Transport system

Abstract

To provide a transport system that does not damage a processed work-piece in the process of transporting the processed work-piece by a transport vehicle.SOLUTION: In a transport system 1 including a control unit 30 that controls the travel of a transport vehicle 10 that travels on a travel lane 50 installed above a plurality of processing devices 100A, 100B... and transports work-pieces to the processing devices 100A, 100B..., the control unit 30 controls the travel of the transport vehicle 10 so that a second traveling speed V2 of the transport vehicle 10 when transporting the work-pieces processed by the processing devices 100A, 100B... is slower than a first traveling speed V1 of the transport vehicle 10 when transporting the unprocessed work-pieces. Here, the transport vehicle 10 is provided with the control unit 30 and a receiving unit 31, the processing devices 100A, 100B... are provided with a speed change unit 111 and a transmitting unit 120, and the control unit 30 makes the transport vehicle 10 travel at a traveling speed received by the receiving unit 31.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a transport system including a transport vehicle that travels along a travel lane between a plurality of processing devices to transport workpieces to each processing device, and a control unit that controls the travel of the transport vehicle. [Background technology]

[0002] For example, multiple processing devices, such as grinding devices that process wafers as workpieces, are installed in a clean room, and a transport system has been proposed in which a transport vehicle holding the wafers travels along a travel lane to transport the wafers to each processing device (see, for example, Patent Document 1).

[0003] Incidentally, when a transport vehicle carrying wafers is made to travel along a travel lane between multiple processing devices, the transport vehicle has conventionally been made to travel at a constant speed regardless of the processing state of the wafers (whether they are in an unprocessed state or a processed state). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-130160 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, for example, if a transport vehicle carrying a thin wafer (processed wafer) whose back side has been ground by a grinding device is caused to travel along a travel lane at a relatively fast constant speed as in the past, the vibrations caused by the transport vehicle while traveling may cause chips or cracks in the wafer.

[0006] In addition, the multiple chips obtained by cutting the wafer held in the ring frame by the tape with the cutting blade of the cutting device are supported by the tape. However, when a transport vehicle holding these multiple chips travels on a travel lane at a relatively fast constant speed as in the past, the vibrations caused by the transport vehicle's travel can cause the tape to vibrate, causing adjacent chips to come into contact with each other and resulting in chip chips.

[0007] The present invention has been made in consideration of the above-mentioned problems, and its object is to provide a conveying system that does not damage processed workpieces during the process of transporting the processed workpieces by a transport vehicle. [Means for solving the problem]

[0008] To achieve the above-mentioned object, the invention described in claim 1 is a conveying system equipped with a control unit that controls the movement of a conveying vehicle that travels on a traveling lane installed above a plurality of processing devices and transports workpieces to the processing devices, wherein the control unit controls the movement of the conveying vehicle so that a second traveling speed of the conveying vehicle when transporting workpieces that have been processed by the processing devices is slower than a first traveling speed of the conveying vehicle when transporting unprocessed workpieces.

[0009] The invention described in claim 2 is characterized in that, in the invention described in claim 1, the transport vehicle is provided with the control unit and the receiving unit, the processing device is provided with a speed change unit that changes the traveling speed of the transport vehicle and a transmitting unit that transmits the traveling speed changed by the speed change unit to the receiving unit provided in the transport vehicle, and the control unit causes the transport vehicle to travel at the traveling speed received by the receiving unit.

[0010] The invention described in claim 3 is characterized in that, in the invention described in claim 1, the processing device is provided with a touch panel, and the touch panel has the speed change unit and a transmission button that transmits the running speed changed by the speed change unit from the transmitting unit to the receiving unit.

[0011] The invention according to claim 4 is the invention according to claim 2 or 3, characterized in that the speed changer sets the second travel speed for each type of processing of the workpiece. Effect of the Invention

[0012] According to the invention described in claim 1, the second traveling speed of the transport vehicle when transporting a workpiece that has been processed by a processing device is made slower than the first traveling speed of the transport vehicle when transporting an unprocessed workpiece (a workpiece that is unlikely to be damaged by the traveling vibrations of the transport vehicle). Therefore, the traveling vibrations of the transport vehicle when transporting processed workpieces that are easily damaged are kept small, and damage (such as chipping or cracking) of the workpieces due to the traveling vibrations is effectively prevented.

[0013] In addition, since the first traveling speed of the transport vehicle when transporting unprocessed workpieces is faster than the second traveling speed when transporting processed workpieces, if an unprocessed workpiece is transported by mistake, the workpiece can be quickly retrieved.

[0014] According to the invention described in claims 2 and 3, when the speed change unit of the touch panel provided on the processing device is operated to change the travel speed of the transport vehicle to an appropriate value and then the transmit button is pressed, a signal of the changed speed is received by the receiving unit of the transport vehicle, and based on this received signal, the control unit controls the travel speed of the transport vehicle to the changed value, so that the travel speed of the transport vehicle is set to the changed value.

[0015] According to the invention as recited in claim 4, the second travel speed of the transport vehicle is set to an appropriate value according to the processing content of the workpiece by the speed changer. [Brief description of the drawings]

[0016] [Figure 1] 1 is a block diagram showing an overall configuration of a transport system according to the present invention; [Diagram 2] 1 is a partially cutaway side view showing a configuration of a portion of a transport system according to the present invention. [Diagram 3] FIG. 2 is a perspective view of the transport vehicle as seen obliquely from above. [Figure 4] FIG. 2 is a plan view showing a portion of the transport lane. [Diagram 5] 1 is a partial cross-sectional side view showing a state in which a transport vehicle moves between a plurality of processing devices along a travel lane. [Figure 6] 6 is a cross-sectional view taken along line AA in FIG. 5. [Figure 7] FIG. 13 is a diagram showing the relationship between the travel distance of a transport vehicle and time. [Figure 8] FIG. 11 is a diagram showing the relationship between the travel speed of a transportation vehicle and time. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0018] [Conveyor system configuration] First, the overall configuration of a transport system according to the present invention will be described with reference to FIG.

[0019] The transport system 1 shown in Figure 1 is composed of a loader / unloader device 2, a plurality of processing devices 100A, 100B..., a plurality of transport vehicles 10..., and a control unit 3 that controls the operation of the loader / unloader device 2, the processing devices 100A, 100B..., and the transport vehicles 10..., and the loader / unloader device 2, the processing devices 100A, 100B..., and the transport vehicles 10... are wirelessly connected to the control unit 3.

[0020] The transport system 1 according to the present embodiment is a system in which the transport vehicle 10 holds a wafer (not shown) that is a workpiece received from the loader / unloader device 2 and travels between the processing devices 100A, 100B, etc., thereby transferring the wafer to each of the processing devices 100A, 100B, etc. Specifically, as shown in Fig. 2, the transport vehicle 10 travels along a travel lane 50 horizontally installed above the processing devices 100A, 100B, etc. (Fig. 2 shows only one processing device (e.g., grinding device) 100A) to transfer the wafer (not shown) to the processing device (e.g., grinding device) 100A, and the transport vehicle 10 that has received the wafer processed by the processing device 100A travels toward another processing device (e.g., polishing device or cutting device) 100B (see Figs. 1, 4, and 5). By repeating such an operation, the processed wafer is transferred sequentially between the multiple processing devices 100A, 100B, etc. As shown in FIG. 2, a plurality of transport vehicles 10, a travel lane 50, a plurality of processing apparatuses 100A, 100B (only one processing apparatus 100A is shown in FIG. 2), and the like are installed in a clean room R.

[0021] The wafers transported by each transport vehicle 10 are, for example, thin disk-shaped members made of single crystal silicon (Si), and are transported in a state housed in a cassette 41 (see FIG. 6) suspended and supported by the transport vehicle 10 so as to be movable up and down. Here, a rectangular opening 50a is formed directly above the cassette stage 101 of each processing device 100A, 100B... on the travel lane 50, as shown in FIGS. 2 and 4 to 6, and the cassette (see FIG. 6) transported by the transport vehicle 10 traveling along the travel lane 50 passes through the opening 50a of the travel lane 50 and moves up and down to deliver the wafer to the cassette stage 101 of each processing device 100A, 100B...

[0022] [Vehicle configuration] Next, the configuration of each transport vehicle 10 will be described below with reference to Fig. 3. In the following description, the traveling direction of the transport vehicle 10 is defined as the "front-rear" direction, and the vehicle width direction perpendicular to the traveling direction is defined as the "left-right" direction, as shown by the arrows in Fig. 3.

[0023] Each transport vehicle 10 has a vehicle body 10A with a double upper and lower structure composed of a chassis 11 made of a polygonal metal plate and a polygonal resin base plate 12 arranged on the upper surface side of the chassis 11, and this vehicle body 10A is supported so as to be able to travel on a travel lane 50 shown in Fig. 2 in the direction of the arrow by a pair of rotatable front wheels 13 arranged on the left and right of the front end and a pair of rotatable rear wheels 14 arranged on the left and right of the rear end. Here, the pair of left and right front wheels 13 function as drive wheels and steering wheels, and the pair of left and right rear wheels 14 are composed of casters that can freely rotate around a vertical axis.

[0024] A pair of front wheels 13 arranged on the left and right sides of the front end of the chassis 11 are supported by rotatable axles 15, and a gear pulley 16 (only one of which is shown in FIG. 3) is attached to each axle 15. In addition, left and right rear wheels (casters) 14 are supported on the left and right sides of the underside of the rear end of the chassis 11 so as to be rotatable about vertical axes (not shown).

[0025] Further, on the vehicle body 10A (base plate 12) of the transport vehicle 10, there are arranged a drive unit 20 that independently rotates a pair of left and right front wheels 13, a control unit 30, a receiving unit 31, and a transmitting unit 32 that are arranged on a rectangular plate-shaped support base 17, and a lifting unit 40 that is provided between the support base 17 and the vehicle body 10A (base plate 12). Note that a first sensor (not shown) is arranged at the front end and rear end of the lower surface of the base plate 12, and a second sensor (not shown) is arranged at the left and right of the middle part in the front-rear direction of the lower surface of the base plate 12, respectively. These first and second sensors optically detect the strip-shaped first mark M1 and second mark M2 laid on the upper surface of the travel lane 50 shown in FIG. 4 in a non-contact manner, and are configured by reflective photosensors in this embodiment.

[0026] Furthermore, third sensors 18 for detecting collision of the transport vehicle 10 with an obstacle are disposed on the left and right of the front and rear ends of the substrate 12. The third sensors 18 are electrically connected to the control unit 30, and may be a touch sensor, a proximity switch, or the like.

[0027] Here, the drive unit 20, which drives and rotates the left and right front wheels 13 independently, is equipped with a pair of left and right electric motors 21 as drive sources, and a battery 22 that supplies power to each electric motor 21, and a gear pulley 23 (see Figures 5 and 6) having a smaller diameter than the gear pulley 16 is attached to the outer end of the output shaft (motor shaft) 21a (see Figure 6) of each electric motor 21, and an endless timing belt 24 is wound around each of these gear pulleys 23 and the gear pulley 16.

[0028] Therefore, when the electric motors 21 are started by supplying electric power from the battery 22 to the electric motors 21, the small-diameter gear pulleys 23 connected to the output shafts (motor shafts 21a) of the electric motors 21 are rotated, and the rotation of each gear pulley 23 is reduced in speed (torque-up) and transmitted to the left and right large-diameter gear pulleys 23 via the timing belts 24. Then, the left and right gear pulleys 23 and the axles 15 rotate, and the front wheels 13 connected to the axles 15 are rotated independently. The rotation of the front wheels 13 allows the transport vehicle 10 to travel on the travel lane 50 shown in FIG. 3 in the direction of the arrow. The battery 22 is a lithium-ion battery or the like. The electric motors 21 are electrically connected to the control unit 30, and the drive of the electric motors 21 is controlled by the control unit 30.

[0029] Here, the control unit 30 provided in the transport vehicle 10 includes a CPU (Central Processing Unit) that performs arithmetic processing according to a control program, and storage units such as a ROM (Read Only Memory) and a RAM (Random Access Memory), and controls the travel speed (first travel speed) of the transport vehicle 10 when the transport vehicle 10 is traveling holding an unprocessed (unprocessed) wafer and the travel speed (second travel speed) of the transport vehicle 10 when the transport vehicle 10 is traveling holding a processed wafer to be a predetermined value, as described later. In addition, the control unit 30 controls the driving of the drive unit 20 and the lift unit 40 based on detection signals transmitted from a first sensor and a second sensor (not shown). In addition, the receiving unit 31 has a function of receiving a signal from the outside and transmitting it to the control unit 30, and the transmitting unit 32 has a function of transmitting a signal received from the control unit 30 to the outside.

[0030] The lifting unit 40 is a mechanism for lifting and lowering a cassette 41 (see FIG. 6) containing wafers, and lifts and lowers the cassette 41 suspended by four hanging members 42 (see FIG. 6) such as belts by winding or unwinding these hanging members 42. The lifting unit 40 is electrically connected to the control unit 30, and as described above, its drive is controlled by the control unit 30, but illustration and description of its specific configuration will be omitted.

[0031] [Processing equipment configuration] For example, as shown in Fig. 2 and Fig. 5, the processing device (grinding device) 100A is provided with a touch panel 110 and a transmitting unit 120, and the touch panel 110 is provided with a speed change unit 111 that allows an operator to change the traveling speed of the transport vehicle 10, and a transmission button 112 that transmits a signal of the changed traveling speed (speed signal) to the transmitting unit 120. When a speed signal is transmitted from the transmission button 112 to the transmitting unit 120, the transmitting unit 120 that receives the speed signal transmits the speed signal to the receiving unit 31 of the transport vehicle 10. Note that the other processing devices 100B... are also provided with touch panels 110 and transmitting units 120, similar to the processing device 100A (see Fig. 5).

[0032] [Travel lane configuration] The upper surface of the travel lane 50 installed above each processing device 100A, 100B... is given a matte black finish by painting or surface treatment, and as shown in Figure 4, a first mark M1 made of silver reflective tape or the like is laid in the center of the width of the upper surface of this travel lane 50 along the traveling direction of the transport vehicle 10 (the up and down direction in Figure 4).

[0033] 4, transfer stations S1, S2, etc. for transferring wafers to and from each of the processing devices 100A, 100B, etc. are formed in the traveling lane 50 at a position above each of the processing devices 100A, 100B, etc., and a rectangular opening 50a is formed in each of the transfer stations S1, S2, etc. Then, second marks M2 are laid on the upper surface of the traveling lane 50, crossing the first marks M1 at a right angle and heading toward each of the transfer stations S1, S2, etc. Here, each second mark M2 is made of silver reflective tape or the like.

[0034] [Function of the transport system] Next, the operation of the transfer system 1 configured as above, that is, the method of transferring wafers, which are workpieces, to the processing devices 100A, 100B, . . . by the transfer vehicle 10 will be described.

[0035] The transport vehicle 10 receives an unprocessed (unprocessed) wafer from the loader-unloader device 2 shown in Fig. 1 into a cassette 41 (see Fig. 6) at an initial position P0 shown in Fig. 5. Then, the transport vehicle 10 receives a control signal transmitted from the control unit 3 shown in Fig. 1 by the receiver 31, and moves toward the processing device 100A along the travel lane 50 at a first travel speed V1 faster than the conventional travel speed V in the direction of the arrow in Fig. 5. In this embodiment, the first travel speed V1 of the transport vehicle 10 is set to 400 mm / sec, and this value is preset by the control unit 3.

[0036] Here, the transport vehicle 10 travels (self-propels) along the first mark M1 in the travel lane 50 shown in Fig. 4 in a direction indicated by an arrow while optically detecting the first mark M1 in a non-contact manner using first sensors (not shown) provided at the front and rear of the transport vehicle 10. That is, when the drive unit 20 is driven and controlled by the control unit 30 shown in Fig. 2, the left and right electric motors 21 are started to rotate the front wheels 13, and the transport vehicle 10 travels (self-propels) along the travel lane 50 along the first mark M1.

[0037] Therefore, the transport vehicle 10 holding unprocessed wafers in a cassette 41 (see FIG. 6) travels from the initial position P0 shown in FIG. 5 toward the processing equipment 100A at a first traveling speed V1 and stops at a first position P1 above the processing equipment 100A. If the time t that the transport vehicle 10 is at the initial position P0 is defined as 0 (t=0), the time that the transport vehicle 10 reaches the first position P1 above the processing equipment 100A (the position where the cassette 41 is lowered to hand over the wafer to the processing equipment 100A) is defined as t1, and the travel distance of the transport vehicle 10 is defined as L1, then, between times t=0 and t1 (T1), as shown in FIG. 7 and FIG. 8, the transport vehicle 10 travels to the first position P1 at a first traveling speed V1 (=L1 / T1), which is faster than the conventional traveling speed V.

[0038] Here, the time when the carrier 10 traveling at the conventional traveling speed V (<V1) reaches the first position P1 above the processing apparatus 100A is indicated by t1' (>t1) in FIG. 7. Therefore, when the carrier 10 travels at the first traveling speed V1 (>V) which is higher than the conventional traveling speed V as in the present embodiment, the required time T1 for the carrier 10 to reach the first position P1 is shortened by ΔT (=t1' - t1) compared to the conventional required time T1'. For this reason, for example, when it is noticed that there is a mistake in the unprocessed wafer held by the carrier 10 traveling from the initial position P0 toward the first position P1 above the processing apparatus 100A, the carrier 10 can be returned to the initial position P0 at the first traveling speed V1 higher than the conventional traveling speed V to recover the wafer.

[0039] As described above, even when the first traveling speed V1 when the carrier 10 holding the unprocessed wafer moves from the initial position P0 to the first position P1 is set higher than the conventional traveling speed V (V1 > V), the unprocessed wafer held by the carrier 10 does not break (such as chipping or cracking) due to the traveling vibration of the carrier 10 because its thickness is relatively thick.

[0040] When it is confirmed by the second sensors arranged on the left and right of the carrier 10 detecting the second mark M2 that the carrier 10 has reached the first position P1 above the processing apparatus 100A, the control unit 30 of the carrier 10 stops the drive of the electric motor 21 of the drive unit 20 and stops the carrier 10 at the first position P1 above the processing apparatus 100A. Thus, when the carrier 10 stops at the first position P1, as shown by the dashed line in FIG. 4, the carrier 10 turns by 90°, moves forward toward the transfer station S1, and stops at a position where the cassette 41 (see FIG. 6) held by the carrier 10 aligns with the opening 50a. Then, from this state, the control unit 30 shown in FIG. 3 drives and controls the elevating unit 40, and as shown in FIG. 6, the cassette 41 in which the wafers are stored is lowered through the opening 50a and transferred to the cassette stage 101 of the processing apparatus 100A.

[0041] As described above, the wafer before processing delivered to the cassette stage 101 of the processing apparatus 100A is thinned by grinding in the processing apparatus 100A which is a grinding apparatus. Then, the wafer thinned by the grinding process (processed wafer) is stored in the cassette 41 waiting at the cassette stage 101. Then, the lifting unit 40 is driven and controlled again by the control unit 30, the cassette 41 rises, passes through the opening 50a that opens at the transfer station S1, and is returned to the transport vehicle 10 and collected. After that, after the transport vehicle 10 makes a U-turn and returns to the original position, it turns by 90° and returns to the original state (the state shown by the solid line in FIG. 4).

[0042] Here, in the processing apparatus 100A, after the traveling speed of the transport vehicle 10 is set to a second traveling speed V2 (<V1) slower than the first traveling speed V1 by the operation of the speed change unit 111 of the touch panel 110 by the operator, when the transmission button 112 is pressed, the signal is transmitted to the transmission unit 120 and transmitted from the transmission unit 120 toward the reception unit 31 of the transport vehicle 10. In the present embodiment, the second traveling speed V2 of the transport vehicle 10 is set to 300 mm / sec. However, as shown in FIGS. 7 and 8, this second traveling speed V2 is set to a speed slower than the conventional traveling speed V (V2 < V).

[0043] Then, the control unit 30 of the carrier vehicle 10 drives and controls the pair of left and right electric motors 21 of the drive unit 20, controls (decelerates) the rotational speeds of the pair of left and right front wheels 13, and causes the carrier vehicle 10 to travel from the first position P1 above the processing apparatus 100A toward the processing apparatus (for example, a polishing apparatus) 100B at a first traveling speed V1 and a second traveling speed V2 (<V<V1) slower than the conventional traveling speed V. Here, if the distance from the first position P1 above the processing apparatus 100A to the second position P2 above the processing apparatus 100B is taken as L2 as shown in FIG. 5, the second traveling speed V2 of the carrier vehicle 10 is L2 / T2, and the carrier vehicle 10 traveling at this second traveling speed V2 reaches the second position (the position for delivering the processed wafer to the processing apparatus 100B) P2 above the processing apparatus 100B at time t2. That is, the carrier vehicle 10 travels from time t1 shown in FIGS. 7 and 8 toward the processing apparatus 100B at the second traveling speed V2 and reaches the second position P2 above the processing apparatus 100B at time t2, but the required time T2 (=t2 - t1) is longer by the time ΔT shown in FIG. 7 than the required time T2' of the carrier vehicle 10 traveling at the conventional traveling speed V. In FIG. 7, T1' is the required time for the carrier vehicle 10 traveling at the conventional traveling speed V to move from the initial position P0 to the first position P1, and T2' is the required time for the carrier vehicle 10 traveling at the conventional traveling speed V to move from the first position P1 to the second position P2.

[0044] Incidentally, in the example shown in FIG. 7, it is assumed that the time when the carrier vehicle 100 traveling at the second traveling speed V2 reaches the second position P2 above the processing apparatus 100B and the time when the carrier vehicle 10 traveling at the conventional traveling speed V reaches the second position P2 are the same time t2, but these two times do not necessarily have to be the same. Note that the second traveling speed V2 of the carrier vehicle 10 may be set to the conventional traveling speed V. Further, when an error occurs during the processing of the wafer, the carrier vehicle 10 may be caused to travel at a first traveling speed V1 faster than the traveling speed V2 in order to quickly recover the wafer.

[0045] Here, referring to FIG. 7, the required time T2 for the carrier 10 traveling at the second traveling speed V2 to move from the first position P1 to the second position P2 is longer than the required time T1 for the carrier 10 to travel from the initial position P0 to the first position P1 at the first traveling speed V1 (T2>T1). However, since the required time T1 for the carrier 10 traveling at the first traveling speed V1 is shortened by the illustrated ΔT with respect to the required time T1' for the carrier 10 traveling at the conventional traveling speed V, the total required time T for the carrier 10 to travel from the initial position P0 to the second position P2 is the same as the conventional value.

[0046] Thus, in the present embodiment, when the thinned wafer ground by the processing device 100A is transported from the processing device 100A to the next processing device (for example, a polishing device) 100B, the carrier 10 is caused to travel at the second traveling speed V2 (<V<V1) slower than the first traveling speed V1 and the conventional traveling speed V. Therefore, the traveling vibration of the carrier 10 when transporting the processed and easily damaged wafer is suppressed to a small level, and damage (such as chipping and cracking) of the wafer due to the traveling vibration is effectively prevented.

[0047] Thereafter, also when the processed wafer is sequentially transported from the processing device 100B to the processing device 100C, from the processing device 100C to the processing device 100D... by the carrier 10, the traveling speed of the carrier 10 is set to the second traveling speed V2 (V<V1) slower than the first traveling speed V1 and the conventional traveling speed V. However, this second traveling speed V2 may be set to an optimal value according to the processing content (for example, cutting, cleaning, etc.) of the wafer in the processing devices 100B, 100C....

[0048] In addition, in the above embodiment, the case where the carrier 10 transports the wafer as the workpiece has been described as an example. However, in the transport system 1 according to the present invention, the carrier 10 may transport any workpiece other than the wafer.

[0049] In addition, in the above embodiment, the traveling speed of the transport vehicle 10 is set by an operator operating the speed change unit 111 of the touch panel 110 provided on each processing device 100A, 100B..., but it is also possible to recognize the position of the transport vehicle 10 (the position of the processing devices 100A, 100B...) by, for example, detecting a mark using a first sensor or a second sensor, or by photographing using a camera, and automatically set the second traveling speed V2 of the transport vehicle 10 to a preset value based on that.

[0050] In addition, the present invention is not limited to the application of the embodiments described above, and various modifications are possible within the scope of the claims and the technical ideas described in the specification and drawings. [Explanation of symbols]

[0051] 1: conveying system, 2: loader / unloader device, 3: control unit, 10: conveying vehicle, 10A: body, 11: chassis, 12: circuit board, 13: front wheel, 14: rear wheel, 15: axle, 16: gear pulley, 17: support base, 18: third sensor, 20: drive unit, 21: electric motor, 21a: output shaft of electric motor, 22: battery, 23: gear pulley, 24: timing belt, 30: control unit, 31: receiving unit, 32: transmitting unit, 40: lifting unit, 41: cassette, 42: hanging member, 50: travel lane, 50a: opening, 100A, 100B...: processing device, 101: cassette stage, 110: touch panel, 111: speed change unit, 112: transmission button, 120: transmission unit, L1, L2: travel distance of the transport vehicle, M1: first mark, M2: second mark, P0: initial position, P1: first position, P2: second position, R: clean room, S1, S2: delivery station, V: conventional running speed, V1: first running speed, V2: 2nd traveling speed

Claims

1. A conveying system including a control unit that controls a conveying vehicle that travels on a travel lane installed above a plurality of processing devices and conveys workpieces to the processing devices, A conveying system characterized in that the control unit controls the travel of the conveying vehicle so that a second travel speed of the conveying vehicle when transporting a workpiece processed by the processing device is slower than a first travel speed of the conveying vehicle when transporting an unprocessed workpiece.

2. The control unit and the receiving unit are provided on the transport vehicle, The processing device is provided with a speed change unit that changes the travel speed of the transport vehicle, and a transmission unit that transmits the travel speed changed by the speed change unit to the receiving unit provided on the transport vehicle, 2. The transportation system according to claim 1, wherein the control unit causes the transportation vehicle to travel at the travel speed received by the receiving unit.

3. The processing device is provided with a touch panel, 2. The conveying system according to claim 1, wherein the touch panel includes the speed change unit and a transmission button for transmitting the travel speed changed by the speed change unit from the transmitting unit to the receiving unit.

4. 4. The transport system according to claim 2, wherein the speed changer sets the second travel speed for each type of processing of the workpiece.

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