Reconfigurable mainframe with replaceable interface plates

Abstract

To provide a reconfigurable mainframe in an electronic device fabrication system including replaceable interface plates.SOLUTION: In a device fabrication system 100A, a mainframe 104 includes a base, a plurality of facets 101A-101D on the base, an a lid over the plurality of facets including frames. The base, the lid and the plurality of facets together define an interior volume 134 that includes a robot arm 136. Replaceable interface plates 128A-131 are attached to the frames of the facets. The replaceable interface plates include a plurality of substrate access ports 132. Substrate access ports are configured such that the robot arm can access process chambers 106-116.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001]

[0001] Embodiments of the present disclosure relate generally to electronic device manufacturing systems, and more particularly to a reconfigurable mainframe of an electronic device manufacturing system that includes a replaceable interface plate. Embodiments also relate to a replaceable interface plate for the mainframe. [Background technology]

[0002]

[0002] A conventional electronic device manufacturing system (also referred to as a device manufacturing system) may include a mainframe with multiple processing chambers and load lock chambers arranged around it. The mainframe may have several side walls (commonly referred to as "facets") to which the processing chambers and / or load lock chambers are coupled. The facets of a conventional mainframe are machined to have a predetermined configuration with substrate access ports having a predetermined size, location, etc. When a conventional mainframe is manufactured, the type, size, arrangement, and location of the substrate access ports are fixed for that mainframe. If the owner of the mainframe desires a new configuration, a new mainframe with the new configuration is purchased. Summary of the Invention

[0003]

[0003] According to a first aspect of the disclosure, a mainframe of a device manufacturing system includes a base, a plurality of facets on the base, and a lid on the plurality of facets. A first facet of the plurality of facets includes a first frame. The base, the lid, and the plurality of facets together define an interior space including a robot arm. A first interchangeable interface plate is attached to the first frame of the first facet. The first interchangeable interface plate includes a plurality of substrate access ports. The first substrate access port of the plurality of substrate access ports is configured to allow the robot arm to access a first processing chamber. The second substrate access port of the plurality of substrate access ports is configured to allow the robot arm to access a second processing chamber. In an embodiment, the first interchangeable interface plate is load-bearing and the frame is not load-bearing.

[0004]

[0004] According to a second aspect of the present disclosure, a replaceable interface plate is configured to be attached to a facet of a mainframe. The replaceable interface plate includes a plurality of substrate access ports. A first substrate access port of the plurality of substrate access ports is configured to provide access from the mainframe to a first processing chamber. A second substrate access port of the plurality of substrate access ports is configured to provide access from the mainframe to a second processing chamber. The replaceable interface plate is load-bearing with respect to the mainframe. Thus, the replaceable interface plate is configured to withstand a vertical force on the mainframe caused by a pressure difference between an interior space of the mainframe and an exterior of the mainframe.

[0005]

[0005] According to a third aspect of the present disclosure, a method of configuring a mainframe includes determining a first plurality of processing chambers to be coupled to a first facet of the mainframe, determining locations of a plurality of substrate access ports on the facet housing the first plurality of processing chambers, determining a configuration of a first interchangeable interface plate having one of the plurality of substrate access ports at a respective location, and manufacturing the first interchangeable interface plate. The method further includes attaching the first interchangeable interface plate to the first facet of the mainframe and attaching the plurality of processing chambers to the first interchangeable interface plate, each of the plurality of processing chambers being accessible from the mainframe via a substrate access port of the plurality of substrate access ports. The method may be performed after the mainframe is manufactured (e.g., to change the configuration of the mainframe).

[0006]

[0006] The present disclosure is shown by way of example, and not limitation, in the accompanying drawings, in which like elements are designated by like reference numerals. It should be noted that various references to "an" or "one" embodiment in the present disclosure are not necessarily to the same embodiment, and such references mean at least one. [Brief description of the drawings]

[0007] [Figure 1A] 1 illustrates a schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a first configuration, according to one embodiment of the present disclosure. [Figure 1B] FIG. 2 illustrates a schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a second configuration, according to an embodiment of the present disclosure. [Figure 1C] FIG. 1 illustrates a schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a third configuration, according to an embodiment of the present disclosure. [Figure 2A]FIG. 2 is a perspective view illustrating a reconfigurable mainframe according to one embodiment of the present disclosure. [Figure 2B] FIG. 2 is a side view of a first exemplary interchangeable interface plate, according to an embodiment of the present disclosure. [Figure 2C] FIG. 13 is a side view of a second exemplary interchangeable interface plate, according to an embodiment of the present disclosure. [Figure 2D] FIG. 13 is a side view of a third exemplary interchangeable interface plate, according to an embodiment of the present disclosure. [Diagram 3] 1 shows a cross-sectional side view of a main frame and attached interchangeable interface plate taken at the board access port, according to one embodiment of the present disclosure. [Figure 4] 1 illustrates a cross-sectional side view of a mainframe and attached replaceable interface plate taken at a frame column of the mainframe, according to one embodiment of the disclosure. [Diagram 5] 1 illustrates a process for assembling a reconfigurable mainframe of an electronic device manufacturing system according to one embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008]

[0017] The embodiments are directed to a reconfigurable mainframe (also referred to as a transfer chamber) having one or more replaceable interface plates. The reconfigurable mainframe includes a plurality of facets, at least one of which includes a frame configured to receive a replaceable interface plate. In one embodiment, the reconfigurable mainframe includes a frame for each facet of the reconfigurable mainframe. A replaceable interface plate may be attached to each of the frames. A lid may be placed over the frame of the facet and may be secured to the replaceable interface plate. In an embodiment, the replaceable interface plate is load-bearing and the frame is not load-bearing. Thus, when the interior space of the mainframe is evacuated to a vacuum by a pump, vertical (and horizontal) forces are maintained by the replaceable interface plate, but little or no force is applied to the frame.

[0009]

[0018] In some embodiments, the mainframe may have a square or rectangular shape. One or more load lock chambers may be coupled to one facet of the mainframe. In one embodiment, one or more load lock chambers are coupled to an interchangeable interface plate on one facet of the mainframe. In one embodiment, additional interchangeable interface plates are connected to one or more additional facets of the mainframe, and one or more processing chambers are coupled to some or all of the additional interchangeable interface plates. The processing chambers may perform various substrate processes, and the processing chambers coupled to different interchangeable interface plates on the facets may, for example, be different sizes, have different sized substrate access ports, have different connection types, and have different heights. For example, some substrate access ports may include heights that accommodate two end effectors with different pitches. Also, each interchangeable interface plate may be configured to couple to the same or different numbers of processing chambers and / or load lock chambers. For example, one interchangeable interface plate may be configured to couple to a single processing chamber of a first size, a second interchangeable interface plate may be configured to couple to two processing chambers of a second size, each different from the first size, and so on. One or more substrate access ports on each interchangeable interface plate may interface with each of the load lock chambers and processing chambers and the transfer chamber to allow transfer of substrates therebetween. The substrate access ports may be sized and positioned on each interchangeable interface plate to accommodate the number and size of chambers that may be coupled to each facet. An electronic device manufacturing system having such a mainframe may allow a wider range and more diverse sequences of substrate processing to be performed on a single system, thus increasing the versatility, capacity, and / or efficiency of such an electronic device manufacturing system.In another aspect, a method of assembling an electronic device manufacturing system is provided.

[0010]

[0019] The reconfigurable mainframe and replaceable interface plate disclosed in the embodiments provide multiple advantages over conventional mainframes. Conventional mainframes have a single design that is determined at the time of manufacture. This single design has a fixed number of board access ports with fixed sizes and fixed positions. If it is advantageous in any case to change the configuration of such a conventional mainframe, the effective option would be to purchase a new mainframe with the new configuration. In contrast, a reconfigurable mainframe can be reconfigured at any time by manufacturing a new replaceable interface plate. If a new configuration is beneficial, one or more new replaceable interface plates with the new configuration may be manufactured. The existing replaceable interface plate can then be removed from the mainframe, and the new replaceable interface plate can be attached to the mainframe. Thus, the flexibility of the mainframe is significantly improved in the embodiments. Additionally, the mainframe can be updated with new replaceable interface plates as new processing chambers become available, new slit valve technologies are developed, new local center detection (LCF) technologies are developed (e.g., using light emitting diodes (LEDs), lasers and / or other scanning methods to determine where the wafer is within the robot blade or end effector pocket), etc., thereby extending the useful life of the mainframe. Older replaceable interface plates with older slit valve technologies, older local center detection technologies, etc. can be replaced with newer replaceable interface plates with newer slit valve technologies and / or new local center detection technologies, for example.

[0011]

[0020] As used herein, the singular forms "a," "an," and "the" include plural referents unless the context clearly indicates otherwise. Thus, for example, reference to a "substrate" includes a single substrate (e.g., a single wafer) as well as mixtures of two or more substrates, reference to a "processing chamber" includes a processing chamber as well as mixtures of two or more processing chambers, and so forth.

[0012]

[0021] As used herein, the term "about" in reference to a measured quantity refers to normal variations in the measured quantity that are expected when one of ordinary skill in the art makes the measurements and exercises a certain level of care and precision of the measuring equipment. In certain embodiments, the term "about" includes the indicated numerical value ±10%, such as, for example, "about 10" includes 9 to 11.

[0013]

[0022] Ranges of values ​​provided herein are intended only to serve as a shorthand method for individually referring to each value falling within the range, unless otherwise indicated herein, and each value is incorporated into the specification as if it were individually recited herein. All methods described herein may be performed in any suitable order, unless otherwise indicated herein or clearly contradicted by context. Any and all examples provided herein, or the use of exemplary language (e.g., "etc.") are intended merely to indicate particular materials and methods, and do not present limitations on the scope. No language in this specification should be construed as indicating any non-claimed element as essential to the practice of the disclosed materials and methods.

[0014]

[0023] 1A-1C show schematic top-down views of an electronic device manufacturing system having a reconfigurable mainframe. FIG 1A shows a schematic top-down view of a first configuration 100A of the electronic device manufacturing system according to one embodiment of the present disclosure. FIG 1B shows a schematic top-down view of a second configuration 100B of the electronic device manufacturing system according to one embodiment of the present disclosure. FIG 1C shows a schematic top-down view of a third configuration 100C of the electronic device manufacturing system according to one embodiment of the present disclosure.

[0015]

[0024] The electronic device manufacturing system may include a main frame (also referred to as a transfer chamber) 104 configured to process substrates and having four facets 101A-101D. Although the four facets 101A-101D are shown in a rectangular configuration, the main frame 104 may alternatively have other numbers of facets (e.g., five facets, six facets, seven facets, eight facets, etc.) and / or other shapes. In embodiments, the facets may have the same size (e.g., the same width) or different widths. In one embodiment, the main frame 104 has a rectangular shape, the facets 101A and 101C are approximately parallel to one another, the facets 101B and 101D are approximately parallel to one another, and the facets 101A and 101C are approximately perpendicular to the facets 101B and 101D. In one embodiment, the facets 101B and 101D have a first length that is at least twice the second length of the facets 101A and 101C. In one embodiment, facets 101B and 101D have a length of about 100-150 inches, and facets 101A and 101C have a length of about 40-60 inches. In one embodiment, main frame 104 has a pentagonal shape. In one embodiment, main frame includes a first facet having a first length, a second facet and a third facet on either side of the first facet, each having a second length greater than the first length, and a fourth facet and a fifth facet connected to the second facet and the third facet, respectively, each having a third length greater than or equal to the first length and less than the second length.

[0016]

[0025] The main frame 104 may include an interior space 134, and the facets 101A-101D may define sidewalls of the interior space 134. The main frame 104 may further include a base (not shown) and a lid (not shown). The facets 101A-101D, the base, and the lid together may define the interior space 134. A robot arm (also referred to as a robot assembly) 136 may be disposed within the interior space 134 of the main frame 104. The interior space 134 may typically be under a vacuum during operation of the main frame 104.

[0017]

[0026] Each of the facets 101A-101D may comprise a frame and may have an interchangeable interface plate attached to it. Alternatively, a subset of the facets 101A-101D may comprise a frame with an interchangeable interface plate attached to it. The other facets may be manufactured in a conventional manner incorporating sidewalls having a fixed configuration. For each facet having a frame rather than a fixed configuration, an interchangeable interface plate may be attached to the facet's frame and may form the sidewalls of the facet. At any time, an existing interchangeable interface plate attached to a facet may be removed and a new interchangeable interface plate having a different design may be attached to that facet. Thus, the mainframe 104 is a reconfigurable mainframe having a flexible design.

[0018]

[0027] 1A, interchangeable interface plate 128A is attached to facet 101B, interchangeable interface plate 129 is attached to facet 101C, interchangeable interface plate 130A is attached to facet 101D, and interchangeable interface plate 131 is attached to facet 101A. Interchangeable interface plate 128A has three substrate access ports 132. Each substrate access port 132 may be configured to allow a horizontally oriented substrate 140 to pass therethrough. Substrate 140 may be a wafer (e.g., a semiconductor wafer or a non-semiconductor device substrate), a glass plate or panel, and / or other workpiece used to fabricate electronic devices or circuit components. Each substrate access port 132 may be, for example, an elongated slot or slit formed in a sidewall of the main frame 104 or the interchangeable interface plate 128A, 130A, and each may include, for example, a slit valve or other suitable device for opening and closing the substrate access port 132, and / or a local center detector (LCF) suitable for determining the position of the substrate 140 transferred through the substrate access port 132. The slit valve may be of any suitable conventional structure, such as, for example, an L-motion slit valve. Other suitable devices may also be used to open and close the substrate access port 132. The substrate access port 132 may include, in embodiments, a single gate or a dual gate (e.g., having a first gate internal to the interchangeable interface plate at the substrate access port and a second gate external to the interchangeable interface plate at the substrate access port).

[0019]

[0028] Mounted on the interchangeable interface plate 128A are three processing chambers 106, 108, 110. Each of the processing chambers 106-110 has a chamber port that aligns with a substrate access port 132 in the interchangeable interface plate 128A.

[0020]

[0029] The interchangeable interface plate 130A has three substrate access ports 132. Three processing chambers 112, 114, 116 are mounted on the interchangeable interface plate 130A. Each of the processing chambers 112-116 has a chamber port that aligns with the substrate access ports 132 in the interchangeable interface plate 130A.

[0021]

[0030] The interchangeable interface plate 129 is a solid plate with no substrate access ports. The interchangeable interface plate 131 includes two substrate access ports 132. The interchangeable interface plate 131 is coupled to one or more load lock chambers 126 (which may include, for example, two side-by-side load lock chambers). Each of the load lock chambers 126 has a chamber port that aligns with one of the substrate access ports in the interchangeable interface plate 129.

[0022]

[0031] Each of the load lock chambers 126 may be a batch type or a single substrate type load lock chamber. In some embodiments, the process chambers 126 may be stacked load lock chambers. For example, the load lock chambers 126 may be dual stacked load lock chambers, triple stacked load lock chambers, load lock chambers with four or more stacked load locks (e.g., quad load lock chambers), etc. Alternatively, the load lock chambers 126 may be single volume load lock chambers. Each load lock chamber 126 may have one or more chamber ports corresponding to the respective substrate access ports 132. For example, a stacked load lock chamber 126, which may have two separate substrate spaces, may have two vertically aligned chamber ports each corresponding to the vertically aligned substrate access ports 132. A triple stacked load lock chamber, which may have three separate substrate spaces, may have three vertically aligned chamber ports corresponding to the vertically aligned substrate access ports. A single volume load lock chamber may have a single chamber port corresponding to the substrate access port 132. Any one or more of the load lock chambers 126 may be stacked load lock chambers, triple stacked load lock chambers, and / or single volume load lock chambers. Also, in some embodiments, any one or more of the load lock chambers 126 may be chambers with processing capabilities. That is, any one or more of the load lock chambers 126, or any one of the volumes located therein, may be capable of performing pre-heating, mitigation, cooling, and / or other processing steps on a substrate.

[0023]

[0032] The mainframe 104, the processing chambers 106-116, and / or the load lock chamber 126 may each operate at vacuum pressure. The processing chambers 106-116 may perform the same or different processes on the substrate 140, including, for example, deposition, oxidation, nitridation, etching, polishing, cleaning, lithography, inspection, etc. Other processes may also be performed therein.

[0024]

[0033] The main frame 104 may further include a robot assembly 136 within the interior space 134. The robot assembly 136 may be configured to transfer one or more substrates 140 into and out of each of the processing chambers 106-116 and the load lock chamber 126. The robot assembly 136 may be configured to transfer the substrates 140 directly from any one chamber to any other chamber of the main frame 104. In some embodiments, the substrates 140 may be transferred by the robot assembly 136 in any order or direction. In some embodiments, the robot assembly 136 may have dual transport blades that can be independently extended from and retracted into any chamber attached to the main frame 104, allowing for simultaneous parallel substrate transfers, thereby increasing the throughput of the system. In some embodiments, the robot assembly 136 may have only a single transport blade and / or may be a SCARA (Selectively Adaptive Articulated Robot Arm) robot. Alternatively, the robot assembly 136 may be any suitable mechanism for transferring substrates between the chambers mounted to the mainframe 104, such as a linear or non-linear robot.

[0025]

[0034] The load lock chambers 126 may be coupled to a factory interface 102, which may be coupled to one or more FOUPs (Front Opening Unified Pods) 118. The one or more load lock chambers 126 may provide a first vacuum interface between the factory interface 102 and the transfer chamber 126. In some embodiments, each of the load lock chambers 126 may increase substrate throughput by alternately communicating with the mainframe (transfer chamber) 104 and the factory interface 102. That is, one load lock chamber 126, or any one space of the stacked or triple stacked load lock chambers, may communicate with the transfer chamber 104, while the other load lock chamber 126, or other space of the stacked or triple stacked load lock chambers, may communicate with the factory interface 102. Substrate transfer between the factory interface 102, the load lock chambers 126, and the transfer chamber 104 may be performed in any other suitable manner.

[0026]

[0035] The FOUPs 118 may each be a container with a cassette mounted therein for holding multiple substrates. The FOUPs 118 may each have a front-opening interface configured for use with the factory interface 102. The factory interface 102 may have a buffer chamber (not shown) and one or more robot assemblies 138 configured to transfer substrates 140 via linear, rotational, and / or vertical motion between the FOUPs 118 and the load lock chambers 126. Substrates may be transferred between the FOUPs 118 and the load lock chambers 126 in any order or orientation. The load lock chambers 126 may be batch or single substrate load lock chambers.

[0027]

[0036] The controller 171 may control the operation of the robot assembly 138, the robot assembly 136, and / or the electronic device manufacturing system. The controller 171 may control the processing and transfer of the substrates 140 in and through the electronic device manufacturing system. The controller 171 may be, for example, a general purpose computer and / or may include a microprocessor or other suitable CPU (Central Processing Unit), memory for storing software routines that control the electronic device manufacturing system, input / output peripherals, and support circuits (e.g., power supplies, clock circuits, drive circuits for the robot assemblies 138, 136, cache, and / or the like). The controller 171 may be programmed to process one or more substrates sequentially, for example, through each of the processing chambers mounted on the mainframe 104. In other embodiments, the controller 171 may be programmed to process substrates in any order through the processing chambers. In still other embodiments, the controller 171 may be programmed to omit and / or repeat the processing of one or more substrates in one or more processing chambers. The controller 171 may alternatively be programmed to process one or more substrates in an electronic device manufacturing system in any suitable manner.

[0028]

[0037] The electronic device manufacturing system may have other suitable numbers of FOUPs 118 and / or load lock chambers 126. In some embodiments, the number of load lock chambers coupled to facet 101A may be independent of the number of processing chambers coupled to any one of facets 101B-101D. For example, the number of load lock chambers may be different than the maximum number of processing chambers coupled to a facet. Also, in some embodiments, up to four processing chambers may be coupled to a single facet, or more than four processing chambers may be coupled to a single facet, depending on the size of main frame 104 relative to the size of the four processing chambers.

[0029]

[0038] FIG. 1B shows the same FOUP 118, factory interface 102, load lock 126, and mainframe 104 as shown in FIG. 1A. However, in FIG. 1B, interchangeable interface plate 128A has been removed from facet 101B and interchangeable interface plate 128B has been attached to facet 101B. Similarly, interchangeable interface plate 130A has been removed from facet 101D and interchangeable interface plate 130B has been attached to facet 101D. Interchangeable interface plate 128B has two substrate access ports 132 as opposed to three substrate access ports 132 in interchangeable interface plate 128A. Similarly, interchangeable interface plate 130B has two substrate access ports 132 as opposed to three substrate access ports 132 in interchangeable interface plate 130A. Thus, in the second configuration 100B, processing chambers 106, 108, 112, and 114 have been rearranged and processing chambers 110 and 116 have been eliminated.

[0030]

[0039] FIG. 1C shows the same FOUP 118, factory interface 102, load lock 126, and mainframe 104 as shown in FIGS. 1A-1B. However, in FIG. 1C, interchangeable interface plate 128A has been removed from facet 101B and interchangeable interface plate 128C has been attached to facet 101B. Similarly, interchangeable interface plate 130A has been removed from facet 101D and interchangeable interface plate 130C has been attached to facet 101D. Interchangeable interface plate 128C has four substrate access ports 132 as opposed to the three substrate access ports 132 of interchangeable interface plate 128A. Interchangeable interface plate 130C has three substrate access ports 132, but they are in different locations than the three substrate access ports 132 of interchangeable interface plate 130A. In the third configuration 100C, processing chamber 112 remains in the same location, but processing chambers 106, 108, 110, 114, and 116 have been removed and replaced with processing chambers 122, 124, 125, and 127.

[0031]

[0040] As shown, any type of processing chamber may be connected to the facets of the mainframe 104 via interchangeable interface plates. Some examples of processing chambers include a quad processing chamber (e.g., including processing chambers 106-116), a single processing chamber (e.g., including processing chambers 125, 127), and a twin processing chamber (e.g., including processing chambers 122, 124). One exemplary processing chamber is:

[0032]

[0041] Each of the substrate access ports 132 may be the same size or may be different sizes. Each interchangeable interface plate 128A-128C, 130A-130C, 129, 131 may include the same or different number of substrate access ports 132, which may be similarly sized or differently sized. For example, some substrate access ports may have a first width (e.g., to accommodate 200 mm wafers), some substrate access ports may have a second width (e.g., to accommodate 300 mm wafers), and some substrate access ports may have a third width. The width of each substrate access port 132 is wide enough to at least allow a substrate 140 to pass through. The different sizes of the substrate access ports may enable the robot assembly 136 to reach different areas within a chamber coupled to any of the facets 101A-101D. In some embodiments where an interchangeable interface plate has two or more substrate access ports, the substrate access ports may not be laterally centered within the substrate interface plate and / or may not be equally spaced from one another. In some embodiments where an interchangeable interface plate has a single substrate access port, that substrate access port may be laterally centered at the facet or offset.

[0033]

[0042] In one embodiment, the interchangeable interface plate 128A is compatible with multiple additional interchangeable interface plates having a) a different number of substrate access ports than the interchangeable interface plate 128A, b) one or more substrate access ports at a different location compared to the multiple substrate access ports in the interchangeable interface plate 128A, c) one or more substrate access ports of a different size compared to the multiple substrate access ports in the interchangeable interface plate 128A, d) a different type of slit valve than the interchangeable interface plate 128A, and / or e) a different type of local center detector than the interchangeable interface plate 128A.

[0034]

[0043] Each of the interchangeable interface plates can have various numbers, sizes, and / or combinations of substrate access ports, provided that the width of the facets is suitable to accommodate the number, size, and / or combination of substrate access ports. For example, in some embodiments, an interchangeable interface plate may have one substrate access port 132 instead of three substrate access ports 132. In other embodiments, one interchangeable interface plate can have one substrate access port 132 of a first width and one substrate access port 132 of a second width, and another interchangeable interface plate can have one substrate access port of a first width and one substrate access port of a third width. Various combinations of substrate access ports can be possible if the facets have the appropriate widths. This allows the mainframe 104 to be customized to couple to a particular type and number of processing chambers and load lock chambers. In one example, the first width can be about 1.2 meters, the second width can be about 2.4 meters, and the third width can be about 800 mm.

[0035]

[0044] In some embodiments, two electronic device manufacturing systems can be clustered. That is, one facet of each mainframe 104, such as, for example, facet 101C of the first mainframe and facet 202 of the second mainframe, can each include an interchangeable interface plate that allows the two mainframes to be coupled together (e.g., with one or more load locks inserted between the two mainframes). The mainframes may be coupled to provide a pass-through chamber for transferring substrates between the two mainframes. This can further increase the versatility, capacity, and / or efficiency of such an electronic device manufacturing system.

[0036]

[0045] 2A illustrates a perspective view of a reconfigurable mainframe 200 according to one embodiment of the present disclosure. Reconfigurable mainframe 200 may correspond to mainframe 104 of FIGS. 1A-1C in one embodiment.

[0037]

[0046] The reconfigurable mainframe 200 includes a base 206 on which a set of frames are mounted. Each frame corresponds to and can be framed as a side or facet of the mainframe 200. The set of frames can conceptually be a single three-dimensional frame 201 with multiple frame faces, each of which faces a facet of the mainframe 200. The frame 201 can include columns 204A-204D and can further include beams 208A-208D connecting the columns 204A-204D. Each of the frames (or frame faces) can include a portion of the base, a pair of columns, and a corresponding beam connecting the pair of columns. For example, base 206, columns 204B-204C and beam 208A can constitute a first frame (or frame surface) for a first facet, base 206, columns 204A-204B and beam 208B can constitute a second frame (or frame surface) for a second facet, base 206, columns 204A and 204D and beam 208C can constitute a third frame (or frame surface) for a third facet, and base 206, columns 204C-204D and beam 208D can constitute a fourth frame (or frame surface) for a fourth facet.

[0038]

[0047] Each of the frames (or frame faces) may include a lip 210A, 210B within the base 206. The lips 210A-210B may be configured to support forces transmitted to the lips 210A-210B by a replaceable interface plate attached to the facet. Additionally, each of the frames (or frame faces) may include a groove or other feature to receive an O-ring 215, 220. The O-ring may seal the replaceable interface plate to the frame (or frame face).

[0039]

[0048] As shown, the interchangeable interface plate 230 is attached to a frame (or frame surface) of a facet of the main frame 200. The interchangeable interface plate 230 may be attached to the frame via bolts, screws, and / or other attachment mechanisms. The interchangeable interface plate 230 may include a configured number, size, and location of substrate access ports 234, 236, each of which may be configured to provide robot arm access to the processing chambers. The interchangeable interface plate 230 may also have slit valves (not shown), LCFs (not shown), and / or other components attached to or integrated into them.

[0040]

[0049] The replaceable interface plate 230 may be a metal plate. For example, the replaceable interface plate may be formed from aluminum, an aluminum alloy, steel, or another metal. In some embodiments, the replaceable interface plate includes a surface treatment, such as a coating or an anodized layer (e.g., an Al2O3 anodized layer). Examples of coatings include coatings deposited by chemical vapor deposition (CVD), atomic layer deposition (ALD), electroplating, and the like. Examples of coatings include dielectric coatings, Al2O3 coatings, nickel plating, Y2O3 coatings, and the like. The replaceable interface plate 230 may be coated prior to attachment to the mainframe 200. Alternatively, the mainframe 200 may be coated after the replaceable interface plate is attached. Thus, in some embodiments, a portion of the replaceable interface plate 230 has a surface treatment.

[0041]

[0050] The interchangeable interface plate 230 further includes a step 232 on an inner bottom surface of the interchangeable interface plate 230. The step can engage with a lip on a sidewall of the base 206 that forms a frame (or frame surface) to which the interchangeable interface plate 230 is attached.

[0042]

[0051] The mainframe is configured to operate under vacuum, which can apply large vertical and horizontal forces to the mainframe 200 based on the pressure difference between the interior space of the mainframe and the exterior of the mainframe (which may be atmospheric pressure, for example). The frame 201 can bend and / or warp when exposed to the forces. Thus, in an embodiment, the replaceable interface plate (e.g., replaceable interface plate 230) is designed to be load-bearing to the mainframe 200, and the frame of the first facet is not load-bearing. Thus, the replaceable interface plate 230 bears the vertical forces on the mainframe 200 caused by the pressure difference between the interior space of the mainframe and the exterior of the mainframe. These vertical forces can be transferred from the replaceable interface plate 230 to the base at the interface of the step 232 and the lip of the base that engages the step 232.

[0043]

[0052] In one embodiment, when under vacuum, a vertical force of approximately 95,000 pounds of pressure is applied to the mainframe 200. In an embodiment in which two facets have lengths of approximately 100-150 inches and two facets have lengths of approximately 40-60 inches, approximately 30-40% of the vertical force is supported by each of the replaceable interface plates attached to the longer facets and approximately 10-15% of the force is supported by each of the replaceable interface plates attached to the shorter facets. Thus, a single replaceable interface plate may be configured to withstand approximately 28,500-38,000 pounds of force without bending.

[0044]

[0053] In an alternative embodiment, steps and lips are not used to transfer vertical forces from one or more interchangeable interface plates to the base 206. Rather than an engaged step and lip, the interchangeable interface plate 230 may include pins on the interior bottom surface of the interchangeable interface plate. The pins may be, for example, square or round pins and may be periodically spaced. The pins may engage one or more features in the sidewall of the base, and the vertical forces may be transferred from the interchangeable interface plate to the base at an interface of the pins and features. The features may be, for example, holes, lips, or other features that engage the pins.

[0045]

[0054] In an alternative embodiment, the base extends below the interchangeable interface plate and normal forces can be transferred from the interchangeable interface plate to the base without the use of any steps, lips, pins, or other features in the base or the interchangeable interface plate.

[0046]

[0055] Although not shown, additional replaceable interface plates may be attached to the remaining facets of the main frame 200. Additionally, a lid may be secured to the top of the main frame over the frame 201 and over the replaceable interface plate. In an embodiment, the lid contacts the replaceable interface plate but not the frame 201. This ensures that the frame will not bear any load even if there is a slight misalignment in the vertical spacing of the lip, step, top of the replaceable interface plate and / or the top of the frame 201.

[0047]

[0056] 2B illustrates a side view of a first exemplary interchangeable interface plate 250 according to one embodiment of the present disclosure. The first interchangeable interface plate 250 includes a step 232 and three substrate access ports 252, 254, 256 that all have the same width, height and vertical position.

[0048]

[0057] 2C illustrates a side view of a second exemplary interchangeable interface plate 260 according to an embodiment of the present disclosure. The second interchangeable interface plate 260 includes a step 232 and three substrate access ports 262, 264, 266 having various widths and heights.

[0049]

[0058] 2D illustrates a side view of a third exemplary interchangeable interface plate 270 according to an embodiment of the present disclosure. The third interchangeable interface plate 270 includes a step 232 and two substrate access ports 272, 274 having equal widths and heights but different vertical positions.

[0050]

[0059] In an embodiment, either the first exemplary interchangeable interface plate 250 , the second exemplary interchangeable interface plate 260 , or the third exemplary interchangeable interface plate 270 may be attached to the mainframe 200 .

[0051]

[0060] 3 shows a side cross-sectional view of a mainframe 300 and an attached replaceable interface plate 330 taken at a substrate access port 335 machined into the replaceable interface plate 330 according to one embodiment of the disclosure. The mainframe 300 includes a base 315, a frame face (including a beam 320, a number of columns (not shown), and a portion of the base), and a lid 325. The beam 320, base 315, and columns (not shown) define a frame (or frame face) for a facet 310 of the mainframe 300. The replaceable interface plate 330 is attached to the frame that forms the facet 310 of the mainframe 300.

[0052]

[0061] The base 315 includes a lip 340 on a sidewall of the base 315. The replaceable interface plate 330 includes a step 342 on an interior bottom surface of the replaceable interface plate 330 that engages the lip 340 on the sidewall of the base 315. As previously described, when the interior space 305 of the mainframe 300 is evacuated to a vacuum, forces 350 can be applied to the mainframe 300. These forces can be concentrated forces 352 that the replaceable interface plate 330 bears. As shown, the lid 325 can be in contact with the replaceable interface plate 330 but not the beam 320. For example, there can be a small gap 354 between the bottom of the lid 325 and the top of the beam 320. Thus, the force is transferred from the lid 325 through the replaceable interface plate 330 to the lip 352 of the base 315.

[0053]

[0062] The lid 325 may include a notch or groove 346 into which an O-ring may be inserted to ensure a seal between the lid 325 and the beam 320 (e.g., between the lid and the top of the frame that includes the beam 320). Additionally, the frame for the facet to which the replaceable interface plate 330 is attached (e.g., including the beam 320, the column (not shown), and the sidewall of the base) may each include a notch or groove 344 into which an O-ring may be inserted to ensure a seal between the replaceable interface plate 330 and the frame.

[0054]

[0063] In one embodiment, the replaceable interface plate 330 includes a lip 390 at a top of the inner surface of the replaceable interface plate 330. The beam 320 may include a corresponding step 392 that may engage with the lip 390. Notably, the top of the step 392 does not contact the bottom of the lip 390. In other embodiments, the replaceable interface plate 330 does not include a lip and the beam 320 does not include a step.

[0055]

[0064] 4 illustrates a side cross-sectional view of a mainframe 400 and an attached replaceable interface plate 430 taken at a frame column 420 of the mainframe according to one embodiment of the disclosure. The mainframe 400 includes a base 415, a frame (including a plurality of beams 421, a plurality of columns 420, and a portion of the base), and a lid 325. A first beam (not shown), the columns 420, and a first portion of the base 415 define a first frame face for a facet 410 of the mainframe 400. A second beam 421, the columns 420, a second column (not shown), and a second portion of the base 415 define a second frame face for a second facet. The replaceable interface plate 430 is attached to the frame forming the facet 410 of the mainframe 400.

[0056]

[0065] The base 415 includes a lip 440 on a sidewall of the base 415. The replaceable interface plate 540 includes a step 442 on an interior bottom surface of the replaceable interface plate 430 that engages with the lip 440 on the sidewall of the base 415. As previously described, forces 450 may be applied to the mainframe 400 when the interior space of the mainframe 400 is evacuated to a vacuum. These forces may be concentrated forces 452 that the replaceable interface plate 430 bears. As shown, the lid 425 may be in contact with the replaceable interface plate 430 but may not be in contact with the frame. For example, there may be a small gap 454 between the bottom of the lid 425 and the top of the frame. Thus, the force is transferred from the lid 425 through the replaceable interface plate 440 to the lip 442 of the base 415.

[0057]

[0066] The lid 425 may include a pair of notches or grooves 446, 448 into which an O-ring may be inserted to ensure a seal between the lid 425 and the frame. In one embodiment, the notch 446 is approximately concentric with the notch 448. In addition, the frame for the facet to which the replaceable interface plate 430 is attached (e.g., including the beams (not shown), the column 420, the additional columns (not shown), and the sidewalls of the base) may each include a pair of notches or grooves 444, 445 into which an O-ring may be inserted to ensure a seal between the replaceable interface plate 430 and the frame. In some embodiments, the notches 444 and 445 may be approximately concentric.

[0058]

[0067] The region between notches 446 and 448 may be an intermediate vacuum region. Similarly, the region between notches 444 and 445 may be another intermediate vacuum region. Column 420 may include one or more channels (i.e., holes) that fluidly connect the intermediate vacuum region to vacuum port 490. For example, column 420 may include vertical channel 452 that fluidly connects the intermediate vacuum region between notches 446 and 448 to vacuum port 490 and may further include horizontal channel 450 that fluidly connects the intermediate vacuum region between notches 444 and 445 to vertical channel 452.

[0059]

[0068] Differential pumping may be performed to pump the intermediate vacuum region to a pressure between the pressure of the interior space of the main frame 400 and atmospheric pressure. A first O-ring may be placed in the notch 445 of the frame, with an outer surface of the first O-ring exposed to the exterior environment and an inner surface of the first O-ring exposed to the intermediate vacuum region. A second O-ring may be placed in the notch 444 of the frame, with an outer surface of the second O-ring exposed to the intermediate vacuum region and an inner surface of the second O-ring exposed to the interior space of the main frame 400. The exterior environment will have a first pressure, the intermediate vacuum region will maintain a second pressure lower than the first pressure, and the interior space will maintain a third pressure lower than the second pressure.

[0060]

[0069] A second frame surface for the second facet that is perpendicular to facet 410 is also shown. The second frame surface includes beam 421, column 420, and base 415. A large opening 405 is formed by the second frame surface. As shown, notches or grooves 460, 462 are machined in beam 421, base 415, and column 420, where notches 460, 462, respectively, receive O-rings to seal an additional replaceable interface plate (not shown) to the second facet of main frame 400. The frame (or frame surface) of facet 410 may further include one or more additional channels in column 420 that fluidly connect to channel 452. These one or more additional channels may fluidly connect an intermediate vacuum region between notches 460, 462 to vacuum port 490.

[0061]

[0070] The additional frame (or frame face) of the main frame may also include channels drilled or otherwise formed therein. These channels may connect to further intermediate vacuum regions between the other notch / O-ring pairs. These channels may be fluidly coupled to the channel 452 of the column 420 and thus to the vacuum port 490. The frame (or frame face) of the facet 410 may further comprise a base 415 that fluidly couples one or more additional channels to the beam 421, and / or to an additional beam (not shown), and / or to one or more channels of the column 420. These channels may further be fluidly coupled to one or more additional channels of the additional columns that fluidly connect the further intermediate vacuum regions to the vacuum port 490.

[0062]

[0071] In one embodiment, the first frame (or first frame surface) includes a first column on a first side of the first facet, a second column on a second side of the first facet, and a first beam connecting the first column to the second column. The second frame (or second frame surface) includes a first column on a first side of the second facet, a third column on a second side of the second facet, and a second beam connecting the first column to the third column. The third frame (or third frame surface) includes a second column on a first side of the third facet, a fourth column on a second side of the third facet, and a third beam connecting the second column to the fourth column. The fourth frame (or fourth frame surface) includes a third column on a first side of the fourth facet, a fourth column on a second side of the fourth facet, and a fourth beam connecting the third column to the fourth column.

[0063]

[0072] The first frame can include one or more first channels in the first column, the one or more first channels fluidly connecting the first intermediate vacuum region to the vacuum port. The first frame can further include one or more second channels in the first beam that fluidly connect to the one or more channels in the first column.

[0064]

[0073] The first frame may further comprise one or more third channels in the second column fluidly connecting to the one or more second channels of the beam. The one or more third channels may fluidly connect a vacuum port to an additional intermediate vacuum region between a pair of O-rings disposed on an outer surface of the second frame.

[0065]

[0074] Alternatively or additionally, the third frame may include one or more additional channels in a third beam of the third frame. In addition, the third frame may include one or more additional channels in a fourth column that fluidly connect one or more intermediate vacuum regions between the additional pairs of O-rings to the vacuum port.

[0066]

[0075] The vacuum port 490 may be coupled to a vacuum pump (not shown). Differential pumping may be implemented to reduce the pressure differential across the O-rings. The O-rings may have large linear surfaces (e.g., in embodiments where the facets may have lengths of up to about 130-150 inches and heights of about 20-50 inches). This may increase leakage across the O-rings and reduce sealing capabilities. By using differential pumping, the leak rate may be significantly reduced. A single vacuum port 490 may, in embodiments, be fluidly connected to intermediate vacuum regions between every pair of O-rings, between the main frame and the lid and replaceable interface plate. These connections may be made by drilling channels (i.e., holes) in one or more of the frame beams and / or columns of the main frame 400, providing connections to the vacuum ports 490 without the use of plug fixings, cross drilling, or welding (e.g., plug welding). This may improve the operation of the differential pumping by minimizing possible additional leak points.

[0067]

[0076] In a further embodiment, multiple stages of differential pumping are used, which may include a set of three concentric notches or grooves, each with its own O-ring, and two adjacent intermediate vacuum regions.

[0068]

[0077] 5 illustrates a method 500 for assembling a reconfigurable mainframe of an electronic device manufacturing system according to one embodiment of the disclosure. Some operations of method 500 may be performed by processing logic, which may be executed on a computing device such as a general purpose computer. For example, certain operations may be performed using computer-aided drafting and / or computer-aided manufacturing (CAM) software installed on the computer.

[0069]

[0078] At block 502 of method 500, a mainframe configuration is determined that includes determining a first plurality of processing chambers to be coupled to a first facet of the mainframe. In addition, load lock chambers and / or processing chambers connected to one or more other facets of the mainframe may be determined.

[0070]

[0079] At block 504, a determination may be made of locations of substrate access ports suitable for the determined mainframe configuration (e.g., accommodating access to each of the processing chambers and / or load locks). At block 506, a configuration of one or more interchangeable interface plates is determined. The interchangeable interface plates may be configured to have substrate access ports at each of the determined locations. At block 508, the interchangeable interface plates may be manufactured. This may include machining a metal (e.g., aluminum) and / or applying a surface treatment to at least a portion of the interchangeable interface plate.

[0071]

[0080] In block 510, the interchangeable interface plate is attached to the main frame (transfer chamber). This may include bolting or screwing the interchangeable interface plate to a frame of the appropriate facet of the main frame. In block 512, the determined processing chambers and / or load locks may be attached to the appropriate interface plate according to the determined configuration.

[0072]

[0081] At any time, the engineer may determine a new configuration of the mainframe. At such time, the method 500 may be repeated. For example, a determination may be made of a second plurality of processing chambers to be coupled to a first facet of the mainframe, new locations of the second plurality of substrate access ports may be determined on the facet housing the second plurality of processing chambers, a configuration of a second interchangeable interface plate having one of the second plurality of substrate access ports at each of the new locations may be determined, and the second interchangeable interface plate may be manufactured. The second interchangeable interface plate may have at least one of: a) a different number of substrate access ports than the first interchangeable interface plate; b) one or more substrate access ports at different locations compared to the plurality of substrate access ports in the first interchangeable interface plate; c) one or more substrate access ports of different sizes compared to the plurality of substrate access ports in the first interchangeable interface plate; d) a different type of slit valve than the first interchangeable interface plate; or e) a different type of local center detector than the first interchangeable interface plate.

[0073]

[0082] Prior to block 510, the existing processing chambers may be removed from the first interchangeable interface plate, followed by removal of the first interchangeable interface plate from the mainframe. The operations of blocks 510 and 512 may then be performed such that the mainframe has an entirely new configuration (e.g., a different number of substrate access ports, substrate access ports in different locations, a different number and / or type of processing chambers, etc.).

[0074]

[0083] In the preceding description, numerous specific details are set forth, such as specific materials, dimensions, process parameters, etc., to provide a thorough understanding of the present disclosure. Particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments. The term "example" or "exemplary" is used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as "example" or "exemplary" should not necessarily be construed as preferred or advantageous over other aspects or designs. Rather, use of the term "example" or "exemplary" is merely intended to present concepts in a concrete manner. As used herein, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X includes A or B" is intended to mean any natural inclusive permutation. That is, if X includes A, X includes B, or X includes both A and B, then "X includes A or B" is satisfied under any of the foregoing cases. Throughout this specification, "an embodiment," "an embodiment," or "one embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in an embodiment," "in an embodiment," or "in one embodiment" in various places in this specification are not necessarily all referring to the same embodiment.

[0075]

[0084] The present disclosure has been described with reference to certain exemplary embodiments thereof. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Various modifications of the present disclosure in addition to those shown and described herein will become apparent to those skilled in the art and are intended to fall within the scope of the appended claims.

Claims

1. 1. A device manufacturing system mainframe comprising: With the base, a plurality of facets on the base, a first facet of the plurality of facets including a first frame; a lid on the plurality of facets, the base, the lid and the plurality of facets together defining an interior space; and a robotic arm within the interior space; a first interchangeable interface plate attached to the first frame of the first facet, the first interchangeable interface plate comprising a plurality of substrate access ports; a first substrate access port of the plurality of substrate access ports configured to provide the robot arm with access to a first processing chamber; A mainframe of a device manufacturing system, wherein a second substrate access port of the plurality of substrate access ports is configured to provide the robot arm with access to a second processing chamber.

2. The mainframe of claim 1 , wherein the first facet has a first length that is at least twice a second length of a second facet of the plurality of facets.

3. 3. The mainframe of claim 2, wherein the mainframe has a rectangular shape, the plurality of facets includes four facets, the second facet is perpendicular to the first facet, and the robotic arm is an off-axis robotic arm.

4. the second facet includes a second frame, the third facet includes a third frame, the fourth facet includes a fourth frame, and the main frame further comprises: a second interface plate sealed to the second frame of the second facet; a third interface plate sealed to the third frame of the third facet; a fourth interface plate sealed to the fourth frame of the fourth facet; The mainframe of claim 3 comprising:

5. 2. The mainframe of claim 1, wherein the mainframe is configured to operate under vacuum, the first frame of the first facet is not load-bearing, the first replaceable interface plate is load-bearing, and the first replaceable interface plate withstands a vertical force on the mainframe caused by a pressure differential between the interior space of the mainframe and an exterior of the mainframe.

6. 6. The mainframe of claim 5, wherein the first replaceable interface plate comprises a step on an interior bottom surface of the first replaceable interface plate, the step engaging a lip on a sidewall of the base, the vertical force being transferred from the first replaceable interface plate to the base at an interface between the step and the lip.

7. The mainframe of claim 5 , wherein the lid contacts the first replaceable interface plate and the lid does not contact the first frame.

8. 6. The mainframe of claim 5, wherein the first replaceable interface plate includes a plurality of pins on an interior bottom surface of the first replaceable interface plate, the plurality of pins engaging one or more features in a sidewall of the base, and the normal force is transferred from the first replaceable interface plate to the base at an interface of the plurality of pins and the one or more features.

9. a first O-ring disposed on an outer surface of the first frame, the outer surface of the first O-ring being exposed to an external environment and the inner surface of the first O-ring being exposed to an intermediate vacuum region; a second O-ring disposed on the outer surface of the first frame, the second O-ring being substantially concentric with the first O-ring, an outer surface of the second O-ring being exposed to the intermediate vacuum region, and an inner surface of the second O-ring being exposed to the interior space; and Further equipped with 2. The mainframe of claim 1, wherein the external environment has a first pressure, the intermediate vacuum region maintains a second pressure lower than the first pressure, and the interior space maintains a third pressure lower than the second pressure.

10. The first frame includes: a first column on a first side of the first facet; a second column on a second side of the first facet; a beam connecting the first column and the second column; one or more channels in the first column fluidly connecting the intermediate vacuum region to a vacuum port; The mainframe of claim 9 comprising:

11. the first frame further comprises one or more second channels in the beams fluidly coupled to the one or more channels in the first column; the first frame further comprises one or more third channels in the second column fluidly coupled to the one or more second channels of the beam; a second facet of the plurality of facets comprises a second frame comprising: a second column on a first side of the second facet; a third column on a second side of the second facet; and a second beam connecting the second column to the third column; a second replaceable interface plate sealed to the second frame of the second facet; 11. The mainframe of claim 10, wherein the one or more third channels fluidly connect the vacuum ports to an additional intermediate vacuum region between a pair of O-rings disposed on an exterior surface of the second frame.

12. 2. The mainframe of claim 1, wherein the first interchangeable interface plate is compatible with a plurality of additional interchangeable interface plates having at least one of: a) a different number of substrate access ports than the first interchangeable interface plate; b) one or more substrate access ports in a different position compared to the plurality of substrate access ports of the first interchangeable interface plate; c) one or more substrate access ports of a different size compared to the plurality of substrate access ports of the first interchangeable interface plate; d) a different type of slit valve than the first interchangeable interface plate; or e) a different type of local center detector than the first interchangeable interface plate.

13. an interchangeable interface plate for mounting to a facet of the mainframe, A plurality of substrate access ports are provided, a first substrate access port of the plurality of substrate access ports configured to provide access from the mainframe to a first processing chamber; a second substrate access port of the plurality of substrate access ports configured to provide access from the mainframe to a second processing chamber; The replaceable interface plate is load-bearing relative to the mainframe, the replaceable interface plate being configured to withstand a vertical force on the mainframe caused by a pressure differential between an interior space of the mainframe and an exterior of the mainframe.

14. a step on an inner bottom surface of the replaceable interface plate configured to engage a lip on a side wall of a base of the main frame; The interchangeable interface plate of claim 13 , wherein the interchangeable interface plate is configured to transfer normal forces from the interchangeable interface plate to the base at an interface between the step and the lip.

15. 14. The interchangeable interface plate of claim 13, further comprising a plurality of local center detectors attached to the interchangeable interface plate, each of the plurality of local center detectors configured to detect a wafer being transferred through a substrate access port of the plurality of substrate access ports.

16. 14. The interchangeable interface plate of claim 13, further comprising a plurality of pins on an inner bottom surface of a first interchangeable interface plate, the plurality of pins engaging one or more features in a sidewall of a base of the mainframe, the interchangeable interface plate configured to transfer the vertical force from the interchangeable interface plate to the base at an interface of the plurality of pins and the one or more features.

17. 1. A method of configuring a mainframe, comprising: determining a first plurality of processing chambers to be coupled to a first facet of the mainframe; determining positions of a plurality of substrate access ports on the first facet that accommodate the first plurality of processing chambers; determining a configuration of a first interchangeable interface plate having one of the plurality of substrate access ports at each of the locations; manufacturing the first replaceable interface plate; attaching the first replaceable interface plate to the first facet of the mainframe; mounting the first plurality of processing chambers to the first interchangeable interface plate; wherein each of the first plurality of processing chambers is accessible from the mainframe through a substrate access port of the plurality of substrate access ports.

18. determining a second plurality of processing chambers coupled to the first facet of the mainframe; determining new locations of a second plurality of substrate access ports on the first facet that accommodate the second plurality of processing chambers; determining a configuration of a second interchangeable interface plate having one of the second plurality of substrate access ports at each of the new locations; manufacturing the second replaceable interface plate; removing the first plurality of processing chambers from the first replaceable interface plate; removing the first replaceable interface plate from the first facet of the mainframe; attaching the second replaceable interface plate to the first facet of the mainframe; mounting the second plurality of processing chambers to the second interchangeable interface plate; 20. The method of claim 17, further comprising: each of the second plurality of processing chambers is accessible from the mainframe through a substrate access port of the second plurality of substrate access ports.

19. 20. The method of claim 18, wherein the second interchangeable interface plate has at least one of: a) a different number of substrate access ports than the first interchangeable interface plate; b) one or more substrate access ports in a different position compared to the plurality of substrate access ports of the first interchangeable interface plate; c) one or more substrate access ports of a different size compared to the plurality of substrate access ports of the first interchangeable interface plate; d) a different type of slit valve than the first interchangeable interface plate; or e) a different type of local center detector than the first interchangeable interface plate.

20. the main frame has a rectangular shape and includes the first facet, the second facet, the third facet and the fourth facet, the first facet and the second facet being parallel to each other and each having a first length that is at least twice a second length of the third facet and the fourth facet; and manufacturing a second interchangeable interface plate for the second facet; attaching the second replaceable interface plate to the second facet of the mainframe; mounting a second plurality of processing chambers to the second interchangeable interface plate; 20. The method of claim 17, comprising:

Images