Electronic control device

Abstract

To provide an electronic control device capable of improving relative position accuracy of two connectors to be connected.SOLUTION: An electronic control device comprises: a base substrate that includes a first connector 611; an electronic device 100 that is mounted in a direction orthogonal to the base substrate, and includes a second connector 113 which is mounted on a wiring substrate 111 and electrically connected to the first connector; and a positioning member 510 that positions the first and second connectors. The positioning member comprises: a first projection 520 that is inserted into a first positioning hole 612 that is provided along a thickness direction of the base substrate; and a second projection part 531 that is inserted into a second positioning hole 115 that is provided along a flat surface direction of the wiring substrate, and is provided on the same axis with a center axis of the first projection part.SELECTED DRAWING: Figure 26

Description

[Technical field]

[0001] The present disclosure relates to electronic control devices. [Background technology]

[0002] Patent Document 1 discloses a configuration in which a printed circuit board is held on a backboard via a support. The support has a base side and a pair of side sides perpendicular to the base side. The base side has contact pins and a housing capable of receiving a connector on the printed circuit board side. The side sides have ventilation holes and guide grooves for inserting the printed circuit board on opposing surfaces.

[0003] The support is positioned by inserting the contact pins into the through holes in the backboard. Meanwhile, the printed circuit board is inserted into the guide groove of the support protruding from the backboard. The guide groove also prevents the printed circuit board from moving up and down, allowing it to slide only in the longitudinal direction. The connector of the printed circuit board then fits into the contact pins on the support. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 8-204363 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, an electronic control device may be configured to position a connector on a main board such as a backboard and a connector on a sub-board such as a printed circuit board using a positioning member. However, even if the electronic control device uses a positioning member, the relative positional accuracy of the two connectors may be reduced depending on the position of the reference for positioning the positioning member and the main board and the reference for positioning the positioning member and the sub-board. In addition, further improvements are required for electronic control devices in the above-mentioned respects and in other respects not mentioned.

[0006] One disclosed object is to provide an electronic control device that can improve the relative positional accuracy of two connected connectors. [Means for solving the problem]

[0007] The electronic control device disclosed herein comprises: A base substrate (600) having a first connector (611); An electronic device (100) that is mounted in a direction substantially perpendicular to a base substrate and has a wiring board (111) and a second connector (113) that is provided on the wiring board and electrically connected to the first connector; a positioning member (510) disposed between the base substrate and the electronic device for positioning the first connector and the second connector; The positioning member is a first protrusion (520) for positioning with the base substrate, inserted into a first positioning hole (612) provided along the thickness direction of the base substrate; The wiring board is characterized by being provided with a second protrusion (531) for positioning with the wiring board, which is inserted into a second positioning hole (115) provided along the planar direction of the wiring board.

[0008] In this way, the electronic control device includes the first protrusion for positioning the base substrate and the positioning member, and the second protrusion for positioning the electronic device and the positioning member, thereby improving the relative positional accuracy of the first connector and the second connector.

[0009] The aspects disclosed in this specification adopt different technical means to achieve their respective objectives. The claims and the parenthetical symbols described in this section are illustrative of the corresponding relationship with the embodiments described below, and are not intended to limit the technical scope. The objectives, features, and effects disclosed in this specification will become clearer by referring to the following detailed description and the attached drawings. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a perspective view showing a schematic configuration of an electronic control device. [Diagram 2] FIG. 2 is a perspective view showing a state in which the electronic device of the electronic control device is removed. [Diagram 3] FIG. 2 is an exploded perspective view showing a schematic configuration of an electronic control device. [Figure 4] FIG. 1 is an exploded perspective view showing a schematic configuration of an electronic device. [Diagram 5] FIG. 2 is a plan view showing a schematic configuration of a circuit board. [Figure 6] FIG. 2 is a perspective view showing a schematic configuration of a case. [Figure 7] FIG. 2 is a perspective view showing a schematic configuration of a rear part of the case. [Figure 8] FIG. 2 is a perspective view showing a schematic configuration of an electronic device and a cooling plate. [Figure 9] FIG. 2 is a perspective view showing a schematic configuration of a slide member. [Figure 10] FIG. 2 is a perspective view showing a schematic configuration of a slider. [Figure 11] FIG. 2 is a perspective view showing a schematic configuration of a slider. [Figure 12] FIG. 4 is a cross-sectional view showing a schematic configuration of a slide member. [Figure 13] FIG. 4 is a perspective view showing a holding structure of a cooling plate. [Figure 14] FIG. 2 is a perspective view showing a schematic configuration of a holding member and a movable member. [Figure 15] FIG. 2 is a plan view showing a schematic configuration of a holding member and a movable member. [Figure 16] FIG. 2 is a perspective view showing a schematic configuration of a movable member. [Figure 17] FIG. 2 is a perspective view showing a schematic configuration of a positioning member and a base substrate. [Figure 18] FIG. 2 is a perspective view showing a schematic configuration of a positioning member. [Figure 19] FIG. 19 is an enlarged view of portion XIX of FIG. 18. [Figure 20] 20 is a cross-sectional view taken along the line XX-XX in FIG. 19. [Figure 21]FIG. 2 is a perspective view showing a schematic configuration of a positioning member, a base substrate, and an electronic device. [Figure 22] FIG. 2 is an enlarged perspective view showing a schematic configuration of a positioning member; [Diagram 23] 2 is a perspective view showing a schematic configuration of a positioning member, a base substrate, and a wiring substrate; FIG. [Figure 24] FIG. 24 is a cross-sectional view taken along line XXIV-XXIV in FIG. 23. [Diagram 25] 11 is an image diagram illustrating positioning by a second positioning unit. FIG. [Figure 26] 11 is an image diagram illustrating positioning by a first positioning unit. FIG. [Figure 27] FIG. 13 is an image diagram illustrating the installation of an electronic device. [Figure 28] FIG. 13 is an image diagram illustrating the installation of an electronic device. [Figure 29] FIG. 13 is an image diagram illustrating removal of the electronic device. [Diagram 30] FIG. 13 is a perspective view showing a holding member and a movable member in a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the following, three mutually orthogonal directions are referred to as the X direction, the Y direction, and the Z direction. One of the X directions, X1, is the first outward direction, and the other, X2, is the second outward direction. One of the Y directions, Y1, is the mounting direction, and the other, Y2, is the removal direction. One of the Z directions, Z1, is the upward direction, and the other, Z2, is the downward direction.

[0012] The Z direction is a direction perpendicular to the mounting direction Y1, and corresponds to the thickness direction of the electronic device 100. The Y direction corresponds to the thickness direction of the base substrate 600. The X direction can also be said to be the left-right direction. In this case, the first outer direction X1 is the right direction, and the second outer direction X2 is the left direction. The thickness direction of the base substrate 600 is the same as the insertion direction of the board-to-board connector 611 and the board-to-board connector 113.

[0013] <Electronic control device> The overall configuration of the electronic control device 1000 will be described with reference to Figures 1 to 3. As shown in Figures 1 and 3, the electronic control device 1000 includes an electronic device 100, a heat conductive member 150, a rack 200, a cooling member 300, movable members 410 and 420, a positioning structure 500 (positioning member 510), a base substrate 600, and the like.

[0014] The electronic control device 1000 is configured to be mountable on a moving object such as a vehicle. The vehicle may be, for example, a gasoline vehicle, a diesel vehicle, a hybrid vehicle, an electric vehicle, a fuel cell vehicle, etc. The moving object may also be an air vehicle other than a vehicle.

[0015] Each electronic device 100 may have a function as a control device. In other words, the electronic control device 1000 can be referred to as a collective control device, a control device cluster, or the like.

[0016] In the electronic control device 1000, a plurality of electronic devices 100 are stacked in the Z direction. In the following, of two electronic devices 100 arranged adjacent to each other in the Z direction, the upper electronic device 100 is referred to as the upper electronic device, and the lower electronic device 100 is referred to as the lower electronic device. In other words, of the two electronic devices 100, the electronic device 100 arranged relatively on the upward Z1 side is the upper electronic device, and the electronic device 100 arranged relatively on the downward Z2 side is the lower electronic device.

[0017] The electronic devices 100 are configured to be mountable to the rack 200. The electronic devices 100 are configured to be removable from the rack 200. The electronic devices 100 are mounted to the rack 200 by moving them in a mounting direction Y1. The electronic devices 100 are also mounted to the rack 200 by being inserted into the rack 200. The electronic devices 100 are removed from the rack 200 by moving them in a removal direction Y2. In other words, the electronic devices 100 are configured to be replaceable.

[0018] The electronic device 100 can also be called a replaceable ECU, etc. ECU is an abbreviation for Electronic Control Unit.

[0019] The electronic devices 100 are electrically connected to the base substrate 600 in a state where they are attached to the rack 200. The electronic devices 100 are mounted in a direction perpendicular to the base substrate 600. Note that the term "perpendicular" here includes a relationship in which the electronic devices 100 and the base substrate 600 are not perpendicular to each other to within an error range. Therefore, the electronic devices 100 can be said to be mounted in a direction approximately perpendicular to the base substrate 600.

[0020] The state in which the electronic device 100 is attached to the rack 200 is referred to as an attached state. In the attached state, the electronic device 100 is fixed to the rack 200. In addition, in the attached state, the cooling plate 330, which will be described later, moves in the downward direction Z2. Furthermore, in the attached state, the heat conductive member 150 is compressed by the electronic device 100 and the cooling plate 330.

[0021] A state in which the electronic device 100 is merely inserted into the rack 200 is referred to as an inserted state. In the inserted state, the cooling plate 330 has not moved in the downward direction Z2. A state in which the electronic device 100 is not attached to the rack 200 is also referred to as a non-attached state. In the non-attached state, the electronic device 100 is not inserted into the rack 200. The electronic device 100 will be described in detail later.

[0022] 3, the rack 200 includes a rack side 210, a rack front 220, a rack top 230, a rack bottom 240, and a rack back 250. Furthermore, the rack 200 includes a retaining member 260.

[0023] The rack 200 has a frame made up of rack side parts 210, rack front part 220, and rack back part 250. The rack 200 has a rack top part 230 and a rack bottom part 240 provided on the upper and lower sides of the frame as covers. The rack top part 230 and the rack bottom part 240 are fixed to the frame by screws, welding, or the like. The rack 200 forms an insertion space IN1 in which the electronic device 100 is placed by the frame, rack top part 230, and rack bottom part 240.

[0024] The rack side portion 210 has two Z-direction sides extending along the Z direction and a Y-direction side portion extending along the Y direction connecting the two Z-direction sides. The Z-direction side portion and the Y-direction side portion are fixed by screwing, welding, or the like. The rack side portions 210 are provided in pairs in the X direction so as to sandwich the electronic device 100 therebetween. Furthermore, a part of the cooling member 300 is disposed between the two Z-direction sides.

[0025] A holding member 260 is fixed to the rack side portion 210. The holding member 260 is a portion that holds the movable members 410, 420 in a state in which the movable members 410, 420 are movable in the Z direction. In other words, the movable members 410, 420 are configured to be movable in the Z direction relative to the holding member 260. In addition, the movable members 410, 420 are fixed to the cooling plate 330 of the cooling member 300. Therefore, the holding member 260 can be said to be a portion that holds the cooling plate 330 in a state in which the cooling plate 330 is movable in the Z direction. The cooling plate 330 is configured to be movable in the Z direction together with the movable members 410, 420.

[0026] The holding member 260 is provided individually for each electronic device 100. The movable members 410, 420 are provided individually for each electronic device 100. The holding member 260 and the movable members 410, 420 will be described in detail later.

[0027] The rack front part 220 has two Z-direction front parts along the Z direction and an X-direction front part along the X direction connecting them. The Z-direction front part and the X-direction front part are fixed by screws, welding, etc. An insertion opening IN2 for the electronic device 100 is formed between the two Z-direction front parts.

[0028] The rack back portion 250 has two Z-direction back portions along the Z direction and two X-direction back portions along the X direction that connect them. The Z-direction back portions and the X-direction back portions are fixed by screws, welding, etc. Also, a part of the positioning structure 500 is disposed in an opening surrounded by the two Z-direction back portions and the two X-direction back portions.

[0029] 12, the rack back 250 is provided with a fixing portion 251 for fixing the push-back member 142. The fixing portion 251 is provided with a female screw that engages with a male screw provided at the tip of the push-back member 142. The push-back member 142 will be described in detail later.

[0030] The rack 200 has a four-tier configuration capable of accommodating four electronic devices 100. However, the rack 200 may be configured to accommodate five or more electronic devices 100. The rack 200 may be configured to accommodate three or fewer electronic devices 100. In other words, the rack 200 may be configured to accommodate only one electronic device 100. Thus, the electronic control device 1000 may be one equipped with a plurality of electronic devices 100 or one equipped with only one electronic device 100.

[0031] 2 and 3, the cooling member 300 includes an inlet portion 310, an outlet portion 320, a cooling plate 330, a back portion 340, and a cooling hose 350. The cooling member 300 is provided to cool the electronic device 100. The cooling member 300 is mainly intended to cool the heat-generating components 112 of the electronic device 100.

[0032] The cooling plates 330 are provided individually for each electronic device 100. The cooling member 300 includes four cooling plates 330. The four cooling plates 330 are stacked and arranged along the Z direction. One electronic device 100 is arranged between the cooling plates 330. Note that the space between the cooling plates 330 refers to the space between two cooling plates 330 adjacent to each other in the Z direction.

[0033] However, the number of cooling plates 330 is not limited to four. The cooling member 300 only needs to include the same number of cooling plates 330 as the number of electronic devices 100 that can be accommodated in the rack 200.

[0034] The cooling member 300 mainly cools the electronic device 100 with a cooling plate 330. The cooling plate 330 is mainly composed of a metal with high thermal conductivity such as aluminum. The cooling plate 330 has a coolant space formed therein through which a liquid coolant such as cooling water flows.

[0035] The cooling plate 330 is disposed opposite the surface on the downward direction Z2 side, with the electronic device 100 to be cooled being disposed thereon. Thus, the electronic control device 1000 is disposed in the downward direction Z2 in the following order: the cooling plate 330, and the electronic device 100 to be cooled by the cooling plate 330. In other words, the cooling plate 330 is disposed in the opposite direction to the direction of gravity relative to the electronic device 100 to be cooled. This allows the cooling plate 330 to suppress the generation of an air layer between the liquid refrigerant and the electronic device 100.

[0036] 2, the surface of the cooling plate 330 on the downward direction Z2 side is the opposing surface SF4. On the other hand, the surface of the electronic device 100 facing the cooling plate 330 is the opposing surface SF1. The opposing surface SF1 is the surface of the electronic device 100 on the upward direction Z1 side. Therefore, in the attached state, the electronic device 100 and the cooling plate 330 are disposed such that the opposing surfaces SF1 and SF4 face each other. The opposing surfaces SF1 and SF4 are, for example, flat surfaces.

[0037] The cooling plate 330 is provided with an inlet portion 310 on one side in the X direction and an outlet portion 320 on the other side. The liquid coolant flows from the inlet portion 310 into the coolant space, flows through the coolant space, and is discharged from the outlet portion 320. The positional relationship between the inlet portion 310 and the outlet portion 320 may be reversed.

[0038] The inlet portion 310 and the outlet portion 320 have a refrigerant flow path through which a liquid refrigerant flows. A cooling hose 350 having a refrigerant flow path is attached to the inlet portion 310 and the outlet portion 320.

[0039] The cooling hoses 350 are attached to the inlet portion 310 and the outlet portion 320 of each cooling plate 330. One end of the cooling hoses 350 is attached to the inlet portion 310 or the outlet portion 320, and the other end is attached to the back portion 340. The back portion 340 has a refrigerant flow path through which the liquid refrigerant supplied to the cooling plate 330 flows, and a refrigerant flow path through which the liquid refrigerant discharged from the cooling plate 330 flows.

[0040] 3, the cooling plate 330 has movable members 410, 420 attached to its four corners. The cooling plate 330 has the movable members 410, 420 attached to its both ends in the X direction in the front-rear direction in the Y direction. The movable members 410, 420 are fixed to the cooling plate 330 by screws, welding, or the like.

[0041] As described above, the cooling plate 330 is configured to be movable in the Z direction. That is, the cooling plate 330 is movable in the Z direction relative to the rack 200 (holding member 260). It can also be said that the cooling plate 330 is attached to the rack 200 in a state in which it is movable in the thickness direction Z perpendicular to the attachment direction Y1. For this reason, the cooling hose 350 is made of a deformable member such as rubber.

[0042] The movable members 410 and 420 are attached to the rack 200 at positions that sandwich the electronic device 100. The movable members 410 and 420 have protrusions 417 and 427 that protrude toward the electronic device 100. The movable members 410 and 420 will be described in detail later.

[0043] 2 and 3, rear part 340 is attached to the back side of rack 200 in attachment direction Y1. Rear part 340 is attached to rack 200 with positioning member 510 and base substrate 600 disposed between rear part 340 and rack back part 250.

[0044] The positioning member 510 is disposed between the base substrate 600 and the plurality of electronic devices 100. The positioning member 510 is a member that positions the inter-board connector 611 of the base substrate 600 and the inter-board connector 113 of the electronic device 100. The positioning member 510 and the base substrate 600 will be described in detail later. The inter-board connector 611 corresponds to a first connector. The inter-board connector 113 corresponds to a second connector.

[0045] 2, the heat conductive member 150 is provided in a state of contact with the electronic device 100 in the unattached state and the inserted state. That is, the heat conductive member 150 is not in contact with the cooling plate 330 in the unattached state and the inserted state. The heat conductive member 150 is provided individually for each electronic device 100. The heat conductive member 150 is also sometimes referred to as a TIM (Thermal Interface Material).

[0046] Moreover, the heat conduction member 150 is disposed between the electronic device 100 and the cooling plate 330 in the attached state. Furthermore, the heat conduction member 150 is also in contact with the cooling plate 330 in the attached state. Therefore, the heat conduction member 150 is disposed in a state of contact with the opposing surfaces SF1 and SF4. The heat conduction member 150 is pressed (compressed) by the electronic device 100 and the cooling plate 330 in the attached state. Note that the heat conduction member 150 is disposed between the cooling plate 330 and the electronic device 100 that is to be cooled by the cooling plate 330.

[0047] The thermal conductive member 150 is a member for facilitating the transfer of heat from the electronic device 100 to the cooling plate 330. The thermal conductive member 150 can also be said to be a member for lowering the thermal resistance between the electronic device 100 and the cooling plate 330. The thermal conductive member 150 is an elastically deformable sheet-like member. The thermal conductive member 150 can also be gel, grease, or the like. The thermal conductive member 150 will be described in detail later.

[0048] <Electronic equipment> The electronic devices 100 will be described with reference to Figs. 4 to 8. Each electronic device 100 has a similar configuration. However, each electronic device 100 has a different circuit configuration and processing content. As shown in Figs. 4 and 5, the electronic device 100 includes a circuit board 110 and a case that houses the circuit board 110.

[0049] The circuit board 110 includes a wiring board 111, a heat generating component 112 as an electronic component, an inter-board connector 113, an external connector 114, and the like. The wiring board 111 has conductive wiring provided on an electrically insulating base material such as resin. The wiring board 111 has one surface SF2 and an opposite surface SF3 of the surface SF2. The wiring board 111 is a so-called printed circuit board. In an attached state, the wiring board 111 is disposed along the XY plane. The XY plane is a plane defined by an X axis extending in the X direction and a Y axis extending in the Y direction.

[0050] Circuit elements including heat-generating components 112 are mounted on wiring board 111. The circuit elements are electrically connected to wiring on wiring board 111. Heat-generating components 112 are circuit elements that generate heat when in operation. Heat-generating components 112 are, for example, SoCs (System on a chip) and semiconductor switching elements such as MOSFETs and IGBTs. Circuit elements other than heat-generating components 112 may be mounted on wiring board 111.

[0051] Heat-generating component 112 is mounted, for example, on the surface opposing opposing surface SF1 of wiring board 111. This is preferable because heat-generating component 112 can be cooled efficiently.

[0052] An inter-board connector 113 is mounted on the wiring board 111 and is used for electrical connection with the base substrate 600. The inter-board connector 113 is electrically connected to the wiring and circuit elements of the wiring board 111. The inter-board connector 113 is electrically connected to an inter-board connector 611 of the base substrate 600. The inter-board connectors 113, 611 are sometimes referred to as board-to-board connectors (BtoB). Note that the inter-board connectors 113, 611 are electrically connected by inserting one into the other.

[0053] For example, a floating connector can be used as the inter-board connector 113, 611. In this case, at least one of the inter-board connectors 113, 611 has a floating mechanism that can move in two directions perpendicular to the connection direction. This allows the inter-board connectors 113, 611 to absorb any misalignment that may occur when connecting. The connection direction of the inter-board connectors 113, 611 is the Y direction.

[0054] An external connector 114 is mounted on the wiring board 111 and is used for electrical connection to an external device provided outside the electronic control device 1000. The external connector 114 is electrically connected to the wiring and circuit elements of the wiring board 111.

[0055] Wiring board 111 is provided with positioning slits 115. Positioning slits 115 are provided for positioning in the X direction in inter-board connectors 113, 611. Positioning slits 115 correspond to second positioning holes.

[0056] In at least the attached state, the first positioning portion 530 of the positioning member 510 is disposed in the positioning slit 115. Furthermore, the positioning member 510 gradually enters the positioning slit 115 when the electronic device 100 is moved in the attachment direction Y1.

[0057] The positioning slit 115 is provided along the planar direction of the wiring board 111. The positioning slit 115 is a hole penetrating the wiring board 111 in the plate thickness direction (Z direction). The positioning slit 115 has an opening in one of the side walls of the wiring board 111. The positioning slit 115 can also be said to be a notch provided along the mounting direction Y1. The positioning slit 115 has a chamfered portion 115a at the opening end. This makes it easier for the positioning member 510 to enter the positioning slit 115. The plate thickness direction of the wiring board 111 corresponds to the distance between one surface SF2 and the opposite surface SF3. The planar direction of the wiring board 111 is the same as the insertion direction of the board-to-board connector 611 and the board-to-board connector 113.

[0058] As shown in Figures 4, 6 and 7, the case includes a base 120 on which the circuit board 110 is mounted, and a cover that covers the circuit board 110. The circuit board 110 is fixed to the base 120 by screws, adhesive or the like. The case forms a storage space for the circuit board 110 by assembling the base 120 and the cover. The base 120 and the cover are fixed by screws, adhesive or the like. The case corresponds to a housing.

[0059] The cover includes a case upper part 130, a guide holding part 131, a removal opening 132, a case back part 133, and screw holes 134. The cover is recessed so as to cover the circuit board 110. The case upper part 130 is disposed opposite one surface SF2 of the wiring board 111. The base 120 is disposed opposite the opposite surface SF3.

[0060] Furthermore, case upper portion 130 includes a portion facing heat-generating component 112. The surface of case upper portion 130 is facing surface SF1. As shown in Fig. 8, in the mounted state of electronic device 100, cooling plate 330 is disposed on facing surface SF1.

[0061] As shown in Figs. 4 and 6, the guide holding portion 131 is provided continuous with the case upper portion 130. The guide holding portion 131 is provided on both ends of the cover in the X direction. The guide holding portion 131 constitutes a side wall along the Y direction of the cover. The guide holding portion 131 is a groove in which the slide member 140 is disposed. The electronic device 100 is provided with the slide member 140 on both ends in the X direction. The guide holding portion 131 can also be called a slide holding portion.

[0062] The slide member 140 includes a slider 141. Therefore, it can be said that the slider 141 is disposed in the guide holding portion 131. The slide member 140 will be described in detail later.

[0063] The guide holding portion 131 is provided with a removal opening 132 at its end in the Y direction. The removal opening 132 is an opening for exposing the push-back member 142 of the slide member 140. In other words, the removal opening 132 is provided so that one end of the push-back member 142 is exposed to the outside of the cover.

[0064] 7, the case back 133 is a side wall on the Y direction side. The case back 133 is provided to be continuous with the case upper part 130. Note that Fig. 7 shows a state in which the circuit board 110 is housed in the case.

[0065] Case back 133 is provided with first opening 133a, second opening 133b, and connection opening 133c. Each of openings 133a to 133c is a hole penetrating case back 133 in the plate thickness direction. Therefore, in FIG. 7, wiring board 111 can be seen from each of openings 133a to 133c.

[0066] First opening 133a is an opening in which first positioning portion 530 of positioning member 510 is disposed, at least in the attached state. First opening 133a is an opening for disposing first positioning portion 530 of positioning member 510 disposed outside electronic device 100 on the housing space side.

[0067] The second opening 133b is an opening in which a part of the second positioning part 540 is disposed, at least in the attached state. The second opening 133b is an opening for disposing a part of the second positioning part 540 of the positioning member 510 disposed outside the electronic device 100 on the accommodation space side.

[0068] The connection opening 133c is an opening for connecting the inter-board connectors 113, 611. In other words, the connection opening 133c is a mechanism for connecting the inter-board connector 113 of the circuit board 110 arranged in the accommodation space and the inter-board connector 611 of the base substrate 600 arranged outside the electronic device 100. In the attachment state, at least one of the inter-board connectors 113, 611 is disposed in the connection opening 133c.

[0069] The screw holes 134 are holes into which fixing screws 1 are inserted for fixing the electronic device 100 to the rack 200. In the attached state, the electronic device 100 is fixed to the rack 200 by the fixing screws 1 and the push-back members 142. Note that the method of fixing the electronic device 100 to the rack 200 is not limited to the above.

[0070] <Slide component> The sliding members 140 will be described with reference to Figs. 4, 6, and 9 to 12. As shown in Figs. 4 and 6, the sliding members 140 are arranged in pairs at both ends of the cover in the X direction. That is, the electronic device 100 includes two sliding members 140. The electronic device 100 also includes a pair of sliding members 140, one arranged on the first outer direction X1 side and the other arranged on the second outer direction X2 side.

[0071] The sliding member 140 includes a slider 141, a push-back member 142, a slider holder 143, and a slider cover 144. The slider 141 corresponds to a guide member. Note that Figs. 9 to 11 show the slider 141 disposed on the first outward direction X1 side of the electronic device 100. That is, Figs. 9 to 11 show the slider 141 disposed to the right.

[0072] 9, slider 141 is attached to slider holder 143. Slider 141 is disposed in guide holding portion 131 while attached to slider holder 143. Slider 141 is held by slider cover 144 so as not to come off guide holding portion 131.

[0073] The slider 141 is configured to be movable along the mounting direction Y1. The slider 141 is movable along the mounting direction Y1 in a state in which it is disposed in the guide holding portion 131. The slider 141 is also movable in the Y direction relative to the slider holder 143 and the case (such as the case upper portion 130).

[0074] As shown in Figs. 10 and 11, the slider 141 is formed, for example, by pressing a plate-like member whose main component is metal. The slider 141 mainly has opposing side walls 141c, 141d, and 141h, and a connecting portion 141a continuing to the side walls 141c, 141d, and 141h. The side walls 141c, 141d, and 141h are portions along the YZ plane. On the other hand, the connecting portion 141a is a portion along the XY plane. The YZ plane is a plane defined by the Y axis and the Z axis extending in the Z direction.

[0075] The side walls 141c and 141d are provided on one end of the connecting portion 141a. The side wall 141h is provided on the other end of the connecting portion 141a. Thus, the side walls 141c and 141d face the side wall 141h.

[0076] The side wall portion 141c is disposed on the inner side of the side wall portion 141d when the electronic device 100 is disposed in the insertion space IN1. Therefore, it can be said that the side wall portion 141c is disposed on the mounting direction Y1 side of the side wall portion 141d.

[0077] The side wall portion 141d is provided via an extension portion 141b provided on a part of the connecting portion 141a. The extension portion 141b is a portion of the connecting portion 141a extended in the first outer direction X1. The extension portion 141b is provided to position the side wall portion 141d further in the first outer direction X1 than the side wall portion 141c. Therefore, the side wall portion 141d is located on the first outer direction X1 side than the side wall portion 141c. In addition, the distance between the side wall portion 141h and the side wall portion 141d is wider than the distance between the side wall portion 141h and the side wall portion 141c. Note that the distance here is the distance in the X direction.

[0078] The slider 141 disposed on the left side has a similar configuration to the slider 141 disposed on the right side. However, the slider 141 disposed on the left side has an extension portion 141b for disposing the side wall portion 141d in the second outer direction X2 further than the side wall portion 141c. Therefore, the side wall portion 141d is located on the second outer direction X2 side than the side wall portion 141c.

[0079] Furthermore, the side wall portions 141c and 141d are provided with guide grooves 141e and 141f along the mounting direction Y1. The side wall portions 141c and 141d can also be said to be slits penetrating the slider 141 in the plate thickness direction. The guide grooves 141e and 141f are grooves in which the protrusions 417 and 427 of the movable members 410 and 420, which will be described later, are disposed. The guide grooves 141e and 141f are grooves in which the protrusions 417 and 427 can move (slide). In other words, the slider 141 can move in the Y direction with the protrusions 417 and 427 disposed in the guide grooves 141e and 141f.

[0080] The guide grooves 141e, 141f have open ends on the mounting direction Y1 side. That is, the guide grooves 141e, 141f are grooves with openings 141f1, 141e1 provided on the mounting direction Y1 side. In the process of mounting the electronic device 100 to the rack 200, the slider 141 has the protrusions 417, 427 that enter through the open ends of the guide grooves 141e, 141f. The guide grooves 141e, 141f can also be referred to as guide slits or cutouts.

[0081] The side walls 141c and 141d have the openings 141f1 and 141e1 formed such that the opening width becomes wider toward the mounting direction Y1 side. It can also be said that the opening width of the guide grooves 141e and 141f of the slider 141 gradually becomes wider toward the open end. Therefore, the protrusions 417 and 427 can easily enter the guide grooves 141e and 141f.

[0082] The guide grooves 141e and 141f include inclined portions SL11 and SL14 inclined with respect to the mounting direction Y1. The inclined portions SL11 and SL14 are inclined so that the mounting direction Y1 side is inclined in the upward direction Z1 more than the removal direction Y2 side. The inclined portions SL11 and SL14 are portions for attracting the cooling plate 330 to the electronic device 100 side. That is, the inclined portions SL11 and SL14 are portions for attracting the cooling plate 330 to the electronic device 100 side when the electronic device 100 is mounted on the rack 200. The inclined portions SL11 and SL14 are portions for pulling the cooling plate 330 away from the electronic device 100 when the electronic device 100 is removed from the rack 200. This point will be described in detail later.

[0083] The guide grooves 141e, 141f also include holding portions SL12, SL15 at the ends on the opposite side in the mounting direction Y1. The holding portions SL12, SL15 are portions that hold the protrusions 417, 427. In this manner, the guide grooves 141e, 141f are grooves that extend from the openings 141f1, 141e1 to the holding portions SL12, SL15.

[0084] The guide grooves 141e and 141f include flat portions SL10 and SL13 between the openings 141f1 and 141e1 and the inclined portions SL11 and SL14. The flat portions SL10 and SL13 are provided along the mounting direction Y1.

[0085] Here, the guide grooves 141e, 141f will be described in detail with reference to Figs. 10 and 11. The slider 141 is provided with a first guide groove 141e and a second guide groove 141f as guide grooves. The first movable member 410, which will be described later, includes a first protrusion 417. On the other hand, the second movable member 420 includes a second protrusion 427. The first guide groove 141e is a groove in which the first protrusion 417 is disposed. The second guide groove 141f is a groove in which the second protrusion 427 is disposed.

[0086] A first guide groove 141e is formed in the side wall portion 141c. The flat portion SL10 is formed between the first guide surfaces SF10 and SF20. The first guide surfaces SF10 and SF20 face each other and are surfaces along the Y direction. The first guide surfaces SF10 and SF20 are, for example, flat surfaces. The opening width of the flat portion SL10 corresponds to the distance between the first guide surfaces SF10 and SF20.

[0087] The inclined portion SL11 is formed between the first inclined surfaces SF11 and SF21. The first inclined surfaces SF11 and SF21 face each other and are inclined with respect to the Y direction. The inclined portion SL11 is inclined in the upward direction Z1 as it approaches the mounting direction Y1. The opening width of the inclined portion SL11 corresponds to the distance between the first inclined surfaces SF11 and SF21.

[0088] The holding portion SL12 is formed between the first holding surfaces SF12 and SF22. The first holding surfaces SF12 and SF22 face each other and are surfaces along the Y direction. The holding portion SL12 may also include a surface continuing to the first holding surfaces SF12 and SF22. The surface continuing to the first holding surfaces SF12 and SF22 is the back surface of the first guide groove 141e. The holding portion SL12 is located below the flat portion SL10 in the downward direction Z2.

[0089] The opening width of the holding portion SL12 corresponds to the distance between the first holding surfaces SF12 and SF22. The opening widths of the flat portion SL10, the inclined portion SL11 and the holding portion SL12 correspond to the opening width of the first guide groove 141e.

[0090] A second guide groove 141f is formed in the side wall portion 141d. The flat portion SL13 is formed between the second guide surfaces SF13 and SF23. The second guide surfaces SF13 and SF23 face each other and are surfaces along the Y direction. The second guide surfaces SF13 and SF23 are, for example, flat surfaces. The opening width of the flat portion SL13 corresponds to the distance between the second guide surfaces SF13 and SF23.

[0091] The inclined portion SL14 is formed between the second inclined surfaces SF14 and SF24. The second inclined surfaces SF14 and SF24 face each other and are inclined with respect to the Y direction. The inclined portion SL14 inclines in the upward direction Z1 as it approaches the mounting direction Y1. The opening width of the inclined portion SL14 corresponds to the distance between the second inclined surfaces SF14 and SF24.

[0092] The holding portion SL15 is formed between the second holding surfaces SF15 and SF25. The second holding surfaces SF15 and SF25 face each other and are surfaces along the Y direction. The holding portion SL15 may include a surface continuing to the second holding surfaces SF15 and SF25. The surface continuing to the second holding surfaces SF15 and SF25 is the back surface of the second guide groove 141f. The holding portion SL15 is located below the flat portion SL13 in the downward direction Z2.

[0093] The opening width of the holding portion SL15 corresponds to the distance between the second holding surfaces SF15 and SF25. The opening widths of the flat portion SL13, the inclined portion SL14, and the holding portion SL15 correspond to the opening width of the second guide groove 141f.

[0094] The opening width of each guide groove 141e, 141f is set according to the diameter (thickness) of the protrusions 417, 427. That is, the opening width of each guide groove 141e, 141f is a size that allows the corresponding protrusions 417, 427 to move. As will be described later, the first protrusion 417 is provided to be thicker than the second protrusion 427. Therefore, the opening width of the first guide groove 141e is wider than the opening width of the second guide groove 141f. However, if the thickness of the protrusions 417, 427 is the same, the opening width of each guide groove 141e, 141f may be the same.

[0095] As described above, the side wall portion 141c is disposed closer to the mounting direction Y1 than the side wall portion 141d. Therefore, when the electronic device 100 is mounted on the rack 200, the first guide groove 141e is inserted into the insertion space IN1 before the second guide groove 141f.

[0096] Moreover, the first guide groove 141e and the second guide groove 141f are provided at different positions in the Y direction. The first guide groove 141e is disposed on the back side in the mounting direction Y1 than the second guide groove 141f. Therefore, the first guide groove 141e can be said to be a guide groove disposed on the back side in the mounting direction Y1. On the other hand, the second guide groove 141f can be said to be a guide groove disposed on the front side in the mounting direction Y1.

[0097] In this way, the electronic device 100 has two guide grooves 141e, 141f on one end side in the X direction, and two guide grooves 141e, 141f on the other end side. This allows the electronic device 100 to move the cooling plate 330 in the Z direction in a well-balanced manner. It can also be said that the electronic device 100 can move the cooling plate 330 while maintaining a parallel positional relationship between the opposing surfaces SF1 and SF4.

[0098] The virtual center line of flat portion SL10 coincides with the virtual center line of flat portion SL13 in the Z direction. The virtual center line of holding portion SL12 coincides with the virtual center line of holding portion SL15 in the Z direction. Each virtual center line is a virtual straight line that passes through the center of each portion SL10, SL12, SL13, and SL15 in the Z direction and extends along the Y direction.

[0099] 9 and other figures, the push-back member 142 is disposed in a space between the side walls 141c, 141d and the side wall 141h. The push-back member 142 is provided to push back the slider 141 when removing the electronic device 100. As shown in FIG. 12, the push-back member 142 includes a rod-shaped portion 142a and a flange portion 142b protruding from the rod-shaped portion 142a.

[0100] Meanwhile, the slider 141 is provided with a pressed portion 141g at an end on the mounting direction Y1 side. When the push-back member 142 moves in the removal direction Y2, the pressed portion 141g is pressed in the removal direction Y2 by the flange portion 142b. When the pressed portion 141g is pressed, the slider 141 moves in the removal direction Y2.

[0101] The electronic device 100 may include an elastically deformable member such as a spring instead of the push-back member 142. In other words, the electronic device 100 only needs to include a mechanism for moving the slider 141 in the removal direction Y2.

[0102] The push-back member 142 is also used to fix the electronic device 100 to the rack 200. The rod-shaped portion 142a has a male screw at the tip on the flange portion 142b side. The male screw engages with a female screw of a fixing portion 251 provided on the rack back portion 250. In other words, the rod-shaped portion 142a is screwed to the fixing portion 251 with the case back portion 133 disposed between the flange portion 142b and the rack back portion 250.

[0103] As a result, the push-back member 142 is fixed to the rack back 250. Then, by fixing the push-back member 142 to the rack back 250, the electronic device 100 is fixed to the rack 200. The electronic device 100 is fixed to the rack 200 by the push-back member 142 and the fixing screw 1.

[0104] However, the push-back member 142 does not necessarily have to include a mechanism for fixing the electronic device 100 and the rack 200 together.

[0105] <Holding member and movable member> Next, the holding member 260 and the movable members 410, 420 will be described with reference to Fig. 3, and Fig. 13 to Fig. 16. Note that Fig. 3 shows a simplified view of the holding member 260 and the movable members 410, 420. Fig. 16 shows a state in which the holding member 260 is not attached.

[0106] There are many common parts between the first movable member 410 and the second movable member 420. Therefore, the common parts will be described using the first movable member 410 or the second movable member 420.

[0107] 15, in order to simplify the drawing, only a portion of the holding member 260 and the second movable member 420 is shown. The first movable member 410 has a sliding portion similar to the sliding portion 426. The first movable member 410 also has a spring receiving surface similar to the spring receiving surface 425a.

[0108] First, a description will be given of the holding members 260. As shown in Figures 13 and 16, the holding members 260 are provided at multiple locations on the rack side portion 210. The holding members 260 are fixed to the rack side portion 210 by screws, welding, or the like.

[0109] The holding members 260 are provided individually for the multiple movable members 410, 420. Therefore, the number of holding members 260 is the same as the number of movable members 410, 420. The holding members 260 are provided at four locations for one electronic device 100. In other words, as shown in Fig. 3, four holding members 260 are provided for each stage of the rack 200.

[0110] 14, the holding member 260 includes a holding base 261 and holding side portions 262 provided on both ends of the holding base 261. That is, the holding side portions 262 are provided on both sides in the Y direction of the holding base 261. The holding base 261 and the two holding side portions 262 are provided, for example, as an integrated member.

[0111] 15, the holding side portion 262 is provided with a slit 263 for holding the second movable member 420 in a state in which the second movable member 420 can move in the Z direction. A sliding portion 426 that is a part of the second movable member 420 is disposed in the slit 263. The second movable member 420 is movable in the Z direction with the sliding portion 426 disposed in the slit 263. In other words, the sliding portion 426 is slidable in the Z direction within the slit 263.

[0112] As shown in Figs. 14 and 15, the recess 264 is a bottomed hole with an opening in the upward direction Z1. A spring member SP1 mainly made of metal is disposed in the recess 264. However, the spring member SP1 is not limited to being mainly made of metal. The spring member SP1 corresponds to the application portion and the elastic member. The application portion may be made of rubber or the like.

[0113] As shown in FIG. 15, the spring member SP1 is disposed between the second movable member 420 provided in correspondence with the upper electronic device and the holding member 260 provided in correspondence with the lower electronic device. It can be said that the holding member 260 provided in correspondence with the lower electronic device has a recess 254 in which the spring member SP1 is disposed. The second movable member 420 provided in correspondence with the upper electronic device has a spring receiving surface 425a with which the spring member SP1 comes into contact. The spring member SP1 is elastically deformed between the holding member 260 and the second movable member 420. The spring member SP1 constantly applies stress to the second movable member 420 in a direction in which the electronic device 100 and the cooling plate 330 move away from each other. The moving away direction corresponds to the Z1 direction.

[0114] The uppermost holding member 260 in the upward direction Z1 does not necessarily have to be provided with the recess 254. Moreover, the uppermost holding member 260 does not necessarily have to have the spring member SP1 disposed in the recess 254.

[0115] 14 and 15, the holding member 260 has recesses 254 provided on each holding side portion 262. Therefore, the spring members SP1 are disposed on both sides of the holding base 261 in the Y direction. Note that it can also be said that the holding member 260 has recesses 254 provided on both sides of the second protrusion 427 in the mounting direction Y1. Therefore, it can also be said that the spring members SP1 are provided on both sides of the protrusions 417, 427 in the mounting direction Y1.

[0116] The spring member SP1 is a member that presses the second movable member 420 in the upward direction Z1. The upward direction Z1 corresponds to the opposite direction to the pressing direction in which the cooling plate 330 presses the heat conductive member 150. Therefore, the pressing direction here is the downward direction Z2.

[0117] The spring member SP1 is provided to hold the position of the second movable member 420 in the Z direction in the non-attached state. In other words, since the electronic control device 1000 includes the spring member SP1, it is easy to hold the second movable member 420 in a predetermined position. This makes it easy to insert the electronic device 100 into the insertion space IN1. In other words, the electronic control device 1000 makes it easy to align the positions of the guide grooves 141e and 141f and the protrusions 417 and 427 in the Z direction when attaching the electronic device 100. Furthermore, the electronic control device 1000 makes it easy to arrange the protrusions 417 and 427 in the guide grooves 141e and 141f when attaching the electronic device 100 to the rack 200, thereby improving the attachability of the electronic device 100 to the rack 200.

[0118] In the attached state, the spring member SP1 is pressed in the downward direction Z2 from the spring receiving surface 425a. This is because, in the attached state, the second movable member 420 moves in the downward direction Z2. This point will be described in detail later.

[0119] 30, the holding member 260 may be provided in common to multiple movable members 410, 420. That is, the holding member 260 is provided in common to multiple first movable members 410 arranged in the Z direction. The holding member 260 is also provided in common to multiple second movable members 420 arranged in the Z direction.

[0120] In this case, the multiple first movable members 410 arranged in the Z direction are attached to the holding member 260 by sliding them in the Z direction, for example. Therefore, it is preferable that the multiple first movable members 410 arranged in the Z direction have different sizes in the Y direction. In FIG. 30, as an example, the multiple first movable members 410 increase in size in the Y direction as they move downward in the Z2 direction. The same is true for the multiple second movable members 420.

[0121] Next, a description will be given of the movable members 410 and 420. Fig. 14 shows a state in which the cooling plate 330 is not attached.

[0122] 3, the movable members 410, 420 are attached to the four corners of the cooling plate 330. Therefore, four movable members 410, 420 are arranged on each stage of the rack 200. In addition, two first movable members 410 and two second movable members 420 are attached to the cooling plate 330. As shown in FIG. 14, the first movable members 410 are arranged on the inner side of the second movable members 420 in the attachment direction Y1.

[0123] 14, 15 and 16, the first movable member 410 includes a movable base 411 and movable side portions 412 provided on both ends of the movable base 411. That is, the movable side portions 412 are provided on both sides of the movable base 411 in the Y direction. The movable base 411 and the two movable side portions 412 are provided, for example, as an integrated unit.

[0124] The movable base 411 includes a cooling fixing part 413 and a first protrusion 417. The cooling fixing part 413 is a part that is fixed to the cooling plate 330. The cooling fixing part 413 and the cooling plate 330 are fixed by screwing, welding, or the like.

[0125] The first protrusion 417 is a portion that protrudes in the X direction from the movable base 411. The first protrusion 417 disposed on the right protrudes in the second outward direction X2. The first protrusion 417 disposed on the left protrudes in the first outward direction X1. The first protrusion 417 has a cylindrical shape.

[0126] The first protrusions 417 are provided corresponding to the first guide grooves 141e. The movable members 410, 420 fixed to one cooling plate 330 have the same number of protrusions 417, 427 as the number of guide grooves 141e, 141f, which correspond to the guide grooves 141e, 141f provided in one electronic device 100.

[0127] It should be noted that the first protrusion 417 is configured as a separate body from the movable base 411. The first protrusion 417 is attached to the movable base 411. However, the first protrusion 417 may be configured as an integral body with the movable base 411.

[0128] As shown in FIG. 14 and FIG. 16, the movable side portion 412 includes a cooling press portion 414 and a spring receiving portion 415. The cooling press portion 414 is provided at the end portion of the movable side portion 412 on the upward Z1 side. The cooling press portion 414 is in contact with the pressing auxiliary portion 331 of the cooling plate 330. As described above, the first movable member 410 moves the cooling plate 330 in the downward Z2 while being fixed to the cooling plate 330. That is, the first movable member 410 presses the cooling plate 330 in the downward Z2. The cooling press portion 414 is a portion that assists the pressing. By including the cooling press portion 414, the first movable member 410 can improve the pressing force in the downward Z2 against the cooling plate 330. However, the first movable member 410 does not have to include the cooling press portion 414.

[0129] The second movable member 420 includes a movable base portion 421 and movable side portions 422 provided on both ends of the movable base portion 421. The movable base portion 421 includes a cooling fixing portion 423 and a second protrusion portion 427. The second protrusion portion 427 is provided in correspondence with the second guide groove 141f.

[0130] The movable side portion 422 includes a cooling pressing portion 424, a spring receiving portion 425, and a sliding portion 426. The spring receiving portion 425 has the spring receiving surface 425a as described above. The sliding portion 426 is a portion that is disposed in the slit 263 as described above. The sliding portion 426 is a portion that slides in the Z direction within the slit 263. The sliding portion 426 is disposed in the slit 263 and can be said to be a flat portion that is movable within the slit 263.

[0131] 14, the first protrusion 417 is longer than the second protrusion 427. In other words, the second protrusion 427 disposed on the front side in the mounting direction Y1 is shorter than the first protrusion 417 disposed on the rear side in the mounting direction Y1. This allows the electronic control device 1000 to insert the electronic device 100 while preventing the slide member 140 and the like from contacting the second protrusion 427. In other words, the electronic control device 1000 can improve the guiding performance when inserting the electronic device 100 into the insertion space IN1. The guiding performance can also be referred to as insertability or attachability.

[0132] Incidentally, a force is applied from the slider 141 to the first protrusion 417 and the second protrusion 427 when the cooling plate 330 is pressed down in the downward direction Z2. This force is also applied to the boundary between the first protrusion 417 and the movable base 411 and the boundary between the second protrusion 427 and the movable base 421. As described above, the first protrusion 417 is longer than the second protrusion 427. Therefore, a larger force is applied to the boundary between the first protrusion 417 and the movable base 411 than to the boundary between the second protrusion 427 and the movable base 421.

[0133] 14, first protrusion 417 has a larger diameter than second protrusion 427. This can improve the strength of the boundary between first protrusion 417 and movable base 411. However, first protrusion 417 may have a diameter similar to that of second protrusion 427 as long as sufficient strength is ensured.

[0134] <Positioning member and base board> 17 to 26, the positioning members 510 and the base substrate 600 will be described. In order to make the relationship between the positioning members 510 and the wiring substrates 111 easier to understand, only one positioning member 510 and one wiring substrate 111 are shown in Fig. 23. For the same reason, the case of the electronic device 100 is omitted. In Figs. 25 and 26, the inter-board connectors 113 and 611 are shown in a simplified form.

[0135] First, the base substrate 600 will be described with reference to Figs. 17, 21, 23, etc. The base substrate 600 includes a wiring substrate 610, an inter-substrate connector 611, etc. The wiring substrate 610 is an electrically insulating base material such as resin, on which conductive wiring is provided. The wiring substrate 610 is a so-called printed circuit board. The wiring substrate 610 is disposed along the XZ plane in a state in which it is electrically connected to the electronic device 100. The XZ plane is a plane defined by the X-axis and the Z-axis. The state in which the wiring substrate 610 and the electronic device 100 are electrically connected is referred to as an inter-substrate connected state. Note that the wiring substrate 610 and the electronic device 100 are in an inter-substrate connected state, for example, in an inserted state.

[0136] Wiring board 610 has a mounting surface SF5 on which inter-board connector 611 is mounted, and a surface SF6 opposite to mounting surface SF5. Inter-board connector 611 is electrically connected to wiring of wiring board 610. As shown in FIG. 23, inter-board connector 611 is electrically connected to inter-board connector 113. That is, electronic device 100 is mounted on mounting surface SF5. Circuit elements such as semiconductor switching elements, resistor elements, and capacitor elements may be mounted on wiring board 610.

[0137] The number of mountable electronic devices 100 is preset on the base substrate 600. In the present embodiment, as an example, the base substrate 600 on which four electronic devices 100 can be mounted is used. Therefore, the base substrate 600 is provided with the same number of inter-board connectors 611 as the number of mountable electronic devices 100.

[0138] The wiring board 610 is provided with a positioning hole 612. In the positioning hole 612, the first protrusion 520 of the positioning member 510 is placed in the board-to-board connection state. The positioning hole 612 corresponds to the first positioning hole.

[0139] The positioning holes 612 are provided individually for each electronic device 100 mounted on the base substrate 600. Furthermore, in this embodiment, a positioning member 510 is provided for each electronic device 100. Therefore, the positioning holes 612 are provided individually corresponding to each positioning member 510.

[0140] Two positioning holes 612 are provided for one positioning member 510. One of the positioning holes 612 is provided for positioning the inter-board connectors 113, 611 in the X and Z directions. The other positioning hole 612 is provided for suppressing rotational misalignment. The rotational misalignment indicates that the base substrate 600 and the positioning member 510 rotate about the Y axis.

[0141] Positioning hole 612 is a hole that penetrates wiring board 610 in the plate thickness direction (Y direction). Positioning hole 612 is a through hole provided along the Y direction. The plate thickness direction of wiring board 610 corresponds to the distance between mounting surface SF5 and the opposite surface SF6. The plate thickness direction of wiring board 610 can also be said to be the thickness direction of base substrate 600. Positioning hole 612 may be a bottomed hole that opens to mounting surface SF5. In other words, positioning hole 612 may be a concave portion.

[0142] Two positioning holes 612 corresponding to one positioning member 510 are provided at positions shifted in the X direction. For example, two positioning holes 612 are provided on both sides in the X direction with respect to inter-board connector 611. Moreover, the positions of the two positioning holes 612 in the Z direction are the same.

[0143] Next, the positioning members 510 will be described with reference to Figs. 17 to 26. The positioning members 510 are provided individually for each electronic device 100 mounted on the base substrate 600. As shown in Fig. 17, the positioning members 510 are stacked in the Z direction to form the positioning structure 500. The positioning members 510 are provided as separate bodies.

[0144] 21, a plurality of positioning members 510 are disposed between a base substrate 600 and a plurality of electronic devices 100. The positioning members 510 are members for positioning inter-board connectors 611 of the base substrate 600 and inter-board connectors 113 of the electronic devices 100. The positioning members 510 have the same configuration. In the following, a description will be given using the positioning member 510 as a representative example.

[0145] 17, 18, 21, 22, etc., positioning member 510 includes a positioning base 511 provided with a connector opening 512 and a component arrangement hole 513. Connector opening 512 is a through hole in which inter-board connector 611 is arranged. Component arrangement hole 513 is a through hole in which push-back member 142 is arranged.

[0146] The positioning base 511 has a first protrusion 520 provided on a surface facing the base substrate 600. The first protrusion 520 protrudes in the mounting direction Y1 side from the periphery. The first protrusion 520 is a protrusion for positioning with the base substrate 600. The first protrusion 520 is inserted into the positioning hole 612.

[0147] 18, 23, etc., the positioning member 510 includes a first positioning portion 530 and a second positioning portion 540 on a surface facing the electronic device 100. The second positioning portion 540 corresponds to a clamping portion.

[0148] The first positioning portion 530 includes a second protrusion 531 and a reinforcing portion 532 provided to protrude in a direction intersecting with the second protrusion 531. The second protrusion 531 is a protrusion for positioning the positioning member 510 and the wiring board 111. The second protrusion 531 is a portion that protrudes in the removal direction Y2 side from the surrounding area. The second protrusion 531 can also be said to be a protrusion for positioning the board-to-board connector 611 and the board-to-board connector 113 in the X direction.

[0149] 24, the case (case back 133) of the electronic device 100 is disposed between the positioning member 510 and the wiring board 1111. A portion of the second protrusion 531 is inserted into the first opening 133a and disposed on the wiring board 111 side. The second protrusion 531 is then inserted into the positioning slit 115. The second protrusion 531 has, for example, a flat plate shape extending in the Y direction from the positioning base 511. However, the second protrusion 531 may have any shape as long as it can be inserted into the positioning slit 115.

[0150] 26, the second protrusion 531 is provided coaxially with the central axis RL1 of the first protrusion 520. That is, the center line of the second protrusion 531 and the center line of the first protrusion 520 are arranged on the same straight line. The center line of the second protrusion 531 is an imaginary line that passes through the center of the second protrusion 531 in the X direction and the Z direction and extends in the Y direction. The center line of the first protrusion 520 is an imaginary line that passes through the center of the first protrusion 520 in the X direction and the Z direction and extends in the Y direction. Therefore, the imaginary line coincides with the central axis RL1.

[0151] Second protrusion 531 is inserted into positioning slit 115 of wiring board 111. Therefore, the center line of second protrusion 531 can be considered to coincide with the center line of positioning slit 115. The center line of positioning slit 115 is an imaginary straight line that passes through the center of positioning slit 115 in the X and Z directions and extends in the Y direction.

[0152] It can also be said that the axis extending in the Y direction of the first protrusion 520 is coaxial with the center line in the X and Z directions of the second protrusion 531. Furthermore, it can be said that the center line of the second protrusion 531 and the center line of the first protrusion 520 are in the same position in the X and Z directions.

[0153] In this way, in the X direction, positioning slit 115 serves as the position reference for wiring board 111. Meanwhile, for positioning member 510, second protrusion 531 serves as the position reference for wiring board 111. Also, for positioning member 510, first protrusion 520 serves as the position reference for base substrate 600. The position reference for wiring board 111 and the position reference for base substrate 600 are the same. The position reference for wiring board 111 can be regarded as the center line of positioning slit 115. The position reference for positioning member 510 can be regarded as center axis RL1.

[0154] 24 and other figures, positioning member 510 has only one second protrusion 531. Positioning member 510 has second protrusion 531 provided at only one location, which is inserted into positioning slit 115 provided in one wiring board 111. The portion that determines the position of inter-board connectors 113, 611 in the X direction is only one second protrusion 531.

[0155] The reinforcing portion 532 is provided to reinforce the second protrusion 531. Moreover, the reinforcing portion 532 is configured as an integral part with the second protrusion 531. The reinforcing portion 532 is provided, for example, at an end of the second protrusion 531. In this case, the first positioning portion 530 has a T-shape in a cross section along the XZ plane. However, the reinforcing portion 532 is not limited to the above. Moreover, the first positioning portion 530 does not have to include the reinforcing portion 532.

[0156] The second positioning portion 540 is a portion that sandwiches the electronic device 100 in the Z direction. The second positioning portion 540 is a portion for positioning the positioning member 510 and the wiring board 111. The second positioning portion 540 can also be said to be a portion for positioning the inter-board connectors 611 and the inter-board connectors 113 in the Z direction. The positioning member 510 includes a plurality of second positioning portions 540 for one electronic device 100.

[0157] The second positioning portion 540 includes a contact portion 541 and a reinforcing portion 542 that protrudes in a direction intersecting the contact portion 541. As shown in Figs. 23 and 24, the contact portion 541 is a portion that protrudes in the removal direction Y2 from the surroundings. The reinforcing portion 542 is configured similarly to the reinforcing portion 532. The reinforcing portion 542 does not necessarily have to be provided.

[0158] The contact portion 541 is a portion that comes into contact with the wiring board 111. More specifically, the contact portion 541 has a contact surface 541a that comes into contact with the wiring board 111 (SF2). The contact portion 541 has, for example, a flat plate shape extending in the Y direction from the positioning base 511. However, the contact portion 541 may have any shape that allows it to come into contact with one surface SF2 of the wiring board 111.

[0159] 18, 19, 20, etc., second positioning section 540 includes a pressing member 543 provided at a position facing contact section 541. Pressing member 543 presses electronic device 100 (wiring board 111) between contact section 541 and pressing member 543. Pressing member 543 is a cantilevered leaf spring. Second positioning section 540 includes attachment section 544 to which pressing member 543 is attached. Attachment section 544 is provided, for example, as an integral part with positioning base 511. Note that pressing member 543 may also be a cantilevered leaf spring.

[0160] As shown in FIG. 24, a part of contact portion 541 is inserted into second opening 133b and disposed on the wiring board 111 side. Then, contact surface 541a contacts one surface SF2 of wiring board 111. Meanwhile, pressing member 543 is disposed outside the case. Pressing member 543 contacts base 120 and presses base 120. Wiring board 111 is fixed to base 120. Thus, pressing member 543 presses wiring board 111 via base 120. Also, pressing member 543 presses wiring board 111 towards contact surface 541a.

[0161] In this way, second positioning portion 540 sandwiches wiring board 111 in the Z direction. Note that pressing member 543 may be inserted into the case and press the opposite surface SF3 of wiring board 111 directly.

[0162] 25, contact surface 541a is provided along central axis RL1 of first protrusion 520. Contact surface 541a coincides with central axis RL1 in the Z direction. That is, in the Z direction, one surface SF2 serves as a positioning reference (reference surface). The positioning reference of positioning member 510 is central axis RL1 of first protrusion 520, as in the X direction. Furthermore, pressing member 543 presses wiring board 111 so that one surface SF2 coincides with central axis RL1.

[0163] The pressing member 543 may be provided as a separate member from the second positioning portion 540. It is only necessary for the pressing member 543 to be able to press the wiring board 111 so that the one surface SF2 and the central axis RL1 coincide with each other.

[0164] <Installation and removal> Next, the installation and removal of electronic device 100 will be described with reference to Figs. 27 to 29. The positional relationship between slider 141 and protrusions 417, 427 in each state, and the positions of movable members 410, 420 will also be described. Note that installation and removal of electronic device 100 can be performed by a dealer or an operator at a factory.

[0165] First, the attachment of the electronic device 100 to the rack 200 will be described with reference to Fig. 27 and Fig. 28. As shown in Fig. 27, when the electronic device 100 is attached to the rack 200, the electronic device 100 is inserted into the insertion space IN1 from the insertion opening IN2. The electronic device 100 is inserted with the heat conductive member 150 provided on the opposing surface SF1. The heat conductive member 150 may be provided on the opposing surface SF4 of the cooling plate 330. Fig. 27 shows the inserted state.

[0166] The electronic device 100 moves in the mounting direction Y1 with the first protrusion 417 disposed on the flat portion SL10 and the second protrusion 427 disposed on the flat portion SL13. Then, the electronic device 100 is inserted to the depth of the insertion space IN1. That is, the electronic device 100 moves to a mounting position facing the cooling plate 330 with the heat conductive member 150 in contact with only one of the electronic device 100 and the cooling plate 330.

[0167] In this state, the male screw provided at the tip of the push-back member 142 is screwed into the fixing part 251 provided on the rack back part 250. Also, the electronic device 100 is fixed to the rack 200 with the fixing screw 1. In this way, the electronic device 100 is fixed to the rack 200.

[0168] In the inserted state, a part of the slider 141 is located outside the insertion port IN2. In addition, the first protrusion 417 is located on the flat portion SL10, and the second protrusion 427 is located on the flat portion SL13. Therefore, the movable members 410, 420 do not move in the downward direction Z2. Therefore, the heat conduction member 150 is not in contact with the cooling plate 330 (opposing surface SF4). That is, a clearance is formed between the heat conduction member 150 and the cooling plate 330 in the Z direction. In addition, the heat conduction member 150 is not compressed.

[0169] Next, as shown in Fig. 28, the cooling plate 330 is moved downward in the Z2 direction. After the electronic device 100 has moved to the mounting position, the positions of the protrusions 417, 427 are displaced from the inclined portions SL11, SL14 to the holding portions SL12, SL15, thereby moving the movable members 410, 420 so as to attract them. Fig. 28 shows the mounting state.

[0170] More specifically, with the electronic device 100 moved to the mounting position, the slider 141 is pushed in the mounting direction Y1. That is, after the electronic device 100 moves to the mounting position, the slider 141 moves in the mounting direction Y1, displacing the position of the first protrusion 417 from the inclined portion SL11 to the holding portion SL12. Similarly, the position of the second protrusion 427 is displaced from the inclined portion SL14 to the holding portion SL15. The slider 141 can be moved by an operator.

[0171] In this way, the positions of the protrusions 417, 427 are displaced from the inclined portions SL11, SL14 to the holding portions SL12, SL15. As a result, the movable members 410, 420 are pushed down in the downward direction Z2 by the slider 141. Therefore, the movable members 410, 420 move in the downward direction Z2.

[0172] The cooling plate 330 is fixed to the movable members 410 and 420. Therefore, the cooling plate 330 moves in the downward direction Z2 in accordance with the movement of the movable members 410 and 420. The cooling plate 330 comes into contact with the heat conductive member 150 by moving in the downward direction Z2. Furthermore, the cooling plate 330 compresses the heat conductive member 150 between itself and the electronic device 100.

[0173] Therefore, the heat conducting member 150 is in contact with the cooling plate 330 (opposing surface SF4). The heat conducting member 150 is also pressed (compressed) in the Z direction by the electronic device 100 and the cooling plate 330. In this manner, the electronic device 100 is attached to the rack 200 with the heat conducting member 150 in contact with both the electronic device 100 and the cooling plate 330.

[0174] As described above, in the attached state, the first protrusion 417 is located in the holding portion SL12, and the second protrusion 427 is located in the holding portion SL15. The protrusions 417, 427 are engaged with the holding portions SL12, SL15. Note that the movement of the slider 141 in the attachment direction Y1 is restricted by arranging the protrusions 417, 427 in the holding portions SL12, SL15.

[0175] The movement amount of the first protrusion 417 in the Z direction corresponds to the orthogonal distance between the flat portion SL10 and the holding portion SL12. Similarly, the movement amount of the second protrusion 427 in the Z direction corresponds to the orthogonal distance between the flat portion SL13 and the holding portion SL15. Note that both movement distances are the same. The orthogonal distance can also be said to be the distance between the flat portion SL10 and the holding portion SL12 in the Z direction.

[0176] Then, the cooling plate 330 moves by the orthogonal distance due to the movement of the slider 141 in the mounting direction Y1. The orthogonal distance is set according to the desired amount of compression (amount of compression, compressive force) of the heat conductive member 150. The orthogonal distance for obtaining the optimal compressive force can be set by experiment, simulation, or the like.

[0177] The orthogonal distance can also be set in consideration of the clearance to be secured when mounting the electronic device 100 on the rack 200. The inclination angles of the inclined portions SL11 and SL14 are set to an angle that does not impede the movement of the slider 141.

[0178] Next, removal of the electronic device 100 from the rack 200 will be described with reference to FIG. 29. First, the push-back member 142 is removed from the fixing portion 251. Furthermore, the push-back member 142 is moved in the removal direction Y2. At this time, the push-back member 142 is moved in the removal direction Y2 with the flange portion 142b in contact with the pressed portion 141g. This causes the slider 141 to move in the removal direction Y2. That is, the slider 141 is pushed back in the removal direction Y2.

[0179] Then, as the slider 141 moves in the removal direction Y2, the position of the first protrusion 417 is displaced from the holding portion SL12 to the inclined portion SL11 and the flat portion SL10. Similarly, the position of the second protrusion 427 is displaced from the holding portion SL15 to the inclined portion SL14 and the flat portion SL13.

[0180] In this way, the positions of the protrusions 417, 427 are displaced from the holding portions SL12, SL15 to the flat portions SL10, SL13. Therefore, the movable members 410, 420 are pushed upward in the upward direction Z1 from the slider 141. Also, the cooling plate 330 moves in the upward direction Z1 in conjunction with the movement of the movable members 410, 420.

[0181] At this time, the first protrusion 417 is located on the flat portion SL10, and the second protrusion 427 is located on the flat portion SL13. The movable members 410, 420 are moved in the upward direction Z1. Therefore, the heat conductive member 150 is separated from the cooling plate 330. In this state, the electronic device 100 can be removed from the rack 200 by moving the electronic device 100 in the removal direction Y2.

[0182] <Effects> As described above, the electronic control device 1000 is configured so that the electronic device 100 can be attached to the rack 200. When the electronic device 100 is attached to the rack 200, the electronic device 100 is placed in an attachment position facing the cooling plate 330 with the heat conductive member 150 in contact with the electronic device 100. After being placed in the attachment position, the electronic device 100 displaces the positions of the protrusions 417, 427 from the inclined portions SL11, SL14 to the holding portions SL12, SL15.

[0183] As a result, the electronic device 100 is attached to the rack 200 with the heat conductive member 150 in contact with both the electronic device 100 and the cooling plate 330. Therefore, the electronic control device 1000 can suppress curling or shearing of the heat conductive member 150 when attaching the electronic device 100 to the rack 200. Furthermore, the electronic control device 1000 can also suppress other loads that are generated on the heat conductive member 150 from the electronic device 100 and the cooling plate 330 during attachment. Note that the electronic control device 1000 can achieve the same effect even if it does not include the positioning member 510 and the base substrate 600.

[0184] The electronic control device 1000 can transfer heat from the electronic device 100 to the cooling plate 330 via the thermally conductive member 150. Therefore, the electronic control device 1000 can cool the electronic device 100 by the cooling plate 330. Furthermore, the thermally conductive member 150 contacts the electronic device 100 and the cooling plate 330 in a good condition. Therefore, the electronic control device 1000 can efficiently cool the electronic device 100.

[0185] The electronic control device 1000 includes a first protrusion 520 for positioning the base substrate 600 and the positioning member 510, and a second protrusion 531 for positioning the electronic device 100 and the positioning member 510, which is provided coaxially with the central axis RL1 of the first protrusion 520. Therefore, the electronic control device 1000 does not need to take into consideration the tolerance caused by the first protrusion 520 and the second protrusion 531 not being coaxial. Therefore, the electronic control device 1000 can improve the relative positional accuracy of the board-to-board connectors 113, 611.

[0186] Electronic control device 1000 includes contact portion 541 (contact surface 541a) provided along center axis RL1 of first protrusion 520. Therefore, electronic control device 1000 can further improve the relative positional accuracy of board-to-board connectors 113, 611.

[0187] Furthermore, the central axis RL1 of the first protrusion 520 of the positioning member 510 coincides with the reference position of the wiring board 111 in the X direction and with the reference plane of the wiring board 111 in the Z direction. This allows the electronic control device 1000 to connect the inter-board connectors 113, 611 within the tolerance range. It can also be said that the positioning member 510 can connect the inter-board connectors 113, 611 within the range of the floating amount of the floating connector. The electronic control device 1000 can achieve an effect related to positioning even if it does not include the slide member 140 or the movable members 410, 420.

[0188] Furthermore, by providing a separate positioning member 510 for each electronic device 100 (four in this embodiment), the distance from the point positioned by the positioning hole 612 and the first protrusion 520 in each electronic device 100 is shortened, so that the dimensional tolerance can be set small, making it easier to keep the dimensional tolerance within the tolerance range of the board-to-board connectors 113, 611.

[0189] Furthermore, in the electronic control device 1000, when the thermally conductive member 150 is pressed, the protrusions 417, 427 of the movable members 410, 420 holding the cooling plate 330 are held by the holding portions SL12, SL15 of the slider 141 of the electronic device 100. Thus, the electronic control device 1000 can prevent the cooling plate 330 and the electronic device 100 from being separated from each other due to the reaction force of the thermally conductive member 150. Therefore, the electronic control device 1000 can be configured such that the thermally conductive member 150 is in contact with the cooling plate 330 and the electronic device 100. Note that the electronic control device 1000 can achieve the same effect even if it does not include the positioning member 510 and the base substrate 600.

[0190] Also, the orthogonal distance is set by experiments, simulations, etc. so that the compressive force on the heat conductive member 150 is an optimal value. Thus, the electronic control device 1000 can compress the heat conductive member 150 with an appropriate compressive force. Furthermore, it can be said that the electronic control device 1000 can set the distance between the cooling plate 330 and the electronic device 100 so that the compressive force on the heat conductive member 150 is an optimal value. Thus, the electronic control device 1000 can keep the heat transfer distance between the cooling plate 330 and the electronic device 100 constant.

[0191] Furthermore, electronic device 100 is provided at its four corners with holding portions SL12, SL15 that engage with protrusions 417, 427. Therefore, electronic control device 1000 can compress heat conduction member 150 while opposing surface SF1 and opposing surface SF4 maintain a parallel positional relationship.

[0192] In addition, this embodiment employs an example in which the heat conductive member 150 is provided as a preferred embodiment. However, the present disclosure does not necessarily require the heat conductive member 150. Even with this configuration, when the electronic device 100 is attached to the rack 200, the electronic device 100 is disposed at an attachment position facing the cooling plate 330, and then the positions of the protrusions 417, 427 are displaced from the inclined portions SL11, SL14 to the holding portions SL12, SL15. By displacing the electronic device 100 in this manner, the movable members 410, 420 are moved so as to attract the movable members, and the electronic device 100 is attached to the rack 200. That is, when the electronic device 100 is attached to the rack, the electronic device 100 can attract the cooling plate 330 to which the movable members 410, 420 are attached. Therefore, the electronic control device 1000 can bring the electronic device 100 and the cooling plate 330 closer to each other. Therefore, the electronic control device 1000 can improve the cooling efficiency of the electronic device 100.

[0193] Furthermore, the electronic control device is configured such that, in a state in which the electronic device 100 is attached to the rack 200, the protrusions 417, 427 are held by the holders SL12, SL15, and the electronic device 100 is disposed at an attachment position facing the cooling plate 330. Therefore, the electronic control device 1000 can improve the heat dissipation performance of the electronic device 100 by the cooling plate 330.

[0194] In addition, in this embodiment, the second protrusion 531 provided coaxially with the central axis RL1 of the first protrusion 520 is adopted as a preferred embodiment. However, the present disclosure can also adopt the second protrusion 531 that is not provided coaxially with the central axis RL1 of the first protrusion 520. Even in such a configuration, the positioning member 510 includes the first protrusion 520 for positioning the base substrate 600 and the positioning member 510, and the second protrusion 531 for positioning the electronic device 100 and the positioning member 510. That is, the positioning member 510 includes both the first protrusion 520 used for positioning with the base substrate 600 and the second protrusion 531 used for positioning with the electronic device 100. Therefore, the electronic control device can improve the relative positional accuracy of the inter-board connectors 113, 611.

[0195] Although the preferred embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit and scope of the present disclosure.

[0196] Although the present disclosure has been described based on the embodiment, it is understood that the present disclosure is not limited to the embodiment or structure. The present disclosure also encompasses various modifications and modifications within the equivalent range. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more than one element, or less than one element are also within the scope and concept of the present disclosure.

[0197] This specification discloses the following technical ideas and combinations thereof.

[0198] (Technical thought 1) A base substrate (600) having a first connector (611); an electronic device (100) mounted in a direction substantially perpendicular to the base substrate, the electronic device having a wiring board (111) and a second connector (113) provided on the wiring board and electrically connected to the first connector; a positioning member (510) disposed between the base substrate and the electronic device for positioning the first connector and the second connector; The positioning member is a first protrusion (520) for positioning with the base substrate, inserted into a first positioning hole (612) provided along the thickness direction of the base substrate; and a second protrusion (531) for positioning with the wiring board, inserted into a second positioning hole (115) provided along a planar direction of the wiring board.

[0199] (Technical thought 2) the positioning member further includes a clamping portion (540) for positioning the electronic device with the wiring board, the clamping portion clamping the electronic device in a thickness direction of the electronic device, The electronic control device according to Technical Idea 1, wherein the clamping portion is a portion that comes into contact with the wiring board and has a contact portion (541, 541a) that is provided along the central axis.

[0200] (Technical Thought 3) A plurality of the electronic devices are mounted on the base substrate, The electronic control device according to Technical Idea 1 or 2, wherein the positioning members are provided in the same number as the electronic devices and are individually positioned for each electronic device.

[0201] (Technical Thought 4) The electronic control device according to any one of Technical Concepts 1 to 3, wherein the positioning member includes only one second protrusion.

[0202] (Technical Thought 5) The electronic control device according to any one of Technical Concepts 1 to 4, wherein the positioning member includes a reinforcing portion (532) protruding in a direction intersecting with the second protrusion.

[0203] (Technical Thought 6) The electronic control device according to Technical Concept 2, wherein the positioning member has a plurality of the clamping portions that clamp one of the electronic devices.

[0204] (Technical Thought 7) The electronic control device according to Technical Concept 2 or 6, wherein the clamping portion includes, in addition to the contact portion, a pressing member (534) that presses the electronic device between the clamping portion and the contact portion.

[0205] (Technical Thought 8) The electronic device further includes a housing (120, 130 to 134) that houses the wiring board, The electronic control device according to Technical Idea 7, wherein the pressing member presses the housing which is a part of the electronic device.

[0206] (Technical Thought 9) The electronic control device according to Technical Concept 8, wherein the pressing member is a leaf spring.

[0207] (Technical Thought 10) The electronic control device according to Technical Concept 8 or 9, wherein the clamping portion has an attachment portion (544) to which the pressing member is attached.

[0208] (Technical Thought 11) The electronic control device described in technical idea 8, wherein the housing has a first opening (133a) in which the second protrusion is arranged, and a second opening (133b) in which a part of the clamping portion is arranged.

[0209] (Technical Thought 12) The electronic control device according to any one of Technical Ideas 1 to 11, wherein the second protrusion is provided coaxially with a central axis of the first protrusion.

[0210] (Technical Thought 13) the positioning member further includes a clamping portion (540) for positioning the electronic device with the wiring board, the clamping portion clamping the electronic device in a thickness direction of the electronic device, The electronic control device according to Technical Idea 12, wherein the clamping portion is a portion that comes into contact with the wiring board and has a contact portion (541, 541a) that is provided along the central axis. [Explanation of symbols]

[0211] 100...electronic device, 113...inter-board connector, 140...slide member, 141...slider, 150...thermal conduction member, 200...rack, 260...holding member, 330...cooling plate, 410...first movable member, 417...first protrusion, 420...second movable member, 427...second protrusion, SP1...spring member, 500...positioning structure, 510...positioning member, 520...first protrusion, 530...first positioning portion, 531...second protrusion, 540...second positioning portion, 541...contact portion, 541a...contact surface, 543...pressure portion, 544...mounting portion, 600...base substrate, 611...inter-board connector, 612...positioning hole, 1000...electronic control device

Claims

1. A base substrate (600) having a first connector (611); An electronic device (100) that is mounted in a direction substantially perpendicular to the base substrate, the electronic device having a wiring board (111) and a second connector (113) that is provided on the wiring board and electrically connected to the first connector; a positioning member (510) disposed between the base substrate and the electronic device for positioning the first connector and the second connector; The positioning member is a first protrusion (520) for positioning with the base substrate, inserted into a first positioning hole (612) provided along the thickness direction of the base substrate; a second protrusion (531) for positioning with the wiring board, inserted into a second positioning hole (115) provided along a planar direction of the wiring board.

2. the positioning member further includes a clamping portion (540) for positioning the electronic device with the wiring board, the clamping portion clamping the electronic device in a thickness direction of the electronic device, The electronic control device according to claim 1 , wherein the clamping portion has a contact portion (541, 541 a) that is a portion that comes into contact with the wiring board.

3. A plurality of the electronic devices are mounted on the base substrate, 3. The electronic control device according to claim 1, wherein the positioning members are provided in the same number as each of the electronic devices and are individually positioned for each electronic device.

4. 2. The electronic control device according to claim 1, wherein the positioning member includes only one second protrusion.

5. 2. The electronic control device according to claim 1, wherein the positioning member includes a reinforcing portion (532) protruding in a direction intersecting with the second protrusion.

6. 3. The electronic control device according to claim 2, wherein the positioning member includes a plurality of the clamping portions for clamping one of the electronic devices.

7. 7. The electronic control device according to claim 2 or 6, wherein the clamping portion includes, in addition to the contact portion, a pressing member (534) that presses the electronic device between the clamping portion and the contact portion.

8. The electronic device further includes a housing (120, 130 to 134) that houses the wiring board, The electronic control device according to claim 7 , wherein the pressing member presses the housing which is a part of the electronic device.

9. The electronic control device according to claim 8 , wherein the pressing member is a leaf spring.

10. The electronic control device according to claim 9, wherein the clamping portion includes a mounting portion (544) to which the pressing member is attached.

11. The electronic control device according to claim 8 , wherein the housing has a first opening (133a) in which the second protrusion is disposed, and a second opening (133b) in which a part of the clamping portion is disposed.

12. 2. The electronic control device according to claim 1, wherein the second protrusion is provided coaxially with a central axis of the first protrusion.

13. the positioning member further includes a clamping portion (540) for positioning the electronic device with the wiring board, the clamping portion clamping the electronic device in a thickness direction of the electronic device, The electronic control device according to claim 12 , wherein the clamping portion is a portion that comes into contact with the wiring board and has a contact portion (541, 541 a) that is provided along the central axis.

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