Display device

Abstract

To provide an electronic book which can reduce the frequency that a driving circuit is broken when a flexible panel is handled, and to provide an electronic book with a simplified structure.SOLUTION: The display device includes: a plurality of flexible display panels having a display unit for performing display control by a scan line driving circuit and a signal line driving circuit; and a binding part for fixing the plurality of display panels, the signal line driving circuit being provided in the inside of the binding part and the scan line driving circuit being provided in an end of the display panel in a vertical direction to the binding part.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The technical field relates to electronic books. [Background technology]

[0002] In recent years, with the advancement of digitalization technology, textual and image information from newspapers, magazines, etc. has become electronic data. This type of electronic data is provided as a Generally, the content is viewed by displaying it on a display device such as a PC. It has.

[0003] As for the display device for displaying the above-mentioned electronic data, in addition to stationary display devices, there are also portable display devices. There are. E-books are a typical example of a portable display device. E-books are usually stored on the body of the device. The display is located on the front, and the next page can be selected by operating the page change key located on the outer periphery of the main unit. The display unit is configured to display the current page or the previous page's data.

[0004] However, electronic books that adopt this structure are different from paper media such as newspapers and magazines. The way they are handled is very different. In particular, the act of switching pages by key operation is different from that of paper media. This is far removed from the way books are handled in Japan. Due to differences in the number of characters, the efficiency of reading characters, the efficiency of understanding sentences, the efficiency of recognizing images, etc. may decrease. There is a problem that...

[0005] In order to eliminate the above-mentioned differences with paper media, electronic books using double-sided display devices have been proposed. (For example, see Patent Document 1 and Patent Document 2). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2005-38608 A [Patent Document 2] JP 2003-58081 A Summary of the Invention [Problem to be solved by the invention]

[0007] In one embodiment of the disclosed invention, the driving circuit is prevented from being damaged when the flexible panel is handled. It is an object of the present invention to provide an electronic book that reduces the number of pages that can be read by the electronic book. One of the objects of the present invention is to provide an electronic book with a simplified structure. [Means for solving the problem]

[0008] In one embodiment of the disclosed invention, display control is performed by a scanning line driver circuit and a signal line driver circuit. The display device has a plurality of flexible display panels each having a display section, and a binding section for fixing the plurality of display panels. The binding portion is provided with a signal line driving circuit, and the display panel is provided with an end portion perpendicular to the binding portion. In the electronic book, a scanning line driving circuit is provided.

[0009] In one embodiment of the disclosed invention, the scan line driver circuit and the signal line driver circuit include transistors. The transistors constituting the scanning line driver circuit and the transistors constituting the signal line driver circuit are Electronic books with different structures may also be used.

[0010] In one embodiment of the disclosed invention, a channel layer of a transistor constituting a scanning line driver circuit is The channel layer of the transistor constituting the signal line driver circuit is a single crystal semiconductor. The electronic book may be a crystalline semiconductor.

[0011] In one embodiment of the disclosed invention, the non-single crystal semiconductor is amorphous silicon, microcrystalline silicon, or the like. The electronic device may be made of a silicon, polysilicon or oxide semiconductor.

[0012] In one embodiment of the disclosed invention, the display portion includes a transistor, and the transistor constituting the display portion The channel layers of the transistors that make up the transistors and the scanning line driving circuit are made of the same material. It can also be an e-book.

[0013] In one embodiment of the disclosed invention, the binding unit includes a signal line driving circuit, a battery, an amplifier, and a The electronic book may be an electronic book having any one of a sensor, a CPU, and a memory.

[0014] In one embodiment of the disclosed invention, a scan line driver circuit includes a plurality of circuit portions. The electronic book may be provided separately from each other.

[0015] In one embodiment of the disclosed invention, an electronic book having a stress concentration area between a plurality of circuit parts is also good.

[0016] In one embodiment of the disclosed invention, the plurality of display panels include a first display having a first display unit. a first display panel having a second display portion; and a second display panel having a first display portion and a second display panel having a second display portion. The display panel has a third display unit on a first surface and a second display unit on a second surface opposite to the first surface. and a third display panel having a fourth display portion, the third display panel being a first display panel. The electronic book may be more flexible than the first and second display panels.

[0017] In one embodiment of the disclosed invention, the first display panel includes a first display section and a third display section. The second display panel has a first optical sensor that controls whether or not a display is performed, and a second display unit and The third display panel has a second optical sensor that controls whether or not the display of the fourth display unit is displayed. The electronic book may have a light blocking portion in an area overlapping the optical sensor and the second optical sensor.

[0018] In addition, in this specification, a semiconductor device is a device that can function by utilizing semiconductor characteristics. This generally refers to electro-optical devices, semiconductor circuits, and electronic devices, all of which are included in the semiconductor device.

[0019] In addition, in this specification and the like, the term "display device" includes a light-emitting device and a liquid crystal display device. The light emitting element includes a light emitting device, and the liquid crystal display device includes a liquid crystal device. This category includes elements whose intensity can be controlled, specifically inorganic EL (Electro L luminescence elements, organic EL elements, etc. Effect of the Invention

[0020] According to one aspect of the disclosed invention, a durable electronic book is provided by reducing the damage to the drive circuit. It is possible.

[0021] According to one embodiment of the disclosed invention, the structure can be simplified and the cost of electronic books can be reduced. . [Brief description of the drawings]

[0022] [Figure 1] FIG. 1 is a diagram illustrating one form of an electronic book. [Diagram 2] FIG. 1 is a diagram illustrating one form of an electronic book. [Diagram 3] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 4] FIG. 1 is a diagram illustrating one form of an electronic book. [Diagram 5] FIG. 1 is a diagram illustrating one form of a circuit configured within a bound portion of an electronic book. [Figure 6]FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 7] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 8] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 9] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 10] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 11] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 12] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 13] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 14] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 15] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 16] FIG. 1 is a block diagram illustrating one form of an electronic book. [Figure 17] 1A and 1B are diagrams illustrating one embodiment of a display panel. [Figure 18] 1A and 1B are diagrams illustrating one embodiment of a display panel. [Figure 19] 1A and 1B are diagrams illustrating one embodiment of a display panel. [Figure 20] 1A and 1B are diagrams illustrating one embodiment of a display panel. [Figure 21] 1A to 1C illustrate one embodiment of a transistor that can be used in an e-book reader. [Figure 22] 1A and 1B are diagrams illustrating one embodiment of a display panel. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] Hereinafter, the embodiments will be described in detail with reference to the drawings. The present invention is not limited to the description of the embodiments, and does not deviate from the spirit of the invention disclosed in this specification. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the present invention. The configurations according to the embodiments can be appropriately combined for implementation. In the configuration of the invention to be described, the same parts or parts having similar functions are designated by the same reference numerals. The repeated explanation will be omitted.

[0024] In addition, the size, layer thickness, or area of ​​each component shown in the drawings of each embodiment may be different. In some cases, the figures are exaggerated for clarity. Therefore, the figures are not necessarily limited to the scale. It won't be done.

[0025] In addition, the terms "first", "second", "third", etc., used in this specification refer to the mixing of components. It should be noted that the numbers are added to avoid confusion and are not intended to be limiting.

[0026] (Embodiment 1) In this embodiment, an example of an electronic book will be described with reference to the drawings.

[0027] In the electronic book described in this embodiment mode, display control is performed by a scanning line driver circuit and a signal line driver circuit. A plurality of display panels each having a display portion that can be fixed to the display panel, and a binding portion that fixes the plurality of display panels. A signal line driving circuit is provided inside the bound portion, and a scanning line driving circuit is provided for each of the plurality of display panels. An operating circuit is provided.

[0028] FIG. 1 shows an example of an electronic book having two display panels (first display panel). A binding portion 4308 is provided at the end of the first display panel 4311 and the second display panel 4312 to form a book. The following illustrates a case where the first display panel and the second display panel are connected to each other with reference to FIG. The electronic book that is composed of the above will be specifically explained. Note that Fig. 1(A) shows the electronic book when it is opened. Fig. 1(B) shows the electronic book in a closed state, and Fig. 1(C) shows the electronic book in a half-open state. Shown in the open state.

[0029] The electronic book shown in FIG. 1 includes a first display panel 4311 having a first display portion 4301 and a second display panel 4312 having a second display portion 4303. A second display panel 4312 having two display units 4307 and a first display panel 4311. A binding portion 4308 provided at one end of the second display panel 4312 and a first display portion 430 The scanning line driver circuits 4321a and 4321b for controlling the display of the first display portion 4307 and the second display portion 4307 are connected to the scanning line driver circuits 4321a and 4321b for controlling the display of the first display portion 4307. The scanning line driver circuits 4322a and 4322b for controlling display, the first display portion 4301 and The LCD panel further includes a signal line driver circuit 4323 for controlling display of the display portion 4307 .

[0030] The scanning line driver circuits 4321a and 4321b are provided in the first display panel 4311. The driver circuits 4322a and 4322b are provided in the second display panel 4312, and the signal line driver circuit The path 4323 is provided inside the binding portion 4308 .

[0031] The first display panel 4311 can be made flexible. A pixel circuit constituting the first display unit 4301 and a scanning Line driver circuits 4321a and 4321b may be provided.

[0032] The second display panel 4312 is also flexible like the first display panel 4311. In this case, the second display unit can be formed on a flexible substrate such as plastic. All that is required is to provide a pixel circuit constituting 4307 and scanning line driver circuits 4322a and 4322b. .

[0033] The binding portion 4308 includes at least a first display panel 4311 and a second display panel 4312. It is preferable to have a structure that is less likely to bend (higher rigidity). The housing constituting the display panel 8 is thicker than the first display panel 4311 and the second display panel 4312. It can be made of plastic, metal, etc. In this case, the electronic book is inserted into the binding part 4308. The outer portion may be configured to be bent (curved).

[0034] The location of the binding portion 4308 is not particularly limited. For example, the binding portion 4308 may be provided on the first display panel 43. A binding portion 4308 may be provided along one edge of the 11th and second display panels 4312. For example, as shown in FIG. When the sheet 2 is rectangular, the binding portion 430 is bound along a predetermined side (so as to fix the side). 8 can be provided. In addition, the rectangular shape mentioned here includes the case where the corners are rounded. It shall be so.

[0035] The signal line driver circuit 4323 is provided inside the binding portion 4308. 8 is provided in a columnar or cylindrical housing having a hollow space, and the signal line driver circuit 432 is provided in the hollow space. 3 can be provided. The signal line driver circuit 4323 can be provided inside the binding portion 4308. This can prevent damage to the signal line driver circuit 4323 caused by bending of the display panel.

[0036] As shown in FIG. 1, the scanning line driver circuits 4321a and 4321b are connected to the first display panel. 4311, it is preferable to provide it at the end in the direction approximately perpendicular to the binding portion 4308. In addition, the scanning line driver circuits 4322a and 4322b are connected to the second display panel 4312. It is preferable to provide the scanning line driving circuit at the end in the direction substantially perpendicular to the common portion 4308. In comparison with the case where the signal line driver circuit is provided in one place (for example, inside the binding portion 4308), This reduces the amount of wiring required and simplifies the structure.

[0037] In addition, the scanning line driver circuits 4321a and 4321b and the pixel circuit constituting the first display portion 4301 By forming the wiring on a flexible substrate in the same process, the scanning line driving circuit 432 1a, 4321b can be curved, and the cost can be reduced. The scanning line driver circuits 4322a and 4322b and the pixel circuits constituting the second display portion 4307 are connected together. By forming the scanning line driver circuit 4322a, This allows bending of 4322b and reduces costs.

[0038] A pixel circuit constituting the first display unit 4301, a pixel circuit constituting the second display unit 4307, and The elements constituting the scanning line driving circuits 4321a, 4321b, 4322a, and 4322b are The signal line driver circuit 4323 and the like can be formed of a thin film transistor or the like. The high-speed circuits are formed using semiconductor substrates such as silicon and SOI substrates. The IC is attached to the binding section 4. 308 。

[0039] In this way, ICs with circuits for high-speed operation such as signal line driving circuits are formed inside the binding section. A scanning line driver circuit and a pixel circuit constituting a display unit are provided on a flexible substrate by using a thin film transistor. By forming the signal line driver circuit and the scanning line driver circuit with an IC, In comparison with the case where the display panel is bent, the display panel can be easily bent and the bending of the display panel can be prevented. This prevents damage to the IC caused by the scanning line driver circuit, and further reduces costs. By providing the display panel at the edge in the direction perpendicular to the binding portion, wiring can be reduced. The stopping structure can be simplified.

[0040] In FIG. 1, the scanning line driver circuits are formed at both ends of the first display panel 4311. However, only one end (the scanning line driver circuit 4321a and the scanning line driver circuit 4321b) is shown. Similarly, the scanning line driver circuit may be provided for the second display panel. Although the case where the filter 4312 is formed at both ends is shown, the filter 4312 may be formed at only one end. stomach.

[0041] This embodiment mode can be implemented in appropriate combination with the configurations described in other embodiments. It is.

[0042] (Embodiment 2) In this embodiment, the specific configuration of the electronic book shown in FIG. 1 will be described with reference to the drawings. Note that the configuration shown in this embodiment is common in many parts to the above-mentioned embodiment 1. Therefore, in the following, we will omit the explanation of the overlapping parts and will focus on the differences. will be explained.

[0043] First, an example of a specific configuration of an electronic book will be described with reference to FIG. FIG. 2(A) shows a plan view of the electronic book in a closed state, and FIG. 2(B) shows a cross-sectional view of FIG. 2(A) between A and B. FIG. 2(C) shows a detailed schematic diagram of the cross section.

[0044] The electronic book shown in FIG. 2 is formed of a housing having a hollow binding portion 4308. A signal line driver circuit 4323 is provided in the IC. The IC is formed of silicon or the like, and the IC is provided inside the binding portion 4308. It can be formed using a semiconductor substrate, an SOI substrate, or the like. Other circuitry (eg, a CPU, memory, etc.) may be provided on the IC.

[0045] In addition, in FIG. 2, the IC provided inside the binding portion 4308 is referred to as a TAB (Tape Auto Using the omated bonding method, FPC (Flexible Printed Circuit) The figure shows the case where it is implemented on a 3D Circuit.

[0046] More specifically, a signal line driver circuit 4323a for controlling the first display portion 4301 is A signal line driver circuit 4323b for controlling the second display portion 4307 is provided on the F A signal line driver circuit 4323a and a signal line driver circuit 4323b are provided on the PC 4324b. The FPC 4324a is electrically connected to the first display 4321 via a printed circuit board 4325. The panel 4311 and the printed circuit board 4325 are electrically connected, and the FPC 4324b is a second The display panel 4312 and the printed circuit board 4325 are electrically connected to each other.

[0047] In addition, in FIG. 2, the printed circuit board 4325 is installed in contact with the housing constituting the binding portion 4308. In this case, the first display panel 4311 and the second display panel 4312 It is fixed by the binding portion 4308.

[0048] As shown in FIG. 2, when a signal line driver circuit is provided on an FPC, the first display panel 4311 It is preferable to provide a stress concentration area 4326 on one or both of the first and second display panels 4312. By providing the stress concentration area 4326 on the display panel, when the electronic book is opened ( When folding the first display panel 4311 and / or the second display panel 4312, This reduces the stress applied to C and prevents damage to the signal line driving circuit on the FPC. can.

[0049] The stress concentration area is the area where the deformation of the material due to the cut, etc., the bending or stretching due to the attachment of the material, etc. The area where stress is concentrated is formed due to the change in strength against bending. Then, a cut is made on the part of the first display panel 4311 or the second display panel 4312 that is to be folded. By providing recesses (concave portions, grooves), stress concentration regions 4326 can be formed.

[0050] For example, the first display panel 4311 is formed by using an element substrate 4331a and a sealing substrate 4332a. A cut portion is provided in one or both of the element substrate 4331a and the sealing substrate 4332a. In FIG. 2, a cutout is provided in the sealing substrate 4332a. In addition, in the structure shown here, The element substrate 4331a includes a pixel circuit for driving the first display portion 4301 and a scanning line driver circuit 4 321a, 4321b, and electrically connect these circuits to FPC 4324a. This can be done.

[0051] Similarly, a second display panel 4312 is formed using an element substrate 4331b and a sealing substrate 4332b. and providing recessed portions in one or both of the element substrate 4331b and the sealing substrate 4332b. The element substrate 4331b may have a structure in which the second display unit 4307 is driven. The pixel circuits and scanning line driver circuits 4322a and 4322b are formed, and these circuits and the FPC 4324b can be electrically connected.

[0052] In addition, the stress concentration area 4326 is located between the first display panel 4311 and the second display panel 4312. For example, in FIG. 2(A), the binding portion 430 8 along a direction approximately parallel to the first display panel 4311 and / or the second display panel 43 By providing a notch from the top to the bottom of 12, the direction in which the display panel is folded can be changed. The display panel can be selectively folded in a direction perpendicular to the binding portion 4308. This can prevent damage to the signal line driver circuit provided on the FPC.

[0053] The stress concentration area 4326 can be provided inside or outside the binding portion 4308. For example, In a state where the first display panel 4311 and the second display panel 4312 are closed, 4308 is provided so as to be in contact with the first display panel 4311 or the second display panel 4312. In this case, stress is concentrated on the outside of the bound portion 4308 (for example, between the bound portion 4308 and the display portion). It is preferred that a middle region 4326 is provided.

[0054] In FIG. 2, a signal line driver circuit 4323a for controlling the first display portion 4301 and a signal line driver circuit 4323b for controlling the second display portion 4302 are The signal line driver circuit 4323b for controlling 307 is formed using a separate IC, and the printed circuit board The signal line driver circuit 4323a and the signal line driver circuit 4323b are electrically connected via 4325. The signal line driver circuit 4323a and the signal line driver circuit 4323b are shown in FIG. 4323b may be integrated into a single IC.

[0055] Next, the configuration of the electronic book, which is different from that shown in FIG. 2, will be described with reference to FIG. 3. FIG. 3(A) shows an electronic book. FIG. 3(B) shows a cross section between A and B in FIG. 3(A). FIG. 3(C) shows a detailed schematic diagram of the cross section.

[0056] FIG. 3 shows an IC provided in the binding portion 4308, which is mounted in a COG (Chip On Glass) manner. Using the formula, the case where the display is mounted on the first display panel 4311 and the second display panel 4312 is shown. is doing.

[0057] More specifically, a signal line driver circuit 4323a for controlling the first display portion 4301 The second display unit 4311 is provided on an element substrate 4331a constituting the first display panel 4311. A signal line driver circuit 4323b for controlling the second display panel 4312 A signal line driver circuit 4323a and a signal line driver circuit 4323b are provided on a substrate 4331b. Electrically connected via FPC4324a, 4324b and printed circuit board 4325 do.

[0058] As shown in FIG. 3, when a signal line driver circuit is provided on a display panel, the first A stress concentration area 43 is provided on one or both of the first display panel 4311 and the second display panel 4312. In this case, the stress concentration region 4326 is preferably provided in the area where the signal line driver circuit is provided. The signal line driver circuit is provided in a region different from the region where the signal line driver circuit is provided. For example, by providing it on the sealing substrate side, when an electronic book is opened (first display panel 431 In the case where the first or second display panel 4312 is folded, the stress applied to the signal line driver circuit is reduced. This can reduce damage to the signal line driver circuit.

[0059] Next, the configuration of the electronic book, which is different from that of FIG. 2 and FIG. 3, will be described with reference to FIG. 4. 4(B) shows a cross section between A and B in FIG. 4(A). FIG. 4(C) shows a detailed schematic diagram of the cross section.

[0060] The electronic book shown in FIG. 4 has an IC on which a signal line driver circuit and other circuits are formed, mounted on a printed circuit board. 1 shows a case where the printed circuit board and the display panel are connected using an FPC.

[0061] More specifically, a signal line driver circuit 4323a for controlling the first display portion 4301 A signal line driver circuit that is provided on a printed circuit board 4327a and controls the second display portion 4307 4323b is provided on a printed circuit board 4327b, and a signal line driver circuit 4323a and a signal line The driving circuit 4323b is electrically connected via the FPC 4329. is electrically connected to the printed circuit board 4327a and the printed circuit board 4327b, and the FPC 432 4a is electrically connected to the first display panel 4311 and the printed circuit board 4327a, and C4324b is electrically connected to the second display panel 4312 and the printed circuit board 4327b. It is being done.

[0062] In Figure 4, the display panel can be folded using FPC4324a and FPC4324b. In order to achieve this, stress concentration areas are provided on the first display panel 4311 and the second display panel 4312. It is possible to adopt a configuration in which no

[0063] Next, an example of the configuration of the binding portion 4308 and a circuit that can be provided in the binding portion 4308 will be described. This will be described with reference to FIG.

[0064] FIG. 5 shows a case where the display control unit 200 including the signal line driving circuit is built in the binding unit 4308. As mentioned above, these circuits are made of semiconductor substrates such as silicon or SOI substrates. The IC formed using the same can be formed using the same.

[0065] The display control unit 200 includes a CPU 201, a storage unit 203, a power supply unit 205, and a power supply circuit 207. , the video signal generating circuit 215, the signal line driving circuits 4323a and 4323b, the operation unit 219, etc. Each component can be connected via an interface, etc. In addition, the display control unit 200 controls the first display panel 4311 and the second display panel 4312. In this embodiment, the operation unit 219 is provided in the binding unit 4308. 2, the operation unit 219 is connected to the first display panel 4311 and / or the second display panel 4312. It may also be provided on the panel 4312.

[0066] The CPU 201 controls the overall operation of the electronic book.

[0067] The data input unit 211 receives data from an external device on the first display unit 4301 and / or the second display unit 4302. The information to be displayed is inputted in the data input section 211. For transmitting and receiving, an antenna 216 may be provided. In this case, the data input unit 211 is Data received by the antenna 216 and data stored in a recording medium (external memory 213) to the internal memory 209.

[0068] The storage unit 203 includes an internal memory 209, a data input unit 211, and an external memory 213. The internal memory 209, the data input unit 211, and the external memory 213 The first display unit 4301 and the second display unit 4307 are used to display information and electronic books. It is possible to record programs that

[0069] The internal memory 209 generates a video signal based on signals from the power supply unit 205, the operation unit 219, etc. The signal output to the circuit 215 and / or the power supply circuit 207 is processed by the CPU 201. A storage unit for storing a program for the operation and data transferred from the data input unit 211, etc. An example of the internal memory 209 is a dynamic random access memory (DRAM). ess Memory), SRAM (Static Random Access Me memory), Mask ROM (Read Only Memory), PROM (Prog It is composed of a RAM, a ramdable read only memory, etc.

[0070] The external memory 213 may be a storage medium such as an IC card or a memory card.

[0071] The power supply unit 205 is composed of a secondary battery, a capacitor, etc. Lithium batteries, preferably lithium polymer batteries using gel electrolytes, lithium ion batteries Of course, any rechargeable battery can be used. Nickel-metal hydride battery, nickel-cadmium battery, organic radical battery, lead-acid battery, secondary air battery, nickel The capacitor may be a rechargeable battery such as a zinc battery or a silver-zinc battery. Using electric double layer capacitors, lithium ion capacitors and other large capacity capacitors Capacitors do not deteriorate much even when they are charged and discharged many times, and they have rapid charging characteristics. The shape of the power supply unit 205 is preferably a sheet shape, a cylindrical shape, a rectangular column shape, or the like. The shape may be selected appropriately from shapes such as plate, coin, etc.

[0072] Moreover, the power supply unit 205 may be configured to supply power wirelessly. In this case, an antenna may be provided on the power supply unit 205.

[0073] The power supply circuit 207, under the control of the CPU 201, supplies power to the first display panel 4311 and In order to turn on and off the display panel 4312 of the second display, the power supply to the display element is controlled. This is a circuit for this purpose.

[0074] The operation unit 219 can be provided with a keyboard, operation buttons, etc. In the case where the first display panel 4311 and / or the second display panel 4312 are provided with The first display unit 4301 and / or the second display unit 4307 are used as touch displays. The display unit can also function as an operation unit.

[0075] In FIG. 5, the display control unit 200 is built in the binding unit 4308. A so-called power device such as a switching power supply or a DC-DC converter may be provided.

[0076] In addition, in the electronic book shown in FIG. 5, the power supply and the display can be controlled by operating the operation unit 219. In addition, the first display unit 4301 and / or the second display unit 43 07 is used as a touch display, and a finger or The configuration may be such that the operation is performed by touching with an input pen or the like.

[0077] In this way, by incorporating the display control unit 200 in the binding unit 4308, The electronic book can be protected by a housing and can be made thin.

[0078] In the first and second embodiments, the scanning line driving circuit 43 21a and 4321b are aligned in the vertical direction of the bound portion 4308 along the first display portion 4301. In the second display panel 4312, scanning line driver circuits 4322a and 4322b are provided. 4308 and along the second display portion 4307. However, this is not limited to this.

[0079] For example, as shown in FIG. 6A, in the first display panel 4311, a scanning line driver circuit 4321a and 4321b are compared with the first display portion 4301 and are separated from the binding portion 4308. Generally, the scanning line driver circuits 4321a and 4321b are configured as follows. Since the elements constituting the pixel circuits are arranged in a more concentrated manner, the first display panel 43 By not providing the scanning line driver circuits 4321a and 4321b at the bent portion of the This can prevent damage to the scanning line driving circuits 4321a and 4321b.

[0080] As shown in FIG. 6B and FIG. 6C, the scanning line driver circuits 4321a and 4321b are Each of the circuit sections may be divided into a plurality of circuit sections, and the plurality of circuit sections may be spaced apart from each other. As a result, even if the first display panel 4311 is curved, the scanning line driving circuit 4 The stress applied to the scanning line driving circuits 4321a and 4321b is reduced. FIG. 6B shows the scanning line driver circuits 4321a and 4321b. Each of the scanning line driver circuits 4321a and 4322a is divided into two circuit parts. 21b is divided into four circuit parts, The number of divisions is not limited to this.

[0081] Also, as shown in FIG. 6(D), in the first display panel 4311, (Only one of the scanning line driver circuit 4321a and the scanning line driver circuit 4321b) is provided. This makes it possible to narrow the frame of the electronic book.

[0082] It is to be noted that the structure shown in FIG.

[0083] This embodiment mode can be implemented in appropriate combination with the configurations described in other embodiments. It is.

[0084] (Embodiment 3) In this embodiment, an electronic book having multiple flexible display panels is opened and curved. An example of the effect of the above embodiment when used in the above-mentioned manner will be shown with reference to Figs. 7 to 10. Please refer to the following for explanation.

[0085] First, in FIG. 7A, the front plane when a user uses an electronic book in a double-open state. In FIG. 7B, a top view of the electronic book when the user uses it in a double-open position is shown. This section presents and explains:

[0086] The electronic book shown in FIG. 7A includes a first display panel 4311, a second display panel 4312, The first display panel 4311 has a first display unit 4301. The first display portion 4301 includes a scanning line driver circuit 4 for supplying a scanning signal to the first display portion 4301. 321, a signal line driver circuit 4323a that supplies image signals to the first display portion 4301 The display control is performed on the second display panel 4312. 07, and the second display portion 4307 has a scanning a signal line driver circuit 4322 for supplying image signals to the second display portion 4307; The display is controlled by the user's hand 435 in FIG. 0a, 4350b indicate the edges of the first display panel 4311 and the second display panel 4312. The figure also illustrates how the part is gripped. The line of sight when viewing the top plan view shown in FIG. 7(B) is also noted.

[0087] The top plan view shown in FIG. 7B shows a first display panel 4311 and a second display panel 4312. 7B, the user holds hands 4350a and 43 When the electronic book is opened and used in the manner shown in FIG. 50b, the flexible display panel has a structure shown in FIG. The bent portion (hereinafter referred to as bent portion C) is in the range indicated by the arrow in the figure, and the non-bent portion is in the range indicated by the arrow in the figure. (Hereinafter referred to as non-bending portion D) is formed.

[0088] In FIG. 7B, as an example, the first display panel 4311 and the second display panel 431 Regarding the folded portion C and the non-folded portion D of 2, the side adjacent to the bound portion 4308 is the folded portion C, and the bound portion The side away from the portion 4308 is described as a non-bending portion D. The display panel is formed according to the structure of the binding portion 4308 and the material of the substrate that constitutes the display panel. The way in which they are curved is different. Therefore, the first display panel 4311 and the second display panel Regarding the folded portion C and the non-folded portion D of the loop 4312, the side away from the bound portion 4308 is the folded portion C. In some cases, the side adjacent to the bound portion 4308 becomes the non-bent portion D.

[0089] In addition, since the electronic book is configured to fix the display panel by the binding part 4308, The first display panel 4308 extends in a direction perpendicular to the direction of the arrow 7002 in FIG. The first display panel 4311 and the second display panel 4312 are formed with a bent portion C and a non-bent portion D. Therefore, the signal line driver circuit 4323a and the signal line driver circuit 4323b are connected to the binding unit 430. The scanning line driver circuit 432 can prevent damage caused by bending the display panel. 1. The scanning line driver circuit 4322 is provided at the vertical end of the display panel, Since it is possible to manufacture the book in the same process, the cost can be reduced. Compared to the case where the display is provided at the bent portion C, the wiring to the display can be reduced. The bent portions D may be formed in a plurality of positions, or may be alternately formed. A stress concentration region may be provided to artificially form a bent portion C and a non-bent portion D.

[0090] Next, in FIG. 8(A) to FIG. 8(C), the electronic book is used in a double-page spread similarly to FIG. 7(A). 43 shows a front plan view of the bent portion C and the non-bent portion D. The arrangement of the scanning line driver circuit 4322 will be described.

[0091] In FIG. 8A, the side close to the bound portion 4308 is the bent portion C, and the side away from the bound portion 4308 is the bent portion C. The side where the bent portion is not bent is described as a non-bent portion D. The circuits 4322 are provided in the non-folded portion D on the side away from the bound portion 4308. In addition, the supply of a scanning signal to the pixel TFT 4352 in the display unit is performed by the scanning line driving circuit 43. 21. By wiring the scanning line driving circuit 4322 to each scanning line of the display unit, In addition, the scanning line driver circuit 4321 and the scanning line driver circuit 4322 may be driven by the following. The supply of control signals such as clock signals is performed through wiring extending from a video signal generating circuit in the binding section 4308. The wiring for electrical connection between circuits is done by microfabrication of metal films, etc. The semiconductor film of the transistor constituting the scanning line driver circuit is formed of a silicon film or the like. It is made of semiconductor material. Metal film has superior ductility compared to semiconductor material, and is less susceptible to damage caused by bending. Therefore, the wiring connected to the scanning line driving circuit is arranged at the bent portion C. By disposing transistors constituting the scanning line driving circuit at the non-bending portion D, This reduces damage to the semiconductor film of the transistor caused by bending. As a result, by arranging the scanning line driver circuit 4321 and the scanning line driver circuit 4322 as shown in FIG. When a user opens the electronic book with their hands 4350a and 4350b, Damage can be suppressed.

[0092] In FIG. 8B, the folded portion C and the non-folded portion B are arranged in a direction from the side close to the bound portion 4308 to the side away from the bound portion 4308. D are alternately provided. The arrangement of the line driving circuit 4322 is such that each driving circuit is divided into multiple parts in the non-bending portion D. , are provided at a distance from each other. The signal is supplied from a first scanning line driver circuit 4321 and a second scanning line driver circuit 4322. This can be achieved by wiring the scanning line driver circuit 4321. The supply of control signals such as clock signals for driving the circuit 4322 is performed in the image forming section 4308. This is done through wiring extending from the image signal generating circuit. Signals propagating between pulse signal generating circuits such as flip-flops are supplied through wiring. The wiring for electrical connection between circuits is formed by microfabrication of metal films, etc. The semiconductor film of the transistor constituting the scanning line driver circuit is formed of a semiconductor material such as a silicon film. Metal films have superior ductility compared to semiconductor materials and are less damaged by bending. A wiring connected to a scanning line driving circuit is provided at the bent portion C, and a wiring connected to a scanning line driving circuit is provided at the non-bent portion D. By disposing the transistors constituting the scanning line driver circuit at the position where the transistors are curved, In addition, in FIG. 8(B), the driving The circuit is divided into several parts, which are spaced apart from each other, so that the scanning line driving circuit is not affected when the display is bent. As a result, the stress generated by the scanning line driver circuit 432 can be dispersed as shown in FIG. 1. The scanning line driving circuit 4322 is arranged so that the user can turn on the When the child book is used in a double-page spread, damage to the circuitry can be more effectively prevented.

[0093] In FIG. 8B, the scanning line driver circuit 4321 and the scanning line driver circuit 4322 are Above and below, there are a scanning line driver circuit 4321a, a scanning line driver circuit 4321b, and a scanning line driver circuit 43 22a, and a scanning line driver circuit 4322b are arranged to provide redundancy, or to output a scanning signal. In FIG. 8(C), the configuration described in FIG. 8(B) may be used to distribute the function of inputting the information. The scanning signal supplied to the pixel TFT4352 is The scanning line driver circuit 4321a and the scanning line driver circuit 4321b are arranged vertically, and the scanning line driver circuit 43 22a and the scanning line driver circuit 4322b are arranged vertically and supplied to form the scanning line driver circuit This reduces the number of flip-flops and other pulse signal generating circuits that are required, When using an e-book with the 4350a or 4350b open, damage to the circuitry is prevented. It is possible.

[0094] In the above, Figs. 8B and 8C show a specific example, and the running direction of the area that becomes the bent portion C is Regarding the advantage of arranging the scanning line driving circuit in the non-bending area D instead of arranging the scanning line driving circuit, This configuration distributes the stress applied to the scanning line driving circuit when the display device is bent. The user can open the electronic book with their hands 4350a and 4350b and use it. In this case, damage to the circuit can be suppressed.

[0095] Next, as shown in Figs. 8(B) and (C), the driving circuit is divided into a plurality of parts and is set apart from each other. When the display panel is folded, stress concentration occurs due to the artificial formation of the bent portion C and the non-bent portion D in the display panel. An example of providing the regions will be described with reference to FIGS.

[0096] In FIG. 9A, the first display panel 4311, the binding portion 4308, the first display portion 4301, The scanning line driver circuit 4321 and the signal line driver circuit 4323a are shown. 4321 is shown divided into two, which are spaced apart from each other via wiring 920. It is preferable that the stress concentration region 921 is formed so as to overlap the wiring 920. FIG. 4B shows an example of a cross section perpendicular to the binding portion 4308. In the stress concentration region 921 overlapping with the element, a notch 922a is provided in the sealing substrate 923. A cut portion 922b may be provided in the substrate 924. A reinforcing plate 925 is attached to the substrate 924 and the sealing substrate 923 on the scanning line driver circuit 4321. By doing so, the cut portions 922a and 922b may be formed. The cutouts 922a and 922b are provided parallel to the longitudinal direction of the binding portion 4308. It may be provided in all areas, or may be provided in only a portion.

[0097] The stress concentration area refers to deformation of the material due to cuts, bending, stretching, etc. due to attachment of the material. Stress concentration areas are formed due to changes in strength relative to the

[0098] The division of the scanning line driving circuit means that the circuit elements such as TFTs and wiring are mixed and repeated. This refers to a state in which the out area is divided by the area used for wiring. cormorant.

[0099] In FIG. 10A, similarly to FIG. 9A, the first display panel 4311 and the binding portion 430 8. First display portion 4301, scanning line driver circuit 4321, and signal line driver circuit 4323a The scanning line driver circuit 4321 is divided into four parts, and is separated from each other by wiring 920. The stress concentration region 921 is formed so as to overlap with the plurality of wirings 920. FIG. 10(B) shows an example of a cross-sectional view in a direction perpendicular to the bound portion. In the stress concentration region 921 overlapping the wiring 920, a plurality of cuts are formed in the sealing substrate 923. A plurality of cutouts 922a may be provided in the element substrate 924, and a plurality of cutouts 922b may be provided in the element substrate 924. As shown in FIG. 10C, the scanning line driver circuit 4 of the element substrate 924 and the sealing substrate 923 By attaching a reinforcing plate 925 onto the substrate 321, the plurality of cutouts 922a and the plurality of cutouts In addition, a plurality of cut portions 922a and a plurality of cut portions 922b may be formed. The cut portion 922b may be provided parallel to the longitudinal direction of the binding portion 4308, or may be provided only partially. It may be configured to provide.

[0100] The number of divisions of the scanning line driving circuit shown in FIG. 9 and FIG. 10 is an example for the purpose of explanation. It may be divided into any number of parts.

[0101] As described above, the configuration of this embodiment allows the user to read the electronic book in a double-page spread. In addition, damage to the scanning line driving circuit can be effectively suppressed when the scanning line driving circuit is damaged. By providing a stress concentration area in advance by making a cut in the display panel, the effect is more improved. Therefore, damage to the scanning line driving circuit can be suppressed.

[0102] This embodiment mode can be implemented in appropriate combination with the configurations described in other embodiments. It is.

[0103] (Embodiment 4) In this embodiment, the electronic book structure having a plurality of display panels described in the above embodiment 1 is used. In addition, a double-sided display type is provided between the first display panel 4311 and the second display panel 4312. An example of a third panel is described below. FIG. 11(B) shows the electronic book in a closed state, and FIG. 11(C) shows the electronic book in a closed state. FIG.

[0104] The electronic book shown in FIG. 11(A) and (B) has a first display panel having a first display portion 4301. A second display panel 43 having a second display unit 4307 and an operation unit 4304. 12, and a third display panel 43 having a third display unit 4302 and a fourth display unit 4310. 13, a first display panel 4311, a second display panel 4312, and a third display panel The third display panel 4 has a binding portion 4308 provided at one end thereof and a binding portion 4313. 313 is inserted between the first display panel 4311 and the second display panel 4312. The electronic book in FIG. 11A and FIG. 11B includes a first display portion 4301, a second display portion 4307, and a third display portion 4308. The computer has four display screens: a third display unit 4302 and a fourth display unit 4310.

[0105] A first display panel 4311, a second display panel 4312, and a third display panel 4313 The first display panel 4311 and the second display panel 4312 are flexible and bend easily. The second display panel 4312 is made of a plastic substrate, and the third display panel 4313 is made of a thin film. In this way, a thin electronic book can be produced. In a lateral cross-sectional view, the third display panel 4313 is a first display panel 4311 and The second display panel 4312 can be made to be a more flexible electronic book. By making the outer display panel harder than the display panel 4313, it feels like a book. This allows for easy handling and prevents the third display panel 4313 from being damaged.

[0106] The third display panel 4313 has both a third display unit 4302 and a fourth display unit 4310. The third display panel 4313 is a dual-emission type display panel. Alternatively, a single-sided emission type display panel may be attached to the backlight. Alternatively, two liquid crystal display panels may be used, sandwiching a light (preferably a thin EL light-emitting panel).

[0107] In addition, the electronic book shown in FIG. 11(A) and (B) has a driving device that controls the display of the first display unit 4301. A scanning line driver circuit (not shown) and a scanning line driver circuit 4 for controlling the display of the second display unit 4307. 322a, 4322b, and the display of the third display unit 4302 and / or the fourth display unit 4310. A scanning line driver circuit (not shown) for controlling display, a first display unit 4301, a second display unit 43 07, a signal for controlling the display of the third display unit 4302 and / or the fourth display unit 4310 The scanning line driver circuits 4321a and 4321b are the first The scanning line driver circuits 4322a and 4322b are provided on the second display panel 4311. A signal line driver circuit 4323 is provided inside the binding portion 4308. is.

[0108] In the electronic book shown in FIG. 11(A) and (B), the second display panel 4312 is A power switch, a display changeover switch, and other functions are associated with the power switch 4304. It is possible.

[0109] In addition, the input operation of the electronic book shown in FIG. 11(A) and (B) is performed using the first display unit 4301 and the second display unit 4302. The input is performed by touching the display unit 4307 with a finger or an input pen, or by operating the operation unit 4304. In FIG. 11A, the display button 4309 displayed on the second display unit 4307 is illustrated, and input can be performed by touching it with a finger or the like.

[0110] In addition, how to use an electronic book with the third display panel 4313 inserted as shown in FIG. 11(A) and (B) For example, a text is read on the first display unit 4301 and the fourth display unit 4310, and It is convenient to refer to the diagram on the display unit 4307 and the third display unit 4302. The display panel 4313 displays the third display unit 4302 and the fourth display unit 4310 simultaneously. Therefore, when you start turning the page, the display of the third display unit 4302 The display is switched to that of the fourth display unit 4310.

[0111] Also, by reading the first display section 4301 to the third display section 4302, the next page, the third table When the user starts to turn over the display panel 4313, the fourth display unit 4310 and the second display unit 4311 are aligned at a certain angle. The fourth display unit 4310 and the second display unit 4311 display the next page. When the user finishes using the third display panel 4307 and starts turning over the third display panel 4313, the third display panel 4313 appears at a certain angle. The first display unit 4302 and the second display unit 4301 display the next page. This makes it possible to make the change invisible to the naked eye and suppress visual discomfort, etc.

[0112] Next, the first display panel 4311, the second display panel 4312, and the third display panel 4313 are As an example of a specific configuration of an electronic book having 313, similar to FIG. 2(A) and (B), The following description will be given with reference to Figs. 13(A) and (B). Fig. 13(A) shows the electronic book in a closed state. 13(B) shows a cross section taken along line AB in FIG. 13(A).

[0113] The electronic book shown in FIG. 13 is formed of a housing having a binding portion 4308 with a hollow space. A signal line driver circuit 4323 is provided in the I C, and the IC is provided inside the binding portion 4308. The IC is made of silicon or the like. The signal line driver circuit can be formed using a semiconductor substrate, an SOI substrate, or the like. Other circuits (eg, a CPU, memory, etc.) may be provided in the IC.

[0114] In addition, in FIG. 13, the IC provided inside the binding portion 4308 is called a TAB (Tape Au FPC (Flexible Printed Circuit) using the tomated bonding method The figure shows the case where it is implemented in a 32-bit ed Circuit.

[0115] More specifically, a signal line driver circuit 4323 for controlling the first display portion 4301 is formed. An IC is provided on the FPC 4324, and a signal line driver for controlling the second display unit 4307 is also provided. An IC on which a circuit 4323 is formed is provided on an FPC 4324, and the third display unit 4302 and An IC on which a signal line driver circuit 4323 for controlling the fourth display unit 4310 is formed is attached to the FPC 4. 324, and a signal line driver circuit 4323 is electrically connected via a printed circuit board 4325. The FPC 4324 is connected to the first display panel 4311 and the second display panel 431 2, and is electrically connected to the printed circuit board 4325.

[0116] In addition, in FIG. 13, the printed circuit board 4325 is bonded to the case constituting the binding portion 4308. It can be set up so that

[0117] As shown in FIG. 13, when a signal line driver circuit is provided on an FPC, the above-described FIG. 2(C) As described above, stress is applied to one or both of the first display panel 4311 and the second display panel 4312. It is preferable to provide a stress concentration area 4326. The stress concentration area 4326 is provided on the display panel. By this, when opening an electronic book (the first display panel 4311 and / or the second display panel This reduces the stress applied to the FPC4324 when bending the FPC4312. This can prevent damage to the signal line driver circuit 4323 provided above. It is formed into a thin film on the panel 4313, and when using an e-book in a double-page spread, It is flexible enough that it can be handled like a book.

[0118] Next, a configuration of an electronic book that is different from that shown in FIG. 13 will be described with reference to FIG. 14. 14(B) shows the plan view of the electronic book in the closed state, and FIG. 14(A) shows the plan view of the electronic book in the closed state. A cross section is shown.

[0119] In the electronic book shown in FIG. 14, an IC provided in the binding portion 4308 is a COG (Chip On Gauge) The first display panel 4311 and the second display panel 4312 are made of a glass. This shows the case where it is implemented.

[0120] More specifically, a signal line driver circuit 4323 for controlling the first display portion 4301 is formed. The IC is provided on an element substrate constituting the first display panel 4311, and similarly, An IC in which a signal line driver circuit 4323 for controlling the second display panel 431 is formed is provided. 2, a third display unit 4302 and a fourth display unit 4310 are provided on the element substrate constituting the display device. An IC in which a signal line driver circuit 4323 for controlling the third display panel 4313 is formed constitutes the third display panel 4313. A signal line driver circuit 4323 is provided on the element substrate 4322 and the FPC 4324 and the printed circuit board 4325. 325.

[0121] Next, a configuration of an electronic book that is different from those shown in FIGS. 13 and 14 will be described with reference to FIG. 15. FIG. 15(A) shows a plan view of the electronic book in a closed state, and FIG. 15(B) shows the A of FIG. -B section is shown.

[0122] The electronic book shown in FIG. 15 has an IC on which a signal line driver circuit and other circuits are formed, mounted on a printed circuit board. This shows a case where the printed circuit board and the display panel are connected using an FPC.

[0123] More specifically, a signal line driver circuit 4323 for controlling the first display portion 4301 is formed. An IC is provided on a printed circuit board 4325, and a signal for controlling the second display unit 4307 is input. An IC in which a line driver circuit 4323 is formed is provided on a printed circuit board, and the third display unit 430 The IC in which the signal line driver circuit 4323 for controlling the second and fourth display portions 4310 is formed is the third A signal line driver circuit 4323 is provided on an element substrate constituting a display panel 4313. Electrically connected via C4324. FPC4324 is printed circuit board 4 325.

[0124] In Figure 15, the display panel can be folded using FPC4324. It is possible to adopt a configuration in which no part is provided.

[0125] Next, a double-sided display type second display panel 4312 is placed between the first display panel 4311 and the second display panel 4312. Explain the structure and functions of an e-book equipped with the 3-panel display using block diagrams, etc. In addition, the electronic book in this embodiment uses a self-generating display element for the display panel. This is particularly suitable for light-emitting devices such as light-emitting devices and liquid crystal devices that control the transmission of light such as backlights. However, the display element of the electronic book may be other display elements such as electrophoretic elements. It is noted that this is applicable.

[0126] FIG. 16 shows a block diagram of an electronic book described in this embodiment. The electronic book shown in FIG. , a first display panel 701, a second display panel 702, and a third display panel 703, The fourth display panel 704 and the display control unit 705 are included. The second display panel 702 has a scanning line driving circuit 706A and a first display section 707A. The third display panel 703 has a scanning line driving circuit 706B and a second display section 707B. The fourth display panel 704 has a scanning line driving circuit 706C and a third display section 707C. It has a scan line driver circuit 706D and a fourth display section 707D.

[0127] As described in the above embodiment, the first display panel 701 to the fourth display panel Each of the display control circuits 704 has flexibility and includes the signal line driver circuit described in the above embodiment mode. The sheet is fixed by a binding portion having a portion 705 formed therein.

[0128] The third display panel 703 and the fourth display panel 704 are dual-emission type display panels. By using the third display unit 707C, a fourth display unit 707D is provided. 3, the electronic book can be made thinner and less expensive. come.

[0129] Each of the first display unit 707A to the fourth display unit 707D has a plurality of pixels 708. Each of the plurality of pixels 708 includes a pixel circuit 710 for controlling a display element. The pixel circuit 710 includes thin film transistors and the like, and forming them all at once results in low current consumption. The first display unit 707A has a light sensor 709A, and the second display unit 707B has a light sensor 709B, and the third display unit 707C has a light sensor 709C. The fourth display unit 707D includes a light sensor 709D.

[0130] The scanning line driver circuits 706A to 706D are the pixel circuit in the pixel 708. 7, which provides a scan signal to line 710.

[0131] As described in the above embodiment, the optical sensors 709A to 709D are 701 and the third display panel 703, or the second display panel 702 and the fourth display panel 704. The function described in this embodiment can be realized by a tilt detection unit on the display panel or another open / close detection means. It is also possible to realize this function.

[0132] In addition, the optical sensor 709C and / or the optical sensor 709D are the same as the optical sensor 709A and / or Alternatively, it can be omitted by increasing the accuracy of the illuminance of the optical sensor 709B. Instead of the light sensor 709C and / or the light sensor 709D, a light blocking portion may be provided. This can improve the accuracy of the illuminance of the light sensor 709A and / or the light sensor 709B. Furthermore, even if a light-transmitting substrate is used, it can be detected by an optical sensor, which is preferable. do.

[0133] The optical sensors 709A to 709D are formed by thin film transistors included in the pixel circuit 710. A photo sensor such as a photodiode or phototransistor is mounted on the substrate. The photosensors 709A to 709D may be formed together with thin film transistors. This will help reduce the cost of e-books.

[0134] The display control unit 705 located in the binding unit 4308 includes a light intensity comparison circuit 711, a CPU 712, , internal memory 713, video signal generating circuit 714, power supply circuit 715, signal transmitting / receiving unit 71 6, power supply unit 717, operation unit 718, signal line driver circuits 714A to 714D Each component is connected via an interface or the like. The configuration includes an antenna unit 719 for transmitting and receiving data to and from an external device. Good too.

[0135] The light intensity comparison circuit 711 detects signals from the optical sensors 709A to 709D. The light intensity comparison circuit 711 is a circuit that compares the strength of the signal according to the illuminance. The signal corresponding to the intensity of the sensor is encoded. The optical sensor 709A and / or the optical sensor 709C of the third display panel 703, The optical sensor 709B of the first display panel 702 and / or the fourth display panel 704 and / or the optical sensor 709D, and compares the signal corresponding to the illuminance with the optical sensor 709C. The signal is sent to the CPU 712, which processes the signal accordingly. The PU 712 also performs processing in response to operations on the operation unit 718 .

[0136] The signal transmission / reception unit 716 transmits data received by the antenna unit 719 or data stored in a recording medium. The internal memory 713 has a function of transferring the data stored in the memory 713 to the internal memory 713. The data is stored in the internal memory 713 via the interface, etc. The data to be transferred includes the video signal to be displayed on the display panel, as well as user IDs, etc. It may also be something that stores information.

[0137] The internal memory 713 stores signals from the light intensity comparison circuit 711, the power supply unit 717, the operation unit 718, etc. A signal to be output to the video signal generating circuit 714 and / or the power supply circuit 715 based on Programs for processing by the CPU 712 and data transferred from the signal transmission / reception unit 716 , and the internal memory 713 has a storage unit that stores the ROM (Read Only Memory). Only Memory (RAM) and RAM (Random Access Memory) It is something that is accomplished.

[0138] The power supply unit 717 supplies power wirelessly or via a wire, or uses a storage battery, a capacitor, or the like. The operation unit 718 has a function of supplying power by a touch panel, a movable The user's operation based on the operation buttons or the like that can operate the unit is encoded and transferred to the CPU 712. The present invention has a means for:

[0139] The video signal generating circuit 714, under the control of the CPU 712, outputs the first display panel 701 to the A scanning line driver circuit for driving the fourth display panel 704 to turn on and off the display A clock signal, a start pulse, etc. are input to each of the scanning line driving circuits 706A to 706 D, and a clock signal for driving a signal line driving circuit provided in the binding section, A start pulse, a video signal, etc. are supplied to each of the signal line driver circuits 714A to 714D. This is a circuit for supplying power.

[0140] The signal line driver circuits 714A to 714D are the pixel circuit An image signal is supplied to the line 710 via a signal line.

[0141] The power supply circuit 715 supplies the first to fourth display panels 701 to 704 under the control of the CPU 712. To control the power supply to the display element in order to turn on and off the display panel 704 For the sake of explanation, in FIG. 16, the first display unit 707A is provided in the power supply circuit 715. a power supply circuit 715A that supplies power to the first display unit 707B; a power supply circuit 715B for supplying power to the third display unit 707C; Illustrated is a power supply circuit 715D that supplies power to a display unit 707D.

[0142] The operation of the electronic book shown in FIG. 16 will be described using an example. First, the optical sensors 709A to The illuminance of the display surface of each display panel obtained by 709D is compared by a light intensity comparison circuit 711. The CPU 712 receives the result of the comparison by the light intensity comparison circuit 711 or the signal from the operation unit 718. The signal from the optical sensor determines which display panel the user is viewing. 709A and / or light sensor 709C, and light sensor 709B and / or light sensor The illuminance of the optical sensor 709D is compared with the illuminance of the optical sensor 709A and / or the optical sensor 709C. is greater than the illuminance of the light sensor 709B and / or the light sensor 709D, the user The CPU 100 determines that the user is viewing the first display unit 707A and / or the third display unit 707C. Based on the determination at 712 as to which display panel the user is viewing, the video signal generating circuit 7 14 supplies video signals and control signals to the first display panel 701 to the fourth display panel 704. A signal and / or power supply circuit 715 supplies the first display panel 701 to the fourth display panel Specifically, the power supply to the second display 704 that is not visually recognized by the user is controlled. A second display panel 702 having a fourth display portion 707B and a fourth display portion 707D. By stopping the power supply to the panel 704, power consumption is reduced and the life of the display panel is extended. It is possible to achieve this.

[0143] The electronic book shown in FIG. 16 detects the page the user is viewing using a light sensor and a light intensity comparison circuit. By determining the current state, the system selectively switches between supplying image signals and power to the display panel. This allows us to provide e-books that consume less power and have a longer lifespan for the display panel. It can be provided.

[0144] This embodiment mode can be implemented in appropriate combination with the configurations described in other embodiments. It is.

[0145] (Embodiment 5) In this embodiment, an example of a display panel provided in an electronic book is shown. A display panel having a plurality of display elements can be applied, and it can be either a passive matrix type or an active matrix type. It can also be of the risk type.

[0146] Display panels include electronic paper, light-emitting display panels (EL (electroluminescence) A display panel, a liquid crystal display panel, or the like can be used. The panel is in a sealed state, and connectors, such as FPC (Flexible Printer Circuit) connected circuit) or TAB (Tape Automated Bond ing) tape or TCP (Tape Carrier Package) is attached. The signal line driver circuit is an IC that is electrically connected to an external circuit. Alternatively, the display panel may be directly mounted using a COG (Chip On Glass) method. .

[0147] The display panel can be either a double-sided display type that displays on both sides or a single-sided display panel that displays on only one side. It may be used.

[0148] In the fourth embodiment, the third display panel 4313 includes a third display unit 4302 and a fourth display unit 4303. The third display panel 4313 is a dual-side display panel having a dual-side emission display unit 4310. A single-sided emission type display panel may be used, or a single-sided emission type display panel may be attached to the display panel. In addition, two liquid crystal display panels with a backlight (preferably a thin EL panel) between them may also be used.

[0149] An example of a double-sided display panel is shown in FIG. 17(A) to (C) using a third display panel 4313. 17(A) to (C), the arrows indicate the emission direction of light.

[0150] FIG. 17A shows a third display panel in which a display element 102 is sandwiched between a substrate 100 and a substrate 101. 4313, the third display unit 4302 is on the substrate 100 side, and the fourth display unit 4304 is on the substrate 101 side. The display element 102 is provided with a third display portion 4302 and a fourth display portion 310. Since the display portion 4310 is to be displayed, the substrate 100 and the substrate 101 have a light-transmitting property. It is preferable that the third display panel 102 is an EL element, which is a self-luminous light-emitting element. When light incident on the panel 4313 is used, a liquid crystal display element or an electrophoretic display element is used as the display element 102. Moving display elements may also be used.

[0151] FIG. 17B shows a single-sided display including a display element 114 sandwiched between a substrate 110 and a substrate 112. A single-sided display panel including a display element 115 sandwiched between a substrate 111 and a substrate 113. The third display panel 4313 is a laminate of the third display unit 4302 and the third display unit 4303 on the substrate 110 side. A fourth display unit 4310 is provided on the substrate 111 side. The display portion 4302 is displayed, and the fourth display portion 4310 is displayed by the display element 115. Therefore, the substrates 110 and 111 are light-transmitting. The single-sided display panels do not need to have a light-transmitting property, but may have a reflective property. The plate 112 and the substrate 113 may be bonded together by an adhesive layer. 2 and the substrate 113 may be used alone.

[0152] It is preferable to use an EL element for the display element 114 and the display element 115. When light incident on the panel 4313 is used, the display elements 114 and 115 are liquid crystal displays. A liquid crystal display element or an electrophoretic display element can also be used. Therefore, it is preferable to use a reflective display panel as the single-sided display panel.

[0153] A backlight may be provided between the light-transmitting liquid crystal display panels to serve as a third display panel 4313. FIG. 17C shows a light-transmitting device including a display element 124 sandwiched between a substrate 120 and a substrate 122. A liquid crystal display panel and a transparent substrate including a display element sandwiched between a substrate and a substrate. A third display panel is formed by stacking a light-emitting type liquid crystal display panel through a backlight 126 serving as a light source. The third display unit 4302 is disposed on the substrate 120 side, and the fourth display unit 4303 is disposed on the substrate 121 side. The third light source 4310 is provided by the light of the backlight 126 and the display element 124. The display unit 4302 is displayed, and the fourth Since the display unit 4310 is displayed, the substrates 120, 121, 122, and 123 are It has light-transmitting properties.

[0154] The single-sided display panel and the backlight may be bonded together using an adhesive layer. Also, only one of the substrate 122 and the substrate 123 may be used. If a thin EL panel is used as the 126, the third display panel 4313 can be made thin. This is preferable.

[0155] In the case of a single-sided display panel, a non-transparent or reflective housing is provided on the side on which the display unit is not provided. Providing such a film is preferable because it can improve the strength of the display panel.

[0156] One embodiment of a display panel will be described with reference to FIGS. 18 to 20. 18 to 20 and 22 correspond to the cross-sectional view taken along line MN in FIG. A first display portion 4301 having a pixel circuit and a first display portion 4322a having a scanning line driver circuit This is an example in which an FPC 4324 is attached to a panel 4311, and the FPC 4324 is installed on an element substrate 4331a. The first display portion 4301 and the scanning line driver circuit 4322a are covered with a sealant 4005. The semiconductor device is sealed with a sealing substrate 4332a.

[0157] As shown in FIG. 18 to FIG. 20 and FIG. 22, the first display panel 4311 has a connection terminal electrode The connecting terminal electrode 4015 and the terminal electrode 401 6 is electrically connected to the terminal of the FPC 4324 via the anisotropic conductive film 4019. There are.

[0158] The connection terminal electrode 4015 is formed from the same conductive film as the first electrode layer 4030. 016 is the same as the source electrode layer and the drain electrode layer of the thin film transistors 4010 and 4011. The substrate is made of the same conductive film.

[0159] As shown in FIG. 4, a single crystal semiconductor film or a polycrystalline semiconductor film is formed on a separately prepared substrate. The signal line driver circuit 4323a formed of a film is mounted by FPC, and is connected to the binding portion 4308. The signal line driver circuit 4323a, the scanning line driver circuit 4322a, and the first table Various signals and potentials are provided to the display unit 4301 through an FPC 4324 .

[0160] The method of connecting the signal line driver circuit 4323a is not particularly limited, and may be a COG method. The method may be a soldering method, a wire bonding method, a TAB method, or the like.

[0161] A first display portion 4301 and a scanning line driver circuit 432 are provided on an element substrate 4331a. 1a has a plurality of thin film transistors, and in FIGS. 18 to 20, the first display unit 430 1 and a thin film transistor 4010 included in the scanning line driver circuit 4321a. The thin film transistors 4010 and 4011 are illustrated. Layers 4020 and 4021 are provided. Note that the insulating film 4023 functions as a base film. It is an insulating film.

[0162] The thin film transistors 4010 and 4011 are not particularly limited and various thin film transistors can be used. In FIG. 18 to FIG. 20, the thin film transistors 4010 and 4011 are An example of using an inverted staggered thin film transistor with a bottom gate structure is shown. Thin film transistor 40 10 and 4011 show channel etch type, but the channel with a channel protection film on the semiconductor layer is Alternatively, a panel-protected inversely staggered thin film transistor may be used.

[0163] The thin film transistor 4010 provided in the first display portion 4301 is electrically connected to a display element. The display element is not particularly limited as long as it can perform display, and various A display element can be used.

[0164] Electronic paper can be used as the display panel. The means of displaying the image are electric field, magnetic field, light, or heat. The change in the display medium is caused by changes in shape or position. There are many methods using various combinations of physical changes, such as twisting. Ball type, electrophoretic type, powder type (also called toner display), liquid crystal type etc.

[0165] In FIG. 18 and FIG. 22, an active matrix type electronic page is used as the first display panel 4311. Here is an example using a paper. Electronic paper has the same readability as paper, but is less sensitive than other display panels. It has the advantages of low power consumption and the possibility of having a thin and lightweight shape.

[0166] 18(A)(B) and 22 show an example of an active matrix type electronic display panel. Show paper.

[0167] The electronic paper in FIG. 18A is an example of a display device using a twisting ball display method. The twist ball display method uses black and white spherical particles as display elements. By placing the electrodes between the layers and creating a potential difference between the layers, the orientation of the spherical particles can be controlled. It is a method for displaying.

[0168] A first electrode layer 4030 connected to the thin film transistor 4010 and a sealing substrate 4332a are provided. Between the second electrode layer 4031 and the black area 4615a and the white area 4615b are formed. A spherical particle 4613 is provided having a cavity 4612 around which the cavity is filled with liquid. The spherical particles 4613 are filled with a filler 4614 such as resin. The electrode layer 4031 corresponds to a common electrode (opposite electrode). It is electrically connected to the line.

[0169] Also, instead of the twist ball, an electrophoretic element can be used. An example of using an electrophoretic element as a detector is shown in FIG. 18(B). negatively charged black particles 4715a as the first particle and positively charged white particles as the second particle. Microcapsules 4713 with a diameter of about 10 μm to 200 μm containing 4715b are used. There are.

[0170] Microcapsules 47 provided between the first electrode layer 4030 and the second electrode layer 4031 13, when an electric field is applied by the first electrode layer 4030 and the second electrode layer 4031, White particles 4715b and black particles 4715a move in opposite directions, showing white or black. The display element that applies this principle is the electrophoretic display element. The display element has high reflectivity, so auxiliary lights are not required, and it consumes little power and is dim. The display can be recognized even in a place where the power is not supplied to the display. Even if radio waves are emitted, it is possible to retain an image once it has been displayed, so the display panel This makes it possible to store the displayed image even if the user moves away from the device.

[0171] The first and second particles contain a dye and do not move in the absence of an electric field. In addition, the first particles and the second particles are different in color (including colorless).

[0172] The microcapsules dispersed in a solvent are called electronic ink. The electronic ink can be printed on surfaces such as glass, plastic, fabric, and paper. A color display is also possible by using a color filter or particles having a pigment.

[0173] The first particles and the second particles in the microcapsules are made of a conductive material, an insulating material, Semiconductor materials, magnetic materials, liquid crystal materials, ferroelectric materials, electroluminescent materials, A material selected from the group consisting of magnetochromic material, magnetophoretic material, and a composite material thereof. Just use it.

[0174] It is also possible to use electronic liquid powder (registered trademark) as a powder system. An example of using electronic liquid powder as a magnet is shown in FIG. 22. 1, and a positively charged black powder 4815a is placed in a space 4812 defined by a rib 4814. and negatively charged white powder 4815b. Space 4812 is filled with air.

[0175] When an electric field is applied by the first electrode layer 4030 and the second electrode layer 4031, the black powder particles The white powder 4815a and the white powder 4815b move in opposite directions, displaying white or black. As the powder, color powder such as red, yellow, and blue may be used.

[0176] In addition, the display element is a light-emitting element (EL element) that uses electroluminescence. The light-emitting element utilizing electroluminescence may be made of an organic compound. Generally, the former are organic EL elements and the latter are inorganic compounds. are called inorganic EL elements.

[0177] In an organic EL element, electrons and holes are released from a pair of electrodes by applying a voltage to the light-emitting element. are injected into layers containing light-emitting organic compounds, causing a current to flow. The rears (electrons and holes) recombine to form an excited state in the light-emitting organic compound. When the excited state returns to the ground state, light is emitted. Such a light-emitting element is called a current-excitation type light-emitting element.

[0178] Inorganic EL elements are divided into dispersion-type inorganic EL elements and thin-film-type inorganic EL elements according to their element structure. Dispersion-type inorganic EL elements have a light-emitting layer in which particles of a light-emitting material are dispersed in a binder. The emission mechanism is a donor-acceptor reaction that utilizes the donor and acceptor levels. Thin-film inorganic EL elements are made by sandwiching a light-emitting layer between dielectric layers. The structure is sandwiched between electrodes, and the light emission mechanism utilizes the inner shell electron transition of metal ions. In this example, the light-emitting element is an organic EL element. do.

[0179] In order to extract light emitted from the light-emitting element, at least one of the pair of electrodes must be transparent. Then, a thin film transistor and a light emitting element are formed on the substrate, and light is emitted from the surface opposite to the substrate. Top emission, bottom emission, and both the substrate side and the opposite side of the substrate. There are light emitting devices with a double-sided emission structure that emits light from both sides, and light emitting devices with any emission structure can be used. It is possible.

[0180] FIG. 19 shows an example in which a light-emitting display panel (EL panel) is used as the first display panel 4311. The light-emitting element 4513 which is a display element is a thin film transistor provided in the display portion 4301. The light-emitting element 4513 is electrically connected to the first electrode layer 403. 0, an electroluminescent layer 4511, and a second electrode layer 4031 are laminated, but the structure is not limited to the one shown. The direction of the light emitted from the light emitting element 4513 is adjusted according to the direction of the light. The configuration can be changed as appropriate.

[0181] The partition 4510 is formed using an organic resin film, an inorganic insulating film, or an organic polysiloxane. In particular, a photosensitive material is used to form an opening on the first electrode layer 4030, and the sidewall of the opening It is preferable that the inclined surface is formed so as to have a continuous curvature.

[0182] The electroluminescent layer 4511 may be composed of a single layer or may be composed of a plurality of layers stacked together. It doesn't matter whether it is done or not.

[0183] In order to prevent oxygen, hydrogen, moisture, carbon dioxide, and the like from entering the light-emitting element 4513, the second electrode layer A protective film may be formed on the partition wall 4510 and the insulating film 4031. The protective film may be a silicon nitride film, A silicon oxynitride film, a DLC film, or the like can be formed. A filler 4514 is provided in the space sealed by the substrate 4332a and the sealant 4005. In this way, the container is airtight and has little outgassing, so that it is not exposed to the outside air. Packaging with protective film (lamination film, UV curing resin film, etc.) or cover material It is preferable to enclose the compound in a container.

[0184] Filler 4514 can be inert gas such as nitrogen or argon, or ultraviolet curing resin or Thermosetting resin can be used, and PVC (polyvinyl chloride), acrylic, polyimide, etc. Mido, epoxy resin, silicone resin, PVB (Polyvinyl Butyral) or EVA (Elastomer) For example, nitrogen may be used as a filler. stomach.

[0185] If necessary, a polarizing plate or a circular polarizing plate (including an elliptical polarizing plate) may be provided on the light-emitting surface of the light-emitting element. Optical films such as retardation plates (λ / 4 plates, λ / 2 plates) and color filters may be provided as appropriate. In addition, the polarizing plate or the circular polarizing plate may be provided with an anti-reflection film. Anti-glare treatment can be applied to diffuse reflected light and reduce glare.

[0186] FIG. 20 shows an example in which a liquid crystal display panel is used as the first display panel 4311. In the liquid crystal element 4013 which is a display element, a first electrode layer 4030 and a second electrode layer 403 1, and a liquid crystal layer 4008. The liquid crystal layer 4008 is sandwiched between two layers functioning as alignment films. The second electrode layer 4031 is provided on the sealing substrate 4. 332a side, and the first electrode layer 4030 and the second electrode layer 4031 are disposed on the liquid crystal layer 400. The structure is such that the layers are stacked via 8.

[0187] Also, 4035 is a columnar spacer obtained by selectively etching the insulating film. It is provided to control the thickness (cell gap) of the liquid crystal layer 4008. A pacer may be used.

[0188] Although not shown in the liquid crystal display device of FIG. 20, a color filter (colored layer), a black matrix Optical components (optical substrates) such as trix (light-shielding layer), polarizing components, phase difference components, and anti-reflection components For example, circular polarization using a polarizing substrate and a retardation substrate may be used. A backlight, a sidelight, or the like may be used as the light source. The use of an L panel is preferable since it allows for a thinner display.

[0189] Alternatively, a liquid crystal that exhibits a blue phase without using an alignment film may be used. The blue phase is one of the liquid crystal phases. When the temperature of cholesteric liquid crystal is increased, the phase immediately transitions from the cholesteric phase to the isotropic phase. The blue phase appears only in a narrow temperature range, so it is necessary to improve the temperature range. In order to achieve this, a liquid crystal composition containing 5% by weight or more of a chiral agent is used for the liquid crystal layer 4008. A liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a response speed of 10 μs to It is short at 100μs, has optical isotropy so no alignment treatment is required, and has small viewing angle dependency. stomach.

[0190] Although FIG. 20 shows an example of a transmissive liquid crystal display panel, a semi-transmissive liquid crystal display panel can also be used in a reflective liquid crystal display panel. The present invention can also be applied to LCD panels.

[0191] 18 to 20 and 22, the element substrate 4331a, the sealing substrate 4332 As the material a, a plastic having light-transmitting properties can be used. For example, FRP (Fiberglass-Reinforced Plastics) plates, PVF (Polyvinyl fluoride) film, polyester film, polyester film Film or acrylic resin film can be used. Aluminum foil can also be used. A sheet sandwiched between VF films or polyester films can also be used.

[0192] The insulating layer 4020 functions as a protective film for the thin film transistor.

[0193] The protective film prevents the intrusion of contaminating impurities such as organic matter, metals, and water vapor suspended in the air. The protective film is a silicon oxide film formed by sputtering. , silicon nitride film, silicon oxynitride film, silicon nitride oxide film, aluminum oxide film, aluminum nitride The aluminum oxide film, the aluminum nitride film, or the aluminum nitride oxide film is a single layer or a laminated layer. That's good.

[0194] The insulating layer 4021 functioning as a planarizing insulating film is made of polyimide, acrylic, or benzosilane. Heat-resistant organic materials such as clobutene, polyamide, and epoxy can be used. In addition to the above organic materials, low-k materials, siloxane resins, and PS G (phosphorus glass), BPSG (borophosphorus glass), etc. can be used. The insulating layer may be formed by stacking a plurality of insulating films made of these materials.

[0195] The method for forming the insulating layers 4020 and 4021 is not particularly limited. ttach method, SOG method, spin coat, dip, spray coating, droplet ejection method (inkjet printing, screen printing, offset printing, etc.), doctor knife, roll coater, A coating machine, knife coater, etc. can be used. The insulating layer is formed using a material liquid. In this case, annealing the semiconductor layer (200℃ to 400℃) at the same time as the baking process is performed. By combining the firing process of the insulating layer with the annealing process of the semiconductor layer, display panels can be manufactured efficiently. It becomes possible to do so.

[0196] The display panel transmits light from a light source or a display element to perform display. The substrate, other insulating films, conductive films, and other thin films provided in the display unit are all resistant to light in the visible light wavelength range. This makes it translucent.

[0197] A first electrode layer 4030 and a second electrode layer 4031 (pixel electrode layer) for applying a voltage to a display element In the case of the layer (also called the common electrode layer, counter electrode layer, etc.), the direction of the light to be extracted and the electrode layer are provided. The light transmission or reflection can be selected depending on the location where the electrode layer is to be disposed and the pattern structure of the electrode layer.

[0198] The first electrode layer 4030 and the second electrode layer 4031 are made of indium oxide containing tungsten oxide. oxide, indium zinc oxide with tungsten oxide, indium oxide with titanium oxide Indium tin oxide (ITO) ), indium zinc oxide, indium tin oxide with added silicon oxide, etc. A conductive material that can be used.

[0199] The first electrode layer 4030 and the second electrode layer 4031 are made of tungsten (W) or molybdenum. (Mo), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (N b) Tantalum (Ta), Chromium (Cr), Cobalt (Co), Nickel (Ni), Titanium Metals such as titanium (Ti), platinum (Pt), aluminum (Al), copper (Cu), and silver (Ag), It can be formed by using one or more of the following metals: Cut.

[0200] The first electrode layer 4030 and the second electrode layer 4031 are made of a conductive polymer (conductive polymer). The conductive polymer may be a conductive composition containing a conductive polymer. For example, a so-called π-electron conjugated conductive polymer can be used. or its derivatives, polypyrrole or its derivatives, polythiophene or its derivatives, and copolymers of two or more of these.

[0201] In addition, since thin-film transistors are easily damaged by static electricity, etc., protective It is preferable to provide a protection circuit. The protection circuit is preferably configured using a nonlinear element. .

[0202] This embodiment mode can be implemented in appropriate combination with the configurations described in other embodiments. It is.

[0203] (Embodiment 6) In this embodiment, examples of materials and element structures constituting an electronic book will be described in detail.

[0204] Since the signal line driver circuit is provided in the binding portion, it does not need to be particularly flexible. A semiconductor that uses a semiconductor substrate (semiconductor wafer) capable of high-speed operation as a signal line driver circuit. It is preferable to use an integrated circuit chip (IC). The substrate may be a polycrystalline semiconductor substrate, such as a silicon wafer or a germanium wafer. semiconductor wafers, compound semiconductor wafers such as gallium arsenide and indium phosphide, etc. do.

[0205] In addition, a substrate having an SOI structure in which a single crystal semiconductor layer is provided on an insulating surface is used for the signal line driver circuit ( A SOI substrate may be used. The SOI substrate is a SIMOX (Separation by Insulation) It can be formed using the IMplanted Oxygen method or the Smart-Cut method. The SIMOX method implants oxygen ions into a single crystal silicon substrate to a specified depth. After forming the oxygen-containing layer, a heat treatment is performed to form a buried insulating layer at a certain depth from the surface. This is a method of forming a single crystal silicon layer on a buried insulating layer. Hydrogen ions are implanted into the oxidized single crystal silicon substrate to form hydrogen ions at a desired depth. A silicon-containing layer is formed on the surface of another semiconductor substrate (a single crystal having a silicon oxide film for bonding). A single crystal silicon substrate is bonded to the substrate, and a heat treatment is performed to form a hydrogen-containing layer. The silicon substrate is divided, and a silicon oxide film and a single crystal silicon layer are laminated on the semiconductor substrate. This is a way to achieve this.

[0206] Semiconductor elements installed in the circuit section of electronic books include not only field effect transistors but also semiconductors. It can also be used for memory (storage) elements that use conductor layers, and is in demand for a wide range of applications. It is possible to provide a semiconductor integrated circuit that fulfills the functions described above.

[0207] There is no particular limitation on the method for providing the scanning line driving circuit and the display section on the flexible substrate of the display panel. The scanning line driver circuit and the display portion may be directly formed on the flexible substrate, or may be formed by other fabrication methods. The device is fabricated on a substrate, and then only the element layer is transferred from the fabrication substrate to a flexible substrate by a peeling method. For example, a scanning line driver circuit and a display portion may be formed on a manufacturing substrate in the same process. The line driver circuit and the display portion can be provided by being transferred to a flexible substrate of the display panel. In this case, the scanning line driver circuit and the display section are formed in the same process, so that transistors of the same structure and material can be used. Therefore, the scanning line driving circuit and the display unit are preferably made of a scanning electrode. The channel layers of the transistors are made of the same material.

[0208] In addition, the substrate is transferred from the substrate to a flexible support substrate, and the substrate is formed into a display panel substrate together with the flexible support substrate. For example, a plurality of scanning line driver circuits may be formed on a manufacturing substrate, and the scanning line driver circuits may be attached to a flexible substrate. After the flexible support substrate is transferred to the support substrate, it is cut into individual scanning line driver circuits. The display panel is provided with a flexible support substrate on which a scanning line driving circuit is bonded as required. In this case, the scanning line driver circuit and the display portion are manufactured in separate steps. Transistors of various configurations and materials can be selected.

[0209] The above-mentioned transposition method and direct formation method may be combined. For example, a printing method or the like may be used. The wiring that electrically connects the display section, scanning line driving circuit section, FPC, etc. is attached to the flexible substrate of the display panel. It may be formed directly on the plate.

[0210] The preparation substrate may be appropriately selected in accordance with the preparation process of the element layer. The substrates are glass substrates, quartz substrates, sapphire substrates, ceramic substrates, and substrates with an insulating layer on the surface. A metal substrate having a surface on which the film is formed can be used. A plastic substrate may also be used.

[0211] As flexible substrates, aramid resin, polyethylene naphthalate (PEN) resin, and polyethylene terephthalate (PEN) resin are used. Polyphenylene sulfide (PES) resin, polyphenylene sulfide (PPS) resin, polyimide In addition, a structure in which fibers are impregnated with organic resin can be used. Certain prepregs may also be used.

[0212] The method for transferring the element layer from the substrate to another substrate is not particularly limited, and various methods can be used. For example, a separation layer may be formed between the formation substrate and the element layer.

[0213] In this specification, the element layer refers to not only the semiconductor element layer provided on the element substrate side, but also the opposing This also includes the counter electrode layer provided on the substrate side. Therefore, the peeling process is performed on both the element base side and the sealing substrate side. In addition, in consideration of the simplicity of the process, the substrate is transferred to a flexible substrate. After that, the flexible substrate is temporarily attached to a glass substrate or the like in the manufacturing process, and the manufacturing process is continued. It is also possible.

[0214] The release layer is formed by sputtering, plasma CVD, coating, printing, etc. W, Molybdenum (Mo), Titanium (Ti), Tantalum (Ta), Niobium (Nb), Nickel (Ni), cobalt (Co), zirconium (Zr), zinc (Zn), ruthenium Ru, Rh, Palladium (Pd), Os, Iridium (Ir), silicon (Si), or an alloy material mainly composed of the element, or A layer made of a compound material containing the above element as a main component is formed as a single layer or a laminate. The crystal structure of the layer may be amorphous, microcrystalline, or polycrystalline. Fabrication methods include spin coating, droplet ejection, and dispensing.

[0215] When the release layer has a single-layer structure, it is preferably a tungsten layer, a molybdenum layer, or a tungsten layer. A layer containing a mixture of tungsten and molybdenum is formed. Alternatively, a layer containing tungsten oxide or oxide A layer containing a nitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten and A layer containing a mixture of oxide or oxynitride of molybdenum is formed. The mixture of tungsten and molybdenum corresponds, for example, to an alloy of tungsten and molybdenum.

[0216] When the release layer has a laminated structure, the first layer is preferably a tungsten layer, a molybdenum layer, or The first layer is a mixture of tungsten and molybdenum, and the second layer is a mixture of tungsten and molybdenum. Oxides, nitrides, oxynitrides or nitrides of molybdenum or mixtures of tungsten and molybdenum Forms an oxide.

[0217] A laminated structure of a layer containing tungsten and a layer containing tungsten oxide is formed as a peeling layer. In this case, a layer containing tungsten is formed, and an insulating layer made of oxide is formed on the layer containing tungsten. By this, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating layer. Furthermore, the surface of the layer containing tungsten may be subjected to a thermal oxidation treatment, Oxygen plasma treatment, treatment with strong oxidizing solutions such as ozone water, etc., are used to remove tungsten oxide. In addition, the plasma treatment or heat treatment may be performed using oxygen, nitrogen, or dioxide. The treatment may be carried out under an atmosphere of nitrogen alone or a mixture of the above gases with other gases. The same applies to the case of forming a layer containing a tungsten nitride, oxynitride, or nitride oxide. After forming a layer containing tungsten, a silicon nitride layer, a silicon oxynitride layer, and a silicon oxynitride layer are formed on the layer. A silicon carbide layer may be formed.

[0218] In the transfer step to another substrate, a separation layer is formed between the substrate and the element layer, and the separation layer and the element layer are A metal oxide film is provided between the element layer and the metal oxide film is weakened by crystallization, and the element layer is peeled off. A method for forming an amorphous silicon film containing hydrogen between a heat-resistant substrate and an element layer, The amorphous silicon film is removed by irradiation or etching, and the element layer is peeled off. A method for manufacturing a semiconductor device, comprising: forming a release layer between a substrate and an element layer; and providing a metal oxide film between the release layer and the element layer. The metal oxide film is weakened by crystallization, and part of the peeling layer is dissolved in a solution or NF3, BrF3, Cl After etching with halogen fluoride gas such as F3, the weakened metal oxide film is The method is to mechanically remove the substrate on which the element layer is formed, or to remove the substrate by using a solution such as NF3, BrF 3. Use a method of removing the material by etching with halogen fluoride gas such as ClF3, etc., as appropriate. In addition, a film containing nitrogen, oxygen, hydrogen, etc. (e.g., an amorphous film containing hydrogen) can be used as the peeling layer. A film containing a silicon oxide, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) is used, and the peeling layer is irradiated with a laser beam. Nitrogen, oxygen, and hydrogen contained in the peeling layer are released as gas to promote peeling between the element layer and the substrate. Alternatively, the following method may be used.

[0219] By combining the above peeling methods, the transposition process can be carried out more easily. irradiation of the light, etching of the peeling layer with gas or solution, or cutting with a sharp knife or scalpel After mechanical removal to make it easier to separate the release layer and the element layer, physical force (mechanical Peeling can also be performed by mechanical means.

[0220] Alternatively, the element layer may be peeled off from the substrate by permeating a liquid into the interface between the peeling layer and the element layer. Water or the like can be used as the body.

[0221] The transistors included in the electronic book disclosed in this specification are not particularly limited. Various structures and semiconductor materials can be used.

[0222] An example of the structure of a thin film transistor will be described with reference to FIG. 21. FIG. 21 shows the structure of a thin film transistor according to the fifth embodiment. 4 is an example of a thin film transistor that can be used as the thin film transistor 4010 in the semiconductor device.

[0223] In FIG. 21(A) to (D), an insulating film 4023 is formed on an element substrate 4331a. Thin film transistors 4010a, 4010b, 4010c, and 4010d are formed on the insulating film 4023. Thin film transistors 4010a, 4010b, 4010c, and 4010d are provided. An insulating layer 4020 and an insulating layer 4021 are formed on the thin film transistors 4010a and 401 A first electrode layer 4030 is provided to electrically connect to the first electrodes 4010b, 4010c, and 4010d. do.

[0224] The thin film transistor 4010a corresponds to the thin film transistor 4010 in FIG. In the semiconductor device, wiring layers 405a and 405b functioning as a source electrode layer and a drain electrode layer and a semiconductor The conductor layer 403 and + The structure is such that the two are in contact without any intervening layer.

[0225] The thin film transistor 4010a is an inverted staggered thin film transistor having an insulating surface. A gate electrode layer 401 and a gate insulating film 4023 are formed on an element substrate 4331a, which is a substrate. A layer 402, a semiconductor layer 403, a wiring layer 40 functioning as a source electrode layer or a drain electrode layer, 5a, 405b. +The layers 404a and 404b are semiconductor layers having a lower resistance than the semiconductor layer 403. This is the body layer.

[0226] The thin film transistor 4010b is a bottom-gate type thin film transistor having an insulating surface. On an element substrate 4331a, which is a substrate to be used, and an insulating film 4023, a gate electrode layer 401 and a gate The insulating layer 402 and the wiring layers 405a and 405b functioning as source and drain electrode layers are b, n acting as a source region or a drain region + Layers 404a, 404b, and the semiconductor The insulating layer 403 covers the thin film transistor 4010b and is in contact with the semiconductor layer 403. An edge layer 4020 is provided.

[0227] In addition, n + The layers 404a and 404b are formed by the gate insulating layer 402 and the wiring layers 405a and 405b. It may be structured so that the n + The layers 404a and 404b are gate insulating layers and wiring layers. A structure in which the insulating film is provided both between the layers and between the wiring layer and the semiconductor layer may be used.

[0228] The thin film transistor 4010b is a gate electrode in the entire region including the thin film transistor 4010b. A substrate having a gate insulating layer 402 and an insulating surface. A gate electrode layer 401 is provided between the gate insulating layer 402 and the gate insulating layer 403. Layers 405a, 405b, and n + Layers 404a and 404b are provided. The insulating layer 402, the wiring layers 405a, 405b, and + On the layers 404a and 404b, a semiconductor Although not shown, a wiring layer 403 is provided on the gate insulating layer 402. In addition to 5a and 405b, a wiring layer is provided, and the wiring layer extends outward from the outer periphery of the semiconductor layer 403. It exists.

[0229] The thin film transistor 4010c is the same as the thin film transistor 4010b except that the source electrode layer and The drain electrode layer and the semiconductor layer are + The structure is such that the two are in contact without any intervening layer.

[0230] The thin film transistor 4010c is a gate electrode in the entire region including the thin film transistor 4010c. A substrate having a gate insulating layer 402 and an insulating surface. A gate electrode layer 401 is provided between the gate insulating layer 402 and the gate insulating layer 403. The gate insulating layer 402 and the wiring layer 405a are provided. A semiconductor layer 403 is provided on the gate insulating layer 405b. 402 has a wiring layer in addition to wiring layers 405a and 405b, and the wiring layer is a semiconductor layer 403 It extends outward from the outer periphery of the

[0231] The thin film transistor 4010d is a top-gate type thin film transistor. The transistor 4010d is an example of a planar thin-film transistor. An element substrate 4331a has a portion on an insulating film 4023, which functions as a source region or a drain region. to + A semiconductor layer 403 including layers 404a and 404b, a gate insulating layer on the semiconductor layer 403 A gate insulating layer 402 is formed on the gate electrode layer 401. n + A wiring which is in contact with the layers 404a and 404b and serves as a source electrode layer or a drain electrode layer Layers 405a and 405b are formed. + The layers 404a and 404b are the semiconductor layer 403 This is a semiconductor region with lower resistance.

[0232] As the thin film transistor, a top-gate type forward staggered thin film transistor may be used.

[0233] In this embodiment, a single gate structure has been described, but a multi-gate structure such as a double gate structure may also be used. In this case, a gate electrode layer may be provided above and below the semiconductor layer. Alternatively, a structure in which a plurality of gate electrode layers are provided on only one side (upper or lower) of a semiconductor layer may be used.

[0234] The semiconductor material used for the semiconductor layer is not particularly limited. Examples of materials that can be used are described below.

[0235] The semiconductor layers of semiconductor elements are made of semiconductor materials such as silane and germanium. Amorphous (hereafter referred to as amorphous) is a material produced by vapor phase growth or sputtering using a gaseous source. (Also called "AS") semiconductors, and amorphous semiconductors using light energy or thermal energy. Crystallized polycrystalline semiconductor or microcrystalline (semi-amorphous or microcrystalline) Also called "SAS". ) Semiconductors can be used. The layer can be deposited by sputtering, LPCVD, plasma CVD, or the like. .

[0236] Considering the Gibbs free energy, the microcrystalline semiconductor film is a quasi-stable film intermediate between amorphous and single crystal. In other words, the third state is the most stable state in terms of free energy. Conductive, with short-range order and lattice distortion. Columnar or needle-shaped crystals are formed on the substrate surface. Microcrystalline silicon, a typical example of a microcrystalline semiconductor, grows in the normal direction. The 520 cm spectrum shows single crystal silicon. -1It is shifted to the lower wavenumber side than That is, 520 cm, which indicates single crystal silicon. -1 and 480 cm, which indicates amorphous silicon. -1 The Raman spectrum of microcrystalline silicon has a peak between these two. At least 1 atomic % or more of hydrogen or halogen is used to terminate the ring bond. It also contains rare gas elements such as helium, argon, krypton, and neon. By further promoting the lattice distortion by increasing the temperature, the stability of the microcrystalline semiconductor film is improved. do.

[0237] This microcrystalline semiconductor film is formed by a high-frequency plasma CVD method with a frequency of several tens to several hundreds of MHz. Alternatively, it can be formed by a microwave plasma CVD apparatus with a frequency of 1 GHz or more. Representative examples include SiH4, Si2H6, SiH2Cl2, SiHCl3, SiCl4, and S It can be formed by diluting silicon hydride such as iF4 with hydrogen. In addition to hydrogen, one or more of the following gases are selected: helium, argon, krypton, and neon A microcrystalline semiconductor film can be formed by diluting the silicon hydride with a rare gas element. The flow rate ratio of hydrogen to nitrogen is 5 to 200 times, preferably 50 to 150 times. More preferably, it is set to 100 times.

[0238] Representative examples of amorphous semiconductors include hydrogenated amorphous silicon and crystalline semiconductors. A typical example is polysilicon. Polysilicon (polycrystalline silicon) has the following features: The so-called "polysilicon-based" semiconductor is formed at a process temperature of 800°C or higher. The main materials are high-temperature polysilicon and polysilicon formed at process temperatures below 600°C. The so-called low-temperature polysilicon is used as a material for the crystallization of amorphous silicon. Of course, as mentioned above, it contains microcrystalline polysilicon. A semiconductor or a semiconductor layer that includes a crystalline phase in part can also be used.

[0239] In addition, semiconductor materials include elements such as silicon (Si) and germanium (Ge), Compound semiconductors such as GaAs, InP, SiC, ZnSe, GaN, and SiGe are also used. There can be.

[0240] When a crystalline semiconductor film is used as the semiconductor layer, the method for manufacturing the crystalline semiconductor film can be various. Methods (laser crystallization, thermal crystallization, or methods using elements that promote crystallization such as nickel) In addition, the SAS microcrystalline semiconductor can be irradiated with laser to form a crystal. If no element that promotes crystallization is introduced, the material will be amorphous. Before irradiating the silicon film with laser light, it is heated at 500°C for 1 hour in a nitrogen atmosphere. The hydrogen concentration of the amorphous silicon film is 1×10 20 atoms / cm 3 Release to the following: This is because when a hydrogen-rich amorphous silicon film is irradiated with laser light, the amorphous silicon film is destroyed. Because it will be put away.

[0241] The method of introducing a metal element into an amorphous semiconductor film is to introduce the metal element into the surface of the amorphous semiconductor film. There is no particular limitation as long as the method can make the surface or interior of the material present thereon. For example, sputtering, CVD, etc. method, plasma treatment method (including plasma CVD method), adsorption method, method of applying a solution of metal salts Among these, the method using a solution is simple and easy, and the concentration of the metal element can be adjusted. In addition, the wettability of the surface of the amorphous semiconductor film is improved. In order to spread the aqueous solution over the entire surface of the amorphous semiconductor film, UV light was applied in an oxygen atmosphere. by irradiation, thermal oxidation, or treatment with ozone water or hydrogen peroxide containing hydroxyl radicals. It is preferable to form an oxide film on the silicon substrate.

[0242] In addition, in the crystallization process of crystallizing the amorphous semiconductor film to form a crystalline semiconductor film, The film is added with an element (also called a catalytic element or metal element) that promotes crystallization, and then heat-treated (550 Crystallization may be performed by heating at 50°C to 750°C for 3 minutes to 24 hours. The elements that can be used are iron (Fe), nickel (Ni), cobalt (Co), and ruthenium (Ru ), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir) , platinum (Pt), copper (Cu) and gold (Au) can be done.

[0243] In order to remove or reduce the elements that promote crystallization from the crystalline semiconductor film, A semiconductor film containing an impurity element is formed in contact with the substrate to function as a gettering sink. As for the pure elements, impurity elements that give n-type, impurity elements that give p-type, and rare gas elements For example, phosphorus (P), nitrogen (N), arsenic (As), antimony ( Sb), Bismuth (Bi), Boron (B), Helium (He), Neon (Ne), Argon (Ar) One or more of the following elements are used: Ar (Ar), Kr (Krypton), and Xe (Xenon) A crystalline semiconductor film containing an element that promotes crystallization may be formed by adding a semiconductor containing a rare gas element. A conductive film is formed and heat treatment is performed (at 550°C to 750°C for 3 minutes to 24 hours). Crystalline semiconductor The elements that promote crystallization contained in the film move into the semiconductor film containing the rare gas element, and the crystallization is promoted. The elements that promote crystallization in the semiconductor film are removed or reduced. The semiconductor film containing the rare gas element that has become a mask is then removed.

[0244] The crystallization of the amorphous semiconductor film may be performed by combining a heat treatment and crystallization by laser light irradiation. The heat treatment or the laser light irradiation may be performed alone a plurality of times.

[0245] Alternatively, the crystalline semiconductor film may be formed directly on the substrate by a plasma method. A crystalline semiconductor film may be selectively formed on a substrate by using a method.

[0246] The semiconductor layer may be made of an oxide semiconductor, such as zinc oxide (ZnO) or tin oxide. (SnO2) can also be used. When ZnO is used for the semiconductor layer, the gate insulating layer The gate electrode layer, source electrode layer, etc. are made of Y2O3, Al2O3, TiO2, and laminations of these. The electrode layer and the drain electrode layer may be made of ITO, Au, Ti, or the like. In, Ga, etc. can also be added to ZnO.

[0247] InMO3(ZnO) as an oxide semiconductor m It is possible to use a thin film represented by (m>0) M can be any of gallium (Ga), iron (Fe), nickel (Ni), manganese (M n) and cobalt (Co). For example, M may be Ga, or may be any of the above except Ga, such as Ga and Ni or Ga and Fe. In some cases, a metal element is contained. In addition, in the above oxide semiconductor, the metal contained as M is In addition to the group elements, impurity elements include Fe, Ni, and other transition metal elements, or oxides of the transition metals. For example, the In-Ga-Zn-O system is used as an oxide semiconductor layer. Non-single crystal films can be used.

[0248] Oxide semiconductor layer (InMO3(ZnO) m (m>0) film) as In-Ga-Zn-O system Instead of a non-single crystal film, InMO3(ZnO) where M is another metal element m (m>0) Membrane In addition to the above, In may be used as an oxide semiconductor for the oxide semiconductor layer. -Sn-Zn-O, In-Al-Zn-O, Sn-Ga-Zn-O, Al-Ga- Zn-O series, Sn-Al-Zn-O series, In-Zn-O series, Sn-Zn-O series, Al-Z nO-based, In-O-based, Sn-O-based, and Zn-O-based oxide semiconductors can be used. .

[0249] This embodiment mode can be implemented in appropriate combination with the configurations described in other embodiments. It is. [Explanation of symbols]

[0250] 100 Substrates 101 Substrate 102 Display element 110 Substrate 111 Substrate 112 Substrate 113 Substrate 114 Display element 115 Display element 120 Substrate 121 Substrate 122 Substrate 123 Substrate 124 Display element 125 Display element 126 Backlight 200 Display control unit 201 CPU 203 Storage section 205 Power Supply Unit 207 Power supply circuit 209 Internal Memory 211 Data Entry Section 213 External Memory 215 Video signal generating circuit 216 Antenna 219 Operation section 401 Gate electrode layer 402 Gate insulating layer 403 Semiconductor Layer 404a n + layer 405a wiring layer 407 Insulating Film 421 Thin Film Transistor 701 First display panel 702 Second display panel 703 Third display panel 704 4th display panel 705 Display control unit 706A Scanning Line Driver Circuit 706B Scanning line driver circuit 706C Scanning line driver circuit 706D Scanning line driver circuit 707A First display 707B Second display 707C 3rd display 707D 4th display unit 708 pixels 709A Optical Sensor 709B Optical Sensor 709C Optical Sensor 709D Optical Sensor 710 Pixel circuit 711 Light intensity comparison circuit 712 CPU 713 Internal Memory 714 Video signal generating circuit 714A Signal line driver circuit 714B Signal line driver circuit 714C Signal line driver circuit 714D Signal line driver circuit 715 Power supply circuit 715A power supply circuit 715B Power supply circuit 715C power supply circuit 715D power supply circuit 716 Signal Transmitter / Receiver 717 Power Supply Unit 718 Operation section 719 Antenna section 920 Wiring 921 Stress concentration region 922a Cutout 922b Cutout 923 Sealing substrate 924 Element Substrate 925 Reinforcement plate 4005 Sealing material 4008 Liquid crystal layer 4010 Thin film transistor 4011 Thin film transistor 4013 Liquid crystal element 4015 Connection terminal electrode 4016 Terminal electrode 4019 Anisotropic conductive film 4020 Insulation layer 4021 Insulation layer 4023 Insulating film 4030 Electrode layer 4031 Electrode layer 4032 Insulating film 4301 First display unit 4302 Third display unit 4304 Operation unit 4307 Second display unit 4308 Binding section 4309 Display button 4310 4th display unit 4311 First display panel 4312 Second display panel 4313 Third display panel 4321 Scanning line driver circuit 4322 Scanning line driver circuit 4323 Signal line driver circuit 4324 FPC 4325 Printed Circuit Board 4326 Stress concentration region 4329 FPC 4352 pixel TFT 4507 Display section 4510 Bulkhead 4511 Electroluminescent layer 4513 Light emitting element 4514 Filling material 4612 Cavity 4613 Spherical particles 4614 Filling material 4712 liquid 4713 Microcapsules 4812 Space 4814 Rib 7002 Arrow 4010a Thin film transistor 4010b thin film transistor 4010c Thin Film Transistor 4010d thin film transistor 4321a Scanning line driver circuit 4321b Scanning line driver circuit 4322a Scanning line driver circuit 4322b Scanning line driver circuit 4323a Signal line driver circuit 4323b Signal line driver circuit 4324a FPC 4324b FPC 4327a Printed Circuit Board 4327b Printed circuit board 4331a Element substrate 4331b Element substrate 4332a Sealing substrate 4332b Sealing substrate 4350a Hand 4350b hand 4615a Black area 4615b White area 4715a Fine particles 4715b Fine particles 4815a Powder and granular materials 4815b Granular materials

Claims

1. A first resin layer and a second resin layer; an active matrix type display unit disposed between the first resin layer and the second resin layer; a scanning line driving circuit disposed between the first resin layer and the second resin layer; a connection terminal electrode disposed on the first resin layer; a first plate and a second plate that are disposed on a surface side of the first resin layer opposite to the second resin layer side and support the first resin layer; the first resin layer has a first region overlapping with the connection terminal electrode, a second region overlapping with the first plate, overlapping with the second resin layer, and overlapping with the display unit, and a third region overlapping with the second plate, overlapping with the second resin layer, and overlapping with the display unit; the first plate and the second plate are spaced apart from each other, the first resin layer has a bending function in a region between the second region and the third region, the first resin layer has a bending function in a fourth region between the first region and the second region, the scanning line driving circuit does not overlap with the first region and the fourth region when the first resin layer is not bent; the scanning line driving circuit overlaps with the first plate via the first resin layer, and overlaps with the second plate via the first resin layer; Display device.

2. A first resin layer and a second resin layer; an active matrix type display unit disposed between the first resin layer and the second resin layer; a scanning line driving circuit disposed between the first resin layer and the second resin layer; a connection terminal electrode disposed on the first resin layer; a first plate and a second plate that are disposed on a surface side of the first resin layer opposite to the second resin layer side and support the first resin layer; the first resin layer has a first region overlapping with the connection terminal electrode, a second region overlapping with the first plate, overlapping with the second resin layer, and overlapping with the display unit, and a third region overlapping with the second plate, overlapping with the second resin layer, and overlapping with the display unit; the first plate and the second plate are spaced apart from each other, the first resin layer has a bending function in a region between the second region and the third region, the first resin layer has a bending function in a fourth region between the first region and the second region, the scanning line driving circuit does not overlap with the first region and the fourth region when the first resin layer is not bent; the scanning line driving circuit overlaps with the first plate via the first resin layer, and overlaps with the second plate via the first resin layer; When the first resin layer is not bent in the fourth region, the second resin layer does not overlap the connection terminal electrode. Display device.

3. A first resin layer and a second resin layer; an active matrix type display unit disposed between the first resin layer and the second resin layer; a scanning line driving circuit disposed between the first resin layer and the second resin layer; a connection terminal electrode disposed on the first resin layer; a first plate and a second plate that are disposed on a surface of the first resin layer opposite to the second resin layer side and support the first resin layer; a signal line driver circuit having a function of supplying a signal to the display unit via the connection terminal electrodes; the first resin layer has a first region overlapping with the connection terminal electrode, a second region overlapping with the first plate, overlapping with the second resin layer, and overlapping with the display unit, and a third region overlapping with the second plate, overlapping with the second resin layer, and overlapping with the display unit; the first plate and the second plate are spaced apart from each other, the first resin layer has a bending function in a region between the second region and the third region, the first resin layer has a bending function in a fourth region between the first region and the second region, the scanning line driving circuit does not overlap with the first region and the fourth region when the first resin layer is not bent; the scanning line driving circuit overlaps with the first plate via the first resin layer, and overlaps with the second plate via the first resin layer; Display device.

4. A first resin layer and a second resin layer; an active matrix type display unit disposed between the first resin layer and the second resin layer; a scanning line driving circuit disposed between the first resin layer and the second resin layer; a connection terminal electrode disposed on the first resin layer; a first plate and a second plate that are disposed on a surface of the first resin layer opposite to the second resin layer side and support the first resin layer; a signal line driver circuit having a function of supplying a signal to the display unit via the connection terminal electrodes; the first resin layer has a first region overlapping with the connection terminal electrode, a second region overlapping with the first plate, overlapping with the second resin layer, and overlapping with the display unit, and a third region overlapping with the second plate, overlapping with the second resin layer, and overlapping with the display unit; the first plate and the second plate are spaced apart from each other, the first resin layer has a bending function in a region between the second region and the third region, the first resin layer has a bending function in a fourth region between the first region and the second region, the scanning line driving circuit does not overlap with the first region and the fourth region when the first resin layer is not bent; the scanning line driving circuit overlaps with the first plate via the first resin layer, and overlaps with the second plate via the first resin layer; When the first resin layer is not bent in the fourth region, the second resin layer does not overlap the connection terminal electrode. Display device.

5. A first resin layer and a second resin layer; a display section disposed between the first resin layer and the second resin layer and having a transistor and a light-emitting element; a scanning line driving circuit disposed between the first resin layer and the second resin layer; a connection terminal electrode disposed on the first resin layer; a first plate and a second plate that are disposed on a surface side of the first resin layer opposite to the second resin layer side and support the first resin layer; the first resin layer has a first region overlapping with the connection terminal electrode, a second region overlapping with the first plate, overlapping with the second resin layer, and overlapping with the display unit, and a third region overlapping with the second plate, overlapping with the second resin layer, and overlapping with the display unit; the first plate and the second plate are spaced apart from each other, the first resin layer has a bending function in a region between the second region and the third region, the first resin layer has a bending function in a fourth region between the first region and the second region, the scanning line driving circuit does not overlap with the first region and the fourth region when the first resin layer is not bent; the scanning line driving circuit overlaps with the first plate via the first resin layer, and overlaps with the second plate via the first resin layer; Display device.

6. A first resin layer and a second resin layer; a display section disposed between the first resin layer and the second resin layer and having a transistor and a light-emitting element; a scanning line driving circuit disposed between the first resin layer and the second resin layer; a connection terminal electrode disposed on the first resin layer; a first plate and a second plate that are disposed on a surface side of the first resin layer opposite to the second resin layer side and support the first resin layer; the first resin layer has a first region overlapping with the connection terminal electrode, a second region overlapping with the first plate, overlapping with the second resin layer, and overlapping with the display unit, and a third region overlapping with the second plate, overlapping with the second resin layer, and overlapping with the display unit; the first plate and the second plate are spaced apart from each other, the first resin layer has a bending function in a region between the second region and the third region, the first resin layer has a bending function in a fourth region between the first region and the second region, the scanning line driving circuit does not overlap with the first region and the fourth region when the first resin layer is not bent; the scanning line driving circuit overlaps with the first plate via the first resin layer, and overlaps with the second plate via the first resin layer; When the first resin layer is not bent in the fourth region, the second resin layer does not overlap the connection terminal electrode. Display device.

7. A first resin layer and a second resin layer; a display section disposed between the first resin layer and the second resin layer and having a transistor and a light-emitting element; a scanning line driving circuit disposed between the first resin layer and the second resin layer; a connection terminal electrode disposed on the first resin layer; a first plate and a second plate that are disposed on a surface of the first resin layer opposite to the second resin layer side and support the first resin layer; a signal line driver circuit having a function of supplying a signal to the display unit via the connection terminal electrodes; the first resin layer has a first region overlapping with the connection terminal electrode, a second region overlapping with the first plate, overlapping with the second resin layer, and overlapping with the display unit, and a third region overlapping with the second plate, overlapping with the second resin layer, and overlapping with the display unit; the first plate and the second plate are spaced apart from each other, the first resin layer has a bending function in a region between the second region and the third region, the first resin layer has a bending function in a fourth region between the first region and the second region, the scanning line driving circuit does not overlap with the first region and the fourth region when the first resin layer is not bent; the scanning line driving circuit overlaps with the first plate via the first resin layer, and overlaps with the second plate via the first resin layer; Display device.

8. A first resin layer and a second resin layer; a display section disposed between the first resin layer and the second resin layer and having a transistor and a light-emitting element; a scanning line driving circuit disposed between the first resin layer and the second resin layer; a connection terminal electrode disposed on the first resin layer; a first plate and a second plate that are disposed on a surface of the first resin layer opposite to the second resin layer side and support the first resin layer; a signal line driver circuit having a function of supplying a signal to the display unit via the connection terminal electrodes; the first resin layer has a first region overlapping with the connection terminal electrode, a second region overlapping with the first plate, overlapping with the second resin layer, and overlapping with the display unit, and a third region overlapping with the second plate, overlapping with the second resin layer, and overlapping with the display unit; the first plate and the second plate are spaced apart from each other, the first resin layer has a bending function in a region between the second region and the third region, the first resin layer has a bending function in a fourth region between the first region and the second region, the scanning line driving circuit does not overlap with the first region and the fourth region when the first resin layer is not bent; the scanning line driving circuit overlaps with the first plate via the first resin layer, and overlaps with the second plate via the first resin layer; When the first resin layer is not bent in the fourth region, the second resin layer does not overlap the connection terminal electrode. Display device.

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