Inspection method for pinholes and degassing failure in bag body hermetically packaging sealed storage container, and inspection device for pinholes and degassing failure in bag body hermetically packaging sealed storage container

Abstract

To provide an inspection method that can determine the presence / absence of pinholes and the presence / absence of a degassing failure in a bag body hermetically packaging a sealed storage container by a simple method without relying on an inspector.SOLUTION: An inspection method for pinholes 17 and a degassing failure in a bag body hermetically packaging a sealed storage container 10 that inspects the presence / absence of the pinholes 17 and the presence / absence of the degassing failure in the bag body in the hermetically packaging state by a packaging material 15 being the bag body in a state where the sealed storage container 10 storing a semiconductor wafer is degassed, includes: a pressurizing step in which, after a certain period of time has elapsed following hermetic packaging, a side portion of the bag body is pressurized by a pressing pad 16; a measuring step in which a distance between an upper end portion 18 and a distance measurement sensor 14 is measured in the state of being pressurized in the pressurizing step by using the distance measurement sensor 14 provided above the upper end portion 18 of the bag body; and a determination step in which the presence / absence of the pinholes 17 and the presence / absence of the degassing failure are determined based on the distance measured in the measuring step.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a method for inspecting a bag in which a sealed storage container is hermetically packed for pinholes and deaeration defects, and to an inspection device for inspecting a bag in which a sealed storage container is hermetically packed for pinholes and deaeration defects. [Background technology]

[0002] 2. Description of the Related Art In recent years, semiconductor devices have become increasingly highly integrated and miniaturized, and contamination control of substrates such as wafers (hereinafter referred to as "wafers"), such as prevention of particle adhesion to the substrates, has become increasingly strict.

[0003] For example, when transporting semiconductor wafers such as silicon wafers, the wafers are stored in sealed storage containers such as FOSBs (Front Opening Shipping Boxes) or FOUPs (Front Opening Unified Pods), and these sealed storage containers are then sealed and packed in plastic bags or aluminum-deposited bags before transport.

[0004] Resin bags and bags with aluminum vapor deposition are moisture-proof bags, and their purpose is to prevent contact with dust-containing air during transportation and to prevent condensation on the surface of semiconductor wafers stored in sealed storage containers due to the influence of humidity. Various types of sealed packaging are known, not limited to those for wafers (Patent Documents 1 to 3). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2003-004580 A [Patent Document 2] JP 2015-194362 A [Patent Document 3] Japanese Patent Application Publication No. 11-316169 Summary of the Invention [Problem to be solved by the invention]

[0006] A problem with conventional sealed packaging is that the bag may be accidentally scratched, torn, or punctured during the packaging process. Larger holes and ruptures are relatively easy to find through inspection, but small holes with a diameter of 1 mm or less (hereafter sometimes referred to as pinholes) are extremely difficult for inspectors to find through visual inspection.

[0007] Furthermore, when inspectors inspected the sealed packaging of sealed storage containers containing semiconductor wafers, they had to lift it with both hands and visually inspect the top and bottom two surfaces and the four sides in turn. The total weight of a FOSB containing 25 300mm diameter wafers was over 8kg, which was a heavy burden on the inspectors.

[0008] In addition, in order to minimize the volume of the sealed container during transportation and to prevent damage to the packaging material, the sealed container is packaged in a state where as much air as possible is removed from between the sealed container and the packaging material, so it is degassed and then sealed. For this reason, it is preferable to be able to check whether there are any problems with the degassing state in addition to the pinhole inspection.

[0009] The present invention has been made to solve the above problems, and aims to provide an inspection method that can determine the presence or absence of pinholes and deaeration defects in a bag that hermetically packages a sealed storage container in a simple manner without the need for an inspector.

[0010] Another object of the present invention is to provide an inspection device that can easily determine whether or not there are pinholes or poor deaeration in a bag that hermetically packages a sealed storage container, without the need for an inspector. [Means for solving the problem]

[0011] The present invention has been made to achieve the above-mentioned object, and provides a method for inspecting for pinholes and degassing defects in a bag in which a sealed storage container is sealed and packaged, the method inspecting for pinholes and degassing defects in the bag in which a semiconductor wafer is stored, the bag being sealed and packaged in a resin or aluminum-evaporated bag in a degassed state so as not to be exposed to the outside air, the method comprising: a pressurizing step of applying pressure with a pad to at least one side surface of the bag in which the sealed storage container is sealed and packaged after a certain period of time has elapsed after the sealing and packaging; a measuring step of using a sensor provided above the upper end of the bag in which the sealed storage container is sealed and packaged to measure the distance between the upper end and the sensor in a pressurized state in the pressurizing step; and a determining step of determining for the presence or absence of pinholes and degassing defects in the bag based on the distance measured in the measuring step.

[0012] According to this inspection method, pressure is applied to the side of the bag, and if there is a pinhole or degassing is poor, the air between the bag and the side of the sealed storage container is moved to the upper end of the bag, changing the distance between the upper end and the sensor, and the presence or absence of a pinhole or poor degassing is detected by measuring this distance.

[0013] As a result, pinhole inspections in sealed packages, which were previously performed by workers, can now be performed automatically by applying pressure and measuring the distance. This means that inspectors will no longer miss pinholes as was the case with previous inspections, and it will also be possible to simultaneously inspect for poor deaeration, thereby increasing the number of inspections processed per hour and significantly reducing inspection costs.

[0014] In this case, the certain period of time can be set to 10 minutes.

[0015] This allows, in the event that a pinhole is present, the bag body to be pressurized after sufficient time has elapsed for air to flow into the bag body through the pinhole, thereby improving the accuracy of detecting whether or not a pinhole is present.

[0016] In this case, after the sealing packaging, the method further includes a pre-pressure measurement process of measuring the distance between the upper end and the sensor using the sensor before the pressurization process, and the determination process can determine that a pinhole is present when the displacement amount, which is the difference between the distance measured in the pre-pressure measurement process and the measurement process, is 1 mm or more.

[0017] This makes it possible to further improve the accuracy of detecting the presence or absence of a pinhole.

[0018] The present invention has been made to achieve the above-mentioned object, and provides an inspection device for pinholes and degassing defects in a bag in which a sealed storage container is sealed, the inspection device inspecting the presence or absence of pinholes and degassing defects in the bag in which a semiconductor wafer is stored, the bag being sealed and packaged in a resin or aluminum-evaporated bag in a degassed state to prevent the sealed storage container from coming into contact with the outside air, the inspection device comprising: a pad that pressurizes at least one side portion of the bag in which the sealed storage container is sealed after a certain period of time has elapsed after the sealed packaging; and a sensor that is provided above an upper end of the bag in which the sealed storage container is sealed and measures the distance to the upper end in a state pressurized by the pad, and the inspection device determines the presence or absence of pinholes and degassing defects in the bag based on the measured distance.

[0019] With this type of inspection device, pressure is applied to the side of the bag, and if there is a pinhole or degassing is poor, the air between the bag and the side of the sealed storage container is moved to the upper end of the bag, changing the distance between the upper end and the sensor, and the presence or absence of a pinhole or poor degassing is detected by measuring that distance.

[0020] As a result, pinhole inspections in sealed packages, which were previously performed by workers, can now be performed automatically by applying pressure and measuring the distance. This means that inspectors will no longer miss pinholes as was the case with previous inspections, and it will also be possible to simultaneously inspect for poor deaeration, thereby increasing the number of inspections processed per hour and significantly reducing inspection costs. Effect of the Invention

[0021] As described above, according to the inspection method of the present invention, it is possible to determine the presence or absence of pinholes or deaeration defects in the bag that hermetically packages the sealed storage container in a simple manner without relying on an inspector.

[0022] Furthermore, the inspection device of the present invention makes it possible to easily determine whether or not there are pinholes or deaeration defects in the bag in which the sealed storage container is sealed without relying on an inspector. [Brief description of the drawings]

[0023] [Figure 1] A schematic diagram of a closed containment vessel (FOSB) is shown. [Diagram 2] A schematic diagram of a sealed storage container (FOSB) sealed in packaging material is shown. [Diagram 3] A schematic diagram of an example of using a distance measuring sensor to measure the distance to the top edge of a packaging material that hermetically packs a sealed storage container (FOSB) is shown. [Figure 4] This shows a schematic diagram of an example in which a pressure pad is used to pressurize the side of the packaging material that hermetically packs a sealed storage container (FOSB), and a distance measuring sensor is used to measure the distance between the side and the top end of the packaging material that hermetically packs the storage container (FOSB). [Diagram 5] 1 shows a schematic diagram of an example of using a distance measuring sensor to measure the distance between a pinhole and the top edge of a package that hermetically packs a closed storage container (FOSB). [Figure 6]This is a schematic diagram of an example in which a pressure pad is used to pressurize the side of the packaging material in which a sealed storage container (FOSB) is sealed, and a distance measuring sensor is used to measure the distance to the top end of the packaging material in which the pinhole is formed, in which the FOSB is sealed. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] The present invention will be described in detail below, but the present invention is not limited thereto.

[0025] As described above, there has been a demand for an inspection method that can determine the presence or absence of pinholes or deaeration defects in a bag that hermetically packages a sealed storage container in a simple manner without relying on an inspector.

[0026] As a result of intensive research into the above-mentioned problems, the inventors have discovered that a method for inspecting for pinholes and degassing defects in a bag obtained by hermetically packaging a sealed storage container, in which a sealed storage container containing a semiconductor wafer is sealed and packaged in a resin or aluminum-evaporated bag in a degassed state so as to prevent the sealed storage container from coming into contact with the outside air, is provided, and the method comprises the steps of: a pressurizing step of applying pressure with a pad to at least one side surface of the bag obtained by hermetically packaging the sealed storage container after a certain period of time has elapsed since the sealing and packaging; a measuring step of using a sensor provided above an upper end of the bag obtained by hermetically packaging the sealed storage container to measure the distance between the upper end and the sensor in a pressurized state in the pressurized state in the pressurizing step; and a judging step of judging the presence or absence of pinholes and degassing defects in the bag obtained by hermetically packaging the sealed storage container based on the distance measured in the measuring step, thereby making it possible to judge the presence or absence of pinholes and degassing defects in the bag obtained by hermetically packaging the sealed storage container in a simple manner without the need for an inspector, and have completed the present invention.

[0027] As described above, there has been a demand for an inspection device that can easily determine whether or not a pinhole or deaeration failure has occurred in a bag that hermetically packages a sealed storage container without relying on an inspector.

[0028] As a result of intensive research into the above-mentioned problems, the inventors have discovered that an inspection device for pinholes and degassing defects in a bag in which a sealed storage container is sealed, inspecting the presence or absence of pinholes and degassing defects in a bag in which a semiconductor wafer is stored and sealed and packaged in a resin or aluminum-evaporated bag in a degassed state so as to prevent the bag from coming into contact with the outside air, the inspection device comprising: a pad that pressurizes at least one side portion of the bag in which the sealed storage container is sealed and packaged after a certain period of time has elapsed after the sealed packaging; and a sensor that is provided above an upper end of the bag in which the sealed storage container is sealed and measures the distance to the upper end in a state pressurized by the pad, and the inspection device determines the presence or absence of pinholes and degassing defects in the bag in which the sealed storage container is sealed, based on the measured distance, and thereby making it possible to easily determine the presence or absence of pinholes and degassing defects in the bag in which the sealed storage container is sealed, without the need for an inspector, and have completed the present invention.

[0029] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method and an apparatus for inspecting pinholes and deaeration defects in a bag body hermetically packaging a sealed storage container according to an embodiment of the present invention will be described with reference to the drawings.

[0030] First, the configuration of a sealed storage container that is sealed and packaged in a bag that is the subject of the present invention will be described with reference to FIG. As shown in Fig. 1, the airtight storage container (FOSB) 10 is composed of a housing 11 and a lid 12. The housing 11 is a box-shaped member with one open side, and a comb-shaped holder for holding a semiconductor wafer W is provided on the bottom side opposite the open side. The lid 12 is a plate-shaped lid body that closes the open side of the housing 11, and has a lid-side holder for holding the wafer W on the inside of the lid body. The airtight storage container 10 is shipped from the manufacturer of the wafers W with typically 25 wafers W stored in the housing 11 and the open side closed with the lid 12.

[0031] [Packaging] Next, the sealed storage container 10 in a sealed packaged state will be described with reference to FIG. As shown in FIG. 2, the sealed storage container 10 is transported in a package 101 (hereinafter also referred to as the sealed packaged sealed storage container 10) in which the container is packaged in a packaging material 15, which is a bag, in order to accommodate environmental changes such as temperature, air pressure, and vibration during transportation by airplane, ship, or truck.

[0032] These packaging methods have the effect of preventing condensation on the wafer surface due to changes in temperature and air pressure, and preventing contamination such as an increase in particles caused by outside air entering through gaps in the lid 12 due to vibration.

[0033] As the packaging material 15, a laminate packaging material in which a transparent resin or the like is formed into a sheet and a moisture-proof layer is laminated, or an aluminum packaging material in which aluminum is vapor-deposited onto the surface of a sheet-like resin to give it a moisture-proof effect, or the like is used.

[0034] When the sealed storage container 10 is not only shipped but also transported, it is packaged in the above-mentioned laminate packaging or aluminum packaging, or in a state where it is packaged in aluminum packaging after being packaged in laminate packaging.

[0035] Furthermore, in order to minimize the volume of the package 101 (sealed storage container 10) during transportation and to prevent damage to the packaging material 15, the package 101 is packaged in a state in which as much air as possible is removed between the sealed storage container 10 and the packaging material 15 so that the sealed storage container 10 is not exposed to outside air. Specifically, the sealed storage container 10 is placed in the packaging material 15, and the inside of the packaging material 15 is depressurized with a vacuum pump and sealed in a degassed state, thereby eliminating as much air as possible from within the packaging material 15 and creating a sealed state.

[0036] [Inspection method for pinholes and deaeration defects] Next, a method and device for inspecting the packaging material 15 of the hermetically wrapped sealed storage container 10 for pinholes and deaeration defects will be described with reference to FIGS. First, the configuration of the inspection device 1 will be described with reference to FIGS.

[0037] The inspection device 1 shown in FIG. 3 is a device for inspecting the packaging material 15 used to hermetically package the sealed storage container 10 for pinholes and poor deaeration, and includes a pressure pad 16 and a distance measuring sensor 14. The pressure pad 16 is a member that applies pressure to the packaging material 15 that has hermetically packed the sealed storage container 10 after a certain period of time has elapsed since the sealing and packaging, and is placed on the side portion of the packaging material 15.

[0038] FIG. 3 shows a configuration in which two pressure pads 16 are arranged on the left and right side portions of packaging material 15 in which sealed storage container 10 is packaged, so that two side portions of packaging material 15 can be pressed; however, it is sufficient for pressure pad 16 to be able to pressurize at least one or more side portions of packaging material 15 in which sealed storage container 10 is packaged. The specific pressure applying structure of the pressure pad 16 is not particularly limited, but an example of such a structure is one that applies pressure with gas, such as an airbag.

[0039] Distance measuring sensor 14 is a sensor provided above packaging material 15 in which sealed storage container 10 is hermetically packed, and is capable of measuring distance D1 from upper end 18 of packaging material 15 in which sealed storage container 10 is hermetically packed. It is also possible to measure distance D2 from upper end 18 of packaging material 15 in a state in which at least one side surface of sealed packaging material 15 is pressed by pressure pad 16 as shown in FIG. The specific distance detection method of the distance measuring sensor 14 is not particularly limited, but examples include those using a laser or ultrasonic waves.

[0040] Next, the procedure of the method of inspecting for pinholes and deaeration defects using the inspection device 1 will be described with reference to FIGS.

[0041] First, the sealed storage container 10 is sealed and packaged in the above-mentioned packaging material 15, and then it is placed on a support stand 20 as shown in Fig. 3 and left to stand for a certain period of time. The reason for this is that in the present invention, the presence or absence of a pinhole is determined by using air that has flowed into the space between the packaging material 15 and the sealed storage container 10 through a pinhole, but even if a pinhole is formed, it takes a certain period of time for air to flow into the packaging material 15 through the pinhole. The certain period of time is not particularly limited, but can be, for example, 10 minutes or more.

[0042] Next, if necessary, after the sealed packaging, and before the pressurization process described below, the distance D1 between the upper end 18 of the packaging material 15 in which the sealed storage container 10 is sealed and the upper end 18 of the packaging material 15 in which the sealed storage container 10 is sealed is measured using a distance measuring sensor 14 provided above the upper end 18 of the packaging material 15 in which the sealed storage container 10 is sealed, as shown in Figure 3 (pre-pressurization measurement process).

[0043] Next, after a certain period of time has elapsed since the sealed packaging, at least one side surface of the packaging material 15 that has sealed the sealed storage container 10 (two side surfaces in FIG. 4) is pressed with a pressure pad 16 (pressurizing process).

[0044] Next, using a distance measuring sensor 14 provided above an upper end portion 18 of the packaging material 15 that hermetically packages the sealed storage container 10 as shown in FIG. 4, the distance D2 between the upper end portion 18 and the distance measuring sensor 14 is measured while the container is pressurized in the pressurization process (measurement process).

[0045] Here, if there are no pinholes, which are holes with a diameter of 1 mm or less, in the packaging material 15, air will not flow in through these pinholes and there is no poor degassing, and there will be almost no air between the packaging material 15 and the sealed storage container 10. Therefore, even if pressure is applied to the two left and right sides of the packaging material 15 of the sealed, packaged sealed storage container 10 as shown in Figure 4, the distance D2 between the upper end 18 of the packaging material 15 of the packaged sealed storage container 10 and the distance measuring sensor 14 will not change from the distance D1 before pressure, as shown in Figure 3.

[0046] However, as shown in Figure 5, if there is a pinhole 17 in the packaging material 15, after a certain amount of time has passed since the sealed storage container 10 was packaged in the packaging material 15, air will flow between the packaging material 15 and the sealed storage container 10, and as shown in Figure 5, air will flow between the sealed storage container 10 and the packaging material 15 through the pinhole 17.

[0047] With air flowing between the sealed storage container 10 and the packaging material 15 in this manner, when the packaging material 15 of the sealed and wrapped sealed storage container 10 is pressed from both the left and right sides with a pressure pad 16, the air present between the sealed storage container 10 and the side portion of the packaging material 15 is pressurized and moves to the upper end portion 18 of the packaging material 15, pushing the upper end portion 18 upward.

[0048] When the upper end 18 is pushed upward, as shown in Fig. 6, the distance D2 between the upper end 18 of the packaging material 15 of the packaged sealed storage container 10 and the distance measuring sensor 14 changes from the distance D1 before pressurization shown in Fig. 5. Based on the distance D2 measured in this way, it is determined whether or not there is a pinhole 17 at any position of the packaging material 15 of the packaged sealed storage container 10 (determination process). Specifically, the presence or absence of a pinhole 17 or deaeration failure can be determined from the amount of displacement, which is the difference between the distance D1 before pressurization and the distance D2 when pressurized.

[0049] Specifically, the amount of displacement required to determine whether a pinhole is present can be determined by, for example, determining in advance the amount of displacement that would occur if a pinhole were present in a preliminary test, and comparing this with the actual measured amount of displacement. For example, a displacement of 1 mm or more can be used to determine whether a pinhole is present.

[0050] In the case of general inspection using images from a camera or the like, a large-scale holding and rotating mechanism is required to inspect the underside, etc., of the packaged sealed storage container 10. However, according to the method of the present invention, even if a pinhole 17 is present on the underside, etc., of the packaged sealed storage container 10, it is unlikely that the pinhole 17 will be completely blocked by the support table 20. Even if it is blocked, when the container is left to stand, after a certain period of time has elapsed, the bottom surface in contact with the support table 20 is placed on a surface other than the surface in contact with the support table 20, and a further certain period of time is allowed to elapse, or the area of ​​the support surface 20 in contact with the sealed storage container is reduced, thereby eliminating the need for these expensive, large-scale, and complex mechanisms. Therefore, in an apparatus for inspecting pinholes 17, the inspection mechanism is simple and the size of the apparatus can be reduced.

[0051] Furthermore, by applying pressure to the four side surfaces of the packaging material 15 in which the sealed storage container 10 is sealed with a pressure pad 16, even if an extremely small pinhole 17 is present, it is possible to accurately measure the presence or absence of the pinhole 17 from the change in distance between the upper end 18 of the packaging material 15 of the packaged sealed storage container 10 and the distance measuring sensor 14.

[0052] As described above, the sealed storage container 10 is sealed in a degassed state when it is packaged, but if this degassing is insufficient and the sealed storage container is sealed without fully removing the air between the sealed storage container 10 and the packaging material 15, it will be a degassed defective product. When the side surface of the packaging material 15 of the sealed storage container 10 packaged with this degassed defective product is pressurized in the same manner as in the pinhole inspection, the air that was not removed during degassing and remains between the sealed storage container 10 and the side surface of the packaging material 15 moves to the upper end 18 of the packaging material 15 and pushes up the upper end 18. From the resulting change in distance D2 between the upper end 18 and the distance measuring sensor 14 from distance D1, it becomes possible to accurately measure the presence or absence of degassing defects.

[0053] Furthermore, by configuring the distance measuring sensors 14 to be placed multiple times above the upper end 18 of the packaging material 15 of the packaged sealed storage container 10, the changing distance D2 can be measured with even greater accuracy, making it possible to detect even extremely small pinholes 17 or poor deaeration due to trace amounts of residual air. EXAMPLES

[0054] The present invention will be specifically described below with reference to examples, but the present invention is not limited thereto.

[0055] Example 1 Twenty-five silicon wafers with a diameter of 300 mm were stored in the sealed storage container 10, and the sealed storage container 10 was packaged in aluminum packaging material as the packaging material 15, and three sealed packages were prepared by degassing and sealing. A pinhole 17 having a diameter of 1.0 mm was intentionally formed in one location on the side of the packaging material 15 of this hermetically wrapped hermetically sealed storage container 10, and the container was left for 5 minutes, 10 minutes, and 30 minutes, respectively.

[0056] Example 2 As in Example 1, 25 silicon wafers each having a diameter of 300 mm were stored in the sealed storage container 10, and this sealed storage container 10 was packaged in aluminum packaging material as the packaging material 15. Three sealed packages were prepared by degassing and sealing. A pinhole 17 with a diameter of 3.0 mm was intentionally formed in one location on the side of the packaging material 15 of this hermetically wrapped sealed storage container 10, and left for 5 minutes, 10 minutes, and 30 minutes, respectively. In other words, the diameter of the pinhole 17 was made larger than that of Example 1.

[0057] Example 3 As in Example 1, 25 silicon wafers each having a diameter of 300 mm were stored in the sealed storage container 10, and the sealed storage container 10 was packaged in aluminum packaging material as the packaging material 15. The containers were then degassed and sealed to prepare three sealed packages. A pinhole 17 with a diameter of 5.0 mm was intentionally formed in one location on the side of the packaging material 15 of this hermetically wrapped sealed storage container 10, and the container was left for 5 minutes, 10 minutes, and 30 minutes, respectively. In other words, the diameter of the pinhole 17 was made larger than in Examples 1 and 2.

[0058] Example 4 As in Example 1, 25 silicon wafers each having a diameter of 300 mm were stored in the sealed storage container 10, and the sealed storage container 10 was packaged in aluminum packaging material as the packaging material 15. The containers were then degassed and sealed to prepare three sealed packages. The packaging material 15 of the hermetically wrapped sealed storage container 10 was left to stand for 5 minutes, 10 minutes, and 30 minutes, respectively, without forming pinholes 17 therein.

[0059] [Pinhole inspection] Pinhole inspection was performed using the inspection method of the present invention on the packaging material 15 in which the sealed storage container 10 produced in Examples 1 to 4 was hermetically packaged. Specifically, the two left and right sides of the packaging material 15 were pressurized with an airbag-type pressure pad 16, and the distances D1 and D2 between the upper end 18 of the packaging material 15 of the packaged sealed storage container 10 and the distance measuring sensor 14 were measured before and during pressurization, and the difference between the distances D1 and D2 was calculated as the amount of displacement. Table 1 shows the results.

[0060] [Table 1]

[0061] As shown in Table 1, the amount of displacement in Examples 1 to 3 in which pinhole 17 was formed was larger than that in Example 4 in which pinhole 17 was not formed, and therefore the presence of pinhole 17 in packaging material 15 of sealed storage container 10 was confirmed from the amount of displacement.

[0062] On the other hand, as shown in Table 1, in Example 1, when left for 5 minutes, the displacement amount was 0.25 mm, when left for 10 minutes, the displacement amount was 1.15 mm, and when left for 30 minutes, the displacement amount was 1.74 mm. It was found that it is preferable to leave it for 10 minutes or more in order to obtain a displacement amount sufficient to determine that a pinhole has been opened.

[0063] In Examples 2 and 3, the amount of displacement was 1.0 mm or more when left for 5, 10, or 30 minutes, which was sufficient to determine that a pinhole had been formed.

[0064] In Example 4, the amount of displacement was 0 mm when the sample was left for 5, 10, or 30 minutes, and it was determined that no pinholes had formed.

[0065] As described above, according to an embodiment of the present invention, a pressure pad 16 is used to pressurize at least one side of a hermetically packaged sealed storage container 10, and a distance measuring sensor 14 is used to measure the distance between the upper end 18 of the packaging material 15 of the hermetically packaged sealed storage container 10. When at least one side of the sealed storage container 10 is pressurized with the pressure pad 16, the distance D2 between the upper end 18 of the packaging material 15 of the sealed storage container 10 is measured, and if there is a change in distance D2 compared to distance D1 before pressurization, it is possible to perform an inspection to determine that a pinhole 17 has opened.

[0066] In the embodiment of the present invention, an example is given of a case in which there are two pressure pads 16 and one distance measuring sensor 14, but the above-mentioned effect is also effective when there is one pressure pad 16 or three or more pressure pads 16 applying pressure. As for deaeration defects, although not illustrated, it is possible to detect deaeration defects from the variation (amount of displacement) of the distance D2 relative to the distance D1, as in the first to third embodiments.

[0067] The present invention is not limited to the above-described embodiment. The above-described embodiment is merely an example, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits similar effects is included in the technical scope of the present invention. [Explanation of symbols]

[0068] 1...inspection device, 10...sealed storage container, 11...housing, 12...lid, 14...distance measuring sensor, 15...packaging material, 16...pressure pad, 17...pinhole, 18...upper end portion, 20...support stand, 101...packaging body.

Claims

1. A method for inspecting a bag body hermetically packed with a sealed storage container for pinholes and deaeration defects, the method comprising inspecting the bag body for pinholes and deaeration defects in a state where the sealed storage container containing semiconductor wafers is sealed and packed in a resin or aluminum-deposited bag body in a deaerated state so as not to be exposed to outside air, the method comprising the steps of: a pressurizing step of pressurizing at least one side surface of the bag in which the sealed storage container is sealed with a pad after a certain time has elapsed since the sealed storage container is sealed; a measuring step of measuring a distance between an upper end of the bag in which the sealed storage container is sealed and the upper end of the bag in a pressurized state in the pressurizing step by using a sensor provided above the upper end of the bag; a determining step of determining whether or not there is a pinhole in the bag body and whether or not there is a deaeration defect based on the distance measured in the measuring step; A method for inspecting a bag body in which a sealed storage container is hermetically packed for pinholes and poor deaeration, comprising:

2. 2. The method for inspecting a bag in which a sealed storage container is packaged for pinholes and poor deaeration according to claim 1, wherein the certain period of time is 10 minutes.

3. The method further includes a pre-pressurization measurement step of measuring a distance between the upper end and the sensor using the sensor before the pressurization step after the sealing and packaging, The method for inspecting pinholes and deaeration defects in a bag body sealed with a sealed storage container as described in claim 1 or 2, characterized in that the judgment process determines that a pinhole is present when the displacement amount, which is the difference between the distance measured in the pre-pressurization measurement process and the measurement process, is 1.0 mm or more.

4. An inspection device for pinholes and deaeration defects in a bag body hermetically packed in a sealed storage container, the device inspecting the presence or absence of pinholes and deaeration defects in the bag body made of resin or aluminum vapor deposition in a deaerated state so that the sealed storage container containing semiconductor wafers is not exposed to outside air, the device comprising: a pad that presses at least one side surface of the bag in which the sealed storage container is sealed after a certain time has elapsed since the sealed storage container is sealed; a sensor provided above an upper end of the bag in which the sealed storage container is sealed and measuring the distance from the upper end when the bag is pressed by the pad; Equipped with An inspection device for pinholes and poor deaeration in a bag body that seals a sealed storage container, which determines whether or not there is a pinhole in the bag body and whether or not there is poor deaeration based on the measured distance.

Images