Connection state determination system and semiconductor device

Abstract

To provide a connection determination system and a semiconductor device, capable of determining a connection state of a bonding wiring in a multi-wiring bonding.SOLUTION: A connection state determination system 2 is related to a plurality of bonding wirings 24a to 24e each of which is to be connected to one corresponding bonding pad among a plurality of bonding pads 22a to 22e of a semiconductor chip 10, and to a reference electrode 20, and comprises: a determination circuit 34 that determines a connection state of each bonding wire; a multiplexer 16 that receives a plurality of input voltages each in accordance with each voltage of the one corresponding bonding pad among the plurality of bonding pads, and outputs the voltage selected from the plurality of input voltages; and a current source 140 that supplies a current to each bonding wire without passing through the multiplexer. The determination circuit determines a connection state of each bonding wire corresponding to the selected input voltage on the basis of the voltage output by the multiplexer.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a connection state determination system and a semiconductor device. [Background technology]

[0002] Conventionally, wire bonding has been performed to connect electrodes of a semiconductor chip to electrodes of a substrate or the like with wires (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-254984 A

[0004] [overview] However, multi-wire bonding may be performed in which a single electrode is connected to a plurality of electrodes using a plurality of bonding wires, and a technique for determining the connection state of these bonding wires is required.

[0005] The present disclosure has been made in view of the above circumstances, and one of its exemplary objectives is to provide a connection determination system and a semiconductor device capable of determining the connection state of bonding wires in multi-wire bonding.

[0006] A connection state determination system according to an embodiment of the present disclosure includes a determination circuit for determining the connection state of a plurality of bonding wires to be connected to a corresponding one of a plurality of bonding pads of a semiconductor chip and a reference electrode, a multiplexer for receiving a plurality of input voltages corresponding to the voltages of the corresponding one of the plurality of bonding pads and outputting a voltage selected from the plurality of input voltages, and a current source for supplying a current to the bonding wires without passing through the multiplexer. The determination circuit determines the connection state of the bonding wire corresponding to the selected input voltage based on the voltage output by the multiplexer.

[0007] A semiconductor device according to another embodiment of the present disclosure includes a semiconductor chip, a reference electrode, a plurality of bonding pads each connected to an internal circuit of the semiconductor chip, a plurality of bonding wires to be connected to a corresponding one of the bonding pads and the reference electrode, and a determination device for determining the connection state of the bonding wires. The semiconductor chip includes a multiplexer that receives a plurality of input voltages corresponding to a corresponding one of the bonding pads and outputs a voltage selected from the plurality of input voltages, and a current source that supplies a current to the bonding wires without passing through the multiplexer. The determination device determines the connection state of the bonding wire corresponding to the selected input voltage based on the voltage output by the multiplexer.

[0008] Any combination of the above components and conversion of the expressions of the present disclosure between methods, devices, systems, etc. are also valid aspects of the present disclosure. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing the back surface of a semiconductor chip according to a reference technique. [Diagram 2] FIG. 2 is a circuit diagram of a semiconductor device according to a reference technique. [Diagram 3] FIG. 3 is a block diagram of a semiconductor device according to an embodiment of the present disclosure. [Figure 4] FIG. 4 is a diagram for explaining an example of the configuration of the semiconductor chip and the determination device according to the embodiment. [Diagram 5] FIG. 5 is a diagram for explaining an example of an operation for determining the connection state of a bonding wire.

[0010] [Detailed Description] (overview) A summary of some exemplary embodiments of the present disclosure will be described. This summary is intended to provide a simplified overview of some concepts of one or more embodiments for a basic understanding of the embodiments as a prelude to the detailed description that follows, and is not intended to limit the scope of the invention or disclosure. This summary is not intended to be an exhaustive overview of all possible embodiments, nor is it intended to identify key elements of all embodiments or to delineate the scope of some or all aspects. For convenience, the term "one embodiment" may be used to refer to one embodiment (example or variant) or multiple embodiments (examples or variants) disclosed in this specification.

[0011] A connection state determination system according to one embodiment includes a determination circuit for determining the connection state of a plurality of bonding wires to be connected to a corresponding one of a plurality of bonding pads of a semiconductor chip and a reference electrode, a multiplexer for receiving a plurality of input voltages corresponding to the voltages of the corresponding one of the plurality of bonding pads and outputting a voltage selected from the plurality of input voltages, and a current source for supplying a current to the bonding wires without passing through the multiplexer. The determination circuit determines the connection state of the bonding wire corresponding to the selected input voltage based on the voltage output by the multiplexer.

[0012] According to this configuration, the connection state of the bonding wires in multi-wire bonding can be determined without being affected by capacitive coupling in the multiplexer.

[0013] In one embodiment, the connection state determination system may further include a current control circuit disposed between two bonding pads included in the plurality of bonding pads. The current control circuit may be configured such that, when one of the two bonding pads and a bonding wire to be connected to the reference electrode are normally connected, a current to be supplied from the current source to the bonding wire does not flow to the current control circuit, and, when the one of the bonding pads and the bonding wire to be connected to the reference electrode are not normally connected, a current to be supplied from the current source to the bonding wire flows to the current control circuit.

[0014] In one embodiment, the current control circuit may include two diodes connected in parallel opposite each other.

[0015] In one embodiment, the connection state determination system may further include a plurality of switches each arranged between a corresponding one of the plurality of bonding pads and a current source, and when one of the plurality of switches is on and the remaining switches are off, the multiplexer may select an input voltage according to a voltage of the bonding pad corresponding to the on switch.

[0016] A semiconductor device according to another embodiment includes a semiconductor chip, a reference electrode, a plurality of bonding pads each connected to an internal circuit of the semiconductor chip, a plurality of bonding wires to be connected to a corresponding one of the bonding pads and the reference electrode, and a determination device for determining the connection state of the bonding wires. The semiconductor chip includes a multiplexer that receives a plurality of input voltages corresponding to a corresponding one of the bonding pads and outputs a voltage selected from the plurality of input voltages, and a current source that supplies a current to the bonding wires without passing through the multiplexer. The determination device determines the connection state of the bonding wire corresponding to the selected input voltage based on the voltage output by the multiplexer.

[0017] According to this configuration, the connection state of the bonding wires in multi-wire bonding can be determined without being affected by capacitive coupling in the multiplexer.

[0018] Hereinafter, preferred embodiments will be described with reference to the drawings. The same or equivalent components, parts, and processes shown in each drawing will be given the same reference numerals, and duplicated descriptions will be omitted as appropriate. In addition, the embodiments are illustrative and do not limit the disclosure and invention, and all features and combinations thereof described in the embodiments are not necessarily essential to the disclosure and invention.

[0019] In this specification, "a state in which component A is connected to component B" includes not only a case in which component A and component B are directly physically connected to each other, but also a case in which component A and component B are indirectly connected to each other via other components that do not substantially affect the electrical connection state between them or that do not impair the function or effect achieved by their combination.

[0020] Similarly, "a state in which component C is connected (provided) between components A and B" includes not only the case in which components A and C, or components B and C, are directly connected to each other, but also the case in which they are indirectly connected to each other via other components that do not substantially affect the electrical connection between them or that do not impair the functions or effects achieved by their combination.

[0021] (Reference technology and its issues) Fig. 1 is a diagram showing the rear surface of a semiconductor chip 90 according to the reference technology. Fig. 2 is a circuit diagram of a semiconductor device 9 according to the reference technology.

[0022] The semiconductor device 9 according to the reference technology includes a semiconductor chip 90 , a reference electrode 91 , a plurality of bonding pads 92 , a plurality of bonding wires 93 , a voltage source 98 , and a voltage measuring device 99 .

[0023] As shown in FIG. 1, a reference electrode 91 is provided on the back surface of a semiconductor chip 90. The reference electrode 91 is a thermal pad. A reference voltage (ground) is supplied to the reference electrode 91. A plurality of bonding pads 92 are each connected to an internal circuit of the semiconductor chip 90 and provided around the reference electrode 91. A plurality of bonding wires 93 are each connected to the reference electrode 91 and a corresponding one of the plurality of bonding pads 92. A reference voltage is supplied from the reference electrode 91 to the internal circuit of the semiconductor chip 90 via the bonding wire 93 and the bonding pad 92.

[0024] Fig. 2 shows five bonding pads 92a-92e and five bonding wires 93a-93e out of the multiple bonding pads 92 and multiple bonding wires 93 shown in Fig. 1. As shown in Fig. 2, the semiconductor chip 90 has wirings 94a-94e, a multiplexer 95, and connection terminals 96 and 97.

[0025] Multiplexer 95 includes an input circuit 950 , a force selection circuit 956 and a sense selection circuit 958 .

[0026] The input circuit 950 includes five input nodes 952a-952e. The input nodes 952a-952e include resistors 954a-954e. One end of the input nodes 952a-952e is connected to the corresponding bonding pads 92a-92e via the corresponding wirings 94a-94e. The other ends of the input nodes 952a-952e are connected to a force selection circuit 956 and a sense selection circuit 958, respectively. Voltages V91-V95 at the other ends of the input nodes 952a-952e correspond to the voltages Va9-Ve9 of the corresponding bonding pads 92a-92e, and are input to the sense selection circuit 958, respectively.

[0027] The force selection circuit 956 is connected to a voltage source 98 via a connection terminal 96. The force selection circuit 956 selects one of the input nodes 952a to 952e, and causes a current If supplied from the voltage source 98 to flow through the selected input node.

[0028] The sense selection circuit 958 is connected to the voltage measuring device 99 via a connection terminal 97. The sense selection circuit 958 selects one of the voltages V91 to V95, and outputs the selected voltage Vs to the voltage measuring device 99.

[0029] When the semiconductor device 9 according to the reference technology judges the connection state of the bonding wire 93a, for example, the force selection circuit 956 passes a current Iw9 through the input node 952a, and the sense selection circuit 958 selects the voltage V91 of the input node 952a and outputs the voltage Vs. This voltage Vs is checked to judge whether the bonding wire 93a is connected normally or not. The state in which the bonding wire 93a is not connected normally is, for example, a state in which the bonding wire 93a is disconnected from the reference electrode 91 or the bonding pad 92a.

[0030] When the bonding wire 93a is normally connected to the reference electrode 91 and the bonding pad 92a, a current I9 flows through the bonding wire 93a (I9=Iw9). If the resistance value of the bonding wire 93a is R9, the resistance value of the wiring 94a is Rw, and the resistance value of the input node 954 is Rm, then the voltage V91 is V91=(R9+Rw+Rm)×Iw9. On the other hand, when the bonding wire 93a is not normally connected, the current I9 does not flow through the bonding wire 93a (I9=0). However, capacitive coupling occurs between the input nodes 952a to 952e of the multiplexer 95, and a voltage V91 corresponding to the voltage due to the capacitive coupling is generated. Therefore, it is not possible to know whether the voltage V91 is a voltage generated by the current I9 flowing through the normally connected bonding wire 93a or a voltage generated by the capacitive coupling between the input nodes 952a to 952e. Therefore, the semiconductor device 9 according to the reference technology cannot accurately determine whether the bonding wire 93a is normally connected.

[0031] (Embodiment) Fig. 3 is a block diagram of a semiconductor device 1 according to an embodiment of the present disclosure. Fig. 4 is a diagram for explaining an example of a configuration of a semiconductor chip 10 and a determination device 30 according to the embodiment. The semiconductor device 1 according to the embodiment includes a semiconductor chip 10, a reference electrode 20, a plurality of bonding pads 22a-22e of the semiconductor chip 10, a plurality of bonding wires 24a-24e, and a determination device 30.

[0032] The reference electrode 20 may be, for example, a thermal pad of the semiconductor chip 10. The reference electrode 20 (reference electrode) and bonding pads 22a to 22e according to this embodiment may be provided on the back surface of the semiconductor chip 10, similar to the reference electrode 91 and bonding pad 92 according to the reference technology. A reference voltage (ground) is supplied to the reference electrode 20.

[0033] Each of the bonding pads 22a to 22e is connected to an internal circuit of the semiconductor chip 10. Each of the bonding wires 24a to 24e is a wire to be connected to a corresponding one of the bonding pads 22a to 22e of the semiconductor chip 10 and the reference electrode 20. A reference voltage is supplied from the reference electrode 20 to the internal circuit of the semiconductor chip 10 via the bonding wires 24a to 24e.

[0034] Although five bonding pads 22a to 22e and five bonding wires 24a to 24e are shown in FIG. 3, the number of bonding pads and the number of bonding wires may each be two to four, or six or more.

[0035] The semiconductor chip 10 may be used, for example, as a digital power supply, etc. The semiconductor chip 10 includes a connection circuit 12, a current supply circuit 14, and a multiplexer 16. In this embodiment, the connection circuit 12, the current supply circuit 14, the multiplexer 16, and the determination device 30 configure a connection state determination system 2.

[0036] The connection circuit 12 connects the bonding pads 22a-22e to the current supply circuit 14. The current supply circuit 14 supplies current to the bonding wires 24a-24e via the connection circuit 12, not via the multiplexer 16. In this embodiment, voltages Va-Ve are generated at the bonding pads 22a-22e in response to the current supplied from the current supply circuit 14. Input voltages V1-V5 corresponding to the voltages Va-Ve are generated between the connection circuit 12 and the current supply circuit 14. These input voltages V1-V5 are input to the multiplexer 16.

[0037] The multiplexer 16 receives a plurality of input voltages V1 to V5 corresponding to the voltages Va to Ve of corresponding ones of the plurality of bonding pads 22a to 22e, and outputs a voltage Vm selected from the plurality of input voltages V1 to V5.

[0038] The determination device 30 determines the connection states of the bonding wires 24a-24e corresponding to the input voltages V1-V5 selected by the multiplexer 16, based on the voltage Vm output by the multiplexer 16. The connection states of the bonding wires 24a-24e to be determined include, for example, a state in which the bonding wires 24a-24e are normally connected to the reference electrode 20 and the bonding pads 22a-22e (short), and a state in which the bonding wires 24a-24e are disconnected from the reference electrode 20 or the bonding pads 22a-22e (open).

[0039] The configurations and functions of the semiconductor chip 10 and the determination device 30 will be described in more detail with reference to Fig. 4. As shown in Fig. 4, the multiplexer 16 includes an input circuit 160 and a selection circuit 168.

[0040] The input circuit 160 receives a plurality of input voltages V1 to V5 corresponding to the voltages Va to Ve of the corresponding bonding pads 22a to 22e, respectively, among the plurality of bonding pads 22a to 22e. The input circuit 160 includes input nodes 162a to 162e. The input nodes 162a to 162e include internal resistors 164a to 164. One end of each of the input nodes 162a to 162e is connected to the connection circuit 12 and the current supply circuit 14. The other end of each of the input nodes 162a to 162e is at the input voltages V1 to V5 and is connected to the selection circuit 168. Although five input nodes 162a to 162e are shown in FIG. 4, the number of input nodes is appropriately adjusted according to the number of bonding pads and the number of bonding wires.

[0041] The selection circuit 168 outputs a voltage Vm selected from a plurality of input voltages V1 to V5. The voltage Vm is input to the determination device 30 via a terminal .

[0042] The connection circuit 12 includes wirings 120a to 120e and current control circuits 124a to 124d.

[0043] Each of the wirings 120a to 120e connects a corresponding one of the input nodes 162a to 162e to a corresponding one of the bonding pads 22a to 22e. The wirings 120a to 120e include wiring resistors 122a to 122e.

[0044] The current control circuits 124a to 124d are arranged between two bonding pads included in the plurality of bonding pads 22a to 22e. More specifically, the current control circuit 124a is arranged between the wiring 120a and the wiring 120b, the current control circuit 124b is arranged between the wiring 120b and the wiring 120c, the current control circuit 124c is arranged between the wiring 120c and the wiring 120d, and the current control circuit 124d is arranged between the wiring 120d and the wiring 120e.

[0045] Here, attention is paid to the current control circuit 124a arranged between the two bonding pads 22a, 22b. The current control circuit 124a is configured so that when one of the two bonding pads 22a, 22b, the bonding pad 22a (or the bonding pad 22b) and the bonding wire 24a (or the bonding wire 24b) to be connected to the reference electrode 20, is normally connected, the current control circuit 124a does not allow the current to be supplied from the current supply circuit 14 to the bonding wire 24a (or the bonding wire 24b) to flow to the current control circuit 124a. Furthermore, the current control circuit 124a is configured so that when one of the bonding pads 22a (or the bonding pad 22b) and the bonding wire 24a (or the bonding wire 24b) to be connected to the reference electrode 20 is not normally connected, the current control circuit 124a allows the current to be supplied from the current supply circuit 14 to the one bonding wire 24a (or the bonding wire 24b) to flow to the current control circuit 124a.

[0046] The current control circuits 124b-124d are configured similarly to the current control circuit 124a. As a result, when the bonding wires 24a-22e are not connected properly, current flows through the current control circuits 124a-124d, and voltages Va-Ve are generated according to the configuration of the current control circuits 124a-124d. This makes it possible to more accurately determine the connection states of the bonding wires 24a-22e based on V1-V5 according to the voltages Va-Ve.

[0047] In this embodiment, each of the current control circuits 124a to 124d is composed of two diodes (hereinafter, also referred to as "opposing diodes") that are connected in parallel and facing each other. By including the opposing diodes in the current control circuits 124a to 124d, the electrical durability of the semiconductor chip 10 can be improved.

[0048] The current supply circuit 14 includes a current source 140 and a plurality of switches 142a-142e. The current source 140 supplies a current to the bonding wires 24a-24e without passing through the multiplexer 16. The current source 140 may be a small current source that supplies a current of, for example, about 10 μA. The plurality of switches 142a-142e are each disposed between the current source 140 and a corresponding one of the bonding pads 22a-22e among the plurality of bonding pads 22a-22e. When the switches 142a-142e are turned on, a current flows from the current source 140 to the wirings 120a-120e corresponding to the turned-on switches 142a-142e, and a current flows to the bonding wires 24a-24e according to the connection states of the bonding wires 24a-24e.

[0049] The determination device 30 includes a measurement circuit 32 and a determination circuit 34. The measurement circuit 32 measures the voltage Vm output by the multiplexer 16. The measurement circuit 32 transmits a signal Sv indicating the measurement result to the determination circuit 34. The determination circuit 34 determines the connection states of the bonding wires 24a-24e corresponding to the input voltages V1-V5 selected by the multiplexer 16 based on the voltage Vm output by the multiplexer 16.

[0050] 5 is a diagram for explaining an example of an operation for determining the connection state of the bonding wire 24a. In this embodiment, for example, when determining the connection state of the bonding wire 24a, the switch 142a corresponding to the bonding wire 24a is turned on, and the remaining switches 142b to 142e are turned off. As a result, the current I1 generated by the current source 140 flows through the wiring 120a via the switch 142a (Iwi=I1). The multiplexer 16 selects an input voltage V1 according to the voltage Va of the bonding pad 22a corresponding to the switch 142a that is turned on, and the determination device 30 determines the connection state of the bonding wire 24a based on the selected voltage Vm.

[0051] When the bonding wire 24a is normally connected to the reference electrode 20 and the bonding pad 22a, the current Iwi flowing through the wiring 120a mainly flows through the bonding wire 24a (Iw1=I1). If the resistance value of the bonding wire 24a is R1, the voltage Va of the bonding pad 22a is Va=R1×I1. If the resistance value of the wiring resistor 122a is R2, the input voltage V1 received by the input node 162a is V1 = (R1 + R2) × I1 (1) It becomes.

[0052] If the bonding wire 24a is not properly connected to the reference electrode 20 and the bonding pad 22a (for example, if the bonding wire 24a is disconnected from the reference electrode 20 or the bonding pad 22a), the current Iw1 does not flow through the bonding wire 24a (Iw1=0). In this case, in the current control circuit 124a, the current Id2 flows in the direction from the wiring 120a to the wiring 120b (Id2=I1). In the current control circuit 124a, a forward voltage Vf of the diode is generated. The forward voltage Vf may be, for example, about 0.7V.

[0053] Furthermore, a current Iw2 (Iw2=I1) flows through the bonding wire 24b via the bonding pad 22b. If the resistance value of the bonding wire 24b is R3, then the voltage Va of the bonding pad 22a is given by Va=R3×I1+Vf. The input voltage V1 is given by V1 = (R3 + R2) × I1 + Vf (2) It becomes.

[0054] If the resistance values ​​R1 and R3 of the bonding wires 24a and 24b are the same, as shown in the above formulas (1) and (2), when the bonding wire 24a is not connected properly, the input voltage V1 is higher by the forward voltage Vf than when the bonding wire 24a is connected properly. Therefore, the determination circuit 34 can determine the connection state of the bonding wire 24a based on the input voltage V1.

[0055] When determining the connection states of the bonding wires 24b-24e, the switches 142b-142e corresponding to the bonding wires 24b-24e to be determined are turned on, and the remaining switches are turned off. The determination circuit 34 can determine the connection states of the bonding wires 24b-24e based on the input voltages V2-V4 corresponding to the bonding wires 24b-24e to be determined.

[0056] The configuration and operation of the semiconductor device 1 according to this embodiment have been described above. According to the semiconductor device 1 according to this embodiment, the current source 140 supplies current to the bonding wires 24a-24e without passing through the multiplexer 16. This makes it possible to determine the connection state of the bonding wires 24a-22e without being affected by capacitive coupling between the input nodes 162a-162e of the multiplexer 16.

[0057] (supplement) Although the embodiments of the present disclosure have been described using specific terms, this description is merely an example to aid in understanding and does not limit the scope of the present disclosure or the claims, and the scope of the present invention is defined by the claims. In addition, not only the embodiments, but also embodiments, examples, and modified examples not described herein are included in the scope of the present invention.

[0058] In the above embodiment, an example in which the current control circuits 124a to 124d are arranged between the wirings 120a to 120e has been described, but the current control circuits 124a to 124d do not need to be arranged. In this case, when the connection state of the bonding wire 24a is judged, as in the above embodiment, only the switch 142a is turned on and the remaining switches 142b to 142e are turned off. When the bonding wire 24a is connected normally, a current flows through the bonding wire 24a, and an input voltage V1 according to the current is generated. On the other hand, when the bonding wire 24a is not connected normally, the current flowing through the wiring 120a does not flow through the bonding wire 24a, and a voltage is generated in a parasitic capacitance generated between the bonding wire 24a and the ground, for example. As a result, an input voltage V1 different from that when the bonding wire 24a is connected normally is generated, and the judgment circuit 34 can judge that the bonding wire 24a is not connected normally based on the input voltage V1.

[0059] In the above embodiment, an example has been described in which each of the current control circuits 124a to 124d includes an opposing diode, but this is not limiting, and each of the current control circuits 124a to 124d may be composed of one diode. In this case, in addition to the current control circuits 124a to 124d, a diode may be further provided between the bonding pad 22a and the bonding pad 22e.

[0060] When determining the connection state of the bonding wires 24a-24e, the corresponding switches 142a-142e are turned on and the remaining switches are turned off. If the bonding wires 24a-24e are connected normally, a current flows through the bonding wires 24a-24e corresponding to the turned-on switches, and input voltages V1-V5 corresponding to the voltages generated in the bonding wires 24a-24e are generated. If the bonding wires 24a-24e are not connected normally, a current flows through the diodes, and input voltages V1-V5 corresponding to the forward voltages of the diodes are generated. It is possible to determine the connection state of the bonding wires 24a-24e based on the input voltages V1-V5 corresponding to the connection state of the bonding wires 24a-24e.

[0061] (Additional Note) One aspect of the technology disclosed in this specification can be understood as follows.

[0062] (Item 1) a determination circuit for determining a connection state of a plurality of bonding wires to be connected to a corresponding one of a plurality of bonding pads of a semiconductor chip and a reference electrode; a multiplexer that receives a plurality of input voltages each corresponding to a voltage of a corresponding one of the plurality of bonding pads and outputs a voltage selected from the plurality of input voltages; a current source that supplies a current to the bonding wire without passing through the multiplexer; the determination circuit determines a connection state of a bonding wire corresponding to the selected input voltage based on a voltage output by the multiplexer; Connection status determination system.

[0063] (Item 2) A current control circuit is further provided between two bonding pads included in the plurality of bonding pads, the current control circuit is configured such that, when one of the two bonding pads and a bonding wire to be connected to the reference electrode are normally connected, a current to be supplied from the current source to the bonding wire does not flow to the current control circuit, and, when the one of the two bonding pads and a bonding wire to be connected to the reference electrode are not normally connected, a current to be supplied from the current source to the bonding wire flows to the current control circuit. Item 2. A connection status determination system according to item 1.

[0064] (Item 3) The current control circuit includes two diodes connected in parallel opposite to each other. Item 3. A connection status determination system according to item 2.

[0065] (Item 4) Further comprising a plurality of switches each disposed between a corresponding one of the plurality of bonding pads and the current source; the multiplexer selects an input voltage according to a voltage of a bonding pad corresponding to the on switch when one switch of the plurality of switches is on and the remaining switches are off. A connection state determination system according to any one of items 1 to 3.

[0066] (Item 5) A semiconductor chip; A reference electrode; a plurality of bonding pads each connected to an internal circuit of the semiconductor chip; a plurality of bonding wires to be connected to corresponding ones of the plurality of bonding pads and the reference electrode, respectively; a determination device for determining a connection state of the bonding wire, the semiconductor chip includes a multiplexer that receives a plurality of input voltages each corresponding to a voltage of one of the plurality of bonding pads and outputs a voltage selected from the plurality of input voltages, and a current source that supplies a current to the bonding wire without passing through the multiplexer; the determination device determines a connection state of a bonding wire corresponding to the selected input voltage based on a voltage output by the multiplexer; Semiconductor device. [Explanation of symbols]

[0067] 1 semiconductor device, 2 connection state determination system, 10 semiconductor chip, 12 connection circuit, 14 current supply circuit, 16 multiplexer, 20 reference electrode, 22a to 22e bonding pads, 24a to 24e bonding wires, 30 determination device, 32 measurement circuit, 34 determination circuit, 120a to 120e wiring, 122a to 122e wiring resistance, 124a to 124e current control circuit, 140 current source, 142a to 142e switch, 160 input circuit, 162a to 162e input node, 164a to 164e internal resistance, 168 selection circuit.

Claims

1. a determination circuit for determining a connection state of a plurality of bonding wires to be connected to a corresponding one of a plurality of bonding pads of a semiconductor chip and a reference electrode; a multiplexer that receives a plurality of input voltages each corresponding to a voltage of a corresponding one of the plurality of bonding pads and outputs a voltage selected from the plurality of input voltages; a current source that supplies a current to the bonding wire without passing through the multiplexer; the determination circuit determines a connection state of a bonding wire corresponding to the selected input voltage based on a voltage output by the multiplexer; Connection status determination system.

2. A current control circuit is further provided between two bonding pads included in the plurality of bonding pads, the current control circuit is configured such that, when one of the two bonding pads and a bonding wire to be connected to the reference electrode are normally connected, a current to be supplied from the current source to the bonding wire does not flow to the current control circuit, and, when the one of the two bonding pads and a bonding wire to be connected to the reference electrode are not normally connected, a current to be supplied from the current source to the bonding wire flows to the current control circuit. The connection status determination system according to claim 1 .

3. The current control circuit includes two diodes connected in parallel opposite to each other. The connection status determination system according to claim 2 .

4. Further comprising a plurality of switches each disposed between a corresponding one of the plurality of bonding pads and the current source; the multiplexer selects an input voltage according to a voltage of a bonding pad corresponding to the on-switch when one switch of the plurality of switches is on and the remaining switches are off; The connection state determination system according to any one of claims 1 to 3.

5. A semiconductor chip; A reference electrode; a plurality of bonding pads each connected to an internal circuit of the semiconductor chip; a plurality of bonding wires to be connected to corresponding ones of the plurality of bonding pads and the reference electrode, respectively; a determination device for determining a connection state of the bonding wire, the semiconductor chip includes a multiplexer that receives a plurality of input voltages each corresponding to a voltage of one of the plurality of bonding pads and outputs a voltage selected from the plurality of input voltages, and a current source that supplies a current to the bonding wire without passing through the multiplexer; the determination device determines a connection state of a bonding wire corresponding to the selected input voltage based on a voltage output by the multiplexer; Semiconductor device.

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