Air conditioning system, air conditioning method, and article manufacturing method

Abstract

To provide an air conditioning system, an air conditioning method, etc., which can efficiently regulate the temperature in a room where a semiconductor manufacturing device is installed.SOLUTION: An air conditioning system S includes a heating element installation room R in which a heating element N is installed, a circulating air conditioning unit 10 that adjusts the temperature of exhaust air B2 recovered from the heating element installation room R to a predetermined temperature and returns it to the heating element installation room R, an air supply unit 30 that supplies intake air B3 from the outside CR of the circulating air conditioning unit 10, an exhaust unit 40 that exhausts exhaust air B to the outside CR of the circulating air conditioning unit 10, and an intake and exhaust adjustment unit 50 that adjusts the air volume of the intake air B3 and the air volume of the exhaust air B2b exhausted from the exhaust unit 40 on the basis of the temperature difference between the intake air B3 and the exhaust air B2.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an air conditioning system for a room in which semiconductor manufacturing equipment is installed. [Background technology]

[0002] 2. Description of the Related Art Lithography apparatus used in lithography processes for manufacturing articles such as semiconductor devices includes, for example, an imprint apparatus. Semiconductor device manufacturing equipment such as imprinting equipment is housed in a semiconductor manufacturing equipment installation room provided in a clean room in order to precisely control the temperature, humidity, and air cleanliness. The semiconductor manufacturing equipment installation room is a nearly sealed space, and its temperature is controlled independently from the temperature control of the clean room. Patent Document 1 describes an air conditioner that can maintain the cleanliness of indoor air without causing large fluctuations in the indoor temperature. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-93542 Summary of the Invention [Problem to be solved by the invention]

[0004] In semiconductor device manufacturing equipment, actuators, which are heat-generating elements, operate continuously throughout the year, so there is a demand for efficient temperature control in the rooms in which the semiconductor manufacturing equipment is installed to reduce running costs. However, with the air conditioning system of Patent Document 1, when the temperature or the like in the room where the semiconductor manufacturing equipment is installed changes significantly, the output of the cooler and heater must be increased, making it difficult to reduce running costs.

[0005] An object of the present invention is to provide an air conditioning system, an air conditioning method, and the like that can efficiently regulate the temperature in a room in which semiconductor manufacturing equipment is installed. [Means for solving the problem]

[0006] In order to solve the above problems, an air conditioning system as one aspect of the present invention comprises a heating element installation room in which a heating element is installed, a circulating air conditioning unit that adjusts the temperature of exhaust air recovered from the heating element installation room to a predetermined temperature and returns it to the heating element installation room, an air supply unit that supplies intake air from outside the circulating air conditioning unit, an exhaust unit that exhausts the exhaust air to the outside of the circulating air conditioning unit, and an intake and exhaust adjustment unit that adjusts the air volume of the intake air and the air volume of the exhaust air exhausted from the exhaust unit based on the temperature difference between the intake air and the exhaust air. Effect of the Invention

[0007] According to the present invention, it is possible to provide an air conditioning system, an air conditioning method, and the like that can efficiently operate air conditioning in a room where semiconductor manufacturing equipment is installed. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic diagram showing an air conditioning system according to an embodiment; [Diagram 2] FIG. 1 is a schematic diagram showing a schematic configuration of an air conditioning system. [Diagram 3] FIG. 4 is a flowchart showing an air conditioning method according to the embodiment. [Figure 4] FIG. 2 is a schematic diagram for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiment. In each drawing, the same members or elements are given the same reference numerals and the description thereof will be omitted.

[0010] [Air conditioning system] FIG. 1 is a schematic diagram showing an air conditioning system S according to an embodiment of the present invention. FIG. 2 is a schematic diagram showing a schematic configuration of an air conditioning system.

[0011] The air conditioning system S is installed integrally with a semiconductor manufacturing equipment installation room (heat generating element installation room) R, and performs air conditioning (temperature control) of the semiconductor manufacturing equipment installation room R. The semiconductor manufacturing equipment installation room R and the air conditioning system S are installed inside a clean room CR. The clean room (outside) CR is equipped with an air intake section C1 and an exhaust system C2, and maintains the inside of the clean room CR at a constant temperature. The air supply section C1 is equipped with a heating coil, a cooling coil, a HEPA filter, etc., and supplies outside air A1 into the clean room CR after regulating the temperature of the air to a constant temperature. Temperature-regulated air A2 is supplied into the clean room CR. The clean room CR is filled with air A2 at a temperature of 23°C. The air A2 is managed to have an error (precision) within ±2°C. The exhaust system C2 recovers the air A2 from the clean room CR and exhausts it to the outside.

[0012] In the semiconductor manufacturing equipment installation room R, a semiconductor manufacturing equipment N such as an imprint device is installed. The semiconductor manufacturing equipment (heating body) N has a large number of actuators. The maximum heat generation of the semiconductor manufacturing equipment N is approximately 2 kW. As the semiconductor manufacturing equipment N operates, the actuators generate heat, causing the temperature inside the semiconductor manufacturing equipment installation room R to rise. The air conditioning system S supplies air at a constant temperature (temperature-controlled air B1) to the semiconductor manufacturing equipment installation room R. At the same time, the air conditioning system S recovers exhaust heat (exhaust air B2) from the semiconductor manufacturing equipment installation room R that accompanies the operation of the semiconductor manufacturing equipment N. This allows the semiconductor manufacturing equipment installation room R to be maintained at a constant temperature. It should be noted that the semiconductor manufacturing equipment installation room R is not a completely sealed space, and some of the air (exhaust heat air B2) within the semiconductor manufacturing equipment installation room R leaks out into the clean room CR.

[0013] The air conditioning system S includes a circulating air conditioning section 10, an air supply section 30, an exhaust section 40, and an air supply / exhaust adjustment section 50. The circulating air conditioning unit 10 adjusts the temperature of the exhaust hot air B2 recovered from the semiconductor manufacturing equipment installation room R to a predetermined temperature, and returns this temperature-adjusted air B1 to the semiconductor manufacturing equipment installation room R. The circulating air conditioning unit 10 includes a circulation duct 11, a blower 12, a cooler 14, a heater 16, a chemical filter 17, an air intake filter 18, and the like.

[0014] The circulation duct 11 is an air duct having one end connected to the floor surface or the like of the semiconductor manufacturing equipment installation room R and the other end connected to the ceiling of the semiconductor manufacturing equipment installation room R. The cross-sectional area of ​​the circulation duct 11 is known. Exhaust air B2 is drawn (recovered) into circulation duct 11 from the floor surface of semiconductor manufacturing equipment installation room R. Inside circulation duct 11, exhaust air B2 is converted into temperature-regulated air B1. Temperature-regulated air B1 is blown (supplied) through circulation duct 11 from the ceiling of semiconductor manufacturing equipment installation room R.

[0015] The blower 12 is disposed inside the circulation duct 11 and causes the air (temperature-controlled air B1, exhaust air B2, and mixed air B4) inside the circulation duct 11 to flow (blow). The blower 12 is disposed at approximately the middle position of the path of the circulation duct 11. The blower has a heat value of, for example, approximately 850 W. The rotation speed of the blower 12 is controlled by a blower inverter 13. During normal operation, the rotation speed of the blower 12 is kept constant and the mixed air B4 is blown at a rate of 17 (m 3 / min) of airflow.

[0016] The cooler 14 is disposed inside the circulation duct 11, downstream of the blower 12. The cooler 14 is connected to a cooling water circulator 15, and cools the air passing through the cooler 14 (air B4). The heater 16 is disposed inside the circulation duct 11, downstream of the cooler 14. The heater 16 heats the air that has passed through the cooler 14 and been cooled. The air (temperature-controlled air B1) that has passed through the cooler 14 and heater 16 is regulated to a predetermined temperature. That is, the exhaust air B2 turns into temperature-controlled air B1 through the cooler 14 and heater 16. The temperature-controlled air B1 is regulated to a temperature of 23°C with an accuracy (error) of 1 / 100 to 1 / 1000°C.

[0017] The chemical filter 17 is disposed downstream of the heater 16. The chemical filter 17 removes (captures) toxic gases and minute acidic and basic particles contained in the temperature regulated air B1. The air intake filter 18 is disposed at a temperature regulated air outlet provided in the ceiling of the semiconductor manufacturing equipment installation room R. The air intake filter 18 is a ULPA filter, and removes dust (contamination) contained in the temperature regulated air B1.

[0018] A supply-side exhaust valve 19 is provided in the circulation duct 11 between the blower 12 and the cooler 14. The supply-side exhaust valve (supply-side exhaust section) 19 functions as an adjustment valve for adjusting the volume and pressure of the mixed air B4 blown out from the blower 12 and flowing into the cooler 14.

[0019] The circulating air conditioning unit 10 has a plurality of sensors. Specifically, it has three thermometers 21-23, two pressure gauges 24 and 25, and three flow meters 26-28. The thermometer 21 is disposed near the temperature-controlled air outlet of the semiconductor manufacturing equipment installation room R. The thermometer 21 measures the temperature of the temperature-controlled air B1 supplied to the semiconductor manufacturing equipment installation room R.

[0020] Thermometer (first thermometer) 22 is disposed in circulation duct 11, downstream of blower 12. Thermometer 22 measures the temperature of mixed air B4 (exhaust air B2, supply air B3) blown out from blower 12 before temperature adjustment.

[0021] Thermometer (second thermometer) 23 is disposed in circulation duct 11, upstream of blower 12. An air intake port of air intake section 30 is provided upstream of blower 12. Thermometer 23 measures the temperature of intake air B3 flowing from air intake section 30 into circulation duct 11.

[0022] The pressure gauge 24 is disposed in the circulation duct 11 on the upstream side (suction side) of the blower 12. The pressure gauge 24 measures the pressure (static pressure) of the mixed air B4 sucked into the blower 12. The pressure gauge 25 is disposed in the circulation duct 11 on the downstream side (discharge side) of the blower 12. The pressure gauge 25 measures the pressure (static pressure) of the mixed air B4 discharged from the blower 12. The operating status of the blower 12 can be confirmed based on the difference (differential pressure) between the measured values ​​of the pair of pressure gauges 24, 25.

[0023] The flow rate meter (second flow rate meter) 26 is disposed in the circulation duct 11, upstream of the blower 12. It measures the flow rate of air (intake air B3) flowing from the air intake section 30 into the circulation duct 11. The flow rate of the intake air B3 is calculated from the flow rate of the intake air B3 and the cross-sectional area of ​​the circulation duct 11.

[0024] The flow rate meter (first flow rate meter) 27 is disposed at the most upstream side of the circulation duct 11. It measures the flow rate of the exhaust air B2 drawn into the circulation duct 11 from the floor surface of the semiconductor manufacturing equipment installation room R. The air volume of the exhaust air B2 can be calculated from the flow rate of the exhaust air B2 and the cross-sectional area of ​​the circulation duct 11. The flow meter (first flow meter) 28 is disposed in the circulation duct 11, between the flow meter 26 and the flow meter 27. An exhaust port 41 of the exhaust unit 40 is provided between the flow meter 26 and the flow meter 27. The flow meter 28 measures the flow speed of air (exhaust heated air B2) that continues to flow through the circulation duct 11 without being discharged from the exhaust unit 40 (exhaust heated air B2). The air volume of the exhaust heated air B2 can be calculated from the flow speed of the exhaust heated air B2 and the cross-sectional area of ​​the circulation duct 11. Furthermore, the flow rate of the exhaust hot air B2b discharged from the exhaust section 40 is calculated from the difference between the measured values ​​of the flow meter 27 and the flow meter 28 (difference in flow speed) and the cross-sectional area of ​​the circulation duct 11.

[0025] The air intake section 30 takes in the air A2 from within the clean room CR into the circulation duct 11. The air intake section 30 is disposed slightly downstream of the blower 12. The air intake section 30 has an air intake port 31 whose opening degree can be adjusted. The air intake section 30 adjusts the volume of air A2 (intake air B3) taken into the circulation duct 11 according to the opening degree of the air intake port 31. A chemical filter 32 is disposed in the air intake port 31. The air A2 passes through the chemical filter 32 and becomes the intake air B3, which flows into the circulation duct 11. The intake air B3 mixes with the air that continues to flow through the circulation duct 11 (the exhaust air B2).

[0026] As described above, a portion of the air (exhaust air B2) in the semiconductor manufacturing equipment installation room R leaks out into the clean room CR. For this reason, during normal operation, the air intake port 31 of the air intake section 30 is always open to continuously take in the intake air B3 into the circulation duct 11. During normal operation (normal operation mode), the air volume of the intake air B3 is 5.0 (m 3 / min). In the energy-saving operation mode, the air intake section 30 can further increase the opening of the air intake port 31 to take in a large amount of intake air B3. In the energy-saving operation mode, the air volume of the intake air B3 is 7.5 (m 3 / min).

[0027] Exhaust section 40 is disposed upstream of air supply section 30. Exhaust section 40 discharges (exhausts) a portion of exhaust air B2 (exhaust air B2b) recovered from the floor surface of semiconductor manufacturing equipment installation room R to the outside of circulation duct 11. The exhaust unit 40 has an openable and closable exhaust port 41 (exhaust valve) and a blower 42. The exhaust unit 40 opens the exhaust port 41 and drives the blower 42 to forcibly exhaust a part of the exhaust air B2 (exhaust air B2b) into the clean room CR. During normal operation, the exhaust port 41 of the exhaust unit 40 is always closed. The exhaust unit 40 operates when the intake unit 30 takes in a large amount of intake air B3. In other words, the exhaust unit 40 operates in the energy saving operation mode. The exhaust section 40 exhausts to the outside the exhaust hot air B2 (exhaust hot air B2b) corresponding to the increase in the amount of air (intake air B3) taken in from the intake section 30. The flow rate of the exhaust hot air B2b is 2.5 (m 3 / min).

[0028] The air supply and exhaust adjustment unit 50 has an air conditioner control unit 51 and controls the air conditioning system S in an integrated manner. The air conditioner control unit 51 controls the blower 12 (blower inverter 13), the cooler 14 (cooling water circulator 15), and the heater 16. The air conditioner control unit 51 also controls the air intake port 31 of the air intake unit 30, the exhaust port 41 of the exhaust unit 40, and the blower 42. The air conditioner control section 51 controls the blower 12 and the like based on the measured values ​​of the thermometers 21-23, the pressure gauges 24 and 25, and the flow meters 26-28.

[0029] For example, the air conditioner control unit 51 determines the temperature difference between the intake air B3 and the exhaust air B2 based on the measured values ​​of the thermometers 22 and 23. Then, when this temperature difference is large, the air conditioner control unit 51 increases the amount of intake air B3. Specifically, the air conditioner control unit 51 increases the rotation speed of the blower 12. At the same time, it increases the opening of the intake port 31 and activates the exhaust port 41 and the blower 42. The air volume of the supply air B3 taken in through the supply air section 30 and the air volume of the exhaust air B2 discharged through the exhaust section 40 are adjusted. The air conditioner control section 51 takes in the cool air (supply air B3) into the circulation duct 11, thereby reducing the running costs of the air conditioning system S.

[0030] [Air conditioning method] FIG. 3 is a flow chart showing an air conditioning method according to the embodiment. In the air conditioning system S, the air conditioner control unit 51 controls the cooler 14 and the heater 16 based on the measurement value of the thermometer 21. The temperature of the temperature-controlled air B1 supplied to the semiconductor manufacturing equipment installation room R is precisely maintained constant. Specifically, the temperature of the temperature-controlled air B1 is maintained at 23°C, and is temperature-controlled to an accuracy of 1 / 100 to 1 / 1000°C. This temperature control is constantly performed when the air conditioning system S is in operation.

[0031] (Step S1: Circulation air conditioning process) First, the air conditioning system S operates (controls temperature) in the normal operation mode. In normal operation mode, the blower 12 blows at a speed of 17 (m 3The mixed air B4 blown out from the blower 12 passes through the cooler 14 and the heater 16 to become the temperature-controlled air B1. The temperature-controlled air B1 has a flow rate of 17 (m 3 / min) of air is supplied to the semiconductor manufacturing equipment installation room R. The exhaust air B2 from the semiconductor manufacturing equipment installation room R is 12.5 (m 3 The exhaust port 41 of the exhaust unit 40 is closed, and all of the exhaust air B2 is sent toward the blower 12. The air intake section 30 takes in the intake air B3 from the air intake port 31. The volume of the intake air B3 is 5.0 (m 3 / min. The intake air B3 and the exhaust air B2 join and are stirred to produce mixed air B4, which is sucked into the blower 12.

[0032] As mentioned above, the maximum heat output of semiconductor manufacturing equipment N in semiconductor manufacturing equipment installation room R is approximately 2 kW. Therefore, if semiconductor manufacturing equipment N continues to operate at 50% output, it is calculated that the temperature of exhaust air B2 will be 26.3°C. If semiconductor manufacturing equipment N continues to operate at 100% output, it is calculated that the temperature of exhaust air B2 will be 29.6°C.

[0033] When the temperature of air A2 in the clean room CR is, for example, 21° C., the temperature of supply air B3 becomes 23.5° C. due to the influence of the heat of adsorption of the chemical filter 32. When the temperature of air A2 is 25° C., the temperature of supply air B3 becomes 27.5° C. The temperature of supply air B3 is measured by thermometer 23.

[0034] When the temperature of the exhaust air B2 is 29.6° C., if intake air B3 having a temperature of 23.5° C. is taken in from air intake section 30 and mixed with the exhaust air B2, the temperature of mixed air B4 downstream of blower 12 will be 30.2° C. The temperature of mixed air B4 is measured by thermometer 22. In order to cool the temperature of this mixed air B4 to 23°C, it becomes necessary to increase the output of the cooler 14.

[0035] (Step S2) The air conditioner control unit 51 determines whether or not to transition to the energy saving operation mode. Thermometer 23 constantly measures the temperature of air (intake air B3) flowing from air intake section 30 into circulation duct 11. Air conditioner control section 51 determines to transition to the energy-saving operation mode when the temperature of intake air B3 falls below the temperature of exhaust air B2. In other words, air conditioner control section 51 determines to transition to the energy-saving operation mode based on the temperature difference between intake air B3 and exhaust air B2.

[0036] More specifically, the volume of intake air B3 is 5.0 (m 3 / min), the temperature is 25.5℃, and the volume of exhaust air B2 is 15(m 3 / min), and the need to switch to energy-saving operation mode is determined based on a temperature of 29.6°C. Specifically, the sum (criterion value) of the products of the air volumes and temperatures of the intake air B3 and the exhaust heat air B2 is calculated. (Judgment value) = 5 x 25.5 + 15 x 29.6 = 571.5 The value of this judgment value is set as the threshold value.

[0037] For example, if the volume of intake air B3 is 7.5 (m 3 / min), the temperature is 23.7℃, and the volume of exhaust air B2 is 12.5(m 3 / min) and the temperature is 31°C, the total value (judgment value) of the air volume and temperature is as follows. (Judgment value) = 7.5 x 23.7 + 12.5 x 31 = 565.2 At this time, the determination value is below the threshold value, so the air conditioner control unit 51 determines to transition to the energy saving operation mode. On the other hand, when the determination value exceeds the threshold value, the air conditioner control unit 51 returns to step S1 and maintains the normal operation mode.

[0038] (Step S3) When the operation mode is switched to the energy saving operation mode, the air conditioner control unit 51 instructs the blower 12 to increase its output (change its output).

[0039] (Step S4) Next, air conditioner control unit 51 monitors the operating status of blower 12 based on the difference (air pressure difference) between the measured values ​​of pressure gauge 24 and pressure gauge 25. In other words, it checks the output status of blower 12. If the difference between the measured values ​​of pressure gauge 24 and pressure gauge 25 is large, it can be confirmed that blower 12 is operating at an increased output. On the other hand, if the difference between the measured values ​​of pressure gauge 24 and pressure gauge 25 has not increased, the process returns to step S3, and an instruction to increase the output of blower 12 is issued again.

[0040] (Step S5: Air supply process, exhaust process) Then, the air conditioner control unit 51 instructs the air supply unit 30 to increase the opening of the air supply port 31. The air volume (air supply volume) of the intake air B3 is increased by 5 (m 3 / min) to 7.5(m 3 / min). At the same time, the air conditioner control unit 51 instructs the exhaust unit 40 to open the exhaust port 41 and operate the blower 42. The exhaust air B2 (exhaust air B2b) is discharged to the outside by an amount equal to the increase in the volume of the intake air B3. In other words, the exhaust air B2b is discharged from the exhaust port 41 at a rate of 2.5 (m 3 The exhaust is forced out at a volume of 100 / min.

[0041] (Step S6: Intake and exhaust adjustment process) The air supply / exhaust adjustment unit 50 makes the volume of the exhaust air B2b equal to the increase in the volume of the supply air B3. That is, the air supply / exhaust adjustment unit 50 balances (adjusts the air supply / exhaust) the increase in the volume of the supply air B3 and the volume of the exhaust air B2b. The air conditioner control unit 51 controls the cooler 14 based on the measurement value of the thermometer 21. When the temperature of the mixed air B4 is 28.6°C, the mixed air B4 is cooled by the cooler 14 to drop to 23°C. When the temperature of the temperature regulated air B1 falls below 23°C due to supercooling by the cooler 14, the mixed air B4 is heated by the heater to raise the temperature of the temperature regulated air B1 to 23°C. The temperature of the air A2 in the clean room CR and the heat generation amount of the semiconductor manufacturing equipment N continue to change. That is, the temperatures of the supply air B3 and the exhaust air B2 also change. For this reason, the air conditioner control unit 51 continues to control the cooler 14 and the heater 16 so that the temperature of the temperature-controlled air B1 is kept constant at 23°C. Then, the process returns to step S2, and the above-mentioned processing is carried out again.

[0042] In the normal operation mode of the air conditioning system S, when the maximum heat output of the semiconductor manufacturing equipment N is about 2 kW, the exhaust air B2 has an air volume of 12.5 (m 3 / min) and the temperature becomes 31.0°C. In the energy saving operation mode, when the temperature of the air A2 in the clean room CR is 22°C, the air A2 flows from the air intake 31 to a volume of 7.5 (m 3 The intake air B3 is sucked in at a flow rate of 23.7°C / min and passes through the chemical filter 32. As a result, the mixed air B4 upstream of the blower 12 has a temperature of 28.2°C. The mixed air B4 upstream of the blower 12 has a temperature of 30.4°C. Therefore, the workload of the cooler 14 is the temperature difference of 7.4°C between the temperature regulated air B1 (23°C) and the mixed air B4 (30.4°C).

[0043] On the other hand, in a conventional air conditioning system (normal operation mode only), when the maximum heat output of the semiconductor manufacturing equipment N is about 2 kW, the exhaust air B2 has an air volume of 15.0 (m 3 / min), and the temperature reaches 29.6°C. When the temperature of air A2 in the clean room CR is 22°C, air A2 is supplied from the air supply port 31 at a rate of 5.0 (m 3 The intake air B3 is sucked in at a flow rate of 100 suction air / min and passes through the chemical filter 32, and its temperature becomes 24.5°C. As a result, the mixed air B4 upstream of the blower 12 has a temperature of 28.3°C. The mixed air B4 upstream of the blower 12 has a temperature of 30.52°C. Therefore, the workload of the cooler 14 is the temperature difference of 7.52°C between the temperature regulated air B1 (23°C) and the mixed air B4 (30.52°C).

[0044] In the air conditioning system S, the amount of heat processed by the cooler 14 throughout the year is 3109.1 (W / year). When converted into electrical energy, this is equivalent to approximately 27235.7 kWH. With a conventional air conditioning system (normal operation mode only), the figure is 3161.7 (W / year), which is equivalent to approximately 27696.5 kWH of electrical energy. Thus, with air conditioning system S, the annual energy saving effect is 460.7 kWH.

[0045] In this way, the air conditioning system S adjusts the volume of the intake air B3 taken in through the intake section 30 and the volume of the exhaust air B2b discharged through the exhaust section 40 based on the temperature difference between the intake air B3 and the exhaust air B2. By taking in cold air (intake air B3) into the circulation duct 11 and discharging a portion of the heated air (exhaust air B2b) from the circulation duct 11, the running costs of the air conditioning system S can be reduced.

[0046] <Example of article manufacturing method> The method for manufacturing an article according to this embodiment is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to this embodiment includes a step of forming a pattern on a composition applied to a substrate using the above-mentioned imprinting apparatus (semiconductor manufacturing apparatus N) (a step of processing the substrate), and a step of processing the substrate on which the pattern has been formed in this step. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, composition peeling, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0047] The pattern of the cured product formed using the imprinting apparatus (semiconductor manufacturing apparatus N) is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, molds, etc. Examples of electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for substrate processing such as imprinting.

[0048] The pattern of the cured product may be used as it is as at least a part of a component of the article, or may be used temporarily as a composition mask, which is removed after etching or ion implantation is performed in a substrate processing step.

[0049] Next, a specific method for manufacturing the article will be described with reference to Fig. 4. As shown in Fig. 4(A), a substrate 1z such as a silicon substrate having a workpiece 2z such as an insulator formed on its surface is prepared, and then a composition 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which the composition 3z in the form of multiple droplets is applied onto the substrate 1z is shown.

[0050] As shown in FIG. 4(B), the mold 4z is placed so that the side on which the concave-convex pattern is formed faces the composition 3z on the substrate 1z. As shown in FIG. 4(C), the substrate 1z to which the composition 3z is applied is brought into contact with the mold 4z, and pressure is applied (contact step). The composition 3z fills the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z in this state as energy for curing, the composition 3z is cured (curing step). At this time, in this embodiment, it is possible to irradiate the composition with light at an irradiation amount that results in an optimal degree of photopolymerization based on the spectral sensitivity characteristics acquired within the device.

[0051] As shown in Fig. 4(D), after the composition 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the composition 3z is formed on the substrate 1z (pattern formation step, molding step). In this cured product pattern, the concave portions of the mold 4z correspond to the convex portions of the cured product, that is, the concave-convex pattern of the mold 4z is transferred to the composition 3z.

[0052] As shown in FIG. 4(E), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin portion remains is removed, forming a groove 5z. As shown in FIG. 4(F), when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured material is removed, but it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing. Note that, although an example of using a mold for transferring a circuit pattern provided with a concave-convex pattern as the mold 4z has been described, a flat template having a flat portion without a concave-convex pattern may also be used.

[0053] <Other embodiments> Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. Furthermore, the various numerical values ​​used in the above description are merely examples, and the present invention is not limited to the above numerical values.

[0054] The various numerical values ​​(heat amount, temperature, air volume, etc.) described in the above-mentioned embodiment are merely examples, and various modifications and changes are possible. The semiconductor manufacturing apparatus N is not limited to an imprint apparatus, but may be various kinds of semiconductor manufacturing apparatus. Also, the semiconductor manufacturing apparatus N is not limited to a semiconductor manufacturing apparatus, but may be an apparatus having a heat source. Furthermore, the semiconductor manufacturing equipment N is not limited to being housed in the semiconductor manufacturing equipment installation room R.

[0055] The disclosure of this embodiment includes the following configuration. (Configuration 1) a heating element installation chamber in which a heating element is installed; a circulating air conditioning unit that adjusts the temperature of the exhaust air recovered from the heating element installation chamber to a predetermined temperature and returns the air to the heating element installation chamber; An air supply unit that supplies air from outside the circulating air conditioning unit; an exhaust section that exhausts the exhaust hot air to the outside of the circulating air conditioning section; an air supply / exhaust adjustment unit that adjusts the volume of the intake air and the volume of the exhaust air discharged from the exhaust unit based on a temperature difference between the intake air and the exhaust air; Equipped with an air conditioning system. (Configuration 2) The air conditioning system according to configuration 1, wherein the air supply / exhaust adjustment unit balances the volume of the intake air and the volume of the exhaust air. (Configuration 3) The air conditioning system according to configuration 2, wherein the air supply / exhaust adjustment unit increases the air volume of the supply air and makes the air volume of the exhaust air equal to the increase in the air volume of the supply air when the heat quantities of the supply air and the exhaust air fall below a threshold value. (Configuration 4) The air intake and exhaust adjustment unit is A first thermometer for measuring the temperature of the air before the temperature is adjusted; A second thermometer for measuring the temperature of the intake air; A first flow meter for measuring the volume of the exhaust air; A second flow meter for measuring the volume of the intake air; The air conditioning system according to any one of configurations 1 to 3, comprising: (Configuration 5) The air intake and exhaust adjustment unit is a pair of pressure gauges for measuring an air pressure difference between the upstream side and the downstream side of a blower provided in the circulating air conditioning unit; 5. The air conditioning system according to any one of configurations 1 to 4, wherein an output change is instructed to the blower, and the output status of the blower is monitored based on the air differential pressure. (Configuration 6) The air conditioning system according to any one of configurations 1 to 5, wherein the circulating air conditioning unit supplies air to the heating element installation room through a ULPA filter. (Configuration 7) 2. The air conditioning system according to claim 1, wherein the circulating air conditioning unit includes a supply-side exhaust unit that adjusts the volume or pressure of the air supplied to the heating element-installed room. (Configuration 8) The heating element installation room is installed in a clean room, 8. The air conditioning system of any one of configurations 1 to 7, wherein the intake air is temperature-controlled air in the clean room.

[0056] (Method 1) a circulating air conditioning process for adjusting the temperature of exhaust air recovered from a heating element installation chamber in which a heating element is installed to a predetermined temperature and returning the exhaust air to the heating element installation chamber; an air supply process for supplying air from the outside; an exhaust step of exhausting the exhaust air to the outside; an air supply / exhaust adjustment process for adjusting an air volume of the intake air and an air volume of the exhaust air to be exhausted to the outside based on a temperature difference between the intake air and the exhaust air; The air conditioning method comprises: (Method 2) The heating element in the air conditioning system according to any one of configurations 1 to 8 is an imprint apparatus, forming a pattern on a substrate using the imprint apparatus; a step of processing the substrate on which the pattern has been formed in the step; A method for manufacturing an article, comprising: [Explanation of symbols]

[0057] S Air Conditioning System 10 Circulating air conditioning section 11 Circulation Duct 12 Blower 14 Cooler 16 Heater 17 Chemical Filter 18 Air Inlet Filter 19 Supply side exhaust valve (supply side exhaust part) 21 Thermometer 22 Thermometer (first thermometer) 23 Thermometer (second thermometer) 24,25 Pressure gauge 26 Current meter (second current meter) 27 Current meter (first current meter) 28 Current meter (first current meter) 30 Air supply section 31 Air supply port 32 Chemical Filter 40 Exhaust section 41 Exhaust port 42 Blower 50 Intake and exhaust adjustment section 51 Air conditioner control unit A1 Outside air A2 Air B1 Temperature-controlled air B2 Waste air B2b Waste air B3 Intake air B4 Mixed Air R Semiconductor manufacturing equipment installation room (heating element installation room) N Semiconductor manufacturing equipment (heating element) CR Clean Room (External)

Claims

1. a heating element installation chamber in which a heating element is installed; a circulating air conditioning unit that adjusts the temperature of the exhaust air recovered from the heating element installation chamber to a predetermined temperature and returns the air to the heating element installation chamber; An air supply unit that supplies air from outside the circulating air conditioning unit; an exhaust section that exhausts the exhaust hot air to the outside of the circulating air conditioning section; an air supply / exhaust adjustment unit that adjusts the volume of the intake air and the volume of the exhaust air discharged from the exhaust unit based on a temperature difference between the intake air and the exhaust air; Equipped with an air conditioning system.

2. The air conditioning system according to claim 1 , wherein the air supply / exhaust adjustment unit balances an air volume of the intake air and an air volume of the exhaust air.

3. The air conditioning system according to claim 2, wherein the air supply / exhaust adjustment unit increases the air volume of the intake air and makes the air volume of the exhaust air equal to the increase in the air volume of the intake air when the heat quantities of the intake air and the exhaust air fall below a threshold value.

4. The air intake and exhaust adjustment unit is A first thermometer for measuring the temperature of the air before the temperature is adjusted; A second thermometer for measuring the temperature of the intake air; A first flow meter for measuring the volume of the exhaust air; A second flow rate meter for measuring the volume of the intake air; The air conditioning system of claim 1 .

5. The air intake and exhaust adjustment unit is a pair of pressure gauges for measuring an air pressure difference between the upstream side and the downstream side of a blower provided in the circulating air conditioning unit; The air conditioning system according to claim 1 , wherein an output change is instructed to the blower, and an output state of the blower is monitored based on the air differential pressure.

6. The air conditioning system according to claim 1 , wherein the circulating air conditioning unit supplies air to the heating element installation room through a ULPA filter.

7. The air conditioning system according to claim 1 , wherein the circulating air conditioning unit includes a supply-side exhaust unit that adjusts an air volume or a pressure of the air supplied to the heating element-installed room.

8. The heating element installation room is installed in a clean room, 2. The air conditioning system of claim 1, wherein the intake air is temperature conditioned air within the clean room.

9. a circulating air conditioning process for adjusting the temperature of exhaust air recovered from a heating element installation chamber in which a heating element is installed to a predetermined temperature and returning the exhaust air to the heating element installation chamber; an air supply process for supplying air from the outside; an exhaust step of exhausting the exhaust air to the outside; an air supply / exhaust adjustment process for adjusting an air volume of the intake air and an air volume of the exhaust air to be exhausted to the outside based on a temperature difference between the intake air and the exhaust air; The air conditioning method comprises:

10. 9. The air conditioning system according to claim 1, wherein the heat generating element is an imprinting device. forming a pattern on a substrate using the imprint apparatus; a step of processing the substrate on which the pattern has been formed in the step; A method for manufacturing an article, comprising:

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