Probe station

Abstract

The utility model provides a probe station, and relates to the technical field of thermal printing head equipment. Comprising an industrial control system, and a vacuum adsorption platform, an XY-axis displacement mechanism, a Z-axis lifting mechanism, a rotation angle compensation mechanism, a visual positioning system, a probe washing device, a probe card and a resistance adjusting case which are connected with the industrial control system. Through the equipment, the uniformity during resistance trimming can be improved, and the resistance trimming efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal print head devices, and more particularly, to a probe station. Background Art

[0002] When preparing the resistance value of the existing thermal print head, a probe is required for resistance adjustment to ensure that the resistance values between each printing point meet the requirements. However, the existing equipment has problems such as poor uniformity, slow resistance adjustment, low stability, and poor reliability during resistance adjustment. Poor uniformity will lead to quality defects such as uneven ink dots for printing, slow resistance adjustment affects the resistance adjustment efficiency, and low stability and poor reliability are likely to cause defective products. Summary of the Utility Model

[0003] The utility model discloses a probe station, aiming to improve the problem of poor uniformity of the existing probe resistance adjustment mechanism.

[0004] The utility model adopts the following scheme:

[0005] A probe station includes an industrial control system and a vacuum adsorption platform, an XY-axis displacement mechanism, a Z-axis lifting mechanism, a rotation angle compensation mechanism, a vision positioning system, a needle cleaning device, a probe card, and a resistance adjustment chassis connected to the industrial control system; wherein,

[0006] There are multiple resistance adjustment probes on the probe card;

[0007] The vacuum adsorption platform is arranged on the XY-axis displacement mechanism, and a positioning mechanism is arranged on the vacuum adsorption platform for positioning and clamping the thermal print head substrate;

[0008] On the thermal print head substrate to be adjusted for resistance, a large number of heating points are densely arranged at a preset interval in the XY direction. By moving the XY coordinates, the heating points to be measured form a one-to-one correspondence with the resistance adjustment probes of the probe card to meet the requirements of positioning and alignment, and the heating points on the thermal print head substrate are grouped and tested according to the number of probes on the probe card until all resistance adjustments are completed;

[0009] The vision positioning system is arranged above the vacuum adsorption platform for identifying and positioning all the heating points and the conductive circuits of the heating points on the substrate to be measured, forming an XY coordinate system, and calculating the deviation angle of the heating points from this XY coordinate system to calculate the angle required to rotate the probe card, so that the resistance adjustment probes of the probe card are aligned with the conductive circuits of the heating points to be measured in the XY extension direction;

[0010] An installation platform suitable for installing the probe card is arranged on the Z-axis lifting mechanism, and is suitable for driving the probe card to lift above the substrate so that each resistance adjustment probe on the probe card contacts the heating point electrode;

[0011] A rotation angle compensation mechanism is provided on the mounting table to drive the probe card to rotate by the calculated angle of deviation of the heating point in the XY direction; the XY-axis displacement mechanism is adapted to drive the substrate to move under the probe card, so that the heating point electrode contacts the trimming probe on the probe card, ensuring that each heating point completes trimming one by one; a needle washing device is provided on the XY-axis displacement mechanism, and the needle washing device is adapted to clean the tips of the probes on the probe card to remove oxides, contaminants and perform horizontal calibration after passivation;

[0012] The probe card is connected to a trimming chassis, and the trimming chassis provides corresponding pulse voltages one by one according to the number of probes of the probe card to trim the resistance values of the corresponding heating points.

[0013] Further, the vision positioning system includes a lifting device and a vision lens provided on the lifting device. The vision lens is adapted to photograph and identify the positions of the heating point electrodes on the substrate, and can move to the probe position under the drive of the lifting device to obtain image information of the probes, and transmit the image information to the industrial control system.

[0014] Further, a fine adjustment mechanism is provided on the Z-axis lifting mechanism, and the fine adjustment mechanism is adapted to adjust the height of the probe card; the industrial control system is configured to, when testing and trimming, according to the probe image information obtained by the vision lens and the potential change generated during the substrate test by the industrial control system, when the height of the probe bottom end is different and the potential fluctuation during the test exceeds the preset range, drive the needle washing device under the probe card to grind it flat to ensure the uniformity of trimming.

[0015] Further, the Z-axis lifting mechanism includes a lifting component provided on the base and two guide rods parallel to the lifting direction of the lifting component. The mounting table is connected to the guide rods through sliders; the fine adjustment mechanism is fixed on the slider and one end of it is in contact connection with the top end of the lifting component, so as to act on the fine adjustment mechanism through the lifting component, and then drive the mounting table to move up and down to adjust the initial height of the probe card.

[0016] Further, a turntable for mounting the probe card is rotatably provided on the mounting table, and gear teeth are provided on the turntable. The rotation angle compensation mechanism includes a rotation motor provided on the mounting table, and an output shaft of the rotation motor is connected with a gear component adapted to match the gear teeth, so as to drive the turntable to rotate through the rotation motor, and then perform fine rotation adjustment of the probe card on the horizontal plane.

[0017] Further, a probe card fixing mechanism is provided on the turntable. The fixing mechanism includes a plurality of locking rods and fine-tuning rods. The locking rods are adapted to be locked on opposite sides of the probe card, and the fine-tuning rods are adapted to press the rear end position of the probe card, so as to keep the probe card horizontal through the plurality of locking rods and fine-tuning rods.

[0018] Further, an elastic fixing assembly is provided on one side of the mounting table. The elastic fixing assembly includes two pressing blocks mounted on a cylinder, and an elastic member is provided on each pressing block to press the substrate onto the vacuum adsorption platform from above when the substrate is placed on the vacuum adsorption platform.

[0019] Further, a spare conductive probe is provided on one side of the vacuum adsorption platform. The spare conductive probe is connected to a flipping mechanism, and the spare conductive probe is adapted to be flipped through the flipping mechanism to connect with the electrodes on the substrate when the substrate placed on the vacuum adsorption platform has no common electrode or the common electrode fails.

[0020] Further, a marking point mechanism is provided on the mounting table. The marking point mechanism is arranged on the side of the probe card to make a marking point when the final resistance value of the heating point does not meet the preset target resistance value range.

[0021] Beneficial effects:

[0022] By the above method, it is possible to solve the quality defects of the existing thermal print head in resistance preparation, such as uneven printing ink dots due to poor uniformity, as well as the technical problems of slow resistance adjustment, low stability, and poor reliability during resistance preparation. It can also achieve high-speed resistance adjustment, continuous rhythm, and high utilization rate. Description of the drawings

[0023] Figure 1 is a schematic diagram of the overall structure of a probe station according to an embodiment of the present invention;

[0024] Figure 2 is a schematic diagram of the structure of the XY-axis displacement mechanism of a probe station according to an embodiment of the present invention;

[0025] Figure 3 is a schematic diagram of the structure of the resistance adjustment mechanism part of a probe station according to an embodiment of the present invention;

[0026] Figure 4 is a schematic diagram of the structure of a probe station after hiding the mounting table according to an embodiment of the present invention;

[0027] Figure 5 is a schematic diagram of the structure of the marking point mechanism of a probe station according to an embodiment of the present invention;

[0028] Icons: base 100, vacuum adsorption platform 110, XY-axis displacement mechanism 120, Z-axis lifting mechanism 130, lifting component 131, guide rod 132, fine-tuning mechanism 140, vision positioning system 150, probe card 160, needle washing device 170, flipping mechanism 181, spare conductive probe 182, mounting table 191, marking point mechanism 192, turntable 193, fixing mechanism 194, locking rod 1941, fine-tuning rod 1942, elastic fixing component !95, rotational angle compensation mechanism 196. Detailed implementation manners

[0029] Embodiment 1

[0030] In combination with Figures 1 to 5As shown in the figure, this embodiment provides a probe station, which includes an industrial control system and a vacuum adsorption platform 110, an XY-axis displacement mechanism 120, a Z-axis lifting mechanism 130, a rotation angle compensation mechanism 196, a vision positioning system 150, a needle washing device 170, a probe card 160, a flipping electrode, and a resistance trimming chassis connected to the industrial control system; wherein, there are multiple resistance trimming probes on the probe card 160; the vacuum adsorption platform 110 is arranged on the XY-axis displacement mechanism 120 and is used for adsorbing a thermal printer head substrate to be trimmed in resistance. A large number of heating points are densely arranged on the thermal printer head substrate to be trimmed in resistance at a preset interval in the XY direction. By moving the XY coordinates, the heating points to be measured are made to form a one-to-one correspondence with the resistance trimming probes of the probe card 160 to meet the requirements of positioning and alignment, and the heating points on the thermal printer head substrate are grouped and tested according to the number of probes on the probe card 160 until all resistance trimming is completed; the vision positioning system 150 is arranged above the vacuum adsorption platform 110 and is used for identifying all the heating points and the conductive lines of the heating points of the thermal printer heads on the substrate to be measured, so as to form an XY coordinate system, and calculating the deviation angle of the heating points from this XY coordinate system to calculate the angle required to rotate the probe card 160, so that the resistance trimming probes of the probe card 160 are kept consistent with the conductive lines of the heating points to be measured in the XY extension direction, ensuring that the resistance trimming probes can be accurately docked with the heating points; the Z-axis lifting mechanism 130 is provided with a mounting table 191 suitable for installing the probe card 160 and is suitable for driving the probe card 160 to lift above the substrate so that each resistance trimming probe on the probe card 160 contacts the heating point electrode; a rotation angle compensation mechanism 196 is arranged on the mounting table 191 and is used for driving the probe card 160 to rotate a predetermined angle; the XY-axis displacement mechanism 120 is suitable for driving the substrate to move below the probe card 16 to make the heating point electrode contact the resistance trimming probes on the probe card 160, ensuring that each heating point is trimmed in resistance one by one; a needle washing device 170 is arranged on the XY-axis displacement mechanism 120, and the needle washing device 170 is suitable for cleaning the tips of the probes on the probe card 160 to remove oxides, contaminants or perform horizontal calibration on the probes after passivation; the probe card 160 is connected to the resistance trimming chassis, and the resistance trimming chassis provides corresponding pulse voltages one by one according to the number of probes on the probe card to trim the resistance values of the corresponding heating points.

[0031] Combined with Figures 1 to 2As shown, in this embodiment, the XY-axis displacement mechanism 120 and the Z-axis lifting mechanism 130 are arranged on the base 100. The vacuum adsorption platform 110 is detachably arranged on the XY-axis displacement mechanism 120. Clamping devices are further arranged on the four peripheral sides of the vacuum adsorption platform 110, which can be used to correct the position of the substrate placed on the vacuum adsorption platform 110 on the one hand, and also used for auxiliary clamping to avoid deviation during the displacement of the machine table or during resistance adjustment. The needle washing device 170 is arranged on the XY-axis displacement mechanism 120 and is used to move below the probe card 160 when needle washing is required, and the probes on the probe card 160 are ground on the needle washing device 170 by moving. In one embodiment, the needle washing device 170 can be sandpaper for grinding the end of the probe. Preferably, a blowing device is arranged on one side of the sandpaper to blow air while washing the needle to prevent debris of the probe from adhering to the end of the probe and affecting the subsequent test and resistance adjustment effects.

[0032] In this embodiment, a large number of heating points are densely arranged on the thermosensitive print head substrate to be resistance-adjusted at a preset interval in the XY direction. By moving the XY coordinates, the heating points to be measured are made to form a one-to-one correspondence with the resistance-adjusting probes of the probe card 160 to meet the requirements of positioning and alignment. And the heating points on the thermosensitive print head substrate are grouped and tested according to the number of probes of the probe card 160 until all resistance adjustments are completed. The visual positioning system 150 can be used to identify all the heating points of the thermosensitive print head on the substrate to be measured and the conductive circuits of the heating points to form an XY coordinate system, and the deviation angle of the heating points is calculated from this XY coordinate system. The coordinate data of the heating points obtained by the visual positioning system 150 is used by the industrial control system to control the XY-axis displacement mechanism 120 and the rotation angle compensation mechanism 196 to adjust the position so that the heating points are accurately docked with the resistance-adjusting probes.

[0033] Combined with Figures 1 to 4As shown, the Z-axis lifting mechanism 130 includes a lifting component 131 disposed on the base 100 and two guide rods 132 parallel to the lifting direction of the lifting component 131. The mounting table 191 is connected to the guide rods 132 through sliders. The fine-tuning mechanism 140 is fixed on the sliders and one end thereof is in contact connection with the top end of the lifting component 131, so as to act on the fine-tuning mechanism 140 through the lifting component 131, thereby driving the mounting table 191 to move up and down. Here, the fine-tuning mechanism 140 can be adjusted by a micrometer component controlled by a gear set with higher precision in cooperation with a motor. The lifting component 131 includes a linear motor. The linear motor is disposed on one side of the two guide rods 132 and is used to drive the slider to rise. When the extending shaft of the linear motor contracts, the slider and the mounting table 191 descend under the action of their own gravity. The end of the micrometer component on the fine-tuning mechanism 140 is in contact with the end of the extending shaft of the linear motor and is used to support the slider. Thus, when adjusting the micrometer component, the mounting table 191 and the probe card 160 on the mounting table 191 can be controlled to perform fine up-and-down adjustment. This is because the precision of the linear motor or other lifting mechanisms is difficult to meet the adjustment of a tiny distance. When there is a tiny distance between the probe on the probe card 160 and the heating point on the substrate, a large potential fluctuation will occur during resistance measurement, and the measured resistance value will also fluctuate, and the fluctuation is relatively large. The reason for the fluctuation may be that the contact point between the probe and the heating point is small, or it may be that the descending height of the tip of the probe is large, resulting in the bending of the tip (the tip is flexible). At this time, if the linear motor is directly started for lifting, it may cause the probe to be completely separated from the substrate, or the amount of downward movement of the probe is large, resulting in damage to the probe. Therefore, by providing the fine-tuning mechanism 140 for adjustment, the precision can reach 1um, which can effectively prevent the occurrence of the above situations.

[0034] Combined with Figures 1 to 5As shown, the vision positioning system 150 includes a lifting device and a vision lens disposed on the lifting device. The vision lens is adapted to photograph and identify the positions of the heating point electrodes on the substrate, and can move to the probe position under the drive of the lifting device to obtain the image information of the probe, and transmit the image information to the industrial control system. The vision lens is provided with a fine-tuning component for adjusting the position and height of the vision lens. After being used for a period of time and after the rotation angle compensation mechanism 196 is adjusted, when the industrial control system can still detect that the resistance value or potential fluctuation of some of the measured heating points exceeds the preset range, it may be that the probe card 160 has not moved in place. At this time, the vision lens can be driven to descend to the probe position for photographing and identification. According to the probe image information obtained by the vision lens, when it is found that the probe is not in full contact with the heating point of the substrate, the probe card 160 can be driven to descend a certain scale distance through the fine-tuning mechanism 140 until the resistance value or potential fluctuation detected by the industrial control system becomes smaller, or the fluctuation range is within the preset range; if the vision lens identifies that the tip part of the probe is bent, it means that the probe card 160 has descended to a relatively large height. At this time, the probe card 160 can be controlled to rise a certain scale distance through the fine-tuning mechanism 140 until the resistance value or potential fluctuation detected by the industrial control system becomes smaller, or the fluctuation range is within the preset range; if the resistance value or potential fluctuation detected by the industrial control system cannot be made smaller through the fine-tuning mechanism 140, or the fluctuation range cannot be made within the preset range, it indicates that there is a problem of uneven probe lengths on the probe card 160. At this time, the needle washing device 170 is driven under the probe card 160 for grinding and cleaning to ensure that the tip heights of each probe are consistent, thereby improving the uniformity of the resistance value during resistance adjustment. In addition, the needle washing device 170 can also perform overall calibration after the resistance adjustment probe is passivated, improving the accuracy of the resistance adjustment.

[0035] Combined with Figures 1 to 5As shown in the figure, a turntable 193 for installing the probe card 160 is rotatably arranged on the installation table 191. The turntable 193 is provided with gear teeth. The rotation angle compensation mechanism 196 includes a rotation motor arranged on the installation table 191. The output shaft of the rotation motor is connected with a gear assembly adapted to match the gear teeth, so as to drive the turntable 193 to rotate through the rotation motor, and then finely adjust the probe card 160 left and right. A probe card fixing mechanism 194 is arranged on the turntable 193. The fixing mechanism 194 includes a plurality of locking rods 1941 and a fine adjustment rod 1942. The locking rods 1941 are adapted to be locked on the opposite sides of the probe card 160, and the fine adjustment rod is adapted to press the rear end position of the probe card 160. The probe card 160 is kept horizontal by the plurality of locking rods 1941 and the fine adjustment rod 1942. In this embodiment, the probe card 160 is installed in the fixing mechanism 194, the locking rods 1941 are adjusted and locked, and then fine adjustment is performed through the fine adjustment rod 1942, so that the probe card 160 is kept horizontal in the fixing mechanism 194. An elastic fixing assembly 195 is arranged on one side of the installation table 191. The elastic fixing assembly 195 includes two pressing blocks installed on the cylinder. Each pressing block is provided with an elastic member to press the substrate onto the vacuum adsorption platform 110 from above the substrate when the substrate is placed on the vacuum adsorption platform 110. A marking point mechanism 192 is arranged on the installation table 191. The marking point mechanism 192 is arranged on the side of the probe card 160 to make a dot mark when the resistance value of the heat generating point at the corresponding position of the substrate is detected to be abnormal.

[0036] In this solution, by setting the rotation angle compensation mechanism 196, it can cooperate with the fine adjustment mechanism 140. When the difference between the actually measured resistance value and the set target resistance value exceeds the preset target value or the measured resistance value reading is abnormal, the probe card 160 is lifted by the lifting mechanism, and then the rotation angle compensation mechanism 196 is used to control the probe card 160 to move left and right respectively for fine adjustment. The fine adjustment range is about 1 - 10 μm at intervals. The left and right fine adjustment and needle insertion are repeated. If the resistance value reading is normal and the difference between the actually measured resistance value and the set target resistance value is within the allowable range of the preset target value, then resistance adjustment can be performed. If the normal reading still cannot be obtained after repeated fine adjustment for many times or the difference between the actually measured resistance value and the set target resistance value still exceeds the preset target value, it is determined that there are relatively large problems with the heat generating points in this area. A dot mark is made through the marking point mechanism 192, and no resistance adjustment action is performed. Here, the rotation angle compensation mechanism 196 can adjust the problem that the probe is not accurately aligned with the heat generating point caused by the position error between the probe and the heat generating point, and the left and right fine adjustment is repeated to make the probe accurately aligned with the heat generating point. During the test process, the resistance adjustment chassis collects the resistance value in real time.

[0037] Combined Figure 1 and Figure 2As shown, in another embodiment, a spare conductive probe 182 is provided on one side of the vacuum adsorption platform 110. The spare conductive probe 182 is connected to a flipping mechanism 181. The spare conductive probe 182 is adapted to be flipped by the flipping mechanism 181 when the substrate to be adjusted for resistance placed on the vacuum adsorption platform 110 has no common electrode or the common electrode fails, so that the spare conductive probe 182 is connected to the electrode on the substrate. By providing the spare conductive probe 182, this mechanism can be adapted to test different types of substrates, especially substrates with and without common electrodes. Here, when adjusting the resistance of a substrate with a common electrode, the common electrode on the substrate is electrically connected to the resistance adjustment chassis, and the probe serves as another electrode to form a circuit with the common electrode, so that the resistance measurement of the heating point can be carried out. Then, a pulsed voltage is output by the resistance adjustment chassis for resistance adjustment. When adjusting the resistance, each heating point is independently adjusted from one end to the other end. For the heating points whose resistance values meet the requirements, no adjustment is needed. For those with too large resistance values, pulsed voltage is required for resistance adjustment. The method of adjusting resistance by pulsed voltage is a prior art and will not be elaborated here. When the substrate has no common electrode, the flipping mechanism 181 flips the spare conductive probe 182 to a position close to the substrate, so that the substrate is connected to the spare conductive probe 182, and the spare conductive probe 182 acts as one of the electrodes of the substrate.

[0038] By providing the fine adjustment mechanism 140 and the rotation angle compensation mechanism 196, the position of the probe card 160 can be finely adjusted in cooperation with the industrial control system before resistance adjustment, thus effectively solving the problem of poor reliability of resistance adjustment. At the same time, in cooperation with the needle washing device 170, the uniformity of resistance adjustment can be improved, and the quality defect that the printing ink dots are thick and thin due to poor uniformity in the resistance preparation of the existing thermal printing heads can be solved.

[0039] Embodiment 2

[0040] The present utility model also provides a method for adjusting the resistance of a probe table, including the following steps:

[0041] S1. Positioning: Use the vision positioning system to comprehensively scan the heat - generating points on the entire substrate, and then perform high - precision positioning and rotation angle compensation to ensure that each probe can accurately contact the electrodes of the heat - generating points for reading resistance and adjusting resistance by power supply. Specifically: After the substrate moves into position, the probe card moves down to measure the resistance at the heat - generating point. The industrial control system judges by comparing the actually measured resistance value with the set upper and lower limit resistance values. When the measured value exceeds the preset upper and lower limit resistance range or the measured resistance value reading is abnormal, the probe card lifts up, and after the substrate moves left or right by a preset small displacement amount, it re - needles to make the probe accurately contact the resistance - adjusting electrode of the heat - generating point. If the resistance value read after repeating the needling exceeds the predetermined value and still does not conform to the preset upper and lower limit resistance values, a dot - marking is made at this position.

[0042] S2. Resistance adjustment: The number of heat - generating points adjusted each time depends on the number of probes on the probe card. Each probe corresponds to a conductive line, and the conductive line is connected to the heat - generating point or the common electrode.

[0043] S21. Before resistance adjustment: Measure the standard resistance value of each probe of the probe card for calibration to ensure the accuracy of the resistance read by the probe each time.

[0044] S22. When the actually measured resistance value is within the preset upper limit and lower limit values, adjust the resistance at each heat - generating point. The resistance is adjusted by the probe connecting to the resistance - adjusting chassis to output a pulsed voltage to adjust the resistance of each heat - generating point to be close to the preset target resistance value.

[0045] S23. Repeat the steps of S22 until the difference between the actual resistance value and the preset target resistance value is within the allowable difference range. In each cycle of step S22, when the difference between the actual resistance value and the preset target resistance value of the corresponding heat - generating point meets the standard, it is judged as qualified, and the qualified heat - generating points will not be adjusted by power supply in the next cycle. The unqualified resistance values are judged based on the resistance value of the last adjustment after multiple power - on resistance - adjustment cycles. Those that do not conform to the target resistance value are judged as defective and dot - marked.

[0046] S3. Needle cleaning: After repeating the above - mentioned resistance - adjustment process a predetermined number of times, clean the tips of the probes to remove oxides and smooth them so that the probe tips are on a horizontal plane to ensure the accuracy of the resistance measurement by the probes each time.

[0047] In this embodiment, in step S23, when the resistance is adjusted in multiple cycles, the resistance value of the last resistance adjustment is used for determination, which is the first determination. If the first determination is unqualified, the second resistance measurement and adjustment are performed by lifting the probe card to the left by a certain small displacement amount, which is the second determination. If the second determination is still unqualified, the probe card is lifted to return the unqualified heating point to the initial position, and then the third resistance measurement and adjustment are performed by moving to the right by a small displacement amount. If any one of the three determinations is qualified, it is regarded as qualified. If the resistance value is still unqualified in the third determination, a dot marking is performed. Through this solution, the probability of mismeasurement can be reduced, and the waste of substrates caused by mismeasurement can be reduced.

[0048] In this embodiment, when several probe stations are provided on the entire device, cross-testing is performed within a predetermined time, that is, after the resistance adjustment of one probe station is completed, it is transferred to another probe station for testing. Only testing is performed on the other probe station without resistance adjustment to determine the accuracy of the resistance value of the substrate adjusted by the probe station. If the resistance values measured between the two probe stations are quite different, it means that there is a problem with one of the probe stations and it needs to be repaired.

[0049] In this embodiment, during the testing stage, when an abnormal resistance value is detected, fine adjustment can be first performed in four directions of up, down, left, and right through the rotation angle compensation mechanism 196 and the fine adjustment mechanism 140 to prevent the problem of abnormal resistance measurement caused by position error. After adjustment by the fine adjustment mechanism 140 and the rotation angle compensation mechanism 196, if the resistance value of a certain heating point is still abnormal or the resistance value fluctuates greatly, the probe tips on the probe card 160 are ground by the needle washing device 170 to solve the problem that some heating points cannot be accurately detected due to different probe heights.

[0050] In the resistance adjustment stage, the resistance is adjusted by repeatedly inserting the needle in multiple cycles, and the resistance value of the last resistance adjustment is used to determine whether it meets the target resistance value. If it does not meet the requirement, a dot marking is performed.

[0051] It should be noted that in this embodiment, each substrate includes multiple thermal print heads, and each thermal print head is provided with multiple heating points. The probe card 160 acts on one of the thermal print heads each time for resistance adjustment. When an unqualified thermal print head is detected, a dot marking is performed, and then the other thermal print heads are tested and adjusted. After the test and adjustment are performed a certain number of times, the probe tips are cleaned to remove oxides and ground so that the probe tips are on a horizontal plane.

[0052] Through the solution of this embodiment, better resistance uniformity can be achieved, the ink dot color saturation of the printing effect can be guaranteed, and the printing can be refined. High-speed resistance adjustment can be achieved with continuous beats and high utilization rate.

[0053] It should be understood that the above is only the preferred embodiment of the present utility model, and the protection scope of the present utility model is not limited to the above embodiments. All technical solutions falling within the concept of the present utility model belong to the protection scope of the present utility model.

[0054] The above introduction of the drawings used in the embodiments only shows some embodiments of the present utility model and should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

Claims

1. A probe station, characterized in that, It includes an industrial control system, a vacuum adsorption platform, an XY-axis displacement mechanism, a Z-axis lifting mechanism, a rotation angle compensation mechanism, a vision positioning system, a needle washing device, a probe card, and a resistance trimming chassis connected to the industrial control system; wherein, There are multiple resistance trimming probes on the probe card; The vacuum adsorption platform is arranged on the XY-axis displacement mechanism, and a positioning mechanism is arranged on the vacuum adsorption platform for positioning and clamping the thermal printer head substrate; On the thermal printer head substrate to be trimmed, a large number of heating points are densely arranged at a preset interval in the XY direction. By moving the XY coordinates, the heating points to be measured form a one-to-one correspondence with the resistance trimming probes of the probe card to meet the requirements of positioning and alignment, and the heating points on the thermal printer head substrate are grouped and tested according to the number of probes of the probe card until all trimming is completed; The vision positioning system is arranged above the vacuum adsorption platform to identify and position all the heating points and the conductive lines of the heating points on the substrate to be measured, form an XY coordinate system, and calculate the deviation angle of the heating points from this XY coordinate system to calculate the angle required to rotate the probe card, so that the resistance trimming probes of the probe card are kept consistent with the conductive lines of the heating points to be measured in the XY extension direction; An installation table suitable for installing the probe card is arranged on the Z-axis lifting mechanism, and is suitable for driving the probe card to lift above the substrate so that each resistance trimming probe on the probe card contacts the heating point electrode; A rotation angle compensation mechanism is arranged on the installation table for driving the probe card to rotate the calculated deviation angle of the heating point in the XY direction; the XY-axis displacement mechanism is suitable for driving the substrate to move under the probe card so that the heating point electrode contacts the resistance trimming probes on the probe card to ensure that each heating point is trimmed one by one; a needle washing device is arranged on the XY-axis displacement mechanism, and the needle washing device is suitable for cleaning the probe tips on the probe card to remove oxides, pollutants and perform horizontal calibration after passivation; The probe card is connected to the resistance trimming chassis, and the resistance trimming chassis provides corresponding pulse voltages one by one according to the number of probes of the probe card for trimming the resistance values of the corresponding heating points.

2. The probe station according to claim 1, wherein The vision positioning system includes a lifting device and a vision lens arranged on the lifting device. The vision lens is suitable for photographing and identifying the positions of the heating point electrodes on the substrate, and can move to the probe position under the drive of the lifting device to obtain the image information of the probe, and transmit the image information to the industrial control system.

3. The probe station according to claim 2, characterized in that, A fine adjustment mechanism is arranged on the Z-axis lifting mechanism, and the fine adjustment mechanism is suitable for adjusting the height of the probe card; the industrial control system is configured to, when testing and trimming, according to the probe image information obtained by the vision lens and the potential change generated by the industrial control system during the substrate test, when the height of the probe bottom end is different and the potential fluctuation during the test exceeds the preset range, drive the needle washing device under the probe card to grind it flat to ensure the uniformity of trimming.

4. The probe station according to claim 3, wherein, The Z-axis lifting mechanism includes a lifting component disposed on the base and two guide rods parallel to the lifting direction of the lifting component. The mounting table is connected to the guide rods through sliders. The fine-tuning mechanism is fixed on the slider and one end thereof is in contact connection with the top end of the lifting component, so as to act on the fine-tuning mechanism through the lifting component, and then drive the mounting table to move up and down to adjust the initial height of the probe card.

5. The probe station according to claim 1, characterized in that, A turntable for mounting the probe card is rotatably disposed on the mounting table. Gear teeth are provided on the turntable. The rotation angle compensation mechanism includes a rotation motor disposed on the mounting table. The output shaft of the rotation motor is connected with a gear assembly adapted to match the gear teeth, so as to drive the turntable to rotate through the rotation motor, and then perform fine rotation adjustment on the probe card on the horizontal plane.

6. The probe station according to claim 5, characterized in that, A probe card fixing mechanism is provided on the turntable. The fixing mechanism includes a plurality of locking rods and fine-tuning rods. The locking rods are adapted to be locked on opposite sides of the probe card, and the fine-tuning rods are adapted to press the rear end position of the probe card. The plurality of locking rods and fine-tuning rods are used to keep the probe card horizontal.

7. The probe station according to claim 5, wherein An elastic fixing component is provided on one side of the mounting table. The elastic fixing component includes two pressing blocks mounted on a cylinder. An elastic member is provided on each pressing block to press the substrate against the vacuum adsorption platform from above the substrate when the substrate is placed on the vacuum adsorption platform.

8. The probe station according to claim 5, wherein A spare conductive probe is provided on one side of the vacuum adsorption platform. The spare conductive probe is connected to a flipping mechanism. The spare conductive probe is adapted to be flipped through the flipping mechanism to connect with the electrodes on the substrate when there is no common electrode or the common electrode fails on the substrate placed on the vacuum adsorption platform.

9. The probe station according to claim 5, wherein, A marking point mechanism is provided on the mounting table. The marking point mechanism is disposed on the side of the probe card to make a marking point when the final resistance value of the heating point does not meet the preset target resistance value range.

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