Multilayer electronic component

Abstract

To improve capacitance per unit volume of a multilayer electronic component without deteriorating reliability thereof.SOLUTION: A multilayer electronic component includes: a body including a dielectric layer 111, a first internal electrode layer 120a and a second internal electrode layer 120b, which are alternately disposed in a first direction with the dielectric layer interposed therebetween; a first external electrode disposed on one surface of two surfaces of the body opposing each other in a second direction perpendicular to the first direction; and a second external electrode disposed on the other surface of the two surfaces of the body opposing each other in the second direction. Each of the internal electrode layers includes a plurality of internal electrodes connected to each of the external electrodes. When s is a distance in a third direction between a first internal electrode 121 and a second internal electrode 122 that is most adjacent to the first internal electrode in the third direction and td is a distance in the first direction between the first internal electrode and a second internal electrode that is most adjacent to the first internal electrode in the first direction, s≥td is satisfied.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as visual devices like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, mobile phones, and infotainment systems, and serve to charge and discharge electricity.

[0003] As electronic products become smaller, slimmer, and more multifunctional, chip components are also required to be smaller, and the packaging of electronic components is becoming more highly integrated. In response to this trend, the space between mounted electronic components is being minimized.

[0004] For an MLCC to have high capacitance, it may be necessary to use a material with a high dielectric constant for the dielectric layer or to design it to have a thinner dielectric layer. However, since MLCCs must simultaneously satisfy many characteristics in addition to capacitance, such as temperature characteristics, voltage characteristics, and humidity resistance reliability, there is a limit to how much the thickness of the dielectric layer can be reduced.

[0005] Therefore, there is a need for structural improvements to MLCCs that can increase the capacitance per unit volume without reducing reliability. Summary of the Invention [Problem to be solved by the invention]

[0006] One of the various objects of the present invention is to improve the capacitance per unit volume of a multilayer electronic component.

[0007] One of the various objects of the present invention is to increase the capacitance per unit volume of a multilayer electronic component without reducing reliability.

[0008] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A multilayer electronic component according to an embodiment of the present invention includes a body including a dielectric layer, first internal electrode layers and second internal electrode layers alternately arranged in a first direction with the dielectric layer sandwiched therebetween, a first external electrode arranged on one surface of the body facing in a second direction perpendicular to the first direction, and a second external electrode arranged on the other surface of the body facing in the second direction, wherein the first internal electrode layer includes a first internal electrode connected to the first external electrode, the second internal electrode layer includes a second internal electrode connected to the second external electrode, and the first and second internal electrodes are arranged in a first and second direction. The first internal electrodes of the first internal electrode layer are alternately arranged in the first direction and spaced apart from each other in a third direction perpendicular to the first direction, and the second internal electrodes of the second internal electrode layer are alternately arranged in the first direction and the second internal electrodes of the first internal electrode layer are alternately arranged in the first direction with the first internal electrodes of the second internal electrode layer, and when the third direction interval between the first internal electrode and the second internal electrode closest to the first internal electrode in the third direction is s and the first direction interval between the first internal electrode and the second internal electrode closest to the first internal electrode in the first direction is td, s≧td is satisfied. [Effects of the Invention]

[0010] One of the many advantages of the present invention is that it improves the density of the electric field, thereby increasing capacitance per unit volume.

[0011] One of the various advantages of the present invention is that the capacitance per unit volume is improved without reducing reliability in an internal electrode structure for improving the integration density of the electric field.

[0012] However, the various advantageous and beneficial effects of the present invention are not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view schematically illustrating a main body according to an embodiment. [Figure 3] 10A and 10B are cross-sectional views showing cross sections in the first and third directions of a multilayer electronic component according to a comparative example, which has been polished up to the center in the second direction. [Figure 4] FIG. 2 is a cross-sectional view taken along line II' of FIG. [Figure 5] FIG. 2 is a plan view showing an internal electrode layer according to an embodiment. [Figure 6] 3A and 3B are cross-sectional views showing cross sections of a capacitance forming portion in a first direction and a third direction according to an embodiment. [Figure 7] 1A is a schematic diagram showing an example of a (3×n) matrix of the electric field flux between the internal electrodes of a multilayer electronic component according to a comparative example, and FIG. 1B is a schematic diagram showing an example of a (3×n) matrix of the electric field flux between the internal electrodes of a multilayer electronic component according to an embodiment. [Figure 8] 1A is a schematic diagram showing an example of an (n×3) matrix of the electric field flux between the internal electrodes of a multilayer electronic component according to a comparative example, and FIG. 1B is a schematic diagram showing an example of an (n×3) matrix of the electric field flux between the internal electrodes of a multilayer electronic component according to an embodiment. [Figure 9] FIG. 7 is an enlarged view of region P in FIG. 6. [Figure 10] 10 is a perspective view showing a part of a process of laminating internal electrodes and dielectric layers according to an embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0015] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation have been omitted, and the size and thickness of each component shown in the drawings have been arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to those shown in the drawings. Furthermore, components that have the same function within the same concept will be described using the same reference numerals. Furthermore, throughout the specification, when a part "comprises" a certain component, this does not mean that it excludes other components, but that it may further include other components, unless otherwise specified to the contrary.

[0016] In the drawings, the first direction may be defined as a direction in which first and second internal electrodes are alternately arranged with a dielectric layer sandwiched therebetween, or a thickness T direction, and the second and third directions may be defined as a length L direction and a width W direction, which are directions perpendicular to the first direction.

[0017] 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a perspective view schematically showing a main body according to an example, FIG. 3 is a cross-sectional view showing a cross section in the first direction and a cross section in the third direction of a multilayer electronic component according to a comparative example, which is polished to the center in the second direction, FIG. 4 is a cross-sectional view of I-I' in FIG. 1, FIG. 5 is a plan view showing an internal electrode layer according to an example, FIG. 6 is a cross-sectional view showing a cross section in the first direction and a cross section in the third direction of a capacitance forming portion according to an example, and FIG. 7(a) is a cross-sectional view showing an electric field flux between internal electrodes of a multilayer electronic component according to a comparative example, which is polished to the center in the second direction of a (3×n) matrix. 7(b) is a schematic diagram showing an example of an electric field flux between the internal electrodes of a multilayer electronic component according to an embodiment as a (3×n) matrix, FIG. 8(a) is a schematic diagram showing an example of an electric field flux between the internal electrodes of a multilayer electronic component according to a comparative example as an (n×3) matrix, FIG. 8(b) is a schematic diagram showing an example of an electric field flux between the internal electrodes of a multilayer electronic component according to an embodiment as an (n×3) matrix, FIG. 9 is an enlarged view of region P in FIG. 6, and FIG. 10 is a perspective view showing a part of a process of laminating internal electrodes and dielectric layers according to an embodiment.

[0018] Hereinafter, a multilayer electronic component 100 according to one embodiment of the present invention and various examples thereof will be described in detail with reference to FIGS.

[0019] A multilayer electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111, a body including first internal electrode layers 120a and second internal electrode layers 120b alternately arranged in a first direction with the dielectric layer sandwiched therebetween, a first external electrode 130 arranged on one surface of the body facing in a second direction perpendicular to the first direction, and a second external electrode 140 arranged on the other surface of the body facing in the second direction, the first internal electrode layer including a first internal electrode 121 connected to the first external electrode, the second internal electrode layer including a second internal electrode 122 connected to the second external electrode, and the first and second internal electrodes 121 and 122 The electrodes are alternately arranged spaced apart from each other in a third direction perpendicular to the first and second directions, the first internal electrodes of the first internal electrode layer are alternately arranged with the second internal electrodes of the second internal electrode layer in the first direction, and the second internal electrodes of the first internal electrode layer are alternately arranged with the first internal electrodes of the second internal electrode layer in the first direction, and when the third direction interval between the first internal electrode and the second internal electrode closest to the first internal electrode in the third direction is s and the first direction interval between the first internal electrode and the second internal electrode closest to the first internal electrode in the first direction is td, s≧td is satisfied.

[0020] Referring to FIG. 4, the body 110 includes a dielectric layer 111 and first and second internal electrode layers 120a and 120b alternately arranged in a first direction with the dielectric layer 111 sandwiched therebetween.

[0021] Although there is no particular limitation on the specific shape of the body 110, as shown in the figure, the body 110 may have a hexahedral shape or a similar shape. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0022] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2, connected to the third and fourth surfaces 3 and 4, and facing each other in the third direction.

[0023] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0024] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti1 - y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. In this case, the dielectric layer 111 can contain barium (Ba) and titanium (Ti), and can further contain calcium (Ca) and zirconium (Zr) depending on the elements in solid solution.

[0025] On the other hand, as a raw material for forming the dielectric layer 111, a CaZrO3-based normal dielectric (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) (CSZT) material can be used. In this case, the dielectric layer 111 can contain calcium (Ca), strontium (Sr), zirconium (Zr), and titanium (Ti).

[0026] In addition, the raw material for forming the dielectric layer 111 may be a powder such as barium titanate (BaTiO3) to which various ceramic additives, organic solvents, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0027] The first internal electrode layers 120a and the second internal electrode layers 120b are alternately arranged with the dielectric layer 111 interposed therebetween, and thus can function to form a capacitance together with the dielectric layer 111. However, the capacitance does not have to be formed over the entire area of ​​the first internal electrode layers 120a and the second internal electrode layers 120b, but can be formed only in an area where an electric field is formed by the first internal electrodes 121, 122 and the second internal electrode 122 overlapping in the first direction or the third direction, as described below, and its periphery. For convenience of explanation, the present specification defines the area where the first internal electrode 121 and the second internal electrode 122 overlap in the first direction or the third direction as a capacitance-forming portion Ac, but the area where the capacitance is actually formed may be different from the capacitance-forming portion Ac.

[0028] In one embodiment, cover portions 112 and 113 may be arranged on one and the other surfaces of the capacitance forming portion Ac in the first direction.

[0029] The cover parts 112 and 113 may be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0030] The cover portions 112 and 113 do not include internal electrodes and may include the same material as the dielectric layer 111. That is, the cover portions 112 and 113 may include a ceramic material, for example, a barium titanate (BaTiO)-based ceramic material.

[0031] On the other hand, there is no need to particularly limit the average thickness of the covers 112 and 113. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the covers 112 and 113 can be 15 μm or less.

[0032] The average thickness of the cover parts 112, 113 may refer to the size in the first direction, and may be the average value of the size in the first direction of the cover parts 112, 113 measured at five equally spaced points on the top or bottom of the capacitance forming part Ac.

[0033] Referring to FIG. 2, in one embodiment, margin portions 114 and 115 may be arranged on one and the other surfaces of the capacitance forming portion Ac in the third direction.

[0034] The margins 114 and 115 may refer to regions between both ends of the first and second internal electrodes 121 and 122 and the boundary surface of the body 110, as shown in FIG.

[0035] The margin portions 114 and 115 basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0036] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet except for the areas where the margin portions are to be formed, thereby forming internal electrodes.

[0037] In addition, in order to suppress the steps caused by the internal electrodes 121, 122, after lamination, the internal electrodes can be cut so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115.

[0038] On the other hand, there is no need to particularly limit the width of the marginal portions 114, 115. However, in order to more easily achieve a smaller size and higher capacity of the multilayer electronic component, the average width of the marginal portions 114, 115 can be 15 μm or less.

[0039] The average width of the margin portions 114, 115 may refer to the average size of the margin portions 114, 115 in the third direction, and may be the average value of the size of the margin portions 114, 115 in the third direction measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0040] The internal electrodes 121 and 122 may be alternately arranged in a first direction with the dielectric layer 111 interposed therebetween, and may also be alternately arranged in a third direction. The internal electrodes 121 and 122 may be divided into a first internal electrode 121 connected to the first external electrode 130 and a second internal electrode connected to the second external electrode 140. In this case, the first internal electrode 121 may be spaced apart from the second external electrode 140, and the second internal electrode 122 may be spaced apart from the first external electrode 121. As a result, different voltages may be applied to the first internal electrode 121 and the second internal electrode 122, respectively.

[0041] Meanwhile, the dielectric layer 111 may also be disposed in the space where the first internal electrode 121 is separated from the second external electrode 140 (described later) and in the space where the second internal electrode 122 is separated from the first external electrode 130 (described later), thereby improving the mechanical strength and moisture resistance reliability of the multilayer electronic component 100.

[0042] 4, the first internal electrodes 121 and the second internal electrodes 122 may be alternately arranged in the same internal electrode layer 120a, 120b at a distance in the third direction, and the first internal electrodes 121 included in one internal electrode layer 120a, 120b may be alternately arranged in the first direction with the second internal electrodes 122 included in the other internal electrode layer. Meanwhile, since the internal electrode layers 120a, 120b are arranged with the dielectric layer 111 sandwiched between them as described above, the first internal electrodes 121 included in one internal electrode layer 120a, 120b may be alternately arranged in the first direction with the second internal electrodes 122 included in the other internal electrode layer. Similarly, the second internal electrodes 122 included in one internal electrode layer 120a, 120b may be alternately arranged in the first direction with the first internal electrodes 121 included in the other internal electrode layer at a distance.

[0043] There are no particular limitations on the material forming the internal electrodes 121 and 122, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0044] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes, including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, on the ceramic green sheets. The method for printing the conductive paste for internal electrodes may be screen printing or gravure printing, but the present invention is not limited thereto.

[0045] The external electrodes 130, 140 are disposed on the body 110. The external electrodes 130, 140 may include a first external electrode 130 in contact with the third surface 3 of the body 110 and a second external electrode 140 in contact with the fourth surface 4. The first external electrode 130 may be connected to the first internal electrode 121, and the second external electrode 140 may be connected to the second external electrode.

[0046] In this embodiment, the multilayer electronic component 100 has a structure having two external electrodes 130 and 140, but the number and shape of the external electrodes 130 and 140 can be changed depending on the shape of the internal electrodes 121 and 122 and other purposes.

[0047] Meanwhile, the external electrodes 130 and 140 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined in consideration of electrical properties, structural stability, etc., and may further have a multi-layer structure.

[0048] For example, the external electrodes 130, 140 may include an electrode layer disposed on the body 110 and a plating layer disposed on the electrode layer.

[0049] As a more specific example of the electrode layer, the electrode layer may be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and resin.

[0050] The electrode layer may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, and may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0051] The conductive metal contained in the electrode layer may be, but is not limited to, a material with excellent electrical conductivity, such as nickel (Ni), copper (Cu), or an alloy thereof, and preferably copper (Cu) to improve adhesion to the body.

[0052] The plating layer serves to improve mounting characteristics. The type of plating layer is not particularly limited, and may be a plating layer containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, and may be formed of multiple layers.

[0053] More specifically, the plating layer may be a Ni plating layer or a Sn plating layer, or may be a form in which a Ni plating layer and a Sn plating layer are sequentially formed on an electrode layer, or a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. The plating layer may also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0054] 3 is a cross-sectional view showing a multilayer electronic component according to a comparative example, polished to the center in the second direction, in the first and third directions. This structure shows a multilayer electronic component having internal electrodes with a conventional general structure.

[0055] Specifically, in the case of the multilayer electronic component according to the comparative example, the capacitance-forming portion Ac' is composed of first internal electrodes 121' and second internal electrodes 122' that are alternately arranged with the dielectric layer 111' sandwiched therebetween. At this time, the internal electrodes 121' and 122' are continuously formed in the second or third direction to ensure an overlapping area of ​​the internal electrodes.

[0056] 3, in order to improve the capacitance per unit volume, it is necessary to increase the degree of lamination by reducing the thickness of the dielectric layer 111' or the internal electrodes 121', 122', and to solve the decrease in reliability that occurs in this process, a method such as increasing the number of dielectric grains per layer of the dielectric layer 111' is used. However, in ultra-compact, high-capacity multilayer electronic components, there is a limit to how much the thickness of the dielectric layer 111' or the internal electrodes 121', 122' can be reduced, and there is also a limit to how much the number of dielectric grains can be increased per layer in the thinner dielectric layer.

[0057] 4 and 5, the structures of the first internal electrode layer 120a and the second internal electrode layer 120b of the multilayer electronic component 100 according to an embodiment of the present invention can be seen.

[0058] Specifically, the first internal electrode layer 120a and the second internal electrode layer 120b include a first internal electrode 121 connected to the first external electrode 130 and a second internal electrode connected to the second external electrode 130. That is, unlike the conventional case, the multilayer electronic component 100 according to an embodiment of the present invention may include all of the internal electrodes connected to different electrodes in each internal electrode layer.

[0059] 4 and 5, the first and second internal electrodes 121, 122 are alternately arranged at a distance in a third direction, which is a direction perpendicular to the first and second directions. The first internal electrodes 121 of the first internal electrode layer 120a are alternately arranged in the first direction with the second internal electrodes 122 of the second internal electrode layer 120, and the second internal electrodes 122 of the first internal electrode layer 120a are alternately arranged in the first direction with the first internal electrodes 121 of the second internal electrode layer 120b. This improves the density of the internal electrodes that contribute to capacitance formation compared to the conventional case shown in FIG. 3. More specifically, the capacitance per unit volume of the multilayer electronic component can be improved by increasing the number of electric field fluxes between the internal electrodes of the multilayer electronic component.

[0060] Hereinafter, it will be described with reference to a schematic diagram of internal electrodes how the capacitance per unit volume of the multilayer electronic component according to an embodiment of the present invention is significantly improved compared to the conventional case due to the difference in the internal electrode structure.

[0061] FIG. 7(a) is a schematic diagram showing the electric field flux between the internal electrodes of a multilayer electronic component according to a comparative example as an example of a (3×n) matrix, and FIG. 7(b) is a schematic diagram showing the electric field flux between the internal electrodes of a multilayer electronic component according to an example as an example of a (3×n) matrix.

[0062] The comparative example is a case where the first and second internal electrodes are formed continuously in the second or third direction, as in the conventional case described above, and the example is a case where the first and second internal electrodes are arranged spaced apart in the second or third direction, as in one embodiment of the present invention. In Figures 7(a) and 7(b), E represents an electric field, and the direction of the arrow indicates the direction of the electric field.

[0063] Specifically, assuming a (3×n) matrix, if the stacking degree of the internal electrodes 121′ and 122′ in FIG. 7(a) is n, the total number of electric field fluxes in the comparative example is equivalent to 3n. On the other hand, if the stacking degree of the internal electrodes 121 and 122 in FIG. 7(b) is n, the total number of electric field fluxes in the embodiment is equivalent to 3n+1. In other words, it can be seen that the difference in the number of electric field fluxes between the comparative example and the embodiment due to the internal electrode structure at the same stacking degree is 1.

[0064] FIG. 8(a) is a schematic diagram showing the electric field flux between the internal electrodes of a multilayer electronic component according to a comparative example as an example of an (n×3) matrix, and FIG. 8(b) is a schematic diagram showing the electric field flux between the internal electrodes of a multilayer electronic component according to an example as an example of an (n×3) matrix.

[0065] The comparative example is a case where the first and second internal electrodes are formed continuously in the second or third direction, as in the conventional case described above, and the example is a case where the first and second internal electrodes are arranged spaced apart in the second or third direction, as in one embodiment of the present invention. In Figures 8(a) and 8(b), E represents an electric field, and the direction of the arrow indicates the direction of the electric field.

[0066] Specifically, assuming an (n × 3) matrix, if the number of divisions of the internal electrodes 121' and 122' in Figure 8(a) is n, the total number of electric field fluxes in the comparative example is equivalent to 2n + 1. On the other hand, if the number of divisions of the internal electrodes 121 and 122 in Figure 8(b) is n, the total number of electric field fluxes in the embodiment is equivalent to 3n + 1. In other words, it can be seen that the difference in the number of electric field fluxes between the comparative example and the embodiment due to the internal electrode structure with the same number of divisions reaches 50%.

[0067] Summarizing the results of Figures 7 and 8, when the first internal electrodes and second internal electrodes 121, 122 are arranged alternately at a distance in a third direction, which is a direction perpendicular to the first and second directions, and the first internal electrodes 121 of the first internal electrode layer 120a are arranged alternately with the second internal electrodes 122 of the second internal electrode layer 120 in the first direction, and the second internal electrodes 122 of the first internal electrode layer 120a are arranged alternately with the first internal electrodes 121 of the second internal electrode layer 120b in the first direction, as in one embodiment of the present invention, it can be seen that the number of electric field fluxes can be significantly improved compared to the conventional case, and thereby the electrostatic capacitance per unit volume of the multilayer electronic component 100 can be significantly improved.

[0068] 7 and 8, it can be seen that the number of divisions of the internal electrodes in the third direction (the width direction of the electrode layers) and the number of internal electrode overlaps is more important than the stacking degree of the internal electrodes in the first direction (the stacking direction of the electrode layers) in improving the capacitance per unit volume of the multilayer electronic component 100. In other words, if the stacking degree of the first internal electrodes 121 and the second internal electrodes 122 in the third direction is higher than the stacking degree of the first internal electrodes 121 and the second internal electrodes 122 in the first direction, it is more advantageous for improving the capacitance per unit volume of the multilayer electronic component 100.

[0069] Here, the stacking degree in the first direction may refer to the number of first internal electrodes 121 and second internal electrodes 122 overlapping in the first direction, and the stacking degree in the third direction may refer to the number of first internal electrodes 121 and second internal electrodes 122 overlapping in the third direction. That is, in one embodiment, the number of first internal electrodes 121 and second internal electrodes 122 overlapping in the third direction may be greater than the number of first internal electrodes 121 and second internal electrodes 122 overlapping in the first direction.

[0070] 4, the first internal electrodes 121 and the second internal electrodes 122 according to an embodiment may be arranged in a lattice pattern in the first and third cross sections of the multilayer electronic component 100. This increases the number of electric field fluxes between the internal electrodes of the multilayer electronic component, thereby improving the capacitance per unit volume of the multilayer electronic component.

[0071] The shape of the lattice structure and the positions of the internal electrodes 121 and 122 are not particularly limited as long as they satisfy an embodiment of the present invention. As an example, the first internal electrode layer 120a and the second internal electrode layer 120b may include a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122, and the internal electrode closest to any one of the plurality of first internal electrodes 121 may be the second internal electrode 122. This increases the number of electric field fluxes formed between the internal electrodes 121 and 122, thereby significantly improving the capacitance per unit volume of the multilayer electronic component 100.

[0072] Meanwhile, as in one embodiment of the present invention, the first and second internal electrodes 121, 122 are alternately arranged at a distance in a third direction perpendicular to the first and second directions, and the first internal electrodes 121 of the first internal electrode layer 120a are alternately arranged with the second internal electrodes 122 of the second internal electrode layer 120 in the first direction, and the second internal electrodes 122 of the first internal electrode layer 120a are alternately arranged with the first internal electrodes 121 of the second internal electrode layer 120b in the first direction. A method for forming such a structure is not particularly limited. As shown in Fig. 10, the first internal electrode forming conductive patterns 221 and the second internal electrode forming conductive patterns 222 may be formed on a dielectric ceramic green sheet 211, and then stacked, pressed, and fired. The conductive pattern 221 for forming the first internal electrode and the conductive pattern 222 for forming the second internal electrode may be formed by printing, but is not limited to this, and may be formed by attaching a one-dimensional conductive material that is continuous in the second direction to the dielectric ceramic green sheet 211.

[0073] Meanwhile, the first and second internal electrodes 121, 122 are alternately arranged at a distance in a third direction, which is perpendicular to the first and second directions, and the first internal electrodes 121 of the first internal electrode layer 120a are alternately arranged in the first direction with the second internal electrodes 122 of the second internal electrode layer 120, and the second internal electrodes 122 of the first internal electrode layer 120a are alternately arranged in the first direction with the first internal electrodes 121 of the second internal electrode layer 120b. Although the capacitance per unit volume of the multilayer electronic component 100 can be improved, it may be difficult to ensure reliability. In order to improve reliability, such as withstand voltage characteristics, in the internal electrode structure of the embodiment of the present invention, various parameters, such as the relative positions and thicknesses of the dielectric layer 111, the first internal electrodes 121, and the second internal electrodes 122, need to be adjusted.

[0074] 9 is an enlarged view of region P in FIG. 6. Referring to FIG. 9, the third-direction distance s between a first internal electrode 121 and a second internal electrode closest to the first internal electrode in the third direction is denoted as s. The third-direction distance s between the first internal electrode 121 and the second internal electrode closest to the first internal electrode in the third direction may refer to the third-direction distance of a line segment connecting one end in the third direction of the first internal electrode 121 and one end in the third direction of one of the second internal electrodes 122 that faces the one end in the third direction of the first internal electrode 121 in a cross section polished to the center of the multilayer electronic component 100 in the second direction. The third-direction distance s may be measured using, but is not limited to, a scanning electron microscope (SEM) or an optical microscope (OM).

[0075] The above s can be further generalized by taking the average value of values ​​measured in the central region of the capacitance-forming portion adjusted so that the first and second internal electrodes appear as 10 or more layers in the first direction in the cross section in the first and third directions polished to the center in the second direction of the multilayer electronic component 100. That is, s can be the average distance in the third direction between the first internal electrode 121 and the second internal electrode that is closest to the first internal electrode in the third direction.

[0076] 9, the first-direction distance between the first internal electrode 121 and the second internal electrode 122 closest to the first internal electrode in the first direction is denoted as td. The first-direction distance td between the first internal electrode 121 and the second internal electrode 122 closest to the first internal electrode in the first direction may refer to the first-direction distance of a line segment connecting one end in the first direction of the first internal electrode 121 and one end in the first direction of the second internal electrode 122 facing the one end in the first direction of the first internal electrode 121 in a cross section in the first and third directions polished to the center of the multilayer electronic component 100 in the second direction, and may be measured using a scanning electron microscope (SEM) or an optical microscope (OM), but is not limited thereto.

[0077] The td can be further generalized by taking the average value of values ​​measured on 10 or more internal electrodes in a central region of a capacitance-forming portion adjusted so that the first and second internal electrodes appear as 10 or more layers in the first direction in a cross section in the first and third directions polished to the center in the second direction of the multilayer electronic component 100. That is, td can be the average distance in the first direction between the first internal electrode 121 and the second internal electrode 122 closest to the first internal electrode in the first direction.

[0078] 9, the maximum size in the first direction of the first internal electrode 121 and the second internal electrode 122 is denoted as te, and the maximum size in the third direction is denoted as we. Since the thickness and width of the first and second internal electrodes 121 and 122 may vary depending on the specific shapes of the first and second internal electrodes 121 and 122, in the present invention, values ​​corresponding to the thickness and width of the first and second internal electrodes 121 and 122 are set as the maximum size in the first direction te and the maximum size in the third direction we of the first and second internal electrodes 121 and 122, respectively. Specifically, in a cross section in the first and third directions of the multilayer electronic component 100 polished to the center in the second direction, the first-direction size of a line segment connecting the highest point and the lowest point in the first direction of any one of the first internal electrodes included in the capacitance forming portion may be defined as the first-direction maximum size te of the first internal electrode 121, and the third-direction size of a line segment connecting the outermost points in the third direction (maximum point in the + direction, maximum point in the - direction) of any one of the first internal electrodes may be defined as the third-direction maximum size we of the first internal electrode 121. This measurement may be similarly applied to the second internal electrode 122, and may be measured using a scanning electron microscope (SEM) or an optical microscope (OM), but is not limited thereto.

[0079] The above te and we can be further generalized by taking the average values ​​of measurements of 10 or more internal electrodes in the central region of the capacitance-forming portion adjusted so that the first and second internal electrodes appear as 10 or more layers in the first direction in a cross section in the first and third directions polished to the center in the second direction of the multilayer electronic component 100. That is, te can mean the average value of the maximum magnitudes of the first and second internal electrodes in the first direction, and we can mean the average value of the maximum magnitudes of the first and second internal electrodes in the third direction.

[0080] In one embodiment, s≧td may be satisfied. If the third-direction distance s between a first internal electrode and a second internal electrode closest to the first internal electrode in the third direction is smaller than the first-direction distance td between the first internal electrode and the second internal electrode closest to the first internal electrode in the first direction, a failure may occur at the distance s between the first internal electrode and the second internal electrode closest to the first internal electrode in the third direction when a high voltage is applied to the multilayer electronic component. Therefore, in one embodiment, the distance between the internal electrodes adjacent in the third direction is adjusted to be the same as or wider than the distance between the internal electrodes adjacent in the first direction, thereby improving the capacitance per unit volume of the multilayer electronic component 100 and improving its withstand voltage characteristics.

[0081] On the other hand, if the dielectric layers are formed as thin films, such as when s or td is 0.41 μm or less, reliability issues may be exacerbated due to failures occurring at s between the first internal electrode and the second internal electrode closest to the first internal electrode in the third direction when a high voltage is applied to the multilayer electronic component. However, in one embodiment, by satisfying s≧td, the withstand voltage characteristics in the third direction, which plays a more important role in capacitance formation, are improved, so the withstand voltage characteristics of the multilayer electronic component 100 can be ensured even when s or td is adjusted to 0.41 μm or less. In other words, the reliability improvement effect of this embodiment may be more significant when s or td is 0.41 μm or less.

[0082] In one embodiment, te≦td may be satisfied. If the maximum size te of the first and second internal electrodes 121, 122 is larger than the distance td in the first direction between the first internal electrode and the second internal electrode closest to the first internal electrode in the first direction, a fringing effect is likely to occur in the internal electrodes. This fringing effect may cause interference with the electric field generated between the first internal electrode 121 and the second internal electrode 122 in the capacitance forming portion, thereby reducing the capacitance per unit volume of the multilayer electronic component 100. Therefore, in one embodiment, the maximum size te of the first and second internal electrodes 121, 122 is adjusted to be equal to or smaller than the distance td in the first direction between the first internal electrode and the second internal electrode closest to the first internal electrode in the first direction, thereby further improving the capacitance per unit volume of the multilayer electronic component 100.

[0083] In the cross sections in the first and third directions, the shapes of the internal electrodes 121 and 122 are not particularly limited, and may be polygonal, regular polygonal, circular, elliptical, or the like.

[0084] In one embodiment, 0.5≦te / we≦1.5 can be satisfied, and more preferably 0.9≦te / we≦1.1 can be satisfied. This allows the first and second internal electrodes 121, 122 to be controlled in shape and efficiently arranged in the capacitance forming portion, thereby further improving the capacitance per unit volume of the multilayer electronic component 100. In this case, when 0.9≦te / we≦1.1 is satisfied, it can be said that the first internal electrode 121 and the second internal electrode 122 have a substantially regular quadrilateral shape in the cross sections in the first and third directions.

[0085] While FIG. 5 illustrates a case where there are a total of 12 internal electrode layers, the present invention is not limited thereto. As shown in FIG. 6, the number of internal electrodes may be 50 or more in the first direction and 50 or more in the third direction. This significantly increases the electric field flux formed between the first internal electrodes 121 and the second internal electrodes 122. In one embodiment, when the maximum size of the body 110 in the first direction is T, 50(te + td) ≦ T may be satisfied, and thus, 25 or more first internal electrode layers 120a and 25 or more second internal electrode layers 120b may be arranged in the first direction. Similarly, when the maximum size of the body 110 in the third direction is W, 50(s + te) ≦ W may be satisfied, and thus, 25 or more first internal electrodes 121 and 25 or more second internal electrodes 122 may be arranged in the third direction.

[0086] There is no particular limitation on the size of the multilayer electronic component 100. However, in order to simultaneously achieve miniaturization and high capacity, the number of layers is increased by reducing the thickness of the dielectric layers and internal electrodes, and therefore it may be difficult to ensure reliability with a multilayer electronic component 100 having a size of 0201 (length × width, 0.2 mm × 0.1 mm) or less.

[0087] Therefore, taking into consideration manufacturing errors, the size of the external electrodes, etc., the reliability improvement effect of the present invention can be more significant when the length of the multilayer electronic component 100 is 0.22 mm or less and the width is 0.11 mm or less. Here, the length of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component 100 in the second direction, and the width of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component 100 in the third direction.

[0088] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited only by the appended claims. Therefore, various substitutions, modifications, and changes may be made by a person skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and these also fall within the scope of the present invention.

[0089] Furthermore, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-described one embodiment does not exclude being realized in combination with features of another embodiment. For example, even if a feature described in one embodiment is not described in another embodiment, it can be understood as being related to the other embodiment unless there is a description in the other embodiment that contradicts or contradicts the feature.

[0090] The terms used in the present invention are merely used to describe one embodiment and are not intended to limit the present invention. In this case, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of symbols]

[0091] 100: Multilayer electronic components 110:Main body 111: Dielectric layer 112, 113: Cover part 114, 115: Margin 121, 122: Internal electrode 130, 140: External electrode 211: Dielectric ceramic green sheet 221, 222: Conductive patterns for forming internal electrodes

Claims

1. a main body including a dielectric layer, and first and second internal electrode layers alternately disposed in a first direction with the dielectric layer interposed therebetween; a first external electrode disposed on a surface of the body facing the first direction in a second direction perpendicular to the first direction; a second external electrode disposed on another surface of the body facing the second direction, the first internal electrode layer includes a first internal electrode connected to the first external electrode, and the second internal electrode layer includes a second internal electrode connected to the second external electrode, The first and second internal electrodes are alternately arranged apart from each other in a third direction perpendicular to the first and second directions, the first internal electrodes of the first internal electrode layer are alternately arranged with the second internal electrodes of the second internal electrode layer in the first direction, and the second internal electrodes of the first internal electrode layer are alternately arranged with the first internal electrodes of the second internal electrode layer in the first direction, When a distance in the third direction between the first internal electrode and a second internal electrode that is closest to the first internal electrode in the third direction is s, and a distance in the first direction between the first internal electrode and a second internal electrode that is closest to the first internal electrode in the first direction is td, A multilayer electronic component that satisfies s≧td.

2. When the maximum size of the first internal electrode and the second internal electrode in the first direction is te and the maximum size of the first internal electrode and the second internal electrode in the third direction is we, 2. The multilayer electronic component according to claim 1, wherein 0.5≦te / we≦1.5 is satisfied.

3. When a distance in the first direction between the first internal electrode and a second internal electrode that is closest to the first internal electrode in the first direction is td, The multilayer electronic component according to claim 1 , wherein te≦td is satisfied.

4. When the maximum size of the first internal electrode and the second internal electrode in the first direction is te and the maximum size of the body in the first direction is T, 2. The multilayer electronic component according to claim 1, wherein 50(te+td)≦T is satisfied.

5. When the maximum size of the first internal electrode and the second internal electrode in the first direction is te and the maximum size of the body in the third direction is W, 2. The multilayer electronic component according to claim 1, wherein 50(s+te)≦W is satisfied.

6. 2. The multilayer electronic component according to claim 1, wherein 25 or more layers of the first internal electrode layers and 25 or more layers of the second internal electrode layers are arranged in the first direction.

7. 2. The multilayer electronic component according to claim 1, wherein the first internal electrodes and the second internal electrodes are arranged in 25 layers or more in the third direction.

8. The multilayer electronic component according to claim 1 , wherein the number of the first internal electrodes and the second internal electrodes overlapping in the third direction is greater than the number of the first internal electrodes and the second internal electrodes overlapping in the first direction.

9. 2 . The multilayer electronic component according to claim 1 , wherein the first internal electrodes and the second internal electrodes are arranged in a lattice pattern in cross sections of the multilayer electronic component in the first direction and the third direction.

10. 2. The multilayer electronic component according to claim 1, wherein the first internal electrode and the second internal electrode have a substantially square shape in cross sections taken in the first and third directions.

11. The multilayer electronic component according to claim 1 , wherein the first internal electrode is disposed apart from the second external electrode, and the second internal electrode is disposed apart from the first external electrode.

12. The multilayer electronic component according to claim 11 , wherein the dielectric layer is also disposed in a space between the first internal electrode and the second external electrode and in a space between the second internal electrode and the first external electrode.

13. The first internal electrode layer and the second internal electrode layer include a plurality of first internal electrodes and a plurality of second internal electrodes, 2. The multilayer electronic component according to claim 1, wherein the internal electrode closest to any one of the plurality of first internal electrodes is the second internal electrode.

14. 2. The multilayer electronic component according to claim 1, wherein the dielectric layer contains Ba and Ti.

15. 15. The multilayer electronic component according to claim 1, wherein the dielectric layers contain calcium (Ca), strontium (Sr), zirconium (Zr) and titanium (Ti).

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