solving the problem]

[0006] One of several solutions proposed through the present disclosure is to provide a printed circuit board including a glass layer having a first side and a second side facing each other in a first direction, a third side and a fourth side facing each other in a second direction perpendicular to the stacking direction and the first direction, a first corner portion connecting the first side and the third side to each other, a second corner portion connecting the first side and the fourth side to each other, a third corner portion connecting the second side and the third side to each other, and a fourth corner portion connecting the second side and the fourth side to each other, a first insulating layer disposed on the glass layer and covering at least a portion of at least one of the first side to the fourth side, and a second insulating layer disposed on the first insulating layer and covering at least one corner portion of the first corner portion to the fourth corner portion.

[0007] Another of several solutions proposed through the present disclosure is to provide a printed circuit board including: a glass layer having a first side and a second side facing each other in a first direction perpendicular to the stacking direction, a third side and a fourth side facing each other in a second direction perpendicular to the stacking direction and the first direction, a first corner portion connecting the first side and the third side to each other, a second corner portion connecting the first side and the fourth side to each other, a third corner portion connecting the second side and the third side to each other, and a fourth corner portion connecting the second side and the fourth side to each other; and an insulating material disposed on the glass layer and covering the first to fourth side sides and the first to fourth corner portions, wherein at least one of the first to fourth corner portions has a plurality of corners. Effect of the Invention

[0008] Among other advantages, the present disclosure may provide a printed circuit board including a glass layer and a method for making the printed circuit board.

[0009] Another advantage of the present disclosure is that it provides a printed circuit board and a method for manufacturing the printed circuit board that are less likely to be damaged during singulation.

[0010] Another advantage of the present disclosure, among other advantages, is that it is possible to provide a printed circuit board and a method for manufacturing a printed circuit board that can improve reliability. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a block diagram illustrating an example of an electronic device system. [Diagram 2] FIG. 1 is a perspective view illustrating an example of an electronic device. [Figure 3a] FIG. 1 is a cross-sectional view illustrating an example of a printed circuit board. [Figure 3b] FIG. 2 is a top cross-sectional view of the glass layer of the printed circuit board. [Figure 4a] 3A and 3B are perspective and cross-sectional views illustrating a step of forming a first through hole in a method for manufacturing a printed circuit board. [Figure 4b] 3A and 3B are perspective and cross-sectional views illustrating a step of forming a first through hole in a method for manufacturing a printed circuit board. [Figure 4c] 3A and 3B are perspective and cross-sectional views illustrating a step of forming a first through hole in a method for manufacturing a printed circuit board. [Figure 4d] 3A and 3B are perspective and cross-sectional views illustrating a step of forming a first through hole in a method for manufacturing a printed circuit board. [Figure 5a] 2A and 2B are perspective and cross-sectional views illustrating a through via forming step in a method for manufacturing a printed circuit board. [Figure 5b] 2A and 2B are perspective and cross-sectional views illustrating a through via forming step in a method for manufacturing a printed circuit board. [Figure 5c] 2A and 2B are perspective and cross-sectional views illustrating a through via forming step in a method for manufacturing a printed circuit board. [Figure 5d] 2A and 2B are perspective and cross-sectional views illustrating a through via forming step in a method for manufacturing a printed circuit board. [Figure 6a] 3A and 3B are an exploded perspective view and a cross-sectional view illustrating a step of forming a first insulating layer in a method for manufacturing a printed circuit board. [Figure 6b]3A and 3B are an exploded perspective view and a cross-sectional view illustrating a step of forming a first insulating layer in a method for manufacturing a printed circuit board. [Figure 6c] 3A and 3B are an exploded perspective view and a cross-sectional view illustrating a step of forming a first insulating layer in a method for manufacturing a printed circuit board. [Figure 6d] 3A and 3B are an exploded perspective view and a cross-sectional view illustrating a step of forming a first insulating layer in a method for manufacturing a printed circuit board. [Figure 7a] 3A and 3B are a developed perspective view and a cross-sectional view showing a step of forming a first wiring layer in a method for manufacturing a printed circuit board. [Figure 7b] 3A and 3B are a developed perspective view and a cross-sectional view showing a step of forming a first wiring layer in a method for manufacturing a printed circuit board. [Figure 7c] 3A and 3B are a developed perspective view and a cross-sectional view showing a step of forming a first wiring layer in a method for manufacturing a printed circuit board. [Figure 7d] 3A and 3B are a developed perspective view and a cross-sectional view showing a step of forming a first wiring layer in a method for manufacturing a printed circuit board. [Figure 8a] 4A and 4B are a developed perspective view and a cross-sectional view illustrating a step of forming a second through hole in a method for manufacturing a printed circuit board. [Figure 8b] 4A and 4B are a developed perspective view and a cross-sectional view illustrating a step of forming a second through hole in a method for manufacturing a printed circuit board. [Figure 8c] 4A and 4B are a developed perspective view and a cross-sectional view illustrating a step of forming a second through hole in a method for manufacturing a printed circuit board. [Figure 8d] 4A and 4B are a developed perspective view and a cross-sectional view illustrating a step of forming a second through hole in a method for manufacturing a printed circuit board. [Figure 9a] 3A and 3B are an exploded perspective view and a cross-sectional view illustrating a step of forming a second insulating layer in a method for manufacturing a printed circuit board. [Figure 9b] 3A and 3B are an exploded perspective view and a cross-sectional view illustrating a step of forming a second insulating layer in a method for manufacturing a printed circuit board. [Figure 9c] 3A and 3B are an exploded perspective view and a cross-sectional view illustrating a step of forming a second insulating layer in a method for manufacturing a printed circuit board. [Figure 9d]3A and 3B are an exploded perspective view and a cross-sectional view illustrating a step of forming a second insulating layer in a method for manufacturing a printed circuit board. [Figure 10] 4A to 4C are cross-sectional views illustrating a step of further forming another component in the method of manufacturing a printed circuit board. [Figure 11] 4A to 4C are cross-sectional views illustrating a step of separating unit areas in a method for manufacturing a printed circuit board. [Figure 12a] 1A-1C are top cross-sectional views of glass layers of a printed circuit board according to various examples. [Figure 12b] 1A-1C are top cross-sectional views of glass layers of a printed circuit board according to various examples. [Figure 12c] 1A-1C are top cross-sectional views of glass layers of a printed circuit board according to various examples. [Figure 12d] 1A-1C are top cross-sectional views of glass layers of a printed circuit board according to various examples. [Figure 12e] 1A-1C are top cross-sectional views of glass layers of a printed circuit board according to various examples. [Figure 12f] 1A-1C are top cross-sectional views of glass layers of a printed circuit board according to various examples. [Figure 12g] 1A-1C are top cross-sectional views of glass layers of a printed circuit board according to various examples. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the present disclosure will be described with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be scaled (or highlighted or simplified) for a clearer description.

[0013] (electronic equipment) FIG. 1 is a block diagram illustrating an example of an electronic device system.

[0014] Referring to the drawing, an electronic device 1000 houses a main board 1010. Chip-related components 1020, network-related components 1030, and other components 1040 are physically and / or electrically connected to the main board 1010. These are also coupled to other electronic components described below to form various signal lines 1090.

[0015] The chip-related components 1020 include, but are not limited to, memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPU), graphic processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs). In addition, these chip-related components 1020 may be combined with each other. The chip-related components 1020 may be in the form of a package including the above-mentioned chips and electronic components.

[0016] The network-related components 1030 may include, but are not limited to, any other wireless and wired protocols designated as Wi-Fi (such as the IEEE 802.11 family), WiMAX (such as the IEEE 802.16 family), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and beyond, and may include any of a number of other wireless or wired standards or protocols. The network-related components 1030 may also be combined with the chip-related components 1020 together.

[0017] The other components 1040 include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCC (multi-layer ceramic capacitors), etc. However, the other components 1040 are not limited to these, and may include passive elements in the form of chip components used for various other applications. In addition, the other components 1040 may be combined with the chip-related components 1020 and / or the network-related components 1030.

[0018] Depending on the type of electronic device 1000, the electronic device 1000 may include other electronic components that may or may not be physically and / or electrically connected to the main board 1010. Examples of other electronic components include, but are not limited to, a camera module 1050, an antenna module 1060, a display 1070, and a battery 1080. Other electronic components may include, but are not limited to, an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a compact disk (CD), a digital versatile disk (DVD), and the like. In addition, other electronic components used for various purposes may be included depending on the type of electronic device 1000.

[0019] The electronic device 1000 may be a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet, a laptop, a netbook, a television, a video game, a smart watch, an automotive, etc. However, the electronic device 1000 is not limited to these, and may be any other electronic device that processes data.

[0020] FIG. 2 is a perspective view that illustrates an example of an electronic device.

[0021] Referring to the drawings, the electronic device may be, for example, a smartphone 1100. A motherboard 1110 is housed inside the smartphone 1100, and various components 1120 are physically and / or electrically connected to the motherboard 1110. In addition, other components, such as a camera module 1130 and / or a speaker 1140, which may or may not be physically and / or electrically connected to the motherboard 1110, are housed inside the smartphone 1100. Some of the components 1120 may be the above-mentioned chip-related components, for example, a component package 1121, but are not limited thereto. The component package 1121 may be in the form of a printed circuit board on which electronic components including active components and / or passive components are mounted on a surface. Alternatively, the component package 1121 may be in the form of a printed circuit board in which active components and / or passive components are built in. Meanwhile, the electronic device is not necessarily limited to the smartphone 1100, but may be other electronic devices as described above.

[0022] (Printed Circuit Board) FIG. 3a is a cross-sectional view that illustrates a schematic example of a printed circuit board.

[0023] 3a, the printed circuit board according to an example may include a glass layer 110, a first insulating layer 111 disposed on the glass layer 110 and covering a portion of a side surface of the glass layer 110, and a second insulating layer 112 disposed on the first insulating layer 111 and covering a remaining portion of a side surface of the glass layer 110. The printed circuit board according to an example may include a through via 130 penetrating the glass layer 110, a first wiring layer 121 disposed on the first insulating layer 111, a first via layer 131 penetrating the first insulating layer 111 to connect the first wiring layer 121 and the through via 130 to each other, a second wiring layer 122 disposed on the second insulating layer 112, and a second via layer 132 penetrating the second insulating layer 112 to connect the second wiring layer 122 and the first wiring layer 121 to each other.

[0024] The printed circuit board according to the embodiment includes the glass layer 110 and can have excellent flatness and can be advantageous in warpage control due to a low coefficient of thermal expansion (CTE). In particular, the printed circuit board according to the embodiment can have the glass layer 110 as a core layer, which can be advantageous in warpage control even in a step of laminating other insulating layers. Furthermore, the first insulating layer 111 and the second insulating layer 112 are sequentially laminated on the glass layer 110, which can further increase flatness and thus can be advantageous in forming a high-density fine circuit having a fine pitch. Furthermore, the number of layers of the printed circuit board can be reduced due to the characteristics of glass having a variable dielectric property of, for example, Dk2.5 to 11, and the degree of freedom in design can be further increased.

[0025] The printed circuit board according to an example has a structure that can reduce the possibility of breakage occurring in a step of cutting the glass layer 110 into each unit glass layer. In the manufacturing step of the printed circuit board including the glass layer 110, there is a high possibility of breakage occurring during a singulation process. In the printed circuit board according to an example, through holes can be formed in the glass layer 110 in stages to protect the glass layer 110, and the singulation process involves cutting through an insulating layer that fills the through holes, so that the possibility of breakage can be reduced. That is, the side of the glass layer 110 can be covered by each of the first insulating layer 111 and the second insulating layer 112, and the glass layer 110 can not be exposed to the outside. After the first through hole h1 is formed along the cutting line u of the unit area, the first insulating layer 111 is laminated, and after the second through hole h2 is formed, the second insulating layer 112 is laminated, so that the side of the glass layer 110 may not be exposed to the outside, which will be described in more detail later in the manufacturing step.

[0026] The glass layer 110 may include glass, which is an amorphous solid. Glass may include, for example, pure silicon dioxide (about 100% SiO2), soda-lime glass, borosilicate glass, alumino-silicate glass, and the like. However, alternative glass materials, such as, but not limited to, fluoroglass, phosphate glass, chalcogenide glass, and the like, may also be used as the material of the glass layer 110. In addition, other additives may be included to form a glass having specific physical properties. These additives may include calcium carbonate (e.g., lime) and sodium carbonate (e.g., soda), as well as magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur, and antimony, as well as carbonates and / or oxides of such elements and other elements. The glass layer 110 is a layer that is distinct from materials containing glass fibers (glass fiber, glass cloth, glass fabric), such as copper clad laminate (CCL) and prepreg (PPG), and can be understood as, for example, sheet glass.

[0027] Each of the first insulating layer 111 and the second insulating layer 112 may include an organic insulating material. The organic insulating material may include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or a material including an inorganic filler, an organic filler, and / or a glass fiber (glass fiber, glass cloth, glass fabric) together with a resin. For example, the insulating material may be a non-photosensitive insulating material such as ABF (Ajinomoto Build-up Film) or PPG (Prepreg), but is not limited thereto, and other polymer materials may be used. The insulating material may also be a photosensitive insulating material such as PID (Photo Imageable Dielectric). The insulating material may also include an adhesive sheet such as BS (Bonding Sheet).

[0028] The first insulating layer 111 and the second insulating layer 112 may each include the same insulating material. Specifically, the first insulating layer 111 and the second insulating layer 112 may each include ABF (Ajinomoto Build-up Film), but are not limited thereto, and may also include other organic insulating materials. However, the first insulating layer 111 and the second insulating layer are not limited thereto, and may also include different materials.

[0029] The first wiring layer 121 and the second wiring layer 122 may each include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The first wiring layer 121 and the second wiring layer 122 may each perform various functions according to the design. For example, the first wiring layer 121 and the second wiring layer 122 may include a signal pattern, a power pattern, a ground pattern, and the like. These patterns may each have various forms such as a line, a plane, and a pad. The first wiring layer 121 and the second wiring layer 122 may each include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electrolytic copper). Or, the first wiring layer 121 and the second wiring layer 122 may include a metal foil (or copper foil) and an electrolytic plating layer (or electrolytic copper). Or, the first wiring layer 121 and the second wiring layer 122 may include a metal foil (or copper foil), an electroless plating layer (or chemical copper), and an electrolytic plating layer (or electrolytic copper). It may also include a sputtered layer instead of an electroless plated layer (or chemical copper), or both if desired.

[0030] The through via 130 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the through via 130 may include, but is not limited to, copper (Cu). The through via 130 may penetrate between the upper and lower surfaces of the glass layer 110. The upper and lower surfaces of the through via 130 may be substantially coplanar with the upper and lower surfaces of the glass layer 110. In FIG. 3a, the through via 130 is filled with one metal layer through the upper and lower surfaces of the glass layer 110, which is a so-called field via, but is not limited thereto. The through via 130 may be a conformal via arranged along the wall surface of a via hole, and a specific method of forming the through via 130 is not limited thereto. The through via 130 may perform various functions according to the design. For example, the through via 130 may include a ground via, a power via, a signal via, etc. The through via 130 may have a substantially circular, elliptical, or polygonal shape on a plane, but is not limited thereto, and may have a composite shape in which various shapes are combined into one on a plane, for example, from the viewpoint of ensuring close contact through an increase in specific surface area. The side surface of the through via 130 may be substantially perpendicular to the upper and lower surfaces of the through via 130, but is not limited thereto, and may be tapered to have an hourglass shape or the like on a cross section as necessary.

[0031] The first via layer 131 and the second via layer 132 may each include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The first via layer 131 and the second via layer 132 may each include a field via that fills a via hole, but may also include a conformal via that is disposed along the wall surface of the via hole. The first via layer 131 and the second via layer 132 may perform various functions according to the design. For example, they may include a ground via, a power via, a signal via, etc. The first and second connection vias 132 and 133 may each include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electrolytic copper). They may also include a sputtering layer instead of the electroless plating layer (or chemical copper), or may include both as necessary.

[0032] The first via layer 131 disposed on the upper surface of the glass layer 110 and the first via layer 131 disposed on the lower surface of the glass layer 110 may have tapered shapes in opposite directions on a cross section. This is a feature that may occur because the printed circuit board according to an example is a so-called core-type printed circuit board in which the glass layer 110 is a core layer, and the first via layer 131 is formed by forming via holes in the first insulating layers 111 laminated on the upper and lower surfaces of the glass layer 110, respectively, so that the first via layers 131 disposed on the upper and lower surfaces of the glass layer 110 may have different tapered directions. More specifically, the width of the first via layer 131 on a cross section may become narrower as it approaches the glass layer 110.

[0033] Meanwhile, in the printed circuit board according to an example, the upper and lower surfaces of the through via 130 penetrating the glass layer 110 may be directly connected to the lower and upper surfaces, respectively, of the first via layer 131. This is because it is difficult to directly form a wiring layer since it is difficult to ensure adhesion of a metal material to the upper and lower surfaces of the glass layer 110. Therefore, after the first insulating layer 111 is formed on the upper and lower surfaces of the glass layer 110, the first wiring layer 121 is formed on the first insulating layer 111, and the first wiring layer 121 may be connected to the through via 130 via the first via layer 131.

[0034] Meanwhile, the printed circuit board according to an example may further include a third insulating layer 113 disposed on the second insulating layer 112, a third wiring layer 123 disposed on the third insulating layer, and a third via layer penetrating the third insulating layer to connect the third wiring layer and the second wiring layer to each other. Each of the third insulating layer 113, the third wiring layer 123, and the third via layer 133 may include one or more layers, and may include a plurality of insulating layers, wiring layers, and via layers.

[0035] The third insulating layer 113 may include an insulating material. The insulating material may include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or a material including inorganic filler, organic filler, and / or glass fiber (glass fiber, glass cloth, glass fabric) together with these resins. For example, the insulating material may be a non-photosensitive insulating material such as ABF (Ajinomoto Build-up Film) or PPG (Prepreg), but is not limited thereto, and other polymer materials may be used. Also, the insulating material may be a photosensitive insulating material such as PID (Photo Imageable Dielectric). The third insulating layer 113 may include the same insulating material as the first insulating layer 111 and / or the second insulating layer 112, but is not limited thereto, and may include insulating materials different from each other.

[0036] The third wiring layer 123 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The third wiring layer 123 may perform various functions according to the design. For example, the third wiring layer 123 may include a signal pattern, a power pattern, a ground pattern, and the like. Each of these patterns may have various forms, such as a line, a plane, and a pad. The third wiring layer 123 may include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electrolytic copper). Alternatively, the third wiring layer 123 may include a metal foil (or copper foil) and an electrolytic plating layer (or electrolytic copper). Alternatively, the third wiring layer 123 may include a metal foil (or copper foil), an electroless plating layer (or chemical copper), and an electrolytic plating layer (or electrolytic copper). Instead of the electroless plating layer (or chemical copper), a sputtering layer may be included, or both may be included as necessary.

[0037] The third via layer 133 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The third via layer 133 may include a field via (filled VIA) that fills a via hole, but may also include a conformal via (conformal VIA) that is disposed along the wall surface of the via hole. The third via layer 133 may perform various functions according to the design. For example, it may include a ground via, a power via, a signal via, and the like. In the third via layer 133, the via layer disposed on the upper side of the glass layer 110 and the via layer disposed on the lower side of the glass layer 110 may have tapered shapes in opposite directions on the cross section. The third via layer 133 may include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electrolytic copper), respectively. It may also include a sputtered layer instead of an electroless plated layer (or chemical copper), or both if desired.

[0038] Meanwhile, the printed circuit board according to an example may further include a solder resist layer 140 on the third insulating layer 113. The solder resist layer 140 is disposed on the outermost side of the printed circuit board to protect the printed circuit board from the outside. The solder resist layer 140 may use a known solder resist, and may include, but is not limited to, a liquid or film type solder resist, and may use other types of insulating materials, and may include a thermosetting resin and an inorganic filler dispersed in the thermosetting resin, but may not include glass fiber. The insulating resin may be a photosensitive insulating resin, and the filler may be, but is not limited to, an inorganic filler and / or an organic filler, and may use other polymer materials as necessary. The solder resist layer 140 may have an opening, and at least a portion of the third wiring layer 123 may be exposed through the opening. The third wiring layer 123 exposed through the opening may be connected to a main board or another printed circuit board, or may be connected to another element such as a semiconductor chip. If necessary, a surface treatment layer may be further formed on the pattern exposed through the opening, or a metal bump may be further formed on the pattern exposed through the opening.

[0039] Meanwhile, the printed circuit board according to the embodiment is not limited to the configuration shown in Fig. 3a, and may further include other general configurations of a printed circuit board, that is, may further include configurations that can be utilized by a person having ordinary skill in the art.

[0040] FIG. 3b is a cross-sectional top view of the glass layer 110 of the printed circuit board.

[0041] FIG. 3b may be a top cross-sectional view of an area of ​​the glass layer 110 separated from the top, and the same cross section may be obtained when cutting horizontally between the top and bottom surfaces of the glass layer 110.

[0042] 3b, the side and corner portions of the glass layer 110 of the printed circuit board according to an example are covered by the first insulating layer 111 and the second insulating layer 112, and the glass layer 110 may not be exposed to the outside of the printed circuit board. A part of the side and corner portions of the glass layer 110 may be covered by the first insulating layer 111, and the remaining part may be covered by the second insulating layer 112.

[0043] More specifically, the glass layer 110 may have a first side and a second side facing each other in a first direction perpendicular to the lamination direction, and a third side and a fourth side facing each other in a second direction perpendicular to the lamination direction and the first direction. The glass layer 110 may also have a first corner portion connecting the first side and the third side, a second corner portion connecting the first side and the fourth side, a second corner portion connecting the second side and the third side, and a fourth corner portion connecting the second side and the fourth side. The first side to the fourth side are shown as corners of the glass layer in FIG. 3b, and the first corner portion to the fourth corner portion are shown as connecting lines connecting the corners to each other on the corner side of the glass layer in FIG. 3b.

[0044] Referring to FIG. 3b, at least one of the first corner portion to the fourth corner portion of the glass layer 110 may have a plurality of corners. The corner may be understood as an intersection line generated when a surface meets another surface, and for example, when the first corner portion where the first side surface and the third side surface are connected has one corner, it means that the first side surface and the third side surface meet in a direct contact to form one corner. In the printed circuit board according to an example, the first corner portion connecting the first side surface and the third side surface has a first corner surface different from the first side surface and the third side surface, so that the first corner surface and the first side surface may have a corner where the first corner surface and the third side surface meet each other. In this manner, in the printed circuit board according to an example, the first corner portion may include a plurality of corners. On the other hand, when the first side and the third side are directly in contact with each other, a corner due to a step that occurs due to an error during the manufacturing process is not understood as a plurality of corners, but rather, it can be understood that the first corner portion has a separate corner surface that is distinct from the first side and the third side, and the first corner portion substantially includes a plurality of corners.

[0045] Meanwhile, in the printed circuit board according to an embodiment, the first corner portion may have a curved surface during manufacturing. In this case, a discontinuous position where the extended surface of the first side surface and the first corner portion do not match may be understood as a starting point of the first corner portion, and in this case, the discontinuous position may be understood as one corner. In this case, the first corner portion may have a discontinuous position that does not match the extended surface of the first side surface, and may also have a discontinuous position that does not match the extended surface of the third side surface, so that the first corner portion may have a corner from each position and may be understood to have a plurality of corners.

[0046] However, without being limited thereto, the first corner portion may be understood to have a separate first corner surface substantially distinct from the first side and the third side, and this may be a result of performing a processing step to form the first corner portion in the step of cutting along the first side and the step of cutting along the third side in the manufacturing step of the printed circuit board according to an example. In addition, the description regarding the relationship between the first side and the third side and the first corner portion may be applied to the other sides and other corner portions in the same spirit. That is, such a relationship may be similarly applied to the second corner portion between the first side and the fourth side, the third corner portion between the second side and the third side, and the fourth corner portion between the second side and the fourth side.

[0047] Referring to FIG. 3b, at least a portion of one of the first to fourth sides of the glass layer 110 may be covered by the first insulating layer 111, and the remaining portion may be covered by the second insulating layer 112. At least one of the first to fourth sides of the glass layer 110 may have a structure in which the first insulating layer 111 and the second insulating layer 112 are alternately arranged so as to be repeated. The region in which the first insulating layer 111 is arranged may correspond to the region in which the first through hole h1 is formed in the manufacturing stage, and the region in which the second insulating layer 112 is arranged may correspond to the region in which the second through hole h2 is formed. By alternately arranging the first through hole h1 and the second through hole h2 having a narrow width in the manufacturing stage, the stress applied to the glass layer 110 during the through hole formation may be dispersed so as not to be concentrated. Meanwhile, the first insulating layer 111 and the second insulating layer 112 may each have a narrower width than that shown in FIG. 3b, and more units may be arranged to be repeated.

[0048] Referring to FIG. 3b, at least one corner portion of the first corner portion to the fourth corner portion of the glass layer 110 may be covered by the second insulating layer 112. As shown in FIG. 3b, the first corner portion to the fourth corner portion may be covered by the second insulating layer 112, but is not limited thereto, and may be covered by the first insulating layer 111. As described above, the region where the first insulating layer 111 is disposed corresponds to the region where the first through hole h1 is formed in the manufacturing stage, and the region where the second insulating layer 112 is disposed corresponds to the region where the second through hole h2 is formed. That is, the first through hole h1 formed in the manufacturing stage may be formed in the area of ​​the first side surface to the fourth side surface of the glass layer 110, and the second through hole h2 formed after the formation of the first insulating layer 111 may be formed in the area of ​​the first corner portion to the fourth corner portion of the glass layer 110. If the first through hole h1 is formed in a corner area of ​​the glass layer 110 in the step of forming the first through hole h1 in the glass layer 110, stress may be concentrated on the glass layer 110, further increasing the possibility of breakage. Therefore, the first through hole h1 may be preferentially formed in the side area of ​​the glass layer 110, and the second through hole h2 may be formed in the corner area of ​​the glass layer 110 after the first insulating layer 111 is formed.

[0049] Meanwhile, referring to Fig. 3b, at least one of the first to fourth corners may be inclined and may form an obtuse angle with the first to fourth side faces. Fig. 3b is a top cross-sectional view of the glass layer 110 of the printed circuit board as viewed from above, and as described above, it is a cross-section in a direction perpendicular to the lamination direction passing through the glass layer 110. Therefore, as shown in Fig. 3b, the corners of the glass layer 110 may each form an obtuse angle with the side face of the glass layer 110, which is a shape that may occur when the corners of the glass layer 110 are removed together to form the second through hole h2 in the manufacturing process. When forming the second through hole h2, if the corner portion is formed so that the side surfaces of the glass layer 110 are perpendicular to each other, stress is concentrated at the corner portion, and therefore there is a high possibility of damage such as cracks occurring at the corner portion. However, when forming the second through hole h2, if a part of the corner portion of the glass layer 110 is removed at the same time so that the corner portion forms an obtuse angle with the side surface, stress can be dispersed in the step of forming the second through hole h2, and the possibility of damage can be reduced. Meanwhile, in FIG. 3b, the inclination of the corner portion is shown as a straight line so as to be substantially constant, but is not limited to that shown in FIG. 3b, and the corner portion can have a convex inclination or a concave inclination. For example, the first corner portion having a convex inclination may be a first corner portion that protrudes from a line connecting the first side surface and the third side surface with a straight line and has a convex curve, and the first corner portion having a concave inclination means that the first corner portion has a concave curve as opposed to this. This may be applicable to the case where the first corner portion has a curved surface. The explanation regarding this may be similarly applied to the second corner portion to the fourth corner portion.

[0050] At this time, the first insulating layer 111 and the second insulating layer 112 may have an interlayer boundary. Although the first insulating layer 111 and the second insulating layer 112 may contain the same insulating material, since they are formed in different manufacturing steps, the first insulating layer 111 formed first and the second insulating layer 112 formed later may have an interlayer boundary so as to be distinguishable from each other. That is, the first insulating layer 111 and the second insulating layer 112 may be distinguishable from each other at a cut surface of the printed circuit board, etc.

[0051] 3b, the first insulating layer 111 and the second insulating layer 112 are shown to be repeated with a certain width, but are not limited thereto, and the widths of the first insulating layer 111 and the second insulating layer 112 can be adjusted according to design, and the widths of the first insulating layer 111 and the second insulating layer 112 can include errors in the manufacturing stage or measurement, etc. The repeat unit of the first insulating layer 111 and the second insulating layer 112 can also be adjusted.

[0052] (Printed Circuit Board Manufacturing Method) A method for manufacturing a printed circuit board according to an example may include forming a first through hole h1 and a via hole h0 in the glass layer 110, forming a through via 130, filling the first through hole h1 and forming a first insulating layer 111 on the glass layer 110, forming a first wiring layer 121 on the first insulating layer 111, forming a second through hole h2 through the first insulating layer 111 and the glass layer 110, filling the second through hole h2 and forming a second insulating layer 112 on the first insulating layer 111, and performing singulation. In addition, the method may further include forming a second wiring layer 122 on the second insulating layer 112, forming a third insulating layer 113 on the second insulating layer 112, and forming a third wiring layer 123 on the third insulating layer 113.

[0053] A method for manufacturing the printed circuit board 100A according to an embodiment will be described in more detail below with reference to the drawings.

[0054] 4a to 4d are developed perspective and sectional views showing a step of forming a first through hole h1 in a method for manufacturing a printed circuit board, in which Fig. 4a is a perspective view, Fig. 4b is a top plan view, Fig. 4c is a sectional view taken along line II' in Fig. 4b, and Fig. 4d is a sectional view taken along line II' in Fig. 4b.

[0055] 4a to 4d, a via hole h0 for a through via 130 may be formed within a unit area in the glass layer 110, and a first through hole h1 may be formed at a portion of a cutting line u for the unit area. In this case, the glass layer 110 may be in the form of a glass plate in strip units before being cut into unit areas, but is not limited thereto.

[0056] The unit area means an area where the printed circuit board is completed by performing a singulation process, and the cutting line u is an imaginary line where the singulation process is performed, and is the area that will become the outermost surface of the printed circuit board. Other components of the printed circuit board, such as through vias, wiring layers, and via layers, are arranged within the cutting line u, which is the unit area. The via hole h0 is arranged within the unit area of ​​the glass layer 110, and is formed in the area where the through via 130 is to be formed.

[0057] The first through hole h1 and the via hole h0 can be formed by various methods such as laser processing, mechanical processing, chemical processing, etc. Since the first through hole h1 is formed in the glass plate in strip units, if the first through hole h1 is excessively large or is formed in an L-shape perpendicular to the corner of the unit area, stress may be concentrated in the area where the first through hole h1 is formed. Therefore, the first through hole h1 is not arranged at the corner of the cutting line u, but is arranged at regular intervals along the corner of the cutting line u to disperse stress. In this case, if the first through hole h1 is arranged as close as possible to the corner in accordance with the second through hole h2 formed in the corner of the cutting line u, stress can be dispersed in the step of forming the second through hole h2.

[0058] The shape of the first through hole h1 is shown as a rectangle when viewed from above, but is not limited thereto, and may be a rectangle with a longer horizontal length, a circle, an ellipse, or may be a regular polygon such as a square, a regular hexagon, etc. Also, the through hole may be formed to have a certain width in a cross-sectional view, but is not limited thereto.

[0059] 4a to 4d, the first through holes h1 are shown as three through holes formed at each corner of the cutting line u, but the number of the first through holes h1 is not limited to this. In addition, in the drawings, the width of the first through holes h1 and the interval between the first through holes h1 are shown as being constant, but this is not limited to this, and the width, interval and number can be adjusted within the range of change that can be made by a person of ordinary skill in the art.

[0060] 5a to 5d are perspective and cross-sectional views showing a step of forming a through via 130 in a method for manufacturing a printed circuit board. Specifically, Fig. 5a is a perspective view, Fig. 5b is a top plan view, Fig. 5c is a cross-sectional view taken along line II' in Fig. 5b, and Fig. 5d is a cross-sectional view taken along line II-II' in Fig. 5b.

[0061] Although the through via 130 is described as a field via filled with one metal layer, it is not limited thereto and may be a conformal via arranged along the wall surface of the via hole. The through via 130 may be filled by plating on a seed layer formed along the via hole h0, or may be formed by removing unnecessary portions, but is not limited thereto and may be formed by filling a paste containing a metal material and then firing it, and any method for forming the through via 130 in the glass layer 110 may be used without limitation. In particular, a means for ensuring the adhesive strength between the glass layer 110 and the through via 130 may be used.

[0062] 6a to 6d are perspective and cross-sectional views showing the step of forming a first insulating layer 111 in a method for manufacturing a printed circuit board. Specifically, Fig. 6a is an exploded perspective view, Fig. 6b is a top plan view of a glass layer 110, Fig. 6c is a cross-sectional view taken along line II' in Fig. 6b, and Fig. 6d is a cross-sectional view taken along line II-II' in Fig. 6b.

[0063] Referring to FIG. 6a, a first insulating layer 111 may be formed on the upper and lower sides of a glass layer 110. The first insulating layer 111 may be in the form of a film including an insulating material, but is not limited thereto. Before the first insulating layer 111 is cured, it has fluidity and can fill the first through hole h1. The step of forming the first insulating layer 111 may be performed by disposing and curing the first insulating layer, but is not limited thereto, and the step of forming the first insulating layer 111 may be performed by a known method of laminating insulating layers of a printed circuit board.

[0064] Since the first insulating layer 111 is formed to fill the first through hole h1, a portion of the side surface of the glass layer 110 may be covered by the first insulating layer 111. In particular, referring to Fig. 6d, a portion of the side surface of the glass layer 110 may be covered by the first insulating layer 111, and the remaining portion may have a shape in which the glass layer 110 remains. The remaining portion corresponds to an area in which a second through hole h2 is formed in a process described below and is filled with the second insulating layer 112.

[0065] 7a to 7d are perspective and cross-sectional views showing a step of forming a first wiring layer 121 in a method for manufacturing a printed circuit board. Specifically, Fig. 7a is an exploded perspective view, Fig. 7b is a top plan view of a glass layer 110, Fig. 7c is a cross-sectional view taken along line II' in Fig. 7b, and Fig. 7d is a cross-sectional view taken along line II-II' in Fig. 7b.

[0066] The first wiring layer 121 may be formed simultaneously with the first via layer 131. The process may proceed by forming a via hole penetrating the first insulating layer 111, performing electroless plating, performing electrolytic plating patterning using a plating resistor, forming the first via layer 131 and the first wiring layer 121, and then removing unnecessary portions, but is not limited thereto, and the step of forming the first wiring layer 121 and the first via layer 131 may be performed without limitation by using any known process for forming a wiring layer and a via layer.

[0067] FIG. 7b corresponds to a plan view of the glass layer seen from above, and the first wiring layer 121 formed on the first insulating layer 111 may not be visible, in which case the first wiring layer 121 may be represented by a dotted line.

[0068] FIG. 7d is a cross-sectional view taken along line II-II' in FIG. 7b and does not pass through first wiring layer 121, so first wiring layer 121 may not be shown in FIG. 7d.

[0069] 8a to 8d are perspective and cross-sectional views showing the step of forming the second through hole h2 in the method for manufacturing a printed circuit board. Specifically, Fig. 8a is an exploded perspective view, Fig. 8b is a top plan view of the glass layer 110, Fig. 8c is a cross-sectional view taken along line II' in Fig. 8b, and Fig. 8d is a cross-sectional view taken along line II-II' in Fig. 8b.

[0070] The second through hole h2 may penetrate the first insulating layer 111 and the glass layer 110 at the same time, and may be formed in a region of the glass layer 110 where the first insulating layer 111 is not filled. That is, the second through hole h2 may be formed to remove the remaining portion of the cutting line u in the glass layer 110. Since the first through hole h1 is formed to have a certain width and a certain interval, the second through hole h2 may be formed to have a certain interval and a certain width inversely corresponding thereto. Therefore, when the second through hole h2 is formed, the glass layer 110 may be separated into unit regions, but the first insulating layer 111 already formed may be connected so that the glass layer 110 is not separated.

[0071] The unit region of the glass layer 110 is connected to the dummy region by a remaining portion that is not removed by the first through hole h1, and the second through hole h2 removes a portion corresponding to this remaining portion. That is, since the step of forming the second through hole h2 is performed in a state in which a portion of the glass layer 110 has been removed in the unit region, the already removed portion of the glass layer 110 absorbs stress, thereby reducing internal damage to the unit region of the glass layer 110.

[0072] Referring to FIG. 8b, which is a top plan view of the glass layer 110, the inner sidewall of the second through hole h2 may be formed to be inclined at a corner region of the cutting line u. The second through hole h2 being inclined at a corner region of the cutting line u may mean that the inner sidewall of the second through hole h2 or its extension does not perpendicularly meet the cutting line u for the unit area or a line extending imaginarily through the cutting line u based on the top plan view. This means that when the unit area has a square or rectangular shape having two faces facing a first direction and two faces facing a second direction perpendicular to the first direction, the inner sidewall of the through hole is not perpendicular to the first direction and the second direction. That is, the second through hole h2 formed at the corner of the cutting line u may be formed so that the corner of the glass layer 110 is not perpendicular to the corner of the glass layer 110 by forming the second through hole h2 so that the inner part of the "L" shape is inclined, rather than having an "L" shape in which any two rectangles perpendicularly intersect with each other.

[0073] When processing the glass layer 110, if the corners of the glass layer 110 are formed so that the side surfaces of the glass layer 110 are perpendicular to each other, stress may be concentrated at the corners of the glass layer 110, causing breakage. As the second through holes h2 formed at the corners of the cutting line u are inclined, the glass layer 110 can be better protected from the risk of breakage by having more gradual corners.

[0074] The second through hole h2 can be formed by various methods such as laser processing, mechanical processing, chemical processing, etc. In Fig. 8a to Fig. 8d, the first insulating layer 111 and the glass layer 110 are shown to be penetrated together, but this is not necessarily limited thereto, and after forming a through hole penetrating the first insulating layer 111, the second through hole h2 can be formed by penetrating the glass layer 110 correspondingly. In this case, the portion penetrating the first insulating layer 111 and the portion penetrating the glass layer 110 can be formed to have different widths on the cut surface, and the degree of taper can also be different.

[0075] 9a to 9d are perspective and cross-sectional views showing the step of forming the second insulating layer 112 in the method for manufacturing a printed circuit board. Specifically, Fig. 9a is an exploded perspective view, Fig. 9b is a top plan view of the glass layer 110, Fig. 9c is a cross-sectional view taken along line II' in Fig. 9b, and Fig. 9d is a cross-sectional view taken along line II-II' in Fig. 9b.

[0076] 9a, a second insulating layer 112 may be formed on and under a glass layer 110. The second insulating layer 112 may be formed in the same process as the process of forming the first insulating layer 111, but is not limited thereto, and the step of forming the first insulating layer 111 may be performed by a known method of laminating insulating layers of a printed circuit board.

[0077] The second insulating layer 112 is formed to fill the second through hole h2, so that a portion of the side surface of the glass layer 110 can be covered by the second insulating layer 112. In particular, referring to FIG. 9d, a portion of the side surface of the glass layer 110 is covered by the first insulating layer 111, and the remaining portion is covered by the second insulating layer 112.

[0078] 10 is a cross-sectional view showing a step of further forming other components in the method of manufacturing a printed circuit board. Specifically, FIG. 10 is a cross-sectional view showing that a second via layer 132, a second wiring layer 122, a third insulating layer 113, a third via layer 133, etc. are further formed.

[0079] FIG. 10 is based on FIG. 9c, which is a cross-sectional view taken along line I-I' in FIG. 9b, and shows that part of the glass layer 110 is covered by a first insulating layer 111 and another part is covered by a second insulating layer 112.

[0080] FIG. 11 is a cross-sectional view showing a step of separating unit areas in a method for manufacturing a printed circuit board.

[0081] The printed circuit board is separated into individual unit areas along the cutting line u, and unnecessary dummy areas can be removed. The step of separating the unit areas can be understood as so-called singulation, and any known method for singulating a strip board, such as sawing or laser processing, can be used without limitation.

[0082] (Printed Circuit Board) 12a to 12e are top cross-sectional views of the glass layer 110 of the printed circuit board according to various examples. Specifically, in each drawing, the upper side shows a stage before singulation, and the lower side shows a top cross-sectional view of the glass layer 110 of the printed circuit board after singulation.

[0083] FIG. 12a illustrates a top cross-sectional view of a glass layer 110 of a printed circuit board according to an example, and therefore a redundant description thereof will be omitted.

[0084] 12b is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Referring to FIG. 12b, a part of a corner portion of the glass layer 110 is covered by a first insulating layer 111. This is a result of forming the first through hole h1 at the corner portion of the cutting line u when forming the first through hole h1. Although the first through hole h1 is formed at the corner portion of the cutting line u, the first through hole h1 is formed so as not to extend to the corner of the cutting line u, so that stress can be dispersed.

[0085] FIG. 12c is a top cross-sectional view of the glass layer 110 of the printed circuit board according to another example. Referring to FIG. 12c, the second through hole h2 may be formed closer to the cutting line u and may be formed to have substantially the same surface as the cutting line u. That is, since the first through hole h1 is formed first and the second through hole h2 is formed after the first insulating layer 111 is formed, the second through hole h2 only needs to remove a part of the glass layer 110 to separate the dummy area from the unit area. Therefore, the second through hole h2 may not be formed larger and may be formed to the cutting line u of the unit area as a minimum. This allows stress to be dispersed when the second through hole h2 is formed. As described above, the second insulating layer 112 may be disposed according to the shape of the second through hole h2. Meanwhile, the printed circuit board according to another example may have the same structure as the printed circuit board according to the one example after the singulation process.

[0086] FIG. 12d is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another embodiment. Referring to FIG. 12d, the second through hole h2 formed at the corner of the cutting line u may have a step. Specifically, referring to FIG. 12d, the second through hole h2 formed at the corner of the cutting line u may include a step-like step. That is, when the second through hole h2 is formed at the corner of the cutting line u, it may have a step-like step for stress dispersion. As described above, the second insulating layer 112 may be disposed according to the shape of the second through hole h2, so the second insulating layer 112 covering the corner of the glass layer 110 may also have a step-like step when viewed from a top plan view. In this case, the first corner portion may have a plurality of first corner surfaces, and the first corner portion may include a corner where the first side surface and the first corner surface meet, a corner where the third side surface and the first corner surface meet, and a corner where the plurality of first corner surfaces meet each other. That is, the first corner portion may have a plurality of corner surfaces between the first side surface and the third side surface that can be distinguished from the first side surface and the third side surface. It is to be noted that the description of the first corner portion can be applied to the second corner portion to the fourth corner portion in the same manner. In FIG. 12d, each corner portion is shown to have three inflection points, but the present invention is not limited thereto, and the corner portion may have a greater number of inflection points and a greater number of steps. On the other hand, the more inflection points there are, the more the stress acting on the glass layer 110 during through-hole processing can be dispersed, and the more advantageous the structure is in terms of breakage. It is to be noted that the present invention is not limited to the content shown in FIG. 12d, and the first corner portion may have a curved surface. When the first corner portion has a curved surface, as described above in the printed circuit board according to the example, the discontinuous positions on the first side surface and the third side surface can be understood as corners, and the inflection points formed between the curved surfaces can be understood as corners. It is to be noted that the shape of the corner portion of the glass layer 110 of the printed circuit board according to the other example can also be applied to the printed circuit board according to the other example shown in FIG. 12b.

[0087] FIG 12e is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Referring to FIG 12e, the second through hole h2 may be formed closer to the cutting line u, and the second through hole h2 formed at the corner of the cutting line u may include a step-like step. This is an example in which the configuration of the printed circuit board according to another example shown in FIG 12c and the printed circuit board according to another example shown in FIG 12d are applied. Meanwhile, the printed circuit board according to another example may have the same structure as the printed circuit board according to another example shown in FIG 12d after a singulation process.

[0088] FIG. 12f is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Referring to FIG. 12f, the side of the glass layer 110 may be covered by a first insulating layer 111, and the corner of the glass layer 110 may be covered by a second insulating layer 112. The corner of the glass layer may be formed to form an obtuse angle with the side of the glass layer 110. In the printed circuit board according to an example, since the second through hole h2 does not extend to the corner region of the cutting line u, the second insulating layer 112 may cover the corner of the glass layer 110, and only the corner of the glass layer 110 may be covered. Of course, the effect of stress dispersion can be obtained by the glass layer 110 not having an "L"-shaped corner that intersects at right angles.

[0089] Fig. 12g is a top cross-sectional view of a glass layer 110 of a printed circuit board according to another example. Referring to Fig. 12g, a corner shape of the glass layer 110 is modified in the printed circuit board according to another example shown in Fig. 12f. The second through hole h2 formed in the corner of the cutting line u may include a step-like step, so that the second insulating layer 112 covering the corner of the glass layer 110 may include a step-like step.

[0090] Meanwhile, in the various exemplary printed circuit boards of Figures 12a to 12g, the explanations other than those regarding the shape of the glass layer, the arrangement of the first insulating layer 111 and the second insulating layer 112, etc. can be applied in the same manner as the explanations regarding the exemplary printed circuit boards and the manufacturing methods for the printed circuit boards, and therefore duplicate explanations will be omitted.

[0091] In the present disclosure, the expressions "cover" and "enclose" may include not only the case of covering entirely but also the case of covering at least a part, and may include not only the case of covering directly but also the case of covering indirectly. Furthermore, the expression "fill" may include not only the case of filling completely but also the case of filling roughly, for example, the case where some gaps or voids are present.

[0092] In the present disclosure, the term "substantially" can be determined by including step errors, positional deviations, and measurement errors that occur during the manufacturing process. For example, "substantially perpendicular" can include not only a case where the two are completely perpendicular, but also a case where the two are approximately perpendicular. Furthermore, "substantially coplanar" can include not only a case where the two are completely in the same plane, but also a case where the two are approximately in the same plane.

[0093] In the present disclosure, the same insulating material can mean not only the case where the insulating material is completely the same, but also the same type of insulating material. Thus, the compositions of the insulating materials are substantially the same, but the specific composition ratios thereof can differ slightly.

[0094] In the present disclosure, the meaning of "on a cross section" can mean the cross-sectional shape of an object cut vertically, or the cross-sectional shape of an object cut vertically, or the cross-sectional shape of an object when viewed from a side, and the meaning of "on a plane" can mean the planar shape of an object cut horizontally, or the planar shape of an object when viewed from the top or bottom.

[0095] In this disclosure, for convenience, the terms lower, bottom, and lower surface are used to mean the downward direction based on the cross section of the drawing, and the terms upper, top, and upper surface are used to mean the opposite direction. However, this is merely a definition of the direction for convenience of explanation, and the scope of the claims is not particularly limited by the description of the direction, and the concepts of up / down can be changed at any time.

[0096] In the present disclosure, the term "connected" refers not only to a direct connection but also to an indirect connection via an adhesive layer or the like. The term "electrically connected" refers to a physical connection and a non-connection. Furthermore, the terms "first" and "second" are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, the first component may be named the second component, and similarly the second component may be named the first component, without departing from the scope of the right.

[0097] The expression "one example" used in the present disclosure does not mean the same embodiment as the other, but is provided to emphasize and describe the unique features that are different from each other. However, the above-mentioned one example does not exclude being realized in combination with the features of another example. For example, even if the matter described in a particular example is not described in another example, it can be understood as being related to the other example, unless there is a description in the other example that is opposite or contradictory to the matter.

[0098] The terms used in the present disclosure are merely used to describe an example and are not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0099] 110 Glass layer 111 First insulating layer 112 Second insulating layer 113 Third insulating layer 121 1st wiring layer 122 2nd wiring layer 123 3rd wiring layer 130 Through Via 131 First via layer 132 2nd via layer 133 3rd via layer 140 Solder resist layer h0 via hole h1 1st through hole h2 2nd through hole u cutting line 1000 electronic equipment 1010 Mainboard 1020 Chip related parts 1030 Network related parts 1040 Other parts 1050 Camera 1060 Antenna 1070 display 1080 Battery 1090 Signal Line 1100 Smartphone 1110 Motherboard 1120 parts 1121 Parts Package 1130 Camera Module 1140 Speaker

Claims

1. a glass layer having a first side and a second side facing each other in a first direction, a third side and a fourth side facing each other in a second direction perpendicular to the first direction, a first corner portion connecting the first side and the third side, a second corner portion connecting the first side and the fourth side, a third corner portion connecting the second side and the third side, and a fourth corner portion connecting the second side and the fourth side; a first insulating layer disposed on the glass layer and covering at least a portion of at least one of the first to fourth side surfaces; a second insulating layer disposed on the first insulating layer and covering at least one of the first corner portion to the fourth corner portion.

2. The printed circuit board according to claim 1 , wherein the first corner portion to the fourth corner portion are covered with the second insulating layer.

3. 2. The printed circuit board according to claim 1, wherein at least one of the first to fourth side surfaces is partially covered by the first insulating layer and another partially covered by the second insulating layer.

4. The printed circuit board according to claim 3 , wherein the first insulating layer and the second insulating layer are alternately arranged on at least one of the first side to the fourth side.

5. 2. The printed circuit board according to claim 1, wherein at least one of the first corner portion to the fourth corner portion is inclined on a plane.

6. 6. The printed circuit board according to claim 5, wherein, on a plane, at least one of the first corner portion to the fourth corner portion forms an obtuse angle with at least one of the first side surface to the fourth side surface.

7. 2. The printed circuit board according to claim 1, wherein at least one of the first corner portion to the fourth corner portion has a step on a plane.

8. The first insulating layer and the second insulating layer each contain the same material, The printed circuit board of claim 1 , wherein the first and second insulating layers have an interlayer boundary with each other.

9. a through via penetrating the glass layer; a first wiring layer disposed on the first insulating layer; a first via layer penetrating the first insulating layer so as to connect the first wiring layer and the through via; a second wiring layer disposed on the second insulating layer; The printed circuit board according to claim 1 , further comprising: a second via layer penetrating the second insulating layer to connect the second wiring layer and the first wiring layer to each other.

10. a third insulating layer disposed on the second insulating layer; a third wiring layer disposed on the third insulating layer; The printed circuit board according to claim 9 , further comprising: a third via layer penetrating the third insulating layer to connect the third wiring layer and the second wiring layer to each other.

11. a glass layer having a first side and a second side facing each other in a first direction, a third side and a fourth side facing each other in a second direction perpendicular to the first direction, a first corner portion connecting the first side and the third side, a second corner portion connecting the first side and the fourth side, a third corner portion connecting the second side and the third side, and a fourth corner portion connecting the second side and the fourth side; an insulating material disposed on the glass layer and covering the first side surface to the fourth side surface and the first corner portion to the fourth corner portion; At least one of the first corner portion to the fourth corner portion of the printed circuit board has a plurality of corners.

12. the first corner portion includes a first corner surface in contact with the first side surface and the third side surface, The printed circuit board of claim 11 , wherein the plurality of corners include a corner where the first corner surface meets the first side surface and a corner where the first corner surface meets the third side surface.

13. The first corner portion includes a plurality of first corner surfaces that are in contact with the first side surface and the third side surface, respectively, or in contact with each other, The printed circuit board of claim 11 , wherein the plurality of corners includes a corner where the plurality of first corner surfaces meet each other.

14. The printed circuit board according to claim 11, wherein at least one of the first corner portion to the fourth corner portion has an incline on a plane.

15. The printed circuit board according to claim 11, wherein at least one of the first corner portion to the fourth corner portion has a step on a plane.

16. The printed circuit board according to claim 15 , wherein the step comprises a staircase-like step on a plane.

17. the insulating material includes a first insulating material disposed on the glass layer and a second insulating material disposed on the first insulating material; the first insulating material covers a portion of a first side surface to a fourth side surface and a portion of a first corner portion to a fourth corner portion of the glass layer; The printed circuit board of claim 11 , wherein the second insulating material covers the first side to fourth side surfaces and the remaining portions of the first corner portion to fourth corner portion of the glass layer.

18. a through via penetrating the glass layer; a wiring layer disposed on or within the insulating material; The printed circuit board of claim 11 , further comprising a via layer penetrating at least a portion of the insulating material to connect the wiring layer and the through via to each other.

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