Mounting device, electronic device manufacturing system, mounting method, and electronic device manufacturing method

Abstract

To easily execute teaching processing on a solid substrate.SOLUTION: A mounting device comprises: a stage that supports a solid substrate; a mounting head that mounts a component on the solid substrate; a measurement data acquisition unit that acquires three-dimensional measurement data of a surface of the solid substrate; a data collation unit that collates the measurement data with design data of the surface of the sold substrate, and extracts a mounting position in the measurement data corresponding to a predetermined mounting position in the design data; a substrate data calculation unit that, on the basis of the difference in the mounting position between the design data and the measurement data, calculates substrate data including a rotation angle for making the surface of the solid substrate horizontal at the mounting position; a stage control unit that, on the basis of the substrate data, controls the stage to make the surface of the solid substrate horizontal at the mounting position; and a head control unit that controls the mounting head to mount the component at the mounting position, with the surface of the solid substrate being horizontal at the mounting position.SELECTED DRAWING: Figure 14

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a mounting apparatus, an electronic device manufacturing system, a mounting method, and an electronic device manufacturing method. [Background technology]

[0002] 2. Description of the Related Art In the technical field relating to mounting apparatuses, a three-dimensional mounting apparatus that mounts components on a three-dimensional substrate, as disclosed in Patent Document 1, is known. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 207313 Summary of the Invention [Problem to be solved by the invention]

[0004] When mounting components on a three-dimensional substrate, it is necessary to control the stage supporting the three-dimensional substrate so that the mounting position of the components on the surface of the three-dimensional substrate is horizontal. For example, when a three-dimensional substrate is formed by bonding a base material having a curved surface to a film, the position of the electric circuit provided on the film is shifted due to a bonding error between the base material and the film, resulting in variation in the mounting position. For this reason, in conventional mounting devices, it is necessary to perform a teaching process one point at a time using a camera provided adjacent to the mounting head based on the curvature of the curved substrate, which is cumbersome.

[0005] The technology disclosed in this specification aims to easily perform teaching processing on a three-dimensional substrate. [Means for solving the problem]

[0006] This specification discloses a mounting apparatus, which includes a stage for supporting a three-dimensional substrate, a mounting head for mounting components on the three-dimensional substrate, a measurement data acquisition unit for acquiring measurement data of a three-dimensional shape of a surface of the three-dimensional substrate, a data comparison unit for comparing design data of the surface of the three-dimensional substrate with the measurement data to extract a mounting position in the measurement data corresponding to a predetermined mounting position in the design data, a substrate data calculation unit for calculating substrate data including a rotation angle for horizontally aligning the surface of the three-dimensional substrate at the mounting position based on a difference in coordinates between the design data and the measurement data at the mounting position, a stage control unit for controlling the stage to horizontally align the surface of the three-dimensional substrate at the mounting position based on the substrate data, and a head control unit for controlling the mounting head so that the component is mounted at the mounting position while the surface of the three-dimensional substrate at the mounting position is horizontal. Effect of the Invention

[0007] According to the technology disclosed in this specification, teaching processing on a three-dimensional substrate can be easily performed. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a substrate and a component according to an embodiment. [Diagram 2] FIG. 2 is a perspective view showing a pallet for supporting a substrate according to the embodiment. [Diagram 3] FIG. 3 is an exploded perspective view showing a substrate and a pallet according to the embodiment. [Figure 4] FIG. 4 is a diagram illustrating a production system for electronic devices according to an embodiment. [Diagram 5] FIG. 5 is a diagram illustrating a three-dimensional measuring apparatus and a mounting apparatus according to an embodiment. [Figure 6] FIG. 6 is a plan view illustrating a mounting apparatus according to an embodiment. [Figure 7] FIG. 7 is a perspective view showing a transfer device and a stage according to the embodiment. [Figure 8] FIG. 8 is an exploded perspective view showing the transport device and the stage according to the embodiment. [Figure 9] FIG. 9 is a perspective view showing a pallet and a stage according to the embodiment. [Figure 10] FIG. 10 is an exploded perspective view showing a pallet and a stage according to the embodiment. [Figure 11] FIG. 11 is a diagram illustrating a mounting head according to an embodiment. [Figure 12] FIG. 12 is a diagram illustrating each of a preheating device and a laser irradiation device according to the embodiment. [Figure 13] FIG. 13 is a diagram illustrating a schematic configuration of a management device according to an embodiment. [Figure 14] FIG. 14 is a diagram for explaining board data according to the embodiment. [Figure 15] FIG. 15 is a diagram for explaining board data according to the embodiment. [Figure 16] FIG. 16 is a flowchart showing a method for manufacturing an electronic device according to this embodiment. [Figure 17] FIG. 17 is a view for explaining the mounting process by the mounting head according to the embodiment. [Figure 18] FIG. 18 is a diagram for explaining the mounting process by the mounting head according to the embodiment. [Figure 19] FIG. 19 is a diagram for explaining a method of controlling the stage. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiment will be described with reference to the drawings. In the embodiment, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X axis of a predetermined surface is defined as the X axis direction. The direction parallel to the Y axis of a predetermined surface perpendicular to the X axis is defined as the Y axis direction. The direction parallel to the Z axis perpendicular to the predetermined surface is defined as the Z axis direction. The rotation direction or tilt direction centered on the X axis direction is defined as the θX direction. The rotation direction or tilt direction centered on the Y axis direction is defined as the θY direction. The rotation direction or tilt direction centered on the Z axis direction is defined as the θZ direction. In the embodiment, the predetermined surface and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. The predetermined surface may be inclined with respect to the horizontal plane. In the embodiment, the predetermined surface including the X axis and the Y axis is appropriately referred to as the XY plane.

[0010] [substrate] FIG. 1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. A protrusion may be provided on the surface of the substrate 1.

[0011] An electric circuit is provided on the surface of the substrate 1. In an embodiment, the substrate 1 is formed by an in-mold molding technique. The substrate 1 includes a base material 1A having a curved surface, and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electric circuit. The electric circuit includes electrodes such as lands and pads (for example, electrode 1C shown in FIG. 14 described later). It is assumed that the position (planar coordinates) of each electrode in the film 1B is known. The surface of the substrate 1 includes the surface of the film 1B.

[0012] The component 2 includes an electronic component. The component 2 may be a lead-type electronic component having leads protruding from a body. The component 2 may be a chip-type electronic component having no leads. By mounting the component 2 on the surface of the substrate 1, an electronic device is manufactured.

[0013] [palette] Fig. 2 is a perspective view showing a pallet 3 supporting a substrate 1 according to an embodiment. Fig. 3 is an exploded perspective view showing a substrate 1 and a pallet 3 according to an embodiment. The pallet 3 supports the substrate 1. In the embodiment, the substrate 1 is handled while being supported by the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1, and a clamp mechanism 5 that fixes the substrate 1.

[0014] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on each of the +Y side and -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from each of the +Y side and -Y side.

[0015] The base portion 4A is in the form of a plate having a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper and lower surfaces of the base portion 4A.

[0016] The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B are provided. The pair of guard portions 4B are spaced apart from each other in the Y-axis direction. One guard portion 4B protrudes to the +Z side from the end portion on the +Y side of the upper surface of the base portion 4A. The other guard portion 4B protrudes to the +Z side from the end portion on the -Y side of the upper surface of the base portion 4A.

[0017] Each of the multiple pin portions 4C protrudes from the top surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The multiple pin portions 4C arranged on the +Y side of the center of the base portion 4A support the end of the substrate 1 on the +Y side. The multiple pin portions 4C arranged on the -Y side of the center of the base portion 4A support the end of the substrate 1 on the -Y side.

[0018] The clamp mechanism 5 is provided on the support member 4. The clamp mechanism 5 fixes the substrate 1 to the support member 4. The clamp mechanism 5 includes a pair of support parts 5A that support an end part of the substrate 1 on the -X side, and a movable part 5B that supports an end part of the substrate 1 on the +X side. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, whereby the substrate 1 is sandwiched between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[0019] In the embodiment, the pallet 3 has an information medium 80. The information medium 80 holds substrate data related to the substrate 1. In the embodiment, the information medium 80 is a two-dimensional code. The information medium 80 may be a one-dimensional barcode. The information medium 80 may be an RF tag. In the embodiment, the information medium 80 is attached to a portion of the upper surface of the base portion 4A. The information medium 80 is positioned so as not to overlap the substrate 1.

[0020] [Production System] Fig. 4 is a diagram illustrating a schematic diagram of an electronic device production system 10 according to an embodiment. As illustrated in Fig. 4, the production system 10 includes a three-dimensional measuring device 11, a mounting device 12, a preheating device 13, a laser irradiation device 14, an inspection device 15, and a management device 16. The three-dimensional measuring device 11, the mounting device 12, the preheating device 13, the laser irradiation device 14, and the inspection device 15 constitute an electronic device production line 17.

[0021] Fig. 5 is a diagram illustrating a three-dimensional measuring device 11 and a mounting device 12 according to the embodiment. Fig. 6 is a plan view illustrating the mounting device 12 according to the embodiment.

[0022] The three-dimensional measuring device 11 measures the three-dimensional shape of the surface of the substrate 1. The three-dimensional measuring device 11 includes a base member 18, a transport device 19 that transports the pallet 3, a sensor 20 that measures the three-dimensional shape of the surface of the substrate 1, and a chamber 21.

[0023] The base member 18 supports a conveying device 19. The conveying device 19 conveys the pallet 3 supporting the substrate 1 in the X-axis direction. The conveying device 19 has a conveyor belt 19A that conveys the pallet 3, and a guide member 19B that guides the pallet 3.

[0024] The sensor 20 measures the three-dimensional shape of the surface of the substrate 1. The sensor 20 includes, for example, a three-dimensional laser scanner. The sensor 20 acquires the Z coordinate of the surface of the substrate 1 fixed to the pallet 3 transported in the X-axis direction by the transport device 19. The sensor 20 outputs the measured Z coordinate linked to the X-axis and Y-axis coordinates of the measurement position. The sensor 20 can, for example, simultaneously measure the Y-axis direction. In this way, the sensor 20 acquires point cloud data of the surface of the substrate 1. The sensor 20 has a resolution sufficient to distinguish at least the unevenness of an electrode (for example, an electrode 1C shown in FIG. 14 described later) arranged on the film 1B on the surface of the substrate 1. In the embodiment, the resolution of the sensor 20 is 2 μm.

[0025] The three-dimensional measuring device 11 may measure the three-dimensional shape of the surface of the substrate 1 based on, for example, a phase shift method. In the embodiment, the three-dimensional measuring device 11 measures the three-dimensional shape of the surface of the substrate 1 fixed to the pallet 3. The substrate 1 is measured by the three-dimensional measuring device 11 while it is fixed to the pallet 3. The three-dimensional measurement data indicating the three-dimensional shape of the surface of the substrate 1 measured by the three-dimensional measuring device 11 is transmitted to the management device 16. The substrate 1 measured by the three-dimensional measuring device 11 is transported to the mounting device 12 while it is fixed to the pallet 3.

[0026] The mounting device 12 mounts the components 2 on the board 1. At least one mounting device 12 is provided in the production line 17. Note that a plurality of mounting devices 12 may be provided.

[0027] The mounting device 12 comprises a base member 22, a conveying device 23, a stage 24, a stage moving device 25, a component supply device 26, a mounting head 28 including a nozzle 27, a board camera 29, a height sensor 30, a head moving device 31, a nozzle moving device 32, a chamber 33, an opening / closing cover 34, a window 35, a display device 36, and an input device 37.

[0028] The base member 22 supports each of the transport device 23 , the stage 24 , the stage moving device 25 , the component supply device 26 , the mounting head 28 , the head moving device 31 , and the nozzle moving device 32 .

[0029] 7 and 8 are a perspective view and an exploded perspective view showing the transfer device 23 and the stage 24 according to the embodiment.

[0030] The transport device 23 transports the pallet 3 supporting the substrate 1 in the X-axis direction. The transport device 23 transports the pallet 3 supplied from the three-dimensional measuring device 11 to a processing position of the mounting device 12. The processing position is defined by a transport path of the transport device 23.

[0031] The conveying device 23 includes a conveying belt 23A that conveys the pallet 3 in the X-axis direction, and a guide member 23B that guides the pallet 3.

[0032] Guide member 23B is long in the X-axis direction. A pair of guide members 23B are provided. The pair of guide members 23B are spaced apart from each other in the Y-axis direction. One guide member 23B is disposed on the +Y side of pallet 3. The other guide member 23B is disposed on the -Y side of pallet 3.

[0033] The conveyor belt 23A is circular. A pair of conveyor belts 23A are provided. The conveyor belt 23A is supported by a guide member 23B via a driving pulley and a driven pulley. The conveyor belt 23A is hung on the driving pulley and the driven pulley. One of the conveyor belts 23A is supported by one of the guide members 23B. The other conveyor belt 23A is supported by the other guide member 23B.

[0034] Of the pair of conveyor belts 23A, the conveyor belt 23A arranged on the +Y side supports the +Y side end of the underside of pallet 3. The conveyor belt 23A arranged on the -Y side supports the -Y side end of the underside of pallet 3. The drive pulley is rotated by a drive motor (not shown), thereby conveying the pallet 3 in the X-axis direction.

[0035] An actuator (not shown) allows one guide member 23B to move in the Y-axis direction relative to the other guide member 23B. When one guide member 23B and the other guide member 23B move away from each other in the Y-axis direction, support of the pallet 3 by the conveyor belt 23A is released.

[0036] Fig. 9 is a perspective view showing the pallet 3 and the stage 24 according to the embodiment. Fig. 10 is an exploded perspective view showing the pallet 3 and the stage 24 according to the embodiment.

[0037] The stage 24 supports the substrate 1 via the pallet 3. The stage 24 supports the pallet 3 from the -Z side that has been transported to the processing position. Two positioning members 24A are provided on the upper surface of the stage 24. The positioning members 24A are inserted into holes 4D of the pallet 3. The positioning members 24A are inserted into the holes 4D from the -Z side of the pallet 3, thereby positioning the stage 24 and the pallet 3. A hook is provided on the upper end of the positioning member 24A. The hook is hung on the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 24A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hung on the pallet 3, thereby fixing the stage 24 and the pallet 3.

[0038] The stage moving device 25 moves the stage 24. In the embodiment, the stage moving device 25 moves the stage 24 in each of the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The stage moving device 25 includes a Y-axis motor that generates power to move the stage 24 in the Y-axis direction, a Z-axis motor that generates power to move the stage 24 in the Z-axis direction, a θX motor that generates power to rotate the stage 24 in the θX direction, and a θY motor that generates power to rotate the stage 24 in the θY direction.

[0039] After the pallet 3 is transported to the processing position by the transport device 23, the guide member 23B on the +Y side moves in the +Y direction away from the other guide member 23B, and the stage moving device 25 moves the stage 24 in the +Z direction. The support of the pallet 3 by the transport belt 23A is released by the guide member 23B on the +Y side moving in the Y-axis direction away from the other guide member 23B. The support of the pallet 3 by the transport belt 23A is released and the stage 24 moves in the +Z direction, so that the pallet 3 is transferred from the transport device 23 to the stage 24. With the pallet 3 supported by the stage 24, the stage moving device 25 moves the stage 24 in the +Y direction so as to be in the center between the two guide members 23B, thereby making it possible to move the stage 24 in each of the Z-axis direction, the θX direction, and the θY direction.

[0040] When transferring the pallet 3 from the stage 24 to the conveying device 23, the stage 24 moves in the -Y direction until one side of the pallet 3 comes onto the conveying belt 23A, and the guide member 23B on the +Y side moves to the -Y side until the other side of the pallet 3 comes onto the conveying belt 23A. After the hook provided at the upper end of the positioning member 24A is released from its fastening, the stage 24 moves in the -Z direction by the stage moving device 25. This releases the support of the pallet 3 by the stage 24, and the pallet 3 is supported by the conveying belt 23A.

[0041] The component supplying device 26 supplies the components 2. The component supplying device 26 includes a plurality of tape feeders. The tape feeders hold a plurality of components 2. The component supplying device 26 supplies at least one component 2 of the plurality of components 2 to a supply position. The component supplying device 26 is disposed on the -Y side of the conveying device 23. Note that the component supplying device 26 may be disposed on both the +Y side and the -Y side of the conveying device 23.

[0042] The mounting head 28 mounts the components 2 on the board 1. The mounting head 28 supports a plurality of nozzles 27. The mounting head 28 holds the components 2 supplied from the component supply device 26 with the nozzles 27 and mounts them on the board 1. The mounting head 28 is movable between a supply position where the components 2 are supplied from the component supply device 26 and a processing position where the board 1 is placed. The mounting head 28 holds the components 2 supplied to the supply position with the nozzles 27, moves to the processing position, and then mounts the components 2 on the surface of the board 1 placed at the processing position.

[0043] The head moving device 31 moves the mounting head 28. In the embodiment, the head moving device 31 moves the mounting head 28 in each of the X-axis and Y-axis directions. The head moving device 31 has an X-axis moving device 31X that moves the mounting head 28 in the X-axis direction, and a Y-axis moving device 31Y that moves the mounting head 28 in the Y-axis direction. Each of the X-axis moving device 31X and the Y-axis moving device 31Y includes an actuator. The X-axis moving device 31X is connected to the mounting head 28. The mounting head 28 moves in the X-axis direction by the operation of the X-axis moving device 31X. The Y-axis moving device 31Y moves the X-axis moving device 31X in the Y-axis direction by the operation of the Y-axis moving device 31Y, and thus the mounting head 28 moves in the Y-axis direction.

[0044] FIG. 11 is a diagram showing a schematic diagram of a mounting head 28 according to an embodiment. As shown in FIG. 11, the mounting head 28 has a plurality of nozzles 27. The nozzles 27 detachably hold the component 2. The nozzles 27 are suction nozzles that suction and hold the component 2. An opening is provided at the lower end of the nozzle 27. The opening of the nozzle 27 is connected to a vacuum system. With the lower end of the nozzle 27 and the component 2 in contact with each other, a suction operation is performed from the opening provided at the lower end of the nozzle 27, so that the component 2 is suctioned and held at the lower end of the nozzle 27. The suction operation from the opening is released, so that the component 2 is released from the nozzle 27. The nozzle 27 may be a gripper nozzle that pinches and holds the component 2.

[0045] The nozzle moving device 32 moves the nozzle 27. In the embodiment, the nozzle moving device 32 moves the nozzle 27 in each of the Z-axis direction and the θZ direction. The nozzle moving device 32 is supported by the mounting head 28. The nozzle 27 is connected to a lower end of the shaft 27A. A plurality of shafts 27A are provided. The plurality of nozzles 27 are connected to each of the plurality of shafts 27A. A plurality of nozzle moving devices 32 are provided. The plurality of nozzle moving devices 32 are connected to each of the plurality of shafts 27A. The nozzle 27 is supported by the mounting head 28 via the shaft 27A and the nozzle moving device 32. The nozzle moving device 32 moves the shaft 27A in the Z-axis direction and the θZ direction to move the nozzle 27.

[0046] Nozzle 27 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by head moving device 31 and nozzle moving device 32. By moving nozzle 27, component 2 held by nozzle 27 can also be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

[0047] The board camera 29 images the board 1. In the embodiment, the board camera 29 images the surface of the board 1 from the +Z side of the board 1. The board camera 29 is provided on the mounting head 28. The board camera 29 moves in the X-axis direction and the Y-axis direction together with the mounting head 28. The board camera 29 can image, for example, an alignment mark provided on the surface of the board 1.

[0048] The height sensor 30 detects a height indicating the position of the surface of the substrate 1 in the Z-axis direction. The height sensor 30 is provided on the mounting head 28. The height sensor 30 moves in the X-axis direction and the Y-axis direction together with the mounting head 28. In the embodiment, the height sensor 30 is a laser positioning sensor. The height sensor 30 can detect the distance from the mounting head 28 to the substrate 1 by irradiating the surface of the substrate 1 with laser light from the +Z side of the substrate 1 and receiving the laser light reflected by the surface of the substrate 1. By detecting the distance from the mounting head 28 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0049] The chamber 33 has an internal space in which the base member 22, the transport device 23, the stage 24, the stage moving device 25, the component supply device 26, the mounting head 28, the head moving device 31, and the nozzle moving device 32 are housed.

[0050] The opening / closing cover 34 opens and closes an opening provided in the upper part of the chamber 33. The opening / closing cover 34 is rotatably supported by at least a part of the chamber 33 via a hinge.

[0051] The window 35 is provided in the opening / closing cover 34. The window 35 is substantially transparent. An operator can visually check the state of the internal space of the chamber 33 through the window 35.

[0052] The display device 36 is provided on the outer surface of the chamber 33. The display device 36 displays display data. Examples of the display device 36 include a flat panel display such as a liquid crystal display or an organic EL display.

[0053] The input device 37 generates input data by being operated by an operator. Examples of the input device 37 include a touch sensor, a computer keyboard, and a mouse. In the embodiment, the display device 36 is a touch screen including a touch sensor. The input device 37 includes the touch screen of the display device 36.

[0054] In the embodiment, the mounting device 12 has a dispenser 38 that applies cream solder to the board 1. The dispenser 38 moves in each of the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the transport device 23. The dispenser 38 and the mounting head 28 are capable of moving separately. After the cream solder is applied to the surface of the board 1 by the dispenser 38, the components 2 are mounted on the board 1 by the mounting head 28. The board 1 on which the components 2 have been mounted by the mounting device 12 is transported to the preheating device 13 while being fixed to the pallet 3.

[0055] FIG. 12 is a diagram that illustrates each of the preheating device 13 and the laser irradiation device 14 according to the embodiment.

[0056] The preheating device 13 reduces the liquid component of the cream solder applied to the substrate 1. The cream solder includes flux and metallic solder balls dispersed in the flux. The preheating device 13 reduces the liquid component of the cream solder by activating the flux and vaporizing at least a part of the liquid component. The preheating device 13 includes a base member 39, a transport device 40 that transports the pallet 3, a heater 41 that heats the substrate 1, and a chamber 42.

[0057] The base member 39 supports a transport device 40. The transport device 40 transports the pallet 3 supporting the substrate 1 in the X-axis direction. The transport device 40 has a transport belt 40A that transports the pallet 3, and a guide member 40B that guides the pallet 3.

[0058] Heater 41 heats substrate 1 so that at least a portion of the liquid component of the flux of the cream solder is vaporized.

[0059] The chamber 42 has an internal space in which the base member 39, the transport device 40, and the heater 41 are respectively housed.

[0060] Preheating device 13 heats substrate 1 supported on pallet 3 so as to reduce the liquid component of the cream solder. Preheating device 13 heats substrate 1 to a temperature lower than the melting point of the cream solder. Preheating device 13 heats substrate 1, for example, at a temperature of 80°C or higher and 100°C or lower for 10 minutes. Substrate 1 preheated by preheating device 13 is transported to laser irradiation device 14 while being fixed to pallet 3.

[0061] The laser irradiation device 14 irradiates the cream solder with a laser beam so as to melt the cream solder. The laser irradiation device 14 includes a base member 43, a transport device 44 for transporting the pallet 3, a stage 45 for supporting the pallet 3, a stage moving device 46 for moving the stage 45, a laser head 47 for emitting a laser beam, a chamber 48, an opening / closing cover 49, and a window 50.

[0062] The base member 43 supports each of the transport device 44, the stage 45, the stage moving device 46, and the laser head 47. The transport device 44 transports the pallet 3 supporting the substrate 1 in the X-axis direction. The transport device 44 has a transport belt 44A that transports the pallet 3, and a guide member 44B that guides the pallet 3. The structure and function of the transport device 44 are substantially equal to the structure and function of the transport device 23.

[0063] The stage 45 supports the pallet 3 from the -Z side. The stage movement device 46 moves the stage 45 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The structure and function of the stage 45 are substantially the same as the structure and function of the stage 24.

[0064] The laser head 47 irradiates the cream solder with a laser beam to melt the cream solder. The laser head 47 moves on the +Z side of the conveyor device 44 in each of the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0065] The chamber 48 has an internal space in which the base member 43, the transport device 44, the stage 45, the stage moving device 46, and the laser head 47 are housed.

[0066] The opening / closing cover 49 opens and closes an opening provided in the upper part of the chamber 48. The opening / closing cover 49 is rotatably supported on at least a part of the chamber 48 via a hinge.

[0067] The window 50 is provided in the opening / closing cover 49. The window 50 reduces the amount of light passing through. An operator can visually check the state of the internal space of the chamber 48 through the window 50. The window 50 has a light-reducing function and an anti-glare function, so that the operator's eyes are prevented from being damaged by reflection of the laser light.

[0068] In the laser irradiation device 14, the cream solder is irradiated with the laser light emitted from the laser head 47. The cream solder is heated by the laser light and melts. The melted cream solder is cooled, and the component 2 is soldered to the board 1. In the embodiment, the cream solder is irradiated with the laser light after the liquid component of the cream solder is reduced in the preheating device 13. Since the cream solder is irradiated with the laser light in a state in which the liquid component of the cream solder has been reduced, solder balls due to bumping of the cream solder are suppressed.

[0069] The inspection device 15 includes a board visual inspection device (AOI: Automated Optical Inspection) that inspects the state of the board 1 after the components 2 are mounted.

[0070] The three-dimensional measuring device 11 is provided with a reading device 101. The mounting device 12 is provided with a reading device 102. The preheating device 13 is provided with a reading device 103. The laser irradiation device 14 is provided with a reading device 104. The reading device 101 reads board data stored in an information medium 80. If the information medium 80 is a two-dimensional code, the reading device 101 is a two-dimensional code reader. If the information medium 80 is an RF tag, the reading device 101 is an RFID reader. Like the reading device 101, the reading device 102, the reading device 103, and the reading device 104 each read board data stored in the information medium 80. Although not shown, the inspection device 15 is also provided with a reading device that reads board data stored in the information medium 80.

[0071] [Management device] 13 is a diagram illustrating a schematic configuration of a management device 16 according to an embodiment. The management device 16 may be present in each of the three-dimensional measuring device 11, the mounting device 12, the preheating device 13, the laser irradiation device 14, and the inspection device 15, or may be present separately via a network. The management device 16 includes a computer system. The management device 16 controls a production line 17.

[0072] The management device 16 has at least one processor 51, a main memory 52, a storage 53, and an interface 54. The processor 51 is a CPU (Central Processing Unit). The main memory 52 includes a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory). Examples of the storage 53 include a hard disk drive (HDD), a solid state drive (SSD), a magnetic disk, a magneto-optical disk, a CD-ROM, and a DVD-ROM. The interface 54 includes an input / output circuit. The functions of the processor 51 are stored in the storage 53 as a program. The processor 51 reads the program from the storage 53, expands it in the main memory 52, and executes processing according to the program. The program may be distributed to the management device 16 via a network.

[0073] The processor 51 has at least one functional unit. In the embodiment, the processor 51 has a measurement data acquisition unit 55, a data collating unit 56, a board data calculation unit 57, a display control unit 59, a head control unit 60, a stage control unit 61, an NC data conversion unit 62, and a board data conversion unit 63. The storage 53 has an NC data storage unit 64, a board data storage unit 65, and a stage data storage unit 66.

[0074] The measurement data acquisition unit 55 acquires measurement data of the three-dimensional shape of the surface of the substrate 1 measured by the three-dimensional measuring device 11. The data collation unit 56 compares the design data and the measurement data of the surface of the substrate 1, and extracts a mounting position in the measurement data that corresponds to a predetermined mounting position in the design data. The design data is, for example, Gerber data of the film 1B.

[0075] The board data calculation unit 57 calculates board data based on the design data and the measurement data of the three-dimensional measuring device 11. The display control unit 59 causes the display device to display the display data.

[0076] The head control unit 60 controls the mounting head 28. In an embodiment, controlling the mounting head 28 includes controlling the nozzle 27, controlling the head moving device 31, and controlling the nozzle moving device 32. The stage control unit 61 controls the stage 24. Controlling the stage 24 includes controlling the stage moving device 25.

[0077] The NC data conversion unit 62 creates NC data, which is the operation coordinate data of each device, from the board data and the mechanical parameters of each device. The board data conversion unit 63 creates board data from the NC data and the mechanical parameters of each device.

[0078] The NC data storage unit 64 stores NC data for each device, which is the operating coordinate data for the drive axes of the mounting device 12, preheating device 13, laser irradiation device 14, and inspection device 15. The NC data is generated from the board data and the mechanical parameters of each device. The board data storage unit 65 stores the board data. The board data calculated by the board data calculation unit 57 is stored in the board data storage unit 65. The stage data storage unit 66 stores mechanical parameters that indicate the outer shape and dimensions of the stage 24, the position of the rotation axis Rm of the stage 24 in the machine coordinate system, and the positional relationship between the machine coordinate system and the board coordinate system, which are previously calculated.

[0079] [Board data] 14 and 15 are diagrams for explaining board data according to an embodiment. In FIG. 15, the deflection angles θ and φ are exaggerated for the sake of explanation. The board data includes the mounting position Pp (xp, yp, zp) of the component 2 on the surface of the board 1 and the rotation angle (θxp, θyp) for horizontally aligning the surface of the board 1 at the mounting position Pp, as well as design data such as surface data of the surface of the board 1 and texture data of the circuit pattern on the surface data.

[0080] The mounting position Pp is based on measurement data obtained by the three-dimensional measuring device 11. In the embodiment, the design data is Gerber data of the film 1B. The design data includes a plurality of mounting positions Pp0 (xp0, yp0, zp0) set for the plurality of electrodes 1C, respectively. The data comparison unit 56 compares the substrate 1A design data with the measurement data, and thereby extracts the mounting position Pp corresponding to the mounting position Pp0 in the design data from the measurement data.

[0081] In the embodiment, the three-dimensional orthogonal coordinates are converted into three-dimensional polar coordinates for the mounting position Pp0 and the mounting position Pp by the board data calculation unit 57. The board data calculation unit 57 calculates the differential deflection angles θ, φ by calculating the difference between the coordinates of the mounting position Pp and the coordinates of the mounting position Pp0. The board data calculation unit 57 calculates the rotation angles (θxp, θyp) for horizontally aligning the surface of the board 1 at the mounting position Pp based on the differential deflection angles θ, φ.

[0082] The board data is expressed in a board coordinate system (Xp, Yp, Zp) with the board coordinate reference point Pr fixed to the board 1 or the pallet 3 as the origin. In the embodiment, the board coordinate reference point Pr is set at the center of the back surface of the board 1. In the embodiment, the Z coordinate of the mounting position Pp0 in the design data is set to the sum of the thickness of the base material 1A and the thickness of the film 1B. In addition to the above, the board data includes the part number to be mounted, the land position to which the cream solder is applied, the preheating temperature, the preheating time, the laser power, the laser irradiation time, etc., and is used by each device on the production line 17.

[0083] [NC data] The stage 24 can rotate in the θX and θY directions around the rotation axis Rm. The stage 24 supports the substrate 1 via the pallet 3. When the stage 24 rotates in the θX and θY directions around the rotation axis Rm and the substrate 1 tilts, the mounting position Pp rotates around the rotation axis Rm. Although the rotation axis Rm is represented by a point in FIG. 14, the rotation axis may be set separately for each of the θX and θY directions.

[0084] The machine coordinate system (Xm, Ym, Zm) is a coordinate system fixed to the mounting device 12, and serves as a reference when the mounting head 28 moves. The origin of the machine coordinate system may be anywhere on the mounting device 12. When the stage 24 rotates in the θX and θY directions around the rotation axis Rm and the board 1 tilts, the mounting position Pp rotates around the rotation axis Rm. The mounting position Pm (xm, ym, zm) in the machine coordinate system of the rotated mounting position Pp is calculated, and the board camera 29, height sensor 30, and nozzle 27 of the mounting head 28 move using this mounting position Pm (xm, ym, zm). The mounting position Pm (xm, ym, zm) in the machine coordinate system and the rotation angle of the stage 24 are stored as NC data, and are used as command positions for the drive motors when the mounting device 12 operates. NC data is similarly created and used in the laser irradiation device 14 and the inspection device 15 other than the mounting device 12. The NC data is calculated from mechanical parameters such as the position of the rotation axis Rm of the stage 24, and therefore the NC data for each device will be different.

[0085] [Electronic device manufacturing method] 16 is a flowchart showing a method for manufacturing an electronic device according to an embodiment. The substrate 1 is fixed to a pallet 3. The substrate 1 fixed to the pallet 3 is carried into a three-dimensional measuring device 11. The three-dimensional measuring device 11 measures the three-dimensional shape of the surface of the substrate 1 fixed to the pallet 3. The three-dimensional measurement data indicating the three-dimensional shape of the surface of the substrate 1 measured by the three-dimensional measuring device 11 is transmitted from the three-dimensional measuring device 11 to the management device 16 (step S1).

[0086] An electric circuit is provided on the surface of the substrate 1. The three-dimensional data of the surface of the substrate 1 transmitted to the management device 16 and acquired by the measurement data acquisition unit 55 includes surface data of the substrate 1 and design data such as texture data indicating the pattern of the electric circuit provided on the surface of the substrate 1 (in this embodiment, film 1B).

[0087] The data matching unit 56 matches the three-dimensional measurement data of the circuit pattern of the substrate 1 measured by the three-dimensional measuring device 11 with the three-dimensional design data of the circuit pattern in the design data. The data matching unit 56 matches the three-dimensional measurement data of the circuit pattern of the substrate 1 measured by the three-dimensional measuring device 11 with the three-dimensional design data of the circuit pattern in the design data, for example, by using a pattern matching technique.

[0088] The three-dimensional design data of the circuit pattern of the design data is constructed in advance based on, for example, design data of an electronic device. Furthermore, a target position of the mounting position Pp0 of the component 2 is defined in the circuit pattern of the design data. A plurality of mounting positions Pp0 are defined on one board 1. The data collation unit 56 extracts a mounting position Pp in the three-dimensional measurement data that corresponds to the predetermined mounting position Pp0 defined in the design data by collation between the three-dimensional measurement data and the three-dimensional design data (step S2).

[0089] The board data calculation unit 57 can calculate board data indicating the coordinates (xp, yp, zp) of the mounting position Pp of the component 2 on the surface of the board 1 and the rotation angle (θxp, θyp) for making the surface of the board 1 horizontal at the mounting position Pp. The board data calculation unit 57 calculates the coordinates (xp, yp, zp) of the mounting position Pp of the component 2 on the surface of the board 1 based on the collation result by the data collation unit 56 and the three-dimensional measurement data. The board data calculation unit 57 calculates the rotation angle (θxp, θyp) for making the surface of the board 1 horizontal at the mounting position Pp based on the difference in coordinates between the mounting position Pp0 (xp0, yp0, zp0) of the three-dimensional design data and the mounting position Pp of the three-dimensional measurement data. The board data includes the mounting position Pp as well as the mounted components, the soldering land positions, and the like (step S3).

[0090] The board data calculated in step S3 is stored in board data storage unit 65. The board data calculated in step S3 is also held in information medium 80. If information medium 80 is a two-dimensional code, a two-dimensional code indicating the board data is created in three-dimensional measuring device 11 and attached to pallet 3 (step S4). Only the identification number may be recorded on information medium 80 held on pallet 3, and the board data stored in board data storage unit 65 on the server managing production system 10 may be referenced.

[0091] Board data is created and stored for each board input into production system 10. Therefore, for a three-dimensional board such as board 1 formed by in-mold molding technology and in which alignment between base material 1A and film 1B including a circuit pattern is difficult, electronic devices can be manufactured using board data of accurate mounting position Pp measured for each board.

[0092] When the alignment accuracy between the substrate 1A and the film 1B including the circuit pattern can be kept within a specified standard, it is possible to omit measurement of the second and subsequent substrates 1 using the 3D measuring device 11 and improve efficiency by recording the same substrate data on the information medium 80.

[0093] The pallet 3 with the information medium 80 attached is transported to the mounting device 12 while supporting the board 1. The reader 102 reads the information medium 80 attached to the pallet 3. The dispenser 38 of the mounting device 12 creates NC data from the board data read by the reader 102 from the information medium 80 and mechanism parameters, and applies cream solder to the board 1 based on the created NC data. The dispenser 38 applies cream solder to pad positions for the component to be mounted at the mounting position Pp (step S5).

[0094] After the cream solder is applied to the board 1, the stage control unit 61 controls the stage 24 and the head control unit 60 controls the mounting head 28 so that the components 2 are mounted on the board 1. The stage 24 is controlled by the stage control unit 61 so that the surface of the board 1 at the mounting position Pp is horizontal. The mounting head 28 mounts the components 2 on the board 1 supported by the stage 24 controlled based on the board data and NC data created from the mechanism parameters. The mounting head 28 mounts the components 2 at the mounting position Pp (step S6). The application of the cream solder and the mounting of the components are repeated for all the components to be mounted on the board 1. The application of the cream solder and the mounting of the components may be performed collectively after the cream solder is applied to all the locations, or the application of the cream solder and the mounting of the components may be repeated for each component.

[0095] After the components 2 are mounted on the board 1, the pallet 3, supporting the board 1, is transported to the preheating device 13. The reading device 103 reads the information medium 80 attached to the pallet 3. The preheating device 13 preheats the cream solder applied to the board 1 based on the preheating temperature and preheating time of the board data read by the reading device 103 from the information medium 80 (step S7).

[0096] After the cream solder is preheated, the pallet 3 is transported to the laser irradiation device 14 while supporting the board 1. The reading device 104 reads the information medium 80 attached to the pallet 3. The laser head 47 and the stage 45 each create NC data based on the board data read by the reading device 104 from the information medium 80 and the mechanism parameters of the stage data storage unit 66, and are controlled based on the created NC data. The laser head 47 is controlled based on the NC data so that the cream solder applied to the board 1 is irradiated with laser light, and the position of the stage 45 in the Z axis direction, θX direction, and θY direction is controlled. The cream solder is melted by the laser light and cooled, so that the component 2 is soldered to the board 1 (step S8). The NC data for component mounting is created so that the surface of the board 1 at the target component mounting position Pp is horizontal, but the surface of the board 1 during laser light irradiation may be inclined within a range in which the component does not shift position due to gravity. By intentionally tilting the surface of the board 1 when irradiating it with laser light, it is possible to control the direction of the reflected laser light on the solder surface and prevent burning of the board 1. The possible angle of tilt is determined by the weight of the component 2 and the adhesive strength of the cream solder, and is stored in advance in the board data.

[0097] After the components 2 are soldered to the board 1, the pallet 3, supporting the board 1, is transported to the inspection device 15. A reading device provided in the inspection device 15 reads the information medium 80 attached to the pallet 3. The inspection device 15 inspects the board 1 based on the board data read from the information medium 80 by the reading device of the inspection device 15 (step S9).

[0098] [Implementation process] 17 and 18 are diagrams for explaining the mounting process by the mounting head 28 according to the embodiment. Board data indicating the mounting position Pp of the component 2 on the board 1 and the rotation angle for horizontally aligning the surface of the board 1 at the mounting position Pp is calculated. In the embodiment, stage data indicating the outer shape and dimensions of the stage 24, the position of the rotation axis Rm of the stage 24 in the machine coordinate system, and the positional relationship between the machine coordinate system and the board coordinate system are obtained in advance and stored in the stage data storage unit 66.

[0099] Board data including the mounting position Pp on the board coordinate system and the rotation angle is read from the board data storage unit 65. From the read board data and stage data, the rotation angles θX, θY of the stage 24 for horizontally aligning the surface of the board 1 for each mounting position Pp are calculated. When the stage 24 is rotated by θX, θY, the mounting position Pp becomes horizontal.

[0100] The rotation angles (θxp, θyp) for horizontally aligning the surface of the board 1 at the mounting position Pp are the rotation angles relative to the attitude measured by the three-dimensional measuring device 11, i.e., the rotation angles from the state in which the pallet 3 is in a horizontal attitude. Therefore, the rotation angle θX based on the horizontal attitude of the stage 24 is equal to θxp, and the rotation angle θY based on the horizontal attitude of the stage 24 is equal to θyp. When the stage 24 is rotated by θX and θY, the position to which the mounting position Pp moves in the XY direction on the machine coordinate system and its height in the Z direction are calculated at the same time, and the XY coordinates to which the mounting head 28 should move when mounting components, the rotation angles θX and θY of the stage 24, and the height of the stage 24 in the Z direction are stored as NC data.

[0101] 18, the stage control unit 61 controls the stage 24 based on the NC data. The head control unit 60 controls the mounting head 28 based on the NC data, thereby enabling the mounting head 28 to mount the component 2 at the mounting position Pp on the surface of the board 1 parallel to the XY plane.

[0102] FIG. 19 is a diagram for explaining a method of controlling the stage 24. The mounting position Pp is defined in a substrate coordinate system fixed to the substrate 1. For example, the substrate coordinate reference point Pr is the origin, and the X-axis, Y-axis, and Z-axis directions are fixed to the substrate 1 in the coordinate system. The mounting position is expressed as Pp (xp, yp, zp) on the substrate coordinate system. At the same time, the mounting position is also expressed in a machine coordinate system fixed to the mounting device 12. In the machine coordinate system, the mounting position is expressed as Pm (xm, ym, zm). The origin of the machine coordinate system may be anywhere fixed in the machine. Usually, it is often provided at the movable end of the XYZ movable axis of the mounting head 28. Conversion from the substrate coordinate system to the machine coordinate system is performed by the NC data conversion unit 62.

[0103] When the stage 24 rotates around the rotation axis Rm, the substrate 1 and the substrate coordinate system also rotate. When the stage 24 moves up and down in the Z-axis direction, the substrate 1 and the substrate coordinate system also move up and down. Therefore, the mounting position Pp (xp, yp, zp) is converted to a mounting position Pm (xm, ym, zm) in the machine coordinate system based on the data of the rotation angle and vertical movement amount of the stage 24, the position of the rotation axis of the stage 24, and the positions of the rotation axis of the stage 24 and the origin of the substrate coordinate system. In addition, the position of the machine coordinate system can also be converted to a position of the substrate coordinate system based on the control amount of the stage 24. Conversion from the machine coordinate system to the substrate coordinate system is performed by the substrate data conversion unit 63.

[0104] [effect] As described above, according to this embodiment, it is possible to calculate board data including a rotation angle for horizontally aligning the surface of board 1 at the mounting position, based on the difference in coordinates between the mounting position in the measurement data of the three-dimensional shape of the surface of board 1 supported by stage 24 and the mounting position in the design data. This makes it possible to control stage 24 so that the surface of the three-dimensional board at the mounting position is horizontal based on the board data, and therefore it is possible to mount component 2 by mounting head 28 at the horizontal mounting position.

[0105] Since the required rotation angle for identifying the mounting position and for leveling can be calculated by comparing and matching the design data with the measurement data, automatic teaching is possible for multiple mounting positions set on the board 1. In other words, unlike the conventional method, it is no longer necessary for an operator to manually input the mounting position and normal vector one by one using a reference board, or to check with a camera and adjust errors, and teaching processing for a three-dimensional board can be easily performed.

[0106] [Other embodiments] Although the embodiments of the present application have been described above, the present invention is not limited by the contents of these embodiments. The above-described embodiments and modified examples can be appropriately combined within a range that does not cause contradictions in the processing contents. In addition, the above-described components include those that a person skilled in the art can easily imagine, those that are substantially the same, and those that are within the so-called equivalent range. Furthermore, the above-described components can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the components can be made within a range that does not deviate from the gist of the above-described embodiments.

[0107] For example, in the embodiment, a circuit pattern is used to compare the design data and measurement data on the surface of the substrate 1, but a plurality of alignment marks may be provided on the surface of the substrate 1 and the comparison may be performed using the alignment marks. Also, before performing step S2, a determination process may be included in which the measurement data is displayed on, for example, a display device, and it is determined whether an error with respect to pre-stored three-dimensional data of a reference substrate is less than a predetermined value.

[0108] Furthermore, among the processes described in the above embodiments, all or part of the processes described as being performed automatically can be performed manually, or all or part of the processes described as being performed manually can be performed automatically by a known method. In addition, the information including the processing procedures, specific names, various data and parameters shown in the above documents and drawings can be changed arbitrarily unless otherwise specified. For example, the various information shown in each drawing is not limited to the illustrated information.

[0109] Moreover, each component of each device shown in the figure is a functional concept, and does not necessarily have to be physically configured as shown in the figure. In other words, the specific form of distribution and integration of each device is not limited to that shown in the figure, and all or part of them can be functionally or physically distributed and integrated in any unit according to various loads, usage conditions, etc. Furthermore, the above-mentioned management device 16 may be configured by multiple computers divided into several functions, and some of the functions of the computers may be possessed by a cloud server that executes various functions in the form of cloud computing. [Explanation of symbols]

[0110] 1...substrate, 1A...base material, 1B...film, 1C...electrode, 2...component, 3...pallet, 4...support member, 4A...base portion, 4B...guard portion, 4C...pin portion, 4D...hole, 5...clamp mechanism, 5A...support portion, 5B...movable portion, 10...production system, 11...3D measuring device, 12...mounting device, 13...preheating device, 14...laser irradiation device, 15...inspection device, 16...management device, 17...production line, 18...base member, 19...transport device, 19A...transport belt, 19B...guide member, 20...cell sensor, 21...chamber, 22...base member, 23...transport device, 23A...transport belt, 23B...guide member, 24...stage, 24A...positioning member, 25...stage moving device, 26...component supply device, 27...nozzle, 27A...shaft, 28...mounting head, 29...substrate camera, 30...height sensor, 31...head moving device, 31X...X-axis moving device, 31Y...Y-axis moving device, 32...nozzle moving device, 33...chamber, 34...opening / closing cover, 35...window, 36...display device, 37...entrance force device, 38...dispenser, 39...base member, 40...transport device, 40A...transport belt, 40B...guide member, 41...heater, 42...chamber, 43...base member, 44...transport device, 44A...transport belt, 44B...guide member, 45...stage, 46...stage moving device, 47...laser head, 48...chamber, 49...opening / closing cover, 50...window, 51...processor, 52...main memory, 53...storage, 54...interface, 55...measurement data acquisition unit, 56... Data comparison unit, 57...board data calculation unit, 59...display control unit, 60...head control unit, 61...stage control unit, 62...NC data conversion unit, 63...board data conversion unit, 64...NC data memory unit, 65...board data memory unit, 66...stage data memory unit, 80...information medium, 101...reading device, 102...reading device, 103...reading device, 104...reading device, Pp...mounting position (board coordinates), Pp0...mounting position, Pm...mounting position (machine coordinates), Pr...board coordinate reference point, Rm...rotation axis.

Claims

1. A stage for supporting the three-dimensional substrate; a mounting head that mounts components on the three-dimensional substrate; a measurement data acquisition unit that acquires measurement data of a three-dimensional shape of a surface of the three-dimensional substrate; a data collating unit that compares design data and the measurement data on the surface of the three-dimensional substrate to extract a mounting position in the measurement data that corresponds to a predetermined mounting position in the design data; a substrate data calculation unit that calculates substrate data including a rotation angle for horizontally aligning a surface of the three-dimensional substrate at the mounting position based on a difference in coordinates between the design data and the measurement data at the mounting position; a stage control unit that controls the stage so as to level the surface of the three-dimensional substrate at the mounting position based on the substrate data; a head control unit that controls the mounting head so that the component is mounted at the mounting position while the surface of the three-dimensional substrate at the mounting position is in a horizontal state. Mounting equipment.

2. The three-dimensional substrate includes a base material having a curved surface, and a film including an electric circuit bonded to the surface of the base material, the data collating unit collates the pattern of the electric circuit with the measurement data; The mounting device according to claim 1 .

3. the board data calculation unit calculates a rotation angle for horizontally rotating a surface of the three-dimensional board based on a difference between an angle of deviation of the design data of the mounting position converted into three-dimensional polar coordinates and an angle of deviation of the measurement data. The mounting device according to claim 1 .

4. A pallet for supporting the three-dimensional substrate; a three-dimensional measuring device that measures a three-dimensional shape of a surface of the three-dimensional substrate fixed to the pallet and outputs measurement data; and the mounting device according to any one of claims 1 to 3, which applies cream solder to the three-dimensional substrate conveyed from the three-dimensional measuring device while being fixed to the pallet, and mounts the component at the mounting position. Electronic device manufacturing system.

5. Obtaining measurement data of a three-dimensional shape of a surface of a three-dimensional substrate supported by a stage; comparing design data and the measurement data of the surface of the three-dimensional substrate to extract a mounting position in the measurement data that corresponds to a predetermined mounting position in the design data; calculating substrate data including a rotation angle for horizontally aligning a surface of the three-dimensional substrate at the mounting position based on a difference in coordinates between the design data and the measurement data at the mounting position; controlling the stage so as to level a surface of the three-dimensional substrate at the mounting position based on the substrate data; and mounting a component at the mounting position with a mounting head while a surface of the three-dimensional substrate at the mounting position is in a horizontal state. How to implement it.

6. Applying cream solder to the three-dimensional substrate; and mounting the component on the three-dimensional substrate by the mounting method according to claim 5. A method for manufacturing an electronic device.

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