Inverter unit and power conversion device

Abstract

To provide an inverter unit capable of suppressing a thermal influence exerted by air, of which the temperature is made relatively high by cooling a semiconductor module of an inverter unit, upon the other electric apparatus disposed above the inverter unit.SOLUTION: In an inverter unit 100, an outlet 22b of a cooling air channel 22 is disposed on a face 21a at the back side (the side of Y2) of a channel part 20 disposed at the back side (the side of Y2) of an inverter unit main body 10.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an inverter unit and a power conversion device. [Background technology]

[0002] 2. Description of the Related Art Conventionally, inverter units have been known that include a flow path portion that includes a cooling air flow path through which air for cooling a semiconductor module passes (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 describes an inverter unit equipped with an air tunnel through which air for cooling a semiconductor module passes. In the inverter unit described in the above-mentioned Patent Document 1, the air taken into the air tunnel absorbs heat from a heat dissipation member arranged inside the air tunnel so as to be in contact with the semiconductor module, becomes hot, and is discharged from the top of the air tunnel to the outside of the air tunnel. The inverter unit described in the above-mentioned Patent Document 1 is arranged at the top inside the housing of the inverter board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-157188 ​​A Summary of the Invention [Problem to be solved by the invention]

[0005] However, although not described in the above Patent Document 1, the inverter unit described in the above Patent Document 1 is generally arranged at a position other than the top in the housing of the power conversion device. In this case, the relatively high-temperature air that cools the semiconductor module of the inverter unit and is discharged from the upper part of the wind tunnel to the outside of the wind tunnel thermally affects other electrical devices arranged above the inverter unit in the housing of the power conversion device. For this reason, a configuration is desired that can suppress the thermal effect of the relatively high-temperature air that cools the semiconductor module of the inverter unit on other electrical devices arranged above the inverter unit.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide an inverter unit and a power conversion device that are capable of preventing the air, which has become relatively hot after cooling the semiconductor module of the inverter unit, from having a thermal effect on other electrical equipment arranged above the inverter unit. [Means for solving the problem]

[0007] In order to achieve the above object, an inverter unit according to a first aspect of the present invention comprises an inverter unit main body including a semiconductor module, and a flow path portion arranged on the rear side of the inverter unit main body, the flow path portion including a cooling air flow path extending in the vertical direction and through which air passes for cooling the semiconductor module, the flow path portion including a heat dissipation member arranged in the cooling air flow path so as to contact the semiconductor module, and a fan for passing air from one of the lower and upper sides to the other in the cooling air flow path, an outlet of the cooling air flow path being arranged on the surface on the rear side of the flow path portion, and at least a portion of the outlet of the cooling air flow path being arranged below the top surface of the inverter unit main body and above the bottom surface of the inverter unit main body.

[0008] In the inverter unit according to the first aspect of the present invention, as described above, the outlet of the cooling air flow path is arranged on the rear surface of the flow path part arranged on the rear side of the inverter unit body. This allows the air that has cooled the semiconductor module of the inverter unit and become relatively hot to be discharged to the rear side of the flow path part from the outlet of the cooling air flow path arranged on the rear surface of the flow path part. As a result, it is possible to prevent the air that has cooled the semiconductor module of the inverter unit and become relatively hot from having a thermal effect on other electrical devices arranged above the inverter unit.

[0009] In the inverter unit according to the first aspect, as described above, at least a part of the outlet of the cooling air flow passage is disposed below the upper surface of the inverter unit main body and above the bottom surface of the inverter unit main body. This makes it possible to prevent the upper end of the flow passage portion including the cooling air flow passage from protruding above the upper surface of the inverter unit main body and the lower end of the flow passage portion including the cooling air flow passage from protruding below the bottom surface of the inverter unit main body, compared to a case in which all of the outlets of the cooling air flow passage are disposed above the upper surface of the inverter unit main body or below the bottom surface of the inverter unit main body. This makes it possible to prevent the height of the inverter unit from increasing.

[0010] In the inverter unit according to the first aspect, the flow path portion preferably includes a guide member that guides the air in the cooling air flow path to the outlet of the cooling air flow path, and at least a part of the guide member is disposed below the upper surface of the inverter unit main body and above the bottom surface of the inverter unit main body. With this configuration, compared to a case where all of the guide members are disposed above the upper surface of the inverter unit main body or below the bottom surface of the inverter unit main body, it is possible to prevent the upper end of the flow path portion including the guide member from protruding above the upper surface of the inverter unit main body and the lower end of the flow path portion including the guide member from protruding below the bottom surface of the inverter unit main body. This makes it possible to prevent the height of the inverter unit from increasing even when the flow path portion includes the guide member.

[0011] In the above-mentioned configuration in which the flow passage portion includes the guide member, preferably, the heat dissipation member is arranged in the center of the cooling air flow passage in the vertical direction, the guide member is arranged so as to be inclined from the front side to the rear side of the flow passage portion as it goes from one of the lower and upper sides to the other, and the end of the guide member on the heat dissipation member side is arranged near the end of the guide member on the heat dissipation member side. With this configuration, since the guide member is arranged so as to be inclined from the front side to the rear side of the flow passage portion as it goes from one of the lower and upper sides to the other, the air in the cooling air flow passage can be efficiently guided to the outlet of the cooling air flow passage. Also, since the end of the guide member on the heat dissipation member side is arranged near the end of the heat dissipation member on the guide member side, the end of the guide member opposite to the heat dissipation member can be positioned on the side of the heat dissipation member arranged in the center of the cooling air flow passage in the vertical direction. This makes it possible to easily realize a configuration in which at least a portion of the guide member is positioned below the top surface of the inverter unit main body and above the bottom surface of the inverter unit main body, even if the guide member is positioned so as to incline from the front side to the back side of the flow path section as it moves from one side to the other at the bottom or top.

[0012] In the above-mentioned configuration in which the guide member is inclined so as to go from the front side to the rear side of the flow path portion as it goes from one side downward or one side upward to the other, the guide member is preferably composed of a single flat plate member that is inclined so as to go from the front side to the rear side of the flow path portion as it goes from one side downward or one side upward to the other. With this configuration, it is possible to easily manufacture a guide member that is inclined so as to go from the front side to the rear side of the flow path portion as it goes from one side downward or one side upward to the other, compared to when the guide member is composed of multiple members, when the guide member is composed of a member having a complex shape, etc.

[0013] In the configuration in which the flow passage portion includes the guide member, the fan, the heat dissipation member, and the guide member are preferably arranged in the cooling air flow passage in this order from one of the lower and upper sides to the other. With this configuration, the fan is arranged upstream of the heat dissipation member in the cooling air flow passage, so that the air passing through the fan can be kept at a relatively low temperature. This makes it possible to prevent the fan from being deteriorated due to exposure to relatively high-temperature air.

[0014] In addition, in order to achieve the above-mentioned object, a power conversion device according to a second aspect of the present invention comprises an inverter unit and a housing that accommodates the inverter unit, the inverter unit comprising an inverter unit main body including a semiconductor module, and a flow path portion arranged on the rear side of the inverter unit main body, the flow path portion including a cooling air flow path extending along the vertical direction and through which air passes for cooling the semiconductor module, the flow path portion including a heat dissipation member arranged in the cooling air flow path so as to contact the semiconductor module, and a fan for passing air from one of the lower and upper sides to the other in the cooling air flow path, an outlet of the cooling air flow path is arranged on the surface on the rear side of the flow path portion, and at least a portion of the outlet of the cooling air flow path is arranged below the top surface of the inverter unit main body and above the bottom surface of the inverter unit main body.

[0015] In the power conversion device according to the second aspect of the present invention, as described above, the outlet of the cooling air flow path is arranged on the rear surface of the flow path portion arranged on the rear surface of the inverter unit body, as in the inverter unit according to the first aspect. This makes it possible to prevent the air that has cooled the semiconductor module of the inverter unit and become relatively hot from exerting a thermal effect on other electrical devices arranged above the inverter unit, as in the inverter unit according to the first aspect.

[0016] In the power converter according to the second aspect, as described above, in the same manner as in the inverter unit according to the first aspect, at least a part of the outlet of the cooling air passage is disposed below the top surface of the inverter unit body and above the bottom surface of the inverter unit body, thereby making it possible to prevent the height of the inverter unit from becoming large, in the same manner as in the inverter unit according to the first aspect.

[0017] In the power conversion device according to the second aspect, preferably, a plurality of inverter units are provided in the housing so as to be aligned vertically. With this configuration, one inverter unit is disposed above another inverter unit, so that it is possible to effectively apply a configuration capable of suppressing the air, which has become relatively hot after cooling the semiconductor module, from exerting a thermal effect on other electric devices disposed above the inverter units.

[0018] In the power converter according to the second aspect, the housing preferably includes an air inlet arranged on the front side of the housing, a unit housing section in which the inverter unit is housed, and an exhaust flow path provided on the rear side of the unit housing section, and the air supplied to the cooling air flow path of the inverter unit is configured to be supplied into the housing through the air inlet, and the air discharged from the outlet of the cooling air flow path of the inverter unit is configured to be discharged to the outside of the housing through the exhaust flow path. With this configuration, the air discharged from the outlet of the cooling air flow path of the inverter unit to the rear side of the flow path section can be discharged to the outside of the housing through the exhaust flow path provided on the rear side of the unit housing section in which the inverter unit is housed. This makes it possible to reliably suppress the air that has cooled the semiconductor module of the inverter unit and become relatively hot from exerting a thermal effect on other electrical equipment arranged above the inverter unit. Effect of the Invention

[0019] According to the present invention, as described above, it is possible to provide an inverter unit and a power conversion device that can prevent the air that has become relatively hot after cooling the semiconductor module of the inverter unit from having a thermal effect on other electrical equipment arranged above the inverter unit. [Brief description of the drawings]

[0020] [Figure 1] 1 is a perspective view showing a power conversion device according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view taken along the YZ plane of a power conversion device according to one embodiment of the present invention. FIG. [Diagram 3] 1 is a perspective view showing an inverter unit according to an embodiment of the present invention; [Figure 4] 2 is a cross-sectional view taken along the YZ plane of an inverter unit according to an embodiment of the present invention. FIG. [Diagram 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0022] 1 to 5, the configurations of an inverter unit 100 and a power conversion device 150 according to one embodiment of the present invention will be described. The power conversion device 150 is a device for converting electric power in a plant or the like.

[0023] (Overall configuration of power conversion device) As shown in FIG. 1, the power conversion device 150 includes an inverter unit 100, an electric device 110 other than the inverter unit 100 (see FIG. 2), and a housing 120 that houses the inverter unit 100, the electric device 110 other than the inverter unit 100, etc.

[0024] In the following description, the left-right direction, front-back direction, and up-down direction of the housing 120 are respectively referred to as the X direction, Y direction, and Z direction. In addition, in the left-right direction (X direction) of the housing 120, the left side (left) and the right side (right) are respectively referred to as the X1 side and the X2 side. In addition, in the front-back direction (Y direction) of the housing 120, the front side and the back side are respectively referred to as the Y1 side and the Y2 side. In addition, in the up-down direction (Z direction) of the housing 120, the upper side (upper) and the lower side (lower) are respectively referred to as the Z1 side and the Z2 side.

[0025] A plurality of inverter units 100 are provided within the housing 120 so as to be lined up in the up-down direction (Z direction). A plurality of inverter units 100 are also provided within the housing 120 so as to be lined up in the left-right direction (X direction). Specifically, a plurality of sets of inverter units 100 (five in FIG. 1) lined up in the X direction are arranged in a plurality of rows (two rows in FIG. 1) so as to be lined up in the Z direction. Note that the number of inverter units 100 lined up in the X direction may be other than five, and the number of rows (number) of inverter units 100 lined up in the Z direction may be other than two rows (two).

[0026] As shown in FIG. 2, the electric device 110 other than the inverter unit 100 is, for example, a reactor 111, a molded case circuit breaker 112, a control power supply, and so on.

[0027] <Case configuration> 1, the housing 120 has a box shape and is made of metal.

[0028] As shown in FIG. 2, the housing 120 includes a unit accommodating section 121 and an exhaust flow path 122. The unit accommodating section 121 is disposed on the Y1 side in the housing 120. The inverter unit 100, the molded case circuit breaker 112, the control power supply, and the like are accommodated in the unit accommodating section 121. The exhaust flow path 122 is provided on the rear side (Y2 side) of the unit accommodating section 121 in the housing 120. The reactor 111 and the like are accommodated in the exhaust flow path 122. The unit accommodating section 121 and the exhaust flow path 122 are partitioned by a partition plate 125 extending along the X direction and the Z direction. The inverter unit 100 is disposed in the unit accommodating section 121 so as to be adjacent to the partition plate 125 in the Y direction.

[0029] The housing 120 is disposed on the Y1 side of the unit accommodating section 121 and includes a front door 123 that can be opened and closed on the Y1 side with respect to the unit accommodating section 121. By opening the front door 123 on the Y1 side, a user can access the inverter unit 100, the circuit breaker 112, the control power supply, and the like accommodated in the unit accommodating section 121.

[0030] The housing 120 includes an air intake port 123a arranged on the front side (Y1 side) of the housing 120. Specifically, the front door 123 arranged on the Y1 side of the unit housing section 121 is formed with the air intake port 123a configured to allow ventilation between the unit housing section 121 and the outside of the housing 120. As shown in Fig. 1, the air intake port 123a is composed of a plurality of holes penetrating the front door 123 in the Y direction.

[0031] 2, the housing 120 includes an air exhaust port 124a disposed at the upper end of the housing 120. Specifically, in the top plate 124 of the housing 120, an air exhaust port 124a that allows ventilation between the exhaust flow path 122 and the outside of the housing 120 is formed at a position corresponding to the exhaust flow path 122. The air exhaust port 124a is configured from one hole penetrating the top plate 124 in the Z direction. Note that the air exhaust port 124a may be configured from a plurality of holes penetrating the top plate 124 in the Z direction.

[0032] (Inverter unit configuration) As shown in FIG. 3, the inverter unit 100 includes an inverter unit body 10 and a flow path portion 20 disposed on the rear side (Y2 side) of the inverter unit body 10.

[0033] <Inverter unit body configuration> As shown in FIG. 4, the inverter unit body 10 includes a substrate 11, a semiconductor module 12, and a capacitor 13.

[0034] As shown in Fig. 3, the inverter unit body 10 has a box shape. As shown in Fig. 4, the inverter unit body 10 accommodates a substrate 11, a semiconductor module 12, a capacitor 13, and the like.

[0035] The substrate 11 is a printed circuit board having a component mounting surface on which electronic components are arranged. The substrate 11 is arranged so that the component mounting surface extends along the Z direction.

[0036] The semiconductor module 12 includes a switching element for converting power, etc. The semiconductor module 12 is disposed on a component arrangement surface on the Y2 side of the substrate 11. The semiconductor module 12 is disposed in the center of the inverter unit body 10 in the Z direction.

[0037] The capacitor 13 is a smoothing capacitor. The capacitor 13 is disposed on the component arrangement surface on the Y1 side of the substrate 11. The capacitor 13 is disposed on the upper part of the inverter unit body 10 in the Z direction. The capacitor 13 may be disposed in the center or lower part of the inverter unit body 10 in the Z direction.

[0038] <Flow path configuration> As shown in FIG. 4, the flow path section 20 includes a flow path housing 21, a cooling air flow path 22, a heat dissipation member 23, a fan 24, and a guide member 25.

[0039] 5, the flow path housing 21 includes a Y2-side surface 21a, an X1-side surface 21b, an X2-side surface 21c, a first Y1-side surface 21d, and a second Y1-side surface 21e. The Y2-side surface 21a, the X1-side surface 21b, the X2-side surface 21c, the first Y1-side surface 21d, and the second Y1-side surface 21e have a flat plate shape.

[0040] The Y2-side surface 21a, the X1-side surface 21b, the X2-side surface 21c, the Y1-side first surface 21d, and the Y1-side second surface 21e are integrally formed. Specifically, the Y2-side surface 21a extends along the X direction and the Z direction. The X1-side surface 21b extends along the Y direction and the Z direction. The Y2-side end of the X1-side surface 21b is connected to the X1-side end of the Y2-side surface 21a. The X2-side surface 21c extends along the Y direction and the Z direction. The Y2-side end of the X2-side surface 21c is connected to the X2-side end of the Y2-side surface 21a. The Y1-side first surface 21d extends along the X direction and the Z direction. The X1-side end of the Y1-side first surface 21d is connected to the Y1-side end of the X1-side surface 21b. The Y1-side second surface 21e extends along the X and Z directions. An end portion on the X2 side of the Y1-side second surface 21e is connected to an end portion on the Y2 side of the X2-side surface 21c. The end portion on the X2 side of the Y1-side first surface 21d and the end portion on the X1 side of the Y1-side second surface 21e are spaced apart in the X direction.

[0041] Each of the first surface 21d on the Y1 side and the second surface 21e on the Y1 side is attached to the surface 10a on the Y2 side of the inverter unit body 10 by fastening members or the like. That is, the flow path housing 21 is attached to the Y2 side of the inverter unit body 10 by fastening members or the like.

[0042] The surface 21a on the Y2 side is disposed adjacent to a partition plate 125 (see FIG. 2) of the housing 120. As shown in FIG. 2, the partition plate 125 of the housing 120 has an opening 125a formed at a position overlapping an outlet 22b of a cooling air flow path 22 described later when viewed from the X direction.

[0043] 4, the cooling air flow path 22 extends in the vertical direction (Z direction) and is configured so that air passes through it to cool the semiconductor module 12. Specifically, as shown in Fig. 5, the cooling air flow path 22 is a cylindrical space extending in the Z direction and defined by the Y2-side surface 21a, the X1-side surface 21b, the X2-side surface 21c, the Y1-side first surface 21d, and the Y1-side second surface 21e of the flow path casing 21 and the Y2-side surface 10a of the inverter unit main body 10.

[0044] 4, the inlet 22a of the cooling air passage 22 is an opening on the Z2 side of the cooling air passage 22 which is configured in a cylindrical shape extending along the Z direction. That is, the inlet 22a of the cooling air passage 22 is disposed at the lower end of the passage portion 20.

[0045] The outlet 22b of the cooling air flow path 22 is disposed on the surface 21a on the rear side (Y2 side) of the flow path section 20 (flow path casing 21) disposed on the rear side (Y2 side) of the inverter unit main body 10. As shown in Fig. 3, the outlet 22b of the cooling air flow path 22 is composed of a plurality of holes penetrating the surface 21a on the Y2 side of the flow path casing 21 in the Y direction. Note that the outlet 22b of the cooling air flow path 22 may be composed of a single hole penetrating the surface 21a on the Y2 side of the flow path casing 21 in the Y direction.

[0046] As shown in Fig. 4, the entire outlet 22b of the cooling air flow path 22 is disposed below (Z2 side) the upper surface 10b of the inverter unit body 10 and above (Z1 side) the bottom surface 10c of the inverter unit body 10. That is, at least a part of the outlet 22b of the cooling air flow path 22 is disposed below (Z2 side) the upper surface 10b of the inverter unit body 10 and above (Z1 side) the bottom surface 10c of the inverter unit body 10. Specifically, the upper end of the outlet 22b of the cooling air flow path 22 is disposed below (Z2 side) the upper surface 10b of the inverter unit body 10. Also, the lower end of the outlet 22b of the cooling air flow path 22 is disposed on the Z1 side of the center of the inverter unit body 10 in the Z direction.

[0047] The fan 24, the heat dissipation member 23, and the guide member 25 are arranged in this order from the lower side (Z2 side) to the upper side (Z1 side) in the cooling air flow path 22. That is, the fan 24, the heat dissipation member 23, and the guide member 25 are arranged in this order from one of the lower side (Z2 side) and the upper side (Z1 side) to the other in the cooling air flow path 22.

[0048] The heat dissipation member 23 is disposed at the center of the cooling air passage 22 in the up-down direction (Z direction). The heat dissipation member 23 is made of metal. A metal (for example, aluminum) having a relatively high thermal conductivity is used for the heat dissipation member 23. The heat dissipation member 23 includes a base portion 23a and a plurality of fins 23b. The base portion 23a has a plate shape extending in the X direction and the Z direction. As shown in FIG. 5, the plurality of fins 23b protrude from the base portion 23a toward the Y2 side and have a plate shape extending in the Y direction and the Z direction. That is, the air passing through the cooling air passage 22 passes through the gaps between the plurality of fins 23b along the Z direction.

[0049] The heat dissipation member 23 is disposed in the cooling air flow path 22 so as to be in contact with the semiconductor module 12. Specifically, in the Z direction, a through hole penetrating in the Y direction is formed at a position on the surface 10a on the rear side (Y2 side) of the inverter unit main body 10 where the semiconductor module 12 is disposed. The Y1 side surface of the base portion 23a of the heat dissipation member 23 is in contact with the Y2 side surface of the semiconductor module 12. As a result, the heat generated from the semiconductor module 12 is transferred to the multiple fins 23b via the base portion 23a of the heat dissipation member 23. The multiple fins 23b are cooled by air passing between the multiple fins 23b along the Z direction. This is repeated to dissipate the heat generated from the semiconductor module 12. That is, the semiconductor module 12 is cooled.

[0050] As shown in Fig. 4, the fan 24 is disposed at a lower portion within the cooling air flow path 22. The fan 24 is provided to pass air from the lower portion (Z2 side) to the upper portion (Z1 side) within the cooling air flow path 22. That is, the fan 24 is provided to pass air from one of the lower portion (Z2 side) and the upper portion (Z1 side) to the other within the cooling air flow path 22. The fan 24 is disposed so that air passes in the vertical direction (Z direction). Specifically, the fan 24 is disposed so that the rotation axis is along the vertical direction (Z direction).

[0051] The guide member 25 is disposed at an upper portion of the cooling air flow path 22 in the up-down direction (Z direction). The guide member 25 is provided to guide the air in the cooling air flow path 22 to the outlet 22b of the cooling air flow path 22. The guide member 25 is configured as a separate body from the flow path casing 21. Note that the guide member 25 may be configured integrally with the flow path casing 21.

[0052] The guide member 25 is disposed so as to incline from the front side (Y1 side) to the rear side (Y2 side) of the cooling air flow passage 22 (flow passage section 20) as it moves from the lower side (Z2 side) to the upper side (Z1 side). That is, the guide member 25 is disposed so as to incline from the front side (Y1 side) to the rear side (Y2 side) of the cooling air flow passage 22 (flow passage section 20) as it moves from one of the lower side (Z2 side) and the upper side (Z1 side) to the other.

[0053] The guide member 25 is made of a single flat plate member that is inclined from the front side (Y1 side) to the rear side (Y2 side) of the flow path section 20 as it moves from the bottom (Z2 side) to the top (Z1 side). That is, the guide member 25 is made of a single flat plate member that is inclined from the front side (Y1 side) to the rear side (Y2 side) of the flow path section 20 as it moves from one of the bottom (Z2 side) and top (Z1 side) to the other.

[0054] All of the guide members 25 are disposed below the upper surface 10b of the inverter unit body 10 (Z2 side) and above the bottom surface 10c of the inverter unit body 10 (Z1 side). That is, at least a part of the guide members 25 is disposed below the upper surface 10b of the inverter unit body 10 (Z2 side) and above the bottom surface 10c of the inverter unit body 10 (Z1 side). Specifically, the Z1-side end 25a of the guide member 25 is disposed below the upper surface 10b of the inverter unit body 10 (Z2 side). In addition, the Z2-side end 25b of the guide member 25 is disposed near the Z1-side end 23c of the heat dissipation member 23. That is, the end 25b of the guide member 25 on the heat dissipation member 23 side (Z2 side) is disposed near the end 23c of the heat dissipation member 23 on the guide member 25 side (Z1 side).

[0055] (Air flow for cooling the semiconductor module of the inverter unit) 2, air supplied to the cooling air flow path 22 of the inverter unit 100 is configured to be supplied into the housing 120 through the air intake port 123a. Specifically, when the fan 24 is driven, air outside the housing 120 is supplied into the housing 120 (the unit housing section 121 housing the inverter unit 100) through the air intake port 123a formed in the front door 123.

[0056] The air supplied to the unit accommodating section 121 is supplied into the cooling air flow path 22 from the inlet 22a of the cooling air flow path 22 arranged at the lower end of the flow path section 20. The air supplied into the cooling air flow path 22 passes through the fan 24 and the heat dissipation member 23 in this order from the Z2 side to the Z1 side in the cooling air flow path 22. The air supplied into the cooling air flow path 22 becomes relatively hot due to heat generated from the semiconductor module 12 (see FIG. 4) while passing through the heat dissipation member 23. The relatively hot air that has passed through the heat dissipation member 23 is bent by the guide member 25 from the direction from the Z2 side to the Z1 side to the direction from the Y1 side to the Y2 side, and is guided to the outlet 22b of the cooling air flow path 22 arranged on the surface 21a (see FIG. 4) on the Y2 side of the flow path section 20.

[0057] The air discharged from the outlet 22b of the cooling air flow path 22 of the inverter unit 100 is configured to be discharged to the outside of the housing 120 through the exhaust flow path 122. Specifically, the relatively high-temperature air discharged from the outlet 22b of the cooling air flow path 22 is discharged to the exhaust flow path 122 through an opening 125a formed in a partition plate 125 that separates the unit accommodating portion 121 and the exhaust flow path 122. The relatively high-temperature air discharged to the exhaust flow path 122 passes through the exhaust flow path 122 from the Z2 side toward the Z1 side, and is then discharged to the outside of the housing 120 through an air outlet 124a formed in the top plate 124 of the housing 120. The relatively high-temperature air discharged to the outside of the housing 120 passes through an exhaust guide member 130 arranged above the housing 120, and is then discharged from the inside of the exhaust guide member 130 to the outside of the exhaust guide member 130 in the Y1 direction and the Y2 direction. The exhaust guide member 130 does not have to be provided above the housing 120.

[0058] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0059] In this embodiment, as described above, the outlet 22b of the cooling air flow path 22 is disposed on the surface 21a on the rear side of the flow path section 20 disposed on the rear side (Y2 side) of the inverter unit main body 10. This allows the air that has cooled the semiconductor module 12 of the inverter unit 100 and become relatively hot to be discharged from the outlet 22b of the cooling air flow path 22 disposed on the surface 21a on the rear side of the flow path section 20 to the rear side of the flow path section 20. As a result, it is possible to prevent the air that has cooled the semiconductor module 12 of the inverter unit 100 and become relatively hot from exerting a thermal effect on other electric devices disposed above the inverter unit 100 (Z1 side).

[0060] In addition, in this embodiment, as described above, at least a part of the outlet 22b of the cooling air flow path 22 is disposed below (Z2 side) the upper surface 10b of the inverter unit body 10 and above (Z1 side) the bottom surface 10c of the inverter unit body 10. This makes it possible to prevent the upper end of the flow path section 20 including the cooling air flow path 22 from protruding above the upper surface 10b of the inverter unit body 10 and the lower end of the flow path section 20 including the cooling air flow path 22 from protruding below the bottom surface 10c of the inverter unit body 10, as compared with the case where all of the outlets 22b of the cooling air flow path 22 are disposed above the upper surface 10b of the inverter unit body 10 or below the bottom surface 10c of the inverter unit body 10. This makes it possible to prevent the height of the inverter unit 100 from increasing.

[0061] In the present embodiment, as described above, the flow path portion 20 includes a guide member 25 that guides the air in the cooling air flow path 22 to the outlet 22b of the cooling air flow path 22. At least a part of the guide member 25 is disposed below (Z2 side) the upper surface 10b of the inverter unit main body 10 and above (Z1 side) the bottom surface 10c of the inverter unit main body 10. This makes it possible to prevent the upper end of the flow path portion 20 including the guide member 25 from protruding above the upper surface 10b of the inverter unit main body 10 and the lower end of the flow path portion 20 including the guide member 25 from protruding below the bottom surface 10c of the inverter unit main body 10, as compared with a case in which the entire guide member 25 is disposed above the upper surface 10b of the inverter unit main body 10 or below the bottom surface 10c of the inverter unit main body 10. This makes it possible to prevent the height of the inverter unit 100 from increasing even when the flow path portion 20 includes the guide member 25.

[0062] In this embodiment, as described above, the heat dissipation member 23 is disposed at the center of the cooling air passage 22 in the vertical direction (Z direction). The guide member 25 is disposed so as to incline from the front side (Y1 side) of the passage section 20 to the back side (Y2 side) as it goes from one of the lower side (Z2 side) and the upper side (Z1 side) to the other. The end 25b of the guide member 25 on the heat dissipation member 23 side is disposed near the end 23c of the guide member 25 side of the heat dissipation member 23. As a result, the guide member 25 is disposed so as to incline from the front side to the back side of the passage section 20 as it goes from one of the lower side and the upper side to the other, so that the air in the cooling air passage 22 can be efficiently guided to the outlet 22b of the cooling air passage 22. Furthermore, since the end 25b of the guide member 25 on the heat dissipation member 23 side is disposed near the end 23c of the heat dissipation member 23 on the guide member 25 side, the end 25b of the guide member 25 opposite the heat dissipation member 23 can be positioned on the heat dissipation member 23 side disposed in the center of the cooling air flow path 22 in the vertical direction. This makes it possible to easily realize a configuration in which at least a part of the guide member 25 is disposed below the top surface 10b of the inverter unit main body 10 and above the bottom surface 10c of the inverter unit main body 10, even if the guide member 25 is disposed so as to be inclined from the front side toward the back side of the flow path portion 20 as it goes from one side downward or from the other side upward.

[0063] In this embodiment, as described above, the guide member 25 is made of a single flat plate member that is inclined from the front side (Y1 side) to the rear side (Y2 side) of the flow path section 20 as it goes from one side downward or upward to the other side. This makes it easier to manufacture the guide member 25 that is inclined from the front side to the rear side of the flow path section 20 as it goes from one side downward or upward to the other side, compared to when the guide member 25 is made of a plurality of members, when the guide member 25 is made of a member having a complex shape, etc.

[0064] In this embodiment, as described above, the fan 24, the heat dissipation member 23, and the guide member 25 are arranged in this order from one of the lower side (Z2 side) and the upper side (Z1 side) to the other in the cooling air flow path 22. As a result, the fan 24 is arranged upstream of the heat dissipation member 23 in the cooling air flow path 22, so that the air passing through the fan 24 can be made relatively low temperature. This makes it possible to suppress deterioration of the fan 24 due to exposure to relatively high temperature air.

[0065] In this embodiment, as described above, a plurality of inverter units 100 are provided so as to be lined up in the vertical direction (Z direction) inside the housing 120. As a result, one inverter unit 100 is disposed above (on the Z1 side) another inverter unit 100, and therefore it is possible to effectively apply a configuration capable of suppressing the air that has cooled the semiconductor module 12 and become relatively hot from exerting a thermal effect on other electric devices disposed above (on the Z1 side) the inverter unit 100.

[0066] In the present embodiment, as described above, the housing 120 includes the air intake 123a disposed on the front side (Y1 side) of the housing 120, the unit housing section 121 in which the inverter unit 100 is housed, and the exhaust flow path 122 provided on the rear side (Y2 side) of the unit housing section 121. The air supplied to the cooling air flow path 22 of the inverter unit 100 is configured to be supplied into the housing 120 through the air intake 123a. The air discharged from the outlet 22b of the cooling air flow path 22 of the inverter unit 100 is configured to be discharged to the outside of the housing 120 through the exhaust flow path 122. As a result, the air discharged from the outlet 22b of the cooling air flow path 22 of the inverter unit 100 to the rear side of the flow path section 20 can be discharged to the outside of the housing 120 through the exhaust flow path 122 provided on the rear side of the unit housing section 121 in which the inverter unit 100 is housed. This reliably prevents the air that has become relatively hot after cooling the semiconductor module 12 of the inverter unit 100 from having a thermal effect on other electrical equipment arranged above (on the Z1 side of) the inverter unit 100.

[0067] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims rather than the description of the above embodiments, and further includes all modifications (variations) within the meaning and scope of the claims.

[0068] For example, in the above embodiment, the air supplied to the cooling air flow path 22 of the inverter unit 100 is supplied into the housing 120 via the air intake port 123a arranged on the front side (Y1 side) of the housing 120, but the present invention is not limited to this. In the present invention, the air supplied to the cooling air flow path of the inverter unit may be configured to be supplied into the housing via a portion other than the air intake port.

[0069] In the above embodiment, the air discharged from the outlet 22b of the cooling air flow path 22 of the inverter unit 100 is discharged to the outside of the housing 120 through the exhaust flow path 122 provided on the rear side (Y2 side) of the unit housing portion 121 housing the inverter unit 100, but the present invention is not limited to this. In the present invention, the air discharged from the outlet of the cooling air flow path of the inverter unit may be discharged to the outside of the housing through a portion other than the exhaust flow path.

[0070] In the above embodiment, the inverter units 100 are provided in a plurality of units arranged in the vertical direction (Z direction) in the housing 120, but the present invention is not limited to this. In the present invention, the inverter units may be provided in a plurality of units not arranged in the vertical direction in the housing, or may not be provided in a plurality of units.

[0071] In the above embodiment, the inverter units 100 are provided in a plurality of units arranged in the left-right direction (X direction) in the housing 120, but the present invention is not limited to this. In the present invention, the inverter units may be provided in a plurality of units not arranged in the left-right direction in the housing, or may not be provided in a plurality of units.

[0072] In the above embodiment, the fan 24, the heat dissipation member 23, and the guide member 25 are arranged in this order from the bottom (Z2 side) to the top (Z1 side) in the cooling air flow path 22, but the present invention is not limited to this. In the present invention, the fan, the heat dissipation member, and the guide member may be arranged in this order from the top to the bottom in the cooling air flow path.

[0073] In the above embodiment, the fan 24, the heat dissipation member 23, and the guide member 25 are arranged in this order from one of the lower side (Z2 side) and the upper side (Z1 side) to the other side in the cooling air flow path 22, but the present invention is not limited to this. In the present invention, the fan, the heat dissipation member, and the guide member do not have to be arranged in this order from one of the lower side and the upper side to the other side in the cooling air flow path. For example, the heat dissipation member, the fan, and the guide member may be arranged in this order from one of the lower side and the upper side to the other side in the cooling air flow path.

[0074] In the above embodiment, the fan 24 is disposed so that the air passes in the vertical direction (Z direction), but the present invention is not limited to this. In the present invention, the fan may be disposed so that the air passes in the front-rear direction.

[0075] In the above embodiment, the guide member 25 is formed of a single flat plate member that is inclined from the front side (Y1 side) to the back side (Y2 side) of the flow path section 20 as it moves from the bottom (Z2 side) to the top (Z1 side), but the present invention is not limited to this. In the present invention, the guide member may be formed of a single flat plate member that is inclined from the front side to the back side of the flow path section as it moves from the top to the bottom.

[0076] In the above embodiment, the guide member 25 is configured from a single flat plate member that is inclined from the front side (Y1 side) to the back side (Y2 side) of the flow path section 20 as it goes from one side of the lower side or the upper side (Z2 side) to the other side, but the present invention is not limited to this. In the present invention, the guide member 25 may be configured from a plurality of members or may be configured from a member having a complex shape, so long as it includes a portion that is inclined from the front side to the back side of the flow path section 20 as it goes from one side of the lower side or the upper side to the other side.

[0077] In the above embodiment, the guide member 25 is disposed so as to be inclined from the front side (Y1 side) to the back side (Y2 side) of the flow path section 20 as it moves from the bottom (Z2 side) to the top (Z1 side), but the present invention is not limited to this. In the present invention, the guide member may be disposed so as to be inclined from the front side to the back side of the flow path section as it moves from the top to the bottom.

[0078] In the above embodiment, the guide member 25 is disposed so as to incline from the front side (Y1 side) to the rear side (Y2 side) of the flow path section 20 as it moves from one of the lower side and the upper side (Z2 side) to the other, but the present invention is not limited to this. In the present invention, the guide member does not have to be disposed so as to incline from the front side to the rear side of the flow path section as it moves from one of the lower side and the upper side to the other.

[0079] In the above embodiment, the end 25b of the guide member 25 on the heat dissipation member 23 side is disposed near the end 25b of the heat dissipation member 23 on the guide member 25 side, but the present invention is not limited to this. In the present invention, the end of the guide member on the heat dissipation member side does not have to be disposed near the end of the heat dissipation member on the guide member side.

[0080] In the above embodiment, an example has been shown in which at least a part of the guide member 25 is disposed below (on the Z2 side) the top surface 10b of the inverter unit body 10 and above (on the Z1 side) the bottom surface 10c of the inverter unit body 10, but the present invention is not limited to this. In the present invention, the guide member does not have to be disposed below the top surface of the inverter unit body and above the bottom surface of the inverter unit body.

[0081] In the above embodiment, the flow path section 20 includes the guide member 25 that guides the air in the cooling air flow path 22 to the outlet 22b of the cooling air flow path 22, but the present invention is not limited to this. In the present invention, the flow path section does not need to include a guide member that guides the air in the cooling air flow path to the outlet of the cooling air flow path. In that case, it is preferable that the flow path section is configured to have no openings other than the inlet and outlet of the cooling air flow path so that the air that has cooled the semiconductor module of the inverter unit and become relatively hot is not discharged above the flow path section. [Explanation of symbols]

[0082] 10 Inverter unit body 10b (Top surface of inverter unit body) 10c Bottom surface (of inverter unit body) 12 Semiconductor Module 20 Flow path 21a (flow passage portion) rear surface 22 Cooling air passage 22b (cooling air passage) outlet 23 Heat dissipation materials 23c (heat dissipation member) end portion on the guide member side 24 Fans 25 Guide member 25b (of the guide member) end portion on the heat dissipation member side 100 Inverter unit 120 Case 121 Unit storage section 122 Exhaust flow path 123a Air intake 150 Power conversion device

Claims

1. an inverter unit body including a semiconductor module; a flow path portion extending in a vertical direction and including a cooling air flow path through which air for cooling the semiconductor module passes, the flow path portion being disposed on a rear side of the inverter unit body; The flow path portion is a heat dissipation member disposed in the cooling air flow path so as to be in contact with the semiconductor module; a fan for passing air through the cooling air flow path from one of the lower portion and the upper portion to the other, an outlet of the cooling air flow passage is disposed on a rear surface of the flow passage portion, An inverter unit, wherein at least a portion of the outlet of the cooling air flow path is disposed below a top surface of the inverter unit body and above a bottom surface of the inverter unit body.

2. the flow path portion includes a guide member that guides air in the cooling air flow path to the outlet of the cooling air flow path, The inverter unit according to claim 1 , wherein at least a portion of the guide member is disposed below the top surface of the inverter unit body and above the bottom surface of the inverter unit body.

3. the heat dissipation member is disposed in a central portion of the cooling air flow path in a vertical direction, the guide member is disposed so as to be inclined from the front side to the rear side of the flow passage portion as it goes from one of the lower portion and the upper portion to the other, The inverter unit according to claim 2 , wherein an end portion of said guide member on said heat dissipation member side is disposed in the vicinity of an end portion of said heat dissipation member on said guide member side.

4. 4. The inverter unit according to claim 3, wherein the guide member is formed of a single flat plate member that is inclined from the front side to the rear side of the flow passage portion as it goes from one of the lower and upper sides to the other.

5. 3. The inverter unit according to claim 2, wherein the fan, the heat dissipation member, and the guide member are arranged in the cooling air flow path in this order from one of the lower portion and the upper portion to the other.

6. An inverter unit; a housing that houses the inverter unit, The inverter unit includes: an inverter unit body including a semiconductor module; a flow path portion extending in a vertical direction and including a cooling air flow path through which air for cooling the semiconductor module passes, the flow path portion being disposed on a rear side of the inverter unit body; The flow path portion is a heat dissipation member disposed in the cooling air flow path so as to be in contact with the semiconductor module; a fan for passing air through the cooling air passage from one of the lower portion and the upper portion to the other. an outlet of the cooling air flow passage is disposed on a rear surface of the flow passage portion, A power conversion device, wherein at least a portion of the outlet of the cooling air flow path is disposed below a top surface of the inverter unit body and above a bottom surface of the inverter unit body.

7. The power conversion device according to claim 6 , wherein the inverter unit is provided in a plurality of units arranged vertically within the housing.

8. The housing includes: An air intake port disposed on a front side of the housing; a unit housing portion in which the inverter unit is housed; an exhaust flow path provided on a rear side of the unit housing portion, The air supplied to the cooling air flow path of the inverter unit is configured to be supplied into the housing through the air intake port, The power conversion device according to claim 6 , wherein air discharged from the outlet of the cooling air flow path of the inverter unit is discharged to the outside of the housing via the exhaust flow path.

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