Electronic component

Abstract

To provide an electronic component capable of improving an attenuation by suppressing inter-element coupling.SOLUTION: An electronic component 1 comprises: an element 2; a first inductor conductor that is arranged into the element 2, and constructs a first filter F1 including a first passing band; a second inductor conductor that is arranged into the element 2, and constructs a second filter F2 including a second passing band that is different from the first passing band; a capacitor conductor that is arranged into the element 2, and constructs the first filter F1 with the first inductor conduct; and a first ground conductor 33 that is arranged in the element 2. The first ground conductor 33 is arranged to between the second inductor conductor and the capacitor conductor in a lamination direction of a plurality of dielectric layers, and the first ground conductor 33 covers at least the capacitor conductor that is overlapped with the second inductor conductor in view from the lamination direction.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] Patent Document 1 discloses an electronic component having a resonator constituted by a laminate including a plurality of dielectric layers each provided with an electrode, the electronic component including a ground electrode provided on any of the dielectric layers, a capacitor electrode provided on any of the dielectric layers, and an inductor electrode formed from a connection point with the capacitor electrode as a starting point and a connection point with the ground electrode as an end point via a line electrode provided on a dielectric layer other than the dielectric layer on which the capacitor electrode is provided and the dielectric layer on which the ground electrode is provided. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2014 / 112160 Summary of the Invention [Problem to be solved by the invention]

[0004] When an electronic component has a plurality of filters, each including a capacitor and an inductor, coupled with the capacitor of one filter and the inductor of another filter may result in a decrease in attenuation characteristics.

[0005] An object of one aspect of the present invention is to provide an electronic component capable of improving attenuation by suppressing inter-element coupling. [Means for solving the problem]

[0006] (1) An electronic component according to one aspect of the present invention comprises an element body formed by stacking a plurality of dielectric layers, a first inductor conductor disposed within the element body and constituting a first filter having a first passband, a second inductor conductor disposed within the element body and constituting a second filter having a second passband different from the first passband, a capacitor conductor disposed within the element body and constituting the first filter together with the first inductor conductor, and a first ground conductor disposed within the element body, wherein the first ground conductor is disposed between the second inductor conductor and the capacitor conductor in the stacking direction of the plurality of dielectric layers, and the first ground conductor covers at least the capacitor conductor that overlaps with the second inductor conductor when viewed from the stacking direction.

[0007] In an electronic component according to one aspect of the present invention, the first ground conductor is disposed between the second inductor conductor and the capacitor conductor in the stacking direction. In this configuration, the first ground conductor covers at least the capacitor conductor that overlaps with the second inductor conductor when viewed from the stacking direction. That is, the first ground conductor covers at least a portion of the capacitor conductor that faces the second inductor conductor in the stacking direction. This improves isolation between the capacitor conductor of the first filter and the second inductor conductor of the second filter in the electronic component. Therefore, the electronic component can suppress coupling between the capacitor conductor of the first filter and the second inductor conductor of the second filter. As a result, the electronic component can improve attenuation by suppressing inter-element coupling.

[0008] (2) The electronic component of (1) above may further include a second ground conductor disposed within the element body, and the capacitor conductor may be disposed between the first ground conductor and the second ground conductor in the stacking direction. In this configuration, a capacitor is formed by the capacitor conductor of the first filter, the first ground conductor, and the second ground conductor, and therefore the capacitance of the capacitor can be increased.

[0009] (3) In the electronic component of (2) above, the capacitor conductor has a first conductor portion arranged at a position overlapping the second inductor conductor as viewed from the stacking direction, and a second conductor portion arranged at a position not overlapping the second inductor conductor as viewed from the stacking direction, the first conductor portion is covered by the first ground conductor as viewed from the stacking direction, and the second conductor portion does not have to be covered by the first ground conductor as viewed from the stacking direction. In this configuration, the first conductor portion overlapping the second inductor conductor in the stacking direction is covered by the first ground conductor, so that coupling between the first conductor portion and the second inductor conductor can be suppressed.

[0010] (4) In the electronic component of (3) above, the capacitor conductor may have a connection portion connecting the first conductor portion and the second conductor portion, and the width of the connection portion may be smaller than the width of each of the first conductor portion and the second conductor portion when viewed from the stacking direction. In this configuration, since the width of the connection portion is small (thin), the capacitance of the capacitor formed by the connection portion and the first ground conductor is small. Therefore, even if a shift occurs in the stacking of the dielectric layers (conductors), the effect on the characteristics of the electronic component is small. Therefore, the variation in the characteristics of the electronic component can be suppressed.

[0011] (5) In the electronic component of (4) above, the first inductor conductor and the second inductor conductor may be spaced apart in a direction perpendicular to the stacking direction, and the connection portion may be disposed between the first inductor conductor and the second inductor conductor as viewed from the stacking direction. With this configuration, it is possible to prevent the connection portion and the second inductor conductor from being coupled to each other.

[0012] (6) In the electronic component according to any one of (3) to (5) above, the first conductor portion may be covered by the second ground conductor when viewed from the stacking direction. This configuration makes it possible to prevent the capacitor conductor of the first filter from being coupled to other elements.

[0013] (7) In the electronic component according to any one of (1) to (6) above, a plurality of terminal electrodes may be disposed on an outer surface of the body, and the first ground conductor may be electrically connected to a plurality of terminal electrodes that are connected to the ground of another electronic device. With this configuration, a stable ground can be obtained.

[0014] (8) In the electronic component of (7) above, the terminal electrode to which the first ground conductor is electrically connected may be different from the terminal electrode to which the second inductor conductor is electrically connected. In this configuration, by separating the terminal electrodes to which the first ground conductor and the second inductor conductor are connected, it is possible to further improve isolation between the capacitor conductor of the first filter and the second inductor conductor of the second filter. Effect of the Invention

[0015] According to one aspect of the present invention, the attenuation can be improved by suppressing the coupling between elements. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is an equivalent circuit diagram of an electronic component according to an embodiment. [Diagram 2] FIG. 2 is a perspective view of the electronic component according to one embodiment. [Diagram 3] FIG. 3 is a perspective view of an internal conductor of the electronic component shown in FIG. [Figure 4] FIG. 4 is a perspective view of an internal conductor of the electronic component shown in FIG. [Diagram 5] FIG. 5 is an exploded perspective view of the electronic component. [Figure 6] FIG. 6 is an enlarged perspective view of the inner conductor in the second direction. [Figure 7] FIG. 7 is an enlarged view of a portion of FIG. [Figure 8] FIG. 8 is a view of the capacitor conductor and the first ground conductor viewed from the second direction. [Figure 9]FIG. 9 is a view of the capacitor conductor and the second ground conductor as viewed from the second direction. [Figure 10] FIG. 10 is a diagram showing the attenuation characteristics of the first filter. [Figure 11] FIG. 11 is a diagram showing the attenuation characteristics of the second filter. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and duplicated explanations will be omitted.

[0018] 1 is an equivalent circuit diagram of an electronic component according to an embodiment. The electronic component 1 includes an input terminal T1 to which a signal is input, a first output terminal T2 to which a signal is output, a second output terminal T3 to which a signal is output, a first filter F1 provided on a first line S1 connecting the input terminal T1 and the first output terminal T2, and a second filter F2 provided on a second line S2 connecting the input terminal T1 and the second output terminal T3. The electronic component 1 is, for example, a diplexer.

[0019] The first filter F1 is, for example, a low-pass filter. The first filter F1 selectively passes a first signal between a first signal having a frequency within a first frequency band (first pass band) and a second signal having a frequency within a second frequency band (second pass band) that is a frequency band higher than the first frequency band. The first filter F1 has an inductor L1, an inductor L2, a capacitor C1, a capacitor C2, and a capacitor C3. The inductor L2 and the capacitor C2 form a resonator (resonant circuit).

[0020] The second filter F2 is, for example, a high-pass filter. The second filter F2 selectively passes the second signal. The second filter F2 has an inductor L3, an inductor L4, an inductor L5, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9, and a capacitor C10. The inductor L3 and the capacitor C4 form a resonator. The inductor L5 and the capacitor C9 form a resonator.

[0021] Fig. 2 is a perspective view of an electronic component according to one embodiment. As shown in Fig. 2, the electronic component 1 includes an element body 2, and a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode 5, a fourth terminal electrode 6, a fifth terminal electrode 7, and a sixth terminal electrode 8 arranged on both ends of the element body 2, respectively.

[0022] The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. The element body 2 has, as its outer surfaces, a pair of end faces 2a, 2b facing each other, a pair of main faces 2c, 2d facing each other, and a pair of side faces 2e, 2f facing each other. The facing direction in which the pair of end faces 2a, 2b face each other is a first direction D1. The facing direction in which the pair of main faces 2c, 2d face each other is a second direction D2. The facing direction in which the pair of side faces 2e, 2f face each other is a third direction D3.

[0023] In this embodiment, the first direction D1 is the longitudinal direction of the element body 2. The second direction D2 is the height direction of the element body 2 and is perpendicular to the second direction D2. The third direction D3 is the width direction of the element body 2 and is perpendicular to the second direction D2 and the first direction D1.

[0024] The pair of end faces 2a, 2b extend in the second direction D2 to connect the pair of principal faces 2c, 2d together. The pair of end faces 2a, 2b also extend in the third direction D3 (the short side direction of the pair of principal faces 2c, 2d). The pair of side faces 2e, 2f extend in the second direction D2 to connect the pair of principal faces 2c, 2d together. The pair of side faces 2e, 2f also extend in the first direction D1 (the long side direction of the pair of end faces 2a, 2b). The principal face 2d can be defined as a mounting face that faces another electronic device (for example, a circuit board or an electronic component) when the electronic component 1 is mounted on the other electronic device.

[0025] The element body 2 is constructed by laminating a plurality of dielectric layers 9 (see FIG. 5). Each dielectric layer 9 is laminated in the second direction D2. That is, the second direction D2 is the lamination direction. The element body 2 has a plurality of laminated dielectric layers 9. Each dielectric layer 9 is constructed, for example, from a sintered body of a ceramic green sheet containing a dielectric material (dielectric ceramic such as BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based). In the actual element body 2, the plurality of dielectric layers 9 are integrated to the extent that the boundaries between the layers are not visible.

[0026] The first terminal electrode 3, the second terminal electrode 4, and the third terminal electrode 5 are arranged on the side surface 2e of the element body 2. The first terminal electrode 3, the second terminal electrode 4, and the third terminal electrode 5 are formed so as to cover part of the side surface 2e along the second direction D2 of the element body 2, and are formed on part of the principal surface 2c and part of the principal surface 2d. The first terminal electrode 3 is located on the end surface 2a side, and the third terminal electrode 5 is located on the end surface 2b side. The second terminal electrode 4 is located between the first terminal electrode 3 and the third terminal electrode 5.

[0027] The fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 are disposed on the side surface 2f of the element body 2. The fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 are formed so as to cover a portion of the side surface 2f along the second direction D2 of the element body 2, and are formed on a portion of the principal surface 2c and a portion of the principal surface 2d. The fourth terminal electrode 6 is located on the end surface 2a side, and the sixth terminal electrode 8 is located on the end surface 2b side. The fifth terminal electrode 7 is located between the fourth terminal electrode 6 and the sixth terminal electrode 8.

[0028] The first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 contain a conductive material (for example, Ag or Pd). The first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 are configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder). A plating layer may be formed on the surface of the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8. The plating layer is formed by, for example, electroplating. The plating layer has a layer structure consisting of a Cu plating layer, a Ni plating layer, and a Sn plating layer, or a layer structure consisting of a Ni plating layer and a Sn plating layer.

[0029] The first terminal electrode 3 constitutes a first output terminal T2. The second terminal electrode 4 constitutes a ground Gnd2. The third terminal electrode 5 constitutes a second output terminal T3. The fourth terminal electrode 6 constitutes a ground Gnd1. The fifth terminal electrode 7 constitutes an input terminal T1. The sixth terminal electrode 8 constitutes grounds Gnd3, Gnd4, and Gnd5.

[0030] 3 and 4, in the electronic component 1, a first filter F1 and a second filter F2 are disposed in an element body 2. As shown in Fig. 5, the first filter F1 (see Fig. 1) is configured to include an inductor conductor (first inductor conductor) 10, an inductor conductor (first inductor conductor) 11, an inductor conductor (first inductor conductor) 12, an inductor conductor (first inductor conductor) 13, a connection conductor 14, a connection conductor 15, a connection conductor 16, a connection conductor 17, a via conductor 18, a via conductor 19, a via conductor 20, a via conductor 21, a via conductor 22, a via conductor 23, a via conductor 24, a via conductor 25, a via conductor 26, a via conductor 27, a via conductor 28, a via conductor 29, a capacitor conductor 30, a capacitor conductor 31, a capacitor conductor 32, a first ground conductor 33, and a second ground conductor 34. The first filter F1 may further be configured to include one or more inductor conductors, connection conductors, and via conductors.

[0031] Each conductor includes a conductive material (such as Ag or Pd) and is formed as a sintered body of a conductive paste containing a conductive material (such as Ag powder or Pd powder).

[0032] A plurality of inductor conductors (not shown), connecting conductor 14, connecting conductor 15, connecting conductor 17, via conductor 18, via conductor 20, via conductor 22, via conductor 23, via conductor 25, via conductor 27 and via conductor 28 form an inductor L1 (see FIG. 1).

[0033] The inductor conductor 10, the inductor conductor 11, the inductor conductor 12, the inductor conductor 13, the connection conductor 16, the via conductor 19, the via conductor 21, the via conductor 24, the via conductor 26, and the via conductor 28 constitute an inductor L2 (see FIG. 1). The inductor conductor 13 is exposed at the side surface 2e of the element body 2 and is connected to the first terminal electrode 3.

[0034] The capacitor conductor 30, the first ground conductor 33, and the second ground conductor 34 form a capacitor C1 (see FIG. 1). The capacitor conductor 30 and the capacitor conductor 32 form a capacitor C2 (see FIG. 1). The capacitor conductor 31, the first ground conductor 33, and the second ground conductor 34 form a capacitor C3 (see FIG. 1).

[0035] The first ground conductor 33 has a first lead portion 33A and a second lead portion 33B. The first lead portion 33A is exposed on the side surface 2e of the element body 2 and is connected to the second terminal electrode 4. The second lead portion 33B is exposed on the side surface 2f of the element body 2 and is connected to the fourth terminal electrode 6. That is, the first ground conductor 33 is electrically connected to two (a plurality of) terminal electrodes, the second terminal electrode 4 and the fourth terminal electrode 6. The second ground conductor 34 has a lead portion 34A. The lead portion 34A is exposed on the side surface 2e of the element body 2 and is connected to the second terminal electrode 4. That is, the second ground conductor 34 is electrically connected to the second terminal electrode 4. In this embodiment, the first ground conductor 33 and the second ground conductor 34 are connected to different terminal electrodes.

[0036] The second filter F2 (see FIG. 1) is configured to include an inductor conductor 40, an inductor conductor (second inductor conductor) 41, a via conductor 43, a via conductor 44, a via conductor 45, a via conductor 46, and a capacitor conductor 47. The second filter F2 may further be configured to include one or more of an inductor conductor, a connecting conductor, a via conductor, and a capacitor conductor.

[0037] The inductor conductor 41 is exposed at a side surface 2f of the element body 2 and is connected to a sixth terminal electrode 8. The capacitor conductor 47 is exposed at a side surface 2e of the element body 2 and is connected to a third terminal electrode 5.

[0038] One or more inductor conductors (not shown) and multiple via conductors (not shown) form inductor L3 (see FIG. 1). Inductor conductor 40, inductor conductor 41, via conductor 45, and via conductor 46 form inductor L4 (see FIG. 1). One or more inductor conductors (not shown), one or more connecting conductors (not shown), and multiple via conductors (not shown) form inductor L5 (see FIG. 1).

[0039] Capacitor conductors (not shown) form the capacitors C4, C5, C6, C7, C8, C9, and C10 (all of which are shown in FIG. 1).

[0040] As shown in FIG. 6, the first ground conductor 33 is arranged (interposed) in the second direction D2 between the capacitor conductors 30 and 31 constituting the first filter F1 and the inductor conductor 41 constituting the second filter F2.

[0041] The capacitor conductor 30 has a first conductor portion 30A, a second conductor portion 30B, and a connection portion 30C. The first conductor portion 30A, the second conductor portion 30B, and the connection portion 30C are integrally formed. The first conductor portion 30A and the second conductor portion 30B have, for example, a rectangular shape. The first conductor portion 30A is disposed at a position overlapping the inductor conductor 41 when viewed from the second direction D2. The second conductor portion 30B is disposed at a position not overlapping the inductor conductor 41 when viewed from the second direction D2.

[0042] The connecting portion 30C connects the first conductor portion 30A and the second conductor portion 30B. As shown in FIG. 8, when viewed from the second direction D2, the width (dimension in the third direction D3) W1 of the connecting portion 30C is smaller (narrower) than each of the width W2 of the first conductor portion 30A and the width W3 of the second conductor portion 30B (W1 < W2, W3). In other words, each of the width W2 of the first conductor portion 30A and the width W3 of the second conductor portion 30B is larger than the width W1 of the connecting portion 30C (W2, W3 > W1). The width W2 of the first conductor portion 30A is larger than the width W3 of the second conductor portion 30B (W2 > W3). The connecting portion 30C is disposed between the inductor conductor constituting the first filter F1 and the inductor conductor constituting the second filter F2 when viewed from the second direction D2.

[0043] The capacitor conductor 31 has a conductor portion 31A and a lead-out portion 31B. The conductor portion 31A and the lead-out portion 31B are integrally formed. The conductor portion 31A has, for example, a rectangular shape.

[0044] As shown in FIG. 7, the first conductor portion 30A of the capacitor conductor 30 is disposed between the first ground conductor 33 and the second ground conductor 34 in the second direction D2. The conductor portion 31A of the capacitor conductor 31 is disposed between the first ground conductor 33 and the second ground conductor 34 in the second direction D2. The first conductor portion 30A of the capacitor conductor 30 and the conductor portion 31A of the capacitor conductor 31 are disposed at the same position in the second direction D2. The first conductor portion 30A of the capacitor conductor 30 and the conductor portion 31A of the capacitor conductor 31 are disposed at a predetermined interval in the third direction D3.

[0045] As shown in FIG. 8, the first conductor portion 30A and the conductor portion 31A are covered by the first ground conductor 33 when viewed along the second direction D2 from the main surface 2c side. That is, when viewed from the second direction D2, the first conductor portion 30A and the conductor portion 31A do not protrude outside the first ground conductor 33. When viewed from the second direction D2, the area of the first ground conductor 33 is larger than the area of each of the first conductor portion 30A and the conductor portion 31A.

[0046] When viewed from the second direction D2, the second conductor portion 30B is not covered by the first ground conductor 33. When viewed from the second direction D2, the connection portion 30C is partly covered by the first ground conductor 33. When viewed from the second direction D2, the lead-out portion 31B is partly covered by the first ground conductor 33.

[0047] 9, the first conductor portion 30A and the conductor portion 31A are covered by the second ground conductor 34 when viewed from the principal surface 2d side along the second direction D2. In other words, the first conductor portion 30A and the conductor portion 31A do not protrude outward beyond the second ground conductor 34 when viewed from the second direction D2.

[0048] The inductor conductor 10, the inductor conductor 11, and the inductor conductor 12 of the first filter F1 and the inductor conductor 40 and the inductor conductor 41 of the second filter F2 are disposed at different positions in the second direction D2.

[0049] As described above, in the electronic component 1 according to the present embodiment, the first ground conductor 33 is disposed between the inductor conductor 41 and the capacitor conductors 30 and 31 in the second direction D2. In this configuration, the first ground conductor 33 covers at least the capacitor conductors 30 and 31 that overlap with the inductor conductor 41 when viewed from the second direction D2. That is, the first ground conductor 33 covers at least the portions of the capacitor conductors 30 and 31 that face the inductor conductor 41 in the second direction D2. This improves isolation between the capacitor conductors 30 and 31 of the first filter F1 and the inductor conductor 41 of the second filter F2. Therefore, in the electronic component 1, it is possible to suppress coupling between the capacitor conductors 30 and 31 of the first filter F1 and the inductor conductor 41 of the second filter F2. As a result, in the electronic component 1, it is possible to improve the attenuation by suppressing inter-element coupling.

[0050] FIG. 10 is a diagram showing the attenuation characteristic of the first filter F1. In FIG. 10, the horizontal axis is frequency (Frequency) [MHz], and the vertical axis is attenuation (Attenuation) [dB]. FIG. 11 is a diagram showing the attenuation characteristic of the second filter F2. In FIG. 11, the horizontal axis is frequency (Frequency) [MHz], and the vertical axis is attenuation (Attenuation) [dB]. As shown in each of FIG. 10 and FIG. 11, in the electronic component 1, by ensuring isolation between the first filter F1 and the second filter F2, it is possible to suppress the deterioration of the attenuation characteristic and obtain the desired attenuation characteristic. This is because, by ensuring isolation, the first filter F1 can obtain an attenuation characteristic of at least 40 dB and at most 70 dB in the vicinity of the frequency band of 4000 to 8000 MHz between the pass band of the second filter F2 and the attenuation band of the first filter F1, where coupling is likely to occur.

[0051] The electronic component 1 according to this embodiment includes a second ground conductor 34 disposed within the element body 2. The capacitor conductors 30 and 31 are disposed between the first ground conductor 33 and the second ground conductor 34 in the second direction D2. In this configuration, the capacitors C1 and C3 are formed by the capacitor conductors 30 and 31 of the first filter F1 and the first ground conductor 33 and the second ground conductor 34, thereby making it possible to increase the capacitance of the capacitors C1 and C3.

[0052] In the electronic component 1 according to this embodiment, the capacitor conductor 30 has a connection portion 30C that connects the first conductor portion 30A and the second conductor portion 30B. When viewed from the second direction D2, the width W1 of the connection portion 30C is smaller than the widths W2 and W3 of the first conductor portion 30A and the second conductor portion 30B, respectively. In this configuration, since the width W1 of the connection portion 30C is small (narrow), the capacitance of the capacitor formed by the connection portion 30C and the first ground conductor 33 is small. Therefore, even if a deviation occurs in the lamination of the dielectric layers 9, the effect on the characteristics of the electronic component 1 is small. Therefore, the variation in the characteristics of the electronic component 1 can be suppressed.

[0053] In the electronic component 1 according to this embodiment, the inductor conductor constituting the first filter F1 and the inductor conductor constituting the second filter F2 are arranged to be spaced apart in the first direction D1. The connection portion 30C of the capacitor conductor 30 is arranged between the inductor conductor constituting the first filter F1 and the inductor conductor constituting the second filter F2 when viewed from the second direction D2. This configuration makes it possible to prevent coupling between the connection portion 30C and the inductor conductor constituting the second filter F2.

[0054] In the electronic component 1 according to the present embodiment, the first conductor portion 30A of the capacitor conductor 30 and the conductor portion 31A of the capacitor conductor 31 are covered by the second ground conductor 34 when viewed from the second direction D2. This configuration makes it possible to prevent the first conductor portion 30A of the capacitor conductor 30 and the conductor portion 31A of the capacitor conductor 31 of the first filter F1 from being coupled to other elements.

[0055] The electronic component 1 according to this embodiment includes a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode 5, a fourth terminal electrode 6, a fifth terminal electrode 7, and a sixth terminal electrode 8. The first ground conductor 33 is electrically connected to two terminal electrodes, the second terminal electrode 4 and the fourth terminal electrode 6. With this configuration, a stable ground can be obtained.

[0056] In the electronic component 1 according to this embodiment, the first ground conductor 33 is electrically connected to the second terminal electrode 4 and the fourth terminal electrode 6, and the inductor conductor 41 of the second filter F2 is electrically connected to the sixth terminal electrode 8. In this configuration, by separating the terminal electrodes to which the first ground conductor 33 and the inductor conductor 41 are connected, it is possible to further improve isolation between the capacitor conductor 30 and the capacitor conductor 31 of the first filter F1 and the inductor conductor 41 of the second filter F2.

[0057] In the electronic component 1 according to this embodiment, the inductor conductors 10, 11, and 12 of the first filter F1 and the inductor conductors 40 and 41 of the second filter F2 are disposed at different positions in the second direction D2. With this configuration, coupling between the inductor conductors 10, 11, and 12 of the first filter F1 and the inductor conductors 40 and 41 of the second filter F2 can be suppressed.

[0058] Although the embodiment of the present invention has been described above, the present invention is not necessarily limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention.

[0059] In the above embodiment, the first terminal electrode 3, the second terminal electrode 4, and the third terminal electrode 5 are arranged on the side surface 2e and the main surfaces 2c and 2d, and the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 are arranged on the side surface 2f and the main surfaces 2c and 2d. However, the shapes (arrangement) of the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 are not limited to this.

[0060] In the above-described embodiment, the shapes and numbers of the inductor conductors and capacitor conductors constituting the first filter F1 and the second filter F2 can be set appropriately. [Explanation of symbols]

[0061] Reference Signs List 1...electronic component, 2...element body, 3...first terminal electrode, 4...second terminal electrode, 5...third terminal electrode, 6...fourth terminal electrode, 7...fifth terminal electrode, 8...sixth terminal electrode, 9...dielectric layer, 10...inductor conductor (first inductor conductor), 11...inductor conductor (first inductor conductor), 30...capacitor conductor, 30A...first conductor portion, 30B...second conductor portion, 30C...connection portion, 31...capacitor conductor, 33...first ground conductor, 34...second ground conductor, 41...inductor conductor (second inductor conductor), F1...first filter, F2...second filter.

Claims

1. An element body formed by laminating a plurality of dielectric layers; a first inductor conductor disposed within the element body and constituting a first filter having a first passband; a second inductor conductor disposed within the element body and constituting a second filter having a second passband different from the first passband; a capacitor conductor disposed within the element body and constituting the first filter together with the first inductor conductor; a first ground conductor disposed within the element body; the first ground conductor is disposed between the second inductor conductor and the capacitor conductor in a stacking direction of the plurality of dielectric layers, The first ground conductor covers at least the capacitor conductor that overlaps with the second inductor conductor when viewed in the stacking direction.

2. a second ground conductor disposed within the element; The electronic component according to claim 1 , wherein the capacitor conductor is disposed between the first ground conductor and the second ground conductor in the stacking direction.

3. The capacitor conductor is a first conductor portion disposed at a position overlapping the second inductor conductor when viewed from the lamination direction; a second conductor portion disposed at a position not overlapping with the second inductor conductor when viewed from the lamination direction, the first conductor portion is covered by the first ground conductor when viewed from the stacking direction, the second conductor portion is not covered by the first ground conductor when viewed from the stacking direction. The electronic component according to claim 2 .

4. the capacitor conductor has a connection portion connecting the first conductor portion and the second conductor portion, The electronic component according to claim 3 , wherein a width of the connection portion is smaller than a width of each of the first conductor portion and the second conductor portion when viewed in the stacking direction.

5. the first inductor conductor and the second inductor conductor are spaced apart from each other in a direction perpendicular to the lamination direction, The electronic component according to claim 4 , wherein the connection portion is disposed between the first inductor conductor and the second inductor conductor when viewed from the stacking direction.

6. The electronic component according to claim 3 , wherein the first conductor portion is covered by the second ground conductor when viewed from the stacking direction.

7. a plurality of terminal electrodes disposed on an outer surface of the element body; The electronic component according to claim 1 , wherein the first ground conductor is electrically connected to a plurality of the terminal electrodes that are connected to a ground of another electronic device, among the plurality of terminal electrodes.

8. The electronic component according to claim 7 , wherein the terminal electrode to which the first ground conductor is electrically connected is different from the terminal electrode to which the second inductor conductor is electrically connected.

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