Manufacturing method for FPC with component

Abstract

To provide a manufacturing method for FPC with a component that can mount a circuit component at a predetermined position branched off from the FPC body.SOLUTION: A manufacturing method 1 for an FPC with a component is a method for manufacturing a component-equipped FPC 10 in which a circuit component 2 is solder-bonded to an FPC 3, and includes an FPC formation step S1 for forming an FPC 3 integrally including an FPC body 31, an FPC arm portion 32 branching off from the FPC body 31, a component mounting portion 33 provided at an end of the FPC arm portion 32 on which the circuit component 2 is mounted, and a bridge 34 connecting the component mounting portion 33 and the FPC body 31, a component mounting step S2 for mounting the circuit component on the component mounting portion via solder 4, and a mounting step S4 for heating the FPC to melt the solder and mount the circuit component on the component mounting portion.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a component-mounted FPC. [Background technology]

[0002] Conventionally, when mounting chip components on a flexible substrate, a technique is known in which the flexible substrate is placed on a tray, chip components are placed on the flexible substrate, and the chip components are mounted on the flexible substrate by reflow deposition (see, for example, Patent Document 1).

[0003] One example of a technique for mounting chip components on a flexible substrate by reflow deposition is a technique in which, in order to prevent warping of the flexible substrate, a plate with openings is placed on the flexible substrate so that the chip components mounted on the substrate are exposed from the openings, and the flexible substrate is pressed against the plate, after which the chip components are mounted on the flexible substrate by reflow deposition. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 6-120653 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the conventional method of mounting chip components on a flexible substrate, as shown in Figures 11 and 12, when mounting chip components 102 on the portion exposed from opening 152a of plate 152, i.e., portion 103A branching off from flexible substrate (FPC) 103, during reflow deposition, there was a concern that portion 103A on which chip components 102 are mounted may warp, causing chip components (circuit components) 102 to be mounted out of position, i.e., resulting in mounting defects.

[0006] An object of the present invention is to provide a method for manufacturing a component-mounted FPC that can mount circuit components at predetermined positions branched off from the FPC body. [Means for solving the problem]

[0007] In order to solve the above problems and achieve the object, the first invention described in the present invention is a component-attached FPC manufacturing method for manufacturing a component-attached FPC in which circuit components are solder-bonded to an FPC, the method comprising the steps of: an FPC formation step of forming an FPC integrally comprising an FPC body, FPC arms branching off from the FPC body, component mounting sections provided at the ends of the FPC arms on which the circuit components are mounted, and a bridge connecting the component mounting sections to the FPC body; a component mounting step of mounting the circuit components in the component mounting sections via solder; and a mounting step of heating the FPC to melt the solder and mount the circuit components on the component mounting sections.

[0008] The second invention described in the present invention is a component-attached FPC manufacturing method for manufacturing a component-attached FPC in which circuit components are solder-bonded to an FPC, the method comprising the steps of: an FPC formation step of forming an FPC integrally comprising an FPC body, an FPC arm portion branching off from the FPC body, a component mounting portion provided at the end of the FPC arm portion on which the circuit components are mounted, and an extension portion extending from an edge of the component mounting portion; a component mounting step of mounting the circuit components on the component mounting portion via solder; a plate mounting step of mounting a plate so as to cover at least a portion of the extension portion while exposing the component mounting portion; and a mounting step of heating the FPC to melt the solder, and mounting the circuit components on the component mounting portion. Effect of the Invention

[0009] According to the present invention, a circuit component can be mounted at a predetermined position branched off from the FPC body. [Brief description of the drawings]

[0010] [Figure 1]1 is a plan view showing a component-mounted FPC manufactured by a component-mounted FPC manufacturing method according to a first embodiment of the present invention. [Diagram 2] 3A to 3C are schematic diagrams for explaining the steps of the method for manufacturing the component-mounted FPC. [Diagram 3] FIG. 13 is a diagram for explaining the manufacturing process of the component-mounted FPC, showing a state in which circuit components are mounted on the FPC. [Figure 4] FIG. 4 is a diagram showing a post-processing step of FIG. 3, showing a state in which a plate has been installed on the FPC. [Diagram 5] 5 is a diagram showing a process subsequent to that shown in FIG. 4, illustrating how a bridge provided on the FPC is cut. FIG. [Figure 6] FIG. 6 is a diagram showing a process subsequent to that shown in FIG. 5, and is a plan view showing a completed component-mounted FPC. [Figure 7] 11 is a plan view showing a modified example of a component-mounted FPC manufactured by the component-mounted FPC manufacturing method. FIG. [Figure 8] FIG. 11 is a plan view showing a component-mounted FPC according to a second embodiment of the present invention. [Figure 9] 3A to 3C are schematic diagrams for explaining the steps of the method for manufacturing the component-mounted FPC. [Figure 10] FIG. 13 is a diagram for explaining a manufacturing procedure for manufacturing the component-mounted FPC, showing a state in which a plate is installed on the FPC. [Figure 11] FIG. 1 is a diagram for explaining the problem to be solved by the present invention, and is a plan view showing a flexible substrate with chip components manufactured by a conventional flexible substrate mounting method. [Figure 12] 12 is a cross-sectional view showing the flexible substrate with the chip part shown in FIG. 11. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] (First embodiment) Hereinafter, a component-mounted FPC manufacturing method 1 according to a first embodiment of the present invention will be described with reference to Figures 1 to 6. Figure 1 is a plan view showing a component-mounted FPC 10 manufactured by the component-mounted FPC manufacturing method 1 according to the first embodiment of the present invention.

[0012] 1, a component-mounted FPC 10 manufactured by the component-mounted FPC manufacturing method 1 includes a circuit component 2 and an FPC 3 (Flexible Printed Circuits) to which the circuit component 2 is soldered. In this embodiment, the arrows X, Y, and Z are perpendicular to each other. The arrows X and Y indicate the planar directions in which the FPC 3 extends, and the arrow Z indicates the direction in which the circuit component 2 is disposed relative to the FPC 3.

[0013] The circuit component 2 is soldered to a component mounting portion 33 of the FPC 3, which will be described later, and is electrically connected to a circuit formed on the FPC 3. Here, it is an element that exhibits various functions. Examples of the circuit component 2 include a connector, a capacitor, a relay, a resistor, a transistor, an IPS (Intelligent Power Switch), and an electronic control unit including a microcomputer. As shown in FIG. 1, the circuit component 2 includes a circuit component body (not shown) and a plurality of connection parts 22 (in the figure, only one of the plurality of connection parts 22 is shown, and the others are omitted) extending from both ends of the circuit component body. Hereinafter, one of the plurality of connection parts 22 may be referred to as a "first connection part" and the others as a "second connection part".

[0014] In this embodiment, the first connection portion 22 is composed of a rectangular plate-shaped conductive metal tab. The first connection portion 22 is installed so that a part of the first connection portion 22 extends from a component installation portion 33 provided on the FPC 3, which will be described later.

[0015] As shown in Figures 1 and 3, the FPC 3 integrally comprises an FPC body 31 formed in a rectangular shape, an FPC arm portion 32 branching off from the FPC body 31, a component mounting portion 33 in which the first connection portion 22 of the circuit component 2 of the FPC arm portion 32 is mounted, and a bridge 34 connecting the component mounting portion 33 and the FPC body 31.

[0016] 3, the FPC body 31 is formed in a rectangular shape. The FPC body 31 has a pair of first sides 31a, 31a that form both ends of the FPC body 31 in the left-right direction X and extend in the front-rear direction Y, and a second side 31b that is continuous with the pair of first sides 31a, 31a and extends in the left-right direction X.

[0017] 3, the FPC arm 32 includes a band-shaped FPC arm main body 321 extending forward Y1 from the second side 31b of the FPC main body 31, and a band-shaped FPC extension portion 322 bent at a right angle and extending in the left-right direction X at an end of the FPC arm main body 321 remote from the FPC main body 31. One end 32L of the FPC arm 32 is continuous with the second side 31b of the FPC main body 31, and the other end 32R is continuous with a first edge 33a of a component installation portion 33 described later.

[0018] As shown in FIG. 3, the component mounting section 33 is formed in a rectangular shape. The component mounting section 33 is configured to have a first edge 33a and a second edge 33b extending in the front-rear direction Y, and a third edge 33c and a fourth edge 33d extending in the left-right direction X. The component mounting section 33 is provided at an end opposite to the FPC arm body 321 across the FPC extension section 322 in the left-right direction X. Solder printing is applied to the upper surface of the component mounting section 33. In the following, the solder is given the reference symbol 4. The component mounting section 33 is configured to electrically connect the first connection section 22 of the circuit component 2 via the solder 4. That is, the circuit component 2 is mounted on the component mounting section 33.

[0019] 3, the bridge 34 is formed in a strip shape. The bridge 34 is located between the FPC body 31 and the component installation portion 33, and is provided continuous with both of them. The bridge 34 is provided extending in the front-rear direction Y, and one end is provided continuous with the second side 31b of the FPC body 31, and the other end is provided continuous with the third edge 33c of the component installation portion 33.

[0020] Next, the manufacturing apparatus 5 used when manufacturing the component-mounted FPC 10 will be described with reference to FIG.

[0021] As shown in FIGS. 3 and 4, the manufacturing equipment 5 includes a tray 51 on which the FPC 3 is placed, a reflow furnace (not shown) for melting the solder 4 by heating, and a plate 52 (shown in FIG. 4) for covering and pressing the FPC 3.

[0022] 4, the tray 51 is configured so that the FPC 3 and the circuit components 2 can be placed thereon. The tray 51 is formed in a flat plate shape and has an area larger than that of the component-mounted FPC 10.

[0023] 4, the plate 52 includes a plate body 521 sized to cover a portion of the FPC body 31 and the FPC arm portion 32 of the FPC 3, and a rectangular opening 522 provided in the plate body 521. The opening 522 is sized to expose the component mounting portion 33, a portion of the FPC arm portion 32 including the other end 32R, and the first connection portion 22 of the circuit component 2.

[0024] Next, a method for manufacturing the component-mounted FPC 10 using the manufacturing apparatus 5 (component-mounted FPC manufacturing method 1) will be described with reference to FIGS.

[0025] 2 and 3, an FPC 3 is formed that is integral with an FPC body 31, an FPC arm portion 32 branching off from the FPC body 31, a component mounting portion 33 provided on the FPC arm portion 32 on which a circuit component 2 is mounted, and a bridge 34 connecting the component mounting portion 33 and the FPC body 31 (FPC formation step S1). After that, solder printing is performed on the upper surface of the component mounting portion 33. Then, the FPC 3 is placed on a tray 51.

[0026] 4, the first connection portion 22 of the circuit component 2 is placed on the component mounting portion 33 (component mounting step S2). The rear portion of the first connection portion 22 is placed on the component mounting portion 33, and the front Y1 portion is placed so as to straddle the fourth edge 33d of the component mounting portion 33.

[0027] 4, the plate 52 is placed on the FPC 3 (plate placement step S3). The plate 52 is placed so that the plate body 521 covers the FPC body 31 and a part of the FPC arm 32, and the part including the other end 32R of the FPC arm 32, the component placement part 33, the first connection part 22 of the circuit component 2, and the bridge 34 are exposed from the opening 522. Hereinafter, the state in which the FPC 3 and the circuit component 2 are placed on the tray 51 and the plate 52 is placed at a predetermined position on the FPC 3 as shown in FIG. 4 may be referred to as a "component set 6." If there is no risk of the FPC body 31 warping, the plate 52 may be omitted.

[0028] Next, the component set 6 is placed in a reflow furnace, whereby the FPC 3 is heated and the solder 4 is melted. At this time, the component mounting portion 33 is supported by the FPC body 31 by the bridge 34, and warping of the component mounting portion 33 is suppressed.

[0029] Thereafter, the first connection portion 22 of the circuit component 2 is electrically connected to a circuit formed on the component mounting portion 33 of the FPC 3 via the solder 4. Also, the second connection portion of the circuit component 2 is electrically connected to the circuit at a predetermined position. In this way, the circuit component 2 is mounted on the component mounting portion 33 (mounting step S4). At this time, since warping of the component mounting portion 33 is suppressed, the circuit component 2 is positioned at a predetermined position on the component mounting portion 33.

[0030] Thereafter, the component set 6 is removed from the reflow furnace, and the plate 52 is removed. Then, as shown in Fig. 5, the bridges 34 are cut at boundary positions L1 between the bridges 34 and the FPC body 31, and at boundary positions L2 between the bridges 34 and the component mounting portions 33 (bridge cutting process S5). In this way, the component-mounted FPC 10 is completed as shown in Fig. 6.

[0031] According to the above-described embodiment, the component-attached FPC manufacturing method 1 for manufacturing a component-attached FPC 10 in which a circuit component 2 is solder-bonded to an FPC 3 includes an FPC formation step S1 for forming an FPC 3 integrally including an FPC body 31, an FPC arm portion 32 branching off from the FPC body 31, a component mounting portion 33 provided at an end of the FPC arm portion 32 on which a circuit component 2 is mounted, and a bridge 34 connecting the component mounting portion 33 and the FPC body 31. As a result, when the FPC 3 is heated, the FPC 3 is heated in a reflow furnace with the component mounting portion 33 supported by the bridge 34 on the FPC body 31, thereby suppressing warping of the component mounting portion 33. As a result, the circuit component 2 can be mounted in a predetermined position (component mounting portion 33) branching off from the FPC body 31 in a predetermined posture.

[0032] The method also includes a plate installation step S3 of installing the plate 52 so as to expose the component installation portion 33 while covering a part of the FPC body 31 and a part of the FPC arm portion 32. This makes it possible to suppress warping of the FPC body 31.

[0033] Furthermore, a bridge cutting step S5 for cutting the bridges 34 is provided, and the bridge cutting step S5 is performed after the mounting step S4. This allows unnecessary portions to be cut off, making it possible to manufacture a lightweight component-mounted FPC 10.

[0034] It should be noted that the present invention is not limited to the above-described embodiment, but includes other configurations that can achieve the object of the present invention, and the following modified examples are also included in the present invention.

[0035] In the above embodiment, the circuit components 2 are placed on the component placement sections 33 of the FPC 3 in the component placement step S2, and then the plate 52 is placed on the FPC 3 in the plate placement step S3, but the present invention is not limited to this. The circuit components 2 may be placed on the component placement sections 33 of the FPC 3 after the plate 52 is placed on the FPC 3. That is, the component placement step S2 may be performed after the plate placement step S3.

[0036] In the embodiment, in the bridge cutting step S5, the bridge 34 is cut at the boundary position L1 between the bridge 34 and the FPC body 31 and at the boundary position L2 between the bridge 34 and the component installation section 33, but the present invention is not limited to this. The bridge 34 may be cut at the intermediate position L3 in the front-rear direction Y as shown in Fig. 7, or the bridge cutting step S5 may not be performed and the component installation section 33 and the FPC body 31 may remain connected, that is, the state in which the bridge 34 is present may be the completed form. Alternatively, perforations may be made in advance at least one of the positions L1 to L3.

[0037] Second embodiment A component-mounted FPC manufacturing method 1A according to a second embodiment of the present invention will be described below with reference to FIGS. 8 to 10. FIG. 8 is a plan view showing a component-mounted FPC 10A according to the second embodiment of the present invention. FIG. 9 is a schematic diagram for explaining the procedure of the component-mounted FPC manufacturing method 1A. FIG. 10 is a diagram for explaining the manufacturing procedure for manufacturing the component-mounted FPC 10A, showing a state in which a plate 52 is installed on the FPC 3A. The component-mounted FPC manufacturing method 1A of the second embodiment and the component-mounted FPC manufacturing method 1 of the first embodiment differ in the configuration of the FPC 3A (3). In the second embodiment, parts having the same configuration as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0038] As shown in FIG. 8, a component-mounted FPC 10A manufactured by the component-mounted FPC manufacturing method 1A includes a circuit component 2 and an FPC 3A (Flexible Printed Circuits) to which the circuit component 2 is soldered.

[0039] As shown in FIG. 8 , the FPC 3A integrally comprises an FPC main body 31, an FPC arm portion 32 branching off from the FPC main body 31, a component mounting portion 33 provided at the end of the FPC arm portion 32 and on which the first connection portion 22 of the circuit component 2 is mounted, and an extension portion 35 extending from the component mounting portion 33.

[0040] 8 and 10, the extension 35 is configured to extend in a direction away from the FPC arm 32 at a front end (an end farther from the FPC body 31 in the front-rear direction Y) of the second edge 33b of the component mounting portion 33. The extension 35 is a portion extending from the second edge 33b of the component mounting portion 33.

[0041] Next, a method for manufacturing the component-mounted FPC 10A using the manufacturing apparatus 5 (component-mounted FPC manufacturing method 1A) will be described with reference to FIGS.

[0042] 8 and 9, an FPC 3A is formed that is integral with an FPC body 31, an FPC arm portion 32 branching off from the FPC body 31, a component mounting portion 33 provided at the end of the FPC arm portion 32 on which a circuit component 2 is mounted, and an extension portion 35 extending from the component mounting portion 33 (FPC formation step S1A). After this, solder printing is applied to the upper surface of the component mounting portion 33.

[0043] Next, the FPC 3A is placed on the tray 51. Then, the first connection portion 22 of the circuit component 2 is placed on the component mounting portion 33 (component mounting step S2). The rear side portion of the first connection portion 22 is mounted on the component mounting portion 33, and the front Y1 side portion is mounted so as to straddle the fourth edge 33d of the component mounting portion 33. In this manner, the circuit component 2 is mounted on the component mounting portion 33 via the solder 4.

[0044] 10, plate 52 is placed on FPC 3A (plate placing step S3). Plate 52 is placed so that plate body 521 covers FPC body 31 and part of FPC arm 32, and a portion including other end 32R of FPC arm 32, component placement portion 33, first connection portion 22 of circuit component 2, and the base of extension portion 35 are exposed from opening 522. Hereinafter, the state in which FPC 3A and circuit component 2 are placed on tray 51 and plate 52 is placed at a predetermined position on FPC 3A as shown in FIG. 10 may be referred to as "component set 16."

[0045] Next, the component set 16 is placed in a reflow furnace, whereby the FPC 3A is heated and the solder 4 is melted. At this time, the component mounting portion 33 is pressed by the plate 52 via the extension portion 35, so that the component mounting portion 33 is prevented from warping.

[0046] Thereafter, the first connection portion 22 of the circuit component 2 is electrically connected to a circuit formed on the component mounting portion 33 of the FPC 3A via the solder 4. The second connection portion of the circuit component 2 is also electrically connected to the circuit at a predetermined position. This allows the circuit component 2 to be mounted on the component mounting portion 33 (mounting step S4). At this time, since warping of the component mounting portion 33 is suppressed, the circuit component 2 is positioned at a predetermined position on the component mounting portion 33.

[0047] Thereafter, component set 6 is removed from the reflow furnace, and plate 52 is removed. In this manner, component-mounted FPC 10A is completed, as shown in FIG.

[0048] According to the above-described embodiment, the component-attached FPC manufacturing method 1A for manufacturing the component-attached FPC 10 in which the circuit components 2 are solder-bonded to the FPC 3A includes an FPC forming step S1A for forming the FPC 3A integrally including the FPC body 31, the FPC arm portion 32 branching from the FPC body 31, the component mounting portion 33 provided at the end of the FPC arm portion 32 and on which the circuit components 2 are mounted, and the extension portion 35 extending from the edge of the component mounting portion 33, and a plate installation step S3 for installing the plate 52 so as to cover at least a part of the extension portion 35 and expose the component mounting portion 33. As a result, when the FPC 3A is heated, the FPC 3A is heated in a reflow furnace with the extension portion 35 pressed by the plate 52, thereby suppressing warping of the component mounting portion 33. As a result, the circuit components 2 can be mounted in a predetermined position (the component mounting portion 33) branching from the FPC body 31 in a predetermined position in a predetermined position.

[0049] In the embodiment, as shown in FIG. 8, the rear portion of the first connection portion 22 of the circuit component 2 is mounted on the component mounting portion 33, and the front Y1 portion is provided straddling the fourth edge 33d of the component mounting portion 33. The extension portion 35 is configured to extend in a direction away from the FPC arm portion 32 in the left-right direction X at the front end of the second edge 33b of the component mounting portion 33, but the present invention is not limited to this. The first connection portion 22 of the circuit component 2 may be partially mounted on the component mounting portion 33, and the other portion may be provided straddling the second edge 33b of the component mounting portion 33. In this case, the extension portion may be configured to extend in a direction away from the FPC body 31 in the front-rear direction Y at the fourth edge 33d of the component mounting portion 33.

[0050] In the above embodiment, in the plate installation step S3, the plate 52 is installed so that the base of the extension portion 35 is exposed from the opening 522 of the plate 52, but the present invention is not limited to this. In the plate installation step S3, the plate 52 may be installed so that the entire extension portion 35 is covered by the plate 52.

[0051] In addition, the best configurations and methods for implementing the present invention are disclosed in the above description, but the present invention is not limited thereto. That is, the present invention has been mainly illustrated and described with reference to specific embodiments, but those skilled in the art can make various modifications to the above-described embodiments in terms of shape, material, quantity, and other detailed configurations without departing from the scope of the technical idea and purpose of the present invention. Therefore, the descriptions limiting the shapes, materials, etc. disclosed above are illustrative descriptions for the purpose of facilitating understanding of the present invention, and do not limit the present invention, and therefore descriptions of the names of components that are free of some or all of the limitations on the shapes, materials, etc. are included in the present invention. [Explanation of symbols]

[0052] 1. 1A Component-attached FPC Manufacturing Method 2 Circuit Components 3, 3A FPC 10, 10A FPC with components 31 FPC body 32 FPC arm 33 Parts installation section 34 Bridge 35 Extension 52 Plate S1, S1A FPC formation process S2 Parts installation process S3 Plate installation process S4 Mounting process S5 Bridge cutting process

Claims

1. A method for manufacturing a component-mounted FPC in which a circuit component is solder-bonded to an FPC, comprising the steps of: an FPC forming process for forming the FPC integrally including an FPC body, an FPC arm portion branching off from the FPC body, a component mounting portion provided at an end of the FPC arm portion on which the circuit components are mounted, and a bridge connecting the component mounting portion and the FPC body; a component mounting step of mounting the circuit component on the component mounting portion via solder; a mounting step of heating the FPC to melt the solder and mount the circuit components on the component mounting portions.

2. 2. The method for manufacturing a component-mounted FPC according to claim 1, further comprising a plate installation step of installing a plate so as to cover a part of the FPC body and a part of the FPC arm portion while exposing the component installation portion.

3. a bridge cutting step of cutting the bridge, 3. The method for manufacturing a component-mounted FPC according to claim 1, wherein the bridge cutting step is performed after the mounting step.

4. A method for manufacturing a component-mounted FPC in which a circuit component is solder-bonded to an FPC, comprising the steps of: an FPC forming process for forming the FPC integrally including an FPC body, an FPC arm portion branching off from the FPC body, a component mounting portion provided at an end of the FPC arm portion on which the circuit components are mounted, and an extension portion extending from an end edge of the component mounting portion; a component mounting step of mounting the circuit component on the component mounting portion via solder; a plate installation process for installing a plate so as to cover at least a portion of the extension portion and expose the component installation portion; a mounting step of heating the FPC to melt the solder and mount the circuit components on the component mounting portions.

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