Light-emitting device and light-emitting module

Abstract

To provide a light-emitting device and a light-emitting module that can improve the bondability with a substrate.SOLUTION: A light-emitting device includes a light-emitting element, a covering member, a first metal film, and a second metal film. The light-emitting element includes a first surface, a second surface, a plurality of third surfaces, and a first conductive member and a second conductive member arranged side by side in a first direction and existing on the second surface. The covering member includes a first covering part that covers a region between the first conductive member and the second conductive member on the second surface, and a second covering part that covers the third surfaces. The covering member exposes at least a part of the first conductive member and at least a part of the second conductive member. The first metal film covers a part of the first covering part and is connected to the first conductive member. The second metal film covers a part of the first covering part apart from the first metal film, and is connected to the second conductive member.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The embodiments relate to a light emitting device and a light emitting module. [Background technology]

[0002] Patent Document 1 discloses a side-emitting light-emitting device. A side-emitting light-emitting device mainly emits light in a direction parallel to the mounting surface of the light-emitting device. There is a demand for further improving the bonding of side-emitting light-emitting devices to a substrate on which they are mounted. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2012-124191 A Summary of the Invention [Problem to be solved by the invention]

[0004] The embodiments have been made in consideration of the above-mentioned problems, and an object of the present invention is to provide a light emitting device and a light emitting module that can improve the bondability with a substrate. [Means for solving the problem]

[0005] The light emitting device according to the embodiment includes a light emitting element, a covering member, a first metal film, and a second metal film. The light emitting element has a first surface, a second surface located opposite to the first surface, a plurality of third surfaces located between the first surface and the second surface, and a first conductive member and a second conductive member located on the second surface in a first direction. The covering member has a first covering portion covering an area between the first conductive member and the second conductive member on the second surface, and a second covering portion covering the plurality of third surfaces. The covering member exposes at least a part of the first conductive member and at least a part of the second conductive member. The first metal film covers a part of the first covering portion and is connected to the first conductive member. The second metal film is separated from the first metal film, covers a part of the first covering portion, and is connected to the second conductive member. In a second direction from the second surface toward the first surface, the maximum length of the first covering portion is longer than the maximum length of the first conductive member. In the second direction, the maximum length of the first metal film is longer than the maximum length of the first conductive member.

[0006] The light emitting module according to the embodiment includes the light emitting device, a substrate, and a first connecting member. The substrate has a mounting surface, and a first terminal and a second terminal located on the mounting surface. The first connecting member is in contact with the first terminal and the first metal film. A proportion of an area of ​​the first metal film that covers the first conductive member and is in contact with the first connecting member is higher than a proportion of an area of ​​the first metal film that covers the second coating and is in contact with the first connecting member. Effect of the Invention

[0007] According to the embodiment, it is possible to realize a light emitting device and a light emitting module capable of improving the bondability with a substrate. [Brief description of the drawings]

[0008] [Figure 1] 1 is a front view showing a light emitting device according to a first embodiment. [Diagram 2] FIG. 2 is a rear view showing the light emitting device according to the first embodiment. [Diagram 3]1 is a side view showing a light emitting device according to a first embodiment. [Figure 4] 1 is a top view showing a light emitting device according to a first embodiment. [Diagram 5] 2 is a cross-sectional view taken along line VV shown in FIG. 1. [Figure 6] FIG. 6 is a partially enlarged cross-sectional view showing an area VI in FIG. 5. [Figure 7A] 2A to 2C are plan views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 7B] FIG. 7B is a cross-sectional view taken along line VIIB-VIIB shown in FIG. 7A. [Figure 8A] 2A to 2C are plan views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 8B] 8B is a cross-sectional view taken along line VIIIB-VIIIB shown in FIG. 8A. [Figure 9A] 2A to 2C are plan views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 9B] 9B is a cross-sectional view taken along line IXB-IXB shown in FIG. 9A. [Figure 10A] 2A to 2C are plan views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 10B] 10B is a cross-sectional view taken along line XB-XB shown in FIG. 10A. [Figure 11A] 2A to 2C are plan views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 11B] 11B is a cross-sectional view taken along line XIB-XIB shown in FIG. 11A. [Figure 12A] 2A to 2C are plan views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 12B] 12B is a cross-sectional view taken along line XIIB-XIIB shown in FIG. 12A. [Figure 13A] 2A to 2C are plan views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 13B] 13B is a cross-sectional view taken along line XIIIB-XIIIB shown in FIG. 13A. [Figure 14A] 2A to 2C are plan views illustrating a method for manufacturing the light emitting device according to the first embodiment. [Figure 14B]14B is a cross-sectional view taken along line XIVB-XIVB shown in FIG. 14A. [Figure 15] 2 is a rear view showing the light-emitting module according to the first embodiment. FIG. [Figure 16] 16 is a cross-sectional view taken along line XVI-XVI shown in FIG. 15. [Figure 17] 16 is a cross-sectional view taken along line XVII-XVII shown in FIG. 15. [Figure 18] FIG. 11 is a rear view showing the light emitting device according to the second embodiment. [Figure 19] 19 is a cross-sectional view taken along line IX-IX shown in FIG. 18. [Figure 20] FIG. 11 is a rear view showing the light emitting device according to the third embodiment. [Figure 21] FIG. 11 is a rear view showing the light emitting device according to the fourth embodiment. [Figure 22] FIG. 11 is a top view showing a light emitting device according to a fourth embodiment. [Diagram 23] FIG. 11 is a cross-sectional view showing a light emitting device according to a fifth embodiment. [Figure 24] FIG. 13 is a front view showing a light emitting device according to a sixth embodiment. [Diagram 25] FIG. 13 is a rear view showing the light emitting device according to the sixth embodiment. [Figure 26] 26 is a cross-sectional view taken along line XXVI-XXVI shown in FIG. 25. [Figure 27] 26 is a cross-sectional view taken along line XXVII-XXVII shown in FIG. 25. [Figure 28] 26 is a cross-sectional view taken along line XXVIII-XXVIII shown in FIG. 25. [Figure 29] FIG. 13 is a perspective view showing a light emitting device according to a sixth embodiment. [Figure 30A] 13A to 13C are rear views illustrating the method for manufacturing the light emitting device according to the sixth embodiment. [Figure 30B] 30B is a cross-sectional view taken along line XXXB-XXXB shown in FIG. 30A. [Figure 30C] 30B is a cross-sectional view taken along line XXXC-XXXC shown in FIG. 30A. [Figure 30D]30B is a cross-sectional view taken along line XXXD-XXXD shown in FIG. 30A. [Figure 31A] 13A to 13C are rear views illustrating the method for manufacturing the light emitting device according to the sixth embodiment. [Figure 31B] 31B is a cross-sectional view taken along line XXXIB-XXXIB shown in FIG. 31A. [Figure 31C] 31B is a cross-sectional view taken along line XXXIC-XXXIC shown in FIG. 31A. [Figure 31D] 31B is a cross-sectional view taken along line XXXID-XXXID shown in FIG. 31A. [Figure 32A] 13A to 13C are rear views illustrating the method for manufacturing the light emitting device according to the sixth embodiment. [Figure 32B] 32B is a cross-sectional view taken along line XXXIIB-XXXIIB shown in FIG. 32A. [Figure 32C] 32B is a cross-sectional view taken along line XXXIIC-XXXIIC shown in FIG. 32A. [Fig. 32D] FIG. 32B is a cross-sectional view taken along line XXXIID-XXXIID shown in FIG. 32A. [Figure 33A] 13A to 13C are rear views illustrating the method for manufacturing the light emitting device according to the sixth embodiment. [Figure 33B] 33B is a cross-sectional view taken along line XXXIIIB-XXXIIIB shown in FIG. 33A. [Figure 33C] 33B is a cross-sectional view taken along line XXXIIIC-XXXIIIC shown in FIG. 33A. [Figure 33D] 33B is a cross-sectional view taken along line XXXIIID-XXXIIID shown in FIG. 33A. [Figure 34A] 13A to 13C are rear views illustrating the method for manufacturing the light emitting device according to the sixth embodiment. [Figure 34B] 34B is a cross-sectional view taken along line XXXIVB-XXXIVB shown in FIG. 34A. [Figure 34C] 34B is a cross-sectional view taken along line XXXIVC-XXXIVC shown in FIG. 34A. [Fig. 34D] 34B is a cross-sectional view taken along line XXXIVD-XXXIVD shown in FIG. 34A. [Figure 35A] 13A to 13C are rear views illustrating the method for manufacturing the light emitting device according to the sixth embodiment. [Figure 35B] 35B is a cross-sectional view taken along line XXXVB-XXXVB shown in FIG. 35A. [Figure 35C] 35B is a cross-sectional view taken along line XXXVC-XXXVC shown in FIG. 35A. [Figure 35D] 35B is a cross-sectional view taken along line XXXVD-XXXVD shown in FIG. 35A. [Figure 36A] 13A to 13C are rear views illustrating the method for manufacturing the light emitting device according to the sixth embodiment. [Figure 36B] 36B is a cross-sectional view taken along line XXXVIB-XXXVIB shown in FIG. 36A. [Figure 36C] 36B is a cross-sectional view taken along line XXXVIC-XXXVIC shown in FIG. 36A. [Figure 36D] 36B is a cross-sectional view taken along line XXXVID-XXXVID shown in FIG. 36A. [Figure 37A] 13A to 13C are rear views illustrating the method for manufacturing the light emitting device according to the sixth embodiment. [Figure 37B] FIG. 37B is a cross-sectional view taken along line XXXVIIB-XXXVIIB shown in FIG. 37A. [Figure 37C] 37B is a cross-sectional view taken along line XXXVIIC-XXXVIIC shown in FIG. 37A. [Figure 37D] 37B is a cross-sectional view taken along line XXXVIID-XXXVIID shown in FIG. 37A. [Figure 38] FIG. 13 is a front view showing a light emitting device according to a seventh embodiment. [Figure 39] FIG. 13 is a rear view showing the light emitting device according to the seventh embodiment. [Diagram 40] FIG. 13 is a side view showing a light emitting device according to a seventh embodiment. [Diagram 41] FIG. 13 is a cross-sectional view showing a light emitting device according to a seventh embodiment. [Diagram 42] FIG. 13 is a top view showing a light emitting device according to a seventh embodiment. [Diagram 43] FIG. 13 is a cross-sectional view showing a light emitting device according to a seventh embodiment. [Diagram 44] FIG. 44 is a partially enlarged cross-sectional view showing an area XLIV of FIG. [Diagram 45]FIG. 13 is a perspective view showing a light emitting device according to a seventh embodiment. [Figure 46] FIG. 13 is a top view showing a light-emitting module according to a seventh embodiment. [Figure 47] FIG. 13 is a cross-sectional view showing a light emitting device according to an eighth embodiment. [Figure 48] FIG. 13 is a front view showing a light emitting device according to a ninth embodiment. [Figure 49] FIG. 13 is a rear view showing the light emitting device according to the ninth embodiment. [Figure 50] FIG. 23 is a front view showing a light emitting device according to a tenth embodiment. [Figure 51] FIG. 23 is a front view showing a light emitting device according to an eleventh embodiment. [Figure 52] FIG. 23 is a rear view showing the light emitting device according to the eleventh embodiment. [Figure 53] FIG. 17 is a cross-sectional view showing a light-emitting device according to an eleventh embodiment. [Figure 54] FIG. 13 is a bottom view showing a top-emitting light-emitting device according to a reference example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] <First embodiment> A light emitting device 1 according to a first embodiment will be described with reference to Figs. 1 to 6. Each figure is schematic and may be appropriately emphasized and simplified. An end view showing only a cut surface may be shown as a cross-sectional view. Furthermore, even if the components are the same, the dimensional ratios between the figures do not necessarily match. The same applies to the other figures described later.

[0010] As shown in Figures 1 to 6, the light emitting device 1 according to this embodiment is a side-emitting type light emitting device. In some figures, a substrate 101 on which the light emitting device 1 is mounted is also shown to make the directions easier to understand. The detailed relationship between the light emitting device 1 and the substrate 101 will be described later. In some figures, the direction of light L emitted from the light emitting device 1 is indicated by an arrow.

[0011] In the following description, the light exit surface of the light emitting device 1 is referred to as the "front surface 1F", the surface opposite the front surface 1F is referred to as the "rear surface 1R", the surface facing the substrate 101 on which it is mounted is referred to as the "bottom surface 1L", the surface opposite the bottom surface 1L is referred to as the "top surface 1U", and the two surfaces surrounded by the front surface 1F, rear surface 1R, bottom surface 1L, and top surface 1U are referred to as the "side surface 1S". However, these expressions are for convenience only and are unrelated to the direction of gravity.

[0012] For ease of explanation, this specification employs an XYZ Cartesian coordinate system. The direction connecting the two side surfaces 1S of the light emitting device 1 is defined as the "first direction X", the direction from the rear surface 1R to the front surface 1F is defined as the "second direction Y", and the direction from the lower surface 1L to the upper surface 1U is defined as the "third direction Z". In addition, the first direction X and the opposite direction are respectively defined as the "+X direction" and the "-X direction" as necessary. The same applies to the second direction Y and the third direction Z.

[0013] The light emitting device 1 according to this embodiment includes a light emitting element 10, a covering member 20, a first metal film 31, and a second metal film 32. The light emitting device 1 may further include a light-transmitting member 40.

[0014] The light emitting element 10 has a first surface 10a, a second surface 10b located on the opposite side of the first surface 10a, and a plurality of third surfaces 10c located between the first surface 10a and the second surface 10b. In one example, the shape of the light emitting element 10 is a substantially rectangular parallelepiped shape, and has four third surfaces 10c. The light emitting element 10 also has a semiconductor laminate 15, a first conductive member 11, and a second conductive member 12. The semiconductor laminate 15 includes, for example, a substrate including sapphire or gallium nitride, an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer sandwiched between the n-type semiconductor layer and the p-type semiconductor layer. The substrate, the n-type semiconductor layer, the light emitting layer, and the p-type semiconductor layer are laminated along the second direction Y.

[0015] The structure of the light emitting layer may be a structure having a single active layer such as a double heterostructure or a single quantum well structure (SQW), or a structure having a group of active layers such as a multiple quantum well structure (MQW). The light emitting layer can emit visible light or ultraviolet light. The light emitting layer can emit visible light ranging from blue to red. Examples of semiconductor laminates including such a light emitting layer include In x Al y Ga 1-x-y N (0≦x, 0≦y, x+y≦1). The semiconductor laminate can include at least one light-emitting layer capable of emitting the above-mentioned light. For example, the semiconductor laminate may have a structure including one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or may have a structure in which a structure including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in order is repeated multiple times. When the semiconductor laminate includes multiple light-emitting layers, the semiconductor laminate may include light-emitting layers having different emission peak wavelengths, or may include light-emitting layers having the same emission peak wavelength. The emission peak wavelength may vary by, for example, about several nm. The combination of such light-emitting layers can be appropriately selected. For example, when the semiconductor laminate includes two light-emitting layers, the light-emitting layers can be selected from combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. The light-emitting layer may include multiple active layers having different emission peak wavelengths, or may include multiple active layers having the same emission peak wavelength. The light emitting element 10 is, for example, a light emitting diode (LED), and emits, for example, blue light.

[0016] The first conductive member 11 and the second conductive member 12 are located on the second surface 10b of the light emitting element 10 and are aligned in the first direction X. The first conductive member 11 is connected to a p-type semiconductor layer of the semiconductor laminate 15, and the second conductive member 12 is connected to an n-type semiconductor layer of the semiconductor laminate 15. In this specification, "connection" means electrical connection.

[0017] The first conductive member 11 includes both a p-side electrode connected to the p-type semiconductor layer and a p-side post connected to the p-side electrode. The light emitting element 10 may not include a p-side post. When the light emitting element 10 does not include a p-side post, the first conductive member 11 is composed of a p-side electrode. The second conductive member 12 includes both an n-side electrode connected to the n-type semiconductor layer and an n-side post connected to the n-side electrode. The light emitting element 10 may not include an n-side post. When the light emitting element 10 does not include an n-side post, the second conductive member 12 is composed of an n-side electrode. The p-side post and the n-side post contain, for example, copper (Cu) and / or nickel (Ni).

[0018] The covering member 20 has a first covering portion 21 and a second covering portion 22. The first covering portion 21 covers a region 13 between the first conductive member 11 and the second conductive member 12 on the second surface 10b of the light-emitting element 10. The second covering portion 22 covers a plurality of third surfaces 10c of the light-emitting element 10. The second covering portion 22 covers a portion of the second surface 10b of the light-emitting element 10. The covering member 20 exposes at least a portion of the first conductive member 11 and at least a portion of the second conductive member 12. In the second direction Y, it is preferable that the first covering portion 21 overlaps a portion of the first conductive member 11 and a portion of the second conductive member 12.

[0019] The covering member 20 may further have a third covering portion 23. The third covering portion 23 overlaps with the first covering portion 21 in the first direction X, and overlaps with the second covering portion 22 in the second direction Y. In the present embodiment, two third covering portions 23 are provided, and are disposed on both sides of the first covering portion 21 in the first direction X. In addition, the two third covering portions 23 are disposed on the -Y direction side of the second covering portion 22.

[0020] The covering member 20 is integrally formed of, for example, a white resin material. The recess 25, at least a part of which is defined by the first covering portion 21 and the third covering portion 23, is open at both ends of the covering member 20 in the third direction Z. That is, the recess 25 penetrates the covering member 20 along the third direction Z and reaches the upper surface 1U and the lower surface 1L. Two recesses 25 are formed and are arranged side by side along the first direction X. The first covering portion 21 is disposed between the two recesses 25. As shown in FIG. 5, a part of the recess 25 overlaps with the light emitting element 10 in the second direction Y, and another part of the recess 25 is separated from the light emitting element 10. Since the other part of the recess 25 is separated from the light emitting element 10 in the second direction Y, the length of the recess 25 in the first direction X can be increased.

[0021] The first metal film 31 covers a part of the first covered portion 21 of the covering member 20 and is connected to the first conductive member 11. For example, the first metal film 31 covers a side surface 21a of the first covered portion 21 and is in contact with the first conductive member 11. The second metal film 32 is separated from the first metal film 31, covers a part of the first covered portion 21 of the covering member 20, and is connected to the second conductive member 12. For example, the second metal film 32 covers a side surface 21b of the first covered portion 21 and is in contact with the second conductive member 12. The side surfaces 21a and 21b of the first covered portion 21 are located on both sides of the first covered portion 21 in the first direction X and generally extend along the YZ plane.

[0022] The first metal film 31 may cover a part of the back surface of the second covered portion 22 and at least a part of the side surface of the third covered portion 23. In this embodiment, the first metal film 31 covers at least a part of the side surface 23a of the third covered portion 23. The side surface 23a of the third covered portion 23 is a surface facing the side surface 21a of the first covered portion 21. Similarly, the second metal film 32 may cover a part of the back surface of the second covered portion 22 and at least a part of the side surface of the third covered portion 23. In this embodiment, the second metal film 32 covers at least a part of the side surface 23b of the third covered portion 23. The side surface 23b of the third covered portion 23 is a surface facing the side surface 21b of the first covered portion 21. In this embodiment, the first metal film 31 is disposed on the entire inner surface defining one recess 25, and the second metal film 32 is disposed on the entire inner surface defining the other recess 25.

[0023] In the first metal film 31, a portion 31a covering the first conductive member 11 protrudes in the -Y direction from the periphery of the portion 31a covering the first conductive member 11. The surface roughness of the portion 31a covering the first conductive member 11 is lower than the surface roughness of the portion 31b covering the second covering portion 22 in the first metal film 31. Similarly, in the second metal film 32, a portion 32a covering the second conductive member 12 protrudes in the -Y direction from the periphery of the portion 32a covering the second conductive member 12. The surface roughness of the portion 32a is lower than the surface roughness of the portion 32b covering the second covering portion 22 in the second metal film 32. The first metal film 31 and the second metal film 32 may be, for example, a three-layer film (Ni / Ru / Au) in which a nickel layer, a ruthenium layer, and a gold layer are laminated, or may be a two-layer film (Ni / Au) in which a nickel layer and a gold layer are laminated.

[0024] In this specification, the surface roughness refers to the arithmetic mean roughness Ra defined in JIS standard B0601:2013. The arithmetic mean roughness Ra can be measured using a laser microscope or a contact surface roughness measuring instrument. For example, the surface roughness can be measured by using a laser microscope VK-X1100 (lens magnification 5x) manufactured by Keyence.

[0025] 6, in the second direction Y, the maximum length L1 of the first covering portion 21 is longer than the maximum length L2 of the first conductive member 11. In addition, in the second direction Y, the maximum length L3 of the first metal film 31 is longer than the maximum length L2 of the first conductive member 11. That is, L1>L2 and L3>L2.

[0026] For example, in the second direction Y, the maximum length L1 of the first covering portion 21 is 2 to 50 times the maximum length L2 of the first conductive member 11. In addition, in the second direction Y, the maximum length L3 of the first metal film 31 is 0.7 to 1.2 times the maximum length L1 of the first covering portion 21.

[0027] 5 and 6, the first metal film 31 is disposed over the entire side surface 21a of the first covered portion 21, and is not disposed on the back surface 21c of the first covered portion 21. In this case, the maximum length L3 of the first metal film 31 is less than one time the maximum length L1 of the first covered portion 21. On the other hand, when the first metal film 31 is disposed on the back surface 21c of the first covered portion 21, the maximum length L3 of the first metal film 31 may be one time or more the maximum length L1 of the first covered portion 21.

[0028] Similarly, in the second direction Y, the maximum length of the first covering portion 21 is longer than the maximum length of the second conductive member 12. In the second direction Y, the maximum length of the second metal film 32 is longer than the maximum length of the second conductive member 12. For example, in the second direction Y, the maximum length of the first covering portion 21 is two to 50 times the maximum length of the second conductive member 12. Furthermore, in the second direction Y, the maximum length of the second metal film 32 is 0.7 to 1.2 times the maximum length of the first covering portion 21.

[0029] 6, the maximum thickness of the portion of the first conductive member 11 that is covered by the first covering portion 21, i.e., the maximum length L2 in the second direction Y, is greater than the maximum thickness of the portion of the first conductive member 11 that is not covered by the first covering portion 21, i.e., the maximum length L4 in the second direction Y. In other words, L2>L4. It is preferable that the maximum length L2 is 1.5 to 4 times the maximum length L4.

[0030] When the light emitting device 1 includes the light-transmitting member 40, the light-transmitting member 40 is located between the second covering portion 22 of the covering member 20 and the third surface 10c of the light emitting element 10. In the second direction Y, the third covering portion 23 overlaps with the light-transmitting member 40. In this embodiment, the light-transmitting member 40 has a wavelength conversion layer 41 and a light-transmitting layer 42. The wavelength conversion layer 41 includes a phosphor, for example, a phosphor that absorbs blue light emitted from the light emitting element 10 and emits red light, and a phosphor that absorbs blue light emitted from the light emitting element 10 and emits green light. The wavelength conversion layer 41 may include a phosphor that absorbs blue light and emits yellow light. The light-transmitting layer 42 does not substantially include a phosphor.

[0031] The phosphors used are yttrium-aluminum-garnet phosphors (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride phosphors, LSN phosphors (e.g., (La,Y)3Si6N 11:Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu), or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc., nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si 1-x Al x )F 6-x :Mn where x satisfies 0 < x < 1), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2), etc. can be used. As the phosphor added to the light-transmitting member 40, one type of phosphor may be used, or a plurality of types of phosphors may be used.

[0032] In the example shown in FIG. 5, the wavelength conversion layer 41 covers the first surface 10a and the third surface 10c of the light-emitting element 10 and does not cover the second surface 10b. The light-transmitting layer 42 is disposed on the +Y direction side in the second direction Y of the wavelength conversion layer 41 and is separated from the light-emitting element 10 through the wavelength conversion layer 41. The surfaces facing both sides in the first direction X of the light-transmitting member 40, the surfaces facing both sides in the third direction Z, and the surface facing the -Y direction side in the second direction Y are covered by the second covering portion 22 of the covering member 20. The surface facing the +Y direction side in the second direction Y of the light-transmitting member 40 is not covered by the covering member 20 and constitutes the main part of the front surface 1F of the light-emitting device 1.

[0033] As shown in FIG. 1, the light-transmitting layer 42 of the light-transmitting member 40 is exposed on the front surface 1F of the light-emitting device 1, and the light-transmitting layer 42 is surrounded by the second covering portion 22 of the covering member 20. As shown in FIG. 2, the first covering portion 21, the two third covering portions 23, the first metal film 31, and the second metal layer 32 of the covering member 20 are located on the rear surface 1R of the light-emitting device 1. Each of the two third covering portions 23 and two recesses 25 partially defined by the first covering portion 21 are located on the rear surface 1R side of the light-emitting device 1. The first metal film 31 and the second metal layer 32 are respectively disposed on the inner surfaces defining the two recesses 25. As shown in FIG. 3, the side surface 1S of the light-emitting device 1 is formed by the covering member 20. As shown in FIG. 4, the end faces of the covering member 20, the first metal film 31, and the second metal film 32 are exposed on the upper surface 1U of the light-emitting device 1. The same is true for the lower surface 1L of the light-emitting device 1.

[0034] Next, a method for manufacturing the light emitting device 1 according to this embodiment will be described with reference to FIGS. 7A to 14B.

[0035] First, as shown in FIG. 7A and FIG. 7B, an uncured light-transmitting member 40 is placed on a support substrate 201 via an adhesive layer 202. The light-transmitting member 40 includes a wavelength conversion layer 41 and a light-transmitting layer 42. The light-transmitting layer 42 is brought into contact with the adhesive layer 202. When the light-transmitting member 40 and / or the support substrate 201 have adhesive properties, the light-transmitting layer 42 and the support substrate 201 may be fixed by contacting each other. In the following description of the manufacturing method, the support substrate 201 side is referred to as "bottom" and the light-transmitting member 40 side is referred to as "top" following FIG. 7B and the like. Note that the adhesive layer 202 is omitted in FIG. 7A. The same applies to plan views described later.

[0036] Next, as shown in FIGS. 8A and 8B, the first surface 10a of the light-emitting element 10 is opposed to the light-transmitting layer 42, and the light-emitting element 10 is inserted into the uncured wavelength conversion layer 41. In this way, the light-emitting element 10 is arranged in the wavelength conversion layer 41. In FIG. 8A, a plurality of light-emitting elements are arranged in a matrix. The plurality of light-emitting elements may be arranged in a regular pattern, not limited to a matrix pattern. When the light-emitting element 10 is arranged in the wavelength conversion layer 41, the first conductive member 11 and the second conductive member 12 are exposed from the wavelength conversion layer 41. In addition, the wavelength conversion layer 41 is left between the light-transmitting layer 42 and the light-emitting element 10. After the light-emitting element 10 is inserted into the wavelength conversion layer 41, the uncured light-transmitting member 40 is cured.

[0037] 9A and 9B, the light-transmitting member 40 is partitioned into individual light-emitting elements 10. At this time, care is taken so that the light-emitting elements 10 are not exposed from the cut surfaces of the light-transmitting member 40.

[0038] 10A and 10B, a resin material is placed on the support substrate 201, molded, solidified, and ground to form the covering member 20. For example, a white resin material is used as the resin material.

[0039] Next, as shown in FIG. 11A and FIG. 11B, a part of the upper surface of the covering member 20 is removed to form a recess 25 extending in one direction. The recess 25 formed on the upper surface of the covering member 20 is formed from one outer edge of the covering member 20 to the other outer edge of the covering member 20 located on the opposite side of the one outer edge of the covering member 20. Methods for forming the recess 25 on the upper surface of the covering member 20 include half dicing using a laser or a blade, etching, and the like. When forming the recess 25 on the upper surface of the covering member 20 by half dicing, one recess 25 may be formed by scanning the laser or the blade once, or one recess 25 may be formed by scanning multiple times. In addition, when forming the recess 25 on the upper surface of the covering member 20 by half dicing using a blade, an arbitrary shape of the recess can be obtained by adjusting the shape of the blade tip. For example, by adjusting the shape of the blade tip, the angle between the bottom surface defining the recess and the side surface defining the recess can be made a right angle, or the corners of the recess can be rounded. Furthermore, when one recess 25 is formed by scanning multiple times, any desired recess shape can be obtained by adjusting the scanning length.

[0040] Two recesses 25 are formed for each light emitting element 10. At this time, at least a part of the first conductive member 11 is exposed on the bottom surface defining one recess 25 facing each light emitting element 10, and at least a part of the second conductive member 12 is exposed on the bottom surface defining the other recess 25. In addition, since the first conductive member 11 and the second conductive member 12 are less likely to be ground than the covering member 20, the first conductive member 11 and the second conductive member 12 can be slightly protruded from the covering member 20 in the -Y direction on the bottom surface defining the recess 25. In addition, when a resin material is used for the covering member 20, the surface roughness of the first conductive member 11 and the second conductive member 12 can be made lower than the surface roughness of the covering member 20 on the bottom surface defining the recess 25, since the resin material is more brittle than the metal material.

[0041] Next, as shown in FIG. 12A and FIG. 12B, a metal material is formed on the entire upper surface of the covering member 20. For example, nickel, ruthenium, and gold may be sputtered in this order, or nickel and gold may be sputtered in this order. As a result, the metal film 30 is disposed on the covering member 20. The metal film 30 is also disposed on the inner surface defining the recess 25. At this time, reflecting that the first conductive member 11 and the second conductive member 12 protrude from the covering member 20 in the -Y direction, the portion of the metal film 30 covering the first conductive member 11 and the second conductive member 12 can be protruded in the -Y direction relative to the surroundings. Also, reflecting that the surface roughness of the first conductive member 11 and the second conductive member 12 is lower than the surface roughness of the covering member 20, the surface roughness of the portion of the metal film 30 covering the first conductive member 11 and the second conductive member 12 can be made lower than the surface roughness of the portion of the metal film 30 covering the covering member 20.

[0042] 13A and 13B, the metal film 30 is selectively removed by laser ablation, so that the metal film 30 remains only on the inner surfaces that define the recesses 25. As a result, the remaining portions of the metal film 30 become the first metal film 31 and the second metal film 32.

[0043] 14A and 14B, the covering member 20 is diced along dicing lines D to separate the light emitting elements 10. At this time, care is taken to prevent the light-transmitting member 40 and the light emitting elements 10 from being exposed from the cut surface of the covering member 20. Next, the adhesive layer 202 is dissolved to remove the support substrate 201. In this manner, the light emitting device 1 according to this embodiment is manufactured.

[0044] Next, a light emitting module 100 according to this embodiment will be described with reference to Figs. 15 to 17. The light emitting module 100 according to this embodiment includes a light emitting device 1, a substrate 101, a first connecting member 106, and a second connecting member 107. The configuration of the light emitting device 1 is as described above. The substrate 101 has a mounting surface 101a. The light emitting device 1 is disposed on the mounting surface 101a of the substrate 101.

[0045] The substrate 101 has a wiring substrate 110, a first terminal 111, and a second terminal 112. The wiring substrate 110 is a substrate having wiring provided on the surface and / or inside of an insulator. The first terminal 111 and the second terminal 112 are located on the mounting surface 101a of the substrate 101. The first terminal 111 and the second terminal 112 are each connected to the wiring of the wiring substrate 110. The first connection member 106 is in contact with the first terminal 111 of the substrate 101 and the first metal film 31 of the light emitting device 1. The second connection member 107 is in contact with the second terminal 112 of the substrate 101 and the second metal film 32 of the light emitting device 1. The first connection member 106 and the second connection member 107 are, for example, solder.

[0046] The first metal film 31 of the light emitting device 1 is connected to a first terminal 111 via a first connecting member 106. Similarly, the second metal film 32 is connected to a second terminal 112 via a second connecting member 107. As a result, the light emitting device 1 is mechanically fixed to the substrate 101, and the light emitting element 10 of the light emitting device 1 is connected to the wiring of the wiring substrate 110.

[0047] As described above, the surface roughness of the portion 31a of the first metal film 31 that covers the first conductive member 11 is lower than the surface roughness of the portion 31b of the first metal film 31 that covers the second coating portion 22. Therefore, the first connection member 106 has better wettability to the portion 31a that covers the first conductive member 11 than to the portion 31b that covers the second coating portion 22. As a result, the first connection member 106 is more likely to spread in the portion 31a that covers the first conductive member 11 than in the portion 31b that covers the second coating portion 22.

[0048] 15, the ratio of the area of ​​the first metal film 31 in the portion 31a covering the first conductive member 11 that contacts the first connection member 106 is higher than the ratio of the area of ​​the first metal film 31 in the portion 31b covering the second covering portion 22 that contacts the first connection member 106. The length L5 of the first connection member 106 in the fourth direction perpendicular to the mounting surface 101a of the substrate 101 is maximum in the portion 31a of the first metal film 31 that covers the first conductive member 11. In this embodiment, the fourth direction is approximately equal to the third direction Z.

[0049] Similarly, the proportion of the area of ​​portion 32a of second metal film 32 covering second conductive member 12 that is in contact with second connection member 107 is higher than the proportion of the area of ​​portion 32b of second metal film 32 covering second covering portion 22 that is in contact with second connection member 107. The length of second connection member 107 in a fourth direction perpendicular to mounting surface 101a is maximum at portion 32a of second metal film 32 covering second conductive member 12.

[0050] The first connection member 106 is in contact with the first terminal 111. In a top view, the first connection member 106 is located in the entire area of ​​the recess 25. For example, in a top view of the cross-sectional view shown in FIG. 16 seen from the Z direction, the first connection member 106 is located in the entire area of ​​the recess 25. Also, as shown in FIG. 15 and FIG. 17, the first connection member 106 creeps up in the third direction Z along the first metal film 31. At this time, the first connection member 106 is more likely to creep up along the portion 31a covering the first conductive member 11 than the portion 31b covering the second covering portion 22. For example, the first connection member 106 covers substantially the entire portion 31a of the first metal film 31 covering the first conductive member 11. Therefore, when viewed from the second direction Y, the outer edge of the first connection member 106 may have a shape that reflects the outer edge of the first conductive member 11. The same applies to the second connection member 107.

[0051] Next, the effects of this embodiment will be described. In the following explanation of the effects, the first metal film 31, the first connecting member 106 and their surrounding parts will be mainly described, but the same applies to the second metal film 32, the second connecting member 107 and their surrounding parts.

[0052] In the light emitting device 1 according to this embodiment, it is preferable that the covering member 20 has the first covering portion 21 and the second covering portion 22, and the first metal film 31 covers a part of the first covering portion 21. This makes it easier to increase the area of ​​the first metal film 31, and therefore makes it easier to increase the contact area between the first metal film 31 and the first connecting member 106. As a result, the bonding strength between the first metal film 31 and the first connecting member 106 is improved, and the bonding between the light emitting device 1 and the substrate 101 is improved.

[0053] Furthermore, in the second direction Y, it is preferable that the maximum length L1 of the first covering portion 21 is longer than the maximum length L2 of the first conductive member 11, and the maximum length L3 of the first metal film 31 is longer than the maximum length L2 of the first conductive member 11. This allows the first metal film 31 to be disposed on the side surface 21a of the first covering portion 21, making it easier to increase the area of ​​the first metal film 31. As a result, it is easier to increase the contact area between the first metal film 31 and the first connecting member 106, improving the bond between the light emitting device 1 and the substrate 101.

[0054] In the second direction Y, it is preferable that the maximum length L1 of the first covering portion 21 is at least twice the maximum length L2 of the first conductive member 11. This makes it easier to increase the area of ​​the first metal film 31 disposed on the side surface 21a of the first covering portion 21. It is also preferable that the maximum length L1 of the first covering portion 21 is no more than 50 times the maximum length L2 of the first conductive member 11. This makes it easier to miniaturize the light emitting device 1 in the second direction Y.

[0055] Furthermore, in this embodiment, it is preferable that the maximum length L3 of the first metal film 31 in the second direction Y is 0.7 times or more the maximum length L1 of the first covered portion 21. This makes it easier to increase the area of ​​the first metal film 31. It is also preferable that the maximum length L3 of the first metal film 31 in the second direction Y is 1.2 times or less the maximum length L1 of the first covered portion 21. This makes it easier to miniaturize the light emitting device 1 in the second direction Y.

[0056] Furthermore, it is preferable that the first covering portion 21 overlaps with a part of the first conductive member 11 and a part of the second conductive member 12 in the second direction Y. This makes it easier to make the distance between the first metal film 31 and the second metal film 32 in the first direction X longer than the distance between the first conductive member 11 and the second conductive member 12 in the first direction X. This makes it easier to reduce short-circuiting between the first metal film 31 and the second metal film 32.

[0057] Furthermore, in this embodiment, it is preferable that the covering member 20 has the third covering portion 23, and the translucent member 40 overlaps with the third covering portion 23 in the second direction Y. This makes it easier to improve the mechanical strength of the covering member 20. It is also preferable that the first metal film 31 covers the side surface 23a of the third covering portion 23. This makes it easier to increase the area of ​​the first metal film 31. In addition, since a part of the recess 25 is defined by the first covering portion 21 and the third covering portion 23, when the first connecting member 106 is joined to the first metal film 31, the range in which the first connecting member 106 spreads is easily kept within the recess 25. As a result, it is possible to reduce the short circuit between the first connecting member 106 and the second connecting member 107.

[0058] Furthermore, it is preferable that the maximum length L2 of the portion of the first conductive member 11 covered by the first covering portion 21 is 1.5 times or more the maximum length L4 of the portion of the first conductive member 11 not covered by the first covering portion 21. This makes it easier to increase the contact area between the first conductive member 11 and the first metal film 31, and therefore makes it easier to improve the bonding strength between the first conductive member 11 and the first metal film 31. It is also preferable that the maximum length L2 of the portion of the first conductive member 11 covered by the first covering portion 21 is 4 times or less the maximum length L4 of the portion of the first conductive member 11 not covered by the first covering portion 21. This makes it easier to miniaturize the light emitting device 1 in the second direction Y.

[0059] Furthermore, it is preferable that the recesses 25 are open at both ends of the covering member 20 in the third direction Z. This makes it easier to form the recesses 25, and makes it easier to reduce variation in the shape of the light emitting device 1 compared to a case in which the recesses 25 are open only at one end of the covering member 20. This makes it easier to improve the yield of the light emitting device 1.

[0060] Furthermore, it is preferable that the surface roughness of the portion 31a of the first metal film 31 that covers the first conductive member 11 is lower than the surface roughness of the portion 31b that covers the second covering portion 22. This makes it easier for the first connection member 106 to wet and spread over the first metal film 31 of the portion 31a that covers the first conductive member 11. This makes it easier to efficiently dissipate heat generated from the light emitting element 10 to the first connection member 106 and the first terminal 111 via the first metal film 31 of the portion 31a that covers the first conductive member 11.

[0061] Of the first metal film 31, a part of the portion 31b covering the second covering portion 22 is preferably located on the +Z direction side of the portion 31a covering the first conductive member 11. As described above, the first connection member 106 spreads relatively easily on the portion 31a and does not spread easily on the portion 31b, so by arranging the portion 31b on the +Z direction side of the portion 31a, the first connection member 106 that spreads on the portion 31a is likely to be prevented from spreading further by the portion 31b. This makes it easier to reduce the first connection member 106 from reaching the upper surface 1U of the light emitting device 1, and therefore makes it easier to miniaturize the light emitting module 100 in the second direction Y.

[0062] Furthermore, the portion 31a of the first metal film 31 that covers the first conductive member 11 protrudes in the -Y direction from the surroundings. This makes it easier to reduce the spread of the first connection member 106 beyond the portion 31a that covers the first conductive member 11. As a result, it is possible to reduce the first connection member 106 from reaching the upper surface 1U of the light emitting device 1, thereby making it possible to reduce the size of the light emitting module 100 in the second direction Y.

[0063] Furthermore, it is preferable that the light-transmitting member 40 has a wavelength conversion layer 41 containing a phosphor and a light-transmitting layer 42 not containing a phosphor, and the wavelength conversion layer 41 is isolated from the external environment by the light-transmitting layer 42. This makes it easier to reduce deterioration of the phosphor in the wavelength conversion layer 41 due to moisture absorption.

[0064] An adhesive resin may be disposed between the mounting surface 101a of the substrate 101 and the covering member 20. This allows the first metal film 31 and the first terminal 111 to be joined by the first connecting member 106, and the second metal film 32 and the second terminal 112 to be joined by the second connecting member 107, and also allows the covering member 20 and the wiring substrate 110 to be bonded by the adhesive resin. As a result, the bonding strength between the substrate 101 and the light emitting device 1 can be further improved. This also applies to other embodiments described later.

[0065] <Second embodiment> A light emitting device 2 of the second embodiment will be described with reference to Figs. 18 and 19. In the light emitting device 2 according to this embodiment, the recess 25 is open on the lower surface 2L of the light emitting device 2, but is not open on the upper surface 2U. In other words, the covering member 20 has two fourth covering portions 24 in addition to the first covering portion 21, the second covering portion 22, and the two third covering portions 23. The fourth covering portion 24 is located between the first covering portion 21 and the third covering portion 23, and constitutes a part of the upper surface 2U. In addition, the first metal film 31 and the second metal film 32 are also disposed on the lower surface of the fourth covering portion 24. Such a configuration can be realized by forming recesses intermittently so as not to span a plurality of light emitting elements in the process shown in Figs. 11A and 11B.

[0066] In the light emitting device 2, the fourth covering portion 24 functions as a visor that covers the upper end of the recess 25. This more reliably reduces the first connecting member 106 and the second connecting member 107 from creeping up to the upper surface 2U of the light emitting device 2. This makes it easier to miniaturize the light emitting module including the light emitting device 2 in the third direction Z. Other configurations, manufacturing methods, and effects of this embodiment are similar to those of the first embodiment.

[0067] <Third embodiment> A light emitting device 3 according to a third embodiment will be described with reference to FIG. 20. The light emitting device 3 according to this embodiment is different from the light emitting device 2 according to the second embodiment in that the width in the first direction X at the lower end 25a of the recess 25 is larger than the width in the first direction X at the portion other than the lower end of the recess 25. Such a configuration can be realized by separately forming the portion with the wider width at the lower end 25a of the recess 25 and the portion other than the lower end of the recess 25 in the process shown in FIG. 11A and FIG. 11B. Note that the recess 25 having the portion with the wider width at the lower end 25a of the recess 25 and the portion other than the lower end of the recess 25 may be formed by a single half dicing by adjusting the cutting edge of the blade.

[0068] According to this embodiment, the width of the bottom end 25a of the recess 25 is wide, so that the first connecting member 106 and the second connecting member 107 can be in contact with the first terminal 111 and the second terminal 112 over a larger area. This further improves the bonding strength between the light emitting device 3 and the substrate 101. Other configurations, manufacturing methods, and effects of this embodiment are similar to those of the second embodiment.

[0069] As shown in FIG. 20, the wide portion of the lower end 25a of the recess 25 may extend in the +X direction and the -X direction of the narrow portion other than the lower end of the recess 25, and the wide portion of the lower end 25a of the recess 25 may extend from one end of the narrow portion other than the lower end of the recess 25. When the wide portion of the lower end 25a of the recess 25 extends from one end of the narrow portion other than the lower end of the recess 25, it is preferable that the wide portion of the lower end 25a of the recess 25 located on the first conductive member 11 side extends in the -X direction away from the second conductive member 12. By doing so, it is easier to reduce short circuits in the light emitting device. Also, when the wide portion of the lower end 25a of the recess 25 extends from one end of the narrow portion other than the lower end of the recess 25, it is preferable that the wide portion of the lower end 25a of the recess 25 located on the second conductive member 12 side extends in the +X direction away from the first conductive member 11.

[0070] <Fourth embodiment> A light emitting device 4 of a fourth embodiment will be described with reference to Figs. 21 and 22. In comparison with the light emitting device 2 of the second embodiment, the light emitting device 4 of this embodiment has a recess 26 formed between the side surface of the third covering portion 23 facing the back side (-Y direction side) and the side surface facing the first direction X. The recess 26 is formed over the entire length of the covering member 20 in the third direction Z. Furthermore, the first metal film 31 and the second metal film 32 are arranged on the back surface 23c of the third covering portion 23 and on the inner surface defining the recess 26, in addition to being arranged on the inner surface defining the recess 25.

[0071] According to this embodiment, by providing the recess 26 and arranging the first metal film 31 and the second metal film 32 on the back surface 23c of the third covering portion 23 and on the inner surface defining the recess 26, it becomes easy to increase the area of ​​the first metal film 31 and the second metal film 32. This makes it easy to increase the contact area between the first metal film 31 and the first connecting member 106 and the contact area between the second metal film 32 and the second connecting member 107. As a result, the bonding strength between the light emitting device 4 and the substrate 101 becomes easier to improve. The configuration, manufacturing method, and effects of this embodiment other than those described above are the same as those of the second embodiment.

[0072] <Fifth embodiment> A light emitting device 5 of the fifth embodiment will be described with reference to Fig. 23. The light emitting device 5 according to this embodiment has two light emitting elements 10. The two light emitting elements 10 are arranged apart from each other along the first direction X. The peak wavelengths of the light emitted by the two light emitting elements 10 may be the same as each other or may be different. Only one light transmissive member 40 is provided, facing the two light emitting elements 10.

[0073] Furthermore, covering member 20 has two first covering portions 21. This defines three recesses 25 in covering member 20. A first metal film 31 is disposed on the inner surface defining recess 25 arranged closest to the -X direction side, and is connected to first conductive member 11 of light-emitting element 10 arranged on the -X direction side. A second metal film 32 is disposed on the inner surface defining recess 25 arranged closest to the +X direction side, and is connected to second conductive member 12 of light-emitting element 10 arranged on the +X direction side.

[0074] A third metal film 33 is disposed on the inner surface defining the recess 25 disposed at the center in the first direction X. The third metal film 33 is connected to the second conductive member 12 of the light emitting element 10 disposed on the -X direction side and the first conductive member 11 of the light emitting element 10 disposed on the +X direction side. The film configuration and film thickness of the third metal film 33 are substantially similar to those of the first metal film 31 and the second metal film 32. This allows the two light emitting elements 10 to be connected in series.

[0075] According to this embodiment, two light emitting elements 10 can be provided in one light emitting device 5. This improves the intensity of light emitted from the light emitting device 5. Other configurations, manufacturing methods, and effects of this embodiment are similar to those of the first embodiment.

[0076] Sixth embodiment A light emitting device 6 according to the sixth embodiment will be described with reference to Figures 24 to 29. In Figure 29, for ease of viewing, dot patterns are added to the first metal film 31G, the second metal film 32G, the first metal film 31B, and the second metal film 32B.

[0077] As shown in FIGS. 24 to 29, the light emitting device 6 according to this embodiment is different from the light emitting device 1 according to the first embodiment in that it has two light emitting elements 10G and 10B. The light emitting element 10G is, for example, an LED that emits blue light, and the light emitting element 10B is, for example, an LED that emits green light. The light emitting element 10G is located above the light emitting element 10B. However, the light emitting element 10G may be located below the light emitting element 10B. The light emitting element 10G has a semiconductor laminate 15G, a first conductive member 11G, and a second conductive member 12G. The light emitting element 10B has a semiconductor laminate 15B, a first conductive member 11B, and a second conductive member 12B.

[0078] The light emitting device 6 according to this embodiment has a light emitting element 10G that emits green light and a light emitting element 10B that emits blue light, and the light emitting element 10G and the light emitting element 10B can be controlled independently. This allows the color tone of the light emitted from the light emitting device 6 to be controlled.

[0079] In addition, the light emitting device 6 is different from the light emitting device 1 in the shape of the covering member 20. In the light emitting device 6, the first covering portion 21 and the third covering portion 23 of the covering member 20 are arranged only on the lower side of the light emitting device 6, i.e., on the light emitting element 10B side, and are not arranged on the upper side of the light emitting device 6, i.e., on the light emitting element 10G side. The second covering portion 22 is arranged on both the lower side and the upper side of the light emitting device 6. A recess 26 extending in the third direction Z is formed between the surface of the second covering portion 22 facing the -Y direction and the surfaces facing both sides of the first direction X. In addition, a recess 27 extending in the first direction X is formed on the back surface of the second covering portion 22, i.e., the surface facing the -Y direction.

[0080] The light emitting device 6 has a first metal film 31G in contact with the first conductive member 11G, a second metal film 32G in contact with the second conductive member 12G, a first metal film 31B in contact with the first conductive member 11B, and a second metal film 32B in contact with the second conductive member 12B. One light-transmitting member 40 is provided in common to the light emitting element 10G and the light emitting element 10B. The light-transmitting member 40 has a wavelength conversion layer 41 and a light-transmitting layer 42. The wavelength conversion layer 41 contains, for example, a base material made of a transparent resin material and a phosphor that emits red light.

[0081] The first metal film 31G and the second metal film 32G are disposed on a part of the back surface 22c of the second covered portion 22 and on the inner surface defining the recess 26. The first metal film 31B and the second metal film 32B are disposed on a part of the back surface 21c of the first covered portion 21, a part of the back surface 23c of the third covered portion 23, and on the inner surface defining the recess 25. No metal film is disposed on the inner surface defining the recess 27 and the inner surface defining the recess 29. In other words, the inner surface defining the recess 27 and the inner surface defining the recess 29 are exposed from the metal film. This allows the first metal film 31B and the first metal film 31G to be separated, and the second metal film 32B and the second metal film 32G to be separated. The recess 27 extends in the first direction X and is formed from one outer edge of the covering member 20 located on the lower side of the light emitting device 6 to the other outer edge of the covering member 20 located opposite to the one outer edge of the covering member 20. The recess 29 extends in the third direction Z and is formed from one outer edge of the covering member 20 located on the lower side of the light device 6 to the other outer edge of the covering member 20 located opposite to the one outer edge of the covering member 20. The depth of the recess 27 relative to the back surface 21c of the first covering portion 21 is deeper than the depth of the recess 29 relative to the back surface 21c of the first covering portion 21.

[0082] The light emitting device 6 may further include a light guiding member 50. The light guiding member 50 covers the entire first surface 10a and at least a part of the third surface 10c of the light emitting elements 10G and 10B (hereinafter also collectively referred to as "light emitting elements 10"). That is, a part of the light guiding member 50 is disposed between the light emitting element 10 and the light-transmitting member 40, and another part is disposed on the third surface 10c of the light emitting element 10.

[0083] A portion of the light-guiding member 50 disposed on the third surface 10c of the light-emitting element 10 becomes thicker as it approaches the light-transmissive member 40, and the side surface of this portion is inclined with respect to the YZ plane. This allows the light that is emitted from the side surface of the light-emitting element 10 and enters the light-guiding member 50 to be reflected by the side surface of the light-guiding member 50 and guided to the light-transmissive member 40.

[0084] The light guide member 50 is made of, for example, a transparent resin material. The resin material constituting the light guide member 50 may be the same type of resin material as the base material of the light-transmitting member 40. The light guide member 50 may also contain a light diffusing material. The refractive index of the light guide member 50 may be set to be greater than the refractive index of the light-transmitting member 40 and less than the refractive index of the light-emitting element 10. In this way, the refractive index is gradually decreased in the path of light from the light-emitting element 10 to the light-transmitting member 40 via the light guide member 50, thereby allowing the light to propagate efficiently.

[0085] Next, a method for manufacturing the light emitting device 6 according to this embodiment will be described with reference to Figures 30A to 37D. Note that the light guide member 50 is omitted from illustration in Figures 30A to 37D.

[0086] First, as shown in Figs. 30A to 30D, a structure 60 is prepared. The structure 60 includes light emitting elements 10G and 10B, a light-transmitting member 40, a light guide member 50, and a covering member 20. The structure 60 has a rectangular parallelepiped shape having a front surface 60F, a rear surface 60R, two side surfaces 60S, an upper surface 60U, and a lower surface 60L. In this specification, the term "rectangular parallelepiped shape" refers not only to a rectangular parallelepiped shape, but also to a shape that can be considered to be substantially a rectangular parallelepiped shape even if there are some distortions or irregular parts. In addition, the rectangular parallelepiped shape in this specification includes a rectangular parallelepiped with chamfered corners and ridges, and a rectangular parallelepiped with rounded corners and ridges.

[0087] The light emitting elements 10G and 10B, the light-transmitting member 40, and the light-guiding member 50 are disposed inside the covering member 20. The light emitting elements 10G and 10B are joined to one main surface of the light-transmitting member 40 via the light-guiding member 50. The other main surface of the light-transmitting member 40 is exposed from the covering member 20 at the front surface 60F of the structure 60. The surface of the structure 60 except for the portion where the light-transmitting member 40 is exposed from the covering member 20 is composed of the covering member 20.

[0088] 31A to 31D, a portion of covering member 20 located between upper surface 60U and rear surface 60R is removed. This forms recess 28 in covering member 20. Recess 28 has a rectangular parallelepiped shape with first direction X as a longitudinal direction. First conductive member 11G and second conductive member 12G are exposed from covering member 20 on the inner surface that defines recess 28.

[0089] 32A to 32D, a portion of the covering member 20 located between the rear surface 60R and the side surface 60S is removed, thereby forming two recesses 26. Each recess 26 has a rectangular parallelepiped shape with the third direction Z as the longitudinal direction, and reaches the upper surface 60U and the lower surface 60L.

[0090] 33A to 33D, a portion of covering member 20 located between rear surface 60R and lower surface 60L is removed. As a result, two recesses 25 are formed in covering member 20. Each recess 25 is shaped, for example, as a semicylindrical cylinder with its axial direction aligned in second direction Y. At the bottom surface defining recess 25, a portion of first conductive member 11B and a portion of second conductive member 12B are exposed from covering member 20.

[0091] Next, as shown in Figs. 34A to 34D, a metal material is deposited from the rear surface 60R side of the structure 60 to form a metal film 30. For example, a (Ni / Ru / Au) triple-layer film may be formed by sputtering nickel, ruthenium, and gold, or a (Ni / Au) double-layer film may be formed by sputtering nickel and gold. The metal film 30 is disposed on the surface of the covering member 20 facing the rear surface 60R side, on the inner surface defining the recess 25, on the inner surface defining the recess 26, and on the inner surface defining the recess 28. The metal film 30 contacts the first conductive members 11G and 11B and the second conductive members 12G and 12B.

[0092] 35A to 35D, a portion of the metal film 30 located at the center in the first direction X is removed by, for example, laser ablation. This separates the metal film 30 into a portion in contact with the first conductive members 11G and 11B and a portion in contact with the second conductive members 12G and 12B.

[0093] Next, as shown in FIGS. 36A to 36D, the metal film 30 and the covering member 20 are removed by half dicing or the like from the central portion in the third direction Z on the rear surface 60R of the structure 60. As a result, a recess 27 is formed in the covering member 20. The shape of the recess 27 is a rectangular parallelepiped with the first direction X as the longitudinal direction. The recess 27 reaches two side surfaces 60S. The metal film 30 is removed from the region where the recess 27 is formed.

[0094] Next, as shown in FIGS. 37A to 37D, in a region on the rear surface 60R of the structure 60 between the region below the recess 27 and the recess 26, the metal film 30 and the covering member 20 are removed by half dicing or the like. As a result, a recess 29 is formed in the covering member 20. The shape of the recess 29 is a rectangular parallelepiped with the third direction Z as the longitudinal direction. The metal film 30 is removed from the region where the recess 29 is formed. The upper end of the recess 29 reaches the recess 28, and the lower end of the recess 29 reaches the lower surface 60L.

[0095] 35A to 37D, the metal film 30 is separated into a first metal film 31G, a second metal film 32G, a first metal film 31B, and a second metal film 32B. The first metal film 31G is in contact with the first conductive member 11G of the light emitting element 10G. The second metal film 32G is in contact with the second conductive member 12G of the light emitting element 10G. The first metal film 31B is in contact with the first conductive member 11B of the light emitting element 10B. The second metal film 32B is in contact with the second conductive member 12B of the light emitting element 10B. In this manner, the light emitting device 6 is manufactured.

[0096] In the light emitting device 6 according to this embodiment, the first metal film 31G and the second metal film 32G are disposed on the inner surface defining the recess 25, on the rear surface of the first covering portion 21, and on the rear surface of the third covering portion 23. The first metal film 31B and the second metal film 32B are disposed on the inner surface defining the recess 26 and on the rear surface of the second covering portion 22. This makes it easier to increase the contact area between each metal film and each connecting member while ensuring insulation between the metal films. As a result, it makes it easier to improve the bonding strength between the light emitting device 6 and the substrate 101. The configuration, manufacturing method, and effects other than those described above in this embodiment are the same as those in the first embodiment.

[0097] <Seventh embodiment> A light emitting device 7 according to a seventh embodiment will be described with reference to FIGS. The light emitting device 7 of this embodiment differs from the light emitting device 1 of the first embodiment in that the second covering portion 22 of the covering member 20 is provided with a first outer surface 22d, a second outer surface 22e, a third outer surface 22f and a connecting surface 22g, the side surfaces 23a and 23b of the third covering portion 23 and the side surfaces 21a and 21b of the first covering portion 21 are inclined with respect to the YZ plane, a light guiding member 50 is provided on the third surface 10c of the light emitting element 10, a part of the second covering portion 22 covers a part of the second surface 10b of the light emitting element 10, and a groove 72 is provided in the part of the second covering portion 22 covering the second surface 10b, the first conductive member 11 and the second conductive member 12 of the light emitting element 10 are exposed on a part of the bottom surface 72a that defines the groove 72, and the first metal film 31 and the second metal film 32 are arranged over the entire bottom surface 72a that defines the groove 72.

[0098] In order to make the drawing easier to see, the first metal film 31 and the second metal film 32 are omitted in Fig. 45. Also, the first outer surface 22d, the third outer surface 22f, the connecting surface 22g, and the exposed portion 11a of the first conductive member 11 and the exposed portion 12a of the second conductive member 12, which will be described later, are shown with hatching.

[0099] First, the second covering portion 22 of the covering member 20 will be described. The second covering portion 22 has a first outer surface 22d overlapping with the third surface 10c of the light-emitting element 10 in the third direction Z, a second outer surface 22e located on the opposite side of the first outer surface 22d, a third outer surface 22f overlapping with the first conductive member 11 and the second conductive member 12 in the third direction Z, and a connecting surface 22g connecting the first outer surface 22d and the third outer surface 22f.

[0100] In this embodiment, the first outer surface 22d, the third outer surface 22f and the connecting surface 22g of the second covering portion 22 form the upper surface 7U of the light emitting device 7. The first outer surface 22d and the third outer surface 22f are, for example, substantially parallel to the XY plane, and the connecting surface 22g is inclined with respect to the XY plane and is, for example, substantially parallel to the XZ plane. In addition, the second outer surface 22e of the second covering portion 22 forms the lower surface 7L of the light emitting device 7.

[0101] A length L10 from the first outer surface 22d to the second outer surface 22e in the third direction Z is longer than a length L11 from the third outer surface 22f to the second outer surface 22e in the third direction Z. That is, L10>L11.

[0102] Moreover, the first metal film 31 and the second metal film 32 are located away from the first outer surface 22d. The first metal film 31 and the second metal film 32 may be in contact with the second outer surface 22e or may be located away from it. At least a part of the connecting surface 22g is exposed from the first metal film 31 and the second metal film 32. For example, the first outer surface 22d, the third outer surface 22f, and the connecting surface 22g are entirely exposed from the first metal film 31 and the second metal film 32.

[0103] In other words, the covering member 20 has a recess 71. The recess 71 is located at the end of the light emitting device 7 on the +Z direction side in the third direction Z, and is provided at the corner of the upper surface 7U and the rear surface 7R of the light emitting device 7. The recess 71 extends in the first direction X, penetrates the covering member 20 in the first direction X, and reaches the side surfaces 7S on both sides of the first direction X of the light emitting device 7. The recess 71 does not reach the front surface 7F of the light emitting device 7. The outer shape of the recess 71 in the rear view is, for example, rectangular. The light emitting element 10 and the translucent member 40 are not exposed on the connecting surface 22g and the third outer surface 22f that define the inner surface of the recess 71. In this embodiment, the first metal film 31 and the second metal film 32 are not arranged on the connecting surface 22g and the third outer surface 22f that define the inner surface of the recess 71. Therefore, the entire inner surface of the recess 71 is formed by the covering member 20.

[0104] Next, a side surface of the third covering portion 23 and a side surface of the first covering portion 21 will be described. In this embodiment, the side surface 23a of one third covering portion 23 is inclined with respect to the side surface 7S of the light emitting device 7, i.e., the YZ plane, so that the further away from the light-transmissive member 40 the side surface 23a is, the further away from the first covering portion 21. In other words, the side surface 23a of one third covering portion 23 is inclined with respect to the YZ plane, so that the further away from the first covering portion 21 the side surface 23a is, the further toward the -Y direction. The angle θ1 between the side surface 7S of the light emitting device 7 and the side surface 23a of the third covering portion 23 is, for example, not less than 5° and not more than 80°.

[0105] As a result, with respect to the length of the third covering portion 23 in the first direction X, the length L6 on the side closer to the light-emitting element 10 is longer than the length L7 on the side farther from the light-emitting element 10 in the second direction Y. That is, L6>L7. Note that the side of the third covering portion 23 farther from the light-emitting element 10 is, for example, the tip portion of the third covering portion 23, and the side of the third covering portion 23 closer to the light-emitting element 10 is, for example, the base portion of the third covering portion 23.

[0106] The boundary between the second covering portion 22 and the third covering portion 23 can be defined as an XZ plane including a boundary line 25d between a bottom surface 25b that defines the recess 25 and a side surface 25c that defines the recess 25. The bottom surface 25b that defines the recess 25 is formed by the second covering portion 22. The side surface 25c that defines the recess 25 is the side surface 23a and the side surface 23b of the third covering portion 23. The boundary line 25d is a bent portion on the inner surface that defines the recess 25. The side surface 23a of the third covering portion 23 may be a curved surface. When there is no clear bend between the second covering portion 22 and the third covering portion 23, the boundary line 25d may be defined as a portion where the curvature is maximum on the concave surface of the inner surface that defines the recess 25. In addition, the side surface 7S of the light emitting device 7, i.e., the outer surface opposite to the side surface 23a or the side surface 23b of the third covering portion 23, may be inclined with respect to the YZ plane.

[0107] Similarly, the side surface 23b of the other third covering portion 23 is inclined relative to the side surface 7S of the light emitting device 7 so as to move away from the first covering portion 21 the further away from the light-transmissive member 40. The angle formed between the side surface 7S of the light emitting device 7 and the side surface 23b of the third covering portion 23 is also θ1.

[0108] Furthermore, the side surface 21a of the first covering portion 21 is inclined with respect to the side surface 7S of the light emitting device 7 so that the further it is from the translucent member 40, the further it is from the opposing third covering portion 23. That is, the side surface 21a of the first covering portion 21 is inclined with respect to the YZ plane so that the further it is from the third covering portion 23 in the -Y direction. The angle θ2 between the side surface 7S of the light emitting device 7 and the side surface 21a of the first covering portion 21 is smaller than the angle θ1. That is, θ2<θ1. The angle θ2 is, for example, 0° or more and 60° or less. Therefore, the length L9 of the side surface 21a in the first direction X is smaller than the length L8 of the side surface 23a in the first direction X. That is, L9 <L8である。

[0109] Similarly, the side surface 21b of the first covering portion 21 is inclined with respect to the side surface 7S of the light emitting device 7 so that the farther the side surface 21b is from the opposing third covering portion 23, the further the side surface 21b is from the light-transmitting member 40. The angle formed between the side surface 7S of the light emitting device 7 and the side surface 21b of the first covering portion 21 is also θ2. In this manner, the side surfaces defining the recess 25 are inclined asymmetrically.

[0110] Next, the light guide member 50 will be described. The light guiding member 50 is disposed on the −Y direction side surface of the wavelength conversion layer 41, on the third surface 10c of the light emitting element 10. The light guiding member 50 may also be disposed between the light emitting element 10 and the wavelength conversion layer 41. Other configurations of the light guiding member 50 are as described in the sixth embodiment.

[0111] Next, the groove 72 and its surroundings will be described. In the light emitting device 7, a part of the second covering portion 22 covers a part of the second surface 10b of the light emitting element 10, and a groove 72 is provided in the part of the second covering portion 22 covering the second surface 10b. Two grooves 72 are provided in the covering member 20, and one groove 72 is located in the bottom surface 25b that defines each recess 25. The grooves 72 penetrate the second covering portion 22 in the third direction Z, and reach the lower surface 7L and the upper surface 7U of the light emitting device 7. The grooves 25 also reach the third outer surface 22f.

[0112] The first conductive member 11 and the second conductive member 12 of the light-emitting element 10 have exposed portions 11a and 12a, respectively, exposed from the second covering portion 22 in the groove 72. The exposed portion 11a is connected to the first metal film 31. The exposed portion 12a is connected to the second metal film 32. For example, the entire first conductive member 11 of the light-emitting element 10 is exposed to the bottom surface 72a defining one groove 72, and the entire second conductive member 12 of the light-emitting element 10 is exposed to the bottom surface 72a defining the other groove 72.

[0113] The first metal film 31 is disposed over the entire inner surface that defines one recess 25. Therefore, the first metal film 31 is disposed over the entire bottom surface 72a that defines one groove 72. Therefore, the portion of the first metal film 31 that is disposed on the bottom surface 72a that defines the groove 72 includes a portion that contacts the first conductive member 11 and a portion that contacts the second covering portion 22.

[0114] Similarly, the second metal film 32 is disposed over the entire inner surface that defines the other recess 25. Therefore, the second metal film 32 is disposed over the entire bottom surface 72a that defines the other groove 72. Therefore, the portion of the second metal film 32 that is disposed on the bottom surface 72a that defines the groove 72 includes a portion that contacts the second conductive member 12 and a portion that contacts the second covering portion 22.

[0115] Next, a method for manufacturing the light emitting device 7 will be described. For example, the covering member 20 is formed by a molding method using a mold, such as an injection molding method, a transfer molding method, or a compression molding method. The light emitting element 10, the light-transmitting member 40, and the light guide member 50 are arranged in the covering member 20. The covering member 20 is also provided with two recesses 25. The side surfaces 23a and 23b of the third covering portion 23 of the covering member 20 are inclined so as to move away from the first covering portion 21 toward the rear surface 7R, and the side surfaces 21a and 21b of the first covering portion 21 are inclined so as to move away from the opposing third covering portion 23 toward the rear surface 7R, so that the releasability between the solidified covering member 20 and the mold can be improved.

[0116] Next, the covering member 20 is ground with a blade to form a groove 72 on the bottom surface 25b that defines each recess 25. As a result, the first conductive member 11 and the second conductive member 12 of the light emitting element 10 are exposed on a part of the bottom surface 72a that defines the groove 72. Next, the first metal film 31 and the second metal film 32 are formed by a method similar to that of the first embodiment. Next, the covering member 20 is ground with a blade to form a depression 71. As a result, the third outer surface 22f and the connecting surface 22g are formed in the second covering portion 22 as the inner surface of the depression 71. The first metal film 31 and the second metal film 32 are removed from the third outer surface 22f and the connecting surface 22g. In this manner, the light emitting device 7 is manufactured.

[0117] Next, a light emitting module 170 according to a seventh embodiment will be described with reference to FIG. The light emitting module 170 includes a substrate 101, a first connecting member 106, a second connecting member 107, and a light emitting device 7. In the light emitting device 7, the first metal film 31 and the second metal film 32 are not disposed on the inner surface of the recess 71, i.e., on the third outer surface 22f and the coupling surface 22g of the second covering portion 22. Therefore, even if the first connecting member 106 is disposed on the entire surface of the first metal film 31 and the second connecting member 107 is disposed on the entire surface of the second metal film 32, the first connecting member 106 and the second connecting member 107 do not enter the recess 71 whose inner surface is defined by the coupling surface 22g and the third outer surface 22. As a result, the first connecting member 106 and the second connecting member 107 are not disposed on the upper surface 7U of the light emitting device 7.

[0118] In addition, it is preferable that at least a part of the coupling surface 22g is exposed from the first metal film 31. This makes it easier to control the shape of the first connection member 106 that spreads over the first metal film 31 by the coupling surface 22g exposed from the first metal film 31. In addition, it is preferable that the part of the coupling surface 22g exposed from the first metal film 31 reaches the side surfaces 7S on both sides in the first direction X of the light emitting device 7. This makes it easier to reduce the first connection member 106 and the second connection member 107 being disposed on the upper surface 7U of the light emitting device 7.

[0119] The effects of this embodiment will be described. In the light emitting device 7 according to this embodiment, the second covering portion 22 is provided with a third outer surface 22f and a connecting surface 22g, and the first metal film 31 and the second metal film 32 are not disposed on the third outer surface 22f and the connecting surface 22g. This makes it possible to reduce the first connecting member 106 and the second connecting member 107 from reaching the upper surface 7U when mounting the light emitting device 7 on the substrate 101. As a result, it is possible to reduce the size of the light emitting device 7 in the first direction X and the third direction Z while reducing short circuits between the first connecting member 106 and the second connecting member 107.

[0120] Furthermore, in the light emitting device 7, the length L6 of the first portion 23e in the first direction X is longer than the length L7 of the second portion 23f in the first direction X. This increases the strength of the third covering portion 23 and increases the rigidity of the entire covering member 20. As a result, warping of the light emitting device 7 can be reduced.

[0121] Furthermore, in the light emitting device 7, the side surfaces 23a and 23b of the third covering portion 23 and the side surfaces 21a and 21b of the first covering portion 21 are inclined. This can improve the releasability between the covering member 20 and the mold.

[0122] Furthermore, in the light emitting device 7, the first conductive member 11 is exposed at a portion of the bottom surface 72a that defines the groove 72, and the first metal film 31 is disposed over the entire bottom surface 72a that defines the groove 72. As a result, the entire surface of the first conductive member 11 facing the -Y direction is in contact with the first metal film 31, and the electrical resistance between the first conductive member 11 and the first metal film 31 can be reduced. Similarly, the electrical resistance between the second conductive member 12 and the second metal film 32 can be reduced. The configuration, manufacturing method, and effects of this embodiment other than those described above are the same as those of the first embodiment.

[0123] <Eighth embodiment> A light emitting device 8 of an eighth embodiment will be described with reference to Fig. 47. The light emitting device 8 of this embodiment differs from the light emitting device 7 of the seventh embodiment in that the side surfaces 23a and 23b of the third covering portion 23 are stepped, the side surfaces 21a and 21b of the first covering portion 21 are not inclined with respect to the side surface 8S of the light emitting device 8, the groove 72 is not formed, and the light-transmitting member 40 is recessed with respect to the covering member 20 on the front surface 8F of the light emitting device 8 to form a recess 73.

[0124] According to this embodiment, the recess 73 is formed on the front surface 8F of the light emitting device 8, so that the light-transmitting member 40 is less likely to come into contact with external members and is less likely to be damaged. In addition, when the front surface 8F of the light emitting device 8 is joined to the light guide plate 210, an air layer is formed in the recess 73. This reduces color unevenness in the light emitted from the light emitting device 8. The configuration, manufacturing method, and effects of this embodiment other than those described above are the same as those of the first embodiment. Note that, in the other embodiments described above or below, the recess 73 may be provided on the front surface of the light emitting device, and the light-transmitting member 40 may be recessed with respect to the covering member 20.

[0125] <Ninth embodiment> A light emitting device 9 of the ninth embodiment will be described with reference to Figures 48 and 49. The light emitting device 9 of this embodiment differs from the light emitting device 6 of the sixth embodiment in that the length in the first direction X of the light emitting element 10G that emits green light is shorter than the length in the first direction X of the light emitting element 10B that emits blue light, and in that four recesses 25 are formed.

[0126] According to this embodiment, by making the length of the light emitting element 10G in the first direction X different from the length of the light emitting element 10B, the first conductive member 11G of the light emitting element 10G can be disposed at a position different from the first conductive member 11B of the light emitting element 10B, and the second conductive member 12G of the light emitting element 10G can be disposed at a position different from the second conductive member 12B of the light emitting element 10B, in the first direction X. This allows the first conductive members 11G and 11B and the second conductive members 12G and 12B to be disposed in mutually different recesses 25 in the first direction X. As a result, the first conductive members 11G and 11B and the second conductive members 12G and 12B can be connected to the substrate 101 independently of each other.

[0127] According to this embodiment, it is possible to simplify the shape of the covering member 20 as compared with the sixth embodiment. The configuration, manufacturing method, and effects of this embodiment other than those described above are similar to those of the sixth embodiment.

[0128] <Tenth embodiment> A light emitting device 90 according to a tenth embodiment will be described with reference to Fig. 50. The light emitting device 90 according to this embodiment differs from the light emitting device 6 according to the sixth embodiment in that two light emitting elements 10G that emit green light and two light emitting elements 10B that emit blue light are provided. The two light emitting elements 10G are arranged at a distance from each other in the first direction X, and the two light emitting elements 10B are also arranged at a distance from each other in the first direction X.

[0129] In this embodiment, the target value of the peak wavelength of the light emitted from the light emitting element 10B is λ B In this case, the peak wavelength of the two light-emitting elements 10B is a wavelength λ B The light emitting element 10B has a peak wavelength of λ B For example, it is preferable to select the light-emitting element 10B having a peak wavelength of (λ B +α) and (λ B -α).

[0130] Specifically, the target peak wavelength λ B is 450 nm, light-emitting element 10B having an actual measured peak wavelength of 449 nm may be combined with light-emitting element 10B having an actual measured peak wavelength of 451 nm, light-emitting element 10B having an actual measured peak wavelength of 448 nm may be combined with light-emitting element 10B having an actual measured peak wavelength of 452 nm, or light-emitting element 10B having an actual measured peak wavelength of 447 nm may be combined with light-emitting element 10B having an actual measured peak wavelength of 453 nm.

[0131] Similarly, the target value of the peak wavelength of the light emitted from the light emitting element 10G is λ G In this case, the peak wavelength of the two light-emitting elements 10G is a wavelength λ G A light-emitting element 10G having a peak wavelength of wavelength λ G For example, it is preferable to select the light emitting element 10G having a peak wavelength of (λ G +β) and (λ G -β).

[0132] Specifically, the target peak wavelength λ G is 540 nm, a light-emitting element 10G having an actual measured peak wavelength of 539 nm may be combined with a light-emitting element 10G having an actual measured peak wavelength of 541 nm, a light-emitting element 10G having an actual measured peak wavelength of 538 nm may be combined with a light-emitting element 10G having an actual measured peak wavelength of 542 nm, or a light-emitting element 10G having an actual measured peak wavelength of 537 nm may be combined with a light-emitting element 10G having an actual measured peak wavelength of 543 nm.

[0133] According to this embodiment, by combining two light emitting elements of the same type, it is possible to compensate for the variation in the peak wavelength of the light emitting elements. The configuration, manufacturing method, and effects of this embodiment other than those described above are the same as those of the sixth embodiment.

[0134] <Eleventh embodiment> A light emitting device 91 according to an eleventh embodiment will be described with reference to Figures 51 to 53. In the light emitting device 91 according to this embodiment, the lengths in the first direction X of the two light emitting elements 10B are different from each other, and the lengths in the first direction X of the two light emitting elements 10G are different from each other, as compared to the light emitting device 90 according to the tenth embodiment.

[0135] In the light emitting device 91, the positions in the first direction X of the first conductive member 11B and the second conductive member 12B of the two light emitting elements 10B and the positions in the first direction X of the first conductive member 11G and the second conductive member 12G of the two light emitting elements 10G are made different from each other. Six recesses 25 are provided in the covering member 20, and a metal film is disposed on the inner surface that defines each recess 25.

[0136] The first conductive member 11B of one light-emitting element 10B is connected to the first connecting member 106B via a first metal film 31B, the second connecting member 107B of one light-emitting element 10B and the first connecting member 106B of another light-emitting element 10B are connected to each other via a third metal film 33B, and the second connecting member 107B of the other light-emitting element 10B is connected to the second connecting member 107B via a second metal film 32B.

[0137] The first conductive member 11G of one light-emitting element 10G is connected to the first connection member 106G via the first metal film 31G, the second connection member 107G of one light-emitting element 10G and the first connection member 106G of another light-emitting element 10G are connected to each other via the third metal film 33G, and the second connection member 107G of the other light-emitting element 10G is connected to the second connection member 107G via the second metal film 32G. This allows currents to flow independently through the circuit in which two light-emitting elements 10B are connected in series and the circuit in which two light-emitting elements 10G are connected in series.

[0138] According to this embodiment, the shape of the covering member 20 can be simplified compared to the sixth embodiment. Other configurations, manufacturing methods, and effects of this embodiment are similar to those of the tenth embodiment.

[0139] <Reference example> Next, some reference examples will be described. For example, the covering member 20 may have the second covering portion 22 and the third covering portion 23, and may not have the first covering portion 21. Furthermore, the covering member 20 may have the second covering portion 22 and the fourth covering portion 24, and may not have the first covering portion 21 and the third covering portion 23. In this case, the fourth covering portion 24 has a shape like a canopy protruding from an upper portion of the back surface of the second covering portion 22 toward the back surface side. Furthermore, the first covering portion 21, the second covering portion 22, and the third covering portion 23 may be formed as separate bodies and then connected to each other to form the covering member 20.

[0140] Furthermore, in each of the above-described embodiments, the light emitting device is of a side emission type, but the light emitting device may be of a top emission type. FIG. 54 is a bottom view showing the top-emitting light emitting device according to this reference example.

[0141] 54, in the light emitting device 301 according to the present invention, two recesses 25 are formed in the lower surface 301L, and a first metal film 31 and a second metal film 32 are disposed on the inner surface defining each recess 25. The first metal film 31 is connected to the first conductive member 11, and the second metal film 32 is connected to the second conductive member 12. In the light emitting device 301, the light-transmitting member 40 is exposed on the upper surface thereof, and light is emitted upward through the light-transmitting member 40.

[0142] The above-described embodiments are examples of the present invention, and the present invention is not limited to these embodiments. For example, the present invention also includes the above-described embodiments in which some components or steps are added, deleted, or changed. In addition, the above-described embodiments can be implemented in combination with each other.

[0143] The present invention includes the following aspects.

[0144] (Appendix 1) a light emitting element having a first surface, a second surface located opposite to the first surface, a plurality of third surfaces located between the first surface and the second surface, and a first conductive member and a second conductive member arranged in a first direction and located on the second surface; a first covering portion covering an area between the first conductive member and the second conductive member on the second surface and a second covering portion covering the third surfaces, the covering member exposing at least a portion of the first conductive member and at least a portion of the second conductive member; a first metal film covering a portion of the first covering portion and connected to the first conductive member; a second metal film separated from the first metal film, covering a part of the first covering portion, and connected to the second conductive member; Equipped with A light emitting device, wherein in a second direction from the second surface to the first surface, the maximum length of the first covering portion is longer than the maximum length of the first conductive member, and the maximum length of the first metal film is longer than the maximum length of the first conductive member.

[0145] (Appendix 2) 2. The light emitting device according to claim 1, wherein in the second direction, the maximum length of the first covering portion is between 2 and 50 times the maximum length of the first conductive member.

[0146] (Appendix 3) 3. The light emitting device according to claim 1, wherein the maximum length of the first metal film in the second direction is 0.7 to 1.2 times the maximum length of the first covering portion.

[0147] (Appendix 4) 4. The light emitting device according to claim 1, wherein the first covering portion overlaps with a part of the first conductive member and a part of the second conductive member in the second direction.

[0148] (Appendix 5) the covering member further includes a third covering portion overlapping the first covering portion in the first direction and overlapping the second covering portion in the second direction, 5. The light emitting device according to claim 1, wherein the first metal film covers at least a portion of the third covering portion.

[0149] (Appendix 6) a light-transmitting member located between the second covering portion and the third surface of the light-emitting element, 6. The light emitting device according to claim 5, wherein the third covering portion overlaps with the translucent member in the second direction.

[0150] (Appendix 7) 7. The light emitting device according to claim 5, wherein the length of the third covering portion in the first direction is longer on a side closer to the light emitting element than on a side farther from the light emitting element in the second direction.

[0151] (Appendix 8) A light emitting device described in any one of Appendices 5 to 7, wherein the recess defined by the first covering portion and the third covering portion is open at both ends of the covering member in a third direction perpendicular to the first direction and the second direction.

[0152] (Appendix 9) 9. The light emitting device according to claim 1, wherein a portion of the first metal film that covers the first conductive member protrudes from the surrounding area.

[0153] (Appendix 10) 10. The light emitting device according to claim 1, wherein the surface roughness of the portion of the first metal film that covers the first conductive member is lower than the surface roughness of the portion that covers the second cover.

[0154] (Appendix 11) the second covering portion has a first outer surface overlapping with the third surface in a third direction perpendicular to the first direction and the second direction, and a second outer surface positioned opposite to the first outer surface, 11. The light emitting device according to claim 1, wherein the first metal film is located away from the first outer surface.

[0155] (Appendix 12) the second covering portion has a third outer surface overlapping the first conductive member in the third direction and a connecting surface connecting the first outer surface and the third outer surface, a length from the first outer surface to the second outer surface in the third direction is longer than a length from the third outer surface to the second outer surface in the third direction; 12. The light emitting device according to claim 11, wherein at least a portion of the coupling surface is exposed from the first metal film.

[0156] (Appendix 13) a portion of the second covering portion covers a portion of the second surface, A groove is provided in a portion of the second covering portion that covers a part of the second surface, the first conductive member has an exposed portion exposed from the second covering portion in the groove, 13. The light emitting device according to claim 1, wherein the exposed portion is connected to the first metal film.

[0157] (Appendix 14) A light emitting device according to any one of claims 1 to 13, a substrate having a mounting surface and a first terminal and a second terminal located on the mounting surface; a first connection member in contact with the first terminal and the first metal film; Equipped with A light-emitting module in which the proportion of the area of ​​the first metal film that covers the first conductive member and that contacts the first connecting member is higher than the proportion of the area of ​​the first metal film that covers the second covering portion and that contacts the first connecting member.

[0158] (Appendix 15) The light-emitting module according to claim 14, wherein the length of the first connection member in a fourth direction perpendicular to the mounting surface is maximum at a portion of the first metal film that covers the first conductive member. [Industrial Applicability]

[0159] The present invention can be used, for example, as a light source for a display device. [Explanation of symbols]

[0160] 1, 2, 3, 4, 5, 6, 7, 8, 9 Light-emitting device 1F front 1L bottom side 1R back 1S side 1U top 2L bottom 2U top 7F front 7R back 7S side 7U top 8F front 8S side 10, 10B, 10G Light-emitting element 10a 1st page 10b 2nd side 10c 3rd page 11, 11B, 11G First conductive member 11a Exposed part 12, 12B, 12G Second conductive member 12a Exposed part 13 areas 15, 15B, 15G Semiconductor laminate 20 Covering material 21 First covering part 21a, 21b side 21c back 22 Second coating section 22c back 22d 1st outer surface 22e 2nd outer surface 22f 3rd outer surface 22g connection surface 23 Third Covering Section 23a, 23b side 23c back 24 Fourth Covering Section 25 Recess 25a bottom end 25b Bottom 25c side 25d border 26, 27, 28, 29 Recesses 30 Metal Film 31, 31B, 31G 1st metal film 31a, 31b part 32, 32B, 32G Second metal film 32a, 32b part 33, 33B, 33G Third metal film 40 Translucent material 41 Wavelength conversion layer 42 Translucent layer 50 Light guide member 60 structure 60F front 60L bottom 60R back 60S Side 60U top 71 Depression 72 Groove 72a Bottom 73 Recess 90, 91 Light-emitting device 100 Light Emitting Module 101 Substrate 101a Mounting surface 106, 106B, 106G First connecting member 107, 107B, 107G Second connecting member 110 Wiring board 111 1st terminal 112 2nd terminal 170 Light Emitting Module 201 Support substrate 202 Adhesive layer 210 Light guide plate 301 Light emitting device 301L bottom surface D Dicing Line L light L1: Maximum length of the first covering portion 21 L2: Maximum length of the first conductive member 11 L3: Maximum length of the first metal film 31 L4: The maximum length of the portion of the first conductive member 11 that is not covered by the first covering portion 21 L5: The length of the first connection member 106 in the fourth direction perpendicular to the mounting surface 101a L6: Length of the first portion 23e in the first direction X L7: Length of the second portion 23f in the first direction X L8: Length of the side surface 23a in the first direction X L9: Length of the side surface 21a in the first direction X L10: Length from the first outer surface 22d to the second outer surface 22e in the third direction Z L11: The length from the third outer surface 22f to the second outer surface 22e in the third direction Z X 1st direction Y Second direction Z 3rd direction θ1: Angle between the side surface 7S of the light emitting device 7 and the side surface 23a of the third covering portion 23 θ2: Angle between the side surface 7S of the light emitting device 7 and the side surface 21a of the first covering portion 21

Claims

1. a light emitting element having a first surface, a second surface located opposite to the first surface, a plurality of third surfaces located between the first surface and the second surface, and a first conductive member and a second conductive member arranged in a first direction and located on the second surface; a covering member including a first covering portion covering an area between the first conductive member and the second conductive member on the second surface and a second covering portion covering the third surfaces, the covering member exposing at least a portion of the first conductive member and at least a portion of the second conductive member; a first metal film covering a portion of the first covering portion and connected to the first conductive member; a second metal film separated from the first metal film, covering a part of the first covering portion, and connected to the second conductive member; Equipped with A light emitting device, wherein in a second direction from the second surface to the first surface, the maximum length of the first covering portion is longer than the maximum length of the first conductive member, and the maximum length of the first metal film is longer than the maximum length of the first conductive member.

2. The light emitting device according to claim 1 , wherein the maximum length of the first covering portion in the second direction is between 2 and 50 times the maximum length of the first conductive member.

3. The light emitting device according to claim 1 , wherein the maximum length of the first metal film in the second direction is 0.7 to 1.2 times the maximum length of the first covering portion.

4. The light emitting device according to claim 1 , wherein the first covering portion overlaps with a part of the first conductive member and a part of the second conductive member in the second direction.

5. the covering member further includes a third covering portion overlapping the first covering portion in the first direction and overlapping the second covering portion in the second direction, The light emitting device according to claim 1 , wherein the first metal film covers at least a portion of the third covering portion.

6. a light-transmitting member located between the second covering portion and the third surface of the light-emitting element, The light emitting device according to claim 5 , wherein the third covering portion overlaps with the light-transmissive member in the second direction.

7. The light emitting device according to claim 5 , wherein a length of the third covering portion in the first direction is longer on a side closer to the light emitting element than on a side farther from the light emitting element in the second direction.

8. The light emitting device according to claim 5 , wherein the recess defined by the first covering portion and the third covering portion is open at both ends of the covering member in a third direction perpendicular to the first direction and the second direction.

9. The light emitting device according to claim 1 , wherein a portion of the first metal film that covers the first conductive member protrudes from the surrounding area.

10. The light emitting device according to claim 1 , wherein the surface roughness of the portion of the first metal film that covers the first conductive member is lower than the surface roughness of the portion that covers the second cover.

11. the second covering portion has a first outer surface overlapping with the third surface in a third direction perpendicular to the first direction and the second direction, and a second outer surface positioned opposite to the first outer surface, The light emitting device of claim 1 , wherein the first metal film is located away from the first outer surface.

12. the second covering portion has a third outer surface overlapping the first conductive member in the third direction and a connecting surface connecting the first outer surface and the third outer surface, a length from the first outer surface to the second outer surface in the third direction is longer than a length from the third outer surface to the second outer surface in the third direction; The light emitting device according to claim 11 , wherein at least a portion of the coupling surface is exposed from the first metal film.

13. a portion of the second covering portion covers a portion of the second surface; A groove is provided in a portion of the second covering portion that covers a part of the second surface, the first conductive member has an exposed portion exposed from the second covering portion in the groove, The light emitting device according to claim 1 , wherein the exposed portion is connected to the first metal film.

14. A light emitting device according to any one of claims 1 to 13, a substrate having a mounting surface and a first terminal and a second terminal located on the mounting surface; a first connection member in contact with the first terminal and the first metal film; Equipped with A light-emitting module in which the proportion of the area of ​​the first metal film that covers the first conductive member and that contacts the first connecting member is higher than the proportion of the area of ​​the first metal film that covers the second coating portion and that contacts the first connecting member.

15. The light emitting module according to claim 14 , wherein a length of the first connection member in a fourth direction perpendicular to the mounting surface is maximum at a portion of the first metal film that covers the first conductive member.

Images