Cooling component and cooling device

Abstract

To enhance cooling efficiency by promoting circulation of a refrigerant while saving a space in a structure for performing heat transfer through a phase change of a gas phase and a liquid phase of the refrigerant in a container.SOLUTION: A cooling component 40 includes: a container 44 in which a refrigerant is sealed; a heat reception part 46 that receives heat from a cooling target and evaporates the refrigerant within the container 44; a condensation part 72 that is located to separate from the heat reception part 46 in the container 44 and condenses a gas-phase refrigerant; a liquid transportation part (transportation pipe 78) that connects the condensation part 72 and the heat reception part 46 and in which a liquid-phase refrigerant is transported from the condensation part 72 to the heat reception part 46 through a capillary phenomenon; a first transportation part 50 that connects the heat reception part 46 and the condensation part 72 and has a first transportation space 74 in which the gas-phase refrigerant is transported from the heat reception part 46 to the condensation part 72; and a pair of second transportation parts (side walls 100) that are provided on both sides in a direction orthogonal to a movement direction of the refrigerant in the first transportation part 50 and each of which connects the heat reception part 46 and the condensation part 72 and has a second transportation space 104 in which the gas-phase refrigerant is transported from the heat reception part 46 to the condensation part 72.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The technology disclosed in this application relates to a cooling component and a cooling device. [Background technology]

[0002] There is a cooling device having a heat receiving portion, a heat dissipation portion, and a connecting portion that connects the heat receiving portion and the heat dissipation portion, and the base portion in the heat receiving portion that is in thermal contact with the object to be cooled is provided with an outer wall portion of the heat receiving portion that is part of the outer wall of the heat receiving portion, and a plurality of protrusions arranged on the bottom surface of the heat receiving portion that comes into contact with the refrigerant. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2012 / 115214 Summary of the Invention [Problem to be solved by the invention]

[0004] There is a cooling device that can transport heat received by a heat receiving part to a part other than the heat receiving part by repeatedly evaporating and condensing the refrigerant in a sealed container and circulating the refrigerant. In a cooling device that circulates a refrigerant, the heat transported by the refrigerant is released to the outside, thereby cooling the cooling target.

[0005] In such cooling components and cooling devices, if the circulation of the refrigerant is insufficient, the heat transport by the vaporized refrigerant cannot be sufficiently performed, and the cooling capacity cannot be fully demonstrated. In order to promote the circulation of the refrigerant, for example, it is possible to expand the transport space of the gas-phase refrigerant from the heat receiving part to the condensing part. However, simply expanding the transport space of the refrigerant requires a large space for the cooling components.

[0006] One aspect of the technology disclosed in this application is to improve cooling efficiency by promoting circulation of a refrigerant in a space-saving structure in which heat transfer is achieved by phase change of a refrigerant between gas and liquid phases inside a container. [Means for solving the problem]

[0007] The technology disclosed in the present application includes a container in which a refrigerant is sealed, a heat receiving section, a condensing section, a liquid transport section, a first transport section, and a second transport section. The container has a refrigerant sealed therein. The heat receiving section receives heat from a cooling target and evaporates the refrigerant inside the container. The condensing section is located inside the container and separates from the heat receiving section, and condenses the gas phase refrigerant. The liquid transport section connects the condensing section, located inside the container and separate from the heat receiving section, to the heat receiving section. In the liquid transport section, the liquid phase refrigerant is transported from the condensing section to the heat receiving section by capillary action. The first transport section connects the heat receiving section and the condensing section inside the container, and includes a first transport space therein through which the gas phase refrigerant is transported from the heat receiving section to the condensing section. The second transport section is provided in pairs on both sides of the direction perpendicular to the movement direction of the refrigerant in the first transport section inside the container, and includes a second transport space therein through which the heat receiving section and the condensing section are connected, and the gas phase refrigerant is transported from the heat receiving section to the condensing section. Effect of the Invention

[0008] The technology disclosed in this application makes it possible to improve cooling efficiency by promoting circulation of the refrigerant in a space-saving structure in which heat is transferred by phase change between gas and liquid phases of the refrigerant inside a container. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing a cooling device according to a first embodiment. [Diagram 2] FIG. 2 is an exploded perspective view showing the cooling device of the first embodiment. [Diagram 3] FIG. 3 is a partial plan view showing an electronic device equipped with the cooling device of the first embodiment together with the internal structure of the cooling device. [Figure 4] FIG. 4 is a plan view showing the internal structure of the cooling device of the first embodiment. [Diagram 5] FIG. 5 is a cross-sectional view taken along line 5-5 in FIG. 4, showing the cooling device of the first embodiment in a non-inclined state. [Figure 6] FIG. 6 is a cross-sectional view showing the cooling device of the first embodiment in an inclined state. [Figure 7] FIG. 7 is a plan view showing one end portion of a transport pipe in the cooling device of the first embodiment together with a part of the evaporator. [Figure 8] FIG. 8 is a cross-sectional view showing the other end portion of the transport pipe in the cooling device of the first embodiment together with a part of the container. [Figure 9] FIG. 9 is a side view showing one end portion of a transport pipe in the cooling device of the first embodiment together with a part of the evaporator. [Figure 10] FIG. 10 is a graph showing the relationship between the inner diameter of the transportation pipe and the height of the water column rising inside the transportation pipe. [Figure 11] FIG. 11 is an enlarged cross-sectional view of the portion indicated by reference numeral 11 in FIG. 5, showing how the refrigerant evaporates in the cooling device of the first embodiment. [Figure 12] FIG. 12 is an enlarged cross-sectional view of the portion indicated by reference numeral 12 in FIG. 5 in which the refrigerant is condensed in the cooling device of the first embodiment. [Figure 13A] FIG. 13A is a cross-sectional view taken along line 13A-13A in FIG. 4, showing the cooling device of the first embodiment. [Figure 13B] 13B is a cross-sectional view of the cooling device of the first embodiment taken along line 13B-13B in FIG. [Figure 13C] 13C is a cross-sectional view of the cooling device of the first embodiment taken along line 13C-13C in FIG. [Figure 14A] FIG. 14A is a perspective view showing a flow of a refrigerant in the cooling device of the first embodiment. [Figure 14B] FIG. 14B is a plan view showing the flow of the refrigerant in the cooling device of the first embodiment. [Figure 15A] FIG. 15A is a perspective view showing the flow of a refrigerant in a cooling device of a comparative example. [Figure 15B] FIG. 15B is a plan view showing the flow of the refrigerant in the cooling device of the comparative example. [Figure 16] FIG. 16 is a plan view showing the internal structure of the cooling device of the present disclosure together with the injection hole and injection pipe. [Figure 17] FIG. 17 is a cross-sectional view taken along line 17-17 in FIG. 16, showing the internal structure of the cooling device of the present disclosure. [Figure 18] FIG. 18 is a cross-sectional view of the injection pipe of the cooling device of the present disclosure in an unsealed state. [Figure 19] FIG. 19 is a cross-sectional view of the injection pipe of the cooling device of the present disclosure in a compressed and sealed state. [Figure 20] FIG. 20 is a cross-sectional view showing the injection hole of the cooling device of the present disclosure sealed with a plug at the end of the injection pipe. [Figure 21] FIG. 21 is an enlarged perspective view of a mesh member and its vicinity in a cooling device according to a second embodiment. [Figure 22] FIG. 22 is a plan sectional view partially showing a cooling device according to a third embodiment. [Diagram 23] FIG. 23 is a cross-sectional view taken along line 23-23 in FIG. 22, showing the cooling device of the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The cooling component 40 and the cooling device 42 of the first embodiment will be described in detail with reference to the drawings.

[0011] 1 and 2 show a cooling component 40 and a cooling device 42 according to a first embodiment. Also, Fig. 3 shows an electronic device 32 equipped with the cooling device 42. The electronic device 32 may be, but is not limited to, an information and communication device such as a server.

[0012] The electronic device 32 has a substrate 34 that is rigid and insulating. A plurality of elements 36, 38 are mounted on the substrate 34. The types of the elements 36, 38 are not particularly limited, but in the example shown in FIG. 3, the element 36 is a processor chip and the element 38 is a memory chip. In this case, the element 36 is an example of a heat generating body. The cooling device 42 is disposed in contact with the element 36 and cools the element 36.

[0013] 1 to 5, the cooling device 42 has a cooling part 40. The cooling part 40 has a container 44, a heat receiving part 46, a heat dissipation part 48, a first transport part 50, and a condensation part 72. The container 44 is plate-shaped including the heat receiving part 46, the first transport part 50, and the condensation part 72. In the drawings, the width direction, depth direction, and height direction of the container 44 are indicated by arrows W, D, and H, respectively.

[0014] The RF coolant (see FIG. 5) is sealed in the container 44. The type of RF coolant is not limited as long as it can transfer heat by circulating in the container 44 while undergoing a phase transition between liquid and gas phases. A specific example of the RF coolant is water, and oil or alcohol can also be used. Water is particularly easy to obtain and easy to handle, and is used in this embodiment. The inside of the container 44 is maintained in a low pressure state, which lowers the boiling point of the coolant. For example, when water is used as the coolant, the temperature of the heat receiving portion 46 can be maintained at a temperature at which the element 36 operates stably by lowering the boiling point of the coolant.

[0015] 3, the heat receiving portion 46 is a portion that is in contact with the element 36 and receives heat from the element 36. The heat receiving portion 46 applies the heat received from the element 36 to the inside of the container 44. The heat receiving portion 46 is provided with an evaporator 62. The evaporator 62 vaporizes the liquid phase refrigerant RF inside the container 44 by heat.

[0016] The condenser section 72 is disposed away from the heat receiving section 46. In the condenser section 72, heat is released from the gas phase refrigerant RF, whereby the gas phase refrigerant RF is condensed and liquefied.

[0017] The first transport section 50 connects the heat receiving section 46 and the condensation section 72. The first transport section 50 has a first transport space 74 therein. As described below, in the first transport space 74, the gas phase and liquid phase refrigerant RF is transported between the evaporation section 62 and the condensation section 72. A part of the heat of the gas phase refrigerant RF is also discharged to the outside in the first transport section 50, and the refrigerant RF is liquefied.

[0018] In this embodiment, the condensation section 72 is wider in the width direction and shorter in the depth direction than the heat receiving section 46. The first transport section 50 is narrower in the width direction than the heat receiving section 46 and has a depth for connecting the heat receiving section 46 and the condensation section 72.

[0019] As shown in FIG. 2, the container 44 has a structure in which two plate members, a bottom plate 52 and a top plate 54, are fixed together in a stacked state in the thickness direction (height direction).

[0020] A heat dissipation portion 48 is provided on the top plate 54 of the container 44. The heat dissipation portion 48 promotes the action of dissipating heat of the refrigerant RF sealed in the container 44 to the outside.

[0021] The heat dissipation section 48 includes a plurality of fins 90. The fins 90 increase the substantial surface area of ​​the container 44, i.e., the heat dissipation area for dissipating heat to the outside (air cooling). In particular, in this embodiment, the fins 90 are provided over substantially the entire area of ​​the top plate 54, ensuring a wide heat dissipation area. Specifically, the fins 90 are formed in the region above the heat receiving section 46, the region above the first transport section 50, and the region above the condensation section 72.

[0022] As described later, heat of the refrigerant RF is also released to the outside from the portion corresponding to the heat receiving portion 46 and the portion corresponding to the first transport portion 50. Therefore, in the container 44, the portion corresponding to the heat receiving portion 46 acts as a heat dissipation portion, and further, the heat dissipation portion 48 acts as an additional heat dissipation portion added to this heat dissipation portion.

[0023] A fan is provided outside the cooling device 42. The wind generated by this fan strikes the heat dissipation section 48, promoting heat dissipation from the heat dissipation section 48. The condensation section 72 is disposed upstream of the flow of air from the fan relative to the heat receiving section 46. In other words, the cooling component 40 is disposed in such a way that it can be efficiently cooled by directly blowing the air from the fan against the fins 90 located at the condensation section 72.

[0024] 1 to 4, bottom plate 52 is provided with insertion holes 88. Fasteners such as screws are inserted into insertion holes 88 and fastened to substrate 34. In this way, cooling device 42 is fixed to substrate 34. Since element 36 to be cooled is mounted on substrate 34, cooling device 42 is also fixed to element 36.

[0025] 2 to 4, the bottom plate 52 is formed with standing walls 52K, 52L having a shape surrounding the insertion hole 88 when viewed in the direction of arrow A1 (shown in FIG. 2). The standing wall 52K surrounds the insertion hole 88 located at the center in the depth direction, and the standing wall 52L surrounds the insertion hole 88L located at the front in the depth direction. The standing walls 52K, 52L isolate the insertion holes 88K, 88L from the internal space of the container 44.

[0026] 2, the top plate 54 has a shape that avoids the insertion holes 88 when viewed in the overlapping direction with the bottom plate 52 (the direction of the arrow A1). Therefore, when fixing the cooling device 42 to the substrate 34, the top plate 54 does not get in the way and a fastening operation (for example, turning a screw) can be performed on the fastener.

[0027] A plurality of second support columns 56 stand upright from the bottom plate 52. The tips (upper ends) of the second support columns 56 are in contact with the top plate 54, and the top plate 54 is supported by the second support columns 56. The inside of the container 44 is maintained at a low pressure, but even in the low pressure state, the second support columns 56 maintain the distance between the top plate 54 and the bottom plate 52. By maintaining the distance between the top plate 54 and the bottom plate 52, the internal volume of the container 44 is ensured.

[0028] In this embodiment, as shown in Figures 2 and 4, multiple second supports 56 are arranged in the heat dissipation section 48 at intervals in the width direction of the container 44, and further, multiple second supports 56 are arranged in the first transport section 50 at intervals in the depth direction of the container 44.

[0029] 2, an opening 58 is formed in the bottom plate 52 at the portion of the heat receiving portion 46. A heat receiving plate 60 is fitted into this opening 58, whereby a sealed structure for the container 44 is realized by the bottom plate 52, the top plate 54, and the heat receiving plate 60.

[0030] A plurality of pillar members 64 are erected on the heat receiving plate 60 facing the top plate 54. As shown in detail in Figs. 5 to 7, the plurality of pillar members 64 are arranged at regular intervals in the width direction and the depth direction, and a lattice-shaped groove portion 66 is formed between the pillar members 64. A groove width W1 of the groove portion 66 is narrower than an inner diameter N1 of a transport pipe 78 described later.

[0031] 11, in the groove portion 66, the heat from the heat receiving portion 46 promotes the vaporization of the liquid phase refrigerant RF. This "vaporization" includes not only "evaporation" in which the refrigerant RF vaporizes from the surface as shown by the arrow GF, but also "boiling" in which the refrigerant RF vaporizes from the inside as shown by the bubbles GB, but hereinafter, these are all referred to as "evaporation." The portion provided with the pillar members 64 is the portion where the liquid phase refrigerant RF vaporizes in this way, and is the evaporation portion 62.

[0032] The tips of the pillar members 64 are in contact with the top plate 54. This also maintains the gap between the top plate 54 and the bottom plate 52 in a low-pressure state inside the vessel 44, and ensures the internal volume of the vessel 44.

[0033] 4, the heat receiving portion 46 has a diffusion space 68. The diffusion space 68 is formed around the heat receiving plate 60 between the top plate 54 and the bottom plate 52. The gas phase refrigerant RF evaporated in the evaporation portion 62 diffuses into the diffusion space 68.

[0034] Between the heat receiving section 46 and the heat dissipating section 48, a first transport space 74 is formed between the top plate 54 and the bottom plate 52. The first transport space 74 is a space in which the gas-phase refrigerant RF generated in the evaporation section 62 and diffused in the diffusion space 68 is transported to the heat dissipating section 48. During the movement of the gas-phase refrigerant RF through the first transport space 74, the heat of the refrigerant RF is discharged to the outside of the container 44. As a result, the gas-phase refrigerant RF is condensed and liquefied. That is, the first transport section 50 is also a portion in which the gas-phase refrigerant RF is condensed in this manner.

[0035] 12, a plurality of protrusions 76 are formed on the top plate 54 toward the bottom plate 52. Each of the protrusions 76 is tapered toward the tip side. By providing such protrusions 76, the surface area of ​​the top face of the condensation section 72 is increased compared to a structure without the protrusions 76.

[0036] As shown in Figs. 4 to 6, a transport pipe 78 extending in the depth direction is disposed inside the container 44. There may be only one transport pipe 78, but in this embodiment, there are multiple transport pipes. Specifically, in the example shown in Fig. 13, two sets of four transport pipes disposed adjacent to each other in the width direction are disposed at intervals in the width direction, for a total of eight transport pipes 78. The longitudinal direction of the transport pipes 78 coincides with the depth direction of the container 44 (the direction of arrow D).

[0037] 7, the inner diameter N1 of the transport pipe 78 is set to a diameter capable of transporting the liquid phase refrigerant RF by capillary action and capable of transporting a sufficient amount of refrigerant RF from the condenser section 72 to the evaporator section 62 in total for the multiple transport pipes 78. The transport pipe 78 is an example of a liquid transport section that transports the liquid phase refrigerant RF to the evaporator section 62 by capillary action.

[0038] 6 shows a case where the cooling device 42 is tilted so that one end portion 78A is higher than the other end portion 78B. Even when the cooling device 42 is tilted in this way, the upper limit of the inner diameter N1 of the transport pipe 78 is determined so that the refrigerant RF can be transported from the other end portion 78B to the one end portion 78A by capillary action.

[0039] 7 and 9, one end portion 78A of the transportation pipe 78 faces the pillar member 64. A gap is provided in the one end portion 78A. Specifically, the transportation pipe 78 is cut out at the one end portion 78A to form an inclined portion 82A that is inclined with respect to the longitudinal direction of the transportation pipe 78. This inclined portion 82A is an example of a gap.

[0040] Particularly, in this embodiment, the inclined portion 82A has a V-shape as shown in Fig. 9. That is, the inclined portion 82A has a pair of inclined surfaces 82T that approach each other as they move away from the pillar member 64. The portion where the inclined portion 82A is provided, i.e., the region between the inclined surfaces 82T, is a gap 84A through which the liquid phase refrigerant RF moves from the transport pipe 78 to the evaporation section 62. A plurality of inclined portions 82A are formed at regular intervals in the circumferential direction in one transport pipe 78. In this embodiment, as shown in Fig. 7, two inclined portions 82A are formed in one transport pipe 78 at a distance in the width direction (arrow W direction) of the container 44.

[0041] The other end portion 78B of the transport pipe 78 faces the side wall 44S of the container 44, as shown in FIG. 8. This side wall 44S is a side wall forming an end portion on the front side in the depth direction (the condensation section 72 side). A second gap portion is provided in the other end portion 78B. Specifically, a second inclined portion 82B is formed by inclining the other end portion 78B in one direction with respect to the longitudinal direction of the transport pipe 78. The region between the side wall 44S and the second inclined portion 82B is the second gap 84B. In the second gap 84B, the liquid phase refrigerant RF moves from the condensation section 72 into the transport pipe 78.

[0042] As shown in Figs. 4, 13B, and 13C, convex portions 86A and 86B are formed inside the container 44. The convex portions 86A and 86B protrude from the bottom plate 52 toward the top plate 54. The convex portions 86A are located on both sides of each pair of transport pipes 78 in the width direction. The convex portions 86A suppress the movement of the transport pipes 78 in the width direction, thereby holding the transport pipes 78. The convex portions 86B are located in a position where each pair of transport pipes 78 is sandwiched between the convex portions 86B and the standing wall 52K. The convex portions 86B and the standing wall 52K also suppress the movement of the transport pipes 78 in the width direction, thereby holding the transport pipes 78.

[0043] The container 44 is provided with side walls 100. In this embodiment, there are two side walls 100. Both of the two side walls 100 are parallel to the fins 90. Each side wall 100 is plate-shaped. The side walls 100 are formed upward from the ends of the heat receiving section 46 in the width direction. The side walls 100 partially overlap the heat receiving section 46 in a plan view, i.e., when viewed in the direction of arrow A1. The side walls 100 are provided in pairs on both sides of the direction perpendicular to the movement direction of the refrigerant in the first transport section 50 inside the container 44.

[0044] Each side wall 100 is continuous in the depth direction from the front end to the rear end of the top plate 54. The height of the side wall 100 is approximately the same as the height of the fins 90. The thickness of the side wall 100 is thicker than that of the fins 90. Specifically, for example, the thickness of the fins 90 is not less than 0.2 mm and not more than 0.4 mm, whereas the thickness of the side wall 100 is not less than 4 mm and not more than 5 mm. The side wall 100 is an example of a second transport section.

[0045] As shown in Figures 13A to 13C, the side wall 100 extends in the depth direction. The side wall 100 includes a first side plate 102A and a second side plate 102B that are parallel to each other. A second transport space 104 is provided inside the side wall 100. As shown in Figure 13A, the second transport space 104 continues in the depth direction from the position of the heat receiving section 46 to the position of the heat dissipating section 48. The width of the second transport space 104 (the inner dimension in the direction of the arrow W) is, for example, about 2 mm.

[0046] 13B, the second transport space 104 is connected to the communication path 108 at the position of the heat receiving section 46. That is, the evaporation section 62 and the second transport space 104 are in communication with each other via the communication path 108. This allows the movement of fluid from the evaporation section 62 to the second transport space 104.

[0047] 13C, the second transport space 104 communicates with the interior of the container 44 at the location of the condenser section 72. This allows the movement of fluid from the second transport space 104 to the condenser section 72.

[0048] A plurality of support columns 106 are provided inside the side wall 100. Each support column 106 extends laterally (widthwise) in the second transport space 104. One end of the support column 106 contacts the first side plate 102A of the side wall 100, and the other end contacts the second side plate 102B. The second transport space 104 is maintained in a low pressure state similar to the inside of the container 44, but even in the low pressure state, the support columns 106 maintain the distance between the first side plate 102A and the second side plate 102B. By maintaining the distance between the first side plate 102A and the second side plate 102B, the volume of the second transport space 104 is ensured.

[0049] In this embodiment, as shown in FIG. 13A, a plurality of second support columns 56 are disposed in the second transport space 104 at intervals in the depth direction.

[0050] The side wall 100 has a function of dissipating heat from the gas phase refrigerant RF. That is, at the side wall 100, a part of the heat of the gas phase refrigerant RF in the second transport space 104 is discharged to the outside, and the gas phase refrigerant RF is liquefied.

[0051] Inside the container 44, a plurality of second supports 56 are also provided in the heat receiving section 46 on both sides of the evaporating section 62 in the width direction. On each side of the evaporating section 62, the plurality of second supports 56 are arranged at intervals in the depth direction. On both sides of the evaporating section 62, the second supports 56 maintain the interval between the top plate 54 and the bottom plate 52. This ensures the volume of the diffusion space 68. The regions between the second supports 56 and the regions between the second supports 56 and the standing walls 52K, 52L form communication paths 108 for the gas-phase refrigerant RF generated in the evaporating section 62 to move to the second transport space 104.

[0052] As shown in Fig. 13A, a recess 110 is formed in the bottom plate 52 of the container 44. The recess 110 is formed at a position that avoids the electronic components mounted on the substrate 34. The recess 110 is formed so that the container 44 does not interfere with the electronic components. In the example shown in Fig. 13A, the recess 110 is formed in the bottom plate 52 at a position that corresponds to the condensation section 72, but the position of the recess 110 is not limited as long as it is a position that can avoid the electronic components. In the cooling component 40 of the first embodiment, the recess 110 is formed by partially thinning the bottom plate 52.

[0053] As shown in Figs. 16 and 17, the container 44 is provided with an injection hole 92 that communicates the inside and outside of the container 44. An injection pipe 96 extends from the injection hole 92 to the outside of the container 44. To inject the refrigerant RF into the container 44, the air in the container 44 is discharged using a vacuum pump or the like in Fig. 18. Then, the refrigerant is injected through the injection pipe 96 as shown by the arrow V1. Then, the refrigerant in the container 44 is heated to boil, and the dissolved air in the refrigerant RF is discharged to the outside of the container 44. However, this operation is not necessary when using a degassed refrigerant from which the dissolved air has been removed in advance. Next, the injection pipe 96 is compressed from the outside and sealed as shown by the arrow V2 in Fig. 19. Furthermore, as shown in Fig. 20, a plug 94 is inserted into the tip of the injection pipe 96 to seal the injection pipe 96 more firmly. That is, by providing the injection hole 92, the refrigerant RF can be injected into the inside of the container 44 through the injection hole 92. Then, after injection, injection hole 92 is sealed with plug 94, thereby sealing the refrigerant RF inside container 44. Note that injection hole 92, plug 94, and injection pipe 96 are not shown in the drawings other than Figures 16 to 20.

[0054] Next, the operation of this embodiment will be described.

[0055] When the heat receiving portion 46 receives heat from the element 36, this heat vaporizes the liquid-phase refrigerant RF in the groove portion 66 in the evaporation portion 62, as shown in Fig. 5. That is, the liquid-phase refrigerant RF becomes gaseous due to evaporation from the surface of the refrigerant RF (see arrow GF) and boiling from the inside of the refrigerant RF (see bubbles GB).

[0056] The gas-phase refrigerant RF is diffused in the diffusion space 68. A portion of the gas-phase refrigerant RF diffused in the diffusion space 68 flows into the first transport space 74. The gas-phase refrigerant RF that has flowed into the first transport space 74 moves to the condensation section 72 through the first transport space 74 (see arrow F1 in FIGS. 5 and 6).

[0057] Furthermore, of the gas phase refrigerant RF diffused in the diffusion space 68, a portion of the gas phase refrigerant RF that does not flow into the first transport space 74 flows into the second transport space 104 through the communication path 108, as shown by arrow F11 in Fig. 13B. Furthermore, the gas phase refrigerant RF that has flowed into the second transport space 104 moves to the condensation section 72 through the second transport space 104, as shown by arrow F12 in Fig. 13A.

[0058] In the diffusion space 68 and the first transport space 74, a portion of the gas-phase refrigerant RF is condensed and liquefied by heat dissipation through the fins 90. In the second transport space 104, a portion of the gas-phase refrigerant RF is condensed and liquefied by heat dissipation through the side wall 100.

[0059] The refrigerant RF that is not liquefied in the diffusion space 68, the first transport space 74, and the second transport space 104 reaches the condenser section 72 while maintaining the gas phase state. In the condenser section 72, the gas phase refrigerant RF is condensed and liquefied. As the gas phase refrigerant RF is liquefied, the condensation heat is released from the top plate 54 to the outside of the container 44. As a result, the heat of the element 36 is released into the outside air.

[0060] 4, the condenser section 72 is formed to be wider in the width direction (arrow W direction) than the evaporator section 62. Therefore, compared to a structure in which the condenser section 72 is not made wider, a larger area for dissipating heat from the gas-phase refrigerant RF can be secured, and the condensation of the refrigerant RF can be promoted. The condenser section 72 is farther away from the heat receiving section 46 than the first transport section 50. That is, the gas-phase refrigerant RF can be transported and condensed not only to the first transport section 50, which is relatively close to the heat receiving section 46, but also to the condenser section 72, which is relatively far away.

[0061] The fins 90 acting as the heat dissipation section 48 are disposed on the top plate 54 in a portion corresponding to the heat receiving section 46, the first transport section 50, and the condensation section 72. Heat can be dissipated over a wide range of the top plate 54, and the gas phase refrigerant RF can be condensed.

[0062] Fig. 14A shows the flow of gas-phase refrigerant RF in the cooling component 40 of the first embodiment. Fig. 14B shows the flow of gas-phase refrigerant RF and liquid-phase refrigerant RF in the cooling component 40 of the first embodiment. Fig. 15A shows the flow of gas-phase refrigerant RF in the cooling component 900 of the comparative example. Fig. 15B shows the flow of gas-phase refrigerant RF and liquid-phase refrigerant RF in the cooling component 900 of the comparative example.

[0063] The cooling component 900 of the comparative example has a structure without a side wall 100, as compared with the cooling component 40 of the first embodiment. Since the cooling component 900 of the comparative example does not have a side wall 100, it does not have a second transport space 104. Since the cooling component 900 of the comparative example does not have the second transport space 104, the transport space of the refrigerant RF between the heat receiving section 46 and the condensing section 72 is two systems, the transport pipe 78 and the first transport space 74 (see FIG. 4 shown as the first embodiment). Therefore, as shown by the arrows FG in FIG. 15A, the gas phase refrigerant RF diffused in the diffusion space 68 is transported to the condensing section 72 only by the first transport space 74. Also, as shown by the arrows FL in FIG. 15B, in the cooling component 900 of the comparative example, the liquid phase refrigerant RF condensed in the condensing section 72 is transported to the heat receiving section 46 by the transport pipe 78. That is, in the first transport section 50, a flow of the gas-phase refrigerant RF (arrow FG) and a flow of the liquid-phase refrigerant RF (arrow FL) opposite to the flow direction of the gas-phase refrigerant RF are generated.

[0064] In contrast, the cooling component 40 of the first embodiment has a side wall 100. A second transport space 104 is provided inside the side wall 100. As shown in FIG. 14A, the gas-phase refrigerant RF diffused in the diffusion space 68 is transported to the condensation section 72 not only by the first transport space 74 but also by the second transport space 104 via the communication path 108 (see FIG. 13B). Also, in the cooling component 40 of the first embodiment, the liquid-phase refrigerant RF in the condensation section 72 is transported to the heat receiving section 46 by the transport pipe 78. As a result, as shown in FIG. 14B, a loop-shaped transport path is formed. In the loop-shaped transport path, the gas-phase refrigerant RF in the diffusion space 68 is transported to the condensation section 72 by the second transport space 104 via the communication path 108, and the liquid-phase refrigerant RF is further transported from the condensation section 72 to the heat receiving section 46 by the transport pipe 78.

[0065] In addition, in the cooling component 900 of the comparative example, when forming such a loop-shaped transport path as the transport path of the refrigerant RF, it is possible to consider arranging a member that forms a new transport path, for example, on the widthwise outer side of the heat receiving section 46 and the first transport section 50.

[0066] 3, in the electronic device 32, various elements such as the element 38 and various parts are mounted around the cooling device 42. Therefore, for example, in the cooling component 900 of the comparative example, it is difficult to form a connection member such as the first transport section 50 that connects the heat receiving section 46 and the condensation section 72 by spreading it out in a plane. In addition, if such a connection member is partially bent or cut to avoid interference with the various elements and parts, it is disadvantageous in terms of transporting the gas-phase refrigerant RF.

[0067] In contrast, in the cooling component 40 of the first embodiment, a pair of side walls 100 are provided inside the container 44 on both sides in a direction perpendicular to the movement direction of the refrigerant in the first transport section 50. The second transport space 104 forming a part of the looped transport path shown in FIG. 14B is provided without widening the container 44 in the width direction. That is, in the cooling component 40 of the first embodiment, a looped transport path is formed in a small space, thereby promoting circulation of the refrigerant RF. And, by promoting circulation of the refrigerant RF, the cooling component 40 and the cooling device 42 can improve the cooling efficiency.

[0068] Furthermore, there are many cases where the electronic device 32 has a height restriction. For example, if the electronic device 32 is a so-called rack-mounted server, the rack-mounted server is limited to a certain height. In this way, even if there is a restriction on the height of the electronic device 32, it is possible to promote the circulation of the refrigerant RF and improve the cooling efficiency of the cooling component 40 and the cooling device 42 without increasing the height of the cooling component 40.

[0069] The container 44 has an insertion hole 88 formed at the position of the first transport section 50. In the portion where the insertion hole 88 is formed, the width of the first transport section 50 is partially narrower than in a structure without the insertion hole 88. Since the width of the first transport section 50 is narrow, it is difficult to ensure a wide first transport space 74 in the first transport section 50 in addition to the transport pipe 78. In contrast, the cooling component 40 of the first embodiment has the second transport space 104. Therefore, the cross-sectional area of ​​the space through which the gas-phase refrigerant RF is transported from the heat receiving section 46 to the condensing section 72 can be ensured to be wide by the first transport space 74 and the second transport space 104.

[0070] In the cooling component 40 of the first embodiment, two side walls 100, which are an example of the second transport section, are provided on both sides of the width direction (direction perpendicular to the movement direction of the refrigerant RF) of the first transport section 50. Although the movement of the gas-phase refrigerant RF from the heat receiving section 46 to the condensation section 72 can be promoted even with one side wall 100, the movement of the refrigerant RF can be further promoted by providing two side walls 100. Note that the number of side walls 100 may be three or more, and in the case where the number of side walls 100 is three or more, the side walls 100 are provided instead of some of the fins 90. By providing two side walls 100, a structure can be realized in which the number of fins 90 is secured while the cross-sectional area through which the gas-phase refrigerant RF moves from the heat receiving section 46 to the condensation section 72 is secured, and the heat dissipation capacity of the fins 90 is also maintained.

[0071] When two side walls 100 are provided, they are provided in pairs in the width direction, that is, at positions symmetrical with respect to the center line CL in the width direction, as shown in Fig. 4. This allows the movement of the gas-phase refrigerant RF from the heat receiving section 46 to the condensing section 72 to be generated symmetrical with respect to the center line CL in the width direction, and makes it possible to suppress uneven movement of the refrigerant RF.

[0072] In this embodiment, the container 44 is plate-shaped. That is, the first transport section 50 is plate-shaped. The side wall 100 is also plate-shaped and is disposed perpendicular to the first transport section 50. In the disclosed technology, an example in which the side wall 100 is disposed at an incline, for example, toward the outside or inside of the width direction of the container 44 with respect to the first transport section 50, is not excluded. When the side wall 100 is perpendicular to the first transport section 50, a structure in which the side wall 100 does not protrude in the width direction or enter the formation region of the fin 90 in a plan view of the container 44 can be realized, compared to a structure in which the side wall 100 is disposed at an incline.

[0073] The second transport section of the disclosed technology is not limited to the side wall 100. For example, the heat receiving section 46 and the condensing section 72 may be connected using one or more tubes having a cross-sectional area sufficient for transporting the gas phase refrigerant RF. That is, even in a structure using such a tube, the tube can be prevented from protruding outward in the width direction from the portion corresponding to the heat receiving section 46 in a plan view of the container 44. When using multiple tubes, if the tubes are arranged in the height direction of the container 44, a narrow space can be used for arranging the tubes.

[0074] The cooling component 40 has a heat dissipation section 48. By dissipating heat by the heat dissipation section 48, the gas-phase refrigerant RF can be condensed and liquefied inside the container 44.

[0075] The heat dissipation section 48 has a plurality of fins 90. The plurality of fins 90 are plate-shaped and parallel to one another. The fins 90 increase the area over which the cooling device 42 dissipates heat to the outside, and therefore heat dissipation from the container 44 can be promoted compared to a structure without the fins 90. By promoting heat dissipation from the container 44, the gas-phase refrigerant RF can be efficiently condensed and liquefied, and the cooling performance of the cooling device 42 is improved.

[0076] The side wall 100 is parallel to the multiple fins 90. Therefore, the side wall 100 does not get in the way when setting the position of the fins 90. The wind from the fan also flows to both sides in the thickness direction of the side wall 100, so that heat can be dissipated from the side wall 100 to the heat sink liquid.

[0077] Both of the two side walls 100 are located at the end of the arrangement direction of the multiple fins 90 in the portion corresponding to the heat receiving portion 46. As a result, when an external force acts on the fins 90 in the portion corresponding to the heat receiving portion 46 from the outside in the width direction (arrow W direction) of the container 44, the side walls 100 receive the external force. By receiving the external force through the side walls 100, the external force does not act on the fins 90, so that deformation of the fins 90 can be suppressed. Moreover, both of the two side walls 100 are thicker than the multiple fins 90. Therefore, the side walls 100 themselves are not easily deformed by an external force acting from the outside in the width direction of the container 44.

[0078] 13A and 13B, a support pillar 106 is provided inside the side wall 100. The support pillar 106 can suppress the first side plate 102A and the second side plate 102B from approaching each other, and can maintain the volume of the second transport space 104. In other words, the cross-sectional area for the flow of the gas-phase refrigerant RF can be maintained.

[0079] In particular, since multiple support columns 106 are provided in one second transport space 104, it is easier to maintain the volume of the second transport space 104 compared to a structure with only one support column 106. The multiple support columns 106 are arranged at intervals in the depth direction. Therefore, the distance between the first side plate 102A and the second side plate 102B can be maintained without excessively narrowing the volume of the second transport space 104 compared to a structure in which the multiple support columns 106 are closely arranged with no intervals.

[0080] A diffusion space 68 is provided inside the container 44. In the diffusion space 68, the gas-phase refrigerant RF generated in the evaporation portion 62 can be diffused around the evaporation portion 62.

[0081] Inside the container 44, a second support 56 is provided between the top plate 54 and the bottom plate 52 at the position of the diffusion space 68. Since the second support 56 can maintain the gap between the top plate 54 and the bottom plate 52, a volume for diffusing the gas-phase refrigerant RF around the evaporation section 62 can be secured inside the container 44 as the diffusion space 68. In particular, the inside of the container 44 is maintained at a lower pressure than the atmospheric pressure to promote the evaporation of the liquid-phase refrigerant RF. In this case, a force in the approaching direction acts on the top plate 54 and the bottom plate 52 due to the pressure difference between the pressure inside the container 44 (vapor pressure of the gas-phase refrigerant RF) and the atmospheric pressure. Even when such a force acts, the approach between the top plate 54 and the bottom plate 52 can be suppressed. In other words, the volume of the diffusion space 68 can be maintained by maintaining the gap between the top plate 54 and the bottom plate 52.

[0082] In particular, a plurality of second support columns 56 are provided on both sides in the width direction of the evaporation section 62. Therefore, compared to a structure in which only one second support column 56 is provided on each side in the width direction of the evaporation section 62, it is easier to ensure the volume of the diffusion space 68. The plurality of second support columns 56 are arranged at intervals in the depth direction, and communication paths 108 are formed between the second support columns 56. Through the communication paths 108, the gas-phase refrigerant RF generated in the evaporation section 62 moves smoothly to the second transport space 104.

[0083] In addition, the second support pillar 56 may be attached to the top plate 54 and have a structure in which its lower end contacts the bottom plate 52, or it may be separate from both the top plate 54 and the bottom plate 52 and have a structure in which its upper end contacts the top plate 54 and its lower end contacts the bottom plate 52.

[0084] Inside the container 44, the refrigerant RF in a liquid phase enters the inside of the transport pipe 78 from the other end portion 78B of the transport pipe 78, as shown by an arrow F2 in Fig. 8. Furthermore, this refrigerant RF is transported by capillary action to the one end portion 78A, i.e., toward the evaporation section 62, as shown by an arrow F3 in Figs. 5 and 6.

[0085] In the evaporation section 62, the liquid-phase refrigerant RF is evaporated again in the groove section 66. In this manner, inside the container 44, the refrigerant RF is circulated between the evaporation section 62 and the condensation section 72 while repeatedly undergoing phase transition between the liquid phase and the gas phase, so that the heat received by the heat receiving section 46 can be transferred to the heat dissipation section 48. This allows the element 36, which is the object to be cooled, to be cooled.

[0086] As shown in FIG. 7, in this embodiment, the groove width W1 of the groove 66 of the evaporation section 62 is smaller than the inner diameter N1 of the transportation pipe 78.

[0087] 10 shows the relationship between the inner diameter N1 of the transport pipe 78 and the rising height of the liquid column rising inside the transport pipe 78 due to surface tension (capillary phenomenon) when the liquid temperature is 25° C. This graph shows an example of water used as the refrigerant RF in this embodiment.

[0088] As can be seen from this graph, the smaller the inner diameter N1 of the transport pipe 78, the higher the rising height of the liquid column. In other words, the smaller the inner diameter N1, the greater the surface tension that can cause the refrigerant RF to rise.

[0089] In the transport pipe 78, the liquid phase refrigerant RF is transported to the evaporation section 62 as shown by the arrow F3 in Figures 5 and 6. However, at one end portion 78A of the transport pipe 78, due to the surface tension of the liquid phase refrigerant RF inside, a refrigerant RF suction force T1 in a direction away from the evaporation section 62 may act as shown in Figure 7. In contrast, in the evaporation section 62, due to the surface tension of the liquid phase refrigerant RF in the groove section 66, a refrigerant RF suction force T2 that draws the refrigerant RF into the evaporation section 62 may act. The refrigerant RF suction force T1 and the refrigerant RF suction force T2 are forces in opposite directions, but since the refrigerant RF suction force T2 is larger, the refrigerant RF flows from the transport pipe 78 toward the evaporation section 62 as shown by the arrow F4.

[0090] Here, for example, as shown in Fig. 6, a case will be considered in which the cooling device 42 is used at an incline such that the one end portion 78A is higher than the other end portion 78B. As an example, a case will be assumed in which the one end portion 78A is higher than the other end portion 78B by about 25 mm. In this case, it will be understood that if the inner diameter N1 of the transport pipe 78 is set to 0.6 mm or less, the refrigerant RF can be transported inside the transport pipe 78 from the other end portion 78B to the one end portion 78A by surface tension.

[0091] In this way, from the viewpoint of increasing the surface tension acting on the refrigerant RF inside the transport pipe 78, it is sufficient to make the inner diameter N1 of the transport pipe 78 smaller. However, if the inner diameter N1 of the transport pipe 78 is made smaller, the flow path cross-sectional area of ​​the refrigerant RF also becomes smaller, and the amount of refrigerant RF that can be transported per unit time also decreases. Therefore, from the viewpoint of ensuring the transport amount of refrigerant RF per unit time, the lower limit value of the inner diameter N1 of the transport pipe 78 is determined.

[0092] 7, in this embodiment, the groove width W1 of the groove portion 66 is narrower than the inner diameter N1 of the transport pipe 78. From the relationship shown in Fig. 10, the surface tension acting on the liquid phase refrigerant RF in the evaporation section 62 is greater than the surface tension acting on the liquid phase refrigerant RF in the transport pipe 78. Therefore, due to the difference between the refrigerant RF suction force T2 and the refrigerant RF suction force T1, a force that moves from the transport pipe 78 to the evaporation section 62 is applied, and the refrigerant RF can be moved from the transport pipe 78 to the evaporation section 62.

[0093] Here, consider a structure in which one end portion 78A of the transport pipe 78 is formed flat without any gap. In a transport pipe having a flat end portion 78A, if the opening portion of the transport pipe faces the pillar member 64 and is in contact with the entire circumference, this opening portion may be covered by the pillar member 64. By increasing the inner diameter N1 of the transport pipe, it is possible to secure a range of the opening portion of the transport pipe that is not covered by the pillar member 64, but there is an upper limit to the inner diameter N1 in order to reliably apply the above-mentioned surface tension to the refrigerant RF.

[0094] In contrast, in this embodiment, an inclined portion 82A is provided at one end portion 78A of the transport pipe 78 as an example of a gap portion. Even if the tip portion of the one end portion 78A is in contact with the evaporation portion 62, a gap 84A that does not contact the evaporation portion 62 is generated between the transport pipe 78 and the evaporation portion 62. That is, the opening portion at the one end portion 78A of the transport pipe 78 is not completely blocked by the column member 64. Therefore, as shown by the arrow F5 in FIG. 7, the liquid phase refrigerant RF transported by the transport pipe 78 flows into the groove portion 66 of the evaporation portion 62 through the gap 84A. That is, a structure that makes it easy for the liquid phase refrigerant RF to move from the transport pipe 78 to the evaporation portion 62 is realized.

[0095] As described above, in a structure in which the groove width W1 of the groove portion 66 is narrower than the inner diameter N1 of the transport pipe 78, the pillar member 64 becomes relatively thick and covers a wide range of the opening portion of the transport pipe 78. However, even in such a structure, in this embodiment, a gap 84A is generated between the transport pipe 78 and the evaporation section 62, so that the liquid phase refrigerant RF can be reliably moved from the transport pipe 78 to the evaporation section 62.

[0096] In the first embodiment, the gap is an inclined portion 82A provided in one end portion 78A of the transportation pipe 78. When the gap is provided in the transportation pipe 78 in this manner, no other member is required to generate the gap 84A, and the structure of the cooling device 42 can be simplified.

[0097] In the above example, the gap portion is the inclined portion 82 A. That is, the gap 84 A can be generated by a simple structure in which one end portion 78 A of the transportation pipe 78 is inclined with respect to the longitudinal direction of the transportation pipe 78.

[0098] 9, the inclined portion 82A has a pair of inclined surfaces 82T. The inclined surfaces 82T are surfaces that approach each other as they move away from the evaporation portion 62. By forming the inclined portion 82A with such inclined surfaces 82T, it is possible to realize a structure in which the gap 84A is generated without excessively increasing the cutting depth of the inclined portion 82A (the length of the portion cut from the evaporation portion 62 side).

[0099] Note that one end portion 78A of the transportation pipe 78 may be provided with an inclined portion inclined in one direction, similar to the second inclined portion 82B of the other end portion 78B.

[0100] Moreover, the inclined portions 82A, which are an example of a gap portion, are provided at a plurality of locations (two locations in this embodiment) in the circumferential direction of one transport pipe 78. By providing a plurality of gap portions, a plurality of gaps 84A are generated, and therefore, compared to a structure in which a gap portion is provided at only one location in one transport pipe 78, a larger cross-sectional area can be ensured for the portion through which the refrigerant RF flows from the transport pipe 78 to the evaporation section 62.

[0101] The other end portion 78B of the transport pipe 78 is provided with a second inclined portion 82B as an example of a second gap portion, and a second gap 84B is generated between the other end portion 78B and the side wall 44S of the container 44. That is, the opening portion of the other end portion 78B of the transport pipe 78 is not blocked by the side wall 44S. Therefore, a structure is realized in which the liquid phase refrigerant RF in the container 44 can easily flow into the inside of the transport pipe 78 through the second gap 84B.

[0102] A plurality of transport pipes 78, which are an example of a liquid transport section, are provided. As described above, in terms of increasing the surface tension acting on the liquid-phase refrigerant RF flowing through the transport pipes 78, there is an upper limit to the inner diameter N1 of the transport pipes 78, so it is difficult to ensure a sufficient flow rate with only one transport pipe 78. In contrast, by providing a plurality of transport pipes 78, the transport pipes 78 can ensure a larger flow rate as a whole.

[0103] The multiple transport pipes 78 are arranged so that a flow path for the liquid-phase refrigerant RF is also formed between two adjacent transport pipes 78 and the bottom plate 52. Not only the inside of the transport pipes 78 but also the outside of the transport pipes 78 is used as a region through which the liquid-phase refrigerant RF flows, so that a larger flow rate of the refrigerant RF can be ensured compared to a structure in which such a flow path is not formed.

[0104] The transport pipe 78 is fixed to the container 44 by the protrusion 86. The transport pipe 78 is not fixed to the container by so-called brazing or bonding, and no wax or adhesive is required. Furthermore, the wax or adhesive does not melt due to temperature changes (high temperatures) that accompany the use of the cooling device 42, and therefore there is no effect on the phase transition of the refrigerant RF inside the container 44.

[0105] In addition, since the multiple transport pipes 78 are fixed in contact with the bottom plate 52 by the convex portion 86, a sufficient flow path cross-sectional area can be secured between the top plate 54 and the transport pipes 78 for the refrigerant RF in the gas phase to move substantially.

[0106] The top plate 54 is provided with protrusions 76. The gas-phase refrigerant RF that flows while in contact with the top plate 54 is condensed and liquefied by dissipating heat to the outside of the container 44 through the top plate 54. At this time, as shown in FIG. 12, the protrusions 76 increase the substantial contact area of ​​the refrigerant RF in contact with the top plate 54 compared to a structure without the protrusions 76. This makes it easier for the gas-phase refrigerant RF to be liquefied as droplets RD, and the liquefaction of the refrigerant RF can be promoted. The liquefied refrigerant RF is efficiently dripped along the protrusions 76, so that a thin liquid film can be maintained in the portions of the top plate 54 where the protrusions 76 are not formed. By maintaining a thin liquid film, heat is efficiently transferred from the gas-phase refrigerant RF to the top plate 54, and a structure that maintains a high condensation and liquefaction capacity of the refrigerant RF can be realized.

[0107] The container 44 has an insertion hole 88. By inserting a fastener into this insertion hole 88, a structure in which the cooling device 42 is fixed to the substrate 34 and further to the element 36 to be cooled can be easily realized.

[0108] Container 44 has an injection hole 92. This injection hole 92 allows refrigerant RF to be easily injected into the interior of container 44 through an injection pipe 96. Then, by inserting a plug 94 into injection pipe 96, injection hole 92 is sealed with plug 94, thereby achieving a structure in which refrigerant RF is hermetically sealed inside container 44.

[0109] Next, a second embodiment will be described. In the second embodiment, the same elements, members, etc. as those in the first embodiment are denoted by the same reference numerals, and detailed description will be omitted. In addition, the overall structure of the cooling device 202 of the second embodiment is similar to that of the cooling device 42 of the first embodiment, and therefore will not be illustrated.

[0110] As shown in Fig. 21, a cooling device 202 of the second embodiment has, as an example of a gap portion, a mesh member 204 separate from the transport pipe 78 and the evaporation section 62. The mesh member 204 is disposed between the transport pipe 78 and the evaporation section 62, with one surface in contact with the transport pipe 78 and the other surface in contact with the evaporation section 62. Note that in the cooling device 42 of the second embodiment, the inclined portion 82A (see Fig. 9) of the first embodiment is not formed in one end portion 78A of the transport pipe 78, and the one end portion 78A is perpendicular to the longitudinal direction of the transport pipe 78.

[0111] The mesh member 204 is a member that allows fluid to move in the thickness direction (direction of arrow T), and this mesh member 204 creates a gap 84A between the transport pipe 78 and the evaporation section 62. Therefore, one end portion 78A of the transport pipe 78 is not blocked by the evaporation section 62, and a flow path of the refrigerant RF from this one end portion 78A to the evaporation section 62 is secured. That is, also in the cooling device 202 of the second embodiment, a structure that makes it easy for the liquid phase refrigerant RF to move from the transport pipe 78 to the evaporation section 62 is realized.

[0112] In the second embodiment, the mesh member 204, which is an example of a gap portion, is separate from the transport pipe 78 and the evaporation section 62. Therefore, it does not affect the shapes of the transport pipe 78 or the evaporation section 62. For example, it is not necessary to process the one end portion 78A of the transport pipe 78, and the structure can be simplified.

[0113] The mesh member 204 is disposed between the transport pipe 78 and the evaporation section 62 and is in contact with both of them. This maintains the relative positions of the transport pipe 78 and the evaporation section 62, and therefore the state in which the gap 84A is generated can also be maintained.

[0114] Next, a third embodiment will be described. In the third embodiment, the same elements, members, etc. as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. In addition, the overall structure of the cooling device 302 of the third embodiment is similar to that of the cooling device 42 of the first embodiment, and therefore illustration thereof will be omitted.

[0115] As shown in Fig. 22 and Fig. 23, in a cooling device 302 of the third embodiment, a recess 304 is provided in the bottom plate 52. The recess 304 has a shape capable of accommodating the lower portions of the transport pipes 78. A wall portion 306A is provided as a part of the bottom plate 52 between the recess 304 and the evaporation section 62. A second wall portion 306B is provided as a part of the bottom plate 52 between the recess 304 and the side wall 44S of the container 44. The wall portion 306A and the second wall portion 306B are essentially portions of the bottom plate 52 where the recess 304 is not provided.

[0116] The wall portion 306A faces the one end portion 78A of the transport pipe 78, but is set to a height H2 that is sufficient not to obstruct the substantial flow of the refrigerant RF in the inner circumferential portion of the transport pipe 78. The wall portion 306A creates a gap 84A between the one end portion 78A of the transport pipe 78 and the condenser portion 72. That is, in the third embodiment, the wall portion 306A is an example of a gap portion.

[0117] As described above, in the third embodiment, the wall portion 306A creates a gap 84A between the transport pipe 78 and the evaporation section 62. Therefore, the one end portion 78A of the transport pipe 78 is not blocked by the evaporation section 62, and a flow path of the refrigerant RF from the one end portion 78A to the evaporation section 62 is secured. That is, also in the cooling device 302 of the third embodiment, a structure that makes it easy for the liquid phase refrigerant RF to move from the transport pipe 78 to the evaporation section 62 is realized.

[0118] The second wall portion 306B faces the other end portion 78B of the transport pipe, but is set to a height H3 that does not substantially hinder the flow of the refrigerant RF in the inner circumferential portion of the transport pipe 78. The second wall portion 306B creates a second gap 84B between the other end portion 78B of the transport pipe 78 and the side wall 44S of the container 44. That is, in the third embodiment, the second wall portion 306B is an example of a second gap portion. Note that the height H2 of the wall portion 306A and the height H3 of the second wall portion 306B both correspond to the depth of the recess 304, and therefore the height H2 of the wall portion 306A and the height H3 of the second wall portion 306B are equal to each other.

[0119] In the third embodiment, a wall portion 306A, which is an example of a gap, is provided in the container 44. Since a gap is not provided in the transportation pipe 78, it is not necessary to process the one end portion 78A of the transportation pipe 78, and the structure can be simplified. In addition, since it is not necessary to provide a new member as the gap, the number of parts does not increase.

[0120] In the third embodiment, a recess 304 is provided in the container 44. As a portion facing the one end portion 78A of the transportation pipe 78, a structure having a gap can be realized with a simple structure.

[0121] Furthermore, since the transport pipe 78 is housed in the recess 304 of the bottom plate 52, a larger space can be secured between the transport pipe 78 and the top plate 54, that is, a larger area can be secured as a moving portion, compared to a structure without the recess 304.

[0122] The above describes the embodiments of the technology disclosed in the present application. However, the technology disclosed in the present application is not limited to the above, and it goes without saying that the technology disclosed in the present application can be implemented in various modified forms without departing from the spirit and scope of the present invention.

[0123] This specification further discloses the following supplementary notes regarding the above embodiments. (Appendix 1) A container in which a refrigerant is sealed; a heat receiving portion that receives heat from an object to be cooled and evaporates the refrigerant inside the container; a condensation section that is located inside the container and separate from the heat receiving section and that condenses the refrigerant in a gas phase; a liquid transport section connecting the condensation section and the heat receiving section, in which the refrigerant in a liquid phase is transported from the condensation section to the heat receiving section by capillary action; a first transport section including a first transport space inside the container, the first transport space connecting the heat receiving section and the condensing section, through which the refrigerant in a gas phase is transported from the heat receiving section to the condensing section; a second transport section provided in the container on both sides in a direction perpendicular to the direction of movement of the refrigerant in the first transport section, the second transport section including a second transport space connecting the heat receiving section and the condensing section, the second transport section having therein a gas phase refrigerant transported from the heat receiving section to the condensing section; A cooling component having a (Appendix 2) 2. The cooling component of claim 1, wherein the first transport section and the second transport section are both plate-shaped, and the second transport section is disposed perpendicular to the first transport section. (Appendix 3) 3. The cooling component according to claim 1, further comprising a heat dissipation section that dissipates heat from the container to the outside. (Appendix 4) 4. The cooling component according to claim 3, wherein the heat dissipation portion has a plurality of fins. (Appendix 5) 5. The cooling component according to claim 4, wherein the fins are plate-shaped and parallel to each other. (Appendix 6) 6. The cooling component of claim 5, comprising a side wall that is parallel to a plurality of the fins and forms the second transport section. (Appendix 7) 7. The cooling component of claim 6, wherein the sidewall is thicker than the fins. (Appendix 8) The cooling component according to claim 6 or 7, comprising a support pillar provided inside the side wall and maintaining the second transport space. (Appendix 9) 9. The cooling component of claim 8, wherein the plurality of pillars are spaced apart. (Appendix 10) The cooling component according to any one of claims 1 to 8, further comprising a second support provided inside the container and maintaining a diffusion space for diffusing the evaporated refrigerant. (Appendix 11) 11. The cooling component of claim 10, wherein the second pillars are spaced apart. (Appendix 12) 12. The cooling component according to any one of claims 1 to 11, further comprising an insertion hole provided in the container through which a screw for fixing the container to a heat generating component is inserted. (Appendix 13) A container in which a refrigerant is sealed; a heat receiving portion that receives heat from an object to be cooled and evaporates the refrigerant inside the container; a condensation section that is located inside the container and separate from the heat receiving section and that condenses the refrigerant in a gas phase; a liquid transport section connecting the condensation section and the heat receiving section, in which the refrigerant in a liquid phase is transported from the condensation section to the heat receiving section by capillary action; a first transport section including a first transport space inside the container, the first transport space connecting the heat receiving section and the condensing section, through which the refrigerant in a gas phase is transported from the heat receiving section to the condensing section; a second transport section provided in the container on both sides in a direction perpendicular to the direction of movement of the refrigerant in the first transport section, the second transport section including a second transport space connecting the heat receiving section and the condensing section, the second transport section having therein a gas phase refrigerant transported from the heat receiving section to the condensing section; A heat dissipation unit that dissipates heat from the container to the outside; A cooling device having (Appendix 14) 14. The cooling device according to claim 13, wherein a direction from the condensation section to the heat receiving section is a direction of air flow generated by a fan. [Explanation of symbols]

[0124] 32 Electronic equipment 34 Substrate 36 Element (example of cooling target) 38 elements 40 Cooling parts 42 Cooling device 44 Container 46 Heat receiving part 48 Heat radiation part 50 First Transportation Department 52 Bottom plate 54 Tabletop 56 Second pillar 60 Heat receiving plate 62 Evaporation section 64 Column members 66 Groove 68 Diffusion Space 72 Condenser 74 First transportation space 78 Transport pipe (an example of a liquid transport section) 88 Insertion hole 90 Fin 100 Side wall (an example of the second transport section) 104 Second transportation space 106 Post 108 Access Road 202 Cooling device 302 Cooling device

Claims

1. A container in which a refrigerant is sealed; a heat receiving portion that receives heat from an object to be cooled and evaporates the refrigerant inside the container; a condensation section that is located inside the container and separate from the heat receiving section and that condenses the refrigerant in a gas phase; a liquid transport section connecting the condensation section and the heat receiving section, in which the refrigerant in a liquid phase is transported from the condensation section to the heat receiving section by capillary action; a first transport section including a first transport space inside the container, the first transport space connecting the heat receiving section and the condensing section, through which the refrigerant in a gas phase is transported from the heat receiving section to the condensing section; a second transport section provided in the container on both sides in a direction perpendicular to the direction of movement of the refrigerant in the first transport section, the second transport section including a second transport space connecting the heat receiving section and the condensing section, the second transport section having therein a gas phase of the refrigerant being transported from the heat receiving section to the condensing section; A cooling component having a

2. The cooling component according to claim 1 , wherein the first transport section and the second transport section are both plate-shaped, and the second transport section is disposed perpendicular to the first transport section.

3. 3. The cooling component according to claim 1, further comprising a heat dissipation portion that dissipates heat from the container to the outside.

4. The cooling component according to claim 3 , wherein the heat dissipation portion comprises a plurality of fins.

5. The cooling component according to claim 4 , wherein the fins are plate-shaped and parallel to each other.

6. The cooling component of claim 5 , further comprising a sidewall that is parallel to a plurality of said fins and defines said second transport portion.

7. The cooling component of claim 6 , wherein the sidewalls are thicker than the fins.

8. The cooling component according to claim 6 or 7, further comprising a support provided inside the side wall and maintaining the second transport space.

9. A container in which a refrigerant is sealed; a heat receiving portion that receives heat from an object to be cooled and evaporates the refrigerant inside the container; a condensation section that is located inside the container and separate from the heat receiving section and that condenses the refrigerant in a gas phase; a liquid transport section connecting the condensation section and the heat receiving section, in which the refrigerant in a liquid phase is transported from the condensation section to the heat receiving section by capillary action; a first transport section including a first transport space inside the container, the first transport space connecting the heat receiving section and the condensing section, through which the refrigerant in a gas phase is transported from the heat receiving section to the condensing section; a second transport section provided in the container on both sides in a direction perpendicular to the direction of movement of the refrigerant in the first transport section, the second transport section including a second transport space connecting the heat receiving section and the condensing section, the second transport section having therein a gas phase of the refrigerant being transported from the heat receiving section to the condensing section; A heat dissipation unit that dissipates heat from the container to the outside; A cooling device having

Images