Multilayer electronic component

Abstract

To provide a multilayer electronic component having improved mechanical strength and improved high-frequency characteristics.SOLUTION: A multilayer electronic component 100 includes: a body 110 including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and having a first surface 1 and a second surface 2 opposing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first and second surfaces and the third and fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the body. The internal electrode is connected to the external electrode through a lead-out portion, and the external electrode includes a first external electrode 131, a second external electrode 132, a third external electrode 133 and a fourth external electrode 134, which are spaced apart from each other. The first and third external electrodes are connected by a first connection electrode 135 including a conductive material.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), which are one type of multi-layered electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small yet high capacitance and easy to mount, and can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors to be smaller and have higher capacitance.

[0004] On the other hand, MLCCs are also widely used for decoupling to remove noise from electrical signals within a set due to their excellent high frequency characteristics (low ESL).

[0005] Also, to solve noise in high-speed integrated circuits (ICs), LSCs (Land Side Capacitors) can be applied to the area adjacent to the ICs, but it is known that LSCs require thin thickness and high frequency characteristics. In order to reduce ESL, it is important to minimize the number of magnetic flux linkages per unit current in the high frequency range. To achieve this, various methods are used to solve the problem, such as controlling the formation and structure in a direction that minimizes current loops, and arranging internal and external electrodes in a direction that can cancel out magnetic fields.

[0006] As mentioned above, LSCs are generally placed at the bottom of IC boards, so they are required to have low ESL characteristics while being thin. At this time, LSCs are mounted at the bottom of the board where the solder balls have been removed, and LICC type capacitors have been mainly used. However, the need for capacitors with a square form factor is gradually increasing. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Patent Publication No. 10-2015-0127441 [Patent Document 2] Japanese Patent Publication No. 2020-119993 Summary of the Invention [Problem to be solved by the invention]

[0008] One of the problems that the present invention aims to solve is to facilitate measurement of the capacitance of a multilayer electronic component.

[0009] One of the problems to be solved by the present invention is to improve the mechanical strength of a multilayer electronic component.

[0010] One of the problems that the present invention aims to solve is to facilitate classification of the appearance of a multilayer electronic component.

[0011] One of the problems to be solved by the present invention is to provide a multilayer electronic component having improved high frequency characteristics (low ESL).

[0012] However, some of the problems that the present invention aims to solve are not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0013] A multilayer electronic component according to an embodiment of the present invention includes a main body including dielectric layers and internal electrodes alternately arranged with the dielectric layers in a first direction, the main body including first and second sides facing each other in the first direction, third and fourth sides connected to the first and second sides and facing each other in the second direction, and fifth and sixth sides connected to the first, second, third and fourth sides and facing each other in the third direction, and an external electrode arranged on the main body, the internal electrodes being connected to the external electrodes via lead-out portions, the external electrodes including a first external electrode, a second external electrode, a third external electrode and a fourth external electrode spaced apart from each other, and a first connecting electrode connecting the first external electrode and the third external electrode, the first connecting electrode including a conductive material.

[0014] A multilayer electronic component according to another embodiment of the present invention includes a main body including dielectric layers and internal electrodes alternately arranged with the dielectric layers in a first direction, the main body including first and second sides facing each other in the first direction, third and fourth sides connected to the first and second sides and facing each other in a second direction, and fifth and sixth sides connected to the first, second, third and fourth sides and facing each other in the third direction, and an external electrode arranged on the main body, the internal electrodes being connected to the external electrodes via lead-out portions, the external electrodes including a first external electrode, a second external electrode, a third external electrode and a fourth external electrode spaced apart from each other, a first connecting electrode connecting the first external electrode and the third external electrode, and a second connecting electrode connecting the second external electrode and the fourth external electrode. Effect of the Invention

[0015] One of the advantages of the present invention is that it improves the ease of measuring the capacitance of a multilayer electronic component.

[0016] One of the effects of the present invention is to improve the mechanical strength of the multilayer electronic component.

[0017] One of the advantages of the present invention is that it makes it easier to distinguish the appearance of a multilayer electronic component.

[0018] One of the effects of the present invention is that the high frequency characteristics (low ESL) of a multilayer electronic component is improved.

[0019] However, the various and beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0020] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 1(a) to 1(d) are schematic cross-sectional views of an internal electrode including a lead portion according to one embodiment of the present invention. [Diagram 3] FIG. 1A is a schematic plan view of one embodiment of the present invention, and FIG. 1B is a schematic bottom view of one embodiment of the present invention. [Figure 4] FIG. 13 is a schematic perspective view of a multilayer electronic component according to another embodiment of the present invention. [Diagram 5] FIG. 2A is a schematic plan view of another embodiment of the present invention, and FIG. 2B is a schematic bottom view of one embodiment of the present invention. [Figure 6] FIG. 2A is a schematic plan view of another embodiment of the present invention, and FIG. 2B is a schematic bottom view of one embodiment of the present invention. [Figure 7] 11(a) to 11(d) are schematic cross-sectional views of an internal electrode including a lead portion according to another embodiment of the present invention. [Figure 8] FIG. 2A is a schematic plan view of another embodiment of the present invention, and FIG. 2B is a schematic bottom view of one embodiment of the present invention. [Figure 9] 11(a) to 11(d) are schematic cross-sectional views of an internal electrode including a lead portion according to another embodiment of the present invention. [Figure 10] FIG. 2A is a schematic plan view of another embodiment of the present invention, and FIG. 2B is a schematic bottom view of one embodiment of the present invention. [Figure 11] 11(a) to 11(d) are schematic cross-sectional views of an internal electrode including a lead portion according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0022] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation are omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to those shown in the drawings. Components that have the same function within the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a part is said to "include" a certain component, this does not exclude other components, but means that the part may further include other components, unless otherwise specified to the contrary.

[0023] In the drawings, the first direction can be defined as the stacking direction or thickness T direction, the second direction can be defined as the length L direction, and the third direction can be defined as the width W direction.

[0024] Multilayer Electronic Components FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIGS. 2(a) to 2(d) are schematic cross-sectional views of internal electrodes including lead portions according to one embodiment of the present invention, FIG. 3(a) is a schematic plan view of one embodiment of the present invention, FIG. 3(b) is a schematic bottom view of one embodiment of the present invention, FIG. 4 is a schematic perspective view of a multilayer electronic component according to another embodiment of the present invention, FIG. 5(a) is a schematic plan view of another embodiment of the present invention, FIG. 5(b) is a schematic bottom view of one embodiment of the present invention, FIG. 6(a) is a schematic plan view of another embodiment of the present invention, and FIG. 6(b) is a schematic plan view of one embodiment of the present invention. 7(a) to (d) of FIG. 7 are schematic cross-sectional views of an internal electrode including a lead portion according to another embodiment of the present invention, FIG. 8(a) is a schematic plan view of another embodiment of the present invention, FIG. 8(b) is a schematic bottom view of one embodiment of the present invention, FIG. 9(a) to (d) are schematic cross-sectional views of an internal electrode including a lead portion according to another embodiment of the present invention, FIG. 10(a) is a schematic plan view of another embodiment of the present invention, FIG. 10(b) is a schematic bottom view of one embodiment of the present invention, and FIG. 11(a) to (d) are schematic cross-sectional views of an internal electrode including a lead portion according to another embodiment of the present invention.

[0025] A multilayer electronic component according to an embodiment of the present invention will be described in detail below with reference to Figures 1 to 11. Although a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, the present invention can also be applied to various electronic products that use a dielectric composition, such as inductors, piezoelectric elements, varistors, thermistors, and the like.

[0026] The multilayer electronic component 100 according to one embodiment of the present invention includes a body 110 including a dielectric layer 111 and internal electrodes 121, 122, 123, 124 arranged alternately with the dielectric layer 111 in a first direction, the body 110 including a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the second direction, a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and facing each other in the third direction, and external electrodes 131, 132, 133 arranged on the body 110. The internal electrodes 121, 122, 123, and 124 are connected to the external electrodes 131, 132, 133, 134, and 135 via lead portions 121a, 122b, 123c, and 124d. The external electrodes 131, 132, 133, 134, and 135 include a first external electrode 131, a second external electrode 132, a third external electrode 133, and a fourth external electrode 134 that are spaced apart from each other, and a first connecting electrode 135 that connects the first external electrodes and the third external electrodes, and the first connecting electrode 135 may include a conductive material.

[0027] The body 110 may be formed by alternately stacking dielectric layers 111 and internal electrodes 121, 122, 123, and .

[0028] More specifically, the main body 110 may include a capacitance forming portion that is disposed inside the main body 110 and includes a first internal electrode 121, a second internal electrode 122, a third internal electrode 123, and a fourth internal electrode 124 that are stacked in a first direction with a dielectric layer 111 sandwiched therebetween to form a capacitance.

[0029] Here, the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 may be defined as one pattern. The first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 are preferably arranged sequentially in the first direction, but are not particularly limited thereto, and may be arbitrarily arranged in the first direction to form one periodically repeated pattern.

[0030] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 does not have a hexahedron shape with perfect straight lines, but can have a substantially hexahedron shape.

[0031] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction and connected to the first surface 1 and the second surface 2, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction and connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4.

[0032] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated so that they are difficult to confirm without using a scanning electron microscope (SEM).

[0033] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3)-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material can contain BaTiO3-based ceramic particles. Examples of the ceramic particles include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0034] Furthermore, the raw material for forming the dielectric layer 111 may be particles of barium titanate (BaTiO3) or the like to which various ceramic additives, organic solvents, binders, dispersants, etc. may be added according to the object of the present invention.

[0035] The thickness td of the dielectric layer 111 does not need to be particularly limited.

[0036] However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness of the dielectric layer 111 may be 0.6 μm or less, and more preferably 0.4 μm or less.

[0037] Here, the thickness td of the dielectric layer 111 may refer to the thickness td of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0038] Meanwhile, the thickness td of the dielectric layer 111 may refer to the size of the dielectric layer 111 in the first direction. Also, the thickness td of the dielectric layer 111 may refer to the average thickness td of the dielectric layer 111, or may refer to the average size of the dielectric layer 111 in the first direction.

[0039] The average size in the first direction of the dielectric layer 111 may be measured by scanning an image of a cross-section in the first and second directions of the body 110 with a scanning electron microscope (SEM) at 10,000 times magnification. More specifically, the average size in the first direction of one dielectric layer 111 may mean an average value calculated by measuring the size in the first direction of one dielectric layer 111 at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points may be designated by a capacitance forming unit. Furthermore, if the measurement of such an average value is extended to 10 dielectric layers 111 and the average value is measured, the average size in the first direction of the dielectric layer 111 may be further generalized.

[0040] The internal electrodes 121 , 122 , 123 , 124 may be stacked alternately with the dielectric layers 111 .

[0041] The internal electrodes 121, 122, 123, 124 may include a first internal electrode 121, a second internal electrode 122, a third internal electrode 123, and a fourth internal electrode 124, and the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 may be alternately arranged to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween. The first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 may be electrically separated from each other by the dielectric layer 111 arranged in the middle in the first direction.

[0042] In this case, the body 110 may be formed by alternately stacking a first ceramic green sheet having a first internal electrode pattern printed thereon, a second ceramic green sheet having a second internal electrode pattern printed thereon, a third ceramic green sheet having a third internal electrode pattern printed thereon, and a fourth ceramic green sheet having a fourth internal electrode pattern printed thereon, and then firing the stacked layers. Here, the first to fourth internal electrode patterns may be formed by applying an internal electrode paste, and may become the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 after firing.

[0043] There is no particular limitation on the material forming the internal electrodes 121, 122, 123, 124, and any material having excellent electrical conductivity can be used. For example, the internal electrodes 121, 122, 123, 124 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0044] In addition, the internal electrodes 121, 122, 123, and 124 may be formed by printing a conductive paste for internal electrodes, including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, on a ceramic green sheet to form an internal electrode pattern. The method for printing the conductive paste for internal electrodes may be a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0045] On the other hand, the thickness te of the internal electrodes 121, 122, 123, and 124 does not need to be particularly limited.

[0046] However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness of the internal electrodes 121, 122, 123, 124 may be 0.6 μm or less, and more preferably 0.4 μm or less.

[0047] Here, the thickness te of the internal electrodes 121, 122, 123, and 124 may refer to the size of the internal electrodes 121, 122, 123, and 124 in the first direction. In addition, the thickness te of the internal electrodes 121, 122, 123, and 124 may refer to the average thickness te of the internal electrodes 121, 122, 123, and 124, or may refer to the average size of the internal electrodes 121, 122, 123, and 124 in the first direction.

[0048] The average size in the first direction of the internal electrodes 121, 122, 123, and 124 may be measured by scanning an image of a cross-section in the first and second directions of the body 110 with a scanning electron microscope (SEM) at 10,000 times magnification. More specifically, the average size in the first direction of one internal electrode may be an average value calculated by measuring the size in the first direction of one internal electrode at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points may be designated by a capacitance forming unit. Furthermore, if the measurement of such an average value is extended to 10 internal electrodes 121, 122, 123, and 124 and the average value is measured, the average size in the first direction of the internal electrodes 121, 122, 123, and 124 may be further generalized.

[0049] The outer electrodes 131, 132, 133, 134, 135, and 136 may be disposed on the body 110 and connected to the inner electrodes 121, 122, 123, and 124.

[0050] The external electrodes 131, 132, 133, 134, 135, and 136 may include a first external electrode 131, a second external electrode 132, a third external electrode 133, and a fourth external electrode 134, and may be disposed spaced apart from each other on the body 110, respectively.

[0051] In addition, the external electrodes 131, 132, 133, 134, 135, and 136 may include connecting electrodes 135 and 136 connecting at least two external electrodes among the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134. When there are a plurality of connecting electrodes, each connecting electrode may be connected to a different external electrode, which will be described in detail later.

[0052] The external electrodes 131, 132, 133, 134, 135, and 136 may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical properties, structural stability, and the like, and may further have a multi-layer structure.

[0053] For example, the external electrodes 131, 132, 133, 134, 135, 136 may include an electrode layer disposed on the body 110 and a plating layer disposed on the electrode layer.

[0054] As a more specific example of the electrode layer, the electrode layer may be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and resin.

[0055] The electrode layer may also be in a form in which a fired electrode and a resin-based electrode are formed in this order on the main body 110 .

[0056] In addition, the electrode layer may be formed by transferring a sheet containing a conductive metal onto the main body 110, or may be formed by transferring a sheet containing a conductive metal onto a fired electrode.

[0057] The conductive metal used for the electrode layer is not particularly limited as long as it can be electrically connected to the internal electrodes 121, 122, 123, and 124 to form capacitance, and may include, for example, at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The electrode layer may be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder, and then firing the paste.

[0058] The plating layer can serve to improve mounting characteristics.

[0059] The type of plating layer is not particularly limited, and may be a single plating layer containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, or may be formed of multiple layers.

[0060] As a more specific example of the plating layer, the plating layer may be a Ni plating layer or a Sn plating layer, or may be a form in which a Ni plating layer and a Sn plating layer are sequentially formed on an electrode layer, or a form in which a Sn plating layer, a Ni plating layer and a Sn plating layer are sequentially formed. Also, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0061] On the other hand, MLCCs are also widely used for decoupling to remove noise from electrical signals within a set due to their excellent high frequency characteristics (low ESL).

[0062] Also, to solve noise in high-speed integrated circuits (ICs), LSCs (Land Side Capacitors) can be applied to the area adjacent to the ICs, but it is known that LSCs require thin thickness and high frequency characteristics. In order to reduce ESL, it is important to minimize the number of magnetic flux linkages per unit current in the high frequency range. To achieve this, various methods are used to solve the problem, such as controlling the formation and structure in a direction that minimizes current loops, and arranging internal and external electrodes in a direction that can cancel out magnetic fields.

[0063] As mentioned above, LSCs are generally placed at the bottom of IC boards, so they are required to have low ESL characteristics while being thin. At this time, LSCs are mounted at the bottom of the board where the solder balls have been removed, and LICC type capacitors have been mainly used. However, the need for capacitors with a square form factor is gradually increasing.

[0064] Therefore, the present invention has an effect of improving the ease of capacitance measurement and strength of a multilayer electronic component by including an internal electrode including an extraction portion and designing a connection electrode that can be electrically connected between external electrodes in a structure that can achieve Low ESL, and also has an effect of making it easier to distinguish the appearance and more convenient to distinguish the upper and lower surfaces during mounting.

[0065] The external electrodes 131, 132, 133, 134, 135, and 136 may include a first external electrode 131, a second external electrode 132, a third external electrode 133, and a fourth external electrode 134 that are spaced apart from each other, and may include connecting electrodes 135 and 136 that connect at least two of the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134.

[0066] In this case, the connecting electrodes 135 and 136 may include a conductive material. As described above, the connecting electrodes 135 and 136 may be formed using any material having electrical conductivity such as metal, and the specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0067] The conductive material included in the connecting electrodes 135 and 136 does not need to be the same as the conductive material included in the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134, and may be made of or include different conductive materials. In this case, all of the conductive materials included in the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 may be different from all of the conductive materials included in the connecting electrodes 135 and 136, and may include a case in which only a part of the conductive materials are overlapped.

[0068] For example, when the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 contain copper (Cu), the connecting electrodes 135, 136 may contain copper (Cu) and nickel (Ni), or may contain nickel (Ni) without containing copper (Cu).

[0069] More specifically, the connecting electrodes 135, 136 may include a first connecting electrode 135 disposed on the second surface 2 of the main body and connected to the first external electrode 131 and the third external electrode 133, or a second connecting electrode 136 disposed on the first surface 1 of the main body and connected to the second external electrode 132 and the fourth external electrode 134. That is, depending on the structure of the multilayer electronic component 100, at least one of the first connecting electrode 135 and the second connecting electrode 136 may be included, or both the first connecting electrode 135 and the second connecting electrode 136 may be included.

[0070] Different voltages may be applied to the first connecting electrode 135 and the second connecting electrode 136, and by applying different voltages to each other, it is possible to easily measure the voltage of the capacitance.

[0071] For example, the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 each include a first lead portion 121a, a second lead portion 122b, a third lead portion 123c, and a fourth lead portion 124d, and are respectively connected to the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134. In this case, when two of the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 are connected to the first connecting electrode 135, and the remaining two external electrodes not connected to the first connecting electrode 135 are connected to the second connecting electrode 136, by applying different voltages to the first connecting electrode 135 and the second connecting electrode 136, it may be easy to measure the capacitance. Here, applying different voltages to the first connecting electrode 135 and the second connecting electrode 136 does not only mean applying a direct voltage to the first connecting electrode 135 and the second connecting electrode 136, but also includes a case where a voltage is applied to an external electrode connected to the first connecting electrode 135 and the second connecting electrode 136, so that the same electrical voltage is applied to the connected electrodes.

[0072] Specifically, the first connecting electrode 135 can be structurally and electrically connected to the first external electrode 131 and the third external electrode 133, and can have substantially the same width. And it preferably has a linear structure, but is not particularly limited thereto, and any structure can be applied as long as it can be electrically connected, such as a curved shape or a stepped shape.

[0073] At this time, when the shortest distances from the first connecting electrode 135 to the second external electrode 132 and the fourth external electrode 134 are defined as Td1 and Td2 respectively, and the width of the first connecting electrode 135 is defined as Td3, 90μm ≦ Td1, 90μm ≦ Td2, and 0μm < Td3 can be satisfied.

[0074] Here, when the width of the first connecting electrode 135 has substantially the same width, the average value of the widths measured at five equally spaced points in the first connecting electrode 135 can be defined as the width or average width of the first connecting electrode 135. On the other hand, when the first connecting electrode 135 does not have substantially the same width, or when measurement is difficult, the larger value of the size of the first connecting electrode 135 in the linear direction parallel to the shortest distances from the first connecting electrode 135 to the second external electrode 132 and the fourth external electrode 134 can be defined as the width of the first connecting electrode 135.

[0075] On the other hand, when 90μm ≦ Td1, 90μm ≦ Td2, and 0μm < Td3 are satisfied, the electrical connectivity between the first external electrode 131 and the third external electrode 133 does not decrease, the measurement of the capacitance can be facilitated, and since the mechanical strength is sufficient, the occurrence of defects in the multilayer electronic component 100 can be prevented. Also, the occurrence of a short can be prevented.

[0076] In contrast, when Td1 < 90μm or Td2 < 90μm, the separation distance between the first connecting electrode 135 and the second external electrode 132 or the fourth external electrode 134 is short, and there is a risk of electrical connection or occurrence of a short. The upper limit values of Td1 and Td2 are not particularly limited and can be determined by the size of the multilayer electronic component or Td3.

[0077] And since Td3 only needs to be able to electrically connect the first external electrode 131 and the third external electrode 133, the lower limit is not particularly limited, and for example, it may be more than 0 μm. On the other hand, the upper limit of Td3 is also not particularly limited and can be determined by the size of the multilayer electronic component, Td1, or Td2.

[0078] The second connection electrode 136 can be structurally and electrically connected to the second external electrode 132 and the fourth external electrode 134 and can have substantially the same width. And it preferably has a linear structure, but is not particularly limited thereto, and any structure can be applied as long as it can be electrically connected, such as a curved shape or a stepped shape.

[0079] At this time, when the shortest distances from the second connection electrode 136 to the first external electrode 131 and the third external electrode 133 are defined as Bd1 and Bd2 respectively, and the width of the second connection electrode 136 is defined as Bd3, 90 μm ≤ Bd1, 90 μm ≤ Bd2, and 0 μm < Bd3 can be satisfied.

[0080] Here, when the width of the second connection electrode 136 has substantially the same width, the average value of the widths measured at five equally spaced points in the second connection electrode 136 can be defined as the width or average width of the second connection electrode 136. On the other hand, when the second connection electrode 136 does not have substantially the same width or when measurement is difficult, the larger value of the sizes of the second connection electrode 136 in the linear direction parallel to the shortest distances from the second connection electrode 136 to the first external electrode 131 and the third external electrode S133 can be defined as the width of the second connection electrode 136.

[0081] On the other hand, when 90 μm ≤ Bd1, 90 μm ≤ Bd2, and 0 μm < Bd3 are satisfied, the electrical connectivity between the second external electrode 132 and the fourth external electrode 134 does not decrease, the measurement of the capacitance can be facilitated, and since the mechanical strength is sufficient, the occurrence of defects in the multilayer electronic component 100 can be prevented. Also, the occurrence of a short can be prevented.

[0082] On the other hand, when Bd1<90 μm or Bd2<90 μm, the distance between the second connecting electrode 136 and the first external electrode 131 or the third external electrode 133 is short, and there is a risk of electrical connection or short circuit occurring. The upper limits of Bd1 and Bd2 are not particularly limited and may be determined by the size of the multilayer electronic component or Bd3.

[0083] And, since it is only necessary for Bd3 to electrically connect the second external electrode 132 and the fourth external electrode 134, the lower limit is not particularly limited and may be, for example, more than 0 μm. On the other hand, the upper limit of Bd3 is also not particularly limited and can be determined by the size of the multilayer electronic component, Bd1 or Bd2.

[0084] On the other hand, when the first connecting electrode 135 and the second connecting electrode 136 have a linear structure, they may cross obliquely when projected in a plan view.

[0085] The first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 may be disposed on the body 110 at a distance from each other.

[0086] More specifically, the first external electrode 131 may be arranged on at least one of the third surface 3 and the fifth surface 5, the second external electrode 132 may be arranged on at least one of the fourth surface 4 and the fifth surface 5, the third external electrode 133 may be arranged on at least one of the fourth surface 4 and the sixth surface 6, and the fourth external electrode 134 may be arranged on at least one of the third surface 3 and the sixth surface 6.

[0087] Meanwhile, the internal electrodes according to an embodiment of the present invention may include a first internal electrode 121, a second internal electrode 122, a third internal electrode 123, and a fourth internal electrode 124, and may be connected to a first external electrode 131, a second external electrode 132, a third external electrode 133, and a fourth external electrode 134 via a first lead portion 121a, a second lead portion 122b, a third lead portion 123c, and a fourth lead portion 124d, respectively.

[0088] More specifically, the first internal electrode 121 may be connected to the first external electrode 131 via the first lead-out portion 121a, the second internal electrode 122 may be connected to the second external electrode 132 via the second lead-out portion 122b, the third internal electrode 123 may be connected to the third external electrode 133 via the third lead-out portion 123c, and the fourth internal electrode 124 may be connected to the fourth external electrode 134 via the fourth lead-out portion 124d.

[0089] In other words, the first internal electrode 121 may be connected to the first external electrode 131 without being connected to the second external electrode 132, the third external electrode 133, and the fourth external electrode 134, the second internal electrode 122 may be connected to the second external electrode 132 without being connected to the first external electrode 131, the third external electrode 133, and the fourth external electrode 134, the third internal electrode 123 may be connected to the third external electrode 133 without being connected to the first external electrode 131, the second external electrode 132, and the fourth external electrode 134, and the fourth internal electrode 124 may be connected to the fourth external electrode 134 without being connected to the first external electrode 131, the second external electrode 132, and the third external electrode 133.

[0090] The first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 are connected to the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 via the first lead portion 121a, the second lead portion 122b, the third lead portion 123c, and the fourth lead portion 124d, respectively, thereby achieving low ESL characteristics in the high frequency range.

[0091] In the present invention, the internal electrodes 121, 122, 123, and 124 may be composed of lead-out portions 121a, 122b, 123c, and 124d and a main portion excluding the lead-out portions 121a, 122b, 123c, and 124d.

[0092] More specifically, the first lead portion 121a, the second lead portion 122b, the third lead portion 123c, and the fourth lead portion 124d may be areas arranged in an area where the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 do not overlap in the first direction, and since the first lead portion 121a, the second lead portion 122b, the third lead portion 123c, and the fourth lead portion 124d do not overlap in the first direction, they do not need to form a capacitance.

[0093] In addition, the main portion may be a region where the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 overlap in a first direction, and since the main portion overlaps in the first direction, a capacitance can be formed, and the region can be a capacitance forming portion.

[0094] More specifically, the main part may include a first main part which is the area of ​​the first internal electrode 121 excluding the first lead portion 121a, a second main part which is the area of ​​the second internal electrode 122 excluding the second lead portion 122b, a third main part which is the area of ​​the third internal electrode 123 excluding the third lead portion 123c, and a fourth main part which is the area of ​​the fourth internal electrode 124 excluding the fourth lead portion 124d.

[0095] In other words, the internal electrode can include the lead portion which is a region that does not form a capacitance, and the main portion which is a region that forms a capacitance.

[0096] Meanwhile, the shapes of the lead-out portions may be various. For example, the first lead-out portion may contact a portion of at least one of the third surface 3 and the fifth surface 5, the second lead-out portion may contact a portion of at least one of the fourth surface 4 and the fifth surface 5, the third lead-out portion may contact a portion of at least one of the fourth surface 4 and the sixth surface 6, and the fourth lead-out portion may contact a portion of at least one of the third surface 3 and the sixth surface 6.

[0097] In other words, it is sufficient that the first drawn-out portion is in contact with a part of at least one of the third surface 3 and the fifth surface 5, and it does not have to be in contact with the third surface 3 and the fifth surface 5 at the same time, and it can include the case where the first drawn-out portion is in contact with the third surface 3 and the fifth surface 5 at the same time. This explanation can be similarly applied to the second drawn-out portion to the fourth drawn-out portion.

[0098] As yet another example, the second internal electrode may further include a second additional lead portion connected to the fourth external electrode, and the fourth internal electrode may further include a fourth additional lead portion connected to the second external electrode.

[0099] That is, the second internal electrode may be connected to the second external electrode via the second lead-out portion and to the fourth external electrode via the second additional lead-out portion, and the fourth internal electrode may be connected to the fourth external electrode via the fourth lead-out portion and to the second external electrode via the fourth additional lead-out portion.

[0100] In other words, the first internal electrode can be connected to the first external electrode, the second internal electrode and the fourth internal electrode can be simultaneously connected to the second external electrode and the fourth external electrode, and the third internal electrode can be connected to the third external electrode.

[0101] When the second and fourth internal electrodes are connected to the second and fourth external electrodes at the same time, the lead portions included in the second and fourth internal electrodes may include an overlapping area between the second and fourth internal electrodes. The shapes of the second and fourth internal electrodes may be substantially the same, but are not limited thereto.

[0102] When the first to fourth internal electrodes are arranged in sequence, the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode can be arranged in sequence.

[0103] As a result, the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 can be in contact with the first lead portion 121a, the second lead portion 122b, the third lead portion 123c, and the fourth lead portion 124d, respectively, and can be arranged to cover the first lead portion 121a, the second lead portion 122b, the third lead portion 123c, and the fourth lead portion 121a, respectively.

[0104] Here, "arranged so as to cover" may mean that the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 are arranged so that the first external electrode 121a, the second external electrode 122b, the third external electrode 123c, and the fourth external electrode 124d, which are in contact with at least one surface of the main body 110, have no portions exposed to the outside.

[0105] More specifically, the first external electrode 131 may be in contact with the first lead portion 121a and arranged to cover the first lead portion 121a, the second external electrode 132 may be in contact with the second lead portion 122b and arranged to cover the second lead portion 122b, the third external electrode 133 may be in contact with the third lead portion 123c and arranged to cover the third lead portion 123c, and the fourth external electrode 134 may be in contact with the fourth lead portion 124d and arranged to cover the fourth lead portion 124d.

[0106] The first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 may be disposed on at least one of the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 of the main body. However, for ease of mounting on a board, excellent moisture resistance reliability, and improved mechanical strength, it is preferable that the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 are disposed so as to extend over a part of the first surface 1 and a part of the second surface 2 of the main body 110.

[0107] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0108] However, in order to simultaneously achieve the effect of reducing Low ESL in the high frequency range, the effect of improving moisture resistance reliability and mechanical strength, and the convenience of capacitance measurement, the effect of the present invention may be more pronounced when the multilayer electronic component 100 has a form factor shape in which the length (size in the second direction) and width (size in the third direction) of the multilayer electronic component 100 are substantially the same and the form factor shape has an ultra-small size, such as 0606 (length x width: 0.6 mm x 0.6 mm) or less.

[0109] Here, the length and width being substantially the same does not mean that they are exactly the same, but includes an allowable error range, and can mean that the difference between the length and width is preferably 10% or less, and more preferably 5% or less. When the length and width are substantially the same, it is possible to improve the current loop, and it is easier to achieve a multilayer electronic component 100 having Low ESL.

[0110] The present invention will be described in more detail below with reference to examples. However, these examples are intended to aid in the specific understanding of the present invention, and the scope of the present invention is not limited to these examples.

[0111] First Example 1 to 3, the multilayer electronic component 100 according to the first embodiment of the present invention will be described. The first internal electrode 121 may be connected to a first external electrode 131 arranged to cover the first lead portion 121a over a part of the third surface 3 and a part of the fifth surface 5 via a first lead portion 121a arranged to contact the part of the third surface 3 and a part of the fifth surface 5. The second internal electrode 122 may be connected to a second external electrode 131 arranged to cover the second lead portion 122b over a part of the fourth surface 4 and a part of the fifth surface 5 via a second lead portion 122b arranged to contact the part of the fourth surface 4 and a part of the fifth surface 5. The third internal electrode 123 may be connected to a third external electrode 133 arranged to cover the third lead portion 123c over a part of the fourth surface 4 and a part of the sixth surface 6 via a third lead portion 123c arranged to contact the part of the fourth surface 4 and a part of the sixth surface 6. The fourth internal electrode 124 may be connected to a fourth external electrode 134 arranged to cover the fourth lead portion 124d over a portion of the third surface 3 and a portion of the sixth surface 6 via a fourth lead portion 124d arranged to contact a portion of the third surface 3 and a portion of the sixth surface 6. Thus, the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 may be connected to the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134, respectively.

[0112] At this time, the first external electrode 131 and the third external electrode 132 are connected by a first connecting electrode 135 arranged on the second surface 2, and the second external electrode 132 and the fourth external electrode 134 are connected by a second connecting electrode 136 arranged on the first surface 1. As a result, the first external electrode 131, the third external electrode 132, and the first connecting electrode 135 are connected, and the second external electrode 132, the fourth external electrode 134, and the second connecting electrode 136 are connected, and the capacitance can be measured by applying different voltages to each of them.

[0113] For example, a first voltage can be applied to the first external electrode 131 and a second voltage can be applied to the second external electrode 132 to measure the capacitance of the multilayer electronic component 100.

[0114] If the first connecting electrode 135 and the second connecting electrode 136 were not present, there would be many cases in which different voltages would be applied to any two of the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134, and the measured capacitance values ​​would be diverse or inaccurate. However, according to one embodiment of the present invention, there is an advantage in that the capacitance can be easily measured by applying voltages at two points.

[0115] Second Example 4 and 5, a multilayer electronic component 200 according to a second embodiment of the present invention will be described. Other configurations may be the same as or similar to those of the multilayer electronic component 100 according to the first embodiment, but the shapes of the first external electrode 231, the second external electrode 232, the third external electrode 233, and the fourth external electrode 234 may be different from those of the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 according to the first embodiment. That is, the shape of the external electrodes may be a rectangle or a triangle based on a plan view or a bottom view, but even if the shape is different, appropriate design and modification may be possible within a range that does not deviate from the problem to be solved by the present invention.

[0116] Third Example 6 and 7, the multilayer electronic component 300 according to the third embodiment of the present invention will be described. The first internal electrode 321 may be connected to a first external electrode 331 arranged to cover the first lead portion 321a over a portion of the fourth surface 4 and a portion of the fifth surface 5 via a first lead portion 321a arranged to contact a portion of the fourth surface 4 and a portion of the fifth surface 5. The second internal electrode 322 may be connected to a second external electrode 331 arranged to cover the second lead portion 322b over a portion of the fourth surface 4 and a portion of the fifth surface 5 via a second lead portion 322b arranged to contact a portion of the fourth surface 4 and a portion of the fifth surface 5. Furthermore, the second internal electrode 322 may be connected to a fourth external electrode 334 arranged to cover the second additional lead portion 322d over a portion of the third surface 3 and a portion of the sixth surface 6 via a second additional lead portion 322d arranged to contact a portion of the third surface 3 and a portion of the sixth surface 6. As a result, the second internal electrode 322 can be simultaneously connected to the second external electrode 332 and the fourth external electrode 334. The third internal electrode 323 can be connected to the third external electrode 333 arranged to cover the third lead portion 323c over a portion of the third surface 3 and a portion of the sixth surface 6 via the third lead portion 323c arranged to contact a portion of the third surface 3 and a portion of the sixth surface 6.

[0117] Although not shown in the drawings, the fourth internal electrode may have the same shape as the second internal electrode 322. Thus, when the first to fourth internal electrodes are arranged in sequence, they can be stacked and arranged in the first direction in the order of the shapes of the first internal electrode 321, the second internal electrode 322, the third internal electrode 323, the second internal electrode 322, the first internal electrode 321, . . .

[0118] At this time, since the second internal electrode 322 is connected to the second external electrode 332 and the fourth external electrode 334, even if only the first connecting electrode 335 is disposed on the second surface 2 of the body 310 and connected to the first external electrode 331 and the third external electrode 333, the capacitance can be easily measured. That is, since the body 310 is not disposed on the first surface 1, the second connecting electrode 336 is not connected to the second external electrode 332 and the fourth external electrode 334. For example, even if a voltage is applied to the first external electrode 331 and the second external electrode 332, the capacitance of the first internal electrode 321, the second internal electrode 322, the third internal electrode 323, and the fourth internal electrode 324 (not shown) can be measured.

[0119] Fourth Example 8 and 9, a multilayer electronic component 400 according to a fourth embodiment of the present invention will be described. The first internal electrode 421 may be connected to a first external electrode 431 disposed on a portion of the third surface 3 to cover the first lead portion 421a via a first lead portion 421a in contact with a portion of the third surface 3. The second internal electrode 422 may be connected to a second external electrode 432 disposed on a portion of the fifth surface 5 to cover the second lead portion 422b via a second lead portion 422b in contact with a portion of the fifth surface 5. The third internal electrode 423 may be connected to a third external electrode 433 disposed on a portion of the fourth surface 4 to cover the third lead portion 423c via a third lead portion 423c in contact with a portion of the fourth surface 4. The fourth internal electrode 424 may be connected to a fourth external electrode 434 disposed on a portion of the sixth surface 6 so as to cover the fourth lead portion 424d via the fourth lead portion 424d that contacts a portion of the sixth surface 6.

[0120] At this time, the first external electrode 431 and the third external electrode 432 are connected by a first connecting electrode 435 arranged on the second surface 2, and the second external electrode 432 and the fourth external electrode 434 are connected by a second connecting electrode 436 arranged on the first surface 1. As a result, the first external electrode 431, the third external electrode 432, and the first connecting electrode 435 are connected, and the second external electrode 432, the fourth external electrode 434, and the second connecting electrode 436 are connected, and the capacitance can be measured by applying different voltages to each of them.

[0121] Fifth Example 10 and 11, a multilayer electronic component 500 according to a fifth embodiment of the present invention will be described. The first internal electrode 521 may be connected to a first external electrode 531 disposed on a portion of the fifth surface 5 so as to cover the first lead portion 521a via a first lead portion 521a in contact with the portion of the fifth surface 5. The second internal electrode 522 may be connected to a second external electrode 532 disposed on a portion of the fifth surface 5 so as to cover the second lead portion 522b via a second lead portion 522b in contact with the portion of the fifth surface 5. The third internal electrode 523 may be connected to a third external electrode 533 disposed on a portion of the sixth surface 6 so as to cover the third lead portion 523c via a third lead portion 523c in contact with the portion of the sixth surface 6. The fourth internal electrode 524 may be connected to a fourth external electrode 534 disposed on a portion of the sixth surface 6 so as to cover the fourth lead portion 524d via the fourth lead portion 524d that contacts a portion of the sixth surface 6.

[0122] At this time, the first external electrode 531 and the third external electrode 532 may be connected by a first connecting electrode 535 disposed on the second surface 2, and the second external electrode 532 and the fourth external electrode 534 may be connected by a second connecting electrode 536 disposed on the first surface 1. As a result, the first external electrode 531, the third external electrode 532, and the first connecting electrode 535 are connected, and the second external electrode 532, the fourth external electrode 534, and the second connecting electrode 536 are connected, and a different voltage is applied to each of them to measure the capacitance.

[0123] Although the embodiment of the present invention has been described in detail above, the present invention is not limited to the above-mentioned embodiment and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications and changes can be made by a person having ordinary knowledge in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0124] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0125] The terms used in the present invention are merely used to describe one embodiment and are not intended to limit the present invention. In this case, a singular expression includes a plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0126] 100: Multilayer electronic components 110: Main unit 111: Dielectric layer 121: 1st internal electrode 122:Second internal electrode 123:Third internal electrode 124: 4th internal electrode 131: 1st external electrode 132:Second external electrode 133: Third external electrode 134: 4th external electrode 135, 136: Connecting electrode

Claims

1. a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; an external electrode disposed on the body; The internal electrodes are connected to the external electrodes via lead portions, the external electrodes include a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode spaced apart from each other, and a first connecting electrode connecting the first external electrode and the third external electrode, The first connecting electrode includes a conductive material.

2. the external electrodes further include a second connecting electrode connecting the second external electrode and the fourth external electrode, The multilayer electronic component according to claim 1 , wherein the second connection electrode comprises a conductive material.

3. 2. The multilayer electronic component according to claim 1, wherein when the shortest distances from the first connecting electrode to the second external electrode and the fourth external electrode are defined as Td1 and Td2, respectively, and a width of the first connecting electrode is defined as Td3, the following conditions are satisfied: 90 μm≦Td1, 90 μm≦Td2, and 0 μm<Td3.

4. 3. The multilayer electronic component according to claim 2, wherein when the shortest distances from the second connecting electrode to the first external electrode and the third external electrode are defined as Bd1 and Bd2, respectively, and the width of the second connecting electrode is defined as Bd3, 90 μm≦Bd1, 90 μm≦Bd2, and 0 μm<Bd3 are satisfied.

5. 2. The multilayer electronic component according to claim 1, wherein the first external electrode is arranged on at least one of the third surface and the fifth surface, the second external electrode is arranged on at least one of the fourth surface and the fifth surface, the third external electrode is arranged on at least one of the fourth surface and the sixth surface, and the fourth external electrode is arranged on at least one of the third surface and the sixth surface.

6. The multilayer electronic component according to claim 1 , wherein the first connecting electrode is disposed on the second surface.

7. The multilayer electronic component according to claim 2 , wherein the first connecting electrode is disposed on the second surface, and the second connecting electrode is disposed on the first surface.

8. 8. The multilayer electronic component according to claim 1, wherein the internal electrodes include a first internal electrode connected to the first external electrode via a first lead portion, a second internal electrode connected to the second external electrode via a second lead portion, a third internal electrode connected to the third external electrode via a third lead portion, and a fourth internal electrode connected to the fourth external electrode via a fourth lead portion.

9. the second internal electrode further includes a second additional lead portion connected to the fourth external electrode, The multilayer electronic component of claim 8 , wherein the fourth internal electrode further comprises a fourth additional lead portion connected to the second external electrode.

10. The multilayer electronic component according to claim 1 , wherein a difference between a size of the multilayer electronic component in the second direction and a size of the multilayer electronic component in the third direction is 10% or less.

11. a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; an external electrode disposed on the body; The internal electrodes are connected to the external electrodes via lead portions, the external electrodes include a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode spaced apart from each other, a first connecting electrode connecting the first external electrode and the third external electrode, and a second connecting electrode connecting the second external electrode and the fourth external electrode.

12. When the shortest distances from the first connecting electrode to the second external electrode and the fourth external electrode are defined as Td1 and Td2, respectively, and the width of the first connecting electrode is defined as Td3, 90 μm≦Td1, 90 μm≦Td2, and 0 μm<Td3 are satisfied; 12. The multilayer electronic component according to claim 11, wherein when the shortest distances from the second connecting electrode to the first external electrode and the third external electrode are defined as Bd1 and Bd2, respectively, and the width of the second connecting electrode is defined as Bd3, 90 μm≦Bd1, 90 μm≦Bd2, and 0 μm<Bd3 are satisfied.

13. 12. The multilayer electronic component according to claim 11, wherein the internal electrodes include a first internal electrode connected to the first external electrode via a first lead portion, a second internal electrode connected to the second external electrode via a second lead portion, a third internal electrode connected to the third external electrode via a third lead portion, and a fourth internal electrode connected to the fourth external electrode via a fourth lead portion.

14. 12. The multilayer electronic component according to claim 11, wherein the first external electrode is arranged on at least one of the third surface and the fifth surface, the second external electrode is arranged on at least one of the fourth surface and the fifth surface, the third external electrode is arranged on at least one of the fourth surface and the sixth surface, and the fourth external electrode is arranged on at least one of the third surface and the sixth surface.

15. The multilayer electronic component according to claim 11 , wherein the first connecting electrode is disposed on the second surface, and the second connecting electrode is disposed on the first surface.

16. 16. The multilayer electronic component according to claim 11, wherein a difference between a size of the multilayer electronic component in the second direction and a size of the multilayer electronic component in the third direction is 10% or less.

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