Multilayer capacitor

Abstract

To provide a multi layer capacitor that reduces cutting stress in an internal electrode to suppress contact failures with an external electrode and the capacity reduction.SOLUTION: A multilayer capacitor includes a capacitor body 110 including first internal electrodes 121 and second internal electrodes 122 that are alternately arranged through one of a plurality of dielectric layers 111, and a first external electrode 130 and a second external electrode 140 that respectively arranged at both end parts of the capacitor body. The first internal electrode and the second internal electrode respectively have a plurality of first lead parts 121b and a plurality of second lead parts 122b extending from a first capacity formation part 121a and a second capacity formation part 122a toward an edge face of the capacitor body and being connected to the first external electrode and the second external electrode. The thickness of each of the plurality of first lead parts and the plurality of second lead parts is thinner than the thickness of each of the fist capacity formation part and the second capacity formation part.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present disclosure relates to a stacked capacitor. [Background technology]

[0002] 2. Description of the Related Art A stacked capacitor is a chip-type capacitor that is mounted on a printed circuit board of various electronic products such as video devices, computers, smartphones, and mobile phones and serves to charge or discharge electricity.

[0003] Such a stacked capacitor can be used as a component of various electronic devices due to its advantages of being small in size, high in capacitance, and easy to mount. Recently, as electronic device components have become smaller in size, there has been an increasing demand for stacked capacitors to be smaller in size and have higher capacitance.

[0004] As miniaturization and high capacity continue to advance, there is a demand for thinner internal electrodes. Internal electrodes manufactured using the existing screen printing method have problems such as poor thickness uniformity and technical limitations making it difficult to achieve a thin layer below a certain thickness, which is why there is a need to develop internal electrodes using the sputtering method. Summary of the Invention [Problem to be solved by the invention]

[0005] A multilayer capacitor capable of reducing the cutting stress of internal electrodes, preventing electrode breakage, and improving poor contact with external electrodes and a decrease in capacitance of the capacitor. However, the problem to be solved by the embodiments of the present invention is not limited to the above problem, and can be variously expanded within the scope of the technical ideas included in the present invention. [Means for solving the problem]

[0006] According to an embodiment, a multilayer capacitor includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first direction and the second direction. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and first internal electrodes and second internal electrodes alternately disposed in the first direction with the dielectric layers interposed therebetween, and a first external electrode and a second external electrode respectively disposed at both ends of the capacitor body in the second direction, the first internal electrode forming a first capacitance. a first external electrode including a first capacitance forming portion and a plurality of first lead portions extending from the first capacitance forming portion toward a third surface of the capacitor body and connected to the first external electrode, the second internal electrode including a second capacitance forming portion overlapping the first capacitance forming portion in the first direction and a plurality of second lead portions extending from the second capacitance forming portion toward a fourth surface of the capacitor body and connected to the second external electrode, and in the thickness along the first direction, the thickness of each of the plurality of first lead portions and the plurality of second lead portions is thinner than the thickness of the first capacitance forming portion and the second capacitance forming portion.

[0007] In the width along the third direction, the width of each of the multiple first lead portions may narrow toward the third surface of the capacitor body, and the width of each of the multiple second lead portions may narrow toward the fourth surface of the capacitor body.

[0008] A thickness of each of the first lead portions may be tapered toward one end of the capacitor body, and a thickness of each of the second lead portions may be tapered toward the other end of the capacitor body.

[0009] The plurality of first lead portions and the plurality of second lead portions may each have an upper surface extending in the first direction that is gradually reduced in height in the first direction.

[0010] The first internal electrode and the second internal electrode may be sputtered layers.

[0011] The first internal electrode may further include a third lead portion extending from the first capacitance forming portion toward the fifth surface of the capacitor body and connected to the first external electrode, and a fourth lead portion extending from the first capacitance forming portion toward the sixth surface of the capacitor body and connected to the first external electrode.

[0012] The second internal electrode may further include a fifth lead portion extending from the second capacitance forming portion toward the fifth surface of the capacitor body and connected to the second external electrode, and a sixth lead portion extending from the second capacitance forming portion toward the sixth surface of the capacitor body and connected to the second external electrode.

[0013] In the width along the third direction, the sum of the widths of the portions where each of the multiple first lead portions contact the third surface of the capacitor body may be smaller than the width of the first capacitance forming portion, and the sum of the widths of the portions where each of the multiple second lead portions contact the fourth surface of the capacitor body may be smaller than the width of the second capacitance forming portion.

[0014] The first lead portions and the second lead portions may each include two portions.

[0015] The number of the first lead portions and the number of the second lead portions may each be four.

[0016] According to an embodiment, a multilayer capacitor includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface facing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first direction and the second direction. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and first internal electrodes and second internal electrodes alternately disposed in the first direction with the dielectric layers interposed therebetween, and a first external electrode and a second external electrode respectively disposed at both ends of the capacitor body in the second direction, the first internal electrode being a first capacitance forming portion and the first capacitance forming portion. The second internal electrode may include a plurality of first lead portions extending from a capacitance forming portion toward a third surface of the capacitor body and connected to the first external electrode, and the second internal electrode may include a second capacitance forming portion overlapping with the first capacitance forming portion in the first direction and a plurality of second lead portions extending from the second capacitance forming portion toward a fourth surface of the capacitor body and connected to the second external electrode, and in the width along the third direction, the width of each of the plurality of first lead portions may narrow toward the first external electrode, and the width of each of the plurality of second lead portions may narrow toward the second external electrode.

[0017] The first internal electrode and the second internal electrode may be sputtered layers.

[0018] The first internal electrode may further include a third lead portion extending from the first capacitance forming portion toward the fifth surface of the capacitor body and connected to the first external electrode, and a fourth lead portion extending from the first capacitance forming portion toward the sixth surface of the capacitor body and connected to the first external electrode.

[0019] The second internal electrode may further include a fifth lead portion extending from the second capacitance forming portion toward the fifth surface of the capacitor body and connected to the second external electrode, and a sixth lead portion extending from the second capacitance forming portion toward the sixth surface of the capacitor body and connected to the second external electrode.

[0020] In the width along the third direction, the sum of the widths of the portions where each of the multiple first lead portions contact the third surface of the capacitor body may be smaller than the width of the first capacitance forming portion, and the sum of the widths of the portions where each of the multiple second lead portions contact the fourth surface of the capacitor body may be smaller than the width of the second capacitance forming portion.

[0021] The first lead portions and the second lead portions may each include two portions.

[0022] The number of the first lead portions and the number of the second lead portions may each be four. Effect of the Invention

[0023] According to the multilayer capacitor according to the embodiment, it is possible to reduce the cutting stress of the internal electrodes, prevent electrode breakage, and improve poor contact with the external electrodes and a decrease in the capacitance of the capacitor.

[0024] According to the multilayer capacitor according to the embodiment, the area of ​​the connection between the internal electrode and the external electrode can be reduced, and defects due to the penetration of a plating solution can be improved, thereby improving product reliability.

[0025] According to the multilayer capacitor according to the embodiment, the connectivity between the internal electrodes and the external electrodes is improved, and the cutting stress of the internal electrodes can be dispersed. [Brief description of the drawings]

[0026] [Figure 1] 1 is a perspective view illustrating a multilayer capacitor according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view taken along line II-II' in FIG. [Diagram 3] 2A to 2C are plan views respectively illustrating first and second internal electrodes applied to the multilayer capacitor of FIG. 1 according to an embodiment. [Figure 4] 11A and 11B are plan views showing a first internal electrode and a second internal electrode according to a modified example. [Diagram 5] 6A to 6C are plan views showing a first internal electrode and a second internal electrode according to another embodiment. [Figure 6] 2 is a cross-sectional view taken along line II-II' of FIG. 1 to show a first internal electrode and a second internal electrode according to another embodiment. [Figure 7] FIG. 11 is a cross-sectional view showing a first internal electrode and a second internal electrode according to a modified example. [Figure 8] FIG. 11 is a cross-sectional view showing a first internal electrode and a second internal electrode according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. In the drawings, unnecessary parts are omitted in order to clearly explain the present invention, and the same or similar components are given the same reference numerals throughout the specification. In addition, in the accompanying drawings, some components are exaggerated, omitted, or illustrated in a schematic manner, and the size of each component does not entirely reflect the actual size.

[0028] The attached drawings are merely intended to facilitate understanding of the embodiments disclosed in this specification, and are not intended to limit the technical ideas disclosed in this specification, but are understood to include all modifications, equivalents, and alternatives included in the idea and technical scope of the present invention.

[0029] Terms including ordinal numbers such as first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from another.

[0030] Furthermore, when a part such as a layer, film, region, or plate is said to be "on" or "above" another part, this includes not only the case where it is "directly on" another part, but also the case where there is another part in between. Conversely, when a part is said to be "directly on" another part, it means that there is no other part in between. Furthermore, being "on" or "above" a reference part means being located above or below the reference part, and does not necessarily mean being located "on" or "above" the side opposite to the direction of gravity.

[0031] Throughout the specification, the terms "comprise" or "have" are intended to specify the presence of any feature, numeral, step, operation, component, part, or combination thereof described in the specification, and are understood not to preclude the presence or additional possibility of one or more other features, numerals, steps, operations, components, parts, or combinations thereof. Thus, when a part is said to "comprise" a certain element, this means that it can further include other elements, but not to the exclusion of other elements, unless specifically stated to the contrary.

[0032] Also, throughout the specification, the term "in a plane" means when the subject part is viewed from above, and the term "in cross section" means when the subject part is cut vertically and viewed from the side.

[0033] Throughout the specification, when a part is said to be "coupled" to another part, this includes not only "directly or physically coupled" but also "indirectly or non-contactingly coupled" with another element between them.

[0034] In addition, throughout the specification, when the term "connected" is used, this does not only mean that two or more components are directly connected, but also that two or more components are indirectly connected through other components, or that they are not only physically connected but also electrically connected, or that they are referred to by different names depending on their position or function but are still one body.

[0035] Hereinafter, the directions of the capacitor body 110 are defined to clearly explain the embodiment of the present invention. In the drawings, x, y, and z respectively indicate the length direction, width direction, and thickness direction of the capacitor body 110. Herein, the z-axis direction (thickness direction) may be a direction perpendicular to the wide surface (main surface) of the sheet-shaped component, and may be used as the same concept as the lamination direction in which the dielectric layers 111 are laminated, for example. The x-axis direction (length direction) may be a direction extending parallel to the wide surface (main surface) of the sheet-shaped component and approximately perpendicular to the z-axis direction (thickness direction), and may be a direction in which the first external electrode 130 and the second external electrode 140 are located on both sides, for example. The y-axis direction (width direction) may be a direction extending parallel to the wide surface (main surface) of the sheet-shaped component and approximately perpendicular to the z-axis direction (thickness direction) and the x-axis direction (length direction), and the length of the sheet-shaped component in the x-axis direction (length direction) may be greater than the width in the y-axis direction (width direction).

[0036] Therefore, the first direction in which the dielectric layer 111 and the first internal electrode 121 and the second internal electrode 122 are stacked may be the z-axis direction (thickness direction), and the second and third directions which are perpendicular to the first direction and perpendicular to each other may be the x-axis direction (length direction) and y-axis direction (width direction), respectively.

[0037] Fig. 1 is a perspective view illustrating a multilayer capacitor according to an embodiment of the present invention, and Fig. 2 is a cross-sectional view taken along line II-II' in Fig. 1. Fig. 2 illustrates an xz cross section passing through a point where the first lead portion 121b and the second lead portion 122b contact the first external electrode 130 and the second external electrode 140.

[0038] 1 and 2, a multilayer capacitor 100 according to the present embodiment includes a capacitor body 110, a first external electrode 130, and a second external electrode 140. The multilayer capacitor 10 ... first external electrode 130 and a second external electrode 140.

[0039] The capacitor body 110 includes a plurality of dielectric layers 111, and a plurality of first internal electrodes 121 and second internal electrodes 122 that are alternately arranged in the z-axis direction with the dielectric layers 111 interposed therebetween.

[0040] The capacitor body 110 is formed by stacking a plurality of dielectric layers 111 in the z-axis direction and then sintering them, and the boundaries between adjacent dielectric layers 111 of the capacitor body 110 can be integrated to such an extent that they are difficult to see without using a scanning electron microscope (SEM).

[0041] The capacitor body 110 may have a predetermined thickness in the z-axis direction, a predetermined length in the x-axis direction, and a predetermined width in the y-axis direction, and may be substantially hexahedral in shape, however, the shape and dimensions of the capacitor body 110 and the number of laminated dielectric layers 111 are not limited to those shown in the drawings of this embodiment.

[0042] For ease of explanation, in this embodiment, the two surfaces of the capacitor body 110 facing each other in the z direction are defined as the first surface S1 and the second surface S2, the two surfaces connected to the first surface S1 and the second surface S2 facing each other in the x direction are defined as the third surface S3 and the fourth surface S4, and the two surfaces connected to the first surface S1 and the second surface S2 and the third surface S3 and the fourth surface S4 facing each other in the y direction are defined as the fifth surface S5 and the sixth surface S6. Also, in this embodiment, the mounting surface of the multilayer capacitor 100 may be the first surface S1 of the capacitor body 110.

[0043] The dielectric layer 111 may include a ceramic material with a high dielectric constant, such as a barium titanate (BaTiO3)-based or strontium titanate (SrTiO3)-based ceramic powder, but the present invention is not limited thereto as long as sufficient capacitance can be obtained.

[0044] In addition to the ceramic powder, ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be further added to the dielectric layer 111. The ceramic additives may be, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), etc.

[0045] The capacitor body 110 may include an active area that contributes to forming the capacitance of the capacitor, and an upper cover 112 and a lower cover 113 that are formed on the upper and lower parts of the active area in the z-axis direction as upper and lower margins.

[0046] The upper cover 112 and the lower cover 113 may have the same material and structure as the dielectric layer 111, except that they do not include internal electrodes.

[0047] Such upper cover 112 and lower cover 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the z-axis direction on the upper and lower surfaces of the active area, respectively, and may essentially serve to prevent damage to the first internal electrode 121 and the second internal electrode 122 due to physical or chemical stress.

[0048] The first internal electrode 121 and the second internal electrode 122 are electrodes to which different polarities are applied, are alternately arranged along the z-axis direction with the dielectric layer 111 interposed therebetween, and one end of each of the first internal electrode 121 and the second internal electrode 122 may be exposed from the third surface S3 and the fourth surface S4 of the capacitor body 110, respectively.

[0049] The first internal electrode 121 and the second internal electrode 122 can be electrically insulated from each other by a dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122 .

[0050] In this manner, the ends of the first internal electrode 121 and the second internal electrode 122 alternately exposed through the third surface S3 and the fourth surface S4 of the capacitor body 110 can be electrically connected to the first external electrode 130 and the second external electrode 140 disposed on the third surface S3 and the fourth surface S4 of the capacitor body 110, respectively, which will be described later. Therefore, the bonding strength between the internal electrodes and the external electrodes can be improved, contact failure can be reduced, and a decrease in the capacitance of the multilayer capacitor 100 can be prevented.

[0051] In addition, the material for forming the first internal electrode 121 and the second internal electrode 122 is not particularly limited. The first internal electrode 121 and the second internal electrode 122 may be a sputtering layer. That is, the first and second electrode layers may be sputtering layers formed by a sputtering process. By forming the first internal electrode 121 and the second internal electrode 122 by the sputtering process, a pattern can be formed more precisely than when a conductive paste is used.

[0052] The first internal electrode 121 may include a first capacitance forming portion 121a and a plurality of first lead portions 121b. The first capacitance forming portion 121a may be a portion located away from the third to sixth faces S3, S4, S5, and S6 of the capacitor body 110 and contributing to forming the capacitance of the capacitor. The first lead portion 121b may be a portion extending from the first capacitance forming portion 121a to be exposed toward the third face S3 of the capacitor body 110 and connected to the first external electrode 130.

[0053] The second internal electrode 122 may include a second capacitance forming portion 122a and a plurality of second lead portions 122b. The second capacitance forming portion 122a may be a portion located away from the third to sixth faces S3, S4, S5, and S6 of the capacitor body 110, overlapping with the first capacitance forming portion 121a in the z-axis direction, and contributing to the formation of the capacitance of the capacitor. The second lead portion 122b may be a portion extending from the second capacitance forming portion 122a to be exposed toward the fourth face S4 of the capacitor body 110 and connected to the second external electrode 140.

[0054] The first lead portion 121b and the second lead portion 122b may be arranged to be offset from each other in the length direction of the capacitor body 110 and may be alternately exposed at both ends of the capacitor body 110 along the length direction.

[0055] With the above-described configuration, when a predetermined voltage is applied to the first external electrode 130 and the second external electrode 140, electric charges are accumulated between the first internal electrode 121 and the second internal electrode 122.

[0056] Here, the capacitance of the multilayer capacitor 100 is proportional to the overlapping area of ​​the first capacitance forming portion 121a of the first internal electrode 121 and the second capacitance forming portion 122a of the second internal electrode 122, which overlap each other along the z-axis direction in the active region of the capacitor body 110.

[0057] The first external electrode 130 and the second external electrode 140 are provided with voltages of different polarities, are disposed at both ends in the x-axis direction of the capacitor body 110, and are electrically connected to exposed portions of the first internal electrode 121 and the second internal electrode 122, respectively. For example, the first external electrode 130 may be electrically connected to a plurality of first lead portions 121b, and the second external electrode 140 may be electrically connected to a second lead portion 122b, which will be described later.

[0058] The first external electrode 130 may include a first conductive layer 131 disposed on a surface of the capacitor body 110 and connected to the first internal electrode 121, a first inner plating layer 132 disposed to cover the first conductive layer 131, and a first outer plating layer 133 disposed to cover the first inner plating layer 132. The second external electrode 140 may include a second conductive layer 141 disposed on a surface of the capacitor body 110 and connected to the second internal electrode 122, a second inner plating layer 142 disposed to cover the second conductive layer 141, and a second outer plating layer 143 disposed to cover the second inner plating layer 142.

[0059] The first conductive layer 131 may include a first connection portion 131a and a first band portion 131b.

[0060] The first connection portion 131a may be located on the third surface S3 of the capacitor body 110 and connected to an exposed portion of the first internal electrode 121. Specifically, the first connection portion 131a may be connected to a plurality of first lead portions 121b exposed from the third surface S3 of the capacitor body 110.

[0061] The first band portion 131b may be a portion extending from the first connection portion 131a to a portion of the first surface S1 of the capacitor body 110. Here, the first band portion 131b may further extend to a portion of the fifth surface S5 and the sixth surface S6 of the capacitor body 110 and a portion of the second surface S2 in order to improve the fixing strength.

[0062] The second conductive layer 141 may include a second connection portion 141a and a second band portion 141b.

[0063] The second connection portion 141a may be located on a fourth surface S4 of the capacitor body 110 and connected to an exposed portion of the second internal electrode 122. Specifically, the second connection portion 141a may be connected to a plurality of second lead portions 122b exposed from the fourth surface S4 of the capacitor body 110.

[0064] The second band portion 141b may be a portion extending from the second connection portion 141a to a portion of the first surface S1 of the capacitor body 110. Here, the second band portion 141b may further extend to a portion of the fifth surface S5 and the sixth surface S6 of the capacitor body 110 and a portion of the second surface S2 in order to improve the fixing strength.

[0065] The first conductive layer 131 and the second conductive layer 141 may include at least one of copper (Cu) and silver (Ag), and may further include glass and epoxy, etc. The first conductive layer 131 and the second conductive layer 141 may be formed by applying a conductive paste containing a metal and baking it.

[0066] The first inner plating layer 132 and the second inner plating layer 142 may be formed containing nickel (Ni) or phosphorus (P). Also, the first inner plating layer 132 and the second inner plating layer 142 may be formed by plating a first metal layer containing nickel and phosphorus on the first conductive layer 131 and the second conductive layer 141. The first inner plating layer 132 and the second inner plating layer 142 may be formed by electroless plating. If the first inner plating layer 132 and the second inner plating layer 142 are formed by electroless plating in this way, the plating characteristics are not significantly different from those of electrolytic plating, but the plating has better corrosion resistance than a coating formed by electrolytic plating, and the plating grows almost the same at each position, so that the plating thickness is uniform. Also, when electroless plating is performed, plating can be performed only on the plated body without a dummy, so that plating preparation work and defective screening work of the plated body after plating can be performed more easily.

[0067] The first outer plating layer 133 and the second outer plating layer 143 may be formed containing palladium (Pd) or phosphorus (P). The first outer plating layer 133 and the second outer plating layer 143 may be formed by electrolessly plating a second metal layer containing palladium and phosphorus on the first inner plating layer 132 and the second inner plating layer 142, respectively. The first outer plating layer 133 and the second outer plating layer 143 serve to prevent the nickel components of the first inner plating layer 132 and the second inner plating layer 142 from oxidizing, and therefore may be formed thinly using a material containing a precious metal that is less likely to oxidize. If the thickness of the first outer plating layer 133 and the second outer plating layer 143 is increased, the possibility of problems such as breakage of the plating layer may increase. By forming the first outer plating layer 133 and the second outer plating layer 143 by electroless plating in this manner, it is possible to provide better corrosion resistance than a coating formed by electrolytic plating while not significantly different in plating characteristics compared to electrolytic plating, and the plating can grow roughly the same in each position, providing a uniform plating thickness.

[0068] The structures of the first internal electrode 121 and the second internal electrode 122 will be specifically described below with reference to FIGS.

[0069] FIG. 3 is a plan view showing a first internal electrode and a second internal electrode applied to the multilayer capacitor of FIG. 1 according to one embodiment, FIG. 4 is a plan view showing a first internal electrode and a second internal electrode according to a modified example, and FIG. 5 is a plan view showing a first internal electrode and a second internal electrode according to another embodiment.

[0070] Referring to FIG. 3(a), a plurality of first lead portions 121b may be disposed at one end of the first capacitance forming portion 121a. For example, two first lead portions 121b may be disposed at one end of the first capacitance forming portion 121a, but the present invention is not limited thereto. The width of the first lead portion 121b along the y-axis direction may be smaller than the width of the first capacitance forming portion 121a along the y-axis direction. The width of the first internal electrode 121 and the second internal electrode 122 may be the maximum value, minimum value, or arithmetic mean value of the lengths of a plurality of line segments connecting a point on the rear surface of the first internal electrode 121 and the second internal electrode 122 to the front surface along the y-axis direction in an xy cross section passing through a point where the first internal electrode 121 or the second internal electrode 122 and the first external electrode 130 or the second external electrode 140 contact each other. The width of the first internal electrode 121 and the second internal electrode 122 may be measured using an optical microscope, a scanning electron microscope, or the like.

[0071] Furthermore, the sum of the widths of each of the multiple first lead portions 121b along the y-axis direction may be smaller than the width of the first capacitance forming portion 121a along the y-axis direction. The widths of each of the multiple first lead portions 121b along the y-axis direction may gradually narrow toward the first external electrode 130. The widths of each of the multiple first lead portions 121b along the y-axis direction may gradually narrow toward the third surface S3 of the capacitor body 110. Therefore, the sum of the widths of the portions of each of the multiple first lead portions 121b in contact with the third surface S3 of the capacitor body 110 along the y-axis direction may be smaller than the width of the first capacitance forming portion 121a along the y-axis direction.

[0072] Referring to FIG. 3B, a plurality of second lead portions 122b may be disposed at one end of the second capacitance forming portion 122a. For example, two second lead portions 122b may be disposed at one end of the second capacitance forming portion 122a. The width of the second lead portion 122b along the y-axis direction may be smaller than the width of the second capacitance forming portion 122a along the y-axis direction. The sum of the widths of the plurality of second lead portions 122b along the y-axis direction may be smaller than the width of the second capacitance forming portion 122a along the y-axis direction. The width of each of the plurality of second lead portions 122b along the y-axis direction may be gradually narrowed toward the second external electrode 140. The width of each of the plurality of second lead portions 122b along the y-axis direction may be gradually narrowed toward the fourth surface S4 of the capacitor body 110. Therefore, the sum of the widths in the y-axis direction of the portions of the second lead portions 122b that contact the fourth surface S4 of the capacitor body 110 may be smaller than the width in the y-axis direction of the second capacitance forming portion 122a.

[0073] As described above, by forming the width of the portion where the first lead portion 121b and the second lead portion 122b contact the capacitor body 110, which corresponds to the cutting region in the manufacturing process of the multilayer capacitor, smaller than the width of the first capacitance forming portion 121a and the second capacitance forming portion 122a, it is possible to reduce cutting stress, prevent electrode breakage, and improve poor contact with the external electrodes and capacitance reduction. In addition, by forming the width of each of the first lead portions 121b and the second lead portions 122b in the y-axis direction to gradually narrow toward the first external electrode 130 and the second external electrode 140, it is possible to reduce the area of ​​the connection between the internal electrode and the external electrode, improve defects due to plating solution penetration, improve product reliability, and easily control the shape of the internal electrode.

[0074] Referring to FIG. 4(a), a plurality of first lead portions 121b may be disposed at one end of the first capacitance forming portion 121a. For example, four first lead portions 121b may be disposed at one end of the first capacitance forming portion 121a, but the present invention is not limited thereto. The width of the first lead portion 121b along the y-axis direction may be smaller than the width of the first capacitance forming portion 121a along the y-axis direction. Also, the sum of the widths of the plurality of first lead portions 121b along the y-axis direction may be smaller than the width of the first capacitance forming portion 121a along the y-axis direction. The width of each of the plurality of first lead portions 121b along the y-axis direction may be gradually narrowed toward the first external electrode 130. The width of each of the plurality of first lead portions 121b along the y-axis direction may be gradually narrowed toward the third surface S3 of the capacitor body 110. Therefore, the sum of the widths of the portions of the first lead portions 121b in contact with the third surface S3 of the capacitor body 110 along the y-axis direction may be smaller than the width of the first capacitance forming portion 121a along the y-axis direction. Each of the first lead portions 121b may include a triangular cross-sectional shape.

[0075] Referring to FIG. 4B, a plurality of second lead portions 122b may be disposed at one end of the second capacitance forming portion 122a. For example, four second lead portions 122b may be disposed at one end of the second capacitance forming portion 122a. The width of the second lead portion 122b along the y-axis direction may be smaller than the width of the second capacitance forming portion 122a along the y-axis direction. The sum of the widths of the second lead portions 122b along the y-axis direction may be smaller than the width of the second capacitance forming portion 122a along the y-axis direction. The width of each of the second lead portions 122b along the y-axis direction may be gradually narrowed toward the second external electrode 140. The width of each of the second lead portions 122b along the y-axis direction may be gradually narrowed toward the fourth surface S4 of the capacitor body 110. Therefore, the sum of the widths of the portions of the second lead portions 122b in contact with the fourth surface S4 of the capacitor body 110 along the y-axis direction may be smaller than the width of the second capacitance forming portion 122a along the y-axis direction. Each of the second lead portions 122b may include a triangular cross-sectional shape.

[0076] The first lead portion 121b and the second lead portion 122b according to this modified example may have a smaller width in the y-axis direction and may have a larger number of them than those in Fig. 3. Therefore, the connectivity between the first lead portion 121b and the second lead portion 122b and the first external electrode 130 and the second external electrode 140 may be improved.

[0077] As described above, in the manufacturing process of the multilayer capacitor, the width of the portion where the first lead portion 121b and the second lead portion 122b, which corresponds to the cutting region, contact the capacitor body 110 is made smaller than the width of the first capacitance forming portion 121a and the second capacitance forming portion 122a, thereby reducing cutting stress, preventing electrode breakage, and improving poor contact with the external electrodes and capacitance reduction. In addition, by forming the width of each of the first lead portions 121b and the second lead portions 122b in the y-axis direction to gradually narrow toward the first external electrode 130 and the second external electrode 140, the area of ​​the connection between the internal electrode and the external electrode is reduced, improving defects due to plating solution penetration and improving product reliability.

[0078] 5(a), a first internal electrode 121 according to another embodiment may include a first capacitance forming portion 121a, a plurality of first lead portions 121b, a third lead portion 121c, and a fourth lead portion 121d.

[0079] A plurality of first lead portions 121b may be disposed at one end of the first capacitance forming portion 121a. For example, four first lead portions 121b may be disposed at one end of the first capacitance forming portion 121a, but the present invention is not limited thereto. The width of the first lead portion 121b along the y-axis direction may be smaller than the width of the first capacitance forming portion 121a along the y-axis direction. The sum of the widths of the first lead portions 121b along the y-axis direction may be smaller than the width of the first capacitance forming portion 121a along the y-axis direction. The width of each of the first lead portions 121b along the y-axis direction may be gradually narrowed toward the first external electrode 130. The width of each of the first lead portions 121b along the y-axis direction may be gradually narrowed toward the third surface S3 of the capacitor body 110. Therefore, the sum of the widths of the portions of the first lead portions 121b in contact with the third surface S3 of the capacitor body 110 along the y-axis direction may be smaller than the width of the first capacitance forming portion 121a along the y-axis direction. Each of the first lead portions 121b may include a triangular cross-sectional shape.

[0080] The third lead portion 121c extends from the first capacitance forming portion 121a toward the fifth surface S5 of the capacitor body 110 and can be connected to the first external electrode 130. The fourth lead portion 121d extends from the first capacitance forming portion 121a toward the sixth surface S6 of the capacitor body 110 and can be connected to the first external electrode 130.

[0081] Referring to FIG. 5(b), the second internal electrode 122 according to another embodiment may include a second capacitance forming portion 122a, a plurality of second lead portions 122b, a fifth lead portion 122c, and a sixth lead portion 122d.

[0082] A plurality of second lead portions 122b may be disposed at one end of the second capacitance forming portion 122a. For example, four second lead portions 122b may be disposed at one end of the second capacitance forming portion 122a, but the present invention is not limited thereto. The width of the second lead portion 122b along the y-axis direction may be smaller than the width of the second capacitance forming portion 122a along the y-axis direction. The sum of the widths of the second lead portions 122b along the y-axis direction may be smaller than the width of the second capacitance forming portion 122a along the y-axis direction. The width of each of the second lead portions 122b along the y-axis direction may be gradually narrowed toward the second external electrode 140. The width of each of the second lead portions 122b along the y-axis direction may be gradually narrowed toward the fourth surface S4 of the capacitor body 110. Therefore, the sum of the widths of the portions of the second lead portions 122b in contact with the fourth surface S4 of the capacitor body 110 along the y-axis direction may be smaller than the width of the second capacitance forming portion 122a along the y-axis direction. Each of the second lead portions 122b may include a triangular cross-sectional shape.

[0083] In addition, the fifth lead portion 122c extends from the second capacitance forming portion 122a toward the fifth surface S5 of the capacitor body 110 and can be connected to the second external electrode 140. The sixth lead portion 122d extends from the second capacitance forming portion 122a toward the sixth surface S6 of the capacitor body 110 and can be connected to the second external electrode 140.

[0084] The first internal electrode 121 and the second internal electrode 122 according to the present embodiment may further include third to sixth lead portions 121c, 121d, 122c, and 122d compared to Fig. 4. Therefore, the connectivity between the first internal electrode 121 and the second internal electrode 122 and the first external electrode 130 and the second external electrode 140 is improved, and the cutting stress of the first internal electrode 121 and the second internal electrode 122 can be dispersed.

[0085] As described above, by forming the width of the portion where the first lead portion 121b and the second lead portion 122b contact the capacitor body 110, which corresponds to the cutting region in the manufacturing process of the multilayer capacitor, smaller than the width of the first capacitance forming portion 121a and the second capacitance forming portion 122a, it is possible to reduce cutting stress, prevent electrode breakage, and improve poor contact with the external electrodes and capacitance reduction. In addition, by forming the width of each of the first lead portions 121b and the second lead portions 122b in the y-axis direction to gradually narrow toward the first external electrode 130 and the second external electrode 140, it is possible to reduce the area of ​​the connection between the internal electrode and the external electrode, improve defects due to plating solution penetration, and improve product reliability.

[0086] FIG. 6 is a cross-sectional view taken along line II-II' in FIG. 1 to show a first internal electrode and a second internal electrode according to another embodiment, and FIG. 7 and FIG. 8 are cross-sectional views showing a first internal electrode and a second internal electrode according to modified examples.

[0087] 6, the thickness of each of the first lead portions 121b along the z-axis direction may be thinner than the thickness of the first capacitance forming portion 121a. Also, the thickness of each of the second lead portions 122b along the z-axis direction may be thinner than the thickness of the second capacitance forming portion 122a. The thickness of the first internal electrode 121 and the second internal electrode 122 may be the maximum value, the minimum value, or the arithmetic average value of the lengths of a plurality of line segments connecting a point on the upper surface of the first internal electrode 121 and the second internal electrode 122 to the lower surface along the z-axis direction in an xz cross section passing through a point where the first internal electrode 121 and the second internal electrode 122 contact the first external electrode 130 and the second external electrode 140. The thickness of the first internal electrode 121 and the second internal electrode 122 may be measured using an optical microscope, a scanning electron microscope, or the like.

[0088] The thickness of each of the plurality of first lead portions 121b along the z-axis direction may become thinner toward one end of the capacitor body 110, and the thickness of each of the plurality of second lead portions 122b along the z-axis direction may become thinner toward the other end of the capacitor body 110. Specifically, the thickness of each of the plurality of first lead portions 121b along the z-axis direction may become gradually thinner along the x-axis direction toward the third surface S3 of the capacitor body 110. In addition, the thickness of each of the plurality of second lead portions 122b along the z-axis direction may become gradually thinner along the x-axis direction toward the fourth surface S4 of the capacitor body 110.

[0089] Each of the first lead portions 121b and the second lead portions 122b may have a shape in which the height of the upper surface along the z-axis direction gradually decreases. However, this is not limited to this, and any shape is possible as long as the thickness of each of the first lead portions 121b and the second lead portions 122b along the z-axis direction is thin. For example, referring to FIG. 7, each of the first lead portions 121b and the second lead portions 122b may have a shape in which the height of the lower surface along the z-axis direction gradually increases. As another example, referring to FIG. 8, each of the first lead portions 121b and the second lead portions 122b may have a shape in which the height of the upper surface is low and the height of the lower surface is high.

[0090] For example, referring to both Figures 3 and 4, the first internal electrode 121 may include a plurality of first lead portions 121b, and the second internal electrode 122 may include a plurality of second lead portions 122b, and the thickness of each of the plurality of first lead portions 121b along the z-axis direction may become thinner toward one end of the capacitor body 110, and the thickness of each of the plurality of second lead portions 122b along the z-axis direction may become thinner toward the other end of the capacitor body 110.

[0091] 5, the first internal electrode 121 may include a plurality of first lead portions 121b, a third lead portion 121c, and a fourth lead portion 121d, and the second internal electrode 122 may include a plurality of second lead portions 122b, a fifth lead portion 122c, and a sixth lead portion 122d. The thickness of each of the first lead portions 121b along the z-axis direction may be thinner toward one end of the capacitor body 110, and the thickness of each of the second lead portions 122b along the z-axis direction may be thinner toward the other end of the capacitor body 110. Alternatively, the thickness of each of the first lead portions 121b, the third lead portion 121c, and the fourth lead portion 121d along the z-axis direction may be thinner toward one end of the capacitor body 110, and the thickness of each of the second lead portions 122b, the fifth lead portion 122c, and the sixth lead portion 122d along the z-axis direction may be thinner toward the other end of the capacitor body 110.

[0092] As described above, by forming the thickness of the portion where the first lead portion 121b and the second lead portion 122b, which corresponds to the cutting region during the manufacturing process of the multilayer capacitor, and the capacitor body 110 are in contact with each other thinner than the thickness of the first capacitance forming portion 121a and the second capacitance forming portion 122a, it is possible to reduce cutting stress, prevent electrode breakage, and improve poor contact with external electrodes and capacitance reduction.

[0093] Although a preferred embodiment of the present invention has been described above, the present invention is not limited thereto, and can be embodied in various modified forms within the scope of the claims, the description of the invention, and the accompanying drawings, which of course also fall within the scope of the present invention. [Explanation of symbols]

[0094] 100: Multilayer capacitor 110: Capacitor body 121: 1st internal electrode 121a: First capacitance forming part 121b: First lead part 121c: 3rd lead part 121d: 4th lead part 122:Second internal electrode 122a: Second capacitance forming part 122b: Second lead part 122c: 5th lead 122d: 6th lead section 130: 1st external electrode 140: 2nd external electrode

Claims

1. a capacitor body including a first surface and a second surface opposed to each other in a first direction, a third surface and a fourth surface opposed to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposed to each other in a third direction perpendicular to the first direction and the second direction, the capacitor body including a plurality of dielectric layers and first internal electrodes and second internal electrodes alternately disposed in the first direction with the dielectric layers interposed therebetween; a first external electrode and a second external electrode disposed at both ends of the capacitor body in the second direction, the first internal electrode includes a first capacitance forming portion and a plurality of first lead portions extending from the first capacitance forming portion toward a third surface of the capacitor body and connected to the first external electrode; the second internal electrode includes a second capacitance forming portion overlapping the first capacitance forming portion in the first direction, and a plurality of second lead portions extending from the second capacitance forming portion toward a fourth surface of the capacitor body and connected to the second external electrode; A multilayer capacitor, wherein the thickness of each of the plurality of first lead portions and the plurality of second lead portions along the first direction is thinner than the thickness of each of the first capacitance forming portion and the second capacitance forming portion.

2. In the width along the third direction, a width of each of the first lead portions narrows toward the third surface of the capacitor body; The multilayer capacitor of claim 1 , wherein a width of each of the second lead portions narrows toward the fourth surface of the capacitor body.

3. a thickness of each of the first lead portions decreases toward one end of the capacitor body; 2. The multilayer capacitor according to claim 1, wherein a thickness of each of the second lead portions decreases toward the other end of the capacitor body.

4. The multilayer capacitor according to claim 3 , wherein the heights of the upper surfaces of the first lead portions and the second lead portions along the first direction gradually decrease.

5. 2. The multilayer capacitor according to claim 1, wherein the first internal electrode and the second internal electrode are sputtering layers.

6. The first internal electrode is a third lead portion extending from the first capacitance forming portion toward the fifth surface of the capacitor body and connected to the first external electrode; and 2. The multilayer capacitor of claim 1, further comprising a fourth lead portion extending from the first capacitance forming portion toward the sixth surface of the capacitor body and connected to the first external electrode.

7. The second internal electrode is a fifth lead portion extending from the second capacitance forming portion toward the fifth surface of the capacitor body and connected to the second external electrode; and 2 . The multilayer capacitor of claim 1 , further comprising a sixth lead portion extending from the second capacitance forming portion toward the sixth surface of the capacitor body and connected to the second external electrode.

8. In the width along the third direction, a sum of widths of portions of the first lead portions in contact with the third surface of the capacitor body is smaller than a width of the first capacitance forming portion; 2 . The multilayer capacitor according to claim 1 , wherein a total width of a portion where each of the second lead portions contacts the fourth surface of the capacitor body is smaller than a width of the second capacitance forming portion.

9. The multilayer capacitor according to claim 1 , wherein the number of the first lead portions and the number of the second lead portions are each two.

10. The multilayer capacitor according to claim 1 , wherein the number of the first lead portions and the number of the second lead portions are each four.

11. a capacitor body including a first surface and a second surface opposed to each other in a first direction, a third surface and a fourth surface opposed to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposed to each other in a third direction perpendicular to the first direction and the second direction, the capacitor body including a plurality of dielectric layers and first internal electrodes and second internal electrodes alternately disposed in the first direction with the dielectric layers interposed therebetween; a first external electrode and a second external electrode disposed at both ends of the capacitor body in the second direction, the first internal electrode includes a first capacitance forming portion and a plurality of first lead portions extending from the first capacitance forming portion toward a third surface of the capacitor body and connected to the first external electrode; the second internal electrode includes a second capacitance forming portion overlapping the first capacitance forming portion in the first direction, and a plurality of second lead portions extending from the second capacitance forming portion toward a fourth surface of the capacitor body and connected to the second external electrode; In the width along the third direction, the width of each of the first lead portions narrows toward the first external electrode, a width of each of the second lead portions narrowing toward the second external electrode.

12. The multilayer capacitor according to claim 11 , wherein the first internal electrode and the second internal electrode are sputtering layers.

13. The first internal electrode is a third lead portion extending from the first capacitance forming portion toward the fifth surface of the capacitor body and connected to the first external electrode; and The multilayer capacitor of claim 11 , further comprising a fourth lead portion extending from the first capacitance forming portion toward the sixth surface of the capacitor body and connected to the first external electrode.

14. The second internal electrode is a fifth lead portion extending from the second capacitance forming portion toward the fifth surface of the capacitor body and connected to the second external electrode; and The multilayer capacitor of claim 11 , further comprising a sixth lead portion extending from the second capacitance forming portion toward the sixth surface of the capacitor body and connected to the second external electrode.

15. In the width along the third direction, a sum of widths of portions of the first lead portions in contact with the third surface of the capacitor body is smaller than a width of the first capacitance forming portion; 12. The multilayer capacitor according to claim 11, wherein a total width of a portion where each of the second lead portions contacts the fourth surface of the capacitor body is smaller than a width of the second capacitance forming portion.

16. The multilayer capacitor according to claim 11 , wherein the number of the first lead portions and the number of the second lead portions are each two.

17. The multilayer capacitor according to claim 11 , wherein the number of the first lead portions and the number of the second lead portions are each four.

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