ACF attachment device and ACF attachment method

Abstract

To provide an ACF attachment device that can suppress reduction in productivity.SOLUTION: An ACF attachment device 10 includes: a tape supply unit 110 that supplies a tape 300; a pressing unit 120 that presses the tape 300 onto a substrate 400 to attach an ACF segment 310 to the substrate 400 in a state of being held by a separator 320; a peeling unit 130 that moves between the separator 320 and the substrate 400 in the longitudinal direction of the separator 320 to peel off the separator 320 from the ACF segment 310 attached to the substrate 400; an imaging unit 140 that is provided in the peeling unit 130 and images the ACF segment 310 attached to the substrate 400; and an inspection unit 220 that inspects the attachment state of the ACF segment 310 attached to the substrate 400 on the basis of the image data generated by imaging the ACF segment 310 attached to the substrate 400 by the imaging unit 140.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an ACF (Anisotropic Conductive Film) joining device and an ACF joining method for joining an ACF to a substrate. [Background technology]

[0002] Conventionally, there are devices that apply ACF (ACF pieces) as an adhesive material for bonding components to a substrate. There are also devices that inspect the application state of the ACF on a substrate based on an image (image data) generated by a camera capturing the state after the ACF is applied to the substrate by this type of device (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-200424 A Summary of the Invention [Problem to be solved by the invention]

[0004] The more ACFs are attached to a board, the more ACF inspection processes are required, and the more ACFs are attached to a board, the lower the productivity is when producing display panels and other products with components attached to the board.

[0005] The present invention provides an ACF application device and the like that can suppress a decrease in productivity. [Means for solving the problem]

[0006] An ACF application device according to one embodiment of the present invention comprises a tape supply unit that supplies a tape having an ACF section and a separator that holds the ACF section; a pressing unit that presses the tape against a substrate, thereby pasting the ACF section to the substrate while being held by the separator; a peeling unit that moves between the separator and the substrate in the longitudinal direction of the separator, thereby peeling the separator from the ACF section pasted to the substrate; an imaging unit provided in the peeling unit that images the ACF section pasted to the substrate; and an inspection unit that inspects the attachment state of the ACF section pasted to the substrate based on image data generated by the imaging unit imaging the ACF section pasted to the substrate.

[0007] Moreover, an ACF application method according to one embodiment of the present invention includes a tape supplying step in which a tape supplying unit supplies a tape having an ACF section and a separator that holds the ACF section; a pressing step in which a pressing unit presses the tape against a substrate, thereby attaching the ACF section to the substrate while being held by the separator; a peeling step in which a peeling unit moves between the separator and the substrate in the longitudinal direction of the separator, thereby peeling the separator from the ACF section attached to the substrate; an imaging step in which an imaging unit provided in the peeling unit images the ACF section attached to the substrate; and an inspection step in which an attachment state of the ACF section attached to the substrate is inspected based on image data generated by imaging the ACF section attached to the substrate in the imaging step. Effect of the Invention

[0008] According to the present invention, it is possible to provide an ACF application device and the like that can suppress a decrease in productivity. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a block diagram showing a functional configuration of an ACF joining device according to an embodiment. [Diagram 2]FIG. 2 is a front view showing an ACF joining work unit according to the embodiment. [Diagram 3] FIG. 3 is a flowchart showing a processing procedure of the ACF joining device according to the embodiment. [Figure 4] FIG. 4 is a diagram for explaining a specific processing procedure of the ACF joining device according to the embodiment. [Diagram 5] FIG. 5 is a diagram for explaining a specific processing procedure of the ACF joining device according to the embodiment. [Figure 6] FIG. 6 is a diagram for explaining a specific processing procedure of the ACF joining device according to the embodiment. [Figure 7] FIG. 7 is a diagram for explaining a specific processing procedure of the ACF joining device according to the embodiment. [Figure 8] FIG. 8 is a diagram for explaining a specific processing procedure of the ACF joining device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection of the components, steps and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims will be described as optional components.

[0011] In addition, each drawing is a schematic diagram and is not necessarily a precise illustration. In addition, in each drawing, the same components are denoted by the same reference numerals.

[0012] In this specification and the drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a right-handed three-dimensional Cartesian coordinate system. In the embodiments, the X-axis direction is the movement direction of the peeling section, and the Z-axis direction is the up-down direction of the ACF application device. In the embodiments described below, the Z-axis direction corresponds to the vertical direction. A side view means that the ACF application device is viewed along the Y-axis direction.

[0013] In addition, in this specification, ordinal numbers such as "first" and "second" do not refer to the number or order of components, unless otherwise specified, but are used for the purpose of avoiding confusion between and distinguishing between components of the same type.

[0014] (Embodiment) [composition] First, the configuration of an ACF joining device according to the embodiment will be described.

[0015] Fig. 1 is a block diagram showing a functional configuration of an ACF joining device 10 according to an embodiment of the present invention. Fig. 2 is a front view showing an ACF joining work unit 100 according to an embodiment of the present invention.

[0016] The ACF application device 10 is a device that applies an ACF piece 310 for bonding a component to a substrate 400. Specifically, the ACF application device 10 applies the ACF piece 310, which is a piece of the ACF layer of the tape 300, to the substrate 400 placed on a stage (not shown) by using a pressing unit 120.

[0017] The ACF bonding apparatus 10 is, for example, a part of a component mounting system for producing a display panel or the like. In this component mounting system, for example, the ACF bonding apparatus 10 bonds an ACF piece 310 to an electrode provided on a substrate 400, and a component pressure-bonding apparatus (not shown) thermocompresses the substrate 400 and a component via the ACF piece 310. The ACF bonding apparatus 10 bonds the ACF piece 310 to the substrate 400 that has been transported from an upstream apparatus by a transport unit (not shown), for example. The substrate 400 to which the ACF piece 310 has been attached is transported by the transport unit, for example, to a component pressure-bonding apparatus located downstream of the ACF bonding apparatus 10.

[0018] Tape 300 has an ACF layer and separator 320. The ACF layer is a layer made of tape-shaped ACF. The ACF layer is cut by cutter 114 to be divided into a plurality of ACF pieces 310. Separator 320 is a tape-shaped film made of a resin such as polyethylene terephthalate.

[0019] The ACF application device 10 cuts (half-cuts) the ACF layer of the tape 300 to a predetermined size by the cutter 114 so that the ACF layer remains held by the separator 320, thereby forming an ACF piece 310. Furthermore, the ACF application device 10 peels the ACF piece 310 from the separator 320 by sandwiching and moving the separator 320 with two peeling pins of the peeling unit 130. Furthermore, the ACF application device 10 adjusts the position of the substrate 400 placed on a stage (not shown), and uses the pressing unit 120 to apply the ACF piece 310 cut to the predetermined size to the substrate 400.

[0020] An example of the substrate 400 is a film-like flexible substrate made of resin, etc. The substrate 400 may be a rigid substrate such as a glass substrate.

[0021] Examples of components that can be attached to the substrate 400 via the ACF piece 310 include electronic components such as an integrated circuit (IC), a tape carrier package (TCP), and flexible printed circuits (FPC).

[0022] The ACF application device 10 includes an ACF application work unit 100 and a control device 200.

[0023] The ACF attachment work unit 100 is a mechanism that attaches an ACF piece 310 to a substrate 400 carried in from upstream and transports it downstream. For example, the ACF attachment work unit 100 performs a predetermined operation by controlling, by the control device 200, devices for driving various devices such as motors that are communicatively connected to the control device 200 wirelessly or via a control line.

[0024] The ACF application section 100 includes a tape supply section 110, a pressing section 120, a peeling section 130, an imaging section 140, a driving section 150, and a supporting section 160.

[0025] The tape supply unit 110 is a mechanism for supplying a tape 300 including an ACF piece 310 and a separator 320 for holding the ACF piece 310. Specifically, the tape supply unit 110 supplies the tape 300 above the substrate 400.

[0026] In this embodiment, the tape supply unit 110 includes a reel 111, a feed roller 112, a recovery unit 113, and a cutter 114.

[0027] Reel 111 is a reel that stores tape 300 and supplies the stored tape 300. One end of tape 300 is connected to collection unit 113, and collection unit 113 rotates to wind up tape 300 (more specifically, separator 320), thereby supplying tape 300 below pressing unit 120.

[0028] The feed roller 112 is a guide that is rotatably supported so that the tape 300 moves at a predetermined position. The feed roller 112 functions as a tape guide portion for guiding the tape 300 between the substrate 400 and the pressing portion 120.

[0029] The recovery unit 113 is a storage unit that is rotated by a motor (not shown) to wind up the tape 300 (more specifically, the separator 320). Specifically, the recovery unit 113 recovers the separator 320 peeled off from the ACF piece 310.

[0030] For example, the tape supply unit 110 guides the tape 300 arranged on the reel 111 from the reel 111, past above the attachment area of ​​the substrate 400 supported by the support unit 160, to the side of the recovery unit 113 located downstream of the reel 111, so that the ACF piece 310 faces the substrate 400.

[0031] Cutter 114 is a blade that cuts the ACF layer supported by separator 320 in tape 300. For example, cutter 114 cuts the ACF layer in tape 300 by driving a drive mechanism having a motor (not shown) by control device 200, thereby forming ACF section 310. Specifically, cutter 114 does not cut separator 320 in tape 300, but cuts the ACF layer in tape 300, that is, cuts half of tape 300 to form ACF section 310. As a result, ACF section 310 is cut to a predetermined size by cutter 114 and moved below pressing unit 120 and above supporting unit 160 (more specifically, substrate 400 supported by supporting unit 160) while being supported by separator 320.

[0032] The pressing unit 120 is a head that presses the ACF piece 310 onto the substrate 400. Specifically, the pressing unit 120 presses the tape 300 onto the substrate 400, thereby attaching the ACF piece 310 to the substrate 400 while the ACF piece 310 is held by the separator 320. More specifically, the pressing unit 120 presses the tape 300 onto the substrate 400 supported by the support unit 160 from the separator 320 side of the ACF piece 310 and the separator 320, thereby attaching the ACF piece 310 to the attachment area of ​​the substrate 400 while the ACF piece 310 is held by the separator 320. For example, the pressing unit 120 presses the ACF piece 310 onto the substrate 400 by a drive mechanism having a guide and a motor (not shown) driven by the control device 200 to move up and down.

[0033] The peeling unit 130 is a mechanism for peeling the ACF piece 310 from the separator 320. Specifically, the peeling unit 130 peels the separator 320 from the ACF piece 310 attached to the substrate 400 by moving between the separator 320 and the substrate 400 in the longitudinal direction of the separator 320. More specifically, the peeling unit 130 supports a second portion of the separator 320 located downstream of a first portion of the separator 320 holding the ACF piece 310 attached to the attachment region of the substrate 400 in a state separated from the substrate 400, and moves relatively upstream with respect to the substrate 400 supported by the support unit 160, thereby peeling the separator from the ACF piece 310 attached to the attachment region of the substrate 400.

[0034] The longitudinal direction of separator 320 refers to the longitudinal direction of separator 320 located directly above substrate 400, which is the X-axis direction in this embodiment.

[0035] For example, the peeling unit 130 includes two peeling pins and a support member that supports the two peeling pins. The peeling unit 130, for example, sandwiches the separator 320 and moves in the longitudinal direction of the separator 320 to peel the ACF piece 310 from the separator 320. Specifically, after the tape 300 is pressed against the substrate 400 by the pressing unit 120 to attach the ACF piece 310 to the substrate 400, the peeling unit 130 is moved by the driving unit 150 from the first position, which is the initial position, in the negative direction of the X-axis to the second position. As a result, the peeling pin lifts up the separator 320 in contact with the ACF piece 310 attached to the substrate 400 to peel it off from the ACF piece 310. The peeling unit 130 is also moved by the driving unit 150 from the second position in the positive direction of the X-axis to move to the first position. In this way, the peeling section 130 moves from the first position to the second position in the longitudinal direction of the separator 320 between the separator 320 and the substrate 400, peeling the separator 320 from the ACF piece 310 attached to the substrate 400, and then moves from the second position back to the first position.

[0036] The imaging unit 140 is a camera that captures an image of the ACF section 310 attached to the substrate 400. Specifically, the imaging unit 140 captures an image of the ACF section 310 attached to the substrate 400 placed on a stage (not shown) to generate an image including the ACF section 310, that is, image data showing the ACF section 310. In this embodiment, the imaging unit 140 captures an image of the substrate 400 supported by the support 160 from above.

[0037] Moreover, the imaging unit 140 is provided in the peeling unit 130. Specifically, the imaging unit 140 is provided in the peeling unit 130 so as to be able to capture an image of the ACF section 310 located below the imaging unit 140. In this embodiment, the imaging unit 140 is provided on the positive side of the X-axis of the peeling unit 130. In other words, the imaging unit 140 is attached to the first position side of the peeling unit 130 out of the first position and the second position.

[0038] For example, imaging unit 140 captures an image of ACF section 310 attached to substrate 400 when peeling unit 130 moves to peel separator 320 from ACF section 310 attached to substrate 400. Specifically, imaging unit 140 captures an image of ACF section 310 attached to the attachment region of substrate 400 that is exposed when separator 320 is peeled off, when peeling unit 130 moves relatively from downstream to upstream with respect to substrate 400.

[0039] Alternatively, for example, imaging unit 140 captures an image of ACF piece 310 attached to substrate 400 when peeling unit 130 moves from the second position to the first position. Specifically, imaging unit 140 captures an image of ACF piece 310 attached to the attachment region of substrate 400 and exposed by peeling off separator 320 when peeling unit 130 returns to the origin position after peeling off separator 320 from ACF piece 310 attached to the attachment region of substrate 400 by relatively moving upstream from a predetermined origin position (first position in this embodiment) provided downstream of the attachment region of substrate 400 supported by support unit 160.

[0040] Also, for example, the imaging section 140 captures an image of the entire ACF piece 310 attached to the substrate 400.

[0041] Depending on the field of view dimensions (imageable range) of imaging section 140, for example, imaging section 140 may not be able to image the entire ACF section 310 attached to substrate 400. In such a case, imaging section 140 may image each of one end and the other end of ACF section 310. For example, when imaging section 140 cannot image the entire ACF section 310 on substrate 400 and the distance between two adjacent ACF sections 310 on substrate 400 is larger than the field of view dimensions, image data including each end of two adjacent ACF sections 310 on substrate 400 is generated.

[0042] The driving unit 150 is a driving mechanism for moving the peeling unit 130. In this embodiment, the driving unit 150 moves the peeling unit 130 in the X-axis direction.

[0043] The support section 160 is a backup stage that supports the edge of the substrate 400 placed on a stage (not shown). Specifically, the support section 160 supports the substrate 400, which has an attachment area where the ACF piece 310 is attached, from below. The substrate 400 is held on the stage in a state where an electrode section is formed on the substrate 400 and the edge where the ACF piece 310 is attached does not overlap with the stage in a top view (i.e., the end of the substrate 400 protrudes from the stage). The support section 160 supports the end of the substrate 400 protruding from the stage from below. The edge of the substrate 400 is sandwiched together with the tape 300 by the pressing section 120 and the support section 160. In this way, the ACF piece 310 is attached to the substrate 400.

[0044] The control device 200 controls each of the components of the ACF pasting device 10. The control device 200 is a computer realized by, for example, a communication interface for communicating with each of the components of the ACF pasting device 10, a non-volatile memory in which a program is stored, a volatile memory which is a temporary storage area for executing the program, an input / output port for transmitting and receiving signals, a processor such as a CPU (Central Processing Unit) that executes the program, and the like.

[0045] The control device 200 includes an acquisition unit 210 , an inspection unit 220 , a control unit 230 , an output unit 240 , and a storage unit 250 .

[0046] The acquiring unit 210 is a processing unit that acquires various information necessary for the operation of the control device 200. The acquiring unit 210 acquires image data including the ACF piece 310 attached to the substrate 400 from the imaging unit 140, for example.

[0047] Inspection unit 220 is a processing unit that inspects the attachment state of ACF section 310 attached to substrate 400, based on image data generated by imaging unit 140 capturing an image of ACF section 310 attached to substrate 400 (specifically, ACF section 310 attached to an attachment area of ​​substrate 400). Specifically, inspection unit 220 judges whether the attachment state of ACF section 310 is good or bad, based on the image data obtained by imaging unit 140.

[0048] For example, inspection unit 220 inspects whether or not both ends of ACF section 310 have curling, chipping, or the like. For example, inspection unit 220 judges whether or not both ends of ACF section 310 have curling, chipping, or the like by whether or not both ends of ACF section 310 in image data are straight lines. For example, inspection unit 220 judges the attachment state of ACF section 310 as good if both ends of ACF section 310 have no curling, chipping, or the like, and judges the attachment state of ACF section 310 as bad if both ends of ACF section 310 have curling, chipping, or the like. Alternatively, inspection unit 220 may judge, for example, whether or not the length of the end of ACF section 310 (for example, the length of a side at a position adjacent to another ACF section 310 on substrate 400) is within a specified range (that is, whether it is within a specified range or outside a predetermined range) as the pass / fail judgment. For example, if the length of the end of ACF section 310 is within a specified range, inspection section 220 judges the attachment condition of ACF section 310 to be good, and if the length of the end of ACF section 310 is outside the specified range, inspection section 220 judges the attachment condition of ACF section 310 to be poor.

[0049] The inspection unit 220 may determine whether the attachment state of one end of the ACF piece 310 is good or bad. Alternatively, the inspection unit 220 may determine whether one end (also referred to as one end) of the ACF piece 310 is good or bad, and if it is determined to be good, may further determine whether the attachment state of the other end (also referred to as the other end) is good or bad.

[0050] Also, for example, the control device 200 may store appropriate image data for the inspection unit 220 to determine pass / fail, and determine the pass / fail of the ACF section 310 by comparing the appropriate image data with the image data generated by the imaging unit 140.

[0051] The control unit 230 is a processing unit that controls the operation and operation timing of each component included in the ACF pasting apparatus 10. For example, the control unit 230 controls the operation of the ACF pasting work unit 100 based on the inspection result of the inspection unit 220. For example, when the inspection unit 220 judges the board 400 to be good, the control unit 230 causes the board 400 to which the ACF piece 310 is pasted to be transported to a downstream device (e.g., a component mounting device) of the ACF pasting work unit 100. On the other hand, when the inspection unit 220 judges the board 400 to be bad, the control unit 230 causes the board 400 to which the ACF piece 310 is pasted in a pasted state judged to be bad to be discarded (for example, the control unit 230 moves the board 400 to another location without passing the board 400 to the downstream device).

[0052] The output unit 240 is a processing unit for outputting information of the control device 200 to the outside. For example, the output unit 240 outputs information indicating the control content of the ACF joining work unit 100 by the control unit 230 to the ACF joining work unit 100. Also, for example, the output unit 240 outputs the inspection result of the inspection unit 220. For example, the output unit 240 notifies the operator of the inspection result by image and / or sound by outputting the inspection result to a notification device such as a display and / or a speaker. When the inspection unit 220 judges the ACF piece 310 to be defective, the output unit 240 may output information indicating that the ACF joining work unit 100 should stop operating, and / or information indicating the substrate 400 to which the ACF piece 310 judged to be defective is attached, to a display device for display.

[0053] Processing units such as the acquisition unit 210, the inspection unit 220, the control unit 230, and the output unit 240 are realized by, for example, a processor and a control program stored in a memory or the like and executed by the processor.

[0054] Memory unit 250 is a storage device that stores various data indicating the size of substrate 400, the attachment position and attachment direction of ACF section 310, the operation of each component, the timing of the operation, the timing of transferring substrate 400 to a component crimping device or the like located downstream of ACF attachment work unit 100, a control program executed by the processing unit, appropriate information used by inspection unit 220 to determine the quality of the attachment state of ACF section 310, etc. Memory unit 250 is realized by, for example, a flash memory, an HDD (Hard Disk Drive), etc.

[0055] [Processing Procedure] Next, a processing procedure of the ACF joining device 10 according to the embodiment will be described in detail.

[0056] Fig. 3 is a flow chart showing the processing procedure of the ACF application device 10 according to the embodiment. Fig. 3 shows the processing procedure after the substrate 400 to which the ACF piece 310 has not been applied is transported to the ACF application work section 100 and the substrate 400 is supported by the support section 160. For example, the transport section receives the substrate 400 from upstream and places it on the stage, and the stage moves so that an end of the substrate 400 is supported by the support section 160.

[0057] First, the tape supply unit 110 supplies the tape 300 including the ACF piece 310 and the separator 320 that holds the ACF piece 310 (S10). Specifically, the tape supply unit 110 supplies the tape 300 onto the upper part of the substrate 400, the lower surface of which is supported by the support unit 160. In this embodiment, the tape supply unit 110 supplies the tape between the substrate 400 and the pressing unit 120.

[0058] The supply of tape 300 and the process of transporting substrate 400 so that substrate 400 is supported by supporting portion 160 may be performed either before or at the same time.

[0059] Next, the pressing unit 120 presses the tape 300 against the substrate 400, thereby attaching the ACF piece 310 to the substrate 400 while it is held by the separator 320 (S20).

[0060] Next, peeling unit 130 moves between separator 320 and substrate 400 in the longitudinal direction of separator 320, thereby peeling separator 320 from ACF piece 310 attached to substrate 400 (S30).

[0061] Next, the imaging section 140 captures an image of the ACF section 310 attached to the substrate 400 (S40). For example, the imaging section 140 captures an image of the ACF section 310 while the peeling section 130 is moving.

[0062] The imaging unit 140 may capture an image when it is positioned at a predetermined position, or may continue capturing images while moving. In other words, the imaging unit 140 may generate a still image (still image data) or a moving image (moving image data).

[0063] Furthermore, the imaging unit 140 may capture an image while the peeling unit 130 is moving from the first direction to the second direction, or may capture an image while the peeling unit 130 is moving from the second direction to the first direction. Furthermore, the peeling unit 130 may move or stop when the imaging unit 140 captures an image.

[0064] For example, the operations of steps S10 to S40 are performed by the control unit 230 controlling each device.

[0065] Next, the inspection unit 220 inspects the attachment state of the ACF piece 310 attached to the substrate 400 based on image data generated by the imaging unit 140 capturing an image of the ACF piece 310 attached to the substrate 400 (S50).

[0066] Next, the control device 200 executes a process according to the inspection result of the inspection unit 220 (S60). For example, if the inspection unit 220 judges the ACF section 310 to be good, the control unit 230 causes the substrate 400 to which the ACF section 310 is attached to be transported to a device downstream of the ACF attachment work unit 100. On the other hand, if the inspection unit 220 judges the ACF section 310 to be bad, the control unit 230 causes the substrate 400 to which the ACF section 310 is attached in a bad attached state, for example. Also, if the inspection unit 220 judges the ACF section 310 to be bad, the output unit 240 notifies the operator of the inspection result by outputting the inspection result of the inspection unit 220 to a notification device.

[0067] 4 to 8 are diagrams for explaining specific processing procedures of the ACF joining device 10 according to the embodiment. More specifically, Fig. 4 to Fig. 8 are front views of the ACF joining work unit 100 for explaining specific processing procedures of the operation of joining the ACF piece 310 to the substrate 400 executed by the ACF joining work unit 100 and the operation of capturing an image of the ACF piece 310 joined to the substrate 400.

[0068] First, for example, the transport section receives the substrate 400 from upstream and places it on the stage, and the stage moves so that the edge of the substrate 400 is supported by the support section 160 .

[0069] Furthermore, the tape supply unit 110 uses the recovery unit 113 and the cutter 114 to half-cut the tape 300 , and moves the ACF piece 310 to above the substrate 400 .

[0070] 4, the pressing unit 120 moves downward, thereby pressing the tape 300 against the substrate 400, so that the ACF piece 310 is attached to the substrate 400 while being held by the separator 320.

[0071] Next, as shown in FIG. 5, the pressing portion 120 moves upward.

[0072] 6, the peeling unit 130 moves from the first position in the negative direction of the X axis. Specifically, the driving unit 150 moves the peeling unit 130 in the negative direction of the X axis.

[0073] Next, as shown in FIG. 7, the imaging section 140 captures an image of the ACF piece 310 attached to the substrate 400.

[0074] 8, after the peeling unit 130 has moved to the second position, it moves in the positive direction of the X-axis. Specifically, the driving unit 150 moves the peeling unit 130 in the negative direction of the X-axis to the second position, and after the separator 320 has been peeled off from the ACF piece 310 attached to the substrate 400, it moves the peeling unit 130 in the positive direction of the X-axis to position it at the first position.

[0075] By repeating these processes, the ACF piece 310 is attached to the substrate 400.

[0076] Furthermore, the inspection section 220 inspects the quality of the ACF section 310 based on image data generated by the imaging section 140 capturing an image of the ACF section 310.

[0077] The timing of the inspection by the inspection unit 220 may be arbitrary. The inspection unit 220 may perform the inspection at the timing when the acquisition unit 210 acquires the image data output from the imaging unit 140, or may perform the inspection at the timing when the peeling unit 130 moves from the first position to the second position and then returns to the first position.

[0078] [Effects, etc.] Below, examples of technologies that can be obtained from the disclosure of this specification will be given, and effects and the like that can be obtained from the exemplified technologies will be described.

[0079] Technique 1 is an ACF application device 10 including: a tape supply unit 110 that supplies tape 300 having ACF slice 310 and separator 320 that holds ACF slice 310; a pressing unit 120 that presses tape 300 against substrate 400, thereby attaching ACF slice 310 to substrate 400 while being held by separator 320; a peeling unit 130 that moves between separator 320 and substrate 400 in the longitudinal direction of separator 320, thereby peeling separator 320 from ACF slice 310 attached to substrate 400; an imaging unit 140 provided in peeling unit 130 that images ACF slice 310 attached to substrate 400; and an inspection unit 220 that inspects the attachment state of ACF slice 310 attached to substrate 400 based on image data generated by imaging unit 140 imaging ACF slice 310 attached to substrate 400.

[0080] Conventionally, in inspecting the attachment state of the ACF section 310 attached to the substrate 400, for example, the ACF section 310 is attached to the substrate 400, the separator 320 is completely peeled off from the ACF section 310 attached to the substrate 400, and then the substrate 400 is transported to an inspection location, the ACF section 310 is imaged, and the attachment state of the ACF section 310 is inspected. On the other hand, according to the ACF attachment device 10, since the image pickup unit 140 is provided in the peeling unit 130, the ACF section 310 can be imaged without moving the substrate 400 to the inspection location. Therefore, the process for inspecting the attachment state of the ACF section 310 can be shortened compared to the conventional method. Therefore, according to the ACF attachment device 10, it is possible to suppress a decrease in productivity. In other words, it is possible to improve productivity.

[0081] Technology 2 is an ACF application device 10 described in Technology 1, in which the imaging unit 140 images the ACF section 310 attached to the substrate 400 when the peeling unit 130 moves to peel the separator 320 from the ACF section 310 attached to the substrate 400.

[0082] This allows imaging of the ACF piece 310 to be performed in parallel with the operation of the peeling unit 130 peeling the separator 320 from the ACF piece 310 attached to the substrate 400. This further reduces the decrease in productivity.

[0083] Technology 3 is the ACF application device 10 described in Technology 1, in which the peeling unit 130 moves from a first position to a second position between the separator 320 and the substrate 400 in the longitudinal direction of the separator 320 to peel the separator 320 from the ACF section 310 attached to the substrate 400, and then moves from the second position back to the first position, and the imaging unit 140 images the ACF section 310 attached to the substrate 400 as the peeling unit 130 moves from the second position to the first position.

[0084] In the operation of the peeling unit 130 to peel the separator 320 from the ACF piece 310 attached to the substrate 400, the peeling unit 130 needs to move in a specific direction, such as from the first position toward the second position, to peel the separator 320 from the ACF piece 310 attached to the substrate 400. Therefore, when the peeling unit 130 moves in the direction from the first position toward the second position to perform peeling, the peeling unit 130 needs to return from the second position to the first position to perform the next peeling. Therefore, by the imaging unit 140 capturing an image of the ACF piece 310 attached to the substrate 400 when the peeling unit 130 moves from the second position to the first position, the imaging unit 140 can capture an image of the ACF piece 310 in parallel with the operation required for the peeling unit 130 to perform peeling. Therefore, a decrease in productivity can be further suppressed.

[0085] Technique 4 is the ACF joining device 10 according to any one of Techniques 1 to 3, in which the imaging section 140 captures an image of the entire ACF piece 310 joined to the substrate 400.

[0086] Conventionally, in inspecting the attachment state of the ACF section 310, after the ACF section 310 is attached to the substrate 400, the attachment state of both ends of the ACF section 310 in the longitudinal direction, which are prone to curling and peeling that are determined to be attachment errors in the inspection, is inspected. In recent years, due to improvements in quality, full-area inspection, which is an inspection of the entire ACF section 310, rather than just both ends, is often performed. However, when full-area inspection is performed using a conventional mechanism, the tact time increases, leading to reduced productivity. Therefore, conventionally, inspection is performed while balancing productivity and quality by inspecting multiple locations rather than the entire ACF section 310. On the other hand, the ACF attachment device 10 can shorten the process for inspecting the attachment state of the ACF section 310 compared to the conventional method, thereby improving both productivity and quality.

[0087] The fifth technique includes a tape supplying step (S10) in which a tape supplying unit 110 supplies a tape 300 including an ACF piece 310 and a separator 320 for holding the ACF piece 310, a pressing step (S20) in which a pressing unit 120 presses the tape 300 against a substrate 400, thereby attaching the ACF piece 310 to the substrate 400 while the ACF piece 310 is held by the separator 320, and a peeling unit 130 moves between the separator 320 and the substrate 400 in the longitudinal direction of the separator 320 to attach the ACF piece 310 to the substrate 400. The ACF application method includes a peeling step (S30) of peeling the separator 320 from the ACF piece 310 attached to the substrate 400, an imaging step (S40) of an imaging unit 140 provided in the peeling unit 130 imaging the ACF piece 310 attached to the substrate 400, and an inspection step (S50) of inspecting the attachment state of the ACF piece 310 attached to the substrate 400 based on image data generated by imaging the ACF piece 310 attached to the substrate 400 in the imaging step.

[0088] This provides the same effects as the ACF application device 10.

[0089] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a recording medium such as a computer-readable CD-ROM, or may be realized as any combination of a system, a method, an integrated circuit, a computer program, and a recording medium.

[0090] The present disclosure may be implemented as a program that causes a computer to execute the ACF pasting method, or may be realized as a computer-readable non-transitory recording medium that stores the program.

[0091] Furthermore, for example, the present disclosure may be realized as a control method in which a tape supply unit 110 supplies a tape 300 having an ACF section 310 and a separator 320 that holds the ACF section 310, a pressing unit 120 presses the tape 300 against a substrate 400, thereby attaching the ACF section 310 to the substrate 400 while being held by the separator 320, a peeling unit 130 moves between the separator 320 and the substrate 400 in the longitudinal direction of the separator 320, thereby peeling the separator 320 from the ACF section 310 attached to the substrate 400, an imaging unit 140 provided in the peeling unit 130 images the ACF section 310 attached to the substrate 400, and an attachment state of the ACF section 310 attached to the substrate 400 is inspected based on image data generated by imaging the ACF section 310 attached to the substrate 400. In addition, the present disclosure may be executed as a program that causes a computer to execute the control method, and the present disclosure may be realized as a computer-readable non-transitory recording medium that stores the program.

[0092] (Other embodiments) Although the ACF joining device and the like according to the present embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0093] For example, all or some of the components of the processing unit, such as the inspection unit, included in the ACF application device may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit, such as a CPU or processor, reading and executing a software program recorded on a recording medium, such as a HDD or semiconductor memory.

[0094] Furthermore, the components of the processing section of the ACF application device may be configured with one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0095] The one or more electronic circuits may include, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration). The IC or LSI may be integrated into one chip or into multiple chips. Here, we refer to it as an IC or an LSI, but depending on the degree of integration, it may be called a system LSI, a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). Also, a Field Programmable Gate Array (FPGA), which is programmed after the LSI is manufactured, can be used for the same purpose.

[0096] The present invention can be realized not only as an ACF pasting device, but also as a program including, as steps, processes performed by each component of the ACF pasting device, and a computer-readable recording medium such as a DVD (Digital Versatile Disc) on which the program is recorded. In other words, the above-mentioned comprehensive or specific aspects may be realized as a system, a device, an integrated circuit, a computer program, or a computer-readable non-transitory recording medium, or as any combination of the system, device, integrated circuit, computer program, and recording medium.

[0097] In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope that does not deviate from the spirit of the present invention. [Industrial Applicability]

[0098] The present invention can be used in an ACF bonding apparatus that bonds an ACF to a substrate. [Explanation of symbols]

[0099] 10 ACF attachment device 100 ACF pasting work section 110 Tape supply section 111 Reel 112 Feed roller 113 Recovery Department 114 Cutter 120 Pressing part 130 Peeling part 140 Imaging unit 150 Drive unit 160 Support part 200 Control device 210 Acquisition Department 220 Inspection Department 230 Control Unit 240 Output section 250 Storage section 300 Tape 310 ACF section 320 Separator 400 Substrates

Claims

1. a tape supplying unit that supplies a tape including an ACF section and a separator that holds the ACF section; a pressing unit that presses the tape against a substrate to attach the ACF piece to the substrate while being held by the separator; a peeling unit that moves between the separator and the substrate in a longitudinal direction of the separator to peel the separator from the ACF section attached to the substrate; an imaging unit provided in the peeling unit and configured to image the ACF section attached to the substrate; an inspection unit that inspects an attachment state of the ACF section attached to the substrate based on image data generated by the imaging unit capturing an image of the ACF section attached to the substrate, ACF application device.

2. the imaging unit images the ACF section attached to the substrate when the peeling unit moves to peel the separator from the ACF section attached to the substrate; The ACF joining device according to claim 1 .

3. the peeling unit moves from a first position to a second position between the separator and the substrate in a longitudinal direction of the separator to peel the separator from the ACF section attached to the substrate, and then moves from the second position back to the first position; the imaging unit images the ACF section attached to the substrate when the peeling unit moves from the second position to the first position; The ACF joining device according to claim 1 .

4. The imaging unit images the entire ACF section attached to the substrate. The ACF joining device according to any one of claims 1 to 3.

5. a tape supplying step in which a tape supplying unit supplies a tape including an ACF section and a separator for holding the ACF section; a pressing step in which a pressing unit presses the tape against a substrate, thereby attaching the ACF piece to the substrate while being held by the separator; a peeling step of peeling the separator from the ACF section attached to the substrate by moving a peeling unit between the separator and the substrate in a longitudinal direction of the separator; an imaging step of imaging the ACF section attached to the substrate by an imaging unit provided in the peeling unit; and an inspection step of inspecting an attachment state of the ACF section attached to the substrate based on image data generated by imaging the ACF section attached to the substrate in the imaging step. How to attach ACF.

Images