Piezoelectric vibration device

Abstract

To provide a piezoelectric vibration device that can be adapted to a plurality of different types of external circuit boards.SOLUTION: A piezoelectric vibration device 1 includes a plurality of external terminals 41, 42, 43, 44 on a bottom surface of a package 22 in which a crystal resonator 11 is accommodated. The external terminals have outer terminals 41a, 42a, 43a, 44a arranged at any corner portions of respective bottom surfaces for each of a plurality of terminal types having different roles, and inner terminals 41b, 42b, 43b, 44b arranged to be closer to a center O side on the bottom surface than the outer terminals. The outer terminals 41a, 42a, 43a, 44a and the inner terminals 41b, 42b, 43b, 44b of the same terminal type are directly electrically connected to each other. The outer terminals 41a, 42a, 43a, 44a have notches at end portions closest to the center O of the bottom surface, and at least a part of the inner terminals 41b, 42b, 43b, 44b is arranged in the notch areas 41d, 42d, 43d, 44d.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a surface mount type piezoelectric vibration device. [Background technology]

[0002] Surface-mounted crystal resonators and crystal oscillators are widely used as piezoelectric vibration devices. For example, a surface-mounted crystal oscillator is constructed such that a crystal vibration element and electronic components such as an integrated circuit element (IC chip) are mounted in a recess in a container made of an insulating material, and the recess is hermetically sealed with a lid. In addition, multiple external terminals are formed on the outer bottom surface of the container, and some of these external terminals are electrically connected to the piezoelectric vibration element and electronic components. The piezoelectric vibration device is mounted on an external circuit board by electrically and mechanically joining the external terminals to mounting pads on the external circuit board with a conductive bonding material such as solder.

[0003] As such a piezoelectric vibration device, a surface-mounted crystal oscillator (piezoelectric vibration device) has been disclosed in which a crystal piece (piezoelectric vibration piece) and an IC chip are sealed in a recess in a container, and external terminals are formed on the four corners of the bottom surface of the container (see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2013-197694 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, the size and position of the external circuit board and the mounting pads on the external circuit board vary depending on the type of electronic device on which the external circuit board is mounted, the specifications of the external circuit board, etc. However, a piezoelectric vibration device such as that described in Patent Document 1 needs to be manufactured according to different standards in which the position of the external terminals and the size of the container are changed for each type of external circuit board on which it is mounted, which causes a problem of poor manufacturing efficiency.

[0006] The present invention has been made in consideration of the above-mentioned problems, and has an object to provide a piezoelectric vibration device that can accommodate a plurality of different mounting pad patterns. [Means for solving the problem]

[0007] The present invention is characterized in that it is a piezoelectric vibration device comprising a piezoelectric vibrator and a package that houses the piezoelectric vibrator, the package having a plurality of external terminals on a substantially rectangular bottom surface, the external terminals having a plurality of terminal types with different functions, each of which has an outer terminal arranged at an end of the bottom surface and an inner terminal arranged closer to the center of the bottom surface than the outer terminal, the outer terminals and the inner terminals of the same terminal type being directly electrically connected to each other, the outer terminals having a notch at an end closest to the center of the bottom surface, and the inner terminals being arranged at least partially within a notch area that is within the range of the notch.

[0008] The piezoelectric vibration device of the present invention has a plurality of types of external terminals with different roles, and each type of terminal has an outer terminal arranged at one of the corners of the bottom surface and an inner terminal arranged closer to the center of the bottom surface than the outer terminal, and the outer terminals and inner terminals of the same terminal type are directly electrically connected to each other, the outer terminal has a notch at the end closest to the center of the bottom surface, and the inner terminal is arranged at least partially within the notch area that is the range of the notch. With this configuration, the outer terminals can be applied to the mounting pads of an external circuit board of a certain pattern, and the inner terminals can be applied to the mounting pads of an external circuit board of a different pattern. In other words, the same piezoelectric vibration device can be used to handle a plurality of different mounting pad patterns, improving manufacturing efficiency.

[0009] Furthermore, by providing a notch in the outer terminal and locating at least a portion of the inner terminal in the notch area, the size of the piezoelectric vibration device can be made smaller while still being compatible with a number of different mounting pad patterns.

[0010] In addition, the piezoelectric vibrating device of the present invention may be configured such that the outer terminals and the inner terminals of the same terminal type are directly electrically connected inside the package. In this configuration, the outer terminals and the inner terminals can be separated at the bottom of the package, and the conductive bonding material remains in the outer terminal area or the inner terminal area, so that the amount of conductive bonding material is stable and the bonding with the external circuit board related to the conductive bonding can be stabilized. Effect of the Invention

[0011] According to the present invention, it is possible to provide a piezoelectric vibration device that can accommodate a plurality of different mounting pad patterns. [Brief description of the drawings]

[0012] [Figure 1] FIG. 2 is a bottom view of the piezoelectric vibration device according to the first embodiment of the present invention. [Diagram 2] 2 is a cross-sectional view taken along the line AA in FIG. 1, showing a schematic configuration of a piezoelectric vibration device according to an embodiment of the present invention. [Diagram 3] FIG. 2 is a schematic diagram showing how a substrate portion according to an embodiment of the present invention is mounted on an external circuit board. [Figure 4] 13 is a schematic diagram of mounting the board portion according to the embodiment of the present invention on another external circuit board. FIG. [Diagram 5] FIG. 13 is a schematic diagram showing how the substrate portion according to the embodiment of the present invention is mounted on yet another external circuit substrate. [Figure 6] FIG. 5 is a bottom view of a piezoelectric vibration device according to a second embodiment of the present invention. [Figure 7] FIG. 11 is a bottom view of a piezoelectric vibration device according to a third embodiment of the present invention. [Figure 8] FIG. 11 is a bottom view of a piezoelectric vibration device according to a fourth embodiment of the present invention. [Figure 9]FIG. 13 is a bottom view of a piezoelectric vibration device according to a fifth embodiment of the present invention. [Figure 10] FIG. 13 is a bottom view showing a case where the present invention is applied to a two-terminal vibrator. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0014] <First embodiment> FIG. 1 is a bottom view of a piezoelectric vibration device 1 according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA showing a schematic configuration of the piezoelectric vibration device 1 according to the embodiment of the present invention. In this specification, the bottom and top are described with the downward direction in FIG. 2 being the bottom side of package 22 and the upward direction being the top side of package 22. The piezoelectric vibration device 1 of this embodiment has a crystal unit 11 which is a piezoelectric vibrator, an IC 12 incorporating an oscillation circuit, a temperature compensation circuit, and a temperature sensor, and a package 22 which houses them. The piezoelectric vibration device 1 of the present invention is a surface-mounted temperature-compensated oscillator which detects temperature changes in the internal space of the package 22 using a temperature sensor, and generates a compensation voltage for compensating for the frequency-temperature characteristics of the piezoelectric vibrator (crystal unit 11) in accordance with the detected voltage using a compensation voltage generating circuit, thereby controlling the oscillation frequency of the piezoelectric vibrator.

[0015] The crystal unit 11 has a thin plate shape and is made of crystal. A pair of excitation electrodes formed on the surface of the crystal unit 11 are bonded to a pair of electrodes 25 for mounting the crystal unit on the upper surface of the step of the storage recess 21 in the internal space of the package 22 by a conductive adhesive 26. The crystal unit 11 thus mounted functions as a piezoelectric vibrator. The crystal unit 11 may have a known cutting direction and shape such as AT cut, SC cut, or tuning fork, and may have a laminated structure with a vibrating part hermetically sealed.

[0016] The IC 12 includes a temperature sensor and a compensation voltage generating circuit as electronic components, which are fixed to an integrated circuit board, for example, via a conductive adhesive such as solder.

[0017] The package 22 includes a base 30 that is open at the top, a lid 24 that is bonded to the upper surface of the base 30 to cover the opening, and a sealing member 23 that bonds the base 30 and the lid 24 together.

[0018] The base 30 has a substrate 31 having a substantially rectangular shape in plan view, a first frame 32 protruding upward along the outer periphery of one main surface side (first main surface side, upper surface side) of the substrate 31, and a second frame 33 protruding upward along the outer periphery of the first frame 32. The substrate 31, the first frame 32, and the second frame 33 form a storage recess 21. The base 30 (substrate 31, first frame 32, and second frame 33) in this embodiment are made of ceramic. Therefore, the package 22 has an internal space (storage recess 21) that is open at the top.

[0019] The storage recess 21 has a bottom 35 and a step 36 disposed above the bottom 35. Furthermore, an IC 12 is provided on the bottom 35, and a crystal unit 11 is provided on the step 36. That is, the storage recess 21 stores the IC 12 and the crystal unit 11. Furthermore, the upper opening of the storage recess 21 is covered (blocked) by a lid 24, and the storage recess 21 is maintained in an airtight sealed state.

[0020] The bottom 35 is formed by the upper surface of the substrate portion 31 of the base 30, and includes an IC mounting electrode 27. The IC mounting electrode 27 and the IC 12 are joined by bumps 38. In this embodiment, the IC 12 is mounted on the IC mounting electrode 27 by flip chip bonding. Note that the mounting of the IC 12 on the bottom 35 (package 22) is not limited to flip chip bonding (electrical mechanical bonding), and may be performed by combining, for example, die bonding (mechanical bonding) and wire bonding (electrical bonding).

[0021] The step portion 36 is formed by the upper surface of the first frame portion 32 of the base 30, and is provided with an oscillator mounting electrode 25. The oscillator mounting electrode 25 and the quartz oscillator 11 are joined by a conductive adhesive 26.

[0022] The substrate 31 is generally rectangular in shape with arc-shaped cutouts at the corners in plan view, and generally rectangular in shape with cutouts on the side surfaces of the four corners. The substrate 31 is disposed at the lowest part of the package 22. Therefore, the lower surface of the substrate 31 corresponds to the bottom surface of the package 22. The substrate 31 has an IC mounting electrode 27 on its upper surface (first main surface), and a first frame portion 32 protrudes from its outer periphery. The substrate 31 also has external terminals 41, 42, 43, 44 as electrodes at the respective corners of its lower surface (second main surface), an outer terminal via hole 34a at a position overlapping with the outer terminals 41a, 42a, 43a, 44a of the external terminals 41, 42, 43, 44, and an inner terminal via hole 34b at a position overlapping with the inner terminals 41b, 42b, 43b, 44b of the external terminals 41, 42, 43, 44. The outer terminal via hole 34a and the inner terminal via hole 34b are configured such that a metal material is filled in a through hole.

[0023] The external terminals 41, 42, 43, and 44 are electrodes, and are arranged at four different corners on the lower surface of the substrate 31 (bottom surface of the package 22), one for each. The external terminals 41, 42, 43, and 44 are electrically connected to the crystal unit 11 and / or the IC 13 by wiring (not shown). In this embodiment, the external terminals 41, 42, 43, and 44 are configured as a first ground terminal (external terminal 41), a power terminal (external terminal 42), a second ground terminal (external terminal 43), and an output terminal (external terminal 44). That is, in this embodiment, the external terminals have a ground terminal, a power terminal, and an output terminal as terminal types. The four external terminals 41, 42, 43, and 44 are arranged at each of the regions divided into four by the center lines of each side on the lower surface of the substrate 31 (bottom surface of the package 22).

[0024] The first ground terminal (external terminal 41) has a first ground outer terminal 41a and a first ground inner terminal 41b. The first ground outer terminal 41a has a shape that is substantially rectangular in shape with two sides formed along the ends of the bottom surface in a plan view, and has a notch 41i formed at a corner closest to the center O of the bottom surface so that the outer shape is a circular arc-shaped concave. The first ground outer terminal 41a is drawn upward from a notch provided at a corner of the substrate portion 31 as a castellation C1 via a side surface.

[0025] The first ground inner terminal 41b has a circular shape in a plan view. The first ground inner terminal 41b is arranged so that at least a portion of the first ground inner terminal 41b is within a cutout region 41d that corresponds to the range of the cutout 41i. Therefore, the first ground inner terminal 41b is arranged closer to the center O than the first ground outer terminal 41a on the bottom surface of the substrate 31. More specifically, the first ground inner terminal 41b is arranged closer to the center O than the first ground outer terminal 41a on the bottom surface of the substrate 31 when viewed from both the short side and the long side.

[0026] The first ground outer terminal 41a and the first ground inner terminal 41b are directly electrically connected to each other inside the package 22 by the outer terminal via hole 34a and the inner terminal via hole 34b. On the other hand, in this embodiment, the first ground outer terminal 41a and the first ground inner terminal 41b are not connected on the bottom surface of the substrate portion 31, but are arranged with an insulating region between them.

[0027] The first outer ground terminal 41a and the first inner ground terminal 41b are disposed adjacent to each other in the same area among four areas set on the lower surface of the substrate portion 31 (the bottom surface of the package 22) divided by the center lines of each side.

[0028] In addition, the first ground outer terminal 41a and the first ground inner terminal 41b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 41e) of the first ground outer terminal 41a is formed along the outer shape of the end (inner terminal end 41f) of the facing first ground inner terminal 41b. In other words, the outer shape of the cutout region 41d is formed along the outer shape of the end (inner terminal end 41f) of the facing first ground inner terminal 41b. With this configuration, the distance between the first ground outer terminal 41a (outer terminal) and the first ground inner terminal 41b (inner terminal) can be made as close as possible. That is, it is possible to correspond to a closer pattern even among different mounting pads.

[0029] The power supply terminal (external terminal 42) has a power supply outer terminal 42a and a power supply inner terminal 42b. The power supply outer terminal 42a has a shape in which a notch 42i is formed so that the outer shape is a circular arc-shaped recess at the corner closest to the center O of the bottom surface of a substantially rectangular shape in a plan view, as seen from above. The power supply outer terminal 42a is drawn upward from a notch provided at the corner of the substrate portion 31 as a castellation C2 via the side surface.

[0030] The power supply inner terminal 42b has a circular shape in a plan view. The power supply inner terminal 42b is arranged so that at least a portion of it is within a cutout region 42d that corresponds to the range of the cutout 42i. Therefore, the power supply inner terminal 42b is arranged closer to the center O than the power supply outer terminal 42a on the bottom surface of the substrate 31. More specifically, the power supply inner terminal 42b is arranged closer to the center O than the power supply outer terminal 42a on the bottom surface of the substrate 31 when viewed from both the short side and long side.

[0031] Furthermore, the power supply outer terminal 42a and the power supply inner terminal 42b are directly electrically connected to each other inside the package 22 by the outer terminal via hole 34a and the inner terminal via hole 34b. On the other hand, in this embodiment, the power supply outer terminal 42a and the power supply inner terminal 42b are not connected on the bottom surface of the substrate portion 31, but are arranged via an insulating region.

[0032] Further, the outer power supply terminal 42a and the inner power supply terminal 42b are disposed adjacent to each other in the same area among four areas set by dividing the lower surface of the substrate portion 31 (the bottom surface of the package 22) by the center lines of each side.

[0033] In addition, the power supply outer terminal 42a and the power supply inner terminal 42b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 42e) of the power supply outer terminal 42a is formed along the outer shape of the end (inner terminal end 42f) of the power supply inner terminal 42b facing it. In other words, the outer shape of the cutout area 42d is formed along the outer shape of the end (inner terminal end 42f) of the power supply inner terminal 42b facing it. With this configuration, the distance between the power supply outer terminal 42a (outer terminal) and the power supply inner terminal 42b (inner terminal) can be made as close as possible. In other words, it is possible to correspond to a closer pattern among different mounting pad patterns.

[0034] The second ground terminal (external terminal 43) has a second ground outer terminal 43a and a second ground inner terminal 43b. The second ground outer terminal 43a has a shape in which a notch 43i is formed so that the outer shape is a circular arc-shaped recess at the corner closest to the center O of the bottom surface of the substantially rectangular shape in a plan view, when viewed from above. The second ground outer terminal 43a also has a positioning terminal 43g for positioning that protrudes from the outer periphery. The second ground outer terminal 43a is also drawn upward from a notch provided at the corner of the substrate portion 31 as a castellation C3 via the side surface.

[0035] The second ground inner terminal 43b has a circular shape in a plan view. The second ground inner terminal 43b is arranged so that at least a portion of the second ground inner terminal 43b is within a cutout region 43d that corresponds to the range of the cutout 43i. Therefore, the second ground inner terminal 43b is arranged closer to the center O than the second ground outer terminal 43a on the bottom surface of the substrate 31. More specifically, the second ground inner terminal 43b is arranged closer to the center O than the second ground outer terminal 43a on the bottom surface of the substrate 31 when viewed from both the short side and the long side.

[0036] The second ground outer terminal 43a and the second ground inner terminal 43b are directly electrically connected to each other inside the package 22 by the outer terminal via hole 34a and the inner terminal via hole 34b. On the other hand, in this embodiment, the second ground outer terminal 43a and the second ground inner terminal 43b are not connected on the bottom surface of the substrate portion 31, but are arranged with an insulating region between them.

[0037] The second outer ground terminal 43a and the second inner ground terminal 43b are disposed adjacent to each other in the same area among four areas set by dividing the lower surface of the substrate portion 31 (the bottom surface of the package 22) by the center lines of each side.

[0038] In addition, the second ground outer terminal 43a and the second ground inner terminal 43b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 43e) of the second ground outer terminal 43a is formed along the outer shape of the end (inner terminal end 43f) of the facing second ground inner terminal 43b. In other words, the outer shape of the cutout region 43d is formed along the outer shape of the end (inner terminal end 43f) of the facing second ground inner terminal 43b. With this configuration, the distance between the second ground outer terminal 43a (outer terminal) and the second ground inner terminal 43b (inner terminal) can be made as close as possible. That is, it is also possible to accommodate patterns that are closer to each other even among different mounting pads.

[0039] The output terminal (external terminal 44) has an output outer terminal 44a and an output inner terminal 44b. The output outer terminal 44a has a shape in which a notch 44i is formed so that the outer shape is a circular arc-shaped concave at the corner closest to the center O of the bottom surface from a substantially rectangular shape in a plan view, as shown in FIG. 1. The output outer terminal 44a is drawn upward from a notch provided at the corner of the substrate portion 31 as a castellation C4 via the side surface.

[0040] The output inner terminal 44b has a circular shape in a plan view. The output inner terminal 44b is arranged so that at least a portion of it is within a cutout region 44d that corresponds to the range of the cutout 44i. Therefore, the output inner terminal 44b is arranged closer to the center O than the output outer terminal 44a on the bottom surface of the substrate 31. More specifically, the output inner terminal 44b is arranged closer to the center O than the output outer terminal 44a on the bottom surface of the substrate 31 when viewed from both the short side and the long side.

[0041] Moreover, the output outer terminal 44a and the output inner terminal 44b are directly electrically connected to each other inside the package 22 by the outer terminal via hole 34a and the inner terminal via hole 34b. On the other hand, in this embodiment, the output outer terminal 44a and the output inner terminal 44b are not connected on the bottom surface of the substrate portion 31, but are arranged via an insulating region.

[0042] Moreover, the output outer terminal 44a and the output inner terminal 44b are disposed adjacent to each other in the same area among four areas set by dividing the lower surface of the substrate portion 31 (the bottom surface of the package 22) by the center lines of each side.

[0043] In addition, the output outer terminal 44a and the output inner terminal 44b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 44e) of the output outer terminal 44a is formed along the outer shape of the end (inner terminal end 44f) of the output inner terminal 44b facing it. In other words, the outer shape of the cutout region 44d is formed along the outer shape of the end (inner terminal end 44f) of the output inner terminal 44b facing it. With this configuration, the distance between the output outer terminal 44a (outer terminal) and the output inner terminal 44b (inner terminal) can be made as close as possible. In other words, it can also accommodate patterns that are closer to each other even among different mounting pads.

[0044] The first frame portion 32 has a generally rectangular frame shape in a plan view, and is formed to have approximately the same outer size as the substrate portion 31. The first frame portion 32 also has a vibrator mounting electrode 25 on the upper surface, and a second frame portion 33 is provided protruding from the outer periphery.

[0045] The second frame portion 33 protrudes upward along the outer periphery of the first frame portion 32. The second frame portion 33 has a generally rectangular frame shape in a plan view, and is formed to have an outer size substantially the same as those of the substrate portion 31 and the first frame portion 32, but a width smaller than that of the first frame portion 32. Therefore, when the base 30 is viewed from above, the upper surface of the first frame portion 32 is visible. The second frame portion 33 is joined to the lid 24 by the sealing member 23 on the upper surface.

[0046] The lid 24 is a thin plate having a rectangular shape in a plan view, and its outer periphery is joined to the second frame portion 33 by a sealing member 23 so as to cover (close) the opening of the storage recess 21. The lid 24 may be made of, for example, ceramic, glass, or metal. In this embodiment, the lid 24 is the member disposed at the topmost position in the package 22. Therefore, the upper surface of the lid 24 becomes the upper surface (top surface) of the package 22.

[0047] The sealing member 23 can be formed in an appropriate sealing form depending on the material forming the lid 24. For example, when the lid 24 is made of metal, the sealing member 23 may be configured by forming a nickel-plated layer or a gold-plated layer on the upper surface of a metallized layer made of tungsten, molybdenum, or the like, or may be configured to include a brazing material such as gold-tin or silver, a seam ring provided with a predetermined plated metal film, or the like.

[0048] FIG. 3 is a schematic diagram of mounting the substrate portion 31 according to an embodiment of the present invention onto an external circuit board 50, FIG. 4 is a schematic diagram of mounting the substrate portion 31 according to an embodiment of the present invention onto another external circuit board 150, and FIG. 5 is a schematic diagram of mounting the substrate portion 31 according to an embodiment of the present invention onto yet another external circuit board 250. The piezoelectric vibration device 1 of the present invention can be mounted (implemented) on an external circuit board stored inside an electronic device. For example, a certain external circuit board 50 (first external circuit board 50) has mounting pads 51 and 52 corresponding to the piezoelectric vibration device 1. In the piezoelectric vibration device 1, the first ground outer terminal 41a of the substrate part 31 is bonded to the mounting pad 51 arranged at a corresponding position on the external circuit board 50 by a conductive bonding material 60 such as solder. In addition, the power supply outer terminal 42a is bonded to the mounting pad 52 arranged at a corresponding position on the external circuit board 50 by a conductive bonding material 60. Furthermore, the second ground outer terminal 43a and the output outer terminal 44a are also bonded to mounting pads (not shown) arranged at corresponding positions on the external circuit board 50 by the conductive bonding material 60.

[0049] Also, for example, another external circuit board 150 (second external circuit board 150) has mounting pads 151 and 152 corresponding to the piezoelectric vibration device 1. In the piezoelectric vibration device 1, the first ground inner terminal 41b of the substrate part 31 is bonded to the mounting pad 151 arranged at a corresponding position on the second external circuit board 150 by a conductive bonding material 60 such as solder. Also, the power supply inner terminal 42b is bonded to the mounting pad 152 arranged at a corresponding position on the second external circuit board 150 by a conductive bonding material 60. Furthermore, the second ground inner terminal 43b and the output inner terminal 44b are also bonded to mounting pads (not shown) arranged at corresponding positions on the second external circuit board 150 by the conductive bonding material 60.

[0050] That is, the piezoelectric vibration device 1 of the present invention applies outer terminals (first ground outer terminal 41a, power outer terminal 42a, second ground outer terminal 43a, and output outer terminal 44a) to the mounting pads of the first external circuit board 50, and applies inner terminals (first ground inner terminal 41b, power inner terminal 42b, second ground inner terminal 43b, and output inner terminal 44b) to the mounting pads of the second external circuit board 150, whose mounting pad positions are different from those of the first external circuit board 50. The corresponding outer terminals and inner terminals are electrically connected by the outer terminal via hole 34a, the inner terminal via hole 34b, and the top surface terminals that connect these via holes. Therefore, the piezoelectric vibration device 1 of the present invention exerts the same function as a piezoelectric vibration device whether it is mounted on the first external circuit board 50 or the second external circuit board 150. The top surface terminal is arranged on the top surface of the substrate portion 31, and directly electrically connects an outer terminal via hole 34a connected to a certain type of outer terminal and an inner terminal via hole 34b connected to the same type of inner terminal.

[0051] Also, for example, another external circuit board 250 (third external circuit board 350) has mounting pads 251, 252 corresponding to the piezoelectric vibration device 1. In the piezoelectric vibration device 1, the first ground outer terminal 41a and the first ground inner terminal 41b of the substrate part 31 are joined to the mounting pads 251 arranged at corresponding positions on the third external circuit board 350 by a conductive bonding material 60 such as solder. Also, the power supply outer terminal 42a and the power supply inner terminal 42b are joined to the mounting pads 252 arranged at corresponding positions on the third external circuit board 250 by a conductive bonding material 60. Furthermore, the second ground outer terminal 43a and the second ground inner terminal 43b, and the output outer terminal 44a and the output inner terminal 44b are also joined to mounting pads (not shown) arranged at corresponding positions on the third external circuit board 250 by a conductive bonding material 60. Even when the mounting pads of the external circuit board are bonded to both the outer terminals and the inner terminals in this manner, the same function is exhibited as when mounted on the first external circuit board 50 and the second external circuit board 150.

[0052] <Second embodiment> FIG. 6 is a bottom view of the piezoelectric vibration device according to the second embodiment of the present invention. In the second embodiment, the configuration other than the lower surface of the substrate portion (the bottom surface of the piezoelectric vibration device) is the same as in the first embodiment, and therefore a description thereof will be omitted. In the second embodiment, the substrate 231 includes an outer connection 241h that electrically connects the first ground outer terminal 241a and the first ground inner terminal 241b, an outer connection 242h that electrically connects the power outer terminal 242a and the power inner terminal 242b, an outer connection 243h that electrically connects the second ground outer terminal 243a and the second ground inner terminal 243b, and an outer connection 244h that electrically connects the output outer terminal 244a and the output inner terminal 244b. The outer connection parts 241h, 242h, 243h, and 244h are all provided on the lower surface of the substrate 231 (the bottom surface of the piezoelectric vibration device in the second embodiment).

[0053] The outer surface connection parts 241h, 242h, 243h, and 244h may not be provided for all of the external terminals 41, 42, 43, and 44, and may be provided for one or more of the four external terminals 41, 42, 43, and 44, for example. Also, for the external terminals 241, 242, 243, and 244 provided with the outer surface connection parts 241h, 242h, 243h, and 244h, it is not necessary to provide via holes (the outer terminal via holes 34a and the inner terminal via holes 34b in the first embodiment). With this configuration, it is not necessary to provide via holes (the outer terminal via holes 34a and the inner terminal via holes 34b in the first embodiment) inside the substrate part 231, and productivity can be improved.

[0054] <Third embodiment> FIG. 7 is a bottom view of the piezoelectric vibration device according to the third embodiment of the present invention. In the third embodiment, the configuration other than the lower surface of the substrate portion (the bottom surface of the piezoelectric vibration device) is the same as in the first embodiment, and therefore a description thereof will be omitted. In the third embodiment, the first ground outer terminal 341a provided on the substrate portion 331 has a generally rectangular shape with two sides extending along the ends of the bottom surface in a plan view, and has a rectangular notch 341i formed at the corner closest to the center O of the bottom surface so that the outer shape is concave.

[0055] The first ground inner terminal 341b has a rectangular shape in a plan view. The first ground inner terminal 341b is arranged such that at least a portion of the first ground inner terminal 341b is within a cutout region 341d corresponding to the range of the cutout 341i. Therefore, the first ground inner terminal 341b is arranged closer to the center O than the first ground outer terminal 341a on the bottom surface of the substrate 331. More specifically, the first ground inner terminal 341b is arranged closer to the center O than the first ground outer terminal 341a on the bottom surface of the substrate 331 when viewed from both the short side and the long side.

[0056] In addition, the first ground outer terminal 341a and the first ground inner terminal 341b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 341e) of the first ground outer terminal 341a is formed along the outer shape of the end (inner terminal end 341f) of the facing first ground inner terminal 341b. In other words, the outer shape of the cutout region 341d is formed along the outer shape of the end (inner terminal end 341f) of the facing first ground inner terminal 341b.

[0057] In addition, in the third embodiment, the power supply outer terminal 342a provided on the substrate portion 331 has a shape in which a rectangular notch 342i is formed so that the outer shape is concave at the corner closest to the center O of the bottom surface, from a roughly rectangular shape with two sides formed along the edge of the bottom surface in a plan view.

[0058] The power supply inner terminal 342b has a rectangular shape in a plan view. The first ground inner terminal 341b is arranged so that at least a portion of it is within a cutout region 342d that corresponds to the range of the cutout 342i. Therefore, the power supply inner terminal 342b is arranged closer to the center O than the power supply outer terminal 342a on the bottom surface of the substrate 331. More specifically, the power supply inner terminal 342b is arranged closer to the center O than the power supply outer terminal 342a on the bottom surface of the substrate 331 when viewed from both the short side and long side.

[0059] In addition, the power supply outer terminal 342a and the power supply inner terminal 342b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 342e) of the power supply outer terminal 342a is formed along the outer shape of the end (inner terminal end 342f) of the opposing power supply inner terminal 342b. In other words, the outer shape of the cutout region 342d is formed along the outer shape of the end (inner terminal end 342f) of the opposing power supply inner terminal 342b.

[0060] In addition, in the third embodiment, the second ground outer terminal 343a provided on the substrate portion 331 has a shape in which a rectangular notch 343i is formed so that the outer shape is concave at the corner closest to the center O of the bottom surface, from a generally rectangular shape with two sides formed along the ends of the bottom surface in a plan view.

[0061] The second ground inner terminal 343b has a rectangular shape in a plan view. The second ground inner terminal 343b is arranged such that at least a portion of the second ground inner terminal 343b is within a cutout region 343d corresponding to the range of the cutout 343i. Therefore, the second ground inner terminal 343b is arranged closer to the center O than the second ground outer terminal 343a on the bottom surface of the substrate 331. More specifically, the second ground inner terminal 343b is arranged closer to the center O than the second ground outer terminal 343a on the bottom surface of the substrate 331 when viewed from both the short side and the long side.

[0062] In addition, the second ground outer terminal 343a and the second ground inner terminal 343b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 343e) of the second ground outer terminal 343a is formed along the outer shape of the end (inner terminal end 343f) of the facing second ground inner terminal 343b. In other words, the outer shape of the cutout region 343d is formed along the outer shape of the end (inner terminal end 343f) of the facing second ground inner terminal 343b.

[0063] In addition, in the third embodiment, the output outer terminal 344a provided on the substrate portion 331 has a shape in which a rectangular notch 344i is formed so that the outer shape is concave at the corner closest to the center O of the bottom surface, from a roughly rectangular shape with two sides formed along the ends of the bottom surface in a plan view.

[0064] Moreover, the output inner terminal 344b has a rectangular shape in a plan view. Moreover, the output inner terminal 344b is arranged so that at least a portion of it is within a cutout region 344d that corresponds to the range of the cutout 344i. Therefore, the output inner terminal 344b is arranged closer to the center O than the output outer terminal 344a on the bottom surface of the substrate portion 331. More specifically, the output inner terminal 344b is arranged closer to the center O than the output outer terminal 344a on the bottom surface of the substrate portion 331 when viewed from both the short side and the long side.

[0065] In addition, the output outer terminal 344a and the output inner terminal 344b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 344e) of the output outer terminal 344a is formed along the outer shape of the end (inner terminal end 344f) of the opposing output inner terminal 344b. In other words, the outer shape of the cutout region 344d is formed along the outer shape of the end (inner terminal end 344f) of the opposing output inner terminal 344b.

[0066] <Fourth embodiment> FIG. 8 is a bottom view of a piezoelectric vibration device according to a fourth embodiment of the present invention. In the fourth embodiment, the configuration other than the lower surface of the substrate portion (the bottom surface of the piezoelectric vibration device) is the same as in the first embodiment, and therefore a description thereof will be omitted. In the fourth embodiment, the first ground outer terminal 441a provided on the substrate portion 431 has a shape in which a rectangular notch 441i is formed so that the outer shape is concave at the corner closest to the center O of the bottom surface, from a generally rectangular shape having two sides formed along the edges of the bottom surface in a plan view.

[0067] The first ground inner terminal 441b has a key shape in a plan view. The first ground inner terminal 441b is arranged such that at least a portion of the first ground inner terminal 441b is within a cutout region 441d corresponding to the range of the cutout 441i. Therefore, the first ground inner terminal 441b is arranged closer to the center O than the first ground outer terminal 441a on the bottom surface of the substrate 431. More specifically, the first ground inner terminal 441b is arranged closer to the center O than the first ground outer terminal 441a on the bottom surface of the substrate 431 when viewed from both the short side and the long side.

[0068] In addition, the first ground outer terminal 441a and the first ground inner terminal 441b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 441e) of the first ground outer terminal 441a is formed along the outer shape of the end (inner terminal end 441f) of the facing first ground inner terminal 441b. In other words, the outer shape of the cutout region 441d is formed along the outer shape of the end (inner terminal end 441f) of the facing first ground inner terminal 441b.

[0069] In addition, in the fourth embodiment, the power supply outer terminal 442a provided on the substrate portion 431 has a shape in which a rectangular notch 442i is formed so that the outer shape is concave at the corner closest to the center O of the bottom surface, from a roughly rectangular shape with two sides formed along the edge of the bottom surface when viewed in a plan view.

[0070] Moreover, the power supply inner terminal 442b has a key shape in a plan view. Moreover, the power supply inner terminal 442b is arranged so that at least a part of it is within a cutout region 442d corresponding to the range of the cutout 442i. Therefore, the power supply inner terminal 442b is arranged closer to the center O than the power supply outer terminal 442a on the bottom surface of the substrate part 431. More specifically, the power supply inner terminal 442b is arranged closer to the center O than the power supply outer terminal 442a on the bottom surface of the substrate part 431 when viewed from both the short side and the long side.

[0071] In addition, the power supply outer terminal 442a and the power supply inner terminal 442b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 442e) of the power supply outer terminal 442a is formed along the outer shape of the end (inner terminal end 442f) of the opposing power supply inner terminal 442b. In other words, the outer shape of the cutout region 442d is formed along the outer shape of the end (inner terminal end 442f) of the opposing power supply inner terminal 442b.

[0072] In addition, in the fourth embodiment, the second ground outer terminal 443a provided on the substrate portion 431 has a shape that, in a plan view, is roughly rectangular with two sides formed along the ends of the bottom surface, but has a rectangular notch 443i formed at the corner closest to the center O of the bottom surface so that the outer shape is concave.

[0073] The second ground inner terminal 443b has a key shape in a plan view. The second ground inner terminal 443b is arranged such that at least a portion of the second ground inner terminal 443b is within a cutout region 443d corresponding to the range of the cutout 443i. Therefore, the second ground inner terminal 443b is arranged closer to the center O than the second ground outer terminal 443a on the bottom surface of the substrate 431. More specifically, the second ground inner terminal 443b is arranged closer to the center O than the second ground outer terminal 443a on the bottom surface of the substrate 431 when viewed from both the short side and the long side.

[0074] In addition, the second ground outer terminal 443a and the second ground inner terminal 443b in this embodiment are formed such that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 443e) of the second ground outer terminal 443a is formed along the outer shape of the end (inner terminal end 443f) of the opposing second ground inner terminal 443b. In other words, the outer shape of the cutout region 443d is formed along the outer shape of the end (inner terminal end 443f) of the opposing second ground inner terminal 443b.

[0075] In addition, in the fourth embodiment, the output outer terminal 444a provided on the substrate portion 431 has a shape in which a rectangular notch 444i is formed so that the outer shape is concave at the corner closest to the center O of the bottom surface, from a roughly rectangular shape in a plan view with two sides formed along the edge of the bottom surface.

[0076] Moreover, the output inner terminal 444b has a key shape in a plan view. Moreover, the output inner terminal 444b is arranged so that at least a part of it is within a cutout region 444d corresponding to the range of the cutout 444i. Therefore, the output inner terminal 444b is arranged closer to the center O than the output outer terminal 444a on the bottom surface of the substrate portion 431. More specifically, the output inner terminal 444b is arranged closer to the center O than the output outer terminal 444a on the bottom surface of the substrate portion 431 when viewed from both the short side and the long side.

[0077] In addition, the output outer terminal 444a and the output inner terminal 444b in this embodiment are formed so that the outer shapes at the positions where they face each other are aligned with each other's outer shapes. In other words, the outer shape of the end (outer terminal end 444e) of the output outer terminal 444a is formed along the outer shape of the end (inner terminal end 444f) of the opposing output inner terminal 444b. In other words, the outer shape of the cutout region 444d is formed along the outer shape of the end (inner terminal end 444f) of the opposing output inner terminal 444b.

[0078] <Fifth embodiment> FIG. 9 is a bottom view of a piezoelectric vibration device according to a fifth embodiment of the present invention. In the fifth embodiment, the configuration other than the lower surface of the substrate portion (the bottom surface of the piezoelectric vibration device) is the same as in the first embodiment, and therefore a description thereof will be omitted. In this embodiment, a recess 532 is formed in the bottom 531. A pad for mounting a temperature sensor (thermistor) is formed in the recess 532, and a temperature sensor 534 (thermistor) is mounted on the pad.

[0079] The pad for mounting the temperature sensor (thermistor) is provided with a plurality of temperature sensor mounting terminals 533a, 533b, which are electrically connected to the terminals of the temperature sensor (not shown). The temperature sensor mounting terminals 533a, 533b can be configured such that one of them is connected to one of the plurality of external terminals (541, 542, 543, 544) provided on the bottom 531 via an electrode passing through the inside of the package, and the other is connected to one of the external terminals (541, 542, 543, 544) different from the external terminal to which the other is connected via an electrode passing through the inside of the package.

[0080] Further, each of the external terminals (541, 542, 543, 544) includes an outer terminal (541a, 542a, 543a, 544a) and an inner terminal (541b, 542b, 543b, 544b). In this case, the temperature sensor mounting terminals 533a, 533b can be configured to be electrically connected to at least one of the outer terminal and the inner terminal.

[0081] It should be noted that the present invention is not limited to the configurations of the above-described embodiments, and many other embodiments can be obtained. For example, the piezoelectric vibration device 1 in each embodiment is a temperature compensated oscillator having an IC 12 equipped with a temperature sensor inside the package 22, but it may be an oscillator without a temperature sensor or a temperature compensation function, or it may be a vibrator without an IC. When the piezoelectric vibration device 1 is a vibrator, as an example of the function and arrangement of each external terminal, the input terminal and the output terminal can be arranged diagonally to each other, and two ground terminals can be arranged diagonally to the other.

[0082] FIG. 10 is a bottom view of the case where the present invention is applied to a two-terminal vibrator. Furthermore, when the piezoelectric vibration device 1 is used as a vibrator, it may be configured to have two external terminals 641, 642 with different functions on the bottom 631. In such a case, for example, it may be configured to have one external terminal 641 arranged on one short side of the bottom surface, and the other external terminal 642 arranged on the other short side.

[0083] Further, the external terminals 641 and 642 of this embodiment have outer terminals 641a and 642a and inner terminals 641b and 642b, respectively. In this case, the outer terminal 641a has a notch 641i at an end portion on the center side of the bottom 631, and the corresponding inner terminal 641b is disposed so that a part of it is included in the notch region 641d. Similarly, the outer terminal 642a has a notch 642i at an end portion on the center side of the bottom 631, and the corresponding inner terminal 642b is disposed so that a part of it is included in the notch region 642d.

[0084] For example, the external terminals in each embodiment are configured to have a ground terminal, a power terminal, and an output terminal as terminal types, but may be terminal types other than those exemplified in each embodiment, and may be external terminals having functions different from those of the external terminals in each embodiment. In addition, in this embodiment, the first ground terminal and the second ground terminal are configured to be arranged side by side on the short side of the bottom, but the first ground terminal and the second ground terminal may be arranged diagonally on the bottom, or side by side on the long side. In other words, the terminal types of the external terminals can be appropriately selected from known types depending on the application and mounting destination of the piezoelectric vibration device, and the arrangement of the external terminals on the bottom (selection of corners on the bottom) can be appropriately changed depending on the application and mounting destination of the piezoelectric vibration device. The embodiments disclosed herein are illustrative in all respects and are not intended to be limiting. Therefore, the technical scope of the present invention is not interpreted solely by the above-described embodiments, but is defined by the claims. Also, all modifications within the scope and meaning equivalent to the claims are included. [Industrial Applicability]

[0085] The piezoelectric vibration device of the present invention can be used in the industry of manufacturing and selling surface-mount type piezoelectric vibration devices. [Explanation of symbols]

[0086] 1. Piezoelectric vibration device 11...Crystal resonator 12…IC 21…Storage recess 22…Package 23...Sealing member 24…Lid 25...Electrode for mounting vibrator 26...Conductive adhesive 27…IC mounting electrode 28…Bump 30…Bass 31... Circuit board 32…First frame section 33…Second frame section 34a…Outer terminal via hole 34b…Inner terminal via hole 41…First ground terminal 41a…First outer ground terminal 41b…First ground inner terminal 42…Power terminal 42a...Power supply outer terminal 42b…Power supply inner terminal 43...Second ground terminal 43a…Second ground outer terminal 43b…Second ground inner terminal 44...Output terminal 44a…Output outer terminal 44b…Output inner terminal 41d, 42d, 43d, 44d…Notched area 41e, 42e, 43e, 44e...Outer terminal end 41f, 42f, 43f, 44f...Inner terminal end 41i, 42i, 43i, 44i...Notch

Claims

1. A piezoelectric vibrator; a package that houses the piezoelectric vibrator; the package has a plurality of external terminals on a substantially rectangular bottom surface; The external terminal is It has multiple terminal types with different functions, Each of the terminal types has an outer terminal disposed on an end side of the bottom surface and an inner terminal disposed closer to the center of the bottom surface than the outer terminal, The outer terminals and the inner terminals of the same terminal type are directly electrically connected to each other, the outer terminal has a notch at an end closest to the center of the bottom surface; The inner terminal is disposed at least partially within a cutout area that is within the cutout. Piezoelectric vibration device.

2. The outer terminals and the inner terminals of the same terminal type are directly electrically connected inside the package.

2. The piezoelectric vibration device according to claim 1.

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