Method for expanding spaces of chips

Abstract

To provide a method for expanding spaces of a plurality of chips formed by dividing a wafer.SOLUTION: The present invention relates to a method for expanding spaces of chips to expand the spaces of a plurality of chips (14) held to a first chip (11) and divided along a division scheduled line (13) formed in an X-direction and in a Y-direction, and the method includes: a replacing step for arranging a second tape (16) so that the second tape faces the first chip (140) and relatively pressing the first chip toward the second tape to replace the first tape with the second tape; and a positioning chip of relatively moving the second chip (141) as a replacement target into one of the X-direction and the Y-direction for the second tape and locating the second tape in a position distant from the first chip by a desired distance. These steps are repeatedly performed so that the spaces of the chips are expanded.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to a method for expanding the chip spacing. [Background technology]

[0002] In the manufacture of electronic devices, a wafer on which a number of chips are formed is supported on a tape. The wafer is then divided into individual chips, and each chip is then picked up by a die bonder and stacked on a printed circuit board or a lead frame.

[0003] If the spacing between chips is insufficient when the chips are picked up by a die bonder, the chips will come into contact with each other, making picking up difficult. For this reason, a method of expanding the tape that supports the wafer, as disclosed in Patent Document 1, is known as a method for expanding the spacing between chips in the pre-die bonding process. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-206136 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, since the range over which the tape supporting the wafer can be expanded is limited, a method was sought that would enable greater spacing between chips.

[0006] SUMMARY OF THE PRESENT DISCLOSURE In order to solve the above problems, an object of the present invention is to provide a method for increasing the chip spacing without relying on the expandable amount of the tape. [Means for solving the problem]

[0007] One aspect of the present invention is a chip spacing expansion method for expanding the spacing between chips of a wafer that is held by a first tape and divided into multiple chips along planned division lines formed in an X direction and a Y direction perpendicular to the X direction, the method comprising: a repositioning step of placing a second tape opposite an arbitrary first chip among the multiple chips and pressing the first chip relatively to the second tape to re-attach the first chip from the first tape to the second tape; and a positioning step of moving the second chip to be next re-attached relative to the second tape in at least one of the X direction or the Y direction to position it at a position where the desired spacing is achieved with respect to the first chip, by repeatedly performing the following steps to expand the spacing between the chips.

[0008] The positioning step may further include a rotating step of rotating an angle of the second tip to an angle approaching parallel to the first tip.

[0009] The method may further include, before the re-attaching step, a step of reducing adhesive strength of the first tape by applying an external force to the first tape to reduce its adhesive strength.

[0010] The method further includes an expansion step before the replacement step of expanding the first tape to increase the spacing between the chips, and by repeating the replacement step and the positioning step, the spacing between the chips can be increased more than after the expansion step.

[0011] The method may further include an inspection step prior to the replacement step to determine whether the chip is good or bad, and the replacement step is performed only for chips determined to be good in the inspection step, while chips determined to be bad in the inspection step may be left on the first tape.

[0012] The inspection step determines the chip as good if it is divided into the chips, and determines the chip as bad if at least a portion of the chip is connected and undivided. Effect of the Invention

[0013] According to the chip spacing expansion method of the present invention, when transferring chips from a first tape to a second tape, the second chip is positioned at a position relative to the first chip that results in the desired chip spacing, thereby making it possible to expand the chip spacing without depending on the amount of expansion of the tape. [Brief description of the drawings]

[0014] [Figure 1] FIG. 2 is a perspective view of a wafer unit in which undivided wafers are supported on a frame via a tape. [Diagram 2] FIG. 2 illustrates the expansion steps. [Diagram 3] FIG. [Figure 4] FIG. 11 is a diagram showing an inspection result in an inspection step. [Diagram 5] FIG. 2 shows a step of reducing adhesion. [Figure 6] FIG. 13 is a diagram showing the state before the chip is replaced in the replacement step. [Figure 7] FIG. 13 is a diagram showing a state in which the first chip in the first row is being replaced in the replacement step. [Figure 8] FIG. 2 illustrates a positioning step. [Figure 9] FIG. 13 is a diagram showing the state in which the second chip in the first row is being replaced in the replacement step. [Figure 10] FIG. 13 is a diagram showing the state in which the last chip in the first row is being replaced in the replacement step. [Figure 11] FIG. 13 is a diagram showing the state in which the first chip in the second row is being replaced in the replacement step. [Figure 12] FIG. 2 is a diagram showing the first tape and the second tape before the replacement step is performed. [Figure 13] FIG. 13 shows the first tape and the second tape after the first chip in the first row has been replaced. [Figure 14] FIG. 13 is a diagram showing the first tape and the second tape after the second chip in the first row has been replaced. [Figure 15] FIG. 13 shows the first tape and the second tape after all the chips in the first row have been replaced. [Figure 16] FIG. 13 shows the first tape and the second tape after the first chip in the second row has been replaced. [Figure 17] FIG. 13 shows the first tape and the second tape after all the chips in the second row have been replaced. [Figure 18] FIG. 13 shows the first tape and the second tape after all the chips have been replaced. [Figure 19] FIG. 13 is a diagram showing a modified example in which a chip is attached to a second tape having a larger area than the first tape. [Figure 20] 13 is a flowchart showing the flow of a chip interval expanding method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The chip spacing expansion method according to this embodiment will be described below with reference to the accompanying drawings. The X, Y, and Z directions shown in each drawing are mutually perpendicular. The X and Y directions are horizontal directions, and the Z direction is a vertical direction. The +Z direction is upward, and the -Z direction is downward.

[0016] The wafer unit 1 shown in FIG. 1 has a wafer 10 supported on a flexible first tape 11, and an annular frame 12 attached to the peripheral area of ​​the first tape 11 outside the support area for the wafer 10.

[0017] The wafer 10 is a disk-shaped semiconductor wafer made of, for example, silicon, and has a plurality of regions partitioned in a lattice pattern by a plurality of planned division lines 13 extending in the X direction and the Y direction, and chips 14, which are electronic devices, are formed in each of the regions partitioned by the planned division lines 13. In other words, the wafer 10 has a plurality of chips 14 arranged in a predetermined positional relationship in the X direction and the Y direction. The material of the wafer 10 and the type of the chips 14 are not limited.

[0018] The first tape 11 is an adhesive tape having a flexible and non-adhesive base layer and a flexible and adhesive adhesive layer laminated on the base layer. The wafer 10 and the frame 12 are attached to the adhesive layer of the first tape 11.

[0019] The first tape 11 may be a sheet made of a thermoplastic resin without an adhesive layer. The first tape 11 made of such a non-adhesive sheet is attached to the wafer 10 or the frame 12 by thermocompression bonding. As the non-adhesive sheet, a polyolefin sheet, a polyethylene sheet, a polypropylene sheet, or a polystyrene sheet is preferable.

[0020] Frame 12 is an annular member made of metal, resin, or the like, and has a substantially circular opening 121 on the inside. The inner diameter of opening 121 is larger than the diameter of wafer 10, and first tape 11 is attached to wafer 10 and frame 12 so as to cover the inside of opening 121. First tape 11 is exposed between the outer edge of wafer 10 and the inner edge of opening 121, and this exposed area of ​​first tape 11 is used as an area where first tape 11 is pressed by expansion roller 23 in an expansion step described below.

[0021] In the chip spacing expanding method of this embodiment, after the wafer 10 is divided along the intended division lines 13, the chips 14 are reattached between a plurality of tapes before the individual chips 14 are picked up by a die bonder, thereby expanding the spacing between the chips 14. The chip spacing expanding method of this embodiment will be described below with reference to the flowchart of Fig. 20 and the figures corresponding to the steps of the flowchart.

[0022] The dividing step, the expanding step, and the adhesive strength reducing step are performed as steps prior to the chip replacement step in which the chip 14 is replaced between multiple tapes. It is also possible to omit any or all of the expanding step, the inspection step, and the adhesive strength reducing step.

[0023] [Split Step] In the dividing step, a plurality of dividing grooves 15 are formed in the wafer 10 along the dividing lines 13, and the wafer 10 is divided into a plurality of chips 14 separated by the dividing grooves 15. Any method can be used for forming the dividing grooves 15 in the wafer 10 and dividing the wafer 10 into a plurality of chips 14. For example, a method of performing cutting processing with a cutting blade along the dividing lines 13, a method of forming a modified layer along the dividing lines 13 by laser processing or the like, and then expanding the first tape 11 to split the wafer 10, and the like can be applied.

[0024] [Extended Step] After the dividing step, an expanding step is performed to increase the width of the dividing groove 15. The expanding step is performed using an expanding device 20 shown in FIG.

[0025] The expanding device 20 includes a frame support table 21. The frame support table 21 is a pedestal structured to surround a virtual central axis extending in the Z direction, and a circular opening penetrating in the Z direction is formed in the center of the frame support table 21. The frame support table 21 is provided with a frame pressing unit 22 that can be opened and closed.

[0026] The wafer unit 1 is transported to the expanding device 20, the frame 12 is placed on the upper surface of the frame support table 21, and the frame pressing portion 22 is closed to press the frame 12 from above, thereby clamping and fixing the frame 12 between the frame support table 21 and the frame pressing portion 22. In addition to the frame 12, the vicinity of the outer edge of the first tape 11 is also clamped between the frame support table 21 and the frame pressing portion 22. When the frame 12 is fixed in this manner, the wafer 10 and the first tape 11 are positioned directly above the opening of the frame support table 21.

[0027] A plurality of expansion rollers 23 are arranged inside the opening of the frame support table 21. The plurality of expansion rollers 23 are located in the -Z direction with respect to the first tape 11. More specifically, the plurality of expansion rollers 23 are arranged in an annular shape corresponding to an annular region in which the first tape 11 is exposed between the outer edge of the wafer 10 and the inner edge of the opening 121 of the frame 12. Each of the expansion rollers 23 is supported at the upper end of the lifting / lowering unit 24 so as to be rotatable about an axis extending in the horizontal direction. The lifting / lowering unit 24 is moved in the Z direction by the lifting / lowering drive unit 25.

[0028] In the expansion step, the wafer unit 1 is set as shown in Fig. 2(A), and then the lifting / lowering drive unit 25 is driven to move the lifting / lowering unit 24 in the +Z direction as shown in Fig. 2(B), and the multiple expansion rollers 23 come into contact with the first tape 11 from below and push it up. Since the outer edge portion of the first tape 11 is held together with the frame 12 by the frame support table 21 and the frame pressing unit 22, the first tape 11 is expanded in the radial direction as it is pushed up by the expansion rollers 23. As the first tape 11 expands, a radially expanding force also acts on the wafer 10 to which the first tape 11 is attached, and the width of the division groove 15 increases, expanding the intervals between the multiple chips 14.

[0029] However, there is a limit to the amount that the first tape 11 can be expanded, and the expansion step alone may not be enough to sufficiently expand the spacing between the multiple chips 14, so the replacement step and positioning step described below are repeated to further increase the spacing between the multiple chips 14.

[0030] After the expansion step, the area of ​​the first tape 11 pushed up by the expansion roller 23 may become loose. In this case, a contraction step may be performed to shrink that area of ​​the first tape 11. For example, if the first tape 11 is a thermally shrinkable tape, a plurality of chips 14 are held by a holding table (not shown) via the first tape 11 inside the expansion roller 23 to maintain the chip spacing, and the pushing up by the expansion roller 23 is released, and the loosened area of ​​the first tape 11 between the holding table and the frame 12 is heated to shrink it.

[0031] [Inspection Steps] After the expansion step, an inspection step is performed to determine whether the chip 14 is good or not, in particular, whether the divided state of the chip 14 is good or not. The inspection step is performed using an inspection device 30 shown in Fig. 3. The inspection device 30 has a support table 31 made of a light-transmitting material such as glass, a light source 32 is arranged in the -Z direction of the support table 31, and an imaging unit 33 is arranged in the +Z direction of the support table 31.

[0032] The light source 32 is a line-type light source capable of irradiating light to a length equal to or greater than the diameter of the wafer 10. The imaging unit 33 is a line-type imaging unit capable of imaging a range equal to or greater than the diameter of the wafer 10. That is, the light source 32 and the imaging unit 33 are each formed to extend in the diameter direction of the wafer 10 to a length equal to or greater than the diameter, and the light emitted from the light source 32 is received by the imaging unit 33, thereby imaging a linear imaging area having a length equal to or greater than the diameter of the wafer 10. Then, the light from the light source 32 and the imaging unit 33 are irradiated and the imaging unit 33 is imaged while the wafer unit 1, the light source 32, and the imaging unit 33 are moved relatively in a direction (X direction in this embodiment) perpendicular to the longitudinal direction (Y direction in this embodiment) of the light source 32 and the imaging unit 33, thereby obtaining image data of the chips 14 and the division grooves 15 of the entire wafer 10.

[0033] In this embodiment, when imaging the chips 14 and division grooves 15 of the entire wafer 10, the support table 31 supporting the wafer unit 1 is fixed, and the line-shaped light source 32 extending in the Y direction and the imaging unit 33 are moved in the X direction, but it is also possible to move the support table 31 in the X direction.

[0034] Furthermore, instead of the line-shaped light source 32 and imaging unit 33 extending over a length equal to or greater than the diameter of the wafer 10, a light source and imaging unit that project light and capture images over a narrower range may be provided, and the light source and imaging unit may be moved arbitrarily in the X and Y directions to capture images of the chips 14 and division grooves 15 over the entire wafer 10.

[0035] Alternatively, instead of the line-shaped light source 32 and imaging unit 33 extending over a length equal to or greater than the diameter of the wafer 10, a surface light source and a wide-angle imaging unit capable of projecting light and imaging a wide area including the entire wafer 10 at once may be provided.

[0036] In the inspection step, the wafer unit 1 is transported to the inspection device 30, and the first tape 11 is placed on the upper surface of the support table 31. When light is irradiated from the light source 32 onto the support table 31, the light that passes through the support table 31 reaches the first tape 11. The first tape 11 is in the form of a thin sheet, and allows a predetermined proportion of the light incident from the support table 31 to pass through. The chips 14 supported on the first tape 11 have a light-shielding property, and block the light incident from the support table 31. In the region where the division grooves 15 are formed, the light that enters from the support table 31 and passes through the first tape 11 can proceed unblocked.

[0037] Therefore, when the entire wafer 10 is imaged from above using the imaging unit 33, an image including areas where light is blocked by the individual chips 14 (black areas) and areas where light has passed through the division grooves 15 (white areas) is obtained, as in the example of the image shown in Fig. 4, and it is possible to determine whether the division of the multiple chips 14 is good or bad based on the image. Note that in the example of the image shown in Fig. 4, the end material areas of the wafer 10 that are outside the multiple chips 14 also block the light from the light source 32.

[0038] 4A is an image in which all chips 14 are appropriately divided. There are no locations where adjacent chips 14 are connected to each other, and all chips 14 are divided by dividing grooves 15. In this case, the inspection device 30 judges all chips 14 to be good.

[0039] 4B is an image of a case where there is an undivided region Er where adjacent chips 14 are connected and left undivided in a part of an area that should have been divided by the dividing groove 15. A place where at least a part of adjacent chips 14 are connected and left undivided, like the undivided region Er, is called a double die, etc., and is determined to be a defective chip by the inspection device 30 because it does not meet the product quality standards.

[0040] In addition to double dies, chips 14 that have chips or cracks are also determined to be defective. By analyzing the images of chips 14 captured by the inspection device 30, it is possible to detect the presence of chips or cracks in the chips 14.

[0041] Methods other than imaging may be used to detect the presence of undivided regions, chips, cracks, etc. in the chip 14. For example, as an inspection method in the inspection step, an ultrasonic inspection device that applies ultrasonic waves to an object and visualizes the echoes may be used.

[0042] The chips 14 that are determined to be defective in the inspection step are excluded from being replaced in the replacement step described later. Information on the defective chips is transmitted from the inspection device 30 to a replacement device 50 described later, and the replacement device 50 performs a process of excluding the defective chips from being replaced.

[0043] [Adhesive strength reduction step] Before the reattaching step, an adhesive strength reducing step is performed in which an external force is applied to first tape 11 to reduce its adhesiveness. In this embodiment, the adhesive (glue) contained in the adhesive layer of first tape 11 is an ultraviolet-curing adhesive whose adhesive strength is reduced by irradiation with ultraviolet rays, and ultraviolet rays are irradiated to apply an external force to first tape 11.

[0044] The adhesive strength reducing step is performed using an adhesive strength reducing device 40 shown in Fig. 5. The adhesive strength reducing device 40 includes a support table 41 made of a light-transmitting material such as glass, and an ultraviolet ray irradiation unit 42 is provided in the -Z direction of the support table 41. The ultraviolet ray irradiation unit 42 includes a plurality of ultraviolet ray light sources 43 that emit ultraviolet ray UV, and irradiates the ultraviolet ray UV toward the support table 41. The ultraviolet ray UV irradiated from the ultraviolet ray light sources 43 of the ultraviolet ray irradiation unit 42 passes through the support table 41 and reaches the first tape 11, and acts on the adhesive layer to reduce the adhesiveness of the first tape 11.

[0045] If the adhesive layer of first tape 11 is of a type whose adhesiveness is reduced by an external force other than irradiation with ultraviolet rays, an external force may be applied by a method other than irradiation with ultraviolet rays to reduce the adhesiveness of first tape 11. For example, if the adhesive layer of first tape 11 is of a type whose adhesiveness is reduced by a temperature change such as heating or cooling, first tape 11 may be heated or cooled to carry out the adhesive force reducing step.

[0046] Thus, in the adhesive strength reducing step, a predetermined external force is applied according to the type of adhesive layer of first tape 11 to reduce the adhesiveness of first tape 11. This makes it easier to replace chip 14 from first tape 11 to second tape 16 in the subsequent replacement step.

[0047] It should be noted that if first tape 11 is made of a thermoplastic resin that does not have an adhesive layer, the adhesive strength reducing step is not carried out.

[0048] [Chip replacement process] Next, the process proceeds to a chip replacement process in which the chip 14 is replaced from the first tape 11 to the second tape 16. As shown in the flowchart in Fig. 20, the chip replacement process includes a replacement step and a positioning step as main steps, and includes a chip quality determination step, an alignment step, a final chip determination step, and the like as auxiliary steps.

[0049] The second tape 16 is an adhesive tape having a flexible and non-adhesive base layer and a flexible and adhesive adhesive layer laminated on the base layer. An annular frame 17 is attached to the outer circumferential region of the second tape 16. The frame 17 is an annular member made of metal, resin, or the like, and has a substantially circular opening 171 on the inside. The second tape 16 is attached to the frame 17 so as to cover the inside of the opening 171.

[0050] 12 to 18 show the surface of the first tape 11 to which the wafer 10 is attached (the side facing the +Z direction when placed in the re-attaching device 50) and the surface of the second tape 16 to which the chips 14 transferred from the first tape 11 are attached (the side facing the -Z direction when placed in the re-attaching device 50). FIG. 12 shows a state before the chips 14 are transferred from the first tape 11 to the second tape 16. FIGS. 13 to 17 show a step-by-step process of transferring a plurality of chips 14 from the first tape 11 to the second tape 16. FIG. 18 shows a state after all the chips 14 have been transferred from the first tape 11 to the second tape 16. In FIGS. 13 to 18, the portion shown by the dashed line on the first tape 11 side shows a portion where the chips 14 are no longer present due to the transfer to the second tape 16.

[0051] 12 to 18, the shape and dimensions of frame 17 are approximately the same as the shape and dimensions of frame 12 in wafer unit 1. Furthermore, the area of ​​second tape 16 disposed inside opening 171 of frame 17 is approximately the same as the area of ​​first tape 11 disposed inside opening 121 of frame 12. That is, in the chip replacement step of this embodiment, chip 14 is replaced from first tape 11 to second tape 16, the areas of which are approximately the same.

[0052] The chip replacement process is performed using a replacement device 50 shown in Figures 6 to 11. The operation of each part of the replacement device 50 described below is controlled by a control unit provided in the replacement device 50. The control unit of the replacement device 50 includes a processor that performs various types of arithmetic processing, and a storage unit that stores control programs and the like, and the processor performs arithmetic processing according to the programs read from the storage unit to control the operation of each part.

[0053] The re-attaching device 50 supports the frame 12 with the frame support part 51, supports the frame 17 with the frame support part 52, and arranges the first tape 11 and the second tape 16 so that their adhesive layers face each other in the Z direction. In other words, the wafer 10 (chip 14) supported by the first tape 11 is arranged to face the adhesive layer of the second tape 16 in the Z direction.

[0054] A first moving mechanism 53 is connected to the frame support part 51. The first moving mechanism 53 can perform an operation of arbitrarily moving the frame 12 in the X direction and the Y direction, and an operation of rotating the frame 12 around an axis in the Z direction. The first tape 111 also performs a similar operation along with the frame 12.

[0055] A second moving mechanism 54 is connected to the frame support part 52. The second moving mechanism 54 can move the frame 17 arbitrarily in the X direction and Y direction, and rotate the frame 17 around an axis in the Z direction. The second tape 16 also performs the same operation along with the frame 17.

[0056] The re-sticking device 50 includes a plurality of expansion rollers 55 positioned in the -Z direction with respect to the first tape 11. The plurality of expansion rollers 55 are arranged in an annular shape corresponding to the annular region in which the first tape 11 is exposed between the outer edge of the wafer 10 and the inner edge of the opening 121 of the frame 12. Each expansion roller 55 is supported at the upper end of a lifting / lowering unit 56 so as to be rotatable about an axis extending in the horizontal direction. The lifting / lowering unit 56 is moved in the Z direction by a lifting / lowering drive unit 57.

[0057] The re-sticking device 50 also includes a first pressing unit 58 located in the -Z direction with respect to the first tape 11, and a second pressing unit 59 located in the +Z direction with respect to the second tape 16. The first pressing unit 58 is moved in the X, Y, and Z directions by a first pressing unit drive unit 60. The second pressing unit 59 is moved in the X, Y, and Z directions by a second pressing unit drive unit 61.

[0058] The area of ​​each of first pressing portion 58 and second pressing portion 59 can be set arbitrarily according to the area to be replaced in one replacement step (the number of chips 14). In this embodiment, in the replacement step, chips 14 are replaced one by one from first tape 11 to second tape 16, so that first pressing portion 58 and second pressing portion 59 have an area corresponding to at least one chip 14.

[0059] As another configuration, the first pressing portion 58 and the second pressing portion 59 may extend long in the Y direction or the X direction and have a length equal to or greater than the diameter of the wafer 10. Alternatively, the first pressing portion 58 and the second pressing portion 59 may have lengths equal to or greater than the area to be replaced in the X direction and the Y direction, respectively.

[0060] Although detailed structures of the first moving mechanism 53, the second moving mechanism 54, the first pressing unit driving unit 60, and the second pressing unit driving unit 61 will not be described, linear movements in the X, Y, and Z directions can be performed using a well-known ball screw mechanism in which an object moves linearly when a ball screw is rotated by a motor drive, or a well-known air cylinder mechanism in which an object moves linearly by reciprocating an air cylinder. In addition, in the first moving mechanism 53 and the second moving mechanism 54, rotational movements about the axis in the Z direction can be performed using a well-known rotating mechanism that transmits a force in the rotational direction by a motor drive.

[0061] The imaging unit 62 included in the replacement device 50 images each of the tapes 11, 16 from the -Z direction, and can particularly image the arrangement and orientation of the chip 14 on the first tape 11 before replacement. The imaging unit 63 images each of the tapes 11, 16 from the +Z direction, and can particularly image the arrangement and orientation of the chip 14 on the second tape 16 after replacement. Furthermore, by referring to the image data captured by the imaging unit 62 and the image data captured by the imaging unit 63 together, the relative positional relationships in the X and Y directions among the first tape 11, the second tape 16, the first pressing unit 58, and the second pressing unit 59 can be controlled.

[0062] In this embodiment, in the chip replacement process, the chips 14 are replaced one by one from the first tape 11 to the second tape 16, so that the replacement step is performed multiple times according to the number of chips 14. Among the multiple replacement steps, in any two consecutive replacement steps, the chip 14 to be replaced in the previous replacement step (n-th replacement step) is designated as the first chip 140, and the chip 14 to be replaced in the next replacement step (n+1-th replacement step) is designated as the second chip 141. Then, in each chip replacement process, a replacement step and a positioning step that satisfy the conditions described below are performed on the first chip 140 and the second chip 141, and this is repeated to increase the distance between the chips 14.

[0063] Fig. 6 shows a state in which in re-attaching device 50, frame 12 is supported by frame support part 51, and frame 17 is supported by frame support part 52, so that the adhesive layer of first tape 11 and the adhesive layer of second tape 16 face each other. As shown in Fig. 12, which corresponds to the state in Fig. 6, at this stage, all chips 14 are supported by first tape 11, and no chips 14 are supported by second tape 16. In other words, chips 14 have not yet been transferred from first tape 11 to second tape 16.

[0064] From this state, the expansion rollers 55 are moved in the +Z direction by driving the lift drive unit 57, and the multiple expansion rollers 55 come into contact with and push up the first tape 11 from below. The upward push from the expansion rollers 55 increases the tension of the first tape 11.

[0065] [Alignment Step] Next, an alignment step is performed in which the first tape 11, the second tape 16, the first pressing portion 58, and the second pressing portion 59 are each set to a predetermined positional relationship in the X direction and the Y direction while referring to the image data captured by the imaging portion 62 and the imaging portion 63.

[0066] In the alignment step, the first moving mechanism 53 and the second moving mechanism 54 are driven to adjust the relative positions of the frame support 51 and the frame support 52 in the horizontal direction (X direction, Y direction), and the first pressing section driving section 60 and the second pressing section driving section 61 are driven to adjust the positions of the first pressing section 58 and the second pressing section 59 in the horizontal direction (X direction, Y direction). In detail, among the multiple chips 14, the chip 14 (first chip 140) to be replaced in the first replacement step and the replacement target area 160 on the second tape 16 side to which the chip 14 is to be replaced are positioned between the first pressing section 58 and the second pressing section 59 in the Z direction. Here, the first chip 14 located at the corners in the +X direction and +Y direction is selected as the first chip 140 (see FIG. 12). Also, the second chip 14 adjacent to the first chip 140 in the -X direction becomes the second chip 141.

[0067] [First replacement step] 7, the first pressing unit drive unit 60 is driven to move the first pressing unit 58 in the +Z direction, and the second pressing unit drive unit 61 is driven to move the second pressing unit 59 in the -Z direction. Through these operations, the first pressing unit 58 pushes up the first tape 11, and the first chip 140 located directly above the location pushed up by the first pressing unit 58 approaches the second tape 16. Furthermore, the second pressing unit 59 pushes down the second tape 16, and the replacement target area 160 of the second tape 16 approaches the first tape 11. Then, due to the pushing up by the first pressing unit 58 and the pushing down by the second pressing unit 59, the first chip 140 is pressed against the replacement target area 160 of the second tape 16. After first chip 140 is pressed against second tape 16 with a predetermined pressure, first pressing portion 58 is moved in the -Z direction, and second pressing portion 59 is moved in the +Z direction to release the pressing. Then, first chip 140 that was attached to first tape 11 is now attached to second tape 16.

[0068] The first pressing portion 58 has a small area at the tip side that contacts the first tape 11. The second pressing portion 59 has a large area at the tip side that contacts the second tape 16. The first pressing portion 58, which presses the first tape 11 with a small area, greatly curves the support region of the first tape 11 for the first chip 140 along the outer surface of the first pressing portion 58 when pressed, and therefore has the effect of making it easier to separate the first chip 140 from the first tape 11. The second pressing portion 59, which supports the replacement target region 160 of the second tape 16 with a large area, receives a pressing force from the first chip 140 side while maintaining the flatness of the replacement target region 160, and therefore has the effect of making it easier to attach the first chip 140 to the second tape 16. In this manner, first pressing portion 58 and second pressing portion 59 each have a shape characteristic that makes it easy to reattach first chip 140 from first tape 11 to second tape 16 when pressed.

[0069] Moreover, by pushing up first chip 140 with first pressing unit 58 while first tape 11 is stretched by extension roller 55, first chip 140 can be efficiently moved toward second tape 16. Furthermore, since the adhesive strength on the first tape 11 side is reduced by the adhesive strength reducing step performed earlier, first chip 140 can be easily separated from first tape 11. With these measures, first chip 140 can be smoothly transferred from first tape 11 to second tape 16.

[0070] As shown in FIG. 13, which shows the state after the re-attaching step in FIG. 7, in the first re-attaching step, one chip 14 located at the corner in the +X direction and the +Y direction is selected as the first chip 140 and re-attached to the second tape 16. The first tape 11 has an area on the outer periphery side of the wafer 10 for pushing up and expanding the first tape 11 by the expansion roller 23 in the previous expansion step, but the second tape 16 does not have such an area for pushing up. Therefore, in the second tape 16, the entire area inside the opening 171 can be used as an area for supporting the chip (for chip replacement). The position of the first chip 140 after being re-attached to the second tape 16 is changed to the outer edge side (a position closer to the frame 17) than the position of the first chip 140 on the first tape 11 before the re-attaching.

[0071] [First positioning step] After the replacement of first chip 140 in the first replacement step is completed, a positioning step is performed. In the positioning step, as shown in Fig. 8, first moving mechanism 53 and second moving mechanism 54 are driven to adjust the horizontal positions of frame support portion 51 and frame support portion 52, and second chip 141 on the side of first tape 11, which is the target of replacement in the second replacement step, is moved in the X direction relative to second tape 16, and second chip 141 is positioned at a desired distance from first chip 140 in the X direction.

[0072] More specifically, in the first positioning step, the relative positional relationship between first tape 11 and second tape 16 is adjusted while referring to image data captured by imaging units 62 and 63 so that the X-direction distance Xb (FIG. 14) between first chip 140 and second chip 141 after being transferred to second tape 16 is larger than the X-direction distance Xa (FIG. 12) between first chip 140 and second chip 141 supported on first tape 11 before being transferred.

[0073] In the positioning step, both first tape 11 and second tape 16 may be moved, or only one of first tape 11 and second tape 16 may be moved.

[0074] In addition, the two chips 14 whose interval is increased in the positioning step may be at the same position or at different positions in a direction (Y direction in this case) perpendicular to the direction in which the interval is increased (X direction in this case). As shown in Fig. 12, the first chip 140 and the second chip 141 whose interval in the X direction is increased in this positioning step are at the same position in the Y direction.

[0075] [Rotation Step] The positioning step may further include a rotation step of rotating the angle of the second chip 141 about the axis in the Z direction to an angle approaching parallel to the first chip 140. In detail, while referring to image data captured by the imaging units 62 and 63, at least one of rotation of the frame 12 by the first moving mechanism 53 (rotation about the axis in the Z direction) and rotation of the frame 17 by the second moving mechanism 54 (rotation about the axis in the Z direction) can be performed to set the angle of the second chip 141 to an angle approaching parallel to the first chip 140.

[0076] If there is variation in the angles between the chips 14 after they have been replaced with the second tape 16, it will be difficult to pick up the chips 14 later using a die bonder, so it is preferable to perform an additional rotation step in the positioning step to align the angles between all of the chips 14 after they have been replaced.

[0077] As one form of the rotation step, while the first chip 140 and the second chip 141 are imaged by the imaging unit 62 and the imaging unit 63, the angle of the second chip 141 is adjusted to match the angle of the first chip 140, based on the first chip 140 that was previously replaced.

[0078] As another form of the rotation step, a reference index indicating the orientations of the X and Y directions is provided at a position where it can be imaged by the imaging unit 62 or the imaging unit 63, and the angle of the second chip 141 is adjusted so that the orientation of each side of the second chip 141 matches the orientation of this reference index. In an alignment step performed before the first replacement step, the angle of the first chip 140 is adjusted in advance so that the orientation of each side of the first chip 140 matches the orientation of the reference index, thereby making it possible to align the angles of the first chip 140 and the second chip 141.

[0079] When the above alignment step, replacement step, and positioning step are performed, one cycle of the chip replacement process is completed. Then, the next cycle of the chip replacement process is performed, and the chip replacement process is repeated a number of times corresponding to the number of chips 14 to be replaced. The chip replacement process further includes a chip quality determination step and a final chip determination step, which will be described later.

[0080] [Second alignment step] In the above-mentioned first positioning step, the relative positional relationship between the first tape 11 and the second tape 16 has been adjusted to expand the distance between the first chip 140 and the second chip 141. While maintaining this adjusted positional relationship between the first tape 11 and the second tape 16, the alignment step in the chip replacement process of the second cycle is performed. In detail, the first pressing section driving section 60 and the second pressing section driving section 61 are driven with reference to image data captured by the imaging section 62 and the imaging section 63 to adjust the horizontal positions (X direction, Y direction) of the first pressing section 58 and the second pressing section 59, and the second chip 141 to be replaced in the second replacement step and the replacement target area 161 on the second tape 16 side are positioned between the first pressing section 58 and the second pressing section 59 in the Z direction.

[0081] [Second replacement step] 9, the first pressing unit driver 60 is driven to move the first pressing unit 58 in the +Z direction, and the second pressing unit driver 61 is driven to move the second pressing unit 59 in the -Z direction. Through these operations, the first pressing unit 58 pushes up the first tape 11, and the second chip 141 located directly above the location pushed up by the first pressing unit 58 approaches the second tape 16. In addition, the second pressing unit 59 pushes down the second tape 16, and the replacement target area 161 of the second tape 16 approaches the first tape 11. Then, the second chip 141 is pressed against the replacement target area 161, and the second chip 141 is replaced from the first tape 11 to the second tape 16.

[0082] As in the first replacement step described above, first pressing portion 58 with a small tip area presses and curves first tape 11, and second pressing portion 59 with a large tip area receives the pressing force from second chip 141 onto second tape 16, making it easier to detach second chip 141 from first tape 11 and replace it with second tape 16.

[0083] With first tape 11 stretched by extension roller 55, second chip 141 can be pushed up by first pressing portion 58, thereby efficiently moving second chip 141 toward second tape 16. Furthermore, since the adhesive strength on the first tape 11 side has been reduced by the adhesive strength reducing step carried out earlier, second chip 141 can be easily separated from first tape 11. With these measures, second chip 141 can be smoothly replaced from first tape 11 to second tape 16.

[0084] 14, which shows the state after the re-attaching step in FIG. 9, in the second re-attaching step, second chip 141 adjacent to the already-reattached first chip 140 in the -X direction is re-attached from first tape 11 to second tape 16. As a result of performing the above-mentioned first positioning step, the distance Xb in the X direction between first chip 140 and second chip 141 after the re-attaching is larger than the distance Xa in the X direction before the re-attaching.

[0085] [Second positioning step] When the second replacement step is completed, the first moving mechanism 53 and the second moving mechanism 54 are driven to adjust the horizontal positions (X direction, Y direction) of the frame support parts 51 and 52, and the chip 14 to be replaced in the third replacement step (the chip 14 adjacent to the second chip 141 in the -X direction) is moved relatively in the X direction with respect to the second tape 16, thereby performing a second positioning step in which the chip 14 to be replaced the third time is positioned at a desired distance in the X direction from the chip 14 replaced the second time (second chip 141) (a position where the distance in the X direction between the two chips 14 is larger than when they were supported by the first tape 11).

[0086] As in the first positioning step described above, the second positioning step may further include a rotation step in which the angle of the chip 14 to be replaced in the third replacement step is rotated to an angle approaching parallel to the chip 14 (second chip 141) replaced in the second replacement step.

[0087] [Chip replacement process from the third time onwards] In this manner, by performing two successive chip replacement processes (each including a replacement step and a positioning step), first chip 140 and second chip 141 are supported by second tape 16 in a positional relationship in which the distance Xb after replacement is larger than the distance Xa before replacement.

[0088] Then, by repeating the chip replacement process similar to that described above any number of times, the multiple chips 14 in the first row (the row located furthest in the +Y direction) are sequentially replaced one by one from the first tape 11 to the second tape 16, starting from the chip 14 in the +X direction toward the chip 14 in the -X direction. A positioning step is performed each time between the nth chip 14 (first chip 140) in the first row and the n+1th chip 14 (second chip 141) in the first row, so that the chip spacing in the X direction after replacement is wider than the chip spacing (width of division groove 15) before replacement.

[0089] Fig. 10 shows the tenth reattaching step in which the last, tenth chip 14 in the first row is reattached from the first tape 11 to the second tape 16, and Fig. 15 shows the state after the reattaching step. As shown in Fig. 15, the ten chips 14 in the first row after reattaching have an X-directional spacing between adjacent chips 14 in the X direction that is larger than the X-directional width of the dividing groove 15 before reattaching. The second tape 16 after reattaching has a larger effective support area for attaching chips 14 (chips 14 can be supported up to the vicinity of the frame 17) than the first tape 11 before reattaching, so it is possible to expand the spacing between chips 14 after reattaching beyond the width of the original dividing groove 15.

[0090] When replacement of all chips 14 in the first row is completed, the process proceeds to replacement of chips 14 in the adjacent second row in the -Y direction. Here, the tenth chip 14 in the first row that is located furthest in the -X direction and is to be replaced last is referred to as first chip 140, and the chip 14 in the second row that is located furthest in the -X direction and is to be replaced first is referred to as second chip 141. Then, as two consecutive chip replacement processes, the replacement of first chip 140, which is the last chip 14 in the first row (FIG. 10), is referred to as the nth chip replacement process, and the replacement of second chip 141, which is the first chip 14 in the second row (FIG. 11), is referred to as the n+1th chip replacement process.

[0091] After performing a replacement step (FIG. 10) of replacing the first chip 140 with the second tape 16, a positioning step is performed in which the second chip 141 on the first tape 11 side is moved relative to the second tape 16 in the Y direction, and the second chip 141 is positioned at a desired distance from the first chip 140 in the Y direction.

[0092] More specifically, in this positioning step, first tape 11 is positioned relative to second tape 16 while referring to image data captured by imaging units 62 and 63 so that the distance Yb ​​(FIG. 16) in the Y direction between first chip 140 and second chip 141 after being attached to second tape 16 is larger than the distance Ya (FIG. 16) in the X direction between first chip 140 and second chip 141 before being attached and supported by first tape 11. Also, in this positioning step, a rotation step may be further performed in which the angle of second chip 141 is rotated to an angle approaching parallel to first chip 140.

[0093] The two chips 14 whose interval is increased in the positioning step may be in the same position or in different positions in a direction (X direction in this case) perpendicular to the direction in which the interval is increased (Y direction in this case). As shown in Fig. 16, the first chip 140 and the second chip 141 whose interval in the Y direction is increased in this positioning step are shifted from each other in the X direction.

[0094] Next, an alignment step is performed to align the positions of the first pressing portion 58 and the second pressing portion 59 with the second chip 141 to be replaced, and then a replacement step (Figure 11) is performed in which the first pressing portion 58 and the second pressing portion 59 are brought closer together in the Z direction to replace the second chip 141, which is the chip 14 in the second row that is furthest in the -X direction, from the first tape 11 to the second tape 16.

[0095] Then, by repeating the replacement step and the positioning step, the multiple chips 14 in the second row (the row located second in the +Y direction) are sequentially replaced from the first tape 11 to the second tape 16 one by one, starting from the chips 14 in the -X direction toward the chips 14 in the +X direction.

[0096] Fig. 17 shows the state after all chips 14 in the second row have been replaced from first tape 11 to second tape 16. As shown in Fig. 17, after replacement, the distance in the X direction between adjacent chips 14 in the second row is larger than the width in the X direction of division groove 15 before replacement. Furthermore, the distance in the Y direction between chips 14 in the first row and chips 14 in the second row is larger than the width in the Y direction of division groove 15 before replacement.

[0097] In this manner, the chips 14 in the nth row in the Y direction are successively replaced from the first tape 11 to the second tape 16. The positioning step is performed for each row of chips 14 such that the spacing between the chips 14 in the X direction after replacement is greater than the width of the division groove 15 in the X direction before replacement. Also, the positioning step is performed such that the spacing between the chips 14 in the nth row and the chips 14 in the (n+1)th row after replacement is greater in the Y direction than the width of the division groove 15 in the Y direction before replacement. That is, for all of the multiple chips 14, replacement from the first tape 11 to the second tape 16 is performed while increasing the spacing between the chips 14 adjacent to each other in the X and Y directions.

[0098] The chip replacement process described above is intended for the case where second tape 16 has an adhesive layer, but second tape 16 may be a sheet made of a thermoplastic resin that does not have an adhesive layer. Second tape 16 made of such a non-adhesive sheet is attached to chip 14 and frame 17 by thermocompression bonding. As the non-adhesive sheet, a polyolefin sheet, a polyethylene sheet, a polypropylene sheet, or a polystyrene sheet is preferable.

[0099] When replacing chip 14 with second tape 16 that does not have an adhesive layer, second tape 16 is heated at the location where chip 14 is replaced. As one example, a replacement step is performed while supplying hot air to chip 14 or second tape 16, and chip 14 is pressed onto second tape 16. As another example, at least one of first pressing unit 58 and second pressing unit 59 is configured to include a heater, and in a state in which the pressing surface of first pressing unit 58 or the pressing surface of second pressing unit 59 is heated, a replacement step is performed to press chip 14 onto second tape 16.

[0100] [Chip quality judgement step] The chip replacement step in the chip replacement process, which is performed multiple times, is performed only on chips 14 that have been determined to be good in the previous inspection step. Chips 14 that have been determined to be bad in the inspection step are left on the first tape 11 without undergoing the replacement step.

[0101] As shown in the flowchart of Fig. 20, a chip quality determination step is performed in each chip replacement process. In the chip quality determination step, the inspection results of the inspection step are referenced to determine whether the quality of the chip 14 to be replaced in the chip replacement process is good or bad. Quality standards referenced in determining the quality of the chip 14 include, for example, the division state of the chip 14 (presence or absence of undivided areas), the presence or absence of chips or cracks in the chip 14, etc.

[0102] If the quality of the chip 14 is judged to be good (NO), an alignment step and a replacement step are performed to replace the chip 14 onto the second tape 16.

[0103] If the quality of the chip 14 is judged to be poor (YES), the alignment step and the replacement step are skipped. In other words, the chip 14 is left on the first tape 11. Then, the positioning step is performed on the chip 14 next to the chip 14 for which replacement was skipped.

[0104] In this way, defective chips that do not meet the quality standards and contain undivided parts, chips, cracks, etc. are sorted out by leaving them on the first tape 11, which has the advantage of eliminating the need to remove defective chips from the second tape 16 in the subsequent process and improving work efficiency. Also, the second tape 16 to which only the chips 14 judged to be good have been replaced is transported to the die bonder, which eliminates the risk of missing defective chips.

[0105] When a defective chip is left on the first tape 11, the second tape 16 has an area margin for the defective chip, and this area margin can be used to increase the chip spacing after replacement. For example, the chip arrangement on the original first tape 11 side may be maintained, while the chip arrangement on the second tape 16 after replacement may be set so that the area corresponding to the defective chip becomes an empty area. In this case, the chip spacing becomes particularly large at the location of the good chip adjacent to the defective chip. Alternatively, the chip arrangement on the second tape 16 side may be changed from the original chip arrangement on the first tape 11 side, and the area margin caused by the defective chip may be evenly distributed, so that the spacing of the good chips to be replaced on the second tape 16 side may be evenly increased.

[0106] [Final chip decision step] As shown in the flowchart of Fig. 20, a final chip determination step is performed in each chip replacement process. In the final chip determination step, it is determined whether the chip 14 that was replaced from first tape 11 to second tape 16 in the immediately preceding replacement step, or the chip 14 that was determined to be defective in the immediately preceding chip pass / fail determination and left on first tape 11, was the last chip 14 to be supported by first tape 11.

[0107] In detail, the total number of chips 14 supported by the first tape 11 is registered in advance before replacement, and each time one cycle of the chip replacement process is performed, the chip number counter is incremented by one, and when the counter reaches the total number of registered chips, it is determined that the final chip has been reached.

[0108] If it is determined in the final chip determination step that it is not the final chip (NO), the process loop continues by carrying out the above chip replacement step on the next chip 14.

[0109] If it is determined in the final chip determination step that it is the final chip (YES), the re-pasting process is completed for all chips, and the process exits from the control flow shown in FIG. 20 and ends.

[0110] Fig. 18 shows a state where all chips 14 have been transferred from first tape 11 to second tape 16. That is, it shows a case where it is determined to be the last chip in the last chip determination step. As shown in Fig. 18, after the transfer is completed, the distances between adjacent chips 14 in the X and Y directions of all chips 14 are wider than the width of dividing groove 15 before the transfer.

[0111] 18 shows an example in which none of the chips 14 are judged to be defective in the chip quality judgment step, and all of the chips 14 are targets for replacement. If any of the chips 14 are judged to be defective, the chip arrangement on the second tape 16 side will be different from that shown in FIG.

[0112] [Modifications of the replacement step and positioning step] 19 shows a modified example in which a plurality of chips 14 are replaced onto a second tape 18 having an area larger than that of the first tape 11 before replacement. An annular frame 19 is attached to the outer peripheral region of the second tape 18, and a substantially circular opening 191 is formed on the inside of the frame 19. The inner diameter of the opening 191 of the frame 19 is larger than the inner diameter of the opening 121 of the frame 12. Therefore, the area of ​​the second tape 18 on the inside of the opening 191 is larger than the area of ​​the first tape 11 on the inside of the opening 121. By replacing the chips 14 onto the second tape 18 having an area larger than that of the first tape 11, the spacing between the chips 14 after replacement can be further expanded.

[0113] In particular, when the difference between the area of ​​first tape 11 and the area of ​​wafer 10 is small or equivalent, even if chips 14 are replaced with second tape 16 having an area equivalent to that of first tape 11, the area of ​​second tape 16 is restricted, and therefore the spacing between chips 14 cannot be significantly expanded. In such a case, it is useful to use second tape 18, which has an area larger than that of first tape 11, as the replacement tape.

[0114] [Pickup] After the chips 14 have been replaced, the second tape 16 (18) and frame 17 (19) are removed from the replacement device 50 and transported to a die bonder (not shown). In the die bonder, each chip 14 is picked up from the second tape 16 (18) and stacked on a printed circuit board or a lead frame. When replacing the first tape 11 with the second tape 16 (18), the spacing between each chip 14 is expanded, so that the chips 14 do not come into contact with each other and can be picked up efficiently.

[0115] Furthermore, defective chips including undivided areas, chips, cracks, etc. are left on the first tape 11 without being transferred to the second tape 16 (18), which eliminates the time and effort required for inspecting and removing the defective chips when they are picked up by the die bonder.

[0116] As described above, according to the chip spacing expansion method of this embodiment, chips 14 are replaced between multiple tapes, and during the replacement, the second chip 141 is positioned at a position that results in the desired spacing relative to the first chip 140, thereby making it possible to reliably expand the chip spacing without depending on the amount of expansion that can be achieved by the tape.

[0117] The above embodiment is merely an example of the application of the present invention, and the present invention is not limited to this embodiment.

[0118] In the above embodiment, the number of tapes before and after replacement is the same, and all chips 14 supported on one first tape 11 are consolidated and replaced on another single second tape 16 (18). As a different variant, multiple second tapes may be prepared and the chips may be replaced by dividing one first tape into multiple second tapes. In this case, the area of ​​each second tape may be smaller than the area of ​​the first tape. In other words, it is sufficient that the total area of ​​the multiple second tapes is equal to or greater than the area of ​​the first tape.

[0119] For example, two second tapes are prepared for one first tape. Of all the chips supported by the first tape, about half of the chips are attached to the first second tape while widening the gap between them, and the remaining half of the chips are attached to the second second tape while widening the gap between them.

[0120] By dividing the chips among multiple second tapes and replacing them, there is more room in the area of ​​the chip support region on each second tape relative to the number of chips, making it possible to further increase the spacing between chips on the second tape.

[0121] In the above embodiment, the chips 14 are transferred one by one from the first tape 11 to the second tape 16 (18) in one replacement step, but it is also possible to replace a plurality of chips 14 collectively in one replacement step. In other words, there may be a plurality of first chips and a plurality of second chips to be replaced in two successive replacement steps.

[0122] For example, when only the chip spacing in the Y direction is to be expanded, a row of chips 14 aligned in the X direction may be replaced collectively from the first tape 11 to the second tape 16 (18). Then, when replacing the chips 14 in the next row aligned in the X direction, a positioning step is performed so as to expand the chip spacing in the Y direction for the chips 14 in the row that was replaced immediately before. In this manner, the replacement step and the positioning step can be performed for each row including multiple chips 14.

[0123] In the above embodiment, the two chips 14 (first chip 140, second chip 141) that are replaced in two successive replacement steps are adjacent in the X direction or the Y direction. This reduces the amount of movement in the X direction or the Y direction of the first tape 11, the second tape 16 (18), the first pressing portion 58, the second pressing portion 59, etc. in each chip replacement process, making it possible to efficiently replace the multiple chips 14.

[0124] However, it is also possible to select two chips 14 (first chip 140, second chip 141) to be replaced in two successive replacement steps that are not adjacent to each other (with another chip 14 placed between them).

[0125] For example, the first chips 140 and the second chips 141 may be spaced apart in the X or Y direction (with another chip 14 disposed between them). Alternatively, among the chips 14 arranged in a row in the X direction, the chip located furthest in the +X direction may be the first chip 140, and the chip located furthest in the -X direction may be the second chip 141.

[0126] In the above embodiment, the chips 14 located at the corners in the +X and +Y directions are selected as the chips to be first transferred from the first tape 11 to the second tape 16, but the position of the chips 14 to be first transferred is arbitrary.

[0127] For example, the chips 14 near the center in the X and Y directions may be replaced first, and then the replacement of the chips 14 may proceed from the center toward the outside in the X and Y directions.

[0128] In the above embodiment, for each chip 14, one replacement (one stage) from the first tape 11 to the second tape 16 (18) is completed, but it is also possible to further replace the second tape 16 (18) with another tape. In other words, chip replacement may be performed in two or more stages. In this case, in the second stage of chip replacement, the second tape 16 (18) that is the source of the replacement is treated as equivalent to the first tape 11 in the above embodiment, and the other tape that is the destination of the replacement is treated as equivalent to the second tape 16 (18) in the above embodiment.

[0129] When replacing chips in two or more stages, it is preferable to gradually increase the chip spacing within the area of ​​the tape used in each stage.

[0130] In the above embodiment, in the replacement step, the chip 14 to be replaced and the second tape 16 are pressed from both the -Z direction and the +Z direction by the first pressing unit 58 and the second pressing unit 59, but the replacement step may be performed by pressing only from one side. In this case, pressing may be performed only from the chip 14 side by a member corresponding to the first pressing unit 58, or pressing may be performed only from the second tape 16 side by a member corresponding to the second pressing unit 59. In other words, the replacement step only needs to satisfy the requirement that the chip 14 to be replaced is pressed relatively against the second tape 16 to replace the chip 14.

[0131] In the above embodiment, after the expansion step of expanding first tape 11 is performed, a chip replacement step (repeated combination of the replacement step and the positioning step) to second tape 16 is performed for multiple chips 14 to expand the chip spacing. Alternatively, it is also possible to immediately perform chip spacing expansion by the chip replacement step for divided chips 14 without performing the expansion step of expanding first tape 11.

[0132] In the above embodiment, in the positioning step, second chip 141 is moved relative to second tape 16 in either the X direction or the Y direction. However, in the positioning step, second chip 141 can be moved in both the X direction and the Y direction relative to second tape 16 to change the relative positional relationship between first chip 140 and second chip 141 in both the X direction and the Y direction.

[0133] In the above embodiment, the expansion step is performed using the expanding device 20, but it is also possible to perform the expansion step using the re-bonding device 50. As described above, in the re-bonding device 50, the lifting drive unit 57 drives the multiple expansion rollers 55 to move in the +Z direction, and the multiple expansion rollers 55 push up the first tape 11 to increase the tension of the first tape 11. By utilizing the push-up action of the multiple expansion rollers 55, the expansion step of widening the width of the division groove 15 can be performed on the wafer 10 on the first tape 11. When the expansion step is performed using the re-bonding device 50, after the expansion step, the wafer unit 1 is transported from the re-bonding device 50 to the inspection device 30 to perform the inspection step, then the wafer unit 1 is transported to the adhesion reducing device 40 to perform the adhesion reducing step, and then the wafer unit 1 is returned to the re-bonding device 50 to perform the chip re-bonding process.

[0134] The embodiments of the present invention are not limited to the above-mentioned embodiments and modifications, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological progress or a derived technology, the present invention may be implemented using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0135] As described above, the chip spacing expansion method of the present invention can efficiently expand chip spacing by replacing chips between tapes even in cases where the tape cannot be expanded significantly or where the chip spacing immediately after division is very narrow, making it easier to pick up the chips after division, thereby greatly contributing to improving chip production efficiency. [Explanation of symbols]

[0136] 1: Wafer unit 10: Wafer 11: Tape 1 12: Frame 13: Planned division line 14: Tip 15:Dividing groove 16: Tape 2 17: Frame 18: Second Tape 19: Frame 20: Expanding device 21: Frame support table 22: Frame clamp 23: Extension roller 24: Lifting section 25: Lifting drive unit 30: Inspection equipment 31: Support table 32:Light source 33: Imaging unit 40: Adhesive strength reducing device 41: Support table 42: Ultraviolet irradiation unit 43: Ultraviolet light source 50: Replacement device 51: Frame support part 52: Frame support part 53: 1st movement mechanism 54:Second movement mechanism 55: Extended roller 56: Lifting section 57: Lifting drive unit 58: First pressing part 59: Second pressing part 60: First pressing unit drive unit 61: Second pressing unit drive unit 62: Imaging unit 63: Imaging unit 140: First chip 141: Second chip 160: Area to be replaced 161: Area to be replaced Er: undivided area UV: Ultraviolet light

Claims

1. A chip spacing expanding method for expanding spacing between chips of a wafer divided into a plurality of chips along planned division lines formed in an X direction and a Y direction perpendicular to the X direction, the method comprising the steps of: a replacement step of placing a second tape opposite an arbitrary first chip among the plurality of chips and pressing the first chip relatively against the second tape to replace the first chip from the first tape to the second tape; a positioning step of moving a second chip to be replaced relative to the second tape in at least one of the X direction and the Y direction, so as to position the second chip at a desired distance from the first chip; and repeating the steps to expand the space between the chips.

2. The positioning step includes:

2. The method for expanding a tip interval according to claim 1, further comprising a step of rotating the angle of the second tip to an angle approaching parallel to the first tip.

3. Before the replacement step, 3. The method for expanding a chip gap according to claim 1, further comprising a step of reducing adhesive strength of the first tape by applying an external force to the first tape to reduce the adhesive strength.

4. Before the replacement step, Further comprising an expanding step of expanding the first tape to increase the spacing between the chips; 3. The chip spacing expanding method according to claim 1, further comprising repeating the replacing step and the positioning step to expand the spacing between the chips to be larger than that after the expanding step.

5. Before the replacement step, Further comprising an inspection step for determining whether the chip is good or bad; The chip spacing expansion method according to claim 1 or 2, characterized in that the replacement step is performed only on the chips that are judged to be good in the inspection step, and the chips that are judged to be bad in the inspection step are left on the first tape.

6. The inspection step includes: If the chip is divided, it is judged as good.

6. The method for expanding a chip interval according to claim 5, further comprising the step of judging the chip to be defective when at least a portion of the chip is connected and not divided.

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