Compression molding device and compression molding method

Abstract

To provide a compression molding device and a compression molding method which prevent occurrence of molding failures and can form a molded article having thin thickness of a resin part, facilitate handling in a sealing resin before resin sealing, prevent occurrence of crack damages in handling, and reduce manufacturing cost and size in the device.SOLUTION: A compression molding device 1 seals workpiece W with a sealing resin R and works the workpiece W into a molded article Wp using a sealing mold 202 having an upper mold 204 and a lower mold 206, wherein a base resin Rm in a state in which a carrier C is fixed is used as the sealing resin R, and a carrier peeling device 16 for peeling the carrier C from the molded article Wp is provided.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a compression molding apparatus and a compression molding method. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and a resin sealing method for sealing a work having electronic components with a sealing resin and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technology in which a predetermined amount of sealing resin is supplied to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, a workpiece is placed in the sealing area, and the upper mold and lower mold are clamped to seal the workpiece with resin. As an example, when a sealing mold having a cavity in the upper mold is used, a technology is known in which the sealing resin is supplied all at once to the center position on the workpiece and molded. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technology is known in which a release film (hereinafter sometimes simply referred to as a "film") that covers the mold surface including the cavity and the sealing resin are supplied and molded (Patent Document 1: See JP 2019-145550 A). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-145550 A Summary of the Invention [Problem to be solved by the invention]

[0005] Conventionally, the compression molding method in which the workpiece is held in the upper die, a cavity is provided in the lower die, and sealing resin (granular resin, as an example) is supplied into the cavity (the so-called compression molding device with a movable lower cavity) has been widely adopted, as it was thought to have advantages in terms of preventing deformation of the workpiece due to contact caused by the flow of the sealing resin or the flow of the wire.

[0006] However, in a configuration in which a workpiece is held in the upper die and a cavity is provided in the lower die, there is a problem that if the workpiece is thin or large, it is difficult to hold it in the upper die and it is likely to fall. In addition, when granular resin is used as the sealing resin, there are problems such as dust generation during molding due to friction between resin particles, difficulty in handling, and difficulty in supplying (spreading) the sealing resin evenly over the entire area inside the cavity provided in the lower die, which tends to cause uneven spreading. In addition, there is a problem that air contained in the gaps between the particles when the sealing resin is spread and gas components caused by degassing from the sealing resin when melted do not escape and remain as voids in the molded product, which tends to cause molding defects.

[0007] On the other hand, when using a solid resin having a fixed shape, rather than a granular resin or liquid resin, as the sealing resin, regardless of the arrangement of the cavities, the following problem was revealed. Specifically, when attempting to form a molded product thin enough that the resin thickness after resin sealing (specifically, the thickness of the resin part at the upper or lower position of the workpiece after resin sealing) is 0.4 mm or less, the thickness of the sealing resin (solid resin) before resin sealing must also be thin. However, the sealing resin (solid resin) before resin sealing is naturally in a state before it is fully cured, so it has low rigidity (brittle) and low strength, and a problem was revealed in that it is extremely prone to breakage during handling (particularly during transportation).

[0008] Furthermore, in order to solve these problems, it is necessary to further reduce the manufacturing costs and the size of the device. [Means for solving the problem]

[0009] The present invention has been made in consideration of the above circumstances, and aims to provide a compression molding device and a compression molding method capable of preventing molding defects caused by uneven spreading of the sealing resin, residual gas, and dust generation during molding, and capable of forming a molded product with a thin resin portion, as well as to facilitate handling of the sealing resin before resin sealing and prevent breakage during handling. Another aim is to reduce manufacturing costs and make the device more compact.

[0010] The present invention solves the above problems by the solution means described below as one embodiment.

[0011] A compression molding apparatus according to one embodiment is a compression molding apparatus that uses a sealing mold having an upper mold and a lower mold to seal a workpiece with sealing resin and process it into a molded product, and is required to use a base resin with a carrier fixed thereto as the sealing resin, and to be equipped with a carrier peeling device that peels off the carrier from the molded product.

[0012] According to the above embodiment, it is possible to prevent molding defects caused by uneven spreading of the sealing resin, residual gas, and dust generation during molding. In addition, it is possible to facilitate handling of the sealing resin, and it is possible to prevent the sealing resin from breaking during handling, especially when forming a thin molded product with a resin part having a thickness of 0.4 mm or less. In addition, by applying the present invention to a configuration in which a cavity is provided in the upper mold and a work is held in the lower mold, it is possible to solve problems such as the work falling. In addition, since the carrier can be peeled off from the molded product and reused, it is possible to reduce the number of parts, thereby reducing manufacturing costs, and to miniaturize the device mainly including the carrier storage section.

[0013] In addition, it is preferable that the sealing resin be a solid resin formed into a predetermined shape by tableting a powder resin and fixing the carrier thereto.

[0014] It is also preferable to provide a transport device that transports the carrier peeled off from the molded product back to an apparatus that forms the sealing resin.

[0015] It is also preferable that the molded product further includes a cutting device that cuts the area from which the carrier has been peeled in the thickness direction and removes the outer edge portion.

[0016] Moreover, a compression molding method according to one embodiment is a compression molding method in which a sealing die having an upper die and a lower die is used to seal a workpiece with sealing resin and process it into a molded product, and the method includes a resin preparation process for preparing a base resin to which a carrier is fixed as the sealing resin, a transport process for transporting the sealing resin into the sealing die, a resin sealing process for closing the sealing die to seal the workpiece with the sealing resin and process it into the molded product, and a carrier removal process for removing the carrier from the molded product.

[0017] It is preferable that the method further comprises a step of returning the carrier peeled off from the molded product to an apparatus for forming the sealing resin, and reusing the carrier when forming the sealing resin.

[0018] The method preferably further comprises the step of cutting the molded product in the thickness direction within the region from which the carrier has been peeled off, and cutting off the outer edge portion. Effect of the Invention

[0019] According to the present invention, it is possible to realize a compression molding device and a compression molding method that can prevent molding defects caused by uneven spreading of the sealing resin, residual gas, and dust generation during molding, and can form a molded product with a thin resin part. In addition, it is possible to facilitate handling of the sealing resin before resin sealing, and to prevent breakage during handling. Furthermore, it is possible to reduce manufacturing costs and make the device more compact. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1 is a plan view showing an example of a compression molding device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a side view showing an example of a first press unit of the compression molding apparatus according to the first embodiment of the present invention. [Diagram 3] 1 is a front cross-sectional view showing an example of a first mold of a compression molding apparatus according to a first embodiment of the present invention. [Figure 4] 4 is a front cross-sectional view showing another example of the first mold of the compression molding apparatus according to the first embodiment of the present invention. FIG. [Diagram 5] FIG. 2 is a side view showing an example of a second press device of the compression molding apparatus according to the first embodiment of the present invention. [Figure 6] 3 is a front cross-sectional view showing an example of a second mold of the compression molding apparatus according to the first embodiment of the present invention. FIG. [Figure 7] FIG. 1 is an explanatory diagram of a compression molding method according to a first embodiment of the present invention. [Figure 8] FIG. 8 is an explanatory diagram following FIG. [Figure 9] Fig. 9A is a plan view showing an example of a sealing resin used in a compression molding apparatus and a compression molding method according to an embodiment of the present invention, Fig. 9B is a cross-sectional view taken along line AA in Fig. 9A, and Fig. 9C is a cross-sectional view showing another example of the sealing resin. [Figure 10] FIG. 9 is an explanatory diagram following FIG. [Figure 11] FIG. 11 is an explanatory diagram following FIG. [Figure 12] FIG. 12 is an explanatory diagram following FIG. [Figure 13] FIG. 13 is an explanatory diagram following FIG. 12. [Figure 14] 14A to 14C are front cross-sectional views showing an example of a molded product formed by the compression molding apparatus and compression molding method according to an embodiment of the present invention, in which FIG. 14A shows the state before the carrier peeling process, FIG. 14B shows the state after the carrier peeling process, and FIG. 14C shows the state after the cutting process. [Figure 15] FIG. 11 is a side view showing an example of a third press device of the compression molding apparatus according to the second embodiment of the present invention. [Figure 16]FIG. 11 is a side view showing an example of a third mold of the compression molding apparatus according to the second embodiment of the present invention. [Figure 17] FIG. 4 is an explanatory diagram of a compression molding method according to a second embodiment of the present invention. [Figure 18] FIG. 18 is an explanatory diagram following FIG. 17. [Figure 19] FIG. 19 is an explanatory diagram following FIG. 18. [Figure 20] FIG. 4 is an explanatory diagram of another example of the compression molding method according to the first embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] [First embodiment] (Overall composition) Hereinafter, the first embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view (schematic view) showing an example of a compression molding apparatus 1 according to this embodiment (a configuration view common to the second embodiment). For convenience of explanation, arrows in the drawing indicate the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction) in the compression molding apparatus 1. In addition, in all the drawings for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0022] The compression molding apparatus 1 according to this embodiment is an apparatus that includes a sealing mold and performs resin sealing (compression molding) of a workpiece (molded article) W using sealing resin R.

[0023] First, the workpiece W to be molded is configured with electronic components. Examples of electronic components include coil sheets, semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, and the like. The workpiece W may be configured to be composed of only electronic components, or may be configured to be mounted on a substrate (wire bonding mounting, flip chip mounting, and the like). Examples of substrates include rectangular or circular plate-like members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. The number of electronic components constituting the workpiece W is not particularly limited, and is set to one or more.

[0024] In this embodiment, a base resin Rm to which a carrier C is fixed is used as the sealing resin R (details will be described later). As an example, the carrier C is a plate-like member formed of a metal material (e.g., copper, copper alloy, etc.) with a thickness of about 0.1 mm to 0.5 mm, but is not limited thereto.

[0025] In this embodiment, a thermosetting resin (such as, but not limited to, an epoxy resin containing a filler) is used as the base resin Rm and the sealing resin R. A powder resin (powder-like resin) that is a thermosetting resin (property) is preferably used as the base resin Rm (details will be described later). However, the base resin Rm is not limited to this, and a granular resin, a crushed resin, a solid resin, a liquid resin, or a resin that is a combination of two or more of these may be used.

[0026] As examples of the film F, film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, etc. are preferably used. The film F is also used when forming the sealing resin R in the resin forming section 50 described later.

[0027] Next, an overview of the compression molding apparatus 1 according to the present embodiment will be described. As shown in FIG. 1, the compression molding apparatus 1 includes a base resin supply unit 10D that supplies the base resin Rm and the carrier C, a resin forming unit 10E that forms the sealing resin R using the base resin Rm and the carrier C, a supply unit 10A that supplies the workpiece W, a press unit 10B that seals the workpiece W with resin and processes it into a molded product Wp, and a storage unit 10C that stores the molded product Wp. As an example, the base resin supply unit 10D, the resin forming unit 10E, the supply unit 10A, the press unit 10B, and the storage unit 10C are arranged in this order along the X direction in FIG. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units, the arrangement order of the units, and the like may be changed. For example, the supply unit 10A and the storage unit 10C may be arranged in a mutually inverse manner in the X direction, or may be arranged to be concentrated in one of the positions (not shown). In addition, the configuration may include units other than those described above (not shown).

[0028] In addition, the compression molding apparatus 1 has a guide rail 20 linearly provided between each unit, and a conveying device (first loader) 22 for conveying the work W and the sealing resin R (may be used for conveying other than the work W and the sealing resin R) and a conveying device (second loader) 24 for conveying the molded product Wp (may be used for conveying other than the molded product Wp) are provided so as to be movable between predetermined units along the guide rail 20. However, the above configuration is not limited, and a configuration may be provided with a common (single) conveying device (loader) for conveying the work W, the sealing resin R, the molded product Wp, etc. (not shown). Also, the conveying device may be configured to include a robot hand or the like instead of a loader.

[0029] In addition, in the compression molding apparatus 1, a control unit 90 that controls the operation of each mechanism in each unit is disposed in the supply unit 10A (it may be disposed in another unit).

[0030] (Base resin supply unit) Next, the base resin supplying unit 10D provided in the compression molding apparatus 1 will be described.

[0031] The base resin supply unit 10D includes a carrier supply section 30 that supplies the carrier C, and a base resin supply section 40 that supplies the base resin Rm. As an example, the carrier supply section 30 is configured to include a storage section (e.g., a stocker, etc.) in which a plurality of carriers C are stored (a pickup, a stage, etc. may be provided as appropriate). The base resin supply section 40 is configured to include a dispenser that supplies the base resin Rm, a conveying device, etc. When the carrier C and the base resin Rm are conveyed from the base resin supply unit 10D to the resin forming unit 10E, the first loader 22 may be used as the conveying device, or another conveying device (not shown) may be used (direct spraying from a dispenser, etc. may also be adopted for the base resin Rm).

[0032] (Resin Forming Unit) Next, the resin forming unit 10E included in the compression molding apparatus 1 will be described.

[0033] The resin forming unit 10E includes a resin forming section 50 as a device for forming the sealing resin R using the base resin Rm and the carrier C. In the present embodiment, two resin forming units 10E (or three or more or one) are provided, and one resin forming section 50 (or two or more) is provided per resin forming unit 10E (see FIG. 1). However, the present invention is not limited to this configuration.

[0034] The resin forming section 50 is provided with a tableting die (first die) 102 having a pair of dies (for example, a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel are assembled) that are opened and closed. Also, a press device (first press device) 150 that drives the first die 102 to open and close is provided. As an example, the configuration is provided with two first press devices 150, but a configuration may be provided with one device, or a configuration may be provided with multiple devices (three or more devices) (not shown). A side view (schematic diagram) of the first press device 150 is shown in FIG. 2, and a front cross-sectional view (schematic diagram) of the first die 102 is shown in FIG. 3.

[0035] Here, as shown in FIG. 2, the first press apparatus 150 is configured to include a pair of platens 154, 156, a plurality of tie bars 152 on which the pair of platens 154, 156 are supported, and a drive device for moving (raising and lowering) the platen 156. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 162 (however, the present invention is not limited to this). In this embodiment, the platen 154 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 152), and the platen 156 on the lower side is set as a movable platen (a platen slidably held by the tie bars 152 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0036] On the other hand, the first mold 102, as shown in FIG. 3, includes a first upper mold 104 on the vertical side and a first lower mold 106 on the vertical side as a pair of molds disposed between the pair of platens 154, 156 in the first press device 150. The first upper mold 104 is assembled to the upper platen (in this embodiment, the fixed platen 154), and the first lower mold 106 is assembled to the lower platen (in this embodiment, the movable platen 156). The first upper mold 104 and the first lower mold 106 approach and move away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction). In the first mold 102 according to this embodiment, the first upper mold 104 constitutes a so-called "pestle mold", and the first lower mold 106 constitutes a so-called "mortar mold".

[0037] Next, the first lower die 106 of the first mold 102 will be described in detail. As shown in Fig. 3, the first lower die 106 includes a lower die chase (first lower die chase) 110, a cavity piece (first cavity piece) 126 held therein, a clamper (first clamper) 128, and the like. The first lower die chase 110 is fixed to the upper surface of a support plate (first support plate) 114 via a support pillar (first support pillar) 112. A cavity (first cavity) 108 is provided on the upper surface (surface on the first upper die 104 side) of the first lower die 106. One carrier C and a predetermined amount of base resin Rm are accommodated in this first cavity 108.

[0038] The first clamper 128 is annularly configured to surround the first cavity piece 126, and is assembled to be movable up and down while being spaced apart (floating) from the upper surface of the first support plate 114 via a push pin (first push pin) 122 and a clamper spring (first clamper spring) 124 (for example, a biasing member exemplified by a coil spring) (however, the assembly structure is not limited to this). The first cavity piece 126 constitutes the inner part (bottom part) of the first cavity 108, and the first clamper 128 constitutes the side part of the first cavity 108. As an example, the upper surface (surface on the first upper mold 104 side) of the first cavity piece 126 is formed in a flat shape. The shape and number of the first cavities 108 provided in one first lower mold 106 are appropriately set (one or multiple).

[0039] Here, the first press device 150 is provided with a lower die film supply section (first lower die film supply section) 111 that supplies a film F for covering a die surface 106a (predetermined area) including the inner surface of the first cavity 108 in the first lower die 106. Note that, as an example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0040] Furthermore, the first lower mold 106 is provided with suction paths (holes, grooves, etc.) (not shown) communicating with a suction device at the boundaries between the first clamper 128 and the first cavity piece 126, etc. This allows the film F supplied from the first lower mold film supply unit 111 to be adsorbed and held on the mold surface 106a including the inner surface of the first cavity 108.

[0041] In this embodiment, a first lower die heating mechanism (not shown) is provided for heating the first lower die 106 to a predetermined temperature. This first lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the first lower die chase 110 and is configured to apply heat to the entire first lower die 106 and the carrier C and base resin Rm contained in the first cavity 108. At this time, the first lower die 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the thermal curing (main curing) of the base resin Rm is unlikely to proceed.

[0042] Next, the first upper die 104 of the first mold 102 will be described in detail. As shown in FIG. 3, the first upper die 104 has a tableting plate (first plate) 142 held (fixed) by an upper die chase (first upper die chase) 140. This tableting plate (first plate) 142 presses the carrier C and a predetermined amount of base resin Rm contained in the first cavity 108 of the first lower die 106 to form (tablet) the sealing resin R having a predetermined shape to which the carrier C is fixed (the forming method will be described later in detail). As an example, the lower surface of the first plate 142 (the surface on the first lower die 106 side) is formed in a flat shape.

[0043] Here, the first press device 150 is provided with an upper die film supply section (first upper die film supply section) 113 that supplies a film F for covering the die surface 104a (predetermined area) of the first upper die 104. Note that, as an example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0044] Furthermore, the first upper mold 104 has suction paths (holes, grooves, etc.) (not shown) communicating with a suction device provided in the first plate 142, etc. This allows the film F supplied from the first upper mold film supply unit 113 to be adsorbed and held on the mold surface 104a.

[0045] In this embodiment, a first upper die heating mechanism (not shown) is provided for heating the first upper die 104 to a predetermined temperature. This first upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the first upper die chase 140 and is configured to apply heat to the entire first upper die 104. At this time, the first upper die 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which the thermal curing (main curing) of the base resin Rm held (contained) in the first lower die 106 is unlikely to proceed.

[0046] Incidentally, the above-mentioned first mold 102 has a structure having a movable clamper (first clamper 128) as an example, but as another example, it may have a structure not having a movable clamper as shown in FIG.

[0047] (Supply unit) Next, the supply unit 10A included in the compression molding apparatus 1 will be described.

[0048] The supply unit 10A includes a supply magazine 12 that stores a plurality of works W. Here, as the supply magazine 12, a known stack magazine, slit magazine, or the like is used.

[0049] The supply unit 10A may be configured to include a work stage or the like (not shown) on which the work W taken out from the supply magazine 12 is placed. The supply unit 10A may be configured to include a resin stage or the like (not shown) on which the sealing resin R is placed.

[0050] The workpiece W and the sealing resin R are held by a transport device (for example, the first loader 22) and transported to the press unit 10B, and set at a predetermined position in the second die 202 (details of the process will be described later). Note that a known holding mechanism (for example, a clamping configuration with holding claws, a suction hole communicating with a suction device and a suction configuration, etc.) is used as a holding mechanism for the workpiece W and the sealing resin R in the first loader 22 (not shown).

[0051] As a variation of the above-mentioned conveying device, instead of the first loader 22 that moves in the X and Y directions, a separate conveying device (loader) that moves in the X direction to convey between units and a separate conveying device (loader) that moves in the Y direction to load and set into the second mold 202 may be provided (not shown).

[0052] The supply unit 10A also includes a preheater (not shown) for preheating the workpiece W and the sealing resin R. As an example, a known heating mechanism (e.g., an electric wire heater, an infrared heater, etc.) is used for the preheater. This allows the workpiece W and the sealing resin R to be preheated before being carried into the second mold 202. Note that a configuration without a preheater is also possible. Also, instead of or together with the preheater, a configuration in which a heater for preheating (not shown) is provided in the first loader 22 may be used.

[0053] (Press unit) Next, the press unit 10B included in the compression molding apparatus 1 will be described.

[0054] The press unit 10B is provided with a resin sealing section 70 that resin-seals the workpiece W and processes it into a molded product Wp. In this embodiment, two press units 10B (or three or more, or just one) each equipped with the resin sealing section 70 are provided, and one press unit 10B is provided with one resin sealing section 70 (or two or more) (see FIG. 1). However, the present invention is not limited to this configuration.

[0055] The resin sealing section 70 includes a sealing die (second die) 202 having a pair of dies (for example, a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel assembled together) that are opened and closed. Also, a press device (second press device) 250 that drives the second die 202 to open and close is included. As an example, two second press devices 250 are included, but one device or a plurality of devices (three or more devices) may be included (not shown). A side view (schematic diagram) of the second press device 250 is shown in FIG. 5, and a front cross-sectional view (schematic diagram) of the second die 202 is shown in FIG. 6.

[0056] Here, as shown in FIG. 5, the second press machine 250 is configured to include a pair of platens 254, 256, a plurality of tie bars 252 on which the pair of platens 254, 256 are supported, and a drive device for moving (raising and lowering) the platen 256. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262 (however, the present invention is not limited to this). In this embodiment, the platen 254 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 252), and the platen 256 on the lower side is set as a movable platen (a platen slidably held by the tie bars 252 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0057] 6, the second mold 202 includes one mold (second upper mold 204) on the upper side in the vertical direction and the other mold (second lower mold 206) on the lower side as a pair of molds disposed between the pair of platens 254, 256 in the second press device 250. That is, the second upper mold 204 is assembled to the upper platen (in this embodiment, the fixed platen 254), and the second lower mold 206 is assembled to the lower platen (in this embodiment, the movable platen 256). The second upper mold 204 and the second lower mold 206 approach and move away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction).

[0058] Next, the second upper die 204 of the second mold 202 will be described in detail. As shown in Fig. 6, the second upper die 204 includes an upper die chase (second upper die chase) 210, a cavity piece (second cavity piece) 226 held thereby, a clamper (second clamper) 228, and the like. The second upper die chase 210 is fixed to the lower surface of a support plate (second support plate) 214 via a support pillar (second support pillar) 212. A cavity (second cavity) 208 is provided on the lower surface (surface on the second lower die 206 side) of the second upper die 204.

[0059] The second clamper 228 is configured in an annular shape so as to surround the second cavity piece 226, and is assembled to be movable up and down while being spaced (floating) from the lower surface of the second support plate 214 via a push pin (second push pin) 222 and a clamper spring (second clamper spring) 224 (for example, a biasing member exemplified by a coil spring) (however, the assembly structure is not limited to this). The second cavity piece 226 constitutes the inner part (bottom part) of the second cavity 208, and the second clamper 228 constitutes the side part of the second cavity 208. The shape and number of the second cavities 208 provided in one second upper mold 204 are appropriately set according to the shape and number of the workpieces W, etc. (one or multiple).

[0060] Here, the second press device 250 is provided with a film supply section (second upper die film supply section) 213 that supplies a film F for covering a die surface 204a (predetermined area) including the inner surface of the second cavity 208 in the second upper die 204. Note that, as an example, the film F is in a roll shape, but may also be in a rectangular shape.

[0061] Furthermore, the second upper mold 204 is provided with suction paths (holes, grooves, etc.) (not shown) communicating with a suction device on the lower surface of the second clamper 228, the boundary between the second clamper 228 and the second cavity piece 226, etc. This allows the film F supplied from the second upper mold film supply unit 213 to be adsorbed and held on the mold surface 204a including the inner surface of the second cavity 208.

[0062] In this embodiment, a second upper die heating mechanism (not shown) is provided to heat the second upper die 204 to a predetermined temperature. This second upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the second upper die chase 210, and heats the second upper die 204 to a predetermined temperature (e.g., 100°C to 300°C).

[0063] Next, the second lower die 206 of the second mold 202 will be described in detail. As shown in Fig. 6, the second lower die 206 includes a lower die chase (second lower die chase) 240, a lower plate (second plate) 242 held thereby, and the like.

[0064] The second lower die 206 is provided with a workpiece holding section 205 that holds (including placing) the sealing resin R and the workpiece W at a predetermined position on the upper surface of the second plate 242. In this embodiment, the workpiece W is held by the workpiece holding section 205 in a state where it is sandwiched between two sealing resins R that are arranged so that their respective carriers C are on the outside (so that they do not face each other). Note that a known suction device, chuck jaws, or the like can be used as the holding mechanism.

[0065] Here, the second press device 250 is provided with a film supply section (second lower die film supply section) 211 that supplies a film F for covering the die surface 206a (predetermined area) of the second lower die 206. Note that, as an example, the film F is in a roll shape, but may also be in a strip shape.

[0066] In addition, the second lower mold 206 has suction paths (holes, grooves, etc.) (not shown) communicating with a suction device provided in the lower plate (second plate) 242, etc. This allows the film F supplied from the second lower mold film supply unit 211 to be adsorbed and held on the mold surface 206a.

[0067] In this embodiment, a second lower die heating mechanism (not shown) is provided to heat the second lower die 206 to a predetermined temperature. This second lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the second lower die chase 240, and heats the second lower die 206 to a predetermined temperature (e.g., 100°C to 300°C).

[0068] (Storage unit) Next, the storage unit 10C included in the compression molding apparatus 1 will be described.

[0069] The molded product Wp is held by a transport device (for example, the second loader 24), carried out from the second mold 202, and transported to the storage unit 10C. Note that the second loader 24 uses a known holding mechanism for the molded product Wp (for example, a clamping mechanism with holding claws, a suction hole communicating with a suction device for suction, etc.) (not shown).

[0070] As a variation of the above-described conveying device, instead of the second loader 24 that moves in the X and Y directions, a separate conveying device (loader) that moves in the X direction to convey between units and a separate conveying device (loader) that moves in the Y direction to unload from the second mold 202 may be provided (not shown).

[0071] The storage unit 10C may be configured to include a molded product stage (not shown) on which the molded product Wp transferred from the press unit 10B is placed.

[0072] Next, the storage unit 10C includes, as an example, a carrier peeling device 16 that peels off the carrier C from the molded product Wp. If necessary, a reversing mechanism that reverses the top and bottom surfaces of the molded product Wp may be included (not shown). The carrier peeling device 16 may include a mechanism that adsorbs and peels off the carrier C.

[0073] The storage unit 10C also includes, as an example, a cutting device 18 that cuts the molded product Wp at a predetermined position. Specifically, the cutting device 18 cuts the molded product Wp in the thickness direction within the area where the carrier C has been peeled off, and cuts off the outer edge. The cutting device 18 may be a known mechanical cutter or a thermal melting cutter.

[0074] The storage unit 10C also includes a storage magazine 14 that stores the molded product Wp after the carrier C has been peeled off and the predetermined positions have been cut. A known stack magazine or the like can be used for the storage magazine 14. The carrier peeling device 16 and the cutting device 18 may be provided separately instead of being attached to this device, in which case the storage unit 10C may be configured to store the molded product Wp in a state in which it has not been peeled off or cut.

[0075] The carrier C peeled off from the molded product Wp is held by a transport device (for example, the second loader 24) and transported from the storage unit 10C to the resin forming unit 10E (or the base resin supply unit 10D). Note that the configuration may be such that the carrier C is transported by a transport device (not shown) other than the second loader 24. With this configuration, the peeled carrier C can be reused when forming the sealing resin R.

[0076] (Compression molding method) Next, there will be described steps of the compression molding method according to this embodiment, which is carried out using the compression molding apparatus 1. Here, Fig. 7 to Fig. 13 are explanatory views of each step, and are illustrated as front cross-sectional views taken in the same direction as Figs. 3 and 6.

[0077] First, the first preparation step is performed. The first preparation step includes the following steps. A heating step (first lower mold heating step) is performed in which the first lower mold 106 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) and heated by the first lower mold heating mechanism. In addition, a heating step (first upper mold heating step) is performed in which the first upper mold 104 is adjusted to a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, for example, 50°C to 80°C) and heated by the first upper mold heating mechanism. In addition, a lower mold film supply step (first lower mold film supply step) is performed in which the first lower mold film supply unit 111 is operated to supply a new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 106a including the inner surface of the first cavity 108 in the first lower mold 106. In addition, an upper mold film supplying process (first upper mold film supplying process) is performed in which the first upper mold film supplying section 113 is operated to supply new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 104a of the first upper mold 104.

[0078] Before or after the first preparation step, or in parallel with the first preparation step, a resin preparation step is carried out to prepare a base resin Rm having a carrier C fixed thereto as the sealing resin R.

[0079] As an example of the resin preparation step, the carrier C is supplied in the carrier supply section 30. In addition, in the base resin supply section 40, a predetermined amount of base resin Rm is supplied by a dispenser or the like (not shown). Next, in the resin forming section 50, a tableting step is performed in which the carrier C and the base resin Rm are tableted to form a solid sealing resin R formed in a predetermined shape with the carrier C fixed thereto. Note that the term "solid" includes a state in which the resin is melted to the so-called B stage or has already been melted, since the resin is tableted while being heated to a temperature at which hardening does not proceed. As an example, the carrier C is placed in the lower mold 106 before the base resin Rm is supplied, but the carrier C may be attached to the lower side of the film F of the upper mold 104.

[0080] Specifically, in the tableting process, the carrier C supplied from the carrier supply unit 30 is conveyed by a conveying device (e.g., the first loader 22, etc.) and accommodated in a predetermined position (e.g., a central position) in the first cavity 108 of the first lower die 106. Next, a predetermined amount of base resin Rm supplied from the base resin supply unit 40 is conveyed by a conveying device (e.g., the first loader 22, etc.) or directly sprayed from a dispenser or the like and accommodated in the first cavity 108 of the first lower die 106. As an example, in the first cavity 108, the base resin Rm is placed on the carrier C accommodated earlier (see FIG. 7). Next, the first press device 150 is operated to close the first die 102 heated to the above-mentioned predetermined temperature (see FIG. 8). At this time, the first cavity piece 126 rises relatively within the first cavity 108, and the carrier C and base resin Rm are compressed (sandwiched and pressurized) between the first cavity piece 126 and the first plate 142. As a result, a sealing resin R in a solid state that has a predetermined shape with the carrier C fixed thereto and has not been thermally cured (mainly cured) is formed.

[0081] As an example, the above-mentioned "predetermined shape" is a shape in which, as shown in FIG. 9A (a plan view of the exposed surface of the carrier C facing upward) and FIG. 9B (a cross-sectional view of line AA in FIG. 9A), the carrier C is arranged in the center in a plan view, and the base resin Rm (in a solid state after tableting) is arranged on the periphery so as to cover the outer periphery Ca of the carrier C. This can enhance the adhesion between the carrier C and the base resin Rm, and can prevent unintended peeling from occurring. The end portion does not necessarily need to be extended to the outside by the base resin Rm, and as shown in FIG. 9C (a cross-sectional view similar to FIG. 9B), the carrier C and the base resin Rm may be almost the same. Alternatively, a base resin Rm having a recess formed therein may be prepared, and the carrier C may be attached to the recess. Alternatively, a flat-plate-shaped carrier C may be attached to a simple flat-plate-shaped base resin Rm without a recess. The above-mentioned fixing includes sticking.

[0082] It is important that the above-mentioned tableting step is carried out at a temperature at which the thermosetting (main curing) of the base resin Rm does not easily proceed (the first lower die 106 and the first upper die 104 are heated to a temperature at which the thermosetting (main curing) does not easily proceed) so that the formed sealing resin R can be thermoset (main cured) in the subsequent resin sealing step. As described above, the "temperature at which the thermosetting (main curing) does not easily proceed" depends on the material of the base resin Rm, but specifically, it is about 50°C to 80°C (about 70°C in this embodiment).

[0083] In addition, it is preferable to use a powder resin as the base resin Rm. This allows the amount of resin to be adjusted and supplied with greater precision than when granular or crushed resin is used. However, the base resin Rm is not limited to a powder resin.

[0084] As another example of the resin preparation process, sealing resin R having the same configuration as described above may be formed in advance outside the apparatus, and then stored in a stocker or the like, or supplied to this apparatus (compression molding apparatus 1) by a conveying device (not shown).

[0085] After the tableting step, the first mold 102 is opened, and the used film F is separated from the sealing resin R (with the carrier C fixed to the lower surface side) to enable removal of the sealing resin R (first mold opening step) (see FIG. 10). In this embodiment, by providing the lower mold film supplying step and upper mold film supplying step described above, the film F is disposed on both the mold surface 106a of the first lower mold 106 and the mold surface 104a of the first upper mold 104, so that the sealing resin R formed by tableting can be easily released, and damage due to the resin adhering to the mold can be prevented.

[0086] In addition, after or in parallel with the first mold opening process, a film supply process (first lower mold film supply process, first upper mold film supply process) is carried out in which the first lower mold film supply unit 111 and the first upper mold film supply unit 113 are operated to send out the used film F from within the first mold 102 and send and set a new film F into the first mold 102.

[0087] Also, a second preparation step is carried out before, after, or in parallel with the above-mentioned first preparation step. The second preparation step has the following steps. A heating step (second upper mold heating step) is carried out in which the second upper mold 204 is adjusted to a predetermined temperature (for example, 100°C to 300°C) and heated by the second upper mold heating mechanism. Also, a heating step (second lower mold heating step) is carried out in which the second lower mold 206 is adjusted to a predetermined temperature (for example, 100°C to 300°C) and heated by the second lower mold heating mechanism. Also, a lower mold film supplying step (second lower mold film supplying step) is carried out in which the second lower mold film supplying unit 211 is operated to supply new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 106a of the second lower mold 206. In addition, an upper mold film supplying process (second upper mold film supplying process) is performed in which the second upper mold film supplying section 213 is operated to supply new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 204a, including the inner surface of the second cavity 208 in the second upper mold 204.

[0088] After the second preparation step, a setting step is performed in which the sealing resin R and the work W are set in the sealing mold (second mold 202). As shown in Fig. 11, the work W is held (including placed) on the work holder 205 in a state where it is sandwiched between two sealing resins R arranged so that each carrier C is on the outside.

[0089] As an example of the setting step, the first sealing resin R prepared in the resin preparation step is transported by a transport device (e.g., the first loader 22, etc.) and placed on the workpiece holding unit 205 with the surface on which the carrier C is exposed facing down. Next, the workpiece W supplied from the supply magazine 12 is transported by a transport device (e.g., the first loader 22, etc.) and placed on the first sealing resin R. Next, the second sealing resin R prepared in the resin preparation step is transported by a transport device (e.g., the first loader 22, etc.) and placed on the workpiece W with the surface on which the carrier C is exposed facing up.

[0090] Alternatively, as another example of the setting step, the first sealing resin R and the second sealing resin R prepared in the resin preparation step and the workpiece W supplied from the supply magazine 12 are stacked so that the workpiece W is sandwiched between the two (first and second) sealing resins R arranged so that the carriers C are on the outside (i.e., the first sealing resin R is prepared with the surface on which the carrier C is exposed on the lower side, the workpiece W is placed on the first sealing resin R, and the second sealing resin R is placed on the workpiece W with the surface on which the carrier C is exposed on the upper side). Next, the first sealing resin R, the workpiece W, and the second sealing resin R in the stacked state are transported by a transport device (for example, the first loader 22, etc.) and placed on the workpiece holding part 205. In this case, there is an advantage in that the workpiece W and the two sealing resins R are transported to the second mold 202 at one time, rather than being transported separately.

[0091] After all the above steps are performed, a resin sealing step is performed in which the work W is sealed with sealing resin R (sandwiched between two sealing resins R in this embodiment) and processed into a molded product Wp. Specifically, the second mold 202 is closed, and the second cavity piece 226 is lowered relatively in the second cavity 208 to perform a mold closing step (second mold closing step) in which the sealing resin R is heated and pressurized against the work W. This thermally hardens the sealing resin R to complete the resin sealing (compression molding) (see FIG. 12). This forms a molded product Wp having a shape shown in FIG. 14A. In this embodiment, the work W is sandwiched between sealing resins R with carriers C from above and below as shown in FIG. 11 and compressed from above and below. However, as another example, as shown in FIG. 20, the sealing resin R with carriers C may be only one of the top and bottom, and the other may be sealing resin R without carriers C.

[0092] After the second mold closing step, the second mold 202 is opened, and a mold opening step (second mold opening step) is performed in which the molded product Wp is separated from the used film F so that the molded product Wp can be removed (see FIG. 13). Next, a molded product unloading step is performed in which the molded product Wp is unloaded from the second mold 202 by a transport device (e.g., the second loader 24, etc.) and transported to the storage unit 10C.

[0093] After or in parallel with the molded product removal process, the second lower die film supply section 211 and the second upper die film supply section 213 are operated to send out the used film F from the second die 202 and send and set a new film F into the second die 202, thereby carrying out a film supply process (second lower die film supply process, second upper die film supply process).

[0094] After the molded product unloading step, a carrier peeling step is performed in which the carrier C is peeled off from the molded product Wp using a carrier peeling device 16. This results in the formation of a molded product Wp having the shape shown in Fig. 14B. In this step, the molded product Wp may be inverted midway and the upper and lower carriers C may be peeled off in order by one peeling mechanism, or the molded product Wp may not be inverted and the upper and lower carriers C may be peeled off by two peeling mechanisms, respectively.

[0095] After the carrier peeling process, a process is carried out in which the carrier C peeled off from the molded product Wp is transported from the storage unit 10C to the resin forming unit 10E (or the base resin supply unit 10D) by a transport device (e.g., the second loader 24, etc.) (the carrier C can be returned to the resin forming section 50 in the end). Note that, if the carrier C is used as a heat sink or the like in the final product, it is not necessarily necessary to peel off the carrier C.

[0096] According to the above configuration, the carrier C can be reused from the resin preparation process in which the carrier C is peeled off from the molded product Wp and the sealing resin R (i.e., the base resin Rm to which the carrier C is fixed) is prepared (formed). Therefore, it is possible to reduce the manufacturing cost by reducing the number of parts (total number of carriers C required). Also, since it is not necessary to prepare many carriers C in advance, it is possible to miniaturize the device, mainly by reducing the size of the storage section (e.g., a stocker) for the carrier C and the installation space.

[0097] After the carrier peeling step, a cutting step is performed to cut the molded product Wp at a predetermined position (the position indicated by the broken line in FIG. 14B). Specifically, a cutting device 18 is used to cut the molded product Wp in the thickness direction within the region where the carrier C has been peeled off, and cut off the outer edge. This makes it possible to form a molded product Wp (final target shape) having the shape shown in FIG. 14C, i.e., a thin resin thickness (resin thickness at the upper or lower part of the workpiece W).

[0098] After the cutting step, a storing step is performed in which the molded product Wp (in this embodiment, the carrier C is peeled off and the molded product Wp is cut at a predetermined position) is stored in the storage magazine 14. It is also possible to store the molded product Wp without performing the carrier peeling step or the cutting step (i.e., in a state where the molded product Wp has not been peeled off or cut).

[0099] The above are the main steps of the compression molding method performed using the compression molding apparatus 1. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

[0100] As described above, when trying to form a molded product Wp with a resin thickness of 0.4 mm or less after resin sealing (specifically, the thickness Da of the resin part at the upper position of the work W or the thickness Db of the resin part at the lower position as shown in FIG. 14C), the thickness of the sealing resin (solid resin) before resin sealing must also be thin. However, the sealing resin (solid resin) before resin sealing is naturally in a state before it is fully cured, so that it has low rigidity (brittle) and low strength, and therefore there is a problem that it is very likely to break during handling (particularly during transportation). In particular, it has been confirmed that this is more pronounced in the case of sealing resin (solid resin) formed by tableting. In contrast, according to the compression molding device 1 and compression molding method using the sealing resin R according to this embodiment, the problem can be solved, that is, the occurrence of breakage during handling (particularly during transportation) of the sealing resin R can be prevented, and a molded product Wp with a thin resin part can be formed. In addition, it has been verified by the inventor's experiments that a shape of Da = Db = 0.1 mm can also be realized.

[0101] Furthermore, by using the sealing resin R having the above-described configuration, it is possible to solve or reduce problems that were previously encountered with granular resin, such as uneven distribution, residual gas, and dust generation during molding, as well as problems such as difficulty in handling.

[0102] [Second embodiment] Next, a second embodiment of the present invention will be described. The compression molding apparatus 1 and compression molding method according to this embodiment are basically the same as those of the first embodiment described above, but have differences in the configuration of the press unit 10B (particularly, the configuration of the press device and the sealing die) and the process performed mainly by the press unit 10B. Hereinafter, this embodiment will be described focusing on the differences.

[0103] The press unit 10B according to the present embodiment includes a sealing die (third die) 302 having a pair of dies (for example, a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel assembled together) that are opened and closed. The press unit 10B also includes a press device (third press device) 350 that drives the third die 302 to open and close. As an example, in FIG. 1 (shown as a common configuration with the second press device 250), two third press devices 350 are provided, but one or more (three or more) may be provided (not shown). A side view (schematic view) of the third press device 350 is shown in FIG. 15, and a front cross-sectional view (schematic view) of the third die 302 is shown in FIG. 16.

[0104] Here, as shown in FIG. 15, the third press machine 350 is configured to include a pair of platens 354, 356, a plurality of tie bars 352 on which the pair of platens 354, 356 are supported, and a drive device for moving (raising and lowering) the platen 356. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 360 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 362 (however, the present invention is not limited to this). In this embodiment, the platen 354 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 352), and the platen 356 on the lower side is set as a movable platen (a platen slidably held by the tie bars 352 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0105] 16, the third mold 302 includes one mold (third upper mold 304) on the upper side in the vertical direction and the other mold (third lower mold 306) on the lower side as a pair of molds disposed between the pair of platens 354, 356 in the third press device 350. That is, the third upper mold 304 is assembled to the upper platen (in this embodiment, the fixed platen 354), and the third lower mold 306 is assembled to the lower platen (in this embodiment, the movable platen 356). The third upper mold 304 and the third lower mold 306 approach and move away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction).

[0106] Next, the third lower die 306 of the third mold 302 will be described in detail. As shown in Fig. 16, the third lower die 306 includes a lower die chase (third lower die chase) 310, a cavity piece (third cavity piece) 326 held thereby, a clamper (third clamper) 328, and the like. The third lower die chase 310 is fixed to the upper surface of a support plate (third support plate) 314 via a support pillar (third support pillar) 312. A cavity (third cavity) 308 is provided on the upper surface of the third lower die 306 (surface on the third upper die 304 side).

[0107] The third clamper 328 is configured in an annular shape so as to surround the third cavity piece 326, and is assembled to be movable up and down while being spaced apart (floating) from the upper surface of the third support plate 314 via a pushing pin (third pushing pin) 322 and a clamper spring (third clamper spring) 324 (for example, a biasing member exemplified by a coil spring) (however, the assembly structure is not limited to this). The third cavity piece 326 constitutes the inner part (bottom part) of the third cavity 308, and the third clamper 328 constitutes the side part of the third cavity 308. The shape and number of the third cavities 308 provided in one third lower die 306 are appropriately set according to the shape and number of the workpieces W, etc. (one or multiple).

[0108] Here, the third press device 350 is provided with a film supplying section (third lower die film supplying section) 311 that supplies film F for covering die surface 306a (predetermined area) including the inner surface of third cavity 308 in third lower die 306. Note that, as an example, film F is in a roll shape, but may also be in a strip shape.

[0109] Furthermore, the third lower mold 306 is provided with suction paths (holes, grooves, etc.) (not shown) communicating with a suction device on the upper surface of the third clamper 328, on the boundary between the third clamper 328 and the third cavity piece 326, etc. This allows the film F supplied from the third lower mold film supply unit 311 to be adsorbed and held on the mold surface 306a including the inner surface of the third cavity 308.

[0110] In this embodiment, a third lower die heating mechanism (not shown) is provided to heat the third lower die 306 to a predetermined temperature. This third lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the third lower die chase 310, and heats the third lower die 306 to a predetermined temperature (e.g., 100°C to 300°C).

[0111] Next, a detailed description will be given of the third upper die 304 of the third mold 302. As shown in Fig. 16, the third upper die 304 includes an upper die chase (third upper die chase) 340, an upper plate (third plate) 342 held thereby, and the like.

[0112] In this embodiment, a holding part 305 is provided to hold the molded product Wp after resin sealing at a predetermined position on the lower surface of the third plate 342. As an example, the holding part 305 is disposed penetrating the third plate 342 and has a suction passage (hole, groove, etc.) communicating with a suction device (not shown). Specifically, one end of the suction passage is connected to the mold surface 304a of the third upper mold 304, and the other end is connected to a suction device disposed outside the third upper mold 304. This makes it possible to suck the molded product Wp after resin sealing by suctioning it on the mold surface 304a (here, the lower surface of the third plate 342) by driving the suction device and holding it. Instead of the above-mentioned suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that hold the outer periphery of the molded product Wp (not shown). The shape and number of the holding parts 305 provided on one third upper mold 304 are appropriately set (one or multiple).

[0113] Here, the third press device 350 is provided with an upper die film supply section (third upper die film supply section) 313 that supplies film F for covering die surface 304a (predetermined area) of the third upper die 304. Note that, as an example, the film F is in a roll shape, but it may also be in a rectangular shape.

[0114] Furthermore, the third upper mold 304 has suction paths (holes, grooves, etc.) (not shown) communicating with a suction device provided in the third plate 342, etc. This allows the film F supplied from the third upper mold film supply unit 313 to be adsorbed and held on the mold surface 304a.

[0115] In this embodiment, a third upper die heating mechanism (not shown) is provided for heating the third upper die 304 to a predetermined temperature. This third upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the third upper die chase 340, and heats the third upper die 304 to a predetermined temperature (e.g., 100°C to 300°C).

[0116] Next, steps of the compression molding method according to this embodiment performed using the compression molding apparatus 1 having the above configuration will be described. Here, Fig. 17 to Fig. 19 are explanatory views of each step and are illustrated as front cross-sectional views in the same direction as Fig. 16.

[0117] First, a first preparation step is carried out, which is the same as that in the first embodiment.

[0118] Before or after the first preparation step, or in parallel with the first preparation step, a resin preparation step is carried out to prepare a base resin Rm to which a carrier C is fixed as the sealing resin R. The specific steps are the same as those in the first embodiment.

[0119] In addition, in this embodiment, a third preparation step is carried out instead of the above-mentioned second preparation step. The third preparation step includes the following steps. A heating step (third upper mold heating step) is carried out in which the third upper mold 304 is adjusted to a predetermined temperature (for example, 100°C to 300°C) and heated by the third upper mold heating mechanism. A heating step (third lower mold heating step) is carried out in which the third lower mold 306 is adjusted to a predetermined temperature (for example, 100°C to 300°C) and heated by the third lower mold heating mechanism. A lower mold film supplying step (third lower mold film supplying step) is carried out in which the third lower mold film supplying unit 311 is operated to supply a new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 306a including the inner surface of the third cavity 308 in the third lower mold 306. In addition, the third upper mold film supply unit 313 is operated to supply new film F and an upper mold film supplying process (third upper mold film supplying process) is performed in which the film F is adsorbed so as to cover a predetermined area of ​​the mold surface 304a of the third upper mold 304.

[0120] After the third preparation step, a setting step is performed in which the sealing resin R and the work W are set in the sealing mold (third mold 302). As shown in Fig. 17, the work W is sandwiched between two sealing resins R arranged so that the carriers C are on the outside, and is held (including placed) in the third cavity 308 (on the third cavity piece 326).

[0121] As an example of the setting step, the first sealing resin R prepared in the resin preparation step is transported by a transport device (e.g., the first loader 22, etc.) and placed in the third cavity 308 (on the third cavity piece 326) with the surface on which the carrier C is exposed facing down. Next, the work W supplied from the supply magazine 12 is transported by a transport device (e.g., the first loader 22, etc.) and placed on the first sealing resin R. Next, the second sealing resin R prepared in the resin preparation step is transported by a transport device (e.g., the first loader 22, etc.) and placed on the work W with the surface on which the carrier C is exposed facing up.

[0122] Alternatively, as another example of the setting step, the first sealing resin R and the second sealing resin R prepared in the resin preparation step and the workpiece W supplied from the supply magazine 12 are stacked so that the workpiece W is sandwiched between the two (first and second) sealing resins R arranged so that the carriers C are on the outside (i.e., the first sealing resin R is prepared with the surface on which the carrier C is exposed facing down, the workpiece W is placed on the first sealing resin R, and the second sealing resin R is placed on the workpiece W with the surface on which the carrier C is exposed facing up). Next, the first sealing resin R, the workpiece W, and the second sealing resin R in the stacked state are transported by a transport device (for example, the first loader 22, etc.) and placed in the third cavity 308 (on the third cavity piece 326). In this case, there is an advantage in that the workpiece W and the two sealing resins R are transported to the third mold 302 at one time, rather than being transported separately.

[0123] After all of the above steps are performed, a resin sealing step is performed in which the workpiece W is sealed with sealing resin R (sandwiched between two sealing resins R in this embodiment) and processed into a molded product Wp. Specifically, the third mold 302 is closed, and the third cavity piece 326 is relatively raised in the third cavity 308 to perform a mold closing step (third mold closing step) in which the sealing resin R is heated and pressurized against the workpiece W. This thermally hardens the sealing resin R, completing the resin sealing (compression molding) (see FIG. 18). The configuration of the molded product Wp is the same as that of FIG. 14A.

[0124] After the third mold closing step, the third mold 302 is opened, and a mold opening step (third mold opening step) is performed in which the molded product Wp is separated from the used film F so that the molded product Wp can be removed (see FIG. 19). Next, a molded product unloading step is performed in which the molded product Wp is unloaded from the third mold 302 by a transport device (e.g., the second loader 24, etc.) and transported to the storage unit 10C.

[0125] After or in parallel with the molded product removal process, the third lower die film supply unit 311 and the third upper die film supply unit 313 are operated to send out the used film F from the third die 302 and send and set new film F into the third die 302, thereby carrying out a film supply process (third lower die film supply process, third upper die film supply process).

[0126] In addition, after the molded product unloading process, a carrier peeling process is performed (the structure of the molded product Wp is the same as that of FIG. 14B). In addition, after the carrier peeling process, a cutting process is performed (the structure of the molded product Wp is the same as that of FIG. 14C). In addition, after the cutting process, a storage process is performed. All of these are specifically similar to those of the first embodiment. In addition, the carrier peeling process or the cutting process can be omitted.

[0127] Other configurations according to this embodiment are similar to those of the first embodiment described above, and therefore repeated description will be omitted.

[0128] The second embodiment described above can also provide the same effects as the first embodiment described above.

[0129] As described above, according to the present invention, it is possible to prevent molding defects caused by uneven spreading of the sealing resin, residual gas, and dust generation during molding. In addition, it is possible to facilitate handling of the sealing resin, and it is possible to prevent the sealing resin from breaking during handling, especially when forming a thin molded product with a resin part having a thickness of 0.4 mm or less. In addition, by applying this to a configuration in which a cavity is provided in the upper mold and a workpiece is held by the lower mold, it is possible to solve problems such as the workpiece falling.

[0130] Furthermore, since the carrier can be reused from the resin preparation process in which the carrier is peeled off from the molded product and the sealing resin is prepared (formed), it is possible to reduce manufacturing costs by reducing the number of parts and to miniaturize the device, which mainly consists of the carrier storage section.

[0131] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. [Explanation of symbols]

[0132] 1. Compression molding equipment 16 Carrier peeling device 18 Cutting device 102 Tablet mold (first mold) 202 Sealing mold (second mold) 302 Sealing mold (third mold) C Career F Release Film R Sealing resin Rm Base Resin Double work

Claims

1. A compression molding apparatus that uses a sealing die having an upper die and a lower die to seal a workpiece with a sealing resin and process it into a molded product, As the sealing resin, a base resin to which a carrier is fixed is used, A carrier removing device is provided for removing the carrier from the molded product. A compression molding apparatus comprising:

2. A compression molding apparatus that uses a sealing die having an upper die and a lower die to seal a workpiece with a sealing resin and process it into a molded product, As the sealing resin, a base resin to which a carrier is fixed is used, The carrier constitutes a heat sink in the molded product. A compression molding apparatus comprising:

3. The sealing resin is a solid resin formed into a predetermined shape by compressing a powder resin into tablets and fixing the carrier thereto.

3. The compression molding apparatus according to claim 1 or 2,

4. A conveying device is provided for conveying the carrier peeled off from the molded product to return it to an apparatus for forming the sealing resin.

2. The compression molding apparatus according to claim 1,

5. The molded product is provided with a cutting device for cutting the area from which the carrier has been peeled in the thickness direction to remove the outer edge portion.

2. The compression molding apparatus according to claim 1,

6. A compression molding method for molding a workpiece into a molded product by sealing the workpiece with a sealing resin using a sealing die having an upper die and a lower die, a resin preparation step of preparing a base resin having a carrier fixed thereto as the sealing resin; a conveying step of conveying the sealing resin into the sealing die; a resin sealing process in which the sealing mold is closed to seal the workpiece with the sealing resin and process the workpiece into the molded product; and a carrier peeling step of peeling the carrier from the molded product. A compression molding method comprising the steps of:

7. A compression molding method for molding a workpiece into a molded product by sealing the workpiece with a sealing resin using a sealing die having an upper die and a lower die, a resin preparation step of preparing a base resin having a carrier fixed thereto as the sealing resin; a conveying step of conveying the sealing resin into the sealing die; a resin sealing process in which the sealing mold is closed to seal the workpiece with the sealing resin and process the molded product, The carrier constitutes a heat sink in the molded product. A compression molding method comprising the steps of:

8. The resin preparation step includes a step of forming the sealing resin in a compression molding device, or a step of forming the sealing resin outside the compression molding device and supplying it into the compression molding device. The compression molding method according to claim 6 or 7, characterized in that

9. The sealing resin is a solid resin formed into a predetermined shape by compressing a powder resin into tablets and fixing the carrier thereto. The compression molding method according to claim 6 or 7, characterized in that

10. The method further includes a step of returning the carrier peeled off from the molded product to an apparatus for forming the sealing resin and using the carrier again when forming the sealing resin. The compression molding method according to claim 6,

11. The molded product may further include a step of cutting the molded product in a thickness direction within the region from which the carrier has been peeled off to remove an outer edge portion. The compression molding method according to claim 6,

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