Alignment device, film deposition apparatus, alignment method and method for manufacturing electronic device

Abstract

To provide: an alignment device capable of further enhancing the accuracy of position control between a mask and a substrate; a film deposition apparatus; an alignment method; and a method for manufacturing an electronic device.SOLUTION: An alignment device includes: an electrostatic adsorption plate 20 for holding a substrate S; a support member 30 for supporting the electrostatic adsorption plate 20; a position control mechanism 100 for moving the support member 30 in at least one direction of a first direction parallel to the film deposition surface of the substrate S and a second direction vertical to the film deposition surface to control a position between a mask M mounted on a mask stand 41 and the substrate S; and slight movement position control means 200 for controlling the position between the mask M and the substrate S by slightly moving the electrostatic adsorption plate 20.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an alignment apparatus, a film forming apparatus, an alignment method, and a method for manufacturing an electronic device. [Background technology]

[0002] In the manufacture of electronic devices such as organic electroluminescence displays, a thin film is formed on a substrate through a mask. As a pretreatment for film formation, the position adjustment (alignment) between the mask and the substrate is performed. For example, the position adjustment is performed by moving a support member that supports an electrostatic adsorption plate (electrostatic chuck) that holds the substrate in a direction parallel to the film formation surface of the substrate and in a direction perpendicular to the film formation surface (see Patent Document 1).

[0003] However, in recent years, the size of the substrate has been getting larger and larger, and the size of the apparatus has also been getting larger. In addition, while the vacuum chamber in the film forming apparatus is getting larger, the rigidity of the members constituting the vacuum chamber tends to decrease due to weight restrictions, and the influence of vibration is also increasing. Therefore, it is becoming difficult to precisely adjust the positions of the mask and the substrate by only adjusting the position of the support member, as in the above technology. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2022-57673 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide an alignment apparatus, a film forming apparatus, an alignment method, and a method for manufacturing an electronic device that can improve the accuracy of position adjustment between a mask and a substrate. [Means for solving the problem]

[0006] The present invention employs the following means to solve the above problems.

[0007] That is, the alignment device of the present invention has A substrate holding member for holding a substrate; A support member for supporting the substrate holding member; a position adjustment mechanism that adjusts a position of the substrate and a mask placed on a mask table by moving the support member in at least one of a first direction parallel to a deposition surface of the substrate and a second direction perpendicular to the deposition surface; a fine movement position adjustment means for adjusting the positions of the mask and the substrate by finely moving the substrate holding member; The present invention is characterized by comprising:

[0008] In addition, the film forming apparatus of the present invention includes The above alignment device; a film formation source for forming a thin film on the substrate through the mask in a state in which the positions of the mask and the substrate are adjusted by the alignment device; The present invention is characterized by comprising:

[0009] Further, the alignment method of the present invention includes the steps of: a first position adjustment step of adjusting the position of a mask placed on a mask table and a substrate by moving a support member supporting a substrate holding member in at least one of a first direction parallel to a deposition surface of a substrate held by the substrate holding member and a second direction perpendicular to the deposition surface, using a position adjustment mechanism; a second position adjustment step of adjusting the positions of the mask and the substrate by finely moving the substrate holding member using a fine movement position adjustment means; The present invention is characterized by having the following.

[0010] Furthermore, the method for producing an electronic device of the present invention includes the steps of: The method is characterized by comprising a film formation step of forming a thin film on the substrate through the mask using a film formation source after the positions of the mask and the substrate are adjusted by the above alignment method. Effect of the Invention

[0011] As described above, according to the present invention, the accuracy of the position adjustment between the mask and the substrate can be further improved. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic configuration diagram of a film forming apparatus according to a first embodiment. [Diagram 2] FIG. 3 is a plan view of a support member according to the first embodiment. [Diagram 3] FIG. [Figure 4] FIG. 11 is a schematic configuration diagram showing a part of a support member according to a second embodiment. [Diagram 5] FIG. 11 is a schematic configuration diagram of a film forming apparatus according to a third embodiment. [Figure 6] FIG. 1 is an explanatory diagram of an organic EL display device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The following is a detailed description of the embodiments of the present invention. However, the following embodiments merely exemplify preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Furthermore, the hardware and software configurations, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the device in the following description are not intended to limit the scope of the present invention to these alone, unless otherwise specified.

[0014] Example 1 With reference to Figs. 1 to 3, an alignment apparatus according to a first embodiment of the present invention, a film forming apparatus including the alignment apparatus, an alignment method, and a manufacturing method for an electronic device will be described. The film forming apparatus according to this embodiment is an apparatus for depositing a film forming material on the surface of a substrate through a mask to form a thin film. Examples of the film forming method include vacuum deposition and sputtering. By aligning the substrate and the mask and performing film formation, a thin film having a pattern corresponding to the opening pattern of the mask is formed on the substrate. When multiple layers are formed on a substrate, the layer already formed up to the previous process may also be referred to as the "substrate". The film forming apparatus according to this embodiment performs alignment to adjust the relative positions of the substrate and the mask in order to perform thin film formation through the mask with high accuracy.

[0015] Examples of the substrate material include glass, semiconductors such as silicon, films of polymeric materials, metals, etc. Examples of the substrate include silicon wafers and substrates on which films such as polyimide are laminated. Examples of the film forming material include organic materials and inorganic materials (metals, metal oxides), etc. Examples of the mask include metal masks having an opening pattern corresponding to the thin film pattern to be formed on the substrate. Examples of the electronic devices manufactured by the manufacturing method of this embodiment include various electronic devices such as semiconductor devices, magnetic devices, and electronic components, optical components, Examples of the material include light-emitting elements, photoelectric conversion elements, touch panels, display devices equipped with light-emitting elements (e.g., organic EL display devices), lighting devices (e.g., organic EL lighting devices), and sensors equipped with photoelectric conversion elements (e.g., organic CMOS image sensors). In particular, the material is suitable for manufacturing organic light-emitting elements such as OLEDs and organic photoelectric conversion elements such as organic thin-film solar cells.

[0016] Hereinafter, the direction parallel to the deposition surface of the substrate is referred to as the first direction, and the direction perpendicular to the deposition surface of the substrate is referred to as the second direction. In the XYZ axes shown in FIG. 1, the X-axis direction and the Y-axis direction are included in the first direction, and the Z-axis direction corresponds to the second direction. Rotation around the Z-axis is referred to as the θ direction. The θ direction is also included in the first direction. In this embodiment, the XY plane is parallel to the horizontal plane, and the Z direction is parallel to the vertical direction.

[0017] <Film forming equipment> 1 is a schematic diagram of a film formation apparatus 1 according to the first embodiment, and is a cross-sectional view showing the schematic configuration of the film formation apparatus 1. The film formation apparatus 1 forms a film on a film formation surface of a substrate S via a mask M. In the film formation apparatus 1, a series of film formation processes are performed, such as delivery of the substrate S and the mask M to a transport device that carries the substrate S and the mask M from the outside into the film formation apparatus 1, adjustment of the relative positions of the substrate S and the mask M (alignment), fixing the mask M and the substrate S, and film formation.

[0018] The film forming apparatus 1 has a vacuum chamber 10. The inside of the vacuum chamber 10 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. The film forming apparatus 1 includes an electrostatic attraction plate 20 (electrostatic chuck (ESC)) as a substrate holding member for holding a substrate S, a support member 30 for supporting the electrostatic attraction plate 20, a mask support member 40 for supporting a mask M, and an evaporation source 50 as a film formation source. The electrostatic attraction plate 20, the lower part of the support member 30, the mask support member 40, and the evaporation source 50 are disposed inside the vacuum chamber 10.

[0019] The support member 30 integrally includes a flat stage 31, a support portion 32 extending in the Z-axis direction (second direction), and a holder 33 for holding the electrostatic adsorption plate 20. The mask support member 40 is provided with a mask table 41 on which the mask M is placed. The mask M has an opening pattern corresponding to the thin film to be formed on the film formation surface of the substrate S. For example, the mask M may be a metal mask having a structure in which a metal foil having an opening pattern is stretched over a highly rigid frame. In this embodiment, after the substrate S and the mask M are aligned, the substrate S is placed on the mask M and film formation is performed.

[0020] The evaporation source 50 is composed of a crucible for accommodating the evaporation material, a heater for heating the crucible, an openable / closable shutter for controlling the scattering of the evaporation material, an evaporation rate monitor, and the like. The film forming apparatus 1 may be provided with a driving mechanism for moving the evaporation source 50. The film thickness on the substrate S can be made uniform by performing film formation while moving the evaporation source 50 by the operation of the driving mechanism. The driving mechanism may be configured to retreat the evaporation source 50 to a predetermined position (home position) except during film formation, and to move the evaporation source 50 when film formation is started. Since the film forming apparatus 1 of this embodiment is a vacuum deposition apparatus, an evaporation source 50 that heats and evaporates a film formation material (evaporation material) is used as a film formation source. However, the film formation source is not limited to the evaporation source 50, and may be, for example, a sputtering apparatus using a sputtering target. The evaporation source 50 plays a role in forming a film on the substrate S through the mask M after the substrate S and the mask M are in close contact with each other.

[0021] A cooling plate may be provided to suppress the temperature rise of the substrate S during film formation. The cooling plate cools the substrate S, thereby suppressing the alteration and deterioration of the organic material. This cooling plate may also serve as a magnet plate to enhance the adhesion between the substrate S and the mask M during film formation by attracting the mask M by magnetic force. FIG. 1 also shows a configuration in which a magnet plate 70 is provided. This magnet plate 70 is configured to be movable up and down, and when the magnet plate 70 approaches the substrate S after the substrate S and the mask M are aligned, the mask M is attracted by magnetic force, thereby enhancing the adhesion between the substrate S and the mask M.

[0022] The film forming apparatus 1 also has a control unit 60. The control unit 60 has a function of controlling various mechanisms, the evaporation source 50, and film formation. The control unit 60 can be configured, for example, by a computer having a processor, memory, storage, I / O, and the like. In this case, the function of the control unit 60 is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 60 may be configured by a circuit such as an ASIC or FPGA. Note that a control unit 60 may be provided for each film forming apparatus 1, or one control unit may control multiple film forming apparatuses 1.

[0023] The film forming apparatus 1 according to this embodiment has a function as an alignment apparatus that adjusts (aligns) the positions of the substrate S and the mask M. As main components that perform this function, the apparatus is provided with a position adjustment mechanism 100 and fine movement position adjustment means 200.

[0024] The position adjustment mechanism 100 has the function of adjusting the position of the mask M placed on the mask table 41 and the substrate S by moving the support member 30 in at least one of a first direction parallel to the deposition surface of the substrate S and a second direction perpendicular to the deposition surface.

[0025] The position adjustment mechanism 100 will be described in more detail below. The position adjustment mechanism 100 is provided with a substrate Z actuator 110 that raises and lowers the entire support member 30 in the Z-axis direction (second direction) at an upper portion outside the vacuum chamber 10. This actuator is composed of, for example, a motor and a ball screw, or a motor and a linear guide, etc.

[0026] The position adjustment mechanism 100 is provided with an alignment stage 120 at an upper portion outside the vacuum chamber 10. This alignment stage 120 can move the substrate S in a first direction (more specifically, move in the XY directions and rotate in the θ direction) to change the position relative to the mask M. The alignment stage 120 includes a chamber fixing part 121 connected and fixed to the vacuum chamber 10, an actuator part 122 for performing XYθ movement, and a connection part 123 connected to the support member 30.

[0027] The actuator section 122 may be an actuator in which an X actuator, a Y actuator, and a θ actuator are stacked. Alternatively, a UVW type actuator in which a plurality of actuators work together may be used. Regardless of the type of actuator section 122, it can be driven in accordance with a control signal transmitted from the control section 60 to move the substrate S in the first direction. The control signal corresponds to operation amount information of each XYθ actuator in the case of a stacked type actuator, and corresponds to operation amount information of each UVW actuator in the case of a UVW type actuator.

[0028] The fine movement position adjustment means 200 has a function of adjusting the positions of the mask M and the substrate S by acting on the support member 30 to finely move the electrostatic attraction plate 20. The fine movement position adjustment means 200 will be described in more detail below.

[0029] The fine adjustment position adjustment means 200 in this embodiment has the function of adjusting the position by deforming a part of the support member 30, and more specifically, has the function of deforming a part of the support member 30 by utilizing magnetic force.

[0030] The fine adjustment position adjustment means 200 includes a stator 210 fixed to the mask support member 40, and a mover 220 fixed to the holder 33 of the support member 30. In FIG. 2, the position where the stator 210 is disposed is indicated by a dotted line with respect to the plan view showing the main configuration of the support member 30. It shows.

[0031] By changing the value of the current flowing through the coil built into the stator 210, it is possible to generate the required thrust by the Lorentz force that is generated on the magnet built into the mover 220. If necessary, it is also possible to cover the coil built into the stator 210 with a water-cooling jacket and actively cool it by running a coolant through it.

[0032] In this embodiment, the movers 220 are disposed at four corners on the upper surface of the holding portion 33 of the support member 30. The stators 210 are disposed so as to face these movers 220, respectively. Although simplified in the figure, the movers 220 and the stators 210 are configured to generate thrust in three directions, X, Y, and Z, for each combination. The stators 210 are also provided with three built-in coils in order to generate thrust in three directions, X, Y, and Z. This makes it possible to apply force (magnetic force) in the X, Y, and Z directions to the corners of the holding portion 33 of the support member 30.

[0033] With the above configuration, by controlling the amount of electricity passed through the coils built into each stator 210, a magnetic force can be applied to the corners of the holding portion 33 of the support member 30, deforming part of the support portion 32 together with the holding portion 33, thereby slightly moving the electrostatic adsorption plate 20.

[0034] An alignment method using the alignment device configured as above will be described. FIG. 3 shows an example of the positional relationship between the mask alignment mark M1 formed on the mask M and the substrate alignment mark S1 formed on the substrate S. These alignment marks are provided so as to be photographed by an alignment camera C provided in the film forming device 1. The alignment camera C is disposed on the outer upper surface of the vacuum chamber 10, and the electrostatic adsorption plate 20 has a through hole in a portion corresponding to the field of view of the alignment camera C, or the portion corresponding to the field of view is made of a light-transmitting member. This allows the alignment camera C to photograph the alignment mark M1 and the alignment mark S1.

[0035] The sensor of the alignment camera C is preferably sensitive to infrared wavelengths, in which case it is possible to photograph the alignment mark M1 by transmitting the light through the substrate S. In order to ensure the mark contrast within the field of view and increase the mark recognition rate, it is desirable to adopt a configuration in which a light source is installed on the mask stage 41, light is irradiated from below the mask M, and the light is received by the sensor of the alignment camera C.

[0036] FIG. 3(a) shows an example of the positional relationship between the alignment mark M1 and the alignment mark S1 before alignment. First, the position adjustment mechanism 100 moves and adjusts the entire support member 30 to adjust the position (first position adjustment step). That is, the control unit 60 moves the support member 30 by the substrate Z actuator 110 to move the substrate S attracted to the electrostatic adsorption plate 20 to a predetermined alignment position. In this state, the control unit 60 moves and adjusts the alignment stage 120 based on image data captured by the alignment camera C, thereby adjusting the position of the substrate S so that the distance between the alignment mark M1 and the alignment mark S1 falls within a predetermined threshold value. Note that the position adjustment is performed on the multiple alignment marks M1 and the alignment mark S1 until they all fall within the threshold value. FIG. 3(b) shows an example of the positional relationship between the alignment mark M1 and the alignment mark S1 after the position adjustment by the position adjustment mechanism 100.

[0037] Next, the position adjustment is performed by the fine movement position adjustment means 200 (second position adjustment step). That is, the alignment camera in a state where the position adjustment is performed by the position adjustment mechanism 100 Based on the image data obtained by the image sensor 20, the control unit 60 controls the amount of current to the coils built into each of the stators 210. As a result, the electrostatic attraction plate 20 is finely moved, and the position of the substrate S is adjusted so that the distance between the alignment mark M1 and the alignment mark S1 falls within a predetermined threshold value. The threshold value when the position adjustment is performed by the fine movement position adjustment means 200 is set to a value smaller than the threshold value when the position adjustment is performed by the position adjustment mechanism 100. FIG. 3(c) shows an example of the positional relationship between the alignment mark M1 and the alignment mark S1 after the position adjustment is performed by the fine movement position adjustment means 200. Here, the fine movement position adjustment means 200 according to this embodiment can also adjust the Z-axis direction (second direction) of the electrostatic attraction plate 20, so that it is also possible to adjust the parallelism between the electrostatic attraction plate 20 (or the substrate S attracted thereto) and the mask M. This point will be described below. Generally, the mask M is replaced with a new mask M every several tens of times because the film forming material accumulates over time in the openings through which the film forming material passes. As the size of the mask M increases, the flatness of the mask M tends to decrease. Therefore, even if the flatness of the mask stage 41 is kept constant, the parallelism between the electrostatic adsorption plate 20 and the mask M may change when the mask M is replaced. Therefore, a sensor (not shown) is provided to measure the distance between the electrostatic adsorption plate 20 (or the substrate S adsorbed thereto) and the mask M at multiple points, and the parallelism between the electrostatic adsorption plate 20 and the mask M (parallelism between the substrate S and the mask M) can be optimized by adjusting the fine movement position adjustment means 200 so that the distances at each point are equal (in reality, the difference in distance between each point falls within a predetermined threshold). As a result, even when the mask M is replaced with a new one, the degree of adhesion between the substrate S and the mask M can be increased when the substrate S and the mask M are brought into contact with each other to form a film after alignment, and the film formation accuracy can be improved.

[0038] After the above-mentioned position adjustment (alignment) has been performed, the substrate S is placed on the mask M, and a film forming operation is performed to form a thin film on the substrate S through the mask M using the evaporation source 50 (film forming step).

[0039] As described above, in this embodiment, after the position adjustment is performed by the position adjustment mechanism 100, the position adjustment is performed by the fine position adjustment means 200. Therefore, even if it is difficult to perform highly accurate position adjustment of the mask M and the substrate S only by the position adjustment mechanism 100 due to the large size of the film forming apparatus 1 or vibration of the vacuum chamber 10, the position adjustment by the fine position adjustment means 200 can improve the accuracy of the position adjustment.

[0040] Example 2 Fig. 4 shows a second embodiment of the present invention. In this embodiment, a case where the configuration of the support member is different from that of the first embodiment will be described. Since the other configurations and functions are the same as those of the first embodiment, the same components are given the same reference numerals and the description thereof will be omitted.

[0041] 4 is a schematic diagram showing a part of the support member according to this embodiment, showing the appearance near the support member. In the film forming apparatus according to this embodiment, only the configuration related to the support portion is different from that of the first embodiment, and therefore, in the following description, only the configuration related to the support portion will be described. The support member according to this embodiment also includes a support portion 32 and a holding portion 33 that holds the electrostatic attraction plate 20. In this embodiment, the support portion 32 includes a first rigid portion 32a and a second rigid portion 32b that is provided closer to the portion that holds the electrostatic attraction plate 20 than the first rigid portion 32a and has a lower rigidity than the first rigid portion 32a.

[0042] As described in the first embodiment, by controlling the amount of electricity supplied to the coil built in the stator 210, a magnetic force acts on the corners of the holding portion 33 of the support member 30, and part of the support column 32 deforms together with the holding portion 33, causing the electrostatic attraction plate 20 to move slightly. Since the pillars 32 are difficult to deform, the electrostatic attraction plate 20 is difficult to move slightly. By adopting a configuration in which the pillars 32 have the second rigid portion 32b with low rigidity as in this embodiment, the electrostatic attraction plate 20 can be easily moved slightly. Therefore, the position adjustment by the fine movement position adjustment means 200 can be performed more smoothly than in the first embodiment. However, when a configuration having the second rigid portion 32b with low rigidity is adopted, the influence of vibration transmitted from the vacuum chamber 10 to the electrostatic attraction plate 20 through the support member increases. Therefore, it is preferable to adopt a configuration in which the second rigid portion 32b is provided with a damping body 32c made of a damping material. This makes it possible to suppress the vibration transmitted to the electrostatic attraction plate 20.

[0043] Example 3 FIG. 5 shows a third embodiment of the present invention. In the first embodiment, the fine adjustment means acts on the support member to finely move the substrate holding member, thereby adjusting the position between the mask and the substrate. In contrast, in the present embodiment, the fine adjustment means acts on the substrate holding member to finely move the substrate holding member, thereby adjusting the position between the mask and the substrate. Since the other configurations and functions are the same as those in the first embodiment, the same components are given the same reference numerals, and the description thereof will be omitted as appropriate. As in FIG. 1 shown in the first embodiment, in the XYZ axes shown in FIG. 5, the X-axis direction and the Y-axis direction are included in the first direction, and the Z-axis direction corresponds to the second direction.

[0044] 5 is a schematic cross-sectional view of a film forming apparatus 1A according to Example 3. The film forming apparatus 1A according to this example also includes a vacuum chamber 10, an electrostatic attraction plate 20A (electrostatic chuck (ESC)), a support member 30A, a mask support member 40A, an evaporation source 50, and a control unit 60.

[0045] The support member 30A according to this embodiment also integrally includes a flat plate-shaped stage 31 and a support column 32 extending in the Z-axis direction (second direction). In the support member 30A according to this embodiment, a damper mechanism 34 is fixed to the lower part of the support column 32. The electrostatic attraction plate 20A is fixed via the damper mechanism 34. This makes it possible to suppress the transmission of vibration to the electrostatic attraction plate 20A.

[0046] The mask support member 40A includes a support column 45 extending in the Z-axis direction (second direction), a mask table 46 supporting the mask M, a damper mechanism 47 for suppressing vibration of the mask table 46, and an actuator 48 for moving the support column 45 in the Z-axis direction. Since the mask table 46 is fixed to the support column 45 via the damper mechanism 47, it is possible to suppress transmission of vibration to the mask table 46.

[0047] The film formation source is not limited to the evaporation source 50, and may be, for example, a sputtering device using a sputtering target, as described in the first embodiment. In addition, a cooling plate for suppressing an increase in temperature of the substrate S may be provided, or a configuration in which a magnet plate 70 is provided may be adopted, as described in the first embodiment.

[0048] The film forming apparatus 1 according to this embodiment has a function as an alignment apparatus that adjusts (aligns) the position of the substrate S and the mask M. As main components that perform this function, the apparatus is provided with a position adjustment mechanism 100 and fine movement position adjustment means 200A. The position adjustment mechanism 100 is as described in the first embodiment, and therefore a description thereof will be omitted.

[0049] The fine movement position adjustment means 200A according to this embodiment has a function of acting on the electrostatic attraction plate 20A to finely move the electrostatic attraction plate 20A, thereby adjusting the positions of the mask M and the substrate S. More specifically, the fine movement position adjustment means 200A employs a configuration that finely moves the electrostatic attraction plate 20A by utilizing a magnetic force.

[0050] The fine adjustment position adjustment means 200A includes a stator 250 provided on the mask stage 46 and a mover 260 provided on the electrostatic adsorption plate 20A. As in the first embodiment, the Lorentz force generated on the magnet built in the mover 260 can generate a required thrust by changing the current value flowing through the coil built in the stator 250. The stator 250 and the mover 260 are arranged in a plurality of locations. As in the first embodiment, the mover 260 and the stator 250 are configured to generate thrust in three directions, X, Y, and Z, for each combination, and the stator 250 is also provided with three coils built in it in order to generate thrust in the three directions, X, Y, and Z.

[0051] With the above configuration, by controlling the amount of current passed through the coils built into each stator 250, a magnetic force is applied to each mover 260, and the electrostatic attraction plate 20A can be slightly moved. In this embodiment, a plurality of optical scales 270 are arranged on the electrostatic attraction plate 20A, and an optical encoder 280 is provided on the mask table 46 at a position facing each optical scale 270. As a result, the relative positional relationship between the electrostatic attraction plate 20A and the mask table 46 can be measured with high precision, thereby enabling highly accurate alignment.

[0052] The alignment method using the alignment device configured as above is the same as that in Example 1, except for the position adjustment by the fine movement position adjustment means 200A (second position adjustment step). Therefore, the position adjustment by the fine movement position adjustment means 200A will mainly be described.

[0053] In this embodiment, before the substrate S held by the electrostatic adsorption plate 20A and the mask M placed on the mask table 46 come into contact with each other, the position adjustment mechanism 100 performs a position adjustment (first position adjustment step). Then, after the first position adjustment step is performed, the substrate S is placed on the mask M, and after the substrate S and the mask M come into contact with each other, the position adjustment is performed by the fine movement position adjustment means 200A while they are in contact with each other (second position adjustment step).

[0054] In the position adjustment by the fine position adjustment means 200A, the control unit 60 controls the amount of current to the coils built into each of the stators 250 based on image data obtained by the alignment camera C in a state in which the position adjustment by the position adjustment mechanism 100 has been performed. This causes the electrostatic attraction plate 20A to finely move, and adjusts the position of the substrate S so that the distance between the alignment mark M1 and the alignment mark S1 falls within a predetermined threshold value. Note that, like in the first embodiment, the threshold value when the position adjustment by the fine position adjustment means 200A is set to a value smaller than the threshold value when the position adjustment by the position adjustment mechanism 100 is performed.

[0055] After the above-mentioned position adjustment (alignment) has been performed, a film forming operation is performed to form a thin film on the substrate S through the mask M using the evaporation source 50 (film forming step).

[0056] As described above, in this embodiment as well, the position adjustment is performed by the fine position adjustment means 200A after the position adjustment is performed by the position adjustment mechanism 100. Therefore, even if it is difficult to perform highly accurate position adjustment of the mask M and the substrate S only by the position adjustment mechanism 100 due to the large size of the film forming apparatus 1A, vibration of the vacuum chamber 10, etc., the position adjustment by the fine position adjustment means 200A can improve the accuracy of the position adjustment.

[0057] In this embodiment, a configuration has been shown in which a coil is provided on the mask table 46 and a magnet is provided on the electrostatic attraction plate 20A. However, a configuration in which a magnet is provided on the mask table and a coil is provided on the electrostatic attraction plate can also be adopted. However, wiring is required to supply electricity to the coil, and there is a concern that the reaction force of the bending of the wiring itself may affect fine alignment. For this reason, it is necessary to provide a coil for the object to be moved and adjusted. It is preferable to adopt a configuration in which a magnet is provided instead of the above-mentioned, and in this embodiment, the above-mentioned configuration is adopted.

[0058] <Electronic device manufacturing method> Next, an example of a method for manufacturing an electronic device using the film forming apparatus of each of the above-mentioned embodiments will be described. Below, the configuration of an organic EL display device will be shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be illustrated.

[0059] First, the organic EL display device to be manufactured will be described. Fig. 5(a) is an overall view of an organic EL display device 150, and Fig. 5(b) shows the cross-sectional structure of one pixel.

[0060] As shown in FIG. 5(a), a plurality of pixels 152 each including a plurality of light-emitting elements are arranged in a matrix in a display region 151 of an organic EL display device 150. Although details will be described later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to the smallest unit that allows a desired color to be displayed in the display region 151. In the case of the organic EL display device according to this embodiment, the pixel 152 is configured by a combination of a first light-emitting element 152R, a second light-emitting element 152G, and a third light-emitting element 152B that emit light different from each other. The pixel 152 is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

[0061] Fig. 5(b) is a schematic partial cross-sectional view taken along line AB in Fig. 5(a). The pixel 152 is made up of a plurality of light-emitting elements, and each light-emitting element has a first electrode (anode) 154, a hole transport layer 155, any one of light-emitting layers 156R, 156G, and 156B, an electron transport layer 157, and a second electrode (cathode) 158 on a substrate 153. Among these, the hole transport layer 155, the light-emitting layers 156R, 156G, and 156B, and the electron transport layer 157 correspond to organic layers. In this embodiment, the light-emitting layer 156R is an organic EL layer that emits red light, the light-emitting layer 156G is an organic EL layer that emits green light, and the light-emitting layer 156B is an organic EL layer that emits blue light. The light-emitting layers 156R, 156G, and 156B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. In addition, the first electrode 154 is formed separately for each light-emitting element. The hole transport layer 155, the electron transport layer 157, and the second electrode 158 may be formed in common for the plurality of light-emitting elements 152R, 152G, and 152B, or may be formed for each light-emitting element. In order to prevent the first electrode 154 and the second electrode 158 from being shorted by foreign matter, an insulating layer 159 is provided between the first electrodes 154. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 140 is provided to protect the organic EL element from moisture and oxygen.

[0062] 5(b), the hole transport layer 155 and the electron transport layer 157 are shown as single layers, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 154 to the hole transport layer 155 can be formed between the first electrode 154 and the hole transport layer 155. Similarly, an electron injection layer can be formed between the second electrode 158 and the electron transport layer 157.

[0063] Next, an example of a method for manufacturing an organic EL display device will be specifically described.

[0064] First, a substrate 153 on which a circuit (not shown) for driving the organic EL display device and a first electrode 154 are formed is prepared.

[0065] An acrylic resin is formed by spin coating on the substrate 153 on which the first electrode 154 is formed. The acrylic resin is patterned by lithography so as to form an opening in the portion where the first electrode 154 is formed, thereby forming the insulating layer 159. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0066] The substrate 153 with the patterned insulating layer 159 is carried into a first organic material film forming apparatus, and the substrate is held by a substrate support table and an electrostatic chuck, and a hole transport layer 155 is formed as a common layer on the first electrode 154 in the display region. The hole transport layer 155 is formed by vacuum deposition. In practice, the hole transport layer 155 is formed to be larger than the display region 151, so no high-resolution mask is required.

[0067] Next, the substrate 153 on which the hole transport layer 155 has been formed is carried into a second organic material deposition apparatus and held by a substrate support table and an electrostatic chuck. The substrate and a mask are aligned, and the substrate is placed on the mask. A red light emitting layer 156R is deposited on the portion of the substrate 153 where a red light emitting element is to be disposed.

[0068] Similar to the formation of the light-emitting layer 156R, a third organic material film formation apparatus is used to form a green light-emitting layer 156G, and a fourth organic material film formation apparatus is used to form a blue light-emitting layer 156B. After the formation of the light-emitting layers 156R, 156G, and 156B is completed, a fifth film formation apparatus is used to form an electron transport layer 157 over the entire display area 151. The electron transport layer 157 is formed as a layer common to the three light-emitting layers 156R, 156G, and 156B.

[0069] The substrate on which the electron transport layer 157 has been formed is moved in a metallic evaporation material deposition apparatus, and a second electrode 158 is deposited.

[0070] Thereafter, the substrate is transferred to a plasma CVD apparatus, where a protective layer 140 is formed, and the organic EL display device 150 is completed.

[0071] If the substrate 153 on which the insulating layer 159 is patterned is exposed to an atmosphere containing moisture or oxygen from the time when it is carried into the film forming apparatus until the film formation of the protective layer 140 is completed, the light emitting layer made of an organic EL material may be deteriorated by moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere. [Explanation of symbols]

[0072] 1, 1A: Film forming apparatus 10: Vacuum chamber 20, 20A: Electrostatic adsorption plate 30, 30A: Support member 31: Stage 32: Support column 32a: First rigid part 32b: Second rigid part 32c: Damping body 33: Holding part 34: Damper mechanism part 40, 40A: Mask support member 41: Mask table 45: Support column 46: Mask table 47: Damper mechanism part 48: Actuator 50: Evaporation source 60: Control part 70 Magnet plate 100: Position adjustment mechanism 110: Substrate Z actuator 120: Alignment stage 121: Chamber fixing part 122: Actuator part 123: Connection part 200, 200A: Fine movement position adjustment means 210, 250: Stator 220, 260: Movable part 270: Optical scale 280: Optical encoder C: Alignment camera M: Mask M1: Alignment mark S: Substrate S1: Alignment mark

Claims

1. A substrate holding member for holding a substrate; A support member for supporting the substrate holding member; a position adjustment mechanism that adjusts a position of the substrate and a mask placed on a mask table by moving the support member in at least one of a first direction parallel to a deposition surface of the substrate and a second direction perpendicular to the deposition surface; a fine movement position adjustment means for adjusting the positions of the mask and the substrate by finely moving the substrate holding member; An alignment apparatus comprising:

2. 2. An alignment apparatus according to claim 1, wherein said fine movement position adjustment means adjusts the positions of said mask and said substrate by acting on said support member to finely move said substrate holding member.

3. 3. The alignment apparatus according to claim 2, wherein the fine movement position adjustment means performs position adjustment after the position adjustment by the position adjustment mechanism.

4. 4. An alignment apparatus according to claim 2, wherein the fine movement position adjustment means adjusts the position by deforming a part of the support member.

5. The support member is A first rigid portion; and a second rigid portion that is provided closer to a portion that holds the substrate holding member than the first rigid portion and has a lower rigidity than the first rigid portion; 5. The alignment apparatus according to claim 4, further comprising:

6. 6. An alignment apparatus according to claim 5, wherein the second rigid portion is provided with an attenuating body made of an attenuating material.

7. 5. The alignment apparatus according to claim 4, wherein the fine movement position adjustment means uses a magnetic force to deform a part of the support member.

8. 2. An alignment apparatus according to claim 1, wherein the fine movement position adjustment means adjusts the positions of the mask and the substrate by acting on the substrate holding member to finely move the substrate holding member.

9. 9. The alignment apparatus according to claim 8, wherein the fine movement position adjustment means finely moves the substrate holding member by utilizing a magnetic force.

10. 10. An alignment apparatus as described in claim 8 or 9, characterized in that position adjustment is performed by the position adjustment mechanism before the substrate held by the substrate holding member and the mask placed on the mask table come into contact with each other, and position adjustment is performed by the fine movement position adjustment means after the substrate and the mask come into contact with each other.

11. An alignment device according to claim 1, 2 or 8; a film formation source for forming a thin film on the substrate through the mask in a state in which the positions of the mask and the substrate are adjusted by the alignment device; A film forming apparatus comprising:

12. a first position adjustment step of adjusting a position between a mask placed on a mask table and the substrate by moving a support member supporting the substrate holding member using a position adjustment mechanism in at least one of a first direction parallel to a deposition surface of the substrate held by the substrate holding member and a second direction perpendicular to the deposition surface; a second position adjustment step of adjusting the positions of the mask and the substrate by finely moving the substrate holding member using a fine movement position adjustment means; An alignment method comprising the steps of:

13. The alignment method according to claim 12, characterized in that in the second position adjustment process, the fine movement position adjustment means is used to act on the support member to finely move the substrate holding member, thereby adjusting the position of the mask and the substrate.

14. 14. The alignment method according to claim 13, wherein in the second position adjustment step, a part of the support member is deformed by a magnetic force using the fine movement position adjustment means.

15. The alignment method according to claim 12, characterized in that in the second position adjustment process, the fine movement position adjustment means is used to act on the substrate holding member to finely move the substrate holding member, thereby adjusting the position of the mask and the substrate.

16. 16. The alignment method according to claim 15, wherein in the second position adjustment step, the fine movement position adjustment means finely moves the substrate holding member by magnetic force.

17. the first position adjustment step is performed before the substrate held by the substrate holding member and the mask placed on the mask table come into contact with each other, 16. The alignment method according to claim 15, wherein the second position adjustment step is performed after the substrate and the mask are brought into contact with each other.

18. 18. A method for manufacturing an electronic device, comprising: a film formation step of forming a thin film on the substrate through the mask using a film formation source after the positions of the mask and the substrate are adjusted by the alignment method according to any one of claims 13 to 17.

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