Pick-and-place machine cleaning system and method

Abstract

To provide a pick-and-place machine cleaning system and method.SOLUTION: Disclosed are a device, a mechanism and a method for regular and consistent cleaning of vacuum aperture, nozzle and contact surfaces of a pick-and-place apparatus and pick-up tools of automated or manual semiconductor device and die handling machines. A cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and / or an irregular surface morphology.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This PCT application claims priority to U.S. patent application Ser. No. 16 / 460877, filed July 2, 2019, Ser. No. 16 / 460918, filed July 2, 2019, Ser. No. 16 / 460929, filed July 2, 2019, and Ser. No. 16 / 794068, filed February 18, 2020, all of which are entitled "SYSTEM AND METHOD FOR CLEANING A PICK AND PLACE MACHINE."

[0002] The present disclosure is particularly applicable to devices, mechanisms and methods for regular and consistent cleaning of apertures, nozzles and contact surfaces of pick and place equipment and pick-up tools of automated or manual semiconductor device and die handling machines, and will be described in this context. The cleaning material includes a cleaning pad layer with one or more intermediate layers having predefined properties, regular geometric features and / or irregular surface morphology. [Background technology]

[0003] Pick and place machines are used to move semiconductor devices, dies or electronic components from one holding tray to another, to move semiconductor devices or dies from one holding tray or wafer tape to a lead frame for die attach, from one holding tray to a test socket for electrical testing and back to the holding tray, or to move electronic components from a holding tray for attachment to a printed circuit board. These machines are used for high speed, high precision pick up and place of a wide range of semiconductor devices and dies. Downtime of this equipment for unplanned maintenance has a significant impact on productivity and throughput loss.

[0004] The pick and place equipment includes multiple suction cups, suction inlets, vacuum collets, nozzles and vacuum pick-up tools to pick up semiconductor devices from device holding trays via vacuum force. The vacuum force suction is generated by a vacuum mechanism with up and down motion to pick up electronic devices from one holding tray and place the devices into a test socket, lead frame or another holding tray or onto a printed circuit board at a preset position. Mishandling due to vacuum failure may damage the devices and require troubleshooting to restore performance. Furthermore, vacuum related issues and excessive downward pressure of the pick-up collet are major factors in die breakage.

[0005] In order to maintain adequate suction force and reliably pick and place the semiconductor device, intimate contact is required between the pick and place equipment and the semiconductor device being handled. Debris in the vacuum openings, the vacuum nozzle of the device, the vacuum inlet / outlet, or on the contact surface of the suction device affects the vacuum strength. Over time, the openings of the pick and place equipment, the pick-up tool, and the suction device and tips can become clogged or contaminated with various materials, reducing the vacuum strength and causing vacuum failure. To clean and maintain the pick and place equipment, IC device handling machinery must be taken offline and the various pick and place equipment is manually cleaned. During offline cleaning operations, materials that have accumulated in the nozzle of the pick-up tool or that have been compressed in or on the nozzle can be difficult to clean or remove. Routine, preventative cleaning and debris removal can be effective in controlling debris accumulation and preventing the growth of stubborn contaminants. Regular preventative cleaning and debris removal can extend mean time between maintenance and improve equipment uptime.

[0006] Cleaning of pick and place equipment is performed by removing the vacuum or suction pick-up tool from the equipment to be cleaned and / or refurbished. Cleaning and refurbishment of pick and place equipment consists of a wet wipe down and scrubbing process using a solvent or other cleaning fluid. Additionally, the vacuum ports of the pick-up tool may be manually cleaned using mechanical manipulation to remove accumulated debris. However, manual handling and cleaning of the pick-up tool carries the risk of damage.

[0007] Such typical cleaning processes for pick and place equipment and vacuum pick-up require the semiconductor device handling function to be stopped while the pick and place assembly is cleaned and refurbished. Furthermore, the wet chemical and mechanical scrubbing processes can damage the vacuum pick-up tool. To maximize performance and maintain uptime for high throughput, it is desirable to be able to clean the pick and place assembly of a semiconductor device handling machine without removing the pick and place equipment, vacuum pick-up tool or suction pick-up tool and without using wet chemical or mechanical scrubbing processes.

[0008] Some embodiments are illustrated by way of example and not limitation in the accompanying figures, in which like reference numbers indicate similar elements and in which: [Brief description of the drawings]

[0009] [Figure 1A] FIG. 1A shows a tool used in manual, semi-automatic or automatic semiconductor device handling machines having a pick and place assembly that utilizes a vacuum and suction pick-up tool to "pick up" semiconductor devices having various contaminants and debris on the surface of the "pick-up" side of the semiconductor device. [Figure 1B]FIG. 1B illustrates a tool used in manual, semi-automatic, or automatic semiconductor device handling machines having a pick and place assembly that utilizes a vacuum and suction pick-up tool to "pick up" semiconductor devices having various contaminants and debris on the surface of the "pick-up" side of the semiconductor device. [Figure 1C] FIG. 1C shows a tool used in manual, semi-automatic or automatic semiconductor device handling machines having a pick and place assembly that utilizes a vacuum and suction pick-up tool to "pick up" semiconductor devices having various contaminants and debris on the surface of the "pick-up" side of the semiconductor device. [Figure 2A] FIG. 2A shows a tool used in a manual, semi-automatic or automatic semiconductor device handling machine having a pick and place assembly, where various contaminants and debris adhere or adhere to the vacuum and suction pick-up tool used to "pick up" the semiconductor device from the surface of the "pick-up" side of the semiconductor device. [Figure 2B] FIG. 2B illustrates a tool used in a manual, semi-automatic or automatic semiconductor device handling machine having a pick and place assembly, in which various contaminants and debris are adhered or attached to the vacuum and suction pick-up tool used to "pick up" the semiconductor device from the surface of the "pick-up" side of the semiconductor device. [Figure 2C] FIG. 2C illustrates a tool used in a manual, semi-automatic or automatic semiconductor device handling machine having a pick and place assembly, where various contaminants and debris are adhered or attached to the vacuum and suction pick-up tool used to "pick up" the semiconductor device from the surface of the "pick-up" side of the semiconductor device. [Figure 3A] FIG. 3A illustrates a tool for use with a manual, semi-automatic, or automatic semiconductor handling machine having a pick and place assembly during a cleaning operation in which one type of pick-up tool moves into contact with the surface of an elastomeric cleaning material. [Figure 3B]FIG. 3B illustrates a tool for use with a manual, semi-automated, or automated semiconductor handling machine having a pick and place assembly during a cleaning operation in which one type of pick-up tool moves into contact with the surface of an elastomeric cleaning material. [Figure 3C] FIG. 3C illustrates a tool for use with a manual, semi-automatic, or automatic semiconductor handling machine having a pick and place assembly during a cleaning operation in which one type of pick-up tool moves into contact with the surface of an elastomeric cleaning material. [Figure 4A] FIG. 4A illustrates a method for cleaning and removing adhering debris and contaminants from various vacuum and suction pick-up tools used on manual, semi-automatic or automatic semiconductor device handling machines having pick and place assemblies. [Figure 4B] FIG. 4B illustrates a method for cleaning and removing adhering debris and contaminants from various vacuum and suction pick-up tools used on manual, semi-automatic or automatic semiconductor device handling machines having pick and place assemblies. [Figure 4C] FIG. 4C illustrates a method for cleaning and removing adhering debris and contaminants from various vacuum and suction pick-up tools used on manual, semi-automatic or automatic semiconductor device handling machines having pick and place assemblies. [Diagram 5] FIG. 5 illustrates an embodiment of a method for cleaning various vacuum and suction pick-up tools used on manual, semi-automatic or automatic semiconductor device handling machines having pick and place assemblies. [Figure 6A-6C] Figure 6A is a top view of a cleaning device where a cleaning pad is attached to a carrier for use in a manual, semi-automatic or automatic semiconductor device handling machine. Figure 6B is a cross-sectional view of a typical cleaning device where a cleaning pad is attached to a substrate surface for use in a manual, semi-automatic or automatic semiconductor device handling machine. Figure 6C is a cross-sectional view of a typical cleaning device where a cleaning pad is attached to an IC package or semiconductor device for use in a manual, semi-automatic or automatic semiconductor device handling machine. [Figure 7A] FIG. 7A is a cross-sectional view of a second embodiment of a cleaning media having one or more compliant intermediate layers of material beneath the cleaning pad layer. [Figure 7B] FIG. 7B is a cross-sectional view of a second embodiment of a cleaning media having one or more intermediate layers of stiff material beneath a cleaning pad layer with preset characteristics. [Figure 7C] FIG. 7C is a cross-sectional view of a second embodiment of a cleaning media having one or more stiff and compliant intermediate layers of material beneath a cleaning pad layer with preset characteristics. [Figure 7D] FIG. 7D is a cross-sectional view of a second embodiment of a cleaning media having one or more alternating stiff and compliant intermediate layers of material beneath a cleaning pad layer with preset characteristics. [Figure 8A] FIG. 8A is a cross-sectional view of a third embodiment of a cleaning material having evenly spaced micro-columns of a preset shape constructed on one or more layers of material with preset characteristics. [Figure 8B] FIG. 8B is a cross-sectional view of a fourth embodiment of a cleaning material having evenly spaced micro-columns of a preset shape constructed from a combination of one or more stiff and compliant intermediate material layers having preset characteristics. [Figure 9A] FIG. 9A is an enlarged cross-sectional view of the equally spaced micro-columns shown in FIG. 8B constructed from a combination of one or more intermediate material layers to provide consistent cleaning efficiency in the contact areas of the vacuum and suction pick-up tools of the pick-and-place assembly. [Figure 9B] FIG. 9B is an enlarged cross-sectional view of a fifth embodiment of a cleaning material having equally spaced micro-pyramids constructed from a combination of one or more intermediate material layers to provide consistent cleaning efficiency in the contact area of ​​the vacuum and suction pick-up tools of the pick-and-place assembly. [Figure 10A-10C]FIG 10A is a plan view of a sixth embodiment of a cleaning material showing portions of mutually separated microfeatures using a "street" arrangement for a second moment of area or moment of inertia to control bending resistance, FIG 10B is a plan view of a seventh embodiment of a cleaning material showing portions of mutually separated microfeatures using an "avenue" arrangement for a second moment of area or moment of inertia to control bending resistance, and FIG 10C is a plan view of an eighth embodiment of a cleaning material showing portions of mutually separated microfeatures using a diagonal arrangement for a second moment of area or moment of inertia to control bending resistance. [Figure 11A] FIG. 11A is a cross-sectional view of a cleaning material with a carrier substrate of FIG. 6A for cleaning the sides, interiors and contact areas of vacuum and suction pick-up tools of a pick and place assembly. [Figure 11B] FIG. 11B is a cross-sectional view of a cleaning material with a carrier substrate of FIG. 6A for cleaning the sides, interiors and contact areas of vacuum and suction pick-up tools of a pick and place assembly. [Figure 11C] FIG. 11C is a cross-sectional view of a cleaning material with a carrier substrate of FIG. 6A for cleaning the sides, interiors and contact areas of vacuum and suction pick-up tools of a pick and place assembly. [Figure 12A] FIG. 12A is a cross-sectional view of the micro-column cleaning material of FIGS. 8B and 9A for cleaning the sides, interiors and contact areas of vacuum and suction pick-up tools of a pick and place assembly. [Figure 12B] FIG. 12B is a cross-sectional view of the micro-column cleaning material of FIGS. 8B and 9A for cleaning the sides, interiors and contact areas of the vacuum and suction pick-up tools of a pick and place assembly. [Figure 12C] FIG. 12C is a cross-sectional view of the micro-column cleaning material of FIGS. 8B and 9A for cleaning the sides, interiors and contact areas of the vacuum and suction pick-up tools of a pick and place assembly. [Figure 13A]FIG. 13A is a cross-sectional view of the micro-pyramidal cleaning material of FIG. 9B for cleaning the interior and contact areas of the vacuum and suction pick-up tools of a pick-and-place assembly. [Figure 13B] FIG. 13B is a cross-sectional view of the micro-pyramidal cleaning material of FIG. 9B for cleaning the interior and contact areas of the vacuum and suction pick-up tools of the pick-and-place assembly. [Figure 13C] FIG. 13C is a cross-sectional view of the micro-pyramidal cleaning material of FIG. 9B for cleaning the interior and contact areas of the vacuum and suction pick-up tools of the pick-and-place assembly. [Figure 14A-14B] Figure 14A is an example of a vacuum collet before cleaning with a cleaning device, and Figure 14B is an example of a vacuum collet after cleaning with a cleaning device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present disclosure is particularly applicable to devices, mechanisms and methods for regularly and consistently cleaning the openings, nozzles and contact surfaces of pick-and-place equipment and pick-up tools of automated or manual semiconductor device handling machines, and the description of the present disclosure will be described in this context. However, it will be appreciated that the devices, mechanisms and methods can be used to clean any device having openings, nozzles and contact surfaces that become clogged or soiled over time with various substances, and can also be used to clean or refurbish other pick-up tools of automated or manual semiconductor device handling machines, and have greater utility as they can be implemented using variations of the embodiments disclosed below that are still within the scope of the present disclosure. For example, the cleaning devices and methods disclosed below can be used to clean pick-and-place equipment of SMT (surface mount technology) component placement machines that are used for placement of a wide range of electronic components, such as capacitors, resistors, integrated circuits on PCBs, etc. Furthermore, the cleaning material used for the above cleaning can be the embodiments described below, but can also be other variations of the cleaning device that are within the scope of the present disclosure.

[0011] In one embodiment, pick and place machines, vacuum pick-up tools and suction pick-up tools can be periodically cleaned with a tacky elastomeric cleaning material (cleaning material in various embodiments generally described below) placed on a surrogate device, on various substrates, at designated locations on the tool or on an in-tool carrier that can be used to maintain the required cleanliness of the contact surfaces to keep the vacuum openings clean on schedule and maintain their performance and to exert maximum vacuum force during pick-up. The contact parts of the tool / machine (pick-up tool or pick-and-place machine or pick-and-place machine for SMT components or pick-and-place machine for packaged devices) that come into contact with the components / devices / ICs etc. to be handled can be cleaned using the cleaning material, the contact elements / parts being, for example, one or more vacuum openings, one or more nozzles, one or more suction cups, one or more suction inlets, one or more vacuum collets and a vacuum pick-up tool connected to a semiconductor device handling machine. In addition to the pick and place machines mentioned above, the cleaning device and method can also be used in the pick and place assembly of a die attach machine or a flip chip bonder machine. The cleaning materials, devices, mechanisms and methods can be used to refurbish pick and place equipment in manual, semi-automated and automated semiconductor device handling machines without the need for unplanned downtime for maintenance. An example of a vacuum collet before cleaning of debris from the collet contact surface is shown in Figure 14A and described below, and an example of the same vacuum collet after cleaning using a cleaning device of the present disclosure is shown in Figure 14B and described below.

[0012] 1A-C show a known automated or manual semiconductor device handling machine (100) having various types of pick-up tools (101, 102, and 103) used to "pick up" surface mounted devices (107), such as electronic or semiconductor devices.

[0013] Figure 1A shows a portion of the machine 100, in particular the conical vacuum pick-up tool (101) portion of the machine with an inlet / outlet positioned adjacent to the semiconductor device (107) for picking and placing the semiconductor device (107), Figure 1B shows a suction cup type pick-up tool (102) with a flexible pad and an inlet / outlet positioned adjacent to the semiconductor device (107) for picking and placing the semiconductor device (107), and Figure 1C shows a multi-sided vacuum collet type pick-up tool (103) with an inlet / outlet positioned adjacent to the semiconductor device (107) for picking and placing the semiconductor device (107). The vacuum pick-up tools (101, 102 and 103) are removably mounted to the semiconductor device handling machine so that the pick-up tools can be periodically removed for cleaning and / or refurbishing. The vacuum pick-up tools (101, 102, and 103) are lowered towards the semiconductor device 107 until they can make contact and apply a vacuum to the surface of the semiconductor device. The contact surface of the pick-up tool also makes contact and applies a vacuum to any debris, particles, or contaminants (104) (collectively referred to as "debris") present on the surface of the semiconductor device, which for illustration purposes is represented by a dotted black line along the surface of the semiconductor device. The actual debris, particles, or contaminants can be of any shape or size and can be composed of a variety of different materials. For example, debris on the device being picked and placed could be metal flakes, mold compound pieces, solder residue, solder flux residue, particles from other devices, dust generated during handling, etc.

[0014] 2A-C show known automated or manual semiconductor device handling machines (100) with various types of pick-up tools (101, 102, and 103) after picking and placing a semiconductor device into a pre-defined location. When a semiconductor device (107) is picked up by the tools 101, 102, and 103, debris, particles, or contaminants (104) from the semiconductor device (107) adhere to the contact surfaces and inlets / outlets of the various pick-up tools (101, 102, and 103) as shown in the figures. For example, FIG. 2A shows a cone-shaped vacuum pick-up tool (101) with debris blocking the vacuum inlet / outlet, FIG. 2B shows a suction cup type pick-up tool (102) with debris attached to a flexible pad and stuck in the vacuum inlet / outlet, and FIG. 2C shows a multi-sided vacuum collet type pick-up tool (103) with debris inside and outside the collet and stuck in the vacuum inlet / outlet. Adhering debris, particles or contaminants (104) reduce the suction force available for the vacuum mechanism to repeatedly and consistently pick up the device (107) from one location and place it in a second pre-set location without dropping or mishandling the device. Excessive downward pressure of the pick-up tools 101-103 (which occurs as the suction force is reduced by adhering debris, particles or contaminants (104) and the pick-up tools press down harder to obtain the desired suction) is a known major cause of die breakage.

[0015] Figures 3 and 4 show a first embodiment of a method for cleaning the contact surfaces and inlets / outlets of various pick-up tools (101 in Figures 3A and 4A, 102 in Figures 3B and 4B, and 103 in Figures 3C and 4C). Using the novel cleaning method, the various pick-up tools (101, 102, and 103) with contaminants (104) attached to them do not need to be removed from the vacuum mechanism, as opposed to typical cleaning methods. The cleaning material (110) can be placed in pre-determined locations on the cleaning substrate, substitute packaging, or clean block or station. The cleaning process can be implemented in various ways, including manually by a human being positioning the cleaning material (110) adjacent to the contact surface and inlet / outlet of the pick-up tools (101, 102 and 103), semi-automatically by a human being commanding a handling machine to position the pick-up tools (101, 102 and 103) near the cleaning material (110), or automatically by a handling machine moving and positioning the cleaning material or cleaning substitute (104) under the pick-up tools (101, 102 and 103) when cleaning is required or during a regular cleaning cycle. When the cleaning method is started manually, semi-automatically or automatically, the machine moves the pick-up tool and the pick-up tool is inserted into the cleaning material or contacted with a substitute cleaning device. FIG. 4 shows how the debris, particles or contaminants (104) are captured and removed by the cleaning material (110). In some embodiments, a pick-up error of the machine can be detected and the cleaning process can be initiated. Cleaning frequency can be preventative maintenance to increase the average time between manual cleaning runs and reduce the need to take the unit off-line.

[0016] FIG. 5 illustrates a cleaning process 500 that can be performed on a pick and place machine, vacuum pick-up tool, or suction pick-up tool. The process illustrated in FIG. 5 can be performed manually, semi-automatically, or automatically as described above. The process 500 can be performed on-site at regular intervals to keep the contact surface of the pick-up tool clean and periodically collect debris, particles, or contaminants, and to maintain suction levels to prevent dropping or mishandling of devices that can result in downtime or equipment errors. As illustrated in FIG. 5, the process can include a cleaning material being positioned adjacent to the tool when the cleaning process is performed (502). The cleaning method can then include inserting the tool into or into the cleaning material to remove debris (504). In one embodiment, the cleaning material can be used to perform the cleaning during normal operating periods of the machine.

[0017] The cleaning material used to clean the pick and place equipment, vacuum pick-up tool or suction pick-up tool can take a variety of forms. For example, the cleaning material can have a cross-linked polymer layer, a cleaning layer on a carrier or substrate or frame so that the cleaning material can be handled in the same way as a semiconductor device, and one or more intermediate layers below the cleaning layer and the cleaning layer. The cleaning material can also have a texture, shape or irregular surface or pattern that is advantageous for cleaning the interior and exterior of the pick-up tool. The cleaning material can be such that it retains debris from the pick-up tool and the vacuum inlet / outlet when the pick-up tool is inserted into the cleaning material. The cleaning material preferably includes a compliant polymer with embedded abrasive particles, such as Probe polish, commercially available from International Test Solutions, Inc., or a lapping film, such as Probe Lap.

[0018] 6A, 6B and 6C show three typical different types of cleaning devices with cleaning materials applied to various substrates, substrates of different sizes, substrates of different shapes, or in some applications without substrate. As shown in Figs. 6A and 6B, cleaning devices 20 and 21 can each include a substrate 23 and a cleaning media material or pad 24, respectively, fixed, attached or applied to a surface of a carrier or substrate of known shape. Substrate 23 can be plastic, metal, glass, silicon, ceramic or any other similar material. Furthermore, substrate 25 shown in Fig. 6C can have a shape similar to that of packaged integrated circuit device (DUT) 22. It is not known to use such cleaning devices with cleaning materials to clean the contact surface, side and vacuum inlet / outlet of the pick-up tool or to clean the contact surface, side and vacuum inlet / outlet of the pick-up tool during normal operation of the machine without removing the pick-up tool from the machine during the cleaning operation.

[0019] The cleaning process and device of the pick-up tool contact surface, sides and vacuum inlet / outlet can use a cleaning media with one or more compliant intermediate layers, as will be described in more detail with reference to the accompanying drawings and embodiments. In one embodiment (FIG. 7A), the cleaning media 220 can be made from a cleaning pad layer 202 with preset properties such as hardness, elastic modulus, etc. that contribute to cleaning the pick-up tool contact surface, sides and vacuum inlet / outlet that contact the bond pad or frame. The cleaning media 220 can also have one or more compliant intermediate layers 203 attached under the cleaning pad layer. The combination of layers creates material properties not available from the individual component materials, and the variety of matrices, abrasive particles and shapes allows for products or structures with the optimal combination to maximize cleaning performance. By adding a sub-layer of compliant or microporous foam under the rigid cleaning layer, the overall properties of the cleaning material are enhanced to extend the overall useful life of the pick-up tool contact surface, sides and vacuum inlet / outlet without sacrificing form or function. By applying layers of abrasive particles to the surface of a compliant unfilled polymer or to the "skin" side of a microporous foam, a multi-layer material with favorable abrasive properties is obtained. The overall compliance of the sublayers is systematically increased (stiffness decreased) to define the overall properties of the cleaning material.

[0020] In one embodiment shown in FIG. 7A, the cleaning media 220 can have a removable protective layer 201 attached on top of the cleaning pad 202 layer prior to intended use to separate the surface cleaning pad layer from contaminants. The removable protective layer 201 protects the working surface of the cleaning pad layer 202 from debris / contaminants until the cleaning device is ready to be used to clean the contact surface, sides and vacuum inlet / outlet of the pick-up tool. Once the cleaning device is ready to be used to clean the contact surface, sides and vacuum inlet / outlet of the pick-up tool, the removable protective layer 201 can be removed to expose the working surface of the cleaning pad layer 202. The protective layer can be made of known non-reactive polymeric film materials, preferably polyester (PET) film. The protective layer can have a matte finish or other "textured" features to increase cleaning efficiency. The matte finish or textured surface may also be useful to identify the cleaning surface. The surfaces become "functional" and the "functional features" aid in the cleaning performance of various nozzles and collets. Such functional features can be inserted inside the vacuum nozzle for cleaning and debris collection within the vacuum passageway.

[0021] In addition to the compliant layer(s) 203, the cleaning medium 220 can have an adhesive layer 204 below the compliant layer(s) 203 and a release layer 205 above the adhesive layer 204, as shown in FIG. 7A. The installation of the cleaning device 220 on a pre-set substrate (for cleaning the tool) is performed by removing the second release liner layer 205 (made of the same material as the first release liner layer) to expose the adhesive layer 204, and then applying the adhesive layer 204 to the substrate surface. The adhesive layer 204 can then be pressed against the substrate to adhere the cleaning device 220 to the substrate. The substrate can be a variety of materials with different purposes as described in the prior art.

[0022] The cleaning pad layer 202 described above and below can provide the cleaning material with pre-defined mechanical, material and dimensional properties. For example, the cleaning pad layer can provide abrasiveness, specific gravity (e.g., in the range of 0.75 to 2.27) (specific gravity is the ratio of density to the density of water at a particular temperature), elasticity (e.g., in the range of 40 MPa to 600 MPa), tackiness (e.g., in the range of 20 to 800 grams), planarity and thickness (e.g., in the range of 25 μm to 500 μm).

[0023] The one or more intermediate layers 203 (which may be compliant as described above, rigid layers as described below, or a combination of compliant and rigid layers as described below) may impart preset mechanical, material, and dimensional properties to the cleaning material. For example, the one or more intermediate layers may impart abrasiveness (described in more detail below), specific gravity (e.g., in the range of 0.75 to 2.27) (specific gravity is the ratio of the density of the one or more intermediate layers to the density of water at a particular temperature), elasticity (e.g., in the range of 40 MPa to 600 MPa), adhesion (e.g., in the range of 20 to 800 grams), planarity, thickness (e.g., in the range of 25 μm to 500 μm), and / or porosity (e.g., in the range of 10 to 150 micropores / inch) (average number of pores per inch).

[0024] In another embodiment shown in Figure 7B, the cleaning media 220 has a cleaning pad layer 202 supported by one or more rigid intermediate layers 206 underlying the cleaning pad layer 202. In another embodiment (Figure 7C), the cleaning media 220 can be constructed using a combination of one or more rigid intermediate layers 206 and one or more compliant material layers 203 beneath the cleaning pad layer 202 with preset properties. The embodiment of Figure 7C has one or more compliant layers 203 between the cleaning pad 202 and the one or more rigid layers 206, but instead can have one or more rigid layers directly beneath the cleaning pad layer 202 and one or more compliant layers beneath the rigid layer 206. The embodiments of Figures 7B and 7C also have two protective liner layers 201, 205 and adhesive layer 204 as described above.

[0025] 7D shows an embodiment in which the cleaning media 220 is constructed by alternating one or more rigid intermediate layers 206 and one or more compliant material layers 203 beneath a cleaning pad layer 202 with preset properties. In this embodiment, the cleaning media 220 has one or more compliant layers 203 beneath the cleaning pad 202, followed by one or more rigid layers 206 and one or more compliant layers 203, although the cleaning media 220 can have alternating compliant and rigid layers in other configurations within the scope of this disclosure. In this embodiment, the cleaning pad 202 and underlying layers (203, 206, etc.) have preset abrasive, dense, elastic, and / or adhesive properties that contribute to cleaning the contact surface, sides, and vacuum inlet / outlet of the pick-up tool. The property superposition of the cleaning layers and intermediate material layers can vary depending on the specific configuration and geometry of the contact surface, sides, and vacuum inlet / outlet of the pick-up tool.

[0026] The abrasiveness of the cleaning pad layer 202 shears debris away from the contact surface, sides and vacuum inlet / outlet of the pick-up tool. By using a preset volume and mass density of abrasive particles, the abrasiveness of the cleaning material can be systematically influenced to facilitate debris removal. Typical abrasive materials and particle weight percentages loaded in the cleaning material layer can range from 30% to 500% weight percent. As used in this application, the weight percentage of the polymer loading can be defined as the weight of the polymer divided by the weight of the polymer plus the weight of the abrasive particles. Typical abrasives that can be incorporated into the material can include aluminum oxide, silicon carbide and diamond, although the abrasive material can be other known abrasive materials. The abrasives can include spatially or selectively distributed particles of aluminum oxide, silicon carbide or diamond, although the abrasive particles can be other known abrasive materials having a Mohs hardness of 7 or greater. The controlled surface adhesion of the cleaning layer ensures that debris on the contact surface, sides and vacuum inlet / outlet of the pick-up tool preferentially sticks to the pad and is removed from the contact surface, sides and vacuum inlet / outlet of the pick-up tool during the cleaning operation.

[0027] In one embodiment, the cleaning material layer 202, and / or the rigid intermediate layer 206, and / or the compliant intermediate layer 203 (each a "material layer") can be made of solid or open or closed cell foam-based elastomeric materials including rubber and both synthetic and natural polymers. Each material layer can have an elastic modulus ranging from greater than 40 MPa to less than 600 MPa, and the layer thickness can range from 25 μm to 500 μm. Each material layer can have a hardness range from 30 Shore A to 90 Shore A. The cleaning adhesive layer can have a service range of -50°C to +200°C. Each elastomeric material can be a material manufactured with pre-set sticky or abrasive particles spatially or selectively distributed within the body of the material. Each material can have preset elasticity, density, and surface tension parameters that allow the contact surface, sides, and vacuum inlet / outlet of the pick-up tool to penetrate into the elastomeric material layer to remove debris from the vacuum pick-up tool without damaging the geometric features of the contact surface, sides, and vacuum inlet / outlet of the pick-up tool while maintaining the integrity of the elastomeric matrix. Each material layer has a preset thickness, generally between 1-20 mils. The thickness of each layer can vary depending on the specific configuration of the contact surface, sides, and vacuum inlet / outlet of the pick-up tool. For example, a cleaning material layer of thin material (~1 mil thick) is suitable for a "non-penetrating" shape such as a flat tube, while a cleaning material layer of thick material (~20 mils) is suitable for a "penetrating" tube shape. In a cleaning pad during normal operation of an automatic, semi-automatic or manual cleaning, as one or more assembly elements of the assembly equipment and supporting hardware, a normal contact force drives the contact element into the pad and debris on the contact surface, sides and vacuum inlet / outlet of the pick-up tool is removed and retained by the pad material.

[0028] In another embodiment of the cleaning media 221 (FIGS. 8A and 8B), the maximum cleaning efficiency of the cleaning material can be improved by using multiple geometric microfeatures 212 of uniform shape and regular spacing, such as micro-columns or micro-pyramids with a preset aspect ratio (diameter to height), cross section (square, circular, triangular, etc.). In the embodiment shown in FIG. 8A, the spaced microfeatures consist of a single layer 212 on and across a combination of compliant or rigid intermediate layers 207 with preset characteristics. As an example of one type of microfeature configuration, the square micro-columns shown in FIG. 8A can be made using a combination of precision manufacturing processes and / or controlled cutting methods, with long axes of 100 microns or less and "street" and "avenue" widths of less than 50 μm. The depth of the "streets" and "avenues" is controlled by the cutting method to obtain the aspect ratio. In this example, the features have a long axis width of 100 microns to a depth (or height) of 200 microns. In this configuration, the depth is obtained without cutting through or into the underlying cleaning material layer. In the embodiment of FIG. 8B, the evenly spaced microfeatures can be constructed from multiple layers 213 of multiple compliant or rigid intermediate layers 207 with preset characteristics. The size and shape of the microfeatures can be varied depending on the configuration and material of the contact surface, sides and vacuum inlet / outlet of the pick-up tool to obtain a pad that removes debris but does not damage the contact surface, sides and vacuum inlet / outlet of the pick-up tool. If the microfeatures are large compared to the shape of the contact elements, the cleaning performance will be adversely affected. If the microfeatures are small compared to the contact element shape, the reciprocal force is insufficient to obtain a high cleaning efficiency to remove the adhering contaminants.

[0029] Generally, the microfeatures can have several types of shapes including cylindrical, square, triangular, rectangular, etc. The cross-sectional size of the long axis of each microfeature can be 25 μm or more and less than 500 μm, and each microfeature can have an aspect ratio ranging from 1:10 to 20:1. The shape of the microfeatures can be tailored in fabricating the cleaning layer so that material can be used to modify the contact surface, sides, and vacuum inlet / outlet of the pick-up tool.

[0030] In the embodiments of Figures 9A and 9B, close-up cross-sectional views of cleaning material with micro-features are shown (micro-columns 219 (9A) and micro-pyramids 319 (Figure 9B) of cleaning material 224, 324, respectively), but the features can be any other regular geometric feature. The distortion of the micro-features under load not only depends on the load, but also on the shape of the cross-section of the feature.

[0031] In the embodiment of FIG. 9A, the spacing or pitch 215 of the micro-columns, the area moment of inertia 216 or second moment of inertia, which is a property of the shape and can both be used to predict the resistance of the feature to bending and distortion, the length 217 of the cleaning pads, the length 218 of the intermediate pads, and the total length 219 of the micro-columns are preset according to the unique configuration of the contact surface, sides, and vacuum inlet / outlet of the pick-up tool. Due to the contact surface, sides, and vacuum inlet / outlet of the pick-up tool, the shape of the micro-columns is such that the cleaning feature can fit "into the inlet / outlet" and physically contact along the side of the tool for cleaning action and debris collection. In this example, the vacuum inlet / outlet is considered to have a diameter of 125 microns. For the cleaning material, the feature cross-sectional major axis length will be less than 125 microns and the height will be at least 60 microns to facilitate overtravel into the cleaning material.

[0032] 9B, the micro-pyramid apex spacing or pitch 315 and variable moment of inertia along the height 316, cleaning pad pyramid length 317, pyramid frustum height 318, and total height 319 of the micro-pyramid are similarly pre-set according to the specific configuration of the vacuum pick-up tool. For example, the micro-pyramid shape is such that the cleaning material can fit into the pick-up tool's contact surface, sides, and vacuum inlet / outlet for cleaning and debris collection within and along the pick-up tool's contact surface, sides, and vacuum inlet / outlet. For a particular pick-up tool configuration, the micro-feature shape is such that the cleaning features can fit into and along the pick-up tool's contact surface, sides, and vacuum inlet / outlet for cleaning and debris collection. The shape of the microfeature is defined by the kerf (i.e., "street width and shape" and "avenue width and shape") if a precision cutting process is used, or by the mold shape if a casting process is used. For cleaning material microfeatures, the cross-sectional major axis length of the microfeature top surface is less than 125 microns to facilitate in-pickup collet cleaning. The overall height is at least 200 microns to facilitate over-travel into the cleaning material and provide sufficient reciprocating force to initiate the cleaning and / or material removal action.

[0033] The microfeatures described above can have abrasive particles applied to the top surface, along the length of the microfeature, within the body of the microfeature, or at the bottom of the microfeature. In one embodiment, the average microfeature can have a cross-sectional width of 1.0 μm or more, a height of 400 μm or less, and an average abrasive particle size of less than 15.0 μm. Typical abrasives that can be incorporated into and across the material layer and the microfeature include aluminum oxide, silicon carbide, and diamond, although the abrasive particles can also be other well-known abrasive materials with a Mohs hardness of 7 or greater. The amount and size of the abrasive material added to the microfeature can vary depending on the configuration and material of the contact surface of the pick-up tool and the vacuum inlet / outlet to obtain a pad that removes and collects debris but does not cause damage.

[0034] 10A, 10B and 10C are diagrams showing embodiments of cleaning materials 226 and 326, respectively, where the microfeatures are formed with a preset arrangement of streets 351, avenues 352 and diagonals 353, separated from each other and with a preset moment of inertia to eliminate undesirable interactions and other coupling effects, obtain a preset surface compliance and support structure for improving the efficiency of removing debris and contamination forces when the vacuum pick-up tool contacts the pad surface by the material into the contact area within the contact element tip shape. The width of the streets, avenues and diagonals can be varied depending on the configuration and material of the vacuum pick-up tool to obtain a separated material surface for evenly removing debris from the sides of the contact element and within the geometric features contact element tip. The streets, avenues and diagonals can have abrasive particles distributed evenly or selectively across their width. The width of the streets, avenues and diagonals and the size of the abrasive material across the width can vary depending on the configuration and materials of the pick-up tool contact surface, sides and vacuum inlets / outlets. In such an embodiment, each island 360 of cleaning material is a microfeature that is separated from other microfeatures.

[0035] The cleaning system and cleaning pad not only remove and collect the adhering particulates from the contact surface, sides and vacuum inlet / outlet of the pick-up tool, but also do not affect the overall shape and geometric characteristics. Inserting the contact surface, sides and vacuum inlet / outlet of the pick-up tool into a cleaning device such as the carrier device 20 shown in Figure 6A, the substrate device 21 in Figure 6B, or the dummy package device 22 in Figure 6C removes the adhering debris and supporting hardware without leaving behind organic residues that must then be removed by additional offline or online processes.

[0036] The method for in-situ cleaning of the contact surface, sides and vacuum inlet / outlet of the pick-up tool achieves the objective of cleaning the pick-up tool without removing the tool from the handling machine, thus reducing downtime and increasing productivity. The cleaning material is placed in a preset position in a cleaning box or station, and when the cleaning algorithm is started manually, semi-automatically or automatically, the machine moves the pick-up tool to the preset location where the cleaning material is placed, and then the pick-up tool is inserted into the cleaning material. The cleaning material layer of the device has preset physical, mechanical and geometrical properties depending on the configuration and materials of the contact surface, sides and vacuum inlet / outlet of the pick-up tool.

[0037] An embodiment of a cleaning material with micro-features suitable for cleaning a cone-shaped vacuum pick-up tool (101) is shown in FIG. 11A. A suction cup type vacuum pick-up tool (102) is shown in FIG. 11B, and a multi-sided vacuum collet type pick-up tool (103) is shown in FIG. 11C. In this exemplary embodiment, a standard pick-up tool is shown, but other known elements of the handling machine are not shown. The cleaning material 324 is placed on the carrier substrate 20 (FIGS. 11A-11C) or on the cleaning area substrate 500. During a cleaning run, the handling machine is programmed to move (manually, semi-automatically, or automatically) to the position of the cleaning block / pad so that the pick-up tool can be inserted into the cleaning material. At specified time intervals or "on demand", the pick-up tool is cleaned when the cleaning material 324 is driven to contact a preset vertical position.

[0038] The cleaning material 324 shown in Figures 11A-11C can have micro-features as described above. Micro-features (e.g., micro-columns) are used and the geometry of the cleaning device has spacing, shape, and abrasiveness of the micro-columns such that the reciprocal pressure against the pick-up tool can be efficiently cleaned to remove and collect debris. The spacing 215, moment of inertia 216, and overall length 219 of the micro-columns are configured based on the configuration and materials of the contact surface, sides, and vacuum inlet / outlet diameter (101, 102, 103) of the pick-up tool. As the pick-up tool (101, 102, 103) is pressed into the cleaning material 324, debris is removed from the surface as well as the interior of the inlet / outlet. The number of pad / polymer / substrate layers and surface micro-features can be controlled to control the overall thickness of the cleaning device and the compliance of the cleaning thickness. This multi-layer embodiment allows for efficient "edge-side" cleaning of the interior of a multi-sided vacuum collet type pick-up tool.

[0039] As mentioned above, the cleaning operation has no impact on the operation of the handling machine since cleaning of the pick-up tool contact surfaces, sides and vacuum inlets / outlets is performed during normal operation. Thus, the cleaning operation allows the pick-up tool contact surfaces, sides and vacuum inlets / outlets to be cleaned inexpensively and without excessive downtime and loss of throughput.

[0040] In the microfeature embodiment shown in Figures 12A-13C, microfeatures (microcolumns 224 in Figures 12A-12C or micropyramidal structures 324 in Figures 13A-13C) are used, and the geometry of the cleaning device has a spacing, shape, and abrasiveness of the micropyramids such that the opposing pressure against the pick-up tool can be efficiently cleaned to remove debris. The separation of the microfeatures by streets 350, avenues 351, and diagonals 352 and width and depth are pre-set depending on the configuration and materials of the contact surface, sides, and vacuum inlet / outlet of the pick-up tool. The number of pad / polymer / substrate layers and surface microfeatures can be controlled to control the overall thickness of the cleaning device as well as the cleaning thickness compliance. This multi-layer embodiment allows for efficient "edge-side" cleaning of the interior of a multi-sided vacuum collet type pick-up tool.

[0041] FIG. 14A is an example of a vacuum collet 1400 before cleaning using a cleaning device, and FIG. 14B is an example of the vacuum collet 1400 after cleaning using a cleaning device. The vacuum collet 1400 has a circular contact surface 1402 with an internal void area. As shown in FIG. 14A, an uncleaned vacuum collet 1400 has one or more pieces of debris 1404 on the contact surface 1402 that have accumulated after repeated pick-up and place operations in a pick-and-place machine. The adhering debris 1404 affects the quality of the vacuum seal between the collet and the device being picked and placed, reducing the vacuum force. The debris pieces 1404 result in unplanned downtime that is required to manually clean the debris and restore the performance of the collet. When the vacuum collet is cleaned using the cleaning material and cleaning process disclosed above, the vacuum collet contacts the surface of the cleaning material and the adhering debris is removed from the contact surface 1402 and along the sides of the collet tip as shown in FIG. 14B. If necessary, the collet can be actuated into the cleaning polymer multiple times to remove any trapped debris. Cleaning of the collet contact surface 1402, as shown in Figure 14B, can be performed without taking the system offline for unscheduled maintenance.

[0042] The foregoing description has been described with reference to specific embodiments. However, the illustrative discussion above is not intended to be exhaustive or to limit the present disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teachings. The embodiments have been chosen and described in order to better explain the principles of the present disclosure and its practical application, and thereby enable others skilled in the art to better utilize the present disclosure and various embodiments with various modifications suited to the particular uses envisioned.

[0043] The systems and methods disclosed in this application can be implemented via or distributed among one or more components, systems, servers, machines, or other subcomponents. When implemented as a system, the system can include components such as software modules, a general purpose CPU, RAM, etc. found in a general purpose computer. In implementations where the innovations reside on a server, such a server can include components such as a CPU, RAM, etc. found in a general purpose computer.

[0044] Additionally, the systems and methods of the present application may be implemented with disparate or entirely different software, hardware, and / or firmware components in addition to those described above. For example, with respect to such other components (e.g., software, processing components, etc.) and / or computer-readable media associated with or embodying the present invention, aspects of the innovations presented in this application may be implemented consistently with numerous general purpose or special purpose computing systems or configurations. Various preferred computing systems, environments, and / or configurations suitable for use with the innovations presented in this application may include, but are not limited to, server computing devices such as personal computers, servers or routing / connection components, handheld or laptop devices, multiprocessor systems, microprocessor-based systems, set-top boxes, consumer electronic devices, network PCs, other existing computing platforms, distributed computing environments that include one or more of the above systems or devices.

[0045] In some cases, aspects of the systems and methods may be achieved or implemented through logic and / or logic instructions, including program modules executed in association with such components or circuitry, for example. Generally, program modules may include routines, programs, objects, components, data structures, etc., that perform particular tasks or implement particular instructions. The present invention may also be implemented in distributed software, computer or circuitry, where the circuits are connected via communication buses, circuitry or links. In a distributed configuration, control / instructions may be obtained from both local and remote computer storage media, including memory storage devices.

[0046] The software, circuitry and components shown in this application may also include and / or utilize one or more types of computer readable media. A computer readable medium may be any available medium that resides on, is coupled to, or is accessible by the circuitry and / or computer components. For example, and without limitation, a computer readable medium may include computer storage media and communication media. Computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information, such as computer readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or other media that can be used to store the desired information and that can be accessed by a computer component. Communication media may include computer readable instructions, data structures, program modules, and / or other components. Additionally, communication media may include wired media, such as a wired network or direct-wired connection, although any such type of media does not include transitory media. Combinations of any of the above are also included within the scope of computer-readable media.

[0047] In this description, terms such as component, module, device, etc. may refer to any type of logical or functional software element, circuit, block, and / or process that may be implemented in various ways. For example, the functions of various circuits and / or blocks may be combined with each other into any number of other modules. Each module may even be implemented as a software program stored in a tangible memory (e.g., random access memory, read only memory, CD-ROM memory, hard disk, etc.) that is read by a central processing unit to implement the functionality of the innovation of the present application. Alternatively, the module may include programming instructions transmitted to a general-purpose computer or processing / graphics hardware via a transmission carrier wave. The module may also be implemented as a hardware logic circuit that implements the functionality encompassed by the innovation of the present application. The module may also be implemented using special purpose instructions (SIMD instructions), field programmable logic arrays, or a mixture of these that provides the desired level of performance and cost.

[0048] As disclosed in this application, features consistent with the present disclosure can be implemented via computer hardware, software, and firmware. For example, the systems and methods disclosed in this application can be embodied in various forms, including, for example, a data processor, such as a computer including a database, digital electronic circuitry, firmware, software, or a combination thereof. Furthermore, while some of the disclosed implementations are described with specific hardware components, the systems and methods consistent with the innovations of this application can be implemented in any combination of hardware, software, and / or firmware. Furthermore, the above features and other aspects and principles of the innovations of this application can be implemented in a variety of environments. Such environments and related applications can include, among others, general-purpose computers or computer platforms configured to perform various routines, processes, and / or operations in accordance with the present invention, or selectively activated or reconfigured by code to provide the required functionality. The processes disclosed in this application are not inherently related to any particular computer, network, architecture, environment, or other apparatus, but can be implemented by any suitable combination of hardware, software, and / or firmware. For example, it may be more convenient to use various general-purpose machines together with programs written in accordance with the teachings of the present invention, or to configure specialized devices or systems to perform the required methods and techniques.

[0049] The embodiments of the methods and systems described herein, such as logic, can be implemented as programmed functionality in a variety of circuit configurations, including field programmable gate arrays (FPGAs), programmable array logic (PAL) devices, programmable logic devices (PLDs) and standard cell-based devices, such as electrically programmable logic and memory devices, as well as application specific integrated circuits. Some other possibilities for implementing the embodiments include memory devices, microcontrollers with memory (EEPROM), embedded microprocessors, firmware, software, and the like. Additionally, the embodiments can be embodied in microprocessors with software-based circuit emulation, discrete logic (sequential and combinatorial), custom devices, fuzzy (neutral) logic, quantum devices, and mixtures of any of the above device types. The underlying device technologies can be provided in a variety of component types, such as metal oxide semiconductor field effect transistor (MOSFET) technologies, such as complementary metal oxide semiconductor (CMOS), bipolar technologies, such as emitter coupled logic (ECL), polymer technologies (e.g., silicon conjugated polymers and metal conjugated polymer-metal structures), and mixed analog and digital.

[0050] The various logic and / or functions disclosed in this application may be enabled using any number of combinations of hardware, firmware, and / or as data and / or instructions embodied in various machine-readable or computer-readable media in terms of actions, register transfers, logic components and / or other features. Computer-readable media in which such formatted data and / or instructions may be embodied include, but are not limited to, non-volatile storage media of various forms (e.g., optical, magnetic or semiconductor storage media), but not including transitory media. Unless the context clearly requires otherwise, throughout the description, the words "comprise" and similar phrases should be interpreted in an inclusive sense, i.e., "including but not limited to," rather than an exclusive or exhaustive sense. Words using the singular or plural number also include the plural or singular number, respectively. Additionally, the words "herein," "herein," "on," "under," and similar words refer to this application as a whole, and not to any particular portion of this application. When "or" is used in reference to a list of two or more items, the word encompasses all of the following interpretations of the word. That is, any of the items in the list, all of the items in the list, and any combination of the items in the list.

[0051] While presently preferred implementations of the present invention have been specifically described in this application, it will be apparent to those skilled in the art to which the present invention pertains that changes and modifications can be made to the various implementations shown and described herein without departing from the spirit and scope of the present invention. Accordingly, it is intended that the present invention be limited only to the extent required by applicable legal provisions.

[0052] Although the foregoing refers to particular embodiments of the present disclosure, those skilled in the art will recognize that changes can be made to the embodiments without departing from the principles and spirit of the present disclosure, the scope of which is defined by the claims. The present disclosure also includes the following aspects. [Aspect 1] 1. A method for cleaning a pick and place apparatus of a semiconductor device handling machine used for packaged semiconductor device testing, the method comprising: positioning an elastomeric cleaning material adjacent a pick and place device connected to a semiconductor device handling machine, the pick and place device having one of a vacuum opening, a nozzle, a suction cup, a suction inlet, a vacuum collet, and a vacuum pick-up tool, each having an inner surface and an outer surface; inserting the pick and place device into and through the elastomeric cleaning material while the pick and place device is attached to the semiconductor device handling machine such that one of the vacuum opening, the nozzle, the suction cup, the suction inlet, the vacuum collet, and the vacuum pick-up tool contacts the elastomeric cleaning material; removing debris from the interior and exterior surfaces of one of the vacuum opening, the nozzle, the suction cup, the suction inlet, the vacuum collet, and the vacuum pick-up tool; A method comprising: [Aspect 2] 2. The method of claim 1, further comprising moving the elastomeric cleaning material adjacent to the pick and place device. [Aspect 3] 2. The method of embodiment 1, further comprising entrapment of the debris within the elastomeric cleaning material. Aspect 4 The method of embodiment 1, wherein the elastomeric cleaning device has a crosslinked polymer layer. Aspect 5 5. The method of embodiment 4, wherein the elastomeric cleaning material further comprises one or more intermediate layers having preset properties beneath the crosslinked polymeric layer. Aspect 6 2. The method of claim 1, wherein positioning the elastomeric cleaning material further comprises using the semiconductor device handling machine to position the elastomeric cleaning material and move a plurality of semiconductor devices during a package testing process. Aspect 7 6. The method of claim 5, wherein the elastomeric cleaning material further comprises a carrier beneath the one or more intermediate layers. Aspect 8 8. The method of claim 7, wherein the elastomeric cleaning material has a predetermined specific gravity, elasticity, viscosity, thickness and porosity. Aspect 9 1. A method for cleaning a pick and place device of a surface mount technology (SMT) component placement machine, the method comprising: positioning an elastomeric cleaning material near a pick and place device connected to the SMT machine, the pick and place device having one of a vacuum opening, a nozzle, a suction cup, a suction inlet, a vacuum collet, and a vacuum pick-up tool; while the pick and place device is attached to the SMT machine, inserting the pick and place device into and through the elastomeric cleaning material such that one of the vacuum opening, the nozzle, the suction cup, the suction inlet, the vacuum collet, and the vacuum pick-up tool contacts the elastomeric material removing debris from one or more surfaces of one or more of the vacuum opening, the nozzle, the suction cup, the suction inlet, the vacuum collet, and the vacuum pick-up tool; A method comprising: Aspect 10 10. The method of claim 9, further comprising moving the elastomeric cleaning material adjacent to the pick and place device. Aspect 11 10. The method of embodiment 9, further comprising entrapment of the debris within the elastomeric cleaning material. Aspect 12 10. The method of embodiment 9, wherein the elastomeric cleaning device has a crosslinked polymer layer. Aspect 13 13. The method of embodiment 12, wherein the elastomeric cleaning material further comprises one or more intermediate layers having preset properties beneath the crosslinked polymeric layer. Aspect 14 10. The method of claim 9, wherein positioning the elastomeric cleaning material further comprises using the semiconductor device handling machine to position the elastomeric cleaning material and move a plurality of semiconductor devices during a printed circuit board assembly process. Aspect 15 14. The method of claim 13, wherein the elastomeric cleaning material further comprises a carrier beneath the one or more intermediate layers. Aspect 16 16. The method of claim 15, wherein the elastomeric cleaning material has a predetermined specific gravity, elasticity, viscosity, thickness and porosity. Aspect 17 1. A method for cleaning a pick and place device of a die attach or flip chip bonder machine, the method comprising: positioning an elastomeric cleaning material near a pick and place device connected to a die attach or flip chip bonder machine, the pick and place device having one of a vacuum opening, a nozzle, a suction cup, a suction inlet, a vacuum collet, and a vacuum pick-up tool, each of which has an inner surface and an outer surface; inserting the pick and place device into and through the elastomeric cleaning material while the pick and place device is attached to the die attach or flip chip bonder machine such that one of the vacuum aperture, the nozzle, the suction cup, the suction inlet, the vacuum collet, and the vacuum pick-up tool contacts the elastomeric cleaning material; removing debris from the interior and exterior surfaces of one of the vacuum opening, the nozzle, the suction cup, the suction inlet, the vacuum collet, and the vacuum pick-up tool; A method comprising: Aspect 18 18. The method of claim 17, further comprising moving the elastomeric cleaning material adjacent to the pick and place device. Aspect 19 18. The method of embodiment 17, comprising entrapment of the debris within the elastomeric cleaning material. Aspect 20 18. The method of embodiment 17, wherein the elastomeric cleaning device has a crosslinked polymer layer. Aspect 21 21. The method of embodiment 20, wherein the elastomeric cleaning material further comprises one or more intermediate layers having preset properties beneath the crosslinked polymeric layer. Aspect 22 20. The method of claim 17, wherein positioning the elastomeric cleaning material further comprises using the semiconductor device handling machine to position the elastomeric cleaning material and move a plurality of semiconductor devices during a printed circuit board assembly process. Aspect 23 23. The method of claim 22, wherein the elastomeric cleaning material further comprises a carrier beneath the one or more intermediate layers. Aspect 24 24. The method of claim 23, wherein the elastomeric cleaning material has a predetermined specific gravity, elasticity, viscosity, thickness and porosity. Aspect 25 An apparatus comprising: a semiconductor device handling machine having a pick and place apparatus, the pick and place apparatus having a contact element having an inner surface and an outer surface, the contact element contacting and picking one of a device and a component using suction; a cleaning material attached to a substrate positioned adjacent to the pick and place device, the cleaning material having a top layer that contacts the contact surface of the pick and place device during a cleaning process, the top layer having properties for cleaning the inner and outer surfaces of the contact elements; Equipped with the contact elements are cleaned by inserting ends of the contact elements into a cleaning material while the contact elements are attached to the pick and place device; and the pick and place device performs a pick and place operation once the contact elements are cleaned. Device. Aspect 26 26. The apparatus of claim 25, wherein the cleaning material further has a surface tack that transfers debris particles on the contact element to the cleaning material. Aspect 27 27. The device of embodiment 26, wherein the surface tackiness is in the range of 20 grams to 800 grams. Aspect 28 26. The apparatus of embodiment 25, wherein the cleaning material further comprises a cleaning pad layer having one or more microfeatures formed in the cleaning pad layer. Aspect 29 29. The apparatus of embodiment 28, wherein the one or more microfeatures are one of microcolumns and micropyramids. Aspect 30 30. The apparatus of embodiment 28, wherein the cleaning material further comprises one or more intermediate layers beneath the cleaning pad layer to support the cleaning pad layer. Aspect 31 31. The device of embodiment 30, wherein the intermediate layer is one of a stiff layer, a compliant layer, and a stiff and compliant layer. Aspect 32 31. The apparatus of embodiment 30, wherein the cleaning material further comprises a release layer on an upper surface of the cleaning pad layer to protect the cleaning pad layer. Aspect 33 26. The apparatus of embodiment 25, wherein the cleaning material further comprises a substrate upon which the cleaning pad layer is supported. Aspect 34 26. The apparatus of embodiment 25, wherein the pick and place apparatus further includes one of a pick and place apparatus for a packaged device to be tested and a pick and place apparatus for components used in a surface mounting process. Aspect 35 26. The apparatus of embodiment 25, wherein the pick and place apparatus further comprises one of a pick and place apparatus for a die attach machine and a pick and place apparatus for a flip chip bonder machine. Aspect 36 26. The apparatus of embodiment 25, wherein the contact element further comprises one of a vacuum opening, a nozzle, a suction cup, a suction inlet, or a vacuum collet of the pick and place apparatus. Aspect 37 26. The apparatus of claim 25, wherein the top surface of the cleaning material is a textured surface that cleans inner and outer surfaces of the vacuum pick-up tool. Aspect 38 26. The apparatus of embodiment 25, wherein the cleaning layer has a set of micro-features with a spacing, moment of inertia, and overall length of each micro-feature determined based on at least a diameter of the content element of the pick-and-place apparatus. Aspect 39 26. The apparatus of claim 25, wherein the cleaning layer has a set of micro-features and an array of streets, avenues, or diagonals separating each micro-feature from each other micro-feature, the width of each street, avenue, or diagonal being based on a dimension of the content element of the pick and place apparatus. Aspect 40 1. A cleaning device comprising: a cleaning material attached to a substrate; the cleaning material is polymeric and has a set of micro-features configured to clean contact elements of a pick and place machine having an inner surface and an outer surface; an upper surface of the cleaning material having a surface tackiness that transfers debris on the contact element surface to the cleaning material and a property that cleans the inner and outer surfaces of the contact element; Cleaning device. Aspect 41 41. The cleaning device of embodiment 40, wherein the surface tackiness is in the range of 20 grams to 800 grams. Aspect 42 42. The cleaning device of embodiment 41, wherein the set of micro-features is one of micro-columns and micro-pyramids. Aspect 43 A cleaning device according to embodiment 40, wherein the cleaning material further comprises a cleaning pad layer and one or more intermediate layers below the cleaning pad layer to support the cleaning pad layer. Aspect 44 Aspect 44. The cleaning device of aspect 43, wherein the intermediate layer is one of a stiff layer, a compliant layer, and a stiff and compliant layer. Aspect 45 A cleaning device according to embodiment 40, wherein the cleaning material further comprises a release layer on an upper surface of the cleaning pad layer to protect the cleaning pad layer. [Aspect 45] (Duplicate) 41. The cleaning device of embodiment 40, wherein the cleaning material has a predetermined specific gravity, elasticity, viscosity, thickness and porosity. Aspect 46 46. ​​The cleaning device of embodiment 45, wherein the cleaning material is one of a rubber, a natural polymer, and a synthetic polymer. Aspect 47 47. The cleaning device of embodiment 46, wherein the cleaning material has a specific gravity in the range of 0.75 to 2.27, an elastic modulus in the range of 40 MPa to 600 MPa, a viscosity in the range of 20 to 800 grams, a thickness in the range of 25 μm to 500 μm, and each layer has a hardness of 30 Shore A to 90 Shore A and a porosity in the range of 10 to 150 micropores / inch. Aspect 48 45. The cleaning device of embodiment 44, wherein the cleaning pad layer further comprises a plurality of abrasive particles having a Mohs hardness of 7 or greater. Aspect 49 49. The cleaning device of embodiment 48, wherein the cleaning material has a specific gravity in the range of 0.75 to 2.27, an elastic modulus in the range of 40 MPa to 600 MPa, a viscosity in the range of 20 to 800 grams, a thickness in the range of 25 μm to 500 μm, and each layer has a hardness of 30 Shore A to 90 Shore A and a porosity in the range of 10 to 150 micropores per inch. Aspect 50 41. The apparatus of claim 40, wherein the top surface of the cleaning material is a textured surface that cleans the inner and outer surfaces of the contact element. Aspect 51 41. The apparatus of embodiment 40, wherein the cleaning layer has a set of micro-features with a spacing, moment of inertia, and overall length of each micro-feature determined based on at least a diameter of the content element. Aspect 52 41. The apparatus of claim 40, wherein the cleaning layer has a set of micro-features and an array of streets, avenues, or diagonals separating each micro-feature from each other micro-feature, the width of each street, avenue, or diagonal being based on a dimension of the content element. Aspect 53 1. A method for picking and placing semiconductor components, the method comprising: performing a pick and place operation on a semiconductor device using a contact element of a pick and place apparatus, the contact element having an inner surface and an outer surface; cleaning the contact elements of the pick and place device while the contact elements are attached to the pick and place device, where cleaning the contact elements further includes inserting ends of the contact elements into a cleaning material and cleaning the inner and outer surfaces of the contact elements with the cleaning material; performing the pick and place operation once the contact elements are cleaned; A method comprising: Aspect 54 54. The method of embodiment 53, wherein cleaning the contact element further comprises transferring debris from a surface of the contact element to the cleaning material. Aspect 55 55. The method of embodiment 54, wherein transferring debris from the surface of the contact element further comprises using surface tackiness of an upper surface of the cleaning material to attract the debris. Aspect 56 56. The method of claim 55, wherein transferring debris from a surface of the contact element further comprises transferring debris from an interior surface of the contact element to the surface of the cleaning material. Aspect 57 54. The method of claim 53, wherein performing the pick-and-place operation further includes one of performing the pick-and-place operation for a packaged device to be tested and performing the pick-and-place operation for a component used in a surface mounting process. Aspect 58 54. The method of claim 53, wherein performing the pick and place operation further includes one of performing the pick and place operation for a die attach machine and performing the pick and place operation for a flip chip bonder machine. Aspect 59 54. The method of embodiment 53, wherein cleaning the contact elements further comprises positioning the cleaning material adjacent to the pick and place device. Aspect 60 54. The method of embodiment 53, wherein cleaning the contact element further comprises cleaning one of a vacuum opening, a nozzle, a suction cup, a suction inlet, or a vacuum cullet of the pick and place device.

Claims

1. 1. An apparatus comprising: a semiconductor device handling machine having a pick and place apparatus, the pick and place apparatus having a contact element having an inner surface and an outer surface, the contact element contacting and picking one of a device and a component using suction; a cleaning material attached to a substrate positioned adjacent to the pick and place device, the cleaning material having a top layer that contacts a contact surface of the pick and place device during a cleaning process, the top layer having a plurality of micro-features, the spacing between the micro-features, the moment of inertia of each micro-feature, and the overall length of each micro-feature being determined based on at least a diameter of the contact elements of the pick and place device that clean inner and outer surfaces of the contact elements and a textured surface that cleans the inner and outer surfaces of the contact elements; Equipped with the contact elements are cleaned by inserting ends of the contact elements into the cleaning material while the contact elements are attached to the pick and place device; and the pick and place device performs a pick and place operation once the contact elements are cleaned. Device.

2. The apparatus of claim 1 , wherein the cleaning material further has a surface tack that transfers debris particles on the contact elements to the cleaning material.

3. The device of claim 2, wherein the surface tackiness is in the range of 20 grams to 800 grams.

4. The apparatus of claim 1 , wherein the cleaning material further comprises a cleaning pad layer having one or more microfeatures formed in the cleaning pad layer.

5. The device of claim 4 , wherein the one or more microfeatures are one of microcolumns and micropyramids.

6. The apparatus of claim 4 , wherein the cleaning material further comprises one or more intermediate layers below the cleaning pad layer to support the cleaning pad layer.

7. The device of claim 6 , wherein the intermediate layer is one of a stiff layer, a compliant layer, and a stiff and compliant layer.

8. The device of claim 6 , wherein the cleaning material further comprises a release layer on an upper surface of the cleaning pad layer to protect the cleaning pad layer.

9. The apparatus of claim 1 , wherein the cleaning material further comprises a substrate on which the cleaning pad layer is supported.

10. 10. The apparatus of claim 1, wherein the pick and place apparatus further comprises one of a pick and place apparatus for a packaged device under test and a pick and place apparatus for a component used in a surface mount process.

11. 10. The apparatus of claim 1, wherein the pick and place machine further comprises one of a pick and place machine for a die attach machine and a pick and place machine for a flip chip bonder machine.

12. The apparatus of claim 1 , wherein the contact element further comprises one of a vacuum opening, a nozzle, a suction cup, a suction inlet, and a vacuum collet of the pick and place device.

13. 2. The apparatus of claim 1, wherein the cleaning material has a set of micro-features and an array of streets, avenues or diagonals separating each micro-feature from each other micro-feature, the width of each street, avenue or diagonal being based on a dimension of the contact elements of the pick and place apparatus.

14. 1. A cleaning device comprising: a cleaning material attached to a substrate; the cleaning material is polymeric and has a set of micro-features configured to clean a vacuum pick-up tool of a pick and place machine and a vacuum inlet / outlet of the vacuum pick-up tool; a top surface of the cleaning material having a surface tackiness that transfers debris particles on a vacuum pick-up tool of the pick and place machine and a vacuum inlet / outlet of the vacuum pick-up tool to the cleaning material, and a textured surface that cleans the interior and exterior surfaces of the vacuum pick-up tool. Cleaning device.

15. The cleaning device of claim 14, wherein the surface tackiness is in the range of 20 grams to 800 grams.

16. The cleaning device of claim 15 , wherein the set of micro-features is one of micro-columns and micro-pyramids.

17. The cleaning device of claim 14, wherein the cleaning material further comprises a cleaning pad layer and one or more intermediate layers below the cleaning pad layer to support the cleaning pad layer.

18. The cleaning device of claim 17, wherein the intermediate layer is one of a stiff layer, a compliant layer, and a stiff and compliant layer.

19. The cleaning device of claim 14, wherein the cleaning material further comprises a release layer on an upper surface of the cleaning pad layer to protect the cleaning pad layer.

20. The cleaning device of claim 14, wherein the cleaning material has a predetermined specific gravity, elasticity, viscosity, thickness and porosity.

21. 21. The cleaning device of claim 20, wherein the cleaning material is one of a rubber, a natural polymer, and a synthetic polymer.

22. 22. The cleaning device of claim 21, wherein the cleaning material has a specific gravity in the range of 0.75 to 2.27, a modulus of elasticity in the range of 40 MPa to 600 MPa, a viscosity in the range of 20 to 800 grams, a thickness in the range of 25 μm to 500 μm, and each layer has a hardness of 30 Shore A to 90 Shore A and a porosity in the range of 10 to 150 micropores per inch.

23. 20. The cleaning device of claim 18, wherein the cleaning pad layer further comprises a plurality of abrasive particles having a Mohs hardness of 7 or greater.

24. 24. The cleaning device of claim 23, wherein the cleaning material has a specific gravity in the range of 0.75 to 2.27, a modulus of elasticity in the range of 40 MPa to 600 MPa, a viscosity in the range of 20 to 800 grams, a thickness in the range of 25 μm to 500 μm, and each layer has a hardness of 30 Shore A to 90 Shore A and a porosity in the range of 10 to 150 micropores per inch.

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