Smart camera substrate

Abstract

To provide a diagnostic substrate and a method for achieving image creation (imaging) within a chamber without needing to take the chamber offline.SOLUTION: A processing chamber includes a diagnostic substrate 250 comprising a plurality of first image sensors 215A on a baseplate 210, and the plurality of first image sensors is oriented horizontally to the baseplate 210. The diagnostic substrate further comprises a plurality of second image sensors 215B on the baseplate, and the plurality of second image sensors is oriented at a non-orthogonal angle to the baseplate. The diagnostic substrate further comprises a printed circuit board (PCB) 240 on the baseplate, and a controller 230 on the baseplate, and the controller is communicatively coupled to the plurality of first image sensors and the plurality of second image sensors by the PCB. The diagnostic substrate further comprises a diffuser lid covering the baseplate, the PCB, and the controller.SELECTED DRAWING: Figure 2A

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority from U.S. Non-provisional Application No. 17 / 021,992, filed September 15, 2020, the entire contents of which are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate to the field of semiconductor processing, and more particularly to a smart camera board capable of providing imaging within a chamber without the need to take the chamber offline. [Background technology]

[0003] When a semiconductor manufacturing tool processes many wafers during operation, the tool may experience process drift, which may result in non-uniform results across a wafer from wafer to wafer, even when using the same processing parameters (e.g., pressure, temperature, gas flow rates, power, etc.). This process drift may be due, at least in part, to deposition on the interior surfaces of the tool's chambers and degradation of the tool hardware.

[0004] However, currently, visual inspection of the inside of the chamber is not possible without taking the chamber offline. Furthermore, even if a camera or other sensor could be placed inside the chamber, there is typically no light source inside the chamber, so the camera cannot see inside the chamber. Therefore, the chamber cannot be inspected without breaking the vacuum and opening the chamber, which would cause significant downtime for the tool, which is undesirable. Summary of the Invention

[0005] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure include diagnostic substrates for chamber monitoring and methods of using the diagnostic substrates.

[0006] In one embodiment, a diagnostic board is disclosed. The diagnostic board may include a base plate and a plurality of image sensors on the base plate. In one embodiment, the diagnostic board may further include a printed circuit board (PCB) on the base plate and a controller on the base plate. In one embodiment, the PCB electrically couples the controller to the plurality of image sensors.

[0007] In one embodiment, a method of using a diagnostic substrate for imaging an interior of a chamber is described. The method of imaging an interior of a chamber includes providing a diagnostic substrate with a plurality of image sensors and a light source, and inserting the diagnostic substrate into a chamber, the chamber being maintained at a sub-atmospheric pressure. In one embodiment, the method further includes turning on the light source and acquiring images of the interior of the chamber with the plurality of image sensors.

[0008] Additional embodiments disclosed herein include a diagnostic board with a base plate, a first plurality of image sensors on the base plate, the first plurality of image sensors oriented horizontally relative to the base plate. In one embodiment, the diagnostic board further comprises a second plurality of image sensors on the base plate, the second plurality of image sensors oriented at a non-orthogonal angle relative to the base plate. In one embodiment, the diagnostic board further comprises a printed circuit board (PCB) on the base plate, and a controller on the base plate, the controller communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In one embodiment, the diagnostic board further comprises a diffuser lid covering the base plate, the PCB, and the controller. [Brief description of the drawings]

[0009] [Figure 1A] 1 is a diagram of a processing chamber having a diagnostic substrate therein according to embodiments disclosed herein. [Figure 1B] FIG. 2 is a block diagram of components of a diagnostic board according to embodiments disclosed herein. [Figure 2A] FIG. 2 is a diagram of a diagnostic board with the lid removed according to embodiments disclosed herein. [Figure 2B] FIG. 2 is a diagram of a diagnostic board including a lid according to embodiments disclosed herein. [Figure 2C] FIG. 2 illustrates a diagnostic board with a sealed battery and multiple light emitting diodes (LEDs) across a printed circuit board (PCB) according to an embodiment disclosed herein. [Figure 2D] 1 illustrates packaging of a battery module on a diagnostic board according to an embodiment disclosed herein. [Figure 3A] FIG. 2 is a block diagram of a diagnostic board according to an embodiment disclosed herein. [Figure 3B] FIG. 2 is a block diagram of a power management module of a diagnostic board according to an embodiment disclosed herein. [Figure 3C] FIG. 2 is a schematic diagram of a multiplexer for individually selecting image sensors according to embodiments disclosed herein. [Figure 4] FIG. 1 is a system level block diagram of a processing tool utilizing a diagnostic board according to embodiments disclosed herein. [Diagram 5] FIG. 2 is a flow diagram of a method of using a diagnostic board according to embodiments disclosed herein. [Figure 6] FIG. 1 illustrates a block diagram of an exemplary computer system according to one embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] A smart camera wafer is described that can provide imaging within the chamber without the need to take the chamber offline. Numerous specific details of a diagnostic board having an imaging sensor and a light source are presented below to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to one of ordinary skill in the art that embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known aspects, such as the fabrication of integrated circuits, have not been described in detail in order to not unnecessarily obscure the embodiments of the present disclosure. Furthermore, it should be understood that the various embodiments illustrated in the figures are illustrative representations and are not necessarily drawn to scale.

[0011] As mentioned above, chamber drift can be caused by changing conditions in the chamber. For example, deposition of by-products on the chamber surfaces (such as the liner or lid) can change the performance of the process running in the chamber. This can result in wafer non-uniformity. However, currently there are no diagnostic tools available to visually monitor the changing chamber conditions without taking the chamber offline and opening it.

[0012] Accordingly, the embodiments disclosed herein include a diagnostic board that can be inserted into the chamber of a processing tool. The diagnostic board can include multiple cameras to image the interior of the chamber. One or more light emitting diodes (LEDs) can further be provided on the diagnostic board to provide a light source. The LEDs can be provided below a light diffuser to reduce reflections and provide a higher quality image. In embodiments where multiple cameras are used, the individual images can be stitched together to provide a single image of the interior of the chamber. Thus, the images can be easily checked to determine if the tool needs maintenance.

[0013] In one embodiment, the diagnostics substrate may have a form factor compatible with semiconductor wafer handling equipment. Thus, the diagnostics substrate may be delivered to the chamber through a factory interface and mainframe. In this way, the tool does not need to be taken completely offline to provide an image of the interior of the chamber. For example, the diagnostics substrate may have a form factor similar to that of a wafer (e.g., 300 mm, 450 mm, etc.). However, it is understood that the diagnostics substrate may include form factors other than typical wafer form factors. Thus, diagnostics may be completed more frequently without significant chamber downtime. The ability to frequently inspect the interior of the chamber may also allow for extended periods of planned maintenance (PM). Thus, the processing capabilities of the tool are more fully utilized. Additionally, the diagnostics substrate may be portable between chambers, resulting in lower overhead costs compared to requiring a dedicated sensor for each chamber.

[0014] 1A, a diagram of a processing tool 100 according to an embodiment is shown. In one embodiment, the processing tool 100 may include a chamber liner 161 and a lid 162 for sealing the chamber 161. The embodiment disclosed herein includes a diagnostic substrate 150 supported on lift pins (not shown) below the lid 162. The diagnostic substrate 150 may have a form factor that allows the diagnostic substrate 150 to be inserted through the slit valve 149. Thus, it is not necessary to remove the chamber lid 162 (and bleed the vacuum) to perform diagnostics using the diagnostic substrate 150. For example, the diagnostic substrate 150 may have a thickness of less than about 10 mm. The diameter of the diagnostic substrate 150 may be similar to the wafers processed in the processing tool 100 (e.g., 300 mm, 450 mm, etc.).

[0015] In one embodiment, the diagnostic board 150 includes a number of image sensors and a light source. The light sources illuminate the interior of the chamber 161, and the image sensors provide images of the surfaces of the chamber 161 and lid 162. Thus, the condition of the chamber can be determined without having to take the chamber completely offline. A more detailed description of the image sensors and light sources is provided below.

[0016] 1B, a block diagram of a diagnostic board 150 according to one embodiment is shown. In one embodiment, the diagnostic board 150 may include a microcontroller 130. The microcontroller 130 may be any suitable integrated circuit die that may be programmed to perform image capture using an image sensor. In one embodiment, the microcontroller 130 is coupled to multiple image sensors 115 via a multiplexer board 140. The multiplexer board 140 allows for individual control of the image sensors 115 to sequentially acquire images from each image sensor 115. That is, in some embodiments, a single image sensor 115 is utilized at a time. However, embodiments are not limited to such a configuration and multiple image sensors 115 may be utilized simultaneously if the microcontroller 130 is configured to accept multiple inputs simultaneously.

[0017] 2A, a perspective view of a diagnostic board 250 according to one embodiment is shown. In the view of FIG. 2A, the lid of the diagnostic board 250 has been omitted to reveal the internal components of the diagnostic board 250. As mentioned above, the diagnostic board 250 can have a form factor suitable for handling by an automated handling system (e.g., a factory interface or mainframe form factor). For example, the diagnostic board 250 can have a thickness of less than about 10 mm and a diameter that substantially matches the diameter of a device wafer (e.g., 300 mm or 450 mm).

[0018] In one embodiment, the diagnostic board 250 may include a base plate 210. The base plate 210 may be a frame for holding various components of the diagnostic board 250. In one embodiment, the base plate 210 includes a ridge 211 and a wall 212. The ridge 211 and the wall 212 may have a substantially circular shape and be disposed proximate an edge of the base plate 210. However, as shown in FIG. 2A, the ridge 211 and the wall 212 do not have to be perfectly circular. For example, openings may be provided to access the charging port 206 and the power switch 207 on the printed circuit board (PCB) 240.

[0019] In one embodiment, a number of image sensors 215 are provided around the periphery of the base plate 210. In one embodiment, the image sensors 215 are positioned adjacent to the wall 211 on the ridge 211. For example, the horizontal image sensor 215 A is provided on the ridge 211. In one embodiment, the angled image sensor 215 B is mounted against the wall 212. B is shown disposed within a recess in the ridge 211. However, in some embodiments, the angled image sensor 215 B It should be appreciated that the additional horizontal image sensor 215 may be located on top of the ridge 211. In one embodiment, the additional horizontal image sensor 215 A may be provided at other locations on the base plate 210 away from the ridge 211 and the wall 212. For example, a pair of horizontal image sensors 215 A is provided near the center of the base plate of FIG. 2A.

[0020] In one embodiment, the horizontal image sensor 215 A An angled image sensor 215 is provided for capturing an image of the chamber lid. B is provided to capture an image of the sidewall of the chamber or chamber liner. A may be oriented substantially horizontally relative to the base plate 210. That is, the horizontal image sensor 215A The field of view (FOV) of the angled image sensor 215 faces away from the base plate 210. B may be oriented at a non-orthogonal angle relative to the base plate. In certain embodiments, the angled image sensor 215 B is at an angle between 0° and 20° from the perpendicular direction to the base plate. B The FOV is directed toward the axial center of the base plate.

[0021] In one embodiment, the number and location of image sensors 215 are determined by the FOV of the image sensors 215 and the shape of the chamber being investigated. In some embodiments, the image sensors 215 are oriented to overlap the FOV of adjacent image sensors 215. For example, the overlap may be about 20% overlap between adjacent sensors 215. This allows for a stitched image of the entire interior surface of the chamber to be generated. In the particular embodiment shown in FIG. 2A, six angled image sensors 215 are B , and 10 horizontal image sensors 215 A There is.

[0022] In one embodiment, the image sensor 215 may include an image sensor for capturing the visible spectrum of light. In other embodiments, the image sensor 215 may be adapted to capture thermal radiation. In some embodiments, the image sensor 215 may be adapted to capture thermal radiation and visible light. In a particular embodiment, the image sensor 215 is an 8 megapixel camera. However, it should be understood that the resolution of the camera may vary depending on the resolution of the image required to provide a diagnosis.

[0023] In one embodiment, the image sensor 215 is electrically coupled to the PCB 240 by a cable 214. The cable 214 may be a flex cable or any other suitable interconnect architecture. In one embodiment, the PCB 240 may provide an electrical coupling from the cable 214 to the controller 230. The PCB 240 may include multiplexing / demultiplexing capabilities so that the image sensors 215 can be individually addressed by the controller 230.

[0024] In one embodiment, the diagnostic board 250 may be powered by one or more batteries 257. In the illustrated embodiment, the batteries are shown exposed to the atmosphere. However, it should be understood that in other embodiments, the batteries are within a sealed chamber. Such embodiments are described in more detail below. Enclosing the batteries 257 allows the diagnostic board to operate in a sub-atmospheric pressure environment. As such, it is not necessary to lose vacuum within the chamber to enable imaging of the interior of the chamber. In a particular embodiment, the batteries may have a voltage of 3.7V, although embodiments are not limited to such voltage.

[0025] In one embodiment, the diagnostic board 250 may further include a light source. For example, the light source may include a light emitting diode (LED) strip 255. The LED strip 255 may surround the periphery of the diagnostic board 250. For example, the LED strip 255 may be wrapped around the exterior surface of the wall 212. In one embodiment, the LED strip 255 may include a diffuser to emit diffuse light within the chamber, thereby avoiding reflections within the chamber and improving image quality. In other embodiments, the diffuser may be incorporated as part of the lid, as described in more detail below.

[0026] 2B, a perspective view of the diagnostic board 250 with a lid 270 attached thereto is shown, according to an embodiment. In one embodiment, the lid 270 may have an opening that allows the image sensor to "see" through the lid 270. A The upper opening of the horizontal image sensor 215 A The angled image sensor 215 may be formed to have dimensions that substantially match the dimensions of the lens of the B The aperture 271 of the angled image sensor 215 may be elongated. B The long and narrow aperture is necessary to allow the full FOV of the image sensor 215 to pass through the lid 270. The length dimension of the aperture 271 is B FOV and Image Sensor 215 B The lid 270 may be defined by an angle relative to the base plate 210. In one embodiment, the lid 270 may be translucent. The translucent lid 270 may facilitate diffusing the light from the light source 255. For example, the lid 270 may be 70% white (i.e., the lid 270 may transmit 30% of the light).

[0027] 2C, a perspective view of a diagnostic board 250 according to an additional embodiment is shown. The diagnostic board 250 of FIG. 2C may be substantially similar to the diagnostic board 250 of FIG. 2A, except that it includes an additional LED 256 and a sealed battery module 258. The diagnostic board 250 of FIG. 2C further illustrates the inclusion of additional sensors, such as a temperature sensor 253 and a vibration sensor 252. Such sensors may be used to monitor temperature and vibration to ensure that limits for safe operation of the diagnostic board 250 are not exceeded.

[0028] In one embodiment, the additional LEDs 256 may be surface mounted devices (SMD) mounted on the PCB 240. The LEDs 256 may be distributed across the PCB 240. In one embodiment, the LEDs 256 provide additional light to the interior of the chamber during operation. In additional embodiments, the LED strips 255 may be omitted. That is, substantially all of the light used during imaging may be provided by the SMD LEDs 256. Point source illumination may be more susceptible to reflections. Thus, the lid 270 provides diffusion to minimize reflections within the chamber. In one embodiment, the SMD LEDs 256 and / or LED strips 255 may be individually controllable (or controllable in groups) to allow for improved lighting control. By selectively turning on and off individual or groups of the SMD LEDs and / or LED strips, images can be acquired with the image sensor 215 while limiting specular reflections.

[0029] In one embodiment, the battery module 258 is hermetically sealed, i.e., the pressure within the battery module 258 is maintained even if the external pressure changes. Thus, even if the diagnostic board 250 is exposed to the vacuum pressure within the chamber, the battery or batteries within the battery module can remain at substantially atmospheric pressure.

[0030] 2D, a perspective view of the battery module 258 is shown in more detail. In FIG. 2D, the lid of the battery module 258 is removed to expose the internal features of the battery module 258. As shown, the battery module 258 includes an enclosure 272 that surrounds the periphery of the battery 257. A gasket 274 may be provided along the inner surface of the enclosure 272. When a lid (not shown) is attached to the enclosure 272, the gasket 274 is compressed to seal. In one embodiment, the battery module 258 remains sealed when the external pressure is about 15 mTorr or less. In one embodiment, the battery module 258 may further include one or more sensors 273, such as a pressure sensor and a VOC sensor. The pressure sensor provides feedback on the tightness of the battery module 258. The VOC sensor indicates when the battery 257 has been compromised due to heat or other reasons. The temperature sensor may be monitored any time the diagnostic board 250 is in the chamber and a non-volatile log indicating the health of the battery may be logged. A decision may be made as to whether to continue using the battery 257 or to discard it based on the temperature and time of exposure, as well as other electrical characteristics of the battery.

[0031] 3A, a control block diagram of components of a diagnostic board 350 is shown, according to an embodiment. In one embodiment, the system includes a microcontroller 330 and a host board 340 (e.g., PCB). FIG 3A illustrates how the various components interact to perform chamber monitoring on the diagnostic board 350.

[0032] In one embodiment, diagnostic board 350 includes a microcontroller 330. Microcontroller 330 is communicatively coupled to a memory (such as an SD card) and / or a wireless communication interface (such as WiFi, Bluetooth, etc.). In one embodiment, the memory may be local to microcontroller 330. In such an embodiment, image data is stored locally on diagnostic board 350. In other embodiments, the wireless communication interface may allow for wireless transmission of image data to an external device.

[0033] In one embodiment, the host board 340 includes a power management circuit 381, a multiplexing / demultiplexing circuit 382. The host board 340 further provides features for on / off switching, USB interconnection, and GPIO. In one embodiment, the host board 340 provides routing for sending data from various sensors to the microcontroller. Although the image sensor 315 is described in more detail above, it will be appreciated that other sensors may be included to provide enhanced functionality. For example, a vibration sensor 353, a temperature sensor 352, and a total volatile organic compounds (TVOC) sensor 316 may be included. The sensors 315, 316, 352, 353 may utilize any suitable communication protocol. In a particular embodiment, communication is performed using an I2C communication protocol.

[0034] 3B, a block diagram of a power management circuit 381 according to an embodiment is shown. In one embodiment, the power management circuit 381 includes a charge controller 341. The charge controller 381 may be coupled to a battery 357. A charge input (e.g., a 5V power supply) may be used to charge the battery 357 via wired or wireless charging. A first LED 344 connected to the charge controller 341 may be an indicator for charging, and a second LED 345 connected to the charge controller 341 may be an indicator of charging completion.

[0035] In one embodiment, the charge controller 341 is coupled to the boost converter and on / off control block 342. In one embodiment, a third LED 348 may be connected to the boost converter 342 to indicate low battery power. An on / off switch or button may be connected to the boost converter 342. A fourth LED 346 may provide an on / off indicator. In one embodiment, the boost converter upconverts the low battery voltage to a high voltage (e.g., 5V) to power the diagnostic board components.

[0036] 3C, a schematic diagram of a multiplexing / demultiplexing circuit 382 is shown, according to an embodiment. In one embodiment, the controller is connected to each of the image sensors 315 via a branching network that includes multiple switches 305. The sensors 315 can be individually activated by activating a series of switches. Thus, a multiple output-single input architecture is all that is needed to utilize multiple image sensors 315.

[0037] 4, there is shown a system level diagram in FIG. 410 of how the diagnostic board 450 functions with the offline analyzer 400. As shown, the diagnostic board 450 includes a mechanical packaging and a controller 461. The mechanical packaging is similar to the architecture described above. The controller 461 includes a microcontroller, a host board, and an image sensor. LEDs (for indicating various states such as charging, fully charged, low power, and on / off) and a power management block may be connected to the host board. A power signal conditioning block may control the voltage supplied to the image sensor, which is further connected to the host board.

[0038] In one embodiment, memory (e.g., S / D card) may be coupled to the microcontroller for storing data. The memory may also be removed from the diagnostic board 450 and sent to the offline analyzer 400 for analysis. Additionally (or alternatively), a wireless communication block (e.g., a WiFi host block) may be connected to the microcontroller for wirelessly transmitting data from the diagnostic board to the server block 463 and ultimately to the offline analyzer 400. The server block 463 may comprise a communication unit / transceiver and a cloud data / web server.

[0039] In one embodiment, the microcontroller may also have access to a software block 462. The software block 462 may include application algorithms and a graphical user interface (GUI). The software block 462 may be remote from the diagnostics board 450 or may be stored on the diagnostics board 450 (e.g., in local memory).

[0040] 5, a flow diagram illustrating a process 590 for monitoring a chamber, according to an embodiment, is shown. In one embodiment, monitoring the chamber may include obtaining an image of the interior of the chamber using a diagnostic substrate. Notably, the process 590 is performed without breaking the vacuum inside the chamber or cooling the chamber body. In one embodiment, the chamber may be any chamber used in a semiconductor manufacturing process. For example, the chamber may be a plasma chamber used for depositing or etching materials, although embodiments are not limited to such chambers.

[0041] Process 590 may begin with operation 591. Operation 591 includes providing a diagnostic board having multiple image sensors and light sources. The diagnostic board may be similar to the diagnostic boards described above. For example, the image sensor may include a horizontal image sensor oriented to provide an image of the chamber lid and an angled image sensor oriented to provide an image of the sidewall of the chamber or chamber liner. In one embodiment, the image sensor may include visible spectrum imaging and / or thermal imaging. In one embodiment, the light source may include an LED strip and / or discrete surface mounted LEDs. To minimize reflections within the chamber, a diffuser plate may be provided as a lid on top of the diagnostic board.

[0042] Process 590 may continue with operation 592. Operation 592 includes inserting a diagnostic substrate into the chamber. In one embodiment, the diagnostic substrate is inserted into the chamber while a sub-atmospheric pressure (e.g., vacuum pressure) is maintained in the chamber. For example, the sub-atmospheric pressure may be about 15 mTorr or less. In one embodiment, the diagnostic substrate is inserted into the chamber using an automated substrate handling device. For example, the diagnostic substrate may be removed from a cassette by a factory interface (FI). The FI may then insert the diagnostic substrate into a load lock, and a mainframe robot may remove the diagnostic substrate from the load lock and insert the diagnostic substrate through a slit valve into the chamber.

[0043] Process 590 may continue with operation 593. Operation 593 includes turning on a light source. In one embodiment, the light source illuminates the interior of the chamber. The interior of the chamber is dark when not illuminated. The light source may include a diffuser to reduce reflections within the chamber that reduce image quality. In one embodiment, the light source may be turned on when the diagnostic substrate is in the chamber, or may be turned on before the diagnostic substrate enters the chamber. In one embodiment, the light source may include individually controllable (or group controllable) LEDs to allow for improved lighting control. By selectively turning on and off individual or groups of LEDs, images can be captured with an image sensor while limiting specular reflections.

[0044] Process 590 may continue with operation 594. Operation 594 includes acquiring images of the interior of the chamber with multiple image sensors. In one embodiment, the multiple image sensors are activated sequentially using multiplexing / demultiplexing circuitry on the diagnostics board host board. In one embodiment, the fields of view of the image sensors may have a degree of overlap. For example, the fields of view of the image sensors may have about 20% overlap. This overlap allows the multiple images to be stitched together into a single image for easier analysis.

[0045] In one embodiment, the image data may be stored in memory included in the diagnostic board. For example, the images may be saved to an SD card, etc. In other embodiments, the image data may be wirelessly transmitted to an external device using a wireless communication protocol such as, but not limited to, WiFi or Bluetooth.

[0046] After acquiring the images, the diagnostic board is removed from the chamber. For example, the mainframe robot and the FI can work together to transport the diagnostic board from the chamber back to a cassette or other storage device. In embodiments where the image data is stored locally on the diagnostic board, the image data may then be downloaded (or the SD card removed) and the image data transferred to an external device.

[0047] In one embodiment, the external device may include a GUI to easily display and analyze the image data. A single stitched image may be displayed and / or an operator may have the ability to review individual images from the image sensor. Additionally, the image data may be automatically analyzed. Automated analysis may include using machine learning techniques to predict process tool performance, indicate preventative maintenance, determine if an in-chamber cleaning (ICC) process is required, and / or perform other monitoring / diagnostic procedures.

[0048] As mentioned above, the use of a diagnostics board as described herein provides many advantages. One advantage is that the chamber does not need to be taken completely offline. In particular, the diagnostics board has a form factor suitable for handling in automated handling equipment and is vacuum compatible (e.g., with a sealed enclosure around the battery). Thus, imaging of the interior of the chamber can be performed more frequently since there is no need to break the vacuum or cool down as long as the wafer time in the chamber is managed and monitored. For example, if the wafer gets too hot, a warning or automatic back out message can be communicated to the wafer handling device. Because diagnostics can be performed more frequently, the time between scheduled maintenance (PM) events may be extended, allowing for more efficient use of the processing tool. Additionally, a diagnostics board as described herein provides a relatively low-cost solution. Dedicated sensors in the chamber would require every chamber to have its own set of sensors, but the use of the diagnostics board allows multiple chambers to share a single diagnostics tool.

[0049] FIG. 6 illustrates a schematic diagram of an exemplary form of a machine, a computer system 600, within which a set of instructions may be executed to cause the machine to perform any one or more of the methods described herein. In alternative embodiments, the machine may be connected (e.g., networked) to other machines in a local area network (LAN), an intranet, an extranet, or the Internet. The machine may operate in the capacity of a server or a client machine in a client / server network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine may be a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a mobile phone, a web appliance, a server, a network router, switch, or bridge, or any machine capable of executing a set of instructions (sequential or otherwise) that specify operations to be performed by the machine. Additionally, although a single machine is illustrated, the term "machine" may be interpreted to include any collection of machines (e.g., a computer) that individually, or together, execute a set (or sets) of instructions to perform any one or more of the methods described herein.

[0050] The exemplary computer system 600 includes a processor 602, a main memory 604 (e.g., read only memory (ROM), flash memory, dynamic random access memory (DRAM) (such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM))), a static memory 606 (e.g., flash memory, static random access memory (SRAM), MRAM, etc.), and a secondary memory 618 (e.g., a data storage device), which communicate with each other via a bus 630.

[0051] Processor 602 represents one or more general-purpose processing devices, such as a microprocessor, a central processing unit, or the like. More specifically, processor 602 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, a processor implementing other instruction sets, or a processor implementing a combination of instruction sets. Additionally, processor 602 may be one or more special-purpose processing devices, such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, or the like. Processor 602 is configured to execute processing logic 626 for performing the operations described herein. Computer system 600 may further include a network interface device 608. Additionally, computer system 600 may also include a video display unit 610 (e.g., a liquid crystal display (LCD), a light emitting diode display (LED), or a cathode ray tube (CRT)), an alphanumeric input device 612 (e.g., a keyboard), a cursor control device 614 (e.g., a mouse), and a signal generating device 616 (e.g., a speaker).

[0052] The secondary memory 618 may include a machine-accessible storage medium (or, more specifically, a computer-readable storage medium) 632 on which one or more sets of instructions (e.g., software 622) are stored, embodying any one or more of the methods or functions described herein. The software 622 may reside, completely or at least partially, within the main memory 604 and / or the processor 602 during execution by the computer system 600. The main memory 604 and the processor 602 also constitute machine-readable storage media. Additionally, the software 622 may be transmitted or received over the network 620 via the network interface device 608.

[0053] While in the exemplary embodiment, the machine-accessible storage medium 632 is shown as a single medium, the term "machine-readable storage medium" should be interpreted to include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) that store one or more sets of instructions. Furthermore, the term "machine-readable storage medium" should be interpreted to include any medium capable of storing or encoding a set of instructions for execution by a machine that cause the machine to perform any one or more of the methods of the present disclosure. Thus, the term "machine-readable storage medium" should be interpreted to include, but is not limited to, solid-state memory, optical media, and magnetic media.

[0054] According to one embodiment of the present disclosure, a machine accessible storage medium has instructions stored thereon that cause a data processing system to execute a method for monitoring conditions within a chamber. In one embodiment, the method includes providing a diagnostic board having multiple image sensors and a light source. In one embodiment, the method continues with inserting the diagnostic board into the chamber. The chamber can be kept at vacuum pressure so there is no need to take it offline. Notably, the diagnostic board is vacuum compatible and has a form factor similar to the device wafer. Thus, a FI or mainframe machine handling robot can be used to insert the diagnostic board into the chamber. In one embodiment, the method can further include turning on the light source. In one embodiment, the method can further include acquiring an image of the interior of the chamber with multiple image sensors.

[0055] Thus, a diagnostic substrate for imaging the interior of a vacuum chamber and a process for acquiring the images is disclosed.

Claims

1. Base plate, a plurality of image sensors on the base plate; a printed circuit board (PCB) on the base plate; and a controller on the base plate, the PCB electrically coupling the controller to the plurality of image sensors; A diagnostic board comprising:

2. The plurality of image sensors include a first image sensor oriented horizontally relative to the base plate; and a second image sensor oriented at a non-orthogonal angle to the base plate, the second image sensor pointing toward a center of the base plate; The diagnostic board of claim 1 , comprising:

3. The diagnostic board of claim 2 , wherein the first image sensor is positioned proximate an edge of the base plate and proximate a center of the base plate.

4. The diagnostic board of claim 1 further comprising a light source.

5. The diagnostic board of claim 4 , wherein the light source comprises a plurality of light emitting diodes (LEDs), the plurality of LEDs being mounted on the PCB.

6. The diagnostic board of claim 5, wherein said LEDs are individually controllable or group controllable.

7. The diagnostic board of claim 1 further comprising a battery.

8. The diagnostic board of claim 7, wherein the battery is housed in a sealed enclosure.

9. The diagnostic board of claim 8 further comprising one or more of a pressure sensor and a volatile organic compound (VOC) sensor within said sealed enclosure.

10. The diagnostic board of claim 1 further comprising one or more of a temperature sensor and a vibration sensor.

11. The diagnostic board of claim 1 , further comprising a diffuser cover covering said base plate, said PCB, and said controller.

12. The diagnostic board of claim 11, wherein the diagnostic board has a thickness of less than 10 mm.

13. The diagnostic board of claim 1 , wherein the image sensor enables imaging in the visible spectrum and thermal imaging.

14. 1. A method for imaging the interior of a chamber, comprising: providing a diagnostic board having a plurality of image sensors and a light source; inserting the diagnostic substrate into the chamber, the chamber being maintained at a subatmospheric pressure; turning on the light source; acquiring images of an interior of the chamber with the plurality of image sensors; The method includes:

15. The method of claim 14 , wherein a multiplexer architecture is used to acquire images from each of the image sensors.

16. The method of claim 14 , further comprising stitching two or more of the acquired images together to provide a stitched image.

17. 15. The method of claim 14, further comprising logging temperature levels at a given point in time to predict battery failure or to predict absolute maximum allowable conditions that would trigger replacement of the battery.

18. 15. The method of claim 14, wherein machine learning is applied to image data from the interior of the chamber to one or more of recognize drift of the chamber over time and to trigger cleaning or other maintenance issues.

19. Base plate, a first plurality of image sensors on the base plate, the first plurality of image sensors being oriented horizontally relative to the base plate; a second plurality of image sensors on the base plate, the second plurality of image sensors being oriented at a non-orthogonal angle relative to the base plate; a printed circuit board (PCB) on the base plate; a controller on the base plate, the controller communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB; and A diffuser lid that covers the base plate, the PCB, and the controller A diagnostic board comprising:

20. 20. The diagnostic board of claim 19, wherein the non-orthogonal angle is between 0 and 20 degrees from an orthogonal angle relative to the base plate.

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