Manufacturing method of third laminate

Abstract

To provide a manufacturing method of a third laminate, the method being capable of effectively manufacturing effectively at low cost a third laminate in which a workpiece such as a semiconductor wafer or the like, a back side protective-coating formation film and a support sheet are laminated in this order.SOLUTION: A manufacturing method of a third laminate includes, in the order described below: a first lamination step of attaching a back side protective-coating formation film 13 onto a back surface 14b of a workpiece 14, one surface of the workpiece 14 being a circuit surface 14a and the other surface being the back side 14b; and a second lamination step of attaching a support sheet 10 onto the back side protective-coating formation film 13. Therein: during processing from the first lamination step to the second lamination step, a second laminate where the back side protective-coating formation film 13 is laminated on the workpiece 14 is transported one by one; and The processing from the first lamination step to the second lamination step is performed by a device for attaching the back side protective-coating formation film and a device for attaching the support sheet coupled with each other, or performed in the same device.SELECTED DRAWING: Figure 1

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