Dual interface card and manufacturing method thereof

Abstract

To improve reliability of electrical connection between an IC module and an antenna of a dual interface card and mechanical connection between the IC module and a card body, to improve manufacturing efficiency.SOLUTION: A dual interface card 1 includes a card body 2, an antenna 8 having a plurality of ends 81, 82 and an IC module 7 having an IC chip and a plurality of terminals 73a, 73b. The IC module 7 is arranged in a recess 9 of the card body 2 so that the terminals and the ends are electrically connected to each other. The ends each have a repeated folding structure with an antenna line 83 from a circumference of the recess 9 toward the center, which is exposed partially. The recess 9 includes a first recess 91, a second recess 92a, and a third recess 93 formed on the center. The ends 81 are exposed in the second recess 92a. The second recess 92a is deeper than the first recess 91. The third recess 93 is deeper than the second recess 92a.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a dual interface card capable of contact and non-contact communication with an external device. [Background technology]

[0002] Conventionally, IC cards include contact IC cards that input and output electrical signals through an external connection terminal on the surface of the card, and contactless IC cards that input and output electrical signals by electromagnetic induction through an antenna. In addition to these, contact and contactless IC cards, i.e., dual interface cards, are also used, which can realize both the functions of a contact IC card and a contactless IC card with a single IC chip. Among them, dual interface cards can be used as contact IC cards that are effective in preventing external leakage of input and output data during financial settlement, and as highly convenient contactless IC cards that exchange data in close proximity when entering and leaving a room or at a ticket gate at a station. For this reason, dual interface cards are also becoming more and more popular in the market.

[0003] Now, the dual interface card is manufactured as follows. First, as described in Patent Document 1, a card substrate including one or more core sheets is formed, and an area for embedding an IC module is cut from the surface of the card substrate. Then, the IC module is embedded in the area for embedding. Here, a conductor is arranged on one of the one or more core sheets, and the conductor forms a wound antenna part for providing the contactless communication function and a contact terminal part in electrical contact with a terminal of the IC module, and the contact terminal part is arranged, for example, in a meandering shape.

[0004] Here, the region to be embedded is cut to include the first recess, the second recess, and the contact opening present in the first recess, and the first recess is for accommodating the substrate part of the IC module, and is cut to a depth that does not expose the contact terminal part of the conductor present inside the card substrate. The second recess is for accommodating the sealing part of the IC module, and is cut to a depth that does not expose the contact terminal part of the conductor present inside the card substrate. Meanwhile, the contact opening present in the first recess is cut deeper than the first recess until the contact terminal part is exposed. By filling the contact opening with a conductive adhesive, the contact terminal part and the terminal on the back side of the substrate part of the IC module are electrically contacted via the conductive adhesive. Also, by attaching an adhesive tape to the back side of the substrate part of the IC module, the IC module is fixed in the first recess of the region to be embedded. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2019-219732 A Summary of the Invention [Problem to be solved by the invention]

[0006] In order to improve the efficiency of manufacturing dual interface cards, it is desirable to use the same adhesive material for the electrical connection between the IC module and the antenna and the mechanical connection between the IC module and the card base. However, depending on the material and characteristics of the adhesive layer, the adhesive conditions required for the electrical connection between the IC module and the antenna often differ from the adhesive conditions required for the mechanical connection between the IC module and the card base, and it is believed that the distance conditions between non-adhered bodies in particular have a large effect on the adhesive strength.

[0007] The present disclosure has been made in consideration of the above-mentioned circumstances, and has as its objective the provision of a dual interface card and a manufacturing method thereof that improves the reliability of both the electrical connection between the IC module and the antenna and the mechanical connection between the IC module and the card base, thereby achieving efficient manufacturing. [Means for solving the problem]

[0008] According to this embodiment, a dual interface card capable of contact communication and contactless communication with an external device comprises a card base, an antenna having multiple ends disposed inside the card base, and an IC module having an IC chip and multiple terminals electrically connected to the IC chip, the IC module is disposed in a recess provided in the card base such that the multiple terminals and the multiple ends facing each other are electrically connected, the multiple ends are formed by a repeated folding structure from the outer periphery of the recess toward the center by an antenna wire constituting the antenna, and a portion of the multiple ends is exposed in the recess, the recess is composed of a first recess which includes a portion of the outer periphery and is separated from each other, a second recess which includes another portion of the outer periphery and is separated from each other, and a third recess which is adjacent to all of the first recess and the second recess and is formed toward the center of these, at least a portion of the multiple ends is exposed in the second recess, the second recess is formed deeper than the first recess, and the third recess is formed deeper than the second recess.

[0009] In addition, in a dual interface card according to another embodiment of the present invention, the second recess may continuously expose a repeated folded structure from the outer periphery of the recess toward the center, the repeated folded structure being made of antenna wires that constitute the antennas at the multiple ends.

[0010] In addition, in a dual interface card according to another embodiment of the present invention, in the first recess, at least the bent portion of the folded structure of the antenna, which is formed by the antenna wire constituting the antenna at the multiple ends and which is repeated from the outer periphery of the recess to the center, is overlapped and not exposed, and in the second recess, portions other than the bent portion may be exposed.

[0011] In the dual interface card according to another embodiment of the present invention, the IC module may have the plurality of terminals and the plurality of end portions that face each other electrically connected to each other via an anisotropic conductive film.

[0012] In the dual interface card according to another embodiment of the present invention, the anisotropic conductive film may be disposed so as to overlap the first recess and the second recess.

[0013] Furthermore, in a dual interface card according to another embodiment of the present invention, the outer periphery may be a substantially rectangular shape having sides that are substantially parallel to the short and long sides of the card base, and the multiple ends may be configured by a repeated folding structure from the outer periphery, which is a side of the recess that is substantially parallel to the short sides of the card base, toward the center by an antenna wire that constitutes the antenna.

[0014] In a dual interface card according to another embodiment of the present invention, a portion of the antenna other than the bent portion of the folded structure may be inclined with respect to a straight line along the outer periphery.

[0015] In addition, in a dual interface card according to another embodiment of the present invention, the recess includes a portion of the outer periphery and further includes a fourth recess adjacent to the third recess, the fourth recess being deeper than the first recess and shallower than the third recess, and a convex portion of a smaller area than the fourth recess may be formed on the surface of the IC module facing the fourth recess.

[0016] According to another embodiment of the present invention, a method for manufacturing a dual interface card capable of contact communication and contactless communication with an external device includes an antenna forming step of embedding an antenna wire in a first substrate while applying heat and pressure to form an antenna having a plurality of ends on one surface of the first substrate, a lamination step of laminating a second substrate on the first substrate on which the antenna is formed so as to sandwich the antenna, a punching step of punching a laminate of the first substrate and the second substrate into a card-sized card base, a recess forming step of forming a recess in the card base for embedding an IC module, an IC module preparing step of preparing an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip, and a card forming step of forming a card having the plurality of terminals and the plurality of ends facing each other. and an IC module bonding process of bonding the IC module to the recess of the card base via a conductive adhesive layer so that the IC module and the IC module are electrically connected to each other, wherein the multiple ends are formed by a repeated folding structure from the outer periphery of the recess toward the center by an antenna wire constituting the antenna, and a portion of the folding structure is exposed in the recess, and the recess is composed of a first recess which includes a portion of the outer periphery and is separated from each other, a second recess which includes another portion of the outer periphery and is separated from each other, and a third recess which is adjacent to all of the first recess and the second recess and is formed more centrally than these, and at least a portion of the multiple ends is exposed in the second recess, the second recess is formed deeper than the first recess, and the third recess is formed deeper than the second recess. Effect of the Invention

[0017] According to the present embodiment, it is possible to provide a dual interface card and a manufacturing method thereof that improve the reliability of both the electrical connection between the IC module and the antenna and the mechanical connection between the IC module and the card base, thereby achieving efficient manufacturing. [Brief description of the drawings]

[0018] [Figure 1] FIG. 2 is a plan view illustrating the structure of the dual interface card according to the first embodiment. [Diagram 2] 2 is a cross-sectional view showing a cross section taken along line AA in FIG. 1. [Diagram 3] 2 is a cross-sectional view showing a cross section taken along line BB in FIG. [Figure 4] 2A and 2B are diagrams illustrating an IC module and a connection between the IC module and an antenna. [Diagram 5] FIG. 1(b) is a plan view illustrating the structure of a dual interface card according to a second embodiment of the present invention. [Figure 6] 6 is a cross-sectional view corresponding to FIG. 3 and showing a cross section taken along line DD in FIG. 5. [Figure 7] FIG. 1(b) is a plan view illustrating the structure of a dual interface card according to a third embodiment. [Figure 8] FIG. 1(b) is a plan view illustrating the structure of a dual interface card according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] An example of a dual interface card according to the present disclosure will now be described with reference to the drawings, etc. However, the dual interface card according to the present disclosure is not limited to the embodiments and examples described below.

[0020] The figures shown below are schematic. Therefore, the size and shape of each part are appropriately exaggerated to facilitate understanding. In addition, hatching showing the cross section of a member is appropriately omitted in each figure. The numerical values ​​such as dimensions of each member and the material names described in this specification are examples of embodiments, and are not limited thereto, and can be appropriately selected and used. In this specification, terms that specify shapes and geometric conditions, such as parallel, orthogonal, and vertical, are intended to include substantially the same state in addition to their strict meanings.

[0021] 1. First embodiment An example of a first embodiment of a dual interface card of the present disclosure will be described. Here, for convenience of description, an XYZ coordinate system is set for the dual interface card 1. First, as shown in FIG. 1(a) and FIG. 2(b), the Z axis is taken as the normal direction of the main surface of the dual interface card 1. Then, the direction from the main surface on the side on which the external connection terminals 71 of the IC module 7 are not arranged to the main surface on the side on which the external connection terminals 71 are arranged is defined as the +Z direction or the upward direction in the thickness direction, and the opposite direction is defined as the -Z direction or the downward direction in the thickness direction.

[0022] When dual interface card 1 is viewed from the +Z direction, the straight line perpendicular to both short sides of dual interface card 1 and the Z axis is defined as the X axis, the direction from one short side closer to external connection terminal 71 to the other short side is defined as the +X direction or rightward direction, and the opposite direction is defined as the -X direction or leftward direction. Furthermore, the axis perpendicular to the X and Z axes is defined as the Y axis, the direction from one long side farther from external connection terminal 71 to the other long side is defined as the +Y direction or upward, and the opposite direction is defined as the -Y direction or downward.

[0023] Here, FIG. 1(a) is a plan view of the dual interface card 1 seen from the +Z direction, and FIG. 1(b) is a diagram for explaining the arrangement of the antenna 8 by enlarging the vicinity of the external connection terminal 71 in the dual interface card 1 of FIG. 1(a). However, in order to make the configuration of the antenna 8 easier to understand, it is shown in a state in which the IC module 7 is removed. Meanwhile, FIG. 2(a) is a cross-sectional view of the dual interface card 1 of FIG. 1(b) cut along the plane along the line AA seen from the -Y direction. FIG. 2(a) is a diagram in which the IC module 7 is omitted, and FIG. 2(b) is a diagram in which the IC module 7 is mounted in FIG. 2(a). Also, FIG. 3(a) is a cross-sectional view of the dual interface card 1 of FIG. 1(b) cut along the plane along the line BB seen from the -X direction, and FIG. 3(a) is a diagram in which the IC module 7 is omitted, and FIG. 3(b) is a diagram in which the IC module 7 is mounted in FIG. 3(a).

[0024] As shown in FIG. 1(a), the dual interface card 1 has a generally rectangular thin plate shape with rounded corners in a plan view from the +Z direction side. An IC module 7 including an external connection terminal 71 can be seen slightly to the upper left of the center on the surface on the +Z direction side of the dual interface card, that is, closer to the -X direction and closer to the +Y direction from the center. As shown in FIG. 2(a) and FIG. 2(b), the IC module 7 is embedded in a recess 9 formed in the card base 2, and is arranged so that the surface on the +Z direction side of the external connection terminal 71 is substantially flush with the surface on the +Z direction side of the card base 2. Such a shape of the dual interface card 1 complies with ISO / IEC 7816, which is an international standard for IC cards.

[0025] 2(a), the card base 2 constituting the card body of the dual interface card 1 is formed by laminating and integrating, in order from the -Z direction side, an over-sheet layer 6, a core layer 5, a core layer 4, and an over-sheet layer 3. Typically, the over-sheet layers 6 and 3 are transparent base materials, and the core layers 5 and 4 are white base materials, but this is not limited thereto. In addition, an antenna wire 83 constituting the antenna 8 is disposed between the core layers 5 and 4 so as to be sandwiched between them.

[0026] The antenna wire 83 constituting the antenna 8 is partially exposed in a region of the bottom surface 92p of the second recess 92a, which is formed relatively shallow, of the recess 9, and is completely buried inside the card base 2 in the other regions. In other words, the antenna wire 83 is buried inside the card base 2, but in the process of cutting the card base 2 to form the recess 9, a part of the antenna wire 83 is cut together with the recess 9 to an extent that the wire is not broken, and the cut surface of the antenna wire 83 is exposed on the bottom surface 92p of the second recess 92a. The recess 9 further includes a first recess 91 formed along the outer periphery 97 side and shallower than the second recess 92a, and a third recess 93 formed closer to the center of the recess 9 than the second recess 92a and deeper than the second recess 92a.

[0027] As shown in FIG. 2(b), the IC module 7 is embedded such that the external connection terminal 71 and the substrate 72 supporting the external connection terminal 71 are placed on the bottom surface 92p of the second recess 92a of the recess 9 described above, and the substrate 72 and the bottom surface 92p of the second recess 92a of the card base 2 are mechanically joined via the conductive adhesive layer 11. Incidentally, the third recess 93 houses the IC chip body 74, which is a protruding part of the IC module 7. Also, the surface of the substrate 72 opposite to the external connection terminal 71 is provided with a terminal 73a electrically connected to the IC chip provided inside the IC module 7. At this time, due to the action of heat and pressure when embedding the IC module 7 in the recess 9 of the card base 2, the antenna wire 83 exposed on the bottom surface 92p and the terminal 73a are electrically connected via the conductive adhesive layer 11.

[0028] Here, both ends of the antenna wire 83 of the antenna 8, which is formed so that most of it is embedded inside the card base 2 and part of it is exposed from the second recesses 92a and 92b, have a shape as shown by the first end 81 and the second end 82 in FIG. 1(b). The first end 81 and the second end 82 are arranged in parallel on the left and right sides along the X-axis, sandwiching the third recess 93 at the center of the recess 9. The first end 81 and the second end 82, which are both ends of the antenna 8, are each configured by a repeated folding structure in which the antenna wire 83 is folded from the outer periphery 97 of the second recesses 92a and 92b toward the center of the recess 9. In other words, the first end 81 and the second end 82 are formed to have a structure called a zigzag shape, a meander shape, or a bellows shape. In this way, by increasing the exposed area of ​​the antenna wire 83 per unit area exposed in the recess 9, the reliability of the electrical connection between the terminal 73a of the IC module 7 and the antenna 8 can be improved.

[0029] In addition, the first exposed portion 86 and the second exposed portion 87, which are the regions where the antenna wire 83 is exposed toward the +Z direction side among the regions where the first end portion 81 and the second end portion 82 are arranged, are formed within the range of the second recesses 92a and 92b of the recess 9, respectively. In addition, the first recess 91 separated on the +Y direction side and the -Y direction side is formed in the portion of the recess 9 excluding the third recess 93 and the second recesses 92a, 92b. Here, the second recesses 92a and 92b have approximately the same depth, and are both formed deeper than the first recess 91. In order to facilitate understanding, in FIG. 1(b), the region of the first recess 91 is displayed with a horizontal line pattern, and the regions of the second recesses 92a and 92b are displayed with a dotted pattern. The same applies to FIG. 5, FIG. 7(a), and FIG. 8(a) described later.

[0030] As shown in Figures 3(a) and 3(b), the recesses 9 of the card base 2 have two different depths, a first recess 91 and second recesses 92a and 92b, at the location where the substrate 72 of the IC module 7 is embedded. Therefore, the distance of the gap between the substrate 72 and the card base 2 varies depending on the location, and as a result, the thickness of the conductive adhesive layer 11 sandwiched between them after bonding varies. That is, the depth of the recesses 9 of the card base 2 facing the region of the substrate 72 where the terminal 73a is formed differs from the region separated from the terminal 73a in the X direction, and the second recess 92a faces the former region, and the first recess 91, which is shallower than the second recess 92a, faces the latter region.

[0031] Here, since the terminal 73a is a layer formed of copper foil or the like of a predetermined thickness, it extends a predetermined thickness further in the same direction from the surface on the -Z direction side of the substrate 72. Therefore, the depth of the second recess 92a is determined so that when the IC module 7 is pressed against the card base 2 by applying heat and pressure, the distance between the terminal 73a via the conductive adhesive layer 11 and the antenna wire 83 exposed on the bottom surface 92p of the second recess 92a is within an appropriate range. That is, at that distance, good conduction between the terminal 73a and the antenna wire 83 can be obtained.

[0032] However, in a region of the substrate 72 spaced apart from the terminal 73a along the Y-axis direction, even if the gap between the substrate 72 and the card base 2 is the above-mentioned distance, it is not necessarily possible to achieve a good mechanical connection between the IC module 7 and the card base 2. In other words, the gap conditions for good electrical connection between the terminal 73a and the antenna wire 83 and the gap conditions for good mechanical connection between the IC module 7 and the card base 2 are generally different.

[0033] In contrast, in this embodiment, in the region of the substrate 72 spaced apart from the terminal 73a along the Y-axis direction, the gap between the substrate 72 and the card base 2 improves the adhesive strength between the IC module 7 and the card base 2, and the depth of the recess 9 of the card base 2 is changed to improve the mechanical connection between them. Specifically, the recess 9 in this region is the first recess 91, which is shallower than the second recess 92a. This is because the depth of the second recess 92a is determined in consideration of the electrical connection between the terminal 73a extending from the substrate 72 in the -Z direction and the antenna wire 83. Therefore, if the depth of the recess 9 of the card base 2 is made the same as the second recess 92a in the region where the terminal 73a does not exist, the gap between the substrate 72 and the card base 2 is too long, the conductive adhesive layer 11 is not sufficiently compressed, and appropriate adhesive strength cannot be obtained.

[0034] Therefore, the dual interface card 1 of the present embodiment can improve the reliability of both the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2. Specifically, for the same conductive adhesive layer 11, the depth of the second recesses 92a, 92b that improve the electrical connection between the IC module 7 and the antenna 8 is different from the depth of the first recess 91 that improves the mechanical connection between the IC module 7 and the card base 2. That is, the second recesses 92a, 92b are formed deeper than the first recess 91. Moreover, by configuring the first recess 91 and the second recesses 92a, 92b in this way, the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2 can be realized by the same conductive adhesive layer 11. This improves the efficiency of manufacturing the dual interface card 1.

[0035] The configuration of the dual interface card 1 of this embodiment and the manufacturing method thereof will be described in detail below.

[0036] (a) Card base The card base 2 refers to the card body excluding the IC module 7 that constitutes the dual interface card 1. As described above, the card base 2 typically has a configuration in which the oversheet layer 6, the core layer 5, the core layer 4, and the oversheet layer 3 are laminated in this order from one end on the -Z direction side in the thickness direction. In addition, an antenna 8 wound in a loop shape and formed of a coated conductor wire or the like is disposed between the core layer 5 and the core layer 4. The card base 2 may refer to both the card before the recess 9 is formed and the card after the recess 9 is formed, and may refer to both the card not including the antenna 8 and the card including the antenna 8. In addition, the first end 81 and the second end 82, which are either the start point or the end point of the antenna 8, are formed by processing the antenna wire 83 into a predetermined shape as described above.

[0037] However, the layer structure of the card base 2 is not limited to this, and may be a three-layer structure of an over-sheet layer, a core layer, and an over-sheet layer, a two-layer structure of a core layer and a core layer, or a five-layer structure of an over-sheet layer, a core layer, a core layer with an antenna formed thereon, a core layer, and an over-sheet layer, etc. Furthermore, printing or embedding of a magnetic stripe may be performed on the surface of the over-sheet layer 3 or 6 of the card base 2 opposite to the core layer 4 or 5, and printing may be performed on the surface of the core layer 4 or 5 adjacent to the over-sheet layer 3 or 6.

[0038] From the standpoint of conforming to standards such as ISO / IEC7816, the thickness of the card base 2 is preferably 0.76 mm or more and 0.84 mm or less, but may be outside this range.

[0039] (i) Core layer For the core layers 4 and 5, a wide variety of white or colored plastic sheets can be used, including the following single films or composite films. For example, polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, polyurethane, etc. The thickness of the core sheet can be appropriately selected taking into account the overall thickness of the card, and can be, for example, about 0.25 mm or more and 0.38 mm or less. As will be described later, it is necessary to arrange the antenna 8 on the surface of either the core layer 4 or 5 so that it is sandwiched between the two core layers.

[0040] (ii) Oversheet layer The over-sheet layers 3 and 6 are usually made of the same material as the core layer, and are often made of a transparent material having a thickness of about 0.05 mm to 0.10 mm. From the viewpoint of preventing curling when the laminate of the core layer and the over-sheet layer is integrated by heat pressing or the like, it is preferable that the over-sheet layers 3 and 6 have the same thickness, but they do not necessarily have to be the same.

[0041] The material of the over-sheet layer may be any material that has adhesiveness when heated, but even if the over-sheet layer itself does not have adhesiveness when heated, the core layer and the over-sheet layer can be integrated by additionally forming a layer of a known adhesive that generates adhesive force when heated, etc., between the core layer and the over-sheet layer. Furthermore, when the dual interface card 1 is used as a magnetic card, a magnetic tape may be embedded in advance by thermal transfer or the like into either or both of the over-sheet layers 3 and 6 on the main surface side opposite the core layers 4 and 5.

[0042] (iii) Antenna sheet In this embodiment, as described later, the antenna 8 is formed on one surface of the core layer 5, and a first end 81 and a second end 82, which are ends of an antenna wire 83 constituting the antenna 8, are processed into a predetermined shape and arranged. The formation of the antenna 8 on the core layer 5 is performed by applying a predetermined heat pressure to the antenna wire 83, and embedding the antenna wire 83 in the core layer 5 while melting the core layer 5 and the covering of the antenna wire 83. An intermediate product in which the antenna 8 is embedded in the core layer 5 may be referred to as an antenna sheet 12. The antenna sheet 12 can be distributed on the market by itself as a part for manufacturing the dual interface card 1, or a commercial form may exist in which a sheet material such as the core layer 5 is supplied to a processor, who processes it into an antenna sheet 12 and delivers it to the supplier.

[0043] The method of forming the antenna sheet 12 will be described in detail later, but the outline is as follows. First, a coated conductor wire coated with an insulating member is embedded in the surface of the core layer 5 by a winding former, starting from either the first end 81 or the second end 82 and ending at the other. That is, while applying a predetermined heat and pressure to the core layer 5, an antenna supply head is drawn in a loop shape as shown in FIG. 1(a), and the antenna wire 83 supplied from the antenna supply head is sequentially embedded in the core layer 5.

[0044] Here, the first end 81 and the second end 82, which are either the start point or the end point of the antenna wire 83, are arranged side by side in the left-right direction of the intended mounting position of the IC module 7 so as to form a predetermined shape described later, with parts of them overlapping with the terminals 73a and 73b of the IC module 7. Then, the winding forming machine cuts the antenna wire 83 after forming either the first end 81 or the second end 82, which is the end point of the antenna 8. In this manner, the antenna sheet 12 is completed.

[0045] (iv) Antenna Terminals 73a and 73b of the IC module 7 are electrically connected to a first end 81 and a second end 82 of the antenna 8 formed in the core layer 5, respectively, so that the IC chip of the IC module 7 and the antenna 8 form a communication circuit for non-contact communication. The communication circuit may be one that performs close-proximity communication using, for example, the HF frequency band of 13.56 MHz defined in ISO / IEC18092, ISO / IEC144443, etc. Alternatively, it may be one that performs communication using, for example, a UHF frequency band of 920 MHz, an LF frequency band of 125 KHz, or a microwave frequency band of 2.45 GHz.

[0046] When the dual interface card 1 is held over an external device such as a reader / writer, a magnetic field generated by the reader / writer generates a current in the communication circuit, which supplies power to the IC chip. This enables the IC chip to be driven, enabling contactless transmission and reception of information with the reader / writer, and reading and rewriting information from and to the memory.

[0047] The antenna wire 83 constituting the antenna 8 is typically formed of a coated conductor wire in which the periphery of a copper wire is coated with an insulating material. In addition to this, it is also possible to select copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, Cu-Be, etc., or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum. By using coated conductor wires, the dual interface card 1 can be manufactured more inexpensively than, for example, a copper foil etching method, etc. .

[0048] The diameter of the antenna wire 83 is not particularly limited as long as the characteristics as a non-contact communication circuit can be ensured, but it can be, for example, 0.03 mm or more and 0.30 mm or less, and preferably 0.05 mm or more and 0.15 mm or less. By setting the diameter in the latter range, durability against heat pressure due to embedding processing and external forces due to cutting processing can be improved, and good communication characteristics can be ensured.

[0049] Next, the configurations of the first end 81 and the second end 82 will be described in detail. In Fig. 1(b), one end of the antenna wire 83 extending from the -X direction toward the +X direction then forms the first end 81, which has a structure in which turns are repeatedly folded from the outer periphery 97 toward the center, near the -X direction side of the third recess 93 of the recess 9. Similarly, one end of the antenna wire 83 extending from the +X direction toward the -X direction then forms the second end 82, which has a structure in which turns are repeatedly folded from the outer periphery 97 toward the center, near the +X direction side of the recess 9. The antenna wire 83 extends so that the folded structure is repeated multiple times in succession.

[0050] The folded structure has a substantially arc-shaped bent portion at the ends on the +Y direction side and the -Y direction side, i.e., at the upper end and the lower end, and the portion other than the bent portion connecting the bent portion at the upper end and the bent portion at the lower end is substantially straight or curved. However, from the viewpoint of the work efficiency of the embedding process of the antenna wire 83 in the core layer 5 and the saving of the material of the antenna wire 83, it is preferable to form the portion other than the bent portion as substantially straight as possible.

[0051] In this embodiment, the outer periphery 97 is a substantially rectangular shape having sides substantially parallel to the short sides and long sides of the card body 2. The first end 81 and the second end 82 are formed by a structure in which the antenna wire 83 constituting the antenna 8 repeatedly folds back from sides 97a and 97b of the outer periphery 97, which are sides of the recess 9 substantially parallel to the short sides of the card body 2, toward the center.

[0052] Further, the portion of the first end 81 other than the bent portion of the folded structure extends along a straight line parallel to the Y axis along the side 97a of the outer periphery 97 of the recess 9, and the center-to-center distance, i.e., the pitch, of the zigzag-shaped antenna wires 83 between the adjacent portions other than the bent portions is substantially constant. Furthermore, the width of the entire first end 81 and the first exposed portion 86 in the direction along the Y axis is W12, and the width of the exposed portion of the antenna wire 83 in the direction along the X axis is substantially the same as the width of the second recess 92a, so that the antenna wires 83 are arranged along the contour of a rectangle. The distance from the end on the +Y direction side to the end on the -Y direction side of the folded structure, i.e., the length from the upper end to the lower end, is substantially the same length.

[0053] In this embodiment, the first exposed portion 86 of the first end 81, which is a region where the antenna wire 83 is actually exposed from the card base 2, includes a continuous section of the antenna wire 83 from the end of the second recess 92a on the -X direction side to the end on the +X direction side. That is, the entire antenna wire 83, including the bent portion of the folded structure and the portion other than the bent portion, is exposed in the second recess 92a, and the conductor is exposed without being covered by the card base 2 or a covering material. At this time, the width W11 of the second recess 92a in the direction along the Y axis is longer than the width W12 of the first end 81 in the direction along the Y axis. The above description of the first end also applies to the second end 82 by replacing the side 97a of the recess 9 with 97b, the second recess 92a with 92b, and the first exposed portion 86 with the second exposed portion 87, respectively.

[0054] The pitch of the antenna wire 83 depends on the capacity of the winding machine and the quality of the antenna sheet 12 after the antenna wire 83 is embedded in the core layer 5, but is preferably 0.50 mm or less, and more preferably 0.25 mm or less. When the pitch is in the former range, the exposed area of ​​the antenna wire 83 per unit area at the first end 81 can be increased, and the area of ​​electrical connection with the terminal 73a of the IC module 7 can be expanded. This improves the reliability of the electrical connection and reduces the electrical resistance of the contact portion between the antenna wire 83 and the terminal 73a. Moreover, when the pitch is in the latter range, the above-mentioned effect can be further increased.

[0055] In this embodiment, the end of the first end 81 in the region along the X-axis on the +X direction side is approximately the same position as the boundary between the second recess 92a and the third recess 93, and the end on the -X direction side is on the -X direction side of the end of the second recess 92a, which is the outer periphery 97 of the recess 9. In this way, when the end of the first end 81 on the +X direction side is approximately the same position as the boundary between the second recess 92a and the third recess 93 or is on the -X direction side of this, it is possible to not cut the antenna wire 83 when cutting the third recess 93, or to reduce the amount of cutting of the antenna wire 83. For this reason, it is possible to suppress branching of the antenna wire 83, that is, the occurrence of whiskers, which is more likely to occur as the cutting depth becomes deeper.

[0056] Furthermore, the end on the -X direction side of the region of the first end 81 along the X direction is located on the -X direction side of the end of the second recess 92a, which is the outer periphery 97 of the recess 9. This allows the dense region of the antenna wires 83 to be continuous even if the antenna 8 is misaligned with respect to the core layer 5 or the recess 9 is misaligned. This ensures a reliable electrical connection with the terminal 73a of the IC module 7. However, the end on the +X direction side of the region of the first end 81 along the X direction may be located on the +X direction side of the boundary between the second recess 92a and the third recess 93, or the end on the -X direction side may be located on the +X direction side of the end of the second recess 92a, which is the outer periphery 97 of the recess 9.

[0057] The above description is about the relationship between the first end 81 of the antenna 8 and the terminal 73a of the IC module 7 electrically connected thereto, but the same relationship also holds between the second end 82 and the terminal 73b electrically connected thereto. Also, in this embodiment, the description is given on the premise that the antenna 8 has two ends, the first end 81 and the second end 82, for electrically connecting with the IC module 7, but the antenna 8 may have three or more ends, and the IC module 7 may have the same number of corresponding terminals.

[0058] (b) IC module Next, each part of the main components of the IC module 7 will be described mainly with reference to Fig. 2(b) and Fig. 4. Fig. 4(a) is a view of the external connection terminal 71 of the IC module 7 seen from the +Z direction side, similar to Fig. 1(a). Fig. 4(b) is a view of the IC module 7 seen from the -Z direction side opposite to Fig. 4(a). Most of the molded part 74b of the IC chip body 74 is omitted here so that the inside can be seen through. Fig. 4(c) is an enlarged cross-sectional view of part C near the terminal 73a in Fig. 2(b).

[0059] The IC module 7 is embedded in a recess 9 formed in the card base 2, and terminals 73a and 73b of the IC module 7 are electrically connected to a first end 81 and a second end 82 of the antenna 8, respectively, to form a communication circuit for contactless communication. Furthermore, contact communication with a contact-type reader / writer or the like can be performed through an external connection terminal 71 provided on the IC module 7.

[0060] The substrate 72 is made by attaching copper foil to the front and back of a flexible resin film such as glass epoxy resin or polyimide resin with an adhesive, and leaving the copper foil attached to the front and back of the resin film so as to form a predetermined pattern. Specifically, a photosensitive material is applied, a film plate with a predetermined pattern is placed, exposed, and the non-photosensitive portion is etched away in order to form an external connection terminal 71 on one copper foil surface of the resin film and terminals 73a and 73b on the other copper foil surface. This forms the substrate 72 with some of the copper foil of the predetermined pattern remaining on the front and back surfaces of the resin film. In addition, the substrate 72 is provided in advance with a plurality of bonding holes 76, which are through holes for wire bonding to the external connection terminals 71.

[0061] There is no particular limit to the thickness of the substrate 72, but taking into consideration the ability to follow the bending of the card base 2 to some extent, it can be, for example, 0.03 mm or more and 0.50 mm or less, and preferably 0.07 mm or more and 0.20 mm or less.

[0062] As shown in Fig. 4(a), the external connection terminal 71 is divided into sections of the external terminal as defined by the ISO / IEC 7816-2 standard. As shown in Fig. 4(b), each of these sections is connected to the IC chip 74a by wires 75 such as gold wires through the above-mentioned bonding holes 76 provided in the substrate 72. Similarly, the terminals 73a and 73b are connected to the IC chip 74a by wires 75. These bonding holes 76 and wires 75 are covered and protected by the molded portion 74b.

[0063] An IC chip body 74 is disposed on the surface of the substrate 72 opposite to the surface on which the external connection terminals 71 are formed. The IC chip body 74 is composed of an IC chip 74a bonded and fixed to the substrate 72 via an adhesive, a bonding wire 75 for connection, and a molded part 74b which is a sealing resin for protecting these. The IC chip 74a includes a CPU for controlling the operation of both contact communication and contactless communication, a storage device such as a RAM, ROM, EEPROM, flash memory, and various circuits such as an interface circuit for decoding input signals and generating output signals for contact communication and contactless communication, and a power generation circuit. Note that the various circuits may be provided as elements separate from the IC chip 74a.

[0064] The molded portion 74b is provided as a protruding portion that covers the IC chip 74a and the wires 75 to protect them from external force loads and environmental loads. An ultraviolet curable resin, a thermosetting resin, or the like is used as the molded portion 74b.

[0065] The thickness of the IC chip body 74 depends on the thickness of the IC chip 74a provided therein and the shape of the bonded wires, but may be, for example, 0.45 mm to 0.75 mm. The total thickness of the IC module 7 may be, for example, 0.35 mm to 1.0 mm, and preferably 0.40 mm to 0.65 mm. The latter range allows the depth of the third recess 93 to be 0.7 mm or less, and the total thickness of the dual interface card 1 to be kept to 0.84 mm or less as defined by the ISO / IEC 7816 standard.

[0066] (c) Conductive adhesive layer A recess 9 for embedding the IC module 7 in the card base 2 is formed by cutting with an end mill or the like, and then the IC module 7 is embedded and fixed in the recess 9 and electrically and mechanically connected to the recess 9. The conductive adhesive layer 11 is a liquid or tape-like member that is disposed so as to be sandwiched between the core layer 5 in the portion where the antenna wire 83 is cut and exposed on the bottom surface 92p, the substrate 72 of the IC module 7 that is embedded and disposed above it, and the terminal 73a formed on the substrate 72, as shown in Fig. 4(c).

[0067] The conductive adhesive layer 11 may be applied or affixed in advance to the surface of the substrate 72 of the IC module 7 opposite the external connection terminal 71, or may be applied or affixed onto the bottom surface 92p of the recess 9 of the card base 2 after cutting.

[0068] A typical conductive adhesive layer 11, which also serves as a mechanical connection between the IC module 7 and the cut card base 2, may be applied or affixed to the entire back surface of the substrate 72 or to portions of the recess 9 that correspond to the first recess 91 and the second recesses 92a, 92b that are disposed along the outer periphery 97 of the recess 9. In this way, the electrical connection between the IC chip 74a and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2 can be achieved with the same type of conductive adhesive layer 11, which contributes to simplifying the process.

[0069] However, the conductive adhesive layer 11 may be applied or affixed to cover only the areas of the terminals 73a and 73b on the rear surface of the substrate 72, and another adhesive that does not have electrical conductivity may be applied or affixed to the rest of the rear surface of the substrate 72. This is because it is not necessary to consider the electrical conductivity of the other adhesive, making it easier to select an adhesive that is more advantageous for mechanical connection.

[0070] As the conductive adhesive layer 11 that can be used for both electrical and mechanical connection, ACF (Anisotropic Conductive Film), i.e., anisotropic conductive film or ACP (Anisotropic Conductive Paste) can be used. In addition, so-called conductive paste in which silver particles are dispersed as a filler in epoxy resin can be used. Among them, if ACF is used, the ACF is thermally laminated on the entire back surface of the substrate 72 of the IC module 7, the IC module 7 is embedded in the recess 9 of the cut card base 2, and then the IC chip 74a and the antenna 8 are heat-pressed at a predetermined temperature and load, so that electrical connection between the IC chip 74a and the antenna 8 can be easily achieved. Furthermore, since the mechanical connection of the IC module 7 to the card base 2 can be achieved at the same time, the mounting process of the IC module 7 to the card base 2 can be simplified.

[0071] The electrical connection between the IC chip 74a and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2 when ACF is used as the conductive adhesive layer 11 can be explained as follows based on Fig. 4(c). The conductive adhesive layer 11 has a structure in which conductive particles 11a, each of which is a spherical resin or a spherical metal and has a metal film formed therearound, are dispersed in an adhesive 11b, which is a binder containing an adhesive component. Here, heat pressure is applied from the +Z direction to the -Z direction to the substrate 72 so that the conductive adhesive layer 11, which is arranged so as to be sandwiched between the core layer 5, from which a part of the antenna wire 83 is exposed, the substrate 72 of the IC module 7, and the terminal 73a formed on the substrate 72, is compressed.

[0072] As a result, a strong heat pressure is applied to the part of the conductive adhesive layer 11 that is particularly narrow and is sandwiched between the core layer 5 and the terminal 73a, and the conductive particles 11a of the conductive adhesive layer 11 at this part are pressed from the antenna wire 83 and the terminal 73a of the core layer 5 along the thickness direction of the conductive adhesive layer 11. Also, when the conductive particles 11a are small, the conductive particles 11a overlap in a daisy chain from the antenna wire 83 to the terminal 73a along the thickness direction of the conductive adhesive layer 11. That is, the exposed antenna wire 83 and the terminal 73a are conducted through the conductive particles 11a. On the other hand, between the core layer 5 and the substrate 72 in the region where the terminal 73a does not exist, the conductive particles 11a are not compressed to the extent that they are pressed from the antenna wire 83 and the terminal 73a along the thickness direction of the conductive adhesive layer 11, or to the extent that they overlap in a daisy chain. However, the adhesive force of the adhesive 11b generated by the heat pressure mechanically connects the core layer 5 and the substrate 72.

[0073] As described above, in the IC module 7, the mutually opposing terminals 73a and 73b and the first end 81 and second end 82 are electrically connected via, for example, the ACF. The ACF is disposed in a region along the outer periphery 97 of the recess 9 so as to overlap with the first recess 91 and the second recesses 92a and 92b in a plan view along the Z-axis direction.

[0074] (d) Recess The recess 9 formed in the card base 2 for embedding the IC module 7 includes a part of the outer periphery 97 and has a first recess 91 separated from each other. The recess 9 also includes another part of the outer periphery 97 and has second recesses 92a and 92b separated from each other, and a third recess 93 adjacent to the first recess 91 and the second recesses 92a and 92b and formed closer to the center than these recesses. In this embodiment, as shown in FIG. 1(b), the second recesses 92a and 92b are approximately rectangular areas in a plan view along the Z axis, respectively arranged on both sides along the X axis sandwiching the central third recess 93. As described above, the first end 81 and the second end 82 of the antenna 8 overlap the second recesses 92a and 92b, respectively, and the first exposed portion 86 and the second exposed portion 87, which are exposed portions of the antenna wire 83, are respectively configured as the overlapping areas.

[0075] On the other hand, the first recess 91 is adjacent to each of the second recesses 92a and 92b, and is a region that is divided and arranged on both sides along the Y axis sandwiching the central third recess 93. In this embodiment, the first recess 91, the first end 81, and the second end 82 do not overlap each other in a plan view along the Z axis. The second recesses 92a and 92b have approximately the same depth, but are formed deeper than the first recess 91, and the third recess 93 is formed deeper than the second recesses 92a and 92b.

[0076] 3(a) and 3(b), the depth d1 of the first recess 91 and the depth d2 of the second recesses 92a, 92b can be set independently as optimal depths for different purposes. That is, the depth d1 of the first recess 91 can be determined in consideration of good mechanical connection between the IC module 7 and the card base 2. The depth d2 of the second recesses 92a, 92b can be determined independently of the depth d1 of the first recess 91 in consideration of good electrical connection between the terminals 73a, 73b of the IC module 7 and the exposed antenna wire 83.

[0077] First, the depth d1 of the first recess 91 can be considered as follows. For example, let the thickness of the substrate 72 be Tp1, the thickness of the conductive adhesive layer 11 be Tacf1, the shrinkage amount in the thickness direction of the conductive adhesive layer 11 when a predetermined thermocompression is applied be Δacf1, and the shrinkage amount in the thickness direction of the card substrate 2 be Δcb1. At this time, if the surface of the external connection terminal 71 of the IC module 7 is made substantially the same as the surface of the card substrate 2, the depth d1 of the first recess 91 is d1 = Tp1 + Tacf1 - Δacf1 - Δcb1. Here, by obtaining the thermocompression conditions such as the load, temperature, and time under which the adhesive force between the IC module 7 and the card substrate 2 is maximized, and Δacf1 and Δcb1 at that time, the optimal d1 can be determined.

[0078] Next, the depth d2 of the second recesses 92a and 92b can be considered as follows. For example, let the thickness of the terminal 73a extending from the substrate 72 in the -Z direction be Tp2, and the above definitions be applied to the other dimensions. At this time, the depth d2 of the second recess 92a is d2 = Tp1 + Tp2 + Tacf1 - Δacf1 - Δcb1. Here, by obtaining the thermocompression conditions under which the electrical connection between the terminal 73a of the IC module 7 and the exposed antenna wire 83 is the best, and Δacf1 and Δcb1 at that time, the optimal d2 can be determined.

[0079] Here, consider using the same conductive adhesive layer 11 for both the mechanical connection between the IC module 7 and the card substrate 2 and the electrical connection between the terminal 73a of the IC module 7 and the antenna wire 83. In this case, the thermocompression conditions applied to the IC module 7 described above are the same for the first recess 91 and the second recesses 92a and 92b. Note that when the conductive adhesive layer 11 is an ACF and the average particle diameter of its conductive particles is dc1, generally, Tacf1 > dc1, and in order to achieve an appropriate electrical connection, it is preferable that Tacf1 - Δacf1 = dc1 or Tacf1 - Δacf1 < dc1.

[0080] At this time, the conductive particles contained in the ACF filling the gap between the terminal 73a and the antenna wire 83 come into contact with both the terminal 73a and the antenna wire 83 either as is or after being compressed, ensuring a reliable electrical connection. However, if the value of Tacf1-Δacf1 is made extremely small, the conductive particles in the ACF may be destroyed, preventing a good electrical connection from being achieved. To prevent such destruction of the conductive particles, it is preferable that, for example, Tacf1-Δacf1>dc1 / 2.

[0081] On the other hand, when the conductive adhesive layer 11 is an ACF, the appropriate value of Δacf1 for improving the mechanical connection between the IC module 7 and the card base 2 is considered to be the same as or in a range close to the above-mentioned conditions for achieving the appropriate electrical connection. This is because, when the ACF is in a state where the optimum electrical connection can be achieved, the adhesive force that mechanically fixes and maintains the terminal 73a and the antenna wire 83 in that state is also considered to be strong. If the conditions for improving the mechanical connection and the conditions for improving the electrical connection are the same, the depth d2 of the second recess 92a needs to be deeper than the depth d1 of the first recess 91 by an amount that is close to the thickness Tp2 of the terminal 73a.

[0082] Illustratively, the depth of the first recess 91 is, for example, about 0.1 mm or more and 0.4 mm or less, and the depth of the second recesses 92a and 92b is, for example, about 0.12 mm or more and 0.5 mm or less. When the thickness of the terminals 73a and 73b is 0.015 mm or more and 0.15 mm or less, it is preferable that the difference between the depth of the second recesses 92a and 92b and the depth of the first recess 91 is about 0.005 mm or more and 0.2 mm or less. It is more preferable that the difference is 40% or more and 120% or less of the thickness Tp2 of the terminals 73a and 73b. In particular, in the latter case, when the conductive adhesive layer 11 is ACF, the thickness of the conductive adhesive layer 11 can be adjusted by heat and pressure so that the optimal conditions for the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2 overlap.

[0083] 3(a) and 3(b) show the cross section after the IC module 7 is mounted in the recess 9 of the card base 2. That is, the thickness of the conductive adhesive layer 11 in the first recess 91 is d11, and the thickness of the conductive adhesive layer 11 in the second recess 92a is d22 in the area other than the terminal 73a, and d3 in the area of ​​the terminal 73a. When the above-mentioned conditions for improving the mechanical connection and the conditions for improving the electrical connection are the same, d11=d3.

[0084] The specific cutting order for forming such recesses 9 in the card base 2 can be arbitrarily determined according to a milling program for the cutting process. An exemplary processing order determined from the viewpoint of efficient processing time and ensuring cutting quality is, for example, in FIG. 1(b), first, the area common to the first recess 91 and the second recesses 92a, 92b along the outer periphery 97 is cut at the depth of the first recess 91 while moving the milling tool counterclockwise or clockwise. Next, the central areas are cut at the depth of the third recess 93 deeper than the first recess 91 while moving the milling tool counterclockwise or clockwise in the same manner.

[0085] Finally, the area common to the second recesses 92a, 92b is cut while moving the milling tool at a depth deeper than the first recess 91 and shallower than the third recess 93. The second recesses 92a, 92b may be cut by first cutting only the second recess 92a while moving the milling tool counterclockwise or clockwise, and then cutting only the second recess 92b in the same manner. Alternatively, the milling tool may be moved left and right across the second recesses 92a, 92b, and cut continuously while shifting it from top to bottom in sequence, to simultaneously form the second recesses 92a, 92b.

[0086] (e) A method for manufacturing a dual interface card Next, an example of a method for manufacturing the dual interface card 1 using the above-mentioned card base 2, IC module 7, and conductive adhesive layer 11 will be described.

[0087] First, a coated conductor wire coated with an insulating member is embedded as an antenna wire 83 by a winding former, starting from either the first end 81 or the second end 82 and ending at the other, on the surface of either the core layer 5 or 4 on the side not adjacent to the over-sheet layer 6 or 3. Specifically, for example, while applying a predetermined heat and pressure to the core layer 5, an antenna supply head is drawn into a loop shape as shown in FIG.

[0088] Here, the antenna wire 83 is arranged at predetermined positions on the left and right of the intended mounting position of the IC module 7 so that the first end 81 and the second end 82 are aligned in the left-right direction, and the antenna wire 83 is cut at its end point. The movement of the winding machine is changed to adjust the arrangement position of the antenna wire 83 so that the first end 81 and the second end 82 are formed by a repeated folding structure of the antenna wire 83 constituting the antenna 8 from the outer periphery 97 to the center of the recess 9. The antenna 8 is formed by being embedded in the core layer 5 so that the part of the antenna wire 83 other than the bent part of the folding structure is aligned along a straight line along the Y-axis, which is a straight line along the outer periphery 97, and the first end 81 and the second end 82 are each aligned along a rectangular outline.

[0089] Next, using core layer 5, which is antenna sheet 12 on which antenna 8 is formed, over-sheet layer 6, core layer 5, core layer 4, and over-sheet layer 3 are layered in this order from the bottom in the thickness direction, as shown in Fig. 2(a). After that, the laminate of large sheets in which cards are arranged vertically and horizontally in multiple faces is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the laminate via the stainless steel plates.

[0090] By passing through such a heat pressing process, a card base of a large sheet unit in which each layer of the laminate is integrated can be obtained. Also, if either the oversheet layer or the core layer has heat resistance such that it is not thermally fused at a predetermined temperature, an adhesive sheet that is thermally fused at a predetermined temperature can be sandwiched between the layers, or an adhesive can be applied, and then the layers can be subjected to a heat pressing process to obtain a card base of an integrated large sheet unit.

[0091] The large-sized card base obtained as described above, on which the cards are arranged in a multi-faceted manner in a row and column, is punched out by a punching machine into the card base 2 that is the size of an ISO / IEC 7816 card. Furthermore, the card base 2 is formed with a recess 9 for embedding the IC module 7 by cutting using an end mill. In this way, the cut card base 2 is obtained. As described above, the recess 9 is made up of a total of three stages, including the first recess 91 and second recesses 92a, 92b for accommodating the flat substrate 72 of the IC module 7, and the third recess 93 for accommodating the convex IC chip body 74.

[0092] Here, the depth of the first recess 91 is determined taking into consideration that the IC module 7 is embedded and bonded to the card base 2, and that the surface of the external connection terminal 71 is approximately flush with the surface of the non-cut area of ​​the card base 2. The depths of the second recesses 92a and 92b correspond to the embedding depths of the first end 81 and the second end 82 of the antenna 8. That is, when the second recesses 92a and 92b are formed by cutting, parts of the antenna wires 83 of the first end 81 and the second end 82 are exposed at the bottom surface 92p.

[0093] In other words, let the depth from the exposed surface of the external connection terminal 71 of the card substrate 2 to the bottom surfaces 92p of the second recesses 92a and 92b be d2. Also, let the distance from the surface to the upper end of the antenna wire 83 at either the first end 81 or the second end 82 be d201, and let the distance from the surface to the lower end of the antenna wire 83 at the one end be d202. At this time, for the respective values of d2, d201, and d202, d201 < d2 < d202 holds. This is because if this is not satisfied, the antenna wire 83 may be disconnected by cutting, or a defect may occur where it does not protrude from the bottom surface 92p.

[0094] On the other hand, separately from the manufacture of the card substrate 2 and the cutting process for forming the recess 9, the conductive adhesive layer 11 is attached to the IC module 7. As the IC module 7, usually, a module tape in which the IC module 7 is formed continuously in a long tape in a single row or two rows is used. An ACF in tape form is pasted onto the surface of the substrate 72 on the side opposite to the formation surface of the external connection terminal 71 of this module tape while applying a constant thermal pressure. Thereafter, the module tape onto which the ACF has been pasted is punched out with a punching machine as a substantially rectangular IC module 7 having rounded corners to obtain individual pieces of the IC module 7 to which the conductive adhesive layer 11 has been attached.

[0095] Thereafter, the IC module 7 to which the conductive adhesive layer 11 has been attached is embedded in the card substrate 2 in which the recess 9 has been formed, and a predetermined heat block is pressed against the external connection terminal 71, and a predetermined thermal pressure is applied toward the card substrate 2 side for a predetermined time. Thereby, by melting the conductive adhesive layer 11 composed of ACF, an electrical connection is made between the terminals 73a and 73b of the IC module 7 and the first end 81 and the second end 82 of the antenna 8, and a mechanical connection is made between the IC module 7 and the card substrate 2. Although there are differences in thermal pressure conditions depending on the type and composition of the ACF, as an example, the time can be 0.5 seconds or more and 10.0 seconds or less, the temperature can be 150°C or more and 250°C or less, and the pressure can be 20 MPa or more and 100 MPa or less. 。

[0096] (f) Dual Interface Card of the First Embodiment In summary, the dual interface card 1 of the first embodiment includes a card base 2 and an antenna 8 disposed inside the card base 2 and having at least a first end 81 and a second end 82 as multiple end portions. The dual interface card 1 further includes an IC module 7 having an IC chip 74a and a multiple terminals 73a and 73b electrically connected to the IC chip 74a. The IC module 7 is disposed in a recess 9 provided in the card base 2 such that the multiple terminals 73a and 73b facing each other and the multiple first end portions 81 and second end portions 82 are electrically connected to each other. .

[0097] The multiple ends, ie, first end 81 and second end 82, are configured by a repeated folding structure of antenna wire 83 constituting antenna 8 from outer periphery 97 toward the center of recess 9, and a part of them is exposed in recess 9, i.e., second recesses 92a and 92b. This increases the exposed area of ​​antenna wire 83 per unit area exposed in recess 9, and improves the reliability of the electrical connection between terminals 73a and 73b of IC module 7 and antenna 8.

[0098] Further, the second recesses 92a, 92b are formed deeper than the first recess 91, and the third recess 93 is formed deeper than the second recesses 92a, 92b.

[0099] As a result, when the IC module 7 is pressed against the card base 2 by applying heat and pressure, the depth of the second recess 92a can be determined as follows. That is, the depth is determined so that the distance between the terminal 73a having a structure protruding in a convex shape from the substrate 72 via the conductive adhesive layer 11 and the antenna wire 83 exposed at the bottom surface 92p of the second recess 92a is within a proper range for electrical connection. Also, in a region of the substrate 72 spaced apart from the terminal 73a along the Y-axis direction, the depth of the first recess 91 can be determined independently of the depths of the second recesses 92a and 92b so that the distance between the substrate 72 and the card base 2 is within a proper range for mechanical connection. However, the depth of the first recess 91 can be adjusted to be shallower than the depths of the second recesses 92a and 92b, taking into account at least the thickness of the terminal 73a.

[0100] Therefore, the dual interface card 1 of the present embodiment can improve the reliability of both the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2. Even when the same conductive adhesive layer 11 is used, it is possible to achieve both the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2. Therefore, the dual interface card 1 of the present embodiment can improve the reliability of both the electrical connection between the IC module and the antenna and the mechanical connection between the IC module and the card base, thereby improving the efficiency of production.

[0101] 2. Second embodiment Next, a dual interface card according to a second embodiment of the present disclosure will be described.

[0102] Fig. 5 is a diagram showing the configuration of the first end 81 and the second end 82 of the antenna 8 corresponding to Fig. 1(b) in the dual interface card 1a of the second embodiment. In the dual interface card 1a of the present embodiment, the first exposed portions 86a and 87a of the first end 81 and the second end 82, which are the areas where the antenna wire 83 is actually exposed from the card base 2, are configured so that multiple sections of the antenna wire 83 are exposed discontinuously.

[0103] That is, the antenna wire 83 constituting the first end 81 and the second end 82 has a portion other than the bent portion of the folded structure exposed in the second recesses 94a and 94b. However, the bent portions of the folded structure, which are the ends on the +Y and -Y sides, overlap with the first recess 91 in a plan view along the Z axis, and are embedded in the card base 2 on the -Z side of the bottom surface of the first recess 91. This is different from the dual interface card 1 of the first embodiment.

[0104] In the first recess 91, at least the bent portions of the folded structure of the antenna 8, which is a repeated folded structure from the outer periphery 97 of the recess 9 toward the center by the antenna wire 83 constituting the antenna 8 at the first end 81 and the second end 82, are overlapped without being exposed. Also, in the second recesses 94a and 94b, the portions other than the bent portions are exposed. Note that the portions other than the bent portions are exposed so as to be lined up intermittently with each other.

[0105] In the first end 81, a covered region 84a where the bent portion of the folded-back structure of the antenna wire 83 is not exposed and overlaps with the first recess 91 is formed on the +Y direction side of a first exposed portion 86a formed in the second recess 94a. Also, a covered region 84b where the bent portion is not exposed and overlaps with the first recess 91 is formed on the -Y direction side of the first exposed portion 86a. Similarly, covered regions 85a and 85b where the bent portion is not exposed and overlaps with the first recess 91 are formed on the +Y direction side and -Y direction side of a second exposed portion 87a in the second end 82.

[0106] In this embodiment, similarly to the first embodiment, the recess 9 formed for embedding the IC module 7 in the card base 2 includes a first recess 91, second recesses 94a and 94b, and a third recess 93. Here, Fig. 6(a) is a cross-sectional view of the dual interface card 1a in Fig. 5 taken along the plane along line DD as viewed from the -X direction, Fig. 6(a) shows a diagram with the IC module 7 omitted, and Fig. 6(b) shows a state in which the IC module 7 is mounted in Fig. 6(a).

[0107] As shown in Fig. 6(a) and Fig. 6(b), the first recess 91 of the recess 9 of the card base 2 is formed to overlap the end portions of the first end 81 of the antenna wire 83 on the -Y direction side and the +Y direction side in a plan view along the Z axis. The overlapping portions are covered regions 84a and 84b in which the bent portion of the folded-back structure of the antenna wire 83 is covered by the core layer 5. Meanwhile, in the second recess 94a of the recess 9, which is deeper than the first recess 91, the portion of the folded-back structure of the first end 81 of the antenna wire 83 other than the bent portion is exposed at the bottom surface 94p. That is, the bare conductor without the core layer 5 or the covering of the covered conductor is exposed.

[0108] As shown in FIG. 5, the exposed portion of the first end 81 other than the bent portion disposed in the first exposed portion 86a of the folded structure extends along a straight line parallel to the Y axis along the side 97a of the outer periphery 97 of the recess 9. The center-to-center distance, i.e., pitch, of the zigzag-shaped antenna wire 83 of the portions excluding the adjacent bent portions is substantially constant. The width of the entire first end 81 in the direction along the Y axis is W22, and the width of the second recess 92a where the portion of the first end 81 overlaps in a plan view along the Z axis, i.e., the width of the first exposed portion 86a along the Y axis is W21. At this time, W22 is longer than W21. In other words, the value of W22 is larger than the value of W21 by the sum of the lengths of the covered regions 84a and 84b of the first end 81 along the Y axis. The above also applies to the second exposed portion 87a and the covered regions 85a and 85b in the second end portion 82.

[0109] In this embodiment, the dual interface card 1a can be manufactured in the same manner as in the first embodiment. Here, when the second recesses 94a, 94b are formed by cutting using a milling tool, the bent portions of the folded structure formed at the ends of the antenna wire 83 on the -Y and +Y sides are covered by the core layer 5 without exposing the entire first end 81 and the entire second end 82 from the bottom surface 94p. As described in the first embodiment, the antenna wire 83 is embedded in the core layer 5 while being subjected to heat and pressure by the winding machine, but in the region where the antenna wire 83 is exposed, only about half of the cross section of the antenna wire 83 is embedded in the core layer 5. At this time, the adhesive strength between the antenna wire 83 and the core layer 5 is lower than that in the portion where the entire antenna wire 83 is embedded in the core layer 5.

[0110] In the dual interface card 1a of the present embodiment, when the recess 9 is formed, the antenna wire 83 at the first end 81 or the second end 82 is not entirely exposed, and at least the bent portion of the antenna wire 83 at the first end 81 or the second end 82 is covered by the core layer 5. This makes it possible to prevent the exposed portion of the antenna wire 83 from peeling off from the core layer 5 during cutting when the recess 9 is formed. In addition, the covered regions 84a, 84b, 85a, and 85b where the antenna wire 83 at the first end 81 or the second end 82 is covered by the core layer 5 are limited to narrow regions that are the bent portions of the first end 81 or the second end 82. This makes it possible to ensure a sufficient region for the first exposed portions 86a and 87a for electrical connection with the terminals 73a and 73b of the IC module 7, thereby achieving good electrical connection between the IC module 7 and the antenna 8.

[0111] Here, if the covered regions 84a and 84b corresponding to the first end 81 are provided to have equal sizes, and the length of each of the covered regions 84a and 84b along the Y axis is Wc2, then Wc2 = (W22 - W21) / 2. The value of Wc2 is preferably 2% to 20% of the value of W22, and more preferably 5% to 15%.

[0112] The former range suppresses peeling of the exposed antenna wire 83 from the core layer 5 during cutting, while maintaining good electrical connection between the IC module 7 and the antenna 8 even when the cutting position of the second recesses 94a, 94b is shifted or the mounting position of the IC module 7 is shifted. The latter range further suppresses peeling of the antenna wire 83 from the core layer 5, and further improves the effect of absorbing shifts in the processing and mounting position, and reduces costs by suppressing unnecessary wiring of the antenna wire 83 that is not involved in the electrical connection.

[0113] 3. Third embodiment Next, a dual interface card according to a third embodiment of the present disclosure will be described.

[0114] 7(a) is a diagram showing the configuration of the first end 81a and the second end 82a of the antenna 8 corresponding to FIG. 1(b) in the dual interface card 1b of the third embodiment. FIG. 7(b) is a diagram extracting the configuration of the antenna wire 83 near the first end 81a of FIG. 7(a). In the dual interface card 1b of this embodiment, the first end 81a and the second end 82a are formed by a repeated folding structure of the antenna wire 83 constituting the antenna 8 from the outer periphery 97 of the recess 9 toward the center. Furthermore, a part of the structure is exposed in the recess 9, and the part of the antenna 8 other than the bent part of the folding structure is inclined with respect to a straight line along the outer periphery 97.

[0115] Of the first end 81a and the second end 82a, the region of the bent portion of the folded structure where the antenna wire 83 is exposed is the first exposed portion 86b and the second exposed portion 87b that overlap the second recesses 95a and 95b in a plan view along the Z-axis direction. On the other hand, the region other than the bent portion where the antenna wire 83 is covered by the core layer 5 is the covered regions 84c, 84d, 85c, and 85d that overlap the first recess 91 in a plan view. The covered regions 84c and 84d are arranged on the +Y direction side and the -Y direction side of the first exposed portion 86b, and the covered regions 85c and 85d are arranged on the +Y direction side and the -Y direction side of the second exposed portion 87b. That is, the first end 81a and the second end 82a are similar to the second embodiment in that they include the covered regions 84c, 84d, and 85c, 85d.

[0116] At the first end 81a and the second end 82a of the antenna wire 83, portions other than the bent portions at the upper and lower ends of the folded-back structure are inclined obliquely with respect to straight lines m1 and m2 parallel to sides 97a and 97b along the outer periphery 97 of the first recess 91 and the second recesses 95a, 95b, respectively, that is, straight lines parallel to the Y-axis. Furthermore, the first end 81a and the second end 82a are formed so as to follow the contour of a rectangle whose width along the X-axis direction is W31 and whose width along the Y-axis direction is W22.

[0117] Here, in the case where the recess 9, whose outer peripheral shape is substantially the same as that of the IC module 7, is formed by cutting, the method of cutting and forming the second recesses 95a and 95b while exposing the antenna wire 83 is as described above. That is, only the second recess 95a may be cut while moving the milling tool counterclockwise or clockwise, and then only the second recess 95b may be cut in the same manner. Alternatively, the milling tool may be moved in the left-right direction across the second recesses 95a and 95b, and cutting may be performed continuously while shifting it from top to bottom in sequence, to simultaneously form the second recesses 95a and 95b.

[0118] Here, when the former method is adopted, cutting is performed on either the second recess 92a or 92b while the milling tool is moved in the direction along the X-axis and the direction along the Y-axis. At this time, if the wiring direction of the antenna wire 83 and the moving direction of the milling tool are approximately parallel, there is a concern that cutting the antenna wire 83 at a midpoint will cause a part of the antenna wire 83 to branch off and produce unintended branches, which is called whisker generation. However, in this embodiment, the above-mentioned problem can be suppressed because the parts other than the bent parts at the upper and lower ends of the folded-back structure of the first end 81a and the second end 82a are inclined. .

[0119] In addition, in the first end 81a, the portion other than the bent portion of the folded-back structure is inclined clockwise by a predetermined angle θ with respect to the Y-axis, which is a straight line along the side 97a of the outer periphery 97 of the recess 9. Here, the inclination angle θ is preferably 2 degrees or more and 20 degrees or less, and more preferably 5 degrees or more and 15 degrees or less. In addition, the inclination angle θ does not need to be strictly the same in all the portions other than the bent portion of the folded-back structure, and may vary within the above-mentioned range. Since the inclination angle θ is in the former range, the antenna wire 83 has an inclination with respect to the direction along the X-axis or Y-axis, which is the movement direction of the end mill when cutting the recess 9, and therefore the problem of the antenna wire 83 being unintentionally branched can be suppressed.

[0120] On the other hand, by setting the inclination angle θ in the latter range, it is possible to further suppress the occurrence of whiskers, which are branches of the antenna wire 83. Also, even if the end on the +X direction side of the first end portion 81a is located on the +X direction side of the boundary between the first recess 91 and the second recess 95a and the third recess 93, it is possible to further reduce the region of the antenna wire 83 that is broken due to cutting the antenna wire 83 when cutting the third recess 93. This can further improve the reliability of the electrical connection between the antenna 8 and the terminal 73a of the IC module 7.

[0121] In this embodiment, the end of the first end 81a in the region along the X-axis direction on the +X direction side is approximately the same position as the boundary between the second recess 95a and the third recess 93, and the end on the -X direction side is on the -X direction side of the end of the second recess 95a, which is the outer periphery 97 of the recess 9. In this way, when the end of the first end 81a on the +X direction side is approximately the same position as the boundary between the second recess 95a and the third recess 93 or is on the -X direction side of this, it is possible to not cut the antenna wire 83 when cutting the third recess 93, or to reduce the amount of cutting of the antenna wire 83. For this reason, it is possible to suppress branching of the antenna wire 83, that is, the occurrence of whiskers, which is more likely to occur as the cutting depth becomes deeper.

[0122] Furthermore, if the end of the first end 81a on the +X side is located on the +X side of the boundary between the first recess 91 and the second recess 95a, and the third recess 93, the antenna wire 83 is cut when the third recess 93 is cut, and the antenna wire 83 is broken along the way. However, if the inclination angle θ is within the above-mentioned range, the broken area of ​​the antenna wire 83 can be reduced, and a reliable electrical connection can be achieved between the antenna 8 and the terminal 73a of the IC module 7. Furthermore, if the end of the first end 81a on the +X side is located on the +X side of the boundary between the first recess 91 and the second recess 95a, and the third recess 93, this area includes the bent portion of the antenna wire 83 with a folded-back structure, and the portion other than the bent portion will be broken along the way. In this way, when cutting the third recess 93, the antenna wire 83 is less likely to branch from the bent portion that is significantly offset from the direction along the Y-axis, which is the movement direction of the end mill, and this ultimately contributes to improved quality.

[0123] In the second end 82a, the portion other than the bent portion of the folded-back structure is inclined counterclockwise opposite to the first end 81a by a predetermined angle θ with respect to the Y axis, which is a straight line along the side 97b of the outer periphery 97 of the recess 9. Here, the range of the inclination angle θ is the same as that of the first end 81a, except that the direction is reversed. The inclination of the portion other than the bent portion of the first end 81a with respect to the straight line along the outer periphery 97 and the inclination of the portion other than the bent portion of the second end 82a with respect to the straight line along the outer periphery 97 are formed line-symmetrically with each other. That is, the first end 81a and the second end 82a are arranged symmetrically with respect to the axis along the Y axis as a whole configuration, including the inclination of the portion other than the bent portion of the antenna wire 83.

[0124] In this way, the inclination of the portion other than the bent portion at the first end 81a and the inclination of the portion other than the bent portion at the second end 82a are arranged in a line-symmetrical relationship with each other. As a result, when the antenna wire 83 is embedded in the core layer 5 to form the antenna sheet 12, the distortion and internal stress of the core layer 5 are offset and dispersed, making it possible to obtain a uniform antenna sheet 12 with less distortion and internal stress.

[0125] In addition, when embedding the IC module 7 in the recess 9, the heat and pressure conditions applied between the first end 81a and the terminal 73a and the heat and pressure conditions applied between the second end 82a and the terminal 73b are symmetrical to each other. This prevents bias in the heat and pressure conditions, and stabilizes the electrical connection between the IC module 7 and the antenna 8 and the mechanical connection between the IC module 7 and the card base 2. .

[0126] However, the inclination of the first end 81a with respect to a straight line along the outer periphery 97 of the portion other than the bent portion and the inclination of the second end 82a with respect to a straight line along the outer periphery 97 of the portion other than the bent portion may be the same, rather than being line-symmetrical with each other. That is, the configuration of the antenna wire 83 of the second end 82a may be substantially the same as the configuration of the antenna wire 83 of the first end 81a, but moved in parallel in the +X direction. In this case, the above-mentioned effects and advantages related to the configuration of the first end 81a also apply to the second end 82a.

[0127] 4. Fourth embodiment Next, a dual interface card according to a fourth embodiment of the present disclosure will be described.

[0128] Fig. 8(a) is a diagram showing the configuration of a dual interface card 1c of the fourth embodiment, in the vicinity of a first end 81 and a second end 82 of an antenna 8 corresponding to Fig. 1(b). Fig. 8(b) is a cross-sectional view of the dual interface card 1c of Fig. 8(a) taken along the line EE, viewed from the -Y direction. Fig. 8(c) is a diagram showing the IC module 7a as viewed from the surface of the substrate 72 opposite to the external connection terminal 71.

[0129] In dual interface card 1c of the present embodiment, first recesses arranged on the +Y and -Y sides of recess 9 of dual interface card 1 of the first embodiment are also divided on the X-axis side. In addition, recess 9 is newly provided with fourth recesses 96a and 96b deeper than the first recesses at approximately the center along the X-axis direction. This is different from the first embodiment.

[0130] The recess 9 includes first recesses 91a, 91b, 91c, and 91d that are separated and disposed at four locations on the +Y direction side and the -X direction side, the +Y direction side and the +X direction side, the -Y direction side and the -X direction side, and the -Y direction side and the +X direction side, and the recess 9 includes another portion of the outer periphery 97 and includes second recesses 92a and 92b that are separated from each other, and a third recess 93 that is adjacent to all of the first recesses 91a, 91b, 91c, and 91d and the second recesses 92a and 92b and is formed closer to the center than these recesses.

[0131] In addition, the recess 9 further includes fourth recesses 96a and 96b which include a part of the outer periphery 97 and are arranged separately on the +Y direction side and the -Y direction side adjacent to the third recess 93. The fourth recess 96a is formed at a position sandwiched between the first recesses 91a and 91b, and the fourth recess 96b is formed at a position sandwiched between the first recesses 91c and 91d. The fourth recesses 96a and 96b are formed deeper than the first recesses 91a, 91b, 91c, and 91d, and shallower than the third recess 93.

[0132] On the other hand, at a predetermined position on the surface of the substrate 72 facing the fourth recesses 96a and 96b when the IC module 7a is mounted, a convex portion having an area smaller than the area of ​​the fourth recesses 96a and 96b when viewed in a plan view along the Z-axis direction is formed. This is the lead portion 77 shown in Figures 8(b) and 8(c). The lead portion 77 functions as a lead wire for carrying a current when nickel-plating or gold-plating the copper foil surfaces of the terminals 73a, 73b, etc. formed on the surface of the substrate 72 opposite the external connection terminal 71 of the IC module 7a to improve durability and environmental resistance.

[0133] As described above, the IC modules 7a are usually formed as a module tape in which a large number of IC modules 7 are formed on a continuous long tape with one or two rows. The lead wires are wired across the IC modules 7a so as to electrically connect the terminals 73a and 73b of the IC modules 7a. Therefore, lead portions 77 remain as traces of the lead wires at the ends on the +Y direction side and the -Y direction side of each individual IC module 7a punched into individual pieces.

[0134] The lead portion 77 is usually made of copper foil or the like, and thus has a certain degree of thickness, similar to the terminals 73a and 73b. Therefore, if the depth of the recess 9 facing the substrate 72 in the region where the lead portion 77 is present is uniformly the same, the conductive adhesive layer 11 is compressed by heat pressure according to the gap between the lead portion 77 and the card base 2. However, the gap between the substrate 72 and the card base 2 in the region where the lead portion 77 is not present becomes too large by the amount of the absence of the lead portion 77, and therefore there is a possibility that a good mechanical connection between the IC module 7a and the card base 2 cannot be achieved in this region.

[0135] Therefore, in this embodiment, as shown in Fig. 8(b), a fourth recess 96a that is deeper than the first recess 91a and the like that are other regions is further formed in the region of the card base 2 facing the lead portion 77. This allows the gap between the IC module 7 and the card base 2 in the region where the lead portion 77 exists and the gap between the IC module 7 and the card base 2 in the region where the lead portion 77 does not exist to be optimized. As a result, it is possible to achieve a stable mechanical connection overall between the IC module 7 and the card base 2 while suppressing a decrease in adhesive strength in a specific location. The same applies to the fourth recess 96b.

[0136] When the thickness of the lead portion 77 is 0.015 mm or more and 0.15 mm or less, the difference between the depth of the fourth recesses 96a, 96b and the depth of the first recesses 91a, 91b, 91c, 91d is preferably about 0.005 mm or more and 0.2 mm or less. Moreover, it is more preferable that the difference is 40% or more and 120% or less of the thickness of the lead portion 77. This is because the above-mentioned effect can be further improved by being in such a range.

[0137] In this embodiment, the lead portions 77 are described as being provided at two locations along the Y-axis, i.e., in the vertical direction, on the surface of the substrate 72 opposite the external connection terminals 71 of the IC module 7a. However, the arrangement of the lead portions 77 is not limited thereto, and the lead portions 77 may be provided at two locations along the X-axis, i.e., in the horizontal direction, on the surface of the substrate 72 opposite the external connection terminals 71 of the IC module 7a. Furthermore, any number of lead portions may be provided at any location along the outer periphery 97 of the IC module 7a. This is because the above-mentioned effects can be obtained by providing the necessary fourth recesses in the card base 2 according to the arrangement and number of the lead portions 77 provided on these IC modules 7a.

[0138] As described above, each of the embodiments and each of the modified examples described in this disclosure can be implemented in combination with each other in part or in whole, provided that no contradiction arises, and the contents of such combinations are naturally included in the present disclosure. [Explanation of symbols]

[0139] 1, 1a, 1b, 1c dual interface cards 2. Card Base 3, 6 Oversheet layer 4, 5 Core layer 7, 7a IC module 8 Antennas 9 Recess 11 Conductive adhesive layer 11a Conductive particles 11b Adhesive 12 Antenna sheet 71 External connection terminal 72 Substrate 73a, 73b terminal 74 IC chip body 74a IC chip 74b Molded part 74p Pad 75 Wire 76 Bonding Hall 77 Lead section 81, 81a First end 82, 82a 2nd end 83 Antenna Wire 84a, 84b, 84c, 84d, 85a, 85b, 85c, 85d Coverage area 86, 86a, 86b 1st exposed part 87, 87a, 87b 2nd exposed part 91, 91a, 91b, 91c, 91d First recess 92a, 92b, 94a, 94b, 95a, 95b Second recess 92p, 94p bottom 93 3rd recess 96a, 96b Fourth recess 97 Circumference Around 97a and 97b

Claims

[Claim 1] A dual interface card capable of contact and non-contact communication with an external device, A card base; an antenna having a plurality of ends disposed within the card base; an IC module having an IC chip and a plurality of terminals electrically connected to the IC chip; the IC module is disposed in a recess provided in the card base such that the terminals and the ends facing each other are electrically connected to each other; the plurality of ends are formed by a repeated folding structure of an antenna wire constituting the antenna from the outer periphery toward the center of the recess, and a part of the structure is exposed in the recess; The recess includes a first recess that includes a portion of the outer periphery and is separated from the first recess; a second recess including another part of the outer periphery and separated from the other recess; a third recess portion formed adjacent to all of the first recess portion and the second recess portion and toward the center thereof; At least a portion of the ends is exposed in the second recess, The second recess is deeper than the first recess, and the third recess is deeper than the second recess.

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