Electronic module and electronic device

Abstract

To prevent the influence of static electricity on an internal circuit of an electronic device, while achieving miniaturization of the electronic device and a removable electronic module.SOLUTION: An operating device 100 is an electronic module removably attached to an imaging apparatus 1. The imaging apparatus 1 has an attachment part 190 to which the operating device 100 can be attached. A plurality of communication terminals 185 are arranged on the bottom of the attachment part 190. The operating device 100 has, on its bottom face, a plurality of contact lands 210, which are connected to the plurality of communication terminals 185, respectively. At least one of the contact lands is a contact land corresponding to the ground electric potential. The operating device 100 has a conductive part on its side face, and the conductive part is electrically connected to the ground of a circuit board.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a technique for removably mounting an electronic module to an electronic device. [Background technology]

[0002] There are electronic devices in which the operating members are detachable electronic modules. By attaching this electronic module to the electronic device, the user can customize the operating members to his / her liking. When a charged user uses an electronic device, the effect of static electricity discharge on the electronic device becomes an issue. Static electricity is generally an electric charge that can generate a high voltage of several thousand to tens of thousands of volts, and discharge can cause significant damage to the internal circuitry of the electronic device. Static electricity often enters the electronic device by discharging from the tips of the user's fingers through the gap between the operating member and the exterior cover.

[0003] A certain gap is formed between the electronic module and the exterior cover of the electronic device. Patent Document 1 discloses a technology that can more reliably prevent the impact of static electricity discharge from the human body on the circuitry. By ensuring a certain distance between the user and the internal circuitry of the electronic device, it is possible to prevent malfunctions of the circuitry. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-84446 A Summary of the Invention [Problem to be solved by the invention]

[0005] Conventional techniques require a certain distance to be secured inside the electronic device, which can lead to an increase in the size of the electronic device and electronic module when applied to an electronic module that is detachable from the electronic device. An object of the present invention is to reduce the size of electronic devices and removable electronic modules while suppressing the effects of static electricity on the internal circuits of the electronic devices. [Means for solving the problem]

[0006] An apparatus according to an embodiment of the present invention is an electronic module that is attachable to and detachable from a mounting portion provided on an electronic device, and has a plurality of contacts electrically connected to a plurality of terminals arranged on the mounting portion, and a conductive portion located on a second surface different from a first surface on which the contacts are arranged, wherein at least one of the plurality of contacts is a contact corresponding to a reference potential, and the conductive portion is electrically connected to the contact of the reference potential. Effect of the Invention

[0007] According to the present invention, it is possible to reduce the size of an electronic device and a removable electronic module, while suppressing the effect of static electricity on the internal circuitry of the electronic device. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view illustrating an imaging device. [Diagram 2] FIG. 1 is a block diagram illustrating a configuration of an imaging device. [Diagram 3] FIG. 2 is a perspective view illustrating an operating device. [Figure 4] FIG. 2 is a diagram illustrating a circuit board of the operating device. [Diagram 5] FIG. 2 is an exploded perspective view illustrating an operating device. [Figure 6] 1A and 1B are diagrams illustrating attachment portions of an operating device to an imaging device. [Figure 7] FIG. 11 is a perspective view illustrating an operating device according to a second embodiment. [Figure 8] FIG. 11 is an exploded perspective view illustrating an operating device according to a second embodiment. [Figure 9] FIG. 13 is a perspective view illustrating an operating device according to a third embodiment. [Figure 10] FIG. 11 is an exploded perspective view illustrating an operating device according to a third embodiment. [Figure 11] FIG. 13 is a perspective view illustrating an operating device according to a fourth embodiment. [Figure 12] FIG. 13 is a perspective view illustrating an operating device according to a fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The present invention is applicable to various electronic devices such as image capture devices and information processing devices. In the embodiments, a lens-interchangeable digital camera is shown as an example of an electronic device.

[0010] [First Example] An imaging device according to the present embodiment will be described with reference to Fig. 1 to Fig. 6. Fig. 1 is a diagram for explaining the imaging device 1. Fig. 1(A) is a perspective view of the imaging device 1 as viewed from the front, and Fig. 1(B) is a perspective view of the imaging device 1 as viewed from the rear. In the following, the subject side is defined as the front side, and the photographer side is defined as the rear side. The direction parallel to the optical axis of the imaging device 1 is defined as the Z-axis direction, and two axes perpendicular to the Z-axis are defined as the X-axis and the Y-axis. The X-axis direction is the left-right direction, and the Y-axis direction is the up-down direction (vertical direction).

[0011] A photographer can capture an image of a subject by attaching a lens device (not shown) to the imaging device 1. The imaging device 1 has a display unit 2 on the rear surface. The display unit 2 displays images and various information. The touch panel 3 can detect touch operations on the display surface (operation surface) of the display unit 2.

[0012] The imaging device 1 includes a number of operating members. The power switch 4 is an operating member for switching the power of the imaging device 1 between ON and OFF. The shutter button 5 is an operating member for the user to give shooting instructions. The mode switching dial 6 is an operating member for switching between various modes. The mode switching dial 6 is an electronic module that is detachable from the imaging device 1, and details thereof will be described later.

[0013] The imaging device 1 has a terminal cover 7 on its side. The terminal cover 7 protects a connector (not shown) of a connection cable that connects an external device to the imaging device 1. The main electronic dial 8 is a rotary operation member that is provided on the upper part of the grip section 25. The user can change settings such as the shutter speed and aperture value by rotating the main electronic dial 8. The changeover switch 10 is an operation member that switches between a still image recording mode and a video recording mode. The sub electronic dial 11 is a rotary operation member that is used to move the selection frame, advance images, etc.

[0014] The imaging device 1 has an operation unit 9 on the rear side. The operation unit 9 is composed of a number of push buttons and an operation dial 12. The user can change settings such as the shutter speed and aperture value by rotating the operation dial 12. The SET button 13 is a push button, and is mainly used to confirm selected items.

[0015] The functions of the various operating members will be briefly described below. ·Video button 14: Used to start and stop video shooting (recording). ·AE (Auto Exposure) Lock Button 15: Press when in standby to lock the exposure. ·AF (Autofocus) Position Switch Button 16: Used to select and move the AF frame. Playback button 17: Used to switch between shooting mode and playback mode. Pressing the playback button 17 during shooting mode switches to playback mode, and the most recent image recorded on a recording medium (not shown) can be displayed on the display unit 2. Rating button 18: When pressed in the playback mode, flag information is added to the selected recording data. Menu button 19: When pressed, a menu screen in which various settings can be made is displayed on the display unit 2. The user can intuitively make various settings using the menu screen displayed on the display unit 2, the operation dial 12, and the SET button 13. Selection member 26: A cross key (four-way key) in which each of the top, bottom, left and right parts can be pressed. The user can issue an operation instruction according to the part of the selection member 26 that is pressed. · AF-on button 35: When the user is ready to shoot, he or she can press this button to focus on the AF frame that has been set. Magnification button 37: The magnification mode can be turned ON or OFF in the Live View (LV) display in the shooting mode. After turning the magnification mode ON, the user can operate the Main Dial 8 to enlarge or reduce the LV image. In the playback mode, it functions as a magnification button to enlarge the playback image and increase the magnification ratio. Information button 38: When pressed in the playback mode, information on the recorded data is played back and displayed. · Erase button 39: When pressed in the playback mode, the selected recorded data is erased.

[0016] A microphone hole 30 is formed on the front side of the imaging device 1. Through the microphone hole 30, an internal microphone (not shown) can record audio data of a subject during video shooting. In addition, a speaker hole 31 is formed on the rear side of the imaging device 1. A speaker (not shown) is disposed inside the speaker hole 31 and is used to play back recorded audio and the imaging device 1's built-in audio.

[0017] The eyepiece 21 is an eyepiece of a peer-in type eyepiece finder. A user can view an image displayed on an internal EVF (electronic viewfinder) 22 through the eyepiece 21. The eyepiece detection unit 23 includes an eyepiece detection sensor that detects whether the photographer places his / her eye on the eyepiece 21.

[0018] A lid 24 (see FIG. 1(B)) provided on the side of the imaging device 1 is a lid for a slot that stores a recording medium (not shown). The grip section 25 is a holding section shaped to be easily held in the user's right hand when holding the imaging device 1. The user holds the imaging device 1 by gripping the grip section 25 with the little finger, ring finger, and middle finger of the right hand. In this holding state, the shutter button 5 and main electronic dial 8 are disposed in positions that can be operated with the index finger of the right hand. Furthermore, in the holding state, the sub electronic dial 11 and selection member 26 are disposed in positions that can be operated with the thumb of the right hand.

[0019] The lens mount section 28 (see FIG. 1(A)) is a section for mounting a detachable lens device (not shown) to the imaging device 1. A communication terminal 20 is provided inside the lens mount section 28, and enables communication between the imaging device 1 and the lens device. A lock button 27 is disposed on the right side of the lens mount section 28. When the lens device is attached to the imaging device 1, a retention lock mechanism (not shown) functions. When the user presses the lock button 27, the retention lock mechanism is released, and the lens device becomes removable.

[0020] An imaging element 90 is disposed behind (on the rear side of) the shutter curtain 42 inside the imaging device 1. For example, the imaging element 90 is a CMOS (complementary metal-oxide semiconductor) image sensor that converts captured optical information into a signal, and is a so-called 35 mm full-size imaging element having an effective area of ​​approximately 24 mm x 36 mm. The imaging device 1 is configured to be capable of mounting a so-called full-size compatible lens that can expose the entire effective area of ​​the imaging element 90, and a lens with a format having a small exposure area, a so-called APS-C compatible lens.

[0021] The imaging device 1 has strap insertion members 40 and 41. A user can carry the imaging device 1 in a hanging state by inserting a string-like member (not shown) through the strap insertion members 40 and 41.

[0022] FIG. 2 is a block diagram illustrating the configuration of the imaging device 1. An interchangeable lens camera that can be used by mounting a lens device 70 on the device body of the imaging device 1 will be described. The lens device 70 includes a lens system control unit 72, a lens driving unit 73, and an imaging optical system 74. An optical axis 99 of the imaging optical system 74, which has a plurality of lenses and an aperture, is indicated by a dashed dotted line. The lens system control unit 72 controls the entire lens device 70. The lens device 70 can communicate with a control unit (camera system control unit 81) in the device body of the imaging device 1 via a communication terminal 20. The lens driving unit 73 drives and controls the focus lens, zoom lens, aperture, etc. according to a control command from the lens system control unit 72.

[0023] The device body of the imaging device 1 includes a camera system control unit 81 and an imaging element 90. The camera system control unit 81 controls the entire imaging device. With the lens device 70 attached to the device body, the imaging element 90 receives light from a subject via the imaging optical system 74 and a shutter mechanism 89, and outputs an electrical signal by photoelectric conversion. An image processing unit 83 acquires the image signal output by the imaging element 90 and performs development processing and the like. Image data after image processing is stored in a storage unit 84.

[0024] The shake detection unit 87 detects shake of the imaging device 1 due to hand shake or the like. The shake detection unit 87 can detect rotation about the optical axis 99 as the central axis, and detects rotational shake of the imaging device 1 in the pitch direction, yaw direction, and roll direction. For example, shake detection is performed using a gyro sensor or the like, and a shake detection signal is output to the camera system control unit 81.

[0025] The image blur correction unit 88 corrects image blur in the captured image according to a control command from the camera system control unit 81. For example, the image blur correction unit 88 performs image blur correction by moving (driving) the image sensor 90 within a plane perpendicular to the optical axis 99. The shutter mechanism unit 89 is disposed on the subject side of the image sensor 90, and controls the exposure time according to a control command from the camera system control unit 81.

[0026] The camera system control unit 81 supervises control of the imaging system including the imaging device 1 and the lens device 70 in accordance with an operation signal detected by an operation detection unit 86. For example, the camera system control unit 81 includes a CPU (Central Processing Unit) and executes a predetermined program to perform various processes in the imaging system.

[0027] The audio control unit 82 controls the compression of audio data to be recorded according to a control command from the camera system control unit 81. The display unit 85 corresponds to the display unit 2 in Fig. 1 and the display unit (not shown) inside the finder. The communication terminal unit 79, the signal switching unit 80, and the replaceable operation device 75 will be described later.

[0028] Next, the operation of the imaging system will be described. Light from a subject passes through the imaging optical system 74 and the shutter mechanism 89 to form an image on the imaging surface of the imaging element 90. Optical adjustment processing of the imaging optical system 74 is performed based on information on the focus evaluation amount and exposure amount obtained from the output signal of the imaging element 90. The imaging element 90 is properly exposed, and an imaging signal corresponding to the subject image is output from the imaging element 90.

[0029] The shutter mechanism 89 has a mechanism for controlling light blocking for the image sensor 90 by moving the shutter curtain 42 (see FIG. 1(A)). The shutter mechanism 89 has a light blocking member (mechanical rear curtain), and the exposure of the image sensor 90 is completed by the shutter mechanism 89. In the image sensor 90, the timing of the start of exposure is controlled by resetting the charge for each line in the processing of the electronic front curtain executed prior to the movement of the rear curtain of the shutter mechanism 89. In the electronic front curtain mode, exposure control is performed by synchronizing the reset operation of the charge of the image sensor 90 with the movement of the rear curtain of the shutter mechanism 89. The technology of the electronic front curtain is well known, so a detailed description thereof will be omitted.

[0030] The image processing unit 83 has an A / D converter, a white balance adjustment circuit, a gamma correction circuit, an interpolation calculation circuit, and the like. For example, the image processing unit 83 performs color interpolation (demosaicing) processing on the Bayer array signal acquired from the imaging element 90 to generate color image data, and outputs the image data for recording to the storage unit 84. The image processing unit 83 also compresses still image and moving image data. The audio control unit 82 compresses audio data to be recorded. The audio data compressed by the audio control unit 82 is synthesized with the moving image and still image data in the image processing unit 83, and then output to the storage unit 84. The storage unit 84 includes a non-volatile memory, and stores image data and various data. The camera system control unit 81 performs processing for storing data in the storage unit 84, and processing for outputting data read from the storage unit 84 to the display unit 85 to present the data to the user.

[0031] The camera system control unit 81 controls image capture processing, image processing, recording and playback processing, etc., in response to a user operation signal. For example, the operation detection unit 86 detects the on-state of a first switch by half-pressing the shutter release button, and further detects the on-state of a second switch when the user fully presses the shutter release button. When the camera system control unit 81 receives a shooting instruction by operating the second switch from the operation detection unit 86, it performs drive control of the image sensor 90, image processing, data compression processing, etc., and controls the display of image information, etc. on the screen of the display unit 2. The operation detection unit 86 also detects an operation of the touch panel 3 (see FIG. 1(B)), for example, and transmits the user's operation instruction to the camera system control unit 81.

[0032] The camera system control unit 81 is connected to the image processing unit 83, and calculates an appropriate focal position and aperture value based on a signal from the image sensor 90. The camera system control unit 81 performs photometry and focus state detection based on the output signal from the image sensor 90, and determines exposure conditions (F-number, shutter speed, etc.). The camera system control unit 81 controls the exposure of the image sensor 90 by aperture control and shutter control. The camera system control unit 81 transmits a command signal to the lens system control unit 72 via the communication terminal 20. The lens system control unit 72 controls the lens driving unit 73 according to the command signal from the camera system control unit 81.

[0033] When a user uses an operation member of the imaging device 1 to instruct shooting of a still image or a video during shooting, the camera system control unit 81 controls the shooting operation according to an operation signal from an operation detection unit 86. The camera system control unit 81 calculates a target value based on a detection signal from a shake detection unit 87, and controls the drive of an image shake correction unit 88. The camera system control unit 81 controls the image shake correction operation according to shooting conditions, exposure conditions, etc.

[0034] In controlling the image blur correction, the operation detection unit 86 detects that the first switch has been operated and starts a shooting preparation operation. In order to facilitate the user's composition during the so-called aiming operation, the image blur correction is performed by the image blur correction unit 88. That is, the image sensor 90 is driven (moved or rotated) by the control of the image blur correction unit 88 based on the detection signal of the shake detection unit 87. After that, the operation detection unit 86 detects that the second switch has been operated and starts a shooting operation (image recording operation). At this time, in order to suppress image blur of the subject image acquired by the exposure operation, the image blur correction operation is stopped when a certain time has passed after the exposure.

[0035] Next, the replaceable operation device 75 in FIG. 2 will be described. The replaceable operation device 75 can be attached to the imaging device 1. The camera system control unit 81 can communicate with the replaceable operation device 75 through a communication terminal unit 79. The replaceable operation device 75 has an operation detection unit 76 and a type information storage unit 77. The operation detection unit 76 detects an operation signal according to a user operation. The type information storage unit 77 stores type information. Types of the replaceable operation device 75 include a mode switching dial, an exposure change dial, and a sub-dial. The imaging device 1 is configured to be able to attach various operation devices, and it is possible to change the mode switching function, exposure change function, sub-dial function, etc. according to the attached operation device. The type information is information for identifying an operation device having a specific function from multiple types of operation devices regarding the various functions described above.

[0036] Specifically, when the replaceable operation device 75 is attached to the imaging device 1, the type information stored in the type information storage unit 77 is transmitted to the camera system control unit 81 via the communication terminal unit 79 and the signal switching unit 80. The camera system control unit 81 determines the type of the replaceable operation device 75 attached to the imaging device 1 from the acquired type information. In the example of FIG. 1, the replaceable operation device 75 corresponds to the mode switching dial 6, and the type information is information indicating a mode switching function. A signal output from the operation detection unit 76 via the communication terminal unit 79 in response to a user operation is input to a predetermined terminal in the camera system control unit 81 by the signal switching unit 80. The camera system control unit 81 executes processing in accordance with the user's operation instruction.

[0037] The configuration of the main parts of the imaging device 1 will be described with reference to Fig. 3 to Fig. 6. The operation device 100 corresponds to the replaceable operation device 75 in Fig. 2. Although an example of a mode switching dial is shown, the present invention is not limited to this and can be applied to operation devices having various functions. Fig. 3(A) is a perspective view of the operation device 100 as viewed from above. Fig. 3(B) is a perspective view of the operation device 100 as viewed from below.

[0038] The operation device 100 is a dial operation member that has a substantially cylindrical shape and is held so as to be rotatable. The operation device 100 has a fixed part and a movable part. The fixed part is composed of an upper cover member 110 and a lower cover member 120. The movable part, a dial member 101, is held so as to be rotatable relative to the fixed part. A plurality of indexes 103 corresponding to various shooting modes are printed on the top surface of the dial member 101. The user can rotate the dial member 101, select a desired index 103, and align it with an index (not shown) of the imaging device 1 to set the shooting mode according to the desired index 103.

[0039] The operation device 100 has a circuit board 200 on the underside. A plurality of contact lands 210 are formed on the circuit board 200 and are exposed to the outside from the lower cover member 120. The lower cover member 120 also has protrusions 125a and 125b protruding in opposite directions in the radial direction. The protrusion 125a is formed to be wider than the protrusion 125b.

[0040] The circuit board 200 will be described with reference to Fig. 4. Fig. 4(A) is a perspective view of the circuit board 200 as viewed from above. Fig. 4(B) is a perspective view of the circuit board 200 as viewed from below. Fig. 4(C) is a view showing the lower surface side of the circuit board 200. The circuit board 200 is a plate-shaped wiring board, and has a structure in which an insulating resist is provided on a copper foil pattern formed on an electrically insulating glass epoxy base material. The copper foil pattern exposed from the insulating resist is gold plated.

[0041] A dial pattern 205 is formed on one surface of the circuit board 200, and the insulating resist is partially opened to expose the copper foil pattern. A plurality of contact lands 210 are formed on the other surface of the circuit board 200, and the insulating resist is partially opened to expose the copper foil pattern. The dial pattern 205 is formed so that a gray code can be configured by combining contact portions with the terminal brush 130 described later. Each signal pattern in the dial pattern 205 and each contact land 210 are electrically connected. Note that the gray code technology is well known, so a detailed description thereof will be omitted.

[0042] The multiple contact lands 210 are arranged side by side at approximately equal intervals. The nine contact lands 210 are as follows: Note that ground is also written as GND. Three contact lands 210 (2101) corresponding to the reference potential GND2101. One contact land 210 (2102) for a power source 2102. One contact land 210 (2103) corresponding to the detection signal 2103. Four contact lands 210 (2104) corresponding to the operation unit signals 2104.

[0043] The detection signal 2103 is a signal output from an electronic component 220 configured on a circuit board 200. The electronic component 220 receives a drive power supply from a power source 2102 and outputs the detection signal 2103. The imaging device 1 can determine the type of the manipulation device 100 by receiving the detection signal 2103.

[0044] The circuit board 200 has positioning holes 203a and 203b and a cutout portion 204. Around the cutout portion 204, openings 206 and 207 of an insulating resist are formed, exposing copper foils 208 and 209, respectively. The copper foils 208 and 209 exposed from the openings 206 and 207 are electrically connected to a GND 2101.

[0045] Fig. 5 is an exploded perspective view illustrating the operation device 100. The up-down direction in Fig. 5 is defined as the Y-axis direction. The dial member 101 is a member formed into a substantially cylindrical shape by resin molding using a synthetic resin material. The dial member 101 has a screw hole 102 formed on the lower side.

[0046] The upper cover member 110 is a member formed by resin molding using a synthetic resin material. The upper cover member 110 has a hole 111 in the center, and storage sections 112a and 112b are formed around the hole 111. Compression springs 170a and 170b are disposed in the storage sections 112a and 112b, respectively. The compression springs 170a and 170b bias the click balls 171a and 171b against the uneven portions (not shown) on the lower side of the dial member 101, respectively. With this configuration, an operating force (click force) with a clicking sensation can be generated in accordance with the rotation operation of the dial member 101. The upper cover member 110 has screw holes 113a, 113b, and 113c and positioning holes 114a and 114b formed therein.

[0047] Disk-shaped rotating member 140 has a center hole 141 and crimped portions 142a and 142b. Conductive terminal brush 130 is made of a metal material and has sliding portions 131a and 131b and holes 132a and 132b. Terminal brush 130 is fixed to crimped portions 142a and 142b of rotating member 140 by heat welding or the like through holes 132a and 132b.

[0048] The screw 162 is inserted through the central hole of the terminal brush 130 and the central hole 141 of the rotating member 140, and then inserted through the hole 111 of the upper cover member 110 and fastened to the screw hole 102 of the dial member 101. With this configuration, the dial member 101, the rotating member 140, and the terminal brush 130 are held rotatably relative to the upper cover member 110.

[0049] The lower cover member 120 is a member formed by resin molding using a conductive resin material containing carbon filler. The lower cover member 120 has an opening 121 in the center. The recesses 123a and 123b formed in the lower cover member 120 can store the magnets 150a and 150b. The magnets 150a and 150b are permanent magnets, and are fixed to the recesses 123a and 123b, respectively, using an adhesive. The lower cover member 120 has positioning bosses 127a and 127b. The positioning bosses 127a and 127b are inserted into positioning holes 203a and 203b of the circuit board 200, thereby positioning the circuit board 200.

[0050] The circuit board 200 has a dial pattern 205 disposed on the upper side. The cutout portion 204 of the circuit board 200 and the screw hole 128 of the lower cover member 120 are fastened and fixed by a screw 161. In this state, the screw 161 comes into contact with the copper foil 208 exposed from the circuit board 200. Fastening the screw 161 electrically connects the lower cover member 120, which is formed using a conductive resin material, to the GND of the circuit board 200.

[0051] The lower cover member 120 on which the circuit board 200 is disposed is positioned by inserting positioning bosses 129a, 129b into positioning holes 114a, 114b of the upper cover member 110. Screws 160a, 160b, 160c are inserted into holes 126a, 126b, 126c of the lower cover member 120, respectively, and fastened to screw holes 113a, 113b, 113c of the upper cover member 110.

[0052] With the above configuration, the dial member 101, the rotating member 140, and the terminal brush 130 are held in a rotatable state relative to the upper cover member 110, the lower cover member 120, and the circuit board 200. That is, in conjunction with the rotation of the dial member 101, the sliding portions 131a and 131b of the terminal brush 130 slide while rotating on the dial pattern 205 of the circuit board 200. The rotation operation is detected by switching the contact state between the dial pattern 205 and the terminal brush 130. Since each signal pattern of the dial pattern 205 and the multiple contact lands 210 are electrically connected, a signal generated when the contact state is switched is transmitted to a circuit inside the imaging device 1 via the contact land 210 and a communication terminal 185 described later.

[0053] Fig. 6 is a diagram illustrating the mounting portion 190 of the imaging device 1 to which the manipulation device 100 is attached. Fig. 6(A) is a perspective view of the mounting portion 190 as viewed from above. Fig. 6(B) is a diagram showing a state in the middle of mounting the manipulation device 100 to the mounting portion 190 in the direction of the arrow Y. Fig. 6(C) is a diagram showing a state in which the manipulation device 100 has been mounted on the mounting portion 190.

[0054] A recess 181 is formed in a top cover 180 located at the top of the imaging device 1. A user can attach an operation device 100 to the recess 181. A plurality of communication terminals 185 are arranged at approximately equal intervals on a bottom surface portion 188 of the recess 181.

[0055] An elastic force is applied to the communication terminal 185 by a spring (not shown) from inside the imaging device toward the outside. When the manipulation device 100 is attached to the attachment portion 190, the communication terminal 185 is pressed by a certain amount toward the inside of the imaging device 1 by the contact land 210 (FIG. 3) of the manipulation device 100. In this state, the communication terminal 185 is in contact with the contact land 210 of the manipulation device 100 while being biased, and is electrically connected. The communication terminal 185 is electrically connected to a circuit board (not shown) arranged inside the imaging device 1, and an electrical signal of the manipulation device 100 is transmitted to the inside of the imaging device via the communication terminal 185.

[0056] Recess 181 has cutouts 182a and 182b on its side surface. Cutout 182a is formed wider than cutout 182b. Convex portions 125a and 125b of manipulation device 100 can engage with cutouts 182a and 182b. Convex portion 125a of manipulation device 100 is formed wider than convex portion 125b. Since convex portion 125a cannot engage with cutout 182b, it is possible to prevent manipulation device 100 from being attached to recess 181 in the opposite phase.

[0057] A magnet (not shown) is provided inside bottom surface portion 188 of recess 181. Magnets 150a and 150b of manipulation device 100 are attracted by the magnet, whereby manipulation device 100 is fixed to attachment portion 190. At this time, a plurality of contact lands 210 of manipulation device 100 come into contact with a plurality of communication terminals 185, respectively, and are electrically connected, thereby enabling communication between manipulation device 100 and imaging device 1.

[0058] In this embodiment, the bottom cover member 120 of GND potential formed by using a conductive resin material is exposed on the side of the electronic module (operation device 100). That is, the electronic module has a conductive portion extending over the entire circumference of the side. For example, when a charged user operates the operation device 100, a situation is assumed in which a discharge path of static electricity is formed from the gap 191 (see FIG. 6(C)) between the top cover 180 and the operation device 100 to the inside of the imaging device 1. In this specification, this situation is referred to as an "assumed situation." In this case, the charge of static electricity reaches the bottom cover member 120 of GND potential before it reaches the contact land 210 and the communication terminal 185 arranged on the bottom side of the operation device 100. That is, since the voltage due to static electricity penetrating into the inside of the operation device 100 is reliably applied to the ground, it is possible to suppress the influence of static electricity discharge on the internal circuit of the imaging device 1.

[0059] [Second Example] A second embodiment will be described with reference to Figures 7 and 8. In this embodiment, the same items as in the first embodiment will be omitted from detailed description by using the same reference numerals and symbols already used, and differences will be mainly described. This method of omitting the description will be the same in the embodiments described later.

[0060] Fig. 7 is a perspective view for explaining the operation device 100 of this embodiment. Fig. 7(A) is a perspective view of the operation device 100 as viewed from above. Fig. 7(B) is a perspective view of the operation device 100 as viewed from below. A metal member 300 is provided between the upper cover member 110 and the lower cover member 120, and a part of the metal member 300 is exposed on the side surface of the operation device 100.

[0061] FIG. 8 is an exploded perspective view for explaining the operating device 100 of this embodiment. The lower cover member 120 is a member formed by resin molding using a synthetic resin material. The metal member 300 is a member manufactured by press molding of a metal plate and has electrical conductivity. The metal member 300 is in the shape of a ring having approximately the same diameter as the lower cover member 120. Positioning holes 305a and 305b are formed in the metal member 300. Positioning bosses 129a and 129b are formed in the lower cover member 120. The metal member 300 is positioned relative to the lower cover member 120 by inserting the positioning bosses 129a and 129b into the positioning holes 305a and 305b, respectively. The metal member 300 also has a cutout portion 306.

[0062] The circuit board 200 is fastened and fixed by screws 161 with the cutouts 306 of the metal member 300 interposed between the cutouts 204 and the screw holes 128 of the lower cover member 120. Fastening the screws 161 brings the copper foil 209 exposed around the cutouts 204 of the circuit board 200 into contact with the cutouts 306 of the metal member 300, electrically connecting the metal member 300 to the GND of the circuit board 200.

[0063] On the side of the electronic module (operation device 100) of this embodiment, the metal member 300 is partially exposed between the upper cover member 110 and the lower cover member 120. That is, the conductive portion of the electronic module is formed by the metal member 300 extending over the entire circumference of the side of the electronic module. Under the assumed circumstances, the static electricity charge reaches the metal member 300 at the GND potential before it reaches the contact land 210 and the communication terminal 185 arranged on the bottom side of the operation device 100. That is, since the voltage due to static electricity penetrating inside the operation device 100 is reliably applied to the ground, it is possible to suppress the effect of static electricity discharge on the internal circuit of the imaging device 1.

[0064] [Third Example] A third embodiment will be described with reference to Figs. 9 and 10. Fig. 9 is a perspective view for explaining the operating device 100 of this embodiment. Fig. 9(A) is a perspective view of the operating device 100 as viewed from above. Fig. 9(B) is a perspective view of the operating device 100 as viewed from below. The lower cover member 120 has a pattern wiring 124. The pattern wiring 124 is exposed on the side surface of the lower cover member 120.

[0065] FIG. 10 is an exploded perspective view for explaining the operating device 100 of this embodiment. The lower cover member 120 is a member formed by resin molding using a synthetic resin material. On the side of the lower cover member 120, a pattern wiring 124 is formed by Molded Interconnect Device (hereinafter, abbreviated as MID) technology. The MID technology is a technology for forming a conductive pattern by irradiating a laser beam to a predetermined location of a base material and applying metal plating only to the irradiated portion. The pattern wiring 124 is formed around the entire periphery of the side of the lower cover member 120 and around the screw holes 128.

[0066] The circuit board 200 is fastened and fixed by screws 161 with the pattern wiring 124 interposed between the cutout portion 204 and the screw hole 128 of the lower cover member 120. Fastening the screws 161 brings the copper foil 209 exposed around the cutout portion 204 of the circuit board 200 into contact with the pattern wiring 124 of the lower cover member 120, electrically connecting the pattern wiring 124 to the GND of the circuit board 200.

[0067] A pattern wiring 124 of the lower cover member 120 electrically connected to the GND of the circuit board 200 is exposed on the side of the electronic module (operation device 100) of this embodiment. The pattern wiring 124 is a conductive pattern formed on the surface of a member constituting the side of the electronic module. In an assumed situation, the static electricity charge reaches the pattern wiring 124 at the GND potential before reaching the contact land 210 and the communication terminal 185 arranged on the bottom side of the operation device 100. In other words, since the voltage due to static electricity penetrating inside the operation device 100 is reliably applied to the ground, it is possible to suppress the effect of static electricity discharge on the internal circuit of the imaging device 1.

[0068] [Fourth Example] A fourth embodiment will be described with reference to Fig. 10 and Fig. 11. Fig. 11 is a diagram for explaining a manipulation device 100 of this embodiment. Fig. 11(A) is a perspective view of manipulation device 100 as viewed from below. Fig. 11(B) is a bottom view of manipulation device 100 as viewed from below.

[0069] Pattern wiring 401 is formed by MID technology on the side surface of lower cover member 120. Pattern wiring 401 is a conductive pattern formed on the side surface of lower cover member 120 and around screw holes 128 (see FIG. 10).

[0070] The lower cover member 120 has a conductive region A on the side where the pattern wiring 401 is formed, and a non-conductive region B on which the pattern wiring 401 is not formed. The non-conductive region B is an area in which the pattern wiring 401 cannot be formed because it has a holding mechanism (not shown) of the operating device 100.

[0071] On the bottom side of the manipulation device 100, a plurality of contact lands 210 of the circuit board 200 are exposed from the bottom cover member 120. The arrangement of the plurality of contact lands 210 is the same as in the first embodiment, and corresponds to GND 2101, power supply 2102, detection signal 2103, and manipulation unit signal 2104, respectively.

[0072] 11(B), when the manipulation device 100 is viewed from the bottom side, the contact land 210 corresponding to the GND 2101 is arranged on the non-conductive area B side. On the other hand, the contact lands 210 corresponding to the power supply 2102, the detection signal 2103, and the operation unit signal 2104 are all arranged on the conductive area A side. The pattern wiring 401 of the lower cover member 120 is electrically connected to the GND 2101 of the circuit board 200.

[0073] In this embodiment, the pattern wiring 401 on the side of the lower cover member 120 exposed in a partial region of the side of the electronic module (operation device 100) is electrically connected to the GND of the circuit board 200. In an assumed situation, on the side of the conductive area A having the pattern wiring 401 on the side of the lower cover member 120, the static electricity charge reaches the pattern wiring 401 at the GND potential before reaching the contact land 210 and the communication terminal 185 arranged on the bottom side of the operation device 100. On the other hand, on the side of the non-conductive area B not having the pattern wiring 401 on the side of the lower cover member 120, the static electricity charge may reach the contact land 210 and the communication terminal 185 arranged on the bottom side of the operation device 100. However, since the contact land 210 with the shortest creepage distance corresponds to the GND 2101, the voltage due to the static electricity penetrating inside the operation device 100 is surely applied to the ground. Therefore, it is possible to suppress the influence of the discharge of static electricity on the internal circuit of the imaging device 1.

[0074] [Fifth Example] Next, a fifth embodiment will be described. In this embodiment, the differences from the first and fourth embodiments will be mainly described. Fig. 12 is a diagram for explaining operation device 100 of this embodiment. Fig. 12(A) is a perspective view of operation device 100 as viewed from below. Fig. 12(B) is a bottom view of operation device 100 as viewed from below.

[0075] 12B, the difference from the fourth embodiment is the contact land 210 (see the contact land 210 (2105) in the upper right) corresponding to the non-circuit GND 2105. A GND that is distinguished from the GND 2101 (reference potential) in the circuit is called a "non-circuit GND." In this embodiment, the multiple contact lands 210 correspond to the GND 2101, the power supply 2102, the detection signal 2103, the operation unit signal 2104, and the non-circuit GND 2105, respectively. The non-circuit GND 2105 is electrically connected to the copper foils 208 and 209 (see FIG. 4) inside the circuit board 200, and is not electrically connected to the GND 2101 inside the circuit board 200.

[0076] 12(B), when the manipulation device 100 is viewed from the bottom side, the contact land 210 corresponding to the non-circuit GND 2105 is arranged on the non-conductive area B side. On the other hand, the contact lands 210 corresponding to the GND 2101, the power supply 2102, the detection signal 2103, and the operation unit signal 2104 are all arranged on the conductive area A side. The pattern wiring 401 of the lower cover member 120 is electrically connected to the non-circuit GND 2105 through the screw holes 128 (see FIG. 10) of the lower cover member 120 and the copper foil 209 of the circuit board 200.

[0077] On the other hand, the communication terminal 185 (see FIG. 6) connected to the contact land 210 in the recess 181 is electrically connected to a circuit board (not shown) inside the imaging device 1. An electrical signal from the operation device 100 is transmitted to a camera system control unit 81 (see FIG. 2) inside the imaging device via the communication terminal 185. The non-circuit GND 2105 is configured to be connected to a conductive structure (not shown) with a large electrical capacity such as a metal chassis inside the imaging device 1, and is not directly connected to the camera system control unit 81. Therefore, the non-circuit GND 2105 and the GND 2101 are configured not to be electrically connected via a circuit board.

[0078] In this embodiment, the pattern wiring 401 on the side of the lower cover member 120 exposed in a partial region of the side of the electronic module (operation device 100) is electrically connected to the non-circuit GND 2105. In an assumed situation, on the side of the conductive area A having the pattern wiring 401 on the side of the lower cover member 120, the static electricity reaches the pattern wiring 401 at the GND potential before it reaches the contact land 210 and the communication terminal 185 arranged on the bottom side of the operation device 100. On the other hand, on the side of the non-conductive area B not having the pattern wiring 401 on the side of the lower cover member 120, there is a possibility that the static electricity reaches the contact land 210 and the communication terminal 185 arranged on the bottom side of the operation device 100. However, since the contact land 210 with the shortest creepage distance corresponds to the non-circuit GND 2105, the voltage due to the static electricity penetrating inside the operation device 100 is surely applied to the non-circuit GND. Therefore, it is possible to suppress the influence of the discharge of static electricity on the internal circuit of the imaging device 1.

[0079] In the above embodiment, since there is no need to secure a certain distance inside the electronic device, it is advantageous for miniaturization and can take measures against static electricity for the electronic device. Although the preferred embodiment of the present invention has been described, it is not limited to the above embodiment, and various modifications and changes are possible within the scope of the gist. The embodiment of the present disclosure includes the following configurations. [Configuration 1] An electronic module that is detachable from a mounting portion provided in an electronic device, A plurality of contacts electrically connected to a plurality of terminals disposed on the mounting portion; a conductive portion located on a second surface different from a first surface on which the contacts are located; At least one of the plurality of contacts corresponds to a reference potential, and the conductive portion is electrically connected to the contact of the reference potential. 1. An electronic module comprising: [Configuration 2] The first surface is a bottom surface of the electronic module, the second surface is a side surface of the electronic module, and the conductive portion extends around the entire periphery of the second surface. 2. The electronic module according to claim 1, [Configuration 3] a circuit board having the plurality of contacts; The conductive portion is electrically connected to the ground of the circuit board. 3. The electronic module according to configuration 1 or 2. [Configuration 4] A conductive member is provided on the second surface, The conductive portion is formed of the conductive member. 4. An electronic module according to any one of configurations 1 to 3. [Configuration 5] a circuit board having the plurality of contacts; The circuit board and the conductive member are fastened together, and the ground of the circuit board and the conductive member are electrically connected. 5. The electronic module according to configuration 4. [Configuration 6] A metal member is included. The conductive portion is formed by exposing the metal member on the second surface. 4. An electronic module according to any one of configurations 1 to 3. [Configuration 7] a circuit board having the plurality of contacts; The circuit board and the metal member are fastened together, and the ground of the circuit board and the metal member are electrically connected to each other. 7. The electronic module according to configuration 6, [Configuration 8] The conductive portion is formed by forming a conductive pattern on the surface of the member that constitutes the second surface. 4. An electronic module according to any one of configurations 1 to 3. [Configuration 9] a circuit board having the plurality of contacts; The circuit board and the member constituting the second surface are fastened together, and the ground of the circuit board and the conductive pattern are electrically connected. 9. The electronic module of configuration 8. [Configuration 10] the second surface has a first region having the conductive portion and a second region not having the conductive portion; When viewed from a direction perpendicular to the first surface, a contact corresponding to the reference potential among the plurality of contacts is disposed on the second region side. 3. The electronic module according to configuration 1 or 2. [Configuration 11] a circuit board having the plurality of contacts; The conductive portion is electrically connected to the ground of the circuit board. 11. The electronic module of configuration 10. [Configuration 12] a circuit board having the contacts; The conductive portion is electrically connected to a second ground that is not electrically connected to a first ground of the circuit board. 11. The electronic module of configuration 10. [Configuration 13] The device has an operating member and an operation detector. 13. An electronic module according to any one of configurations 1 to 12. [Configuration 14] The electronic module according to any one of configurations 1 to 13 is detachably attached to the mounting portion. 1. An electronic device comprising: [Configuration 15] the mounting portion has a recess into which the electronic module can be attached, The plurality of terminals are disposed in the recess. 15. The electronic device according to configuration 14. [Explanation of symbols]

[0080] 1. Imaging device 100...Operating equipment 120...Lower cover member 124,401···Pattern wiring 300 Metallic parts

Claims

1. An electronic module that is detachable from a mounting portion provided in an electronic device, A plurality of contacts electrically connected to a plurality of terminals disposed on the mounting portion; a conductive portion located on a second surface different from a first surface on which the contacts are located; At least one of the plurality of contacts corresponds to a reference potential, and the conductive portion is electrically connected to the contact of the reference potential.

1. An electronic module comprising:

2. The first surface is a bottom surface of the electronic module, the second surface is a side surface of the electronic module, and the conductive portion extends around the entire periphery of the second surface.

2. The electronic module of claim 1.

3. a circuit board having the plurality of contacts; The conductive portion is electrically connected to the ground of the circuit board.

3. An electronic module according to claim 1 or 2.

4. A conductive member is provided on the second surface, The conductive portion is formed of the conductive member.

2. The electronic module of claim 1.

5. a circuit board having the plurality of contacts; The circuit board and the conductive member are fastened together, and the ground of the circuit board and the conductive member are electrically connected.

5. Electronic module according to claim 4.

6. A metal member is included. The conductive portion is formed by exposing the metal member on the second surface.

2. The electronic module of claim 1.

7. a circuit board having the plurality of contacts; The circuit board and the metal member are fastened together, and the ground of the circuit board and the metal member are electrically connected to each other.

7. Electronic module according to claim 6.

8. The conductive portion is formed by forming a conductive pattern on the surface of the member that constitutes the second surface.

2. The electronic module of claim 1.

9. a circuit board having the plurality of contacts; The circuit board and the member constituting the second surface are fastened together, and the ground of the circuit board and the conductive pattern are electrically connected.

9. Electronic module according to claim 8.

10. the second surface has a first region having the conductive portion and a second region not having the conductive portion; When viewed from a direction perpendicular to the first surface, a contact corresponding to the reference potential among the plurality of contacts is disposed on the second region side.

3. An electronic module according to claim 1 or 2.

11. a circuit board having the plurality of contacts; The conductive portion is electrically connected to the ground of the circuit board.

11. Electronic module according to claim 10.

12. a circuit board having the plurality of contacts; The conductive portion is electrically connected to a second ground that is not electrically connected to a first ground of the circuit board.

11. Electronic module according to claim 10.

13. The device has an operating member and an operation detector.

2. The electronic module of claim 1.

14. The electronic module according to claim 1 is detachably attached to the mounting portion.

1. An electronic device comprising:

15. the mounting portion has a recess into which the electronic module can be attached, The plurality of terminals are disposed in the recess.

15. The electronic device according to claim 14.

Images