Pickup unit, mounting device, and pickup method

Abstract

To provide a pickup unit capable of suppressing a failure which may occur in a chip component when picking up the chip component from a sheet, a mounting device, and a pickup method.SOLUTION: A pickup unit 30 comprises: a stage 35; a peeling mechanism 36 including a plurality of blocks 40 disposed concentrically inside of an opening 35b which is formed on a placing face 35a; and a collet 37 which adsorbs and holds a semiconductor chip 101. A recess C1b extending from a side part B11 of a distal end face 41a is formed on an outside face 41b of a first block 41. The recess C1b includes a bottom surface S11 and a pair of side surfaces S12 and S13. The pair of side surfaces S12 and S13 extends in a direction of inclination with respect to a face which is vertical to the outside face 41b so as to be separated in an opposite direction of a mutual opposing direction as it approaches the outside face 41b from the bottom surface S11 when the distal end face 41a is viewed in a Z axis direction.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a pick-up unit, a mounting device, and a pick-up method. [Background technology]

[0002] Semiconductor chips obtained by dividing a semiconductor wafer are components of electronic devices. In the manufacturing process of electronic devices, a task occurs in which a semiconductor chip attached to a wafer sheet is picked up from the wafer sheet and placed on a circuit board. Methods for picking up semiconductor chips are known, for example, as described in Patent Documents 1 to 3. For example, in the method described in Patent Document 1, while the back surface of the wafer sheet around the semiconductor chip is attached to the surface of a stage, a plurality of push-up pins arranged in an opening of the stage are protruded above the surface of the stage to press the back surface of the wafer sheet and push up the semiconductor chip on the wafer sheet. Thereafter, for example, the push-up pins are lowered in order from the outermost one to pick up the semiconductor chip by peeling it off from the wafer sheet. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-182278 A [Patent Document 2] JP 2006-005030 A [Patent Document 3] JP 2022-114399 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, the thickness of semiconductor chips has been decreasing in response to demands for higher integration. When attempting to peel such thin semiconductor chips from a wafer sheet, the semiconductor chips pushed up by the push-up pins may deform significantly in accordance with the deformation of the wafer sheet. As a result, there is a risk of problems such as damage to the semiconductor chips.

[0005] The present invention provides a pick-up unit, a mounting device, and a pick-up method that can suppress defects that may occur in chip components when the chip components are picked up from a sheet. [Means for solving the problem]

[0006] A pickup unit according to one embodiment of the present invention is a pickup unit that picks up chip components affixed to a surface of a sheet from the surface of the sheet, and includes a stage that includes a mounting surface on which the chip components are placed via the sheet and that adsorbs the back surface of the sheet, a peeling mechanism that includes a plurality of blocks that are concentrically arranged inside openings formed on the mounting surface and that are capable of reciprocating along a normal direction of the mounting surface, and peels the chip components from the surface of the sheet by the plurality of blocks protruding from the openings, and a chip holding mechanism that picks up the chip components from the surface of the sheet by adsorbing and holding the chip components. each of the plurality of blocks includes a tip surface facing the back surface of the sheet in a normal direction, and an outer surface extending from the tip surface along the normal direction, and the outer surface of at least one of the plurality of blocks has a recess formed thereon extending along the normal direction from an edge portion connecting adjacent corner portions of the tip surface, and the recess includes a bottom recessed from the outer surface and a pair of side surfaces connecting the bottom and the outer surface, and the pair of side surfaces extend in a direction inclined with respect to a plane perpendicular to the outer surface so as to move away from each other in a direction opposite to the opposing direction as the tip surface approaches the outer surface from the bottom.

[0007] This pickup unit includes a plurality of blocks for pushing up the chip components. When the plurality of blocks push up the chip components, tension in the tensile direction is applied to the sheet to which the chip components are attached. When the chip components are peeled off from the sheet in this state, the corners of the chip components are likely to become the starting points of peeling, and stress is likely to concentrate at the corners. In contrast, in the above pickup unit, a recess extending from the edge of the tip surface along the normal direction is formed on the outer surface of at least one of the plurality of blocks. In this case, the starting points of peeling are also likely to be formed near the recess, so that it is possible to suppress a situation in which a large stress is applied to the corners of the chip components. Furthermore, when the tip surface is viewed in the normal direction, the pair of side surfaces of the recess extend in a direction inclined with respect to a plane perpendicular to the outer surface so that they move away from each other in the opposite direction from the facing direction as they approach the outer surface from the bottom. In this case, unlike the case in which the pair of side surfaces of the recess extend along a plane perpendicular to the outer surface, the stress acting on the starting points of peeling formed in the recess can be distributed to the tensile direction perpendicular to the outer surface and the direction perpendicular to the tensile direction. This makes it possible to reduce the tensile stress applied to the vicinity of the recess. Therefore, with the above pickup unit, it is possible to prevent a situation in which a large stress acts locally on the chip component when the chip component is peeled off from the surface of the sheet. This makes it possible to prevent the occurrence of defects such as damage to the chip component caused by stress concentration.

[0008] In the above pickup unit, the multiple blocks may include an outermost block located at the outermost side inside the opening, and at least the outermost block among the multiple blocks may have a recess formed on its outer surface. When the multiple blocks push up the chip components, the sheet to which the chip components are attached is likely to be significantly stretched by the outermost block located at the outermost side. In this case, a large tension is applied to the sheet by the outermost block. In the above configuration, a recess is formed on the outer surface of the outermost block, so that it is possible to suppress a situation in which a large stress due to the tension is locally applied to the chip components. As a result, it is possible to effectively suppress the occurrence of defects such as damage to the chip components caused by stress concentration.

[0009] In the above pickup unit, a recess may be formed on each of the outer surfaces of the multiple blocks. For example, after the multiple blocks push up the chip components, the blocks may be returned to their original positions to peel off the chip components from the surface of the sheet. In the above configuration, since a recess is formed on each of the outer surfaces of the multiple blocks, even if any of the blocks generates a large tension on the sheet, it is possible to prevent a large stress caused by the tension from acting locally on the chip components. As a result, it is possible to effectively prevent the occurrence of defects such as damage to the chip components caused by stress concentration.

[0010] In the above pickup unit, each of the blocks may include a plurality of outer surfaces extending from the tip surface along a normal direction, and a recess may be formed on each of the plurality of outer surfaces. In this case, the stress applied to the chip components near the recesses on the plurality of outer surfaces of the block can be kept small, so that the occurrence of defects such as damage to the chip components caused by stress concentration can be effectively suppressed.

[0011] In the above pickup unit, the bottom of the recess may extend from the center of the side along the normal direction, in which case the chip components can be peeled off smoothly from the corners of the chip components toward the center of the side when peeling them off from the surface of the sheet.

[0012] In the above pickup unit, when the tip surface is viewed in the normal direction, the pair of side surfaces of the recess may be arranged symmetrically with respect to a reference axis passing through the center of the bottom and perpendicular to the outer surface. In this case, the stress acting near the recess can be evenly distributed, so that the chip component can be effectively prevented from being locally subjected to large stress. As a result, the occurrence of defects such as damage to the chip component caused by stress concentration can be effectively prevented.

[0013] In the above pickup unit, the plurality of blocks include a first block disposed at the outermost position inside the opening, a second block disposed on the inner side of the first block, and a third block disposed on the inner side of the second block, and each of the first, second, and third blocks is configured to reciprocate between a waiting position where its tip surface does not protrude beyond the mounting surface and a push-up position where its tip surface protrudes beyond the mounting surface and pushes up the chip component, and after the first, second, and third blocks move from the waiting position to the push-up position to push up the chip component, the first and third blocks may simultaneously move from the push-up position to the waiting position while the second block is maintained at the push-up position, and then the second block may move from the push-up position to the waiting position. In this way, when the first, second, and third blocks are moved to the push-up position and then the first and third blocks are moved to the waiting position simultaneously, the peeling time of the chip component by the push-up operation can be shortened compared to when the first, second, and third blocks are moved to the waiting position in order. Furthermore, by skipping the second block and moving the first and third blocks to the standby position at the same time, more starting points for peeling of the chip components can be formed compared to moving the first and second blocks adjacent to each other to the standby position at the same time, which effectively prevents large stress from acting locally on the chip components, thereby effectively preventing defects such as damage to the chip components caused by stress concentration.

[0014] A mounting device according to one aspect of the present invention includes any one of the pickup units described above, and a bonding unit that bonds the chip component picked up by the pickup unit to a substrate. Since the mounting device includes any one of the pickup units described above, it can achieve the above-mentioned effects.

[0015] A pickup method according to one embodiment of the present invention is a pickup method implemented by using any one of the pickup units described above, and includes the steps of: moving a first block, which is disposed on the outermost side of the opening, a second block, which is disposed on the inner side of the first block, and a third block, which is disposed on the inner side of the second block, among the blocks, from a waiting position where a leading end surface does not protrude from the mounting surface to a push-up position where a leading end surface protrudes from the mounting surface, thereby pushing up chip components; moving the first block and the third block simultaneously from the push-up position to the standby position while maintaining the second block at the push-up position; and peeling the chip components from the surface of the sheet by moving the second block from the push-up position to the standby position. In this way, when the first block, the second block, and the third block are moved to the push-up position and then the first block and the third block are moved to the standby position simultaneously, the peeling time of the chip components by the push-up operation can be shortened compared to the case where the first block, the second block, and the third block are moved to the standby position in order. Furthermore, by skipping the second block and moving the first and third blocks to the standby position at the same time, more starting points for peeling of the chip components can be formed compared to moving the first and second blocks adjacent to each other to the standby position at the same time, which effectively prevents large stress from acting locally on the chip components, thereby effectively preventing defects such as damage to the chip components caused by stress concentration. Effect of the Invention

[0016] According to the present invention, a pick-up unit, a mounting device, and a pick-up method are provided that can suppress defects that may occur in chip components when the chip components are picked up from a sheet. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a schematic diagram showing a mounting apparatus according to an embodiment. [Diagram 2]FIG. 2 is a cross-sectional view showing the pickup unit of FIG. [Diagram 3] FIG. 3 is a perspective view showing the block of FIG. [Figure 4] FIG. 4 is a plan view showing the block of FIG. [Diagram 5] FIG. 5 is an enlarged view of a portion of the block in FIG. [Figure 6] FIG. 6 is an enlarged view of another portion of the block of FIG. [Figure 7] 7(a), 7(b), and 7(c) are cross-sectional views showing the operation of the block. [Figure 8] FIG. 8 is a diagram showing the distribution of stress acting on a chip component pushed up by a block. [Figure 9] FIG. 9 is a perspective view showing a block according to a comparative example. [Figure 10] FIG. 10 is a diagram showing the distribution of stress acting on the chip component pushed up by the block of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, the embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are given the same reference numerals, and duplicated description will be omitted. In each drawing, an XYZ Cartesian coordinate system is shown as necessary. In the following description, the normal direction of a mounting surface 35a of a stage 35 described later is defined as the Z axis direction, and the surface directions along the mounting surface 35a are defined as the X axis direction and the Y axis direction. In addition, in the following, the positive direction in the Z axis direction may be referred to as "up" and the negative direction in the Z axis direction may be referred to as "down".

[0019] The mounting device 1 shown in Fig. 1 removes a semiconductor chip 101, which is an example of a chip component, from a semiconductor wafer and mounts it on a substrate. The semiconductor wafer is composed of a plurality of diced semiconductor chips 101. The plurality of semiconductor chips 101 are attached to a surface 120a of a dicing sheet 120, which is an example of a sheet, via a viscoelastic film 102. The thickness of each semiconductor chip 101 is, for example, about 20 µm. The thickness of the dicing sheet 120 is, for example, about 100 µm.

[0020] The mounting device 1 picks up each semiconductor chip 101 attached to the front surface 120a of the dicing sheet 120 by peeling it off together with the viscoelastic film 102 from the dicing sheet 120. Then, the mounting device 1 bonds the picked-up semiconductor chip 101 to a predetermined position on the substrate.

[0021] The mounting device 1 includes, for example, a bonding unit 10, a controller unit 20, and a pickup unit 30. The pickup unit 30 picks up a semiconductor chip 101. A chip main surface 101a of the semiconductor chip 101 is adsorbed to the pickup unit 30. Next, the pickup unit 30 temporarily places the picked-up semiconductor chip 101 on an intermediate stage 60. The intermediate stage 60 is disposed, for example, between the bonding unit 10 and the pickup unit 30. The intermediate stage 60 may be a part of a rotary head collet configured to be movable in the X-axis direction and the Y-axis direction by a driving mechanism such as a linear motor. The bonding unit 10 holds the semiconductor chip 101 on the intermediate stage 60 and bonds the semiconductor chip 101 to a substrate 110. The pickup unit 30 may be configured to deliver the semiconductor chip 101 to the bonding unit 10 by a so-called flip-chip operation.

[0022] The controller unit 20 controls the operation of the bonding unit 10 and the pickup unit 30. The controller unit 20 outputs control signals to the bonding unit 10 and the pickup unit 30. The controller unit 20 is a computer including, for example, a CPU, a storage unit such as a ROM and a RAM, an input / output unit, and a driver. The controller unit 20 operates the input / output unit under the control of the CPU. Furthermore, the controller unit 20 reads and writes data in the storage unit. These operations generate control signals to be provided to the bonding unit 10 and the pickup unit 30. The bonding unit 10 and the pickup unit 30 perform each operation such as a bonding operation and a pickup operation based on the control signal.

[0023] The bonding unit 10 includes, for example, a bonding stage 12 and a bonding head 13 .

[0024] The bonding stage 12 is a stage on which the supplied substrate 110 is placed and on which the semiconductor chip 101 is mounted. The bonding stage 12 has, for example, suction holes and sucks and holds the substrate 110 from below.

[0025] The bonding head 13 includes a bonding body 14 and a bonding tool 15. The bonding body 14 is connected to the guide rail 11. The bonding body 14 reciprocates along the guide rail. This guide rail extends, for example, from the pickup unit 30 to an area where the bonding work is performed. The bonding body 14 includes a motor for driving the bonding tool 15. The bonding tool 15 detachably holds the semiconductor chip 101 on the intermediate stage 60. For example, the bonding tool 15 has a vacuum suction mechanism as a detachment mechanism. Furthermore, the bonding tool 15 bonds the semiconductor chip 101 to the substrate 110. For example, the bonding tool 15 may have a heater or the like and be able to provide heat to the semiconductor chip 101.

[0026] The pick-up unit 30 includes, for example, a pick-up section 32 and a pick-up head 33 .

[0027] The pick-up unit 32 assists the pick-up operation. The pick-up unit 32 includes, for example, a wafer holder 34, a stage 35, and a peeling mechanism 36. The wafer holder 34 holds the dicing sheet 120. When the wafer holder 34 holds the dicing sheet 120, a tension F (see FIG. 4, described later) acts from the center of the dicing sheet 120 toward the periphery. The tension F stretches the dicing sheet 120.

[0028] The stage 35 adjusts the relative positions of the wafer holder 34 and the peeling mechanism 36. For example, the stage 35 translates the wafer holder 34 in the X-axis direction. The stage 35 may rotate the wafer holder 34 around the Z-axis. By this operation, the stage 35 moves the semiconductor chip 101 to be picked up onto the peeling mechanism 36.

[0029] The peeling mechanism 36 includes a plurality of blocks 40 that can reciprocate along the Z-axis direction. The power for this reciprocating movement is provided by, for example, a drive motor. When the block 40 is in the standby position, its tip does not contact the back surface 120b of the dicing sheet 120. When the block 40 is in the push-up position, its tip contacts the back surface 120b of the dicing sheet 120. When in the push-up position, the tip of the block 40 protrudes above the mounting surface 35a and presses the back surface 120b of the dicing sheet 120, whereby the semiconductor chip 101 is pushed upward (in the positive direction of the Z-axis direction).

[0030] In this manner, the wafer holder 34 is movable in the X-axis direction, and the block 40 moves back and forth in the Z-axis direction, whereby the pickup unit 32 can push up the desired semiconductor chip 101.

[0031] The pickup head 33 includes, for example, a collet 37 (chip holding portion). The collet 37 is disposed at the tip of the pickup head 33. The collet 37 reciprocates along a guide rail. This guide rail extends from an area where the picking operation is performed to the bonding unit 10. The collet 37 detachably holds the semiconductor chip 101 pushed up by the peeling mechanism 36. That is, the collet 37 picks up the semiconductor chip 101. The collet 37 holds the semiconductor chip 101 by, for example, vacuum suction. The pickup head 33 may include a die motor that reciprocates the collet 37 in the Z-axis direction. The collet 37 places the picked-up semiconductor chip 101 on the intermediate stage 60. The semiconductor chip 101 placed on the intermediate stage 60 is held by the bonding unit 10 described above.

[0032] The configuration of the peeling mechanism 36 will be described in more detail with reference to FIG. 2. The stage 35 shown in FIG. 2 has, for example, a cylindrical shape extending in the Z-axis direction. A mounting surface 35a on which the back surface 120b of the dicing sheet 120 is mounted is formed at the upper end of the stage 35 in the Z-axis direction. The normal direction of the mounting surface 35a is along the Z-axis direction. An opening 35b communicating with the inside of the stage 35 is formed at the center of the mounting surface 35a. The opening 35b has a rectangular shape slightly larger than the semiconductor chip 101. A plurality of blocks 40 are arranged inside the opening 35b, which protrude upward from the mounting surface 35a and push up the back surface 120b of the dicing sheet 120.

[0033] The blocks 40 are arranged concentrically with respect to a central axis L along the Z-axis direction. The central axis L may be, for example, an axis passing through the center of the rectangular opening 35b when viewed in the Z-axis direction. A gap d is formed between the inner surface of the opening 35b and the outer side surfaces of the blocks 40. A suction groove 35c for suctioning the back surface 120b of the dicing sheet 120 is formed on the mounting surface 35a around the opening 35b. The suction groove 35c is provided, for example, so as to surround the opening 35b. The suction groove 35c is connected to a suction hole connected to a vacuum pump. The air in the suction groove 35c is sucked out through the suction hole, so that the back surface 120b of the dicing sheet 120 around the semiconductor chip 101 is suctioned to the suction groove 35c.

[0034] The peeling mechanism 36 further includes a drive unit 50 that reciprocates each of the multiple blocks 40 in the Z-axis direction independently. The drive unit 50 receives a control signal provided from the controller unit 20 and moves each of the blocks 40 in the Z-axis direction.

[0035] 2, the multiple blocks 40 include, for example, a first block 41, a second block 42, a third block 43, and a fourth block 44. The first block 41 is the outermost block arranged on the outermost side. In other words, the first block 41 is arranged at a position farthest from the central axis L. The first block 41 has, for example, a rectangular cylindrical shape extending along the Z-axis direction.

[0036] As shown in FIG. 3, the first block 41 includes, for example, a tip surface 41a and four outer side surfaces 41b, 41c, 41d, and 41e. The tip surface 41a is located at the upper end (tip) of the first block 41 in the Z-axis direction. When the first block 41 pushes up the semiconductor chip 101, the tip surface 41a abuts against the back surface 120b of the dicing sheet 120 in the Z-axis direction. The tip surface 41a is, for example, a flat surface intersecting the Z-axis direction and extending along the X-axis direction and the Y-axis direction. The tip surface 41a has, for example, a rectangular ring shape when viewed in the Z-axis direction. The four outer side surfaces 41b, 41c, 41d, and 41e extend from the tip surface 41a along the Z-axis direction. The two outer side surfaces 41b and 41c are aligned in the Y-axis direction and extend along the X-axis direction and the Z-axis direction. The other two outer sides 41d and 41e are aligned in the X-axis direction and extend along the Y-axis and Z-axis directions.

[0037] As shown in FIG. 4, the rectangular tip surface 41a includes four corners A11, A12, A13, and A14 and four sides B11, B12, B13, and B14. The four corners A11, A12, A13, and A14 of the tip surface 41a correspond to the vicinity of the four corners of the semiconductor chip 101 and push up the vicinity of the four corners. The side B11 connects two corners A11 and A12 adjacent to each other in the X-axis direction on one side of the tip surface 41a in the Y-axis direction. The side B11 is connected to the outer side 41b. The side B13 connects two corners A13 and A14 adjacent to each other in the X-axis direction on the other side of the tip surface 41a in the Y-axis direction. The outer side 41c is connected to the side B13. Side B12 connects two corners A12, A13 adjacent to each other in the Y-axis direction on one side of the tip surface 41a in the X-axis direction. An outer surface 41d is connected to side B12. Side B14 connects two corners A11, A14 adjacent to each other in the X-axis direction on the other side of the tip surface 41a in the X-axis direction. An outer surface 41e is connected to side B14.

[0038] The four outer side surfaces 41b, 41c, 41d, and 41e are respectively formed with recesses C1b, C1c, C1d, and C1e. The recess C1b formed on the outer side surface 41b extends, for example, linearly along the Z-axis direction from the center in the X-axis direction of the side portion B11 of the tip surface 41a. The recess C1b extends, for example, along the Z-axis direction from the center of the side portion B11 to a position a predetermined distance away in the Z-axis direction (see FIG. 3). The recess C1b has, for example, a V-shape expanding toward the outer side surface 41b when viewed in the Z-axis direction. The recess C1c formed on the outer side surface 41c is formed, for example, symmetrically to the recess C1b formed on the outer side surface 41b with respect to the central axis L. Therefore, the recess C1c extends linearly along the Z-axis direction from the center in the X-axis direction of the side portion B13 of the tip surface 41a to a position a predetermined distance away in the Z-axis direction in response to the recess C1b. The recess C1c has, for example, a V-shape widening toward the outer surface 41c when viewed in the Z-axis direction.

[0039] The recess C1d formed on the outer side surface 41d extends linearly along the Z-axis direction from the center of the side B12 of the tip surface 41a in the Y-axis direction to a position a predetermined distance away in the Z-axis direction. The recess C1d has a V-shape that widens toward the outer side surface 41d when viewed in the Z-axis direction. The recess C1e formed on the outer side surface 41e is formed symmetrically with the recess C1d formed on the outer side surface 41d, for example, with respect to the central axis L. Therefore, the recess C1e extends linearly along the Z-axis direction from the center of the side B14 of the tip surface 41a in the X-axis direction to a position a predetermined distance away in the Z-axis direction in response to the recess C1d. The recess C1e has a V-shape that widens toward the outer side surface 41e when viewed in the Z-axis direction, for example.

[0040] 4, the outline of the semiconductor chip 101 is indicated by a two-dot chain line, and the edge of the opening 35b of the stage 35 is indicated by a dashed line. As described above, the dicing sheet 120 around the opening 35b is attracted by the suction grooves 35c. As a result, when the semiconductor chip 101 is peeled off by the peeling mechanism 36, a large tension F acts on the dicing sheet 120 between the edge of the opening 35b and the semiconductor chip 101 in a direction from the central axis L toward the periphery.

[0041] The recess C1c has a symmetrical configuration to the recess C1b, and the recess C1e has a symmetrical configuration to the recess C1d. Therefore, in the following, the configuration of the recess C1b will be described in more detail as a representative of the recesses C1b and C1c, and the configuration of the recess C1d will be described in more detail as a representative of the recesses C1d and C1e. First, the configuration of the recess C1b will be described in more detail with reference to FIG. 5.

[0042] As shown in FIG. 5, the recess C1b includes, for example, a bottom surface S11 (bottom) and a pair of side surfaces S12 and S13. The bottom surface S11 is a flat surface recessed from the outer surface 41b in the Y-axis direction. The bottom surface S11 extends along the X-axis direction and the Z-axis direction. The bottom surface S11 extends, for example, parallel to the outer surface 41b. The bottom surface S11 extends, for example, from the center of the side portion B11 in the X-axis direction along the Z-axis direction. That is, when the tip surface 41a is viewed in the Z-axis direction, if a reference axis L1 is defined that passes through the center of the side portion B11 in the X-axis direction and extends along the Y-axis direction, the bottom surface S11 is disposed at a position that intersects with the reference axis L1. The reference axis L1 intersects, for example, with the center of the bottom surface S11 in the X-axis direction. A distance D11 in the Y-axis direction between the bottom surface S11 and the edge of the opening 35b is longer than, for example, a distance D12 between the corner A12 and the corner of the opening 35b.

[0043] The pair of side surfaces S12, S13 connect the bottom surface S11 and the outer surface 41b. The distance between the pair of side surfaces S12, S13 in the X-axis direction increases as the distance approaches from the bottom surface S11 to the outer surface 41b. In other words, the pair of side surfaces S12, S13 extend in a direction inclined with respect to a plane perpendicular to the outer surface 41b so as to move away from each other in the direction opposite to the facing direction. When the tip surface 41a is viewed in the Z-axis direction, the pair of side surfaces S12, S13 are inclined with respect to both the X-axis direction and the Y-axis direction.

[0044] The pair of side surfaces S12, S13 are formed, for example, symmetrically with respect to a reference axis L1 passing through the center of the bottom surface S11. The distance in the X-axis direction between the side surface S12 and the reference axis L1 increases as the distance from the bottom surface S11 to the outer surface 41b increases, and similarly, the distance in the X-axis direction between the side surface S13 and the reference axis L1 increases as the distance from the bottom surface S11 to the outer surface 41b increases. At each position along the Y-axis direction, the distance in the X-axis direction between the side surface S13 and the reference axis L1 is equal to the distance in the X-axis direction between the side surface S12 and the reference axis L1.

[0045] In this embodiment, the recess C1b is formed in the center of the outer side surface 41b in the X-axis direction, and is not formed at both ends of the outer side surface 41b in the X-axis direction. Both ends of the outer side surface 41b in the X-axis direction are connected to both ends P11a, P11b of the side portion B11. One end P11a of the side portion B11 is a straight line connecting the corner A11 and one side surface S12 of the recess C1b in the X-axis direction. The other end P11b of the side portion B11 is a straight line connecting the corner A12 and the other side surface S13 of the recess C1b in the X-axis direction.

[0046] Next, the configuration of the recess C1d will be described in more detail with reference to FIG. 6. As shown in FIG. 6, the recess C1d includes, for example, a bottom surface S21 (bottom) and a pair of side surfaces S22, S23. The bottom surface S21 is a flat surface recessed in the X-axis direction from the outer surface 41b. The bottom surface S21 extends along the Y-axis direction and the Z-axis direction. The bottom surface S21 extends, for example, parallel to the outer surface 41d. The bottom surface S21 extends, for example, from the center of the side portion B12 in the Y-axis direction along the Z-axis direction. That is, when the tip surface 41a is viewed in the Z-axis direction, if a reference axis L2 is defined that passes through the center of the side portion B12 in the Y-axis direction and extends along the X-axis direction, the bottom surface S21 is disposed at a position that intersects with the reference axis L2. The reference axis L2 intersects, for example, with the center of the bottom surface S21 in the Y-axis direction. A distance D13 in the Y-axis direction between the bottom surface S21 and the edge of the opening 35b is longer than, for example, a distance D12 between the corner A12 and the corner of the opening 35b.

[0047] The pair of side surfaces S22, S23 connect the bottom surface S21 and the outer surface 41d. The distance between the pair of side surfaces S22, S23 in the X-axis direction increases as the distance approaches from the bottom surface S21 to the outer surface 41d. In other words, the pair of side surfaces S22, S23 extend in a direction inclined with respect to a plane perpendicular to the outer surface 41d so as to move away from each other in the direction opposite to the facing direction. When the tip surface 41a is viewed in the Z-axis direction, the pair of side surfaces S22, S23 are inclined with respect to both the X-axis direction and the Y-axis direction.

[0048] The pair of side surfaces S22, S23 are formed symmetrically with respect to a reference axis L2 passing through the center of the bottom surface S21. The distance in the Y-axis direction between the side surface S22 and the reference axis L2 increases as the surface approaches the outer surface 41d from the bottom surface S21. Similarly, the distance in the Y-axis direction between the side surface S23 and the reference axis L2 increases as the surface approaches the outer surface 41d from the bottom surface S21. At each position along the X-axis direction, the distance in the Y-axis direction between the side surface S23 and the reference axis L2 is equal to the distance in the Y-axis direction between the side surface S22 and the reference axis L2.

[0049] In this embodiment, the recess C1d is formed in the center of the outer side surface 41d in the Y-axis direction, and is not formed at both ends of the outer side surface 41d in the Y-axis direction. Both ends of the outer side surface 41d in the Y-axis direction are connected to both ends P12a, P12b of the side portion B12. One end P12a of the side portion B12 is a straight line connecting the corner A12 and one side surface S22 of the recess C1d in the Y-axis direction. The other end P12b of the side portion B12 is a straight line connecting the corner A13 and the other side surface S23 of the recess C1d in the Y-axis direction.

[0050] Referring again to Fig. 3, the second block 42 is disposed inside the first block 41. In other words, the second block 42 is surrounded by the first block 41. The second block 42 has a rectangular tubular shape extending along the Z-axis direction, similar to the first block 41. The second block 42 includes, for example, a tip surface 42a and four outer surfaces 42b, 42c, 42d, and 42e.

[0051] The tip surface 42a is located at the upper end (tip) of the second block 42 in the Z-axis direction. When the second block 42 pushes up the semiconductor chip 101, the tip surface 42a abuts against the rear surface 120b of the dicing sheet 120 in the Z-axis direction. The tip surface 42a is, for example, a flat surface intersecting the Z-axis direction and extending along the X-axis direction and the Y-axis direction. The tip surface 42a has, for example, a rectangular ring shape when viewed in the Z-axis direction. The four outer side surfaces 42b, 42c, 42d, and 42e extend from the tip surface 42a along the Z-axis direction. The two outer side surfaces 42b and 42c are aligned in the Y-axis direction and extend along the X-axis direction and the Z-axis direction. The other two outer side surfaces 42d and 42e are aligned in the X-axis direction and extend along the Y-axis direction and the Z-axis direction.

[0052] The four outer surfaces 42b, 42c, 42d, and 42e are formed with recesses C2b, C2c, C2d, and C2e, respectively. The recesses C2b, C2c, C2d, and C2e have the same configurations as the recesses C1b, C1c, C1d, and C1e of the first block 41 described above. Therefore, the recesses C2b, C2c, C2d, and C2e can be described in the same manner as the recesses C1b, C1c, C1d, and C1e, respectively, and therefore detailed description of the recesses C2b, C2c, C2d, and C2e will be omitted.

[0053] The third block 43 is disposed inside the second block 42. That is, the third block 43 is surrounded by the second block 42. The third block 43 has a rectangular tubular shape extending along the Z-axis direction, similar to the second block 42. The third block 43 includes, for example, a tip surface 43a and four outer side surfaces 43b, 43c, 43d, and 43e.

[0054] The tip surface 43a is located at the upper end (tip) of the third block 43 in the Z-axis direction. When the third block 43 pushes up the semiconductor chip 101, the tip surface 43a abuts against the rear surface 120b of the dicing sheet 120 in the Z-axis direction. The tip surface 43a is, for example, a flat surface intersecting the Z-axis direction and extending along the X-axis direction and the Y-axis direction. The tip surface 43a has, for example, a rectangular ring shape when viewed in the Z-axis direction. The four outer side surfaces 43b, 43c, 43d, and 43e extend from the tip surface 43a along the Z-axis direction. The two outer side surfaces 43b and 43c are aligned in the Y-axis direction and extend along the X-axis direction and the Z-axis direction. The other two outer side surfaces 43d and 43e are aligned in the X-axis direction and extend along the Y-axis direction and the Z-axis direction.

[0055] The four outer surfaces 43b, 43c, 43d, and 43e are formed with recesses C3b, C3c, C3d, and C3e, respectively. The recesses C3b, C3c, C3d, and C3e have configurations corresponding to the recesses C1b, C1c, C1d, and C1e of the first block 41 described above. Therefore, the recesses C3b, C3c, C3d, and C3e can be described in the same manner as the recesses C1b, C1c, C1d, and C1e, respectively, and therefore detailed description of the recesses C3b, C3c, C3d, and C3e will be omitted.

[0056] The fourth block 44 is disposed inside the third block 43. That is, the fourth block 44 is surrounded by the third block 43. The fourth block 44 is the innermost block disposed on the innermost side. That is, the fourth block 44 is disposed at a position closest to the central axis L. The fourth block 44 is disposed on the central axis L. The fourth block 44 has, for example, a rectangular columnar shape extending along the Z-axis direction with the central axis L as the center. The fourth block 44 includes, for example, a tip surface 44a and four outer surfaces 44b, 44c, 44d, and 44e.

[0057] The tip surface 44a is located at the upper end (tip) of the fourth block 44 in the Z-axis direction. When the fourth block 44 pushes up the semiconductor chip 101, the tip surface 44a abuts against the rear surface 120b of the dicing sheet 120 in the Z-axis direction. The tip surface 44a is, for example, a flat surface intersecting the Z-axis direction and extending along the X-axis direction and the Y-axis direction. The tip surface 44a has, for example, a rectangular ring shape when viewed in the Z-axis direction. The four outer side surfaces 44b, 44c, 44d, and 44e extend from the tip surface 44a along the Z-axis direction. The two outer side surfaces 44b and 44c are aligned in the Y-axis direction and extend along the X-axis direction and the Z-axis direction. The other two outer side surfaces 44d and 44e are aligned in the X-axis direction and extend along the Y-axis direction and the Z-axis direction.

[0058] The two outer surfaces 44b, 44c are respectively formed with recesses C4b, C4c. The recesses C4b, C4c have configurations corresponding to the recesses C1b, C1c of the first block 41 described above. Therefore, the recesses C4b, C4c can be described similarly to the recesses C1b, C1c, respectively, and therefore detailed description of the recesses C4b, C4c will be omitted. Note that the other two outer surfaces 44d, 44e may be formed with recesses corresponding to the recesses C1d, C1e, respectively.

[0059] As described above, the first block 41, the second block 42, the third block 43, and the fourth block 44 are configured to be independently movable back and forth along the Z-axis direction. In the following description, when the first block 41, the second block 42, the third block 43, and the fourth block 44 are not to be distinguished from one another, they will each be referred to simply as "block 40."

[0060] 2, the peeling mechanism 36 switches between a state in which the block 40 is in a standby position P1 and a state in which the block 40 is in a push-up position P2. This switching of states is performed by the operation of the drive unit 50 based on a control signal provided from the controller unit 20.

[0061] The state where the block 40 is in the standby position P1 refers to a state where the tip of the block 40 (specifically, tip faces 41a, 42a, 43a, 44a) is flush with the mounting surface 35a of the stage 35, or a state where the tip of the block 40 is located below the mounting surface 35a. When the block 40 is in the standby position, the semiconductor chip 101 maintains a state where it is placed on the mounting surface 35a. On the other hand, the state where the block 40 is in the push-up position P2 refers to a state where the tip of the block 40 is located above the mounting surface 35a of the stage 35. In this state, the tip of the block 40 presses the back surface 120b of the dicing sheet 120 to push up the semiconductor chip 101.

[0062] Hereinafter, the pick-up operation of the semiconductor chip 101 by the pick-up unit 30 will be described with reference to Fig. 7(a), Fig. 7(b), and Fig. 7(c). Also, the pick-up method according to the present embodiment will be described. The pick-up method according to the present embodiment is performed using the pick-up unit 30.

[0063] 7(a), first, the controller unit 20 moves the semiconductor chip 101 to be picked up directly above the peeling mechanism 36. Then, the controller unit 20 moves all the blocks 40 in the positive Z-axis direction from the standby position P1 to the push-up position P2. As a result, the first block 41, the second block 42, the third block 43, and the fourth block 44 rise from the standby position P1 to the push-up position P2.

[0064] By this operation, the first block 41, the second block 42, the third block 43, and the fourth block 44 press the rear surface 120b of the dicing sheet 120 to push up the semiconductor chip 101. As a result, the semiconductor chip 101 approaches the pick-up head 33. Next, the controller unit 20 moves the collet 37 in the negative Z-axis direction. Then, the controller unit 20 activates the suction mechanism. As a result, the pick-up head 33 suctions the semiconductor chip 101.

[0065] 7B, the controller unit 20 moves some of the blocks 40 in the negative Z-axis direction from the push-up position P2 to the standby position P1. For example, the controller unit 20 skips the second block 42 and simultaneously moves the first block 41 and the third block 43 from the push-up position P2 to the standby position P1. As a result, while the second block 42 and the fourth block 44 are maintained at the push-up position P2, the first block 41 and the third block 43 simultaneously move down from the push-up position P2 to the standby position P1.

[0066] Next, as shown in FIG. 7(c), the controller unit 20 moves the remaining blocks 40 from the push-up position P2 to the standby position P1 in the negative Z-axis direction. For example, the controller unit 20 simultaneously moves the second block 42 and the third block 43, which have been maintained at the push-up position P2, from the push-up position P2 to the standby position P1. As a result, the first block 41, the second block 42, the third block 43, and the fourth block 44 all return to the standby position P1. In addition, the controller unit 20 moves the collet 37 in the positive Z-axis direction. Through the above operations, the semiconductor chip 101 is peeled off from the surface 120a of the dicing sheet 120, and the semiconductor chip 101 is picked up by the pick-up head 33.

[0067] Thereafter, the controller unit 20 moves the pickup head 33 toward the intermediate stage 60 (see FIG. 1). In parallel with this operation, the controller unit 20 moves the bonding head 13 toward the intermediate stage 60. Then, the semiconductor chip 101 is delivered from the intermediate stage 60 to the bonding head 13, and the bonding head 13 bonds the semiconductor chip 101 to the substrate 110.

[0068] The effects of the pick-up unit 30, the mounting device 1, and the pick-up method explained above will be explained together with problems of the comparative example.

[0069] 9 includes, for example, blocks 241, 242, 243, and 244. Each of the blocks 241, 242, 243, and 244 has four flat side surfaces. The blocks 240 differ from the present embodiment in that the four side surfaces of each of the blocks 241, 242, 243, and 244 do not have a configuration corresponding to the recessed portion according to the present embodiment.

[0070] Fig. 10 shows the results of a simulation showing the distribution of stress acting on dicing sheet 120 around semiconductor chip 101 when block 240 presses dicing sheet 120 to push up semiconductor chip 101. In Fig. 10, the magnitude of stress around semiconductor chip 101 is represented by the degree of dot density. That is, the higher the dot density, the greater the stress, and the lower the dot density, the smaller the stress.

[0071] When the block 240 pushes up the semiconductor chip 101, a tension F (see FIG. 4) in the pulling direction is applied to the dicing sheet 120 to which the semiconductor chip 101 is attached. When the semiconductor chip 101 is peeled off from the dicing sheet 120 under such tension F, the corners of the semiconductor chip 101 tend to become the starting points of peeling, and stress concentration due to the tension F tends to occur at the corners. As shown in FIG. 10, it can be seen that large stress acts on the portions P101a, P101b, and P101c corresponding to the corners of the semiconductor chip 101. If such stress acts on the semiconductor chip 101, there is a risk of problems such as damage to the semiconductor chip 101 occurring.

[0072] In contrast, in this embodiment, recesses C1b, C1c, C1d, and C1e are formed on the outer surfaces 41b, 41c, 41d, and 41e of the first block 41, respectively. Similarly, recesses C2b, C2c, C2d, and C2e are formed on the outer surfaces 42b, 42c, 42d, and 42e of the second block 42, respectively. Similarly, recesses C3b, C3c, C3d, and C3e are formed on the outer surfaces 43b, 43c, 43d, and 43e of the third block 43, respectively. Similarly, recesses C4b, C4c, C4d, and C4e are formed on the outer surfaces 44b, 44c, 44d, and 44e of the fourth block 44, respectively. In this case, peeling starting points are also easily formed near each recess, so that it is possible to suppress a situation in which a large stress is locally applied to the corners of the semiconductor chip 101.

[0073] Furthermore, when focusing on the recess C1b among these recesses, for example, the pair of side surfaces S12, S13 of the recess C1b extend in a direction inclined with respect to a plane perpendicular to the outer side surface 41b so as to move away from each other in the opposite direction from the opposing direction as they approach the outer side surface 41b from the bottom surface S11 when viewing the tip surface 41a in the Z-axis direction (see FIG. 5). In this case, unlike the case where the pair of side surfaces S12, S13 of the recess C1b extend along a plane perpendicular to the outer side surface 41b, the stress acting on the starting point of peeling formed in the recess C1b can be distributed to a tensile direction perpendicular to the outer side surface 41b and a direction perpendicular to the tensile direction. This makes it possible to suppress the stress in the tensile direction applied to the vicinity of the recess C1b when peeling the semiconductor chip 101 from the dicing sheet 120. The same explanation can be given for the other recesses.

[0074] FIG. 8 is a simulation result showing the distribution of stress acting on the dicing sheet 120 around the semiconductor chip 101 when the dicing sheet 120 is pressed by a plurality of blocks 40 to push up the semiconductor chip 101. In FIG. 8, the magnitude of stress around the semiconductor chip 101 is expressed by the degree of dot density. That is, the higher the dot density, the higher the stress, and the lower the dot density, the lower the stress. As shown in FIG. 8, it can be seen that the stress acting on the parts P101a, P101b, and P101c corresponding to each corner of the semiconductor chip 101 is smaller than the simulation result of FIG. 10 described above. In this way, in this embodiment, when the semiconductor chip 101 is peeled off from the dicing sheet 120, it is possible to suppress the situation in which a large stress acts locally on the semiconductor chip 101. This makes it possible to suppress the occurrence of defects such as damage to the semiconductor chip 101 caused by stress concentration.

[0075] As in this embodiment, the bottom surface S11 of the recess C1b may extend along the Z-axis direction from the center of the side B11. In this case, when the semiconductor chip 101 is peeled off from the front surface 120a of the dicing sheet 120, the semiconductor chip 101 can be peeled off continuously from the corners A11 and A12 toward the center of the side B11, so that the semiconductor chip 101 can be peeled off smoothly.

[0076] As in this embodiment, when the tip surface 41a is viewed in the Z-axis direction, the pair of side surfaces S12, S13 of the recess C1b may be arranged symmetrically with respect to a reference axis L1 that passes through the center of the bottom surface S11 and is perpendicular to the outer surface 41b. In this case, the stress acting near the recess C1b can be evenly distributed, so that it is possible to effectively prevent a situation in which a large stress acts locally on the semiconductor chip 101. As a result, it is possible to effectively prevent the occurrence of defects such as damage to the semiconductor chip 101 caused by stress concentration.

[0077] As in this embodiment, after the first block 41, the second block 42, and the third block 43 move from the standby position P1 to the push-up position P2 to push up the semiconductor chip 101, the first block 41 and the third block 43 may simultaneously move from the push-up position P2 to the standby position P1 while the second block 42 is maintained at the push-up position P2, and then the second block 42 may move from the push-up position P2 to the standby position P1. In this manner, when the first block 41, the second block 42, and the third block 43 are moved to the push-up position P2 and then the first block 41 and the third block 43 are moved to the standby position P1 simultaneously, the peeling time of the semiconductor chip 101 by the push-up operation can be shortened compared to the case where the first block 41, the second block 42, and the third block 43 are moved to the standby position P1 in order. Furthermore, by skipping the second block 42 and moving the first block 41 and the third block 43 to the standby position P1 at the same time, more starting points for peeling of the semiconductor chip 101 can be formed compared to the case where the adjacent first block 41 and second block 42 are moved to the standby position P1 at the same time, and therefore it is possible to effectively prevent a situation in which a large stress acts locally on the semiconductor chip 101. As a result, it is possible to effectively prevent the occurrence of defects such as damage to the semiconductor chip 101 caused by stress concentration.

[0078] The present invention has been described in detail above based on the embodiments. However, the present invention is not limited to the above embodiments. The present invention can be modified in various ways without departing from the spirit and scope of the present invention.

[0079] For example, in the above embodiment, the peeling mechanism 36 includes four blocks 40. However, the number of blocks is not limited, and two, three, five or more blocks may be used. The shape of the blocks does not necessarily have to be a rectangular tube or a rectangular column, and may be another shape. In the above embodiment, the case where recesses are formed in all of the four blocks 40 has been described. However, recesses may be formed in any of the four blocks 40. In addition, recesses do not have to be formed on all four outer surfaces of one block 40, and recesses may be formed in any of the four outer surfaces.

[0080] The present disclosure includes the following configurations.

[0081] The present disclosure relates to a pickup unit that picks up a chip component attached to a surface of a sheet from the surface of the sheet, a stage including a mounting surface on which the chip components are mounted via the sheet and adapted to adsorb the rear surface of the sheet; a peeling mechanism including a plurality of blocks concentrically arranged inside an opening formed on the mounting surface, the plurality of blocks being movable back and forth along a normal direction of the mounting surface, the plurality of blocks protruding from the opening to peel the chip components from the surface of the sheet; a chip holding section that picks up the chip component from the front surface of the sheet by suction and holding the chip component; Equipped with Each of the plurality of blocks includes a leading end surface facing the back surface of the sheet in the normal direction, and an outer side surface extending from the leading end surface along the normal direction, a recess is formed in the outer side surface of at least one of the plurality of blocks, the recess extending along the normal direction from a side portion connecting adjacent corner portions of the tip surface, The recess includes a bottom portion recessed from the outer surface and a pair of side surfaces connecting the bottom portion and the outer surface, The pair of side surfaces extend in a direction inclined with respect to a plane perpendicular to the outer surface so as to move away from each other in a direction opposite to the opposing direction as the pair of side surfaces approaches the outer surface from the bottom when the tip surface is viewed in the normal direction.

[0082] The disclosure states, [2] "The plurality of blocks includes an outermost block located at the outermost side inside the opening, The pickup unit according to the above-mentioned [1], wherein the recess is formed on the outer surface of at least the outermost block among the plurality of blocks.

[0083] The present disclosure is [3] "The pickup unit described in [1] above, wherein the recess is formed on the outer surface of each of the plurality of blocks."

[0084] The present disclosure further provides, [4] "each of the plurality of blocks includes a plurality of outer surfaces extending from the tip surface along the normal direction, The pickup unit according to any one of the above-mentioned [1] to [3], wherein the recess is formed on each of the plurality of outer surfaces."

[0085] The present disclosure is [5] "The pickup unit according to any one of the above [1] to [4], wherein the bottom of the recess extends from the center of the side along the normal direction."

[0086] The present disclosure is [6] "a pickup unit described in any of [1] to [5] above, wherein, when the tip surface is viewed in the normal direction, the pair of side surfaces of the recess are arranged symmetrically with respect to a reference axis that passes through the center of the bottom and is perpendicular to the outer surface."

[0087] The disclosure states, [7] "The plurality of blocks are a first block disposed on the outermost side within the opening; A second block disposed on the inner side of the first block; a third block disposed on the inner side of the second block; Including, each of the first block, the second block, and the third block is configured to reciprocate between a standby position in which the tip surface does not protrude beyond the placement surface and a push-up position in which the tip surface protrudes beyond the placement surface and pushes up the chip component; The pickup unit according to any one of the above [1] to [6], wherein after the first block, the second block, and the third block move from the standby position to the push-up position to push up the chip component, the first block and the third block move simultaneously from the push-up position to the standby position while the second block is maintained at the push-up position, and thereafter the second block moves from the push-up position to the standby position."

[0088] The present disclosure relates to a pickup unit according to any one of the above items [1] to [7], a bonding unit that bonds the chip component picked up by the pickup unit to a substrate; "A mounting device comprising:

[0089] The present disclosure relates to a pickup method implemented by using the pickup unit according to any one of the above items [1] to [7], a step of pushing up the chip component by moving a first block, which is disposed on the outermost side inside the opening, a second block, which is disposed on the inner side than the first block, and a third block, which is disposed on the inner side than the second block, among the plurality of blocks, from a waiting position in which the tip surfaces do not protrude beyond the placement surface to a push-up position in which the tip surfaces protrude beyond the placement surface; a step of simultaneously moving the first block and the third block from the push-up position to the standby position while maintaining the second block at the push-up position; a step of peeling off the chip component from the front surface of the sheet by moving the second block from the lifting position to the standby position; "Including the pick-up method." [Explanation of symbols]

[0090] 1...mounting device, 10...bonding unit, 30...pickup unit, 35...stage, 35a...mounting surface, 35b...opening, 36...peeling mechanism, 37...collet (chip holding part), 40...block, 41...first block, 41a, 42a, 43a, 44a...tip surface, 41b, 41c, 41d, 41e, 42b, 42c, 42d, 42e, 43b, 43c, 43d, 43e, 44b, 44c, 44d, 44e...outer surface, 4 2...second block, 43...third block, 110...substrate, 120a...front surface, 120b...rear surface, B11, B12, B13, B14...side portions, C1b, C1c, C1d, C1e, C2b, C2c, C2d, C2e, C3b, C3c, C3d, C3e, C4b, C4c, C4d, C4e...recesses, L1, L2...reference axis, P1...waiting position, P2...push-up position, S11, S21...bottom surface (bottom portion), S12, S13, S22, S23...side portions.

Claims

1. A pickup unit that picks up chip components attached to a surface of a sheet from the surface of the sheet, a stage including a mounting surface on which the chip components are mounted via the sheet and adapted to adsorb the rear surface of the sheet; a peeling mechanism including a plurality of blocks concentrically arranged inside an opening formed on the mounting surface, the plurality of blocks being movable back and forth along a normal direction of the mounting surface, the plurality of blocks protruding from the opening to peel the chip components from the surface of the sheet; a chip holding section that picks up the chip component from the front surface of the sheet by suction and holding the chip component; Equipped with Each of the plurality of blocks includes a leading end surface facing the back surface of the sheet in the normal direction, and an outer side surface extending from the leading end surface along the normal direction, a recess is formed in the outer side surface of at least one of the plurality of blocks, the recess extending along the normal direction from a side portion connecting adjacent corner portions of the tip surface, The recess includes a bottom portion recessed from the outer surface and a pair of side surfaces connecting the bottom portion and the outer surface, A pickup unit, wherein the pair of side surfaces extend in a direction inclined with respect to a plane perpendicular to the outer surface so that, when the tip surface is viewed in the normal direction, the side surfaces move away from each other in a direction opposite to the opposing direction as they approach the outer surface from the bottom.

2. the plurality of blocks includes an outermost block located at the outermost side inside the opening, The pickup unit according to claim 1 , wherein the recess is formed in the outer surface of at least the outermost block of the plurality of blocks.

3. The pickup unit according to claim 1 , wherein the recess is formed in the outer surface of each of the plurality of blocks.

4. Each of the plurality of blocks includes a plurality of the outer side surfaces extending from the tip surface along the normal direction, The pickup unit according to claim 1 , wherein the recess is formed in each of the plurality of outer surfaces.

5. The pickup unit according to claim 1 , wherein the bottom of the recess extends from a center of the side along the normal direction.

6. The pickup unit according to claim 1 , wherein when the tip surface is viewed in the normal direction, the pair of side surfaces of the recess are arranged symmetrically with respect to a reference axis that passes through the center of the bottom portion and is perpendicular to the outer surface.

7. The plurality of blocks include: a first block disposed on the outermost side within the opening; A second block disposed on the inner side of the first block; a third block disposed on the inner side of the second block; Including, each of the first block, the second block, and the third block is configured to reciprocate between a standby position in which the tip surface does not protrude beyond the placement surface and a push-up position in which the tip surface protrudes beyond the placement surface and pushes up the chip component; 2. The pickup unit according to claim 1, wherein after the first block, the second block, and the third block push up the chip component by moving from the standby position to the push-up position, the first block and the third block simultaneously move from the push-up position to the standby position while maintaining the second block at the push-up position, and then the second block moves from the push-up position to the standby position.

8. A pickup unit according to any one of claims 1 to 7; a bonding unit that bonds the chip component picked up by the pickup unit to a substrate; A mounting device comprising:

9. A pick-up method carried out using a pick-up unit according to any one of claims 1 to 7, comprising the steps of: a step of pushing up the chip component by moving a first block, which is disposed on the outermost side inside the opening, a second block, which is disposed on the inner side than the first block, and a third block, which is disposed on the inner side than the second block, among the plurality of blocks, from a waiting position in which the tip surfaces do not protrude beyond the placement surface to a push-up position in which the tip surfaces protrude beyond the placement surface; a step of simultaneously moving the first block and the third block from the push-up position to the standby position while maintaining the second block at the push-up position; a step of peeling off the chip component from the front surface of the sheet by moving the second block from the lifting position to the standby position; Including, how to pick up.

Images