Substrate transfer device capable of moving layer

Abstract

To provide a substrate transfer device capable of moving a layer of a substrate to increase the processing amount in a limited area.SOLUTION: The substrate transfer device according to the invention of the present application includes: a first moving plate; a second moving plate located below the first moving plate; a shuttle for storing the substrate, the shuttle moving on the first moving plate and the second moving plate; and a first layer transfer connected to the first moving plate and the second moving plate, the first layer transfer moving the shuttle on one of the first moving plate and the second moving plate to the other of the first moving plate and the second moving plate.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a substrate transfer device, and more particularly to a substrate transfer device capable of layer-by-layer movement of a substrate. [Background technology]

[0002] It is very important to reduce the area of ​​equipment used in semiconductor or display processes. For example, by reducing the area occupied by a substrate transfer device, more equipment can be installed and operated in a factory, thereby improving productivity and production capacity. In addition, by optimizing the use of space in a factory through the reduction in area, the space utilization efficiency increases, which is advantageous for cost reduction, and by shortening the movement path, the movement time during the production process can be reduced, thereby optimizing the production line. Therefore, a technology is needed to increase the throughput per unit area of ​​equipment used in semiconductor processes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Korean Patent No. 10-1757865 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a substrate transfer device capable of layer-by-layer movement of substrates to increase the throughput in a limited area. [Means for solving the problem]

[0005] A substrate transfer device according to one embodiment may include a first moving plate, a second moving plate located below the first moving plate, a shuttle configured to move on the first moving plate or the second moving plate and accommodate a substrate, and a first layer transfer connected to the first moving plate and the second moving plate and configured to move the shuttle from one of the first moving plate to the other of the second moving plate.

[0006] Here, one end of the first layer transfer may be connected to the first moving plate, and the other end may be connected to the second moving plate.

[0007] Here, the first layer transfer may be configured in a spiral shape including a curved surface.

[0008] Here, the first moving plate includes a first side and a second side, the second moving plate includes a third side corresponding to the first side and a fourth side corresponding to the second side, one end of the first layer transfer may be connected to the first moving plate so as to be closer to the first side than the second side, and the other end of the first layer transfer may be connected to the second moving plate so as to be closer to the fourth side than the third side.

[0009] Here, the first moving plate and the second moving plate include magnetic levitation rails, and the shuttle can be magnetically levitated by the magnetic levitation rails and move on the first moving plate or the second moving plate.

[0010] Here, the actuator may further include a third moving plate disposed adjacent to the first moving plate, and a first link connected to the first moving plate and the third moving plate and configured to move the shuttle from one of the first moving plate and the third moving plate to the other.

[0011] Here, the wafer may further include a second layer transfer connected to the second moving plate and the third moving plate and configured to move the shuttle from one of the second moving plate and the third moving plate to the other.

[0012] Here, the second moving plate may include a third side and a fourth side, the first layer transfer may be connected to the first moving plate so as to be closer to the fourth side than the third side, and the second layer transfer may be connected to the first moving plate so as to be closer to the third side than the fourth side.

[0013] Here, the actuator may further include a fourth moving plate disposed adjacent to the second moving plate, and a second link connected to the second moving plate and the fourth moving plate and configured to move the shuttle above one of the second moving plate and the fourth moving plate and above the other one of the second moving plate and the fourth moving plate.

[0014] Here, the wafer may further include a third layer transfer connected to the first moving plate and the fourth moving plate and configured to move the shuttle from one of the first moving plate and the fourth moving plate to the other one of the first moving plate and the fourth moving plate.

[0015] Here, the first moving plate may include a first side and a second side, the first layer transfer may be connected to the first moving plate so as to be closer to the first side than the second side, and the third layer transfer may be connected to the first moving plate so as to be closer to the second side than the first side.

[0016] Here, the first layer transfer may include a protector for preventing the shuttle from colliding or falling. Effect of the Invention

[0017] According to an embodiment of the present invention, a substrate transfer device capable of layer-by-layer movement of a substrate is provided, thereby increasing the throughput in a limited area. [Brief description of the drawings]

[0018] [Figure 1] 1 is a diagram illustrating a substrate transfer process using a substrate transfer apparatus according to an embodiment; [Diagram 2] 11 is a diagram illustrating a substrate transferring process using a substrate transferring apparatus according to another embodiment; [Diagram 3] 1 is a view illustrating a substrate transfer device capable of moving a layer according to an embodiment; [Figure 4] 1 illustrates a side view of a substrate transport apparatus capable of layer movement according to one embodiment. [Diagram 5] 13 is a view illustrating a substrate transfer device capable of moving a layer according to another embodiment; [Figure 6] 13 is a view illustrating a substrate transfer device capable of moving a layer according to another embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] The embodiments described in this specification are intended to clearly explain the concept of the present invention to those having ordinary skill in the art to which the present invention pertains, and therefore the present invention is not limited to the embodiments described in this specification, and the scope of the present invention should be construed as including modifications or variations that do not deviate from the concept of the present invention.

[0020] The terms used in this specification are currently widely used and general terms that are possible in consideration of the functions of the present invention, but these may change depending on the intentions of those skilled in the art to which the present invention belongs, precedents, the emergence of new technology, etc. However, when a specific term is defined and used with an arbitrary meaning, the meaning of the term is described separately. Therefore, the terms used in this specification should be defined based on the substantial meaning of the term and the overall content of this specification, rather than simply the name of the term.

[0021] The drawings attached to this specification are intended to easily explain the present invention, and the shapes illustrated in the drawings are exaggerated as necessary to facilitate understanding of the present invention, and therefore the present invention is not limited by the drawings.

[0022] In this specification, if it is determined that a detailed description of a known structure or function related to the present invention may make the gist of the present invention unclear, the detailed description will be omitted as necessary.

[0023] FIG. 1 is a view illustrating a substrate transfer process using a substrate transfer apparatus according to an embodiment.

[0024] Referring to FIG. 1, an embodiment of a substrate transfer apparatus may include at least one of a plurality of processing chambers 112 - 138 , a moving plate 140 , magnetic levitation rails 142 - 148 , a plurality of arms 152 , 154 , and a plurality of shuttles 162 , 164 .

[0025] The first shuttle 162 and / or the second shuttle 164 may each move along the magnetic levitation rails 142-148 to transfer a substrate (hereinafter, the first shuttle 162 will be mainly described). Specifically, the first shuttle 162 may obtain a substrate from any one of the plurality of processing chambers 112-138 and transfer the obtained substrate along the magnetic levitation rails 142-146. Thereafter, the substrate may be transferred to the load lock chamber 170 by at least one of the plurality of arms 152, 154.

[0026] The magnetic levitation rails 142 to 148 may include a plurality of regions. Specifically, the magnetic levitation rails 142 to 148 may include a first rail region 142 disposed along a vertical direction on one side edge of the moving plate 140 and / or a second rail region 146 disposed along a vertical direction on the other side edge of the moving plate 140.

[0027] The magnetic levitation rails 142-148 may include a third rail region 144 and / or a fourth rail region 148 configured to connect the first rail region 142 and the second rail region 146. In this case, the third rail region 144 and / or the fourth rail region 148 may be disposed along the lateral direction of the moving plate 140 as shown in FIG.

[0028] Meanwhile, the magnetic levitation rails 142 to 148 may include an area for stopping any one of the shuttles 162, 164 so that the shuttles do not collide with each other while the shuttles 162, 164 are moving. In this manner, the area for stopping may be included in a specific area of ​​the magnetic levitation rails 142 to 148. Alternatively, the area for stopping may be selected as a specific area of ​​the magnetic levitation rails 142 to 148 based on the moving direction and / or position of the shuttles 162, 164.

[0029] Additionally or alternatively, the magnetic levitation rails 142-148 may include a third rail region 144 and / or a fourth rail region 148 for moving any one of the multiple shuttles 162, 164 from one side edge of the moving plate 140 (i.e., the first rail region 142) to the other side edge of the moving plate 140 (i.e., the second rail region 146).

[0030] The plurality of shuttles 162, 164 may include a first shuttle 162 and / or a second shuttle 164. Although the plurality of shuttles 162, 164 is illustrated in Figure 1 as including two shuttles, this is not limiting. For example, the plurality of shuttles 162, 164 may include three or more shuttles.

[0031] Each of the multiple shuttles 162, 164 can accommodate one or more substrates. For example, any of the multiple shuttles 162, 164 can carry a substrate to be processed in any one of the multiple processing chambers 112-138 and transfer it to the any one of the processing chambers. For example, any of the shuttles can carry a substrate that has been processed in any one of the processing chambers and transfer it to the load lock chamber 170.

[0032] The second shuttle 164 can stop at another predetermined region among the magnetic levitation rails 142-148 such that a path that includes one region among the magnetic levitation rails 142-148 is provided for the first shuttle 162. In this case, a shuttle among the multiple shuttles 162, 164 that stops at another region can be determined as a shuttle located relatively close to the other region.

[0033] Specifically, the first shuttle 162 is moving upward along the first rail area 142, and the second shuttle 164 is moving downward along the first rail area 142. In this case, the second shuttle 164, which is located relatively close to the fourth rail area 148 set in another area, can move to the fourth rail area 148 and stop there.

[0034] Therefore, the first shuttle 162 can continue to move along the first rail region 142. However, the region where the second shuttle 164 stops is not limited to the fourth rail region 148. For example, if the first shuttle 162 must be provided with a route that includes another region, the second shuttle 166 may stop in another region.

[0035] 1 illustrates an example in which multiple shuttles 162, 164 move along the same rail region, but is not limited to this. For example, the first shuttle 162 may be moving from the first rail region 142 to the second rail region 146 via the third rail region 144, and the second shuttle 164 may be moving from the second rail region 146 to the first rail region 142 via the third rail region 144.

[0036] In this case, the first shuttle 162 located relatively close to the fourth rail area 148 can move to the second rail area 146 via the fourth rail area 148. Accordingly, the second shuttle 164 can move to the first rail area 142 via the third rail area 144. That is, the movement direction and / or stopping position of the multiple shuttles 162, 164 can be controlled so as not to collide with each other.

[0037] In this case, the movement direction and / or stopping position of each of the shuttles 162, 164 may be determined so as to minimize the total movement direction of the shuttles 162, 164. With this configuration, the substrate transfer apparatus can provide an efficient movement line for the shuttles 162, 164, thereby improving throughput and reducing energy consumption.

[0038] FIG. 2 is a view illustrating a substrate transfer process using a substrate transfer apparatus according to another embodiment.

[0039] 2, a substrate transfer apparatus according to another embodiment can include a first moving plate 100, another moving plate 102, and a link connecting the two 110. In addition, the substrate transfer apparatus can include multiple processing chambers, magnetic levitation rails, multiple arms, and multiple shuttles, like the substrate transfer apparatus of FIG.

[0040] The substrate throughput can be improved through the substrate transfer apparatus of Fig. 2. Specifically, one of the processing chambers connected to the moving plate 100 can fail. At this time, the shuttle can move onto another moving plate 102 connected to the moving plate 100 via a link 110. The shuttle transfers the substrate to a normal processing chamber connected to the other moving plate 102, so that the substrate can be processed in the failed processing chamber.

[0041] In this manner, the link 110 can act as a bridge connecting the moving plates. The shuttle can move between the moving plates via the link 110, so that the throughput can be increased through efficient substrate processing. Although Fig. 2 illustrates a rectangular link 110, the shape of the link 110 is not limited thereto and can be various shapes such as a circle, an ellipse, a wave shape, an arch shape, a step shape, a diagonal shape, a slide shape, etc.

[0042] According to an embodiment, the link 110 may be embodied to be adjustable in length, and since the distance between the moving plates may not be fixed at a specific value, the link 110 may be adjustable in length. For example, the link 110 may be embodied in a sliding type, a type including multiple ends, etc., but is not limited thereto.

[0043] To increase the substrate throughput, the moving plates may be connected adjacent to each other or vertically. Specifically, by using a second moving plate disposed below the first moving plate, it is possible to move to an alternative processing chamber in the event of a processing chamber failure or to a processing chamber for performing another process. In this case, a structure capable of moving a shuttle between the moving plates disposed above and below is required.

[0044] The present invention relates to a substrate transfer device capable of layer movement, which includes a layer transfer device that enables a shuttle to move layers. Hereinafter, the substrate transfer device capable of layer movement will be described in detail with reference to FIGS. 3 to 7.

[0045] FIG. 3 is a view illustrating a substrate transfer device capable of moving a layer according to an embodiment.

[0046] 3, a substrate transfer device capable of layer movement according to an embodiment may include a first moving plate 100, a second moving plate 101, a third moving plate 102, and a fourth moving plate 103. In addition, the substrate transfer device may include a plurality of processing chambers disposed adjacent to each moving plate, a plurality of arms disposed on each moving plate, a magnetic levitation rail, and a plurality of shuttles.

[0047] The second moving plate 101 may be located under the first moving plate 100. In this case, the second moving plate 101 may be disposed to correspond to the first moving plate 100. Specifically, when viewed from above, the central axes or central points of the first moving plate 100 and the second moving plate 101 may overlap. However, this is not limited thereto, and the position of the second moving plate 101 does not have to correspond to the first moving plate 100 and may be freely disposed.

[0048] The first moving plate 100 and the third moving plate 102 may be disposed in the same layer. The first moving plate 100 and the third moving plate 102 may be connected to a first link 196. Therefore, the shuttle located on the first moving plate 100 may move onto the third moving plate 102 through the first link 196.

[0049] The third moving plate 102 may be disposed in a straight line with the first moving plate 100. Specifically, when viewed from the front, the center points or one axis of the first moving plate 100 and the third moving plate 102 may overlap. However, this is not limited thereto, and the position of the third moving plate 102 may be freely disposed without being in a straight line with the first moving plate 100.

[0050] A fourth moving plate 103 may be located under the third moving plate 102. The fourth moving plate 103 may be disposed to correspond to the third moving plate 102. Specifically, when viewed from above, the central axes or central points of the third moving plate 102 and the fourth moving plate 103 may overlap. However, this is not limited thereto, and the position of the third moving plate 102 does not have to correspond to the fourth moving plate 103 and may be freely disposed.

[0051] The second moving plate 101 and the fourth moving plate 103 may be disposed in the same layer. The second moving plate 101 and the fourth moving plate 103 may be connected to a second link (not shown). Therefore, the shuttle located on the second moving plate 101 can move onto the fourth moving plate 103 through the second link.

[0052] The first moving plate 100 and the second moving plate 101 may be connected by a first layer transfer 191. The first layer transfer 191 may be connected to the first moving plate 100 and the second moving plate 101 and configured to move the shuttle from one of the first moving plate 100 and the second moving plate 101 to the other.

[0053] The first moving plate 100 may include a first side 181 and a second side 182. The first side 181 may be disposed adjacent to a first processing chamber group including a plurality of processing chambers. Also, the second side 182 may be disposed adjacent to a second processing chamber group including a plurality of processing chambers. In this case, the first processing chamber group and the second processing chamber group may be disposed facing each other.

[0054] The second moving plate 101 may include a third side 183 corresponding to the first side 181 and a fourth side 184 corresponding to the second side 182, similar to the first moving plate 100. The third side 183 may be disposed adjacent to a third processing chamber group including a plurality of processing chambers. Also, the fourth side 184 may be disposed adjacent to a fourth processing chamber group including a plurality of processing chambers. In this case, the third processing chamber group and the fourth processing chamber group may be disposed opposite to each other. Also, in this case, the third processing chamber group may be disposed below the first processing chamber group, and the fourth processing chamber group may be disposed below the second processing chamber group.

[0055] One end of the first layer transfer 191 may be connected to the first moving plate 100, and the other end may be connected to the second moving plate 101. The first layer transfer 191 may be configured in a spiral shape including a curved surface as shown in Fig. 3. However, the shape of the first layer transfer 191 is not limited thereto, and may be various shapes such as a step shape, a rectangular shape, etc. Also, although the spiral shape in Fig. 3 is illustrated as a half turn, the shape is not limited thereto, and the first layer transfer 191 may be a spiral shape twisted multiple times, such as one and a half turns.

[0056] The first layer transfer 191 may include a protector (not shown) for preventing collision or falling of the shuttles. Specifically, two or more shuttles may move on the first layer transfer 191. At this time, the movement direction on the first layer transfer 191 may be set to prevent the two or more shuttles from colliding with each other.

[0057] For example, like a highway, a shuttle moving from an upper layer to a lower layer along the left / right traffic can follow a certain path, and a shuttle moving from a lower layer to an upper layer can follow a certain path. At this time, a protector to prevent collision of the shuttle can be placed between the certain paths (e.g., the center of the first layer transfer 191) like a center line guardrail of a highway. At this time, the shape of the protector can be various, such as a guardrail shape, a rod shape, etc. Also, the material of the protector can be various, such as a sponge material or a cushion material that can absorb impact force.

[0058] In addition, the first layer transfer 191 may include a protector (not shown) arranged to prevent the shuttle from falling out while moving. For example, the protector may be arranged on the outer side of the first layer transfer 191, but is not limited thereto. The shape of the protector may be various, such as a guardrail or a bar shape. The material of the protector may be various, such as a sponge material or a cushion material that can absorb impact force.

[0059] One end of the first layer transfer 191 may be connected to the first moving plate 100 so as to be closer to the first side 181 than the second side 182 of the first moving plate 100. Also, the other end of the first layer transfer 191 may be connected to the second moving plate 101 so as to be closer to the fourth side 184 than the third side 183 of the second moving plate 101. Therefore, one end and the other end of the first layer transfer 191 may be located close to different sides of the first moving plate 100 or the second moving plate 101 when viewed from above.

[0060] A magnetic levitation rail may be disposed on one side of the first layer transfer 191. The shuttle may be magnetically levitated by the magnetic levitation rail of the first layer transfer 191 and move to the second moving plate 101 on the first moving plate 100, or vice versa. For example, a first processing chamber disposed adjacent to the first moving plate 100 may break down. At this time, the shuttle may use the first layer transfer 191 to move the substrate to a second processing chamber disposed adjacent to the second moving plate 101.

[0061] The shuttle can move from a layer (upper layer) of the first moving plate 100 to a layer (lower layer) of the second moving plate 101 through the first layer transfer 191. The shuttle can transfer the substrate to a second processing chamber performing the same process as the first processing chamber. Since layers can be switched through the first layer transfer 191 in this manner, the throughput of the substrate can be improved.

[0062] The third moving plate 102 and the fourth moving plate 103 may also be connected by a layer transfer 190. The layer transfer 190 may be connected to the third moving plate 102 and the fourth moving plate 103 and configured to move the shuttle from one of the third moving plate 102 and the fourth moving plate 103 to the other.

[0063] The third moving plate 102 may include a fifth side 185 and a sixth side 186, similar to the first moving plate 100. The fifth side 185 may be disposed adjacent to a fifth processing chamber group including a plurality of processing chambers. Also, the sixth side 186 may be disposed adjacent to a sixth processing chamber group including a plurality of processing chambers. In this case, the fifth processing chamber group and the sixth processing chamber group may be disposed facing each other.

[0064] The fourth moving plate 103 may include a seventh side 187 corresponding to the fifth side 185 and an eighth side 188 corresponding to the sixth side 186, similar to the third moving plate 102. The seventh side 187 may be disposed adjacent to a seventh processing chamber group including a plurality of processing chambers. Also, the eighth side 188 may be disposed adjacent to an eighth processing chamber group including a plurality of processing chambers. At this time, the seventh processing chamber group and the eighth processing chamber group may be disposed opposite each other. Also, at this time, the seventh processing chamber group may be disposed below the fifth processing chamber group, and the eighth processing chamber group may be disposed below the sixth processing chamber group.

[0065] One end of the layer transfer 190 connected to the third moving plate 102 and the fourth moving plate 103 may be connected to the third moving plate 102, and the other end may be connected to the fourth moving plate 103. The layer transfer 190 may be configured in a spiral shape including a curved surface as shown in Fig. 3. However, the shape of the layer transfer is not limited thereto, and may be various shapes such as a step shape, a rectangle shape, etc.

[0066] One end of the layer transfer 190 may be connected to the third moving plate 102 so as to be closer to the fifth side 185 than the sixth side 186 of the third moving plate 102. Also, the other end of the layer transfer 190 may be connected to the fourth moving plate 103 so as to be closer to the eighth side 188 than the seventh side 187 of the fourth moving plate 103. Therefore, when viewed from above, one end and the other end of the layer transfer 190 may be located close to different sides of the third moving plate 102 or the fourth moving plate 103.

[0067] Also, the layer transfer 190 may be disposed symmetrically to the first layer transfer 191. Specifically, although Fig. 3 illustrates one end of the layer transfer 190 being closely connected to the fifth side 185 corresponding to the first side 181, one end of the layer transfer 190 may be closely connected to the sixth side 186. In this case, the other end of the layer transfer 190 may be connected to the seventh side 187 rather than the eighth side 188. In this case, the layer transfer 190 and the first layer transfer 191 may be disposed symmetrically to each other.

[0068] A magnetic levitation rail may be disposed on one side of the layer transfer 190. The shuttle may be magnetically levitated by the magnetic levitation rail of the layer transfer 190 and move to the fourth moving plate 103 on the third moving plate 102, or vice versa. For example, the fifth processing chamber disposed adjacent to the third moving plate 102 may be broken. At this time, the shuttle may use the layer transfer 190 to move the substrate to the seventh processing chamber disposed adjacent to the fourth moving plate 103.

[0069] The shuttle can move from the layer (upper layer) of the third moving plate 102 to the layer (lower layer) of the fourth moving plate 103 through the layer transfer 190. The shuttle can transfer the substrate to the seventh processing chamber which performs the same process as the fifth processing chamber. Since layers can be switched through the layer transfer 190 in this manner, the throughput of the substrate can be improved.

[0070] Also, for example, the fifth processing chamber arranged adjacent to the third moving plate 102 and the first processing chamber arranged adjacent to the first moving plate 100 may fail. At this time, the shuttle may move onto the first moving plate 100 via the first link 196 on the third moving plate 102 to move the substrate to the seventh processing chamber arranged adjacent to the fourth moving plate 103. Also, the shuttle may move onto the second moving plate 101 on the first moving plate 100 using the first layer transfer 191.

[0071] In this manner, the shuttle can freely move horizontally between the moving plates using the first link 196 and the second link, and can freely move layers vertically between the moving plates using the layer transfer 190 and the first layer transfer 191.

[0072] Conventional substrate transfer devices utilize additional devices such as elevators for layer movement. However, the substrate transfer device capable of layer movement of the present invention has an advantage of having a simple structure using a magnetic levitation rail disposed on a moving plate and a layer transfer connected to the moving plate. Therefore, hardware design and installation are easy, and costs can be reduced.

[0073] FIG. 4 is a side view of a substrate transport apparatus capable of layer movement according to one embodiment.

[0074] 4, a substrate transfer device capable of layer movement according to an embodiment may include an upper moving plate 401, a lower moving plate 402, and a layer transfer 430. In addition, the substrate transfer device may include a first magnetic levitation rail 410 disposed on the upper moving plate 401, a second magnetic levitation rail 420 disposed on the lower moving plate 402, and a shuttle 300 configured to be movable on the magnetic levitation rails.

[0075] One side of the layer transfer 430 may be connected to the upper moving plate 401, and the other side may be connected to the lower moving plate 402. A magnetic levitation rail is disposed on one side of the layer transfer 430, so that the shuttle 300 can move between the upper moving plate 401 and the lower moving plate 402 by the magnetic levitation rail.

[0076] Although FIG. 4 illustrates the layer transfer 430 having a spiral shape including a curved surface, the shape of the layer transfer 430 is not limited to this, and may be various other shapes such as a slide shape, a step shape, and the like.

[0077] The shuttle 300 may be configured to accommodate a substrate therein. The shuttle 300 may include a permanent magnet 340 arranged to face the magnetic levitation rail. Although FIG. 4 illustrates two permanent magnets arranged on the bottom of the shuttle 300, the number of permanent magnets is not limited thereto and may be one, three, four, etc. The permanent magnet 340 may magnetically levitate the shuttle 300 by an attractive or repulsive force with the electromagnets of the magnetic levitation rails 410 and 420. The shuttle 300 may magnetically levitate on the first magnetic levitation rail 410 or the second magnetic levitation rail 420 using the permanent magnet 340 to deliver a substrate to a processing chamber or move a substrate processed in the processing chamber.

[0078] The shuttle 300 may include a first space 310 and a second space 320 configured to accommodate at least one substrate. In this case, the first space 310 and the second space 320 may be separated and partitioned from each other. The environments of the first space 310 and the second space 320 may be set to be different from each other. For example, the first space 310 may be set to a vacuum state, and the second space 320 may be set to a non-vacuum state. Also, for example, the environments of the first space 310 and the second space 320, such as temperature and / or humidity, may be set to be different from each other.

[0079] The first space 310 and the second space 320 may be arranged along one axis. For example, as shown in Fig. 4, the first space 310 and the second space 320 may be arranged along an axis perpendicular to the ground. In this case, the first space 310 may be arranged above the second space 320. In this case, the lateral area occupied by the shuttle 300 on the moving plate is small, so that the movement side may be efficient.

[0080] Alternatively, the first space 310 and the second space 320 may be arranged along an axis parallel to the ground. Specifically, unlike Fig. 4, the first space 310 and the second space 320 may be arranged side by side. In this case, the area occupied vertically by the moving plate may be reduced.

[0081] The first space 310 and the second space 320 may accommodate different types of substrates. Specifically, the first space 310 may accommodate substrates to be processed in the processing chamber, and the second space 320 may accommodate substrates that have been processed in the processing chamber. The shuttle 300 accommodates substrates before and after processing in the processing chamber separately, thereby preventing confusion regarding the substrates before and after processing.

[0082] In addition, since the first space 310 and the second space 320 of the shuttle 300 are separated from each other, it is possible to provide an optimized environment for each of the pre-processing and post-processing substrates. For example, the first space 310 accommodates the pre-processing substrate in a vacuum state, and the second space 320 accommodates the post-processing substrate in a non-vacuum state, so that the shuttle 300 can provide an optimized environment for each substrate.

[0083] The shuttle 300 may include a support 350 capable of supporting a substrate accommodated therein. Specifically, the first space 310 and / or the second space 320 of the shuttle 300 may include a support 350 configured to support a substrate. The substrate is disposed on the support 350 and may be moved through the shuttle 300. The support 350 may support an unprocessed substrate, a processed substrate, a dummy substrate, or a substrate-shaped sensor. In this case, the dummy substrate may refer to a test substrate for evaluating the stability, performance, etc. of the entire device.

[0084] According to an embodiment, a friction member may be disposed on one surface of the support 350. Specifically, the friction member may be disposed on one surface of the support 350 that contacts the rear surface of the substrate. In this case, the friction member may include a material with a high friction coefficient so that the substrate supported by the support 350 does not vibrate due to minute vibrations of the shuttle 300. For example, the friction member may be neoprene or rubber, but is not limited thereto.

[0085] The shuttle 300 may include at least one sensor (not shown) therein. Specifically, a sensor for sensing the internal environment may be disposed in the first space 310 and / or the second space 320 of the shuttle 300. The sensor may be, but is not limited to, a temperature sensor, a humidity sensor, a vibration sensor, a weight sensor, or a gradient sensor.

[0086] For example, the first space 310 or the second space 320 may include a sensor capable of measuring the weight of the substrate or the slope of the substrate. Also, for example, the first space 310 or the second space 320 may include a sensor capable of checking whether the temperature / humidity or vacuum state of each space is properly set. In this case, the sensor may have the same shape as the substrate, but is not limited thereto.

[0087] The sensor can sense the overall environmental information of the substrate transfer apparatus as well as the environment inside the shuttle 300. Specifically, when the shuttle 300 enters a processing chamber, the sensor can sense environmental information inside the processing chamber. Also, when the shuttle 300 enters a load lock chamber, the sensor can sense environmental information inside the load lock chamber. In this way, the substrate transfer apparatus can sense environmental information inside the apparatus using the sensor of the shuttle 300.

[0088] FIG. 5 is a view illustrating a substrate transfer device capable of moving a layer according to another embodiment.

[0089] 5, a substrate transfer apparatus capable of layer movement according to another embodiment may include a moving plate and a transfer having a different shape in addition to the substrate transfer apparatus of FIG.

[0090] The substrate transfer device may include a layer transfer that connects two diagonally positioned moving plates. Specifically, the substrate transfer device may include a second layer transfer 192 that is connected to the second moving plate 101 and the third moving plate 102 and configured to move the shuttle from one of the second moving plate 101 and the third moving plate 102 to the other one.

[0091] The second moving plate 101 may be connected to the first layer transfer 191 and the second layer transfer 192 adjacent to different sides of the second moving plate 101. Specifically, the first layer transfer 191 may be disposed adjacent to the fourth side 184 of the second moving plate 101, and the second layer transfer 192 may be disposed adjacent to the third side 183 of the second moving plate 101.

[0092] The third moving plate 102 may be closely connected to the layer transfer 190 and the second layer transfer 192 at different sides. Specifically, the layer transfer 190 may be disposed close to the fifth side 185 of the third moving plate 102, and the second layer transfer 192 may be closely connected to the sixth side 186.

[0093] The second layer transfer 192 may be disposed so as to cross the layer transfer 190 and the first layer transfer 191. When the substrate transfer device is viewed from the front, the second layer transfer 192 has a point where it crosses the layer transfer 190 and the first layer transfer 191.

[0094] By introducing the second layer transfer 192, the substrate transfer device of the present invention can provide movement not only between moving plates located above and below the shuttle, but also between moving plates located diagonally opposite to each other.

[0095] FIG. 6 is a view illustrating a substrate transfer device capable of moving a layer according to another embodiment.

[0096] 6, a substrate transfer apparatus capable of layer movement according to another embodiment may include a moving plate and a transfer having another shape in addition to the substrate transfer apparatus of FIG.

[0097] The substrate transfer device may include a layer transfer that connects two moving plates located diagonally. Specifically, the substrate transfer device may include a third layer transfer 193 that is connected to the first moving plate 100 and the fourth moving plate 103 and configured to move the shuttle from one of the first moving plate 100 and the fourth moving plate 103 to the other one.

[0098] The first moving plate 100 may be connected to the first layer transfer 191 and the third layer transfer 193 close to different sides of each other. Specifically, the first layer transfer 191 may be disposed close to the first side 181 of the first moving plate 100, and the third layer transfer 193 may be disposed close to the second side 182 of the first moving plate 100.

[0099] The fourth moving plate 103 may be closely connected to the layer transfer 190 and the third layer transfer 193 at different sides. Specifically, the layer transfer 190 may be disposed close to the eighth side 188 of the fourth moving plate 103, and the third layer transfer 193 may be closely connected to the seventh side 187.

[0100] The third layer transfer 193 may be disposed so as not to cross the layer transfer 190 and the first layer transfer 191. When the substrate transfer device is viewed from the front, the second layer transfer 192 may not have a point where it crosses the layer transfer 190 and the first layer transfer 191. However, if the layer transfer 190 is symmetrical to the first layer transfer 191, the location and connection form of the third layer transfer 193 may also vary depending on the case.

[0101] By introducing the third layer transfer 193, the substrate transfer device of the present invention can provide movement not only between moving plates located above and below the shuttle, but also between moving plates located diagonally opposite to each other.

[0102] The method according to the embodiment may be embodied in the form of program instructions that can be executed by various computer means and recorded on a computer readable medium. The computer readable recording medium may include program instructions, data files, data structures, and the like, alone or in combination. The program instructions recorded on the computer readable recording medium may be specially designed and configured for the embodiment, or may be known and available to those skilled in the art of computer software. Examples of computer readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specially configured to store and execute program instructions, such as ROMs, RAMs, flash memories, and the like. Examples of program instructions include not only machine language codes such as those produced by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, and the like. The hardware devices may be configured to operate as one or more software modules to perform the processes according to the present invention, and vice versa.

[0103] Although the embodiments have been described above with reference to limited embodiments and drawings, those skilled in the art may make various modifications and variations from the above description. For example, the described techniques may be performed in a different order than described, and / or the components of the described systems, structures, devices, circuits, etc. may be combined or combined in a different manner than described, or may be replaced or substituted by other components or equivalents, and still achieve suitable results.

[0104] Accordingly, other implementations, embodiments, and equivalents of the claims are intended to be within the scope of the following claims. [Explanation of symbols]

[0105] 100 First moving plate 101 Second moving plate 102 3rd moving plate 103 4th moving plate 191 1st Layer Transfer 192 2nd Layer Transfer

Claims

1. A first moving plate; a second moving plate located below the first moving plate; a shuttle configured to move on the first moving plate or the second moving plate and to receive a substrate; a first layer transfer coupled to the first moving plate and the second moving plate and configured to move the shuttle from one of the first moving plate to the other of the second moving plate.

2. 2. The substrate transfer apparatus of claim 1, wherein one end of the first layer transfer is connected to the first moving plate and the other end is connected to the second moving plate.

3. The substrate transfer apparatus of claim 1 , wherein the first layer transfer member is configured in a spiral shape including a curved surface.

4. the first moving plate includes a first side and a second side; the second moving plate includes a third side corresponding to the first side and a fourth side corresponding to the second side, one end of the first layer transfer is connected to the first moving plate so as to be closer to the first side than to the second side; 3. The substrate transfer apparatus of claim 2, wherein the other end of the first layer transfer is connected to the second moving plate so as to be closer to the fourth side surface than to the third side surface.

5. the first moving plate and the second moving plate include magnetic levitation rails; The substrate transfer apparatus of claim 1 , wherein the shuttle is magnetically levitated by the magnetic levitation rail and moves on the first moving plate or the second moving plate.

6. a third moving plate disposed adjacent to the first moving plate; 2. The substrate transfer apparatus of claim 1 , further comprising a first link connected to the first moving plate and the third moving plate to move the shuttle from one of the first moving plate to the other of the third moving plate.

7. 7. The substrate transfer apparatus of claim 6, further comprising a second layer transfer coupled to the second moving plate and the third moving plate and configured to move the shuttle from one of the second moving plate to the other of the third moving plate.

8. the second moving plate includes a third side and a fourth side; the first layer transfer is connected to the second moving plate so as to be closer to the fourth side than to the third side, 8. The substrate transfer apparatus of claim 7, wherein the second layer transfer is connected to the second moving plate so as to be closer to the third side than to the fourth side.

9. a fourth moving plate disposed adjacent to the second moving plate; 2. The substrate transfer apparatus of claim 1 , further comprising a second link connected to the second moving plate and the fourth moving plate and configured to move the shuttle from one of the second moving plate to the other of the fourth moving plate.

10. 10. The substrate transfer apparatus of claim 9, further comprising a third layer transfer coupled to the first moving plate and the fourth moving plate to move the shuttle from one of the first moving plate to the other of the fourth moving plate.

11. the first moving plate includes a first side and a second side; the first layer transfer is connected to the first moving plate so as to be closer to the first side than to the second side; 11. The substrate transfer apparatus of claim 10, wherein the third layer transfer is connected to the first moving plate so as to be closer to the second side than to the first side.

12. 2. The substrate transfer apparatus of claim 1, wherein the first layer transfer includes a protector for preventing the shuttle from colliding with or falling.

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