Method and device for cleaning cleaning tool, substrate cleaning device, and method for manufacturing cleaning tool

Abstract

To confirm the degree of cleaning a cleaning tool by a simple and environment-friendly method.SOLUTION: A cleaning device for performing cleaning processing of a cleaning tool by bringing a cleaning tool into contact with a cleaning member while supplying a cleaning liquid to the cleaning tool used for cleaning a substrate includes: a liquid extraction unit for extracting a cleaning liquid remaining in the cleaning tool or a cleaning liquid having flown out of the cleaning tool when the cleaning processing is performed; a fluorescence analysis unit for performing fluorescence analysis on the cleaning liquid extracted by the liquid extraction unit and measuring the fluorescence intensity of the cleaning liquid to excitation light with a predetermined wavelength; and a determination unit for determining whether cleaning of the cleaning tool is finished on the basis of the measured fluorescence intensity.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a method and apparatus for cleaning a cleaning tool used for cleaning substrates after polishing, and a method for manufacturing the cleaning tool. [Background technology]

[0002] One method for planarizing the surface of a substrate for forming semiconductor devices is polishing using a chemical mechanical polishing (CMP) device. In CMP, the surface of the object to be polished, such as a substrate, is pressed against a polishing member, and a polishing liquid is supplied between the polishing member and the object to be polished while the polishing member and the object to be polished are moved relative to each other, thereby polishing the surface of the object to be polished flat.

[0003] In general, a polishing apparatus for polishing a substrate is equipped with a substrate cleaning apparatus for cleaning the polished substrate. The substrate cleaning is performed by bringing a cleaning tool such as a roll sponge or a pen sponge into contact with the substrate after polishing while rotating the substrate.

[0004] The cleaning tool used for cleaning substrates is, for example, a sponge made of PVA (polyvinyl alcohol), and is set in a cleaning device before use. Here, the cleanliness level used in cleaning semiconductor devices is much higher than the cleanliness level required in the manufacturing process of the cleaning tool, so the cleaning tool must be cleaned before it is used for cleaning substrates. Specifically, a cleaning and rinsing process is performed using a combination of ultrapure water, alkaline chemicals, or enzyme-based cleaning solutions. The cleaning tool is cleaned when it is replaced with a new one (called break-in), or after a certain number of substrates have been cleaned.

[0005] Furthermore, the substrate cleaning apparatus described in Patent Document 1 discloses a technology for extracting the cleaning liquid remaining inside the cleaning tool (or flowing out from the cleaning tool) during the cleaning process, subjecting the extracted cleaning liquid to an iodine color reaction, detecting its color intensity, and determining whether or not cleaning of the cleaning tool has been completed based on the detected color intensity. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2022-34694 A Summary of the Invention [Problem to be solved by the invention]

[0007] According to the technology described in the above Patent Document 1, the cleaning degree is judged by utilizing an iodine color reaction, so an iodine solution is required. In addition, a starch decomposition enzyme is required to grasp the content of starch or crosslinked PVA, which not only makes the judgment process complicated, but also requires the disposal of waste liquid such as the iodine solution and the decomposition enzyme. For this reason, a method for confirming the cleaning degree using a simpler method with less environmental impact has been desired.

[0008] The present invention has been made in consideration of the above, and aims to provide a cleaning method and device, as well as a method for manufacturing a cleaning tool, that enables confirmation of the degree of cleaning of a cleaning tool in a simple manner that has a low environmental impact. [Means for solving the problem]

[0009] The inventors of the present application have conducted extensive research into the types of defects transferred from a PVA brush, which is a cleaning tool, to a substrate to be cleaned, and methods for detecting them. Figure 1 shows an example of the results of spectrofluorometric analysis, using a spectrofluorometer, of a liquid (brush extract) discharged when a PVA brush used as a cleaning tool is cleaned with pure water. The graph in Figure 1 shows an example of a fluorescence spectrum when the wavelength of excitation light is 225 nm.

[0010] From the fluorescence spectrum in Figure 1, it can be seen that peaks are observed at fluorescence wavelengths of around 290 nm and 340 nm. The eluate (extract) from the PVA brush mainly contains starch and PVA, and since the fluorescence wavelength derived from the reference (soluble starch reagent) is around 280 nm, it can be seen that the peak around 340 nm in Figure 1 is a peak derived from PVA.

[0011] Figure 1 shows the change in the fluorescence spectrum when the immersion time (cleaning time) of the PVA brush is increased from 0.5 hours (0.5h) to 2 hours (2.0h). The multiple graphs in Figure 1 show that the peaks around 290nm and 340nm become lower as the immersion time increases, indicating that defects (starch and PVA eluates) are reduced as the PVA brush is immersed (cleaned), and that the defects are reduced to a certain value or below the threshold value after about 1.5 hours of cleaning treatment.

[0012] Figure 2 is a graph showing an example of the change in fluorescence intensity versus immersion time, showing the time-dependent change in fluorescence intensity for excitation light wavelength / fluorescence wavelength: 220 nm / 295 nm (originating from starch) and excitation light wavelength / fluorescence wavelength: 225 nm / 340 nm (originating from PVA). According to the graph in Figure 2, the fluorescence intensity (vertical axis of the graph) decreases as the immersion time increases, indicating that defects (starch eluates, PVA eluates) are reduced as the PVA brush is immersed (cleaned), and that the defects fall below a certain level after approximately 1.5 hours of cleaning treatment.

[0013] The above fluorescence spectroscopic analysis gave similar results not only when the brush was immersed in pure water, but also when the brush was immersed in ammonia water. Thus, it was found that by performing fluorescence spectroscopic analysis on the eluate from the PVA brush and monitoring the peak intensity at a specific wavelength, it is possible to detect and judge the cleaning level of the brush, i.e., whether it has been cleaned to a level that can be used for cleaning substrates.

[0014] In view of the above, one aspect of the present invention is a cleaning device that performs a cleaning process on a cleaning tool used for cleaning substrates by supplying a cleaning liquid to the cleaning tool and bringing it into contact with a cleaning member, and is configured to include a liquid extraction unit that extracts the cleaning liquid remaining inside the cleaning tool or the cleaning liquid that has flowed out of the cleaning tool during the cleaning process, a fluorescence analysis unit that performs fluorescence analysis on the cleaning liquid extracted by the liquid extraction unit and measures the fluorescence intensity of the cleaning liquid in response to excitation light of a predetermined wavelength, and a judgment unit that judges whether or not cleaning of the cleaning tool has been completed based on the measured fluorescence intensity.

[0015] Another aspect of the present invention is a method for cleaning a cleaning tool used for cleaning substrates, comprising: a cleaning step of cleaning the cleaning tool by supplying a cleaning liquid to the cleaning tool and bringing it into contact with a cleaning member; an extraction step of extracting the cleaning liquid remaining inside the cleaning tool or the cleaning liquid flowing out from the cleaning tool in the cleaning step; a fluorescence analysis step of performing fluorescence analysis on the cleaning liquid extracted in the extraction step and measuring the fluorescence intensity of the cleaning liquid in response to excitation light of a predetermined wavelength; and a determination step of determining whether or not cleaning of the cleaning tool has been completed based on the measured fluorescence intensity. Effect of the Invention

[0016] According to the present invention, the degree of cleaning of a cleaning tool can be confirmed using a simple method that places little burden on the environment. [Brief description of the drawings]

[0017] [Figure 1] 1 is a graph showing an example of a fluorescence spectrum when the immersion time (cleaning time) of a PVA brush is changed. [Diagram 2] 1 is a graph showing an example of changes in fluorescence intensity with respect to immersion time. [Diagram 3] 1 is a plan view showing a schematic configuration of a substrate processing apparatus including a substrate cleaning apparatus according to an embodiment of the present invention. [Figure 4]1 is a perspective view showing a configuration of a substrate cleaning apparatus according to an embodiment of the present invention; [Diagram 5] FIG. 11 is a perspective view showing a configuration of a substrate cleaning apparatus according to another embodiment of the present invention. [Figure 6] FIG. 11 is a diagram illustrating self-cleaning of a pen member. [Figure 7] 10A and 10B are diagrams illustrating self-cleaning of a roll member. [Figure 8] FIG. 2 is an explanatory diagram showing a functional configuration of a cleaning evaluation device. [Figure 9] FIG. 2 is an explanatory diagram illustrating a photometric method for fluorescence spectrometry. [Figure 10] 10 is a flowchart showing a procedure of a cleaning evaluation process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 3 shows an outline of a substrate processing apparatus including a substrate cleaning apparatus according to this embodiment, and the substrate processing apparatus 10 has a housing 12 and a load port 14. The load port 14 is equipped with, for example, an open cassette that stores a large number of substrates W.

[0019] The housing 12 accommodates a plurality of polishing units 16a to 16d for polishing (planarizing) the substrate W, a first cleaning unit 18 and a second cleaning unit 20 for cleaning the polished substrate W, and a drying unit 22 for drying the cleaned substrate W. In the example of Fig. 1, the polishing units 16a to 16d are aligned along the longitudinal direction of the substrate processing apparatus 10, and the cleaning units 18, 20 and the drying unit 22 are aligned in parallel to the polishing units 16a to 16d.

[0020] A first transport robot 24 is disposed between the load port 14 and the polishing unit 16a and drying unit 22 located on the load port 14 side, and receives the unpolished substrate W from the load port 14 and delivers it to the transport unit 24, and also receives the dried substrate W taken out of the drying unit 22 from the transport unit 24. In addition, a transport unit 26 is disposed between the polishing units 16a to 16d and the cleaning units 18 and 20 and the drying unit 22.

[0021] A second transport robot 26 is disposed between the first cleaning unit 18 and the second cleaning unit 20 to transfer the substrate W therebetween. In addition, a third transport unit 28 is disposed between the second cleaning unit 20 and the drying unit 22 to transfer the substrate W therebetween.

[0022] A control unit 32 that controls the operation of each device of the substrate processing apparatus 10 is disposed inside the housing 12. In this embodiment, the control unit 32 is disposed inside the housing 12, but the control unit 32 may be disposed outside the housing 12 and connected to the substrate processing apparatus 10 via a network. The control unit 32 also includes an input unit 34 that receives external input. Here, the external input includes mechanical operations by a user and input of signals from an external device via wired or wireless connection.

[0023] The cleaning units 18 and 20 of this embodiment clean the substrate W by rotating a cleaning tool described below and bringing it into contact with the surface of the substrate W while rotating the substrate W. The cleaning units 18 and 20 may also use a two-fluid jet cleaning device that cleans the surface of the substrate W with a two-fluid jet in combination with the cleaning tool. As an example, the drying unit 22 dries the substrate W by ejecting IPA vapor from a nozzle (not shown) toward the rotating substrate W. Alternatively, the substrate W may be rotated at high speed to dry the substrate W by centrifugal force.

[0024] Fig. 4 is a perspective view showing a schematic configuration of a substrate cleaning apparatus 36 according to one embodiment, and Fig. 5 is a perspective view showing a schematic configuration of a substrate cleaning apparatus 38 according to another example. The substrate cleaning apparatuses 36, 38 (corresponding to the substrate cleaning units 18, 20 in Fig. 3) have a substrate rotation mechanism that holds and rotates the substrate W, and a cleaning liquid supply unit 42 that supplies a cleaning liquid to the substrate W. As the cleaning liquid, for example, a rinse liquid such as ultrapure water (DIW), an alkaline solution (ammonia water, ammonia hydrogen peroxide (SC1)), a chemical solution such as a surfactant, a chelating agent, or a mixture of these can be used depending on the type of film on the target substrate surface.

[0025] The substrate W rotates about its central axis as the axis of rotation. In this embodiment, the surface of the substrate W extends horizontally and the axis of rotation extends vertically, but the present invention is not limited to this. The substrate rotation mechanism of this embodiment has four support members 40 that support the outer periphery of the substrate W. The support members 40 are, for example, spindles or chucks, and rotate the substrate W by rotating.

[0026] The substrate cleaning devices 36, 38 are equipped with a cleaning tool that cleans the substrate W that it comes into contact with. In the example of Fig. 4, the cleaning tool uses a pen member 44A that rotates about an axis of rotation that is substantially perpendicular to the surface of the substrate W, and a roll member 44B that extends linearly over substantially the entire diameter of the substrate W. In the example of Fig. 5, the cleaning tool uses a pair of roll members 44B that extend linearly over substantially the entire diameter of the substrate W.

[0027] The substrate cleaning apparatus 36 shown in Fig. 4 includes cleaning tool rotation mechanisms 46, 48 that hold and rotate a pen member 44A and a roll member 44B, which are cleaning tools, respectively, and rotate the pen member 44A about a rotation axis that is approximately perpendicular to the surface of the substrate W. The substrate cleaning apparatus 38 shown in Fig. 7 includes a cleaning tool rotation mechanism 50 that holds a roll member 44B, which is a cleaning tool, and rotates it about a rotation axis that is parallel to the surface of the substrate W. The cleaning tool rotation mechanisms 46, 48, 50 move the cleaning tools 44A, 44B parallel to the surface of the substrate W to a contact position where they come into contact with the substrate W and a standby position (not shown).

[0028] In the example shown in Fig. 4, the pen member 44A cleans the upper surface of the substrate W, and the roll member 44B cleans the lower surface of the substrate W. In the example shown in Fig. 5, a pair of roll members 44B clean the front and back surfaces of the substrate W. Note that the configuration of the substrate cleaning device is not limited to these examples as long as the substrate W is cleaned by the cleaning tool coming into contact with the front surface of the substrate W.

[0029] The new cleaning tools 44A and 44B have particles on their surfaces and insides that may cause contamination, and therefore cannot be used as is to clean semiconductor devices. If such cleaning tools are used to clean a substrate W, the clean substrate W may be contaminated by the cleaning tools. For this reason, a prescribed cleaning process (break-in) is performed on the new cleaning tools before they are used for substrate processing.

[0030] FIG. 6 is a diagram showing a schematic configuration of an apparatus for breaking in the pen member 44A, and FIG. 7 is a diagram showing a schematic configuration of an apparatus for breaking in the roll member 44B. As shown in FIGS. 6 and 7, the cleaning member 52 is disposed in the liquid tank 54. The cleaning member 52 is formed of an inorganic oxide-based material such as a quartz plate or a sapphire plate, or an organic polymer-based material having good chemical resistance and low elution properties such as PTFE, PVDF, PFA, PPS, PEEK, or PMMA. In addition, the liquid tank 54 stores a liquid (cleaning liquid) such as a rinse liquid such as ultrapure water (DIW), an alkaline solution (ammonia water, ammonia hydrogen peroxide (SC1)), a substrate cleaning liquid, or a chemical liquid such as an amylolytic enzyme solution.

[0031] A liquid supply unit 56 is connected to the liquid tank 54, which supplies a chemical liquid during chemical cleaning and pure water during rinsing to the liquid tank 54 as a cleaning liquid. The cleaning liquid may be configured to be circulated to the liquid tank 54 while purifying it. It is also preferable that the temperature of the liquid stored in the liquid tank 54 can be adjusted by a temperature adjustment mechanism such as a heater. Furthermore, a vibration unit that applies ultrasonic vibrations to the liquid tank 54 when cleaning the cleaning tools 44A and 44B may be provided in the bath 54.

[0032] As shown in Fig. 6, when cleaning the pen member 44A, the cleaning tool rotation mechanism 46 rotates the pen member 44A and presses the pen member 44A against the cleaning member 52. Note that Fig. 6 shows an example in which the surface of the cleaning member 52 is perpendicular to the rotation axis of the pen member 44A, but the present invention is not limited to this example.

[0033] 7, when cleaning the roll member 44B, the cleaning tool rotation mechanisms 48, 50 rotate the roll member 44B while pressing the roll member 44B against the cleaning member 52. Note that in the example shown in Fig. 7, the surface of the cleaning member 52 is inclined with respect to the vertical direction, and the roll member 44B moves in the vertical direction to come into contact with the cleaning member, but the present invention is not limited to this example.

[0034] The drainage liquid from the liquid tank 54 is discharged to the outside of the apparatus, or sent to the liquid supply device 56 by a circulation mechanism (not shown) for reuse. The cleaning liquid and rinsing pure water may be supplied to the liquid tank 54 from the liquid supply device 56 as shown in Figures 6 and 7, but they can also be supplied under pressure from the liquid supply device 56 to the outside of the brushes through liquid supply ports provided inside the brushes 44A and 44B. In the case of the pressurized supply method, foreign matter present deep inside the brushes can be effectively pushed out. Alternatively, the depth of the liquid tank 54 may be made shallow so that most of the brushes are exposed, and the cleaning liquid and rinsing pure water may be sprayed directly onto the brushes by a spray or the like.

[0035] The liquid tank 54 is connected to a cleaning evaluation device 60 for evaluating the degree of cleaning of the cleaning tools 44A, 44B. Fig. 8 is a block diagram showing an example of the configuration of the cleaning evaluation device 60. The cleaning evaluation device 60 includes a test liquid collecting section (liquid extracting section) 62, a fluorescence analyzing section 64, a cleaning section 70, a determining section 72, a memory section 74, and an output section 76. The cleaning evaluation device 60 and the liquid tank 54 are provided inside or in a position close to the substrate cleaning apparatus 36, and during break-in processing, cleaning with a chemical liquid and rinsing processing with pure water are performed on the cleaning tools 44A, 44B.

[0036] The test liquid collecting section 62 is equipped with a test liquid collecting port and a reduced pressure generating mechanism (e.g., a pump), and the test liquid collecting port is pressed against the surfaces of the cleaning tools 44A, 44B after they have been washed and rinsed, and the reduced pressure generating mechanism reduces the pressure inside the test liquid collecting port to suck and collect the liquid remaining inside the pores on the surface of the cleaning tools 44A, 44B, which are PVA sponges (liquid that may contain eluates from the cleaning tools 44A, 44B; hereinafter referred to as the "residual liquid").

[0037] The collection of the remaining liquid by the test liquid collecting section 62 is not limited to the above-mentioned manner, and the remaining liquid may be collected, for example, by collecting the liquid that falls when the cleaning tools 44A, 44B are brought into contact with and rotated against the cleaning member 52, by collecting waste liquid obtained when the substrate W (test substrate) is cleaned by the cleaning tools 44A, 44B, or by collecting the inner rinse that has passed through the inside of the cleaning tools 44A, 44B.

[0038] The fluorescence analysis unit 64 performs fluorescence analysis using a fluorometer on the remaining liquid collected by the test liquid collection unit 62. Fig. 9 is a diagram showing an outline of the configuration of the fluorescence analysis unit 64, in which excitation light is irradiated from a light irradiation unit (not shown) onto a sample 65 containing the remaining liquid. Of the excitation light and fluorescence emitted from the sample 65 by the excitation light, only the fluorescence passes through a fluorescence filter 66 arranged on the optical path, and only the fluorescence from the sample 65 is detected by a detector 67. The fluorescence analysis unit 64 then extracts the fluorescence corresponding to the excitation light of a predetermined wavelength.

[0039] From the viewpoint of simultaneously detecting the spectra derived from starch and PVA, the wavelength (predetermined wavelength) of the excitation light for extracting fluorescence in the fluorescence analysis unit 64 is preferably in the range of 200 nm to 290 nm, and particularly preferably 220 nm to 225 nm. Furthermore, the wavelength of the excitation light corresponding to the starch measurement and the wavelength of the excitation light corresponding to the PVA measurement may be the same wavelength or different wavelengths (for example, the wavelength of the excitation light corresponding to starch is 220 nm, and the wavelength of the excitation light corresponding to PVA is 225 nm).

[0040] The determination unit 72 determines whether the fluorescence intensity at a predetermined wavelength measured by the fluorescence analysis unit 64 falls below a predetermined threshold, and if so, sends an indication to the output unit 76 that cleaning of the cleaning tools 44A, 44B should be terminated. On the other hand, if the measured absorbance value is equal to or greater than the threshold, an instruction to continue cleaning of the cleaning tools 44A, 44B is sent to the substrate cleaning device 36. This makes it possible to evaluate the degree of remaining contaminants that may cause starch and PVA defects remaining inside the cleaning tool without performing inspection with a defect inspection device.

[0041] Here, the predetermined wavelengths of fluorescence to be judged by the judgement unit 72 are the fluorescent wavelength derived from starch (e.g., 295 nm) and the fluorescent wavelength derived from PVA (e.g., 340 nm). The judgement unit 72 judges whether the corresponding fluorescent intensity for both the fluorescent wavelengths derived from starch and PVA has fallen below a predetermined threshold. Alternatively, since both starch and PVA are removed by cleaning the cleaners 44A and 44B, the judgement unit 72 may be configured to judge whether the corresponding fluorescent intensity for one of the fluorescent wavelengths derived from starch and PVA has fallen below a predetermined threshold.

[0042] The storage unit 74 stores information about a threshold value (of the fluorescence intensity) used in the determination process in the determination unit 72. The storage unit 74 also stores information about the results of a fluorescence spectroscopic analysis of pure water (not used in the rinsing process of the cleaning tools 44A and 44B), and may be configured to subtract the measurement values ​​for the pure water and the cleaning liquid from the measurement values ​​of the fluorescence intensity for the liquid remaining from the cleaning tools 44A and 44B.

[0043] The cleaning unit 70 cleans the test liquid collecting unit 62 with pure water every time the fluorescence intensity measurement of the remaining liquid is performed by the cleaning evaluation device 60. This prevents the influence (contamination) of the remaining liquid used in the previous fluorescence intensity measurement when the fluorescence intensity measurement of the remaining liquid is performed.

[0044] The procedure for breaking in the cleaning tools with the above configuration will be described below with reference to the flow chart in Fig. 10. When the cleaning tools 44A, 44B are replaced and break-in is started (step S10), the cleaning tools 44A, 44B are set in the liquid tank 54 filled with a chemical solution. The cleaning tools 44A, 44B are rotated while being pressed against the cleaning member 52, whereby the cleaning tools 44A, 44B are cleaned, and further a rinsing process with pure water is performed (step S11).

[0045] When the rinsing process is completed, the test liquid collecting unit 62 collects the remaining liquid in the cleaning tools 44A, 44B (step S12). When a certain amount of the remaining liquid is collected, the sample containing the remaining liquid is irradiated with excitation light in the fluorescence analysis unit 64 for fluorescence analysis, and the fluorescence intensity for the excitation light of a predetermined wavelength is detected (step S13). The fluorescence analysis unit 64 then measures the fluorescence intensity of specific wavelengths (e.g., 295 nm and 340 nm) derived from starch and PVA (step S14). The fluorescence intensity data obtained by the measurement is stored in the memory unit 74 of the cleaning evaluation device 60.

[0046] When the measurement of the fluorescence intensity is completed, the judgment unit 72 judges whether the measured value falls below a set value (threshold value) (step S15), and if so, judges that the starch and cross-linked PVA concentrations are sufficiently low (i.e., starch and cross-linked PVA have been sufficiently removed from the cleaning tools 44A, 44B after the cleaning and rinsing process), and outputs and displays the fact that the evaluation by fluorescence analysis is terminated. Thereafter, the test substrate cleaned by the cleaning tools 44A, 44B is set in a defect inspection device and checked for the presence or absence of defects (step S16). This ends the break-in process (step S17). Note that the check by the defect inspection device may be omitted. Furthermore, the set value of the fluorescence intensity can be data of the fluorescence intensity measurement for a brush that has been previously determined to have ended break-in.

[0047] On the other hand, if the measured value of the fluorescence intensity is equal to or greater than the set value ("N" in step S15), the process returns to step S11, where the brush cleaning and rinsing process is performed again on the cleaning tools 44A and 44B, and the fluorescence analysis and measurement of the fluorescence intensity are performed. This reduces the frequency of checking for the presence or absence of defects using a defect inspection device, thereby shortening and streamlining the break-in process.

[0048] In addition, after rinsing the cleaning tools 44A and 44B with pure water, the supply of pure water may be stopped, and the cleaning tools 44A and 44B may be rotated while maintaining pressure on the cleaning members for a predetermined time (for example, one minute), and then the liquid inside the brush may be collected. This allows the cleaning tools 44A and 44B to be rinsed with the same rinsing water, which increases the concentration of eluates from the cleaning tools 44A and 44B, thereby improving the analytical sensitivity of fluorescence intensity measurement based on fluorescence analysis.

[0049] In addition, when cleaning the cleaning tools 44A and 44B, the cleaning liquid may be foamed and supplied to the cleaning tools 44A and 44B instead of flowing it as it is. Specifically, the cleaning liquid is foamed by supplying clean air (to the extent that the solubility of the cleaning liquid is greater than or equal to the solubility of the cleaning liquid) through a gas-dissolving membrane, or by adding a surfactant and foaming it by mechanical stirring. In the break-in, only the cleaning liquid that comes into contact with the surfaces of the cleaning tools 44A and 44B contributes to cleaning, so in the case of flowing in the cleaning liquid, most of the cleaning liquid is discarded without contributing to cleaning. By using a foamed cleaning liquid, the amount of cleaning liquid can be significantly reduced, and the cost required for break-in can be reduced.

[0050] In the above embodiment, an example has been described in which a break-in process is performed after the cleaning tool is set in the substrate cleaning apparatus, but the present invention is not limited to this and can be equally applied to, for example, a situation in which a cleaning tool is inspected for defects before shipment.

[0051] In the above embodiment, a cleaning process is performed on a cleaning tool that cleans substrates in chemical mechanical polishing (CMP). However, the present invention is not limited to CMP and can be equally applied to a process in which a substrate is scrubbed using a PVA brush.

[0052] The above-described embodiments have been described for the purpose of enabling a person having ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments are naturally possible for a person skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments. The present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope according to the technical idea defined by the claims. [Explanation of symbols]

[0053] 10 Substrate processing equipment 36 Substrate cleaning equipment 44A Cleaning tool (pen parts) 44B Cleaning tool (roll member) 60 Cleaning evaluation device 62 Test liquid collection section 64 Fluorescence Analysis Unit 72 Judgment section

Claims

1. A cleaning device that performs a cleaning process on a cleaning tool used for cleaning a substrate by supplying a cleaning liquid to the cleaning tool and bringing the cleaning tool into contact with a cleaning member, a liquid extracting unit that extracts the cleaning liquid remaining inside the cleaning tool or the cleaning liquid that has flowed out from the cleaning tool during the cleaning process; a fluorescence analyzer that performs fluorescence analysis on the cleaning liquid extracted by the liquid extractor and measures the fluorescence intensity of the cleaning liquid in response to excitation light of a predetermined wavelength; a determination unit that determines whether or not cleaning of the cleaning tool has been completed based on the measured fluorescence intensity; A cleaning device comprising:

2. The cleaning device according to claim 1 , characterized in that the fluorescence analysis unit measures the fluorescence intensity of a first wavelength of the fluorescence of the cleaning liquid in response to excitation light of a predetermined wavelength, and determines that cleaning of the cleaning tool is completed when the measured value of the fluorescence intensity is less than a set value.

3. 2. The cleaning device according to claim 1, wherein the fluorescence analysis unit measures a fluorescence intensity of a first wavelength and a fluorescence intensity of a second wavelength of the fluorescence of the cleaning liquid in response to excitation light of a predetermined wavelength, and determines that cleaning of the cleaning tool is completed when the fluorescence intensity of the first wavelength is less than a first set value and the fluorescence intensity of the second wavelength is less than a second set value.

4. The cleaning tool is a PVA sponge, 4. The cleaning device of claim 3, wherein the first wavelength corresponds to a fluorescent wavelength of starch and the second wavelength corresponds to a fluorescent wavelength of PVA.

5. 1. A method for cleaning a cleaning tool used to clean a substrate, comprising: a cleaning step of cleaning the cleaning tool by supplying a cleaning liquid to the cleaning tool and contacting the cleaning tool with a cleaning member; an extraction step of extracting the cleaning liquid remaining inside the cleaning tool or the cleaning liquid flowing out from the cleaning tool in the cleaning step; a fluorescence analysis step of performing a fluorescence analysis on the cleaning solution extracted in the extraction step, and measuring the intensity of a fluorescence spectrum of the cleaning solution with respect to an excitation light having a predetermined wavelength; a determining step of determining whether or not cleaning of the cleaning tool has been completed based on the measured fluorescence intensity; A cleaning method comprising:

6. 6. The cleaning method according to claim 5, wherein the cleaning liquid is pure water, an alkaline solution, a substrate cleaning liquid or an amylolytic agent.

7. A method for producing a cleaning tool for cleaning a substrate, comprising subjecting a cleaning tool to the cleaning method according to claim 5 or 6.

8. 5. A substrate cleaning apparatus comprising the cleaning apparatus according to claim 1, and performing a cleaning process on a substrate using the cleaning tool that has been cleaned by the cleaning apparatus.

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