Sensor, sensor system, and electronic apparatus

Abstract

To provide a sensor, a sensor system, and an electronic apparatus that can improve accuracy.SOLUTION: According to an embodiment, a sensor includes a first member, a first substrate, and a sensor unit. A direction from the first member to the first substrate extends along a first direction. A first member thickness of the first member along the first direction is larger than a first substrate thickness of the first substrate along the first direction. The sensor unit is provided between the first member and the first substrate. The sensor unit is fixed to the first member. The first substrate is fixed to the sensor unit. The sensor unit includes a housing, and a sensor element provided in the housing. The sensor element includes a sensor base body, a fixation part fixed to the sensor base body, and a movable part supported on the fixation part. A direction from the fixation part to the sensor base body extends along the first direction. A first gap is provided between the sensor base body and the movable part.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE FIELD OF THE DISCLOSURE Embodiments of the invention relate to sensors, sensor systems and electronic devices. [Background technology]

[0002] For example, there is a sensor having a MEMS (Micro Electro Mechanical Systems) structure. In some cases, electronic devices are controlled by the force obtained by the sensor. It is desirable to improve the accuracy of the sensor. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6533518 Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE DISCLOSURE Embodiments of the present invention provide sensors, sensor systems and electronic devices that allow for improved accuracy. [Means for solving the problem]

[0005] According to the embodiment, the sensor includes a first member, a first substrate, and a sensor unit. A direction from the first member to the first substrate is along a first direction. A first member thickness of the first member along the first direction is thicker than a first substrate thickness of the first substrate along the first direction. The sensor unit is provided between the first member and the first substrate. The sensor unit is fixed to the first member. The first substrate is fixed to the sensor unit. The sensor unit includes a housing and a sensor element provided in the housing. The sensor element includes a sensor base, a fixed portion fixed to the sensor base, and a movable portion supported by the fixed portion. A direction from the fixed portion to the sensor base is along the first direction. A first gap is provided between the sensor base and the movable portion. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Diagram 2] FIG. 2 is a schematic plan view illustrating the sensor according to the first embodiment. [Diagram 3] FIG. 3 is a graph illustrating the characteristics of the sensor. [Figure 4] FIG. 4 is a graph illustrating the characteristics of the sensor. [Diagram 5] FIG. 5 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Figure 6] FIG. 6 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. [Figure 7] FIG. 7 is a schematic view illustrating an electronic device according to the third embodiment. [Figure 8] 8(a) to 8(h) are schematic views illustrating applications of the electronic device according to the embodiment. [Figure 9] 9(a) and 9(b) are schematic diagrams illustrating applications of the sensor according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] (First embodiment) FIG. 1 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. FIG. 2 is a schematic plan view illustrating the sensor according to the first embodiment. FIG. 1 is a cross-sectional view taken along line A1-A2 of FIG. As shown in FIG. 1, a sensor 110 according to the embodiment includes a first member 41, a first substrate 51, and a sensor unit .

[0008] The direction from the first member 41 to the first substrate 51 is along the first direction D1. The first direction D1 is defined as the Z-axis direction. One direction perpendicular to the Z-axis direction is defined as the X-axis direction. The direction perpendicular to the Z-axis direction and the X-axis direction is defined as the Y-axis direction.

[0009] The sensor section 10 is provided between the first member 41 and the first substrate 51. The sensor section 10 is fixed to the first member 41. The first substrate 51 is fixed to the sensor section 10. In this example, the sensor 110 further includes a first fixing member 51F. For example, the first fixing member 51F is provided between the sensor section 10 and the first substrate 51. The first fixing member 51F fixes the sensor section 10 to the first substrate 51. The first fixing member 51F may fix a side portion of the sensor section 10 to the first substrate 51. A plurality of first fixing members 51F may be provided. The first fixing member 51F includes, for example, a metal. The first fixing member 51F may include, for example, a solder. Stable and strong fixation is obtained.

[0010] The sensor unit 10 includes a housing 18 and a sensor element 10E provided in the housing 18. The pressure inside the housing 18 is lower than 1 atmosphere. By keeping the inside of the housing 18 in a reduced pressure state, for example, the influence of temperature changes outside the housing 18 and the like are suppressed.

[0011] The sensor element 10E includes a sensor base 10B, a fixed portion 10F, and a movable portion 10M. The sensor base 10B may be, for example, a silicon substrate.

[0012] The fixed portion 10F is fixed to the sensor base 10B. The movable portion 10M is supported by the fixed portion 10F. The direction from the fixed portion 10F to the sensor base 10B is along the first direction D1. A first gap 10G is provided between the sensor base 10B and the movable portion 10M.

[0013] In this example, the sensor element 10E further includes a connecting member 10C. A part 10Cp (see FIG. 2) of the connecting member 10C is supported by the fixed part 10F. Another part 10Cq (see FIG. 2) of the connecting member 10C supports the movable part 10M. The connecting member 10C has, for example, a meandering structure (or a spring structure). The provision of the connecting member 10C having a spring structure makes it easier for the movable part 10M to move. The fixed part 10F is, for example, an anchor.

[0014] The movable part 10M is displaceable, for example, in the XY plane. As shown in FIGS. 1 and 2, the sensor element 10E may further include a movable electrode 15. The movable part 10M can vibrate when an AC voltage is applied between the movable electrode 15 and the movable part 10M. For example, when an external force (e.g., angular velocity) is applied to the vibrating movable part 10M, the vibration state of the movable part 10M changes. The external force can be detected by detecting the change in the vibration state of the movable part 10M. The change in the vibration state due to the external force is, for example, the effect of the Coriolis force.

[0015] The housing 18 on which the sensor element 10E is provided is fixed to a first substrate 51. As shown in FIG. 1, the first substrate 51 includes a first surface 51a and a second surface 51b. The second surface 51b is between the sensor unit 10 and the first surface 51a in the first direction D1. The second surface 51b faces the sensor unit 10. The first surface 51a faces a detection member 81 to which the first substrate 51 is fixed. The detection member 81 is an object to be inspected by the sensor 110.

[0016] 1, the sensor 110 may include a control unit 70. The control unit 70 is, for example, an electric circuit. The control unit 70 is provided on the first substrate 51. The control unit 70 is provided on, for example, the second surface 51b. The movable part 10M vibrates in response to a control signal from the control unit 70. The vibration state of the movable part 10M is detected by the control unit 70.

[0017] When the sensor unit 10 is fixed to the first substrate 51, energy dissipation due to the anchor occurs in a system including the movable unit 10M, the fixed unit 10F, the sensor base 10B, the first fixing member 51F, and the first substrate 51. For example, the Q value may vary. In such a configuration, for example, the elastic wave may propagate asymmetrically. Due to these, a difference may occur in the excitation intensity of the movable unit 10M in the XY plane of the sensor 110, and the stability of detection may deteriorate.

[0018] In the embodiment, the first member 41 is fixed to the sensor unit 10. The first member 41 functions as, for example, a weight. By providing the weight, dissipation of energy can be suppressed. For example, the difference in excitation intensity in the XY plane can be reduced. For example, the influence of asymmetric propagation of elastic waves can be suppressed. According to the embodiment, a sensor capable of improving stability can be provided.

[0019] As shown in Fig. 1, the thickness of the first member 41 along the first direction D1 is defined as a first member thickness t41. The thickness of the first substrate 51 along the first direction D1 is defined as a first substrate thickness t51. In the embodiment, the first member thickness t41 is thicker than the first substrate thickness t51. This makes it easier for the first member 41 to function as a weight. Stable vibration of the movable part 10M can be maintained.

[0020] For example, the density of the first member 41 is higher than the density of the first substrate 51. For example, the mass of the first member 41 is greater than the mass of the first substrate 51. The mass of the first member 41 is greater than the mass of the movable part 10M. A sufficiently heavy first member 41 can maintain stable vibration of the movable part 10M.

[0021] For example, the first member 41 includes a metal. For example, the first member 41 may include at least one selected from the group consisting of aluminum, iron, and copper. Due to the high density, the first member 41 easily functions as a weight.

[0022] As shown in FIG. 2, the first member 41 has a first member length L41 in a second direction D2 perpendicular to the first direction D1. The second direction D2 is, for example, the X-axis direction. The housing 18 has a housing length L18 in the second direction D2. The first member length L41 is preferably 0.9 to 5 times the housing length L18. If the first member length L41 is excessively short, the function of the first member 41 as a weight is reduced. If the first member length L41 is excessively long, the first member 41 is more likely to bend, and the influence of other vibration components is increased. The first member length L41 may be 1 to 50 times the housing length L18.

[0023] The movable part 10M can resonate at a first frequency f1 (unit: Hz). A first sound speed v1 (unit: m / s) of the transverse wave in the first member 41 is the product of the first frequency f1 and a first wavelength λ1 (unit: m) of the transverse wave in the first member 41. In the embodiment, the first member thickness t41 is preferably ¼ or more of the first wavelength λ1. This makes it possible to effectively suppress energy loss of the transverse wave.

[0024] As already described, the first member 41 has a first member length L41 (unit: m) in the second direction D2 perpendicular to the first direction D1 (see FIG. 2). The second sound speed v2 (unit: m / s) of the longitudinal wave in the first member 41 is the product of the first frequency f1 of resonance of the movable part 10M and the second wavelength λ2 (m) of the longitudinal wave in the first member 41. In the embodiment, the first member length L41 is preferably ¼ times or more the second wavelength λ2. This makes it possible to effectively suppress energy loss of the longitudinal wave.

[0025] An example of the characteristics of the sensor 110 will now be described. FIG. 3 is a graph illustrating the characteristics of the sensor. Fig. 3 illustrates the characteristics when the ratio of the first member thickness t41 to the first wavelength λ1 is changed. The horizontal axis of Fig. 3 is the first parameter P1. The first parameter P1 is the ratio of the first member thickness t41 to the first wavelength λ1 (t41 / λ1). The vertical axis of Fig. 3 is, for example, the Q value Q1 of the movable part 10M.

[0026] In the sensor unit 10, the movable unit 10M is excited in an arbitrary direction. The excitation includes excitation along the X-axis direction and excitation along the Y-axis direction. FIG. 3 illustrates the Q value Q1x in the excitation along the X-axis direction and the Q value Q1y in the excitation along the Y-axis direction. The difference between the Q value Q1x and the Q value Q1y is caused, for example, by the influence of asymmetric propagation of the elastic wave. As shown in FIG. 3, when the first parameter P1 is 0.25 or more, the difference between the Q value Q1x and the Q value Q1y becomes small. In the embodiment, the first parameter P1 may be 1 or more. The difference in the Q value with respect to the excitation direction becomes smaller, and it becomes easier to obtain symmetric vibration in the XY plane. In the embodiment, the first member thickness t41 is preferably 1 time or more of the first wavelength λ1. In the embodiment, for example, the first member thickness t41 is preferably 5 times or less of the first wavelength λ1. If the first member thickness t41 is excessively large, for example, distortion may easily occur in at least one of the sensor unit 10 and the first fixing member 51F.

[0027] FIG. 4 is a graph illustrating the characteristics of the sensor. Fig. 4 illustrates the characteristics when the ratio of the first member length L41 to the second wavelength λ2 is changed. The horizontal axis of Fig. 4 is the second parameter P2. The second parameter P2 is the ratio of the first member length L41 to the second wavelength λ2 (L41 / λ2). The vertical axis of Fig. 4 is, for example, the Q value Q1 of the movable part 10M.

[0028] FIG. 4 illustrates the Q value Q1x in the excitation along the X-axis direction and the Q value Q1y in the excitation along the Y-axis direction. As shown in FIG. 4, when the second parameter P2 is 0.25 or more, the difference between the Q value Q1x and the Q value Q1y becomes small. In the embodiment, the second parameter P2 may be 1 or more. The difference in the Q value with respect to the excitation direction becomes smaller, and it becomes easier to obtain symmetric vibration in the XY plane. In the embodiment, the first member length L41 is preferably 1 time or more of the second wavelength λ2. In the embodiment, for example, the first member length L41 is preferably 5 times or less of the second wavelength λ2. If the first member length L41 is excessively thick, for example, distortion is likely to occur in at least one of the sensor unit 10 and the first fixing member 51F.

[0029] FIG. 5 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. 5, in the sensor 111 according to the embodiment, the first member 41 has a laminated structure. Except for this, the configuration of the sensor 111 may be similar to the configuration of the sensor 110.

[0030] In the sensor 111, the first member 41 includes a first partial region 41a and a second partial region 41b. The second partial region 41b is provided between the first partial region 41a and the housing 18. A second material of the second partial region 41b is different from a first material of the first partial region 41a. The first partial region 41a includes a metal. For example, the second partial region 41b may include a metal different from the metal of the first partial region 41a.

[0031] For example, the first partial region 41a may include at least one selected from the group consisting of aluminum, iron, and copper. For example, the second partial region 41b may include solder or the like. For example, the melting point of the second material is lower than the melting point of the first material. The second partial region 41b may be, for example, an adhesive region.

[0032] The first member 41 includes a plurality of partial regions made of different materials, which facilitates design and manufacturing.

[0033] In one example, the thickness of the first partial region 41a along the first direction D1 may be greater than the thickness of the second partial region 41b along the first direction D1.

[0034] FIG. 6 is a schematic cross-sectional view illustrating the sensor according to the first embodiment. 6, in the sensor 112 according to the embodiment, the first member 41 also includes a first partial region 41a and a second partial region 41b. In the sensor 112, the configuration of the second partial region 41b is different from the configuration of the second partial region 41b in the sensor 111. Except for this, the configuration of the sensor 112 may be similar to the configuration of the sensor 111.

[0035] 6, in the sensor 112, the second partial region 41b is provided between a part of the first partial region 41a and the housing 18. For example, the second partial region 41b may be provided in a region that overlaps with the housing 18 and the first direction D1.

[0036] Second embodiment The second embodiment relates to a sensor system. As shown in Fig. 1, a sensor system 210 according to the second embodiment includes a sensor 110 and a detection member 81. As shown in Fig. 5, a sensor system 211 according to the second embodiment includes a sensor 111 and a detection member 81. As shown in Fig. 6, a sensor system 212 according to the second embodiment includes a sensor 112 and a detection member 81. In the second embodiment, a highly accurate detection result is obtained.

[0037] Third embodiment The third embodiment relates to an electronic device. FIG. 7 is a schematic view illustrating an electronic device according to the third embodiment. As shown in FIG. 7, an electronic device 310 according to the embodiment includes the sensor according to the first embodiment and a circuit control unit 170. In the example of FIG. 7, a sensor 110 is depicted as the sensor. The circuit control unit 170 can control a circuit 180 based on a signal S1 obtained from the sensor. The circuit 180 is, for example, a control circuit for a driving device 185. According to the embodiment, for example, the circuit 180 for controlling the driving device 185 can be controlled with high accuracy.

[0038] 8(a) to 8(h) are schematic views illustrating applications of the electronic device according to the embodiment. As shown in FIG. 8(a), the electronic device 310 may be at least a part of a robot. As shown in FIG. 8(b), the electronic device 310 may be at least a part of a machine robot installed in a manufacturing factory or the like. As shown in FIG. 8(c), the electronic device 310 may be at least a part of an automatic guided vehicle in a factory or the like. As shown in FIG. 8(d), the electronic device 310 may be at least a part of a drone (unmanned aerial vehicle). As shown in FIG. 8(e), the electronic device 310 may be at least a part of an airplane. As shown in FIG. 8(f), the electronic device 310 may be at least a part of a ship. As shown in FIG. 8(g), the electronic device 310 may be at least a part of a submarine. As shown in FIG. 8(h), the electronic device 310 may be at least a part of a car. The electronic device 310 may include, for example, at least one of a robot and a moving object.

[0039] 9(a) and 9(b) are schematic diagrams illustrating applications of the sensor according to the embodiment. As shown in FIG. 9(a), a sensor 430 according to the embodiment includes the sensor according to the first embodiment and a transmitting / receiving unit 420. In the example of FIG. 9(a), the sensor 110 is depicted as the sensor. The transmitting / receiving unit 420 can transmit a signal obtained from the sensor 110, for example, by at least one of a wireless and a wired method. The sensor 430 is provided, for example, on a slope surface 410 of a road 400 or the like. The sensor 430 can monitor, for example, the state of a facility (for example, infrastructure) or the like. The sensor 430 may be, for example, a state monitoring device.

[0040] For example, the sensor 430 detects a change in the condition of the slope surface 410 of the road 400 with high accuracy. The change in the condition of the slope surface 410 includes, for example, at least one of a change in the inclination angle and a change in the vibration state. A signal (inspection result) obtained from the sensor 110 is transmitted by the transceiver unit 420. The condition of a facility (e.g., infrastructure) can be monitored, for example, continuously.

[0041] As shown in FIG. 9(b), the sensor 430 is provided, for example, in a part of a bridge 460. The bridge 460 is provided on a river 470. For example, the bridge 460 includes at least one of a main girder 450 and a pier 440. The sensor 430 is provided in at least one of the main girder 450 and the pier 440. For example, due to deterioration or the like, the angle of at least one of the main girder 450 and the pier 440 may change. For example, the vibration state of at least one of the main girder 450 and the pier 440 may change. The sensor 430 detects these changes with high accuracy. The detection result can be transmitted to any location by the transmitting / receiving unit 420. Anomalies can be effectively detected.

[0042] The embodiments may include the following technical solutions. (Technical proposal 1) A first member; a first substrate, the direction from the first member to the first substrate being along a first direction, and a first member thickness of the first member along the first direction being greater than a first substrate thickness of the first substrate along the first direction; a sensor section provided between the first member and the first substrate, the sensor section being fixed to the first member and the first substrate being fixed to the sensor section, the sensor section including a housing and a sensor element provided in the housing, the sensor element including a sensor base, a fixed portion fixed to the sensor base, and a movable portion supported by the fixed portion, the direction from the fixed portion to the sensor base being along the first direction, and a first gap being provided between the sensor base and the movable portion; A sensor equipped with

[0043] (Technical proposal 2) the first substrate includes a first surface and a second surface; the second surface is between the sensor unit and the first surface in the first direction, The second surface faces the sensor unit, The sensor described in Technical Solution 1, wherein the first surface faces a detection member to which the first substrate is fixed.

[0044] (Technical proposal 3) The sensor described in Technical Solution 1 or 2, wherein the density of the first member is higher than the density of the first substrate.

[0045] (Technical proposal 4) The sensor according to any one of Technical Solutions 1 to 3, wherein the mass of the first member is greater than the mass of the movable part.

[0046] (Technical proposal 5) The sensor element further includes a connecting member, A portion of the connection member is supported by the fixed portion, The sensor according to any one of Technical Solutions 1 to 4, wherein the other part of the connection member supports the movable part.

[0047] (Technical proposal 6) The sensor according to any one of Technical Schemes 1 to 5, wherein the pressure inside the housing is lower than 1 atmosphere.

[0048] (Technical proposal 7) Further comprising a first fixing member, the first fixing member is provided between the sensor unit and the first substrate, The sensor according to any one of Technical Solutions 1 to 6, wherein the first fixing member fixes the sensor portion to the first substrate.

[0049] (Technical proposal 8) The sensor described in Technical Solution 7, wherein the first fixing member includes a metal.

[0050] (Technical proposal 9) The movable part is capable of resonating at a first frequency (unit: Hz); a first sound speed (unit: m / s) of the shear wave in the first member is the product of the first frequency and a first wavelength (unit: m) of the shear wave in the first member; The sensor according to any one of Technical Solutions 1 to 8, wherein the first member thickness is 1 / 4 or more of the first wavelength.

[0051] (Technical proposal 10) The sensor described in Technical Proposal 9, wherein the first member thickness is at least 1 time the first wavelength.

[0052] (Technical proposal 11) The sensor described in Technical Proposal 9 or 10, wherein the first member thickness is less than or equal to 5 times the first wavelength.

[0053] (Technical proposal 12) the first member has a first member length in a second direction perpendicular to the first direction, the housing has a housing length in the second direction, The sensor according to any one of Technical Solutions 1 to 9, wherein the length of the first member is 0.9 to 5 times the length of the housing.

[0054] (Technical proposal 13) The movable part is capable of resonating at a first frequency (unit: Hz); The first member has a first member length (unit: m) in a second direction perpendicular to the first direction, a second sound speed (unit: m / s) of the longitudinal wave in the first member is the product of the first frequency and a second wavelength (m) of the longitudinal wave in the first member; The sensor according to any one of Technical Solutions 1 to 8, wherein the first member length is 1 / 4 or more of the second wavelength.

[0055] (Technical proposal 14) The sensor described in Technical Proposal 13, wherein the length of the first member is at least one time the second wavelength.

[0056] (Technical proposal 15) The sensor described in Technical Proposal 13 or 14, wherein the length of the first member is less than or equal to 5 times the second wavelength.

[0057] (Technical proposal 16) The sensor according to any one of Technical Solutions 1 to 15, wherein the first member includes a metal.

[0058] (Technical proposal 17) The first member includes a first partial region and a second partial region, The second partial region is provided between the first partial region and the housing, The sensor according to any one of technical proposals 1 to 15, wherein the second material of the second partial region is different from the first material of the first partial region.

[0059] (Technical proposal 18) The sensor described in Technical Proposal 17, wherein a first partial region thickness along the first direction of the first partial region is thicker than a second partial region thickness along the first direction of the second partial region.

[0060] (Technical proposal 19) A sensor according to Technical Proposal 2; The detection member; A sensor system comprising:

[0061] (Technical proposal 20) A sensor according to any one of technical proposals 1 to 18; a circuit control unit capable of controlling a circuit based on a signal obtained from the sensor; An electronic device comprising:

[0062] According to the embodiments, it is possible to provide a sensor, a sensor system, and an electronic device that enable improved accuracy.

[0063] In this specification, "vertical" and "parallel" do not only mean strictly vertical and strictly parallel, but also include, for example, variations in the manufacturing process, and may mean substantially vertical and substantially parallel.

[0064] The above describes the embodiment of the present invention with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configurations of each element included in the sensor, such as the member, substrate, sensor unit, housing, sensor element, base, fixed unit, movable unit, and control unit, are included in the scope of the present invention as long as a person skilled in the art can implement the present invention in the same way and obtain the same effect by appropriately selecting them from the known range.

[0065] Furthermore, any combination of two or more elements of each of the specific examples, within the scope of technical feasibility, is also included within the scope of the present invention as long as it includes the gist of the present invention.

[0066] In addition, all sensors, sensor systems, and electronic devices that can be implemented by a person skilled in the art by appropriate design modifications based on the sensors, sensor systems, and electronic devices described above as embodiments of the present invention also fall within the scope of the present invention as long as they include the gist of the present invention.

[0067] In addition, within the scope of the concept of the present invention, a person skilled in the art may think of various modifications and alterations, and it will be understood that these modifications and alterations also fall within the scope of the present invention.

[0068] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0069] 10: sensor section, 10B: sensor base, 10C: connection member, 10Cp: part, 10Cq: other part, 10E: sensor element, 10F: fixed section, 10G: first gap, 10M: movable section, 15: movable electrode, 18: housing, 41: first member, 41a, 41b: first and second partial regions, 51: first substrate, 51F: first fixed member, 51a, 51b: first and second surfaces, 70: control section, 81: detection member, 110-112: sensor, 170: circuit control section, 180: circuit, 185: drive device, 210-212: sensor system, 310: electronic device, 400: road, 410: slope surface, 420: transmission / reception section, 430: sensor, 440: pier, 450: girder, 460: bridge, 470: river, D1, D2: 1st and 2nd directions, L18: housing length, L41: 1st member length, P1, P2: 1st and 2nd parameters, S1: signal, t41: 1st member thickness, t51: 1st board thickness

Claims

1. A first member; a first substrate, the direction from the first member to the first substrate being along a first direction, and a first member thickness of the first member along the first direction being greater than a first substrate thickness of the first substrate along the first direction; a sensor section provided between the first member and the first substrate, the sensor section being fixed to the first member and the first substrate being fixed to the sensor section, the sensor section including a housing and a sensor element provided in the housing, the sensor element including a sensor base, a fixed portion fixed to the sensor base, and a movable portion supported by the fixed portion, the direction from the fixed portion to the sensor base being along the first direction, and a first gap being provided between the sensor base and the movable portion; A sensor equipped with

2. the first substrate includes a first surface and a second surface; the second surface is between the sensor unit and the first surface in the first direction, The second surface faces the sensor unit, The sensor according to claim 1 , wherein the first surface faces a detection member to which the first substrate is fixed.

3. The sensor according to claim 1 , wherein the density of the first member is higher than the density of the first substrate.

4. The sensor according to claim 1 , wherein the mass of the first member is greater than the mass of the movable portion.

5. The movable part is capable of resonating at a first frequency (unit: Hz); a first sound speed (unit: m / s) of the shear wave in the first member is the product of the first frequency and a first wavelength (unit: m) of the shear wave in the first member; The sensor according to claim 1 , wherein the first member thickness is equal to or greater than ¼ of the first wavelength.

6. the first member has a first member length in a second direction perpendicular to the first direction; The housing has a housing length in the second direction, The sensor according to claim 1 , wherein the length of the first member is 0.9 to 5 times the length of the housing.

7. The movable part is capable of resonating at a first frequency (unit: Hz); The first member has a first member length (unit: m) in a second direction perpendicular to the first direction, a second sound speed (unit: m / s) of the longitudinal wave in the first member is the product of the first frequency and a second wavelength (m) of the longitudinal wave in the first member; The sensor according to claim 1 , wherein the first member length is equal to or greater than ¼ of the second wavelength.

8. The first member includes a first partial region and a second partial region, The second partial region is provided between the first partial region and the housing, The sensor according to claim 1 or 2, wherein the second material of the second partial region is different from the first material of the first partial region.

9. A sensor according to claim 2; The detection member; A sensor system comprising:

10. A sensor according to claim 1 or 2; a circuit control unit capable of controlling a circuit based on a signal obtained from the sensor; An electronic device comprising:

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