Electronic apparatus heat scattering system in pure water shower

Abstract

To provide a heat scattering system in which water with high specific heat capacity is used for scattering heat of an electronic apparatus as a coolant of a direct liquid cooling.SOLUTION: A new type heat scattering system constructed by a chassis 1, an ultrapure water device, and a cooling device that reduces a water temperature, directly showers ultrapure water as cooling water to an electric board 29 and scatters electric heat with a fluidization water. In the chassis, the electric board of a heat scattering object is mounted in a longitudinal arrangement to a vertical direction, a water supply port pipe is penetrated to an upper part of the chassis, and a shower sprinkler 28 is mounted. In a bottom part of the chassis, a taper groove 30 is provided, and a water filter 31 is mounted to an inner wall. The ultrapure water device refines the ultrapure water in a reverse osmosis at two times to obtain cooling water for scattering heat. The ultrapure water is dumped on the electric board with the shower sprinkler, and heat of the electric board is discharged with the fluid water, and a temperature of the water collected with the taper groove is reduced with the cooling device and is reused. In order to prevent impregnation of a water molecular into an internal part of an electron device, a hydrophobic film is previously coated to the electric board.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to the technical field of thermal management and heat dissipation, and in particular to electrical heat dissipation and heat dissipation technology and device for electronic devices. [Background technology]

[0002] As we all know, with the continuous improvement of IC chip integration and circuit board packaging density, the performance of electronic devices such as computer servers and communication devices has been greatly improved, but the dissipation rate of electrical heat per unit density of the electrical board of the device has also increased rapidly. The temperature rise of electronic devices caused by electrical heat not only reduces the performance of electronic devices, but also leads to the deterioration of the quality of electronic components and electronic device failure. According to some statistics, 65% to 80% of electronic device failures are caused by the damage of electronic devices and electronic component materials due to high temperatures caused by electrical heat. Therefore, efficient heat dissipation of electrical circuit boards has become an important factor to ensure the normal operation of electronic devices.

[0003] Currently, the most common method of heat dissipation for electronic devices is forced air cooling. In other words, air is used as a refrigerant, and a fan is used to forcibly stir the air around the heat-generating electronic components to promote air flow, and the flowing air absorbs and dissipates electrical heat. For this reason, various radiator technologies have been developed to improve heat dissipation performance, increasing the contact area between the heat-generating device and the air, increasing the convective conductivity of the heat dissipation surface, and otherwise improving the heat exchange rate with the heat-generating components.

[0004] However, there is a limit to the efficiency of air as a refrigerant, so for electronic devices with high power and high heat density, "liquid cooling" is used, in which a liquid with better heat conductivity than air is used as the refrigerant. Liquid refrigerants have a much higher thermal conductivity and specific heat than air, and can achieve a much higher heat exchange rate than air. There are two types of "liquid cooling" technologies: "indirect liquid cooling" and "direct liquid cooling", as described below. "Indirect liquid cooling" method: The coolant does not come into direct contact with the electronic device, but is enclosed in a sealed cold plate, which is in close contact with the heat-generating device on the electrical board, and the coolant absorbs and dissipates the heat from the electronic device through the cold plate. "Direct liquid cooling" method: The refrigerant liquid / cooling liquid comes into direct contact with the heat-generating electronic device, directly exchanging heat with the heat-generating device and absorbing and dissipating heat. By directly immersing the electronic board of the electronic device in the cooling liquid, not only is the heat exchange and heat dissipation effect higher than "indirect" contact with the cooling liquid, but it also does not require a complex and precise cold plate structure design, and the versatility and reliability of the system are also improved.

[0005] In "direct liquid cooling", the electric boat is directly immersed in the cooling liquid, so the cooling liquid used must be electrically insulating and chemically stable. Legacy electric cooling liquids include transformer oil, liquid nitrogen, and liquid ammonia, but new electric electronic cooling liquids, called e-liquids, which are artificial compound liquids based on fluorine, have also been developed. The above-mentioned electrical coolants have high operating and manufacturing costs and various limitations in their use, making them unable to be used on a large scale. Currently, they are only used for heat dissipation in a very small number of relatively expensive electronic devices, such as supercomputers and power amplifiers for television broadcasting, or in electrical devices used in high-temperature and harsh environments.

[0006] On the other hand, water is the liquid with the largest specific heat capacity in nature, and is the most commonly used coolant for "indirect liquid cooling" systems. "Pure water" without impurities is electrically insulating and has stable chemical properties. Therefore, "pure water" is considered to be the most ideal coolant.

[0007] However, water is also a solvent, and if pure water is left in the natural environment for a long period of time, it will dissolve gases in the surrounding air and objects it is immersed in, causing the quality and purity of the pure water to deteriorate, and its electrical insulation properties may also decrease. Therefore, it is necessary to devise ways to maintain the "quality" of the pure water used for cooling and to recycle the pure water that has been used. Summary of the Invention [Problem to be solved by the invention]

[0008] In order to solve or mitigate the problems existing in the current heat dissipation technology for electrical equipment, the present invention proposes a liquid cooling heat dissipation system for electronic equipment that showers ultrapure water directly onto the electric boat of the electronic equipment, and hopes to provide at least a useful alternative to the liquid cooling technology for electronic equipment. [Means for solving the problem]

[0009] The liquid cooling heat dissipation system of the present invention is characterized in that it is composed of three functional blocks: a chassis (1) that houses the electrical board, an ultrapure water device (2) that produces ultrapure water, and a cooling device (3) that cools the hot water.

[0010] The chassis has electric boards arranged vertically to the ground. A water launch pipe penetrates the top of the chassis, and a shower sprinkler is attached to the inner end. The shower sprinkler sprays cooling water over the entire electric board, and the flowing water absorbs and flows away the heat of the electronic devices on the electric board, dissipating the heat from the electric board. The water sprayed on the electric board flows naturally by gravity along the electric board to the bottom of the chassis, and water does not accumulate around the electronic devices. A tapered groove is provided at the bottom of the chassis to receive the water showered over the electric board. A water filter is attached to the inner wall of the tapered groove to filter out dust and impurities contained in the water used to wash the electric board. A water outlet pipe penetrates the bottom of the tapered groove, and this pipe sends the water that has absorbed the heat from the electric board to a cooling device and is recycled.

[0011] The ultrapure water system includes functional components such as a raw water tank, a prefilter, a primary reverse osmosis host, a pure water tank, and a secondary reverse osmosis host. The raw water tank stores tap water, well water, etc. The stored water is sent to the pre-filter by a booster pump, where residual chlorine, free chlorine, particulates, and other suspended impurities are removed from the water. The raw water from which suspended impurities have been removed is pumped into the primary reverse osmosis host by a high-pressure pump. Electrolytes and impurity ions dissolved in the raw water are removed by reverse osmosis and ion exchange treatment, and pure water that is almost electrically insulated and free of conductive ions is obtained, which is then stored in a pure water tank. In order to obtain even purer "ultrapure water," the present invention employs a two-stage reverse osmosis ion exchange treatment method to continuously produce ultrapure water. The ultra-pure water obtained through a two-stage reverse osmosis process is showered directly onto the power boat and used as a coolant to dissipate heat from electronic devices.

[0012] The cooling device absorbs the heat from the electric boat and cools the warm water. The recovered water, whose temperature has been lowered by the cooling device, is sent to a pure water tank for reuse.

[0013] Furthermore, the present invention considers that the characteristics and quality of electronic devices may deteriorate due to the penetration of water molecules when they are submerged in water for a long time, and adds a method in which, in order to prevent water from penetrating into the electronic device or water from accumulating around the device for a long time due to water tension, the electronic device is subjected to a waterproof and hydrophobic protection treatment before the electric board is used, and an ultra-thin hydrophobic waterproof film with a thickness of only a few microns is formed on the surface of the electric board and the electronic device. The ultra-thin hydrophobic waterproof film does not interfere with the heat dissipation of the electronic device, prevents water molecules from penetrating into the electronic device and getting wet, and prevents water deterioration of electronic devices exposed to water for a long time. Effect of the Invention

[0014] It is believed that the adoption of the present invention provides the following advantages and effects. 1. The technical solution of this invention uses water as a coolant, and directly pours water on the electric board and electronic devices to absorb and dissipate heat from the electronic devices. Water has the largest specific heat capacity in nature, and it is calculated that it can dissipate heat about ten times more effectively than air as a coolant. In particular, in a small space where a large number of electronic devices are concentrated in a high heat density environment, pouring water directly on the heating element is the most effective way to dissipate heat. 2. The present invention proposes an ultrapure water shower system. Using flowing water to dissipate heat from electronic devices not only has a high heat dissipation effect, but the water exposed to the electronic devices is always fresh and flowing ultrapure water, so there is no accumulation of impure water around the electronic devices, and the system is highly reliable. 3. The present invention is equipped with a filter in the water collecting groove at the bottom of the chassis, which can filter out dust particles mixed in the water showered over the electric boat and electronic devices, facilitating re-purification and purification. The repeated use of pure water for cooling can reduce the operating costs of the system and avoid the generation of a large amount of waste. [Brief description of the drawings]

[0015] In order to more clearly show the embodiments or technical solutions of the present invention, the following briefly introduces drawings that need to be used in the embodiments or technical description. These drawings are only some embodiment examples shown in this application, and those skilled in the art can obtain other implementation drawings based on these drawings without making creative efforts. [Figure 1] FIG. 2 is a top view of the three-dimensional structure of the present invention. [Diagram 2] FIG. 2 is a top view of the structure of the present invention. [Diagram 3] FIG. 1 is a front structural view of the present invention. [Figure 4] FIG. 3 is an enlarged structural view of part A in FIG. 2 of the present invention. [Diagram 5] FIG. 3 is an enlarged structural view of region B in FIG. 2 of the present invention. [Figure 6] FIG. 3 is an enlarged structural view of region C in FIG. 2 of the present invention. [Figure 7] FIG. 4 is a cross-sectional view of the DD side of FIG. 3 (image of the internal structure of the chassis). [Figure 8] FIG. 4 is an enlarged structural view of region E in FIG. 3 of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] In the following, only some exemplary embodiments are briefly described. As can be understood by those skilled in the art, all the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention. Thus, the drawings and descriptions should be regarded as illustrative in nature, and not restrictive.

[0017] The embodiment of the present invention proposes a heat dissipation system as shown in Figures 1 to 8. This system is mainly composed of three functional blocks: a chassis (1), an ultrapure water generator (2), and a hot water cooling device (3).

[0018] The chassis (1) has electric circuit boards (29) to be dissipated heat arranged in a vertical array; the ninth pipe (20) penetrates the top of the chassis (1), and a water shower sprinkler (28) is attached to the inner end of the pipe; a tapered groove (30) is installed at the bottom of the chassis (1), and a water filter (31) is installed on the inner wall of the tapered groove (30); the eleventh pipe (23) penetrates the inner wall of the tapered groove (30). The outer end of the eleventh pipe (23) is connected to the cooling device (3).

[0019] The ultrapure water generating apparatus (2) has functional components for generating ultrapure water, such as a raw water tank (202), a primary reverse osmosis host (203), a pure water tank (204) and a secondary reverse osmosis host (205), mounted on a base (201). The raw water tank (202) temporarily stores external water (tap water, well water, etc.) and serves as a water supply source for the continuous operation of the system. The primary reverse osmosis host (203), the pure water tank (204) and the secondary reverse osmosis host (205) functional components are connected in series to continuously produce ultrapure water.

[0020] The cooling device (3) absorbs the heat from the electric boat and dissipates it to lower the temperature of the hot water flowing from the chassis (1). The cooled water is then returned to the pure water tank (204) and is once again reprocessed by reverse osmosis, making it an important device for recycling ultrapure water.

[0021] In actual practice, the electric boat (29) to be dissipated heat is subjected to a hydrophobic protection treatment before being mounted on the chassis (1), and an ultra-thin hydrophobic film with a thickness of only microns is formed on the surface of the electric boat and the electronic devices mounted thereon. The thin, non-adhesive hydrophobic film does not impede the heat dissipation of the electronic devices, and prevents the penetration of water molecules into the electronic devices that are exposed to water for a long time, thereby preventing deterioration of the electronic devices due to water ingress.

[0022] In one embodiment, a pre-filter (7) for filtering impurities from the raw water, an activated carbon filter (8), a sodium ion softener (11), and a precision filter (11) are installed on the base (201), and each filter is connected in the order described above by a third pipe (9).

[0023] In one embodiment, a booster pump (4) is installed on the base (201) and is connected to the raw water tank (202) via a first pipe (5), and the water output from the booster pump (4) is sent to a pre-filter (7) via a second pipe (6).

[0024] In one embodiment, a first high pressure pump (13) is installed on the base (201) and receives the output of the precision filter (11) through a fourth pipe (12). The output of the first high pressure pump (13) is sent to the primary reverse osmosis host (203) through a fifth pipe (14).

[0025] In one embodiment, the controller 19 is mounted on the base 201 .

[0026] In one embodiment, a water supply pipe (25) is provided at the water inlet of the raw water tank (202), and a third solenoid valve (26) is inserted into the water supply pipe (25) to control the water supply. Also, a first solenoid valve (21) is inserted into the ninth pipe (20), and a second solenoid valve (24) is inserted into the eleventh pipe (23).

[0027] In one embodiment, a door body (27) is attached via a pin shaft to the front surface of the housing of the chassis (1). A door handle (32), a door locker (33), and a locker catcher are attached to the door body (27).

[0028] The operation flow of the system according to one embodiment of the present invention is as follows: the third solenoid valve (26) is opened and raw water is poured into the raw water tank (202) through the water supply pipe (25). When the raw water tank (202) is full of raw water, the third solenoid valve is closed. Then, the booster pump (4) is started and the raw water in the raw water tank (202) is poured into the pre-filter (7) through the second pipe (6). The pre-filter (7) filters out solid particle impurities in the raw water, and then passes the raw water through the third pipe (9) to the activated carbon filter (8), sodium ion softener (10) and precision filter (11) in that order to filter out residual chlorine, free chlorine, fine particles and other suspended matter particles in the raw water. Then, the first high pressure pump (13) is started, and the filtered raw water is injected into the first reverse osmosis host (203) through the fourth pipe (12) and the fifth pipe (14), and the microorganisms and ions remaining in the raw water are removed, and it becomes almost electrically insulated pure water. The purified pure water is once injected into the pure water tank (204) through the sixth pipe (15) and stored. After this, the second high pressure pump (17) is started, and the pure water in the pure water tank (204) is injected into the secondary reverse osmosis host (205) through the seventh pipe (16) and the eighth pipe (18), and further undergoes secondary purification processing to become ultrapure water. When the first solenoid valve (21) is in the open state, the ultrapure water that has been subjected to the secondary purification processing is sent to the chassis (1) through the ninth pipe (20), and is showered by the shower sprinkler (28) on the electric boat (29) to dissipate heat from the electronic device. Since the electrochemical boat (29) is arranged vertically, the showered water does not stagnate above the electrochemical boat (29), and the hot pure water flows into the tapered groove (30) at the bottom of the chassis. The tapered filter (31) filters out dust particles mixed in the water used to wash the electrochemical boat (29), and the filtered water is sent to the cooler (3) through the eleventh pipe (23), where it is cooled and then collected in the pure water tank (204). The second solenoid valve (24) controls the amount of collected water. The tapered filter (31) and the secondary reverse osmosis host (205) remove impurities and residual ions mixed in or dissolved in the ultrapure water showered through the electrochemical boat (29) when it is used. The ultrapure water is circulated to maintain its quality at all times. [Industrial Applicability]

[0029] One example of industrial use of the present invention is as a power saving measure in data centers. As we all know, data centers are facilities that consolidate and operate computers, servers, network communication devices, and other electronic devices, and are positioned as an essential basic infrastructure in modern society. According to a statistical survey in 2022, the electricity consumption of data centers already accounts for just over 2% of the world's electricity. Therefore, energy conservation measures for data centers are a top priority.

[0030] According to statistical data, approximately 45% of the electricity consumed by currently operating data centers is consumed by air conditioning. This is because the electronic devices housed in the data center emit a large amount of heat when they are in operation, and in order to dissipate that heat and ensure that the electronic devices can function normally, it is necessary to create cool air using powerful air conditioning and maintain a low ambient temperature in the data center at all times. Improving the heat dissipation efficiency of electronic devices and eliminating the need to maintain a low ambient temperature can reduce the electricity consumed by data centers for air conditioning, which is considered to be the most effective power saving measure for data centers.

[0031] This invention uses water, which has the highest specific heat capacity, instead of air as a refrigerant, and directly showers ultrapure water onto the electrical board to dissipate heat from the electrical device. This not only achieves a heat dissipation effect several dozen times greater than forced air cooling, but also eliminates the need to always set a low environmental temperature in the data center, and reduces the electricity used for air conditioning. [Explanation of symbols]

[0032] 1=chassis; 2=ultrapure water generator; 201=base; 202=raw water tank; 203=primary reverse osmosis host; 204=pure water tank; 205=secondary reverse osmosis host; 3=cooling system; 4=booster pump; 5=first pipe; 6=second pipe; 7=prefilter; 8=activated carbon filter; 9=third pipe; 10=sodium ion softener; 11=precision filter; 12=fourth pipe; 13=first high pressure pump; 14=fifth pipe; 15=sixth pipe; 16=seventh pipe; 17=second high pressure pump; 18=eighth pipe; 19=controller; 20=ninth pipe; 21=first solenoid valve; 22=tenth pipe; 23=eleventh pipe; 24=second solenoid valve; 25=supply pipe; 26=third solenoid valve; 27=chassis door; 28=shower sprinkler; 29=electric boat; 30=tapered groove; 31=tapered filter; 32=door handle; 33=door locker; 34=locker catcher.

Claims

1. This is a heat dissipation system for electronic devices that is characterized by being composed of three functional blocks: a chassis (1) that houses the electrical board, an ultrapure water device (2) that produces ultrapure water, and a cooling device (3) that cools the hot water.

2. The new heat dissipation system described in claim 1 is characterized in that ultrapure water is used as a refrigerant and is showered directly onto an electrical circuit board, with the flowing ultrapure water absorbing the electrical heat generated by the electronic devices on the electrical board, thereby dissipating the heat from the electronic devices.

3. In the heat dissipation method for electronic devices described in claim 2, water is directly sprayed onto the electric circuit board (29) using water as a coolant. In order to prevent water from entering the electronic devices, the electric boards are arranged vertically in a vertical row inside the chassis, and the sprayed water naturally flows downward along the electric circuit board due to the pull of gravity, so that water does not always accumulate around the electronic devices.

4. In the heat dissipation method for electronic devices described in claim 2, since the electronic device is exposed to water for a long period of time, in order to prevent deterioration due to the penetration of water molecules when the electronic device is placed in a humid environment for a long period of time, a hydrophobic and waterproofing measure is taken in advance before the electrical board to be heat dissipated and cooled is placed on the chassis, and an extremely thin water-repellent film is coated on the surface of the electrical board and the electronic device placed thereon.

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