Wiring accessory

Abstract

To provide a wiring accessory that can improve heat dissipation while maintaining internal volume.SOLUTION: A wiring accessory 1 has a board (e.g., parent board 100) on which a plurality of electronic components are arranged, a case (e.g., body C3) that houses the board, spacer 9, and heat dissipation member 60. The spacer 9 is placed between the board and the case and is in contact with the board and the case. The heat dissipation member 60 is positioned between the board and the case. The board, case, and spacer 9 are fastened together with screws 6. The plurality of electronic components includes heat-generating components positioned between the board and the case. The heat dissipation member 60 is designed to cover the heat-generating components. The heat dissipation member 60 is in contact with the board, the heat-generating components, and the case.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates generally to wiring fixtures, and more particularly to wiring fixtures that include a substrate. [Background technology]

[0002] A conventional wiring device is a Universal Serial Bus (USB) outlet (wiring device) shown in Patent Document 1. The USB outlet described in Patent Document 1 includes a housing having a cover and a body. The body has a storage recess. Circuit components are stored in the storage recess. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-178097 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, USB outlets (wiring devices) have been equipped with many electronic components, etc., and there is a tendency for the electronic components to generate more heat. Furthermore, it is necessary to ensure the internal volume of the USB outlet in order to accommodate the many electronic components, etc.

[0005] The present disclosure has been made in consideration of the above-mentioned problems, and aims to provide a wiring accessory that can improve heat dissipation while ensuring internal volume. [Means for solving the problem]

[0006] A wiring device according to one aspect of the present disclosure includes a substrate on which a plurality of electronic components are arranged, a case for housing the substrate, a spacer, and a heat dissipation member. The spacer is arranged between the substrate and the case and is in contact with the substrate and the case. The heat dissipation member is arranged between the substrate and the case. The substrate, the case, and the spacer are fastened by screws. The plurality of electronic components include a heat generating component arranged between the substrate and the case. The heat dissipation member is provided so as to cover the heat generating component. The heat dissipation member is in contact with the substrate, the heat generating component, and the case. A wiring device according to one aspect of the present disclosure includes a substrate on which a plurality of electronic components are arranged, a case for housing the substrate, a spacer, a heat dissipation member, and an insulating sheet. The spacer is arranged between the substrate and the case and is in contact with the substrate and the case. The heat dissipation member is arranged between the substrate and the case. The insulating sheet provides insulation between the plurality of electronic components and the case. The substrate, the case, and the spacer are fastened together by screws. The insulating sheet is provided with an opening into which the heat dissipation member is fitted. Effect of the Invention

[0007] According to the present disclosure, it is possible to improve heat dissipation while ensuring the internal volume. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a block diagram showing a configuration of a wiring accessory according to one embodiment. [Diagram 2] FIG. 2 is another block diagram showing the configuration of the wiring device. [Diagram 3] FIG. 3 is a perspective view of the wiring device. [Figure 4] FIG. 4 is an exploded perspective view of the wiring device. [Diagram 5] FIG. 5 is a cross-sectional view taken along line X1-X1 in FIG. [Figure 6]FIG. 6 is a cross-sectional view taken along line X2-X2 in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The embodiments and modifications described below are merely examples of the present disclosure, and the present disclosure is not limited to the following embodiments and modifications. Various modifications other than the following embodiments and modifications are possible according to the design, etc., as long as they do not deviate from the technical idea of ​​the present disclosure.

[0010] (Embodiment) A wiring device 1 according to this embodiment will be described below with reference to Figs.

[0011] (1) Overview The wiring device 1 according to the present embodiment is, for example, a USB outlet to which a USB plug provided at the tip of a USB (Universal Serial Bus) cable can be connected, and satisfies the USB-PD (Power Delivery) standard. For example, the wiring device 1 complies with the charging standard of USB-PD3.0 or later. Since the wiring device 1 complies with the USB-PD charging standard, it can output a relatively large amount of power, for example, 240 W (48 V, 5 A) or 100 W (20 V, 5 A). The wiring device 1 according to the present embodiment supplies power to an electric device (for example, a smartphone) electrically connected to a USB cable. In addition, the wiring device 1 according to the present embodiment is, for example, an indoor wiring device attached to a wall of a building. The building in which the wiring device 1 is installed is, for example, a detached house, each dwelling unit of an apartment building, an office, a store, a nursing care facility, or the like.

[0012] The wiring device 1 is attached to a construction surface (here, a wall surface of a building) in a state where an electric wire is electrically connected to the wiring device 1. In this wiring device 1, a USB plug of a USB cable is inserted into a through hole 80 (see FIG. 3) formed in the front surface of a cover C2 (see FIG. 3) provided in the wiring device 1, whereby the USB plug is electrically connected and power can be supplied from the wiring device 1 to an electrical device. Here, the wiring device 1 is a recessed wiring device and is attached to the construction surface using a mounting frame. Specifically, the mounting frame to which the wiring device 1 is attached is fixed to, for example, a recessed box, so that the wiring device 1 is attached to the construction surface. The recessed box here is a box-shaped member with an open front surface, and is installed in a wall so that the front surface is exposed forward from a construction hole formed in the construction surface.

[0013] 2, the wiring device 1 includes a mother board 100 (first board) on which a first circuit block 2 is arranged, and a daughter board 200 (second board) on which a second circuit block 3 is arranged. The first circuit block 2 includes at least one of a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3. The daughter board 200 is electrically connected to the mother board 100. In this embodiment, the first circuit block 2 includes both a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3.

[0014] According to this configuration, the circuits included in the wiring device 1 are arranged separately on the mother board 100 and the daughter board 200. That is, the circuits included in the wiring device 1 are divided between the mother board 100 and the daughter board 200. This makes it possible to arrange the daughter board 200 in the space left behind when the mother board 100 is arranged. As a result, the limited space within the wiring device 1 can be effectively utilized. This makes it possible to prevent the wiring device 1 from becoming large.

[0015] 5, the wiring device 1 includes a board (parent board 100) on which a plurality of electronic components are arranged, a case (body C3) that houses the board, a spacer 9, and a heat dissipation member 60. The spacer 9 is disposed between the board and the case and is in contact with the board and the case. The heat dissipation member 60 is disposed between the board and the case. The board, the case, and the spacer 9 are fastened together with screws 6.

[0016] With this configuration, heat generated from multiple electronic components can be dissipated from the case via the heat dissipation member 60. Furthermore, since the board, case, and spacer 9 are fastened together with screws 6, the positioning of the board can be easily performed. Therefore, the internal volume can be secured while improving heat dissipation.

[0017] (2) Composition The wiring device 1 according to this embodiment will be described in detail below. In the following description, unless otherwise specified, the up-down, left-right, and front-rear directions of the wiring device 1 are defined by the arrows shown in Figs. 3 to 6. That is, when the wiring device 1 is attached to a construction surface and viewed from the front, the vertical direction is defined as the up-down direction, the normal direction to the construction surface is defined as the front-rear direction, and the direction perpendicular to both the up-down direction and the front-rear direction is defined as the left-right direction. However, these directions are not intended to define the direction in which the wiring device 1 is used. Moreover, the arrows shown in Figs. 3 to 6 are merely shown for the purpose of assisting in the description and do not have any substance.

[0018] 1, the wiring device 1 according to the present embodiment includes a common filter 10, a diode bridge 20, a normal filter 30, an isolated DC / DC converter 40, and an output circuit 50. The wiring device 1 includes a power supply unit 5 as shown in FIGS. 3 and 4.

[0019] The power supply unit 5 is provided on the lower right side of the wiring device 1. The power supply unit 5 includes a quick-connect terminal. The quick-connect terminal is electrically connected to a distribution board that is connected to the commercial power supply 1000. The quick-connect terminal is electrically connected to the common filter 10 via wiring 5a and 5b.

[0020] The common filter 10 filters the power (current) supplied from the commercial power source 1000, and passes a current with reduced common mode noise.

[0021] The diode bridge 20 includes a plurality of rectifier diodes 21. The plurality of rectifier diodes 21 configure a bridge circuit. The diode bridge 20 rectifies the current that has passed through the common filter 10. The AC power rectified by the diode bridge 20 is converted into DC power by the normal filter 30.

[0022] 4 and 6, the normal filter 30 includes a coil 31 and a plurality of (one in the illustrated example) capacitors 32. The normal filter 30 filters the rectified current and passes a current in which normal mode noise has been reduced. Furthermore, the normal filter 30 converts the AC power rectified by the diode bridge 20 into DC power.

[0023] The isolated DC / DC converter 40 is an active clamp flyback circuit. As shown in FIG. 1 and FIG. 2, the isolated DC / DC converter 40 includes an active clamp circuit having a regenerative capacitor 41, an insulating transformer 42, and a switching device 43. As shown in FIG. 1, the switching device 43 includes, for example, a GaN device. The switching device 43 may be an IGBT (Insulated Gate Bipolar Transistor), a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), or the like. The isolated DC / DC converter 40 converts DC power in which common mode noise and normal mode noise have been reduced into DC power of a predetermined voltage. For example, the isolated DC / DC converter 40 converts DC power with a voltage of 20V into DC power with a voltage of 5V. Alternatively, the isolated DC / DC converter 40 converts DC power with a voltage of 5V into DC power with a voltage of 20V. The switching device 43 is omitted in FIG. 4 to FIG. 6.

[0024] 5, the output circuit 50 includes a plurality of output terminals 51 (two in the illustrated example). The output terminal 51 is, for example, a USB socket. The output terminal 51 is, for example, a USB Type-C terminal. The output terminal 51 is electrically connected to the isolated DC / DC converter 40. The output terminal 51 can be connected to a USB plug of a USB cable. When the USB plug of the USB cable is connected to the output terminal 51, it becomes possible to supply power of a predetermined voltage to an electric device.

[0025] 2, the wiring device 1 includes a mother board 100 on which a first circuit block 2 is arranged, and a daughter board 200 on which a second circuit block 3 is arranged. The first circuit block 2 includes at least one of a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3. The daughter board 200 is electrically connected to the mother board 100.

[0026] The mother board 100 is a printed wiring board including, for example, an insulating plate made of glass-epoxy resin and a pattern conductor formed on the insulating plate. A plurality of electronic components are arranged on the mother board 100. The plurality of electronic components include a switching device 43 and one or more heat generating components 4. Here, the plurality of heat generating components 4 are components that generate a heat amount equal to or greater than a predetermined value. The plurality of heat generating components 4 include a diode bridge 20. The diode bridge 20 includes a rectifier diode 21. That is, the plurality of heat generating components 4 include the rectifier diode 21. The diode bridge 20 may be packaged with the plurality of rectifier diodes 21. In this case, the packaged diode bridge 20 is arranged on the mother board 100. The plurality of heat generating components 4 include an insulating transformer 42. That is, the first circuit block 2 includes a plurality of electronic components. In other words, the first circuit block 2 includes the rectifier diode 21 and the insulating transformer 42. Here, a circuit included in the first circuit block 2 and that outputs a signal to the second circuit block 3 corresponds to a circuit configured with rectifier diodes 21, i.e., a diode bridge 20. A circuit included in the first circuit block 2 and that receives a signal from the second circuit block 3 corresponds to a circuit that configures the diode bridge 20 and the isolation transformer 42.

[0027] Daughter board 200 includes first daughter board 201 (third board) and second daughter board 202 (fourth board). First daughter board 201 and second daughter board 202 are, for example, printed wiring boards including an insulating plate made of glass-epoxy resin and a pattern conductor formed on the insulating plate.

[0028] Second circuit block 3 includes at least a portion of the common filter functions of common filter 10. Here, circuits including all of the common filter functions are arranged on first daughter board 201. That is, all of the circuits that make up common filter 10 are arranged on first daughter board 201.

[0029] Second circuit block 3 includes at least a part of the normal filter function of normal filter 30. Here, a part of the circuits of the normal filter function is arranged on second daughter board 202. That is, a part of the circuits constituting normal filter 30 is arranged on second daughter board 202. For example, the remaining circuits constituting normal filter 30 are arranged on mother board 100.

[0030] In short, second circuit block 3 includes a first function which is at least a part of the common filter function, and a second function which is at least a part of the normal filter function. A circuit constituting the first function of second circuit block 3 is arranged on first daughter board 201. A circuit constituting the second function of second circuit block 3 is arranged on second daughter board 202. In this embodiment, the first function is the entire common filter function, and the second function is the entire normal filter function.

[0031] Also, the second daughter board 202 is provided with the regenerative capacitor 41 included in the isolated DC / DC converter 40. In other words, some of the functions of the isolated DC / DC converter 40 are provided on the mother board 100. In this embodiment, heat-generating components among the electronic components constituting the isolated DC / DC converter 40 are provided on the mother board 100, and other electronic components are provided on the daughter board 200. That is, the other electronic components provided on the daughter board 200 include electronic components that generate less than a predetermined amount of heat. Note that all of the functions of the isolated DC / DC converter 40 may be provided on the mother board 100. That is, the regenerative capacitor 41 may be provided on the mother board 100.

[0032] The daughter board 200 (first daughter board 201, second daughter board 202) is provided with a plurality of pin connectors 210 for connection to the mother board 100. The mother board 100 is also provided with a plurality of connection parts 110 for inserting the plurality of pin connectors 210 provided on the first daughter board 201 and the second daughter board 202. That is, the mother board 100 and the daughter board 200 are electrically connected by inserting the plurality of pin connectors 210 into the plurality of connection parts 110 one-to-one. The plurality of pin connectors 210 of the first daughter board 201 (one in FIG. 5) are disposed behind the first daughter board 201. The plurality of pin connectors 210 of the second daughter board 202 (one in FIG. 6) are disposed behind the second daughter board 202. The plurality of connection parts 110 (one in FIG. 5) for connecting to the plurality of pin connectors 210 of the first daughter board 201 are disposed below the mother board 100. That is, first daughter board 201 is electrically connected to mother board 100 below mother board 100. Multiple connection parts 110 (one in FIG. 6) that connect to multiple pin connectors 210 of second daughter board 202 are disposed at the upper left end of mother board 100. That is, second daughter board 202 is electrically connected to mother board 100 at the upper left end of mother board 100.

[0033] When parent board 100 and child board 200 are connected by pin connector 210, normal line A1 of parent board 100 intersects with a normal line of child board 200. Specifically, normal line A1 of parent board 100 intersects with normal line A2 of first child board 201, and normal line A1 of parent board 100 intersects with normal line A2 of second child board 202.

[0034] The wiring device 1 includes an output circuit board 300, as shown in Fig. 2 and Fig. 5. The output circuit board 300 is, for example, a printed wiring board including an insulating plate made of glass-epoxy resin and a pattern conductor formed on the insulating plate. An output circuit 50 is disposed on the output circuit board 300. That is, a plurality of output terminals 51 are disposed on the output circuit board 300.

[0035] As shown in Fig. 3, the wiring device 1 includes a housing C1. The housing C1 includes a cover C2 and a body C3 (case). The body C3 is formed in a box shape with one side (front side) open. The cover C2 is attached to the body C3 so as to close the opening. In this embodiment, the cover C2 is attached to the body C3 by being screwed with a plurality of screws 8. The cover C2 is made of PBT (polybutylene terephthalate) resin. The body C3 is made of aluminum die-cast.

[0036] The cover C2 has a plurality of through holes 80 (two in the illustrated example). The through holes 80 correspond one-to-one to the output terminals 51. When the wiring device 1 is assembled, the output terminals 51 face the through holes 80 of the cover C2, respectively. Therefore, by inserting a USB plug of a USB cable into the through hole 80, the USB plug is electrically connected to the output terminal 51, and power can be supplied from the wiring device 1 to an electric device.

[0037] The body C3 houses the mother board 100 and the daughter board 200. The body C3 houses the output circuit board 300.

[0038] The wiring device 1 also includes a spacer 9 and a heat dissipation member 60. The wiring device 1 also includes a screw 6 and a nut .

[0039] The spacer 9 is made of resin. For example, the spacer 9 is made of PBT resin. The spacer 9 is in a rectangular cylindrical shape. The spacer 9 is disposed between the mother board 100 and the body C3 (case) and is in contact with the mother board 100 and the body C3 when the wiring device 1 is assembled. The mother board 100, the body C3 and the spacer 9 are fastened together by screws 6. Fastening the mother board 100, the body C3 and the spacer 9 together by screws 6 facilitates positioning of the mother board 100.

[0040] The parent board 100 (board), the body C3 (case), and the spacer 9 are fastened together by screws 6 and nuts 7. The screws 6 are, for example, flat head screws 6a, and are molded from resin. The nuts 7 are molded from resin, and are used in combination with the screws 6. For example, the screws 6 and the nuts 7 are molded from PBT resin.

[0041] A countersunk hole 81 is formed in the bottom C31 of the body C3, penetrating in the front-rear direction. A through hole 101 is formed in the mother board 100, penetrating in the front-rear direction. A screw 6 is inserted through the countersunk hole 81 of the body C3, the spacer 9, and the through hole of the mother board 100, in that order. The screw 6 inserted through the countersunk hole 81 of the body C3, the spacer 9, and the through hole of the mother board 100 is combined with a nut 7, thereby fastening the mother board 100, the body C3, and the spacer 9. As a result, the mother board 100 is fixed to the housing C1 by the screw 6, and the distance between the bottom C31 of the body C3 and the mother board 100 in the front-rear direction is maintained to the dimension of the spacer 9.

[0042] The heat dissipation member 60 is disposed between the mother board 100 and the body C3 (case). The heat dissipation member 60 is, for example, a thermal sheet, and is made of elastic silicon. The heat dissipation member 60 dissipates heat from the heat-generating component 4 disposed on the mother board 100 to the outside via the body C3. In this embodiment, a plurality of heat dissipation members 60 (three in FIG. 4) are disposed between the mother board 100 and the body C3 (case). That is, the child board 200 is disposed on the opposite side of the heat dissipation member 60 with respect to the mother board 100. In addition, when the mother board 100 is viewed in a plan view from the front-rear direction, the plurality of heat dissipation members 60 overlap at least a portion of the mother board 100 (see FIGS. 4 and 5). More specifically, in at least one of the plurality of heat dissipation members 60 (for example, the heat dissipation member 61), at least a portion of the heat dissipation member 61 overlaps at least a portion of the heat-generating component 4 (for example, the insulating transformer 42) provided on the mother board 100 (board). The wiring device 1 may be configured to include one heat dissipation member 60.

[0043] Since the mother board 100 (board), the body C3 (case), and the spacer 9 are fastened by the screws 6 and the nuts 7, the heat dissipation member 60 is compressed by the mother board 100 and the bottom C31 of the body C3. This improves the heat dissipation of the heat-generating components 4, which are electronic components arranged on the mother board 100.

[0044] As described above, a plurality of electronic components are arranged on the mother board 100. The plurality of electronic components include heat-generating components arranged between the mother board 100 (board) and the body C3 (case). The heat dissipation member 60 is provided so as to cover the heat-generating components arranged between the mother board 100 and the body C3. The heat-generating components arranged between the mother board 100 and the body C3 are, for example, rectifier diodes 21 (see FIGS. 4 and 5).

[0045] As shown in Figures 4 to 6, the wiring device 1 includes a plurality of insulating sheets 70. The plurality of insulating sheets 70 insulates between electronic components arranged on the mother board 100 or the daughter board 200 and other components or members. The plurality of insulating sheets 70 include a first insulating sheet 71, a second insulating sheet 72, and a third insulating sheet 73.

[0046] The first insulating sheet 71 includes a side sheet 75 covering the side surface C32 of the body C3, and a bottom sheet 76 covering the bottom surface C31 of the body C3. That is, the first insulating sheet 71 insulates between the body C3 and electronic components arranged on the mother board 100 and the daughter board 200 (first daughter board 201, second daughter board 202). The first insulating sheet 71 has a plurality of openings. The openings correspond one-to-one to the heat dissipation members 60. A corresponding heat dissipation member 60 is fitted into each of the openings. That is, the heat dissipation member 60 contacts the bottom surface of the body C3 (see FIGS. 5 and 6).

[0047] The second insulating sheet 72 is disposed between the isolation transformer 42 and the output circuit board 300 so as to cover the front of the isolation transformer 42 disposed on the mother board 100. In other words, the second insulating sheet 72 provides insulation between the isolation transformer 42, which is an electronic component disposed on the mother board 100, and the output circuit board 300.

[0048] Third insulating sheet 73 is disposed between common filter 10 and output circuit board 300 so as to cover the front of common filter 10 disposed on first daughter board 201. That is, third insulating sheet 73 provides insulation between common filter 10, which is an electronic component disposed on daughter board 200 (first daughter board 201), and output circuit board 300.

[0049] The wiring device 1 may be configured to include only one insulating sheet 70, for example, the first insulating sheet 71.

[0050] (3) Effects As described above, the wiring device 1 according to the present embodiment includes a mother board 100 (first board) on which the first circuit block 2 is arranged, and a daughter board 200 (second board) on which the second circuit block 3 is arranged. The first circuit block 2 includes at least one of a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3. The daughter board 200 is electrically connected to the mother board 100. In the present embodiment, the first circuit block 2 includes both a circuit that outputs a signal to the second circuit block 3 and a circuit that receives a signal from the second circuit block 3.

[0051] According to this configuration, the circuits included in the wiring device 1 are arranged separately on the mother board 100 and the daughter board 200. That is, the circuits included in the wiring device 1 are divided between the mother board 100 and the daughter board 200. This makes it possible to arrange the daughter board 200 in the space left behind when the mother board 100 is arranged. As a result, the limited space within the wiring device 1 can be effectively utilized. This makes it possible to prevent the wiring device 1 from becoming large.

[0052] Moreover, the wiring device 1 according to this embodiment includes a board (mother board 100) on which a plurality of electronic components are arranged, a case (body C3) that houses the board, a spacer 9, and a heat dissipation member 60. The spacer 9 is disposed between the board and the case and is in contact with the board and the case. The heat dissipation member 60 is disposed between the board and the case. The board, the case, and the spacer 9 are fastened together with screws 6.

[0053] With this configuration, heat generated from multiple electronic components can be dissipated from the case via the heat dissipation member. Furthermore, since the board, case, and spacer 9 are fastened with screws 6, the board can be easily positioned while compressing the heat dissipation member 60. Therefore, the internal volume can be secured while improving heat dissipation.

[0054] (4) Variations The following are examples of modified examples. The modified examples described below can be applied in appropriate combination with the above-described embodiment.

[0055] In the embodiment, the mother board 100 and the body C3 are configured to be fastened at one location by a screw via a spacer 9, but the present invention is not limited to this configuration. The mother board 100 and the body C3 may be fastened by a screw 6 (a flat head screw 6a) via a plurality of spacers 9 corresponding to each of the plurality of screw fastening locations provided.

[0056] The screw 6 may be a different type of screw than the countersunk screw 6a.

[0057] In the embodiment, the daughter board 200 includes a first daughter board 201 and a second daughter board 202, but is not limited to this configuration. There may be only one daughter board 200. In this case, both the common filter 10 and the normal filter may be arranged on one daughter board 200. Alternatively, one of the common filter 10 and the normal filter may be arranged on one daughter board 200. When one of the common filter 10 and the normal filter is arranged on one daughter board 200, the other is arranged on the mother board 100.

[0058] In the embodiment, daughter board 200 (first daughter board 201, second daughter board 202) is configured to be electrically connected to mother board 100 via multiple pin connectors 210, but is not limited to this configuration. Daughter board 200 (first daughter board 201, second daughter board 202) may also be electrically connected to mother board 100 via one pin connector 210. Alternatively, daughter board 200 (first daughter board 201, second daughter board 202) may be electrically connected to mother board 100 via one or more wires.

[0059] (5) Summary From the above-described embodiments, the present specification discloses the following aspects.

[0060] (5.1) First Summary The wiring device (1) of the first embodiment includes a first board (mother board 100) on which a first circuit block (2) is arranged, and a second board (child board 200) on which a second circuit block (3) is arranged. The first circuit block (2) includes at least one of a circuit that outputs a signal to the second circuit block (3) and a circuit that receives a signal from the second circuit block (3). The second board is electrically connected to the first board.

[0061] According to this configuration, it is possible to place the second board in the space left when the first board is placed. As a result, it is possible to effectively use the limited space inside the wiring device (1). This makes it possible to prevent the wiring device (1) from becoming large.

[0062] In the wiring device (1) of the second aspect, in the first aspect, the normal line (A1) to the first substrate and the normal lines (A2, A3) to the second substrate intersect.

[0063] According to this configuration, the limited space inside the wiring device (1) can be effectively utilized.

[0064] In the wiring device (1) of the third aspect, the first board and the second board are connected by a pin connector (210) in the second aspect.

[0065] With this configuration, the first substrate and the second substrate can be easily connected.

[0066] In the wiring device (1) of the fourth aspect, in any one of the first to third aspects, the first circuit block (2) includes a plurality of heat-generating components (4).

[0067] According to this configuration, a plurality of heat generating components (4) can be arranged on one board.

[0068] In the wiring device (1) of the fifth aspect, in the fourth aspect, the plurality of heat-generating components (4) include rectifier diodes (21).

[0069] According to this configuration, the rectifier diode (21) can be disposed together with the other heat generating components (4) on one substrate.

[0070] In the wiring device (1) of the sixth aspect, in the fourth or fifth aspect, the plurality of heat-generating components (4) include an insulating transformer (42).

[0071] According to this configuration, the isolation transformer (42) can be disposed together with the other heat generating components (4) on one board.

[0072] In the wiring device (1) of the seventh aspect, in any one of the fourth to sixth aspects, the plurality of electronic components includes a switching device (43).

[0073] According to this configuration, the switching device (43) can be arranged together with the other heat generating components (4) on one board.

[0074] In the wiring device (1) of the eighth embodiment, in the seventh embodiment, the switching device (43) includes a GaN device (44).

[0075] With this configuration, the GaN device (44) can be placed on one substrate together with other heat generating components (4).

[0076] In the wiring device (1) of a ninth aspect, in any one of the first to eighth aspects, the second circuit block (3) includes at least a part of the common filter function.

[0077] According to this configuration, at least a part of the function of the common filter (10) can be included in the second circuit block (3).

[0078] In the wiring device (1) of a tenth aspect, in any one of the first to eighth aspects, the second circuit block (3) includes at least a part of a normal filter function.

[0079] According to this configuration, at least a part of the function of the common filter (10) can be included in the second circuit block (3).

[0080] In the wiring device (1) of an eleventh aspect, in any one of the first to eighth aspects, the second substrate includes a third substrate (first daughter substrate 201) and a fourth substrate (second daughter substrate 202). The second circuit block (3) includes a first function which is at least a part of the common filter function, and a second function which is at least a part of the normal filter function. A circuit constituting the first function of the second circuit block (3) is disposed on the third substrate. A circuit constituting the second function of the second circuit block (3) is disposed on the fourth substrate.

[0081] According to this configuration, the first function of the common filter (10) and the second function of the normal filter (30) can be included in the second circuit block (3).

[0082] The wiring device (1) of a twelfth aspect is any of the first to eleventh aspects, and further includes a case (for example, a body C3) and a heat dissipation member (60). The case houses a first board and a second board. The heat dissipation member (60) is disposed between the case and the first board. The second board is disposed on the opposite side of the first board to the heat dissipation member (60).

[0083] According to this configuration, the limited space inside the wiring device (1) can be effectively utilized.

[0084] (5.2) Second Summary A wiring device (1) of a first aspect includes a board (e.g., a mother board 100) on which a plurality of electronic components are arranged, a case (e.g., a body C3) for accommodating the board, a spacer (9), and a heat dissipation member (60). The spacer (9) is disposed between the board and the case and is in contact with the board and the case. The heat dissipation member (60) is disposed between the board and the case. The board, the case, and the spacer (9) are fastened together with screws (6).

[0085] With this configuration, heat generated by multiple electronic components can be dissipated from the case via the heat dissipation member. Furthermore, since the board, case, and spacer (9) are fastened with screws (6), the positioning of the board can be easily performed. Therefore, the internal volume can be secured while improving heat dissipation.

[0086] In the wiring device (1) of the second aspect, the board, the case, and the spacer (9) in the first aspect are fastened by the screws (6) and the nuts (7). The screws (6), the nuts (7), and the spacer (9) are molded from resin.

[0087] According to this configuration, the screw (6), the nut (7) and the spacer (9) are made of resin, so that an insulation distance can be ensured.

[0088] In the wiring device (1) of the third embodiment, the screw (6) is a flat head screw (6a) in the second embodiment. A countersunk hole (81) is formed in the case.

[0089] According to this configuration, by using countersunk head screws (6a) as the screws (6), it is possible to prevent the screws (6) from protruding from the case.

[0090] In the wiring device (1) of the fourth aspect, in any one of the first to third aspects, the plurality of electronic components includes a rectifier diode (21).

[0091] This configuration can improve the heat dissipation properties of the rectifier diode (21).

[0092] In the wiring device (1) of a fifth aspect, in any one of the first to fourth aspects, the plurality of electronic components includes an insulating transformer (42).

[0093] This configuration improves the heat dissipation properties of the isolation transformer (42).

[0094] In the wiring device (1) of a sixth aspect, in any one of the first to fifth aspects, the plurality of electronic components includes a switching device (43).

[0095] This configuration can improve the heat dissipation properties of the switching device (43).

[0096] In the wiring device (1) of the seventh embodiment, in the sixth embodiment, the switching device (43) includes a GaN device (44).

[0097] This configuration can improve the heat dissipation of the GaN device (44).

[0098] In the wiring device (1) of an eighth aspect, in any one of the first to seventh aspects, the case is formed by aluminum die casting.

[0099] This configuration can improve the efficiency of heat dissipation.

[0100] In a wiring device (1) of a ninth aspect, in any one of the first to eighth aspects, the plurality of electronic components includes a heat-generating component (4) disposed between the board and the case. The heat dissipation member (60) is provided so as to cover the heat-generating component (4).

[0101] This configuration improves the heat dissipation properties of the heat-generating component (4) covered with the heat dissipation member (60).

[0102] In a wiring device (1) of a tenth aspect, in any one of the first to ninth aspects, the plurality of electronic components includes a heat-generating component (4). When the board is viewed in plan, at least a portion of the heat-dissipating member (60) overlaps with at least a portion of the heat-generating component (4) provided on the board.

[0103] This configuration can improve the heat dissipation of the heat generating component (4) mounted on the board. [Explanation of symbols]

[0104] 1 Wiring device 2 First Circuit Block 3 Second Circuit Block 4 Heat generating parts 6 Screws 6a flat head screw 7 Nut 9 Spacer 10 Common Filter 21 Rectifier diode 30 Normal Filter 42 Isolation transformer 43 Switching Devices 44 GaN devices 60 Heat dissipation material 61 Heat dissipation materials 81 Countersink hole 100 Mother board (board, first board) 200 Daughter board (second board) 201 1st daughter board (3rd board) 202 Second daughter board (fourth board) 210-pin connector A1 Normal A2 normal A3 normal C3 Body (case)

Claims

1. A substrate on which a plurality of electronic components are arranged; A case for accommodating the substrate; a spacer disposed between the substrate and the case and in contact with the substrate and the case; a heat dissipation member disposed between the substrate and the case, the substrate, the case, and the spacer are fastened together by screws; the plurality of electronic components includes a heat generating component disposed between the substrate and the case, the heat dissipation member is provided to cover the heat generating component, the heat dissipation member is in contact with the substrate, the heat generating component, and the case; Wiring equipment.

2. A substrate on which a plurality of electronic components are arranged; A case for accommodating the substrate; a spacer disposed between the substrate and the case and in contact with the substrate and the case; a heat dissipation member disposed between the substrate and the case; an insulating sheet for insulating the electronic components from the case, the substrate, the case, and the spacer are fastened together by screws; The insulating sheet is provided with an opening into which the heat dissipation member is fitted. Wiring equipment.

3. the substrate, the case, and the spacer are fastened together by the screws and nuts; The screw, the nut and the spacer are made of resin. The wiring device according to claim 1 or 2.

4. The screw is a countersunk head screw, The case has a countersunk hole formed therein. The wiring device according to claim 3.

5. The plurality of electronic components include a rectifying diode. The wiring device according to any one of claims 1 to 4.

6. The plurality of electronic components include an isolation transformer. The wiring device according to any one of claims 1 to 5.

7. the plurality of electronic components includes a switching device; The wiring device according to any one of claims 1 to 6.

8. the switching device comprises a GaN device; The wiring device according to claim 7.

9. The case is made of die-cast aluminum. The wiring device according to any one of claims 1 to 8.

10. the plurality of electronic components includes a heat generating component, When the substrate is viewed in a plan view, at least a portion of the heat dissipation member overlaps with at least a portion of the heat generating component provided on the substrate. The wiring device according to any one of claims 1 to 9.

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