Probe and probe card

Abstract

To provide a probe 10 that can be attached to a circuit board 20 without bonding to the circuit board 20 with solders, etc.SOLUTION: A probe 10 electrically connects an electronic device to be inspected and a circuit board 20. The probe 10 comprises: a rigid portion 101 with a substrate contact portion 101a that is formed at one end and can contact the circuit board 20; an arm portion 102 having a fixed end 102a and a free end 102b, and a cantilever structure in which the fixed end 102a is connected to the rigid portion 101; a device contact portion 103 that can contact the electronic device and is connected to the free end 102b of the arm portion 102; and a spring portion 104 having a fixed end 104a and a free end 104b, and a cantilever structure in which the fixed end 104a is connected to the other end 101e of the rigid portion 101. The spring portion 104 exerts a force on the substrate contact portion 101a toward the circuit board 20 by a load applied to the free end 104b.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a probe and a probe card. [Background technology]

[0002] There is known a probe card that inspects a device under test while one end of a probe is brought into contact with the device under test (see Patent Document 1). The probe card has a wiring board to which the other end of the probe is joined.

[0003] In Patent Document 1, a support block for the probe is fixed to a probe pad provided on the lower surface of the wiring board, so that the probe is flexibly supported on the lower surface of the wiring board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-246133 A Summary of the Invention [Problem to be solved by the invention]

[0005] Soldering is generally used to attach the probe to the wiring board, which can lead to solder defects or peeling of the probe pad due to thermal stress.

[0006] The present invention has been made to solve such conventional problems, and its object is to provide a probe that can be attached to a circuit board without being joined to the circuit board with solder or the like, and a probe card that can be attached to a circuit board without being joined to the circuit board with solder or the like. [Means for solving the problem]

[0007] One aspect of the present invention is a probe for electrically connecting an electronic device to be tested to a circuit board. The probe has a rigid part having a board contact part formed at one end thereof capable of contacting the circuit board, an arm part having a fixed end and a free end and having a cantilever structure with the fixed end connected to the rigid part, a device contact part connected to the free end of the arm part and capable of contacting the electronic device, and a spring part having a fixed end and a free end and having the fixed end connected to the other end of the rigid part. The spring part biases the board contact part toward the circuit board by a load applied to the free end.

[0008] Another aspect of the present invention is a probe card comprising a probe according to the aspect of the present invention described above, a circuit board with which the board contact portion is in contact, and a probe guide that fixes the probe while the board contact portion is biased toward the circuit board by a spring portion. Effect of the Invention

[0009] According to the present invention, the probe can be attached to the circuit board without being joined to the circuit board by soldering or the like. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional view showing an outline of a probe card 1 according to the first embodiment. [Diagram 2] FIG. 2 is a plan view showing the entire probe card 1. As shown in FIG. [Figure 3A] FIG. 3A is a plan view showing a first main surface 30a of a guide plate 32. FIG. [Figure 3B] FIG. 3B is a cross-sectional view taken along the line AA in FIG. 3A. [Figure 4A] FIG. 4A is a plan view showing each of slit guides 33A and 33B as viewed from the first main surface 30a side of guide plate 32. FIG. [Figure 4B] FIG. 4B is a cross-sectional view taken along the line BB in FIG. 4A. [Diagram 5]FIG. 5 is a plan view showing the guide plate 32, the slit guides 33A and 33B, and the probe 10 in an assembled state. [Figure 6] FIG. 6 is a cross-sectional view taken along the CC cut surface of FIG. 5, showing a state in which board contact portion 101a applies a preload load to contact pattern 21 of circuit board 20 (post-preload state). [Figure 7] FIG. 7 is a cross-sectional view taken along the CC cut surface of FIG. 5, showing a state before board contact portion 101a applies a preload load to contact pattern 21 of circuit board 20 (state before preload). [Figure 8] FIG. 8 is a cross-sectional view showing an outline of a probe card 1A according to the second embodiment. [Figure 9] FIG. 9 is a side view showing the configuration of a probe 10A according to the third embodiment. [Figure 10] FIG. 10 is a diagram showing the configuration of a probe 10B according to the fourth embodiment, and is a cross-sectional view taken along the CC cut surface of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the probe and the probe card according to the embodiment will be described in detail with reference to the drawings. Note that the embodiment described below is a comprehensive or specific example. The numerical values, shapes, materials, components, installation positions and connection forms of the components shown in the following embodiment are examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiment, components that are not described in the independent claim showing the highest concept are described as optional components. Furthermore, the dimensional ratios in the drawings are exaggerated for the convenience of explanation and may differ from the actual ratios. In addition, the following embodiment and its modified examples may include similar components, and the similar components are given common symbols and redundant explanations are omitted.

[0012] (First embodiment) [Outline of probe card 1] An outline of a probe card 1 according to the first embodiment will be described with reference to Fig. 1. The probe card 1 according to the first embodiment is an electrical connection device that electrically connects an electronic device 40 to be tested and an inspection device (not shown) such as a tester that inspects electrical characteristics of the electronic device 40. The probe card 1 has a plurality of probes 10, a circuit board 20 to which one end of each of the probes 10 is electrically connected, and a probe guide 30 that supports the plurality of probes 10.

[0013] The probes 10 for electrical connection devices (hereinafter simply referred to as "probes 10") are made of a conductive material and can be manufactured using MEMS (Micro Electro Mechanical Systems) technology, but may also be manufactured using other manufacturing methods. One end (the end in the Z direction) of each probe 10 is in contact with the lower surface, which is one of the main surfaces of the circuit board 20.

[0014] The circuit board 20 is a board on which wiring that electrically connects the tester and the probes 10 and circuit elements necessary for testing are formed. As an example of a circuit element, a capacitor 53 is disposed on the lower surface of the circuit board 20. The upper surface, which is the other main surface of the circuit board 20, is electrically connected to the tester via a cable or the like (not shown).

[0015] The probe guide 30 has a first main surface 30a facing the circuit board 20, a plurality of recesses 31 formed in the first main surface 30a, and a second main surface 30b facing the electronic device 40. The plurality of probes 10 and the capacitor 53 are housed in the recesses 31, respectively.

[0016] The probe 10 has a needle portion 103a at its lower end. The needle portion 103a penetrates the bottom of the recess 31, and the tip of the needle portion 103a protrudes from the second main surface 30b of the probe guide 30. By moving a stage (not shown) on which the electronic device 40 to be tested is placed, the tip of the needle portion 103a can be brought into contact with the electrode pad 402 of the electronic device 40. In this manner, the electric circuit formed on the semiconductor substrate 401 and the tester are electrically connected. The probe card 1 can electrically connect the electronic device 40 to be tested and the tester (not shown).

[0017] The probe guide 30 is fastened to the circuit board 20 by a plurality of screws 50, 51 with a probe 10 or a capacitor 53 housed in each recess 31. The plurality of screws 50, 51 determine the position of the probe guide 30 with respect to the circuit board 20, specifically, the position in the X direction and the Y direction. As will be described in detail later, each probe 10 is fixed at a predetermined position in the recess 31. Thus, the position of the probe 10 with respect to the circuit board 20 is also fixed by fastening the plurality of screws 50, 51. The probe guide 30 supports the plurality of probes 10 with one end of each probe 10 in contact with the lower surface of the circuit board 20. Thus, a stable electrical connection of the probe 10 with respect to the circuit board 20 can be obtained.

[0018] When forming holes in the probe guide 30 for inserting the multiple screws 50, 51, a hole processing, i.e., a countersinking process is performed to prevent the screw heads, washers, etc. from protruding from the second main surface 30b. The recesses 31 are formed on the first main surface 30a by the same processing method as the countersinking process.

[0019] The probe guide 30 further has a support ring 52 arranged on its outer periphery. A plurality of screws 51 arranged on the outer periphery of the probe guide 30 fasten (tighten together) the circuit board 20, the probe guide 30, and the support ring 52 in a stacked state. An opening formed in the circuit board 20 to pass the screws 50 through is closed by a cap 54.

[0020] [Details of Probe Card 1] A detailed structure of the probe card 1 according to this embodiment will be described with reference to FIGS. 2 to 7. Note that there are some parts with different structures between the schematic diagram of FIG. 1 and the detailed diagrams of FIGS. 2 to 7, but the same reference numerals will be used to continue the description. FIG. 2 is a diagram showing the entire probe card 1, and is a plan view of the probe card 1 seen from the circuit board 20 side. A support ring 52 surrounds the outer periphery of the circuit board 20 having a substantially circular planar shape. On the back side of the paper surface of FIG. 2 (the opposite direction to the Z direction), a probe guide 30 having substantially the same shape as the circuit board 20 is disposed adjacent to the circuit board 20. A plurality of test units 60 corresponding to DUTs (Device Under Tests) are formed on the plane of the probe card 1. The same structure is repeatedly formed for each test unit 60 on the probe card 1. The structure of the probe card 1 in one test unit 60 will be described below.

[0021] The structure of the probe card 1 in the inspection unit 60 will be described with reference to Figures 3A, 3B, 4A, 4B, and 5. In this embodiment, the probe guide 30 is composed of a guide plate 32 in which the recess 31 of Figure 1 is formed, and slit guides 33A and 33B arranged in the recess 31. Figures 3A and 3B show the structure of the guide plate 32 alone. Figures 4A and 4B show the structure of the slit guides 33A and 33B alone. Figure 5 shows the guide plate 32, the slit guides 33A and 33B, and the probe 10 in an assembled state.

[0022] FIG. 3A is a plan view showing the first main surface 30a of the guide plate 32. FIG. 3B is a cross-sectional view taken along the AA cut surface of FIG. 3A. The first main surface 30a of the probe guide 30 coincides with the first main surface 30a of the guide plate 32. As shown in FIG. 3A, the planar shape of the inspection unit 60 is a rectangle having long and short sides. A recess 31 is formed in the first main surface 30a of the guide plate 32. The planar shape of the recess 31 is also a rectangle. Both the long side of the DUT 60 and the long side of the recess 31 are oriented in the Y direction and are substantially parallel to each other. A plurality of through holes 34 are formed in the bottom 31a of the recess 31 along the long side (Y direction) of the recess 31. As shown in FIG. 3B, the plurality of through holes 34 penetrate from the bottom 31a to the second main surface 30b corresponding to the first main surface 30a of the guide plate 32. The through holes 34 are arranged in the approximate center of the short side direction (X direction) of the bottom 31a along the long side direction (Y direction). A needle portion 103a of the probe 10 is inserted into each of the through holes 34, as described below.

[0023] FIG. 4A is a plan view showing the slit guides 33A and 33B as viewed from the first main surface 30a side of the guide plate 32. FIG. 4B is a cross-sectional view taken along the line BB in FIG. 4A. As shown in FIGS. 4A and 4B, the planar shape of the slit guides 33A and 33B is a rectangle extending along the long side (Y direction) of the inspection unit 60. A plurality of slits (grooves) 35 are formed in the slit guides 33A and 33B. The slits 35 of the slit guide 33A and the slits 35 of the slit guide 33B are formed in directions facing each other. The plurality of slits 35 are arranged along the long side (Y direction) of the slit guides 33A and 33B.

[0024] As shown in FIG. 5, a pair of slit guides 33A and 33B are inserted into the recess 31. The slit guides 33A and 33B are fitted and fixed in the recess 31. One probe 10 is inserted into each slit 35. The probes 10 inserted into the slits 35 of the slit guide 33A and the probes 10 inserted into the slits 35 of the slit guide 33B are arranged alternately in the long side direction (Y direction). In this embodiment, a pair of slit guides 33A and 33B are used, but if the interval (pitch) between the multiple electrode pads 402 formed on the electronic device 40 is wide, only one of the slit guides 33A and 33B may be used. In this embodiment, the probe guide 30 is divided into the guide plate 32 and the slit guides 33A and 33B. However, the guide plate 32 and the slit guides 33A and 33B may be integral with each other.

[0025] 6 is a cross-sectional view taken along the CC cut surface of FIG. 5. FIG. 6 illustrates the slit guide 33B and the probe 10 inserted into the slit 35 of the slit guide 33B. The slit guide 33A and the probe 10 inserted into the slit 35 of the slit guide 33A have a plane-symmetric structure with the YZ plane as the symmetric plane in FIG. 6. As shown in FIG. 5 and FIG. 6, the slit guide 33A and the slit guide 33B are disposed on both sides in the short direction (X direction) of the recess 31, and the bottom of the recess 31 and a through hole (not shown) are exposed at the center of the short direction (X direction) of the recess 31. A part of the probe 10 is inserted into each slit 35.

[0026] 6, the slit guide 33B and the probe 10 are disposed in the recess 31. The first main surface 30a of the guide plate 32 contacts the lower surface 20a of the circuit board 20. The contact pattern 21 is formed on a part of the lower surface 20a of the circuit board 20. A through hole 34 is formed in the bottom portion 31a of the recess 31.

[0027] The probe 10 has a rigid part 101, an arm part 102, a device contact part 103, and a spring part 104. The rigid part 101 is a part having sufficient rigidity not to be deformed by various external forces applied to the probe 10 in a normal use state. The rigid part 101 has a board contact part 101a formed at one end (one end in the Z direction) thereof so as to be able to contact the circuit board 20. The board contact part 101a is located at an end of the rigid part 101 on the circuit board 20 side. The board contact part 101a is in contact with the contact pattern 21. The board contact part 101a may have, for example, a plurality of (three in FIG. 6) protruding contact parts 101a. Since the number of contact points with the circuit board 20 is increased, the board contact part 101a and the circuit board 20 can be electrically connected more stably.

[0028] The rigid portion 101 has a contact support portion 101b that supports the substrate contact portion 101a, and a cantilever support portion 101c that supports the arm portion 102 and the spring portion 104.

[0029] The contact support portion 101b supports the state in which the board contact portion 101a applies a predetermined load to the contact pattern 21 (state after preload).

[0030] The cantilever support portion 101c is connected to the lower side (opposite to the Z direction) of the contact support portion 101b. The cantilever support portion 101c has sufficient strength so that it will not deform even if a predetermined load is applied to the arm portion 102 and the spring portion 104.

[0031] The arm portion 102 has a cantilever structure and has a fixed end 102a and a free end 102b. The fixed end 102a is connected to a cantilever support portion 101c of the rigid portion 101. A device contact portion 103 capable of contacting an electronic device 40 to be inspected is connected to the free end 102b. The arm portion 102 may include multiple arms (three arms in FIG. 6). The arm portion 102 has a first biasing function that biases the device contact portion 103 toward the electronic device 40.

[0032] The device contact portion 103 is connected to the free end 102b of the arm portion 102 so as to be able to come into contact with the electronic device 40. The device contact portion 103 has a needle portion 103a at the end portion on the electronic device 40 side (the end portion in the opposite direction to the Z direction). The needle portion 103a is inserted into the through hole 34, and the tip of the needle portion 103a protrudes from the second main surface 30b of the guide plate 32.

[0033] The spring portion 104 has a cantilever structure and has a fixed end 104a and a free end 104b. The fixed end 104a is mechanically connected to the other end 101e of the rigid portion 101. The other end 101e of the rigid portion 101 is an end portion on the opposite side to one end of the rigid portion 101. In other words, the other end 101e of the rigid portion 101 is located on the opposite side of the rigid portion 101 with respect to the board contact portion 101a formed at one end of the rigid portion 101. The spring portion 104 has a second biasing function of biasing the board contact portion 101a toward the circuit board 20 by a load applied to the free end 104b.

[0034] The fixed end 102a of the arm portion 102 is connected to a position on the rigid portion 101 that is different from the other end 101e of the rigid portion 101. The arm portion 102 and the spring portion 104 are not directly connected to each other, but are connected only via the cantilever support portion 101c. The fixed end of the arm portion 102 is connected to a position on the rigid portion 101 that is different from the other end 101e of the rigid portion 101. For example, the fixed end 102a of the arm portion 102 is located between the fixed end 104a of the spring portion 104 and the substrate contact portion 101a. Therefore, the arm portion 102 and the spring portion 104 can function independently of each other.

[0035] The free end 104b of the spring portion 104 may be curved toward the board contact portion 101a. The load generated by the deformation of the spring portion 104 may be smaller than the load generated by the deformation of the arm portion 102.

[0036] The through hole 34 penetrates the probe guide 30 from the bottom 31a of the recess 31 in the direction in which the device contact portion 103 is biased (the opposite direction to the Z direction). Therefore, the arm portion 102 is elastically deformed by a load applied to the needle portion 103a of the device contact portion 103 connected to the free end 102b. The arm portion 102 biases the needle portion 103a toward the circuit board 20 through the through hole 34 by elastically deforming. The needle portion 103a can apply an overdrive (OD) load to the electrode pad 402 of the electronic device 40.

[0037] The width (length in the Y direction) of the slit 35 is, for example, 40 μm, and the width (length in the Y direction) of the probe 10 is, for example, 30 μm. Therefore, a gap of 5 μm in the Y direction is formed between the slit 35 and the probe 10. This gap allows the arm portion 102 and the spring portion 104 to freely elastically deform within the slit 35.

[0038] The entire rigid portion 101, a part of the arm portion 102 including the fixed end 102a, and a part of the spring portion 104 including the fixed end 104a are housed in the slit 35. The remaining portion of the arm portion 102 including the free end 102b, the entire device contact portion 103, and the remaining portion of the spring portion 104 including the free end 104b are disposed outside the slit 35.

[0039] As shown in FIG. 7, the length of the arm portion 102c housed in the slit 35 is about 40% to 80% of the entire length of the arm portion 102 (102c, 102d). The ratio of the gap in the Y direction between the slit 35 and the probe 10 and the length of the arm portion 102c housed in the slit 35 is adjusted. This allows the slit guide 33B to maintain the posture of the probe 10 in the recess 31, and prevents the probes 10 from contacting each other and from falling over. By setting the length of the arm portion 102c housed in the slit 35 to 80% or less, at least 20% of the remaining portion 102d of the arm portion 102 is exposed outside the slit 35. For example, a robot hand can grasp the remaining portion 102d of the arm portion 102 and insert the probe 10 into the slit 35.

[0040] [About the preload of probe card 1] The preload of the probe card 1 will be described. FIG. 7 is a cross-sectional view showing a state before the board contact portion 101a applies a preload load to the contact pattern 21 of the circuit board 20 (state before preload). Meanwhile, FIG. 6 is a cross-sectional view showing a state after the board contact portion 101a applies a preload load to the contact pattern 21 of the circuit board 20 (state after preload). As shown in FIG. 7, in the state before preload, the board contact portion 101a is in contact with the contact pattern 21 but is not biased toward the contact pattern 21. That is, the board contact portion 101a does not apply a preload load to the contact pattern 21. In addition, the free end 104b of the spring portion 104 is in contact with the bottom 31a of the recess 31 but is not subjected to a load from the bottom 31a of the recess 31. Therefore, the spring portion 104 is not elastically deformed. Furthermore, a gap is formed between the first main surface 30a of the guide plate 32 and the lower surface 20a of the circuit board 20. From the state before preload shown in FIG. 7, the screws 50 and 51 are fastened. As a result, there is no gap between the first main surface 30a of the guide plate 32 and the lower surface 20a of the circuit board 20, and the state changes to the state after preload shown in FIG. 6. At this time, a load is applied from the bottom 31a of the recess 31 to the free end 104b of the spring portion 104, and the spring portion 104 is elastically deformed toward the circuit board 20 side. Due to the elastic deformation of the spring portion 104, a load for preload is applied from the board contact portion 101a to the lower surface 20a of the circuit board 20. In other words, the spring portion 104 urges the board contact portion 101a toward the circuit board 20 by the load applied to its free end 104b. By fastening the screws 50 and 51, the state after preload is maintained, and the probe 10 is fixed in the recess 31 of the probe guide 30. In this manner, the probe card 1 is assembled without bonding the probes 10 to the circuit board 20.

[0041] As shown in FIG. 7, the length L1 in the depth direction (Z direction) of the recess 31 is longer than the length L2 in the Z direction of the rigid part 101 of the probe 10. The length L3 in the Z direction by which the spring part 104 can deform is equal to or greater than the difference between the length L1 in the Z direction of the recess 31 and the length L2 in the Z direction of the rigid part 101. This allows the spring part 104 to elastically deform and perform preloading by fastening the screws 50, 51 until the first main surface 30a of the probe guide 30 contacts the lower surface 20a of the circuit board 20. At the same time, the probe guide 30 can be fixed to the circuit board 20. This allows a stable electrical connection between the circuit board 20 and the probe 10 to be realized without joining the circuit board 20 and the probe 10. The length L3 in the Z direction by which the spring part 104 can deform is, for example, 100 μm. The length in the Z direction by which the spring part 104 is deflected during preloading (called the "preload amount") is set to be equal to or less than the length L3.

[0042] 6, a side surface 101f on the X-direction side of the rigid portion 101 abuts against a side surface of the slit guide 33B of the probe guide 30. The side surface 101f on the X-direction side of the rigid portion 101 is a side surface of the rigid portion 101 on the opposite side to the direction in which the spring portion 104 extends from the fixed end 104a (the opposite direction to the X-direction). For example, the side surface 101f on the X-direction side of the rigid portion 101 and the side surface of the rigid portion 101 may be in contact with each other at a surface having a predetermined area.

[0043] [Effects] Conventionally, probes were soldered to the board. For one probe card, several thousand to tens of thousands of probe pins are grasped by a handler and bonded with a laser, which creates the problem of time-consuming creation of the probe card. In particular, there has been a strong need recently to shorten the manufacturing time of the bonding part. Therefore, we devised a structure that allows the probe card to be assembled without bonding.

[0044] As shown in FIG. 6, a board contact portion 101a capable of contacting the circuit board 20 is formed at one end (end in the Z direction) of the rigid portion 101. A fixed end 104a of a spring portion 104 having a cantilever structure is connected to the other end 101e (end in the opposite direction to the Z direction) of the rigid portion 101. The spring portion 104 urges the board contact portion 101a toward the circuit board 20 by a load applied to a free end 104b of the spring portion 104. Therefore, if the state in which the board contact portion 101a applies a load to the circuit board 20 by the spring portion 104 (state after preload) can be maintained, the probe 10 can be attached to the circuit board 20 without bonding the board contact portion 101a to the circuit board 20 by solder or the like. That is, the probe card 1 including the probe 10 and the circuit board 20 can be assembled without bonding, without performing laser bonding or the like.

[0045] The arm portion 102 biases the device contact portion 103 toward the electronic device 40. The arm portion 102 and the spring portion 104 exert biasing functions independently of each other. In a state in which the board contact portion 101a applies a load to the circuit board 20 by the spring portion 104 (post-preload state), the arm portion 102 functions independently of the spring portion 104. Therefore, even in the post-preload state, the arm portion 102 can bias the device contact portion 103 toward the electronic device 40. Therefore, the device contact portion 103 can apply an overdrive (OD) load to the electronic device 40. Therefore, the probe 10 can accurately electrically connect the electronic device 40 to be tested and the circuit board 20.

[0046] Fixed end 102a of arm portion 102 is connected to a position different from the other end 101e of rigid portion 101. Fixed end 104a of spring portion 104 is connected to the other end 101e of rigid portion 101. Since fixed end 102a of arm portion 102 and fixed end 104a of spring portion 104 are each connected to different positions of rigid portion 101, the two cantilevers 102, 104 can function independently of each other.

[0047] The fixed end 102a of the arm portion 102 is located between the fixed end 104a of the spring portion 104 and the board contact portion 101a. This makes it possible to maintain the arm portion 102, which is located between the board contact portion 101a and the spring portion 104, in a floating state after the preload. Therefore, in the post-preload state, the device contact portion 103 can apply an overdrive load to the electronic device 40 by using the arm portion 102.

[0048] The free end 104b of the spring portion 104 is curved toward the board contact portion 101a side. This makes it possible to prevent the free end 104b from getting caught when a load is applied from the bottom 31a of the recess 31 to the free end 104b of the spring portion 104.

[0049] If the load for preloading is too large, the probe guide 30 may be warped, bent, or broken. Therefore, the load (load for preloading) generated by the deformation of the spring portion 104 is set to be smaller than the load (load for overloading) generated by the deformation of the arm portion 102. For example, the spring portion 104 generates a load for preloading (for example, 10 g weight per probe 10) that does not cause the probe guide 30 to be warped, bent, or broken. This makes it possible to realize a stable electrical connection between the circuit board 20 and the probe 10 while suppressing warping of the probe guide 30. For example, the load of the spring portion 104 may be changed by adjusting the thickness, length, angle, etc. of the spring portion 104. It is possible to suppress damage, bending, etc. of the probe guide 30 after preloading.

[0050] The board contact portion 101a has a plurality of protruding contact portions 101a, which increases the number of contact points with the circuit board 20, allowing the board contact portion 101a and the circuit board 20 to be electrically connected more accurately.

[0051] The probe card 1 has a probe guide 30, and the probe guide 30 fixes the probe 10 in a state in which the board contact portion 101a of the probe 10 is biased toward the circuit board 20 by the spring portion 104 of the probe 10. This allows the probe 10 to be attached to the circuit board 20 without joining the board contact portion 101a to the circuit board 20 by solder or the like. In other words, the probe card 1 including the probe 10 and the circuit board 20 can be assembled without joining.

[0052] The spring portion 104 biases the board contact portion 101a toward the circuit board 20 by a load applied from the bottom portion 31a of the recess 31 to a free end 104b of the spring portion 104. This enables the probe guide 30 to fix the probe 10 in a state in which the board contact portion 101a is biased toward the circuit board 20 by the spring portion 104.

[0053] 7, the length L1 in the depth direction (Z direction) of the recess 31 is longer than the length L2 in the Z direction of the rigid part 101 of the probe 10, and the length L3 in the depth direction over which the spring part 104 can deform is equal to or greater than the difference between the length L1 in the Z direction of the recess 31 and the length L2 in the Z direction of the rigid part 101. This allows the board contact part 101a to be biased toward the circuit board 20 within the range over which the spring part 104 can deform.

[0054] As shown in Fig. 6, since the spring portion 104 has a cantilever structure, a rotation moment is generated around the fixed end 104a when a load is applied to the free end 104b. Therefore, a side surface 101f of the rigid portion 101 on the opposite side to the direction in which the spring portion 104 extends from the fixed end 104a (opposite the X direction) is abutted against a side surface of the probe guide (slit guide 33B). This makes it possible to suppress movement of the probe 10 due to the rotation moment. Specifically, it is possible to suppress movement of the probe 10 relative to the circuit board 20 or the probe guide 30 due to the rotation moment.

[0055] The through hole 34 penetrates the probe guide (guide plate 32) from the bottom 31a of the recess 31 toward the direction in which the device contact portion 103 is biased. The device contact portion 103 has a needle portion 103a that penetrates the through hole 34. Since the through hole 34 can guide the movement of the needle portion 103a, buckling or deformation of the probe 10 can be suppressed.

[0056] Second embodiment With reference to FIG. 8, the outline of the probe card 1A according to the second embodiment will be described. In FIG. 1, the circuit elements such as the capacitor 53 are housed in the recess 31. If the number of recesses 31 increases, the thin portion of the probe guide 30 increases, so the strength of the probe guide 30 decreases and warping or bending is likely to occur. Therefore, instead of the recesses 31, a spacer 55 is inserted between the circuit board 20 and the probe guide 30A. This makes it unnecessary to have a recess for inserting the circuit elements, reduces the number of countersunk holes (recesses), and suppresses the decrease in the strength of the probe guide 30. In addition, the distance from the bottom 31a of the recess 31 of the probe guide 30 to the bottom surface of the circuit board 20 is increased by the amount of the spacer 55. This can be addressed by lengthening the portion supporting the needle portion 103a of the probe.

[0057] The spacer 55 has a sufficient thickness (length in the Z direction) to accommodate circuit elements such as the capacitor 53. The spacer 55 is formed to be thicker than the thickness (length in the Z direction) of the capacitor 53. The spacer 55 is formed in a portion where the screw 50 for fixing the circuit board 20 and the probe guide 30A and the screw 51 for fastening the circuit board 20, the probe guide 30A, and the support ring 52 are disposed. The spacer 55 is formed with holes for passing the screws 50 and 51. By disposing the spacer 55 between the circuit board 20 and the probe guide 30A and fastening the screws 50 and 51, the probe 10 can be fixed to the circuit board 20 and the probe guide 30A while being in a preloaded state, as in the first embodiment.

[0058] Third embodiment The configuration of a probe 10A according to the third embodiment will be described with reference to Fig. 9. The probe 10A is a modified example of the probe 10 according to the first embodiment. Differences from the probe 10 will be described, and common points will be given the same reference numerals and will not be described. The main difference between the probe 10A and the probe 10 is that the spring portion 104A has a folded-back structure.

[0059] The spring portion 104A has a fixed end 104Aa, a free end 104Ab, and a folded portion 104Ac. The folded portion 104Ac is located between the fixed end 104Aa and the free end 104Ab. The spring portion 104A extends from the fixed end 104Aa in the opposite direction to the X direction, changes the angle by about 180° at the folded portion 104Ac, and extends toward the X direction to the free end 104Ab. The free end 104Ab is located a predetermined distance away from the fixed end 104Aa in the opposite direction to the Z direction. Although FIG. 9 shows a case where the number of folded portions 104Ac is one, the spring portion 104A may have two or more folded portions 104Ac.

[0060] By having the spring portion 104A have a folded structure, the preload load by the spring portion 104A can be made larger than in a case where the spring portion does not have a folded structure, and the electrical connection between the circuit board 20 and the probe 10A can be made more stable.

[0061] The probe 10A has a rigid portion 101A, an arm portion 102 connected to the rigid portion 101A, a device contact portion 103 connected to the arm portion 102, and a spring portion 104A connected to the rigid portion 101A.

[0062] (Fourth embodiment) The configuration of the probe 10B according to the fourth embodiment will be described with reference to FIG. 10. Compared to the probe 10 shown in FIG. 6, the structure of the device contact portion 103B and the through holes 34Aa and 34Ab is different. The other parts are common. In the probe 10B according to the fourth embodiment, a part of the device contact portion 103B is inserted into the through hole 34Ab. The needle portion 103a of the device contact portion 103B is inserted into the through hole 34Aa. The through hole 34Ab is a hole larger than the through hole 34Aa. The through hole 34Ab can support a part of the device contact portion 103B. Therefore, compared to the example of FIG. 6 in which the through hole 34 guides only the needle portion 103a, the probe guide 30 can hold the probe 10B more stably. In particular, the device contact portion 103B and the needle portion 103a can be held more stably.

[0063] Although the present invention has been described by the above embodiment, the description and drawings forming a part of this invention should not be understood as limiting the present invention. From this disclosure, various alternative embodiments, examples and operating techniques will become apparent to those skilled in the art. [Explanation of symbols]

[0064] 1, 1A probe card 10, 10A, 10B Probes 20 Circuit Board 21 Contact Pattern 30, 30A Probe Guide 30a 1st main surface (top surface) 31 Recess 31a bottom 32 Guide plate 33A, 33B Slit guide 34, 34Aa, 34Ab through hole 35 Slit 40 Electronic Devices 55 Spacer 101, 101A Rigid part 101a, 101Aa Board contact part 101e other end 101f side 102 Arm section 102a, 104a, 104Aa fixed end 102b, 104b, 104Ab free end 103, 103B Device contact 103a Needle part 104, 104A Spring part 104Ac Folding part

Claims

1. A probe for electrically connecting an electronic device under test and a circuit board, a rigid portion having a board contact portion formed at one end thereof capable of contacting the circuit board; an arm portion having a cantilever structure with a fixed end and a free end, the fixed end being connected to the rigid portion; a device contact portion connected to a free end of the arm portion and capable of contacting the electronic device; a cantilever spring portion having a fixed end and a free end, the fixed end being connected to the other end of the rigid portion, the cantilever spring portion urging the board contact portion toward the circuit board by a load applied to the free end; A probe having

2. the arm portion has a function of biasing the device contact portion toward the electronic device, The probe according to claim 1 , wherein the arm portion and the spring portion exert a biasing function independently of each other.

3. The probe according to claim 1 , wherein the fixed end of the arm portion is connected to a position different from the other end of the rigid portion.

4. The probe according to claim 1 , wherein the fixed end of the arm portion is located between the fixed end of the spring portion and the board contact portion.

5. 2. The probe according to claim 1, wherein the free end of the spring portion is curved toward the board contact portion.

6. The probe according to claim 1 , wherein the spring portion has one or more folded portions between the free end and the fixed end.

7. 2. The probe according to claim 1, wherein a load generated by the deformation of the spring portion is smaller than a load generated by the deformation of the arm portion.

8. 2. The probe according to claim 1, wherein the substrate contact portion has a plurality of protruding contact portions.

9. A probe according to any one of claims 1 to 8; the circuit board with which the board contact portion is in contact; a probe guide that fixes the probe in a state in which the board contact portion is biased toward the circuit board by the spring portion; and A probe card comprising:

10. The probe guide comprises: A first main surface facing the circuit board; a recess formed in the first main surface, The probe is housed within the recess; The spring portion biases the board contact portion toward the circuit board by a load applied from the bottom of the recess to a free end of the spring portion. The probe card of claim 9 .

11. a depth direction length of the recess is longer than a depth direction length of the rigid portion of the probe; a length in the depth direction in which the spring portion can deform is equal to or greater than a difference between a length in the depth direction of the recess and a length in the depth direction of the rigid portion; The probe card of claim 10.

12. The side surface of the rigid portion opposite to the direction in which the spring portion extends from the fixed end is in contact with the side surface of the probe guide. The probe card of claim 9 .

13. the probe guide has a through hole penetrating the probe guide from a bottom of the recess toward a direction in which the device contact portion is biased; The device contact portion has a needle portion that penetrates the through hole. The probe card of claim 10.

14. A spacer is inserted between the circuit board and the probe guide. The probe card of claim 9 .

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