Integrated liquid cooling radiator

The integrated liquid-cooled radiator design addresses installation challenges and cooling inefficiencies by reducing height and volume while increasing fluid capacity and enhancing cooling efficiency through partitioned coolant chambers and air insulation.

JP2025019971AActive Publication Date: 2025-02-07黄崇贤
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
JP2023147101
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-07-28
Filing Date
2023-09-11
Publication Date
2025-02-07
Estimated Expiration
2043-09-11

AI Technical Summary

Technical Problem

Existing liquid-cooled radiators for computers and servers are bulky, inconvenient to install, and suffer from slow coolant flow rates and reduced cooling efficiency due to heat conduction between coolant chambers.

Method used

An integrated liquid-cooled radiator design with a first and second liquid tank, a heat dissipation flow channel unit, and a partitioned coolant chamber to reduce height, increase fluid capacity, and prevent heat conduction between coolant chambers using air insulation.

Benefits of technology

The design reduces the overall height and volume of the radiator, enhances fluid capacity, and improves cooling efficiency by preventing heat conduction between coolant chambers, allowing for efficient heat dissipation.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025019971000001_ABST
    Figure 2025019971000001_ABST
Patent Text Reader

Abstract

To provide an integrated liquid cooling radiator that can reduce the height and increase the internal working fluid capacity of a liquid cooling radiator.SOLUTION: An integrated liquid cooling radiator includes a liquid cooling section 100, a liquid cooling head 200, and a liquid pump 300. The liquid cooling section 100 includes a first liquid tank 10, a second liquid tank 20, and a heat dissipation channel pipe unit 30. An upper tank and a lower tank protruding downward from a lower end of the upper tank are formed in the first liquid tank 10, a lower end of the lower tank is combined with an upper end of the heat dissipation channel pipe unit 30, and a liquid collection space in the first liquid tank 10 is changed below the first liquid tank 10, thereby reducing the height of the upper tank. Front and rear ends of the upper tank and the second liquid tank 20 protrude from the front and back of the heat dissipation channel pipe unit 30 and a fan installation space 40 is formed at the front and back of the liquid cooling section 100, so that a fan 400 can simultaneously supply air to the heat dissipation channel pipe unit 30 and the lower tank to dissipate heat.SELECTED DRAWING: Figure 11
Need to check novelty before this filing date? Find Prior Art

Description

[Technical field]

[0001] The present invention relates to the field of liquid cooling radiator technology, and more particularly to an integrated liquid cooling radiator that can reduce the height and increase the working fluid capacity inside the liquid cooling radiator. [Background technology]

[0002] Liquid cooling radiators applied to computers and servers are typically separate liquid cooling radiators, which are known to have separate liquid cooling sections, liquid cooling heads, liquid pumps, and other means, and to connect each means using multiple liquid tubes.

[0003] In a separate type liquid-cooled radiator, the liquid cooling part and the liquid-cooled head are installed separately, the structure is not compact enough, the installation is relatively inconvenient, and the flow rate of the coolant is relatively slow. Therefore, the present inventor has proposed an integrated liquid-cooled radiator (Patent Document 1) to solve the shortcomings of the known separate type liquid-cooled radiator. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Taiwan Patent Publication No. I765680 Summary of the Invention [Problem to be solved by the invention]

[0005] However, (in Patent Document 1) when installing the integrated liquid cooling radiator, the liquid cooling head at the bottom of the liquid cooling unit must be attached to the surface of the chip processor, and the liquid cooling unit must be installed vertically on the chip processor, which can easily cause a problem of insufficient internal space in the computer case. Therefore, the primary problem that this invention aims to solve is how to reduce the height and volume of the integrated liquid cooling radiator while at the same time increasing the internal working fluid volume.

[0006] In addition, the liquid recovery tank at one end of the liquid cooling section of a known integrated liquid cooling radiator is internally partitioned into a cold liquid chamber and a hot liquid chamber, and when the liquid that flows through the liquid cooling head absorbs heat and becomes hot liquid and flows into the hot liquid chamber, the heat is transferred to the cold liquid in the adjacent cold liquid chamber via the metal partition plate, and the cold liquid that is about to flow into the liquid cooling head is abnormally heated first, which affects the cooling effect after it flows into the liquid cooling head. [Means for solving the problem]

[0007] The main object of the present invention is to provide an integrated liquid cooling radiator. A preferred embodiment of the radiator includes a liquid cooling unit, a liquid cooling head installed at the bottom of a second liquid tank, and a liquid pump installed in a first liquid tank, the liquid cooling unit including a first liquid tank, a second liquid tank, and a heat dissipation channel pipe unit having both ends connected to the first liquid tank and the second liquid tank. The first liquid tank includes an upper tank and a lower tank protruding downward from the lower end of the upper tank, and the lower end of the lower tank is connected to the upper end of the heat dissipation channel pipe unit, so that the liquid recovery space in the first liquid tank is changed to below the first liquid tank.

[0008] Another object of the present invention is to provide an integrated liquid cooling radiator, the preferred embodiment of which includes that the front and rear ends of the upper tank and the second liquid tank protrude from the front and rear surfaces of the heat dissipation flow passage pipe unit, which increases the capacity of the working liquid and forms a fan mounting space recessed inward on the front and rear surfaces of the liquid cooling part.

[0009] Another object of the present invention is to provide an integrated liquid cooling radiator, in a preferred embodiment of which the interior of the second liquid tank in the liquid cooling section includes a cold liquid chamber and a hot liquid chamber separated by an air insulation space, and the air insulation space has a relatively low thermal conductivity, preventing heat transfer from the hot working liquid in the hot liquid chamber to the cold working liquid in the cold liquid chamber. Effect of the Invention

[0010] (1) The present invention implements the first liquid tank at the upper end of the liquid cooling section in a structure in which the height of the upper tank is relatively small and the lower tank protrudes downward from the bottom of the upper tank, thereby achieving the effect of reducing the height of the liquid cooling section by extending the lower tank downward into the space of the heat dissipation flow path pipe unit.

[0011] (2) In the present invention, the front and rear ends of the first and second liquid tanks protrude forward and backward, thereby increasing the capacity of the working liquid without increasing the height of the liquid cooling unit. At the same time, a recessed fan installation space is formed on the front and rear sides of the heat dissipation channel pipe unit, and air can be supplied to both the heat dissipation channel pipe unit and the lower tank by the fan to dissipate heat.

[0012] (3) By dividing the inside of the second liquid tank at the lower end of the liquid cooling section into a cold liquid chamber and a hot liquid chamber by an air-insulated space, the present invention can prevent heat transfer from the hot working liquid in the hot liquid chamber to the cold working liquid in the cold liquid chamber, thereby improving the cooling effect of the liquid-cooled radiator. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic perspective view of an integrated liquid cooling radiator according to the present invention; [Diagram 2] 1 is a schematic front view of the integrated liquid cooling radiator of the present invention; [Diagram 3] 1 is a schematic exploded view of the integrated liquid cooling radiator of the present invention; [Figure 4] FIG. 2 is a schematic exploded view of a first liquid tank and a heat dissipation flow path pipe unit of the present invention. [Diagram 5] FIG. 2 is a schematic exploded view of a first liquid tank of the present invention. [Figure 6] FIG. 4 is a schematic exploded view of a second liquid tank and a heat dissipation flow path pipe unit of the present invention. [Figure 7] FIG. 4 is a schematic exploded view of a second liquid tank of the present invention. [Figure 8] 1 is a schematic front cross-sectional view of the integrated liquid cooling radiator of the present invention; [Figure 9]1 is a schematic cross-sectional side view of an integrated liquid cooling radiator according to the present invention; [Figure 10] 2 is a schematic diagram of an integrated liquid cooling radiator of the present invention with a fan attached; FIG. [Figure 11] FIG. 2 is a schematic exploded view of the integrated liquid cooling radiator of the present invention with a fan attached. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] As shown in FIG. 1 and FIG. 2, a preferred and specific embodiment of the integrated liquid cooling radiator of the present invention includes a liquid cooling unit 100, a liquid cooling head 200, and a liquid pump 300. The liquid cooling unit 100 includes a first liquid tank 10, a second liquid tank 20, and a heat dissipation flow pipe unit 30. The first liquid tank 10 and the second liquid tank 20 are tanks made of a heat dissipation metal (e.g., aluminum alloy) and are used to inject a working fluid (water or other coolant) into the first liquid tank 10 and the second liquid tank 20. The heat dissipation flow pipe unit 30 includes a plurality of first flow pipes 31, second flow pipes 32, and cooling fins 33 arranged in parallel with a gap therebetween. The first flow path pipe 31 and the second flow path pipe 32 are flat metal pipes, both ends of which are connected and communicated with the first liquid tank 10 and the second liquid tank 20, respectively. Cooling fins 33 are installed on the outer surfaces of the first flow path pipe 31 and the second flow path pipe 32, respectively. The liquid cooling head 200 has one surface which is connected to the outer surface of the bottom wall of the second liquid tank 20 and the other surface of the liquid cooling head 200 which is attached to a chip processor (not shown). The liquid pump 300 is installed in the first liquid tank 10 and drives the working liquid in the liquid cooling unit to circulate between the first liquid tank 10, the first flow path pipe 31, the second liquid tank 20, the liquid cooling head 200, the second flow path pipe 32 and the first liquid tank 10.

[0015] As shown in Figures 3, 4 and 5, a preferred embodiment of the first liquid tank 10 above the liquid cooling unit 100 includes a first tank body 11, a first tank lid 12, and a first partition plate 13. The first tank body 11 is formed by integrally molding a rectangular upper tank 111 and a lower tank 112, the thickness L1 and width W1 of the upper tank 111 being greater than those of the lower tank 112, the upper end of the upper tank 111 being recessed downward to form a first upper chamber 113, and the lower tank 112 protruding downward from the lower end of the upper tank 111, and the upper tank 111 and the lower tank 112 of the first tank body 11 are formed as a tank body having a T-shape in side view (as shown in Figure 9). At the same time, the bottom surface of the first upper chamber 113 forms a first lower chamber 114 recessed into the lower tank, and the first upper chamber 113 and the first lower chamber 114 are formed as a chamber having a T-shaped cross section in a side view (as shown in FIG. 9). A plurality of first flow path pipe insertion ports 115 communicating with the first lower chamber 114 are provided on the bottom wall of the lower tank 112, and the upper ends of the first flow path pipe 31 and the second flow path pipe 32 in the heat dissipation flow path pipe unit 30 are inserted into the first flow path pipe insertion ports 115 (as shown in FIG. 8). The first tank lid 12 covers the upper end of the upper tank 111 and seals the first upper chamber 113, the first partition plate 13 is installed across the first upper chamber 113 and the first lower chamber 114 to divide the first upper chamber 113 and the first lower chamber 114 into a liquid supply chamber 116 and a liquid discharge chamber 117, the upper end of the first flow path pipe 31 is connected to the liquid discharge chamber 117, the upper end of the second flow path pipe 32 is connected to the liquid supply chamber 116, and the liquid pump 300 is connected to the first tank lid 12 and located in the liquid supply chamber 116.

[0016] As shown in Figures 6, 7 and 8, a preferred embodiment of the second liquid tank 20 below the liquid cooling section 100 comprises a second tank body 21 and a second tank lid 22, and the upper end of the second tank body 21 is recessed downward to form a second chamber 23, and the second chamber 23 is divided into a cold liquid chamber 24 and a hot liquid chamber 25. The outer surface of the bottom wall of the second tank body 21 contacts the above-mentioned liquid cooling head 200, and the cold liquid chamber 24 and the hot liquid chamber 25 are each connected to the liquid cooling head 200. The second tank lid 22 covers the upper end of the second tank body 21 and seals the second chamber 23. The top wall of the second tank lid 22 is provided with a plurality of second flow path pipe insertion openings 26 that communicate with the cold liquid chamber 24 and the hot liquid chamber 25. The lower ends of the first flow path pipe 31 and the second flow path pipe 32 are each inserted into the second flow path pipe insertion openings 26 (shown in FIG. 8), connecting the lower end of the first flow path pipe 31 with the cold liquid chamber 24 and the lower end of the second flow path pipe 32 with the hot liquid chamber 25.

[0017] In the present invention, by structurally designing the upper tank 111 and the lower tank 112 of the first liquid tank 10, the first liquid tank 10 can be implemented with a structure in which the height of the upper tank 111 is relatively small and the lower tank 112 protrudes downward from the bottom of the upper tank 111. This allows the lower tank 112 to extend downward into the space of the heat dissipation flow path pipe unit 30, and only the upper tank 111, which is relatively small in height, remains in the heat dissipation flow path pipe unit 30 (and above the fan described below). This allows the height and volume of the liquid cooling unit 100 to be reduced, and the liquid cooling unit 100 can be installed inside a relatively small computer housing. As shown in FIG. 9, the front and rear ends of the upper tank 111 of the first liquid tank 10 and the front and rear ends of the second liquid tank 20 protrude from the front and rear surfaces of the heat dissipation flow path pipe unit 30, respectively, allowing a larger amount of working fluid (such as water) to be accommodated in the liquid cooling section 100 without increasing the height of the liquid cooling section 100, and also forming inwardly recessed fan installation spaces 40 on the front and rear surfaces of the liquid cooling section 100, each of which can accommodate a fan 400 (as shown in FIG. 10 and FIG. 11).

[0018] 4, 5 and 8, the inner surface of the first tank lid 12 in the first liquid tank 10 has a liquid pump seat 121 protruding into the first tank body 11, the liquid pump seat 121 being cylindrical, and the outer surface of the first tank lid 12 has a liquid pump chamber 122 recessed inward and extending to the liquid pump seat 121, whereby the liquid pump 300 is inserted into the liquid pump chamber 122 from the outer surface of the first tank lid 12. The end surface of the liquid pump seat 121 has a liquid supply port 123 connecting the liquid pump chamber 122 to the liquid supply chamber 116, and the side surface of the liquid pump seat 121 has a bump 124, and the bump 124 has a liquid discharge port 125 connecting the liquid pump chamber 122 to the liquid discharge chamber 117. In addition, the first partition plate 13 is formed as a T-shaped plate, and a notch 131 corresponding to the contour of the bump 124 is provided on its long side, and the notch 131 is in close contact with the peripheral surface of the bump 124, and the other edge of the first partition plate 13 is in close contact with the inner walls of the first upper chamber 113 and the first lower chamber 114. When the liquid pump 300 operates, the working liquid in the liquid supply chamber 116 is sucked in through the liquid supply port 123, and then transported through the liquid discharge port 125 to the liquid discharge chamber 117, so that the working liquid can continuously circulate in the liquid cooling unit 100, and the circulating flow necessarily passes through the liquid cooling head 200 to cool the chip processor, and further dissipate heat through the heat dissipation flow channel pipe unit 30.

[0019] 4, 5 and 8, in order to improve the structural strength of the first liquid tank 10, a first convex rib 118 protruding into the first upper chamber 113 is provided on the bottom wall of the upper tank 111 of the first tank body 11, and a second convex rib 126 protruding into the first upper chamber 113 is provided on the top wall of the first tank lid 12. A liquid inlet 127 communicating with the first upper chamber 113 is provided on the top wall of the first tank lid 12, and a separable seal part 128 (such as a seal screw) is coupled into the liquid inlet 127.

[0020] As shown in Figures 7 and 8, in order to prevent the thermal working fluid that has passed through the liquid cooling head 200 and flowed into the hot liquid chamber 25 of the second tank body 21 from conducting heat to the adjacent cold liquid chamber 24, an air insulation space 27 is provided in the second chamber 23 in the second tank body 21 of the present invention, and the air insulation space 27 is composed of a hot liquid partition plate 271 and a cold liquid partition plate 272 installed at a certain distance apart in the second chamber 23, and the second chamber 23 is divided into a cold liquid chamber 24 and a hot liquid chamber 25 by the air insulation space 27. A cold liquid inlet 241 is provided in the tank wall at the lower end of the cold liquid chamber 24, which allows the cold working fluid to flow from the cold liquid chamber 24 to the liquid cooling head 200, and a hot liquid outlet 251 is provided in the tank wall at the lower end of the hot liquid chamber 25, which returns the hot working fluid from the liquid cooling head 200 to the hot liquid chamber 25. Among these, in a preferred embodiment, the second tank body 21 has a surface that forms a quadrangular pyramid whose width narrows from the upper end to the lower end, and the second chamber 23 is a truncated pyramid-shaped chamber that corresponds to the quadrangular pyramid.

[0021] 10 and 11, the preferred embodiment of the liquid cooling unit 100 of the present invention further includes two fan chassis 50, which are coupled to both sides of the heat dissipation channel pipe unit 30, so that one or two fans 400 are inserted into the fan installation space 40 on the front and back sides of the liquid cooling unit 100, and the fans 400 are fixed to the two fan chassis 50 respectively. When the fan 400 is operated to blow air, it can blow air not only to the heat dissipation channel pipe unit 30 but also to the lower tank 112 protruding downward above the heat dissipation channel pipe unit 30, thereby improving the heat dissipation efficiency of the present invention. [Explanation of symbols]

[0022] 100:Liquid cooling section 10: First liquid tank 11: First tank body 111: Upper tank 112: Lower tank 113: First upper chamber 114: First lower chamber 115: First flow passage pipe insertion port 116:Liquid supply chamber 117:Liquid discharge chamber 118: First ridge 12: First tank lid 121: Liquid pump base 122: Liquid pump chamber 123:Liquid supply port 124: Bump 125:Liquid outlet 126: Second ridge 127:Liquid inlet 128: Sealing parts 13: First partition plate 131: Notch L1: Thickness W1:Width 20: Second liquid tank 21: Second tank body 22: Second tank lid 23: Second chamber 24: Cold liquid chamber 241: Coolant inlet 25: Heat liquid chamber 251: Hot liquid outlet 26: Second flow passage pipe insertion port 27: Air insulation space 271: Heat liquid partition plate 272: Coolant partition plate 30: Heat dissipation flow pipe unit 31: First flow pipe 32: Second flow pipe 33: Cooling fin 40: Fan installation space 50: Fan chassis 200: Liquid cooling head 300: Liquid pump 400: Fan

Claims

1. A liquid cooling section; A liquid cooling head, A liquid pump; Including, the liquid cooling unit includes a first liquid tank, a second liquid tank, and a heat dissipation flow path pipe unit, the heat dissipation flow path pipe unit includes a plurality of first flow path pipes, a second flow path pipe, and a cooling fin, each of the first flow path pipes and each of the second flow path pipes is a flat metal pipe having both ends connected to the first liquid tank and the second liquid tank, respectively, and the cooling fins are installed on outer surfaces of each of the first flow path pipes and each of the second flow path pipes, the liquid cooling head has one surface coupled to an outer surface of a bottom wall of the second liquid tank; The liquid pump is provided in the first liquid tank, and in an integrated liquid cooling radiator, the first liquid tank comprises a first tank body, a first tank lid, and a first partition plate, the first tank body being formed as an integral body of an upper tank and a lower tank, the thickness and width of the upper tank being greater than those of the lower tank, the upper end of the upper tank being recessed downward to form a first upper chamber, the lower tank protruding downward from the lower end of the upper tank, a bottom surface of the first upper chamber forming a first lower chamber recessed into the lower tank, a bottom wall of the lower tank is provided with a plurality of first flow path pipe insertion ports communicating with the first lower chamber, upper ends of the first flow path pipe and the second flow path pipe are respectively inserted into the first flow path pipe insertion ports, the first tank lid covers the upper end of the upper tank, and the first partition plate is installed in the first upper chamber and the first lower chamber to divide the first upper chamber and the first lower chamber into a liquid supply chamber and a liquid discharge chamber, the second liquid tank comprises a second tank body and a second tank lid, an upper end of the second tank body is recessed downward to form a second chamber, the second chamber is partitioned into a cold liquid chamber and a hot liquid chamber, the cold liquid chamber and the hot liquid chamber are each connected to the liquid cooling head, the second tank lid covers the upper end of the second tank body, a top wall of the second tank lid is provided with a plurality of second flow tube insertion openings connected to the cold liquid chamber and the hot liquid chamber, lower ends of the first flow tube and the second flow tube are each inserted into the second flow tube insertion opening, and An integrated liquid-cooled radiator in which the front and rear ends of the upper tank of the first tank body of the first liquid tank and the front and rear ends of the second liquid tank protrude from the front and rear surfaces of the heat dissipation flow path pipe unit, respectively, and form fan installation spaces that are recessed inward on each of the front and rear surfaces of the liquid cooling section.

2. The upper tank and the lower tank of the first tank body are formed as a tank body having a T-shape in a side view, 2 . The integrated liquid cooling radiator according to claim 1 , wherein the first upper chamber and the first lower chamber are formed as chambers having a T-shaped cross section in a side view.

3. an inner surface of the first tank lid having a liquid pump seat protruding into the first tank body; the first tank lid has an outer surface provided with a liquid pump chamber recessed inwardly and extending to the liquid pump seat; 3. The integrated liquid cooling radiator of claim 2, wherein the liquid pump is inserted into the liquid pump chamber from an exterior surface of the first tank lid.

4. a liquid supply port that communicates the liquid pump chamber with the liquid supply chamber is provided on an end surface of the liquid pump base; a bump is provided on a side surface of the liquid pump base, and a liquid discharge port that communicates the liquid pump chamber with the liquid discharge chamber is provided on the bump; 4. The integrated liquid cooling radiator according to claim 3, wherein the first partition plate is provided with a notch corresponding to an outline of the bump, and the notch is in close contact with a peripheral surface of the bump.

5. a first protrusion protruding into the first upper chamber is provided on a bottom wall of the upper tank; 5. The integrated liquid cooling radiator according to claim 4, further comprising a second protrusion on a top wall of the first tank lid, the second protruding toward the first upper chamber.

6. 2. The integrated liquid cooling radiator as described in claim 1, wherein a liquid inlet communicating with the first upper chamber is provided on the top wall of the first tank lid, and a separable seal part is coupled to the liquid inlet.

7. An air insulation space is provided in the second chamber of the second tank body, and the air insulation space is composed of a hot liquid partition plate and a cold liquid partition plate installed at a certain distance apart in the second chamber, 2. The integrated liquid-cooled radiator of claim 1, wherein the air insulation space divides the second chamber into the cold liquid chamber and the hot liquid chamber, and the tank wall at the lower end of the cold liquid chamber is provided with a cold liquid inlet for allowing working liquid to flow from the cold liquid chamber to the liquid cooling head, and the tank wall at the lower end of the hot liquid chamber is provided with a hot liquid outlet for returning the working liquid from the liquid cooling head to the hot liquid chamber.

8. The second tank body has a surface in the shape of a quadrangular pyramid whose width narrows from the upper end to the lower end, The integrated liquid cooling radiator according to claim 7 , wherein the second chamber is a frustum-shaped chamber corresponding to the truncated pyramid.

9. The integrated liquid cooling radiator according to claim 1 , further comprising two fan chassis, the two fan chassis being coupled to either side of the heat dissipation flow passage pipe unit.

10. The integrated liquid cooling radiator according to claim 9 , further comprising at least one fan, said fan being placed in said fan installation space and fixed to said two fan chassis.

Citation Information

Patent Citations

  • Integrated liquid cooling heat dissipation device with heat resistance structure

    CN116483186A

  • Liquid cooling radiator

    JP2022153211A

  • Vertical liquid cooling radiator

    TWI765680B