Holding member, transfer device, cutting table, cutting device, semiconductor manufacturing device, manufacturing method for holding member, and manufacturing method for semiconductor device

Abstract

To make it possible to easily remove a to-be-held object after suction is released without damaging a holding member's suction power.SOLUTION: A holding member 10 has suction holes 10a formed for sucking and holding a to-be-held object W. Multiple recesses 10c are formed on the surface of a holding area 10R for holding the to-be-held object W by the suction holes 10a. A surface other than the multiple recesses 10c in the holding area 10R is a roughened surface 10d.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a holding member, a transport device, a cutting table, a cutting device, a semiconductor manufacturing device, a manufacturing method of a holding member, and a manufacturing method of a semiconductor device. [Background technology]

[0002] Conventionally, as shown in Patent Document 1, an adsorption member for adsorbing parts has been used in cleaning equipment, film forming equipment, etc. This adsorption member adsorbs one or more parts on the same adsorption surface and includes an adsorption layer and a support. The adsorption layer is made of a ceramic porous body, and the average pore diameter is adjusted to improve the adsorption and release of parts. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-183535 A Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, from the viewpoints of water resistance, ability to follow warping of the object to be held, prevention of displacement of the object to be held, etc., elastic resins (rubber materials) such as silicone-based resins and fluorine-based resins are used for the holding member (holding layer) that holds the object to be held. Also, suction holes are formed in the holding member to suction and hold the object to be held.

[0005] However, when the suction force for holding the object to be held is increased, the object to be held will stick to the holding member even after the suction through the suction holes is released. Also, the larger the contact area between the holding member and the object to be held is, due to the surface tackiness or dirt of the holding member, the greater the sticking force becomes. Furthermore, when the contact surfaces of the object to be held and the holding member are smooth, vacuum sticking occurs, and when the holding member becomes wet with water, the unevenness of the contact surfaces is filled with water, increasing the sticking force. In this way, when the object to be held sticks to the holding member, it is not possible to remove the object to be held from the holding member, and a situation occurs in which the object to be held cannot be transported.

[0006] The present invention has been made to solve the above problems, and its main objective is to easily remove the held object after suction is released without compromising the suction force of the holding member. [Means for solving the problem]

[0007] In other words, the holding member of the present invention is a holding member formed with suction holes that adsorb and hold the object to be held, wherein a plurality of recesses are formed on the surface of a holding area that holds the object to be held by the suction holes, and the surface of the holding area other than the plurality of recesses is a roughened surface. Effect of the Invention

[0008] According to the present invention thus configured, the held object can be easily removed after the suction force is released without impairing the suction force of the holding member. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic diagram showing a configuration of a cutting device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a cross-sectional view showing a schematic configuration of a cutting table of the embodiment. [Diagram 3]FIG. 2A is a plan view showing a schematic configuration of a substrate, and FIG. 2B is a plan view showing a schematic configuration of a holding member in the embodiment. [Figure 4] FIG. 2 is a partially enlarged plan view illustrating a schematic configuration of a holding member according to the embodiment. [Diagram 5] FIG. 4 is a partially enlarged cross-sectional view showing a schematic configuration of a holding member of the embodiment. [Figure 6] 13 is a plan view showing a schematic configuration of a holding member according to a modified embodiment. FIG. [Figure 7] 13 is a partially enlarged plan view showing a schematic configuration of a holding member according to a modified embodiment. FIG. [Figure 8] 13 is a partially enlarged cross-sectional view showing a schematic configuration of a holding member according to a modified embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Next, the technology according to the present invention will be described in more detail with reference to examples, although the present invention is not limited to the following technology.

[0011] The holding member of Technology 1 according to the present invention is a holding member formed with suction holes that suction and hold the object to be held, wherein a plurality of recesses are formed on the surface of a holding area that holds the object to be held by the suction holes, and the surface of the holding area other than the plurality of recesses is a roughened surface.

[0012] With this holding member, since a plurality of recesses are formed on the surface of the holding area that holds the object to be held, it is possible to reduce the contact area between the holding member and the object to be held, thereby reducing the sticking force. Also, since the surface of the holding area other than the plurality of recesses is roughened, it is possible to reduce the sticking force due to vacuum sticking, etc. Therefore, the object to be held can be easily removed after the suction is released without impairing the suction force of the holding member.

[0013] If the suction holes and the outer space of the holding area are connected by the multiple recesses formed in the holding area, the suction force of the holding member may be reduced. In order to solve this problem, in addition to the configuration of the holding member of the above-mentioned technology 1, it is desirable that the multiple recesses are formed so that the suction holes and the outer space of the holding area are not connected to each other when the holding object is held.

[0014] Specific embodiments of the holding member include a configuration in which a plurality of recesses are regularly formed, a configuration in which a plurality of recesses are irregularly formed, or a configuration in which a plurality of recesses are formed in an irregular shape. Here, a configuration in which a plurality of recesses are regularly formed makes it easier to process the holding member. Therefore, in addition to the configuration of the above-mentioned technology 1 or 2, it is desirable that the holding member of technique 3 according to the present invention has the plurality of recesses in a lattice, stripe, or dot shape in a plan view.

[0015] The conveying device of Technology 4 according to the present invention includes a holding unit that adsorbs and holds an object to be conveyed, and a moving mechanism that moves the holding unit, and the holding unit has a holding member having the configuration of any one of Technology 1 to 3 described above. With this configuration, the object to be transported can be easily removed after the suction force of the holding member is released without compromising the suction force of the holding member, so that the object to be transported can be transported reliably to a predetermined position.

[0016] A cutting table according to a fifth aspect of the present invention is a cutting table that adsorbs and holds an object to be cut, and is characterized by having a holding member having the configuration of any one of the first to third aspects described above. With this configuration, the object to be cut can be easily removed after the suction force is released without compromising the adhesive force of the holding member, thereby preventing the object from shifting position during cutting and allowing the cut object to be easily removed after the suction force is released.

[0017] The cutting device of Technique 6 according to the present invention includes a cutting table that adsorbs and holds an object to be cut, and a cutting mechanism that cuts the object held on the cutting table, and the cutting table has a holding member having the configuration of any one of Techniques 1 to 3 above. With this configuration, the object to be cut can be easily removed after the suction force of the holding member is released without compromising the suction force, thereby preventing the object from shifting position during cutting, and the cut object can be easily removed from the cutting table after the suction force is released.

[0018] A semiconductor manufacturing apparatus according to Technology 7 of the present invention is a semiconductor manufacturing apparatus for cutting a substrate having a plurality of semiconductor devices formed thereon to manufacture individual semiconductor devices, and is provided with a cutting table for adsorbing and holding the substrate, a cutting mechanism for cutting the substrate held on the cutting table, and a transport mechanism for transporting the individual semiconductor devices from the cutting table, wherein the cutting table or the transport mechanism has a holding member having the configuration of any one of Technologies 1 to 3 above. With this configuration, the semiconductor device that has been singulated after suction release can be easily removed without impairing the suction force of the holding member, so that when the cutting table has a holding member having the configuration of any one of the above techniques 1 to 3, it is possible to prevent the object to be cut from shifting position during cutting, and the semiconductor device that has been singulated after suction release can be easily removed from the cutting table. Also, when the transport mechanism has a holding member having the configuration of any one of the above techniques 1 to 3, it is possible to reliably transport the semiconductor device that has been singulated after suction release to a predetermined position.

[0019] The manufacturing method of a holding member of Technology 8 according to the present invention is a method for manufacturing a holding member having the configuration of any one of Technologies 1 to 3 described above, and is characterized in that a laser beam is irradiated to a surface other than the plurality of recesses in the holding area to form the roughened surface. With this configuration, the surface of the holding area can be roughened to form a roughened surface, while dirt on the surface of the holding area can be burned and removed. In particular, by irradiating the laser light after the recesses are formed to roughen the surface, dirt on the surface caused by the formation of the recesses can be burned and removed.

[0020] In addition to the configuration of the above-mentioned technique 8, the manufacturing method for a holding member according to technique 9 of the present invention preferably includes irradiating a surface of the holding region with laser light to form the plurality of recesses. With this configuration, since not only the roughened surface but also the recesses are formed by using laser light, the manufacturing process of the holding member can be simplified.

[0021] The manufacturing method of a semiconductor device according to Technology 10 of the present invention is a manufacturing method of a semiconductor device using the semiconductor manufacturing apparatus of Technology 7 described above, characterized in that the substrate held on the cutting table is cut by the cutting mechanism, and the individual semiconductor devices are carried out by the transport mechanism.

[0022] <One embodiment of the present invention> DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a cutting device according to the present invention will be described with reference to the drawings. In addition, in any of the drawings shown below, for the purpose of easy understanding, some parts are omitted or exaggerated in schematic form as appropriate. The same components are denoted by the same reference numerals and the description thereof is omitted as appropriate.

[0023] <Overall configuration of the cutting device 100> The cutting apparatus 100 of this embodiment cuts a substrate W, which is an object to be cut, into a plurality of cut products P.

[0024] Here, examples of the substrate W include a flip chip substrate or a sealed substrate. The flip chip substrate is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are flip-chip connected. The sealed substrate is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and is resin-molded to seal at least the electronic elements. The substrate constituting the sealed substrate may be a lead frame or a printed wiring board, and may also be a semiconductor substrate (including semiconductor wafers such as silicon wafers), a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, or the like. The substrate constituting the sealed substrate may or may not be wired.

[0025] 1, the cutting apparatus 100 includes, as its components, a supply module 100A for supplying a substrate W, a cutting module 100B for cutting the substrate W, and an inspection module 100C for inspecting cut products P that have been cut and diced. Each component is detachable and replaceable with respect to the other components. When the substrate W is a substrate on which a plurality of semiconductor devices are formed, the cutting apparatus 100 can be said to be a semiconductor manufacturing apparatus for manufacturing diced semiconductor devices.

[0026] The operation of the cutting device 100 including the modules 100A to 100C described below is controlled by a control unit CTL provided in the supply module 100A. This control unit CTL may be provided in modules 100B and 100C other than the supply module 100A. Furthermore, the control unit CTL may be divided into a plurality of units and provided in at least two of the supply module 100A, the cutting module 100B, and the inspection module 100C.

[0027] The supply module 100A receives the substrate W to be cut from the outside and accommodates the substrate W. The supply module 100A is provided with a substrate accommodation section 2 that accommodates the substrate W. The substrate W is transported from the supply module 100A to the cutting module 100B by a transport mechanism (loader) 3. The loader 3 transports the substrate W to the cutting module 100B using a guide rail 31. The cutting device 100 of this embodiment has three substrate accommodation sections 2, but the number of substrate accommodation sections 2 is not particularly limited.

[0028] The cutting module 100B cuts the substrate W into a plurality of cut products P. The cutting module 100B has a cutting table 4 that adsorbs and holds the substrate W, which is the object to be cut, and a cutting mechanism 5 that cuts the substrate W held on the cutting table 4.

[0029] The cutting mechanism 5 is configured by mounting a rotary blade 52 on a spindle 51. The cutting table 4 and the cutting mechanism 5 are moved relative to each other, so that the substrate W is cut by the rotary blade 52 and singulated into cut products P. Here, a cutting fluid supply unit 50 supplies the rotary blade 52 and the substrate W with cutting fluid to suppress frictional heat generated when the substrate W is cut. Thereafter, the singulated cut products P are transported from the cutting module 100B to the inspection module 100C by a transport mechanism (unloader) 6. The unloader 6 has a holding unit 61 that individually adsorbs and holds a plurality of cut products P, which are transport objects, and a moving mechanism 62 that moves the holding unit 61. The cutting device 100 of this embodiment has two cutting mechanisms 5, but may have only one cutting mechanism 5.

[0030] The inspection module 100C inspects the cut products P that have been individualized by the cutting module 100B by imaging them. This inspection module 100C includes an inspection table 7 that adsorbs and holds a plurality of cut products P, which are the objects to be inspected, and an inspection camera 8 that images the plurality of cut products P held on the inspection table 7. Then, the inspection module 100C classifies the individualized cut products P into good products and defective products based on the images obtained by the inspection camera 8. Then, a transport mechanism (not shown) transports and stores the good products in a tray 9a for good products and the defective products in a tray 9b for defective products (see FIG. 1).

[0031] <Configuration of the holding member 10 that adsorbs and holds the substrate W or multiple cut pieces P> 2 to 5, in this embodiment, a holding member 10 that adsorbs and holds the substrate W or a plurality of cut products P is provided on at least one of the cutting table 4, the holding part 61 of the unloader 6, or the inspection table 7. The holding member 10 is made of an elastic resin (rubber material) such as a silicone-based resin or a fluorine-based resin.

[0032] 2 to 5 show a configuration in which the cutting table 4 has a holding member 10, and the holding member 10 is formed with a blade avoidance groove 10M for avoiding the rotary blade 52 during cutting.

[0033] Here, as shown in FIG. 3(a), the substrate W has product parts Wx that are used as products after cutting, and non-product parts Wy that are not used as products after cutting. The product parts Wx are cut into individual cut products P. In this embodiment, a plurality of product parts Wx are arranged in the center, for example, in a vertical and horizontal matrix shape (for example, a rectangular shape overall), and non-product parts Wy are arranged on the periphery of the plurality of product parts Wx. The arrangement of the product parts Wx and non-product parts Wy is not limited to the above. For example, the non-product parts Wy may be arranged other than on the periphery of the substrate W.

[0034] For this reason, as shown in Figure 3(b), the blade groove 10M is formed in a lattice pattern corresponding to the product portion Wx and the non-product portion Wy, and the rectangular area surrounded by the blade groove 10M becomes the holding area 10R that holds each product portion Wx of the substrate W.

[0035] In addition, when the holding portion 61 of the unloader 6 that adsorbs and holds the plurality of cut products P that have been individualized has a holding member 10, a holding area 10R is formed corresponding to each of the plurality of cut products P. In addition, when the inspection table 7 that adsorbs and holds the plurality of cut products P that have been individualized has a holding member 10, a holding area 10R is formed corresponding to each of the plurality of cut products P.

[0036] The holding member 10 is formed with suction holes 10a for suctioning and holding the substrate W or a plurality of cut pieces P. In this embodiment, in order to increase the suction force of the suction holes 10a, the opening size of the suction side opening of the suction holes 10a is enlarged to form pocket portions 10b. The suction holes 10a and the pocket portions 10b are formed inside each holding region 10R in a plan view. Although the pocket portions 10b in Figs. 2 to 5 are rectangular in a plan view, the shape of the pocket portions 10b in a plan view is not limited thereto. The suction holes 10a of the holding member 10 communicate with a suction flow path 40a formed in a holding body 40 (table body in Fig. 2) to which the holding member 10 is attached.

[0037] 4 and 5, the holding member 10 has a plurality of recesses 10c formed on the surface of a holding region 10R that holds the substrate W or a plurality of cut pieces P by means of suction holes 10a. The plurality of recesses 10c serve to reduce the contact area between the surface of the holding region 10R and the substrate W. By forming the plurality of recesses 10c, the contact area is set to, for example, 50% to 60%, assuming that the contact area in the case where the recesses 10c are not formed is 100%.

[0038] The recesses 10c are formed so that the suction holes 10a and the outer space of the holding area 10R do not communicate with each other when the substrate W or the cut products P are held. Specifically, the recesses 10c are in a lattice, stripe or dot shape in a plan view. FIG. 4 shows an example in which the recesses 10c are in a dot shape. Here, the width and depth of each recess 10c are preferably small enough to prevent foreign matter from being trapped in the recess 10c, and are also preferably large enough to prevent the recess 10c from being affected by wear caused by cutting the substrate W (production of the cut products P) and cleaning. Specifically, the width and depth of each recess 10c may be, for example, several tens to several hundreds of μm.

[0039] Furthermore, as shown in Fig. 4 and Fig. 5, the surface of the holding member 10 other than the multiple recesses 10c in the holding region 10R is a roughened surface 10d. This roughened surface 10d improves peeling against vacuum adhesion. The roughened surface 10d of this embodiment is formed by irradiating the surface other than the multiple recesses 10c in the holding region 10R with laser light. Furthermore, the roughened surface 10d has unevenness smaller than the width and depth of the recesses 10c, and is, for example, striped with a pitch of several tens of µm.

[0040] <Method of manufacturing the holding member 10> Next, an example of a method for manufacturing the holding member 10 of this embodiment will be described. First, the holding member 10 having the suction holes 10a and the pockets 10b formed therein is prepared. In the case of the holding member 10 used for the cutting table 4, a blade avoidance groove 10M for avoiding the rotary blade 52 is formed.

[0041] Then, a laser beam is irradiated onto the surface of the holding region 10R of the holding member 10 to form a plurality of recesses 10c. Here, in consideration of processability, the laser beam can be irradiated to form a plurality of recesses 10c without distinguishing between the suction holes 10a and the pocket portions 10b (or the blade groove 10M, if any).

[0042] After forming the multiple recesses 10c, the surface of the holding region 10R of the holding member 10 other than the multiple recesses 10c is irradiated with laser light to form the roughened surface 10d. Here, taking into consideration processability, the surface of the holding region 10R can be roughened by irradiating with laser light without distinguishing between the multiple recesses 10c, the suction holes 10a, and the pocket portions 10b (or the blade groove 10M, if present).

[0043] Since the roughened surface 10d is formed by irradiating the laser light in this manner, dirt on the surface of the holding region 10R can be burned and removed. In particular, by irradiating the laser light to roughen the surface after the recesses 10c are formed, dirt on the surface caused by the formation of the recesses 10c can be burned and removed. In this manner, the holding member 10 having the recesses 10c and the roughened surface 10d formed therein is manufactured.

[0044] <Effects of this embodiment> According to the cutting device 100 of this embodiment, since a plurality of recesses 10c are formed on the surface of the holding region 10R that holds the substrate W or the cut product P, the contact area between the holding member 10 and the substrate W is reduced, thereby reducing the adhesion force, and the substrate W or the cut product P can be easily removed after suction is released. Furthermore, since the surface of the holding region 10R other than the plurality of recesses 10c is roughened as the roughened surface 10d, the adhesion force due to vacuum adhesion or the like is reduced, and the substrate W or the cut product P can be easily removed after suction is released. Therefore, the substrate W or the cut product P can be easily removed after suction is released without impairing the adhesion force of the holding member 10.

[0045] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0046] For example, in the above embodiment, the cutting device 10 is configured to use a holding member 10 on at least one of the cutting table 4, the unloader 6, or the inspection table 7, but if there is another suction mechanism for suction-holding the substrate W or the cut product P, the holding member 10 of the above embodiment may be used for that suction mechanism.

[0047] Furthermore, the holding member 10 of the above embodiment can also be applied to semiconductor manufacturing equipment other than the cutting apparatus 100, for example, a resin molding equipment such as compression molding or transfer molding, or an inspection equipment for inspecting an object to be inspected such as a semiconductor device.

[0048] In addition, the method of forming the recess 10c may be, in addition to the method of irradiating laser light, for example, mechanical processing such as cutting, chemical processing using a chemical solution, or mold transfer molding.

[0049] Furthermore, the roughened surface 10d may be formed by machining such as cutting, blasting, or mold transfer molding, in addition to the laser light irradiation method.

[0050] Moreover, in the above embodiment, the holding member 10 has the pocket portion 10b, but the holding member 10 may have a configuration without the pocket portion 10b.

[0051] Furthermore, when the holding member 10 is used for the cutting table 4, as shown in Figs. 6 to 8, the holding member 10 may have a plurality of second recesses 10e formed on the surface of the contact region 10S that contacts the non-product part Wy resulting from cutting the substrate W. The plurality of second recesses 10e reduce the contact area between the surface of the contact region 10S and the non-product part Wy. By forming the plurality of second recesses 10e, the contact area is set to, for example, 20% to 30% of the contact area when the second recesses 10e are not formed. Note that Figs. 6 to 8 omit the illustration of the recesses 10c and the roughened surface 10d of the above embodiment.

[0052] In addition, the plurality of second recesses 10e communicate with the outside of the contact area 10S when the non-product portion Wy is in contact with the contact area 10S. Here, communicating with the outside of the contact area 10S includes that the second recesses 10e extend to the outside of the non-product portion Wy in a plan view and open to the surface of the holding member 10, or that the second recesses 10e are covered by the non-product portion Wy in a plan view but open to the side surface 101 of the holding member 10 or the inner surface 102 of the blade groove 10M as shown in FIG. 8. In addition, in a plan view, both ends of the second recesses 10e may be configured to communicate with the outside of the contact area 10S, or one end of the second recesses 10e may be configured to communicate with the outside of the contact area 10S. In addition, when one end of the second recess 10e is configured to communicate with the outside of the contact region 10S, it is preferable that one end on the side to which the machining liquid is supplied is configured to communicate with the outside of the contact region 10S.

[0053] Specifically, the second recesses 10e are in a lattice, stripe, or dot shape in plan view. FIGS. 7 and 8 show an example in which the second recesses 10e are in a lattice shape. Here, the width and depth of each second recess 10e are preferably small enough to prevent foreign matter from being trapped in the second recess 10e, and are also desirably large enough to prevent the second recesses 10e from being affected by wear caused by cutting the substrate W (production of the cut product P) and cleaning. Specifically, the width and depth of each second recess 10e may be, for example, several tens to several hundreds of μm. The pitch of the second recesses 10e may be, for example, several tens of μm. These second recesses 10e may be formed by irradiating a laser beam, by machining such as cutting, by chemical treatment using a chemical solution, or by mold transfer molding.

[0054] In this way, since the plurality of second recesses 10e are formed on the surface of the contact region 10S that contacts the non-product portion Wy, the contact area between the holding member 10 and the non-product portion Wy is reduced, and the sticking force is reduced, so that the non-product portion Wy can be easily removed. In addition, since the plurality of second recesses 10e are connected to the outside of the contact region 10S, the processing liquid can easily flow between the holding member 10 and the non-product portion Wy, and the non-product portion Wy can be easily removed. Therefore, the non-product portion Wy generated by cutting the substrate W can be prevented from sticking to the holding member 10. In addition, the amount of processing liquid supplied can be reduced, so that the processing liquid can be saved.

[0055] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0056] 100 Cutting equipment (semiconductor manufacturing equipment) W: Substrate (object to be held, object to be transported, object to be cut) P... Cutting products (semiconductor device) 4. Cutting table 5...Cutting mechanism 6. Unloader (transport device) 61...Holding part 62...Moving mechanism 10 Holding member 10a...Adsorption hole 10R...Holding area 10c Recess 10d...Roughened surface

Claims

1. A holding member having a suction hole for suctioning and holding an object to be held, a plurality of recesses are formed on a surface of a holding area that holds the object to be held by the suction holes; A holding member, wherein a surface of the holding region other than the plurality of recesses is a roughened surface.

2. The holding member according to claim 1 , wherein the plurality of recesses are formed such that, when the object to be held is held, the suction hole and an outer space of the holding area do not communicate with each other.

3. The holding member according to claim 1 or 2, wherein the plurality of recesses are arranged in a lattice, stripe or dot pattern in a plan view.

4. a holding section that adsorbs and holds the object to be transported; a moving mechanism for moving the holding unit, A conveying device, wherein the holding section comprises the holding member according to claim 1 .

5. A cutting table that adsorbs and holds an object to be cut, A cutting table comprising a holding member according to any one of claims 1 to 3.

6. a cutting table that adsorbs and holds the workpiece; a cutting mechanism configured to cut the object held on the cutting table, A cutting device, wherein the cutting table comprises a holding member according to claim 1 .

7. A semiconductor manufacturing apparatus for manufacturing individual semiconductor devices by cutting a substrate on which a plurality of semiconductor devices are formed, comprising: a cutting table that adsorbs and holds the substrate; a cutting mechanism that cuts the substrate held on the cutting table; a transport mechanism for transporting the individual semiconductor devices from the cutting table, A semiconductor manufacturing apparatus, wherein the cutting table or the transport mechanism comprises the holding member according to claim 1 .

8. A method for manufacturing the holding member according to any one of claims 1 to 3, comprising the steps of: A method for manufacturing a holding member, comprising: irradiating a surface of the holding region other than the plurality of recesses with laser light to form the roughened surface.

9. The method for manufacturing a holding member according to claim 8 , further comprising the step of irradiating a surface of the holding region with laser light to form the plurality of recesses.

10. A method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus according to claim 7, cutting the substrate held on the cutting table by the cutting mechanism; The semiconductor device thus obtained is conveyed out by the conveying mechanism.

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