Chip

Abstract

To provide a chip.SOLUTION: A chip according to the present invention is flip-chip bonded to a circuit board. The chip has at least one bump and at least one support member. The support member protrudes from the active surface of the chip and is located between the bump and a first side edge of the active surface. The support member is used to support the leads of the circuit board, preventing the leads from contacting metal burrs protruding from the active surface or from contacting metal cut surfaces exposed on the side walls of the chip, thereby preventing short circuits or electrical abnormalities from occurring in the leads and the chip.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a chip, and more particularly to a chip that can prevent a situation in which leads of a circuit board come into contact with metal burrs or cut metal surfaces of the chip. [Background technology]

[0002] In the scribing process, a tool (not shown) scribes the wafer 10 along scribe lines 11, and breaks the wafer 10 into multiple chips 12 (see FIGS. 1 and 2). The tool cuts the metal layer (e.g., circuits and marks) located at the scribe lines 11, and the metal layer forms a metal cut surface 14 on the sidewall 13 of the chip 12. The metal layer is ductile, and the metal cut surface 14 generates a metal burr 16 that protrudes onto the active surface 15. Summary of the Invention [Problem to be solved by the invention]

[0003] As shown in FIG. 2, when leads 21 of a circuit board are joined to bumps 17 of chip 12, leads 21 may come into contact with cut metal surface 14 or metal burrs 16, possibly causing a short circuit or electrical abnormality.

[0004] Therefore, the present inventors believed that the above-mentioned drawbacks could be improved, and as a result of extensive research, they came to propose the present invention, which effectively improves the above-mentioned problems through rational design.

[0005] The present invention has been made in view of the above, and has an object to provide a chip in which the leads of a circuit board are supported by at least one support member protruding from an active surface thereof. [Means for solving the problem]

[0006] In order to solve the above problems, a chip according to one embodiment of the present invention includes at least one bump and at least one support member. The bump is disposed on an active surface and is used to join a lead of a circuit board. The support member is disposed on the active surface and is used to support the lead. The support member is located between the bump and a first side edge of the active surface, and the bump and the support member protrude into the active surface. A first height of the bump is equal to or greater than a second height of the support member.

[0007] When bonding the bumps to the leads, a support member protruding from the active surface is used to support the leads, and by suspending the leads above a first side edge of the active surface, the leads are prevented from coming into contact with metal cut surfaces or metal burrs located on the first side edge, which could cause shorts or electrical abnormalities. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view showing a conventional wafer. [Diagram 2] FIG. 1 is a cross-sectional view showing a conventional chip. [Diagram 3] FIG. 1 is a plan view of a portion of a chip according to an embodiment of the present invention. [Figure 4] 1 is a cross-sectional view showing a chip according to an embodiment of the present invention. [Diagram 5] FIG. 1 is a plan view of a portion of a chip according to an embodiment of the present invention. [Figure 6] 1 is a cross-sectional view showing a chip according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments of the present invention will be described in detail. However, the present invention is not limited to these, and various modifications are possible within the scope of the description. The technical scope of the present invention also includes embodiments obtained by appropriately combining the technical means disclosed in the different embodiments.

[0010] A wafer (not shown) has a plurality of chips 100 formed thereon after scribing, each of which has an active surface 110, at least one bump 120, at least one support member 130, a metal layer 140, a protective layer 150, and at least one circuit layer 160 (see FIGS. 3 and 4). The bumps 120 and the support member 130 are disposed on the active surface 110, and the bumps 120 are located in bump setting areas 112 of the active surface 110 and protrude into the active surface 110, and are used to bond leads 210 of a circuit board 200. The chips are flip-chip bonded to the circuit board.

[0011] As shown in Figures 3 and 4, the metal layer 140 has a plurality of conductive pads 141, a seal ring 142, and at least one mark 143. In this embodiment, the mark 143 is located on a scribe line (not shown) of the wafer, but the present invention is not limited thereto. The circuit layer 160 is connected to the conductive pads 141, the seal ring 142 wraps around the conductive pads 141, and the protective layer 150 covers the seal ring 142 and the circuit layer 160 but does not cover the conductive pads 141. In this embodiment, the active surface 110 of the chip 100 is the surface of the protective layer 150, and the bumps 120 are electrically connected to at least one conductive pad 141.

[0012] 3 and 4, after the scribing process, at least one sidewall 100a is formed on each of the chips 100, a circuit cut surface 161 is formed on the sidewall 100a of the circuit layer 160, and a mark cut surface 143a is formed on the sidewall 100a of the mark 143. Since the metal layer 140 and the circuit layer 160 are malleable, metal burrs 143b protruding onto the active surface 110 may be generated on the mark cut surface 143a, and metal burrs (not shown) protruding onto the active surface 110 may also be generated on the circuit cut surface 161.

[0013] 3 and 4, the support members 130 protrude into the active surface 110 and are located between the bumps 120 and the first side 111 of the active surface 110. The material of the support members 130 is selected from polymeric materials or non-conductive materials. Preferably, each of the chips 100 has a plurality of support members 130, and between adjacent support members 130, there is an opening 170 that communicates with the first side 111 and the bump setting area 112 of the active surface 110. The underfill (not shown) flows from the first side 111 to the bump setting area 112 through the opening 170 to seal the bumps 120 and the leads 210. The bumps 120 and the support members 130 protrude into the active surface 110, and the first height H1 of the bumps 120 is equal to or greater than the second height H2 of the support members 130. In this embodiment, the first height H1 is higher than the second height H2, and the difference between the first height H1 and the second height H2 is 7 μm or less, and preferably, the second height H2 is 5 μm or more. When the joining end 211 of the lead 210 is joined to the bump 120, the support member 130 is used to support the exposed portion 212 of the lead 210 so as to prevent the exposed portion 212 from contacting the mark cut surface 143a, the metal burr 143b, the circuit cut surface 161, or the metal burr of the circuit cut surface 161.

[0014] 4, there is a first distance S1 between the bump 120 and the support member 130, the imaginary line 111a extends along the first side 111 of the active surface 110, there is a second distance S2 between the support member 130 and the imaginary line 111a, and the ratio (S1 / S2) of the first distance S1 to the second distance S2 is in the range of 0.5 to 100. By controlling the ratio of the first distance S1 to the second distance S2, the rigidity of the exposed portion 212 is increased, and a situation in which the exposed portion 212 is curved and comes into contact with the mark cut surface 143a, the metal burr 143b, the circuit cut surface 161, or the metal burr of the circuit cut surface 161 is prevented.

[0015] As shown in FIG. 3 and FIG. 4, the seal ring 142 is projected on the active surface 110 and a seal ring projection 142a is formed. In this embodiment, the support member 130 is located between the bump 120 and the seal ring projection 142a. An axis extends from the support member 130 toward the first side edge, and along the axis X direction, the support member 130 has a width W, preferably, the width W is equal to or greater than 5 μm and is not longer than the distance from the bump 120 to the seal ring projection 142a. An outer wall 131 of the support member 130 is adjacent to the first side edge 111 of the active surface 110, and an inner wall 132 of the support member 130 is adjacent to the bump 120. A third distance S3 between the outer wall 131 and the seal ring projection 142a is equal to or greater than 1 μm and is equal to or less than 100 μm. A first distance S1 between the inner wall 132 and the bump 120 is not less than 1 μm and not more than 100 μm.

[0016] 3 and 4, along a direction perpendicular to the axis X, the bump 120 has a first length L1, and the support member 130 has a second length L2, which is equal to or greater than the first length L1. The bump 120 is projected onto the support member 130 along the axis X, and a bump projection 121 is formed on the support member 130. The bump projection 121 has a second side 121a, and the support member 130 has a third side 133 adjacent to the second side 121a. A fourth distance S4 from the second side 121a to the third side 133 along a direction perpendicular to the axis X is equal to or greater than 1 μm and equal to or less than 10 μm. When the lead 210 is bonded to the bump 120 at an angle, the support member 130 supports the exposed portion 212.

[0017] 4, 5 and 6, in another embodiment, the support member 130 is disposed between the seal ring projection 142a and the first side edge 111. The support member 130 is used to support the exposed portion 212 so as to prevent the exposed portion 212 from contacting the mark cut surface 143a, the metal burr 143b, the circuit cut surface 161, or the metal burr of the circuit cut surface 161 when the bonding end 211 is bonded to the bump 120. In another embodiment, the outer wall 131 of the support member 130 is aligned with the side wall 100a of the chip 100 (not shown).

[0018] The present invention supports the lead 210 joined to the bump 120 by a support member 130 protruding from the active surface 110, and suspends the exposed portion 212 of the lead 210 above the first side edge 111 of the active surface 110, thereby preventing the exposed portion 212 from coming into contact with a metal cut surface and / or metal burrs located on the first side edge 111, which could cause a short circuit or electrical abnormality.

[0019] Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is clear to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the description of the claims that such modifications and improvements can also be included in the technical scope of the present invention. [Explanation of symbols]

[0020] 10 Wafers 11 Scribe Line 12 Chips 13 Side wall 14 Metal cutting surface 15 Active Surface 16 Metal burrs 17. Bump 21 Lead 100 chips 100a Sidewall 110 Active Surface 111 1st side 111a Virtual Line 112 Bump setting area 120 Bump 121 Bump Projection 121a 2nd side 130 Support member 131 Outside wall 132 Inner Wall 133 Third side 140 metal layer 141 Conductive Pad 142 Seal ring 142a Seal Ring Projection 143 marks 143a Mark cut surface 143b Metal burrs 150 protective layer 160 circuit layers 161 Circuit cutting surface 170 Opening 210 Lead 211 Joint end 212 Exposed part H1 First height H2 Second height L1 First length L2 Second length S1 1st distance S2 2nd distance S3 3rd distance S4 4th distance W width X axis

Claims

1. At least one bump disposed on the active surface and used to bond a lead of a circuit board; at least one support member disposed on the active surface and positioned between the bump and a first side edge of the active surface, the support member being used to support the lead, the bump and the support member protruding onto the active surface, and a first height of the bump being equal to or greater than a second height of the support member.

2. 2. The chip according to claim 1, wherein the first height is greater than the second height, and the difference between the first height and the second height is 7 [mu]m or less.

3. The chip according to claim 2 , wherein the second height is 5 μm or more.

4. 2. The chip of claim 1, wherein a first distance is between the bump and the support member, a virtual line extends along the first side of the active surface, a second distance is between the support member and the virtual line, and a ratio of the first distance to the second distance is in a range between 0.5 and 100.

5. The chip of claim 4, wherein an axis extends from the support member toward the first side, and along the axis, the support member has a width, the width being no less than 5 μm.

6. 2. The chip of claim 1, further comprising a metal layer and a protective layer, the metal layer having a plurality of conductive pads and a seal ring, the seal ring wrapping around the conductive pads, the protective layer covering the seal ring but not the conductive pads, the active surface being a surface of the protective layer, the bumps being electrically connected to any one of the conductive pads, the seal ring being projected onto the active surface to form a seal ring projection, and the support member being located between the bumps and the seal ring projection.

7. 2. The chip of claim 1, further comprising a metal layer and a protective layer, the metal layer having at least one conductive pad and a seal ring, the seal ring wrapping around the conductive pad, the protective layer covering the seal ring but not the conductive pad, the active surface being a surface of the protective layer, the bumps being electrically connected to the conductive pads, the seal ring being projected onto the active surface to form a seal ring projection, and the support member being disposed between the seal ring projection and the first side edge.

8. 7. The chip of claim 6, wherein an outer wall of the support member is adjacent to the first side, and a third distance between the outer wall and the seal ring projection is greater than or equal to 1 [mu]m.

9. 9. The chip of claim 8, wherein an inner wall of the support member is adjacent to the bump, and a first distance between the inner wall and the bump is greater than or equal to 1 [mu]m.

10. The chip described in claim 6 or 7, characterized in that it comprises a plurality of support members, with openings between adjacent support members, the bumps are installed in bump setting areas of the active surface, and the openings are connected to the first side edge and the bump setting areas.

11. The tip of claim 1 or 7, wherein an outer wall of the support member is aligned with a side wall of the tip.

12. The chip described in claim 1, characterized in that an axis extends from the support member toward the first side edge, along the axial direction, along which the bump is projected onto the support member and perpendicular to the axis, the bump has a first length, the support member has a second length, and the second length is greater than or equal to the first length.

13. 13. The chip of claim 12, wherein the bump forms a bump projection on the support member, the bump projection having a second side edge, the support member having a third side edge adjacent to the second side edge, and a fourth distance from the second side edge to the third side edge along the direction perpendicular to the axis is 1 μm or more.

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