Laminate molding system

Abstract

To provide a laminate molding press machine, laminate molding system and laminate molding method, which enable laminate molding of a laminate molded product with high precision or which enable good laminate molding of a laminate molded product using a laminate film with high inorganic material content.SOLUTION: In a laminate molding press machine 3 for pressurizing and molding a laminate film A2 and a laminated material A1 with a concavo-convex part A1a between an upper platen 312 and a lower platen 314, pressure blocks 317 and 318 mounted on at least one platen 312 and 314 of the upper platen 312 or the lower platen 314 are provided with metal sheets 322 and 32 constituting pressure surfaces 322a and 325a via a resin film 321 of engineering plastic or thermosetting resin. A resin of the resin film has a R scale of Rockwell hardness of 15 or more and 140 or less.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a lamination molding press device that press-forms a laminated material having an uneven portion and a laminate film between an upper plate and a lower plate, a lamination molding system including the lamination molding press device, and a lamination molding method. [Background technology]

[0002] As a lamination molding press device for pressurizing a laminated material having an uneven portion and a laminated film between an upper plate and a lower plate, those described in Patent Documents 1 to 4 are known. In Patent Document 1, a flattening press machine, which is a lamination molding press device, is provided in a post-process of a vacuum lamination device. In the flattening press, a cushioning material made of rubber having a thickness of, for example, about 1.5 mm is attached to the surface of a polishing plate, which is a pressurizing block, and an elastically deformable mirror plate made of stainless steel having a thickness of about 2 mm is attached to the surface of the cushioning material. It is described that during molding, the mirror plate constituting the molding surface initially elastically deforms in accordance with the unevenness of the surface of the product, and then gradually acts to return to the original flat surface due to the elastic deformation of the cushioning material and the elastic deformation of the mirror plate.

[0003] Similarly to Patent Document 1, Patent Document 2 describes a flat press machine, which is a laminate molding press machine in a post-process of a vacuum lamination machine, and is also common in that a cushioning material and a flexible metal plate are sequentially placed on the surface of a press block in the flat press. Patent Document 2 also describes that fluororubber is particularly preferable as a material for the cushioning material, but also describes that paper and plastic may be used.

[0004] Furthermore, Patent Document 3 describes that a metal plate-like body is provided via a cushioning material on each surface of the hot platen facing the film-like resin material in both the vacuum lamination device for performing the primary molding and the flat press device for performing the secondary molding, and that an elastic press plate that abuts against the surface of the film-like resin material and presses it is adhered and fixed to the plate-like body. And, (0031) of the specification describes that it is preferable to provide a cushioning material having rubber elasticity or the like.

[0005] Furthermore, Patent Document 4 describes a vacuum press facility consisting of a first vacuum press device and a second vacuum press device, and describes that the pressure surface of the first vacuum press device has sufficient elasticity, and that the pressure surface of the second press device can be formed from a metal member, but can also be molded using an elastic member such as hard rubber. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2002-120100 A (Claim 1), (0029), (0035), (Fig. 1), (Fig. 5) [Patent Document 2] JP 2004-122553 A (Claim 1), (0041) to (0044), (Fig. 1) [Patent Document 3] JP 2008-12918 A (Abstract), (Claim 1), (0030), (0031), (Fig. 1), (Fig. 8) [Patent Document 4] JP 2005-334902 A (Claim 1), (0018), (0019), (Fig. 1) Summary of the Invention [Problem to be solved by the invention]

[0007] In recent years, the number of laminate films used in lamination molding that have an increased content of inorganic materials such as SiO2 has been increasing for the purpose of improving adhesion to the laminated object by lowering the roughness of the film surface, preventing peeling from the substrate by lowering the thermal expansion coefficient, improving insulation (reducing dielectric loss), and lowering the moisture content. However, as a result, the number of laminate films with a large Young's modulus has increased, and there is a problem that the fluidity of the molten material when the laminate film is heated and pressurized is also lower than that of conventional types of laminate films.

[0008] Furthermore, when the pressure applied during pressing is simply increased using a conventional press device to address this problem, as shown in Figure 5, the large elasticity of the cushioning material causes stress to concentrate on the parts of the pressing surface that correspond to the edges of the laminate, causing the resin material of the laminated film near the edges to flow outwards, resulting in molding defects.

[0009] Therefore, the present invention aims to provide a laminate molding press device, a laminate molding system, and a laminate molding method that enable laminate molding of highly accurate laminate molded products or enable good laminate molding of laminate molded products using laminate films with a high inorganic material content. [Means for solving the problem]

[0010] The laminate molding press apparatus according to claim 1 of the present invention is a laminate molding press apparatus for pressurizing a laminate material having an uneven portion and a laminate film between an upper platen and a lower platen, the pressurizing block attached to at least one of the upper platen and the lower platen is provided with a metal thin plate that constitutes a pressurizing surface via a resin film of engineering plastic or thermosetting resin, The resin of the resin film is characterized by having a hardness of 15 or more and 140 or less on the Rockwell R scale. Effect of the Invention

[0011] The laminate molding press device described in claim 1 of the present invention is a laminate molding press device which press-forms a laminate material having an uneven portion and a laminate film between an upper platen and a lower platen, and a pressure block attached to at least one of the upper platen or lower platen is provided with a thin metal plate which forms a pressure surface via a resin film of engineering plastic or thermosetting resin, and the resin of the resin film has a Rockwell R scale hardness of 15 or more and 140 or less, so that it is possible to laminate mold a highly accurate laminate molded product, or to laminate mold a laminate molded product using a laminate film with a high content of inorganic material. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic explanatory diagram of a lamination molding system according to a first embodiment. [Diagram 2] 1 is an enlarged view of a main part of a laminate molding press apparatus according to a first embodiment. [Diagram 3] FIG. 11 is a schematic explanatory diagram of a lamination molding system according to a second embodiment. [Figure 4] FIG. 11 is a schematic explanatory diagram of a lamination molding system according to a third embodiment. [Diagram 5] FIG. 1 is a schematic explanatory diagram showing pressure molding performed using a conventional laminate molding press device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] A lamination molding system 1 according to a first embodiment of the present invention will be described with reference to Fig. 1, which shows cross sections of a vacuum lamination device 2 and a lamination molding press device 3. In the lamination molding system 1, a lamination molding press device 3 is provided downstream of a vacuum lamination device 2, and a substrate A1 and a lamination film A2, which are materials to be laminated and have uneven portions and are transported from the vacuum lamination device 2 by carrier films F1 and F2, are press-molded by the lamination molding press device 3.

[0014] The carrier film delivery device 4, which also functions as a transfer device and tension device for the substrate A1 and the laminated film A2, is equipped with a lower unwinding roll 411 and a driven roll 412. The lower carrier film F1 unwound from the unwinding roll 411 is changed to a horizontal state at the driven roll 412. At the part where the lower carrier film F1 is in a horizontal state, a loading stage section 413 is provided on which the substrate A1 and the laminated film A2, which are the materials to be molded and sent in a superimposed state from the previous process, are placed. The carrier film delivery device 4 also includes an upper unwinding roll 414 and a driven roll 415, and the upper carrier film F2 unwound from the unwinding roll 414 is superimposed on the laminated molded product A3 consisting of the substrate A1 and the laminated film A2 at the driven roll 415. The substrate A1 and laminate film A2 are transported sandwiched between these carrier films F1, F2, and laminate molding is performed via the carrier films F1, F2 in the vacuum lamination device 2 or the laminate molding press device 3. This has the advantage of preventing the laminate film A2 from melting and adhering to the equipment parts, and also provides a certain cushioning effect when pressurizing the intermediate laminate material A4, particularly in the laminate molding press device 3.

[0015] The vacuum lamination device 2, which is disposed after the carrier film delivery device 4, pressurizes the laminated molded product A3 consisting of the substrate A1 and the laminated film A2 by a pressurizing body such as a diaphragm 211 in a vacuum state (reduced pressure state) chamber C, and laminates and molds an intermediate laminated material A4, which is a primary molded product. In the vacuum lamination device 2, the lower plate 213 is provided so as to be liftable and lowerable by a lifting mechanism 214 with respect to the fixedly provided upper plate 212, and when the lower plate 213 rises and abuts against the upper plate 212, a chamber C can be formed inside. The chamber C is connected to a vacuum pump (not shown) and can be depressurized. A hot plate 215 is attached to the lower surface at the center of the upper plate 212, and an elastic body 216 such as a heat-resistant rubber film (not shown) is attached to the surface of the hot plate 215. Meanwhile, a hot plate 217 is also attached to the upper surface at the center of the lower plate 213. A diaphragm 211 made of a heat-resistant rubber film, which is a pressurizing body, is attached to the periphery of the hot plate 217 of the lower plate 213 so as to cover the upper surface of the hot plate 217. When pressurized air is sent to the rear side of the diaphragm 211 by a compressor (not shown), the diaphragm 211 expands in the chamber C and pressurizes the substrate A1 and the laminated film A2 between the hot plate 217. The diaphragm 211 of the vacuum lamination device 2 may be attached to the upper plate. The pressurizing body of the vacuum lamination device may be one that pressurizes the substrate A1 and the laminated film A2 between roll bodies having an elastic body attached to their surfaces or between the roll body and the pressurizing plate.

[0016] The lamination molding press 3, which is disposed in series after the vacuum lamination device 2, pressurizes the intermediate laminate A4, which is made of the laminated material A1 and the laminated film A2, and has unevenness left on the laminated film A2 side, and pressurizes and molds it into a flatter laminated product A5. The lamination molding press 3 is provided with a substantially rectangular base plate 311 provided below and tie bars 313 erected between the four corners of an upper plate 312, which is a substantially rectangular fixed plate located above the base plate 311. The lamination molding press 3 is provided with a lower plate 314, which is a substantially rectangular movable plate, that can be raised and lowered between the base plate 311 and the upper plate 312. The base plate 311 is provided with a pressure cylinder 315, which is a pressure means and is operated by hydraulic pressure, and a ram 316 of the pressure cylinder 315 is fixed to the back surface of the lower plate 314. The pressurizing means of the laminate molding press apparatus 3 of the first embodiment may be of another type, such as a combination of an electric motor and a toggle device. Furthermore, the laminate molding press apparatus 3 may be one in which an upper platen descends relative to a lower platen. Furthermore, the laminate molding press apparatus 3 of the first embodiment does not have a chamber that can be put into a vacuum state, but it may be one that has a chamber that can be put into a vacuum state and pressurization is performed within the vacuum chamber.

[0017] Pressure blocks 317 and 318 are attached to the opposing surfaces of the upper plate 312 and the lower plate 314 of the laminate molding press device 3. Next, the pressure block 318 on the lower plate 314 side will be described in detail with reference to FIG. 2. In FIG. 2, the thickness of the fluororesin film 321, which is a resin film, and the stainless steel thin plate 322, which is a metal thin plate, are drawn thicker than in reality. A heat insulating material 319 is arranged between the lower plate 314 and the pressure block 318 of the laminate molding press device 3, and a plurality of cartridge heaters 320, which are heating means, are arranged in parallel inside the pressure block 318. The pressure block 318, which is also a hot plate, may be equipped with a polishing plate or a plate-shaped heater as in Patent Document 1, and is not limited to the one shown in FIG. 2.

[0018] A resin film of a thermosetting resin such as a fluororesin film 321 such as PTFE or an engineering plastic resin film such as polyimide is laid on the smooth surface 318a of the pressure block 318 as a buffer material. A metal thin plate such as a stainless steel thin plate 322 is laid on the surface of the fluororesin film 321. In the first embodiment, the surface 318a of the pressure block 318, the fluororesin film 321, and the stainless steel thin plate 322 have the same shape in a plan view. The surface of the stainless steel thin plate 322 constitutes the pressure surface 322a. The fluororesin film 321 and the stainless steel thin plate 322 are provided with holes for bolts (not shown) at multiple locations (4 locations, 6 locations, 8 locations, etc.) around the periphery other than the pressure surface, and bolts are inserted through the holes into the bolt holes of the pressure block 318, and the fluororesin film 321 and the stainless steel thin plate 322 are fixed to the pressure block 318. An adjustment portion may be provided at the portion where the bolt is inserted to allow for thermal expansion of the stainless steel thin plate 322, etc. Also, the method of attaching the fluororesin film 321 and the stainless steel thin plate 322 to the pressure block 318 may be by using a holder or adhesive other than the bolt. With the above-mentioned structure, the pressure block 318 of the laminate molding press device 3 is provided with the metal thin plate 322 that constitutes the pressure surface 322a via the fluororesin film 321, which is a buffer material.

[0019] Next, a resin film used as a cushioning material for the laminate molding press device 3 in the present invention will be described. The resin film used in the present invention is preferably a thermosetting resin film, an engineering plastic film, or an industrial functional film. In the first embodiment, fluororesin films 321, 324 are used. The fluororesin film 321 is made of polytetrafluoroethylene (PTFE), also known as Teflon (registered trademark) (Rockwell R scale (ISO 2039-2) 20, deflection temperature under load (℃ (1.81MPa)) 55℃, maximum use temperature 260℃), PFA (Rockwell R scale 50, deflection temperature under load 47℃, maximum use temperature 260℃), FEP (Rockwell R scale 50, deflection temperature under load 50℃, maximum use temperature 200℃), PCTFE (Rockwell R scale 80, deflection temperature under load 90℃, maximum use temperature 120℃), ETFE (Rockwell R scale 50, deflection temperature under load 74℃, maximum use temperature 150℃), ECTFE (Rockwell R scale 50, deflection temperature under load 77℃, maximum use temperature 150℃), PVDF (Rockwell R scale 93 to 116, deflection temperature under load 100℃, maximum use temperature 156℃), and any of the above-mentioned fluororesin films 321 may be used. PTFE is particularly popular because it is easy to obtain and has a high maximum operating temperature. Polytetrafluoroethylene (PTFR) has a low Rockwell R scale value of about 18, and similar laminate molding is possible even with a resin film with a hardness of about R15. The fluororesin used in the fluororesin film is not cross-linked like fluororubber, and does not have the elasticity of fluororubber.

[0020] Examples of the thermosetting resin film used in the present invention include, but are not limited to, fluororesin (FR), phenolic resin (PF), urea resin (UF), melamine resin (MF), allyl resin (PDAP), alkyd resin (ALK), unsaturated polyester (UP), epoxy resin (EP), diarylphthalate (DAP), polyurethane resin, silicone resin (SI), polyimide (PI), etc. Thermosetting resin films are preferably selected because they have excellent heat resistance and are not easily deteriorated even when the temperature used in the lamination molding press device 3 is relatively high.

[0021] The resin film used for the buffer material may be an engineering plastic. In the present invention, the definition of engineering plastic refers to a resin having a heat resistance of 100°C or more, a tensile strength of 49 MPa or more, and a flexural modulus of 2.4 GPa or more. The engineering plastic of the present invention includes general-purpose engineering plastics (also called general-purpose engineering plastics for short) and super engineering plastics (also called special engineering plastics for short). Examples of general-purpose engineering plastics used for the buffer material include, but are not limited to, polyamide (PA), polyacetal (POM), polycarbonate (PC), modified polyphenylene ether (PPE), polybutyl terephthalate (PBT), glass fiber reinforced polyethylene terephthalate (GF-PET), ultra-high molecular weight polyethylene (UHPE), and the like. General-purpose engineering plastics can be used when a laminate molding press is used at a relatively low temperature.

[0022] In addition, super engineering plastics are resins with a heat resistance of 150°C or higher. Examples of general-purpose engineering plastics used as cushioning materials include, but are not limited to, polysulfone (PSF), polyethersulfone (PES), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polyethylene naphthalate (polyether nitrile) (PEN), polyarylate (PAR), polyethersulfone (PES), polyarylate (PAR), polyetheretherketone (PEEK), polyetherimide (PFI), polyamideimide (PAI), polyaminobisarylimide (PABM), polybutylene maleimide triazine (BT-resin), polyoxybenzoyl (POB), aramid (a polyamide composed only of aromatic skeletons, sometimes referred to as Ar), and thermoplastic polyimide (PI).

[0023] Among the engineering films containing the above super engineering plastics, resins that are particularly suitable for use in the present invention include polyimide (both thermoplastic and thermosetting) (deflection temperature under load of 260°C or more, Rockwell R scale of 110 to 130), polyether ketone (deflection temperature under load of 140°C, Rockwell R scale of 126), polysulfone (deflection temperature under load, Rockwell R scale of 110 to 120), polyphenylene sulfide (deflection temperature under load of 260°C, Rockwell R scale of 100), polyether sulfone (deflection temperature under load of 203°C, Rockwell R scale of 100), polyethylene naphthalate (polyether nitrile film) (deflection temperature under load of 330°C, Rockwell R scale of 114), and aramid (deflection temperature under load of 200°C to 230°C), which are relatively easily available as commercial products. At least one of these resins may be used. Among the above, polyimide film or a resin film mainly composed of polyimide is preferably used. Polyimide films are relatively easy to obtain and have excellent heat resistance.

[0024] The resin film used in the present invention is preferably one having a hardness (Rockwell R scale) (ISO 2039-2) of 15 to 140, although it is not limited thereto. The Rockwell R scale is merely a measurement method, and it goes without saying that the present invention also covers resins for which the measured values ​​of other measurement methods, such as the Rockwell M scale, are listed in catalogs. If the hardness of the resin film is too low, stress will be concentrated on a part of the pressurized surface (particularly the end of the laminated product) as in the case of using rubber as a cushioning material, and if the hardness is too high, stress will be concentrated on a part of the pressurized surface (particularly the front surface of the convex part of the laminated material). If the hardness of the resin film is within an appropriate range, it is easy to apply approximately uniform pressure to each part of the pressurized surface.

[0025] The resin film of the present invention may be a mixture of multiple resins as long as it contains the resin as the main component in the highest ratio (volume %). Or, multiple resin films may be attached to form a resin film. Furthermore, if the main component is a resin material as described above, it may contain something other than a resin material. For example, it may contain something that contains fibers or other additives in addition to resin. Also, it may be a foamed resin if it has a small foaming ratio. That is, Patent Document 2 shows an example of a rubber buffer material with a hardness of Shore A70 degrees, but it is sufficient as long as it does not have a buffering effect like a buffer material with a hardness of Shore A70 degrees or less. Patent Document 2 also describes the use of plastic as a buffer material, but it lists it along with paper and rubber, and lists materials on the assumption that a buffer material with a buffering effect like the above rubber is used, and does not state what type of plastic is used.

[0026] In the first embodiment, only one fluororesin film 321 is used as the cushioning material, but two or more of the same resin films, or two or more resin films of different types or thicknesses may simply be stacked or pasted together. The resin film of the present invention is flexible, but may be one that breaks when bent with a force greater than a certain level. As in Patent Document 1, a rubber heater may be placed on the surface of the pressure block, or an extremely thin coating layer containing rubber or the like may be formed on the surface of the pressure block, a resin film such as polyimide may be placed on top of that, and a thin metal plate such as stainless steel thin plate 322 may be provided on the upper surface of that.

[0027] The thickness of the resin film as the buffer material is preferably 0.01 mm to 2.00 mm, more preferably 0.02 mm to 1.00 mm. Generally, a thickness of 1.00 mm or less is called a film, and a thickness of 1.00 mm or more is called a sheet, but in the present invention, all resin films in the range of 1.00 mm to 2.00 mm are included in the concept of a film. When a plurality of resin films are stacked and used as a buffer material, it is desirable that the total thickness is the above thickness. When the thickness of the resin film is thinner than 0.02 mm, the elastic deformation effect of the stainless steel thin plates 322, 325 is hardly obtained, so there is a problem that excessive force is applied only to the front portion of the convex portion A1b of the substrate A1. When the thickness of the resin film is thicker than 2.00 mm, the same problem occurs as when rubber is used as a buffer material, as shown in the deformed view in FIG. 5. When the resin film is in the range of 0.02 mm to 0.05 mm, it may be a problem when the height of the convex portion A1b of the substrate A1 is high. Furthermore, in the range of 1.00 mm to 2.00 mm, the cushioning effect may become too large. Note that these thicknesses of the resin film are the thicknesses when the resin film is attached to the pressure block 318. The thickness dimension of the resin film after attachment to the pressure block 318 may decrease slightly as the number of press moldings is increased, so when the resin film is removed after press molding, the same thickness is not necessarily maintained. However, even if the thickness of the resin film changes slightly, it will not cause much of a problem in pressure molding as long as it does not change significantly.

[0028] The stainless steel thin plate 322 overlaid on the surface of the fluororesin film 321 has a smooth mirror-finished surface 322a, which is the pressure-applied surface. The stainless steel thin plate 322 has a thickness of 0.05 mm to 5.0 mm, and more preferably 0.5 mm to 3.0 mm. The material of the thin metal plate is not limited to stainless steel (Young's modulus (E / GPa) 200), but may be iron (Young's modulus (E / GPa) 205), aluminum (Young's modulus (E / GPa) 70), nickel (Young's modulus (E / GPa) 204), copper (Young's modulus (E / GPa) 110), or alloys thereof or metals with equivalent Young's modulus. Depending on the molded product, the surface that is the pressure-applied surface may have a predetermined surface roughness. In the present invention, by combining a plastic film such as a polyimide film with the thin metal plate, it is possible to prevent large elastic deformation of the metal plate when pressure is applied, as occurs when a conventional rubber-made cushioning material is used, and as a result, it is possible to prevent the laminated film from flowing outward from the edge of the substrate. Depending on the type of laminated molded product A, a thinner metal sheet such as stainless steel having a thickness of 0.1 mm to 0.8 mm can be used to achieve a stronger elastic effect. The surface of the stainless steel thin plate 322 on which the pressure is applied is also included in the metal sheet of the present invention in which the surface is the pressure surface.

[0029] In the laminate molding press apparatus 3 of the first embodiment, the upper platen 312 also has the same pressure block 317 as the lower platen 314, a fluororesin film 324 such as PTFE, and a stainless steel thin plate 325. However, at least one of the pressure block 317 on the upper platen 312 side and the pressure block 318 on the lower platen 314 side may have the above structure, or the upper platen 312 and the lower platen 314 may have different materials or thicknesses of the film as a buffer material, or the upper platen 312 and the lower platen 314 may have different materials or thicknesses of the thin metal plate. Specifically, when the uneven portion A1a is provided on only one surface of the substrate A1 and the laminate film A2 is bonded only to the side having the uneven portion A1a, a pressure block including a polyimide film and a stainless steel thin plate may be provided only on the platen corresponding to the side having the uneven portion A1a of the substrate A1. However, when the substrate A1 has uneven surfaces on both sides and the laminate film A2 is to be attached to both sides, it is desirable to provide the pressure blocks 317, 318 of the upper platen 312 and the lower platen 314 of the laminate molding press device 3 with fluororesin films 324, 321 such as PTFE and stainless steel thin plates 322, 325 as shown in Figure 1.

[0030] A carrier film winding device 5, which also functions as a transport device and tension device for the laminated product A5, is provided at the rear of the laminated molding press device 3. The carrier film winding device 5 includes a lower winding roll 511 and a driven roll 512, and the lower carrier film F1 is wound by the winding roll 511. The carrier film winding device 5 also includes an upper winding roll 513 and a driven roll 514, and the upper carrier film F2 is peeled off from the laminated product A5 at the driven roll 514, and the upper carrier film F2 is wound by the upper winding roll 513. A take-out stage 515 for the laminated product A5 is provided at the portion where only the lower carrier film F1 is sent in a horizontal state. As a transport device for the carrier films F1 and F2, a transfer device that grips both sides of the carrier films F1 and F2 and pulls them toward the rear process may be provided. The transport device for the laminated product A3 and the intermediate laminated material A4 of the laminated molding system 1 is not limited to the above, and may be a multi-axis robot or the like. In the first laminate molding system 1, when another device such as a cooling press device is provided downstream of the laminate molding press device 3, the carrier film winding device 5 is provided downstream of the other device.

[0031] Next, a method for laminating a laminate material A1 and a laminate film A2 using a laminate molding system 1 including a laminate molding press device 3 of the first embodiment will be described. In the laminate molding system 1 during continuous molding, pressure molding is performed in a batch process at the same time by sequence control in a diaphragm type vacuum laminating device 2 and a laminate molding press device 3 which is a flattening press device. However, here, the molding sequence of the substrate A1 and laminate film A2 which are the laminate material for one batch will be described. The upper and lower carrier films F1 and F2 which are provided to be unwound from a carrier film delivery device 4 and wound up by a carrier film winding device 5 are often made of polyethylene terephthalate (PET) and have a thickness of 0.02 mm to 0.20 mm, although this is not limited thereto.

[0032] The laminate material A1 placed on the loading stage 413 of the carrier film delivery device 4 is a circuit board for build-up having an uneven portion A1a consisting of a convex portion A1b of the copper foil portion bonded to the board surface and a concave portion A1c of the portion without the copper foil. The thickness of the copper foil (height relative to the board portion) is not limited to this, but is on the order of several um to several tens of um, and in most cases is 0.1 mm or less. A laminate film A2 is laminated on the top and bottom of the circuit board A1, respectively, to form a laminated molded product A3 for build-up molding. Although one laminated molded product A3 is shown in FIG. 1, multiple laminated molded products A3 may be laminated and molded at the same time.

[0033] The laminated film A2 in the first embodiment is an insulating film, and the PET films laminated on both sides of the laminated film A2 are peeled off from the original storage state before use. The resin material of the laminated film A2 is a thermosetting resin such as epoxy or a thermosetting resin that is the main component. In addition, materials other than the thermosetting resin contain various materials and additives for the purpose of adjusting roughness, imparting flame retardancy, imparting low expansion, imparting fluidity, imparting film-forming properties, lowering dielectric tangent (insulating properties), lowering moisture content, etc. In particular, in recent years, there has been an increase in the type of film in which the content of inorganic materials is increased for the purpose of adjusting roughness, imparting low expansion, lowering dielectric tangent, lowering moisture content, etc. The type of inorganic material is not limited to this, but may be SiO2, etc.

[0034] In the first embodiment, a laminated film A2 having a content (volume %) of SiO2, which is an inorganic material, of 20% or more is preferably used. In the present invention, a laminated film A2 having a content (volume %) of SiO2, which is an inorganic material, of 20% or more is defined as a resin film with a high content of inorganic material. Although not limited thereto, in the example of "Ajinomoto Build-up Film (ABF)" (registered trademark), which is an interlayer insulating film of Ajinomoto Fine-Techno Co., Ltd., GX13 (Young's modulus (GPa) 4.0), GX92 (Young's modulus (GPa) 5.0), GX-T31 (Young's modulus (GPa) 7.5), NextGX (Young's modulus) 7.5), GZ41 (Young's modulus (GPa) 9.0), or a film with a Young's modulus (GPa) of 9.0 or more are listed as resin films with a high content of inorganic material to be used. In addition, other companies' products also include resin films with a high content of inorganic material of the same material. As described above, these resin films contain 20% by volume or more, or 40% by weight or more of inorganic material for the purpose of improving adhesion to the laminated object by reducing the roughness of the film surface, preventing peeling from the substrate by reducing the thermal expansion coefficient, improving insulation (reducing dielectric loss), and reducing the moisture content. In particular, for substrates for 5G, which is the fifth generation communication system, a laminate film A2 (interlayer insulating film) containing 25% by volume or more of inorganic material is particularly preferably used because even greater precision is required. The thickness of the laminate film A2 is not limited to this, but interlayer insulating films manufactured by Ajinomoto Fine-Techno Co., Ltd. and the like are commercially available and are widely used, with a thickness of 0.01 mm to 0.1 mm. The laminate film A2 may also be one in which a copper foil layer is laminated, and these are also used in the laminate molding press device of the present invention.

[0035] The laminated product A3 placed on the placement stage 413 is moved together with the upper and lower carrier films F1 and F2 as the winding rolls 511 and 513 are rotated and driven, and is sent to and positioned in the chamber C of the vacuum lamination device 2 in an open state. Next, the chamber C of the vacuum lamination device 2 is closed, and the chamber C is evacuated by a vacuum pump (not shown). Pressurized air is then sent in to expand the diaphragm 211 into the chamber C, and the laminated product A3 consisting of the substrate A1 and the laminated film A2 is pressurized between the elastic body 216 of the hot plate 215 on the upper platen 212 side. The pressure applied by the diaphragm 211 at this time is, for example, 1 MPa or less, and the substrate A1 and the laminated film A2 are bonded together in such a manner that the laminated film A2 is embedded in the recess A1c of the substrate A1, and the intermediate laminated material A4, which is a primary molded product, is laminated. However, the surface of the laminated film A2 of the intermediate laminated material A4 laminated by the vacuum lamination device still has unevenness following the shape of the uneven portion A1a of the substrate A1. Furthermore, in this case, if the laminate film used has a high inorganic material content, the fluidity of the molten resin is low, so that unevenness is more likely to remain.

[0036] In the vacuum lamination device 2, the intermediate laminate A4, which is made of the laminated material A1 having the uneven portion A1a and the laminating film A2 and in which the two are attached, is laminated and molded, and the chamber C is opened. Then, the carrier film winding device 5 feeds the next carrier films F1 and F2, and the intermediate laminate A4 is transported between the upper plate 312 and the lower plate 314 of the lamination molding press device 3, and is stopped at a predetermined pressurizing position. Next, the pressurizing cylinder 315 of the lamination molding press device 3 is operated, and the lower plate 314 and the pressurizing block 318 are raised. As described above, the elastically deformable stainless steel thin plate 322 is attached to the pressurizing block 318 via the fluororesin film 321 having a cushioning effect, and after the pressurizing surface 322a of the stainless steel thin plate 322 abuts against the lower carrier film F1, the intermediate laminate A4 is further pushed up via the lower carrier film F1. The intermediate laminate A4 is then brought into contact with the pressure surface 325a of the stainless steel thin plate 325 of the upper platen 312 via the upper carrier film F2, and is then pressed between the upper and lower pressure surfaces 322a and 325a.

[0037] The temperature of the pressurizing blocks 317, 318 (hot plates) of the laminate molding press 3 at this time is controlled to 80°C to 140°C, more preferably 90°C to 130°C, although it is not limited thereto because it varies depending on the materials of the substrate A1 and the laminate film A2. If the temperature is too high, the viscosity of the resin material constituting the laminate film when melted will be low and the fluidity will be too high, so that the resin material constituting the laminate film will flow out from the end of the intermediate laminate material, and the desired plate thickness and insulating layer thickness of the laminate molded product will not be obtained. Furthermore, if the temperature of the pressurizing blocks 317, 318 at the time of pressurization is too high, problems such as deterioration of the resin material and a longer molding cycle time including cooling in the post-process will occur. On the other hand, if the temperature of the pressurizing blocks 317, 318 at the time of pressurization is too low, the viscosity of the resin material will be too high to obtain the desired fluidity, and problems such as insufficient embedding of the laminate film A2 into the substrate A1 and insufficient flatness of the surface of the laminate molded product A5 will occur.

[0038] The pressure (surface pressure) applied to the intermediate laminate A4 also varies depending on the materials of the substrate A1 and the laminate film A2, and is not limited thereto, but is controlled to 0.3 MPa to 4.0 MPa, more preferably 0.5 MPa to 2.5 MPa. If the pressure is too strong, the molten resin material constituting the laminate film A2 will flow out from the end of the intermediate laminate A4, and good pressure molding will not be possible, as with the temperature conditions. If the pressure is too low, the laminate film A2 will not be embedded sufficiently into the substrate A1, or the surface of the laminate molded product A5 will not be sufficiently flat.

[0039] In the first embodiment, the buffer material between the stainless steel thin plates 322, 325, which are elastic metal plates, and the pressure blocks 317, 318 is a resin film such as the fluororesin film 324, 321, which increases the hardness of the buffer material compared to conventional buffer materials that use rubber, thereby suppressing the elastic deformation of the stainless steel thin plates 322, 325, which are elastic metal plates, to a desired range or to a degree that the buffer material is substantially not deformed. If the pressure block is only a metal block, too much force is applied only to the surface portion of the intermediate laminate A4 corresponding to the front surface of the convex portion A1b of the substrate A1, which may destroy the substrate A1 or may not press the concave portion A1c of the substrate A1 sufficiently.

[0040] In this regard, in the conventional laminate molding press 10 using rubber as the cushioning material, as shown in Fig. 5, the central parts 101a, 102a of the cushioning materials 101, 102 are compressed by the reaction force of the intermediate laminate A4 during press molding, and the central parts 103a, 104a of the stainless steel thin plates 103, 104 that directly contact the intermediate laminate A4 are also bent toward the pressurizing blocks 105, 106. In contrast, the outer parts 101b, 102b of the cushioning materials 101, 102 that do not directly pressurize the intermediate laminate A4 are hardly compressed. As a result, a phenomenon occurs in which the distance between the pressurizing blocks 105, 106 and the outer parts 103b, 104b of the stainless steel thin plates is relatively larger than the distance between the pressurizing blocks 105, 106 and the central parts 103a, 104a of the stainless steel thin plates. When the above phenomenon occurs, the outer parts 103b, 104b of the stainless steel thin plate corresponding to the outer side of the intermediate laminate A4 form inclined surfaces 103c, 104c in which the center side recedes toward the pressurizing blocks 105, 106 and the outer side protrudes from the pressurizing blocks 105, 106. Therefore, a certain angle α is formed between the inclined surfaces 103c, 104c of the outer parts 103b, 104b of the stainless steel thin plate and the surface of the outer part of the intermediate laminate A4. As a result, stress is concentrated on the end A2a of the laminate film A2 layer of the intermediate laminate A4 when pressurized. As a result, there is a problem that the molten resin near the end A2a of the laminate film A2 of the intermediate laminate A4 protrudes outward like the outflowing resin A2b.

[0041] In contrast, in the first embodiment, since a thermosetting resin film such as the fluororesin films 321, 324 or an engineering plastic is used as the cushioning material, the degree to which only the resin film of the cushioning material at the center is largely compressed partially when pressure is applied to the intermediate laminate material A4 is small, and the elastic deformation of the stainless steel thin plates 322, 325, which are elastic metal plates, is also small. Therefore, the degree to which stress is concentrated at the end A4c of the laminate film A2 on the surface of the intermediate laminate material A4 is small, and the molten resin near the end A4c of the laminate film A2 layer of the intermediate laminate material A4 hardly flows outward.

[0042] Then, by applying pressure at the above temperature and pressure in the laminate molding press device 3, the surfaces of the upper and lower laminate films A2 of the intermediate laminate material A4, which still has unevenness, become flat, and the laminate molded product A5 is formed. After the predetermined pressurizing time has elapsed, the pressurizing cylinder 315 is operated again to lower the lower platen 314, and then the upper and lower winding rolls 511, 513 are rotated, and the laminate molded product A5 is transferred to the removal stage 515 and carried out to a subsequent process by a transfer device (not shown). The laminate molded product A5 or a substrate or the like obtained by reprocessing the laminate molded product A5 are included in the present invention.

[0043] Next, the laminate molding system 6 of the second embodiment shown in FIG. 3 will be described with reference to the differences from the laminate molding system 1 of the first embodiment. The laminate molding press device 8 of the laminate molding system 6 of the second embodiment does not use a diaphragm, and the pressurizing mechanism such as the pressurizing cylinder 819 has almost the same structure as the laminate molding press device 3 of the first embodiment. In the laminate molding press device 8, the pressurizing blocks 813 and 814 attached to the upper plate 811 and the lower plate 812 respectively include polyimide films 815 and 816 as buffer materials and stainless steel thin plates 817 and 818 as metal thin plates, and the surfaces of the stainless steel thin plates 817 and 818 are pressurizing surfaces 817a and 818a. Also, the lower plate 812 is raised by the pressurizing cylinder 819 to perform pressurizing between the pressurizing surfaces 817a and 818a.

[0044] The difference between the laminate molding press 3 of the first laminate molding system 1 and the laminate molding press 8 of the laminate molding system 6 of the second embodiment is that in the laminate molding press 8, side walls 820, 821, which are chamber forming members, are formed on at least one of the upper plate 811 and the lower plate 812, and a chamber C is formed when the relative distance between the upper plate 811 and the lower plate 812 is reduced by raising the lower plate 812, etc. The laminate molding press 8 is equipped with a vacuum pump (not shown) for creating a vacuum inside the chamber C. Therefore, the laminate molding press 8 is a vacuum laminate apparatus.

[0045] In addition, the laminate molding press 3 used for secondary molding, which is the same as that of the first embodiment, is provided in the post-process of the laminate molding press 8. The fluororesin films 815, 816 and the stainless steel thin plates 817, 818, which are the cushioning materials of the laminate molding press 8, and the resin films such as the fluororesin films 321, 324 and the stainless steel thin plates 322, 325, which are the cushioning materials of the laminate molding press 3, may be made of the same material or different materials. In the case of different materials, it is preferable that the laminate molding press 8 has better embeddability. As an example, it is preferable that the resin films such as the fluororesin films 815, 816 used in the laminate molding press 8 are made thicker than the resin films such as the fluororesin films 321, 324 used in the laminate molding press 3, or that the metal thin plates such as the stainless steel thin plates 322, 325 are made thinner. Alternatively, fluororesin films 321, 324 may be used in lamination molding press 3, and a resin film having a higher Rockwell hardness than the fluororesin films, such as polyimide films 815, 816, may be used in lamination molding press 8 in the subsequent process.

[0046] In the lamination molding method using the lamination molding system 6 of the second embodiment, the laminated materials, the substrate A1 and the laminated film A2, are pressed from the primary molding by the lamination molding press device 8. Therefore, the primary molding can be performed with a larger pressurizing force than the vacuum lamination device 2 using the diaphragm 211 of the first embodiment. Therefore, as described above, even if the specific gravity of the inorganic material of the laminated film A2 is quite high, for example, 60% to 75% by weight, pressure molding can be performed effectively.

[0047] The intermediate laminate material A4 laminated (primary molding) by the laminate press 8 is sent to the laminate press 3. The temperature and pressure (surface pressure) of the pressure block of the laminate press 8 and the laminate press 3 may be the same or different. Although not limited to this, as an example, the temperature of the pressure block of the laminate press 8 may be higher than that of the laminate press 3 to improve the fluidity of the resin material of the laminate film, and the pressure of the laminate press 3 may be higher than that of the laminate press 8 to increase the smoothness of the surface of the laminate product A5. The laminate product A5 laminated in the second embodiment or a substrate obtained by reprocessing the laminate product A5 is also included in the present invention.

[0048] As a modification of the second embodiment, the lamination molding system 6 may be configured to complete molding using only one lamination molding press device 8, which is a vacuum lamination device. Even in this case, the invention can be completed by providing a pressure block attached to at least one of the upper and lower plates of the present invention with a metal thin plate that forms a pressure surface via a resin film. Also, the lamination molding press device 3 may be followed by another lamination molding press device 3 of the same type or a cooling press device of a different type, which are arranged in series.

[0049] Next, a lamination molding system 7 of a third embodiment shown in Fig. 4 will be described with reference to the differences from the lamination molding system 1 of the first embodiment. The lamination molding system 7 of the third embodiment is provided with another similar lamination molding press 9 in the process downstream of the lamination molding press 3 of the lamination molding system 1 of the first embodiment. That is, two lamination molding presses 3.9 of the lamination molding system 7 are provided in series in the process downstream of the vacuum lamination device 2. The intermediate laminate material A4, which is made of the laminated material A1 having uneven parts and the laminate film A2 transported from the vacuum lamination device 2 by the carrier films F1 and F2, is press-molded sequentially by the two lamination molding presses 3.9.

[0050] The laminate molding press device 9 has a structure similar to that of the laminate molding press device 3, and the pressure blocks 913, 914 attached to the upper platen 911 and the lower platen 912, respectively, are equipped with polyimide films 915, 916 as cushioning materials and stainless steel thin plates 917, 918 which are thin metal plates, and the surfaces of the stainless steel thin plates 917, 918 form pressure surfaces 917a, 918a.

[0051] The resin films such as fluororesin films 915, 916, which are the cushioning materials of the laminate molding press 9, the thin metal plates such as stainless steel thin plates 917, 918, and the resin films such as fluororesin films 321, 324, which are the cushioning materials of the laminate molding press 3, and the thin metal plates such as stainless steel thin plates 322, 325 may have the same thickness or different thicknesses. In the third embodiment, the laminate molding press 3 and the laminate molding press 9 use fluororesin films having a thickness of 0.01 mm to 1.00 mm. However, the laminate molding press 3 and the laminate molding press 9 may use resin films having different thicknesses as cushioning materials. For example, the laminate molding press 3 in the preceding process may use a resin film such as a thicker fluororesin film so that it has better embeddability.

[0052] Furthermore, the materials of the resin films serving as the cushioning materials of the laminate molding press 9 and the laminate molding press 3 may be the same or different. If the materials are different, it is desirable to use a film made of a material with a smaller Rockwell R scale so that the laminate molding press 3 in the preceding process has better embeddability. Furthermore, the metal thin plates such as the stainless steel thin plates 322, 325 of the laminate molding press 3 may have better embeddability than the laminate molding press 9 by being thinner or by using a metal material with a smaller Young's modulus.

[0053] In the lamination molding method using the lamination molding system 6 of the third embodiment, intermediate laminated materials A4a and A4b that have been laminated are sent in this order to the vacuum lamination device 2, the lamination molding press device 3, and the lamination molding press device 9. In the case of two lamination devices as in the first embodiment, the lamination molding press device 3 often requires a longer pressurization time than the vacuum lamination device 2, and the overall molding time is often determined by the lamination molding press device 3. However, in the lamination molding system 7 of the third embodiment, the molding time can be distributed by two pressurization moldings by the lamination molding press device 3 and the lamination molding press device 9, and in most cases moldings by the other lamination molding press device 3 and the lamination molding press device 9 can also be performed in the molding time required for the vacuum lamination device 2.

[0054] In addition, since two pressurization processes using the laminate molding press 3 and the laminate molding press 9 are possible, even if the laminate film A2 contains a large amount of inorganic material and has poor fluidity when melted, it can be laminated well. The temperature and pressure (surface pressure) of the pressurizing block of the laminate molding press 3 and the laminate molding press 9 may be the same or different. Although not limited to this, as an example, the temperature of the pressurizing block of the laminate molding press 3 may be higher than that of the laminate molding press 9 to improve the fluidity of the resin material in the molten state of the laminate film A2, and the pressure of the laminate molding press 9 may be higher than that of the laminate molding press 3 to increase the smoothness of the surface of the laminate molding product A5. In the third embodiment, a further device such as a cooling press may be provided in the process following the laminate molding press 9. The laminate molding product A5 laminated in the third embodiment or a substrate obtained by reprocessing the laminate molding product A5 is also included in the present invention.

[0055] As a modification of the third embodiment, a laminate molding press whose pressing surface is made of an elastic plate such as rubber may be used in place of the laminate molding press 3 installed next to the vacuum lamination device 2. In that case, the laminate molding press 9 of the present invention is used only for the third laminate molding.

[0056] It is also envisaged that the laminate molding presses 3, 8, 9 of the present invention will be shipped without the resin film or thin metal plate as a cushioning material attached, and that the resin film or the like of the present invention will be attached later, and such configurations are also included in the present invention. Also included in the present invention is the replacement of the cushioning material of the laminate molding presses 3, 8, 9 with the resin film included in the present invention or a material with a large cushioning effect such as rubber, depending on the type of the material A1 to be laminated or the laminate film A2 to be laminated in the factory where the laminate molding is performed.

[0057] Although not listed one by one, the present invention is not limited to the above-mentioned first to third embodiments, and it goes without saying that the present invention is applicable to those modified by those skilled in the art based on the spirit of the present invention and those combining the descriptions of the first to third embodiments. The laminated molded products laminated by the laminated molding systems 1, 6, and 7 may be circuit boards, semiconductor wafers, or other plate-like bodies, and are not limited thereto. [Explanation of symbols]

[0058] 1,6.7 Laminated molding system 2. Vacuum lamination device 3,8,9 Lamination molding press equipment 212,312,811,911 Upper board 213,314,812,912 Lower board 317,318,813,814,913,914 Pressurized Block 321, 324, 815, 816, 915, 916 Fluorine resin film (resin film) 322, 325, 817, 818, 917, 918 Stainless steel sheet (metal sheet) 322a, 325a, 817a, 818a, 917a, 918a Pressurized surface

Claims

1. In a lamination molding system, a laminate material having an uneven portion to be molded and a laminate film are pressurized in stages, First, the molding object is pressurized by a lamination device having a chamber capable of reducing the pressure inside the chamber; Secondly, the molding object is pressed by a lamination molding press device having an upper platen and a lower platen, The pressurizing block attached to at least one of the upper plate and the lower plate of the laminate molding press device includes: A metal thin plate constituting a pressure surface is provided via a resin film of a thermosetting resin or an engineering plastic, The resin of the resin film has a hardness of 15 or more and 140 or less on the Rockwell R scale. Laminated molding system.

2. The laminate molding press presses the molding object with a surface pressure of 0.3 MPa to 4.0 MPa. The layered molding system of claim 1 .

3. The laminate molding press device heats the pressure block to 80°C to 140°C and presses the molding object. The layered molding system of claim 1 .

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