Projector

Abstract

To provide a projector capable of keeping the temperature low inside an exterior housing.SOLUTION: A projector comprises: a first heat source; an exterior housing accommodating the first heat source; and a first wavelength-selective emission member for receiving heat from the first heat source and emitting first infrared rays in a specific wavelength band from received thermal energy through the exterior housing to the outside of the exterior housing.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a projector. [Background technology]

[0002] Conventionally, there is known a projector that cools the heat dissipation member, and thereby the heat receiving member and the heat source, by providing a heat receiving member that receives heat from a heat source and circulating cooling gas in an exterior housing through the heat dissipation member using a fan (see, for example, Patent Document 1). In the projector described in Patent Document 1, the heat-receiving member receives heat from an airflow generated by the rotation of a phosphor wheel, which is a heat source, and transfers the received heat to a heat sink. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-5566 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there has been a demand for projectors with higher brightness, and the amount of heat generated by projector components increases with the increase in the brightness of image light. When the amount of heat generated by the heat source increases in this way, for example, in the projector described in Patent Document 1, it is necessary to increase the airflow rate of the fan or increase the number of fans to improve the cooling performance of the heat source. In order to increase the amount of air blown by the fan, it is conceivable to employ a large fan or to increase the fan power in order to rotate the fan at a high speed. However, when a large fan is used, the projector becomes larger, while when the fan power is increased, the fan generates louder noise. When the number of fans is increased, the projector becomes larger and the noise increases. Due to these problems, there has been a demand for a configuration that can maintain a low temperature inside the exterior housing. [Means for solving the problem]

[0005] A projector according to a first aspect of the present disclosure includes a first heat source, an exterior housing that houses the first heat source, and a first wavelength-selective emission member that receives heat from the first heat source and emits first infrared rays of a specific wavelength band from the received thermal energy through the exterior housing to the outside of the exterior housing.

[0006] A projector according to a second aspect of the present disclosure includes a light source device, an image forming device that modulates light from the light source device into image light, a projection optical device that projects the image light modulated by the image forming device, an exterior housing that constitutes an exterior, and an outer wavelength-selective emission member that is provided in at least a part of the exterior housing, receives heat inside the exterior housing, and emits infrared rays of a specific wavelength band from the received thermal energy to the outside of the exterior housing. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of a projector according to a first embodiment. [Diagram 2] FIG. 1 is a schematic diagram showing the configuration of a light source device according to a first embodiment. [Diagram 3] FIG. 2 is a schematic diagram showing an example of an uneven pattern provided on the surface of the wavelength-selective emission member according to the first embodiment. [Figure 4] FIG. 11 is a schematic diagram showing a part of a light source device provided in a projector according to a second embodiment. [Diagram 5] FIG. 13 is a rear view of a projector according to a third embodiment. [Figure 6] FIG. 13 is a schematic diagram showing the configuration of a projector according to a fourth embodiment. [Figure 7] FIG. 13 is a perspective view showing a rear surface portion on which a wavelength-selective emission member according to a fourth embodiment is provided. [Figure 8] FIG. 13 is a schematic diagram showing the configuration of a projector according to a fifth embodiment. [Figure 9] FIG. 13 is a schematic diagram showing the configuration of a projector according to a sixth embodiment. [Figure 10] FIG. 13 is a schematic diagram showing the configuration of a projector according to a seventh embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] [First embodiment] Hereinafter, a first embodiment of the present disclosure will be described with reference to the drawings. [Projector configuration] FIG. 1 is a schematic diagram showing the configuration of a projector 1 according to the present embodiment. A projector 1 according to this embodiment projects image light according to image information. As shown in Fig. 1, the projector 1 includes an exterior housing 2 and an image projection device 3 housed in the exterior housing 2. In addition, although not shown, the projector 1 includes a control device that controls the operation of the projector 1, a power supply device that supplies power to electronic components of the projector 1, and a cooling device that cools a cooling target of the projector 1.

[0009] [Exterior casing configuration] The exterior housing 2 has a front portion 21, a rear portion 22, a left side portion 23, a right side portion 24, and a top surface and a bottom surface (not shown), and is formed into a generally rectangular parallelepiped shape. The front portion 21 and the back portion 22 constitute opposite surfaces of the exterior housing 2. The front portion 21 has an opening for exposing an end portion on the light emission side of a projection optical device 36 described later. The left side surface portion 23 and the right side surface portion 24 constitute surfaces that are opposite to each other in the exterior housing 2. The top surface portion and the bottom surface portion constitute surfaces that are opposite to each other in the exterior housing 2. In the following description, the three mutually orthogonal directions are defined as the +X direction, the +Y direction, and the +Z direction. Furthermore, the +Z direction is defined as the direction from the rear portion 22 toward the front portion 21, the +X direction is defined as the direction from the right side portion 24 toward the left side portion 23, and the +Y direction is defined as the direction from the bottom portion toward the top portion. Although not shown in the figures, the direction opposite to the +X direction is defined as the -X direction, the direction opposite to the +Y direction is defined as the -Y direction, and the direction opposite to the +Z direction is defined as the -Z direction. The axis along the +X direction is defined as the X axis, the axis along the +Y direction is defined as the Y axis, and the axis along the +Z direction is defined as the Z axis.

[0010] [Configuration of image projection device] The image projection device 3 forms image light according to input image information, and projects the formed image light. The image projection device 3 includes a light source device 4, an image forming device 30, and a projection optical device . The light source device 4 emits illumination light to the homogenizing optical system 31. The configuration of the light source device 4 will be described in detail later.

[0011] The image forming device 30 forms image light from the illumination light emitted from the light source device 4. The image forming device 30 has a homogenizing optical system 31, a color separation optical system 32, a relay optical system 33, a light modulation device 34, and an optical component housing 35. The homogenizing optical system 31 homogenizes the illumination light emitted from the light source device 4. The homogenized illumination light passes through a color separation optical system 32 and a relay optical system 33, and illuminates a modulation area of ​​a light modulation element 343 (described later). The homogenizing optical system 31 includes two lens arrays 311 and 312, a polarization conversion element 313, and a superimposing lens 314. The color separation optical system 32 separates the illumination light incident from the uniformization optical system 31 into red, green, and blue light. The color separation optical system 32 includes two dichroic mirrors 321 and 323, a reflecting mirror 322 that reflects the blue light separated by the dichroic mirror 321, and The optical system includes a lens 324 disposed between the dichroic mirror 321 and the reflecting mirror 322, and a lens 325 disposed between the dichroic mirrors 321 and 323.

[0012] Relay optical system 33 is provided on the optical path of red light which is longer than the optical paths of the other colored lights, and suppresses loss of red light. Relay optical system 33 includes an incident side lens 331, a relay lens 333, and reflecting mirrors 332 and 334. In this embodiment, red light is guided to relay optical system 33. However, this is not limiting, and for example, a configuration may be adopted in which blue light is the colored light having a longer optical path than the other colored lights, and the blue light is guided to relay optical system 33.

[0013] The light modulation device 34 modulates the incident red, green, and blue color lights, and combines the modulated color lights to form image light. The light modulation device 34 has three field lenses 341 provided according to the incident color lights, three incident-side polarizing plates 342, three light modulation elements 343, three exit-side polarizing plates 344, and one color combining optical system 345.

[0014] The light modulation elements 343 modulate the light from the light source device 4 to form image light. Specifically, the light modulation elements 343 modulate the color light incident from the incident-side polarizing plate 342 in accordance with an image signal, and emit the modulated color light. The three light modulation elements 343 include a light modulation element 343R that modulates red light, a light modulation element 343G that modulates green light, and a light modulation element 343B that modulates blue light. An example of the light modulation elements 343 is a transmissive liquid crystal panel.

[0015] The color synthesis optical system 345 synthesizes the three color lights modulated by the light modulation elements 343R, 343G, and 343B. The image light synthesized by the color synthesis optical system 345 is incident on the projection optical device 36. In this embodiment, the color synthesis optical system 345 is configured by a substantially rectangular parallelepiped cross dichroic prism, but may be configured by a plurality of dichroic mirrors.

[0016] The optical component housing 35 accommodates therein the homogenizing optical system 31, the color separation optical system 32, and the relay optical system 33. Note that the image projection device 3 is designed to have an optical axis Ax, and the optical component housing 35 holds the homogenizing optical system 31, the color separation optical system 32, the relay optical system 33, and the light modulation device 34 at predetermined positions on the optical axis Ax. The light source device 4, the light modulation device 34, and the projection optical device 36 are disposed at predetermined positions on the optical axis Ax. The projection optical device 36 projects the image light incident from the light modulation device 34 onto a projection surface such as a screen. That is, the projection optical device 36 projects the image light formed by the light modulation device 34. The projection optical device 36 can be, for example, a lens assembly including a plurality of lenses and a lens barrel that houses the plurality of lenses.

[0017] [Light source configuration] FIG. 2 is a schematic diagram showing the configuration of the light source device 4. As shown in FIG. The light source device 4 emits illumination light WL in the +X direction toward the homogenization optical system 31. As shown in Fig. 2, the light source device 4 includes a solid-state light source 41, a diffusive transmission section 42, a light separation section 43, a first light collecting element 44, a wavelength conversion element 45, a second light collecting element 46, a diffusive optical member 47, and a light source housing CA.

[0018] The light source device 4 has an optical axis Ax1 along the Z axis and an optical axis Ax2 along the X axis, the optical axes Ax1 and Ax2 being perpendicular to each other. The optical components of the light source device 4 are disposed on the optical axis Ax1 or the optical axis Ax2. Specifically, the solid-state light source 41, the diffuse transmission section 42, the light separating section 43, the first light collecting element 44, and the wavelength conversion element 45 are disposed on the optical axis Ax1. The diffusive optical member 47, the second light collecting element 46, and the light separating section 43 are disposed on the optical axis Ax2. That is, the light separating section 43 is disposed at the intersection of the optical axis Ax1 and the optical axis Ax2. The optical axis Ax2 is connected to the optical axis Ax of the image projection device 3 by the lens array 311 of the uniformizing optical system 31.

[0019] [Solid-state light source configuration] The solid-state light source 41 emits light in the −Z direction. The solid-state light source 41 includes a light-emitting element 411 and a substrate 412. The light emitting element 411 emits blue light BL. The blue light BL is excitation light that excites the phosphor of the wavelength conversion element 45. The light emitting element 411 is, for example, a semiconductor laser that emits laser light with a peak wavelength of 455 nm. The substrate 412 is fixed to the inner surface of the light source casing CA while supporting the light emitting element 411. The substrate 412 receives heat from the light emitting element 411 and transfers the received heat to a heat receiving plate CA1 (described later) of the light source casing CA.

[0020] [Configuration of diffuse transmission section] The diffuse transmission section 42 diffuses the blue light BL incident from the solid-state light source 41 and emits light with a uniform illuminance distribution. The blue light BL emitted from the diffuse transmission section 42 enters the light separation section 43. Examples of the diffuse transmission section 42 include a configuration having a hologram, a configuration in which a plurality of small lenses are arranged on a plane perpendicular to the optical axis, and a configuration in which the surface through which light passes is a rough surface. Note that a homogenizer optical element having a pair of multi-lens arrays may be used in the light source device 4 instead of the diffuse transmission section 42. On the other hand, when the diffuse transmission section 42 is used, the distance from the solid-state light source 41 to the light separation section 43 can be made shorter than when a homogenizer optical element is used.

[0021] [Structure of the light separation section] The light separating unit 43 has a function of a half mirror that transmits a part of the blue light BL and reflects the other blue light BL among the blue light BL incident from the solid-state light source 41 via the diffuse transmission unit 42. That is, the light separating unit 43 transmits a first partial light, which is a part of the blue light BL, among the blue light BL incident from the diffuse transmission unit 42, in the -Z direction to make it incident on the first light collecting element 44, and reflects a second partial light, which is the other blue light BL, in the -X direction to make it incident on the second light collecting element 46. The light separating unit 43 further functions as a dichroic mirror that reflects the fluorescence YL incident from the wavelength converting element 45 in the +Z direction and transmits the blue light BL incident from the diffusing optical member 47 in the +X direction.

[0022] [Configuration of the first light-collecting element] The first light collecting element 44 collects the first partial light transmitted through the light separating unit 43 onto the wavelength conversion element 45. In addition, the first light collecting element 44 collimates the fluorescence YL incident from the wavelength conversion element 45 and causes the fluorescence YL to be incident on the light separating unit 43 along the +Z direction.

[0023] [Configuration of wavelength conversion element] The wavelength conversion element 45 is a reflective wavelength conversion element that converts the wavelength of incident light, and diffuses the converted light in the opposite direction to the incident direction of the light. The wavelength conversion element 45 has a phosphor layer 451 and a substrate 452, and is fixed to the inner surface of a heat receiving plate CA2 (to be described later) of the light source housing CA. The phosphor layer 451 contains a phosphor that is excited by the incidence of blue light BL, which is excitation light, and emits fluorescence YL having a wavelength longer than the wavelength of the incident blue light BL. That is, the wavelength conversion element 45 is the phosphor of the present disclosure. The light emitted from the phosphor layer 451 is unpolarized fluorescence YL having a peak wavelength in the range of 500 to 700 nm, for example, and the fluorescence YL includes green light and red light. Substrate 452 supports phosphor layer 451 and receives heat from phosphor layer 451. Although not shown, a reflective layer that reflects light incident from phosphor layer 451 is provided between phosphor layer 451 and substrate 452. Alternatively, the surface of substrate 452 on which phosphor layer 451 is provided functions as a reflective surface. The fluorescence YL emitted from the wavelength conversion element 45 passes through the first light collecting element 44 along the optical axis Ax1, and then enters the light separating unit 43. The fluorescence YL that enters the light separating unit 43 is reflected in the +X direction by the light separating unit 43, and is emitted to the outside of the light source device 4 along the optical axis Ax2.

[0024] [Configuration of the second light-collecting element] The second light collecting element 46 collects the second partial light incident from the light separating unit 43 onto the diffusing optical member 47. The second light collecting element 46 collimates the blue light incident from the diffusing optical member 47 and causes the light to enter the light separating unit 43 along the +Z direction.

[0025] [Configuration of diffusing optical components] The diffusing optical member 47 is fixed to the inner surface of a heat receiving plate CA3 (described later) of the light source housing CA. The diffusing optical member 47 reflects and diffuses the blue light BL incident from the second light collecting element 46 at a diffusion angle substantially the same as the diffusion angle of the fluorescence YL emitted from the wavelength conversion element 45 or at a diffusion angle slightly smaller than the diffusion angle of the fluorescence YL. In other words, the diffusing optical member 47 reflects and diffuses the incident light without converting the wavelength of the incident light. The blue light BL reflected in the +X direction by the diffusing optical member 47 passes through the second light collecting element 46, then passes through the light separating unit 43 in the +X direction, and is emitted to the outside of the light source device 4 together with the fluorescent light YL. As described above, the illumination light WL emitted to the outside of the light source device 4 is white light that is a mixture of blue light BL and fluorescence YL containing green light and red light. The illumination light WL is emitted from the light source device 4 in the +X direction through the passage CA4 of the light source housing CA.

[0026] [Light source housing configuration] The light source housing CA is a housing for the light source device 4, and is one of the internal housings housed inside the exterior housing 2. The light source housing CA houses the solid-state light source 41, the diffuse transmission section 42, the light separation section 43, the first light collecting element 44, the wavelength conversion element 45, the second light collecting element 46, and the diffusion optical member 47. In this embodiment, the light source housing CA is a sealed housing into which dust is unlikely to enter. However, the light source housing CA is not limited to this and may be any housing capable of housing the above-mentioned optical components.

[0027] The light source housing CA has a heat receiving plate CA1, a heat receiving plate CA2, a heat receiving plate CA3, and a passage opening CA4. The heat receiving plate CA1 is provided on the +Z direction surface of the light source casing CA. The heat receiving plate CA1 is connected to the substrate 412 of the solid-state light source 41 so as to be capable of thermal transfer, and receives heat from the light emitting element 411, which is a heat source, via the substrate 412. The heat receiving plate CA2 is connected to the substrate 452 of the wavelength conversion element 45 so as to be capable of thermal transfer, and receives heat from the phosphor layer 451, which is a heat source, via the substrate 452. In this embodiment, the heat receiving plate CA2 corresponds to the first heat receiving plate, and the wavelength conversion element 45, which is a phosphor, corresponds to the first heat source. A wavelength-selective emitting member WS, which will be described later, is provided on a surface CA21 of the heat receiving plate CA2 facing the outside of the light source device 4. That is, the light source housing CA has a wavelength-selective emitting portion CA5 constituted by the wavelength-selective emitting member WS. The wavelength-selective emitting member WS will be described in detail later. The heat receiving plate CA3 is connected to the diffusing optical member 47 so as to be capable of transferring heat therethrough, and receives heat from the diffusing optical member 47 which is a heat source. The passage CA4 is an opening through which the illumination light WL passes through the light source housing CA. It is preferable that the heat receiving plates CA1, CA2, and CA3 are made of a material having a high thermal conductivity among the members constituting the light source housing CA. Also, if the light source housing CA is made of a material having a high thermal conductivity, it is not necessary to provide the heat receiving plates CA1, CA2, and CA3 as members separate from the light source housing CA. In this case, it is sufficient to use a part of the light source housing CA as the heat receiving plates CA1, CA2, and CA3.

[0028] [Configuration of wavelength-selective emission member] The wavelength-selective emitting member WS receives heat, converts the received thermal energy into infrared rays of a predetermined wavelength band, and emits the converted energy. In this embodiment, the wavelength-selective emitting member WS is disposed between a heat-receiving plate CA2 that receives heat from the wavelength conversion element 45, which is a heat source, and the inner surface of the rear portion 22 of the exterior housing 2 so as to cover the heat-receiving plate CA2. More specifically, the wavelength-selective emitting member WS directly faces the inner surface of the rear portion 22. That is, no other member is interposed between the wavelength-selective emitting member WS and the inner surface of the rear portion 22. The wavelength-selective radiation member WS receives heat from the wavelength conversion element 45 via the heat-receiving plate CA2, converts the received thermal energy into infrared rays, and radiates the infrared rays toward the inner surface of the back surface portion 22.

[0029] FIG. 3 is a schematic diagram showing an example of a concave-convex pattern provided on the surface of the wavelength-selective emission member WS. Such a wavelength-selective emitting member WS is made of a wavelength-selective heat emitting material, and has a heat emitting surface on which a large number of microcavities are two-dimensionally arranged, for example, by finely forming a periodic uneven pattern on the surface, as shown in Fig. 3. That is, on the surface of the wavelength-selective emitting member WS, lattice-shaped convex portions WS1 and approximately rectangular concave portions WS2 provided between the convex portions WS1 are formed. The length of one side of the concave portion WS2 is preferably 4 μm or more and 6 μm or less. In this way, by providing the heat radiating surface of the wavelength-selective emitting member WS with regularly aligned minute recesses or protrusions, it is possible to impart directionality to the emitted infrared rays.

[0030] Here, among the surfaces of the exterior housing 2, at least the back surface 22 facing the wavelength selective radiation member WS is made of a material containing at least one of epoxy resin and polycarbonate resin. The material constituting the exterior housing 2 may contain glass fiber filler or the like. Although detailed illustrations are omitted, the epoxy resin and the polycarbonate resin transmit infrared rays having a wavelength of 7 μm or less. In other words, infrared rays having a wavelength of 7 μm or less transmit through the epoxy resin and the polycarbonate resin. Therefore, the wavelength-selective emission member WS converts the thermal energy received from the heat receiving plate CA2 into first infrared rays having a wavelength of 7 μm or less, and emits the converted first infrared rays toward the inner surface of the rear surface portion 22, whereby the first infrared rays pass through the rear surface portion 22 in the -Z direction. That is, the first infrared rays originating from the heat of the wavelength conversion element 45 pass through the rear surface portion 22 and are emitted to the outside of the exterior housing 2. This makes it possible to maintain a low temperature inside the light source housing CA, and in turn, inside the exterior housing 2. Note that by setting the size and period of the opening of the microcavity, the wavelength-selective emission member WS can emit first infrared rays having a wavelength of 7 μm or less.

[0031] The wavelength-selective emitting member WS preferably has an average emissivity of the first infrared ray of 0.5 or more, which means that 50% or more of the light emitted by radiation from the received heat from the wavelength-selective emitting member WS is the first infrared ray. When the average emissivity of the wavelength selective emitting member WS for the first infrared ray is 0.5 or more, the first infrared ray that transmits through the exterior housing 2 can be efficiently emitted from the wavelength selective emitting member WS.

[0032] [Effects of the first embodiment] The projector 1 according to the present embodiment described above provides the following advantages. The projector 1 includes a wavelength conversion element 45 that corresponds to a first heat source, an exterior housing 2 that houses the wavelength conversion element 45, and a wavelength-selective emission member WS. The wavelength-selective emitting member WS corresponds to a first wavelength-selective emitting member. The wavelength-selective emitting member WS receives heat from the wavelength conversion element 45, and emits a first infrared ray having a specific wavelength band from the received thermal energy to the outside of the exterior housing 2 via the exterior housing 2.

[0033] According to this configuration, the wavelength-selective emission member WS converts the heat of the wavelength conversion element 45 generated inside the exterior housing 2 into the first infrared rays and emits the converted first infrared rays to the outside of the exterior housing 2, thereby maintaining the temperature of the exterior housing 2 low. This reduces the need to provide a fan inside the exterior housing 2. Even if a fan is provided inside the exterior housing 2, it is possible to reduce the power consumption and noise of the fan, and also to reduce the number of fans, thereby making it possible to reduce the size of the projector 1.

[0034] The projector 1 includes a heat receiving plate CA2 that receives heat from the wavelength conversion element 45. The heat receiving plate CA2 corresponds to a first heat receiving plate. The wavelength-selective emitting member WS is provided on the heat receiving plate CA2. According to this configuration, the wavelength-selective emission member WS that emits the first infrared ray from the received thermal energy is provided on the heat-receiving plate CA2 that receives the heat of the wavelength conversion element 45, so that the heat of the wavelength conversion element 45 can be effectively emitted to the outside of the exterior housing 2. Therefore, the temperature of the exterior housing 2 can be maintained low.

[0035] In the projector 1, the first heat source is the wavelength conversion element 45 out of the solid-state light source 41, the wavelength conversion element 45 that converts the wavelength of the light emitted from the solid-state light source 41, and the diffusion optical member 47 that diffuses the light emitted from the solid-state light source 41. The wavelength conversion element 45 has a phosphor layer 451 that contains a phosphor. According to such a configuration, the heat of the wavelength conversion element 45 can be effectively released to the outside of the exterior housing 2 by the wavelength selective release member WS.

[0036] In the projector 1, the exterior housing 2 is made of a material containing resin. Examples of such resin include epoxy resin and polycarbonate resin. The first infrared ray is an infrared ray having a wavelength of 7 μm or less. Here, the exterior housing 2 made of a material containing resin transmits infrared rays having a wavelength of 7 μm or less. Therefore, by the first infrared rays being infrared rays in the above wavelength band, the wavelength-selective emitting member WS can easily release the transferred heat to the outside of the exterior housing 2. In other words, by the wavelength-selective emitting member WS emitting infrared rays in a wavelength band that easily transmits through the exterior housing 2, the transferred heat can be easily released to the outside of the exterior housing 2.

[0037] The projector 1 includes a light source housing CA that is provided inside the exterior housing 2 and surrounds the wavelength conversion element 45. The light source housing CA is one of the internal housings. The wavelength-selective emission member WS is provided in the light source housing CA. According to this configuration, the heat generated inside the light source housing CA can be released by the wavelength-selective release member WS to the outside of the exterior housing 2. Therefore, the temperature inside the light source housing CA can be kept low.

[0038] In the projector 1, the wavelength selective emission member WS directly faces the inner surface of the exterior housing 2. To be more specific, the wavelength selective emission member WS according to this embodiment directly faces the inner surface of the rear surface portion 22 that constitutes the exterior housing 2. According to this configuration, no other member is interposed between the wavelength selective emitting member WS and the exterior housing 2. This makes it possible to easily emit the first infrared light emitted by the wavelength selective emitting member WS to the outside of the exterior housing 2.

[0039] [Modification of the first embodiment] In the first embodiment, the wavelength-selective radiation member WS is provided on the surface of the heat receiving plate CA2 that is heat-transferably connected to the wavelength conversion element 45, facing the inner surface of the back surface portion 22. However, the present invention is not limited to this, and the wavelength-selective radiation member WS may be provided on the heat receiving plates CA1 and CA3. In this case, for example, the heat receiving plate CA1 that receives the heat of the solid-state light source 41 may be directly opposed to any of the inner surfaces of the top surface, the bottom surface, and the right side surface 24 of the exterior housing 2. Similarly, the heat receiving plate CA2 that receives the heat of the wavelength conversion element 45 and the heat receiving plate CA3 that receives the heat of the diffusing optical member 47 are also similar. In addition, when the wavelength-selective emission member WS converts the thermal energy from the solid-state light source 41 into the first infrared ray and emits it, the heat of the solid-state light source 41 can be effectively emitted to the outside of the exterior housing 2. Similarly, when the wavelength-selective emission member WS converts the thermal energy from the diffusing optical member 47 into the first infrared ray and emits it, the heat of the diffusing optical member 47 can be effectively emitted to the outside of the exterior housing 2.

[0040] [Second embodiment] Next, a second embodiment of the present disclosure will be described. The projector according to this embodiment has a similar configuration to the projector 1 according to the first embodiment, but differs in that heat from multiple heat receiving plates is transferred to one wavelength-selective emitting member WS and emitted as infrared rays. Note that in the following explanation, parts that are the same or approximately the same as parts already explained will be given the same reference numerals and explanations thereof will be omitted.

[0041] [Projector configuration] FIG. 4 is a schematic diagram showing a part of a light source device 4A provided in the projector according to this embodiment. As shown in FIG. 4, the projector according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it further includes heat transfer members TM1 and TM2 and a heat diffusion member HS.

[0042] The heat transfer members TM1 and TM2 transport heat from one end to the other end, and in this embodiment are formed of heat pipes. One end of the heat transfer member TM1 is connected to a heat receiving plate CA1 that receives heat from the solid-state light source 41, which is a heat source, and the other end of the heat transfer member TM1 is connected to a heat receiving plate CA3 that receives heat from the diffusing optical member 47, which is a heat source. That is, the heat transfer member TM1 transfers the heat of the solid-state light source 41 received by the heat receiving plate CA1 to the heat receiving plate CA3 that is separated from the heat receiving plate CA1. One end of the heat transfer member TM2 is connected to a heat receiving plate CA2 that receives heat from the wavelength conversion element 45, which is a heat source, and the other end of the heat transfer member TM2 is connected to a heat receiving plate CA3. That is, the heat transfer member TM2 transfers the heat of the wavelength conversion element 45 received by the heat receiving plate CA2 to the heat receiving plate CA3 that is separated from the heat receiving plate CA2.

[0043] The heat diffusion member HS is provided on the surface of the heat receiving plate CA3 opposite to the diffusion optical member 47 and the heat transfer members TM1 and TM2, and diffuses the heat transferred to the heat receiving plate CA3 in a planar manner and transfers it to the wavelength-selective emission member WS. In this embodiment, the heat diffusion member HS is configured by a vapor chamber. 4, a through hole CA31 corresponding to the diffusing optical member 47 is provided in the heat receiving plate CA3, and a protruding portion HS1 protruding in the +X direction in the heat diffusing member HS is configured to come into contact with the diffusing optical member 47. However, the present invention is not limited to this, and the heat diffusing member HS does not necessarily need to include the protruding portion HS1.

[0044] In this embodiment, the wavelength-selective emission member WS is also received on the opposite side of the heat receiving plate CA3 with respect to the heat diffusion member HS. The wavelength-selective emission member WS receives heat from the solid-state light source 41, the wavelength conversion element 45, and the diffusion optical member 47, which are heat sources, via the heat diffusion member HS. Then, the wavelength-selective emission member WS converts the received thermal energy into first infrared rays, and emits the converted first infrared rays to the outside of the exterior housing 2 via the right side surface portion 24, in the same way as in the projector 1 according to the first embodiment. The first infrared rays have a wavelength of 7 μm or less, and the right side surface portion 24 of the exterior housing 2 is made of a material containing at least one of epoxy resin and polycarbonate resin.

[0045] [Effects of the second embodiment] The projector according to this embodiment described above provides the following effects in addition to the effects similar to those of the projector 1 according to the first embodiment. The projector according to this embodiment includes a heat receiving plate CA1 that receives heat from a solid-state light source 41, a heat receiving plate CA3 that is disposed opposite the inner surface of the right side surface portion 24 of the exterior housing 2, and a heat transfer member TM1. The solid-state light source 41 is one of the first heat sources, the heat receiving plate CA1 is one of the first heat receiving plates, and the heat receiving plate CA3 corresponds to the second heat receiving plate. The heat transfer member TM1 transfers heat from the heat reception plate CA1 to the heat reception plate CA3. The wavelength selective emitting member WS corresponds to a first wavelength selective emitting member, and is provided on the heat receiving plate CA3.

[0046] According to this configuration, the heat of the solid-state light source 41 is transferred through the heat receiving plate CA1 and the heat transfer member TM1 to the heat receiving plate CA3 facing the inner surface of the right side portion 24. Since the wavelength-selective release member WS is provided on the heat receiving plate CA3, the wavelength-selective release member WS releases the first infrared ray from the heat of the solid-state light source 41. This can increase the degree of freedom in arranging the solid-state light source 41 and the heat receiving plate CA1, and therefore the degree of freedom in arranging the components that configure the projector 1 can be increased.

[0047] The projector according to this embodiment includes a heat receiving plate CA1 that receives heat from the solid-state light source 41, a heat receiving plate CA2 that receives heat from the wavelength conversion element 45, a diffusive optical member 47, a heat receiving plate CA3, and heat transfer members TM1 and TM2. As described above, the wavelength conversion element 45 is one of the first heat sources, and the heat receiving plate CA2 is one of the first heat receiving plates. The diffusive optical member 47 corresponds to the second heat source. The heat receiving plate CA3 corresponds to a second heat receiving plate. The heat receiving plate CA3 is disposed opposite to the inner surface of the right side surface portion 24 of the exterior housing 2 and receives heat from the diffusing optical member 47. The heat transfer member TM1 transfers the heat from the heat receiving plate CA1 to the heat receiving plate CA3, and the heat transfer member TM2 transfers the heat from the heat receiving plate CA2 to the heat receiving plate CA3. The wavelength selective emitting member WS corresponds to a first wavelength selective emitting member, and is provided on the heat receiving plate CA3.

[0048] According to this configuration, not only the heat of the diffusion optical member 47 but also the heat of the solid-state light source 41 is transferred to the heat receiving plate CA3 arranged opposite the inner surface of the exterior housing 2 via the heat receiving plate CA1 and the heat transfer member TM1, and the heat of the wavelength conversion element 45 is transferred to the heat receiving plate CA2 and the heat transfer member TM2. Since the wavelength selective emission member WS is provided on the heat receiving plate CA3, the wavelength selective emission member WS emits the first infrared ray from the heat of each of the solid-state light source 41, the wavelength conversion element 45, and the diffusion optical member 47. In this way, the heat of the solid-state light source 41 is transferred to the heat receiving plate CA3 via the heat receiving plate CA1 and the heat transfer member TM1, and the heat of the wavelength conversion element 45 is transferred to the heat receiving plate CA3 via the heat receiving plate CA2 and the heat transfer member TM2, so that the heat receiving plates CA1 and CA2 do not need to directly face the inner surface of the exterior housing 2. Therefore, the degree of freedom in the arrangement of each of the solid-state light source 41, the wavelength conversion element 45, and the heat receiving plates CA1 and CA2 in the projector can be increased.

[0049] In the projector according to this embodiment, the first heat source, the heat of which is transferred to the heat receiving plate CA3 via the heat transfer members TM1 and TM2, is the solid-state light source 41 and a wavelength conversion element 45 that converts the wavelength of the light emitted from the solid-state light source 41. The wavelength conversion element 45 can be said to be a phosphor. The second heat source, the heat of which is transferred to the heat receiving plate CA3 without the heat transfer member, is a heat source different from the solid-state light source 41 and the wavelength conversion element 45, and is a diffusion optical member 47 that diffuses the light emitted from the solid-state light source 41. According to such a configuration, the heat of each of the solid-state light source 41, the wavelength conversion element 45, and the diffusing optical member 47 can be effectively released to the outside of the exterior housing 2. In addition, since the heat of the three heat sources can be released to the outside of the exterior housing 2 by the common wavelength-selective release member WS, the configuration of the projector can be simplified compared to the case where a wavelength-selective release member WS is provided for each heat source. It is not necessary to transmit the heat of one of the solid-state light source 41 and the wavelength conversion element 45 to the heat receiving plate CA3. Even in this case, the heat of the two heat sources can be released to the outside of the exterior housing 2 by the common wavelength-selective release member WS.

[0050] In addition, the configuration is not limited to transferring the heat of the solid-state light source 41 and the wavelength conversion element 45 to the heat receiving plate CA3 that receives heat from the diffusing optical member 47, but depending on the arrangement of the solid-state light source 41, the wavelength conversion element 45 and the diffusing optical member 47, the heat of one or two heat sources among the solid-state light source 41, the wavelength conversion element 45 and the diffusing optical member 47 may be transferred to a heat receiving plate that receives heat from the other heat source. In addition, the heat from multiple heat sources may be transferred to one heat receiving plate via heat transfer members in the same number as the number of heat sources, and a wavelength-selective emission member WS provided on the one heat receiving plate may be configured to emit first infrared rays converted from the heat of each heat source.

[0051] [Third embodiment] Next, a third embodiment of the present disclosure will be described. The projector according to this embodiment has a similar configuration to the projector 1 according to the first embodiment, but differs in that a window facing the wavelength-selective emission member is provided in the exterior housing. Note that in the following description, parts that are the same or approximately the same as parts already described will be given the same reference numerals and descriptions thereof will be omitted.

[0052] [Projector configuration] Fig. 5 is a diagram showing a projector 1B according to this embodiment as viewed from the rear side. In other words, Fig. 5 is a diagram showing a rear surface part 22 of an exterior housing 2B constituting the projector 1B. Note that Fig. 5 shows a top surface part 25 and a bottom surface part 26 of the exterior housing 2. The projector 1B according to this embodiment has an exterior housing 2B shown in FIG. 5 instead of the exterior housing 2, and other than that, has the same configuration and functions as the projector 1 according to the first embodiment.

[0053] [Exterior casing configuration] The exterior housing 2B accommodates the image projection device 3 therein, similar to the exterior housing 2 according to the first embodiment. The exterior housing 2B is provided with a window WD for transmitting infrared rays at a position directly facing the wavelength selective emission member WS. In the projector 1B according to the present embodiment, the wavelength selective emission member WS is provided on the heat receiving plate CA2 and directly faces the inner surface of the rear section 22, and therefore the window WD is provided at a position on the rear section 22 that covers the wavelength selective emission member WS when viewed from a position facing the outer surface of the rear section 22. The window WD has a frame portion WD1 that penetrates the rear portion 22 along the Z-axis, and a transmission portion WD2 that closes the frame portion WD1. The transmission portion WD2 is made of an infrared transmission material that transmits infrared rays, and transmits infrared rays. Examples of infrared transmission materials include quartz glass, sapphire, and silicon. For example, sapphire can transmit infrared rays of 1 μm or more and 5 μm or less, and silicon can transmit infrared rays of 2 μm or more and 9 μm or less.

[0054] [Function of windows] The wavelength-selective emission member WS emits the first infrared ray converted from the received thermal energy to the outside of the exterior housing 2 through the transmission portion WD2 of the window WD. As a result, the first infrared ray emitted by the wavelength-selective emission member WS passes through the window WD without passing through the portion of the rear surface portion 22 that is made of the material containing the resin. Therefore, by setting the size and period of the openings of the microcavities, the wavelength range of the first infrared ray can be set according to the infrared ray transmittance of the window material. This increases the degree of freedom of the wavelength of the infrared ray emitted by the wavelength-selective emission member WS, and thus increases the degree of freedom of the wavelength-selective emission member WS.

[0055] [Effects of the third embodiment] The projector 1B according to the present embodiment described above provides the following effects in addition to the effects similar to those of the projector 1 according to the first embodiment. In the projector 1B, the exterior housing 2B has a window WD in an area facing the wavelength-selective emitting member WS. The window WD transmits the first infrared ray emitted from the wavelength-selective emitting member WS at a transmitting portion WD2 made of an infrared-transmitting material. According to such a configuration, the first infrared ray emitted by the wavelength-selective emission member WS can be easily emitted to the outside of the exterior housing 2 through the window WD provided in the exterior housing 2. In addition, the window WD transmits the first infrared ray emitted from the wavelength selective emitting member WS to the outside of the exterior housing 2B, which increases the degree of freedom in selecting the wavelength of the infrared ray contained in the first infrared ray. Therefore, the degree of freedom in selecting the material of the exterior housing 2 and the degree of freedom in selecting the wavelength selective emitting member WS can be increased.

[0056] [Fourth embodiment] Next, a fourth embodiment of the present disclosure will be described. The projector according to this embodiment has a similar configuration to the projector 1 according to the first embodiment, but differs in that it has a wavelength-selective emitting member provided on the outer surface of the exterior housing, instead of the wavelength-selective emitting member provided on the heat receiving plate of the light source housing. Note that in the following description, parts that are the same or approximately the same as parts already described will be given the same reference numerals and descriptions thereof will be omitted.

[0057] [Projector configuration] Fig. 6 is a schematic diagram showing the configuration of a projector 1C according to this embodiment, in other words, Fig. 6 is a schematic diagram showing the arrangement of a wavelength-selective emission member WT in the projector 1C. A projector 1C according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it has a wavelength-selective emitting member WT shown in FIG. 6 instead of the wavelength-selective emitting member WS.

[0058] [Configuration of wavelength-selective emission member] The wavelength-selective radiation member WT is provided on at least a part of the outer surface of the exterior housing 2. In this embodiment, the wavelength-selective radiation member WT is provided on the outer surface of the back surface portion 22. The wavelength-selective emitting member WT converts the received thermal energy into infrared rays and emits the infrared rays, similar to the wavelength-selective emitting member WS. The wavelength-selective emitting member WT is formed of a polymer matrix material in which dielectric particles having an average particle size of 3 μm or more and 30 μm or less are dispersed. In this embodiment, the wavelength-selective emitting member WT is formed by applying a polymer matrix material to the outer surface of the back surface portion 22.

[0059] The wavelength-selective radiation member WT receives thermal energy and emits the second infrared radiation having a wavelength of 7 μm or more and 14 μm or less. Preferably, the second infrared radiation has a wavelength of 8 μm or more and 14 μm or less. In addition, in the wavelength-selective emission member WT, it is preferable that the average emissivity of the second infrared ray having a wavelength of 7 μm or more and 14 μm or less is 0.8 or more. The average emissivity of the second infrared ray being 0.8 or more means that the proportion of the light emitted by radiation that is occupied by the second infrared ray is 80% or more.

[0060] Such a wavelength-selective radiation member WT receives heat from inside the exterior housing 2 via the rear surface portion 22, converts the received thermal energy into second infrared rays, and radiates the second infrared rays to the outside of the exterior housing 2. Here, infrared rays having a wavelength of 7 μm or more and 14 μm or less transmit through the atmosphere due to a so-called “atmospheric window.” For this reason, the second infrared rays emitted from the wavelength-selective emission member WT easily transmit through the atmosphere around the projector 1C, so that an increase in the temperature around the wavelength-selective emission member WT, and therefore the temperature around the projector 1C, is suppressed. In addition, some infrared rays having wavelengths of 7 μm or more and less than 8 μm do not pass through the atmosphere. On the other hand, most infrared rays having wavelengths of 8 μm or more and 14 μm or less pass through the atmosphere. For this reason, it is preferable that the second infrared rays be infrared rays having wavelengths of 8 μm or more and 14 μm or less. It is preferable that a protective layer is provided on the outer surface of the wavelength-selective emission member WT to prevent damage and deterioration. The protective layer is preferably made of a material that does not block infrared rays having a wavelength of 7 μm or more and 14 μm or less.

[0061] FIG. 7 is a perspective view showing the rear surface portion 22 on which the wavelength-selective emitting member WT is provided. Considering the efficiency of emitting the second infrared ray by the wavelength selective emitting member WT, it is preferable that the surface area of ​​the wavelength selective emitting member WT is large. Meanwhile, in order to increase the area of ​​the outer surface that serves as the heat emitting surface of the wavelength selective emitting member WT, for example, it is considered to provide irregularities on the outer surface of the exterior housing 2 on which the wavelength selective emitting member WT is provided. For this reason, in this embodiment, the wavelength selective emission member WT is constructed by forming the above-mentioned wavelength selective emission layer on the back surface portion 22, and therefore, as shown in FIG. 7, a plurality of projections and recesses 22A are provided on the outer surface of the back surface portion 22. This makes it possible to increase the area of ​​the heat emitting surface of the wavelength selective emitting member WT, thereby increasing the efficiency with which the wavelength selective emitting member WT emits the second infrared ray. The wavelength-selective radiation member WT may be provided on any of the front portion 21, the left side portion 23, the right side portion 24, the top portion and the bottom portion in addition to the rear portion 22, or may be provided on multiple surfaces, or may even be provided on the entire outer surface of the exterior housing 2.

[0062] [Effects of the fourth embodiment] The projector 1C according to the present embodiment described above provides the following advantages. The projector 1C includes a light source device 4, an image forming device 30 that modulates light from the light source device 4 into image light, a projection optical device 36 that projects the image light modulated by the image forming device 30, an exterior housing 2 that forms the exterior, and a wavelength-selective emission member WT. The wavelength-selective emitting member WT corresponds to an outer wavelength-selective emitting member, and is provided in at least a part of the exterior housing 2. The wavelength-selective emitting member WT receives heat inside the exterior housing 2, and emits infrared rays in a specific wavelength band from the received thermal energy to the outside of the exterior housing 2.

[0063] According to this configuration, the wavelength-selective emission member WT emits the heat inside the exterior housing 2 to the outside of the exterior housing 2 as infrared rays in the specific wavelength band, thereby making it possible to maintain a low temperature inside the exterior housing 2. This reduces the need to provide a fan inside the exterior housing 2. Even if a fan is provided inside the exterior housing 2, it is possible to reduce the power consumption and noise of the fan, and also to reduce the number of fans, thereby making it possible to reduce the size of the projector 1C.

[0064] In projector 1C, the wavelength-selective emitting member WT is made of a polymer matrix material in which dielectric particles are dispersed in the polymer. According to this configuration, since the wavelength-selective emission member WT is made of the polymer matrix material, the wavelength-selective emission member WT can emit infrared rays having a wavelength of 8 μm or more and 14 μm or less, and therefore, it is possible to suppress an increase in the temperature of the atmosphere around the exterior housing 2.

[0065] [Fifth embodiment] Next, a fifth embodiment of the present disclosure will be described. The projector according to this embodiment has a configuration that combines the projector 1 according to the first embodiment and the projector 1C according to the fourth embodiment. That is, the projector according to this embodiment has a configuration similar to that of the projector 1 according to the first embodiment, and further has a wavelength-selective emission member WT that is included in the projector 1C according to the fourth embodiment. Note that in the following description, parts that are the same or approximately the same as parts already described will be given the same reference numerals and descriptions thereof will be omitted.

[0066] [Projector configuration] Fig. 8 is a schematic diagram showing the configuration of a projector 1D according to this embodiment. In other words, Fig. 8 is a schematic diagram showing the positional relationship between the wavelength-selective emission members WS and WT in the projector 1D. 8, the projector 1D according to the present embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it further includes a wavelength-selective emission member WT according to the fourth embodiment. That is, the projector 1D includes a wavelength-selective emission member WS corresponding to the first wavelength-selective emission member, and a wavelength-selective emission member WT corresponding to the second wavelength-selective emission member. In other words, the projector 1D includes a first wavelength-selective emission section constituted by the wavelength-selective emission member WS, and a second wavelength-selective emission section constituted by the wavelength-selective emission member WT.

[0067] [Action of wavelength-selective emission material] In this embodiment, the wavelength-selective release member WS is provided on the heat receiving plate CA2 that receives heat from the wavelength conversion element 45, which is a heat source. However, the present invention is not limited to this, and the wavelength-selective release member WS may be provided on the heat receiving plate CA1 that receives heat from the solid-state light source 41, which is a heat source, or on the heat receiving plate CA3 that receives heat from the diffusing optical member 47, which is a heat source. That is, the wavelength-selective release member WS may be provided on a heat receiving plate of the heat receiving plates CA1 to CA3 provided in the light source device 4, the surface of which opposite to the heat source faces one of the -X direction, +Y direction, -Y direction, and -Z direction.

[0068] The wavelength-selective release member WT is provided in a portion facing the wavelength-selective release member WS on the outer surface of a surface portion, of the multiple surfaces that the exterior housing 2 has, whose inner surface directly faces the wavelength-selective release member WS. In this embodiment, since the wavelength-selective release member WS is provided on the heat receiving plate CA2, the wavelength-selective release member WT is provided in a portion facing the wavelength-selective release member WS on the outer surface of the rear portion 22, whose inner surface directly faces the wavelength-selective release member WS. In other words, the wavelength-selective release member WT is provided in a position covering the wavelength-selective release member WS on the outer surface of the rear portion 22 when the projector 1D is viewed from the rear side. A protective layer may be provided on the outer surface of the wavelength selective emitting member WT. Moreover, the back surface portion 22 on which the wavelength-selective emitting member WT is provided may be provided with the above-mentioned irregularities 22A.

[0069] In such a projector 1D, the first infrared ray emitted from the wavelength selective emitting member WS in the −Z direction is incident on the wavelength selective emitting member WT via the exterior housing 2. The wavelength-selective emission member WT absorbs electromagnetic waves in the wavelength band of the first infrared ray that has passed through the exterior housing 2, and emits the above-mentioned second infrared ray in the -Z direction. This makes it possible to emit the heat inside the exterior housing 2 to the outside of the exterior housing 2 without increasing the temperature around the rear part 22, and therefore around the projector 1D.

[0070] For example, when the wavelength-selective emitting member WS directly faces the inner surface of the right side surface portion 24, the wavelength-selective emitting member WT may be provided in a portion facing the wavelength-selective emitting member WS on the outer surface of the right side surface portion 24. Also, for example, when the wavelength-selective emitting member WS directly faces the inner surface of the top surface portion, the wavelength-selective emitting member WT may be provided in a portion facing the wavelength-selective emitting member WS on the outer surface of the top surface portion. Furthermore, the wavelength selective emitting member WT may be provided on the entire outer surface of the face portion of the exterior housing 2 on which the wavelength selective emitting member WT is provided. For example, when the wavelength selective emitting member WT is provided on the outer surface of the back surface portion 22, the wavelength selective emitting member WT may be provided on the entire outer surface of the back surface portion 22. In other words, as long as the wavelength selective emitting member WT is arranged in a region covering the wavelength selective emitting member WS on the outer surface of the exterior housing 2 when viewed from the emission direction of the first infrared ray from the wavelength selective emitting member WS, the size of the arrangement region of the wavelength selective emitting member WT can be changed as appropriate.

[0071] [Effects of the fifth embodiment] The projector 1D according to the present embodiment described above provides the following effects in addition to the effects similar to those of the projector 1 according to the first embodiment. The projector 1D includes a wavelength-selective emitting member WT that receives heat inside the exterior housing 2 and emits second infrared rays in a specific wavelength band from the received thermal energy to the outside of the exterior housing 2. The wavelength-selective emitting member WT corresponds to a second wavelength-selective emitting member. According to this configuration, the wavelength-selective radiation member WT converts the heat inside the exterior housing 2 into the second infrared radiation and releases it to the outside of the exterior housing 2. Therefore, the heat inside the exterior housing 2 can be more effectively released to the outside of the exterior housing.

[0072] In projector 1D, the second infrared ray is an infrared ray having a wavelength of not less than 8 μm and not more than 14 μm. Here, infrared rays having a wavelength of 8 μm or more and 14 μm or less are transmitted through the atmosphere. For this reason, since the second infrared rays emitted to the outside of the exterior housing 2 are the above-mentioned infrared rays, it is possible to prevent the atmosphere around the exterior housing 2 from being heated by the second infrared rays. Therefore, it is possible to prevent an increase in temperature around the exterior housing 2, and therefore around the projector 1D.

[0073] In projector 1D, a first infrared ray emitted from a wavelength selective emitting member WS, which is a first wavelength selective emitting member, is emitted toward a wavelength selective emitting member WT via an exterior housing 2. The wavelength selective emitting member WT absorbs electromagnetic waves in the wavelength band of the first infrared ray and emits a second infrared ray. According to this configuration, the first infrared ray emitted to the outside of the exterior housing 2 is emitted from the wavelength selective emitting member WS to the wavelength selective emitting member WT via the exterior housing 2. The wavelength selective emitting member WT absorbs the first infrared ray and emits the second infrared ray that transmits through the atmosphere to the outside of the exterior housing 2. According to this, the heat of the heat source arranged inside the exterior housing 2 can be emitted to the outside of the exterior housing 2 without increasing the temperature around the exterior housing 2. Therefore, the heat of the heat source such as the wavelength conversion element 45 can be effectively emitted to the outside of the exterior housing 2, and the temperature inside the exterior housing 2 can be maintained low.

[0074] Furthermore, the projector 1D achieves the following effects in addition to the effects similar to those of the projector 1C according to the fourth embodiment. The projector 1D includes a wavelength-selective emission member WS made of a material in which microcavities that form a concave-convex pattern are arranged two-dimensionally. The wavelength-selective emission member WS corresponds to an inner wavelength-selective emission member. The exterior housing 2 is made of a material containing resin. The wavelength-selective emission member WS is provided in a light source housing CA, which is the case of the light source device 4 among the light source device 4, the image forming device 30, and the projection optical device 36, and emits infrared rays in a specific wavelength range from the received thermal energy. According to this configuration, since the wavelength selective emitting member WS is made of the above-mentioned material, the wavelength selective emitting member WS can emit infrared rays with directionality, which makes it easier to emit infrared rays from the wavelength selective emitting member WS through the exterior housing 2 to the outside of the exterior housing 2.

[0075] In the projector 1D, the first infrared ray emitted from the wavelength selective emitting member WS is emitted toward the wavelength selective emitting member WT via the exterior housing 2. The wavelength selective emitting member WT absorbs electromagnetic waves in the wavelength band of the first infrared ray emitted from the wavelength selective emitting member WS and emits the second infrared ray. According to such a configuration, the heat inside the exterior housing 2 can be released to the outside of the exterior housing 2 without increasing the temperature around the exterior housing 2. Therefore, the temperature inside the exterior housing 2 can be kept low.

[0076] [Sixth embodiment] Next, a sixth embodiment of the present disclosure will be described. The projector according to this embodiment has a similar configuration to the projector 1 according to the first embodiment, but the heat source is different. In the following description, parts that are the same or approximately the same as parts already described are given the same reference numerals and description thereof will be omitted.

[0077] [Projector configuration] FIG. 9 is a schematic diagram showing the configuration of a projector 1E according to the present embodiment. 9, the projector 1E according to the present embodiment has the same configuration and function as the projector 1D according to the fifth embodiment, except that it further includes an internal cooling device 5 including a wavelength-selective emitting member WS. That is, the projector 1E includes a wavelength-selective emitting member WS provided in the light source device 4 and a wavelength-selective emitting member WT provided in a rear portion 22 of the exterior housing facing the wavelength-selective emitting member WS, and also includes a set of wavelength-selective emitting members WS, WT provided in positions different from these wavelength-selective emitting members WS, WT. In addition, the wavelength selective emitting member WS arranged within the outer housing 2 corresponds to a first wavelength selective emitting member constituting the first wavelength selective emitting section, and the wavelength selective emitting member WT arranged outside the outer housing 2 corresponds to a second wavelength selective emitting member constituting the second wavelength selective emitting section.

[0078] [Internal cooling system configuration] The internal cooling device 5 mainly cools the light modulation elements 343 constituting the light modulation device 34 of the image projection device 3. The internal cooling device 5 includes an internal housing 51, a circulation fan 52, and a wavelength-selective emitting member WS. The internal housing 51 is a sealed housing that houses the homogenizing optical system 31, the color separation optical system 32, the relay optical system 33, the light modulation device 34, and the optical component housing 35. In other words, the internal housing 51 is a case for the image forming device 30. A wavelength-selective emission member WS is provided on an outer surface of the internal housing 51 facing the +X direction. The internal housing 51 is formed of, for example, a metal, and a side portion 511 on whose outer surface the wavelength-selective emission member WS is provided in the internal housing 51 functions as a heat receiving portion that receives heat from the gas inside the internal housing 51.

[0079] The circulation fan 52 is provided inside the internal housing 51. The circulation fan 52 circulates the gas inside the internal housing 51 by sucking in the gas inside the internal housing 51 and sending it to heat sources such as the light modulation element 343, the polarizing plates 342 and 344, and the polarization conversion element 313. This cools each heat source. Note that if the gas inside the internal housing 51 circulates by natural convection or if the amount of heat generated by the heat source inside the internal housing 51 is small, the circulation fan 52 may not be required.

[0080] The wavelength-selective emitting member WS receives heat from the side surface portion 511 of the internal housing 51, and emits the first infrared ray converted from the received thermal energy in the +X direction. The heat of the gas received at the side surface portion 511 includes heat of a heat source such as the optical modulation element 343 housed in the internal housing 51. Therefore, the wavelength-selective emitting member WS emits the first infrared ray based on the heat of the heat source in the +X direction. That is, the wavelength-selective emitting member WS emits the first infrared ray toward the wavelength-selective emitting member WT. In this embodiment, the surface of the wavelength selective radiation member WS in the +X direction, which is the heat radiation surface, directly faces the inner surface of the left side surface portion 23.

[0081] In this embodiment, the wavelength selective emitting member WT is provided on the outer surface of the left side surface portion 23. Although not shown in the drawings, when viewed from the emission direction of the first infrared ray by the wavelength selective emitting member WS, the wavelength selective emitting member WT is provided at a position covering the wavelength selective emitting member WS. The wavelength-selective emission member WT absorbs electromagnetic waves in the wavelength band of the first infrared ray that has passed through the left side surface portion 23, and emits the above-mentioned second infrared ray in the +X direction. This makes it possible to emit the heat inside the exterior housing 2 to the outside of the exterior housing 2 without increasing the temperature around the rear surface portion 22, and therefore around the projector 1E. As described above, a protective layer may be provided on the outer surface of the wavelength selective emitting member WT. Also, the outer surface of the left side surface portion 23 on which the wavelength selective emitting member WT is provided may be provided with irregularities similar to the irregularities 22A.

[0082] [Effects of the sixth embodiment] The projector 1E according to the present embodiment described above provides the same effects as the projector 1D according to the fifth embodiment. The projector 1E includes a heat source constituting the light source device 4, a light source housing CA that houses the heat source, and also includes a light modulation device 34 and an internal housing 51 that surrounds the light modulation device 34. One of the heat source constituting the light source device 4 and the light modulation device 34 is a first heat source, and the other is a second heat source. When the heat source constituting the light source device 4 is the first heat source, the light source housing CA is a first internal housing, and the internal housing 51 is a second internal housing. When the light modulation device 34 is the first heat source, the internal housing 51 is the first internal housing, and the light source housing CA is the second internal housing. The wavelength-selective emitting member WS is provided in each of the light source housing CA and the inner housing 51.

[0083] According to this configuration, the heat of the heat sources constituting the light source device 4 can be released to the outside of the exterior housing 2 by the wavelength-selective release member WS provided in the light source housing CA, and further, the heat of the heat sources such as the optical modulation device 34 can be released to the outside of the exterior housing 2 by the wavelength-selective release member WS provided in the internal housing 51. Therefore, it is possible to easily release the heat of each heat source to the outside of the exterior housing 2, and the temperature inside the exterior housing 2 can be maintained even lower.

[0084] In the projector 1E, of the first and second internal housings, one of the internal housings is a light source housing CA for a light source device 4 having a solid-state light source 41, and the other internal housing is a case for an image forming device 30 that modulates light from the light source device 4 into image light. According to such a configuration, the heat of the light source device 4 and the heat of the image forming device 30 can be dissipated to the outside of the exterior housing 2.

[0085] In the projector 1E, the exterior housing 2 is made of a material containing resin. The first infrared ray emitted by the wavelength-selective emission member WS is an infrared ray having a wavelength of 7 μm or less. According to such a configuration, the wavelength-selective radiation member WS can easily radiate the transferred heat to the outside of the exterior housing 2, as described above.

[0086] The projector 1E includes a wavelength-selective emission member WT. The wavelength-selective emission member WT corresponds to a second wavelength-selective emission member, receives heat inside the exterior housing 2, and emits second infrared rays in a specific wavelength range from the received thermal energy to the outside of the exterior housing 2. According to this configuration, the wavelength-selective radiation member WT converts the heat inside the exterior housing 2 into the second infrared radiation and releases it to the outside of the exterior housing 2. Therefore, the heat inside the exterior housing 2 can be more effectively released to the outside of the exterior housing 2.

[0087] [Seventh embodiment] Next, a seventh embodiment of the present disclosure will be described. The projector according to this embodiment has a similar configuration to the projector 1D according to the fifth embodiment, but further includes a circuit board, and the arrangement of the wavelength-selective emission members WS, WT is different. Note that in the following explanation, parts that are the same or approximately the same as parts already explained are given the same reference numerals and explanations thereof will be omitted.

[0088] [Projector configuration] FIG. 10 is a schematic diagram showing the configuration of a projector 1F according to the present embodiment. Like the projector 1 according to the first embodiment, the projector 1F according to the present embodiment modulates light emitted from a light source device 4 to project an image according to image information. As shown in Fig. 10, the projector 1F includes an exterior housing 2F, an image projection device 3F, a circuit board 6, a wavelength-selective emission member WS, and a wavelength-selective emission member WT.

[0089] [Exterior casing configuration] The exterior housing 2F houses the image projection device 3F, the circuit board 6, and the wavelength-selective emission member WS, and constitutes the exterior of the projector 1F. Like the exterior housing 2, the exterior housing 2F has a left side surface portion 23, a right side surface portion 24, a top surface portion 25, and a bottom surface portion 26, as well as a front surface portion and a rear surface portion which are not shown in FIG. A wavelength-selective radiation member WT is provided on the outer surface of each of the left side surface portion 23 and the right side surface portion 24. The outer surface of each of the left side surface portion 23 and the right side surface portion 24 may be provided with unevenness similar to the unevenness 22A described above, and a protective layer may be provided on the outer surface of the wavelength-selective radiation member WT. The bottom surface portion 26 is provided with legs 261 that come into contact with the installation surface when the projector 1F is installed on the installation surface.

[0090] [Configuration of image projection device] Similar to the image projection device 3 according to the first embodiment, the image projection device 3F forms image light from light emitted from the light source device 4 and projects the formed image light. The image projection device 3F includes a light source device 4, an image forming device 30, and a projection optical device 36. In the image projection device 3F, the light source device 4 emits illumination light in the +Y direction. The image forming device 30 is disposed in the +Y direction with respect to the light source device 4, and emits image light formed from illumination light incident from the light source device 4 in the +Z direction. In this embodiment, the light modulation device 34 is accommodated inside the optical component housing 35. The projection optical device 36 is disposed in the +Z direction with respect to the image forming device 30, and projects the image light incident from the image forming device 30 in the +Z direction.

[0091] In such an image projection device 3F, the light source casing CA of the light source device 4 is a case of the light source device 4. The -X direction surface of the light source casing CA directly faces the inner surface of the right side surface portion 24, and the -Y direction surface of the light source casing CA directly faces the inner surface of the bottom surface portion 26. The +X direction surface of the light source casing CA directly faces the circuit board 6. The optical components casing 35 of the image forming device 30 is a case of the image forming device 30. The -X direction surface of the optical components casing 35 directly faces the inner surface of the right side surface portion 24, and the +Y direction surface of the optical components casing 35 directly faces the inner surface of the top surface portion 25. The +X direction surface of the optical components casing 35 directly faces the circuit board 6.

[0092] [Circuit board configuration] The circuit board 6 processes input image information or executes control processing of the entire projector 1F. The circuit board 6 is disposed along the inner surface of the left side surface portion 23, between the light source device 4 and the image forming device 30. In other words, the circuit board 6 is disposed along the light source housing CA, which is the case for the light source device 4, and the optical component housing 35, which is the case for the image forming device 30. The circuit board 6 has a plurality of circuit elements for performing the above processes. The plurality of circuit elements are heat sources. That is, the circuit board 6 has a heat source. The +X direction surface of the circuit board 6 directly faces the inner surface of the left side surface portion 23. The -X direction surface of the circuit board 6 directly faces the +X direction surfaces of the light source casing CA and the optical component casing 35.

[0093] [Function of wavelength-selective emission material] The wavelength-selective emission member WS is provided on an outer surface of the light source casing CA that directly faces the inner surface of the right side surface portion 24 and an outer surface of the bottom surface portion 26, and is also provided on an outer surface of the optical component casing 35 that directly faces the right side surface portion 24. In other words, the wavelength-selective emission member WS is not provided on the outer surfaces of the light source casing CA and the optical component casing 35 that directly face the circuit board 6. The wavelength-selective emission member WS may be provided on the outer surface of the light source casing CA that directly faces the inner surface of the top surface portion 25. Of the wavelength-selective emitting members WS provided in the light source housing CA and the optical component housing 35, the wavelength-selective emitting member WS directly facing the right side surface portion 24 receives heat from the light source device 4 and the image forming device 30, and emits first infrared rays converted from the received thermal energy in the -X direction. In other words, the wavelength-selective emitting member WS directly facing the right side surface portion 24 emits the first infrared rays toward the wavelength-selective emitting member WT provided in the right side surface portion 24. Of the wavelength-selective radiating members WS provided in the light source housing CA, the wavelength-selective radiating member WS directly facing the bottom surface portion 26 radiates first infrared rays converted from thermal energy received from the light source device 4 in the -Y direction.

[0094] As described above, the wavelength-selective radiation member WT is provided on the outer surface of the left side surface portion 23 and the outer surface of the right side surface portion 24, respectively. The wavelength-selective radiation member WT provided on the outer surface of the left side surface portion 23 receives heat from the gas inside the exterior housing 2 that is transferred to the left side surface portion 23. The wavelength-selective radiation member WT converts the received thermal energy into the second infrared rays, and emits the converted second infrared rays in the +X direction. The wavelength selective emitting member WT provided on the outer surface of the right side surface portion 24 receives heat from the gas inside the exterior housing 2 that is transferred to the right side surface portion 24. The wavelength selective emitting member WT converts the received thermal energy into the second infrared ray, and emits the converted second infrared ray in the +X direction. In addition, the wavelength selective emitting member WT absorbs electromagnetic waves in the wavelength band of the first infrared ray emitted from the wavelength selective emitting member WS that directly faces the inner surface of the right side surface portion 24, and emits the second infrared ray. As a result, the heat of the gas inside the exterior housing 2F is released to the outside of the exterior housing 2F as the second infrared ray. Note that the wavelength-selective release member WT may be further provided on the top surface portion 25.

[0095] [Effects of the Seventh Embodiment] The projector 1F according to the present embodiment described above provides the following effects in addition to the effects similar to those of the projector 1C according to the fourth embodiment and the projector 1D according to the fifth embodiment. The projector 1F includes a circuit board 6 having a heat source, and the circuit board 6 is disposed along the light source housing CA and the optical components housing 35. One of the light source housing CA and the optical components housing 35 corresponds to the first inner housing. The wavelength-selective radiation member WS is disposed on a surface not facing the circuit board 6. In this embodiment, the wavelength-selective radiation member WS is provided on the outer surface in the -X direction and the outer surface in the -Y direction of the light source housing CA not facing the circuit board 6, and is also provided on the outer surface in the -X direction of the optical component housing 35 not facing the circuit board 6. According to such a configuration, it is possible to prevent the first infrared ray emitted from the wavelength selective emission member WS from being incident on the circuit board 6. Therefore, it is possible to make it easier for the first infrared ray to be emitted to the outside of the exterior housing 2.

[0096] In the projector 1F, the second infrared ray emitted by the wavelength-selective emitting member WT is an infrared ray having a wavelength of not less than 8 μm and not more than 14 μm. According to this configuration, in the same manner as described above, it is possible to suppress a rise in temperature around the exterior housing 2 caused by the second infrared ray being emitted to the outside of the exterior housing 2.

[0097] In projector 1F, the first infrared ray is emitted in the -X direction from the wavelength selective emitting member WS toward the wavelength selective emitting member WT via the exterior housing 2. The wavelength selective emitting member WT, which is disposed in the -X direction with respect to the wavelength selective emitting member WS, absorbs electromagnetic waves in the wavelength band of the first infrared ray and emits the second infrared ray. According to this configuration, similarly to the above, the heat of the heat source arranged inside the exterior housing 2 can be released to the outside of the exterior housing 2 without increasing the temperature around the exterior housing 2. Therefore, the heat of the heat source can be effectively released to the outside of the exterior housing 2, and the temperature inside the exterior housing 2 can be maintained low.

[0098] [Modifications of the embodiment] The present disclosure is not limited to the above-described embodiments, and modifications and improvements within the scope that can achieve the object of the present disclosure are included in the present disclosure. The configurations of the projectors according to the above embodiments may be combined with each other. For example, the configuration using the heat transfer members TM1, TM2 and the heat diffusion member HS shown in the second embodiment may be combined with the configuration including a plurality of pairs of wavelength-selective emission members WS, WT shown in the sixth embodiment.

[0099] In the above first to third and fifth to seventh embodiments, the wavelength-selective radiation member WS is provided on the heat receiving plate that receives heat from the heat source. However, the present invention is not limited to this, and the wavelength-selective radiation member WS may be provided on the heat source. In the fourth to seventh embodiments, the wavelength-selective radiation member WT is provided on a part of the outer surface of the exterior housing. However, the present invention is not limited to this, and the wavelength-selective radiation member WT may be provided on, for example, substantially the entire outer surface of the exterior housing.

[0100] In each of the above embodiments, the light source device 4 includes the solid-state light source 41, the wavelength conversion element 45, and the diffusion optical member 47. However, the present invention is not limited to this, and the projector may include a light source device having a discharge light source lamp such as an extra-high pressure mercury lamp.

[0101] In each of the above embodiments, the projector includes three light modulation elements 343R, 343G, and 343B. However, the present disclosure is not limited to this, and can also be applied to a projector including two or less light modulation elements, or four or more light modulation elements. In each of the above embodiments, the light modulation element 343 is a transmissive liquid crystal panel having different light incident and light exit surfaces. However, the light modulation element 343 is not limited to this, and may be a reflective liquid crystal panel having the same light incident and light exit surfaces. In addition, as long as the light modulation element is capable of modulating the incident light beam to form an image according to image information, a light modulation element other than a liquid crystal, such as a device using a micromirror, for example, a device using a DMD (Digital Micromirror Device), may be used in the projector.

[0102] In addition to the above configuration, the projector according to each of the above embodiments may further include a speaker, a wireless communication device, and other components housed in the exterior housing. These components may be disposed in the exterior housing to avoid the emission area of ​​the first infrared ray by the wavelength-selective emission member WS.

[0103] [Summary of this disclosure] The following is a summary of this disclosure. [Appendix 1] A first heat source; an exterior housing that houses the first heat source; a first wavelength-selective emission member that receives heat from the first heat source and emits first infrared rays in a specific wavelength band from the received thermal energy to the outside of the exterior housing through the exterior housing; A projector characterized by:

[0104] According to this configuration, the first wavelength-selective emission member converts heat generated inside the exterior housing into the first infrared ray and emits the converted first infrared ray to the outside of the exterior housing, thereby keeping the temperature of the exterior housing low. This reduces the need to provide a fan inside the exterior housing. Even if a fan is provided inside the exterior housing, it is possible to reduce the power consumption and noise of the fan, and the number of fans can be reduced, thereby making it possible to miniaturize the projector.

[0105] [Appendix 2] In the projector according to claim 1, A first heat receiving plate that receives heat from the first heat source is provided, The first wavelength selective emitting member is provided on the first heat receiving plate. A projector characterized by: According to this configuration, the first wavelength-selective emission member that emits the first infrared ray from the received thermal energy is provided on the first heat receiving plate that receives the heat from the first heat source, so that the heat from the first heat source can be effectively emitted to the outside of the exterior housing, thereby keeping the temperature of the exterior housing low.

[0106] [Appendix 3] In the projector according to claim 1, A first heat receiving plate that receives heat from the first heat source; A second heat receiving plate disposed opposite the inner surface of the exterior housing; A heat transfer member that transfers heat from the first heat receiving plate to the second heat receiving plate, The first wavelength selective emitting member is provided on the second heat receiving plate. A projector characterized by: According to this configuration, the heat of the first heat source is transferred to the second heat receiving plate facing the inner surface of the exterior housing via the first heat receiving plate and the heat transfer member. Since the first wavelength-selective emitting member is provided on the second heat receiving plate, the first wavelength-selective emitting member emits the first infrared ray from the heat of the first heat source. This increases the degree of freedom in arranging the first heat source and the first heat receiving plate, and increases the degree of freedom in arranging the components that make up the projector.

[0107] [Appendix 4] In the projector according to any one of Supplementary Note 1 to Supplementary Note 3, The first heat source is one of a solid-state light source, a phosphor that converts the wavelength of light emitted from the solid-state light source, and a diffusion optical member that diffuses the light emitted from the solid-state light source. A projector characterized by: According to this configuration, the heat of one of the heat sources, the solid-state light source, the phosphor, and the diffusive optical member, is released as the heat of the first heat source by the first wavelength-selective release member, thereby making it possible to effectively release the heat of the heat source to the outside of the exterior housing.

[0108] [Appendix 5] In the projector according to claim 1, A first heat receiving plate that receives heat from the first heat source; A second heat source; and a second heat receiving plate that is disposed opposite the inner surface of the exterior housing and receives heat from the second heat source; A heat transfer member that transfers heat from the first heat receiving plate to the second heat receiving plate, The first wavelength selective emitting member is provided on the second heat receiving plate. A projector characterized by:

[0109] According to this configuration, not only the heat of the second heat source but also the heat of the first heat source is transferred to the second heat receiving plate arranged opposite the inner surface of the exterior housing via the first heat receiving plate and the heat transfer member. Since the first wavelength selective emitting member is provided on the second heat receiving plate, the first wavelength selective emitting member emits the first infrared ray from the heat of the first heat source and the second heat source. In this way, the first heat receiving plate and the heat transfer member receive the heat of the second heat source and transfer it to the second heat receiving plate provided with the first wavelength selective emitting member, so that the first heat receiving plate does not need to directly face the inner surface of the exterior housing. Therefore, it is possible to increase the degree of freedom in the arrangement of the first heat source and the first heat receiving plate in the projector.

[0110] [Appendix 6] In the projector according to claim 5, the first heat source is one of a solid-state light source, a phosphor that converts a wavelength of light emitted from the solid-state light source, and a diffusion optical member that diffuses the light emitted from the solid-state light source; The second heat source is a heat source different from the first heat source among the solid-state light source, the phosphor, and the diffusing optical member. A projector characterized by: According to this configuration, the heat of two heat sources among the solid light source, the phosphor, and the diffusing optical member can be effectively released to the outside of the exterior housing. In addition, since the heat of the two heat sources can be released to the outside of the exterior housing by the common first wavelength-selective release member, the configuration of the projector can be simplified compared to the case where a first wavelength-selective release member is provided for each of the two heat sources.

[0111] [Appendix 7] 7. The projector according to claim 1, the exterior housing is made of a material containing resin, The first infrared ray is an infrared ray having a wavelength of 7 μm or less. A projector characterized by: Here, the exterior housing made of a material containing resin transmits infrared rays having a wavelength of 7 μm or less, and therefore, by the first infrared rays being infrared rays in the above-mentioned wavelength band, the first wavelength-selective emitting member can easily radiate the transferred heat to the outside of the exterior housing.

[0112] [Appendix 8] 7. The projector according to claim 1, the exterior housing has a window in an area facing the first wavelength selective emission member, The window transmits the first infrared ray emitted from the first wavelength selective emission member at a transmission portion made of an infrared transmitting material. A projector characterized by: According to this configuration, the first infrared ray emitted by the first wavelength-selective emitting member can be easily emitted to the outside of the exterior housing through the window provided in the exterior housing. In addition, since the window transmits the first infrared ray emitted from the first wavelength-selective emitting member to the outside of the exterior housing, the degree of freedom in selecting the wavelength of the infrared ray contained in the first infrared ray can be increased, and therefore the degree of freedom in selecting the material of the exterior housing and the degree of freedom in selecting the first wavelength-selective emitting member can be increased.

[0113] [Appendix 9] 9. The projector according to claim 1, a second wavelength-selective emission member that receives heat inside the exterior housing and emits second infrared rays in a specific wavelength band from the received thermal energy to the outside of the exterior housing; A projector characterized by: According to this configuration, the second wavelength-selective emission member converts the heat inside the exterior housing into the second infrared ray and emits it to the outside of the exterior housing. Therefore, the heat inside the exterior housing can be more effectively emitted to the outside of the exterior housing.

[0114] [Appendix 10] 10. The projector according to claim 9, The second infrared ray is an infrared ray having a wavelength of 8 μm or more and 14 μm or less. A projector characterized by: Here, infrared rays having a wavelength of 8 μm or more and 14 μm or less are transmitted through the atmosphere. For this reason, since the second infrared rays emitted to the outside of the exterior housing are the above-mentioned infrared rays, the atmosphere around the exterior housing is prevented from being heated by the second infrared rays, and therefore, it is possible to prevent an increase in temperature around the exterior housing, and ultimately around the projector.

[0115] [Appendix 11] 11. The projector according to claim 10, the first infrared ray emitted from the first wavelength selective emitting member is emitted toward the second wavelength selective emitting member through the exterior housing, The second wavelength selective emission member absorbs electromagnetic waves in the wavelength band of the first infrared ray and emits the second infrared ray. A projector characterized by: According to this configuration, the first infrared ray emitted to the outside of the exterior housing is emitted from the first wavelength selective emitting member through the exterior housing to the second wavelength selective emitting member. The second wavelength selective emitting member absorbs the first infrared ray and emits the second infrared ray that transmits through the atmosphere to the outside of the exterior housing. This allows the heat of the first heat source arranged in the exterior housing to be emitted to the outside of the exterior housing without increasing the temperature around the exterior housing. Therefore, the heat of the first heat source can be effectively emitted to the outside of the exterior housing, and the temperature inside the exterior housing can be maintained low.

[0116] [Appendix 12] In the projector according to claim 1, a first inner housing provided inside the exterior housing and surrounding the first heat source; The first wavelength-selective emitting member is provided in the first inner housing. A projector characterized by: According to this configuration, the heat generated inside the first inner housing can be released to the outside of the exterior housing by the first wavelength-selective release member, and therefore the temperature inside the first inner housing can be kept low.

[0117] [Appendix 13] 13. The projector according to claim 12, The first wavelength-selective emission member directly faces the inner surface of the exterior housing. A projector characterized by: According to this configuration, no other member is interposed between the first wavelength-selective emitting member and the exterior housing, which makes it easier for the first infrared light emitted by the first wavelength-selective emitting member to be emitted to the outside of the exterior housing.

[0118] [Appendix 14] In the projector according to claim 12 or 13, A second heat source; and a second inner housing surrounding the second heat source; The first wavelength-selective emission member is provided in each of the first inner housing and the second inner housing. A projector characterized by: According to this configuration, the first wavelength-selective emitting member is provided not only in the first internal housing surrounding the first heat source, but also in the second internal housing surrounding the second heat source. Therefore, the first wavelength-selective emitting member provided in the first internal housing can radiate heat from the first heat source to the outside of the exterior housing, and the first wavelength-selective emitting member provided in the second internal housing can radiate heat from the second heat source to the outside of the exterior housing. Therefore, it is possible to easily radiate heat from each heat source to the outside of the exterior housing, and the temperature inside the exterior housing can be maintained even lower.

[0119] [Appendix 15] 15. The projector according to claim 12, The first internal housing is one of a case of a light source device having a light source and a case of an image forming device that modulates light from the light source device into image light. A projector characterized by: According to this configuration, heat from one of the light source device and the image forming device can be dissipated to the outside of the exterior housing.

[0120] [Appendix 16] 16. The projector according to claim 12, the exterior housing is made of a material containing resin, The first infrared ray is an infrared ray having a wavelength of 7 μm or less. A projector characterized by: According to such a configuration, since the first infrared ray is infrared ray in the above wavelength band, as described above, the first wavelength-selective emitting member can easily radiate the transferred heat to the outside of the exterior housing.

[0121] [Appendix 17] 17. The projector according to claim 12, a second wavelength-selective emission member that receives heat inside the exterior housing and emits second infrared rays in a specific wavelength range from the received thermal energy to the outside of the exterior housing; A projector characterized by: According to this configuration, as described above, the second wavelength-selective emitting member converts the heat inside the exterior housing into the second infrared ray and radiates it to the outside of the exterior housing. Therefore, the heat inside the exterior housing can be more effectively radiated to the outside of the exterior housing.

[0122] [Appendix 18] 18. The projector according to claim 17, a circuit board having a heat source and disposed along the first inner housing; The first wavelength selective emitting member is disposed on a surface that does not face the circuit board. A projector characterized by: According to this configuration, it is possible to prevent the first infrared ray emitted from the first wavelength-selective emitting member from being incident on the circuit board, and therefore it is possible to easily emit the first infrared ray to the outside of the exterior housing.

[0123] [Appendix 19] 19. The projector according to claim 17, The second infrared ray is an infrared ray having a wavelength of 8 μm or more and 14 μm or less. A projector characterized by: According to this configuration, similarly to the above, it is possible to suppress a rise in temperature around the exterior housing caused by the second infrared ray being emitted to the outside of the exterior housing.

[0124] [Appendix 20] 19. The projector according to claim 17, the first infrared ray emitted from the first wavelength selective emitting member is emitted toward the second wavelength selective emitting member through the exterior housing, The second wavelength selective emission member absorbs electromagnetic waves in the wavelength band of the first infrared ray and emits the second infrared ray. A projector characterized by: According to this configuration, similarly to the above, the heat of the first heat source disposed inside the exterior housing can be released to the outside of the exterior housing without increasing the temperature around the exterior housing. Therefore, the heat of the first heat source can be effectively released to the outside of the exterior housing, and the temperature inside the exterior housing can be kept low.

[0125] [Appendix 21] A light source device; an image forming device that modulates light from the light source device into image light; a projection optical device that projects the image light modulated by the image forming device; An exterior housing constituting the exterior; an outer wavelength-selective emission member provided in at least a part of the exterior housing, which receives heat inside the exterior housing and emits infrared rays in a specific wavelength band from the received thermal energy to the outside of the exterior housing; A projector characterized by:

[0126] According to this configuration, the outer wavelength-selective emission member emits heat inside the exterior housing to the outside of the exterior housing as infrared rays in a specific wavelength band, thereby maintaining a low temperature inside the exterior housing. This reduces the need to provide a fan inside the exterior housing. Even if a fan is provided inside the exterior housing, it is possible to reduce the power consumption and noise of the fan, and the number of fans can be reduced, which allows the projector to be made more compact.

[0127] [Appendix 22] 22. The projector according to claim 21, The outer wavelength selective emission member is made of a polymer matrix material having dielectric particles dispersed in the polymer. A projector characterized by: According to this configuration, since the outer wavelength-selective emitting member contains the polymer matrix material, the outer wavelength-selective emitting member can emit infrared rays having a wavelength of 8 μm or more and 14 μm or less, and therefore, it is possible to suppress an increase in the temperature of the atmosphere around the exterior housing.

[0128] [Appendix 23] 23. The projector according to claim 22, An inner wavelength-selective emission member is provided, the inner wavelength-selective emission member being made of a material in which microcavities forming a concave-convex pattern are arranged two-dimensionally; the exterior housing is made of a material containing resin, the inner wavelength-selective emission member is provided in a case of at least one of the light source device, the image forming device, and the projection optical device, and emits infrared rays in a specific wavelength range from the received thermal energy; A projector characterized by: According to this configuration, since the inner wavelength-selective radiation member is made of the above-mentioned material, the inner wavelength-selective radiation member can emit infrared rays with directionality, which makes it easier to emit infrared rays from the inner wavelength-selective radiation member through the exterior housing to the outside of the exterior housing.

[0129] [Appendix 24] 24. The projector according to claim 23, the infrared light emitted from the inner wavelength selective emitting member is emitted toward the outer wavelength selective emitting member through the exterior housing, The outer wavelength selective emission member absorbs electromagnetic waves in a wavelength band of infrared light emitted from the inner wavelength selective emission member and emits infrared light. A projector characterized by: According to this configuration, similarly to the above, the heat inside the exterior housing can be released to the outside of the exterior housing without increasing the temperature around the exterior housing, and therefore the temperature inside the exterior housing can be kept low. [Explanation of symbols]

[0130] 1, 1B, 1C, 1D, 1E, 1F... projector, 2, 2B, 2F... exterior housing, 21... front part, 22... rear part, 23... left side part, 24... right side part, 25... top part, 26... bottom part, 3, 3F... image projection device, 30... image forming device, 31... uniformization optical system, 311, 312... lens array, 313... polarization conversion element, 314... superimposition lens, 32... color separation optical system, 321, 323... dichroic mirror, 322... reflection mirror, 324, 325... lens, 33... relay optical system, 331... entrance side lens, 332, 334... reflection mirror, 333... relay lens, 34... light modulation device, 341... field lens, 342... entrance side polarizing plate, 343, 343B , 343G, 343R...light modulation element, 344...output side polarizing plate, 345...color synthesis optical system, 35...housing for optical components, 36...projection optical device, 4, 4A...light source device, 41...solid light source, 45...wavelength conversion element (phosphor), 47...diffusion optical member, 5...internal cooling device, 51...internal housing, 52...circulation fan, 6...circuit board, CA...housing for light source, CA1...heat receiving plate (first heat receiving plate), CA2...heat receiving plate (first heat receiving plate), CA3...heat receiving plate (second heat receiving plate), HS...thermal diffusion member, TM1, TM2...heat transfer member, WS...wavelength selective emission member (first wavelength selective emission member, inner wavelength selective emission member), WT...wavelength selective emission member (second wavelength selective emission member, outer wavelength selective emission member).

Claims

1. A first heat source; and an exterior housing that houses the first heat source; a first wavelength-selective emission member that receives heat from the first heat source and emits first infrared rays in a specific wavelength band from the received thermal energy to the outside of the exterior housing through the exterior housing; A projector characterized by:

2. 2. The projector according to claim 1, A first heat receiving plate that receives heat from the first heat source is provided, The first wavelength selective emitting member is provided on the first heat receiving plate. A projector characterized by:

3. 2. The projector according to claim 1, a first heat receiving plate that receives heat from the first heat source; A second heat receiving plate disposed opposite the inner surface of the exterior housing; A heat transfer member that transfers heat from the first heat receiving plate to the second heat receiving plate, The first wavelength selective emitting member is provided on the second heat receiving plate. A projector characterized by:

4. 2. The projector according to claim 1, The first heat source is one of a solid-state light source, a phosphor that converts a wavelength of light emitted from the solid-state light source, and a diffusion optical member that diffuses the light emitted from the solid-state light source. A projector characterized by:

5. 2. The projector according to claim 1, a first heat receiving plate that receives heat from the first heat source; A second heat source; and a second heat receiving plate disposed opposite the inner surface of the exterior housing and configured to receive heat from the second heat source; A heat transfer member that transfers heat from the first heat receiving plate to the second heat receiving plate, The first wavelength selective emitting member is provided on the second heat receiving plate. A projector characterized by:

6. 6. The projector according to claim 5, the first heat source is one of a solid-state light source, a phosphor that converts a wavelength of light emitted from the solid-state light source, and a diffusion optical member that diffuses the light emitted from the solid-state light source; The second heat source is a heat source different from the first heat source among the solid-state light source, the phosphor, and the diffusing optical member. A projector characterized by:

7. The projector according to any one of claims 1 to 6, the exterior housing is made of a material containing resin, The first infrared ray is an infrared ray having a wavelength of 7 μm or less. A projector characterized by:

8. 7. The projector according to claim 1, the exterior housing has a window in an area facing the first wavelength selective emission member, The window transmits the first infrared ray emitted from the first wavelength selective emission member at a transmission portion made of an infrared transmitting material. A projector characterized by:

9. 7. The projector according to claim 1, a second wavelength-selective emission member that receives heat inside the exterior housing and emits second infrared rays having a specific wavelength band from the received thermal energy to the outside of the exterior housing; A projector characterized by:

10. 10. The projector according to claim 9, The second infrared ray is an infrared ray having a wavelength of 8 μm or more and 14 μm or less. A projector characterized by:

11. The projector according to claim 10, the first infrared ray emitted from the first wavelength selective emitting member is emitted toward the second wavelength selective emitting member through the exterior housing, The second wavelength selective emission member absorbs electromagnetic waves in the wavelength band of the first infrared ray and emits the second infrared ray. A projector characterized by:

12. 2. The projector according to claim 1, a first inner housing provided inside the exterior housing and surrounding the first heat source; The first wavelength-selective emitting member is provided in the first inner housing. A projector characterized by:

13. The projector according to claim 12, The first wavelength-selective emitting member is directly opposed to the inner surface of the exterior housing. A projector characterized by:

14. The projector according to claim 12 or 13, A second heat source; and a second inner housing surrounding the second heat source; The first wavelength selective emission member is provided in each of the first internal housing and the second internal housing. A projector characterized by:

15. The projector according to claim 12 or 13, the first internal housing is one of a case of a light source device having a light source and a case of an image forming device that modulates light from the light source device into image light; A projector characterized by:

16. The projector according to claim 12 or 13, the exterior housing is made of a material containing resin, The first infrared ray is an infrared ray having a wavelength of 7 μm or less. A projector characterized by:

17. The projector according to claim 12 or 13, a second wavelength-selective emission member that receives heat inside the exterior housing and emits second infrared rays in a specific wavelength range from the received thermal energy to the outside of the exterior housing; A projector characterized by:

18. 18. The projector according to claim 17, a circuit board having a heat source and disposed along the first inner housing; The first wavelength selective emitting member is disposed on a surface that does not face the circuit board. A projector characterized by:

19. 18. The projector according to claim 17, The second infrared ray is an infrared ray having a wavelength of 8 μm or more and 14 μm or less. A projector characterized by:

20. 18. The projector according to claim 17, the first infrared ray emitted from the first wavelength selective emitting member is emitted toward the second wavelength selective emitting member through the exterior housing, The second wavelength selective emission member absorbs electromagnetic waves in the wavelength band of the first infrared ray and emits the second infrared ray. A projector characterized by:

21. A light source device; an image forming device that modulates light from the light source device into image light; a projection optical device that projects the image light modulated by the image forming device; An exterior housing constituting the exterior; an outer wavelength-selective emission member provided in at least a part of the exterior housing, which receives heat inside the exterior housing and emits infrared rays in a specific wavelength band from the received thermal energy to the outside of the exterior housing; A projector characterized by:

22. 22. The projector according to claim 21, The outer wavelength selective emission member is made of a polymer matrix material having dielectric particles dispersed in the polymer. A projector characterized by:

23. 23. The projector according to claim 22, An inner wavelength-selective emission member is provided, the inner wavelength-selective emission member being made of a material in which microcavities forming a concave-convex pattern are arranged two-dimensionally; the exterior housing is made of a material containing resin, the inner wavelength-selective emission member is provided in a case of at least one of the light source device, the image forming device, and the projection optical device, and emits infrared rays in a specific wavelength range from received thermal energy; A projector characterized by:

24. 24. The projector according to claim 23, the infrared light emitted from the inner wavelength selective emitting member is emitted toward the outer wavelength selective emitting member through the exterior housing, The outer wavelength selective emission member absorbs electromagnetic waves in a wavelength band of infrared light emitted from the inner wavelength selective emission member and emits infrared light. A projector characterized by:

Images