Electronic component

Abstract

To provide an electronic component that suppresses the variation in positions of external electrodes on the surface of a base.SOLUTION: A coil component 1 includes a base 3 that includes a resin part 30 and an external electrode 5 that is arranged on the base 3 and includes a plating layer 50. The surface of the resin part 30 constitutes the surface of the base 3. The plating layer 50 constitutes an innermost layer of the external electrode 5 and is formed on a surface of the resin part 30.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] There is known an electronic component that includes a base, a coil, and an external electrode disposed on the surface of the base (see, for example, Patent Document 1). The coil and the external electrode are electrically connected to each other. The external electrode is formed as a sintered body of a coated conductive paste. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-030673 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of one aspect of the present invention is to provide an electronic component in which variation in the positions of external electrodes on the surface of a base is suppressed. [Means for solving the problem]

[0005] According to one embodiment, an electronic component includes a base including a resin part, and an external electrode disposed on the base and including a plating layer. The surface of the resin part constitutes the surface of the base. The plating layer constitutes the innermost layer of the external electrode and is formed on the surface of the resin part. Effect of the Invention

[0006] One aspect of the present invention provides an electronic component in which variation in the positions of external electrodes on the surface of a base is suppressed. [Brief description of the drawings]

[0007] [Figure 1]FIG. 1 is a perspective view of a coil component according to a first embodiment. [Diagram 2] FIG. 2 is a diagram showing a cross-sectional configuration of the coil component according to the first embodiment. [Diagram 3] FIG. 3 is a diagram showing a cross-sectional configuration of the coil component according to the first embodiment. [Figure 4] FIG. 4 is a diagram showing a cross-sectional configuration of the coil component according to the first embodiment. [Diagram 5] FIG. 5 is a perspective view of a coil component according to the second embodiment. [Figure 6] FIG. 6 is a diagram showing a cross-sectional configuration of a coil component according to the second embodiment. [Figure 7] FIG. 7 is a perspective view of a coil component according to the third embodiment. [Figure 8] FIG. 8 is a diagram showing a cross-sectional configuration of a coil component according to the third embodiment. [Figure 9] FIG. 9 is a perspective view of a coil component according to the fourth embodiment. [Figure 10] FIG. 10 is a perspective view of a coil component according to the fifth embodiment. [Figure 11] FIG. 11 is a perspective view of a coil component according to the sixth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the description of the drawings, the same or corresponding elements are given the same reference numerals, and duplicated description will be omitted as appropriate.

[0009] The configuration of a coil component 1 according to a first embodiment will be described with reference to Figs. 1 to 4. The coil component 1 is an example of an electronic component. Fig. 1 is a perspective view of the coil component according to the first embodiment. Fig. 2 is a diagram showing a cross-sectional configuration of the coil component according to the first embodiment. Fig. 3 is a diagram showing a cross-sectional configuration in a different direction from that of Fig. 2. Fig. 4 is a diagram showing a cross-sectional configuration in which a part of Fig. 3 is enlarged.

[0010] As shown in Fig. 1 to Fig. 3, the coil component 1 includes a coil element 2, a base 3, a resin 4, and a plurality of external electrodes 5. The coil element 2 is an example of an element. The coil component 1 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0011] As shown in Figures 1 and 2, the coil element 2 has a coil portion 21 and a pair of connection portions 22. The coil portion 21 is made of a wound conductor 20. An insulating coating is formed on the surface of the conductor 20. The coil portion 21 forms an air-core coil having a spiral shape. The coil portion 21 includes a plurality of turns. The pair of connection portions 22 are continuous with both ends of the portion of the conductor 20 that forms the coil portion 21. The pair of connection portions 22 are part of the conductor 20. The connection portions 22 electrically connect the coil portion 21 and the external electrode 5 to each other.

[0012] The coil element 2 is disposed within a base 3. The base 3 has a space S in which the coil element 2 is disposed. The base 3 has a pair of side walls 31 and a pair of side walls 32. For example, the pair of side walls 31 are defined as a pair of first side walls, and the pair of side walls 32 are defined as a pair of second side walls. The pair of side walls 31 are spaced apart in a direction D1. The pair of side walls 31 face each other in the direction D1. Each side wall 31 is adjacent to the coil element 2 in the direction D1. The pair of side walls 32 are spaced apart in a direction D2. The pair of side walls 32 face each other in the direction D2. The pair of side walls 32 connect the pair of side walls 31. Each side wall 32 is adjacent to the coil element 2 in the direction D2. The direction D2 intersects with the direction D1. In the coil component 1, the direction D1 and the direction D2 are perpendicular to each other. The pair of side walls 31 and the pair of side walls 32 define a space S.

[0013] In the coil device 1, each side wall 31 has a rectangular parallelepiped shape, and each side wall 32 has a plate shape. The side wall 32 is continuous with a pair of side walls 31. The side walls 31 and 32 each include an outer surface facing the outside of the base 3 and an inner surface facing the space S. The side wall 31 includes an outer surface and an inner surface facing the direction D1, and the side wall 32 includes an outer surface and an inner surface facing the direction D2. The thickness of the side wall 31 in the direction D1 is thicker than the thickness of the side wall 32 in the direction D2. The length of the base 3 in the direction D1 is longer than the length of the base 3 in the direction D2. The size of the space S in the direction D1 is larger than the size of the space S in the direction D2.

[0014] In the coil component 1, the coil element 2 is arranged such that the pair of side walls 32 and the coil axis of the coil element 2 intersect. In one example, the coil axis of the coil element 2 is along direction D2. The size of the coil element 2 in direction D2 along the coil axis is smaller than the size of the coil element 2 in direction D1, which is one of the directions perpendicular to the coil axis. One of the pair of connecting portions 22 extends from one end of the coil portion 21 in direction D2. The other of the pair of connecting portions 22 extends from the other end of the coil portion 21 in direction D2.

[0015] The base 3 has a pair of opening ends 3a, 3b formed by a pair of side walls 31 and a pair of side walls 32. The pair of opening ends 3a, 3b are located at both ends of the base 3 in the direction D3. The space S has both ends open in the direction D3. The direction D3 intersects with the direction D1 and the direction D2. In the coil component 1, the direction D3 is perpendicular to the direction D1 and the direction D2. For example, the direction D3 is defined as a first direction, the direction D1 is defined as a second direction, and the direction D2 is defined as a third direction. The coil component 1 has a rectangular parallelepiped shape with the direction D1 as the longitudinal direction. When viewed from the direction D3, the space S has a rectangular shape with the direction D1 as the longitudinal direction. Hereinafter, the side where the opening end 3a is located may be referred to as “upper,” and the side where the opening end 3b is located may be referred to as “lower.” For example, the opening end 3a includes the upper surface of the base 3, and the opening end 3b includes the lower surface of the base 3.

[0016] The base 3 includes a resin part 30. The surface of the resin part 30 constitutes at least a part of the surface of the base 3. The resin part 30 is included in the side wall 31 and the side wall 32. The surface of the resin part 30 constitutes at least a part of the surface of the side wall 31. In the coil component 1, the base 3 is entirely constituted by the resin part 30. The base 3 may be entirely formed by the resin part 30 by injection molding. The resin part 30 includes a resin material and a metal compound. The resin material may be made of ABS resin, epoxy resin, LCP resin, PC resin, PC / ABS resin in which PC resin and ABS resin are mixed, PC / PET resin in which PC resin and PET resin are mixed, PA / PPA resin in which PA resin and PPA resin are mixed, PBT resin, COP resin, PPO resin, PPE resin, PEI resin, or PEEK resin. In one example, the metal compound may include a compound of a metal catalyst. The metal catalyst may have autocatalytic reactivity. The metal catalyst may include, for example, nickel, copper, palladium, or gold. The compound of the metal catalyst may include an organometallic complex of the metal catalyst. The metal compound is dispersed to the surface of the resin portion 30.

[0017] The resin 4 is disposed in the space S. The resin 4 is formed, for example, by filling the space S and then curing. The resin 4 may be filled from the open end 3a to the open end 3b. The resin 4 includes a pair of surfaces 4a that face each other in the direction D3 and are exposed from the base 3. The resin 4 covers the coil element 2. The coil element 2 is fixed to the base 3 by the resin 4. The coil portion 21 includes an exposed portion 2a. The exposed portion 2a is exposed from the surface 4a on the open end 3a side of the pair of surfaces 4a. A part of the coil portion 21 included in the exposed portion 2a and a part of the pair of connection portions 22 are exposed from the surface 4a on the open end 3a side of the pair of surfaces 4a. The exposed portion 2a may be located outside the open end 3a. The size of the exposed portion 2a in the direction D3 may be half or less of the diameter of the conductor 20.

[0018] The resin 4 has electrical insulation properties. The resin 4 may be composed of a polybismaleimide resin, a urethane resin, an epoxy resin, or a silicone resin. The visible light transmittance of the resin 4 is higher than the visible light transmittance of the base 3. For example, the visible light transmittance of the resin 4 may be 10% or more, 50% or more, or 95% or more.

[0019] Each external electrode 5 is electrically connected to the coil element 2. The external electrodes 5 are disposed on the surface of the base 3. The external electrodes 5 are disposed on the side walls 31. In the coil component 1, the multiple external electrodes 5 are disposed at the upper ends of the pair of side walls 31 in the direction D3. The external electrodes 5 constitute the mounting surface of the coil component 1. When viewed from the direction D3, each external electrode 5 has a rectangular shape. The external electrodes 5 include a plating layer 50. The plating layer 50 constitutes the innermost layer of the external electrode 5 and is formed on the surface of the resin part 30. The innermost layer of the external electrode 5 is the part of the external electrode 5 that is closest to the base 3. In the coil component 1, the external electrode 5 is entirely composed of the plating layer 50. The plating layer 50 constitutes the outermost layer of the external electrode 5. The outermost layer of the external electrode 5 is the part of the external electrode 5 that is farthest from the base 3.

[0020] The connection portion 22 includes an end portion 22a. The end portion 22a is physically connected to the plating layer 50 and is disposed on the plating layer 50. The end portion 22a is exposed. The conductive wire 20 at the end portion 22a is exposed from the insulating coating.

[0021] Each side wall 31 includes a portion 31a, a portion 31b, and a portion 31c. The portion 31b is continuous with the portion 31a in the direction D2. The portion 31c is continuous with the portion 31a such that the portion 31a is located between the portion 31b and the portion 31c. In the side wall 31, the portions 31a, 31b, and 31c are continuous with each other in the order of the portion 31b, the portion 31a, and the portion 31c. The portion 31b includes one end of the side wall 31 in the direction D2. The portion 31c includes the other end of the side wall 31 in the direction D2. The upper surface of the portion 31b and the upper surface of the portion 31c are continuous with the upper surface of the side wall 32.

[0022] The portions 31a and 31b form a step in which the portion 31a is lower than the portion 31b. The portions 31a and 31c form a step in which the portion 31a is lower than the portion 31c. The size of the step formed by the portions 31a and 31b in the direction D3 is approximately equal to the size of the step formed by the portions 31a and 31c in the direction D3. The upper surfaces of the portions 31b and 31c may be located on a single imaginary plane.

[0023] A recess 3d having a shape corresponding to the shape of the end 22a is formed in each side wall 31. The recess 3d is, for example, defined as a first recess. The surface of the resin part 30 constitutes a surface including a portion corresponding to the recess 3d. The recess 3d may include a groove formed by the portion 31a, the portion 31b, and the portion 31c. The groove extends from the inner surface of the side wall 31 to the outer surface of the side wall 31 so as to open into the inner surface and the outer surface of the side wall 31, respectively. The groove formed by the portion 31a, the portion 31b, and the portion 31c may have a horseshoe shape in which the width of the groove narrows as it approaches the bottom of the groove, as viewed from the direction D1 in which the groove extends.

[0024] Each external electrode 5 includes regions 5a, 5b, and 5c that are located on the surface of the resin portion 30 including the portion corresponding to the recessed portion 3d and that include the plating layer 50. The region 5a is located on the portion 31a. The region 5b is located on the portion 31b. The region 5c is located on the portion 31c. The region 5a is defined as, for example, a third region. The region 5b is continuous with the region 5a in the direction D2. The region 5c is continuous with the region 5a such that the region 5a is located between the region 5b and the region 5c. In the external electrode 5, the regions 5a, 5b, and 5c are continuous in the order of the region 5b, the region 5a, and the region 5c. The region 5b includes one end of the external electrode 5 in the direction D2. The region 5c includes the other end of the external electrode 5 in the direction D2.

[0025] Regions 5a and 5b form a step along portions 31a and 31b, where region 5a is lower than region 5b. Regions 5a and 5c form a step along portions 31a and 31c, where region 5a is lower than region 5c. The size of the step formed by regions 5a and 5b in direction D3 is approximately equal to the size of the step formed by regions 5a and 5c in direction D3. The upper surfaces of regions 5b and 5c may be located on a single imaginary plane.

[0026] The plating layer 50 included in the region 5a has a recess 5d corresponding to the recess 3d. The recess 5d is defined as, for example, a second recess. The end 22a is disposed on the plating layer 50 at a portion corresponding to the recess 5d. The recess 5d may include a groove formed by the region 5a, the region 5b, and the region 5c. The groove extends from the inner surface of the side wall 31 to the outer surface of the side wall 31 along the groove included in the recess 3d so as to open on the inner surface and the outer surface of the side wall 31, respectively. The end 22a may extend to the position of the outer surface. The groove formed by the region 5a, the region 5b, and the region 5c may have a horseshoe shape in which the width of the groove narrows as it approaches the bottom of the groove, as viewed from the direction D1 in which the groove extends.

[0027] The shape of the end 22a is not limited to a cylindrical shape. The end 22a may have an elliptical cylinder shape. The end 22a may include a plane along the upper surface of the region 5b and the upper surface of the region 5c. The plane is located on a virtual plane on which the upper surfaces of the regions 5b and 5c are located.

[0028] FIG. 4 shows an enlarged view of a portion where the end 22a, the plating layer 50, and the side wall 31 in FIG. 3 overlap. As shown in FIG. 4, the plating layer 50 includes a metal coating 51, a metal coating 52, and a metal coating 53. The metal coating 51 is formed on the resin part 30. For example, the metal coating 51 is formed by electroless plating using the metal 30a appearing on the surface of the resin part 30 as a self-catalyst. The metal 30a appearing on the surface of the resin part 30 may be a metal compound activated by laser irradiation. In one example, the metal coating 51 is made of copper. The metal coating 52 is disposed between the metal coating 51 and the metal coating 53. For example, the metal coating 52 is formed by electroless plating. In one example, the metal coating 52 is made of nickel. The metal coating 53 is disposed on the metal coating 52 and is joined to the end 22a. For example, the metal coating 53 is formed by electroless plating. In one example, the metal coating 53 is made of gold.

[0029] The metal coating 53 and the end 22a do not have to be directly bonded to each other. The metal coating 53 and the end 22a may be bonded to each other via a bonding member. The bonding member is, for example, solder. The thickness of the metal coating 52 may be greater than the thickness of the metal coating 51. The thickness of the metal coating 52 may be greater than the thickness of the metal coating 53. The metal coating 52 may be harder than the metal coating 51. The metal coating 52 may be harder than the metal coating 53.

[0030] Next, the configuration of a coil component 1A according to a second embodiment will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is a perspective view of the coil component according to the second embodiment. Fig. 6 is a diagram showing a cross-sectional configuration of the coil component according to the second embodiment. The coil component 1A according to the second embodiment differs from the coil component 1 in terms of the configurations of the base 3 and the external electrode 5. Below, the differences between the coil component 1 and the coil component 1A will be mainly described. The coil component 1A includes an external electrode 5A. In the coil component 1A, the base 3 has a side wall 31A.

[0031] The side wall 31A includes a portion 31a and a portion 31b. The side wall 31A does not include a portion 31c. For example, the portion 31a is defined as a first portion, and the portion 31b is defined as a second portion. In the side wall 31A, the portion 31b includes one end of the side wall 31A in the direction D2. In the side wall 31A, the portion 31a includes the other end of the side wall 31A in the direction D2. The portion 31b is higher than the portion 31a, and forms a step 3s with the portion 31a. For example, the step 3s is defined as a first step. The surface of the resin part 30 constitutes the surface of the portion 31a and the surface of the portion 31b. The upper surface of the side wall 32 is continuous with the upper surface of the portion 31b. The side wall 32 and the portion 31a form a step in which the portion 31a is lower than the side wall 32. The external electrode 5A includes a region 5a and a region 5b. The external electrode 5A does not include a region 5c. For example, the region 5a is defined as a first region, and the region 5b is defined as a second region. In the external electrode 5A, the region 5b includes one end of the external electrode 5A in the direction D2. In the external electrode 5A, the region 5a includes the other end of the external electrode 5A in the direction D2. The region 5a is located on the surface of the portion 31a and includes a plating layer 50. The region 5b is located on the surface of the portion 31b and includes a plating layer 50. The plating layer 50 included in the region 5a and the plating layer 50 included in the region 5b form a step 5s corresponding to the step 3s. For example, the step 5s is defined as a second step. In the coil component 1A, the end 22a is disposed on the plating layer 50 included in the region 5a. The end 22a may be disposed along the step 5s. The end 22a may abut against the step 5s. The end 22a may include a plane along the upper surface of the region 5b. The plane is located on a virtual plane on which the upper surface of the region 5b is located.

[0032] Next, the configuration of a coil component 1B according to a third embodiment and the configuration of a coil component 1C according to a fourth embodiment will be described with reference to Figs. 7, 8, and 9. Fig. 7 is a perspective view of the coil component according to the third embodiment. Fig. 8 is a diagram showing a cross-sectional configuration of the coil component according to the third embodiment. Fig. 9 is a perspective view of the coil component according to the fourth embodiment. The coil component 1B according to the third embodiment differs from the coil component 1 in terms of the configuration of the coil element 2. The coil component 1C according to the fourth embodiment differs from the coil component 1A in terms of the configuration of the coil element 2. Below, differences between the coil components 1 and 1B, and differences between the coil components 1A and 1C will be mainly described. The coil components 1B and 1C each include a coil element 2B.

[0033] The coil element 2B is arranged so that the pair of side walls 31 and the coil axis of the coil element 2B intersect. In one example, the coil axis of the coil element 2B is along the direction D1. The size of the coil element 2B in the direction D1 along the coil axis is larger than the size of the coil element 2B in a direction D2, which is one of the directions perpendicular to the coil axis. One of the pair of connecting parts 22 extends from one end of the coil part 21 in the direction D1. The other of the pair of connecting parts 22 extends from the other end of the coil part 21 in the direction D1. In the coil component 1B, the end 22a is arranged along the groove formed by the region 5a, the region 5b, and the region 5c. In the coil component 1C, the end 22a is arranged along the step 5s formed by the region 5a and the region 5b.

[0034] Next, the configuration of a coil component 1D according to a fifth embodiment and the configuration of a coil component 1E according to a sixth embodiment will be described with reference to Figs. 10 and 11. Fig. 10 is a perspective view of the coil component according to the fifth embodiment. Fig. 11 is a perspective view of the coil component according to the sixth embodiment. The coil component 1D according to the fifth embodiment differs from the coil component 1 in terms of the configurations of the coil element 2, the side wall 31, and the external electrode 5. The coil component 1E according to the sixth embodiment differs from the coil component 1A in terms of the configurations of the coil element 2, the side wall 31A, and the external electrode 5A. Hereinafter, the differences between the coil components 1 and 1D and the differences between the coil components 1A and 1E will be mainly described.

[0035] In coil parts 1D and 1E, coil portion 21 does not include exposed portion 2a. Coil portion 21 is not exposed from surface 4a. In coil parts 1D and 1E, coil element 2 is not exposed from resin 4 except for end 22a. In coil parts 1D and 1E, coil element 2 may be located inside open end 3a. In coil part 1D, imaginary planes on which the upper surfaces of portions 31b and 31c are located do not include end 22a. In coil part 1E, imaginary planes on which the upper surface of portion 31b is located do not include end 22a. End 22a is located below the imaginary planes.

[0036] As described above, the external electrodes 5, 5A are disposed on the surface of the base 3. The surface of the resin part 30 constitutes the surface of the base 3. The plating layer 50 constitutes the innermost layer of the external electrodes 5, 5A and is formed on the surface of the resin part 30. Since the plating layer 50 is directly formed on the surface of the resin part 30, the variation in the position of the plating layer 50 on the surface of the resin part 30 is suppressed. The position of the plating layer 50 on the surface of the resin part 30 corresponds to the position of the external electrodes 5, 5A on the surface of the base 3. Therefore, in the coil components 1, 1A, 1B, 1C, 1D, and 1E, the variation in the position of the plating layer 50 on the surface of the resin part 30 is suppressed, and therefore the variation in the position of the external electrodes 5, 5A on the surface of the base 3 can be suppressed.

[0037] The resin portion 30 includes a metal compound. The surface of the resin part 30 constitutes the surface of the base 3. The metal compound of the resin part 30 can appear as a metal 30a on the surface of the base 3. For example, the metal compound is composed of a compound of a metal catalyst. The compound of the metal catalyst is activated by irradiation with a laser and appears as a metal 30a on the surface of the base 3. The plating layer 50 is formed using the metal 30a that appears on the surface of the base 3 as a self-catalyst. The position where the compound of the metal catalyst appears as a metal 30a on the surface of the base 3 is selectively determined as the position on the surface of the base 3 that is irradiated with a laser. Therefore, in the configuration of the resin part 30 including the compound of the metal catalyst, the variation in the position of the external electrodes 5, 5A on the surface of the base 3 can be further suppressed.

[0038] The coil components 1, 1A, 1D, and 1E each include a coil element 2 and a connection portion 22 including an end portion 22a. The coil element 2 is disposed within the base 3. The connection portion 22 electrically connects the coil element 2 and the external electrodes 5 and 5A to each other. The coil components 1B and 1C each include a coil element 2B and a connection portion 22. The coil element 2B is disposed within the base 3. The connection portion 22 electrically connects the coil element 2B and the external electrodes 5 and 5A to each other. The plating layer 50 constitutes the outermost layer of the external electrodes 5 and 5A. The end portion 22a is physically connected to the plating layer 50 and is disposed on the plating layer 50. In the connection portion 22 that electrically connects the coil element in the base 3 and the external electrodes 5, 5A arranged on the surface of the base 3, the end portion 22a is arranged on the plating layer 50 and is physically connected to the plating layer 50. In a configuration in which the end portion 22a arranged on the plating layer 50 is connected to the external electrodes 5, 5A, wiring of the connection portion 22 is easier than in a configuration in which the end portion arranged in the base is connected to the external electrodes, so that the coil element is less likely to interfere with the connection portion 22 in the base 3. Therefore, in a configuration in which the end portion 22a arranged on the plating layer 50 is connected to the external electrodes 5, 5A, the design freedom of the coil element is improved compared to a configuration in which the end portion arranged in the base is connected to the external electrodes.

[0039] In the coil components 1A, 1C, and 1E, the base 3 has a side wall 31A on which the external electrode 5A is disposed. The side wall 31A includes a portion 31a and a portion 31b. The portion 31b is higher than the portion 31a and forms a step 3s with the portion 31a. The surface of the resin part 30 is made up of the surface of the portion 31a and the surface of the portion 31b. The external electrode 5A includes a region 5a and a region 5b. The region 5a is located on the surface of the portion 31a and includes a plating layer 50. The region 5b is located on the surface of the portion 31b and includes a plating layer 50. The plating layer 50 included in the region 5a and the plating layer 50 included in the region 5b form a step 5s corresponding to the step 3s. The end portion 22a is located on the plating layer 50 included in the region 5a. Since the region 5a and the region 5b form a step 5s in which the region 5a is lower than the region 5b, the end 22a disposed on the plating layer 50 in the region 5a is unlikely to shift from the region 5a toward the region 5b. Therefore, the physical strength of the connection between the end 22a and the plating layer 50 can be improved.

[0040] In the coil components 1, 1B, and 1D, the base 3 has a sidewall 31 on which the external electrode 5 is disposed. A recess 3d having a shape corresponding to the shape of the end 22a is formed in the sidewall 31. The surface of the resin part 30 constitutes the surface of the sidewall 31. The surface of the sidewall 31 includes a portion corresponding to the recess 3d. The external electrode 5 has a region 5a located on the surface of the sidewall 31 and including a plating layer 50. The plating layer 50 included in the region 5a has a recess 5d corresponding to the recess 3d formed therein. The end 22a is disposed on the plating layer 50 in a portion corresponding to the recess 5d. In the coil components 1, 1B, and 1D, the end 22a is disposed on the plating layer 50 in a portion corresponding to the recess 5d. The recess 5d corresponds to the recess 3d having a shape corresponding to the shape of the end 22a. Therefore, the end 22a is unlikely to be displaced from within the recess 5d. As a result, the physical strength of the connection between the end 22a and the external electrode 5 can be improved.

[0041] The coil elements 2 and 2B each include a coil portion 21 made of a wound conductor 20. The connection portion 22 is a part of the conductor 20. The connection portion 22 is a part of the conductor 20 forming the coil portion 21. Since the coil portion 21 and the connection portion 22 electrically connecting the coil elements 2, 2B and the external electrode 5 to each other are configured from a single conductor 20, the coil components 1, 1A, 1B, 1C, 1D, 1E can more easily ensure electrical connection between the external electrodes 5, 5A and the coil elements 2, 2B compared to a configuration in which the coil portion and the connection portion are separate.

[0042] In the coil components 1, 1A, 1D, and 1E, the coil element 2 is disposed in the space S, and in the coil components 1B and 1C, the coil element 2B is disposed in the space S. The space S in which the coil elements 2 and 2B are disposed is formed in the base 3, and both ends in the direction D3 are open. In a coil component in which a space with at least one of both ends in the direction D3 closed is formed in the base, the coil element is designed so as not to interfere with a portion that closes the space. The coil components 1, 1A, 1B, 1C, 1D, and 1E do not include a portion that closes the space S in the direction D3. Therefore, in the design of the coil elements 2 and 2B, there is no interference with the portion that closes the space S. As a result, the coil components 1, 1A, 1B, 1C, 1D, and 1E improve the degree of freedom in the design of the coil elements 2 and 2B.

[0043] The coil components 1, 1A, 1B, 1C, 1D, and 1E include a resin 4 that covers the coil elements 2 and 2B. The resin 4 is disposed in a space S. Since the resin 4 is interposed between the base 3 and the coil elements 2, 2B, in the coil components 1, 1A, 1B, 1C, 1D, and 1E, the mechanical properties of the coil components 1, 1A, 1B, 1C, 1D, and 1E can be improved.

[0044] The resin 4 may have a higher visible light transmittance than the base 3 . The space S is open at both ends of the base 3 in the direction D3. The resin 4 is disposed within the space S. In a configuration in which the light transmittance of the resin 4 is higher than that of the base 3, the coil elements 2, 2B are easily visually confirmed when viewed from the direction D3. Therefore, the positions of the coil elements 2, 2B in the space S or the shapes of the coil elements 2, 2B can be visually confirmed from the outside. As a result, in the coil components 1, 1A, 1B, 1C, 1D, 1E, the states of the coil elements 2, 2B can be easily confirmed from the outside.

[0045] The resin 4 includes a pair of surfaces 4a that face each other in the direction D3 and are exposed from the base 3. The coil portion 21 includes an exposed portion 2a that is exposed from one of the pair of surfaces 4a. In a configuration in which the coil portion 21 is exposed from the surface 4a of the resin 4, the position of the coil portion 21 in the space S can be visually confirmed from the outside. Therefore, in the coil components 1, 1A, 1B, and 1C, any misalignment of the coil portion 21 is easily found, and the states of the coil elements 2 and 2B can be easily confirmed from the outside.

[0046] Coil element 2 is disposed so that the side wall 32 intersects with the coil axis of coil element 2. Coil element 2B is disposed so that the side walls 31 and 31A intersect with the coil axis of coil element 2B. In a coil component in which a coil element is arranged such that the coil axis is along the direction D3, the coil element is designed so as not to interfere with both the side walls 31, 31A and the side wall 32. In the coil components 1, 1A, 1B, 1C, 1D, and 1E, the space S in which the coil elements 2, 2B are arranged is open at both ends in the direction D3. Therefore, it is sufficient that the coil elements 2, 2B are designed so as not to interfere with either the side walls 31, 31A or the side wall 32. As a result, the design freedom of the coil elements 2, 2B is improved in the coil components 1, 1A, 1B, 1C, 1D, and 1E.

[0047] Coil components 1 and 1D include a pair of external electrodes 5 electrically connected to coil element 2. Coil component 1B includes a pair of external electrodes 5 electrically connected to coil element 2B. Coil components 1A and 1E include a pair of external electrodes 5A electrically connected to coil element 2. Coil component 1C includes a pair of external electrodes 5A electrically connected to coil element 2B. The pair of external electrodes 5 are each arranged at one end of the pair of side walls 31 in direction D3. The pair of external electrodes 5A are each arranged at one end of the pair of side walls 31A in direction D3.

[0048] The present invention has been described in detail above based on the embodiments. However, the present invention is not limited to the above embodiments. The present invention can be modified in various ways without departing from the gist of the present invention.

[0049] Coil components 1, 1A, 1B, 1C, 1D, and 1E are various examples of electronic components according to the present embodiment. Coil elements 2 and 2B are various examples of elements according to the present embodiment. The electronic components according to the present embodiment may be electronic components other than coil components, such as a capacitor, a piezoelectric element, a resistive element, or a transformer. The connection portion does not have to be a part of the conductive wire constituting the coil portion. The connection portion and the coil portion may be made of different materials. The coil components 1D and 1E may include a coil element 2B instead of the coil element 2. The coil elements may be arranged such that the coil axis of the coil element does not intersect with the pair of side walls 31 or the pair of side walls 32. The coil elements may be arranged such that the coil axis of the coil element is along the direction D3.

[0050] As will be understood from the above description of the embodiments and modifications, this specification includes disclosure of the following aspects. (Appendix 1) A base including a resin part; an external electrode disposed on the base and including a plating layer; a surface of the resin portion constitutes a surface of the base, the plating layer constitutes an innermost layer of the external electrode and is formed on the surface of the resin portion; Electronic components. (Appendix 2) The resin portion contains a metal compound. 2. An electronic component as described in Appendix 1. (Appendix 3) An element disposed within the base; a connection portion that electrically connects the element and the external electrode to each other, the plating layer constitutes an outermost layer of the external electrode, The connection portion includes an end portion that is physically connected to the plating layer and is disposed on the plating layer. 3. An electronic component according to claim 1 or 2. (Appendix 4) the base has a sidewall on which the external electrode is disposed; the sidewall includes a first portion and a second portion that is higher than the first portion and forms a first step with the first portion; the surface of the resin portion constitutes a surface of the first portion and a surface of the second portion, the external electrode has a first region located on the surface of the first portion and including the plating layer, and a second region located on the surface of the second portion and including the plating layer, the plating layer included in the first region and the plating layer included in the second region form a second step corresponding to the first step, The end portion is disposed on the plating layer included in the first region. 2. An electronic component as described in Appendix 3. (Appendix 5) the base has a sidewall on which the external electrode is disposed; a first recessed portion having a shape corresponding to a shape of the end portion is formed in the side wall; the surface of the resin portion includes a portion of the side wall corresponding to the first recessed portion, the external electrode has a third region located on the surface including a portion corresponding to the first recessed portion and including the plating layer; A second recessed portion corresponding to the first recessed portion is formed in the plating layer included in the third region, The end portion is disposed on the plating layer in a portion corresponding to the second recessed portion. 2. An electronic component as described in Appendix 3. (Appendix 6) the element is a coil element including a coil portion made of a wound conductor, The connection portion is a part of the conductor. 6. An electronic component according to any one of claims 3 to 5. [Explanation of symbols]

[0051] 1, 1A, 1B, 1C, 1D, 1E... coil component. 2, 2B... coil element, 2a... exposed portion, 20... conducting wire, 21... coil portion, 22... connection portion, 22a... end portion, 3... base, 3a, 3b... opening end, 3d... recessed portion, 3s... step, 30... resin portion, 31, 31A... side wall, 31a, 31b, 31c... portion, 32... side wall, 4... resin, 4a... surface, 5, 5A... external electrode, 5a, 5b, 5c... region, 5d... recessed portion, 5s... step, 50... plating layer, D1, D2, D3... direction, S... space.

Claims

1. A base including a resin part; an external electrode disposed on the base and including a plating layer; a surface of the resin portion constitutes a surface of the base, the plating layer constitutes an innermost layer of the external electrode and is formed on the surface of the resin portion; Electronic components.

2. The resin portion contains a metal compound. The electronic component according to claim 1 .

3. An element disposed within the base; a connection portion that electrically connects the element and the external electrode to each other, the plating layer constitutes an outermost layer of the external electrode, The connection portion includes an end portion that is physically connected to the plating layer and is disposed on the plating layer. The electronic component according to claim 1 or 2.

4. the base has a sidewall on which the external electrode is disposed; the sidewall includes a first portion and a second portion that is higher than the first portion and forms a first step with the first portion; the surface of the resin portion constitutes a surface of the first portion and a surface of the second portion, the external electrode has a first region located on the surface of the first portion and including the plating layer, and a second region located on the surface of the second portion and including the plating layer, the plating layer included in the first region and the plating layer included in the second region form a second step corresponding to the first step, The end portion is disposed on the plating layer included in the first region. The electronic component according to claim 3 .

5. the base has a sidewall on which the external electrode is disposed; a first recessed portion having a shape corresponding to a shape of the end portion is formed in the side wall; the surface of the resin portion constitutes a surface of the side wall, the surface of the side wall includes a portion corresponding to the first recessed portion, the external electrode has a third region located on the surface of the side wall and including the plating layer; A second recessed portion corresponding to the first recessed portion is formed in the plating layer included in the third region, The end portion is disposed on the plating layer in a portion corresponding to the second recessed portion. The electronic component according to claim 3 .

6. the element is a coil element including a coil portion made of a wound conductor, The connection portion is a part of the conductor. The electronic component according to claim 3 .

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